| Entries |
| Document | Title | Date |
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| 20100271059 | METHOD OF DETERMINING AN ELECTRICAL PROPERTY OF A TEST SAMPLE - A method of obtaining an electrical property of a test sample, comprising a non-conductive area and a conductive or semi-conductive test area, by performing multiple measurements using a multi-point probe. The method comprising the steps of providing a magnetic field having field lines passing perpendicularly through the test area, bringing the probe into a first position on the test area, the conductive tips of the probe being in contact with the test area, determining a position for each tip relative to the boundary between the non-conductive area and the test area, determining distances between each tip, selecting one tip to be a current source positioned between conductive tips being used for determining a voltage in the test sample, performing a first measurement, moving the probe and performing a second measurement, calculating on the basis of the first and second measurement the electrical property of the test area. | 10-28-2010 |
| 20110006794 | METHOD AND APPARATUS FOR INTERROGATING ELECTRONIC EQUIPMENT COMPONENTS - An apparatus for interrogating an electronic circuit supported by a substrate includes a tester external to the substrate and comprising an tester transceiver. A testing circuit is supported by the substrate and connected to the electronic circuit. The testing circuit includes a processor and a testing circuit transceiver in communication with the tester transceiver for transmitting instructions from the tester to the processor and for transmitting results of an interrogation from the processor to the tester. The processor being programmed to process instructions from the tester to interrogate the electronic circuit with an interrogation corresponding to the instructions. | 01-13-2011 |
| 20110006795 | CONTACT PROBE DEVICE - To obtain a satisfactory contact state in an ultra high frequency range with a low loss, in a contact probe device with an electronic component connected to a mounting substrate. Insulating substrate | 01-13-2011 |
| 20110018565 | DIELECTRIC BREAKDOWN LIFETIME ENHANCEMENT USING ALTERNATING CURRENT (AC) CAPACITANCE - A time-to-breakdown for a dielectric layer in a semiconductor device is determined based upon a sudden change in capacitance. An alternating voltage, greater in magnitude than an operating voltage of the device, is applied to the semiconductor device, capacitance is measured across the dielectric layer during the application of the voltage until a sudden change in capacitance occurs, thereby indicating a breakdown in the dielectric layer, and the breakdown time is scaled to the operating voltage. | 01-27-2011 |
| 20110025357 | IC Test Substrate for Testing Various Signals - The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state. | 02-03-2011 |
| 20110050261 | TEST PROBE - A test probe includes a filtering unit and a contact unit. The filtering unit includes an inductive component, a capacitive component, and an insulation component insulates the inductive component from the capacitive component. The contact unit contacts a test point to get a test signal. The filtering unit filters noise from the test signal. The test probe can be assembled and disassembled easily, and parameters of the filtering unit can be changed by changing structure of each component. | 03-03-2011 |
| 20110062976 | Pad Structure and Test Method - The present invention discloses a pad structure and a method for testing a integrated circuit. The structure includes the first pads and the second pads, where the first pads are distributed over a peripheral portion of the integrated circuit and connected with lead-out wires of the integrated circuit, and the second pads are connected with a metal line at a circuit portion in the integrated circuit and are sized larger than the minimum characteristic dimension of the metal line and of the integrated circuit and smaller than the size of the first pads. The pad structure and method can position a test portion with improved efficiency. Correspondingly, a probe can be used to position the test portion with improved accuracy as well. | 03-17-2011 |
| 20110062977 | PROBE CIRCUIT, MULTI-PROBE CIRCUIT, TEST APPARATUS, AND ELECTRIC DEVICE - A probe circuit is provided in an electronic device that includes a circuit which is under test and outputs a response signal corresponding to an input signal in synchronization with an operation clock. The probe circuit includes a sampling clock supplying section that outputs a sampling clock having a predetermined frequency, and a sampling section that outputs, outside the electronic device, a probe output signal of which frequency is lower than a frequency of the response signal and which corresponds to a sampling result obtained by sampling the response signal using the sampling clock. The response signal has a prescribed signal pattern repeated with a predetermined recurrence period, and the sampling clock supplying section outputs the sampling clock of which relative phase with respect to the signal pattern sequentially changes in each recurrence period. | 03-17-2011 |
| 20110068815 | METHODS AND APPARATUS FOR IMPLEMENTING ELECTRICAL CONNECTIVITY FOR ELECTRONIC CIRCUIT TESTING - Various embodiments are directed at an apparatus for implementing electrical connectivity for testing of a semiconductor device. The apparatus comprises a probe head which comprises an upper guide plate and a lower guide plate, wherein the upper guide plate defines a plurality of first apertures, and the lower guide plate defines a plurality of second apertures in some embodiments. The apparatus further comprises a plurality of probes, wherein each of the plurality of probes passes through one of the plurality of first apertures on the upper guide plate and one of the plurality of second apertures on the lower guide plate, and at least one of the plurality of probes defines a buckled form after the at least one of the plurality of probes is finally assembled in the apparatus. The apparatus further comprises a template member to guide the plurality of probes. | 03-24-2011 |
| 20110074454 | TEST DEVICE AND INSPECTION APPARATUS USING THE SAME - A testing device suitable for a testing apparatus with light inspection of a display panel is provided, in which the testing device includes a main part and two contact parts. The testing device is fixed to the testing apparatus with light inspection by the main part. Two contact parts are respectively extended from two ends of the main part along a first direction, and each of the contact parts has a plurality of tips. The tips of each contact part have different heights. Besides, a testing apparatus is also provided. Therefore, the abovementioned testing device and the testing apparatus are able to drastically extend the user lifetime, improve the inspection accuracy and save cost. | 03-31-2011 |
| 20110074455 | PROBE CARD AND SEMICONDUCTOR WAFER INSPECTION METHOD USING THE SAME - A probe card has a thin film substrate having projection electrodes on a first surface facing the semiconductor wafer and at a position facing the pad electrodes, a non-contact electrode, and first electrodes provided a second surface opposite to the first surface; and a wiring substrate having second electrodes disposed at a side opposite to the semiconductor wafer in the thin film substrate and at a position facing the first electrodes. The wiring substrate and the thin film substrate form a first sealed space and the thin film substrate and the semiconductor wafer form a second sealed space. By reducing the pressure in the first and the second sealed space, the first and the second electrodes are brought into close contact with each other and the pad electrodes and the projection electrodes are brought into close contact with each other, and the pressure of each of the first and second sealed space can be independently adjusted. | 03-31-2011 |
| 20110074456 | PROBE APPARATUS AND TEST APPARATUS - A probe apparatus exchanging signals with a target device, includes: a contact section electrically connected to the target device by contacting a terminal of the target device; a non-contact section that exchanges signals with the target device in a state not contacting the terminal of the target device; and a retaining section that retains the contact section and the non-contact section, in such a manner that a relative position between the contact section and the non-contact section in a connection direction connecting the non-contact section and a region corresponding to the target device is displaceable. | 03-31-2011 |
| 20110089961 | Interface test device and method - A monitored test block for use in medium and high voltage electrical monitoring circuits such as found in substation facilities that signals via a communication protocol the operational status of potential, current and signal secondary circuits when connected to protection and monitoring devices (or test devices) such as protective relays, fault recorders or any other monitoring and controlling device. The monitored test block includes various safety features to prevent damage to the equipment or harm to a technician. The monitoring circuits may be located in the front for ease of access. | 04-21-2011 |
| 20110089962 | TESTING OF ELECTRONIC DEVICES THROUGH CAPACITIVE INTERFACE - An embodiment of a test apparatus for executing a test of a set of electronic devices having a plurality of electrically conductive terminals, the test apparatus including a plurality of electrically conductive test probes for exchanging electrical signals with the terminals, and coupling means for mechanically coupling the test probes with the electronic devices. In an embodiment, the coupling means includes insulating means for keeping each one of at least part of the test probes electrically insulated from at least one corresponding terminal during the execution of the test. Each test probe and the corresponding terminal form a capacitor for electro-magnetically coupling the test probe with the terminal. | 04-21-2011 |
| 20110089963 | TEST CONTACT ARRANGEMENT - The invention relates to a test contact arrangement ( | 04-21-2011 |
| 20110089964 | METHOD FOR TESTING SEMICONDUCTOR MEMORY DEVICE USING PROBE AND SEMICONDUCTOR MEMORY DEVICE USING THE SAME - Example embodiments relate to a semiconductor memory device including a first pad having a probe region and a sensing region, the first pad may be adapted to come in contact with a primary probe, a sensing unit adapted to sense a weak contact of the first pad and the primary probe, the sensing unit may generate an output current in response to a contact point of the primary probe, and a second pad may be adapted to come in contact with a secondary probe to input/output an electric signal. The output current of the sensing unit may be output through the second pad or the secondary probe. | 04-21-2011 |
| 20110115512 | Integrated circuit tester with high bandwidth probe assembly - Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter. | 05-19-2011 |
| 20110121846 | CONTACT STRUCTURE FOR INSPECTION - A contact structure for inspection that is installed on a bottom surface of a circuit board includes a ground conductor that is grounded; an elastic contact member that is brought into contact with an inspection target object; and a conductive line that electrically connects the circuit board and the elastic contact member. Here, the elastic contact member may be provided on a bottom surface of the ground conductor that is grounded. The elastic contact member may include an insulating layer, a wiring layer, a contactor and an elastic body provided at a position corresponding to the contactor. The elastic body provides the elastic contact member with elasticity when the contactor is brought into contact with an electrode. The elastic contact member is provided in parallel with the ground conductor. The wiring layer and the ground conductor form a microstrip line. | 05-26-2011 |
| 20110128025 | ELECTRICAL CONTACT MEMBER AND CONTACT PROBE - An electrical contact member and a contact probe that are durable and economical are provided. For this purpose, an outer peripheral portion, which has a symmetrical shape with respect to a central axis in a longitudinal direction and has a hollow portion, and a core portion, which has an approximate bar shape extending in the longitudinal direction and filling the hollow portion, are included. One of the outer peripheral portion and the core portion is made of a noble metal alloy, and the other is made of a conductive material other than the noble metal alloy. The one of the outer peripheral portion and the core portion, which is made of the noble metal alloy, projects further than the other at one end portion in the longitudinal direction. | 06-02-2011 |
| 20110156736 | SEMICONDUCTOR APPARATUS AND PROBE TEST METHOD THEREOF - Various embodiments of a semiconductor apparatus and related methods are disclosed. In one exemplary embodiment, a semiconductor apparatus may include a chip, scribe lanes disposed around the chip, and a probe test logic circuit for conducting a probe test on the chip. The probe test logic circuit is disposed on a portion of the scribe lanes. | 06-30-2011 |
| 20110163772 | MICRO CONTACT PROBE COATED WITH NANOSTRUCTURE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a micro contact probe used for a probe card. | 07-07-2011 |
| 20110193581 | SYSTEMS AND METHODS TO TEST INTEGRATED CIRCUITS - Open and short systems and methods for testing integrated circuits are disclosed. An example implementation includes engaging an integrated circuit testing module with an integrated circuit testing apparatus, the integrated circuit testing module for receiving an integrated circuit, a first set of contact points, and a second set of contact points; engaging a first probe onto at least one of the contact points of the first set of contact points, controllably engaging at least one of a second probe onto at least one contact pair of the integrated circuit testing module, and providing an electrical stimulus to the integrated circuit testing module. | 08-11-2011 |
| 20110193582 | SOCKET, AND TEST APPARATUS AND METHOD USING THE SOCKET - An apparatus for testing electric characteristics of a test object including first connection terminals on a bottom surface and second connection terminals on a top surface, the apparatus comprises a test board comprising first pads on a predetermined surface; a socket configured to electrically connect the test object to the test board; and a handler configured to transport the test object to the socket. The socket comprises a first connection unit configured to be electrically connected to the first connection terminals of the test object and a second connection unit configured to be electrically connected to the second connection terminals of the test object. | 08-11-2011 |
| 20110199108 | SILICON CHICKLET PEDESTAL - A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another. | 08-18-2011 |
| 20110204911 | PROBER UNIT - To facilitate connection between a narrow-pitched probe assembly and a coarse-pitched printed circuit board. A prober unit in which probes are brought into contact with to-be-tested semiconductor chips to establish electrical connection between the semiconductor chips and a test unit via the probes, in which: a probe assembly and a plurality of wiring boards are prepared, the probe assembly including output terminals to be connected directly to the probes, the probe assembly being constituted by integrated regularly-arranged multiple probe groups including the output terminals, and each of the wiring boards including wiring adhering to a surface of a non-conductive film; and an n-th row of an output terminal group of the probe assembly is brought into contact with a land group provided at an end of an n-th wiring board, and a wiring terminal provided at the other end of the n-th wiring board is connected to one of a wiring board of the test unit and a connector to establish electrical connection between the to-be-tested semiconductor chips and the test unit. | 08-25-2011 |
| 20110210759 | FAST OPEN CIRCUIT DETECTION FOR OPEN POWER AND GROUND PINS - A system and method for identifying opens among parallel connections on a circuit assembly such as a printed circuit board (PCB). In a learn phase performed on a known good circuit assembly, a group of parallel connected pins are excited with a first signal. A second signal, out-of-phase with the first signal, is applied to a second group of pins associated with the component. The amplitude and/or the phase of the second signal and the number and/or specific pins in the second group of pins are selected so that first and second signals coupled to a detector plate proximal to the component substantially offset. During a manufacturing test, signals of comparable amplitude and phase are applied to like pins on a like component of a circuit assembly under test. If the response signal coupled to a like detector plate is below a threshold, it is determined that each pin in the group of parallel connected pins is connected. If the amplitude of the response is over the threshold, one or more of the parallel pins is determined to be open. Additional tests may be performed to identify which of the parallel pins is likely open. | 09-01-2011 |
| 20110215824 | OPERATION VOLTAGE SUPPLY APPARATUS - The voltage application probe and the voltage measurement probe are connected to the voltage application pad and the voltage measurement pad of the semiconductor device. The voltage application pad and the voltage measurement pad are connected by the conductor, measuring the voltage applied to the voltage application pad through the voltage measurement probe. The voltage compensation circuit in the voltage development device operates to make the voltage applied to the voltage application pad equal to the set voltage for the voltage development device. Even when the resistance between the voltage application probe and the voltage application pad increases, the accurate setting voltage is applied to the voltage application pad. | 09-08-2011 |
| 20110227594 | ELECTRONIC COMPONENT CONTACTOR, APPARATUS FOR TESTING ELECTRONIC COMPONENT, AND METHOD FOR TESTING ELECTRONIC COMPONENT - An electronic component contactor includes a plurality of contact pins, a housing that encases and determines positions of the plurality of contact pins, and a buffer member that buffers against the behavior of the contact pins. The contact pins each includes a base portion, a stretch portion that stretches from the base portion in an arc shape, a contact portion that is formed in the stretch portion, and a load receiving portion. The housing includes a support base in which a surface supporting the buffer member is formed to be flat. The buffer member is formed in a sheet-like shape. A portion of the buffer member that faces the load receiving portion is supported by the support base. | 09-22-2011 |
| 20110260743 | CONTACTLESS MEASURING SYSTEM - The invention relates to a contactless measuring system having at least one test probe forming part of a coupling structure for the contactless decoupling of a signal running on a signal waveguide, wherein the signal waveguide is designed as a conductor of the electric circuit on a circuit board and as part of an electric circuit. To this end, at least one contact structure is configured and disposed on the circuit board such that said contact structure is galvanically separated from the signal waveguide, forms part of the coupling structure, is displaced completely within the near field of the signal waveguide, and has at least one contact point, which may be electrically contacted by a contact of the test prod. | 10-27-2011 |
| 20110273198 | LOW PROFILE PROBE HAVING IMPROVED MECHANICAL SCRUB AND REDUCED CONTACT INDUCTANCE - A vertically folded probe is provided that can provide improved scrub performance in cases where the probe height is limited. More specifically, such a probe includes a base and a tip, and an arm extending from the base to the tip as a single continuous member. The probe arm is vertically folded, such that it includes three or more vertical arm portions. The vertical arm portions have substantial vertical overlap, and are laterally displaced from each other. When such a probe is vertically brought down onto a device under test, the probe deforms. During probe deformation, at least two of the vertical arm portions come into contact with each other. Such contact between the arm portions can advantageously increase the lateral scrub motion at the probe tip, and can also advantageously reduce the probe inductance. | 11-10-2011 |
| 20110279137 | PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS AND CORRESPONDING PRODUCTION METHOD - An embodiment of a method is proposed for producing cantilever probes for use in a test apparatus of integrated electronic circuits; the probes are configured to contact during the test corresponding terminals of the electronic circuits to be tested. An embodiment comprises forming probe bodies of electrically conductive materials. In an embodiment, the method further includes forming on a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe. | 11-17-2011 |
| 20110316572 | TESTING DIE-TO-DIE BONDING AND REWORK - A method of testing a multi-die integrated circuit (IC) can include testing an inter-die connection of the multi-die IC. The inter-die connection can include a micro-bump coupling a first die to a second die. The method can include detecting whether a fault occurs during testing of the inter-die connection. Responsive to detecting the fault, the multi-die integrated circuit can be designated as including a faulty inter-die connection. Also described is an integrated circuit that includes a first die, a second die on which the first die may be disposed, a plurality of inter-die connections coupling the first die to the second die, and a plurality of probe pads, where each probe pad is coupled to at least one of the inter-die connections. | 12-29-2011 |
| 20120038379 | PROBES FORMED FROM SEMICONDUCTOR REGION VIAS - Embodiments of the invention describe forming a set of probes using semiconductor regions each including a plurality of vias. A first set of probe segments may be formed from a first set of vias on a first semiconductor region. A second set of probe segments may be formed from a second set of vias on a second semiconductor region and bonded to the first set of probe segments. At least one spring comprising a dielectric material may be formed to couple the first set of probe segments, while a set of metal tips disposed on the second set of probe segments. | 02-16-2012 |
| 20120098559 | SYSTEMS AND METHODS FOR SIMULTANEOUS OPTICAL TESTING OF A PLURALITY OF DEVICES UNDER TEST - Systems and methods for simultaneous optical testing of a plurality of devices under test. These systems and methods may include the use of an optical probe assembly that includes a power supply structure that is configured to provide an electric current to a plurality of devices under test (DUTs) and an optical collection structure that is configured to simultaneously collect electromagnetic radiation that may be produced by the plurality of DUTs and to provide the collected electromagnetic radiation to one or more optical detection devices. The systems and methods also may include the use of the optical probe assembly in an optical probe system to evaluate one or more performance parameters of each of the plurality of DUTs. | 04-26-2012 |
| 20120133381 | STACKABLE SEMICONDUCTOR CHIP WITH EDGE FEATURES AND METHODS OF FABRICATING AND PROCESSING SAME - A method of performing a function on a three-dimensional semiconductor chip package as well as on individual chips in the package is disclosed. That method involves the creation of an operative relationship between a function performer and an edge feature on the chip or chips wherein the edge feature consists of one or more of an electrically conductive pad, thermally conductive pad, a probe pad, a fuse, a resistor, a capacitor, an inductor, an optical emitter, an optical receiver, a test pad, a bond pad, a contact pin, a heat dissipator, an alignment marker, a metrology feature and a function performer may be any one or more of a test probe, the laser, a programming device, an interrogation device, a loading device or a tuning device. In addition, a chip per se with edge features is disclosed along with a three-dimensional stack of such chips in either of several different configurations. The disclosure provides information regarding the formation of edge feature, the singulation of dice having incipient edge features, the stacking of dice and the handling or dice with edge features. | 05-31-2012 |
| 20120161804 | APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER - A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side. | 06-28-2012 |
| 20120176150 | MEASURING EQUIPMENT FOR PROBE-EFFECT CANCELLATION AND METHOD THEREOF - A measuring equipment, such as a vector network analyzer, is provided. The measuring equipment includes a first port and a second port, a probe connected to the first port, an antenna connected to the second port, and a test board corresponding to a type of a device-under-test. A probe-effect is obtained by measuring the test board via the probe and the antenna. | 07-12-2012 |
| 20120182035 | BUMPED SEMICONDUCTOR WAFER OR DIE LEVEL ELECTRICAL INTERCONNECT - A probe assembly that acts as a temporary interconnect between terminals on an IC device and a test station. The probe assembly includes a plurality of stud bumps arranged on a first surface of a substrate in a configuration corresponding to the terminal on the IC device. The stud bumps include a shape adapted to temporarily couple with the terminals on the IC device. A plurality of conductive traces on the substrate electrically couple the stud bumps with the test station. | 07-19-2012 |
| 20120212247 | TEST APPARATUS AND TEST METHOD - Provided is a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, including: a probe card to be connected to respective contacts of the plurality of the devices under test on a connection surface to be overlapped on the semiconductor wafer, the probe card being provided with a plurality of corresponding contacts on a rear surface of the connection surface; and a test head that tests the plurality of devices under test on the semiconductor wafer by sequentially connecting to each part of the plurality of contacts of the probe card. | 08-23-2012 |
| 20120235697 | SYSTEMS AND METHODS OF TESTING SEMICONDUCTOR DEVICES - Systems and methods of testing semiconductor devices, the system including a tester configured to evaluate electrical characteristics of a semiconductor device provided on a wafer, and a probe unit configured to transfer electrical signals used to test the semiconductor device between the tester and the semiconductor device. The probe unit may include: a housing; a wafer supporting member disposed in the housing to support the wafer; a printed circuit board disposed on the housing to transfer the electrical signals from and to the tester, and a probe card disposed opposite the wafer supporting member, in the housing. The probe card may include probe pins to deliver the electrical signal from and to the semiconductor device. Each of the probe pins may include a probe tip configured to adjustably extend to contact the wafer. | 09-20-2012 |
| 20120242360 | High-frequency coupling testing device by coupling effect - Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe. Further, the filter between the coupling circuit and the high-frequency circuit can be adjusted by changing the number of the coupling metal probes surrounding the high-frequency metal probe, or by changing the distances between the coupling metal probes and the high-frequency metal probes. | 09-27-2012 |
| 20120274346 | TESTING SYSTEM WITH CAPACITIVELY COUPLED PROBE FOR EVALUATING ELECTRONIC DEVICE STRUCTURES - Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a capacitive coupling probe. The probe may have electrodes. The electrodes may be formed from patterned metal structures in a dielectric substrate. A test unit may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the electrodes. Complex impedance data, forward transfer coefficient data, or other data may be used to determine whether the structures are faulty. A fixture may be used to hold the capacitive coupling probe in place against the conductive electronic device structures during testing. | 11-01-2012 |
| 20120286814 | 3D IC Testing Apparatus - A three dimensional (3D) integrated circuit (IC) testing apparatus comprises a plurality of connection devices. When a device under test (DUT) such as an interposer or a 3D IC formed by a plurality of 3D dies operates in a testing mode, the 3D IC testing apparatus is coupled to the DUT via a variety of interface channels such as probes. The connection devices and a variety of through silicon vias (TSVs) in the DUT form a TSV chain so that a electrical characteristic test of the variety of TSVs can be tested all at once. | 11-15-2012 |
| 20120299610 | METHOD AND APPARATUS FOR TESTING A SEMICONDUCTOR WAFER - A method for testing a semiconductor wafer comprises providing a semiconductor wafer. The semiconductor wafer comprises a protruding annular rim, a first redistribution structure disposed on the front side of the semiconductor wafer, a second redistribution structure disposed on the rear side of the semiconductor wafer within the protruding annular rim and a plurality of vias extending from the front side to the rear side. A first probe is contacted to the first redistribution structure on the front side and a second probe is contacted to the second redistribution structure on the rear side. The first probe is in contact with the first redistribution structure and the second probe is in contact with the second redistribution structure at the same time. | 11-29-2012 |
| 20120306521 | TEST SYSTEM WITH TEMPORARY TEST STRUCTURES - Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault. | 12-06-2012 |
| 20120319713 | AUTOMATIC PROBE CONFIGURATION STATION AND METHOD THEREFOR - A probe system for facilitating the inspection of a device under test. System incorporates a storage rack; a probe bar gantry assembly; a probe assembly configured to electrically mate the device under test; and a robot system for picking the probe assembly from the storage rack and deliver the probe assembly to the probe bar gantry. The robot system is also enabled to pick a probe assembly from the probe bar gantry and deliver the probe assembly to the storage rack. The probe assembly includes a clamping assembly for attaching the probe assembly to the probe bar gantry or the storage rack. The probe assembly may include an array of contact pins configured to mate with conductive pads on the device under test when the probe assembly is installed on the probe bar gantry assembly. | 12-20-2012 |
| 20120319714 | PROBE-ABLE VOLTAGE CONTRAST TEST STRUCTURES - Test structures and method for detecting defects using the same. A probe-able voltage contrast (VC) comb test structure that includes first, second and third probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines, switching devices coupled with an end portion of each floating tine, and connecting the floating tines to the second probe pad, and the third probe pad being a control pad which controls the switching devices. A probe-able VC serpentine test structure that includes first, second, third and fourth probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines and each floating tine connected together between the second and third probe pads, switching devices connected to an end portion of each floating tine and connecting the floating tines to the second and third probe pads, and the fourth probe pad being a control pad which controls the switching devices. | 12-20-2012 |
| 20130002281 | CONTACT PROBE AND PROBE UNIT - A contact probe having a substantially flat plate shape, used to connect different substrates and having a uniform plate thickness includes: a first contact portion which has a side surface curved in an arc shape and which makes contact with one substrate at the side surface thereof; a second contact portion which has a side surface curved in an arc shape and which makes contact with the other substrate at the side surface thereof; a connection portion which connects the first contact portion and the second contact portion; and an elastic portion which extends from the second contact portion, has a portion curved in an arc shape, and is elastically deformed by a load applied to the first contact portion and the second contact portion. | 01-03-2013 |
| 20130015870 | TEST SYSTEM WITH CONTACT TEST PROBESAANM Nickel; Joshua G.AACI San JoseAAST CAAACO USAAGP Nickel; Joshua G. San Jose CA USAANM Pascolini; MattiaAACI San MateoAAST CAAACO USAAGP Pascolini; Mattia San Mateo CA USAANM Syed; AdilAACI Santa ClaraAAST CAAACO USAAGP Syed; Adil Santa Clara CA US - Electronic device structures such as structures containing antennas, cables, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a test system to perform conducted testing. The test system may include a vector network analyzer or other test unit that generates radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using a contact test probe that has at least signal and ground pins. The test probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault. | 01-17-2013 |
| 20130015871 | SYSTEMS, DEVICES, AND METHODS FOR TWO-SIDED TESTING OF ELECTRONIC DEVICES - Systems, devices, and methods for two-sided testing of electronic devices. These systems, devices, and methods may include the use of a test fixture that is configured to electrically connect a back side electrical pad of a device under test with an auxiliary pad that faces in a different direction than the back side electrical pad. Additionally or alternatively, these systems, devices, and methods also may include the use of a probe head that is configured to form an electrical connection with both the auxiliary pad and a front side electrical pad of the device under test. The systems, devices, and methods also may include providing a test signal to the device under test, receiving a resultant signal from the device under test, and/or analyzing the resultant signal. | 01-17-2013 |
| 20130021050 | Resonant test probe for integrated circuits - A resonant test probe for testing high-speed integrated circuit devices. The test probe includes a probe tip that makes electrical contact with a device under test to receive a test signal from the device, and an output circuit transmits the received test signal to a testing apparatus. The test probe also includes tuning circuitry coupled between the probe tip and the output circuit. The tuning circuitry is configured to tune a resonance frequency of the test probe to be substantially equal to an operating frequency of the device under test to enable the test probe to transmit the test signal to the device under test. | 01-24-2013 |
| 20130027070 | METHOD AND DEVICE FOR CONTACTING A ROW OF CONTACT AREAS WITH PROBE TIPS - The invention generally relates to a method and device for contacting contact areas ( | 01-31-2013 |
| 20130038343 | TEST CIRCUIT FOR TESTING SHORT-CIRCUIT - A test circuit includes two probes, a comparison circuit, a switch circuit, and an indication circuit. The probes are connected to an electronic component to be tested, and a low level signal is output if the electronic component is short-circuited. The comparison circuit outputs a comparison signal based on the shorting signal from the probes. The switch circuit outputs a switch signal based on the comparison signal from the comparison circuit. The indication circuit indicates that the electronic component is short-circuited or not short-circuited based on the switch signal fro m the switch circuit. | 02-14-2013 |
| 20130069680 | RISERS INCLUDING A PLURALITY OF HIGH ASPECT RATIO ELECTRICAL CONDUITS AND SYSTEMS AND METHODS OF MANUFACTURE AND USE THEROF - Risers including a plurality of high aspect ratio electrical conduits, as well as systems and methods of manufacture and/or use of the risers and/or the high aspect ratio electrical conduits. The systems and methods may include incorporation of the plurality of high aspect ratio electrical conduits within a substantially planar body that may include and/or be formed from a solid dielectric material. The plurality of electrical conduits may be configured to conduct a plurality of electric currents between a first surface of the body and a second, substantially opposed, surface of the body. The surfaces may include a plurality of contact pads configured to provide a robust and/or corrosion-resistant surface and/or to improve electrical contact between the riser and another device. The risers also may include a layered structure, wherein the layers are sequentially formed to increase a thickness of the riser and/or the aspect ratio of the electrical conduits. | 03-21-2013 |
| 20130120012 | TESTING INTEGRATED CIRCUITS USING FEW TEST PROBES - A method of testing integrated circuits, including establishing at least a first physical communication channel between a test equipment and an integrated circuit under test by having at least a first probe of the test equipment contacting a corresponding physical contact terminal of the integrated circuit under test; having the test equipment and the integrated circuit under test exchange, over said first physical communication channel, at least two signals selected from the group including at least two test stimuli and at least two test response signals, wherein said at least two signals are exchanged by means of at least one modulated carrier wave modulated by the at least two signals. | 05-16-2013 |
| 20130127486 | Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Package Having The Same - A test pad structure may include a plurality of test pads and a plurality of connection leads. A plurality of the test pads may be sequentially arranged from a wiring pattern on a substrate and arranged in rows parallel with one another. The plurality of the test pads may include a first group of test pads having at least one pad and a second group of test pads having at least two pads. A plurality of the connection leads may extend from end portions of the wiring pattern to be connected to the plurality of test pads. A plurality of the connection leads may include at least one inner lead passing between the at least two pads of the second group of the test pads and arranged in a first row closest to the first group of the test pads. The at least one inner lead may be connected to at least one pad of the at least two pads of the second group of the test pads arranged in a second row next to the first row. | 05-23-2013 |
| 20130135001 | Hybrid Electrical Contactor - An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad. | 05-30-2013 |
| 20130278280 | APPARATUS AND METHOD FOR ACTIVE VOLTAGE COMPENSATION OF ELECTROSTATIC DISCHARGE OF A SUBSTRATE - A voltage compensation assembly adapted for apparatus having a prober for contacting the electronic elements on a substrate is described. The voltage compensation assembly includes a controller connected to the prober and adapted for active voltage compensation, and a voltage measuring unit connected to the controller and for measuring a voltage on the substrate. | 10-24-2013 |
| 20130285689 | METHOD FOR DETECTING WORKING STATE OF I/O PINS OF ELECTRONIC COMPONENTS - In a method for detecting working states of I/O pins of electronic components, a signal is transmitted between at least two of the I/O pins. A probe of an oscilloscope is connected to an I/O pin. A waveform of the signal through the I/O pin is detected. Charges are transmitted to the probe. A working state of the I/O pin is determined by detecting whether the waveform of the signal through the I/O pin is changed when the charges are transmitted to the probe. | 10-31-2013 |
| 20130285690 | STIFFENER PLATE FOR A PROBECARD AND METHOD - A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. | 10-31-2013 |
| 20130300445 | VARIABLE SPACING FOUR-POINT PROBE PIN DEVICE AND METHOD - A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins include respective first portions arranged to contact the conductive layer to measure the property. In a second configuration, the first and second probe pins include respective second portions arranged to contact the conductive layer to measure the property. A first area for each respective first portion is different from a second area for each respective second portion. | 11-14-2013 |
| 20130314114 | MULTIPLE CONTACT TEST PROBE - A probe apparatus may include a plurality of probe pins attached to a probe head portion. Each of the probe pins may be independently movable relative to the probe head portion. | 11-28-2013 |
| 20130314115 | WAFER TESTING SYSTEM AND ASSOCIATED METHODS OF USE AND MANUFACTURE - A wafer testing system and associated methods of use an manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways. | 11-28-2013 |
| 20130321015 | INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus includes an insulating substrate, a probe pin having a body portion secured to the insulating substrate, a tip portion connected to one end of the body portion and disposed on the back surface side of the insulating substrate, and a connection portion connected to the other end of the body portion and disposed on the front surface side of the insulating substrate, and a heat-radiating terminal in contact with the connection portion, wherein a current is applied through the heat-radiating terminal and the probe pin to an object to measured, and wherein the heat-radiating terminal discharges heat from the probe pin. | 12-05-2013 |
| 20140009181 | Capacitive Test Device and Method for Capacitive Testing a Component - A system and a method for capacitive testing a component (including a packaged component) are disclosed. An embodiment of a test head comprises a holding unit configured to pick-up, hold and release the component, an electrode configured to receive a capacitive signal from the component and a preamplifier configured to amplify the capacitive signal. | 01-09-2014 |
| 20140035608 | SYSTEM AND METHOD FOR TESTING AN ELECTRONIC DEVICE - Adapters for electrostatic discharge probe tips are disclosed herein. An embodiment of the adapter includes an attachment device that is attachable to the tip of the probe. A first conductor is affixed to the attachment device so that the first conductor contacts the tip when the attachment device is attached to the tip of the probe. A second conductor extends between the first electrical conductor and a point external to the attachment device. | 02-06-2014 |
| 20140043054 | VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAY - A testing method (and the probes used) comprising providing one or more probes each comprising: a body portion which is substantially straight; an extended portion extending from the body portion and comprising at least two separate probe portions; and a tip portion at the opposite end of the extended portion; and contacting an object to be tested with the one or more probes. | 02-13-2014 |
| 20140055155 | Method and Apparatus for RFID Tag Testing - A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner. | 02-27-2014 |
| 20140062517 | PROBE CARD, TEST METHOD FOR IMAGING ELEMENT AND TEST APPARATUS - In accordance with an embodiment, a probe card includes a substrate, a first probe and a second probe. The substrate includes a first area and a second area adjacent to the first area. In the first area a first opening is provided. The first probe is provided in the first area. An end of the first probe extends into the first opening. The second probe is provided in the second area. | 03-06-2014 |
| 20140091821 | COMPOSITE WIRE PROBES FOR TESTING INTEGRATED CIRCUITS - An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10 | 04-03-2014 |
| 20140132298 | FINE PITCH PROBES FOR SEMICONDUCTOR TESTING, AND A METHOD TO FABRICATE AND ASSEMBLE SAME - An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes. | 05-15-2014 |
| 20140145740 | TESTING DEVICE - A testing device comprises a first probe member, a second probe member, and an insulation member. The first probe member comprises a tip portion for contacting a device being tested. The second probe member also comprises a tip portion for contacting the device being tested. The insulation member is located at or can be moved to a location between the tip portions of the first and second probe members. | 05-29-2014 |
| 20140167801 | RIGID PROBE WITH COMPLIANT CHARACTERISTICS - A probe conducts testing of a circuit. The probe includes a base coupled to a substrate. The probe also includes a cantilever attached to the base at a first end, the cantilever deflecting from a first position to a second position in which a second end opposite the first end is in contact with the substrate and to move between the second position and the first position based on movement of a compliant bump of the circuit, and a probe tip attached to the cantilever at the second end, the probe tip maintaining contact with the compliant bump of the circuit. | 06-19-2014 |
| 20140176172 | COMPOSITE WIRE PROBE TEST ASSEMBLY - An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer. | 06-26-2014 |
| 20140184258 | HIGH POWER RADIO FREQUENCY (RF) IN-LINE WAFER TESTING - Approaches for performing in line wafer testing are provided. An approach includes a method that includes generating a radio frequency (RF) test signal, and applying the RF test signal to a device under test (DUT) in a wafer using a buckling beam probe set with a predefined pitch. The method also includes detecting an output RF signal from the DUT in response to the applying the RF test signal to the DUT, and sensing at least one frequency component of the detected output RF signal. | 07-03-2014 |
| 20140210503 | STARTUP BOOT CYCLE TESTING OF A MOBILE DEVICE AT DIMINISHED POWER SUPPLY CURRENT - A startup boot cycle test system for testing a mobile multi-function device under test (DUT) that has a power manager and a main system processor is described. The system includes an external power source and a tester device. The external power source provides an input current to the power manager, which in turn provides a boot current, drawn from the input current, to the main system processor. The tester device connects to a test point in the DUT using a contact test probe to draw a margin current from the boot current. The resulting diminished boot current is used by the processor to boot. The tester device detects whether the processor successfully boots using the diminished boot current using a data input connector connected between the DUT and tester device. Other embodiments are also described and claimed. | 07-31-2014 |
| 20140239994 | Concept for Extracting a Signal Being Exchanged Between a Device Under Test and an Automatic Test Equipment - A printed circuit board has first terminals for contacting terminals of a socket, second terminals for contacting terminals of a test fixture of an automatic test equipment, which are adapted for contacting the terminals of the socket of a device under test, transmission lines for connecting the first terminals and the terminals, and an extracting circuit electrically coupled to one of the transmission lines and configured to extract the signal being exchanged between the device under test and the automatic test equipment. The extracting circuit has a resistor or an electrical resistor network, wherein a loss added on the signal being exchanged between the device under test and the automatic test equipment over the one transmission line due to the presence of the printed circuit board is smaller than 6 dB. | 08-28-2014 |
| 20140300379 | TWO-STEP INTERCONNECT TESTING OF SEMICONDUCTOR DIES - The present invention relates generally to testing of interconnects in a semiconductor die, and more particularly to testing of semiconductor chips that are three-dimensionally stacked via an interposer. In one aspect, a method for testing an interconnect in a semiconductor die comprises providing the semiconductor die, which includes a plurality of electrical contact elements formed at one or more surfaces of the semiconductor die, at least one interconnect-under-test disposed between a first electrical contact element and a second electrical contact element, and an electrical component electrically coupled between the interconnect-under-test and at least one third electrical contact element. | 10-09-2014 |
| 20140300380 | METHOD OF DETERMINING SCATTERING PARAMETERS USING MEASUREMENT ARRANGEMENT HAVING A CALIBRATION SUBSTRATE AND ELECTRONIC CIRCUIT - A method for determining scattering parameters using a calibration substrate having at least one calibration standard with at least two electrical connection points, each for one measurement gate of a vector network analyzer. At least one electrical connection point is formed of at least one calibration standard having a switch, wherein the switch has a first electrical contact electrically connected to an electrical connection point of the calibration standard, a second electrical contact designed for electrically connecting to a measurement gate of the vector network analyzer, and a third electrical contact, wherein the switch is designed such that an electrical contact is established either between the first and third electrical contact or between the first and second electrical contact. | 10-09-2014 |
| 20140333335 | PROBE - A probe includes a first deforming portion which includes a linkage mechanism formed by a vertical probe and a plurality of horizontal beams extending in a direction perpendicular to vertical direction, one ends of the horizontal beams being connected to a fixed end and the other ends being connected to the vertical probe, wherein: a vertical portion of the vertical probe extending from the horizontal beams forms a second deforming portion including a horizontal beam portion extending toward the fixed end from an intermediate part of the vertical portion; and scrubbing of the vertical probe in whole operation of an overdrive is strictly controlled by causing bending moment to act on the horizontal beam portion of the second deforming portion, simultaneously with the overdrive applying in a direction in which bending moment applied to the vertical probe of the first deforming portion is offset. | 11-13-2014 |
| 20140333336 | TESTING OF ELECTRONIC DEVICES THROUGH CAPACITIVE INTERFACE - An embodiment of a test apparatus for executing a test of a set of electronic devices having a plurality of electrically conductive terminals, the test apparatus including a plurality of electrically conductive test probes for exchanging electrical signals with the terminals, and coupling means for mechanically coupling the test probes with the electronic devices. In an embodiment, the coupling means includes insulating means for keeping each one of at least part of the test probes electrically insulated from at least one corresponding terminal during the execution of the test. Each test probe and the corresponding terminal form a capacitor for electro-magnetically coupling the test probe with the terminal. | 11-13-2014 |
| 20140347083 | SILICON-ON-INSULATOR (SOI) BODY-CONTACT PASS GATE STRUCTURE - A circuit for testing a floating body field-effect transistor (FET), and a related method, are provided. Embodiments of this invention include a circuit including a contacted-body FET structure that can be operated in a floating body mode or a body-contacted mode, and a passgate FET. A body of the contacted-body FET structure is connected to the drain of the passgate FET. Voltage can be applied to the passgate FET to either allow or restrict current flow through the passgate FET, to operate the contacted-body FET structure in body contacted mode or floating body mode. Data can be taken in each mode and compared to extract a floating body voltage. | 11-27-2014 |
| 20140354317 | CIRCUIT BOARD INSPECTION APPARATUS, CIRCUIT BOARD INSPECTION METHOD AND CIRCUIT BOARD INSPECTION TOOL - A circuit board inspection apparatus configured to perform electrical inspection of wiring patterns formed on a circuit board with a built-in electronic component is provided with a plurality of contactors, a switching circuit, and a controller. The controlling device applies voltage by using a power supply between a contactor and a contactor in a state a switch of the switching circuit is set to be ON and inspects an insulating state between two wiring patterns corresponding to two inspection points on the circuit board. At this time, if forward bias is applied to and forward current flows in diodes inserted between the contactors outside the circuit board, a potential difference between the contactors becomes equal to a potential difference between the diodes and is limited to a relatively small value. | 12-04-2014 |
| 20140375346 | TEST CONTROL DEVICE AND METHOD FOR TESTING SIGNAL INTEGRITIES OF ELECTRONIC PRODUCT - A test control device and a method automatically test signal integrities of an electronic product. The test control device includes an oscilloscope and robot devices each holding a probe of the oscilloscope. The test control device sets test projects and locations of test points of each test project on the electronic product. The test control device selects a test project and selects probes for measuring electrical outputs at the test points of the selected test project, controls robot devices holding the selected probes to move tips of the selected probes to touch the test points, and controls the electronic product to activate the test points. The oscilloscope measures the electrical outputs at the test points through the selected probes. The test control device further obtains results of the measurements from the oscilloscope, analyzes and integrates all of the measurements, and generates a signal integrity report of the electronic product. | 12-25-2014 |
| 20150008947 | BALL GRID ARRAY CONFIGURATION FOR RELIABLE TESTING - A method of testing a semiconductor die having an array of contacts, where at least two I/O pads in adjacent positions have the same data signal during testing operations with a test probe. The adjacent I/O pads form a test cluster allowing the use of a larger test probe tip and/or greater tolerance on test probe tip alignment during testing operations. | 01-08-2015 |
| 20150015288 | Test Probe Coated with Conductive Elastomer for Testing of Backdrilled Plated Through Holes in Printed Circuit Board Assembly - A test probe is provided for probing signal information on a back-drilled plated through hole connector formed in a printed circuit board, where the test probe includes a conductive probe body with a distal tip region extending a predetermined minimum coverage length (L | 01-15-2015 |
| 20150015289 | Multipath Electrical Probe And Probe Assemblies With Signal Paths Through Secondary Paths Between Electrically Conductive Guide Plates - A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. The gap can be relatively small and thus provide the probe with a low loop inductance. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. The signal path of each of the probes can be electrically insulated from both guide plates, but the secondary path of each probe can be electrically connected to one or both of the guide plates. In some configurations, the probe assembly can include one or more secondary probes disposed in passages of the conductive guide plates and electrically connected to one or both of the guide plates. In some configurations, a probe assembly can comprise probes that are substantially the same shape and/or configuration all of which are disposed in passages through substantially parallel guide plates. Some of the probes can be electrically insulated from the guide plates and thus provide signal paths, and others of the probes can be electrically connected to the guide plates and thus provide secondary paths. Any of the foregoing types of probe assemblies can be part of a test contactor such as a probe card assembly, a load board, or the like. | 01-15-2015 |
| 20150022227 | INTEGRATED HIGH-SPEED PROBE SYSTEM - An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system. | 01-22-2015 |
| 20150070037 | TEST FIXTURE FOR PROBE APPLICATION - Systems and methods to fixture and utilizing a probe which tests a capacitive array are described herein. A support bracket with freedom about a plurality of axes may aid in locating a probe and allowing the probe to contact multiple surfaces consistently. By utilizing the support bracket, the angle between a test probe and a contact surface may be minimized such that the surface of the test probe and the contact surface may rest flat against one another. The system may also limit the force translated through support bracket. This system and method may allow for a high degree of accuracy and a high degree of precision during contact of the test probe and the test surface. | 03-12-2015 |
| 20150077149 | TEST TERMINAL BLOCK - A test terminal block is formed of a series terminal block and a test plug block pluggable onto the series terminal block and fastening clamps for releasably securing them together. Each of two fastening clamps has a clamp housing contains at least two catch elements and the housing of each has at least two corresponding mating catch elements that determine two interlocking positions of fastening parts in the fastening clamps, one position is arranged after the other in the plug-on direction of the fastening parts. An unlocking element is movably arranged in the housing of each of the two fastening parts, which unlocking element can be brought into a first unlocking position and a second unlocking position, the locking of the first interlocking position being released in the first unlocking position and the locking of the second interlocking position being released in the second unlocking position by the unlocking element. | 03-19-2015 |
| 20150084660 | TIME-DOMAIN REFLECTOMETER DE-EMBED PROBE - A de-embed probe including an input configured to connect to a device under test, a memory, a signal generator connected to the input, the signal generator configured to generate a test signal, and a controller connected to the signal generator and configured to control the signal generator. The de-embed probe may be used in a test and measurement system. The test and measurement system also includes a test and measurement instrument including a processor connected to the controller of the de-embed probe, the processor configured to provide instructions to the controller, and a test and measurement input to receive an output from the de-embed probe. | 03-26-2015 |
| 20150102831 | METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND PROBING ASSEMBLY FOR USE THEREIN - A probing assembly includes a TDR probe coupling a time-domain reflectometry (TDR) device with a semiconductor device including a transistor therein, the transistor having a gate electrode, a source electrode, and a drain electrode on a substrate, wherein the TDR probe includes a first probe tip connecting the gate electrode to a signal line of the TDR device, and second to fourth probe tips connecting the source electrode, the drain electrode, and a bulk region of the substrate to ground lines of the TDR device, respectively. | 04-16-2015 |
| 20150109013 | SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME - A semiconductor device includes a unit region including a circuit test region and a probe test region. The circuit test region includes a test circuit and a plurality of circuit test pads operatively coupled to the test circuit. The probe test region includes first and second probe test pads insulated from the circuit test pads, and a first resistance pattern operatively coupled to the first and second probe test pads. | 04-23-2015 |
| 20150115989 | SEMICONDUCTOR EVALUATION APPARATUS - A semiconductor evaluation apparatus includes a jig for evaluation and a probe substrate. The jig for evaluation is provided such that a plurality of semiconductor devices can be placed thereon. The probe substrate is provided so as to face the jig for evaluation, and includes a contact probe. The jig for evaluation includes a plurality of housing portions divided by a frame portion such that the plurality of semiconductor devices can be separately placed on the plurality of housing portions, respectively. The semiconductor evaluation apparatus is configured such that the contact probe can be brought into contact with a plurality of elements in the state where a space is provided by bringing the frame portion and the probe substrate in proximity to each other. In this space, each of the plurality of semiconductor devices is placed between a corresponding one of the plurality of housing portions and the probe substrate. | 04-30-2015 |
| 20150115990 | DIE STACK TEST ARCHITECTURE AND METHOD - A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die. | 04-30-2015 |
| 20150137845 | Methods and Devices for Testing Segmented Electronic Assemblies - Methods and devices are disclosed for testing an electronic assembly comprising a number of segments. In one embodiment, a scalable periphery amplifier may comprise a number of amplifier segments. In one embodiment a method of testing the amplifier segments in a scalable periphery architecture is described. One or more of the amplifier segments can be independently turned on and/or turned off to achieve desired impedance characteristics of the overall amplifier to test the scalable periphery amplifier. In another embodiment, the electronic assembly comprises digitally tunable capacitors. | 05-21-2015 |
| 20150301124 | TESTING A MULTI-PHASE VOLTAGE REGULATOR MODULE - Low-impedance pins are electrically connected to a set of corresponding nodes of a multi-phase VRM. The multi-phase VRM is activated. A failure condition is induced in a phase of the multi-phase VRM by modifying operating parameters of the phase of the multi-phase VRM using the set of low-impedance pins. The output signal of the multi-phase VRM is monitored in response to the induced failure condition. | 10-22-2015 |
| 20150338453 | SYSTEMS AND METHODS FOR PLACEMENT OF SINGULATED SEMICONDUCTOR DEVICES FOR MULTI-SITE TESTING - Systems and methods for multi-site placement of singulated semiconductor devices are presented. The systems and methods for multi-site placement may facilitate multi-site testing of the singulated semiconductor devices. A method may include determining a quantity of singulated semiconductor devices to be arranged in a test configuration. The method may also include determining, using a data processing device, a test configuration in response to the quantity. In further embodiments, the method may include placing the singulated semiconductor devices in a test frame according to the test configuration. | 11-26-2015 |
| 20160003895 | SYSTEM AND METHOD FOR CAPACITIVE COUPLING TESTING - A system for measuring RFID strap characteristics by coupling through a dielectric. The system can include a meter, test pads, springs, and wiring. Test pads may contact a substrate opposite of the RFID strap, and the coupling capacitance through the dielectric substrate may be utilized to calculate the strap capacitance. Similarly, other electrical properties of an RFID strap or other RFID assembly may be measured by coupling through a dielectric. | 01-07-2016 |
| 20160011232 | TESTING DEVICE AND A CIRCUIT ARRANGEMENT | 01-14-2016 |
| 20160025776 | PROBES AND PROBE ASSEMBLIES FOR WAFER PROBING - In one aspect, a probe assembly for probing an IC is provided. The probe assembly includes a probe, which includes a probe head for contacting the integrated circuit and a body. The probe head is elongated in a first direction. The body includes a spring and an edge portion contacting the probe head. One conductor extends in a second direction and is configured to connect to a voltage potential. An electric field between the probe and the at least one conductor is perpendicular to a magnetic field of the probe. In another aspect, a probe assembly includes a first probe and second probe. Each of the first probe and the second probe is elongated in a first direction and is configured to contact an IC. A conductor extends in a second direction is provided between the first probe and the second probe. The conductor is connected to a voltage potential. | 01-28-2016 |
| 20160033578 | Test Switch Signal Analyzer - A test switch signal analyzer comprising: an analyzer hub operably couplable to a test switch base that includes test switch conductors; signal probe(s) couplable to the analyzer hub and to the plurality of test switch conductors when the analyzer hub is coupled to the test switch base, a signal processing unit coupled to the analyzer hub; the signal processing unit, the analyzer hub, and at least a portion of the at least one signal probe being positionable within a test switch cover that mates with the test switch base when the signal probe is coupled to the test switch conductor(s) and the test switch cover is secured to the test switch base. | 02-04-2016 |
| 20160084882 | TEST PROBE HEAD FOR FULL WAFER TESTING - A test probe head for probe testing multiple chips on a wafer in a single probing. A probe head substrate includes an array of probe tip attach pads on one surface. The array includes a subarray for each probe head chip test site. Probe tips attached to each probe tip attach pad have an across the head tip height variation less than one micrometer (1 μm). The subarray probe tips may be on a pitch at or less than fifty microns (50 μm). The test probe head may be capable of test probing all chips in a quadrant and even up to all chips on a single wafer in a single probing. | 03-24-2016 |
| 20160104956 | CABLE ASSEMBLY - A connector includes a connector body including a hole, a contact disposed in the hole and arranged such that, when the connector is connected to a substrate, the contact is connected to a corresponding electrical pad on the substrate, a conductive elastomeric interface arranged such that, when the connector is connected to the substrate, the conductive elastomeric interface is between the connector body and the substrate, and a cable connected to the contact. The contact includes a ground ferrule and a locking ferrule arranged to mate with the hole, and the hole of the connector body and the locking ferrule are at least partially threaded. When the connector is connected to the substrate and when the locking ferrule is threaded with the hole, the ground ferrule contacts at least one of the conductive elastomeric interface and the upper surface of the substrate. | 04-14-2016 |
| 20160139178 | DUAL OUTPUT HIGH VOLTAGE ACTIVE PROBE WITH OUTPUT CLAMPING AND ASSOCIATED METHODS - A high-voltage active measurement probe is for a measurement instrument such as an oscilloscope. The high voltage active measurement probe includes an input terminal configured to receive an input signal from a device under test (DUT), a first output terminal configured to transmit a first output signal to the measurement instrument for measurement and display of peak voltages, and a second output terminal configured to transmit a second output signal to the measurement instrument for high sensitivity measurement and display of low level voltages. A first probe signal path is between the input terminal and the first output terminal, and a second probe signal path between the input terminal and the second output terminal. A first amplifier is in the first probe signal path between the input terminal and the first output terminal, and a second amplifier is in the second probe signal path between the input terminal and the second output terminal. A first attenuator is in the first probe signal path between the input terminal and the first amplifier, and a second attenuator in the second probe signal path between the input terminal and the second amplifier. A clamping circuit is in the second signal path between the second amplifier and the second output terminal and configured to clamp an internal probe signal, e.g. between an upper clamping threshold and a lower clamping threshold, to produce the second output signal. | 05-19-2016 |
| 20160178664 | SINGLE-ENDED TEST PROBE HAVING GROUND AND SIGNAL TIPS | 06-23-2016 |
| 20160187380 | Method and Apparatus for RFID Tag Testing - A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner. | 06-30-2016 |
| 20220137094 | INSPECTION JIG - An inspection jig includes contact terminals and a pitch conversion unit electrically connected to the contact terminals and configured to convert a first pitch between adjacent two of the contact terminals into a second pitch different from the first pitch. The contact terminals each include a tubular body that extends in an axial direction of the contact terminal and is electrically conductive, and a conductor that is electrically conductive and has a stick shape. The tubular body includes a spring portion that has a helical shape along a peripheral surface of the tubular body. The conductor includes an uninserted portion that protrudes from the tubular body toward a first side in the axial direction, and an inserted portion that is disposed in the tubular body and is fixed to a first axial end portion of the tubular body. The pitch conversion unit includes a board portion and a protruding portion. | 05-05-2022 |
