| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324754100 | Probe contact confirmation | 10 |
| 20110025356 | METHOD FOR MAKING ELECTRICAL TEST PROBE CONTACTS - A method of testing an electrical component includes coupling the electrical component to at least a first probe, a second probe, and a third probe. The probes are in communication with a test control module. Furthermore, the method includes confirming that the probes are in sufficient electrical connection with the electrical component by allowing the test control module to supply a current through the electrical component via the first probe and the third probe, and simultaneously detecting a potential difference across the electrical component by the second probe and the third probe. Furthermore, the method includes testing a performance characteristic of the electrical component by supplying a redundant signal to the electrical component via at least two of the first probe, the second probe, and the third probe. | 02-03-2011 |
| 20110133765 | METHOD AND APPARATUS FOR PROBE CONTACTING - There is provided a method and a device for accurately detecting the contact of a mechanical probe with a contact object. The contact detecting device comprises a mechanical probe movable for being in contact with a contacted object, a charged particle beam source which generates a charged particle beam applied to the contacted object, a detector for detecting secondary particles or reflected particles from the contacted object, a calculating device which calculates, from a detection signal from the detector, a feature quantity of a shadow of the mechanical probe projected on the contacted object, and a control device which controls the operation of the mechanical probe. The calculating device calculates, as the feature quantity of the shadow of the mechanical probe, a shadow depth S(x, y), and obtains an evaluation value J(z), showing a distance between the contacted object and the mechanical probe, based on the shadow depth S(x, y). | 06-09-2011 |
| 20130049782 | METHOD FOR CLEANING A CONTACT PAD OF A MICROSTRUCTURE AND CORRESPONDING CANTILEVER CONTACT PROBE AND PROBE TESTING HEAD - A method for cleaning a contact pad of a microstructure or device to be tested when it is in electric contact with a measure apparatus, being obtained by electrically contacting a flexible probe with said contact pad. The method includes mechanically engaging a free end of the flexible probe in a manner that sticks the free end in the pad; and laterally flexing, by means of a tip charge, the flexible probe in a manner that keeps the free end stuck in the pad, so as to locally dig into a covering layer of the pad and realize a localized crushing thereof. | 02-28-2013 |
| 20130106455 | PRESSURE SENSING AND CONTROL FOR SEMICONDUCTOR WAFER PROBING | 05-02-2013 |
| 20130154679 | TESTING SYSTEM - Disclosed is a testing system, which includes a thin film transistor substrate. The thin film transistor substrate includes a plurality of thin film transistors and a plurality of connecting pads. Each of the thin film transistors includes a first electrode, a second electrode, and a third electrode. The thin film transistor substrate further includes a testing pad. One of the first electrode and the second electrode of each of the thin film transistors is electrically connected with one of the connecting pads. The third electrode and the other one of the first electrode and the second electrode of each of the thin film transistors are electrically connected with the testing pad. The testing system of the present invention is capable of decreasing the cost of the testing system and the complexity of disposed circuits. | 06-20-2013 |
| 20140091820 | PROBE OUT-OF-POSITION SENSING FOR AUTOMATED TEST EQUIPMENT - Detecting misalignment of test probes with component carriers in an automated test system is taught. Automated test systems for testing electronic components can have electronic components held in component carriers in preparation for testing. Testing can include moving test probes through openings provided in the component carrier to contact the electronic components held therein. Aspects of disclosed implementations use force feedback from the test probes to determine if the test probes have successfully contacted the electronic component without, for example, contacting the component carrier. | 04-03-2014 |
| 20150084659 | CONTACT ARRANGEMENTS AND METHODS FOR DETECTING INCORRECT MECHANICAL CONTACTING OF CONTACT STRUCTURES - A contact arrangement is provided, including a contact structure and a sense structure. The sense structure may be arranged in proximity of the contact structure. The sense structure may be configured such that a correct mechanical contacting of the contact structure will not impact the sense structure and an incorrect mechanical contacting of the contact structure will impact the sense structure. | 03-26-2015 |
| 20160018441 | PROBE CARD, AND CONNECTING CIRCUIT BOARD AND SIGNAL FEEDING STRUCTURE THEREOF - A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end. | 01-21-2016 |
| 20160054385 | CAPACITIVE OPENS TESTING OF LOW PROFILE COMPONENTS - A probe assembly for capacitive testing electrical connections of a low profile component to a circuit assembly. The probe assembly is configured to reduce coupling of noise signals from the circuit assembly to the capacitive probe. The probe assembly includes a sensing member with a geometry that allows the probe to preferentially couple to test signals from the pins of a component under test rather than conductive structures on the circuit assembly, such as pads, and signal traces to which those pins are attached. The sensing member may be a vertical capacitive sense plate such that coupling is to an edge of the plate. The sensing member alternatively may be a horizontal capacitive sense plate with an active area of the probe surrounded by an isolation ring. Measurements made with such capacitive probes may provide test measurements that yield a reliable discrimination between a properly attached pin and an open pin. | 02-25-2016 |
| 20160077147 | INTEGRATED FAN-OUT PILLAR PROBE SYSTEM - Disclosed herein is a method of probe testing dies, the method comprising loading a wafer having a first die and a second die into a prober and bringing probes of the prober into contact with first contact pads of the first die according to first probe parameters. A first probe contact test of first values of the contact between the probes and the first contact pads is performed, and a die test of the first die is performed after performing the probe contact test. Results of the die test and results of the probe contact test are saved and second probe parameters are automatically generated based on at least the results of the first probe contact test. | 03-17-2016 |
