| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324754030 |
Contact probe
| 233 |
| 324754210 |
Non-contact probe
| 63 |
| 324754020 |
Hand-held | 2 |
| 20140035607 | Handheld Devices, Systems, and Methods for Measuring Parameters - Embodiments of the present disclosure are generally directed to handheld systems, individual components, and methods of using such systems and components for measuring parameters, such as electrical, mechanical, and physical measurement parameters. In one embodiment of the present disclosure, a host handheld device generally includes a measuring system for measuring a first parameter, wherein the first parameter is an electrical parameter, and a receiving system for receiving at least a second parameter from a separate module device. | 02-06-2014 |
| 20160187383 | Talking Test Light - A hand-held electric circuit tester includes a probe. The probe includes a hollow body, a control circuit, a probe member, and a speaker. The probe member is operatively mounted in the hollow body, and is configured to contact a probe location of an electric circuit to be measured and electrically connect the probe location with the control circuit to produce a measurement. The control circuit is configured to generate a voice signal with reference to the measurement of the probe and output the voice signal to the speaker, which is configured to generate a voice output with reference to the voice signal indicative of the measurement. The probe can include a first switch for operating the probe member, a microphone for voice activation, or a second switch for selecting between different voices for the voice output, with the different voices stored in computer-readable memory. | 06-30-2016 |
| Entries |
| Document | Title | Date |
|---|
| 20110006793 | OSCILLOSCOPE PROBE - Disclosed is a probe ( | 01-13-2011 |
| 20110204910 | METHOD AND APPARATUS FOR TESTING ELECTRICAL CONNECTIONS ON A PRINTED CIRCUIT BOARD - A test system and method for identifying open and shorted connections on a printed circuit board (PCB). An integrated circuit (IC) unit on the PCB is configured to generate a test signal on an output pin connected to a test pin on a second device, connector, or socket on the PCB. For a connection, the test signal is capacitively coupled to a detector plate proximal the second device. Based on the signal coupled to the detector, time domain analysis is performed on the coupled signal to determine if the test pin has a good connection to the PCB or if the pin is open or shorted. Analysis may include cross-correlating the coupled signal with a learned signal obtained from a known “good” PCB. The test pin may pass the test if the cross-correlation is within a specified threshold window. If the test fails, additional tests may be performed to troubleshoot the cause of the testing failure. | 08-25-2011 |
| 20110291681 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes: a first power line coupled to a first power transfer pad; a second power line coupled to a second power transfer pad; and a test option unit coupled to the first and second power lines and configured to couple the first and second power lines. | 12-01-2011 |
| 20120119771 | METHOD AND APPARATUS FOR INDEXING AN ADJUSTABLE TEST PROBE TIP - Embodiments of the present invention are directed to adjustable test probe tips that are indexable. In one embodiment a mechanism is coupled to a probe tip so that the mechanism may be used to index the probe tip to a plurality of particular positions. A label portion may be provided to communicate to a user that the length of the exposed probe tip is less than a particular length, such as the maximum length an exposed probe tip may be for a particular application. | 05-17-2012 |
| 20120146676 | METHOD FOR MEASUREMENT OF A POWER DEVICE - A method is disclosed for the measurement of a power device in a prober, which serves the examination and testing of such components. In the process, a power device is held by a chuck, and at least one electric probe is held by a probe holder, and optionally, the power device or the probe is positioned each relative to the other using a positioning device with an electrical drive, and contacts the power device. At the same time, an electrical connection remains between the probe to a signal unit with which a power signal is sent out or received, is blocked and only unblocked when it is determined that the contact between probe | 06-14-2012 |
| 20120235696 | HIGH FREQUENCY ANALYSIS OF A DEVICE UNDER TEST - Analyzing a device under test (“DUT”) at higher frequencies. A phase shifter varies the phase of a standing wave on a transmission line coupled to the DUT. The standing wave magnitude is sampled at each of the phase shifts and one or more DUT characteristics are determined as a function of the sampled magnitudes and phase shifts. Further aspects include a related phase shifter comprising a waveguide having a plurality of sub-resonant slots formed therein and having active elements for loading the slots to control the phase shift applied to the signal. | 09-20-2012 |
| 20120319712 | Probe Module With Interleaved Serpentine Test Contacts For Electronic Device Testing - A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught. | 12-20-2012 |
| 20130076384 | METHOD FOR TESTING MULTI-CHIP STACKED PACKAGES - Disclosed is a method for testing multi-chip stacked packages. Initially, one or more substrate-less chip cubes are provided, each consisting of a plurality of chips such as chips stacked together having vertically connected with TSV's where there is a stacked gap between two adjacent chips. Next, the substrate-less chip cubes are adhered onto an adhesive tape where the adhesive tape is attached inside an opening of a tape carrier. Then, a filling encapsulant is formed on the adhesive tape to completely fill the chip stacked gaps. Next, the tape carrier is fixed on a wafer testing carrier in a manner to allow the substrate-less chip cubes to be loaded into a wafer tester without releasing from the adhesive tape. Accordingly, the probers of the wafer tester can be utilized to probe testing electrodes of the substrate-less chip cubes so that it is easy to integrate this testing method in TSV fabrication processes. | 03-28-2013 |
| 20130154680 | SIGNAL TRANSMISSION LINES WITH TEST PAD - A pair of signal transmission lines includes an aggressor line, a victim line, a first test pad, and a second test pad. The first test pad is in the aggressor line. The victim line is parallel to the aggressor line. A second test pad is in the victim line. The first test pad, on the aggressor line, is misaligned with the second test pad, on the victim line, to reduce the incidence and amplitude of any crosstalk generated. | 06-20-2013 |
| 20130265072 | DISPLAY APPARATUS AND METHOD OF TESTING THE SAME - A display apparatus includes a display panel including a plurality of pixels, a plurality of first lines and a plurality of second lines, a plurality of first pads electrically connected to the first lines, respectively, where the first pads are divided into a first group and a second group, a plurality of pads including a second pad, a third pad, a fourth pad and a fifth pad, a first shorting bar configured to be connected to the first group of the first pads and to be connected between the second pad and the fourth pad during a test process of the first lines, and a second shorting bar configured to be connected to the second group of the first pads and to be connected between the third pad and the fifth pad during the test process of the first lines. | 10-10-2013 |
| 20140070830 | MEASURING DEVICE, MEASURING METHOD, AND ELEMENT MANUFACTURING METHOD INCLUDING MEASURING METHOD - A measuring device includes: a probe applying a voltage to an electrode of an element; and a supplying member supplying an insulating liquid to a contact portion between the electrode and the probe via a surface of the probe. Accordingly, the insulating liquid can be securely supplied to the contact portion between the electrode and the probe via the surface of the probe positioned relative to the electrode. | 03-13-2014 |
| 20140320157 | OSCILLOSCOPE PROBE HAVING OUTPUT CLAMPING CIRCUIT - A probe for a measurement instrument comprises an input terminal configured to receive an input signal from a device under test (DUT), an output terminal configured to transmit an output signal to a measurement instrument, and a clamping circuit disposed in a signal path between the input terminal and the output terminal and configured to clamp an internal probe signal between an upper clamping threshold and a lower clamping threshold to produce the output signal, wherein the clamping circuit operates with substantial gain and amplitude linearity throughout a range between the upper clamping threshold and the lower clamping threshold. | 10-30-2014 |
