Class / Patent application number | Description | Number of patent applications / Date published |
324754080 | In or on support for device under test | 13 |
20110115513 | WAFER PROBER AND FAILURE ANALYSIS METHOD USING THE SAME - According to one embodiment, a wafer prober for conducting a backside analysis on a wafer is provided. The wafer prober includes a wafer stage and a movable plate. The wafer stage includes surface and back opposed in a thickness direction, a concave portion provided at the surface which supports the wafer, and a first through hole which passes through a bottom face of the concave portion in the thickness direction in the concave portion. The movable plate is accommodated in the concave portion of the wafer stage. The movable plate is movable in a direction parallel to a top face of the wafer stage. The movable plate has a thickness equivalent to a depth of the concave portion of the wafer stage. The movable plate has a second through hole. The second through hole passes through the movable plate in a thickness direction. The second through hole is smaller than the first through hole. The second through hole communicates with the first through hole. | 05-19-2011 |
20110285415 | Connector And Semiconductor Testing Device Using The Same - A ground terminal has a cylindrical main body. A signal terminal has a terminal main body that is disposed on the inside of the cylindrical main body, and a connecting plate portion that extends from an end portion of the terminal main body. Additionally, a ground terminal has at least three connecting plate portions that are disposed so as to encompass the connecting plate portion of the ground terminal, each extending from mutually different positions on an edge of the cylindrical main body. | 11-24-2011 |
20110291683 | APPARATUS AND METHOD FOR ELECTROSTATIC DISCHARGE (ESD) REDUCTION - A substrate support unit adapted for a system for testing or processing of a substrate is provided. The substrate support unit includes a support table having at least one substrate carrier structure adapted to support a substrate, wherein the substrate carrier structure is electrically floating with respect to ground. | 12-01-2011 |
20110316574 | PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATE - A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate. | 12-29-2011 |
20140159758 | ASSEMBLY FOR OPTICAL BACKSIDE FAILURE ANALYSIS OF PACKAGE-ON-PACKAGE (POP) DURING ELECTRICAL TESTING - A method and apparatus for testing a package-on-package digital device is provided. The method includes the steps of: affixing a top device onto a wing board; affixing a bottom device onto the wing board; connecting the top side solderballs of the bottom package to the bond fingers of the wing board. The wing board is then mounted onto a flat top socket. Once the mounting has been completed, the testing begins, and may use a solid immersion lens or optical diagnostic tool. The configuration of the flat top socket and wing board allows the optical diagnostic tool full access to the bottom device for the testing process and failure analysis. | 06-12-2014 |
20140253162 | INTEGRATED CIRCUIT TEST SYSTEM AND METHOD - A system for testing a device under test (DUT) includes a probe card and a test module. The probe card includes probe beds electrically coupled to a circuit board and a first plurality of electrical contacts coupled to the circuit board, which are for engaging respective ones of a plurality of electrical contacts of a test equipment module. Probes are coupled to respective probe beds and are disposed to engage electrical contacts of the DUT. The probe card includes a second plurality of electrical contacts coupled to the circuit board. The first and second pluralities of contacts are mutually exclusive. The test module includes a memory, a processor, and a plurality of electrical contacts electrically coupled to respective ones of the second plurality of electrical contacts of the probe card. The circuit board includes a first electrical path for electrically coupling the test equipment module to the test module. | 09-11-2014 |
20150008948 | PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATE - A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate. | 01-08-2015 |
20150048857 | UNIVERSAL WATTHOUR METER SOCKET/ADAPTER FOR FIELD TESTING - A universal meter socket for portable test equipment has low insertion and extraction forces. The universal meter socket is durable and light in weight, providing a long service life. The universal meter socket contains field-cleanable terminals with replaceable wear components. The universal meter socket also optimizes short current paths for the high current section of the meter, further reducing equipment weight by reducing wire weight and volt-ampere (hereinafter sometimes VA) drive requirements for test equipment. The universal meter socket complies with ANSI C12.7-2005 REQUIREMENTS FOR WATTHOUR METER SOCKETS. The universal meter socket is generally intended for use with electricity meters that comply with ANSI C12 requirements. | 02-19-2015 |
20150130488 | INSPECTION APPARATUS - An inspection apparatus capable of reducing the effect of noises is provided. An inspection apparatus according to the present invention includes a work table | 05-14-2015 |
20160116502 | TEST PROBE, TEST PROBE COMPONENT AND TEST PLATFORM - The present invention discloses a test probe, a test probe component, and a test platform. The test probe comprises a probe body, wherein one end of the probe body is of a hollow design, thereby cooperating with a gold finger through insertion. According to the present invention, one end of the probe body is of a hollow design, thereby cooperating with the gold finger through insertion, thus solving the current technical problems of the assembling of the probe being relatively difficult, the requirements for processing of the through-hole being relative high, and the powering on being unstable. | 04-28-2016 |
20160125776 | METHOD AND DEVICE FOR DETECTING DEFECT OF DISPLAY PANEL - A method and device for detecting a defect of a display panel, the method comprises steps of: connecting at least one electrical test pad on the display panel to a first detecting terminal, and connecting another at least one electrical test pad on the display panel to a second detecting terminal; providing a preset voltage between the first detecting terminal and the second detecting terminal; and, detecting whether magnitudes of currents passing through the first detecting terminal and the second detecting terminal within a predetermined time are less than a preset current threshold, and if not, then determining there is a defect on the display panel. The present disclosure can implement effective detection and interception of a progressive defect or badness in the display panel. | 05-05-2016 |
324754090 | Carrier feature | 2 |
20130063172 | CONTACTOR WITH MULTI-PIN DEVICE CONTACTS - A contactor assembly for automated testing a device under test (DUT) that includes a plurality of separate electrodes including a first electrode includes a tester load board and a contactor body coupled to the tester load board. A plurality of contactor pins carried by the contactor body includes a first contactor pin and a second contactor pin that are electrically coupled to the tester load board. The tester load board is configured to couple the plurality of contactor pins to automatic test equipment (ATE) for testing the DUT. The first contactor pin and second contactor pin are positioned to both contact the first electrode. A first path to the first contactor pin and a second path to the second contactor pin are electrically shorted together by the contactor assembly to be electrically in parallel to provide redundant paths to the first electrode during automated testing of the DUT. | 03-14-2013 |
20140097862 | TEST STRUCTURE FOR WAFER ACCEPTANCE TEST AND TEST PROCESS FOR PROBECARD NEEDLES - Provided is a test structure for wafer acceptance test (WAT). The test structure includes a row of a plurality of first pads electrically connecting to each other, a second pad, a third pad, a first peripheral metal line, and a second peripheral metal line. The second pad is disposed in the vicinity of a first end of the row, wherein the second pad is electrically disconnected to the first pads. The third pad is disposed in the vicinity of a second end of the row, wherein the third pad is electrically disconnected to the first pads. The first peripheral metal line is disposed at a first side of the row and electrically connected to the second pad. The second peripheral metal line is disposed at a second side of the row and electrically connected to the third pad. | 04-10-2014 |