Class / Patent application number | Description | Number of patent applications / Date published |
324754110 | Probe contact enhancement or compensation | 42 |
20100277190 | PROBE WITH HIGH-PRECISION DC-VOLTAGE MEASUREMENT - A test-signal detection system provides a probe, a first transmission line and a measuring device. The probe is connected to the measuring device by the first transmission line. The first transmission line transmits broadband test signals to the measuring device. The test-signal detection system provides at least one further transmission line. The probe is additionally connected to the measuring device at least indirectly by the at least one further transmission line. The at least one further transmission line transmits DC-voltage test signals to the measuring device. | 11-04-2010 |
20100277191 | SPRING CONTACT PIN FOR AN IC TEST SOCKET AND THE LIKE - A spring contact pin includes a depressible probe member having a tapered configuration that prevents contact between the projecting end of the probe member and the end of the spring barrel throughout the compression and release cycle of the probe. The tapered configuration of the depressible probe member improves the mechanical performance, reliability, and high-speed signal performance of the contact pin. | 11-04-2010 |
20110018567 | SENSING PROBE FOR MEASURING DEVICE PERFORMANCE - A sensing probe for measuring device performance electrically at a delivery inspection is disclosed. The probe comprises a plunger, a barrel and a coil spring. The plunger provides a groove in an outer surface thereof, while, the inner surface of the barrel provides a projection. The groove comprises a plurality of unit patterns including a front groove and a rear groove. The projection slides in the front groove as the plunger is pulled into the barrel, while, it slides in the rear groove as the plunger is pushed out from the barrel. Moreover, the plunger rotates in the barrel as the projection slides in the front and rear grooves, which makes an area of the plunger coming in contact with the barrel always fresh and lowers the contact resistance between them. | 01-27-2011 |
20110121847 | PROBE, ELECTRONIC DEVICE TEST APPARATUS, AND METHOD OF PRODUCING THE SAME - A probe comprises: a membrane having a bump which contacts an input/output terminal of an IC device built into a semiconductor wafer under test; a pitch conversion board having a bottom surface on which a first terminal is provided and a top surface on which a second terminal connected to the first terminal is provided; a circuit board which is electrically connected to a test head and has a third terminal; a first anisotropic conductive rubber member having a first conductor part which electrically connects the bump of the membrane and the first terminal of the pitch conversion board; and a second anisotropic conductive rubber member having a second conductor part which electrically connects the second terminal of the pitch conversion board and the third terminal of the circuit board, and the second conductor parts are provided on the whole of the second anisotropic conductive rubber member. | 05-26-2011 |
20110248735 | Probecard System and Method - A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. The adjustment mechanisms allow for quick, sensitive adjustment of the positions of microelectronic contactors relative to semiconductor devices to be tested. | 10-13-2011 |
20110254575 | PROBE CONNECTOR - A probe connector ( | 10-20-2011 |
20120019275 | Contact -Connection Unit for a Test Apparatus for Testing Printed Circuit Boards - The invention relates to a contacting unit for a test apparatus for testing printed circuit boards. The contacting unit comprises a full grid cassette and an adapter. The full grid cassette is provided with a plurality of spring contact pins arranged in the grid of contact points of a basic grid of a test apparatus. The adapter is provided with test needles for electrically connecting each of the spring contact pins of the full grid cassette to a circuit board test point of a printed circuit board to be tested, the spring contact pins being secured in the full grid cassette against falling out on the side remote from the adapter and the test needles being secured in the adapter on the side remote from the full grid cassette. The adapter and the full grid cassette are releasably joined to each other. In this way, both the spring contact pins and the test needles are secured against falling out of the contacting unit in the assembled state of the adapter and the full grid cassette. | 01-26-2012 |
20120043984 | Test Adapter and Method for Achieving Optical Alignment and Thermal Coupling Thereof With a Device Under Test - Independent assemblies are compliantly mounted to a force transfer mechanism to optically align and thermally couple a device under test (DUT) to a test apparatus. A first assembly includes an optical connector. The first assembly has an alignment feature and a first compliant interface. A second assembly includes a thermal control member and force transfer members coupled to a structure. A passage permits a portion of the arm of the first assembly to extend through the structure. The force transfer members provide respective seats for an additional compliant interface. The alignment feature engages a corresponding feature to align the optical connector with the DUT before the compliant interfaces compress under an external force. Compliant mounting of the assemblies accommodates manufacturing tolerances in the DUT so that contact forces on the DUT are relatively consistent and thereby enable consistent optical and thermal coupling between the test apparatus and the DUT. | 02-23-2012 |
20120043985 | Electrical Probe and Associated Method - An electrical probe and associated method are provided to establish electrical contact with a wire. The electrical probe includes an elongate member extending between opposed first and second ends, and first and second needles connected to the elongate member and extending beyond the first end of the elongate member. The electrical probe also includes first and second conductors electrically connected to the first and second needles, respectively, and extending along the elongate member. The electrical probe also includes a bumper stop connected to the elongate member proximate the first end of the tube. Further, the electrical probe includes a movable engagement member extending lengthwise along the elongate member. The moveable engagement member includes a hook that extends beyond the first end of the elongate member and beyond the first and second needles. The hook may include a terminal portion configured to contact the bumper stop. | 02-23-2012 |
20120074976 | WAFER TESTING SYSTEMS AND ASSOCIATED METHODS OF USE AND MANUFACTURE - A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways. | 03-29-2012 |
20120074977 | WAFER PROBE STATION CAPABLE OF ACTIVELY CONTROLLING TILT OF CHUCK AND CONTROLLING METHOD THEREOF - The wafer probe station includes: a plurality of the pressure sensors; a tilt correction unit which is constructed with a plurality of actuators, a plurality of displacement sensors which are disposed at positions adjacent to the corresponding actuators and a microcomputer; and a control unit which allows the wafer to be come in contact with the probe card by lifting up a Z-axis stage by a predetermined overdriving amount, extracts the pressure values of the installation positions from the pressure sensors, calculates driving amounts of the actuators of the tilt correction unit by using the pressure values so that a uniform load is applied to the chuck, calculates X and Y directional displacement values w occurring according to a change in a tilt of the chuck, lifts down the Z-axis stage, and after that, corrects an eccentric load of the chuck by driving the actuators of the tilt correction unit according to the driving amounts, and controls movement of the XY-axis stage by using the X and Y directional displacement values w. Accordingly, it is possible to accurately sense an eccentric load occurring at the time of performing the overdriving, and it is possible to rapidly and accurately perform initial setting for the eccentric load by adjusting a tilt of the chuck, so that it is possible to reduce a read time of a testing process. | 03-29-2012 |
20120161806 | PROBE MANUFACTURING METHOD, PROBE STRUCTURE, PROBE APPARATUS, AND TEST APPARATUS - Minute probes are created to correspond to the alignment of the input/output terminals of a device under test. A probe manufacturing method of manufacturing a probe, includes: forming a contact section on a probe main body; and shaping at least one of the contact section and the probe main body by cutting by means of a cutting tool. The contact section is formed on a substrate that is to become the probe main body, and the probe manufacturing method further includes: after shaping at least one of the contact section and the substrate that is to become the probe main body, removing the portion of the substrate excluding the probe main body thereby forming a probe. | 06-28-2012 |
20120182036 | CONTACT PROBE AND SOCKET - A contact probe includes: a first and second plungers, one of the first and second plungers being connected to an object to be inspected, the other being connected to an inspecting board; and a spring urging the first and second plungers so as to be separated from each other. The first plunger includes a distal end side columnar part and a flange part. The flange part includes a first portion that has a first length from a center point, which is, greater than a radius of the distal end side columnar part, in a first direction perpendicular to an axial direction, and includes a second portion that has a second length from the center point, which is smaller than the radius of the distal end side columnar part, in a second direction perpendicular to the axial direction and different from the first direction. | 07-19-2012 |
20120242361 | SCR Module Dynamic Counter Tester - An SCR module tester facilitates rapid testing of SCR modules by a series of tests that are tailored to detect faults without applying full power to the modules. The SCR tester includes a quick clamp connector that is able to securely and easily clamp SCR modules for both the F/A-18 A/D GCU and F/A-18-E/F GCU facilitating the rapid testing of SCR modules. | 09-27-2012 |
20120268152 | CONNECTION DEVICE FOR QUALITY TESTING OF CHARGE-COUPLED DEVICE MODULES - A connection device for connecting charge-coupled device (CCD) modules to test apparatuses to test the CCD modules includes a connection unit and a test unit. The connection unit includes a plurality of connection pins. The unit under test is electrically connected to the connection unit and the test apparatuses. When the connection pins are in contact with the CCD modules, the CCD modules are electrically connected to the test apparatuses through the connection unit and the test unit, such that the test apparatus receives electric signals generated by the CCD modules to enable quality testing of the CCD modules. | 10-25-2012 |
20130088250 | CONTACT APPARATUS AND SEMICONDUCTOR TEST EQUIPMENT USING THE SAME - A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block. | 04-11-2013 |
20130093448 | VOLTAGE TESTER HAVING ALTERNATIVELY ATTACHABLE OR SEPARABLE PROBES - A tester includes a main body and a removable probe. The main body includes a main body probe and a front panel including selectable options for selecting a tester function. The removable probe may be coupled to the main body via a cord. The removable probe is fixable to the main body via a latch assembly. The latch assembly including a socket disposed on one of the removable probe or the main body and a mating protrusion disposed at the other of the removable probe or the main body, the main body having a probe support ridge associated therewith and the removable probe having an alignment ridge associated therewith, the alignment ridge and the probe support ridge lying in a same plane when the mating protrusion is inserted into the socket. | 04-18-2013 |
20130093449 | VOLTAGE TESTER HAVING ALTERNATIVELY ATTACHABLE OR SEPARABLE PROBES - A tester includes a main body and a removable probe. The main body includes a main body probe and a front panel including selectable options for selecting a tester function. The removable probe may be coupled to the main body via a cord. The removable probe is fixable to the main body via a latch assembly. The latch assembly includes a socket disposed on one of the removable probe or the main body and a mating protrusion disposed at the other of the removable probe or the main body. | 04-18-2013 |
20130099810 | Electrically Conductive Kelvin Contacts For Microcircuit Tester - Terminals ( | 04-25-2013 |
20130099811 | PROBE - Disclosed is a probe which stably transmits a test signal. The probe electrically connects a semiconductor device and a tester for testing the semiconductor device. The probe may include an upper plunger which is configured to be electrically connected to the semiconductor device; a lower plunger which is configured to be electrically connected to the tester; an elastic member which is disposed between the upper plunger and the lower plunger, and elastically biases the upper and lower plungers to have them spaced from each other; a conductive member which is disposed in an inside or outside of the elastic member and electrically connects the upper plunger and the lower plunger; and a barrel which accommodates therein the upper plunger, the lower plunger, the elastic member and the conductive member. | 04-25-2013 |
20130222003 | WIRING BOARD AND PROBE CARD USING THE SAME - A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability. | 08-29-2013 |
20140009182 | Electrical Contactor and Contact Method for the Same - An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S | 01-09-2014 |
20140021976 | CONTACT INSPECTION DEVICE - A contact inspection device including contacts that contact with a test object for inspection, each contact having a base end portion, a needle tip portion having a needle tip that contacts with the test object, and an elastically deformable portion located between the base end portion and the needle tip portion, with the base end portion and the needle tip portion having axes which coincide with each other. The elastically deformable portion is deformable under a compressive force applied in the axial direction of the needle tip portion while the needle tip is pressed against the test object and converts the compressive force into a tilting motion of the needle tip portion about the needle tip through deformation. The needle tip portion is displaceable in a direction in which the needle tip portion is pivotally tilted while the needle tip is pressed against the test object. | 01-23-2014 |
20140070832 | INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS - An interconnect assembly includes a bond pad and an interconnect structure configured to electrically couple an electronic structure to the bond pad. The interconnect structure physically contacts areas of the bond pad that are located outside of a probe contact area that may have been damaged during testing. Insulating material covers the probe contact area and defines openings spaced apart from the probe contact area. The interconnect structure extends through the openings to contact the bond pad. | 03-13-2014 |
20140139248 | TEST APPARATUS HAVING A PROBE CORE WITH A TWIST LOCK MECHANISM - A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core. | 05-22-2014 |
20140176174 | DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS - Nano spike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a translator having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer-side sites are carried by the translator at the wafer side of the translator. The nanospikes can be attached to nanospike sites on a wafer side of a translator. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, the nanospikes can be formed by sputtering over a metal carrier with a photoresist mask. In particular embodiments, the nanospikes have generally conical cross-section. | 06-26-2014 |
20140347084 | LOW OVERDRIVE PROBES WITH HIGH OVERDRIVE SUBSTRATE - A method for testing a semiconductor device is disclosed. The method comprises positioning a probe card comprising a plurality of probes above the semiconductor device and moving the probe card in a vertical direction towards the semiconductor device. The plurality of probes are moving in a vertical direction towards a plurality of electrical structures of the semiconductor device until each probe of the plurality of probes has made mechanical contact with a corresponding electrical structure of the plurality of electrical structures with a minimum quantity of force. The each probe of the plurality of probes absorbs a portion of vertical overdrive after contacting their corresponding electrical structures. The probe card absorbs any remaining vertical overdrive. The vertical overdrive is a continuing vertical movement of the plurality of probes after a first probe of the plurality of probes mechanically contacts a first corresponding electrical structure. | 11-27-2014 |
20150008949 | BALL GRID ARRAY CONFIGURATION FOR RELIABLE TESTING - A semiconductor die with an array of contacts, where at least two contacts in adjacent positions have the same data signal during testing operations with a test probe. The adjacent contacts of the cluster allow the use of a larger test probe tip and/or greater tolerance on test probe tip alignment during testing operations. | 01-08-2015 |
20150022228 | CONDUCTIVITY INSPECTION APPARATUS AND CONDUCTIVITY INSPECTION METHOD - At least two needles ( | 01-22-2015 |
20150054540 | CONNECTOR, PROBE, AND METHOD OF MANUFACTURING PROBE - A connector includes multiple probes and a first insulator part and a second insulator part joined to cover the probes. Each of the probes has a monolithic structure of a single bent metal plate. Each of the probes includes an end part configured to come into contact with an electrode terminal; a spring part having a meandering shape and connected to the end part; a housing part bent to enclose the spring part; and a bent part provided between the spring part and the housing part. The end parts of the probes are at least partially projecting outward from first openings provided in the first insulator part, and the bent parts of the probes are at least partially projecting outward from second openings provided in the second insulator part. | 02-26-2015 |
20150061714 | Apparatus and Method for Accurate Measurement and Mapping of Forward and Reverse-Bias Current-Voltage Characteristics of Large Area Lateral P-N Junctions - Methods and apparatus for providing measurements in p-n junctions and taking into account the lateral current for improved accuracy are disclosed. The lateral current may be controlled, allowing the spreading of the current to be reduced or substantially eliminated. Alternatively or additionally, the lateral current may be measured, allowing a more accurate normal current to be calculated by compensating for the measured spreading. In addition, the techniques utilized for controlling the lateral current and the techniques utilized for measuring the lateral current may also be implemented jointly. | 03-05-2015 |
20150070039 | APPARATUS OF MEASURING SEMICONDUCTOR DEVICE - According to one embodiment, an apparatus of measuring a semiconductor device includes a first sense terminal, a first force terminal, a second sense terminal, and a plurality of second force terminals. The first sense terminal is configured to be electrically connected to a first electrode provided on a first surface of a semiconductor device. The first force terminal is configured to be electrically connected to the first electrode of the semiconductor device. The second sense terminal is configured to be electrically connected to a second electrode provided on a second surface of the semiconductor device. The second surface is opposite to the first surface. The plurality of second force terminals is disposed in a circumference of the second sense terminal, and is configured to be electrically connected to the second electrode of the semiconductor device. | 03-12-2015 |
20150070040 | TEST PROBE ASSEMBLY AND RELATED METHODS - A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring. A method includes disposing a first plunger within a spring along a spring longitudinal axis, disposing a second probe within the spring along the spring longitudinal axis, and engaging the spring latch and the second plunger spring latch with the spring, for instance by capturing an end coil of the spring with the spring latch of at least one of the spring latch or the second plunger spring latch. | 03-12-2015 |
20150109014 | CONNECTOR - A connector includes a connector case and probe pins that are arranged two-dimensionally in the connector case. Each of the probe pins includes a housing, a first contact terminal disposed at one end of the housing, a second contact terminal disposed at another end of the housing, and plural bent parts formed in the housing and protruding outward from a surface of the housing. The connector case includes through holes. Each of the through holes accommodates the probe pin and includes grooves that are formed in its inner surface and correspond to the bent parts. The grooves of each through hole face substantially the same directions as the grooves of other through holes. | 04-23-2015 |
20150123687 | TEST PROBE AND MACHINING METHOD THEREOF - Disclosed are a test probe and a machining method of a test probe, the test probe including a plunger end part contacting a tested contact point, the plunger end part including a plurality of tips protruding toward the tested contact point, and at least one of the plurality of tips is a higher tip and at least another one of the plurality of tips is a lower tip that is lower than the higher tip. | 05-07-2015 |
20150130489 | SUBSTRATE INSPECTION APPARATUS - A probe apparatus | 05-14-2015 |
20150145545 | HIGH PERFORMANCE LIGA SPRING INTERCONNECT SYSTEM FOR PROBING APPLICATION - A zero insertion force (ZIF) connector can include a connector housing defining an opening and an interior space for receiving a mating member, multiple LIGA springs positioned within the interior space and configured to apply pressure to the mating member while in a first position, and a locking component to cause the LIGA springs to move to a second position responsive to a user pressing the locking component. The LIGA springs do not apply pressure to the mating member while in the second position. | 05-28-2015 |
20160025806 | SYSTEMS AND METHODS FOR RELIABLE INTEGRATED CIRCUIT DEVICE TEST TOOLING - In one embodiment of the present invention, a test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact with a corresponding plurality of DUT contacts when under a compliant force. The pad provides mechanical support and/or electric coupling for the plurality of probes. In turn, the PCB/interposer supports the pad. In some embodiments, the plurality of probes includes a hard core material such as diamond. In other embodiments, the surface of the probes is hardened | 01-28-2016 |
20160061888 | Test Instrument Probe with a Pointed Tip That Is Also Capable of Gripping - A test instrument probe that encompasses the dual alternate action of a point or a clamp-grip within the same probe. This probe has approximately the same dimensions as a conventional probe, and allows either the point or clamp action to be used without the necessity of removing the probe from the hand. This alternate action requires only using a thumb and finger pressure to change from a point to a clamp or the clamp to a point. One embodiment allows a clamp jaw opening of up to a nominal ¼ inch that is usually sufficient to grip onto the leads of an electronic component such as resistor, capacitor or integrated circuit pin. The probes are also designed so that when not in use, the two probes can be connected together by a snap-in action that minimizes the potential loss of a probe and importantly allows the points to become safely enclosed to minimize a sharp point hazard. | 03-03-2016 |
20160124021 | Reduced Cost Package Device Simulator, Manufacturing Method and Method of Use - An improved package device simulator for the testing of testing sockets, the package device simulator being formed of a first layer of non-conductive rigid substrate with a second layer formed of a plurality of electrically conductive traces being added thereto. A third layer of non-conductive rigid substrate is adhered to the first layer with the second layer being sealed there between. The third layer having a plurality of openings therein, wherein the openings align with and expose a portion of the electrically conductive traces of the second layer. Conductive binding material and contact balls are added to the openings and the chip is cured thereby fusing the contact balls with the exposed portions of the traces. Next, the exposed surfaces are coated with a hardening conductive material, such as layers of Nickel and/or Gold. In this way an improved package device simulator is formed that is durable, easier to manufacture and less expensive than a solid metallic package device simulator. | 05-05-2016 |
20160146885 | PROBE AND CONTACT INSPECTION DEVICE - A probe comprises a first end that contacts and separates from a test object and a second end that contacts a circuit board to perform inspection of the test object. The second end is provided with a rotation restricted portion that restricts rotation of the probe about the axial direction thereof. An extendable portion, which is freely extendable and contractible in the axial direction of the probe and has at least one spiral slit, is provided between the first end and the second end. The second end is formed by a tubular member. Also, at least two of the extendable portions are provided between the first end and the second end, and an intermediate portion is formed between the extendable portions. | 05-26-2016 |
20160169964 | MAGNETIC PROBE CABLE ANCHOR WITH METAL MARKER BANDS | 06-16-2016 |