Relative positioning or alignment of device under test and test structure
324537000 - Of individual circuit component or element
Patent class list (only not empty are listed)
|Class / Patent application number
|Number of patent applications / Date published
|By mechanical means
|Adjustable support for device under test
|By electrical contact means
|Using optical means
|Testing device mounted for multi-directional movement
|By information on device under test
|POSITIONING METHOD AND APPARATUS FOR INSPECTING SOLAR BATTERY PANEL - In a positioning method and apparatus capable of preventing a solar battery panel from suffer damage during inspection, the method includes steps of providing a transport platen, a set of positioning device, a first probe row and a second probe row; transporting the solar battery panel to an inspecting region by the transport platen; moving the positioning devices to position the solar battery panel step by step; the first probe row pressing an electrode line on one surface of the solar battery panel; the second probe row pressing an electrode line on the other surface of the solar battery panel, thereby electrically connecting the first probe row and the second probe row. In this way, the solar battery panel can be inspected accurately without suffering damage.
|TESTING APPARATUS AND METHOD USING SAME - A testing apparatus for testing a number of different characteristics of a circuit board includes at least two probes, at least one measuring meter, and a storage device. After a circuit schematic diagram of the circuit board and a circuit wiring diagram of the circuit board have been compared, the location of each electric contact is determined. The probes necessary for testing particular characteristics are connected in turn to the measuring meter. The circuit board is moved to align the electric contacts with the probes, and bring the probes into electrical contact with the electric contacts for testing.
|ELECTRONIC DEVICE AND PRINTED CIRCUIT BOARD TESTING METHOD - An exemplary printed circuit board testing method includes determining whether there is an open shielding box every a time interval. The method then transmits a first control signal including a first predetermined path to a robot when there is an open shielding box. Next, the method obtains an image captured by a camera and recognizes a unique identifier of a to-be-tested PCB in the obtained image. The method then determines a second predetermined path corresponding to the determined open shielding box, and transmits a second control signal comprising the determined second predetermined path to the robot. Next, the method closes the determined shielding box when a duration after transmitting the second control signal reaches a predetermined time, and controls a testing software to test the to-be-tested PCB, to generate a testing result corresponding to the unique identifier of the to-be-tested PCB.
|Pin Verification Device And Method - A device of one embodiment includes a sensor, an indicator electrically connected to the sensor, a first base portion including a plurality of first channels, a second base portion including a plurality of second channels and located between the first base portion and the sensor, and a plurality of pins. Each pin includes first and second ends, and each pin passes through a respective first channel and a respective second channel such that the first end extends beyond the first base portion away from the sensor and the second end extends beyond the second base portion toward the sensor. Each pin is adjustably disposed within the respective first and second channels such that each pin is operable to move along a longitudinal axis of the pin. Furthermore, the sensor is operable to determine whether all pins of the plurality of pins are positioned proximate to the sensor.
|APPARATUS AND METHOD FOR NANOPROBING OF ELECTRONIC DEVICES - A method for probing a semiconductor device under test (DUT) using a combination of scanning electron microscope (SEM) and nanoprobes, by: obtaining an SEM image of a region of interest (ROI) in the DUT; obtaining a CAD design image of the ROI; registering the CAD design image with the SEM image to identify contact targets; obtaining a Netlist corresponding to the contact targets and using the Netlist to determine which of the contact targets should be selected as test target; and, navigating nanoprobes to land a nanoprobe on each of the test targets and form electrical contact between the nanoprobe and the respective test target.
|By capacitive means
|MICRO POSITIONING TEST SOCKET AND METHODS FOR ACTIVE PRECISION ALIGNMENT AND CO-PLANARITY FEEDBACK - Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.
|CHARGE ELIMINATING APPARATUS AND METHOD, AND PROGRAM STORAGE MEDIUM - A charge eliminating apparatus eliminates, when an electrical characteristics test of a target object is performed by moving a mounting table mounting the target object thereon and a probe card relative to each other to bring the target object into electrical contact with the probe card, static electricity of the target object via the mounting table. The charge eliminating apparatus includes a grounding wiring for grounding the mounting table; a relay switch disposed on the grounding wiring; and a switch controller that controls the relay switch to be opened or closed.
|PROBES WITH OFFSET ARM AND SUSPENSION STRUCTURE - A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a contact force between the skate and the conductive pad. While the scrub motion clears oxide from the pad to establish electrical contact, the rotation removes debris from the skate and thus preserves a low contact resistance between the skate and the pad. The use of probes with one or more blunt skates and methods of using such self-cleaning probes are especially advantageous when testing DUTs with low-K conductive pads or other mechanically fragile pads that tend to be damaged by large contact force concentration.
|PRE-ALIGNMENT METHOD OF SEMICONDUCTOR WAFER AND COMPUTER-READABLE RECORDING MEDIUM HAVING PRE-ALIGNMENT PROGRAM RECORDED THEREON - Disclosed is a pre-alignment method and a computer-readable medium storing a pre-alignment program capable of reducing pre-alignment time and transfer time of a semiconductor wafer. The pre-alignment method includes steps of rotating the semiconductor wafer transferred from a receiving unit onto a rotating body of a pre-alignment mechanism by a transfer mechanism, calculating and storing an eccentric value between a shaft center of the rotating body and a center of the semiconductor wafer detected by a sensor of the pre-alignment mechanism, correcting a positional deviation of the semiconductor wafer on the rotating body by the transfer mechanism according to the calculated eccentric value, when the calculated eccentric value exceeds a predetermined value, and estimating the eccentric value when conducting the pre-alignment operation for a succeeding semiconductor wafer, based on the eccentric value accumulated during the pre-alignment operation conducted for semiconductor wafers prior to the succeeding semiconductor wafer.
|SEMICONDUCTOR INSPECTION APPARATUS, SEMICONDUCTOR WAFER POSITIONING METHOD, AND SEMICONDUCTOR WAFER INSPECTION METHOD - A semiconductor inspection apparatus comprising: a plurality of wafer stages provided independently for each of a plurality of laminated semiconductor wafers, that directly or indirectly secure the corresponding semiconductor wafers and that possess a mechanism for positioning the corresponding semiconductor wafers; and a probe card, arranged outside or in between the plurality of laminated semiconductor wafers so as to face the semiconductor wafers, that transmits a signal or power to the plurality of semiconductor wafers.
|WAFER PROBER FOR SEMICONDUCTOR INSPECTION AND INSPECTION METHOD - A wafer prober is provided with a tray which supports a wafer at a set position, transports it to a processing position of the wafer and is placed at the processing position; one or more alignment units which position the wafer at the set position with respect to the tray; contact units arranged in number larger than that of the alignment units and performing inspection processing in contact with the wafer at the processing position; and a tray transport portion for transporting the tray supporting the wafer between the alignment unit and the contact unit. The tray is provided with three or more pin holes for allowing movement of the chuck pin in the XYZθ directions, an alignment mark for positioning the wafer, and an alignment portion for positioning the tray itself.
|TEST HEAD MANIPULATOR - A test head manipulator system comprising a base structure, a main arm unit configured to support a test head and to be moved relative to the base structure, an actuator having a range of motion of L, and an enhancement mechanism positioned between the main arm unit and the actuator and configured such that movement of the actuator a first distance causes the main arm unit to move a second distance that is greater than the first distance. Additionally, a fluid control system for controlling a test head manipulator system. The pneumatic control system includes a regulator configured to controllably provide an output pressure to the main fluid actuator, and a second fluidly controlled actuator configured to adjust the regulator to modify the output pressure provided to the main fluid actuator. The second actuator is configured to be positively positioned in at least four operating modes with each operating mode causing the regulator to provide a different output pressure to the main fluid actuator.
|MEASUREMENT SYSTEM - The invention discloses a contacting device for a thin film solar cell, comprising a positioning plane for positioning the solar cell thereon, a contact element for electrically contacting the solar cell and a suction element, wherein the solar cell is arrangeable on the top side of the positioning plane, the contact element is arranged slideably in a direction orthogonal to the positioning plane and arranged slideably through an opening of the positioning plane, and the suction element is arranged on the bottom side of the positioning plane for sucking air through the opening. The contacting device allows for obtaining improved measurement accuracy.
|TEST APPARATUS, TEST METHOD AND COMPUTER READABLE MEDIUM - A test apparatus comprising a position information acquiring section that acquires position information concerning first terminals on a surface of a device under test and position information concerning second terminals on a surface of a probe card used for testing the device under test; a control section that calculates a displacement amount between each first terminal and a corresponding second terminal, based on the position information concerning the first terminals and the position information concerning the second terminals, and determines relative positions of the device under test and the probe card such that a maximum value from among the calculated displacement amounts is less than a predetermined value; and an aligning section that adjusts the relative positions of the device under test and the probe card, based on a signal from the control section, and electrically connects the device under test to the probe card.
|PROCESS FOR CONTROLLING THE CORRECT POSITIONING OF TEST PROBES ON TERMINATIONS OF ELECTRONIC DEVICES INTEGRATED ON A SEMICONDUCTOR AND CORRESPONDING ELECTRONIC DEVICE - An embodiment for making a check of the electric type executed on wafer for testing the correct positioning or alignment of the probes of a probe card on the pads or bumps of the electronic devices integrated on semiconductor wafer. An embodiment consists in making a current circulate in at least part of the seal ring of at least one of the above devices, and in case it has to flow in the seal ring of more devices, these seal rings are suitably interconnected to each other. Thanks to an embodiment the seal ring may also be reinforced in the angle areas of the chip, and suitable circuits may be possibly inserted in the seal ring or between the seal rings.
|TEST HEAD MOVING APPARATUS AND ELECTRONIC COMPONENT TESTING APPARATUS - A test head moving apparatus includes elevating arms that move a test head up and down, a frame that horizontally moves the test head, and an interlock mechanism that prohibits the horizontal movement of the frame on the basis of a height of the test head. The interlock mechanism has a limit switch that detects that the test head is positioned at the lowermost limit and stoppers capable of pressing the pressing units onto a floor plane.
|METHOD FOR PROVIDING ALIGNMENT OF A PROBE - A method for aligning a probe relative to a supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, using an etch reagent, a recess in the exposed area, the recess defining first and second opposed sidewalls, an end wall remote from the edge, and a bottom wall. The method further includes the step of providing a probe substrate defining a second planar surface and a second crystal plane identical to the first crystal plane, and positioning the probe substrate so that the first and the second crystal planes are positioned identically when forming a probe from the probe substrate using the etch reagent, wherein the probe defines congruent surfaces to the first and second sidewalls.
|PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING AND IMPEDANCE MATCHING METHOD THEREFORE - A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
|WAFER CHUCK INCLINATION CORRECTING METHOD AND PROBE APPARATUS - A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount.
|MEASURING SYSTEM FOR DETERMINING SCATTER PARAMETERS - A measuring system for determining scatter parameters of an electrical measurement object on a substrate, having a measuring machine having at least one measuring channel and at least one measuring probe electrically connected to at least one measuring channel and designed for non-contacting or contacting connection to an electrical signal line of the electrical measurement in the electronic circuit. A first positioning device is provided for at least one measuring probe, wherein at least one sensor detects a position of at least one measuring probe and outputs a position signal.
|MANIPULATOR OF ROBOT - An exemplary manipulator of a robot includes a detecting bar including two detecting pins and a regulating mechanism for regulating the distance between the two detecting pins, a fastening seat supporting the detecting bar, a fixing device fixed to the fastening seat, a driving mechanism disposed on the fastening seat, and an adjusting element connecting the driving mechanism with the regulating mechanism of the detecting bar. Under a driving action of the driving mechanism on the adjusting element, the adjusting element rotates to cause the regulating mechanism of the detecting bar to regulate the distance between the two detecting pins.
|SEMICONDUCTOR WAFER TEST APPARATUS - An apparatus includes a plurality of test heads to which probe cards are electrically connected; a wafer tray which is able to hold a semiconductor wafer; and an alignment apparatus which positions the semiconductor wafer held on the wafer tray relatively with respect to the probe card so as to make the wafer tray face the probe card. The wafer tray has a pressure reducing mechanism which pulls the wafer tray toward the probe card. The alignment apparatus is configured to be able to move along the array direction of the test heads.
|MANIPULATOR OF ROBOT - An exemplary manipulator of a robot includes a fastening seat defining two guiding grooves, a driving mechanism disposed on the fastening seat, two transmitting plates respectively received in the two guiding grooves and cooperating with the driving mechanism, and two detecting bars each fixedly connecting with a corresponding transmitting plate. A detecting pin is fixed on each of the detecting bars. Under a driving action of the driving mechanism on the transmitting plates, the transmitting plates are activated to slide in the guiding grooves to cause the detecting bars to move close to or apart from each other, whereby a distance between the two detecting pins is automatically regulated.
|WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - A wafer inspection interface IF comprises a probe card, an adsorption unit configured to adsorb a wafer to the probe card, a wafer adsorption sealing member to which the probe card is adsorbed, and a fixing ring configured to fix the wafer adsorption sealing member to a card holder. The adsorption unit includes an air exhaustion unit, a first air duct whose right end portion is opened in the hermetically closed space and the left end portion is opened at a side of the fixing ring, a second air duct whose right end portion is opened to face an opening of the left end portion of the first air duct and the left end portion is opened to be connected with the air exhaustion unit, and a hole by which the first air duct is in communication with the second air duct.
|SENSING STRUCTURE OF ALIGNMENT OF A PROBE FOR TESTING INTEGRATED CIRCUITS - A sensing structure for use in testing integrated circuits on a substrate. The sensing structure includes at least two sensing regions connectable to a probe and at least one first sensing element. Each of the at least one first sensing elements is directly connected to two sensing regions such that for each sensing region a different value of an electrical parameter is measurable between the sensing region and a first reference potential so as to reliably determine a drift direction of a probe.
|Test Unit and Test System - A test unit to be used with a tester that tests an electrical characteristic of a circuit formed in a wafer includes a tester a board electrically connected to the tester; a first wireless port mounted on a lower surface of the tester board and electrically connected to the tester; a probe board that includes a probe to be in contact with an electrode pad of the electronic circuit, and is configured so that the probe board may be transferred along with the wafer into the system box while the probe and the electrode pad are in contact with each other; a second wireless port that is mounted on an upper surface of the probe board and electrically connected to the probe, and carries out contactless transmission/reception with the first wireless port; a chuck plate that is away from the tester board, and holds the probe board and the wafer; and a flexible expandable chamber that may be inflated by introducing gas thereinto.
|SEMICONDUCTOR TEST DEVICE, SEMICONDUCTOR TEST CIRCUIT CONNECTION DEVICE, AND SEMICONDUCTOR TEST METHOD - A semiconductor test device and method for sequentially carrying out tests including an AC test, DC test, and thermal resistance test on a power semiconductor device are provided. The semiconductor test device includes a holding unit that positions the power semiconductor device. Test units each generate a test signal for the power semiconductor device and determine a test result generated in response to the test signal. A connection unit switches between the test units and selectively connects the test units electrically to electrodes of the power semiconductor device. The connection unit is controlled such that the test units are sequentially connected to the power semiconductor device to perform a plurality of the tests. The connection unit may include parallel plate electrodes in proximity to each other across an insulating sheet. The parallel plate electrodes may connect the power semiconductor device to positive and negative power sources of the test unit.
|APPARATUS AND METHOD FOR TESTING BACK-CONTACT SOLAR CELLS - The present invention relates to an apparatus for testing of back-contact solar cells. In one embodiment, the apparatus includes a support plate having vacuum holes with suction cups partially within the holes and probe pins within the suction cups. A solar cell is placed into contact with the suction cups and vacuum forces are applied through the suction cups to force contact pads of the solar cell against the probe pins. In another embodiment, the apparatus includes a support plate having probe pin holes with hollow probe pins located therein. Vacuum forces are applied through the hollow probe pins to force contact pads of the solar cell against the probe pins. The support plate in either embodiment may be an end effector of a robot used to pick up the solar cell and hold the front surface of the solar cell adjacent a light source while performing light induced testing.
|TEST DEVICE - A test device for testing a circuit board includes a base, a conveying platform, a driving unit, a connecting element, and a testing unit. The base has an operating space from above. The conveying platform is hinged to the base at a variable gradient, communicates with the operating space, and has thereon a carrier movable toward or away from the operating space as needed and configured to carry the circuit board. The driving unit is connected to the conveying platform and configured to drive the carrier to move. The connecting unit is connected to the conveying platform and the driving unit. The gradient of the conveying platform varies when the driving unit drives the carrier to move and thereby moves the connecting unit. The testing unit is movably disposed at the base and has at least one test terminal capable of approaching the operating space and testing the circuit board.
|WIDE AREA SOFT DEFECT LOCALIZATION - Various apparatus and methods of testing a semiconductor chip for soft defects are disclosed. In one aspect, a method of testing a semiconductor chip that has a surface and plural circuit structures positioned beneath the surface is provided. An irradiation mask directs light or heat to a series of fractional portions of the surface to perturb portions of the plural circuit structures. The irradiation mask is adjustable such that at least one of the exposed series of fractional portions is smaller than another of the series of fractional portions. The semiconductor chip undergoes a test pattern during the irradiation to each of the fractional portions to determine if a soft defect exists in any of the series of fractional portions. Multiple paths can be tested simultaneously to inform subsequent individual CTP path tests.
|PROBE CARD POSITIONING MECHANISM AND INSPECTION APPARATUS - A probe card positioning mechanism in which, when a probe card used to inspect electrical characteristics of an object to be processed is detachably inserted in a head plate of an inspection apparatus or an insert ring fixed to the head plate, at least three positioning pins placed circumferentially with an interval therebetween on an outer circumference of the probe card are inserted in at least three corresponding positioning long holes formed in the head plate or the insert ring such that the probe card is positioned at a specified position of the head plate or the insert ring, wherein the positioning holes are formed as long holes being elongated in a width-wise direction of the probe card and the entire inner circumferential surface of the long holes is configured as a taper surface which is gradually declined along an insertion direction of the pins.
|PROBE CARD DETECTING APPARATUS, WAFER POSITION ALIGNMENT APPARATUS AND WAFER POSITION ALIGNMENT METHOD - A probe card detecting apparatus includes a probe detecting chamber having a supporting body, a probe card positioned and mounted detachably via a first holder on the predetermined position of the supporting body, a first imaging device movably provided in the probe detecting chamber to detect needle tips of at least two probes of the probe card, a probe correction card positioned and mounted detachably via a second holder to the predetermined position of the supporting body, and a control device. Under the control of the control device, using the first imaging device, a difference between a horizontal position of needle tips of at least two probes and a horizontal position of at least two targets is detected as a correction value for performing a position alignment of the at least two probes with the at least two electrode pads of said semiconductor wafer.
|ALIGNMENT SYSTEM FOR ELECTRONIC DEVICE TESTING - An alignment system for aligning one or more devices under test with respect to a test station includes a carrier that is configured to carry the one or more devices under test, a conveyor that is configured to move the carrier in unison with the conveyor, and an alignment structure. The alignment structure is engageable with the carrier to move the carrier with respect to the conveyor to align at least one of the devices under test with respect to the test station.
|CAPACITOR TEST FIXTURE AND TEST SYSTEM EMPLOYING THE SAME - A capacitor test fixture for positioning capacitors under test includes a main body, a clamping section, an operating section, and a cover. The main body defines an opening, a plurality of receiving slots at the bottom of the opening to receive the capacitors, some positioning slots located at opposite sides of the opening, and a sliding slot. The clamping section includes a first hook, and the operating section includes a second hook corresponding to the first hook. The cover locates and fixes the clamping section and the operating section to the main body. The operating section functions when the second hook holds back the first hook, the capacitors under test are received within the receiving slots, and when the second hook releases the first hook, the clamping section secures and makes contact with the capacitors for testing.
|STACKABLE PROBE SYSTEM - A probe system includes a plurality of spaced apart height-variable legs, each of which is composed of a stack of blocks magnetically attached to each other, a platen bridging and magnetically secured to the legs, and a probe positioner magnetically attached to the platen. The probe positioner includes an xyz-axes position adjuster mounted on the platen and connected to a first link, a first ball joint interconnecting the first link and a second link, a rotary connector interconnecting the second link and a third link, and a second ball joint connecting the third link to a chuck unit for holding a probe.
|Method for Panel Reliability Testing and Device Thereof - A device for panel reliability testing and method thereof are proposed. The device includes a connection module, for connecting the panel and an aging module; a reliability chamber control module for sending a voltage regulation command to a bias module and/or a switch control command to the aging module; the bias module, for regulating voltage and transmitting information about voltage regulation to the aging module; and the aging module, for performing an aging operation on the panel depending on the switch control command sent from the reliability chamber control module and the information about voltage regulation transmitted from the bias module. Compared with the prior art, LCD panels undergo the aging testing before being packaged, thereby shortening a time period of manufacturing LCD panels and enhancing production efficiency.
|METHOD AND APPARATUS FOR IMPLEMENTING PROBES FOR ELECTRONIC CIRCUIT TESTING - Disclosed is an improved probe having a spring portion which allows effective contact with a device under test without requiring a lower die portion. The probe includes a slot retention and placement portion, which provides for an improved approach for manufacturing arrangements of probes, where the slot retention and placement portions of the probe facilitate precise placement and alignment of the probes while not excessively increasing the cost or complexity of the probes and probe cards.
|Probe Head Formation Methods Employing Guide Plate Raising Assembly Mechanism - An assembly includes a lower guide plate having a first plurality of through-holes therein, and an upper guide plate over the lower guide plate. The upper guide plate includes a second plurality of through-holes therein. The assembly further includes a plurality of probe pins. Each of the probe pins is inserted through one of the first plurality of through-holes and one of the second plurality of through-holes. The assembly further includes a plurality of probe pin stoppers, each attached to one of the probe pins, wherein the plurality of probe pin stoppers has lateral sizes greater than lateral sizes of the second plurality of through-holes. The plurality of probe pin stoppers is located over the upper guide plate.
|TEST PROBE ALIGNMENT STRUCTURES FOR RADIO-FREQUENCY TEST SYSTEMS - Electronic devices may be tested using a test station with a test fixture. The test fixture may include a first holding structure in which a device under test may be placed and a second holding structure for supporting test probes. The second holding structure may be mated with a test probe alignment structure during test station setup operations. The test probe alignment structure may include registration features configured to set the relative position of the first and second holding structures to a known configuration and may include test probe alignment features that can be used to correctly position the placement of the test probes. If at least one of the test probes is not sufficiently aligned to its corresponding alignment feature, the test probe alignment structures will not be able to engage properly with the second holding structure, and the position of the problematic test probe may be adjusted accordingly.
|WAFER TRAY, SEMICONDUCTOR WAFER TEST APPARATUS, AND TEST METHOD OF SEMICONDUCTOR WAFER - A wafer tray which holds a semiconductor wafer includes a wafer set plate on which the semiconductor wafer is set, a tray body which supports the wafer set plate to be able to finely move, and a vibration actuator which imparts vibration to the wafer set plate.
|Methods for Reducing Path Loss While Testing Wireless Electronic Devices with Multiple Antennas - A test station may include a test host, a test unit, and a test enclosure. A device under test (DUT) having at least first and second antennas may be placed in the test enclosure during production testing. Radio-frequency test signals may be conveyed from the test unit to the DUT using a test antenna in the test enclosure. In a first time period during which the performance of the first antenna is being tested, the DUT may be oriented in a first position such that path loss between the first antenna and the test antenna is minimized. In a second time period during which the performance of the second antenna is being tested, the DUT may be oriented in a second position such that path loss between the second antenna and the test antenna is minimized. The DUT is marked as a passing DUT if gathered test data is satisfactory.
|INSERT FOR SEMICONDUCTOR PACAKGE AND TESTING APPARATUS WITH THE SAME - An insert for a semiconductor package testing apparatus comprises a body having a pocket constructed and arranged to receive the semiconductor package, and a sliding tool slidingly positioned on the body. The sliding tool is constructed and arranged to open and close the pocket as a result of a sliding motion of the sliding tool relative to the body.
|PACKAGE TEST DEVICES HAVING A PRINTED CIRCUIT BOARD - In a method of designing a printed circuit board, a package capacitance, a package inductance, and a chip capacitance of an actual memory device are calculated. A signal line capacitance and a signal line inductance per unit length of a signal line are calculated based on characteristics of the printed circuit board. A length of the signal line for each pin is determined based on the package capacitance and the signal line capacitance.
|MAINTAINING A WAFER/WAFER TRANSLATOR PAIR IN AN ATTACHED STATE FREE OF A GASKET DIPOSED - A wafer translator and a wafer, removably attached to each other, provides the electrical connection to electrical contacts on integrated circuits on a wafer in such a manner that the electrical contacts are substantially undamaged in the process of making such electrical connections. Various embodiments of the present invention provide a gasketless sealing means for facilitating the formation by vacuum attachment of the wafer/wafer translator pair. In this way, no gasket is required to be disposed between the wafer and the wafer translator. Air, or gas, is evacuated from between the wafer and wafer translator through one or more evacuation pathways in the gasketless sealing means.
|APPARATUS AND METHOD FOR EVALUATING CHARACTERISTICS OF A PHOTOVOLTAIC DEVICE - An apparatus is provided for evaluating characteristics of a photovoltaic device with an exposed back contact layer having a plurality of electrically discrete areas arranged in a grid. The apparatus may include, for example, a light source for illuminating the photovoltaic device and a probe head assembly having a plurality of probes arranged in a grid corresponding to the grid on the photovoltaic device so that a given pair of the probes corresponds to a respective one of the electrically discrete areas within the grid. The probes and photovoltaic device may be positionable so that the probes contact the back contact layer. Related methods for evaluating characteristics are also provided.
|Testing system for Testing Semiconductor Package stacking Chips and Semiconductor Automatic Tester thereof - A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.
|RESISTIVITY-MEASURING DEVICE - A resistivity-measuring device comprising: a carrier platform used for loading a plurality of products under measure; a material-incoming conveyor, on which the carrier platform is disposed, and comprising a material-incoming guide wheel group for moving the carrier platform horizontally; a probe module, used for measuring the resistance of the products under measure; a probe position regulating mechanism, disposed on the material-incoming conveyor and connected to the probe module for elevating the probe module vertically and moving the probe module horizontally; a revolving machine, connected to the material-incoming conveyor for receiving and transferring a plurality of products under measure from the material-incoming conveyor, wherein a transferring direction of the revolving machine is adjustable; and a controller, electrically connected to the material-incoming conveyor, the probe module, the probe position regulating mechanism and the revolving machine. The resistivity-measuring device achieves automatic measuring resistivity, increases the efficiency of measurement, and reduces labor power cost.
|INTERGRATED APPARATUS AND METHOD FOR TESTING OF SEMICONDUCTOR COMPONENTS USING A TURRET MACHINE - The invention discloses a semiconductor components delivery system associated with a turret type testing apparatus for testing integrity and functionality of semiconductor components wherein at least two input feeders loadable with semiconductor components to be vision checked, tested and/or packed are provided. The delivery system is also provided with multiple output means such as a tube, a tape or a bin or a combination thereof for semiconductor components determined to be non defective.
|TESTING APPARATUS AND METHOD - Disclosed is a testing apparatus, including: a base having opposite upper and lower surfaces, and a plurality of electrical circuits formed in the base, each of the electrical circuits extending from the upper surface to the lower surface and bending backwards to the upper surface such that two terminal ends of the electrical circuit are located on the upper surface. While in a testing, an element is disposed on the upper surface of the base such that testing probes are placed on the electrical contact spots of both the element and the upper surface of the base, thus without resorting to double sided testing that testing probes are placed on the upper and lower surfaces of the element as mentioned in the prior art. Hence, the testing apparatus and testing method can simplify the testing process and prevent the element from damage caused by mechanical stresses of the testing probes.
|DEVICE AND METHOD FOR TESTING ELECTRONIC COMPONENT DEVICES ON A CARRIER OR A SUBSTRATE - A device for testing electronic component devices on a carrier or a substrate, having a positioning and holding device for the earner or the substrate, a test head and a test socket connected thereto, with which multiple simultaneous electronic component devices on the carrier or the substrate are contactable. At least one additional test socket is connected to the test head.
|SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE - Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a first test structure onboard an interposer that has a first side and second side opposite the first side. Additional test structures may be fabricated.
|PROBE CARD AND MANUFACTURING METHOD - There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips.
|DOCKING DEVICE, DOCKING METHOD - A docking device for connecting a semiconductor probe to a semiconductor handler has in each case one probe-side and one handler-side connecting device, a handling device for handling a contact-making device and a coupling device for coupling the connecting devices. The coupling device has a first shifting device, which allows the translational and guided shifting of the probe-side connecting device relative to the handler-side connecting device towards and away from one another.
|PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING - A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
|RECONFIGURABLE ELECTRIC FIELD PROBE - Systems and methods for EMC, EMI and ESD testing are described. A probe comprises a center conductor extending along an axis of the probe, a probe tip, and a shield coaxially aligned with the center conductor and configured to provide electromagnetic screening for the probe tip. One or more actuators may change the relative positions of the probe tip and shield with respect to a device under test, thereby enabling control of sensitivity and resolution of the probe.
|PRE SPACE TRANSFORMER, SPACE TRANSFORMER MANUFACTURED USING THE PRE SPACE TRANSFORMER, AND SEMICONDUCTOR DEVICE INSPECTING APPARATUS INCLUDING THE SPACE TRANSFORMER - Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; and signal electrodes, power electrodes, and ground electrodes disposed on the first surface, wherein the signal electrodes, the power electrodes, and the ground electrodes are repeatedly disposed while configuring a unit pattern.
|MECHANISM FOR FACILITATING MODULAR PROCESSING CELL FRAMEWORK AND APPLICATION FOR ASYNCHRONOUS PARALLEL SINGULATED SEMICONDUCTOR DEVICE HANDLING AND TESTING - A mechanism is described for facilitating and employing a modular processing cell framework according to one embodiment. A method of embodiments may include accepting one or more semiconductor devices in one or more media at a modular processing cell framework (“framework”) including a plurality of test cells, moving the one or more semiconductor devices from the one or more media to one or more test cells for testing; and testing the one or more semiconductor devices.
|POSITIONING DEVICE AND POSITIONING METHOD - An exemplary positioning method controls a capturing unit to capture an image of a product. The method then determines a label in the captured image. Next, the method determines a virtual distance along a X-axis and a virtual distance along the Y-axis between the capturing unit and the label in the image to determine an actual distance along the X-axis and an actual distance along the Y-axis between the discharging unit and the label according to a stored ratio and a detected distance between the capturing unit and the discharging unit along the Y-axis. The method then controls the driving device to drive the discharging unit to move the determined actual distance along the X-axis in the X direction, the determined actual distance along the Y-axis in the Y direction, and a stored distance between the label and the discharging unit along the Z-axis in the Z direction.
|MAINTAINING A WAFER/WAFER TRANSLATOR PAIR IN AN ATTACHED STATE FREE OF A GASKET DISPOSED - A wafer translator and a wafer, removably attached to each other, provides the electrical connection to electrical contacts on integrated circuits on a wafer in such a manner that the electrical contacts are substantially undamaged in the process of making such electrical connections. Various embodiments of the present invention provide a gasketless sealing means for facilitating the formation by vacuum attachment of the wafer/wafer translator pair. In this way, no gasket is required to be disposed between the wafer and the wafer translator. Air, or gas, is evacuated from between the wafer and wafer translator through one or more evacuation pathways in the gasketless sealing means.
|RESISTANCE MEASURING APPARATUS FOR INSPECTING COMPRESSION QUALITY AND MEASURING METHOD USING THE SAME - A resistance measuring apparatus for inspecting compression quality includes a probe configured to measure resistance by contacting compression resistance measuring tags of a display device, a probe support for supporting the probe, and a torque motor coupled to the probe support and configured to control a position of the probe.
|VIBRATING DEVICE FOR POSITIONING A MINIATURIZED PIECE IN A TESTING ACCOMMODATION, AND POSITIONING METHOD - An embodiment of a device for positioning a miniaturized piece, including: a positioning structure, which forms a first cavity, designed to receive with play the miniaturized piece, and a second cavity communicating with the first cavity; at least one electrical-contact terminal, facing the second cavity and electrically coupleable to an electronic testing device, designed to carry out an electrical test on the miniaturized piece; and an actuator device, which causes a vibration of the positioning structure, the vibration being such that the miniaturized piece translates, in use, towards the second cavity, until it penetrates at least in part into the second cavity.
|Automated Attaching And Detaching Of An Interchangeable Probe Head - A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.
|PROBE GUIDE PLATE AND SEMICONDUCTOR INSPECTION APPARATUS - A probe guide plate used for a semiconductor inspection apparatus that inputs and outputs an electrical signal for inspecting an object via a probe needle, the probe guide plate includes a silicon substrate provided with a through hole that penetrates the silicon substrate from one surface to another surface through which the probe needle is inserted, the through hole including a first tapered portion provided at an end portion at the one surface side such that the hole size of which increases as it approaches the one surface, and a second tapered portion provided at an end portion at the other surface side such that the hole size of which increases as it approaches the other surface; and a silicon oxide film formed on an inner wall surface of the through hole including the first tapered portion and the second tapered portion.
|ANTI-ROTATION FOR WIRE PROBES IN A PROBE HEAD OF A DIE TESTER - Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.
|WORK PIECE CONTACT PAD WITH CENTERING FEATURE - A data storage device may be tested during or after manufacture by a testing device that may have at least a work piece with at least one contact pad concurrently contacting bottom and sidewall surfaces of a probe tip with a centering feature of the at least one contact pad.
|SENSING STRUCTURE OF ALIGNMENT OF A PROBE FOR TESTING INTEGRATED CIRCUITS - A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.
|ADAPTER FOR A SENSOR FOR MEASURING A DIFFERENTIAL SIGNAL - An adapter for a sensor measuring a differential signal comprises two electrically conductive test-contact elements which are arranged in each case eccentrically relative to an axis of rotation in order to register respectively one partial signal of the differential signal. Moreover, two adjustment components, each rotatable about one of the two axes of rotation, are provided in the adapter for the adjustment of a variable spacing distance between the two test-contact elements. The two adjustment components are connected to one another in a force-fit manner.
|POSITIONER OF PROBE CARD AND PROBE HEAD OF PROBE CARD - A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.
|SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD OF USE - A cartridge, including a cartridge frame, formations on the cartridge frame for mounting the cartridge frame in a fixed position to an apparatus frame, a contactor support structure, a contactor interface on the contactor support structure, a plurality of terminals, held by the contactor support structure, for contacting contacts on a device, and a plurality of conductors, held by the contactor support structure, connecting the interface to the terminals.
|INSPECTION DEVICE - A method of inspecting a sensor sheet formed by a roll-to-roll scheme for a touch sensor, the sensor sheet including a roll sheet and a sensor electrode layer thereon, the sensor electrode layer including sensor electrodes running in a prescribed direction, the sensor sheet further including a terminal connected to the sensor electrode layer and alignment marks, the method including: arranging the sensor sheet on an inspection table of an inspection device, the inspection table having an alignment mark and inspection electrodes running in another prescribed direction such that at least one of the alignment marks aligns with the alignment mark on the inspection table and such that the inspection electrodes face the sensor electrodes orthogonally in a plan view and are vertically separated by a dielectric to form capacitances at respective intersections therebetween; measuring the capacitances at the respective intersections; and outputting the measured capacitances as an inspection result.
|PROBE CARD LOADING APPARATUS AND PROBE CARD MANAGING SYSTEM INCLUDING THE SAME - A loading apparatus is provided which includes a package jig, a transfer unit, and a load port. The package jig is fixed to a package. The transfer unit includes a hand for holding the package jig and transferring the package. The package transferred by the transfer unit is loaded on the load port. The load port and the hand include first alignment pins and first alignment sockets for aligning the package to the load port.
|ALIGNING DEVICE AND HANDLING DEVICE
Patent applications in class Relative positioning or alignment of device under test and test structure
Patent applications in all subclasses Relative positioning or alignment of device under test and test structure