| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324750240 | By electrical contact means | 27 |
| 20100315110 | HERMETICITY TESTING - Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus. | 12-16-2010 |
| 20110062975 | ELECTRICAL TERMINAL TEST POINT AND METHODS OF USE - Described herein are embodiments of an electrical terminal test point that can be temporarily attached to an electrical terminal (e.g., terminal block) in order to provide an interface between the test leads/jumpers of a test device and the electrical contact points of the electrical terminal. In one aspect, embodiments of the electrical terminal test point provide a shield for the electrical contact points of the electrical terminal (whether or not being used for testing) from inadvertent contact and prevents test leads/jumpers of test device from accidentally falling off or being knocked off of their contact points. Electrical terminal test point can be installed and removed without affecting the electrical connections made by electrical terminal (e.g., without removing terminal screws of electrical terminal). | 03-17-2011 |
| 20120169365 | SUBSTRATE INSPECTING APPARATUS AND ALIGNING METHOD IN SUBSTRATE INSPECTING APPARATUS - A substrate inspecting apparatus includes an inspecting apparatus main body for electrically inspecting a substrate on which an electronic circuit and electrode pads are formed, and a contactor electrically connected to the inspecting apparatus main body. The contactor includes contact portions made of conductive material. In the substrate inspecting apparatus, the contact portions are electrically connected to the electrode pads of the substrate via conductive liquid to inspect the electronic circuit formed on the substrate. | 07-05-2012 |
| 20130154678 | Electrically Conductive Pins For Microcircuit Tester - The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board including a rocker base protrusion, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface. | 06-20-2013 |
| 20130169301 | Probes With Programmable Motion - The elongated body of an electrically conductive contact probe can be disposed in a guide hole and can include a patterned region for engaging and riding on a contact region of an inner sidewall of the guide hole as the elongated body moves in the guide hole in response to a force on a tip of the probe. As the patterned region rides the contact region, the tip moves in a lateral pattern that is a function of the surface(s) of the patterned region. | 07-04-2013 |
| 20130214808 | High Throughput Current-Voltage Combinatorial Characterization Tool and Method for Combinatorial Solar Test Substrates - Measuring current-voltage (I-V) characteristics of a solar cell using a lamp that emits light, a substrate that includes a plurality of solar cells, a positive electrode attached to the solar cells, and a negative electrode peripherally deposited around each of the solar cells and connected to a common ground, an articulation platform coupled to the substrate, a multi-probe switching matrix or a Z-stage device, a programmable switch box coupled to the multi-probe switching matrix or Z-stage device and selectively articulating the probes by raising the probes until in contact with at least one of the positive electrode and the negative electrode and lowering the probes until contact is lost with at least one of the positive electrode and the negative electrode, a source meter coupled to the programmable switch box and measuring the I-V characteristics of the substrate. | 08-22-2013 |
| 20130241588 | WAFER INSPECTION APPARATUS - An inspection chamber | 09-19-2013 |
| 20130265071 | TRANSLATORS COUPLEABLE TO OPPOSING SURFACES OF MICROELECTRONIC SUBSTRATES FOR TESTING, AND ASSOCIATED SYSTEMS AND METHODS - Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods are disclosed. An arrangement in accordance with one embodiment includes a microelectronic substrate having a first major surface, a second major face facing opposite from the first major surface, and electrically conductive through-substrate vias extending through the substrate and electrically accessible from both the first and second surfaces. The arrangement further includes a first translator releasably connected to the substrate and positioned in a first region extending outwardly from the first surface, the first translator including first electrical signal paths that access the vias from the first surface, and a second translator releasably connected to the substrate simultaneously with the first translator, the second translator being positioned in a second region extending outwardly from the second surface, the second translator including second electrical signal paths that access the vias from the second surface. | 10-10-2013 |
| 20140002122 | Methods, Apparatus, and Systems for Contacting Semiconductor Dies that are Electrically Coupled to Test Access Interface Positioned in Scribe Lines of a Wafer | 01-02-2014 |
| 20140021975 | Automatic Aligning Apparatus - An automatic aligning apparatus for aligning aligning components of a first object with aligning components of a second object includes first and second aligning mechanisms. The first aligning mechanism carries the first object and has a guiding groove. The second aligning mechanism has a carrying component that carries the second object, two rear holding plates, and two connecting components, each extending through a through hole in a corresponding rear holding plate and having two clamping parts that clamp a corresponding rear holding plate. The carrying component is movable between an initial position and an aligning position where a guiding stud of the carrying component extends into the guiding groove. | 01-23-2014 |
| 20140139247 | INTERPOSER APPARATUS AND METHODS - Embodiments of the present disclosure describe interposer apparatus and methods for their fabrication and use. In some embodiments, an interposer includes a first frame having a first opening, a second frame having a second opening, and a body frame, disposed between the first frame and the second frame. A first end portion of a pin is disposed in the first opening, a second end portion of the pin is disposed in the second opening, and a body portion of the pin is disposed in the body opening between the first and second frames. Other embodiments may be described and/or claimed. | 05-22-2014 |
| 20140167800 | Method for Testing Semiconductor Chips or Semiconductor Chip Modules - A semiconductor chip panel includes a plurality of semiconductor chips embedded in an encapsulation material. At least part of the semiconductor chips comprise a first electrical contact element on a first main face and a second electrical contact element on a second main opposite to the first main face, respectively. One of the plurality of semiconductor chips is tested by establishing an electrical contact between a test contact device and the first electrical contact element and between an electrically conductive holder and the second contact element. | 06-19-2014 |
| 20140184257 | INTERFACE FOR A TEST SYSTEM - An example test system includes: a pin electronics board for exchanging signals with a device under test (DUT), where the pin electronics board includes first electrical contacts; an interposer between the pin electronics board and a paddle board, where the paddle board includes second electrical contacts, and where the interposer includes electrical connectors for use in establishing electrical pathways between the first electrical contacts and the second electrical contacts; and an actuator configured to force the paddle board and the interposer to make contact so as to cause the electrical connectors to contact the second electrical contacts and thereby establish the electrical pathways. | 07-03-2014 |
| 20140232424 | APPARATUS FOR TESTING ELECTRONIC DEVICES - An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer. | 08-21-2014 |
| 20140266273 | TEST-YIELD IMPROVEMENT DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME - A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | 09-18-2014 |
| 20140320156 | APPARATUS FOR DETECTING MISALIGNMENT OF TEST PAD - An apparatus for detecting misalignment of a test pad and a probe card includes: a test pad unit; a guard unit configured to surround the test pad unit, and formed to maintain a predetermined interval with the test pad unit; and a power supply unit configured to supply a predetermined voltage to the guard unit. | 10-30-2014 |
| 20140354316 | CIRCUIT BOARD INSPECTION METHOD, CIRCUIT BOARD INSPECTION APPARATUS AND CIRCUIT BOARD INSPECTION TOOL - There is provided a circuit board inspection tool configured to electrically connect a circuit board with a built-in electronic component and a circuit board inspection apparatus configured to inspect a plurality of wiring patterns formed on the circuit board. The circuit board inspection tool includes a plurality of contactors, an electrode body on which the respective contactors abut at the other end and which are electrically connected to the circuit board inspection apparatus, and a holding body having an inspection-side holding unit configured to guide one ends of the contactors to the inspection points and an electrode-side holding unit configured to guide the other ends thereof to the electrode units, wherein an amount of projection of a contactor which abuts on an inspection point of a wiring pattern conductively connected to the electronic component is formed to be greater than that of the other contactors. | 12-04-2014 |
| 20150084658 | TEST SOCKET WHICH ALLOWS FOR EASE OF ALIGNMENT - The present invention relates to a test socket which allows for ease of alignment, and more particularly, to a test socket that is interposed between a device to be inspected and an inspection apparatus so as to electrically connect terminals of the device to be inspected and pads of the inspection apparatus, the test socket including: an alignment member that has a plurality of through-holes formed at points corresponding to the terminals of the device to be inspected or the pads of the inspection apparatus and is attached to the inspection apparatus such that the through-holes are located at the pads of the inspection apparatus; and an elastic conductive sheet including conductive parts that are disposed at the points corresponding to the terminals of the device to be inspected and include a plurality of conductive particles that are distributed in an insulating elastic material, insulating support parts that support the conductive parts and disconnect an electrical connection between adjacent conductive parts, and protruding conductive parts that protrude downward from the conductive parts and are inserted into the plurality of through-holes of the alignment member, wherein when the protruding conductive parts are inserted into the through-holes of the alignment member, the elastic conductive sheet is aligned in the the alignment member. | 03-26-2015 |
| 20150091595 | Touchdown Monitoring for Individual Dies of a Semiconductor Wafer - A prober system comprises a chuck, sensor and processing circuit. The chuck is configured to horizontally move a semiconductor wafer having a plurality of dies to position a selected group of the dies for parallel testing and vertically move the wafer to press the selected group of dies in contact with probes of a tester probe card. The sensor is configured to measure the vertical movement of the chuck when the wafer is on the chuck. The processing circuit is configured to control the horizontal and vertical movement of the chuck to test different groups of the dies, determine a total number of touchdowns between the wafer and the probes based on the vertical movement of the chuck measured by the sensor and associate each of the touchdowns with a location of the wafer contacted by the probes during that touchdown. A corresponding test data analysis system is also provided. | 04-02-2015 |
| 20150323591 | THREE-DIMENSIONAL INTEGRATED CIRCUIT AND TESTING METHOD FOR THE SAME - Each chip in a three-dimensional circuit includes a pair of connections, a test signal generation circuit, and a test result judgment circuit. The connections are electrically connected with an adjacent chip. The test signal generation circuit outputs a test signal to one of the connections. The test result judgment circuit receives a signal from the other of the connections and, from the state of the signal, detects the conducting state of the transmission path for the signal. Before layering the chips, a conductor connects the connections to form a series connection, and the conducting state of each connection is detected from the conducting state of the series connection. After layering the chips, the test signal generation circuit in one chip outputs a test signal, and the test result judgment circuit in another chip receives the test signal, and thus the conducting state of the connections between the chips is tested. | 11-12-2015 |
| 20160018461 | PROCESS FOR CONTROLLING THE CORRECT POSITIONING OF TEST PROBES ON TERMINATIONS OF ELECTRONIC DEVICES INTEGRATED ON A SEMICONDUCTOR AND CORRESPONDING ELECTRONIC DEVICE - An electrical check executed on wafer tests for the correct positioning or alignment of the probes of a probe card on the pads or bumps of the electronic devices integrated on the wafer. A signal is applied to cause a current to circulate in at least part of a seal ring of at least one of the electronic devices. In a case where the current flows between and through multiple electronic devices, the seal rings of those electronic devices are suitably interconnected to each other by electronic structures that extend through the scribe line between electronic devices. | 01-21-2016 |
| 20160054356 | PROBE ALIGNMENT - A probe for automatic test equipment (ATE) includes: an outer shroud including a course alignment feature configured to receive a target device and to guide the target device into an interior of the outer shroud, where the target device includes exposed electrical leads; and an inner structure that is at least partly inside the outer shroud. The inner structure includes electrical contacts for making an electrical connection to the exposed electrical leads, and also includes a fine alignment feature configured to guide the target device towards the electrical contacts to make the electrical connection. | 02-25-2016 |
| 20160116503 | ELECTRONIC DEVICE HANDLING APPARATUS AND ELECTRONIC DEVICE TESTING APPARATUS - Provided is an electronic device handling apparatus capable of increasing the number of simultaneous measurements while suppressing the increase in cost. An electronic device handling apparatus, which moves bare dies relative to a probe card, includes: a thermal head which includes a plurality of holding regions each of which holds the bare die and has openings; at least one lift unit which is movably held by the thermal head so as to correspond to the holding regions and is able to advance and retreat through the openings; a moving device which moves the thermal head; and a fixed arm which is able to support the one lift unit. | 04-28-2016 |
| 20160178663 | FORMED WIRE PROBE INTERCONNECT FOR TEST DIE CONTACTOR | 06-23-2016 |
| 20160178666 | ALIGNMENT CHECKING APPARATUS AND INTEGRATED CIRCUIT INCLUDING THE SAME | 06-23-2016 |
| 20160178693 | SEQUENTIAL ACCESS ASSEMBLY STRIP TEST ADAPTER | 06-23-2016 |
| 20180024167 | PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES WITH ENHANCED FILTERING PROPERTIES | 01-25-2018 |
