| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324750230 | Using optical means | 17 |
| 20110254574 | PROBER, TESTING APPARATUS, AND METHOD OF INSPECTING SEMICONDUCTOR CHIP - A prober includes a probe card provided with a support board and a probe attached to the support board, a stage on which a measurement wafer is mounted, a camera provided over the probe card to observe an electrode pad of a first semiconductor chip formed on the measurement wafer, and a stage moving unit for moving the position of the stage relative to the probe card. | 10-20-2011 |
| 20110279136 | ELECTRONIC COMPONENT TESTING DEVICE AND ELECTRONIC COMPONENT TRANSPORT METHOD - An electronic component testing device includes a first imaging device for imaging an upper-surface electrode of an electronic component before the electronic component is held by a holding part, a second imaging device for imaging a contact terminal provided to a testing head, a third imaging device for imaging a lower-surface electrode of the electronic component held by the holding part, and a fourth imaging device for imaging a testing socket. A control device controls the position adjustment part of the testing head to adjust the position of the holding part, and thereby controlling, based on images captured by the first and second imaging devices, a holding orientation when the holding part holds the electronic component, and controlling, based on the images captured by the third and fourth imaging devices, a holding orientation of the holding part in relation to the testing socket. | 11-17-2011 |
| 20130207680 | DEVICE FOR THE ELECTROMAGNETIC TESTING OF AN OBJECT - The invention relates to a device for the electromagnetic testing of an object, comprising a network of electromagnetic probes ( | 08-15-2013 |
| 20130241587 | WAFER STAGE - A wafer stage and a method of supporting a wafer for inspection. the wafer stage comprises a platform for supporting a wafer such that a backside of the wafer is suspended above a cavity of the platform; and a support structure disposed substantially within the cavity for supporting a portion of the wafer; wherein the wafer stage is adapted for relative movement of the platform with respect to the support structure for alignment of the wafer with respect to a probe. | 09-19-2013 |
| 20140111235 | ELECTRONIC COMPONENT HANDLING APPARATUS, ELECTRONIC COMPONENT TESTING APPARATUS, AND ELECTRONIC COMPONENT TESTING METHOD - There is provided an electronic component handling apparatus which can be reduced in size or can improve the throughput when the number of contact arms is increased. A handler comprises: a plurality of contact arms which are arrayed along a first direction, each of the plurality of contact arms including a holding part which holds a DUT and including an adjustment unit which moves the holding part relative to a base part of each contact arm; an imaging unit capable of imaging the DUT and the holding part; an operation unit which operates the adjustment unit; and a moving unit which moves the imaging unit and the operation unit along an X direction. The adjustment unit adjusts the relative position of the holding part according to an operation of the operation unit. | 04-24-2014 |
| 20140203830 | TEST SYSTEM AND METHOD FOR WAFER INCLUDING OPTICAL COMPONENT - A wafer test system includes an input device configured to transmit a test signal, a wafer including an optical port, an input port configured to receive the test signal, and an output port configured to output a result signal based on the test signal, a measuring device configured to measure the result signal, and an alignment device configured to align an optical fiber port of an optical probe with an alignment port based on the result signal and then align the optical fiber port with the optical port. The alignment port is the input port or the output port. The optical probe is configured to be the input device when the input port is the alignment port and the optical probe is configured to be the measuring device when the output port is the alignment port. | 07-24-2014 |
| 20140218061 | MICRO POSITIONING TEST SOCKET AND METHODS FOR ACTIVE PRECISION ALIGNMENT AND CO-PLANARITY FEEDBACK - Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques. | 08-07-2014 |
| 20140347081 | SEMICONDUCTOR DEVICE ASSESSMENT APPARATUS - A semiconductor device assessment apparatus that electrically assesses a semiconductor device formed on a semiconductor substrate includes a holding unit having a surface to hold the semiconductor substrate thereon, and a detection unit to detect irregularity on the surface of the holding unit. The holding unit on the surface includes a plurality of grooves formed such that when the semiconductor substrate is held on the surface, the grooves overlap a periphery of the semiconductor substrate and also have a portion located outer than the periphery of the semiconductor substrate. | 11-27-2014 |
| 20150015286 | MICRO-VISION ALIGNMENT SYSTEM WITH GUIDING RINGS FOR IC TESTING - A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array. | 01-15-2015 |
| 20150362552 | Probe Device - A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount. | 12-17-2015 |
| 20150369861 | GROUP VISION ALIGNMENT FOR DOUBLE SIDED IC DEVICE TESTING - A system for double sided integrated circuit device testing includes: (i) a picking section including: (a) a plurality of picking-section pockets; (b) a picking-section plate including: one or more picking-section pocket openings, and first and second picking-section plate pins; (ii) a placing section including: (a) a plurality of placing-section contactors; (b) a placing-section member including: one or more placing-section contactor openings, and first and second placing-section member pins; and (iii) a pick-and-place section including: (a) a pick-and-place device including: a plurality of pick-and-place head contactors, and one or more sets of actuators; and (b) a pick-and-place head plate including: one or more pick-and-place head contactor openings, each pick-and-place head contactor opening corresponding to a pick-and-place head contactor, and first and second spring-loaded bushings configured to engage with the first and second picking-section plate pins, and the first and second placing-section member pins. | 12-24-2015 |
| 20160103175 | ELECTRICAL TEST SYSTEM WITH VISION-GUIDED ALIGNMENT - An electrical testing system is adapted to perform electrical tests on devices fabricated on successive frames of a web of substrate, each frame including a plurality of fiducial marks. A digital imaging system captures a digital image of a frame, which is analyzed to determine spatial relationships between positions of a set of test pads and positions of the fiducial marks. The frame is advanced to an electrical test fixture which includes a set of test probes adapted to make electrical contact with the test pads. A fiducial sensing system including a plurality of fiducial sensors determines positions of the fiducial marks. The position of the electrical test fixture is adjusted responsive to the determined spatial relationships and the determined fiducial mark positions so that the test probes are aligned with corresponding test pads, and an electrical test of the device is performed. | 04-14-2016 |
| 20160103176 | ELECTRICAL TEST METHOD WITH VISION-GUIDED ALIGNMENT - A method for electrically testing devices fabricated on successive frames of a web of substrate, each frame including a plurality of fiducial marks. A digital imaging system is used to capture a digital image of a frame, which is analyzed to determine spatial relationships between positions of a set of test pads and positions of the fiducial marks. The frame is advanced to an electrical test fixture which includes a set of test probes adapted to make electrical contact with the test pads. A fiducial sensing system including a plurality of fiducial sensors is used to determine positions of the fiducial marks. The position of the electrical test fixture is adjusted responsive to the determined spatial relationships and the determined fiducial mark positions so that the test probes are aligned with corresponding test pads, and an electrical test of the device is performed. | 04-14-2016 |
| 20160103177 | VISION-GUIDED ALIGNMENT SYSTEM - A system is used to perform an operation on an article, the article including a plurality of fiducial marks and a set of features. A digital imaging system captures a digital image of the article, which is analyzed to determine spatial relationships between positions of the features and positions of the fiducial marks. The article is positioned in proximity to an instrument and a fiducial sensing system including a plurality of fiducial sensors is used to determine positions of the fiducial marks. Predicted positions of the features are determined responsive to the determined spatial relationships and the determined fiducial mark positions. The position of the instrument or the article is adjusted responsive to the predicted positions of the features, and the instrument is used to perform an operation on the article. | 04-14-2016 |
| 20160103178 | VISION-GUIDED ALIGNMENT METHOD - A method for performing an operation on an article, the article including a plurality of fiducial marks and a set of features. A digital imaging system is used to capture a digital image of the article, which is analyzed to determine spatial relationships between positions of the features and positions of the fiducial marks. The article is positioned in proximity to an instrument and a fiducial sensing system including a plurality of fiducial sensors is used to determine positions of the fiducial marks. Predicted positions of the features are determined responsive to the determined spatial relationships and the determined fiducial mark positions. The position of the instrument or the article is adjusted responsive to the predicted positions of the features, and the instrument is used to perform an operation on the article. | 04-14-2016 |
| 20160161553 | PROBE APPARATUS AND PROBE METHOD - A probe apparatus includes a stage, a first and a second imaging device, a first and a second imaging optical unit, and a projection optical unit. The stage is movable in horizontal and vertical directions. The first imaging device picks up an image of a probe needle which is made to contact with an electrode of a device formed on a surface of the substrate. The first and second imaging optical units include optical systems for performing an image pickup by using the first and second imaging devices, respectively. The second imaging device picks up an image of the electrode held on the stage. The projection optical unit includes an optical system that projects an optical target mark, used in a position alignment of the first and the second imaging device, onto each of image forming units of the first and second imaging devices at the same time. | 06-09-2016 |
| 20160377657 | LOOP-BACK PROBE TEST AND VERIFICATION METHOD - A method is provided for using a loop-back test device to verify continuity between loop-back probes electrically connected to each other on a probe card, the loop-back test device including a first conductive region electrically connected to a substrate, a second conductive region electrically isolated from the substrate, the second conductive region spaced apart from the first conductive region such that when a first loop-back probe contacts the first conductive region a second loop-back probe contacts the second conductive region, The method includes placing the first loop-back probe in electrical contact with the first conductive region, and placing the second loop-back probe in electrical contact with the second conductive region. Continuity between the substrate and the second conductive region is then measured. | 12-29-2016 |
