Class / Patent application number | Description | Number of patent applications / Date published |
324750250 | By mechanical means | 80 |
20110234248 | CIRCUIT BOARD TESTING DEVICE WITH SELF ALIGNING PLATES - A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral sideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed. | 09-29-2011 |
20120062259 | WAFER INSPECTION APPARATUS AND METHOD FOR PRE-HEATING PROBE CARD - A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support. | 03-15-2012 |
20120194209 | SYSTEM AND METHOD FOR PICKING AND PLACEMENT OF CHIP DIES - According to an aspect of the invention, there is provided a chip die manipulator apparatus arranged for pick and placing of a chip die ( | 08-02-2012 |
20120217986 | MODULE ASSEMBLY HOLDING WORKBOARD - A module assembly holding workboard is provided and includes a base having a central portion to support a computing module, a first wing at a first side of the central portion to support a first adapter and a second wing at a second side of the central portion to support a second adapter, the first and second adapters being coupled to the computing module via first and second conductive elements and a plurality of routing channel elements fixedly disposed at the first and second wings to retain the first and second conductive elements. | 08-30-2012 |
20120235695 | SOCKET, AND TEST APPARATUS AND METHOD USING THE SOCKET - An apparatus for testing electric characteristics of a test object including first connection terminals on a bottom surface and second connection terminals on a top surface, the apparatus comprises a test board comprising first pads on a predetermined surface; a socket configured to electrically connect the test object to the test board; and a handler configured to transport the test object to the socket. The socket comprises a first connection unit configured to be electrically connected to the first connection terminals of the test object and a second connection unit configured to be electrically connected to the second connection terminals of the test object. | 09-20-2012 |
20120280702 | TESTING HEAD FOR A TEST EQUIPMENT OF ELECTRONIC DEVICES - A testing head for a test equipment of electronic devices of the type includes a plurality of contact probes inserted into guide holes which are realized in at least an upper guide and a lower guide separated one another by an air zone. Each of such contact probes include at least a probe body having a substantially rectangular section and a projecting arm from the probe body which ends with a probe tip for contacting one of a plurality of contact pads of a device to be tested. The projecting arm projects outside the probe body so as to have a lug with respect to both faces of the probe body which converge in an edge in order to define a probe tip offset and external with respect to the probe body. | 11-08-2012 |
20130033278 | INSPECTION CONTACT ELEMENT AND INSPECTING JIG - Provided is a micro contact element which is capable of coping with the miniaturization and greater complexity of substrates or boards, which is simplified due to a reduction in the number of components, and which creates sufficient contact pressure and stroke. Also provided is an inspection jig using this contact element. An inspection contact element having the contact pressure and amount of contraction required to carry out an inspection is formed by using notch parts respectively formed in two conductive cylindrical members having different outer and inner diameters so that the notch parts can function as elastic parts, and combining the two cylindrical members in such a way that the elastic parts are arranged in parallel or in series. | 02-07-2013 |
20130063171 | PROBE APPARATUS - A probe apparatus includes a movable mounting table for holding a test object provided with a plurality of power devices including diodes; a probe card arranged above the mounting table with probes; a measuring unit for measuring electrical characteristics of the power devices by bringing the probes into electrical contact with the test object in a state that a conductive film electrode formed on at least a mounting surface of the mounting table is electrically connected to a conductive layer formed on a rear surface of the test object; and a conduction member for electrically interconnecting the conductive film electrode and the measuring unit when measuring the electrical characteristics. The conduction member is interposed between an outer peripheral portion of the probe card and an outer peripheral portion of the mounting table. | 03-14-2013 |
20130106454 | PRINTED CIRCUIT BOARD TESTING DEVICE | 05-02-2013 |
20130127485 | PRINTED CIRCUIT BOARD TESTING DEVICE - A printed circuit board testing device for performing electrical tests on a printed circuit board having test contacts includes a test platform. An installable and uninstallable positioning module is disposed on the test platform and adapted to receive the printed circuit board. The positioning module has through-holes corresponding in position to the test contacts. A dial module is disposed between the test platform and the positioning module, and has a needle corresponding in position to the through-holes, such that the distance between the dial module and the positioning module can be altered to cause the needle to penetrate a corresponding one the through-holes, insert into the positioning module, and come into contact with the test contacts to facilitate the electrical test. The printed circuit board testing device can perform electrical tests on any printed circuit boards having the test contacts, by changing the positioning module and the dial module. | 05-23-2013 |
20130141129 | CONTACTOR AND SEMICONDUCTOR TEST APPARATUS COMPRISING THE SAME - Provided is a test contactor for testing a semiconductor device which includes a cylinder, a piston which is configured to reciprocate between a first position and a second position according to a change in pressure in the cylinder, and a pressing part which is configured to change its location according to the reciprocating motion of the piston. The pressing part is configured to be in contact with the semiconductor device when the piston is located at the first position, and the pressing part is configured not to be in contact with the semiconductor device when the piston is located at the second position. | 06-06-2013 |
20130147504 | WAFER INSPECTION DEVICE - A wafer inspection device, which inspects the electrical properties of a semiconductor wafer on which a semiconductor integrated circuit is formed, and the wafer inspection device has: a holding mechanism for holding a probe card; a wafer stage that holds the semiconductor wafer on the upper surface and is movably provided; and a pressing mechanism that are held and press the wafer stage against the probe card. The wafer stage is provided on the outer periphery with a seal ring. The seal ring forms a sealed space in a state where the wafer and the probe card are brought close to each other by contacting the probe card and is provided in such a manner as to reduce the pressure of the sealed space. | 06-13-2013 |
20130169302 | SYSTEM AND ADAPTER FOR TESTING PACKAGED INTEGRATED CIRCUIT CHIPS - High precision connectivity for a device under test (DUT) in an electronic test system at reduced cost and superior performance characteristics is provided by incorporating an appropriate contact structure into a printed circuit board (PCB) of the electronic test system. Alternatively, a superior adapter that is formed on the basis of highly precise volume production techniques, for example using well-established semiconductor materials and related manufacturing techniques, is provided to support high precision connectivity. | 07-04-2013 |
20130169303 | ELECTRONIC DEVICE TESTING APPARATUS - There is provided an electronic device testing apparatus which can effectively use a space in an electronic device handling apparatus since a preciser is not necessary. | 07-04-2013 |
20130176046 | MOBILE TRANSFORMER TESTING SYSTEM - A system includes a transformer testing system that includes a mobile platform configured to couple to a vehicle and an impulse testing system coupled to the mobile platform. The impulse testing system includes an impulse generator tower disposed in a lowered position along the mobile platform during transport by the vehicle. The transformer testing system also includes a lift system coupled to the mobile platform. The lift system is configured to lift the impulse generator tower from the lowered position to a raised position. The impulse testing system is configured to perform an impulse test of a high voltage power transformer while the impulse generator tower is disposed in the raised position. The transformer testing system also includes a protective cover disposed on the mobile platform. The protective cover is configured to surround a region having the impulse testing system. | 07-11-2013 |
20130234746 | SHIELDED PROBE ARRAY - Shielded probe array. In accordance with a first embodiment, an article of manufacture includes a plurality of rows of electronic probes. Each row of probes is substantially in a plane. Each probe includes a metal signal layer and a ground layer, separated by an insulator. The article of manufacture also includes a space transformer for mechanically supporting the plurality of rows of electronic probes. The space transformer also provides an electrical path from each of the probe metal signal layers and the probe ground layers to a higher level electronic assembly. Each of the plurality of rows of electronic probes may include a handle including a substrate for handling the row of electronic probes. | 09-12-2013 |
20130249582 | AUXILIARY ELEMENT OF PRINTED CIRCUIT BOARD MODULE - An auxiliary element of a printed circuit board defining a plurality of vias with different shapes and sizes includes a test board defining a plurality of test holes with different shapes and sizes. The test holes of the test board are to have the same shape and size as corresponding vias of the printed circuit board. | 09-26-2013 |
20130257467 | CONTACT TEST DEVICE - Because a guide hole that guides a plunger of a probe requires cumbersome machining of a hole, it is difficult to accommodate to narrowing of pitch and multi-polarization of terminals or electrodes. A probe ( | 10-03-2013 |
20130271171 | DUAL STAGE VACUUM CHAMBER WITH FULL CIRCUIT BOARD SUPPORT - A dual-stage fixture for a circuit tester includes a slide plate that can be slid between at least a first position and a second position. In the first position, an upper stripper plate is spring-loaded, and a full set of test probes, including both long-stroke and short-stroke probes, can contact the circuit board or UUT (unit under test). In the second position, the upper stripper plate becomes fixed in position, and only the long-stroke probes can contact the circuit board. The fixed positioning of the upper stripper plate prevents the short-stroke probes from contacting the circuit board even when there is unbalanced loading of probe pressure between the top and bottom of the circuit board, thereby preventing transient signals from interfering with testing. In addition, a vacuum is applied in this position during a non-powered test. | 10-17-2013 |
20130285688 | LATERALLY DRIVEN PROBES FOR SEMICONDUCTOR TESTING - A method for testing a semiconductor device. The method comprises moving a probe in a vertical direction towards an electrical structure on a semiconductor device to position the probe alongside the electrical structure. A tip of the probe is positioned lower than an elevation of an outermost periphery of the electrical structure. The method also includes moving the probe in a lateral direction towards the electrical structure to contact the electrical structure. The probe tip mechanically and electrically engages the electrical structure. | 10-31-2013 |
20130335109 | METHOD OF TEST PROBE ALIGNMENT CONTROL - A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value. | 12-19-2013 |
20130335110 | PLANAR CIRCUIT TEST FIXTURE - There is provided a test fixture for testing a planar circuit. The test fixture comprises a body adapted to retain therein the planar circuit and to be connected to test equipment. The body provides a transition between the planar circuit and the test equipment and comprises a base member having a first surface and a fixation member having a second surface and connected to the base member through a first connection allowing movement along a first axis of the fixation member relative to the base member, a spacing defined between the first surface and the second surface for retaining therein an end of the planar circuit, the fixation member movable along the first axis relative to the base member for adjusting the spacing. | 12-19-2013 |
20130342233 | Wafer Level Integrated Circuit Contactor and Method of Construction - A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin ( | 12-26-2013 |
20140035606 | TEST PLATFORM - A test platform includes a supporting member, a first slide rail located below the supporting member, and a conductive second slide rail located below the first slide rail for being electrically connected to a power source. A wireless router and an uninterruptible power supply (UPS) electrically connected to the wireless router are mounted on a bottom of the supporting member. A network socket is mounted on the supporting member and electrically connected to the wireless router. A power socket is mounted on the supporting member and electrically connected to the UPS. A number of first wheels are rotatably mounted on the bottom of the supporting member. Each first wheel rests on and rolls along the first slide rail. A number of conductive second wheels are rotatably mounted on a bottom of the UPS. Each second wheel rests on and rolls along the second slide rail. | 02-06-2014 |
20140049278 | TEST HEAD FOR ELECTRICAL TESTING OF A TEST SPECIMEN - The present disclosure relates to a test head for electrical testing of a test specimen, in particular a wafer, having at least two guide plates, which are spaced apart by means of at least one spacer and have guide holes distributed over the surfaces thereof, in which test contact pins for physical contact with the test specimen are guided in a sliding manner. Provision is made for the spacer to be formed by a multiplicity of point supports arranged in a manner distributed over the surfaces of the guide plates and secured on the guide plates. | 02-20-2014 |
20140111236 | TERMINAL TESTER - A terminal testing device provides an adapter customized to a port of a connector being tested so that force applied to the adapter identifies loose and fixed terminals in the connector. The adapter includes springs and push pins that correspond in number to the number of terminals being tested and has a face plate that corresponds to the type of connector being tested. The push pins provide force against the terminal end. Specifically, the device seats the adapter and connector to align both and permit force to be in line with terminal ends. The force applied to the terminal ends is uniform and controlled by means of the adapter and is obtained by a single driving means. | 04-24-2014 |
20140118016 | Probes With Spring Mechanisms For Impeding Unwanted Movement In Guide Holes - Elongated flexible probes can be disposed in holes of upper and lower guide plates of a probe card assembly. Each probe can include one or more spring mechanisms that exert normal forces against sidewalls of holes in one of the guide plates. The normal forces can result in frictional forces against the sidewalls that are substantially parallel to the sidewalls. The frictional forces can reduce or impede movement parallel to the sidewalls of the probes in the holes. | 05-01-2014 |
20140159757 | System and Methods for Memory Installation in Functional Test Fixture - A system and a method for testing information handling systems is provided. The system includes a top cover having a memory circuit and a bottom platform for receiving a test printed circuit board assembly (PCBA) including a slot. The system includes a sensor determining the relative position of the memory circuit and the slot; and a host controller coupled to the test PCBA and the sensor through a port. A computer program product including a non-transitory computer readable medium having computer readable and executable code is also provided. The code instructs a processor in a host controller in a test fixture to load a memory circuit on a crane; engage a sub-module carrying the memory circuit; load a printed circuit board assembly (PCBA); place a memory device on a slot in the PCBA; perform a system test on the PCBA; disengage the sub-module and the test fixture. | 06-12-2014 |
20140210502 | ENHANCED REVERBERATION CHAMBER - A method and apparatus for an enhanced reverberation chamber are disclosed. In one embodiment, one or more positioners are coupled to a tuner, such that when the tuner moves, the positioner moves. A device involved with a test may be mounted to the positioner so that when the positioner moves, the device moves. | 07-31-2014 |
20140232425 | MULTI-PURPOSE INTEGRATED CIRCUIT DEVICE CONTACTOR - A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (PCB) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test PCB. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor. The frame and guide plate can be removed and a thinner frame coupled to the contactor, which changes its function to a pogo block assembly. | 08-21-2014 |
20140232426 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH CONVEX SUPPORT STRUCTURE - A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT. | 08-21-2014 |
20140239993 | SOCKET DEVICE FOR AN IC TEST - Disclosed herein is a socket device for an integrated circuit (IC) test. The device includes: a socket which is provided with a pin guide plate that can guide and protect a spring contact so as to prevent damage to or breakage of the spring contact that electrically connects an IC lead to a PCB; and an IC insert provided with a guide plate. According to said configuration, ball grid array (BGA) ICs in which IC leads are balls can be more efficiently tested. Particularly, contact pins of the socket and the IC leads can be mechanically and electrically more precisely positioned for narrow pitches of the IC leads such as 0.4 mm, 0.35 mm, and 0.3 mm. Thereby, damage to or breakage not only of the ICs to be tested but also of the socket can be minimized. | 08-28-2014 |
20140253159 | HIGH ACCURACY ELECTRICAL TEST INTERCONNECTION DEVICE AND METHOD FOR ELECTRICAL CIRCUIT BOARD TESTING - A high accuracy electrical test interconnect method employs a tester interface transfer block to enable the transfer of electrical contact from less accurate tester resource probes to target probes which are contained in the tester interface transfer block and can be positioned with high accuracy using the three dimensional printing to enable reliable contact with smaller test pads. The target probes can directly contact the tester resource probes or a transfer plate can be interposed between the target probes and the tester resource probes to allow positional adjustment of the target probes relative to the tester resource probes. This invention also includes the use of specialized shape target probes that can contact circuit board objects, such as vertical conductive surfaces and irregular shape test pads that have not been accessible with traditional methods. | 09-11-2014 |
20140253160 | ROLL TO ROLL TESTER AND METHOD OF TESTING FLEXIBLE SUBSTRATES ROLL TO ROLL - An apparatus for testing of a plurality of electronic devices on a flexible substrate is described. The apparatus includes at least two rollers ( | 09-11-2014 |
20140266274 | PROBE GUIDE PLATE AND METHOD FOR MANUFACTURING THE SAME - There is provided a probe guide plate. The probe guide plate includes: a substrate having a through hole for guiding a probe, which is formed through the substrate, wherein the substrate includes a first main surface and a second main surface opposite to the first main surface; and a first insulating film formed on an inner wall of the through hole and on the first and second main surfaces of the substrate such that portions of the first and second main surfaces of the substrate are exposed. | 09-18-2014 |
20140266275 | GUIDE PLATE FOR PROBE CARD - The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film. | 09-18-2014 |
20140266276 | CROSS-BAR UNIT FOR A TEST APPARATUS FOR CIRCUIT BOARDS, AND TEST APPARATUS CONTAINING THE FORMER - A cross-bar unit for a test apparatus for circuit boards having at least one cross-bar spanning a test field in which a circuit board to be tested may be placed, and is configured to hold positioning units for test fingers in a linearly traversable manner so that the test fingers are able to scan at least part of the test field. The cross-bar unit is configured to hold at least two linear guides, independent of one another, for guiding in each case at least one of the positioning units. | 09-18-2014 |
20140292362 | DUAL STAGE VACUUM CHAMBER WITH FULL CIRCUIT BOARD SUPPORT - A dual-stage fixture for a circuit tester includes a slide plate that can be slid between at least a first position and a second position. In the first position, an upper stripper plate is spring-loaded, and a full set of test probes, including both long-stroke and short-stroke probes, can contact the circuit board or UUT (unit under test). In the second position, the upper stripper plate becomes fixed in position, and only the long-stroke probes can contact the circuit board. The fixed positioning of the upper stripper plate prevents the short-stroke probes from contacting the circuit board even when there is unbalanced loading of probe pressure between the top and bottom of the circuit board, thereby preventing transient signals from interfering with testing. In addition, a vacuum is applied in this position during a non-powered test. | 10-02-2014 |
20140306730 | ALIGNMENT ADJUSTING MECHANISM FOR PROBE CARD, POSITION ADJUSTING MODULE USING THE SAME AND MODULARIZED PROBING DEVICE - An alignment adjusting mechanism for a probe card includes a frame, a substrate and positioning screws. The frame has an opening, an inner periphery wall surrounding around the opening, and an outer periphery wall corresponding to the inner periphery wall. The substrate is disposed in the opening and supported by a support flange extending from the inner periphery wall toward a center of the opening. The frame is provided with a plurality of positioning threaded holes each extending from the outer periphery wall to the inner periphery wall in communication with the opening. Each positioning screw is threaded into one of the positioning threaded holes and has an end stopped at a lateral side of the substrate. By turning the positioning screws, the planimetric position of the substrate on an imaginary plane is adjustable. | 10-16-2014 |
20140327461 | Probe Card Assembly For Testing Electronic Devices - A probe card assembly can comprise a guide plate comprising probe guides for holding probes in predetermined positions. The probe card assembly can also comprise a wiring structure attached to the guide plate so that connection tips of the probes are positioned against and attached to contacts on the wiring structure. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate. The probes can include compliant elements that fail upon high electrical current and thermal stresses located away from the contact tips. | 11-06-2014 |
20140333334 | PARALLELISM ADJUSTING DEVICE AND PARALLELISM ADJUSTING METHOD - A parallelism adjusting device and a parallelism adjusting method capable of adjusting the parallelism between the surface of a semiconductor and the surface of an electrode by reducing the load on the semiconductor and capable of shortening the cycle time by increasing the operating speed. A probe device of adjusting the parallelism between the surface and the surface of a contact body that is in contact with the surface to press the surface and apply a current is configured to include a pressing body assembly that presses the contact body with a predetermined pressing force until the surface and the surface come into contact with each other to adjust the parallelism and, after that, presses the contact body with a pressing force that is stronger than the predetermined pressing force. | 11-13-2014 |
20140340104 | Assembly and Method for Testing an Electronic Circuit Test Fixture - A method provides testing of an electronic circuit test system that includes a test fixture having headed and headless test probes, a shorting plate and a test probe verification plate with apertures. A probe verification test includes: moving the test probe verification plate and the shorting plate into position, where the shorting plate engages any test probe that extends through an aperture of the verification plate; and transmitting an electrical signal to each of the test probes. The electricity flow associated with each of the test probes is analyzed to determine if any of the headless test probes have an open circuit. In response to detecting an open circuit: one or more of the headless test probes are indicated as (a) defective in the test fixture or (b) missing from the test fixture; and the specific locations in the test fixture of the defective or missing test probes are identified. | 11-20-2014 |
20140361800 | METHOD AND APPARATUS FOR HIGH VOLUME SYSTEM LEVEL TESTING OF LOGIC DEVICES WITH POP MEMORY - A method and apparatus for high volume testing of logic devices with package-on-package (POP) memory. The apparatus includes a handler arm, compound nest attached to the handler arm, swing arm and a socketed assembly that facilitates alignment. In the method, a logic device is first installed in a compound nest. The compound nest is them attached to a handler arm. The compound nest is then aligned with a socketed assembly using a swing arm. Fine tuning of the alignment may be performed using guide pins and shoulder screws. | 12-11-2014 |
20150015287 | TESTING APPARATUS AND METHOD FOR MICROCIRCUIT AND WAFER LEVEL IC TESTING - The test system provides an array of test probes having a cross beam. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. The probes are biased upwardly through the retainer by an elastomeric block having a similar array of slots. The elastomer is then capped at its bottom by a second or lower retainer with like slots to form a sandwich with the elastomer therebetween. The bottom ends of the probes are group by probe height. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and take continue the circuits to a probe card where test signals originate. | 01-15-2015 |
20150054537 | SYSTEM AND METHOD FOR ASSEMBLING A PROBE HEAD - A method of assembling a probe head for a probe card interface is disclosed. The probe head includes a plurality of alignment plates, wherein each of the alignment plates includes a set of holes. The plurality of alignment plates are stacked so that each of the alignment plates is adjacent to at least one other alignment plate and a set of holes in each of the alignment plates is aligned with a corresponding set of holes in each of the remaining alignment plates. A set of probe wires is then inserted through the set of holes, respectively, in each of the plurality of alignment plates. After the set of probe wires are inserted, the plurality of alignment plates are spaced so that none of the plurality of alignment plates is adjacent to another alignment plate. One or more multi-piece spacers may be used to space the alignment plates. | 02-26-2015 |
20150091596 | PROBE RETENTION ARRANGEMENT - A retention arrangement that includes one or more templates for securing and aligning probes for testing a device under test. | 04-02-2015 |
20150109012 | Multi-Stage Circuit Board Test - Multi-stage in circuit test of a circuit board has support to reduce strain placed on the circuit board during each test stage. A shuttle plate is disposed between a load plate that supports a circuit board under test and a probe plate that directs test probes towards the circuit board. The shuttle board slides between different positions with each position establishing the distance between the circuit board and the test probes. For instance, in a first position, the shuttle plate aligns intermediary members to rest between the load plate and shuttle plate to keep the probes spaced by a first distance from the circuit board so that only some test probes contact the circuit board. In a second position, the shuttle plate aligns the intermediary members with blind vias to bring the shuttle plate and load plate proximate each other so that all test probes contact the circuit board. | 04-23-2015 |
20150115988 | AUTOMATION TESTING SYSTEM FOR TESTING A MOTHERBOARD - An automation testing system for testing a motherboard includes a frame, a first jig plate, a second jig plate, a platform, a first driving mechanism, a second driving mechanism and a console computer. The frame includes a track, a debug docking board is detachably disposed on the first jig plate for docking with the motherboard, the platform is slidably installed on the track and disposed between the first jig plate and the second jig plate, and the platform is for holding the motherboard. The console computer controls the first driving mechanism to drive the platform to move in a first direction along the track, and controls the second driving mechanism to drive the second jig plate to move in a second direction perpendicular to the first direction. | 04-30-2015 |
20150123685 | MODULE FOR EXCHANGING AN INTERFACE UNIT IN A TESTING SYSTEM FOR TESTING SEMICONDUCTOR COMPONENTS AND TESTING SYSTEM COMPRISING SUCH A MODULE - The invention relates to a module for exchanging an approximately planar interface unit in a testing system for testing semiconductor elements. The module includes a base element, a holder, and guide elements. The guide elements are embodied so that the interface unit can be moved by means of a linear, translatory movement from an end position into an intermediate position and from the intermediate position into a removal position that is situated outside the testing system. The mechanism includes a lever mechanism that is controlled by a sliding guide and is supported so that it can move crosswise to the linear translation movement of the holder. | 05-07-2015 |
20150123686 | SEMICONDUCTOR TRANSPORTING AND TESTING FIXTURE - The semiconductor transporting and testing fixture according to the present invention comprises: a frame portion ( | 05-07-2015 |
20150145543 | MEMS DEVICE POSITIONING APPARATUS, TEST SYSTEM, AND TEST METHOD - A positioning apparatus includes a support structure, a positioning structure, and a fixture for retaining MEMS devices. A shaft spans between the support structure and the positioning structure, and is configured to rotate about a first axis relative to the support structure in order to rotate the positioning structure and the fixture about the first axis. The positioning structure includes a pair of beams spaced apart by a third beam. Another shaft spans between the pair of beams and is configured to rotate about a second axis relative to the positioning structure in order to rotate the fixture about the second axis. Methodology entails installing the positioning apparatus into a chamber, orienting the fixture into various positions, and obtaining output signals from the MEMS devices to determine functionality of the MEMS devices. | 05-28-2015 |
20150145544 | PRESSURE SENSING AND CONTROL FOR SEMICONDUCTOR WAFER PROBING - A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures. | 05-28-2015 |
20150301083 | GUIDE PLATE FOR A PROBE CARD AND PROBE CARD PROVIDED WITH SAME - It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate | 10-22-2015 |
20150309076 | TESTING HEAD OF ELECTRONIC DEVICES - It is described a testing head for a testing equipment of an electronic device comprising at least one upper guide and a lower guide provided with guide holes, a plurality of contact probes inserted into the guide holes of the upper and lower guides and at least one containment element of the probes being is disposed between the upper and lower guides, each of the contact probes having at least one terminal portion which ends with a contact tip adapted to abut on a respective contact pad of the electronic device to be tested; at least one spacer element sandwiched between the containment element and at least one of the upper and lower guides, the spacer element being removable to adjust a length of the terminal portions of the contact probes projecting from the lower guide. | 10-29-2015 |
20150323565 | CONTACT MODULE FOR ELECTRONIC COMPONENTS MEASUREMENT - When a pressure plate is positioned above an electronic component placed in a measurement socket of an electronic-component measurement apparatus, a cam-follower drive mechanism of a measurement pressure mechanism is horizontally driven to lower the pressure plate via a cam block, whereby the pressure plate presses the electronic component against the measurement socket at a predetermined pressure. | 11-12-2015 |
20150331037 | TESTING APPARATUS FOR TESTING ELECTRICAL CIRCUIT BOARD HAVING ELECTRICAL CONNECTORS THEREON - A testing apparatus for testing a circuit board is disclosed, which includes an upper plate, a lower plate, and an adaptor circuit board. A plurality of positioning units is received in the lower plate. Each positioning unit has a plurality of length-variable test probes secured therein. Each test probe has a shell and upper and lower probe ends at opposite ends of the shell. In test, the circuit board is put on the lower plate and the upper plate is lowered to push the circuit board and the lower plate toward the adaptor circuit board. The upper ends of the test probes engage with electrical connectors of the circuit board and the lower ends thereof engage with the adaptor circuit board whereby test of the circuit board can be automatically performed by the testing apparatus. | 11-19-2015 |
20150331042 | JOINING AND GUIDING DEVICE - A guided approach device for guiding together a first device (handler or tester) and a second device (including a test head for electronic components), including a latching device with a cylindrical pin socket for holding and fixing a front end of a catch pin. The latching device is connected to a linear displacement device such that the cylindrical pin socket may be displaced in a linear direction at least a short distance corresponding to a multiple of a length of a leading section of the catch pin, which may be inserted into the pin socket. Additionally or alternatively, the latching device is connected to a linear displacement device such that the latching element, a spring element and the pin socket may be displaced, with the catch pin engaged, in a linear direction by the linear displacement device, so that the first and second devices maybe moved relative to one another. | 11-19-2015 |
20150338440 | GUIDE AND SUPPORT MEMBER FOR A DEVICE FOR TESTING ELECTRONIC COMPONENTS - Embodiments of the invention come up from a guide and support member within a device for testing electronic components, which guide and support member can be moved into a feeding position and into a testing position, the guide and support member with a base body for accommodating an electronic component to be tested, with at least one support for supporting contact springs of the electronic component to be tested, and with at least one stopper that stops the movement of the electronic component to be tested at one of its contact springs once the electronic component to be tested is in an exact position. According to the invention, the at least one support comprises a ceramic material, wherein the stopper is anchored in the base body. | 11-26-2015 |
20150346237 | MODULAR TEST FIXTURE - A modular test fixture for testing electronic devices. In some embodiments, such a modular test fixture can include a support frame having a base, and a substrate having a plurality of test components, with the substrate being coupled to the base. The modular test fixture can further include an upper support positioned above the support frame, and a plurality of suspension elements that each extend between the upper support and the support frame. The suspension elements can couple the upper support to the support frame, and the upper support can be movable relative to the support frame. The modular test fixture can further include a daughterboard module coupled to the upper support, and a daughterboard having a test device interface. The daughterboard can be coupled to the daughterboard module and be operatively coupled to the plurality of test components. | 12-03-2015 |
20150355279 | CONTROLLING AUTOMATED TESTING OF DEVICES - In an embodiment, a method includes causing a test floor system to insert a DUT (device under test) into a DUT receptacle. This is performed in a manner that couples the DUT to an electrical interface of the DUT receptacle and that encloses the DUT inside the DUT receptacle to facilitate testing of the DUT. Also, the method includes causing the test floor system to transport the DUT receptacle that encloses the DUT to a tester of the test floor system and to insert the DUT receptacle into a DUT testing module of the tester. Further, the method includes causing the test floor system to determine identification information of the DUT. Furthermore, the method includes, based on the identification information, sending a test routine to the DUT testing module to perform on the DUT. | 12-10-2015 |
20150362546 | PROBE APPARATUS AND WAFER TRANSFER SYSTEM - The present disclosure provides a probe apparatus that is capable of suppressing generation of a transfer error by adsorbing and holding a semiconductor wafer even in a case where the semiconductor wafer has been warped. The probe apparatus includes a measuring section and a loader section, that is, a transfer unit. The loader section is provided with a wafer cassette placed on a load port, a wafer transfer mechanism having a wafer transfer arm, and a gas ejection mechanism having a gas ejection nozzle. When the wafer transfer arm adsorbs and holds a warped semiconductor wafer in the wafer cassette, the gas ejection nozzle ejects a gas from a substantially central portion on the upper side of the semiconductor wafer toward the lower side, thereby reducing warpage of the semiconductor wafer. | 12-17-2015 |
20150369843 | ELECTRICAL CONNECTION DEVICE COMPRISING CONNECTION ELEMENTS WITH CONTROLLABLE POSITION - Electrical connection device comprising at least one substrate and one or several first electrical connection elements located on a front face of the electrical connection device such that they can be coupled to contact pads of an electronic device to which the electrical connection device is intended to be connected, each first electrical connection element comprising:
| 12-24-2015 |
20160011253 | METHOD AND DEVICE FOR TESTING A WORKPIECE | 01-14-2016 |
20160025803 | SYSTEM AND METHODS FOR MEMORY INSTALLATION IN FUNCTIONAL TEST FIXTURE - A system and a method for testing information handling systems is provided. The system includes a top cover having a memory circuit and a bottom platform for receiving a test printed circuit board assembly (PCBA) including a slot. The system includes a sensor determining the relative position of the memory circuit and the slot; and a host controller coupled to the test PCBA and the sensor through a port. A computer program product including a non-transitory computer readable medium having computer readable and executable code is also provided. The code instructs a processor in a host controller in a test fixture to load a memory circuit on a crane; engage a sub-module carrying the memory circuit; load a printed circuit board assembly (PCBA); place a memory device on a slot in the PCBA; perform a system test on the PCBA; disengage the sub-module and the test fixture. | 01-28-2016 |
20160033552 | PROBE UNIT, METHOD OF MANUFACTURING PROBE UNIT, AND TESTING METHOD - A probe unit includes a probe pin and a support unit supporting the probe pin. The support unit includes first and second arms disposed at a distance along a direction in which the probe pin probes a probed object; a holding unit holding base ends of the arms; and a linking unit attached to the probe pin and linking front ends of the arms. The support unit constructs a four-bar linkage that permits linear or approximately linear movement of the probe pin in an opposite direction to the probing direction. The first and second arms have through-holes at positions slightly closer to the front ends than the base ends and positions slightly closer to the base ends than the front ends, center parts between the through-holes function as bars in the four-bar linkage, and formation positions of the through-holes function as joints in the four-bar linkage. | 02-04-2016 |
20160033569 | WAFER PROBER INTEGRATED WITH FULL-WAFER CONTACTER - Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober; removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer. | 02-04-2016 |
20160084904 | HANDLER AND MANAGEMENT METHOD THEREOF - A handler includes a loading unit transporting substrates and sockets coupled to the substrates, a test unit including a printed circuit board, the sockets being mounted on the printed circuit board, and latches fixing the sockets to the printed circuit board, and an unloading unit unloading the substrates and the sockets from the test unit. | 03-24-2016 |
20160089793 | GRASPING GRIPPER - An example gripper may include: a base; two or more fingers attached to the base, with each finger being movable towards, and away from, one or more others of the fingers; and one or more ports at the base or at one or more of the fingers to provide suction through a vacuum. | 03-31-2016 |
20160109503 | JIG, MANUFACTURING METHOD THEREOF AND TEST METHOD - In accordance with an embodiment, a jig includes a substrate, a plurality of wiring lines on the substrate, and an electrode on one end of each of the wiring lines. The electrode is located so as to correspond to a location of an electrode of an external semiconductor chip and includes gold (Au), silver (Ag), aluminum (Al), tin (Sn), or indium (In). | 04-21-2016 |
20160109510 | TEST BOARD SUPPORT PLATFORM FOR SUPPORTING A TEST BOARD - The invention provides a test board support platform for supporting a test board during tests, the platform comprising a heat conductive interface arranged to contact a bottom side of the test board at a first side of the heat conductive interface. The support platform also comprises a thermal conditioner coupled to a second side of the heat conductive interface, the second side being opposite the first side. By using this test board support platform a test board can be supported and thermally controlled in a way so that a DUT positioned on the test board can be probed from above, while the temperature is controlled from below. | 04-21-2016 |
20160133171 | TEST FIXTURE AND TEST METHOD USING THE SAME - The present disclosure relates to the field of display technology, in particular to a test fixture, comprising a pressing connection mechanism ( | 05-12-2016 |
20160146884 | CONTACT INSPECTION DEVICE - A contact inspection device includes: plural probes each having a first end to be brought into contact with a test object; a probe substrate including contact portions in contact with respective second ends of the probes; a probe head through which the probes extend and which is detachably attached to the probe substrate; and plural positioning members which are provided on a surface of the probe head facing the probe substrate and through which the probes extend. Each probe has a rotation restricted portion provided on the side of the second end. Each positioning member has rotation restricting portions adapted to engage the rotation restricted portions. When the positioning members are moved relative to each other, the rotation restricting portions align the probes and switch the probes from a rotation unrestricted state to a rotation restricted state. | 05-26-2016 |
20160161528 | Wafer Level Integrated Circuit Contactor and Method of Construction - A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin ( | 06-09-2016 |
20160161534 | POWER SUPPLY DETECTION APPARATUS AND DETECTING METHOD THEREOF - A power supply detection apparatus including a base, a couple of longitudinal motion mechanisms, a couple of lateral motion mechanisms, a couple of pin bases and a couple of vertical motion mechanisms is provided. Each lateral motion mechanism is movably arranged on the corresponding longitudinal motion mechanism and thereby driven to move horizontally. Each pin base is driven to move horizontally by the corresponding lateral motion mechanism and a probe is arranged on each pin base. The probe and the perpendicular lateral motion mechanism are moved along respective directions perpendicular with each other. Each vertical motion mechanism is arranged on the corresponding pin base for driving the probe to move vertically. The probes can be thereby moved to automatically detect an electric power status of an electronic component on a circuit board of a power supply. | 06-09-2016 |
20160202290 | PACKAGE TRANSFER UNIT AND PACKAGE MANAGEMENT APPARATUS INCLUDING THE SAME | 07-14-2016 |
20160202291 | ELECTRICAL CONDUCTOR TESTING DEVICE | 07-14-2016 |
20160202292 | METHOD AND APPARATUS FOR DOCKING A TEST HEAD WITH A PERIPHERAL | 07-14-2016 |
20180024165 | TEST SYSTEMS WITH A PROBE APPARATUS AND INDEX MECHANISM | 01-25-2018 |
20180024166 | CONTACT PROBE AND CORRESPONDING TESTING HEAD | 01-25-2018 |
20220137092 | SHIELDED SOCKET AND CARRIER FOR HIGH-VOLUME TEST OF SEMICONDUCTOR DEVICES - A test apparatus comprising a tester interface board (TIB) affixed in a slot of a tester rack, wherein the TIB comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT). The test apparatus further comprises a carrier comprising an array of DUTs, wherein the carrier is operable to slide into the slot of the tester rack, and wherein each DUT in the array of DUTs aligns with a respective socket on the TIB. Further, the test apparatus comprises a plurality of socket covers, wherein each socket cover of the plurality of socket covers is operable to actuate a top portion of each DUT of the array of DUTs in the carrier. | 05-05-2022 |