Entries |
Document | Title | Date |
20090097197 | SIDE PLATE OF HOUSING - A side plate that allows the locations of heat-dissipating holes to be arranged includes a plate, a plurality of sealed sealing blocks and a plurality of air-hole blocks having air holes. The plate is provided with a through hole occupying a considerable area thereof and a plurality of sliding rails that are arranged at intervals to straddle on the through hole. Each of the sealing blocks and each of the air-hole blocks have substantially the same size and the same shape. Two adjacent sliding rails have a predetermined pitch therebetween to accommodate the air-hole blocks or the sealing blocks, whereby the air-hole blocks and the sealing blocks are arranged in array fashion to cover the through hole. | 04-16-2009 |
20090109610 | Symmetric Multiprocessing Computer and Star Interconnection Architecture and Cooling System Thereof - A symmetric multiprocessor computer is provided with a star interconnection architecture and a cooling system. The star interconnection architecture include a middle plane, and plural first processor boards and second processor boards configured vertically onto opposite surfaces of the middle plane. The first processor boards and the second processor boards are crisscross to each other at the opposite surfaces of the middle plane. The cooling system includes a first cooling module and a second cooling system module configured for generating a plurality of first airflows and second airflows for the first processor boards and the second processor boards respectively, wherein the paths of the first airflows and the second airflows are crisscross to each other at the opposite surfaces of the middle plane. | 04-30-2009 |
20090116183 | Gas Assisted Thixotropic Molded Chassis For Cooling A Computer Chassis - A housing including a housing portion having a reinforcing rib including a cylindrical cross-section. The rib provides reinforcing for the housing and may simultaneously provide a cooling passage for the housing. A cooling path is defined through the housing by the cylindrical cross-section of the rib. | 05-07-2009 |
20090135558 | AIRFLOW MODULE, DATA STORAGE DEVICE ENCLOSURE AND METHOD OF COOLING ELECTRONICS MODULE - An airflow module for being received in a module bay of a data storage device enclosure is disclosed. The airflow module comprises a body having: a first face having a first opening therein; a second face having a second opening therein, the first face being adjacent to the second face; and, an airflow channel between the first opening and the second opening so as to allow the passage of air between the first opening and the second opening. The first and second openings are arranged to co-operate with airflow openings in modules positioned in adjacent bays of a said data storage device enclosure to direct a cooling stream of air between said modules in use. The airflow channel is free from components that generate substantial amounts of heat in their normal operation. | 05-28-2009 |
20090141442 | Removable Cooling Duct With Interlocking Dovetail Connections For An Air Tight Thermal Seal - A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed portion and a removable portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the first and second thermal duct portions such that the block can be secured at least partially to either/or thermal duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling. | 06-04-2009 |
20090147464 | Ventilation Assembly for Computer Hardware Systems - An assembly for dissipating heat generated by electronic components which include a ventilating panel having a plurality of vent holes arranged thereon. More specifically, the perforation pattern of vent holes is staggered to provide adjacent larger and smaller vent holes in at least two rows of vent holes. A second row of vent holes is staggered with respect to the first row of vent holes such that the larger vent holes are aligned with smaller vent holes, preferably in a ratio of two smaller vent holes per one larger vent hole. Such a perforation arrangement of vent holes may be provided on a blindswap cassette for securing and aligning computer cards for mounting in a housing, such as a sled for use in computer systems. | 06-11-2009 |
20090147465 | COMPUTER - A computer storing an operating system therein and including a first case, a second case, a driving mechanism and a starting unit is provided. The driving mechanism is connected between the first case and the second case. The starting unit is disposed at the first case, electrically connected to the driving mechanism, and used to start the operating system. When the starting unit starts the operating system, the driving mechanism drives a relative movement between the first case and the second case to enhance heat dissipation efficiency of the computer. | 06-11-2009 |
20090161310 | SERVER CHASSIS WITH ACCESS FLAP - A server chassis includes a base defining an opening, a rotating plate, a sliding plate, and first and second elastic members. The base includes a middle plate opposite to the opening and defines a space communicating with the opening. The rotating plate defines a plurality of first air holes. The sliding plate defines a plurality of second air holes. The rotating plate is rotated toward the middle plate when the functional module is inserted into the space, the sliding plate abuts against the middle plate and slides toward the opening, and the second air holes align with the first air holes. The second elastic member restores the rotating plate to obstruct the opening when the functional module is drawn out, and the first elastic member restores the sliding plate to make the second air holes be staggered with the first air holes. | 06-25-2009 |
20090168328 | SERVER CHASSIS WITH ACCESS FLAP - The invention relates to an access flap for shielding an opening defined in a server chassis. that the access flap includes a rotating plate, a sliding plate, and a resilient member. The rotating plate is pivotably mounted to a side of the opening of the server chassis. The rotating plate defines a plurality of first air holes therein. The sliding plate is slidably attached to the rotating plate. The sliding plate defines a plurality of second air holes therein. The resilient member includes two ends connected to the rotating plate and the sliding plate. The rotating plate can rotate and the sliding plate can slide when a functional module passes through the opening to enter into the server chassis. Thereby, he second air holes of the sliding plate are aligning with the first air holes of the rotating plate. | 07-02-2009 |
20090168329 | Devices with faraday cages and internal flexibility sipes - A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising a semiconductor wafer having a multitude of microchips. The multitude of microchips forming a plurality of independently functioning computers, each computer having independent communication capabilities. | 07-02-2009 |
20090190301 | Server device - The present invention relates to a server device which comprises a case having two symmetric slots disposed on the top and a first handle disposed in each of the slots to make it easier to lift up the server device, a horizontal partition disposed in the case and dividing the inner space of the case into upper and lower parts, wherein the upper part is a first holding space capable of holding at least an electronic device, a first heat dissipation unit is disposed at the front of the electronic, the lower part of the case is a second holding space capable of holding at least a server, and a second heat dissipation unit may be disposed at one side of the second holding space, such that a plurality of servers, electronic devices and heat dissipation units may be integrated into the server device for easily and conveniently being moved. | 07-30-2009 |
20090195977 | DATA CENTER COOLING - A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure. | 08-06-2009 |
20090231802 | CARD FIXING STRUCTURE - A card fixing structure includes a card holder for disposing at least one card. The card holder has an air deflector clamped on its one side. The air deflector catches the card to securely fix the card in the card holder, thereby reducing the number of fixing members and the manufacturing cost. Also, the card, the air deflector, and the card holder are easy to be assembled or disassembled. | 09-17-2009 |
20090244826 | AIRFLOW MANAGEMENT APPARATUS FOR COMPUTER CABINETS AND ASSOCIATED METHODS - Airflow management apparatuses for computer cabinets and associated methods are disclosed herein. The computer cabinets include a plurality of computer modules positioned between an air inlet and an air outlet and an air mover configured to move a flow of cooling air from the air inlet, past the plurality of computer modules, and out the computer cabinet via the air outlet. The computer cabinets carry an airflow restrictor positioned proximate to the air outlet. The airflow restrictor is configured to restrict the flow of cooling air through a portion of the computer cabinet to achieve a desired temperature profile in the computer cabinet. | 10-01-2009 |
20090296342 | Reducing Maximum Power Consumption Using Environmental Control Settings - A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center. | 12-03-2009 |
20090296343 | HEAT DISSIPATION SYSTEM - A heat dissipation system for an electronic device comprises a base, a fan, a pulse width modulation speed control circuit controlling the speed of the fan, a converter outputting a voltage signal, a selection switch connected to the motor, and a control element provided on the base, connected to the switch and to the converter. When the control element is operated, the switch selectively enables the motor be connected to the output of the pulse width modulation speed control circuit or to the output of the converter, and when the motor is electrically connected to the converter, the control element can modify the output voltage of the converter. | 12-03-2009 |
20090323271 | Round Housings for Virtual computing systems with Stylesheets - A computer system that has an outer shape that is round in outer cross-section. The computer housing can be formed of first and second housing parts that are each round in outer cross-section where one unscrews relative to another like taking the lid off a jar. The inside of the housing can store various kinds of nonvolatile memory and a processor. The user's entire processing environment may be stored within the memory and processor, and part of that environment may include stylesheet that represents specific styles of the user. | 12-31-2009 |
20090323272 | Electronic apparatus - An electronic apparatus that includes: a housing having two surfaces extending in parallel, and a side surface connecting edges of the two surfaces; a circuit board placed in the housing and extends in parallel with the two surfaces; a plate member that extends to face a first surface of the circuit board; and a fan provided on a second surface of the circuit board, wherein the circuit board has a heat-generating electronic component mounted on the first surface and an opening through which air flows to the second surface side, and the plate member includes a concave groove formed in the first surface; a convex line formed on the second surface facing the circuit board on a portion corresponding to a back surface of the concave groove; and a guiding inclined surface formed on the back of the convex line to guide air to the opening. | 12-31-2009 |
20090323273 | SUPPORT DEVICE AND ELECTRONIC DEVICE USING SAME - A support device used to support a circuit board includes a substrate, a plurality of protrusions, and a plurality of electrical-conductive pads. The protrusions are perpendicularly extending from a surface of the substrate and arranged as a matrix and each of the protrusions defines a threaded hole therein. The electrical-conductive pads are mounted on the substrate around the corresponding protrusions and grounding the circuit board. | 12-31-2009 |
20100002372 | COMPUTER ENCLOSURE WITH AIRFLOW-GUIDING DEVICE - A computer enclosure includes a chassis and an airflow-guiding device mounted to the chassis. A receiving slot is defined in the chassis. An elastic receiving portion is formed around the receiving slot. One side of the airflow-guiding device is detachably fixed on the chassis. A first resilient securing member is formed on another side of the airflow-guiding device corresponding to the receiving slot. A wedge is formed on the first securing member to slide over the receiving portion and insert into the receiving slot. | 01-07-2010 |
20100033920 | Aeraulic Cooling Device for a "Full ARINC" Computer - The invention proposes a new aeraulic cooling design for ARINC series 600 computers. Using a network of ducts (N) and holes (HM) on an intermediate plate (M) situated just above the bottom place (B) through which a stream of cool air (AF) is injected into said computer (C), the present invention makes it possible to effectively cool the dissipative areas and the identified hot spots on the electronic modules (E) that it contains. | 02-11-2010 |
20100053883 | METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES THROUGH USER INTERFACES - An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device. | 03-04-2010 |
20100067191 | THERMAL MANAGEMENT SYSTEM FOR EMBEDDED ENVIRONMENT AND METHOD FOR MAKING SAME - A thermal management system for an embedded environment is described. The thermal management system includes a pleumo-jet that has at least one wall defining a chamber, at least one piezoelectric device on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening providing fluid communication between said chamber and the embedded environment. A cooling system is also described. A method for making a pleumo-jet is also described. | 03-18-2010 |
20100073863 | ELECTRONIC APPARATUS - An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing. | 03-25-2010 |
20100157521 | Blocking device adapted in a blade server and blade server - A blocking device adapted in a blade server and a blade server are provided. The blade server comprises a chassis and a plurality of blocking devices. The chassis comprises an opening, a plurality of connecting interfaces and a plurality of convection holes. The connecting interfaces are placed in parallel to connect a CPU blade respectively. Each convection holes are corresponding to a connecting interface. Each of the blocking devices is corresponding to a convection hole and comprises two blocking plates and a pushing means. The two blocking plates blocks the convection hole and comprises a hinge and a torsion spring. When a CPU blade is connected to the connecting interface, the pushing means displaces to make the two blocking plates rotate about the hinge to expose the convection hole. When the CPU blade is removed, the torsion springs make the two blocking plates rotate back to block the convection hole. | 06-24-2010 |
20100165565 | DATA CENTER - A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum. | 07-01-2010 |
20100202107 | ELECTRONIC BUILT-IN SYSTEM - An electronic built-in system for installation in a support structure mounted in a passenger compartment of a vehicle. The system includes at least one electronic module and a housing for receiving the electronic modules. The housing is mounted to the support structure of the vehicle and includes a front control panel with operating elements for operating the electronic system. The front control panel faces the passenger compartment. A cooling unit is provided in the housing for guiding cooling air through the housing for cooling the electronic modules. At least one first opening in an outer wall portion of the housing supplies cooling air to the housing. At least one second opening in an outer wall portion of the housing removes the cooling air from the housing. The first and second openings are arranged at different wall portions of the housing, which are separated from the passenger compartment by the support structure when the built in system is installed in the support structure. | 08-12-2010 |
20100214733 | AIRFLOW BYPASS DAMPER - Airflow bypass dampers made from a resilient material and systems including the resilient dampers. The dampers are secured in a chassis and extend into a deployed position to obstruct airflow through a component bay of a chassis in the absence of a component, such as a sever blade, within the selected bay. The airflow bypass damper bends into a retracted position in response to installing a component into the bay. It returns to its original shape and position when the component is removed. An air moving device moves air through a component installed in the chassis. A plurality of the resilient airflow bypass dampers may be secured in a plurality of bays of a chassis, each resilient damper moving independently of the others. The resilient material bends without permanent deformation. For example, the resilient material may include, without limitation, natural polymers, synthetic polymers and metals. A preferred damper has a curved cross-sectional shape. | 08-26-2010 |
20100214734 | HEAT DISSIPATING MECHANISM HAVING ENHANCED HEAT DISSIPATING EFFICIENCY WITH JETS AND RELATED ELECTRONIC DEVICE - A heat dissipating mechanism includes a housing. A hollow space is formed inside the housing. The heat dissipating mechanism further includes an airflow guiding structure installed inside the hollow space for separating the hollow space into a first channel and a second channel. An inlet and an outlet are formed on the airflow guiding structure. Airflow enters the first channel via the inlet and jets out of the outlet for mixing with thermal current generated by a heat source in the second channel. | 08-26-2010 |
20100254081 | Heat exchange system with a heat exchanger and a method for the manufacture of a heat exchange system - The invention relates to a heat exchange system ( | 10-07-2010 |
20100321880 | MODULAR DATA PROCESSING COMPONENTS AND SYSTEMS - Data processing modules including a housing and optical interfaces associated with the exterior of the housing, and systems including the same. | 12-23-2010 |
20110002098 | CIRCUIT, SYSTEM AND METHOD FOR CONTROLLING HEAT DISSIPATION FOR MULTIPLE UNITS ON A CIRCUIT BOARD - A circuit for controlling heat dissipation means for multiple units on a circuit board may comprise a first logical OR operation unit connected to said multiple units. The first logical OR operation unit is for performing a logical OR operation on a first set of signals output from the multiple units that represents whether any one of the multiple units has reached an overheated status. A resultant signal is output from the first logical OR operation to control an overheat protection unit connected to the first logical OR operation unit. A second logical OR operation unit is for performing a logical OR operation on a set of signals from the multiple units representing a relationship between the workload and the core temperature of a unit, whether a unit has reached an alert status and whether any of the multiple units has reached an overheated status. | 01-06-2011 |
20110019358 | ALL-IN-ONE COMPUTER - An all-in-one computer includes a front enclosure and a rear enclosure fixed together. The front enclosure includes a rear piece opposite to the front enclosure, and two side pieces extending forwards from left and right ends, respectively. The rear piece defines an air outlet including a number of first holes each having a width or diameter between 1 mm and 2 mm. Each side piece defines an air intake including a number of vertically spaced elongated second holes. The front enclosure and the rear enclosure cooperatively bound an airtight space except communicating with outside via the air intakes and the air outlet. Each second hole is slanted lengthwise down towards the front enclosure with a first slanting angle of not less than 15 degrees. A bottom wall of each second hole is slanted down outwards with a second slanting angle of not less than 30 degrees. | 01-27-2011 |
20110026218 | THERMAL MANAGEMENT OF BATTERIES USING SYNTHETIC JETS - A thermally managed power source ( | 02-03-2011 |
20110063792 | Facilitating Cooling Of An Electronics Rack Employing Water Vapor Compression System - A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser. | 03-17-2011 |
20110063793 | SERVER CABINET - A server cabinet includes a rack and an air baffle plate. The rack defines an interior space configured for accommodating a plurality of servers therein. The rack includes a top wall, an opposite bottom wall and two sidewalls respectively connected between left sides of the top and the bottom walls and right sides of the top and the bottom walls. The servers are arranged along a bottom-to-top direction. Each of the servers is fixed between the two sidewalls. A space is defined between a topmost server and the top wall. The air baffle plate is positioned in the space for blocking an airflow on a rear side of the servers from flowing back to a front side of the servers via the space. | 03-17-2011 |
20110075352 | Electronic Device With Deployable Air Flow Enhancing Support - An electronic device includes a body portion such as, for example, a laptop chassis, and a deployable support coupled to the bottom surface of the body portion. The deployable support can be moved between a stowed position relative the bottom surface of the body portion and a deployed position in which support is positioned in spaced relationship to the bottom to create an airflow path beneath the body portion. | 03-31-2011 |
20110090640 | METHOD AND APPARATUS FOR EXTERNAL PROCESSOR THERMAL CONTROL - A system and method for throttling a slave component of a computer system to reduce an overall temperature of the computing system upon receiving a first signal is disclosed. The first signal may be from a master component indicating that a temperature for the master component has exceeded its threshold temperature. The slave component or the master component may be a central processing unit, a graphics memory and controller hub, or a central processing unit memory controller hub. The slave component may send a second signal to indicate that a temperature for the slave component has exceeded its temperature. The master component would then initiate throttling of the master component to reduce the overall temperature of the computing system. The master component may be throttled to a degree less than the slave component. A first component may be designated the master component and the second component may be designated the slave component based on a selection policy. The selection policy may be received from a user through a graphical user interface. The selection policy may be based on an action being performed by the computing system. | 04-21-2011 |
20110103005 | AIRFLOW RESTRICTOR DOOR - An airflow restrictor door is pivotably supported by and extends from a support towards a card receiving bay. | 05-05-2011 |
20110116225 | SPOT-COOLING FOR AN ELECTRONIC DEVICE - In at least some embodiments, an apparatus includes a pressurized air source and a tube coupled to the pressurized air source. The apparatus also includes an electronic component that is spot-cooled by moving air between the pressurized air source and the electronic component via the tube. | 05-19-2011 |
20110122570 | APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK - Disclosed is both a method and apparatus for delivering cooling air to an electronics rack in a data room in an energy efficient manner. The present apparatus provides directionally delivered cooling air to an electronics rack with usage rates up to 90%. The tiles utilize angled directional vanes for delivering the cooling air. The tiles both conserve energy and increase the overall possible power usage for each cabinet. The tiles greatly increase the cooling efficiencies in the data room and conserve energy. | 05-26-2011 |
20110128697 | REGULATION OF AIR FLOW THROUGH A COMPUTER BLADE CHASSIS USING MECHANICALLY ACTUATED VARIABLE AIR FLOW DAMPERS - A server blade chassis having at least one mechanically actuated variable air flow damper is presented. One or more variable air flow dampers are aligned with server blades in the server blade chassis. When a server blade is pressed into a slot in the server blade chassis, one or more of the variable air flow dampers are mechanically opened, to variable degrees of movement, by the server blade pressing against the variable air flow dampers. | 06-02-2011 |
20110128698 | INFORMATION PROCESSING APPARATUS - According to one embodiment, an information processing apparatus includes a cooling module configured to cool an electronic component, a thermoelectric element configured to absorb heat generated from the electronic component, and to generate first electricity by performing a thermoelectric conversion by use of the heat, a determination module configured to determine whether the supply source is a battery, and a switcher configured to switch between a first mode and a second mode, the thermoelectric element performing the thermoelectric conversion and the cooling module is driven by the first driving electricity generated from the first electricity in the first mode, and the thermoelectric element absorbing the heat and the cooling module is driven by the second driving electricity generated by use of second electricity from a supply source includes a battery in the second mode. | 06-02-2011 |
20110149503 | MULTI-SPECIFICATION FIXING MODULE AND MOTHERBOARD WITH MULTI-SPECIFICATION FIXING MODULE - A multi-specification fixing module used at a motherboard and a cooler. The multi-specification fixing module includes a plurality of the fixing sheet and a specification adjusting base plate. Each of the fixing sheets has a fixing hole. The specification adjusting base plate includes a plurality of adjusting portions at a periphery of the specification adjusting base plate. Each of the adjusting portions has an adjusting guiding rail group and an adjusting portion hole. The positions of the fixing sheets are adjusted according to the size of the cooler body to install the fixing sheets in the adjusting guiding rail groups, and the installing fixing accessories are connectedly fixed at the motherboard holes via the fixing holes and the adjusting portion holes to fix and install the cooler body above the socket. | 06-23-2011 |
20110157813 | FLOW TUBE APPARATUS - A flow tube apparatus may include a flow tube having a first opening and a second opening, a corona electrode provided in the flow tube, a collecting electrode provided in the flow tube, and at least one focusing electrode provided in the flow tube to guide ions and thereby provide an ionic wind. In at least one embodiment, the flow tube apparatus may be provided in an electronic apparatus to provide an air flow. | 06-30-2011 |
20110182027 | AIR FLOW DUCTS FOR COOLING ELECTRONIC DEVICES WITHIN A DATA PROCESSING UNIT - Air flow ducts for improving the air flow within data processing units are described herein. In some embodiments, a duct includes an inlet portion and an outlet portion. An interior surface of the outlet portion of the duct defines, at least in part, a portion of a flow path. The duct is configured to be coupled to a printed circuit board within a data processing unit such that a first portion of a cooling fluid can flow within the flow path between the inlet portion of the duct and an electronic device coupled to the printed circuit board. An exterior surface of the outlet portion of the duct is configured to redirect a second portion of the cooling fluid to a volume within the data processing unit apart from the electronic device. | 07-28-2011 |
20110182028 | COOLING SYSTEM - A cooling system including several air jet elements, a heat exchange assembly and a frame is provided. The cooling system is applied to a rack server configured to receive a plurality of electronic assemblies. The air jet elements receive a high-pressure air and convert the high-pressure air into a low-temperature air. The heat exchange assembly is disposed in the frame and is connected to the air jet elements so as to perform a heat exchange between the low-temperature air and a high-temperature air generated by the rack server so as to lower the temperature of the high-temperature air. The frame is applied to accommodate the heat exchange assembly. | 07-28-2011 |
20110194244 | REMOVABLE MODULE FOR A CONSOLE - A housing, which may contain a hard disk drive, is configured to removably mount to a recessed surface of a console. The housing includes a lip and a biased latch arm so that the lip can be inserted into a corresponding feature in the recessed surface and the housing can be rotatably mounted to the recessed surface. The biased latch arm is retained by a latch arm retainer so that the housing is held in place. A cable connector extends from the bottom of the housing and is configured to connect to a receptor on the console when the housing is installed. When desired, a latch on the housing can be translated where the translation cause the biased latch arm to translate so as to clear the latch arm retainer. Thus the housing can be readily removed from the console. Preferably a portion of the housing extends beyond a wall of the recessed surface so that when installed, the housing alters the profile of the console. | 08-11-2011 |
20110242755 | COOLING SYSTEM - According to an embodiment of the present invention, there is provided a system for cooling. The system comprises an equipment rack installable in a facility and for accommodating a plurality of electronic equipment. The system further comprises an exhaust duct into which the electronic equipment, when installed in the rack, exhausts gas drawn from a first section of a facility. The system further comprises a gas flow meter for measuring gas flow in the exhaust duct, and a controller for generating control signals to control, based on the measured gas flow, the output of a cooling unit arranged to provide cooled gas to the first section of the facility. | 10-06-2011 |
20110242756 | COMPUTER HINGE HAVING A HOLLOW CLUTCH - A hinge assembly having a hollow clutch is arranged to pivotally couple a portable computer base portion to a portable computer lid portion. The hinge assembly includes at least a hollow cylindrical portion that includes an annular outer region and a central bore region, the central bore region suitably arranged to provide support for electrical conductors between the base and lid portions. The hinge assembly also includes a plurality of fastening components that couple the hollow clutch to the base portion and the lid portion of the portable computer, with at least one of the fastening regions being integrally formed with the hollow cylindrical portion such that space, size and part count are minimized. The integrally formed fastening region(s) can be flat with holes dispersed therethrough for screws, bolts or the like. The central bore can also support a heat transfer element and can also serve as a lubricant reservoir. | 10-06-2011 |
20110255237 | COMPUTER CABINETS HAVING PROGRESSIVE AIR VELOCITY COOLING SYSTEMS AND ASSOCIATED METHODS OF MANUFACTURE AND USE - Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet. | 10-20-2011 |
20110267767 | SERVER ASSEMBLY - A server assembly includes a first server and a first airflow guiding pipe. The first server comprises a front wall. An input hole is defined in the front wall. A first input opening and a first output opening are defined in the first airflow duct. The first output opening corresponds to the input hole so as to guide airflow into the inner of the first server to dissipate heat generated by the first server. The first airflow guiding pipe is connected to the first input opening of the first airflow duct, the first airflow guiding pipe is configured to receive and guide airflow into the first airflow duct. | 11-03-2011 |
20110279967 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 11-17-2011 |
20110292592 | THERMAL MANAGEMENT SYSTEMS AND METHODS - A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet and a fluid discharge, can be disposed proximate the second aperture. Fluid from the chamber can provide an inflow to the fluid inlet and an outflow from the fluid discharge can be directed to the exterior of the electronic enclosure. | 12-01-2011 |
20120020008 | UNIVERSAL RACK BACKPLANE SYSTEM - Disclosed is an embodiment of a rack system including a universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane area on a second side of the rack system opposite to the first side, a power bus, a plurality of partitions, a plurality of module bays, and two or more service unit backplanes. The power bus may be configured to provide power to the modules coupled to the universal backplane area. | 01-26-2012 |
20120020009 | Computer Chassis Cooling Sidecar - A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis. | 01-26-2012 |
20120020010 | NOTEBOOK COMPUTER HOUSING STRUCTURE - A notebook computer housing structure is described. The notebook computer housing structure includes a body, which is made of one of plastic, aluminum, and an aluminum magnesium alloy. A circuit board installed with electronic elements such as a CPU and an interface card is placed inside the body. The improvement lies in that a plurality of holes is disposed on the body to form a convection effect inside the body after cold air enters the body through the holes. | 01-26-2012 |
20120020011 | DATA CENTER AND SERVER MODULE OF THE SAME - A data center includes a rack mounted with two first slide rails, a server module arranged in the rack. Two second slide rails are mounted on the top and bottom sidewalls of the server module, to mate with the first slide rails, thereby slidably attaching the server module to the rack. | 01-26-2012 |
20120020012 | STORAGE MODULE FOR COMPUTER SYSTEMS - A storage module for computer systems includes a housing defining an opening, a power supply unit and an air cooling unit, a storage unit detachably received in the housing through the opening, a bracket for mounting the storage unit, and a magnetic member. The bracket includes a tray plate defining a plurality of heat dissipation holes, a first side plate, an opposite second side plate, a stop plate including a first end detachably coupled to the second side plate and a second end pivotally connected to the first side plate, and a resilient member resiliently biasing the stop plate away from the first side plate. The storage unit is moveably and insertably positioned between the first and the second side plates. The magnetic member is positioned in one of the second side plate and the stop plate such that the second side plate and the stop plate are magnetically attracted. | 01-26-2012 |
20120044629 | MOUNTING ASSEMBLY FOR PACKAGING AND SHIPPING COMPUTER COMPONENTS - An air duct installed in a chassis is configured to have a heat dissipating device mounted thereon during shipping. The heat dissipating device defining a number of mounting holes corresponding to a number of fixing members extending from a surface of the air duct to accomplish the mounting. Thereby, the heat dissipating device may be conveniently and securely packaged and transported with the air duct and chassis. | 02-23-2012 |
20120087085 | Disaster resistant server enclosure with cold thermal storage device and server cooling device - A disaster resistant server enclosure is provided. A fire resistant outer enclosure is provided, and may be made of gypsum. A water resistant, thermally conductive container is mounted within the outer enclosure. A server is mounted within the water resistant container. A cold thermal storage device, such as a block of ice, is also mounted within an insulating cover inside said outer enclosure. When a fire is sensed outside the outer enclosure, an actuator thermally connects the cold thermal storage device to the water resistant container to cool the server during the fire. | 04-12-2012 |
20120120593 | APPARATUS AND ARTICLE FOR SEPARATING INTAKE AIR FROM EXHAUST AIR - An apparatus and article is disclosed for separating intake air from exhaust air. The apparatus discloses an intake port, coupled to conduct intake air; an exhaust port, coupled to conduct exhaust air; and an air-curtain port, coupled to conduct air-curtain air to separate at least a portion of the intake air conducted by the intake port from the exhaust air conducted by the exhaust port. The article discloses a ductwork shell article, having an intake vent, an intake chamber, an exhaust vent, an exhaust chamber, an air-curtain vent, and an air-curtain chamber; wherein: the air-curtain vent is in part located between the exhaust vent and the intake vent. | 05-17-2012 |
20120127652 | ELECTRONIC APPARATUS WITH IMPROVED HEAT DISSIPATION - An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction. | 05-24-2012 |
20120127653 | SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS - A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system. | 05-24-2012 |
20120134103 | SERVER CABINET FOR SERVER SYSTEM - A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate adjacent to the top plate is different from a total area of the through holes in a lower half portion of the front side plate adjacent to the bottom plate. | 05-31-2012 |
20120134104 | DATA CENTER - A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum. | 05-31-2012 |
20120155015 | HEAT DISSIPATION UNIT FOR A WIRELESS NETWORK DEVICE - According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection. | 06-21-2012 |
20120162903 | ELECTRO-HYDRODYNAMIC COOLING FOR HANDHELD MOBILE COMPUTING DEVICE - Embodiments of the invention are directed towards passive cooling systems for handheld mobile computing devices. An electro-hydrodynamic air mover (EAM) may be included in a handheld mobile computing device, the EAM to include an inlet and an outlet. The inlet and outlet are each included in at least one surface side of the handheld mobile computing device. | 06-28-2012 |
20120170205 | SYSTEM AND METHOD FOR SEQUENTIAL PLACEMENT OF COOLING RESOURCES WITHIN DATA CENTER LAYOUTS - A computer-implemented method for sequential placement of cooling resources in a data center comprises: defining a weighted, higher-order cooling metric, | 07-05-2012 |
20120218706 | KEYBOARD WITH ADJUSTING FUNCTION AND COMPUTER SYSTEM UTILIZING THE SAME - A keyboard adjusting heat dissipation efficiency of a heat dissipation unit disposed in a host device and including a switching unit, a control unit, and a communication port is disclosed. The switching unit is switched to different states. The control unit generates a control signal according to the state of the switching unit. The communication port transmits the control signal to the host device. The host device adjusts the heat dissipation efficiency of the heat dissipation unit according to the control signal. | 08-30-2012 |
20120229971 | INFORMATION HANDLING SYSTEM SHARED INFRASTRUCTURE CHASSIS WITH FLEXIBLE DEPTH - An information handling system tray component is selected for a depth to fit into chassis support components to provide processing resources in a space having different depths. An end user selects a chassis component having a depth that fits a data center and then installs tray components into the chassis component by selecting the tray component depths to fit in that of the chassis component. The tray component supports different processing components depending upon the selected depth so that information handling system features are adapted to chassis depth while using a common infrastructure component. | 09-13-2012 |
20120229972 | HOT AISLE CONTAINMENT COOLING SYSTEM AND METHOD - An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed. | 09-13-2012 |
20120243173 | Individually Cooling One Or More Computers In A Rack Of Computers In A Data Center - Individually cooling one or more computers in a rack of computers in a data center including an air intake chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center and a plurality of openings at a top end for providing air into a plurality of flexible air channels; and a plurality of flexible air channels, each air channel having a first end opening into the air intake chamber and having an opening at a second end and having a connector to connect the second end of the flexible air chamber to a particular position in the rack corresponding to the location of a particular computer in the rack. | 09-27-2012 |
20120281352 | Data center aisle containment system utilizing a movable sash that is integral to the computer rack cabinet - An embodiment includes a transparent sash mounted integral to the perforated doors on racks which hold computer servers typically installed in data centers. The racks are arrayed in rows forming cold aisles and hot aisles. Cooled air introduced into the cold aisle flows through the racks and cools the servers, and subsequently is removed from the hot aisle. Embodiment sashes slide vertically and extend above the tops of the racks and form a sealing relationship with the data center ceiling and adjacent sashes, thereby preventing wasteful mixing and recirculation of cooled and heated air over the tops of the racks. Embodiments are raised and lowered manually or automatically. The controls for the movement of the sashes are tied to the building automation and fire alarm systems and the sashes are lowered automatically upon activation of the data center fire suppression system, thereby complying with code requirements and avoiding interference with the fire sprinkler and suppression systems. | 11-08-2012 |
20120281353 | COMPUTER POWER SYSTEM - A computer power system includes a first power supply unit having a first output end, and a second power supply unit stacked on the first power supply unit and having a second output end adjacent to the first output end, a first power interface board electrically connected to the first output end and perpendicular to an end surface of the first output end, a second power interface board electrically connected to the second output end and perpendicular to an end surface of the second output end, and an electrical connection device. The electrical connection device connects the first power interface board and the second power interface board, such that the first power supply unit and the second power supply unit are electrically connected in parallel to the second power interface board. | 11-08-2012 |
20120300391 | MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME - A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space. | 11-29-2012 |
20130027873 | ELECTRONIC DEVICE - An electronic device includes a main body and a rotating base. The rotating base has a first vent and is pivoted at the main body and adapted to rotate between an operating position and a retracted position relatively to the main body. When the rotating base is located at the operating position, the first vent is exposed out of the main body, and when the rotating base is located at the retracted position, the first vent is retracted into the main body. | 01-31-2013 |
20130033815 | AIRFLOW ADJUSTMENT DEVICE AND BLADE SERVER - An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket. | 02-07-2013 |
20130058037 | Presence Detectable Baffle For Electrical Components In A Computing System - A presence detectable baffle for electrical components in a computing system, including: a passive chassis having a form factor is consistent with an electrical component of the computing system; and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component. | 03-07-2013 |
20130120929 | Flexible Tier Data Center - A server cooling system includes: a flex-switch with one or more flexible building bridges; one or more utility farms coupled with the flex-switch; a power distribution unit operably connected to the flex-switch; and a server POD including one or more racks operably connected to the power distribution unit. The flex-switch is configurable to include additional utility farms, one or more generator farms, and one or more UPS farms. | 05-16-2013 |
20130128450 | AIR VENT - A removable vent ( | 05-23-2013 |
20130148290 | AIR DUCT AND COMPUTER SYSTEM WITH AIR DUCT - An air duct includes a top wall and a blocking plate. The top wall includes a limiting block, a resilient arm, and a pair of hooks. A latching slot is defined between the pair of hooks. The blocking plate is rotatably secured to the top panel and includes a body and a shaft connected to the body. The shaft is rotatably engaged in the latching slot. The limiting block and the resilient arm abut two opposite surfaces of the body and block the body preventing the blocking plate from rotating relative to the top wall. The blocking plate is adapted to abut an electronic component and guide airflow towards the electronic component. | 06-13-2013 |
20130148291 | MODULAR DATA CENTER - Described are methods, systems, and apparatus relating to a modular data center. In some embodiments, a modular data center includes one or more data modules. The modular data center includes a network module connected to the one or more data modules, the network module containing equipment for facilitating data communications by the one or more data modules. The modular data center includes a power module connected to the one or more data modules and the network module, the power module containing electronics equipment for conditioning and distributing power to the one or more data modules and the network module. In the modular data center, each module of the one or more data modules, the network module, and the power module comprises: an enclosure defining an internal space; a floor within the enclosure separating the internal space into an above-floor space and a sub-floor space; and a plurality of bays in the subfloor space, each bay of the plurality of bays configured to contain a field-replaceable environmental management component. | 06-13-2013 |
20130155605 | ELECTRONIC APPARATUS - An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element. | 06-20-2013 |
20130163189 | Hand-Held Electronic Devices and Related Methods for Improving Thermal Behavior of Such Devices - Hand-held electronic devices and methods for improving thermal behavior of such devices are provided. In this regard, a representative hand-held electronic device includes: a processor operative to execute instructions; a kinetic energy harvester operative to generate electrical power responsive to movement of the hand-held electronic device; and a Peltier component in thermal communication with the processor, the Peltier component being operative to receive power from the kinetic energy harvester and to remove heat from the processor. | 06-27-2013 |
20130163190 | Blade And Air Deflector In A Plenum - A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling. | 06-27-2013 |
20130163191 | COMPUTER SYSTEM WITH AIR DUCT - A computer system includes an enclosure, a printed circuit board, and an air duct. The enclosure comprises a bottom panel, a rear panel, and a mounting panel. The printed circuit board is mounted on the bottom panel and is located between the rear panel and the mounting panel. A plurality of expansion cards is inserted in the printed circuit board. The plurality of expansion cards is substantially parallel to each other. The air duct is placed on the rear panel and the mounting panel. The air duct comprises an air duct body and a guiding plate. The guiding plate comprises a securing portion secured to the air duct body and a plurality of bent elastic tabs extending from the securing portion at an angle. The plurality of bent elastic tabs resists the plurality of expansion cards, thereby guiding air to flow to the plurality of the expansion cards. | 06-27-2013 |
20130170132 | Electronic Computer Comprising an Air Channeling System for Cooling Electronic Boards - The electronic computer according to the invention comprises:
| 07-04-2013 |
20130176678 | RACK LEVEL HOT AISLE CONTAINMENT SYSTEM - A method and system of cooling a server rack unit is described herein. A server rack for housing certain devices may be configured to receive a first air flow at a server rack front. Each device may form a wall at the back of the device creating a channel between the wall and the server rack back. The camber may collect warm air created by the first air flow as it extends over the at least one server. A first surface of the server may define at least one server rack opening allowing the warm air in the channel to exit the server rack. | 07-11-2013 |
20130188307 | Synthetic Jet Ejector For The Thermal Management of PCI Cards - A method for constructing a thermal management system is provided herein. In accordance with the method, a fan ( | 07-25-2013 |
20130201623 | DEVICES WITH FARADAY CAGES AND INTERNAL FLEXIBILITY SIPES - A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising an undiced semiconductor wafer having a multitude of microchips. The multitude of microchips on the wafer forming a plurality of independently functioning computers, each computer having independent communication capabilities. | 08-08-2013 |
20130208418 | AFFIXABLE, DETACHABLE PLATFORM SET FOR PORTABLE COMPUTERS - Users of portable computers tend to carelessly place their usage of such where damage to their units become inevitable, unintentionally setting them in places which blocks air from circulating through such systems. | 08-15-2013 |
20130229768 | COMPUTER CABINETS HAVING PROGRESSIVE AIR VELOCITY COOLING SYSTEMS AND ASSOCIATED METHODS OF MANUFACTURE AND USE - Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet. | 09-05-2013 |
20130235519 | SYSTEM AND METHOD FOR CONTROLLING INFORMATION PROCESSING DEVICE - A data center includes an air-conditioner and an information processing system that includes a plurality of information processing devices that is cooled with air flowing from an outlet port from the air-conditioner. The information processing device executes a program and acquires first air volume information measured by an air volume meter that measures an air volume from an outlet port corresponding to the subject device. The information processing device acquires a second air volume information measured by an air volume meter that measures an air volume from an outlet port corresponding to each of other information processing devices. The information processing device specifies other information processing devices that are cooled with a larger air volume than the air volume that cools the subject device based on the first and the second air volume information. The information processing device migrates the executed program to the specified information processing device. | 09-12-2013 |
20130308266 | PROVIDING AND DYNAMICALLY MOUNTING AND HOUSING PROCESSING CONTROL UNITS - Systems and methods for mounting a modular processing unit that is configured to be selectively used alone or with other processing units in an enterprise. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units (including base modules and/or peripheral modules) in an enterprise. The one or more processing units are dynamically mounted based upon the particular enterprise needed and corresponding environment. In at least some implementations, shock mounting is included to provide for needed shock and vibe requirements. In some implementations, the mounting system includes a fixed mounting system for environments that need to be fixably secured. In other implementations, a selectively releasable connector is provided to allow for ease in mounting and removing the dynamically modular processing unit. In other implementations, a press-fit connector is provided to allow for ease in mounting and removing the dynamically modular processing unit. | 11-21-2013 |
20130329355 | Scalable hardware architecture, scalable cooling system, and convection-cooled electrical circuit - A unified scalable hardware system architecture contains subsystems which can be made available to a user depending on demand, a status of user's subscription or on a level of acquired licenses. This allows achieving manufacturing economies of scale with flexible monetization policies depending on the subscribed service level. | 12-12-2013 |
20130342991 | SERVER RACK - A server rack includes a rack, a first electronic device, a second electronic device, and an air block plate. The first electronic device is mounted in the front of the rack and arranged close to a left side of the rack. An opening is defined between the first electronic device and a right side of the rack. The second electronic device is mounted in the rear of the rack and arranged on a same level with the first electronic device. The air block plate is slantingly connected between the first electronic device and the second electronic device. A first end of the air block plate is connected to a right end of the first electronic device, and a second end of the air block plate opposite to the first end is connected to a left end of the second electronic device. | 12-26-2013 |
20140049905 | Computer Room Cooling Control - A method for cooling a data center having a plurality of racks and an adjustable cooling system includes the following steps. A minimum and maximum temperature is set for each of the racks. A temperature of each of the racks is determined based on i) a rate R(t) at which the chilled air at a temperature Tc is introduced to each of the racks and ii) a rate R at which warm air from each of the racks at a temperature T is returned to the cooling system. The cooling system is adjusted to add cooling or to reduce cooling to the data center. The determining and adjusting steps are repeated at a predetermined time interval to achieve and maintain the temperature of each of the racks to be greater than or equal to the minimum temperature and less than or equal to the maximum temperature. | 02-20-2014 |
20140055946 | Heat Dissipation Device for a Notebook Computer - A heat dissipation device for a notebook computer is disclosed. The heat dissipation device includes a base, a connection device and a bracket. The connection device includes a first connecting member and a second connecting member which can be detachably connected with the first connecting member. The bracket is pivotally connected with the base through the connection device. The first connecting member is provided on the base, and the second connecting member is fixed on the bracket. The bracket is regulated by controlling engagement and separation of the first connecting member and the second connecting member, achieving stepless adjustment of the tilt angle of the heat dissipation device for a notebook computer, and the adjustment will be more convenient. Furthermore, the bracket is locked by the engagement of the first connecting member and the second connecting member, and it is of better stability. | 02-27-2014 |
20140063729 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 03-06-2014 |
20140063730 | MULTI-MODE COOLING SYSTEM AND METHOD WITH EVAPORATIVE COOLING - A air channeling sub-system may include a mechanical cooling section and a direct evaporative cooling section. The direct evaporative cooling section may be downstream from the mechanical cooling section. Cooling air is channeled through the air channeling sub-system and into the room. If a first set of control conditions is met, the air channeling sub-systems is operated in an adiabatic mode. The adiabatic mode includes channeling cooling air through the direct evaporative cooling section to evaporate water into the cooling air. If a second set of control conditions is met, the air channeling sub-system is operated in a hybrid mode. The hybrid mode includes channeling cooling air through the mechanical cooling section to remove heat from the cooling air and channeling the cooling air through the direct evaporative cooling section to evaporate water into the cooling air. | 03-06-2014 |
20140071613 | GEOTHERMAL COOLING FOR MODULAR DATA CENTERS - A cooling system for cooling a heat producing module includes a heat dissipation system and at least one cooling loop. The heat dissipation system is in thermal communication with the heat producing module and contains coolant flowing therethrough. The at least one cooling loop is disposed beneath the surface of the Earth and directly underneath a footprint of the heat producing module. The at least one cooling loop is coupled to the heat dissipation system to receive the coolant from the heat dissipation system and to dissipate the heat from the coolant to the Earth. The at least one cooling loop is completely contained within the footprint of the heat producing module in order to minimize the ecological impact. | 03-13-2014 |
20140071614 | HEAT DISSIPATION DEVICE - A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability. | 03-13-2014 |
20140078667 | DATA FRAME HOT/COLD AISLE BAFFLE SYSTEM - A data room air circulation system has adjacent racks located side by side. The racks have a front, a rear, and a first and second side. A computer system component is mounted in at least one of the racks. A cold aisle, containing cold air, is located at the front of the racks. As the cold air passes through the component, hot air is formed and discharged to a hot aisle located at the rear of the racks. A baffle, having a front end, a rear end, and a hot air side is located between the racks. The front baffle end is attached to the front of one of the racks, and the rear end is attached to the rear of the other of the racks. The baffle separates the cold aisle from the hot aisle for at least the height of the baffle. | 03-20-2014 |
20140118924 | Server Cooling by Airflow Throttling - In a data center including hot and cold aisles, the flow rate of airflow from the cold aisle through servers to the hot aisle depends on the flow resistance of different servers. As servers may have different cooling needs, an airflow throttling mechanism is coupled to each server to individually adjust the flow resistance through each server based on the amount of cooling airflow needed by a server. Hence, servers use the amount of cooling airflow they need, reducing the overall airflow needs, which reduces the central fan requirements, of the data center. | 05-01-2014 |
20140133088 | COOLING COMPUTING ASSETS IN A DATA CENTER USING A HOT STACK - A data center includes a hot stack for exhausting heated air from the data center. As air flows across computing assets operating in the data center, the air absorbs heat generated by the computing assets. The temperature difference between the heated air and air outside the data center, the height of the hot stack, and the area of the hot stack causes the heated air to flow through the hot stack and outside of the data center. This air flow may be used to decrease the pressure of a portion of the data center, causing air to flow from a higher pressure portion of the data center to the depressurized portion of the data center. | 05-15-2014 |
20140133089 | COOLING COMPUTING ASSETS IN A DATA CENTER USING HOT AND COLD STACKS - A data center includes a hot stack for exhausting heated air from the data center and a cold stack that cools intake air relative to the environment surrounding the data center. The temperature difference between air in the cold stack and the environment creates an airflow through the cold stack and into a cold aisle. This pressurizes the cold aisle, causing air to flow from the cold aisle across computing assets to a lower-pressure hot aisle. While flowing across the computing assets, the air absorbs heat generated by the computing assets. The temperature difference between the heated air and air outside the data center causes the heated air to flow through the hot stack and outside of the data center. | 05-15-2014 |
20140153183 | EXHAUST AIR DEFLECTING SYSTEM - An air deflecting system includes an air deflector that is physically mounted against a hot air exhaust vent of a network equipment element using a rack coupling mechanism that is adjustable to accommodate a variable lateral distance of the hot air exhaust vent from the computing rack. The air deflector receives an airflow from the hot air exhaust vent at a first direction and deflects the airflow in a second direction. | 06-05-2014 |
20140160668 | COLLAPSIBLE CHIMNEY FOR ELECTRONIC DEVICE - In one embodiment a housing for an electronic device comprises a first section, a second section, and a collapsible chimney coupled to the first section and the second section to provide an airflow path from a portion of the first section. Other embodiments may be described. | 06-12-2014 |
20140160669 | ELECTRONIC DEVICE - An electronic device includes a first body, a second body, a baffle and a drive mechanism. The second body includes an opening the bottom surface thereof, and the baffle is disposed on the bottom surface to cover the opening. The baffle moves with respect to the second body and has a raised portion. The drive mechanism includes a pivot, a linkage and a sliding member. The pivot connects the first body and the second body. The linkage is sleeved over the pivot. The sliding member is connected to the linkage and has a pushing portion. While the first body rotates with respect to the second body, the pivot rotates with the first body and drives the linkage to push the sliding member. In the meantime, the sliding member displaces to push the raised portion by the pushing portion, so that the baffle moves and exposes part of the opening. | 06-12-2014 |
20140160670 | AIR-FLOW-BY COOLING TECHNOLOGY AND AIR-FLOW-BY CIRCUIT BOARD MODULES - Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference. | 06-12-2014 |
20140168886 | MOTHERBOARD MODULE HAVING AIR DUCT WITH INDICATORS - An air duct includes a main body mounted on a motherboard and an indicating apparatus installed to the main body. The motherboard includes a first connector for outputting signals of the working states of the motherboard. The main body defines a number of through holes. The indicating apparatus includes a number of indicators respectively received in and exposed through the through holes, a second connector installed to the main body and electrically connected to the first connector, and a number of cables respectively connected between the second connector and the indicators. | 06-19-2014 |
20140168887 | BAFFLE CONTROL DEVICE AND SERVER RACK USING SAME - A server rack includes a baffle control device and a plurality of server cases. Each server case accommodates a server and comprises an air inlet and a baffle located at a side of the air inlet to open or close the air inlet. The baffle control device includes a server monitoring unit and a baffle control unit. The server monitoring unit monitors a power on event and a power off event of the server. When the power on event of the server of a corresponding server case is monitored, the baffle control unit controls the baffle of the corresponding server case to open the air inlet of the corresponding server case. When the power off event of the server of the corresponding server case is monitored, the baffle control unit controls the baffle of the corresponding server case to close the air inlet of the corresponding server case. | 06-19-2014 |
20140168888 | COOLING OF A MEMORY DEVICE - A system for providing cooling of a memory device comprises a cooling system arranged to store a coolant, a valve system connected to the output of the cooling system, and a control system connected to the valve system and arranged to open the valve system when power is lost to the control system. The system further comprises a delivery system connected to the output of the valve system and arranged to deliver the coolant to the memory device and the cooling system comprises a canister of low boiling point fluid. | 06-19-2014 |
20140177163 | Cooling Servers in a Data Center Using Prevailing Winds - A data center includes a wind collecting structure that directs prevailing winds external to the data center into an interior of the wind collecting structure. The wind collecting structure includes vents around its perimeter configured to selectively open on a side of the wind collecting structure receiving prevailing wind, pressurizing the intake air. The pressurized air flows from the wind collecting structure through a compartment of the data center including computing assets. The air is directed across the computing assets to extract heat from the computing assets during operation. | 06-26-2014 |
20140177164 | AIRFLOW MANAGEMENT SYSTEM FOR CABINET HAVING FIELD REPLACEABLE UNITS - A system for use with a computing rack that prolongs operation of computing devices mounted within the rack by preventing or at least limiting the circulation of airflow (e.g., hot airflow) through empty receiving bays of the rack upon removal of computing devices from the receiving bays. In one arrangement, the system includes a plurality of airflow restriction devices (e.g., baffle plates) movably secured adjacent respective receiving bays of the cabinet. Each airflow restriction device is automatically movable between a deployed position to restrict airflow through respective receiving bay in the absence of a computing device in the receiving bay and a refracted position to allow for mounting of a computing device in the receiving bay (e.g., so that the computing device can exhaust hot air out of the rear portion of the receiving bay). | 06-26-2014 |
20140204527 | AIR GUIDE UNIT - An air guide unit is disclosed, which is adapted to be disposed between the back of a motherboard and a chassis. The motherboard and the chassis are joined by at least a first locking unit and a second locking unit. The air guide unit comprises an annular side wall. The annular side wall comprises: a first engagement portion adapted to engage with the first locking unit; and a second engagement portion adapted to engage with the second locking unit, wherein the engagement of the first engagement portion with the first locking unit and the engagement of the second engagement portion with the second locking unit limit the movement of the air guide unit in a first direction and a second direction. The second direction is perpendicular to the first direction. | 07-24-2014 |
20140211410 | CONFIGURABLE COMPUTER HOUSING - A configurable computer housing includes a frame and a removable motherboard unit. There are a plurality of openings on the frame that are configured to receive the removable motherboard unit. | 07-31-2014 |
20140211411 | Data Center Canopy Including Turning Vanes - Examples provide data center canopies, data center housings, and data centers including turning vanes to facilitate air flow. In some examples, a data center canopy may include turning vanes to direct portions of an exhaust flow from an exhaust inlet toward floor sections to be output via exhaust outlets opposite the floor sections. Other examples are described and claimed. | 07-31-2014 |
20140218859 | System for Cooling Hard Disk Drives Using Vapor Momentum Driven By Boiling of Dielectric Liquid - A system for cooling hard disk drives (HDDs) includes: an enclosure having a lower volume within which a cooling liquid is heated to a boiling point temperature to cause some of the cooling liquid to evaporate into a plume of rising vapor; a HDD cooling area with at least one HDD placed in the direct path of the rising vapor, which cools the at least one HDD during functional operation of the at least one HDD; and a heat source that dissipates heat into the lower volume of the enclosure, sufficient to heat the cooling liquid to the boiling point temperature. The system can also include a condenser located above both the HDD cooling area. A substantial portion of the rising vapor that passes through the HDD cooling area and cools the at least one HDD is condensed back into liquid phase on contact with the condenser. | 08-07-2014 |
20140233173 | SERVER COOLING SYSTEM - In a server cooling device having a cold zone and a hot zone, a flow of cold air is determined depending on an air conditioner disposed in the hot zone and a size of a casing. A server cooling system is provided in which a chamber is substantially divided into two parts with a cold aisle formed in one part and a hot aisle formed in the other part, and a server rack is disposed on a boundary between the cold aisle and the hot aisle. The server cooling system includes: an air conditioner provided on the hot aisle side; a circulation path disposed so as to extend from the air conditioner to the cold aisle; and a shield provided on the boundary excluding the server rack. The shield is provided with a gallery capable of venting from the cold aisle to the hot aisle. | 08-21-2014 |
20140240916 | SHEAR DRIVEN MICRO-FLUIDIC PUMP - An example includes an apparatus to pump a fluid. The apparatus includes a housing extending along a length defining an elongate interior, an actuator in the housing, conforming to the elongate interior, the actuator including a plurality of lumens, each having a length extending substantially parallel to the elongate interior, each from around 10 to 200 micrometers across and an actuator configured to oscillate the actuator in the actuator housing along the length of the elongate interior with a rate differential between movement in a first direction versus movement in a second direction opposite the first direction to pump the fluid. | 08-28-2014 |
20140254089 | STALL CONTAINMENT OF RACK IN A DATA CENTER - A system for managing air flow computing devices in a rack includes a stall and filler elements. The stall includes a stall top panel and two side panels spaced apart from one another. The stall accommodates a rack computing system. The filler elements fill gaps between the computing devices of the rack computing systems and the panels of the stalls. An air moving system moves air from the cold aisle through cold-aisle facing air inlets of the computing devices. The filler elements inhibit air moving toward the cold aisle-facing inlets from leaking through gaps between the computing devices of the rack computing systems and the stall panels such that the filler elements inhibit air moving toward inlets in the computing devices from leaking through the gaps between the computing devices in the rack and the stall panels. | 09-11-2014 |
20140285964 | AIRFLOW BLOCK RESPONSE IN A SYSTEM - A system including a chassis (102), a vent (130,132) in the chassis to exchange air from outside the chassis with air inside the chassis, a temperature sensor ( | 09-25-2014 |
20140301035 | AIR SHIELD FOR RACK-MOUNT SERVER - An air shield is mounted to a cabinet to replace a server unit. The air shield includes a supporting shell detachably mounted in an opening defined the cabinet through which the server unit can enter the receiving space, and an adjusting apparatus slidably installed to the supporting shell. The supporting shell defines a number of vents communicating with the receiving space of the cabinet. The adjusting apparatus includes a number of spaced shield pieces. The adjusting apparatus is operated, to move the shield pieces to cover, partially cover, or uncover the vents of the supporting shell. | 10-09-2014 |
20140362518 | THERMAL MANAGEMENT OF A PORTABLE COMPUTING DEVICE - Various computing devices and methods of thermally managing the same are disclosed. In one aspect, an apparatus is provided that includes a case and a first sensor in the case. a case and a first sensor in the case. The first sensor is operable to generate an output in response to sensing contact with a body part of a user. The computing device manages thermal behavior of the computing device responsive to the output. | 12-11-2014 |
20140362519 | COMPUTER SYSTEM - A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing. | 12-11-2014 |
20140376174 | ELECTRONIC ASSEMBLY WITH THERMAL CHANNEL AND METHOD OF MANUFACTURE THEREOF - An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail. | 12-25-2014 |
20140376175 | Apparatus for Preventing Deformation of Communication Card - An apparatus for preventing deformation of a communication card includes a card holder configured to install a communication card; a temperature control component that is located on one side of the card holder and connected to a power supply configured to perform cooling or heating; a temperature sensor configured to collect temperature of the card holder; and the power supply configured to generate a supply current according to the temperature collected by the temperature sensor to supply power to the temperature control component, so that the temperature control component performs cooling or heating to maintain the temperature of the card holder within a preset temperature range, and the communication card is not deformed when the communication card is in the card holder and within the preset temperature range. | 12-25-2014 |
20150016052 | COOLING ELECTRONIC DEVICES - Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel. | 01-15-2015 |
20150016053 | HOUSING FOR AT LEAST ONE ELECTRIC OR ELECTRONIC DEVICE, AND ELECTRIC OR ELECTRONIC DEVICE COMPRISING THE HOUSING - Housing for at least one electric or electronic device, the housing surrounding a housing interior comprising a storage space, the electric or electronic device being arrangeable in the storage space, the housing comprising a housing upper part, which delimits the housing interior, the housing comprising at least one intermediate ceiling portion, which is arranged in the housing interior below the housing upper part and, together with the housing upper part, encloses at least one intermediate space, the intermediate ceiling portion having at least one cooling air passage, through which cooling air can flow from the storage space into the intermediate space, the housing upper part having at least one cooling air outlet, through which the cooling air can escape outwardly from the intermediate space, wherein the intermediate ceiling portion forms a catching arrangement for dripping water, which infiltrates the intermediate space through the cooling air outlet. | 01-15-2015 |
20150016054 | Notebook Auxiliary Device - A notebook auxiliary device includes a first rigid body, a second rigid body and a folding portion. The first rigid body is disposed on a top surface of a screen body of a notebook. The second rigid body is disposed on a bottom surface of a mainframe body of the notebook. A folding portion is disposed between the first rigid body and the second rigid body, and the folding portion is driven by the first rigid body such that the folding portion is bent under the mainframe body to produce a protrusion so as to form a preset support angle to support the mainframe body. Thus, one side of the notebook can lift to a preset support angle when the notebook is at open state, so as to increase the heat dissipation effect of the notebook and to reduce the fatigue which is introduced by prolonged use of notebook. | 01-15-2015 |
20150036284 | COMPUTE NODE COOLING WITH AIR FED THROUGH BACKPLANE - A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels. | 02-05-2015 |
20150036285 | COVER FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and a adhesive layer. The transparent substrate defines at least one through hole. The adhesive layer is adhered to an inner wall of the at least one through hole. | 02-05-2015 |
20150036286 | COVER FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A cover for an electronic device includes a transparent portion and a non-transparent portion beside the transparent portion. The transparent portion defines a display area of the electronic device. The non-transparent portion defines a non-display area of the electronic device beside the display area. The non-transparent portion includes a transparent substrate integrated with the transparent portion. A plurality of through holes are defined on the transparent substrate. | 02-05-2015 |
20150043156 | Thermal Mitigation Adaptation for a Mobile electronic device - The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value. | 02-12-2015 |
20150085441 | Speaker Cooling - Embodiments are provided for cooling one or more components of a playback device using speaker vibrations that result from inaudible audio. Movement of air molecules arising from the speaker vibrations may disperse heat away from the one or more components of a playback device. The playback device may include a thermal sensor to determine the temperature on or around one or more components. If the playback device is no longer playing audible audio and temperature on or around one or more components rises above a first predetermined threshold, the playback device may play inaudible audio. Playback of inaudible audio may result in movement of air molecules and the dispersion of heat away from the one or more components. Playback of the inaudible audio may stop if the playback device begins playing audible audio or if the temperature on or around one or more components drops below a second predetermined threshold. | 03-26-2015 |
20150098179 | Cold Row Encapsulation for Server Farm Cooling System - An apparatus includes an enclosure defining an interior space and at least one server-rack port configured to engage one or more of racks such that one or more servers installed in each rack are contiguous to the interior space. The enclosure is inside of a room and includes at least one stability control unit at the bottom of the enclosure. Each server includes a fan that draws air from the interior space into the server and expels the air outside of the enclosure into the room. The apparatus also includes a mixing chamber that is contiguous to the enclosure. The mixing chamber includes a first set of one or more dampers that are contiguous to natural air outside of the room and a second set of one or more dampers that are contiguous with air in the room. | 04-09-2015 |
20150124397 | Electronic Assembly with Thermal Channel and Method of Manufacture Thereof - In accordance with some implementations of this invention, an electronic assembly is formed with a thermal channel that controls an air flow for the purpose of dissipating heat generated in the electronic assembly. The electronic assembly includes a top board, a bottom board and a subassembly that further includes a rail, an airflow tab and an interconnect. The subassembly couples the top and bottom boards together. The rail has an opening through which air passes. The interconnect faces the airflow tab, carries electrical signals between the top board and the bottom board, and is configured to channel air directed through the opening of the rail. | 05-07-2015 |
20150146367 | CONTAINER DATA CENTER AND HEAT DISSIPATION SYSTEM - A heat dissipation system includes a number of condensers, an air distribution apparatus, a number of guiding pipes, and a controller. The air distribution apparatus includes a distribution box and a number of adjusting members. The distribution box defines an air inlet and a number of air outlets arranged along a lengthwise direction of the distribution box. The adjusting members are rotatably installed in the air outlets of the distribution box. The guiding pipe is connected between the condensers and the air inlet of the air distribution apparatus. The controller controls the adjusting members to rotate to change opening sizes of the air outlets. | 05-28-2015 |
20150296664 | SERVER CABINET - A server cabinet includes a bottom side, a top side, a first side wall, a second side wall opposite to the first side wall, a first air inlet tube with a number of air outlets, a second air inlet tube with a number of air outlets, and a number of pairs of adjusting apparatuses. The first air inlet tube is attached to the first side wall and extends from the bottom side to the top side, the second air inlet tube is attached to the second side wall and extends from the bottom side to the top side and the top side and the bottom side are each configured with an opening to receive the first air inlet tube and the second air inlet tube. Each air adjusting apparatus comprises a slidable shielding plate substantially covering the corresponding air outlets. | 10-15-2015 |
20150305202 | ADJUSTABLE AIRFLOW BARRIER SYSTEM - An adjustable airflow barrier system has a roll of flexible sheet air barrier contained in a housing. The air barrier is biased in retracted position and has a range of extended positions. A pull bar is attached to a free edge of the air barrier. A first magnetic mount is coupled to the housing to removably mount the housing to a first support surface, such as a cabinet in a data center. A second magnetic mount is coupled to the pull bar to removably mount the pull bar to a second support surface spaced from the first support surface. The housing is operable to form a substantial air seal with the first support surface, and the pull bar is operable to form a substantial air seal with the second support surface. | 10-22-2015 |
20150319878 | FLEXIBLE DATA CENTER INFRASTRUCTURE DISTRIBUTION - A data center includes various sets of infrastructure modules which each provide a particular type of infrastructure support to support computing operations in the data center. Separate sets of infrastructure modules can be installed incrementally based on incrementally changing support capacity for the corresponding type of infrastructure support in the data center. Such incrementally changing support capacity can be based upon support requirements of electrical loads, including rack computer systems, which are inbound to the data center. Where support capacity for a particular type of infrastructure support drops below a threshold, a quantity of additional infrastructure modules which provide the particular type of infrastructure support can be selected and installed to increase the support capacity. Separate sets of infrastructure modules can be selected and installed independently of each other, to independently adjust support capacity for separate types of infrastructure support, which can minimize excess support capacity at any given time. | 11-05-2015 |
20150319888 | CONTAINER DATA CENTER - A container data center includes a container and a row of server cabinets received in the container. The container includes a front wall defining a plurality of air inlets and a rear wall defining a plurality of air outlets. Each server cabinet is adjoined with an inner surface of the rear wall. Cooling air enters into the container from the air inlets of the front wall and flows through the server cabinets, and is directly exhausted through the air outlets of the rear wall. | 11-05-2015 |
20150327406 | DEVICE FOR PASSIVE COOLING OF ELECTRONIC EQUIPMENT AND POWER SUPPLY FOR A COLLECTION OF A PLURALITY OF COMPUTER UNITS - Device for cooling electronic equipment, comprising a supply channel (A, | 11-12-2015 |
20150327408 | MAGNETIC BLOCKING TILES FOR A DATACENTER FACILITY - A distribution of the cooling air through one or more perforated tiles or other open areas in the raised floor of the data room is customized by placing one or more magnetic blocking tiles in a pattern to lie on top of the one or more of the perforated floor tiles or other open areas. The cooling air flow through the perforated floor tiles or other open areas to areas where the computing systems are not installed is cut off; and thus, the air flow is directed flow areas in the datacenter where the computing systems are designed to be located and actually are installed in the datacenter. The magnetic blocking tiles have a top surface that is solid and a bottom surface. The magnetic blocking tiles adhere magnetically to either the raised floor or the perforated tiles. | 11-12-2015 |
20150331461 | Computing Device having a Spectrally Selective Radiation Emission Device - A computing device having a spectrally selective radiation emission device is described. In one or more implementations, an apparatus includes a housing, one or more electrical components disposed within the housing, and a spectrally selective radiation emission device. The one or more electrical components are configured to generate heat during operation. The spectrally selective radiation emission device is disposed on the housing and configured to emit radiation when heated by the one or more electrical components at one or more wavelengths of electromagnetic energy and reflect radiation at one or more other wavelengths of electromagnetic energy. | 11-19-2015 |
20150342094 | MODULAR DATA CENTER ROW INFRASTRUCTURE - A data center row infrastructure module enables rapid deployment of a computing room enclosure for computer systems that provides intake air circulation to, and exhaust air removal from, the computer systems in the enclosure. The data center row infrastructure module includes free-standing exhaust plenum structures encompassing opposite sides of the enclosure and a plenum module spanning a top end of the enclosure between the free-standing exhaust plenum structures. Each free-standing exhaust plenum structure includes an internal exhaust air plenum that directs exhaust air received from the enclosure through an exhaust air outlet on a top end of the free-standing exhaust plenum structure. The plenum module establishes a bottom end of a cooling air plenum above and separate from the enclosure and between the free-standing exhaust plenum structures. Some plenum modules can direct cooling air directly to the enclosure as intake air. Some plenum modules can mix cooling air with recirculated exhaust to provide the intake air. | 11-26-2015 |
20150351289 | DUCTED EXHAUST EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion. | 12-03-2015 |
20150359128 | LIGHTWEIGHT SERVER CHASSIS CONFIGURED FOR MODULAR INSERTION OF CUSTOMER SELECTABLE COMPONENTS FOR DOWNSTREAM ASSEMBLY OF INFORMATION HANDLING SYSTEM AT CUSTOMER LOCATIONS - An information handling system (IHS) includes a lightweight server chassis having a surface that includes a plurality of slots formed within the chassis surface. Each slot is sized to receive a specific compute component of a plurality of different compute components that collectively provide a fully functional IHS. In one embodiment, at least one slot that is formed within the chassis surface is sized to receive a respective one of the more than one type of compute component of a plurality of different compute components. Thereby, an original equipment manufacturer (OEM) can flexibly ship at least portions of the IHS to an end user destination for possible downstream reconfiguration and assembly. | 12-10-2015 |
20150359129 | SYSTEM FOR A RACK DESIGN - A rack system is disclosed. The racks and the computer systems included within the racks have a shallow configuration. The racks are placed next to one another in a back-to-back configuration in which the backs of each of the racks are adjacent to one another. All of the user-accessible components of the computers system face toward the front of each rack. The heated air from each of the computer systems is expelled in the space between each of the racks. The space between each of the racks is relatively narrow, as there are no user-accessible components between the racks. The racks are coupled to one another with a bar that may include at least some spring action to accommodate some movement of the racks toward or away from one another without the tipping of either rack. | 12-10-2015 |
20150373882 | SYSTEM AND METHOD FOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN A SEALED ENCLOSURE - A system and method for cooling electronic devices disposed with the innermost volume of a hollow-walled fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes within the hollow walls of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The innermost volume of the sealed container contains one or more single phase or multi-phase dielectric thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in the innermost volume of the sealed container. | 12-24-2015 |
20150382511 | SUBMERGED DATACENTER - The subject disclosure is directed towards a submerged datacenter, which may be made up of modules, into a body of water such as the ocean. The submersion facilitates cooling of the datacenter as well as providing protection of the datacenter from environmental conditions that exist at or near the surface. Power may be generated from the datacenter heat, and power generated by or near the body of water (e.g., via waves, tides, wind, currents, temperature differences) may be used to help power the datacenter. | 12-31-2015 |
20160037678 | Information Handling System Thermal Control with Adaptive Non-Rotational Cooling Devices - A tablet information handling system manages thermal conditions with selective installation of either a wireless wide area network interface card or an air moving device in an internal communication link card slot, such as an M.2 card slot. If an air moving device is installed, then greater thermal demands may be managed at the tablet information handling system, such as greater CPU clock speeds for a given CPU, internal housing or skin temperature. For example, a piezoelectric bellows-based fan having substantially the same footprint as a WWAN NIC and powered from the communications slot interface aids distribution of thermal energy whether or not the tablet housing has air vents. | 02-04-2016 |
20160057892 | CONTAINER-TYPE DATA CENTER HAVING AIR CONDITIONING FACILITY - The present invention provides a container-type data center having an air conditioning facility, which enables to effectively cool IT equipment by applying the arrangement to an existing container. A system ceiling | 02-25-2016 |
20160062420 | APPARATUS AND METHOD TO EFFICIENTLY COOL A COMPUTING DEVICE - Embodiments disclosed herein include devices to cool the walls of a mobile computing device. In one embodiment, a louvered vent is formed within an external wall of a mobile computing device to create an air curtain between the external wall and a heat generating component to cool the external wall. In another embodiment, a nozzle vent is formed within the external wall of a mobile computing device to flow cooling air at a heat generating component to cool the heat generating component. | 03-03-2016 |
20160073555 | Cooling Control for Data Centers with Cold Aisle Containment Systems - Embodiments of the present invention generally relate to the field of data center cooling and energy management. In an embodiment of the present invention, multiple PODs within a data center are controlled by a controller via active dampers. | 03-10-2016 |
20160088772 | METHOD AND APPARATUS TO REDUCE THERMAL RESISTANCE IN A SERVER CHASSIS - A server chassis includes add-on cards, interposer elements, and an interconnect subsystem including back planes. The interposer elements are physically connect to the at least two back planes and to the add-on cards therefore electrically coupling the add-on cards to the back planes. The add-on cards are configured in a stacked position such that unobstructed air flows between the add-on cards and through a space defined to be in between the back planes so that unobstructed air flow causes lowering of thermal resistance associated with the server chassis. | 03-24-2016 |
20160088774 | EMBEDDED CHASSIS DUCTING SYSTEM FOR PARALLELIZING AIRFLOW THROUGH COMPONENTS ORIENTED IN SERIES - An information handling system (IHS) has a server chassis assembly including a server chassis with a cold air inlet and a hot air exhaust and provisioned with compute components that are series aligned. A ducting structure positioned in the server chassis defines a cold air plenum in fluid communication with the cold air inlet and a hot air plenum in fluid communication with the hot air exhaust. A shroud of the ducting structure separates the cold air plenum and the hot air plenum. Air drops are provided longitudinally along the shroud corresponding respectively to the respective compute components being cooled. The air drops are each in fluid communication between the cold air plenum and the hot air plenum. Hot air from one compute component is routed directly to the hot air plenum away from other compute components. | 03-24-2016 |
20160100502 | MODULAR INFORMATION TECHNOLOGY (IT) RACK AND AIR FLOW SYSTEM - A method for designing and assembling a modular IT rack includes a manufacturer designing and constructing lightweight, modular corrugated cardboard modules/segments and corresponding banding and corner components that can be used to assemble the modular IT rack. A user/assembler of the modular IT rack assembles modular tray grouping and enclosure (MTGE) casing units using a first set of cardboard modules. The user constructs trays using a second set of cardboard modules. The user affixes cable support components to the sides of sub-groups of the constructed trays. The user encloses sub-groups of trays having the affixed cable support components within the assembled MTGE casing units to create MTGE blocks. The user vertically stacks the MTGE blocks having the tray sub-groups and the affixed cable support components enclosed within. The user aligns and secures the vertically stacked MTGE blocks in a fixed position using banding and corner components. | 04-07-2016 |
20160100507 | DATA CENTER CANOPY INCLUDING TURNING VANES - Examples provide data center canopies, data center housings, and data centers including turning vanes to facilitate air flow. In some examples, a data center canopy may include turning vanes to direct portions of an exhaust flow from an exhaust inlet toward floor sections to be output via exhaust outlets opposite the floor sections. Other examples are described and claimed. | 04-07-2016 |
20160128226 | RACK AIRFLOW CONDUIT - Provided is an apparatus including a frame a conduit coupled to the frame. The conduit is configured to adjustably extend from the frame, thereby providing a channel between the frame and a side of the server rack. The channel is configured to substantially thermally isolate a flow of gas through the channel. | 05-05-2016 |
20160135322 | SERVER CAPABLE OF ACCESSING AND ROTATING STORAGE DEVICES ACCOMMODATED THEREIN - A server capable of rotating and accessing storage devices accommodated therein includes a server chassis, a motherboard, a power supply module, two racks, and a system cooling module. The server chassis includes two side plates and an accommodating space between the two side plates. The power supply module is disposed in the accommodating space and arranged corresponding to the motherboard. The racks are arranged parallel to each other and detachably connected to the server chassis. A pivot structure and a handle for operating the rack are disposed at the rack near the motherboard. The rack is rotatable with respect to the server chassis by means of the pivot structure. The system cooling module is disposed adjacent to the rack. At least one cord passage is provided between the system cooling module and each of the side plates. | 05-12-2016 |
20160143191 | SYSTEM AND METHOD FOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN A SEALED ENCLOSURE - A system and method for cooling electronic devices disposed with the innermost volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The innermost volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in a volume of the sealed container. | 05-19-2016 |
20160150681 | BASE LAYER ARCHITECTURE INFRASTRUCTURE DEVICE - A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers. | 05-26-2016 |
20160157389 | CONTAINER DATA CENTER | 06-02-2016 |
20160183412 | COLD AIR CONTAINMENT SYSTEM IN A DATA CENTRE | 06-23-2016 |
20160198592 | EXPANDABLE, MODULAR INFORMATION TECHNOLOGY FACILITY WITH MODULARLY EXPANDABLE COOLING | 07-07-2016 |
20160205812 | AIR BLOCKING PANEL ASSEMBLY FOR A SERVER OR IT RACK | 07-14-2016 |
20160381835 | ARTIFICIAL REEF DATACENTER - Examples of the disclosure provide for an apparatus for actively promoting marine life. The apparatus includes a datacenter implemented in a body of water and coupled to a network, a pressure vessel that houses the datacenter, and one or more components coupled to the pressure vessel and adapted to actively promote reef life and sustain a surrounding ecosystem. | 12-29-2016 |
20160381840 | UNDERWATER CONTAINER COOLING VIA INTEGRATED HEAT EXCHANGER - In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell. | 12-29-2016 |
20160381841 | UNDERWATER CONTAINER COOLING VIA EXTERNAL HEAT EXCHANGER - In one example, a shell includes walls that collectively define an interior space of the shell, the interior space sized and configured to receive heat generating equipment. An internal heat exchanger disposed within the interior space is arranged for thermal communication with heat generating equipment when heat generating equipment is located in the interior space. Additionally, an external heat exchanger is located outside of the shell and arranged for fluid communication with the internal heat exchanger. Finally, a prime mover is provided that is in fluid communication with the internal heat exchanger and the external heat exchanger, and the prime mover is operable to circulate a flow of coolant through the internal heat exchanger and the external heat exchanger. | 12-29-2016 |
20170235344 | PROTECTIVE CASE FOR A COMPUTER AND METHOD FOR MANUFACTURING SUCH A CASE | 08-17-2017 |
20170235348 | HEAT VENTING MECHANISM | 08-17-2017 |
20170238443 | MODULAR DATA CENTER | 08-17-2017 |
20220141973 | ADJUSTABLE VENTING RATIO MECHANISM FOR INFORMATION HANDLING SYSTEM - An information handling system may include a chassis and a variable venting assembly comprising a wall having a plurality of spaced venting holes and an adjustable venting block mechanically coupled to the wall via an axis of rotation and having a plurality of spaced blocking fins such that as a position of the adjustable venting block varies, an overlap between the spaced blocking fins and the spaced venting holes varies. | 05-05-2022 |