| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361679520 | Heat pipe | 34 |
| 20090080151 | HEAT TRANSFER SYSTEM - The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system. | 03-26-2009 |
| 20090122480 | HEAT DISSIPATION ASSEMBLY FOR GRAPHICS CARD AND BLADE SERVER USING THE SAME - A heat dissipation assembly mounted to a main board in a blade server includes a graphics card, a heat sink, and a thermal board. The graphics card includes a GPU and a plurality of first graphics memory chips mounted on a top thereof, and a plurality of second graphics memory chips mounted on a bottom thereof. The heat sink for cooling the GPU and the first graphics memory chips, includes a base attached to the top of the graphics card, a finned part fixed to a top of the base, and a heat pipe sandwiched between the base and the finned part. A pathway of the heat pipe passes over the GPU and at least part of the first graphics memory chips of the graphics card. The thermal board is mounted to the bottom of the graphics card for cooling the second graphics memory chips. | 05-14-2009 |
| 20090161313 | HEAT DISSIPATING STRUCTURE - A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element. | 06-25-2009 |
| 20090268392 | NOTEBOOK COMPUTER HAVING HEAT PIPE - A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component. | 10-29-2009 |
| 20090268393 | PORTABLE ELECTRONIC DEVICE INCORPORATING THERMAL MODULE - A portable electronic device includes a casing, an electronic component disposed in the casing, and a thermal module for dissipating heat of the electronic component. The thermal module includes a heat pipe, a fin unit, and a transverse fan. The heat pipe includes an evaporating section thermally attached to the electronic component, and a condensing section thermally attached to the fin unit. The transverse fan is arranged in the casing for generating an airflow through the electronic component and the fin unit. The transverse fan includes a rotor, and a sidewall on a floor of the casing and surrounding the rotor. The sidewall defines an air inlet and an air outlet therein. The air outlet faces to the fin unit. The air inlet faces to the electronic component. | 10-29-2009 |
| 20090323276 | HIGH PERFORMANCE SPREADER FOR LID COOLING APPLICATIONS - Apparatuses, systems, and methods for a heat spreader plate and pulsating heat pipes to transfer heat sourced from one or more electronic components are described herein. Other embodiments may also be described and claimed. | 12-31-2009 |
| 20100079941 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases. | 04-01-2010 |
| 20100091450 | HEAT DISSIPATING HINGE FOR PORTABLE ELECTRONIC DEVICE - A portable electronic device includes a housing receiving a heat generating electrical component therein, a display unit and a heat dissipating hinge pivotably interconnecting the housing and the display unit. The heat dissipating hinge includes a body, a cover, a first heat pipe and a second heat pipe. A body defines a first receiving groove receiving a condenser section of the second heat pipe therein. The cover and the body cooperatively define a receiving channel receiving the evaporator section of the first heat pipe therein. Heat generated by the electric device is transferred from the heat generating electronic component to the display unit through the heat dissipating hinge. First and second supporting members are secured to two ends of the evaporator section of the first heat pipe to prevent leakage of thermal grease from a middle portion of the receiving channel. | 04-15-2010 |
| 20100188811 | Memory cooling device - A memory cooling device includes a left clamping seat and a right clamping seat that clamp at least one heat pipe. At least one side of the heat pipe is a straight surface which is affixed with a clamping surface of the left clamping seat or the right clamping seat through a thermal adhesive, and another surface of the thermal adhesive is affixed on a bottom surface of the memory, such that operating temperature generated by the working memory can be directly transmitted to the heat pipe and the left and right clamping seats through the thermal adhesive, to increase the heat dissipation efficiency for the memory, and actually and effectively dissipate the heat, thereby improving a lifetime of usage of the memory. | 07-29-2010 |
| 20100195281 | Hybrid Industrial Networked Computer System - A Kitchen Display System (KDS) includes a workstation including a first Personal Computer (PC)-based controller, a fanless workstation including a second PC-based or a non-PC-based controller having lower cost than the first PC-based controller, an Ethernet network operatively coupling the controllers, and a bump bar, keyboard, touchscreen, or keypad operatively coupled to at least one of the controllers. The first PC-based controller stores and displays video, multimedia, or a build card. At least one of the controllers includes a rugged computing module, which includes a circuit board including an outer perimeter and traces associated therewith, an integrated circuit mounted on the circuit board, at least one interface connector, a housing, and a thermal transfer device. | 08-05-2010 |
| 20100214740 | Phase-Separated Evaporator, Blade-Thru Condenser and Heat Dissipation System Thereof - A phase-separated evaporator includes a boiler plate and a phase separation chamber that includes a housing, connected to the boiler plate, having a gas port and a liquid port; and a phase partitioner connected to interiors of the housing, dividing the phase-separated evaporator into a vapor directing compartment and a condensate directing compartment. The phase partitioner includes a partition panel and multiple feeding injectors extending from the partition panel, with the injector tips disposed immediately above the boiler plate. The returning condensate from a condenser enters from the liquid port into the condensate directing compartment and feeds onto the boiler plate through the feeding injectors; while the vapor generated in the vapor directing compartment exits from the gas port, without encountering the condensate. Further disclosed are a high efficiency heat dissipation system utilizing the phase-separated evaporator and a blade-thru condenser, and a computer system utilizing the heat dissipation system. | 08-26-2010 |
| 20100271774 | HEAT DISSIPATION DEVICE - A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card. | 10-28-2010 |
| 20110019359 | ELECTRONIC APPARATUS - According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block. | 01-27-2011 |
| 20120092825 | ELECTRONIC DEVICE WITH HEAT DISSIPATION MODULE - An electronic device includes a mainframe module and a heat dissipation module. The mainframe module includes a base panel and a motherboard attached on the base panel. The motherboard has a first heat generating component and a second heat generating component mounted thereon. The heat dissipation module includes a first heat sink, a second heat sink attached to a first open side of the first heat sink, a first heat pipe, and a second heat pipe. The first heat pipe is connected between the first heat sink and the first heat generating component. The second heat pipe is connected between the second heat sink and the second heat generating component. The motherboard and the heat dissipation module are mounted on the base panel side by side. | 04-19-2012 |
| 20120106073 | DATA CENTER MODULE - A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end. | 05-03-2012 |
| 20120314363 | HEAT TRANSFER SYSTEM - The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system. | 12-13-2012 |
| 20130003295 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
| 20130003296 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
| 20130050935 | CONTAINER DATA CENTER HAVING HIGH HEAT DISSIPATING EFFICIENCY - A container data center includes a container, servers, a monitoring device, a cooling system, and a controller. The container is divided into first regions and a second region which are separated from each other. The servers are received in the respective first regions. The monitoring device is for monitoring the servers and received in the second region. The cooling system includes a first generator for generating a first cool airflow, a second generator for generating a second cool airflow for the second region, an air pipe connecting the first regions and directing the first cool airflow to the first regions, and valves arranged in the air pipe. Each valve is positioned between each two adjacent first regions. The controller controls the first generator, the valves and the second generator. | 02-28-2013 |
| 20130050936 | HEAT TRANSFERRING MODULE AND START UP METHOD OF ELECTRONIC DEVICE - A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring module includes at least one water head, at least two loop heat pipes, at least two pumps, and a working fluid. The water head is thermally connected to the heat source. The loop heat pipes are connected to the water head respectively, and at least one of the loop heat pipes is thermally connected to the ready-to-heat elements. Each pump is connected to the corresponding loop heat pipe. The working fluid flows into the water head and at least one of the loop heat pipes by at least one of the pumps, so heat generated by the heat source is transferred to at least one of the ready-to-heat elements. A method of starting up an electronic device is also provided. | 02-28-2013 |
| 20130094141 | HEAT REMOVAL IN COMPACT COMPUTING SYSTEMS - A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed. | 04-18-2013 |
| 20130135822 | COOLING MODULE - A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module includes a cooling loop and a plurality of heat pipes. The cooling loop includes a plurality of cooling units. The cooling units are connected in series through a plurality of connection tube and each cooling unit is thermally coupled to one of the first heat source. The heat pipes are thermally coupled to the second heat sources and the cooling units. When the cooling unit is in failure, the cooling units can be directly removed and replaced. Also, the second heat sources of the electronic device are capable of exchanging heat with the cooling unit through the heat pipe. | 05-30-2013 |
| 20130258585 | ACTIVE COOLING DEBRIS BYPASS FIN PACK - Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins. | 10-03-2013 |
| 20130271913 | TECHNIQUES FOR COMPUTING DEVICE COOLING USING A SELF-PUMPING FLUID - Techniques for computing device cooling using a self-pumping cooling fluid are described. For example, an apparatus may comprise one or more heat-generating components, a housing forming a cavity including the one or more heat-generating components, and a self-pumping cooling fluid arranged in the cavity. The self-pumping cooling fluid may comprise a slurry of microencapsulated phase change material (mPCM) particles suspended in a working fluid and arranged to circulate throughout the cavity. Other embodiments are described. | 10-17-2013 |
| 20140185232 | METHOD AND APPARATUS FOR COOLING DEVICES USING PHASE CHANGE MATERIALS - In some embodiments, cooling devices with metal hydrides are disclosed. | 07-03-2014 |
| 20140268553 | SYSTEM FOR COOLING MULTIPLE IN-LINE CENTRAL PROCESSING UNITS IN A CONFINED ENCLOSURE - A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin pitch. The system may further include a rear CPU disposed in line with the front CPU and a rear heat sink coupled to the rear CPU. The rear heat sink may have a plurality of fins and a corresponding fin pitch. The fin pitch of the rear heat sink may be higher than the fin pitch of the front heat sink. In another embodiment, the front and rear heat sinks may be coupled together by one or more heat pipes. | 09-18-2014 |
| 20150043160 | Adjustable Heat Sink Supporting Multiple Platforms and System Configurations - An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks. | 02-12-2015 |
| 20150077929 | SHEET-TYPE HEAT PIPE AND MOBILE TERMINAL USING THE SAME - Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal. | 03-19-2015 |
| 20150124399 | HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME - A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided. | 05-07-2015 |
| 20150300750 | ELECTRONIC DEVICE AND HEAT DISSIPATION PLATE - An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing. | 10-22-2015 |
| 20160048179 | SYSTEM, INFORMATION PROCESSING DEVICE AND RACK - A rack in which a single or plurality of blade servers are installed includes: a fixing portion that detachably fixes the blade server; and a pipe with which cooling fluid supplied from outside the rack is passed through inside the rack and then introduced outside the rack, the pipe being thermally connected, in a state where the blade server is fixed by the fixing portion, to a heat transfer block thermally connected to at least one heat source included in the blade server. | 02-18-2016 |
| 20160066468 | SYSTEMS AND METHODS FOR HEAT MANAGEMENT OF AN INFORMATION HANDLING RESOURCE IN AN INFORMATION HANDLING SYSTEM - In accordance with embodiments of the present disclosure, a system may include a structural element and a heat pipe. The structural element may be for mechanically supporting an information handling resource. The heat pipe may be thermally and mechanically coupled to the structural element, such that the heat pipe conducts heat generated by an information handling resource supported by the structural element to the structural element. | 03-03-2016 |
| 20160124474 | EVAPORATOR, COOLING DEVICE, AND ELECTRONIC APPARATUS - There is provided an evaporator including: a container including a top plate, and a bottom plate configured to be heated by an electronic component; a reinforcing member having a tubular shape extending from the bottom plate to the top plate, and configured such that a coolant is introduced inside the reinforcing member; a side opening formed in a side portion of the reinforcing member, and configured to allow the coolant to flow out to the bottom plate; and a discharge port provided in the top plate outside the reinforcing member, and configured to discharge vapor from the container, the vapor being generated by the coolant contacting the bottom plate. | 05-05-2016 |
| 20160147269 | GASKETS FOR THERMAL DUCTING AROUND HEAT PIPES - The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly. | 05-26-2016 |
