| Entries |
| Document | Title | Date |
|---|
| 20090027840 | Cooling Device and Electronic Apparatus - According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section; a heat dissipation member thermally connected to the heat-sinking section; and a fan that blows air to the heat dissipation member. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section and the heat-sinking section are provided on one of the first and second plate members. The fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section. | 01-29-2009 |
| 20090109611 | METHOD AND COMPUTER SYSTEM WITH ANTI-TAMPER CAPABILITY AND THERMAL PACKAGING STRUCTURE FOR IMPLEMENTING ENHANCED HEAT REMOVAL FROM PROCESSOR CIRCUITRY - A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits. | 04-30-2009 |
| 20090161311 | Top mount surface airflow heatsink and top mount heatsink component device - It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu | 06-25-2009 |
| 20090161312 | LIQUID COOLING SYSTEMS FOR SERVER APPLICATIONS - Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force applied to the two heat exchangers. The mounting mechanism may include an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server to lessen the possibility of disconnecting the electrical connections between the electronics server and the rack, and/or lessening mechanical stresses transferred to the electronics server and the rack chassis. The mounting mechanism also may be coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. | 06-25-2009 |
| 20090168330 | ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT - An electronic device includes an enclosure ( | 07-02-2009 |
| 20090168331 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus is provided with a circuit board contained in a case and including a first surface and a second surface formed on the reverse side of the first surface, a first heat generating component mounted on the first surface, a second heat generating component mounted on the second surface, a radiator section located off the circuit board, a first heat transfer member extending along the first surface and provided between the first heat generating component and the radiator section, and a second heat transfer member extending along the second surface and provided between the second heat generating component and the radiator section. | 07-02-2009 |
| 20090190302 | METHOD, APPARATUS AND COMPUTER SYSTEM FOR VORTEX GENERATOR ENHANCED COOLING - Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may include one or more vortex generators coupled to a heat spreader and positioned in close proximity to an electronic component, and a flow of air to provide for an exchange of thermal energy, where the flow of air is provided by a configuration of the housing, and where the one or more vortex generators may promote turbulence to enhance the exchange of thermal energy of the electronic component. In some embodiments, an air mover may be used to increase the flow of air in the housing. Other embodiments are described. | 07-30-2009 |
| 20090190303 | HEAT DISSIPATION PLATE, GAP ADJUSTING JIG FOR HEAT DISSIPATION AND MOTHERBOARD - A gap adjusting jig for heat dissipation is suitable to hold at least a heat source of a plate-shaped module. The gap adjusting jig for heat dissipation includes a first heat dissipation plate and a second heat dissipation plate and at least a gap adjusting element. A gap is formed between the first and second heat dissipation plates. The heat source is suitable to be provided in the gap and lean against the first and second heat dissipation plates. The gap adjusting element is connected between the first and second heat dissipation plates. The gap adjusting element is suitable to adjust the gap between the first and second heat dissipation plates to enable the first and second heat dissipation plates to hold the heat source. | 07-30-2009 |
| 20090190304 | COOLING DEVICE FOR MEMORY MODULE - A cooling device for memory module is held onto a memory module and includes a first cooling assembly, a second cooling assembly, and a fastener. In the invention, the first cooling assembly includes a cooling plate and a vapor chamber, in which cooling fins are formed at one side of the cooling plate, at upper side of which engaging parts are formed. One inner side of the cooling plate is attached to one side of the vapor chamber, while another side is attached to the memory module. The second cooling assembly also includes a cooling plate and a vapor chamber. Cooling fins are formed at one side of the cooling plate, at upper side of which engaging parts are formed. When the two cooling plates are fixed correspondingly, all cooling fins are aligned correspondingly, and the engaging parts are engaged to each other. In the meantime, at least one fastener is applied for clamping and fixing the first and second cooling assemblies together. Thereby, two sides of the memory module are provided with vapor chambers capable of rapid heat conduction to boost the cooling efficiency of the entire cooling device. | 07-30-2009 |
| 20090213537 | Housing for a Computer - A housing for a computer or multi-media equipment or the like includes at least one heat-generating component. The housing may have a respective cooling body on opposing walls and a heat conduction conduit that is thermally coupled to the heat-generating component. The heat conduction conduit can run along both opposing walls and is thermally coupled to the cooling bodies, whereby heat from the heat-generating component can be dissipated from the housing via the heat conduction conduit and the cooling bodies. By running the heat conduction conduit along opposing walls, heat may be transferred in a rapid, uniform manner to the entire surface of the cooling bodies that are contained in the walls. | 08-27-2009 |
| 20090213538 | Graphics Card and Heat Dissipation Method Thereof - A graphics card includes a graphics processing unit (GPU), a heat dissipation fin, an electric cooling module and a thermoelectric generator. The electric cooling module has a cold side and a hot side. The cold side contacts the GPU, and the hot side contacts the heat dissipation fin. The thermoelectric generator contacts the heat dissipation fin and is electrically connected to the electric cooling module. Furthermore, a method for dissipating the heat of the graphics card is also disclosed herein. | 08-27-2009 |
| 20090231803 | Casing used for Electronic Device and Server for Computing - The present invention provides a casing used for electronic device and server for computing, wherein the server including a casing and a circuit board, and the casing including a casing body and a carrier mechanism. The casing body has an internal space, and the carrier mechanism including a carrier unit and a fastening unit, wherein the carrier unit is disposed in the internal space and it carries the circuit board. The fastening unit is disposed on the terminal of the carrier unit, wherein the fastening unit has a handle. One terminal of the handle is pivoted on the carrier unit, and the other terminal has a fastening element, which is for the use of fastening on the casing body. The present invention can shorten the time spending on replacing the electronic components by using the casing used for electronic device so as to facilitate the users. | 09-17-2009 |
| 20090244827 | System and Method for Portable Information Handling System Thermal Shield - An information handling system's thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier allows airflow through the air channel to a vent opening of the information handling system. The airflow through the air channel cools the base of the thermal barrier so that an end user will experience reduced thermal energy if the information handling system rests on the end user, such as in the end user's lap. | 10-01-2009 |
| 20090244828 | System unit of a computer - The invention relates to a system unit of a computer. The system unit has a plug-in card populated with components and a fan which supplies an air flow to an air ducting body arranged in the system unit. The air flow is provided for cooling the plug-in card which is arranged in the system unit essentially parallel to the air ducting body. Cooling of the plug-in card is improved in that the air ducting body has a central conduit and a first and a second side conduit. The side conduits are provided with a plurality of openings which are arranged in a row and aligned essentially parallel to heat sinks arranged on the plug-in card. The central conduit has a constriction for the admission of air. | 10-01-2009 |
| 20090244829 | Heat Removal System for Computer Rooms - According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism. | 10-01-2009 |
| 20090244830 | Systems and Methods for Cooling a Computing Component in a Computing Rack - According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate. | 10-01-2009 |
| 20090262495 | High efficiency heat removal system for rack mounted computer equipment - An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets. | 10-22-2009 |
| 20090279247 | HEAT DISSIPATION DEVICE OF NOTEBOOK COMPUTER - A heat dissipation device is provided for dissipating heat from a heat source inside a notebook computer, and includes a hood, a bottom board, a thermal insulation layer, and at least one fan. The hood and the bottom board together define a heat dissipation channel. The bottom board integrally forms a plurality of fins and pegs. The bottom board is set above the heat source. The fan is set above the bottom board to efficiently expel heat from the inside to the outside. With the plurality of fins and pegs, the heat dissipation surface area of the bottom board and the heat source is increased and the overall heat dissipation performance is enhanced. | 11-12-2009 |
| 20090284911 | PELTIER-ASSISTED LIQUID-COOLED COMPUTER ENCLOSURE - Disclosed is a design for a computer enclosure. Heat is passed from the heat-generating components directly to a non-conductive liquid coolant. Some of the heat is expelled directly to the environment via a heatsink “chimney”, and some is expelled with the help of a thermoelectric heat pump. | 11-19-2009 |
| 20090290299 | FRAME-TYPE COMPUTER COOLING DEVICE - A frame-type computer cooling device for installation in a host computer is provided. The host computer has a heat-generating source and a slot compartment. The slot compartment communicates with the inside of the host computer and the outside of the host computer. The frame-type computer cooling device includes a frame and a cooling circulation device. The frame is insertedly disposed in the slot compartment and includes a receiving recess. The cooling circulation device includes an evaporator, a compressor, a condenser, and an expansion valve connected to one another by a pipeline filled with a coolant. The compressor, the condenser, and the expansion valve are received in the receiving recess. The evaporator adjoins the heat-generating source. Accordingly, the cooling circulation device is easy to install, and heat dissipation of the heat-generating source is swift and efficient. | 11-26-2009 |
| 20090290300 | POWER-ON CIRCUIT FOR COMPUTER - A power-on circuit of a computer includes a heat sink, an SIO chip, a connector, a first electric switch, a second electric switch, and a third electric switch. When the heat sink is installed properly, the heat sink is grounded, and the first electric switch is turned off. After a power-on button is pressed down, a power supply on pin of the SIO chip sends a low level signal to turn off the second electric switch, the third electric switch is turned on, a power supply on pin of the connector is at a low level, and the computer is powered on. When the heat sink is installed improperly, the heat sink is not grounded, the first electric switch is turned on, the third electric switch is turned off, the power supply on pin of the connector is at a high level, and the computer cannot be powered on. | 11-26-2009 |
| 20100002373 | HEAT DISSIPATING DEVICE FOR ELECTRONIC DEVICE - A heat dissipating device is provided. The heat dissipating device includes a seat and a plurality of fins secured on the seat. The fins are regularly aligned in a matrix. A first set of fins comprise of a convex profile. | 01-07-2010 |
| 20100008036 | Portable Device Cooling System - A cooling system cools an electrically rechargeable portable device accommodated in a docking station. The cooling system includes a docking station having a non-forced air active cooling unit and a housing. The cooling unit maintains a first heatsink surface at a temperature below an ambient temperature and a second heatsink surface at a temperature exceeding said first heatsink surface temperature. The housing accommodates an electrically re-chargeable portable device. The housing re-charges said portable device and seats said portable device in a position providing thermal contact between said docking station first heatsink surface and a heat spreader of said portable device while re-charging of said portable device. | 01-14-2010 |
| 20100014242 | COMPUTER ATTACHABLE TO AN UNDERSURFACE OF A DESK - A computer attachable to an undersurface of a desk is disclosed, in which an office space can be maximized by allowing a body part to horizontally slide into an undersurface of an upper board of a desk, and complicated electric wires can be arranged clean, and an office interior can be cleaned, and a compact size computer system can be obtained while using typical size computer elements, which lead to a cost competitive excellent quality computer system. | 01-21-2010 |
| 20100014243 | HEAT DISSIPATION APPARATUS - A heat dissipating apparatus includes a base, a heat sink received in the base, and a retaining cover attached to the base. The retaining cover defines two crossing slots for cooperatively forming at least one flap. Each free portion of flap has a free portion. The free portion of each flap elastically curves towards the heat sink to bias the heat sink towards the base. | 01-21-2010 |
| 20100027214 | MOTHERBOARD MODULE ARRAY - A motherboard module array suitable for being assembled to a chassis of a server is provided. The chassis includes a bottom plate, two sidewalls, a front plate, and a rear plate opposite to the front plate. The motherboard module array includes at least one group of dividing plates and a plurality of motherboard modules. The dividing plates are arranged inside the chassis and in parallel to the two sidewalls and have at least one group of supporting rails extending inwards. Each of the motherboard modules includes a motherboard which has a plurality of components and an extractable tray which supports the motherboard, wherein the extractable tray is disposed on the supporting rails and the extractable tray is suitable for being pulled out from the chassis. | 02-04-2010 |
| 20100033921 | LIQUID-COOLED RACK WITH PRE-COOLER AND POST-COOLER HEAT EXCHANGERS USED FOR EMI SHIELDING - A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference. | 02-11-2010 |
| 20100053884 | HEAT DISSIPATION DEVICE AND COMPUTER USING SAME - A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively. | 03-04-2010 |
| 20100061052 | ELECTRONIC APPARATUS - The invention discloses an electronic apparatus including a sealed housing, a heat-conducting component, and a fan. The heat-conducting component penetrates the sealed housing, and a fan is disposed in the sealed housing. The fan drives an air-flow, and the air-flow flows in the sealed housing and flows through the heat-conducting component. | 03-11-2010 |
| 20100061053 | Ruggedized Computer Capable of Operating in High-Temperature Environments - Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment. | 03-11-2010 |
| 20100067192 | HEAT DISSIPATION DEVICE HAVING FIXTURES FOR ATTACHMENT OF A FAN - A heat dissipation device includes a heat sink, a fan holder covering the heat sink and formed with a plurality of fastening pins thereon, a fan arranged on the fan holder and mounted on the fastening pins, and a plurality of fixtures mounted on the fastening pins and extending through the fan to secure the fan on the fastening pins of the fan holder. The fan includes a flange having a plurality of fixing holes defined therein for the fastening pins extending therethrough. The fixtures each includes a locking plate locking on a bottom side of the flange of the fan, and a plurality of claws abutting against an upper side of the flange of the fan and clamping on a corresponding fastening pin. | 03-18-2010 |
| 20100067193 | CONVERGENCE OF AIR WATER COOLING OF AN ELECTRONICS RACK AND A COMPUTER ROOM IN A SINGLE UNIT - Systems and methods are provided for cooling an electronics rack and a computer room from a single unit, which includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack. First and second modular cooling units (MCUs) are associated with the rack and configured to provide system coolant to the electronics subsystem for cooling thereof. System coolant supply and return manifolds are in fluid communication with the MCUs for facilitating providing of system coolant to the electronics subsystem, and to an air-to-liquid heat exchanger associated with the rack for exclusively cooling air passing through the rack, as well as conditioning the ambient air of the computer room. Such cooling is exclusive of an outside-of-rack conditioned air unit. | 03-18-2010 |
| 20100073864 | HEAT DISSIPATION DEVICE AND COMPUTER USING SAME - A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam. | 03-25-2010 |
| 20100073865 | ELECTRONIC DEVICE AND A THERMAL CONNECTOR USED THEREIN - An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part. | 03-25-2010 |
| 20100073866 | COOLING DEVICE AND ELECTRONIC EQUIPMENT INCLUDING COOLING DEVICE - A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove. | 03-25-2010 |
| 20100091447 | System and Method for Providing Liquid Cooling of Memory Devices - A device comprising a first thermal interface material, and a first micro-channel cold plate. The first thermal interface material is in physical communication with a first plurality of memory modules of a computer system. The first micro-channel cold plate is in physical communication with the first thermal interface material. The first micro-channel cold plate is adapted to allow a fluid flow through a first plurality of micro-channels, and configured to remove a first amount of heat produced by the first memory modules of the computer system through the first thermal interface material. | 04-15-2010 |
| 20100097751 | AIR CONDITIONING SYSTEMS FOR COMPUTER SYSTEMS AND ASSOCIATED METHODS - Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet. | 04-22-2010 |
| 20100110626 | System and Method for High Density Information Handling System Enclosure - An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers. | 05-06-2010 |
| 20100124011 | HEAT DISSIPATION MODULE - An electronic device includes a first electronic component, a second electronic component adjacent to the first electronic component, a heat sink arranged on the first electronic component to absorb heat therefrom, an axial fan mounted on the heat sink for generating an airflow to the heat sink, and a guiding member. The axial fan includes a frame and an impeller received in the frame. A cutout is defined in the frame facing the second electronic component. The guiding member is arranged between the axial fan and the second electronic component for guiding a part of the airflow escaping from the frame via the cutout to the second electronic component. | 05-20-2010 |
| 20100124012 | BLADE SERVER - A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard. | 05-20-2010 |
| 20100128431 | HYBRID LIQUID-AIR COOLED GRAPHICS DISPLAY ADAPTER - A hybrid liquid-air cooling system which may be easily adapted to provide a liquid cooling mechanism for use with a wide range of heat sources on components or adapter boards ( | 05-27-2010 |
| 20100134971 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades. | 06-03-2010 |
| 20100142142 | METHOD AND DEVICE FOR COOLING HEAT-GENERATING COMPUTER COMPONENTS - The invention relates to a cooling arrangement with a first and at least one second heat-creating computer component, each coupled to at least one heatsink ( | 06-10-2010 |
| 20100149749 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources. | 06-17-2010 |
| 20100149750 | ELECTRONIC APPARATUS - According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other. | 06-17-2010 |
| 20100165566 | HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink. | 07-01-2010 |
| 20100172088 | HEAT DISSIPATION DEVICE FOR MEMORY MODULE - A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation. | 07-08-2010 |
| 20100172089 | HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE HAVING THE SAME - A heat dissipation module includes a heat sink, a wind-guiding element and a pivot. The wind-guiding element is disposed on the heat sink, and the pivot is connected between the heat sink and the wind-guiding element to allow the wind-guiding element to rotate relative to the heat sink via the pivot. The wind-guiding element can change a direction of airflow to provide an optimal heat dissipation effect. Additionally, an electronic device using the heat dissipation module is also provided. The heat dissipation module can provide superior heat dissipation effect to an electronic component on the electronic device and maintain a normal operation of the electronic component. | 07-08-2010 |
| 20100177477 | ADJUSTABLE RETENTION LOAD PLATE OF ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly electrically connecting a CPU and a printed circuit board comprises an electrical connector mounted on the printed circuit board, and a heat dissipating device, the CPU is mounted upon the connector. The heat dissipating device includes a load plate, a heat pipe, and a heat plate. The load plate is mounted upon the CPU under condition that heat from the CPU is absorbed by the heat pipe and the heat plate. The load plate is sandwiched between the heat plate and the heat pipe. The load plate has two clips, each clip has two cantilever arms extending toward and engaging with the other clip. | 07-15-2010 |
| 20100188809 | Radiator For Computer Memory - A radiator has a main heat sink and at least one secondary heat sink. The main heat sink has a heat conductor and multiple longitudinal fins. The heat conductor is formed from two mounting panels being connected along connecting beams being wider than the panel so forming a mounting space and having multiple conducting posts being formed on and protruding from the connecting beams and at least one trough formed in one mounting panel. The longitudinal fins are mounted on the conducting posts to dissipate heat. The secondary heat sink has a conducting bar mounted in and protruding from the trough with multiple transverse fins mounted on the connecting bar. A computer memory is mounted in the mounting space for improved efficacy. | 07-29-2010 |
| 20100195280 | Heat-dissipation module and electronic device using the same - A heat-dissipation module and an electronic device including a first heat source and the heat-dissipation module are provided. The heat-dissipation module includes a first heat pipe, a second heat pipe, a first set of heat fins, a second set of heat fins and a fan. One end of the first heat pipe and one end of the second heat pipe are respectively in contact with the first heat source. The first set of heat fins and the second set of heat fins are, respectively, in contact with the other end of the first heat pipe and the other end of the second heat pipe. Heat generated by the first heat source is transferred to the two sets of heat fins through the first and the second heat pipes. The fan is used for providing an air-flow blowing toward the two sets of heat fins to dissipate heat. | 08-05-2010 |
| 20100214735 | Portable folding heat-sink assembly for notebook computer - A portable folding heat-sink assembly for notebook computers implements two or more housings connected at adjacent sides thereof with one or more pivot shafts. Furthermore, heat-sink fans, a circuit board, a switch, and an indication lamp may be optionally settled in some of the housings. Anti-slip pads and supports may be provided at the bottoms of the housings while adjustable pedestals may be provided on the housings. Thus, by the pivot shafts, the heat sink assembly can be expanded for use and can be folded into a reduced volume for portage. Besides, the heat sink assembly can be uprighted on a table to function as an electric cooling fan. | 08-26-2010 |
| 20100214736 | Cooling system for computer, cooling apparatus and cooling method - A cooling system for computer, a cooling apparatus and a cooling method are described. The cooling system includes a computer casing, a fan and the fan-less cooling apparatus. The fan-less cooling apparatus has an air passage with two open ends and a closed circumference. The air passage passes a heat dissipating part of the apparatus, one end of the air passage communicates with air outside the computer casing and the other end communicates with air inside the computer casing. a plurality of blowholes for the fan and the air passage are formed in the computer casing. There is at least one fan. Air is blown inside or outside through the blowholes, which causes a pressure difference between the interior and the exterior of the computer casing. The pressure difference leads an air flow to flow through the blowholes to dissipate heat. | 08-26-2010 |
| 20100220439 | FLAT HEAT PIPE RADIATOR AND APPLICATION THEREOF - A flat radiator with flat type heat pipe and its application for portable computers is provided. The heat pipe in a radiator use tubular type and plate type structures. An air convective extended heat exchange surface surrounds and is over against the fan impeller, such that the radiator is extremely compacted, and the heat transport distance in heat pipe is shortened. Further introducing enhanced convective heat transfer structure and setting the fins according to the aerodynamics improve the heat dissipating capacity. The restrictions to a radiator when installing are reduced, which helps to implement the standardization of the radiator series. Also portable computers using the radiator are provided. | 09-02-2010 |
| 20100259886 | External thermal solution for a mobile computing device - A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device. | 10-14-2010 |
| 20100259887 | COMPUTER ENCLOSURE - A computer enclosure includes an absorber plate, a thermoelectric converter, and a refrigerator. The absorber plate is arranged in the computer enclosure to absorb heat generated in the computer enclosure. The thermoelectric converter is arranged in the computer enclosure to receive heat absorbed by the absorber plate, and then convert the absorbed heat to electrical energy. The refrigerator is arranged in the computer enclosure to receive the electrical energy generated by the thermoelectric converter, and then work to generate cold air to dissipating heat in the computer enclosure. | 10-14-2010 |
| 20100259888 | THERMAL SPREADER FOR HEAT PIPE COOLERS AND WATER COOLERS - This invention relates to thermal spreader incorporated into heat pipe coolers and water coolers for electronic components, said spreader having optimal aspect ratio T/(√S)≧0.17 to provide optimal parameters of thermal resistance and lowering noise created by these coolers supplying by operating fans, where T is thickness of said thermal spreader and (√S) is square root of the surface area of the first surface of said thermal spreader. Further, the invention relates to electronic systems comprising said thermal spreader with optimal aspect ratio T/(√S)≧0.17 to provide better thermal management of electronic components incorporated into these electronic systems. | 10-14-2010 |
| 20100265653 | HEATSINKS AND A SPRING IN A BAFFLE SLOT BETWEEN ADJACENT COMPONENTS - A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks. | 10-21-2010 |
| 20100277863 | DATA CENTERS - According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A second data center section comprises a heat exchanger, the second data center section being substantially segregated from the first section. A heat transfer element is thermally coupled to at least some of the heat generating sources and is further thermally coupled to the heat exchanger. | 11-04-2010 |
| 20100277864 | COOLING - According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation. | 11-04-2010 |
| 20100284142 | HEAT DISSIPATING ASSEMBLY - A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base. | 11-11-2010 |
| 20100302725 | VAPOR CHAMBER HEAT SINK WITH CROSS MEMBER AND PROTRUDING BOSS - One embodiment provides a vapor chamber having an outwardly protruding boss. A frame surrounds a perimeter of the vapor chamber. A plurality of heat sink fins extend from the frame. A cross-member spans the frame across the vapor chamber wall and defines an opening through which the boss protrudes at least slightly beyond the cross-member. The heat sink may be secured to a socket on a circuit board, with the boss engaging a processor positioned in the socket. In response to securing the heat sink, the boss compresses flush with the cross-member and the cross-member engages the processor to seat the processor in the socket. The opening in the cross-member reinforces the boss against outward deformation. | 12-02-2010 |
| 20100302726 | ACTIVE THERMAL MODULE - An active thermal module including a radiating chassis, a radiating fin assembly fixedly perpendicularly mounted on the radiating chassis, a heat pipe assembly and a fan. The heat pipe assembly penetrates through the radiating fin assembly. The heat pipe assembly includes one or more heat pipes each having a heat absorption section, a heat conduction section and a bending section between the heat absorption section and heat conduction section. The heat absorption sections horizontally attach to the radiating chassis in parallel to the heat conduction sections and the radiating chassis. The bending sections protrude from a lateral side of the radiating fin assembly and are exposed to outer side thereof. With the thermal module positioned in a limited space, the space can be fully utilized to increase heat dissipation area and enhance heat dissipation effect. | 12-02-2010 |
| 20100315770 | COOLANT PULSING FOR COMPUTER SYSTEM - The present invention provides for repeatedly pulsing coolant through a first channel exposed to heat-generating computer components. The pulsing involves a relatively low baseline coolant flow rate with repeated excursions to a relatively high expulsion coolant flow rate. | 12-16-2010 |
| 20100328877 | METHODS AND DEVICES FOR FORCED AIR COOLING OF ELECTRONIC FLIGHT BAGS - An electronic flight bag computer (EFB) includes a housing defining first and second compartments that are fluidly isolated from and in thermal communication with one another. The first compartment contains electronic components connected to a user interface on an exterior portion of the housing for providing interactive flight related computation functions to a user. The second compartment contains a forced convection cooling component in thermal communication with the electronic components. The forced convection cooling component directs a flow of cooling fluid into the second compartment to convey heat produced by the electronic components out of the housing, such that the cooling fluid in the second compartment remains fluidly isolated from the electronic components in the first compartment of the housing. | 12-30-2010 |
| 20100328878 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board. | 12-30-2010 |
| 20110013357 | Combination Grill And Computer Add-in-card Retention Structure - A monolithic combination radiator grill and retention structure for computer add-in cards includes a longitudinally extending rectangular frame defining a longitudinally extending rectangular aperture. Transversely extending crossbars traverse the aperture. The crossbars are spaced so as to leave transversely extending gaps therebetween. The crossbars have transversely extending and upwardly facing grooves. Each of the grooves is dimensioned for receiving and retaining an end of a computer add-in card or extension to an add-in card. | 01-20-2011 |
| 20110026219 | HEAT TRANSFER SYSTEMS AND METHODS - A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length. | 02-03-2011 |
| 20110032672 | Memory Heat Sink System - A memory heat sink system includes a base comprising a first side and a second side, wherein the first side is oriented substantially perpendicularly to the second side. A plurality of convective heat transfer members extend from the first side. At least one conductive liquid cooling coupling surface located on the second side. | 02-10-2011 |
| 20110038120 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 02-17-2011 |
| 20110058330 | COMPUTER CHASSIS - A computer chassis is provided. The computer chassis includes a housing having a first closed compartment with a first heat sink having a first heat dissipating surface formed on one side of the first closed compartment; and a second closed compartment having a second heat sink with a second heat dissipating surface formed on one side of the second closed compartment. The first and second compartments are substantially isolated from air flow within the housing. The housing, the first closed compartment and the second closed compartment are configured to define an air passage way between the housing, the first heat dissipating surface and the second heat dissipating surface. This air passage way forms a chimney effect that aids in cooling and promotes natural air convection. | 03-10-2011 |
| 20110063794 | COMPUTER WITH HEAT DISSIPATION - A computer includes a circuit board, a heat dissipation module for facilitating dissipation of heat from the computer, and a housing for receiving the circuit board and the heat dissipation module. The heat dissipation module includes a fan and a motor. The motor is for supporting and driving the fan. The motor is electrically connected to the circuit board and directly set on the housing. | 03-17-2011 |
| 20110075353 | LIQUID SUBMERSION COOLING SYSTEM - A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling; heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device, such as a fan can be used to blow air across the heat exchanger to increase heat transfer. | 03-31-2011 |
| 20110085296 | Cooling System For A Computer Blade - A cooling system for a computer blade is disclosed. The cooling system comprises a main printed circuit (PC) board with at least one component mounted on a top side of the main PC board. A heat transfer plate is located at the first end of the main PC board. An airflow divider is mounted on, and is perpendicular with, the top side of the main PC board. The airflow divider runs in an axis generally parallel with the first side of the main PC board. A lid is coupled to the main PC board thereby enclosing the main PC board, the heat transfer plate and the airflow divider. The lid encloses a first airflow channel running along the first side of the main PC board and a second airflow channel running along the second side of the main PC board. A fan is located on top side of the main PC board in the first airflow channel. The fan is configured to re-circulate air from the second airflow channel through the first airflow channel, past the heat transfer plate, and then back into the second airflow channel. | 04-14-2011 |
| 20110090641 | COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT - A computer system includes a chassis, a motherboard, a heat sink and an airflow guiding duct. The chassis includes a chassis bottom wall, a first chassis sidewall, and a second chassis sidewall. The first chassis sidewall defines a first ventilation hole. The second chassis sidewall defines a second ventilation hole. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The airflow guiding duct is configured to guide airflow flowing from the second ventilation to the first ventilation hole. A fan is received inside the airflow guiding duct. | 04-21-2011 |
| 20110110029 | Dedicated Air Inlets And Outlets For Computer Chassis Chambers - A computer chassis comprises a plurality of chambers. Each of the chambers comprises a hardware group, an aft inlet exposed to air external to the chassis and dedicated to the chamber, and an air outlet exposed to air external to the chassis and dedicated to the chamber. Airflow between the air net and the air outlet cools the hardware group. | 05-12-2011 |
| 20110134603 | COMPUTER SYSTEM WITH DUCT - A computer system includes a chassis, a motherboard, a heat sink, a duct and a fan. The chassis includes a chassis bottom wall. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The duct includes a guiding portion and a latch portion located on the guiding portion. The latch portion is secured to the chassis bottom wall. The guiding portion is adjacent to the heat sink to direct airflow to the heat sink. The fan is secured on the latch portion of the duct. The guiding portion of the duct is positioned between the heat sink and the fan. | 06-09-2011 |
| 20110134604 | CASE AND RACK SYSTEM FOR LIQUID SUBMERSION COOLING OF ELECTRONIC DEVICES CONNECTED IN AN ARRAY - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 06-09-2011 |
| 20110141686 | HEAT DISSIPATION APPARATUS FOR ELECTRONIC DEVICE - A heat dissipation apparatus adapted for simultaneously cooling a first electronic component and a second electronic component includes a heat sink adapted for being thermally attached to the first electronic component, a fan duct receiving the heat sink therein and a fan mounted to the fan duct. The fan duct comprises a top plate and two side plates extending from two opposite sides of the top plate. A receiving space is defined in the fan duct between the top plate and a top of the heat sink and adapted for receiving the second electronic component. Airflow from the fan is guided by the fan duct to blow towards the heat sink and the second electronic component, simultaneously. | 06-16-2011 |
| 20110149504 | FAN CASING INTEGRATED HEAT SPREADER FOR ACTIVE COOLING OF COMPUTING SYSTEM SKINS - In one embodiment, a fan casing may have a direct thermal connection with a heat spreader. The fan casing might be used in an active cooling system of a mobile computing device such as a notebook computer to reduce and/or eliminate the occurrence of thermal hot spots on the skin of the device. In one example, the heat spreader extends from the enclosure and is disposed between a heat source and the skin of the device. | 06-23-2011 |
| 20110149505 | IN-LINE MEMORY MODULE COOLING SYSTEM - A system to aid in cooling an in-line memory module may include a thermal interface material adjacent the in-line memory module. The system may also include a heat spreader adjacent the thermal interface material. The system may further include a cold-plate adjacent the heat spreader, the cold-plate, heat spreader, and thermal interface material to aid in cooling the in-line memory module. | 06-23-2011 |
| 20110157814 | NOTEBOOK COMPUTER WITH THERMAL INSULATING LAYER - A notebook computer includes a bottom plate, a top cover, and an electronic component. The bottom plate and the top cover cooperatively define a receiving space therebetween. The electronic component is received in the receiving space and faces the top cover. A thermal insulating layer is attached to an inner surface of the top cover and located directly above the electronic component. | 06-30-2011 |
| 20110176273 | System and Method for Cooling Information Handling Resources - Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid. | 07-21-2011 |
| 20110222236 | PORTABLE COMPUTER WITH HEAT DISSIPATION UNIT - A portable computer includes a shell, a printed circuit board in the shell, a heat generating element, a heat conducting sheet, a primary heat dissipation unit, a subsidiary heat dissipation unit, and a heat-transfer unit. The heat generating element is electronically connected on the printed circuit board. The heat conducting sheet is positioned on the heat generating element. The heat-transfer unit includes a heat-transfer member and a drive unit. The heat-transfer member connects to the heat conducting sheet. The drive unit moves the heat-transfer member to connect with the primary heat dissipation unit or the subsidiary heat dissipation unit. | 09-15-2011 |
| 20110228470 | INDUSTRIAL COMPUTER CAPABLE OF DUST PREVENTION AND RESISTANT TO VIBRATION - A dust-free and anti-vibration industrial computer. The industrial computer has a case sealed from the outside, a heat diffusion fin assembly mounted on the outer surface of the case, and a circulation pipe for allowing a heat generating component and at least a heat diffusion fin to be communicated with each other, or a heat pipe for transferring heat between the heat generating component and the heat diffusion fin. The heat generating component can be cooled in a state in which dust is prevented from being produced within the case. | 09-22-2011 |
| 20110267768 | EXTRUDED SERVER CASE - A liquid submersion cooled computer that includes a seamless, extruded main body used to form a liquid-tight case holding a cooling liquid that submerges components of the computer. By forming the main body as a seamless extrusion, the number of possible leakage paths from the resulting liquid-tight case is reduced. No seams are provided on the main body, and there are no openings through the walls of the main body, so liquid cannot leakage through the main body. Any leakage paths are limited to joints between the main body and end walls which are sealingly attached to the main body to form the liquid-tight case. | 11-03-2011 |
| 20110279968 | HEAT SINK HAVING AUTO SWITCHING FUNCTION, HEAT SINK SYSTEM AND HEAT SINKING METHOD FOR THE SAME - A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device. | 11-17-2011 |
| 20110279969 | MODULAR THERMAL MANAGEMENT SYSTEM FOR GRAPHICS PROCESSING UNITS - A modular thermal management system that allows one or a few heat sink and fan combinations to transfer heat away from a heat zone of a variety of graphics processing cards is provided. The thermal management system includes a mounting bracket configured to attach to the graphics processing card in thermal contact with the heat zone, the mounting bracket having a first opening that corresponds to a processor in the heat zone, a heat sink configured to attach to the mounting bracket, wherein the heat sink overlies the first opening and is in thermal contact with at least a portion of the processor through the first opening, and a fan configured to attach to the mounting bracket adjacent the heat sink. | 11-17-2011 |
| 20110279970 | ELECTRONIC DEVICE WITH THERMAL INSULATION MEMBER FOR HEAT SINK - An exemplary electronic device includes an enclosure, two electronic components received in the enclosure, a heat sink, and a thermal insulation member. The enclosure defines a receiving space for receiving the electronic components and the thermal insulation member. Two ventilating holes are defined in the enclosure. The thermal insulating member defines a heat dissipating passage therein, communicating with the exterior via the ventilating holes of the enclosure. The heat sink is received in the heat dissipating passage and thermally coupled to the electronic components for dissipating heat from the electronic components. The heat dissipating passage is substantially thermally insulated from the part of the receiving space of the enclosure having the electronic components by the thermal insulation member. | 11-17-2011 |
| 20110286175 | LIQUID COOLANT CONDUIT SECURED IN AN UNUSED SOCKET FOR MEMORY MODULE COOLING - An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit. | 11-24-2011 |
| 20110292593 | INDEPENDENTLY OPERABLE IONIC AIR MOVING DEVICES FOR ZONAL CONTROL OF AIR FLOW THROUGH A CHASSIS - Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones. | 12-01-2011 |
| 20110304976 | COOLING ARRANGEMENT FOR SMALL FORM FACTOR DESKTOP COMPUTER - A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger. | 12-15-2011 |
| 20110304977 | ELECTRONIC DEVICE ENCLOSURE WITH ANTI-EMI HOLES - An electronic device enclosure for suppressing Electro-Magnetic Interference (EMI) includes a first plate defined on a first plane, a second plate defined on a second plane and a number of polygonal holes defined in the first plate at an angle of orientation. The second plane is substantially perpendicular to the first plane. The angle of orientation of the number of polygonal holes in the first plate is set according to a number of maximum dimensions in a direction substantially perpendicular to the second plane. The angle of orientation is defined such that there are a minimum number of maximum dimensions. | 12-15-2011 |
| 20110304978 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a bottom wall and a sidewall. A motherboard is mounted on the bottom wall. The motherboard includes a heat generation apparatus and a heat sink attached thereon. The heat sink is in contact with the heat generation apparatus, and is configured to transmit heat from the heat generation apparatus to the heat sink. The sidewall defines a number of vents, which are in alignment with the heat sink. A fan is mounted between the sidewall and the heat sink with an air inlet side of the fan directed towards the heat sink and an air outlet side of the fan directed towards the plurality of vents. | 12-15-2011 |
| 20110304979 | COOLING APPARATUS - A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket. | 12-15-2011 |
| 20110304980 | Ruggedized Computer Capable of Operating in High Temperature Environments - Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment. | 12-15-2011 |
| 20120008275 | AIR CONDITIONING SYSTEMS FOR COMPUTER SYSTEMS AND ASSOCIATED METHODS - Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet. | 01-12-2012 |
| 20120020013 | AIR DUCT AND COMPUTER SYSTEM WITH THE AIR DUCT - An air duct includes a top panel and a blocking member rotatable secured to the top panel. A through hole is defined in the top panel, and a pair of clipping portions are located an edge of the through hole. The blocking member includes an operating portion and a blocking portion connected to the operating portion. The operating portion is located on an outside of the top panel, and the blocking portion is located on an inside of the top panel. The operating portion of the blocking member is passed through a bottom surface of the top panel through the through hole, extends to a top surface of the top panel, and engaged with the pair of clipping portions. | 01-26-2012 |
| 20120026676 | DATA CENTER - A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, and a fan mounted in the housing near the cooling units. When the data center is operating, heated air is driven to the cooling units by fans, and then the cooled air is driven to enter the server modules. | 02-02-2012 |
| 20120039035 | SERVER SYSTEM AND HEAT DISSIPATION DEVICE THEREOF - An exemplary server system includes a server cabinet, multiple servers, and a heat dissipation module. The server cabinet includes a rack, a front door and a rear plate. The front door and the rear plate are hinged on front and rear sides of the rack, respectively. The servers are arranged in the server cabinet along a lateral axis of the server cabinet. The heat dissipation device includes a fan module mounted on the servers and a dissipating module arranged on the fan module. The fan module is configured for drawing airflow along an upward axis in the server cabinet. | 02-16-2012 |
| 20120039036 | THERMAL BUS BAR FOR A BLADE ENCLOSURE - A cooling system for a blade enclosure is disclosed. The cooling system comprises a thermal bus bar (TBB) | 02-16-2012 |
| 20120044630 | VIDEO/AUDIO COMPUTER DISPLAY PROCESSOR - A video/audio computer display processor comprising a chassis, a video processor, a graphics card, and a ventilation duct. The chassis has first, second and third fans mounted therein and the video processor has a processor heatsink mounted thereon, wherein the processor heatsink has fins extending therefrom. The first fan is mounted on the processor heatsink and the second fan is positioned to direct an airflow parallel to and along the fins of the processor heatsink. The graphics card has a graphics card heatsink mounted thereon, and the graphics card heatsink has fins extending therefrom. The ventilation duct extends along a side of the chassis and has an opening therein adjacent the graphics card heatsink. The third fan is positioned to direct airflow through the ventilation duct, out through the opening and parallel to and along the fins of the graphics card heatsink. | 02-23-2012 |
| 20120044631 | SERVER SYSTEM WITH HEAT DISSIPATION DEVICE - An exemplary server system includes a server cabinet, racks arranged in the server cabinet, servers mounted on the racks, and a heat dissipation device. The heat dissipation device includes a heat exchanger arranged over the racks, a first fan module arranged under the racks for drawing cooling air from the heat exchanger to the servers to exchange heat, and a second fan module including drawing fans respectively arranged on the racks for drawing up heated air from the servers to the heat exchanger. | 02-23-2012 |
| 20120044632 | SERVER SYSTEM AND HEAT DISSIPATION DEVICE THEREOF - An exemplary server system includes a server cabinet, multiple racks arranged in the server cabinet, multiple servers mounted on the racks, and a heat dissipation device for cooling the servers. The heat dissipation device includes a fan module and a dissipating module. The fan module is arranged over the racks for generating downwards airflow across the servers to exchange heat with the servers. The dissipating module is arranged over the racks to exchange heat with the airflow after the airflow passes the servers. | 02-23-2012 |
| 20120044633 | EXTRUDED SERVER CASE - A liquid submersion cooled computer that includes a seamless, extruded main body used to form a liquid-tight case holding a cooling liquid that submerges components of the computer. By forming the main body as a seamless extrusion, the number of possible leakage paths from the resulting liquid-tight case is reduced. No seams are provided on the main body, and there are no openings through the walls of the main body, so liquid cannot leakage through the main body. Any leakage paths are limited to joints between the main body and end walls which are sealingly attached to the main body to form the liquid-tight case. | 02-23-2012 |
| 20120057296 | HOST APPARATUS WITH WATERPROOF FUNCTION AND HEAT DISSIPATION MODULE THEREOF - A heat dissipation module is suitable for a host apparatus. The heat dissipation module of the present invention has a shell body. The shell body has a heat conductive side and an air outlet-inlet side. The air outlet-inlet side has an air outlet and an air inlet. A contact sink is installed on the heat conductive side for contacting a position where needs heat dissipation in the host apparatus. In addition, there is a heat conductive tube, a heat dissipation fin and a waterproof fan disposed in the shell body. Thus, heat energy conducted from the contact sink is conducted to the heat dissipation. Furthermore, the waterproof fan exhausts the air, which passes through the heat dissipation, out of the shell body via the air outlet, so as to release heat generated by the system of the host apparatus. | 03-08-2012 |
| 20120063082 | DATA CENTER - A data center includes a housing and a number of server module assemblies received in the housing. Airflow interspaces are formed between neighboring server module assemblies, and between the two outmost server module assemblies and corresponding sidewalls of the housing. The airflow interspaces are alternately used for cold aisles and hot aisles. An inside of each server module is communicated with one of the hot aisles and one of the cold aisles at opposite sides of the server module. A number of cooling units are installed in the housing over the server module assemblies. A number of fans are installed in the housing to draw hot air from the hot aisles to flow through the corresponding cooling units to be cooled, and the cooled air flow into the corresponding cold aisles, thereby creating air differences in air pressure between the cold aisles and the hot aisles. | 03-15-2012 |
| 20120063083 | SERVER SYSTEM WITH HEAT DISSIPATING DEVICE - An exemplary server system includes a server cabinet, two rows of racks arranged in the server cabinet, a number of servers mounted in the racks and a heat dissipating device. The server cabinet includes two side plates parallel to each other. The servers of each row are evenly distributed between the side plates. A channel is defined between the two rows of racks. The heat dissipating device includes an air conditioner arranged over the racks for generating cooling air and an air guiding mechanism. The air conditioner defines a number of apertures facing the passage. The guiding mechanism includes a number of tubes received in the passage and respectively coupled to the apertures of the air conditioner. Each of the tubes defines a number of air outlets for exhausting the cooling air towards the servers. | 03-15-2012 |
| 20120087086 | Apparatus And Method For Cooling Of A Substantially Closed Space With Recirculation Air - The invention relates to an apparatus for cooling of a substantially closed space, in particular a data centre, where continuous or intermittent heat is produced by at least one heat source, with recirculation air, comprising a heat exchanger with a first set of ducts and a second set of ducts, each set of ducts having an in- and outlet, wherein the in- and outlet of the first set of ducts are connected to the space to form a first recirculation path, and the in- and outlet of the second set of ducts are connected to an environment of the space to form a second recirculation path, and wherein the heat exchanger is a plate heat exchanger. | 04-12-2012 |
| 20120106070 | FIELD SERVICEABLE CPU MODULE - A computer apparatus comprising a computer chassis, a baseboard component disposed within the computer chassis and a computer module electronically coupled to the baseboard component is disclosed. A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, wherein the heat sink assembly forms part of an integral exterior structure of the computer chassis. The chassis may comprise a compartment disposed through an exterior surface of the chassis for receiving the computer module heat sink assembly in mated fashion. The computer module heat sink assembly forms a water and air tight seal with the internal compartment of the chassis in mated fashion. | 05-03-2012 |
| 20120106071 | FLUID COOLING SYSTEM AND ASSOCIATED FITTING ASSEMBLY FOR ELECTRONIC COMPONENT - A fluid cooling system and associated fitting assembly for an electronic component such as a multi-processor computer offer easy and reliable connect and disconnect operations while doing so in a minimum amount of available space without damaging associated components of an electronic device, computer or cooling system. One exemplary fitting assembly includes a manifold mount with a port that is in fluid communication with a manifold tube. A fitting is sized and configured to mate with the port and is in fluid communication with associated cooling tubes of a cold plate. A latch is pivotally mounted to the manifold mount for movement to and between a first position in which the latch secures the fitting to the manifold mount and a second position in which the fitting is capable of being disconnected from the manifold mount. | 05-03-2012 |
| 20120113584 | COOLING SYSTEM FOR SERVER AND COOLING METHOD FOR ELECTRONIC APPARATUS - A cooling system for a server includes at least one radiator and at least one cooling plate that are installed in a server cabinet, a cooling assembly, a storage tank, and a heat exchanger. The cooling assembly is connected to the radiator, and is carried with a first cooling fluid therein. The storage tank is connected to the cooling plate, and is carried with a second cooling fluid therein. The first cooling fluid enters the heat exchanger through the radiator, and the second cooling fluid enters the heat exchanger through the cooling plate. The first cooling fluid and the second cooling fluid perform heat exchange in the heat exchanger, so as to reduce the temperature of the second cooling fluid, thus reducing the required energy enabling the second cooling fluid to return to a set temperature. | 05-10-2012 |
| 20120113585 | BLOWER FAN FOR LOW PROFILE ENVIRONMENT - According to some embodiments, a method and system are provided to receive an airflow at a blower fan via an axial fan, and expel the airflow via a blower fan. The blower fan comprises a hub associated with an axis of rotation, and the axial fan comprises the hub. | 05-10-2012 |
| 20120113586 | COLD PLATE HAVING BLADES THAT INTERLEAVE WITH MEMORY MODULES - A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate. | 05-10-2012 |
| 20120120594 | HEAT DISSIPATING CASING STRUCTURE FOR MAIN BOARD - The heat dissipating casing structure contains a metallic casing, a metallic heat conducting block, and a heat conducting paste. The heat conducting block is positioned inside and attached to the casing. The heat conducting paste is disposed on the heat conducting block. When a main board is positioned inside the casing, the heat conducting paste is behind a heat source of the main board and is attached to the main board. The heat produced by the heat source therefore could be conducted to the casing through the heat conducting paste and the heat conducting block. By the large exposure area of the casing to the outside atmosphere, the heat could be easily dissipated, even after power is turned off. | 05-17-2012 |
| 20120120595 | COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT - A computer system includes a computer case and a heat dissipating device. The heat dissipating device includes a heat sink, a fan and an airflow guiding duct. The fan is attached to the heat sink, and the airflow guiding duct covers on the fan. The airflow guiding duct includes a bottom panel, two side panels and a blocking panel. Each side panel includes a first panel and a second panel connected to the first panel. The blocking panel is slanted and connected to the bottom panel and the second panel of each side panel, the blocking panel is adapted to allow the air to pass through the airflow guiding duct, and an inward direction of the airflows generated by the fan is substantially perpendicular or oblique to an outward direction of the airflow. | 05-17-2012 |
| 20120127654 | COMPUTER SYSTEM AND HEAT SINK - A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space. | 05-24-2012 |
| 20120127655 | SERVER CABINET - A server cabinet is provided, which not only utilizes a first cooling fluid to flow through a heat exchanger of the cabinet to lower the temperature of entrances of fan modules without wasting additional energy, but also utilizes a cooling fluid pipe set to send a second cooling fluid to heat exchange apparatuses in a server to lower the temperature of heating elements inside the cabinet. The server cabinet could lower the heat dissipating loading of the heat exchanger of the cabinet and achieve the efficiency of saving energy. | 05-24-2012 |
| 20120127656 | DATA CENTER - A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum. | 05-24-2012 |
| 20120134105 | DATA CENTER - A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, a fan mounted in the housing near the cooling units, and a number of directing plates arranged in the housing and spaced from the inner surfaces of the housing. When the data center is operating, heated air from the server modules is driven into the apace between the inner surfaces of the housing and the directing plates and then to the cooling units by the fan, and then the cooled air is driven to enter the server modules. | 05-31-2012 |
| 20120134106 | SERVER - A server including a rack, chassis, a power module, first copper columns, and second copper columns is provided. The rack has a front end and an opposite back end. The chassis are disposed in the rack and suitable for being pulled out from the front end. Each chassis contains a motherboard module. The power module is disposed in the rack. The first copper columns are fixed on the rack, electrically connected to the power module, and are suitable for electrically connecting an external power supply. The second copper columns are fixed on the rack and electrically connected to the power module and the motherboard modules. A high voltage from the external power supply is transmitted to the power module via the first copper columns. The power module converts the high voltage into a low voltage and transmits the low voltage to the motherboard modules via the second copper columns. | 05-31-2012 |
| 20120134107 | CONTAINER DATA CENTER - A container data center is disclosed in the present invention, relating to the field of data centers. The container data center includes: a container box, in which the inside of the box is divided into an equipment compartment, a power supply and distribution compartment and a water chilling set compartment; doors set in the box; a power supply equipment installed in the power supply and distribution compartment; an electronic equipment and a water chilling terminal installed in the equipment compartment; a water chilling set installed in the water chilling set compartment, in which the water chilling set is in communication with the water chilling terminal to provide cold water for the water chilling terminal. | 05-31-2012 |
| 20120140403 | COOLING HEAT-GENERATING ELECTRONICS - A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets. | 06-07-2012 |
| 20120140404 | CONTROLLING MINIMUM AIR INLET TEMPERATURE USING WASTE HEAT - An electronic device has a ventilation system with an inlet section that receives inlet air that travels past components of the computing device to be cooled and exits at an outlet section. The air carries heat away from the components. A liquid heat transfer system captures heat generated by the components and transfers the captured heat to the inlet section of the ventilation system to warm the inlet air before it travels past the components to be cooled. | 06-07-2012 |
| 20120140405 | HEAT DISSIPATION SYSTEM - A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes. | 06-07-2012 |
| 20120170206 | ELECTRONIC DEVICE HAVING HEAT DISSIPATION AIRFLOW PATH - An exemplary electronic device includes a cover, a motherboard and a driving module both disposed at an inner side of the cover, an electronic component fixed on the motherboard, and a fan duct mounted on the motherboard and covering the electronic component. The driving module has a rotating shaft for supportively driving an optical disk rotating. The fan duct guides hot air therein toward the driving module. | 07-05-2012 |
| 20120170207 | ELECTRONIC DEVICE - An electronic device includes a display, a cover, and a blocking board. The display defines a rear side. A motherboard and a first cooling assembly are secured to the rear side of the display, and a second cooling assembly is secured to the motherboard. The cover is secured to the rear side for coving the rear side, and defines a number of air inlets and air outlets. The blocking board is secured to a side of the motherboard, and located between the first cooling assembly and the second cooling assembly. A first air path is defined by the air inlet, the display, the first cooling assembly, and the air outlet, and a second air path is defined by the air inlet, the motherboard, the second cooling assembly, and the air outlet. The first air path and the second air path are divided by the blocking board. | 07-05-2012 |
| 20120176745 | Dual Mode Portable Information Handling System Cooling - Liquid cooling is selectively enabled at a portable information handling system to provide enhanced processing capabilities when needed or desired. A liquid cooling cold plate conducts thermal energy from a processing component heat pipe or heat sink to a liquid pumped from external to the information handling system housing. The pump operates with power provided from an AC/DC adapter of the information handling system or power provided from an interface with the information handling system, such as a USB port and cable. Alternatively, liquid cooling is included in a cradle to automatically engage with the information handling system is coupled to the cradle. | 07-12-2012 |
| 20120188706 | SYSTEMS AND ASSOCIATED METHODS FOR CONTROLLABLY COOLING COMPUTER COMPONENTS - Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer. | 07-26-2012 |
| 20120194995 | MOBILE COMPUTING APPARATUS - A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect. | 08-02-2012 |
| 20120194996 | Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems - A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air. | 08-02-2012 |
| 20120212901 | SYSTEM AND METHOD FOR A MODULAR FLUID HANDLING SYSTEM WITH MODES IN A MODULAR DATA CENTER - In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure. | 08-23-2012 |
| 20120212902 | ELECTRONIC APPARATUS - According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block. | 08-23-2012 |
| 20120300392 | HEAT MANAGEMENT IN AN ABOVE MOTHERBOARD INTERPOSER WITH PERIPHERAL CIRCUITS - A computing device has a circuit substrate having a socket, a main processor inserted into the socket, an interposer substrate inserted between the socket and the main processor, the circuit substrate, the socket and the interposer substrate being electrically connected, at least one peripheral circuit on the interposer substrate, and a heat sink thermally coupled to the peripheral circuit. | 11-29-2012 |
| 20120327589 | COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT - A computer includes a computer case and an airflow guiding duct. The computer case includes a rear plate with a number of air outlets. A bracket and a first fan are received in the case. The bracket receives a number of first heat generating components and includes a mounting plate with a number of through holes. A heat sink and a second fan are received in the case, and the second fan is attached to the heat sink for absorbing heat generated by a second heat generating component. The duct defines an hole and an opening. The through holes, the first fan, the hole, and the air outlets define a first airflow passage for cooling the first heat generating components, and the second fan, the opening, the hole, and the air outlets define a second airflow passage for cooling the second heat generating component. | 12-27-2012 |
| 20120327590 | MODULAR ABSORPTION HEAT SINK DEVICES FOR PASSIVE COOLING OF SERVERS AND OTHER ELECTRONICS - A passive heat sink for cooling an electronic component such as a high-performance processor. The heat sink includes a shell with a surface that is positionable adjacent a heat generating surface of the electronic component. The shell includes a heat exchanger portion with cooling fins extending outward and positioned in a fan-provided airflow. A generator compartment is provided within the shell with a generator vessel for containing an absorbent, and the generator compartment is maintained at a pressure lower than ambient. The generator compartment conducts heat away from the electronic component to the absorbent in the generator vessel. An absorber compartment, at a pressure lower than the generator compartment, is provided within the shell above the generator compartment, and, in use, an absorption refrigeration cycle contained within the shell is activated by heat from the electronic component. A bubble pump moves absorbent from the generator compartment to the absorber compartment. | 12-27-2012 |
| 20130003292 | CONSOLIDATED THERMAL MODULE - A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed. | 01-03-2013 |
| 20130003293 | COMPUTER SYSTEM - A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through. | 01-03-2013 |
| 20130010422 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
| 20130010423 | Evaporative Induction Cooling - A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone. | 01-10-2013 |
| 20130021746 | DATA CENTER COOLING WITH AN AIR-SIDE ECONOMIZER AND LIQUID-COOLED ELECTRONICS RACK(S) - A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air. | 01-24-2013 |
| 20130021747 | ALL-IN-ONE COMPUTER - An all-in-one computer includes a display, a chassis mounted to the display, a support connected to the chassis, and a heat dissipation assembly. A number of electronic components are received in the chassis. The heat dissipation assembly includes a heat sink mounted to the support, a fan mounted to the support and aligned with the heat sink, and a number of heat pipes extending from the heat sink and attached to the electronic components. | 01-24-2013 |
| 20130033816 | COMPUTER WITH HEAT DISSIPATION SYSTEM - A computer includes a backplane, an enclosure, a motherboard, a shielding cover, a guiding plate, and a fan. The enclosure covers on the backplane. The motherboard is located on the backplane. The motherboard includes a plurality of heat generating elements. A shielding cover covers the motherboard and located in the enclosure. The shielding space is defined in the shielding cover. The guiding plate is located on the backplane adjacent to the shielding cover. A heat dissipating space is defined between the shielding cover and the guiding plate. The heat dissipating space communicates with the shielding space. The fan is located in the heat dissipating space. The fan is adapted to generate airflow from the shielding space and is adapted to dissipate the airflow through the heat dissipating space. | 02-07-2013 |
| 20130063886 | ELECTRONIC DEVICE USING HEAT DISSIPATION ASSEMBLY - An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink. | 03-14-2013 |
| 20130077232 | THERMAL MANAGEMENT INFRASTRUCTURE FOR IT EQUIPMENT IN A CABINET - The present invention attempts to reduce the thermal resistance with the use of heat-transfer devices (e.g., vapor chambers) placed directly on the heat-generating components in IT equipment and the integration of a cold plate within the cabinet. In some embodiments, the present invention is a thermal management system comprising a cabinet-side thermal management system and a server-side thermal management system using moveable thermal components. | 03-28-2013 |
| 20130094139 | COMBINED POWER AND COOLING RACK SUPPORTING AN ELECTRONICS RACK(S) - A combined power and cooling apparatus is provided facilitating powering and cooling one or more electronics racks, which are distinct from the power and cooling apparatus. The power and cooling apparatus includes a frame, one or more bulk power assemblies associated with the frame, and one or more heat exchange assemblies associated with the frame. The one or more bulk power assemblies are configured to provide power to the one or more electronics racks, and the one or more heat exchange assemblies are configured to cool system coolant provided to the one or more electronics racks. Heat is transferred by the one or more heat exchange assemblies from the system coolant to a facility coolant. In operation, the power and cooling apparatus is coupled to provide both power and cooling to the one or more electronics racks. | 04-18-2013 |
| 20130107447 | MULTI-RACK ASSEMBLY WITH SHARED COOLING APPARATUS | 05-02-2013 |
| 20130107448 | Modular Data Center Cooling | 05-02-2013 |
| 20130120930 | DYNAMIC VOLTAGE REFERENCE FOR SAMPLING DELTA BASED TEMPERATURE SENSOR - A system and method for measuring integrated circuit (IC) temperature. An integrated circuit (IC) includes a thermal sensor and data processing circuitry. The thermal sensor utilizes switched currents provided to a reference diode and a thermal diode. The ratios of the currents provided to each of these diodes may be chosen to provide a given delta value between the resulting sampled diode voltages. At a later time, a different ratio of currents may be provided to each of these diodes to provide a second given delta value between the resulting sampled diode voltages. A differential amplifier within the data processing circuitry may receive the analog sampled voltages and determine the delta values. Other components within the data processing circuitry may at least digitize and store one or both of the delta values. A difference between the digitized delta values may calculated and used to determine an IC temperature digitized code. | 05-16-2013 |
| 20130155606 | COOLING DEVICE AND ELECTRONIC APPARATUS USING SAME - To improve a local cooling effect even when the rearrangement of devices is very difficult. A cooling device | 06-20-2013 |
| 20130163192 | Energy Center - Systems are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load. | 06-27-2013 |
| 20130163193 | Method of Operating an Energy Center - Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load. | 06-27-2013 |
| 20130170133 | HEAT DISSIPATING APPARATUS - A heat dissipating apparatus includes a base, a first fin assembly, a second fin assembly, and at least one heat pipe. The base includes a top surface and a bottom surface, the bottom surface makes contact with an electronic heat-generating component. The first fin assembly is disposed on the top surface of the base. The second fin assembly is separate from the first fin assembly. The at least one heat pipe includes a first contacting portion in contact with the base and a second contacting portion in contact with the second fin assembly. | 07-04-2013 |
| 20130176679 | Cooling System for Electronic Components - Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages. | 07-11-2013 |
| 20130194744 | THERMAL CONTROL USING AN ADD-ON MODULE - An exemplary embodiment of the present invention includes an add-on module. The add-on module is in contact with a base cooling plate that is connected to a thermal energy transport element and at least one thermal energy generating device when the cooling capacity of the base cooling plate is exceeded by the rating of the thermal energy generating device. | 08-01-2013 |
| 20130194745 | LIQUID-COOLED MEMORY SYSTEM HAVING ONE COOLING PIPE PER PAIR OF DIMMS - Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate. | 08-01-2013 |
| 20130201624 | HEAT DISSIPATING SYSTEM - A heat dissipating system includes an enclosure body, a plurality of heat generating elements, and a heat dissipating module. The enclosure body includes a mounting panel. The mounting panel defines a mounting opening. The plurality of heat generating elements is mounted to an inner side of the mounting panel and covers the mounting opening. The heat dissipating module includes a base and a plurality of fins extending from the base. The base is mounted to an outer side of the mounting panel to cover the mounting opening and to contact the plurality of heat generating elements. | 08-08-2013 |
| 20130215570 | ELECTRONIC APPARATUS WITH HEAT DISSIPATION MODULE - An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel. | 08-22-2013 |
| 20130242502 | ACTIVE COOLING FAN - Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, heat generated by the processor may be expelled from the computing device using a fan. The fan may include an air intake over an impeller or blades which move air through an impeller portion and an air duct and out of a housing of the fan. The components of the fan may be configured in the housing to increase the area of an air intake which is not obstructed by features such as keyboards or displays in the computing device. | 09-19-2013 |
| 20130265712 | SERVER HEAT DISSIPATING ASSEMBLY - A server heat dissipating assembly includes a server chassis, a heat dissipating unit, and at least one connecting unit. Several electronic components are mounted inside the server chassis, the server chassis defines a plurality of holes corresponding in location to each of the several electronic components. The heat dissipating unit includes several connecting ports and an exhaust fan. The connecting unit is connected to at least one hole of the server chassis and at least one connecting port of the heat dissipating unit, the exhaust fan exhausts the heat from the server chassis through the connecting unit. | 10-10-2013 |
| 20130279111 | BACKPLANE DESIGN FOR MINIATURE CONFIGURABLE COMMUNICATIONS DATA CENTER - A ruggedized communications data center is provided. The ruggedized communications data center includes a ruggedized enclosure having a main body. The ruggedized enclosure includes a secured sealed access cover affixed to the main body, a backplane support structure within the main body, and a backplane coupled to the backplane support structure within the main body. The backplane includes a plurality of connectors to connect with a plurality of cards including at least one connector to connect to a power supply card, at least one connector to connect to a switch matrix card, and at least one connector to connect to a module card. The backplane also includes a first plurality of electrical connections to electrically connect a power supply card with a switch matrix card and a module card and a second plurality of electrical connections to electrically connect a switch matrix card with a module card. | 10-24-2013 |
| 20130286580 | HEAT DISSIPATION ASSEMBLY AND SERVER USING THE SAME - A heat dissipation assembly includes a housing, a number of fans, and an exhaust apparatus. The housing defines a receiving groove and an opening intercommunicating with the receiving groove. The fan is received in the receiving groove and is used for heat dissipation. The exhaust apparatus is received in the receiving groove and is positioned adjacent to the opening. The exhaust apparatus draws airflow to form an air partition, the air partition prevents an airflow generated by the fans from going out of the housing through the opening. | 10-31-2013 |
| 20130301212 | HEAT DISSIPATING MODULE AND COMPUTER USING SAME - A heat dissipating module includes a heat sink and an aerofoil deflector above the heat sink. The heat sink has an upper surface corresponding to the camber of the deflector, to increase the speed and efficiency of a cooling airflow passing therethrough, the airflow generated by a fan. | 11-14-2013 |
| 20130301213 | METHOD AND AN APPARATUS FOR COOLING A COMPUTER - A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device. | 11-14-2013 |
| 20130329356 | THERMAL DISSIPATION TECHNIQUES FOR MULTI-SENSORY ELECTROMECHANICAL PRODUCTS PACKAGED IN SEALED ENCLOSURES - In general, the disclosure is directed to sealed enclosures and devices that include enclosures for protecting enclosed heat sensitive components from the heat generated by enclosed heat producing components. Heat producing components within the enclosure may be placed to achieve uniform distribution of heat produced by the heat producing components, to optimize the dissipation of heat from the heat producing components to the enclosure, and to minimize the heat experienced by the heat sensitive components. The exterior of the enclosure may be designed to increase thermal dissipation and to protect against thermal radiation. | 12-12-2013 |
| 20130329357 | GASKETS FOR THERMAL DUCTING AROUND HEAT PIPES - The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly. | 12-12-2013 |
| 20130342992 | PASSIVE NOISE CANCELLATION FOR COMPUTER COOLING SYSTEMS - Methods and systems may provide for a computing system including an electrical component, a heat exchanger coupled to the electrical component, and a fan having a rotor with a plurality of blades, one or more inlet sides and one or more outlet sides disposed adjacent to the heat exchanger. The computing system may also include an obstruction disposed adjacent to at least one of the one or more inlet sides of the fan, wherein a tone to be generated by the obstruction reduces a tonal noise associated with the fan during operation. | 12-26-2013 |
| 20140016264 | HEAT DISSIPATION DEVICE - A heat dissipation device is mounted in a chassis of an information handling apparatus. The heat dissipation device includes a box and a cooling member, a first heat sink, a second heat sink, and a fan received in the box. A partitioning plate mounted inside the box. The box includes defines two air passage arranged at opposite sides of the partitioning plate. The cooling member is fixed to the partitioning plate. The first and second heat sinks are respectively received in the first and second air passages, and respectively abut cold and hot sides of the cooling member. The fan drives air to flow into the box through the first air passage to be cooled by the first heat sink. At the same time, the fan drives air to flow into the box through the second air passage to absorb heat from the second heat sink. | 01-16-2014 |
| 20140022724 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a motherboard has a first heat source and a second heat source thereon, a heat transmission module and a cooling fan. One terminal of the heat transmission module contacts the first heat source. The heat transmission module transmits heat from the first heat source to another terminal of the heat transmission module. The cooling fan has a first air inlet opening, a first air outlet opening and a second air outlet opening. The first air outlet opening faces the another terminal of the heat transmission module. The second air outlet opening faces the second heat source. The cooling fan rotates and generates airflow that flows from the first air outlet opening to the another terminal of the heat transmission module. The cooling fan rotates and generates airflow that flows from the second air outlet opening to the second heat source. | 01-23-2014 |
| 20140029193 | COMPUTER SYSTEM COOLING USING AN EXTERNALLY-APPLIED FLUID CONDUIT - A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released. | 01-30-2014 |
| 20140043751 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 02-13-2014 |
| 20140043752 | COMPUTER BAY COOLING DEVICE AND COMPUTER EQUIPMENT COMPRISING SAME - A cooling device of a computer rack equipped with a back panel including an evacuation zone, toward the exterior of the rack, of air having circulated over electric power components arranged within the computer rack and a rear door in the thickness of which air cooling means is arranged. The cooling device also includes a supporting frame on which the rear door is mounted, molded to surround the air evacuation zone of the computer rack, and removable positioning means of the supporting frame against the back panel of the computer rack. | 02-13-2014 |
| 20140055947 | HEAT DISSIPATION DEVICE FOR A NOTEBOOK COMPUTER - A heat dissipation device for a notebook computer includes a heat dissipating plate and a bracket for supporting the heat dissipating plate. When the notebook computer is positioned on the heat dissipating plate, the notebook computer tends to slip towards the first side closest to the user rather than the second side away from the user, as the bracket makes the first side lower than the second side. Because a protrusion is provided on the bracket close to the first side, the tendency of slipping towards the first side is stopped by the protrusion, preventing the notebook from slipping off the heat dissipation device. This ensures the security of the notebook computer when it is used with the heat dissipation device. | 02-27-2014 |
| 20140063731 | ADJUSTABLE HEAT SINK ASSEMBLY - An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel. | 03-06-2014 |
| 20140063732 | PORTABLE COMPUTER HAVING HEAT DISSIPATION STRUCTURE - A portable computer having a heat dissipation structure includes a main body in which a heat generation device generating heat is arranged, wherein a sealed space that is sealed to prevent intrusion of external water and an exposed space into which external air is taken, a heat transfer unit connected to the heat generation device and extended to the exposed space in the sealing space of the main body and transferring the heat of the heat generation device to the exposed space, and a heat dissipation unit arranged in the exposed space of the main body and dissipating the heat transferred by the heat transfer unit. The intrusion of water into the main body may be prevented and simultaneously the heat generated by the heat generation devices may be efficiently dissipated. Thus, the portable computer may be used even in an inferior outdoor environment during rain. | 03-06-2014 |
| 20140071615 | COOLING HOST MODULE - A cooling host module is operable for providing cooling gas flow in a substantially isolated closed loop for a computing device. The computing device comprises a substantially vertical first face having an inlet portion comprising no more than about a lower third of a height of the first face for inlet gas flow and a substantially vertical second face opposite the first face for outlet gas flow. The cooling host module comprises: a heat exchanger adjacent to the second face of the computing device for cooling outlet gas flow; a gas flow path directing air exiting the heat exchanger beneath the computing unit; a gas moving device for moving gas in the gas flow path; and a vent towards distal end of the gas flow path for providing gas flow to the inlet portion of the first face of the computing device. | 03-13-2014 |
| 20140071616 | ELECTRONIC APPARATUS AND COOLING MODULE MOUNTED IN THAT ELECTRONIC APPARATUS - An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow. | 03-13-2014 |
| 20140071617 | COOLING HOST MODULE - A cooling host module is operable for providing cooling gas flow in a substantially isolated closed loop for a computing device. The computing device comprises a substantially vertical first face having an inlet portion comprising no more than about a lower third of a height of the first face for inlet gas flow and a substantially vertical second face opposite the first face for outlet gas flow. The cooling host module comprises: a heat exchanger adjacent to the second face of the computing device for cooling outlet gas flow; a gas flow path directing air exiting the heat exchanger beneath the computing unit; a gas moving device for moving gas in the gas flow path; and a vent towards distal end of the gas flow path for providing gas flow to the inlet portion of the first face of the computing device. | 03-13-2014 |
| 20140078668 | APPARATUS, SYSTEM, AND METHOD FOR CONFIGURING A SYSTEM OF ELECTRONIC CHASSIS - An example apparatus is provided and may comprise a housing, an electronic blade system, and a plurality of airflow management components. The housing may have an upper chamber and a lower chamber. The electronic blade system may be located between the upper chamber and the lower chamber. The plurality of airflow management components may be configured to be removable and to manage airflow in the housing. | 03-20-2014 |
| 20140078669 | Display Apparatus and Electronic Apparatus - An electronic apparatus comprises a case, a circuit board, a heat sink, a heat pipe and a fan. The case includes a first wall which is provided with an input unit for receiving an input operation and a top surface and a second wall which is opposed to the first wall. Both the heat sink and the circuit board are housed in the case, where the circuit board is mounted with a heat generation body. The heat pipe is configured to thermally connect the heat generation body and the heat sink while the fan includes an air discharge outlet which is directed to the heat sink. According to one embodiment, the first wall includes a slant portion which inclines with respect to the top surface and extends toward the second wall and is provided with a first air inlet, and the second wall includes a second air inlet. | 03-20-2014 |
| 20140085807 | SERVER SYSTEM - A server system includes a rack, a server disposed in the rack, an electronic device and a power supply disposed in the rack. The rack includes a first side and a second side opposite to each other, two first brackets, two second brackets and two lateral rails. Each first brackets, disposed at the first side, includes a heat-dissipation part. Each heat-dissipation part includes at least one ventilating perforation. The second brackets are disposed at the second side. The electronic device is disposed between the lateral rails and at the first side. The power supply is disposed between the two lateral rails and at the second side and includes a main body and at least one fan. The main body includes a plurality of through openings facing the ventilating perforations. The at least one fan draws airstreams from the ventilating perforations via the through openings. | 03-27-2014 |
| 20140085808 | SERVER SYSTEM AND SERVER THEREOF - A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes a chassis, a circuit board, a first heat source, a second heat source, a liquid cooling device, and a shielding cover. The circuit board is disposed on the chassis, and the first heat source and the second heat source are disposed on the circuit board. The liquid cooling device is thermally connected to the second heat source covered by the shielding cover. When the fan module is in operation, outside air is taken into the server by the fan module. The flow rate of an air flow passing by the first heat source is greater than that of another air flow passing by the second heat source capped by the shielding cover. | 03-27-2014 |
| 20140104783 | ELECTRONIC DEVICE WITH AIR GUIDING APPARATUS - An electronic device includes a chassis and an air guiding apparatus. The chassis includes a bottom wall, a first sidewall, a second sidewall, a first end wall, a second end wall, a circuit board mounted on the bottom wall, and a fan. The air guiding apparatus includes a flexible air guiding piece. The first and second end walls each define a number of vents. A chip is mounted on the circuit board. The fan is installed in the chassis adjacent to the vents of the second end wall. The air guiding apparatus is fixed to the first end wall. A first end of the air guiding piece is stretchable to be fixed to the second end wall. The air guiding piece, the first sidewall, the first end wall, and the second end wall cooperatively bound an airflow channel for receiving the fan and the chip. | 04-17-2014 |
| 20140104784 | SERVER SYSTEM AND METHOD FOR CONTROLLING THE SAME - A server system has an air inlet side and an air outlet side. The server system includes two server rack modules arranged side by side and a controller electrically connected to the server rack modules. Each server rack module includes a cabinet having a first side close to the air inlet side, multiple server hosts detachably disposed in the cabinet and a fan component. The fan component, disposed at the first side, includes multiple fans electrically connected to the controller. The first side of one of the cabinets abuts against the second side of the other cabinet. When the fan components operate, an air flow is formed in the cabinets. The server hosts are located in the flow path of the air flow. When one of the fans is failed, the controller is adapted for increasing a rotational speed of the fan component close to the air outlet side. | 04-17-2014 |
| 20140126141 | On-Blade Cold Sink For High-Density Clustered Computer System - A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold. | 05-08-2014 |
| 20140126142 | Twin Server Blades For High-Density Clustered Computer System - A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element. | 05-08-2014 |
| 20140126143 | Independent Removable Computer Rack Power Distribution System for High-Density Clustered Computer System - A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus. | 05-08-2014 |
| 20140133090 | ELECTRONIC DEVICE - An electronic device includes a motherboard, at least one heat dissipation module, a fan module and a wind scooper. The heat dissipation module is arranged on the motherboard and provided with a first positioning component. The fan module is arranged on one side of the motherboard and faces the heat dissipation module. The wind scooper has a second positioning component corresponding to the first positioning component. The wind scooper is fixed on the heat dissipation module through the cooperation between the first positioning component and the second positioning component. The wind scooper is connected between the fan module and the heat dissipation modules, so that the airflow provided by the fan module can flow through the heat dissipation module. | 05-15-2014 |
| 20140146465 | CONTAINER DATA CENTER - A container data center includes a container and a server cabinet received in the container. The server cabinet includes a rack and a number of heat dissipation devices mounted to a rear side of the rack. Each heat dissipation device includes a case fixed to the rack, a fan mounted to an outer side of the case, and a heat dissipation plate received in the case and aligning with the fan. The heat dissipation plate defines a vent. The fan draws heat air through the vent of the heat dissipation plate from the rack, and the heat air is cooled by refrigerant received in the heat dissipation plate to become cool air. The cool air flows in the container, and circularly flows into the cabinet from a front side of the cabinet. | 05-29-2014 |
| 20140146466 | COOLING HEAT-GENERATING ELECTRONICS - A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets. | 05-29-2014 |
| 20140160671 | MOTHERBOARD COOLING SYSTEM - A motherboard cooling system includes a motherboard, a heat producing element, a fan module, a heat sink, a heat pipe, and a heat conducting plate. The heat conducting plate, the heat pipe, the heat sink, and the fan module cooperatively define an air path for airflow produced by the fan module to cool the heat producing element. | 06-12-2014 |
| 20140185231 | COOLING FOR ELECTRONIC EQUIPMENT - An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed. | 07-03-2014 |
| 20140192480 | MOBILE COMPUTING DEVICE DOCK STATION WITH HEADSET JACK HEAT PIPE INTERFACE - An improved electronic communications system | 07-10-2014 |
| 20140198448 | ACTIVE COOLING DEBRIS BYPASS FIN PACK - Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins. | 07-17-2014 |
| 20140211412 | HARD DRIVE COOLING FOR FLUID SUBMERSION COOLING SYSTEMS - Hard disk drives and computing systems to which they are connected are cooled by submerging the computing systems into a dielectric liquid coolant in a tank and by thermally coupling the hard disk drives to a heat conductive extension that is partly submerged into the coolant and partly out of the coolant. To keep the hard disks drives out of the coolant, they are mounted to the part of the heat conductive extension that is out of the coolant. In such a configuration, the hard disk drives are cooled through conduction of the heat from the hard disk drive to the coolant via the heat conductive extension. A pump may be used to move warmer coolant from the tank into a heat exchanger where the coolant is cooled and to move the cooled coolant back into the tank. | 07-31-2014 |
| 20140233174 | HEAT SINK FOR PROCESSOR - A heat sink for a processor includes: a main heat exchange zone that bears in contact with a processor; at least one peripheral heat exchange zone that bears in contact with a cooling source, and at least one heat pipe connecting the main heat exchange zone with the peripheral heat exchange zone, the heat pipe containing a cooling fluid. | 08-21-2014 |
| 20140233175 | ELECTRONIC BOARD PROVIDED WITH A LIQUID COOLING SYSTEM - An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first threshold height h | 08-21-2014 |
| 20140240917 | COOLING CIRCUIT SYSTEM, IN PARTICULAR TO BE USED IN A DATA CENTER, AND CONTROLLING METHOD THEREOF - The invention relates to a cooling circuit system, comprising a plurality of juxtaposed racks; a double bottom consisting of double bottom elements mounted on a base bottom on which double bottom the racks are mounted; electric or electronic components to be cooled, which components are accommodated in the racks; and a cooling system, the components of which are accommodated in the double bottom, wherein the cooling system comprises fans that are connected in parallel and that blow cooled air from the double bottom towards the juxtaposed racks. The invention relates also to a method of controlling a cooling circuit system of that type. | 08-28-2014 |
| 20140240918 | HEAT SINK WITH AN INTEGRATED VAPOR CHAMBER - A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion. | 08-28-2014 |
| 20140268545 | MODULAR SYNTHETIC JET EJECTOR AND SYSTEMS INCORPORATING THE SAME - A synthetic jet ejector ( | 09-18-2014 |
| 20140268546 | HEAT AND AIRFLOW MANAGEMENT IN A DATA STORAGE DEVICE - A chassis sub-assembly for computing devices includes a first heat sink plate and a second heat sink plate. The first heat sink plate includes a first plurality of perforations and the second heat sink plate includes a second plurality of perforations. The chassis sub-assembly also includes a first computing device and a second computing device. Each of the first and second computing devices is positioned between the first heat sink plate and the second heat sink plate. The first and second computing devices are in contact with both the first and second heat sink plates, and define a channel gap between the first and second computing devices. At least some of the first and second plurality of perforations are aligned with the channel gap. The first plurality of perforations, the channel gap, and the second plurality of perforations define an airflow channel. | 09-18-2014 |
| 20140268547 | ELECTRONIC DEVICE RACK AND INFORMATION PROCESSING APPARATUS - An electronic device rack includes a plurality of panels surrounding a first space. Moreover, the electronic device rack includes: an electronic-device housing unit disposed in the first space and configured to house electronic devices; a heat exchanger disposed in the first space at a position away from the electronic-device housing unit; a second space provided between the electronic-device housing unit and the heat exchanger and isolated from the rest of the first space; and an air blower configured to circulate air inside the first space through the electronic-device housing unit, the second space, and the heat exchanger in the described order. | 09-18-2014 |
| 20140268548 | Thermosiphon Systems for Electronic Devices - A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick | 09-18-2014 |
| 20140268549 | Device for Cooling an Electronic Component in a Data Center - A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is configured for dissipating heat from the electronic component in the data center to liquid in the first portion of the closed loop. The second area is configured for removing heat from the liquid in the second portion of the closed loop by receiving ambient air, which moves across the second portion, from outside the data center and configured for outputting the ambient air with the dissipated heat from the second area and the data center. The barrier is configured for preventing the ambient air from entering the first area. | 09-18-2014 |
| 20140293531 | SERVER NODE - According to an example, a server node may include a base module and a plurality of face modules rotatably coupled to the base module to form an enclosure. The base module and a face module of the plurality of face modules may each include an inner surface that includes an electrical component. A flexible printed circuit interconnect may communicatively interconnect the electrical component on the inner surface of the base module to the electrical component on the inner surface of the face module. | 10-02-2014 |
| 20140301036 | SERVER COOLING SYSTEM WITHOUT THE USE OF VAPOR COMPRESSION REFRIGERATION - A system, method, and computer product for cooling a server center without the use of vapor compression refrigeration. An example embodiment involves using outdoor ambient air to cool first server components directly and to cool heat exchanges containing liquid used to cool second server components. | 10-09-2014 |
| 20140321050 | COOLING DEVICE FOR COOLING RACK-TYPE SERVER, AND DATA CENTER PROVIDED WITH SAME - A cooling device for cooling a rack-type server of which a housing includes a plurality of electronic devices includes an interior cooling unit and an exterior cooling unit. The interior cooling unit includes a heat-receiving unit, a heat dissipation unit, an outward path pipe, and a return path pipe. The interior cooling unit allows working fluid to be circulated through the heat-receiving unit, the outward path pipe, the heat dissipation unit, the return path pipe, and the heat-receiving unit to thereby move the heat from the heat-receiving unit to the heat dissipation unit. The exterior cooling unit has a heat exchange unit abutted on the heat dissipation unit and allows, by a circulated cooling medium, the heat of the working fluid discharged from the heat dissipation unit to be dissipated to external air. | 10-30-2014 |
| 20140334091 | COUNTER ROTATING BLOWER WITH INDIVIDUAL CONTROLLABLE FAN SPEEDS - A blower having counter rotating fan blades for generating uniform air flow across a heat sink, which maximizes the cooling efficiency of the heat sink. The counter rotating fan blades may individually controlled to optimize performance of the blower. Only one set of fan blades may be used for low temperature conditions, thereby consuming less power and reducing acoustic noise, while both sets of fan blades may be used for high temperature conditions, thereby maximizing heat transfer. The blower may be configured to operate one or both sets of fan blades at a desired operating fan speed based on one or more pre-determined conditions. The pre-determined conditions include at least one of temperature, acoustic, and power levels and or measurements of one or more components of the computer system. | 11-13-2014 |
| 20140334092 | HEAT DISSIPATION SYSTEM AND RACK-MOUNT SERVER USING THE SAME - A heat dissipation device includes a heat absorbing member, a number of fins mounted on the heat absorbing member, a first connecting pipe, and a second connecting pipe. A top surface of the heat absorbing member defines a serpentine slot. The slot includes an inlet hole and an outlet hole communicating with two opposite ends of the slot and extending through the heat absorbing member. The first connecting pipe is connected to the inlet hole of the heat absorbing member, and the second pipe is connected to the outlet hole of the heat absorbing member. | 11-13-2014 |
| 20140334093 | ELECTRONIC DEVICE WITH AIR DUCT - An electronic device includes a motherboard. A first heat sink and a second heat sink are set on the motherboard. A number of memories are set on the motherboard and located at two sides of the first heat sink. An air duct is located between the first heat sink and the second heat sink. The air duct includes a main body and two air baffles. The main body includes a top board and two side boards extending from opposite sides of the top board. The top board and the two side boards cooperatively define an airflow channel. The airflow channel includes an air intake facing the first heat sink, and an air outlet facing the second heat sink. Each side board defines an opening. Each air baffle is pivotably mounted to the corresponding side board and adjacent to the corresponding opening. | 11-13-2014 |
| 20140334094 | Heat-Dissipation Structure and Electronic Apparatus Using the Same - A heat-dissipation structure is disclosed. The heat-dissipation structure is used on an electronic apparatus including a heating element and a vent structure. The heat-dissipation structure includes a heat pipe, a fin group, a fan, a heat-dissipation gate and a shape memory element. One end of the shape memory element is connected with the heat pipe and another end is connected with the heat-dissipation gate. Heat deformation of the shape memory element causes the heat-dissipation gate to move so as to open or close the vent structure. | 11-13-2014 |
| 20140340841 | HANDHELD COMMUNICATION DEVICE WITH HEAT DISSIPATING STRUCTURE - A handheld communication device with a heat dissipating structure includes a housing, a heat generating unit and a heat dissipator. The housing includes a chamber formed therein; the heat generating unit is received inside the chamber; the heat dissipator is arranged corresponding to the heat generating unit. The heat dissipator includes a heat pipe and a heat conductive plate. The heat pipe includes one end thermally attached to the heat generating unit and another end arranged away from the heat generating unit, and the heat conductive plate is thermally attached to the heat pipe. With such structure, the heat generated by the heat generating unit can be uniformly conducted to the heat conductive plate in order to prevent the accumulation of heat at the surrounding of the heat generating unit and to improve the efficiency of the heat dissipation of the device. | 11-20-2014 |
| 20140355201 | PROTECTING DEVICES AGAINST HOT AIR BACKFLOW IN A COMPUTER SYSTEM RACK HAVING A REAR DOOR HEAT EXCHANGER - A rear door heat exchanger is used to cool exhaust air as it exits a rack containing a plurality of computing devices. An air flow rate is determined for each of the plurality of computing devices within the rack, wherein each of the plurality of computing devices includes a fan drawing air through the computing device. The position of a baffle or louver is controlled to allow exhaust air to bypass the rear door heat exchanger in response to determining that the total air flow rate through the plurality of computing devices exceeds a predetermined air flow capacity threshold of the rear door heat exchanger. | 12-04-2014 |
| 20140355202 | Cooling System, Cooled Computer System and Computer Facility - A cooling system for the electronic components of a computer rack, including a primary circuit of primary liquid; a primary exchanger intended to transfer heat from first electronic components to the primary liquid; a secondary circuit of refrigerant fluid; a primary-secondary exchanger; a tertiary circuit of tertiary liquid; a secondary-tertiary exchanger; and a tertiary-thermal source exchanger. The cooling system also includes a tertiary-secondary exchanger; and an air-tertiary exchanger intended to transfer, to the tertiary liquid, heat from the air of the computer rack heated by second electronic components, the air-tertiary exchanger being arranged, in the tertiary circuit, downstream of the tertiary-secondary exchanger and upstream of the secondary-tertiary exchanger. | 12-04-2014 |
| 20140362520 | DYNAMIC SURFACE AREA EXPANSION IN A REAR DOOR HEAT EXCHANGER - A method comprising flowing a liquid through supply pipe couplings to a fin tube assembly of an air-to-liquid heat exchanger and through the fin tube assembly to return pipe couplings, wherein the fin tube assembly forms a central air flow pathway. The method further comprises passing air through components within a rack secured to the rear door heat exchanger and through the fin tube assembly and detecting an operating condition within the rack. The method then automatically moves the fin tube assembly from a retracted position to an extended position in response to the operating condition, wherein the retracted position directs substantially all of the air to exit the rack through the central air flow pathway, and wherein the extended position allows the air to exit through the central air flow pathway and also through first and second side air flow pathways. | 12-11-2014 |
| 20140362521 | Maintaining Thermal Uniformity Among Devices in a Multi-Device Enclosure - Apparatus and method for maintaining processing devices at a nominally common temperature, such as but not limited to storage devices in a multi-device networked storage enclosure. In accordance with some embodiments, an enclosed housing has a first side adjacent a cold zone with a lower ambient temperature and an opposing second side adjacent a warm zone with a higher ambient temperature. First and second processing devices are arranged within the enclosed housing so that the first processing device is adjacent the cold zone and the second processing device is adjacent the warm zone. First and second thermal interface material (TIM) modules are contactingly affixed to the first and second devices and are provided with different heat conductivities so that the first and second devices are maintained at a nominally common operational temperature. | 12-11-2014 |
| 20140362522 | COMPUTER THERMAL SYSTEM - The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system. | 12-11-2014 |
| 20140362523 | COMPUTER THERMAL MANAGEMENT - The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system. | 12-11-2014 |
| 20140362524 | MOUNTING STRUCTURE AND METHOD FOR DISSIPATING HEAT FROM A COMPUTER EXPANSION CARD - A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure. | 12-11-2014 |
| 20140362525 | LOW-NOISE COMPUTER HEAT DISSIPATION DEVICE - The present application discloses a low-noise computer heat dissipation device, which relates to electronic devices, and more particularly to the dissipation of heat generated by computer devices such as a server, a network device, a personal computer (PC), a notebook computer, etc. The computer heat dissipation device comprises a heat conduction member, a central radiator, and auxiliary heat dissipation fans. The heat conduction member is mainly formed by heat pipes, evaporation ends of the heat pipes are connected to main heating members inside a chassis, condensation ends of the heat pipes are connected to the central radiator, and the central radiator has cooling fins with large heat dissipation areas and a low-speed fan. The advantages of this technical solution are that noise of heat dissipation fans of the chassis can be reduced and the overall heat dissipation efficiency can be enhanced. | 12-11-2014 |
| 20140368991 | RENEWABLE ENERGY BASED DATACENTER COOLING - A data center is cooled through hydronic convection mechanisms, geothermal mechanisms or combinations thereof. The individual computing devices of such a data center are cooled through a thermally conductive interface with a liquid. The liquid's container can extend to a cooling apparatus located physically above such computing devices to provide hydronic convection cooling, or it can extend into the earth, either in the form of a heat pipe, or in the form of conduits through which the liquid is actively pumped. The hydronic convection cooling and geothermal heat pipe cooling operate via temperature differentials and consume no external electrical power. Geothermal cooling avoids heat soak by utilizing multiple different sets of conduits extending into the earth, where at least some of those sets of conduits are not utilized for a period of time. Combinations of hydronic convection mechanisms and geothermal cooling can also be utilized. | 12-18-2014 |
| 20140376176 | LIQUID TEMPERATURE CONTROL COOLING - Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack ( | 12-25-2014 |
| 20150009620 | ELECTRONIC APPARATUS - An electronic apparatus includes: an electronic device including a housing that accommodates a heat producing part, a heat transfer member configured to be exposed to an outer surface of the housing, and a heat pipe accommodated in the housing and configured to connect the heat producing part and the heat transfer member; and a cooling member, in contact with the heat transfer member, that is disposed on an outside of the housing, the cooling member in which a coolant circulating to and from an external coolant supply part. | 01-08-2015 |
| 20150009621 | SERVER TUNNEL - A computing center module with a module casing and a module area in which electronic devices are arrangeable, at least one access path being provided in the module area. The module area has a hot air outlet region, and the module casing tapers towards the hot air outlet region such that a natural cooling process is allowed. The computing center module is easily and inexpensively produced, requires little surface area, can be cooled efficiently and inexpensively, and offers the possibility to scale the provided module area as needed in a simple manner and to protect against specific environmental risks. The module casing is formed by a pipe which is closeable at the axial ends, and the module casing is provided with at least one movable coupling device for connecting to another computing center module casing such that a common module area is produced when the module casings are connected. | 01-08-2015 |
| 20150009622 | MODULE-TYPE DATA CENTER AND METHOD OF CONTROLLING THE SAME - A module-type data center includes: a casing including a first intake opening, a second intake opening, and an exhaust opening; an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air into direct contact with a refrigerant; a fan unit provided in the casing and configured to generate a second airflow by taking in the outside air through the second intake opening; and an electronic device provided in the casing and configured to be exposed to a mixed airflow of the first airflow and the second airflow and release an exhaust airflow containing the mixed airflow to the exhaust opening. The first intake opening and the second intake opening are provided on the same surface of the casing. | 01-08-2015 |
| 20150016055 | PIPING CONNECTION STRUCTURE, COOLING SYSTEM, AND ELECTRONIC EQUIPMENT - A piping connection structure includes: a pipe; and an elastic tube connected to the pipe, the tube including a connection into which the pipe is inserted and fitted, and a main body linked seamlessly with the connection, wherein the main body includes a projection that is formed circularly along a circumferential direction of the main body, and across the main body in an axial direction, and projects into an inside of the tube in a radial direction with respect to an inner periphery of the connection. | 01-15-2015 |
| 20150022967 | System for Using Constricted Convection with Closed Loop Cooling System As the Convection Plate - A gas cooling system for an electronic display is disclosed herein. A closed loop of circulating gas is preferably positioned to surround the electronic display. An open loop of cooling air preferably travels along the rear surface of the electronic display. In an exemplary embodiment the cooling air does not mix with the circulating gas. Heat may be transferred from the circulating gas to the cooling air in order to cool the display. | 01-22-2015 |
| 20150029658 | SYSTEM FOR COOLING AN INTEGRATED CIRCUIT WITHIN A COMPUTING DEVICE - One variation of a system for cooling an electrical component within a computing device—including a digital display—includes: an internal heatsink thermally coupled to the integrated circuit and defining a fluid passage including a first end and a second end; a heat exchange layer arranged across a viewing surface of the digital display, including a transparent material, and defining a fluid channel extending across a portion of the digital display, the fluid channel including a fluid inlet coupled to the first end of the fluid passage and a fluid outlet coupled to the second end of the fluid passage; a transparent fluid; and a displacement device configured to circulate the transparent fluid between the internal heatsink and the fluid channel. | 01-29-2015 |
| 20150043157 | SERVER AND HEAT DISSIPATION SYSTEM THEREOF - A server includes a chassis, processing units and an airflow generating device. The processing units are disposed inside the chassis for heat dissipation of the processing units. Each processing unit includes a motherboard, an electric heat source, a heat dissipation fin set and a stopping air bag. The electric heat source is disposed on the motherboard, the heat dissipation fin set is attached to the electric heat source and the stopping air bag including an air inlet opening is located at space between the heat dissipation fin set and one of the processing units which is adjacent to the stopping air bag. When the airflow generating devices are operated, air is blown into the stopping air bag through the air inlet opening so that the stopping air bag is inflated to occupy the space to stop an airflow from flowing through the space. | 02-12-2015 |
| 20150049430 | ELECTRONIC DEVICE - An electronic device is described, which includes: a first cooling member having a first overlapping portion in which a first insertion hole is formed, and provided to be abutted on a first component to be cooled provided on a substrate; a second cooling member having a second overlapping portion in which a second insertion hole is formed, and provided to be abutted on a second component to be cooled provided on the substrate, the second overlapping portion overlapping the first overlapping portion; and a coupling member inserted through the first insertion hole and the second insertion hole to couple the first overlapping portion to the second overlapping portion through an elastic member. | 02-19-2015 |
| 20150049431 | MODULE-TYPE DATA CENTER AND METHOD OF CONTROLLING THE SAME - A module-type data center includes: a casing including a first intake opening, a second intake opening, and an exhaust opening; an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air into direct contact with a refrigerant; a fan unit provided in the casing and configured to generate a second airflow by taking in the outside air through the second intake opening; and an electronic device provided in the casing and configured to be air-cooled by a mixed airflow of the first airflow and the second airflow and release an exhaust airflow after the air-cooling to the exhaust opening. The first intake opening and the second intake opening are provided on different surfaces of the casing. | 02-19-2015 |
| 20150062802 | HEAT PIPE ASSEMBLIES - Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe. | 03-05-2015 |
| 20150062803 | SERVER - A server includes a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a liquid cooling heat exchanger, a circulation line and several fans. The cooling plate is thermally contacted with the heat source. The liquid cooling heat exchanger is located on one side of the motherboard. The liquid cooling heat exchanger is connected with the cooling plate via the circulation line for forming a circulation circuit. The plurality of fans are located next to the liquid cooling heat exchanger. | 03-05-2015 |
| 20150062804 | VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust. | 03-05-2015 |
| 20150070836 | SYSTEM FOR COOLING AN INTEGRATED CIRCUIT WITHIN A COMPUTING DEVICE - One variation of a system for cooling an integrated circuit within a computing device includes: a substrate arranged within the computing device, extending to an external housing of the computing device, and defining a closed fluid circuit comprising a cavity, a first boustrophedonic fluid channel across a first region of the substrate adjacent the integrated circuit, and second boustrophedonic fluid channel across a second region of the substrate; a volume of fluid within the closed fluid circuit; a displacement device comprising a diaphragm arranged across the cavity and operable between a first position and a second position, the diaphragm distended into the cavity in the first position and distended away from the cavity in the second position; and a power supply powering the displacement device to oscillate the diaphragm between the first position and the second position to pump the volume of fluid through the closed fluid circuit. | 03-12-2015 |
| 20150070837 | HEAT-DISSIPATING DEVICE FOR INTERFACE CARD - A heat-dissipating device for interface card is disposed on an interface card. The heat-dissipating device includes a heat sink, a housing, and a fan. The heat sink is disposed on the interface card. The housing is disposed on the heat sink. The housing has a top plate and two side plates connected to the top plate. The top plate has an inlet opening. An inner surface of the top plate proximate to the inlet opening has a protruding wall and an opening. The protruding wall has a curve panel. The fan is arranged in the housing and correspondingly arranged at the inlet opening. The fan has a rotational shaft, a plurality of axial fan blades, and centrifugal fan blades. The rotational shaft is pivotally disposed on a bottom seat. The assembled heat-dissipating device can optimize air flow to improve heat dissipation and effectively improve heat dissipating rate. | 03-12-2015 |
| 20150103485 | ELECTRONIC APPARATUS, METHOD OF CONTROLLING ELECTRONIC APPARATUS AND PROGRAM FOR CONTROLLING ELECTRONIC APPARATUS - An electronic apparatus includes: a flowpath through which a liquid flows; a heat-generating body that is cooled by the liquid; a liquid temperature measuring device that measures a temperature of the liquid; a temperature measuring device that measures a temperature of the heat-generating body; a heat generation amount measuring device that measures a heat generation amount of the heat-generating body; a storage apparatus that stores information representing a relationship between a temperature of the liquid, a temperature of the heat-generating body, a heat generation amount of the heat-generating body, and a flow rate of the liquid; and a processing apparatus that calculates the flow rate of liquid from the temperature of the liquid measured by the liquid temperature measuring device, the temperature of the heat-generating body measured by the temperature measuring device, and the heat generation amount of the heat-generating body based on information inside the storage apparatus. | 04-16-2015 |
| 20150103486 | Phase Change Module and Electronic Device Mounted with Same - To provide a phase change module as a cooling system capable of saving energy and miniaturizing of the cooling system utilizing a thermo siphon, and an electronic device suitable to mounting such a phase change module. | 04-16-2015 |
| 20150109728 | FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS - A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink. | 04-23-2015 |
| 20150109729 | FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS AND SEPARABLE HEAT SINKS - Cooled electronic systems and cooling methods are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the electronic system. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into, for instance, one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink is configured and disposed to physically couple to the enclosure and facilitates rejection of heat from the fluid disposed within the compartment when the field-replaceable bank of electronic components is operatively inserted into the electronic system. | 04-23-2015 |
| 20150116928 | Centrifugal Fan with Integrated Thermal Transfer Unit - Disclosed herein are computing devices, and methods of manufacturing computing devices, that have a cooling fan and integrated thermal transfer unit. A centrifugal fan unit includes a rotatable hub, a plurality of blades disposed on the rotatable hub, and a motor coupled to the rotatable hub. The motor causes the rotatable hub to rotate about an axis such that airflow proceeds outward from the centrifugal fan unit along trajectories that are perpendicular to the axis. One or more thermal transfer units have first portions that are coupled to the one or more heat sources and second portions that collectively at least partially surround the centrifugal fan unit. | 04-30-2015 |
| 20150131223 | LIQUID COOLING OF MULTIPLE COMPONENTS ON A CIRCUIT BOARD - An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights. | 05-14-2015 |
| 20150138722 | CLOSED LOOP LIQUID COOLING SYSTEM FOR ELECTRONIC PACKAGES - A closed loop liquid cooling system for electronic packages, the closed loop liquid cooling system including: a fan impeller configured so that air flows from the fan impeller through a radiator of the closed loop liquid cooling system; an electric motor coupled to the fan impeller, the electric motor configured to rotate the fan impeller; and a pump impeller configured for delivering liquid to the electronic package via a cold plate, the pump impeller mechanically coupled to the fan impeller such that rotating the fan impeller causes the pump impeller to rotate such that liquid is circulated in the closed loop liquid cooling system. | 05-21-2015 |
| 20150138723 | METHOD OF COOLING SERIES-CONNECTED HEAT SINK MODULES - A method of cooling two or more heat-providing surfaces using a cooling apparatus having two or more fluidly connected heat sink modules in a series configuration can include providing a flow of single-phase liquid coolant to a first heat sink module mounted on a first heat-providing surface. The method can include projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module and causing phase change of a first portion of the liquid coolant and thereby forming two-phase bubbly flow with a first quality. The method can include transporting the two-phase bubbly flow to a second heat sink module and projecting the two-phase bubbly flow against a second heat-providing surface within the second heat sink module and causing phase change of a second portion of the coolant and formation of two-phase bubbly flow with a second quality greater than the first quality. | 05-21-2015 |
| 20150305209 | COOLING SYSTEM FOR ELECTRONIC DEVICE STORING APPARATUS AND COOLING SYSTEM FOR ELECTRONIC DEVICE STORING BUILDING - A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer. | 10-22-2015 |
| 20150316965 | Heat radiation apparatus of terminal - The present invention provides a heat radiation apparatus of a terminal, the apparatus includes an air channel ( | 11-05-2015 |
| 20150316966 | ELECTRONIC DEVICE WITH IMPROVED HEAT DISSIPATION - An electronic device may include: a circuit board having a board surface; a heat-generating source including a first electronic component mounted on the board surface of the circuit board; and a heat dissipating panel stacked over the circuit board, having a panel surface, and formed with a first recess that is indented inwardly from the panel surface and that is defined by a first recess-defining wall. The first electronic component protrudes from the board surface into the first recess to contact the first recess-defining wall. | 11-05-2015 |
| 20150334879 | BIMODAL COOLING IN MODULAR SERVER SYSTEM - A server system includes a plurality of stacked modular computing structures. Each modular computing structure includes a circuit board comprising a computing resource, an air-fluid heat exchange structure comprising a first set of pipe segments, and a cold plate structure attached to a second set of pipe segments of the modular computing structure. The first set of pipe segments of each modular computing structure interfaces with the first set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a first fluid circulation loop. The second set of pipe segments of each modular computing structure interfaces with the second set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a second fluid circulation loop. | 11-19-2015 |
| 20150334880 | SYSTEM AND METHOD FOR AIR-COOLING HARD DRIVES IN LIQUID-COOLED SERVER RACK - Embodiments that allow for the air cooling of disk drives associated with liquid cooled nodes are disclosed. A node for performing computing operations includes a frame, a power supply coupled to the |frame| | 11-19-2015 |
| 20150346784 | INTEGRATED VAPOR CHAMBER FOR THERMAL MANAGEMENT OF COMPUTING DEVICES - A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use. | 12-03-2015 |
| 20150351290 | METHOD OF ABSORBING SENSIBLE AND LATENT HEAT WITH SERIES-CONNECTED HEAT SINKS - A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow. | 12-03-2015 |
| 20150359145 | APPARATUS FOR COOLING SERVER CABINET, SERVER CABINET APPARATUS, AND INTERNET DATA CENTER - Disclosed are an apparatus for cooling a server cabinet, a server cabinet apparatus, and an Internet data center. The apparatus includes: a bracket and a cooling device; where the bracket is positioned below one or a plurality of server cabinets, and the cooling device is positioned in the bracket, and cools the server cabinet on the bracket. The apparatus for cooling a server is positioned below one or a plurality of server cabinets, such that all the server cabinets in a large-scale Internet data center are effectively cooled, and in addition, resources are saved. | 12-10-2015 |
| 20150382515 | DATACENTER IMMERSED IN COOLING LIQUID - The subject disclosure is directed towards a datacenter or partial datacenter (e.g., a datacenter module) contained in a sealed container. The container may be filled with a cooling fluid, such as a dielectric fluid, to help cool the datacenter components. The container and its internal datacenter or datacenter portion may be submerged in water, in which event the fluid also helps to equalize the external water pressure. | 12-31-2015 |
| 20160007497 | APPARATUS AND METHOD FOR CONDUCTIVE COOLING OF AN INFORMATION HANDLING SYSTEM - An apparatus provides conductive cooling of an information handling system. The apparatus includes a panel having a vent area formed in the panel. The vent area includes a perimeter, an interior section and a plurality of ribs that extend across the interior section. The vent area further includes several openings defined by lateral spacing between the ribs. The openings extend through the panel and are configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings. A conductive heat sink layer is attached to the panel. The conductive heat sink layer covers a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs. | 01-07-2016 |
| 20160021792 | AIR CONDITIONING CONTROLLING SYSTEM AND AIR CONDITIONING CONTROLLING METHOD - An air conditioning controlling system, includes: a sensor configured to measure a first air pressure in a cold aisle in a first space cooled by an air conditioner and a second air pressure in a hot aisle in a second space cooled by the air conditioner; and a control apparatus configured to calculate a first prediction value of a power consumption amount of an information processing apparatus and a second prediction value of a power consumption amount of the air conditioner for each of a plurality of first temperatures at an air capacity of the air conditioner which is based on the first air pressure and the second air pressure, detect, from among the plurality of first temperatures, a temperature at which a total value of the first prediction value and the second prediction value is minimized, and set the detected temperature as a second temperature to the air conditioner. | 01-21-2016 |
| 20160021793 | MODULAR DATA CENTER - A modular data center includes a plurality of first containers and a plurality of second containers. The plurality of first containers and second containers are partitioned into a plurality of functional modules respectively, the functional modules of the plurality of first containers being arranged in parallel, and the functional modules of the plurality of second containers being arranged in parallel on one side of the plurality of first containers and corresponding to the functional modules of the plurality of first containers respectively. The present disclosure combines the functional modules of the plurality of first containers and the plurality of second containers into modular data centers with different forms, capacities, and data center usability tiers, and the assembly of the plurality of first containers and second containers with standardized sizes may facilitate the transportation and reduce the time and cost of assembling and delivery of the modular data center. | 01-21-2016 |
| 20160034007 | Triangular System for Modifiable Thermal Control - An information handling system includes a triangular chassis, a plurality of graphics cards, and a plurality of air movers. An air stream of a first air mover may be axially aligned with the graphics cards and the first air mover may to direct the air stream into a first zone of the information handling systems including the graphics cards, the air stream being parallel to a longitudinal axis of the graphics cards. The first air mover may be a fan and the air flow may be laminar. A second zone of the information handling systems may include a CPU. The first zone may include a power supply unit. The air movers may be controlled independently, enabling independent control of a temperature in the first zone and a temperature in the second zone. | 02-04-2016 |
| 20160044824 | LIQUID-VAPOR PHASE CHANGE THERMAL INTERFACE MATERIAL - An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink. | 02-11-2016 |
| 20160044831 | SMALL FORM FACTOR DESKTOP COMPUTER - An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding. | 02-11-2016 |
| 20160046791 | THERMALLY CONDUCTIVE CLAY - The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles. | 02-18-2016 |
| 20160057894 | COMPUTER ROOM, DATA CENTER, AND DATA CENTER SYSTEM - A data center system includes an infrastructure unit including a public area and a bridge area and at least one computer room. The computer room is disposed along an extending direction of the bridge area, and a length of the bridge area is matched with a length of computer rooms arranged along the bridge area, so that a number of computer rooms may be increased according to the needs. The computer room includes a plurality of layers of data centers stacked on each other. Cold passage areas and hot passage areas of two neighboring layers of data centers form a cold air passage and a hot air passage so that cold air produced by a cooling module may be directed to each data center, and hot air in each data center may be directed to the cooling module to enable devices in each data center to operate under appropriate temperature. | 02-25-2016 |
| 20160066478 | Cabinet for Electronic Equipment | 03-03-2016 |
| 20160070319 | HEAT SINK - A heat sink ( | 03-10-2016 |
| 20160077558 | Uniform Flow Heat Sink - A uniform flow heat sink is described that is configured to employ variable spacing for air flow channels to account for non-uniformities in air flow due to arrangements of components within a housing of a computing device. Non-uniformities may be ascertained by analysis of an air flow profile for a computing device to detect regions of high and low flow. Air flow rates for the computing device may be balanced by configuring air flow channel spacing for the heat sink to vary around a perimeter of the heat sink and account for the ascertained non-uniformities. Air flow channel spacing may be controlled by changing the concentration, spacing, pitch, positioning and/or other characteristics of heat transfer surfaces associated with the heat sink. Generally, air flow channel spacing is increased in areas of high system impedance and decreased in areas of low system impedance to increase uniformity of flow. | 03-17-2016 |
| 20160084257 | AIR-MOVING ASSEMBLIES WITH FLYWHEELS - Apparatuses and methods are provided for facilitating air-cooling of, for instance, one or more electronics racks within a data center. The apparatus includes an air-moving assembly and one or more flywheels. The air-moving assembly includes a shaft, one or more mechanical fans coupled to the shaft to rotate, at least in part, with the shaft, and a motor coupled to the shaft to rotatably drive the shaft. The flywheel(s) is sized and coupled to the shaft of the air-moving assembly to store rotational energy, and to facilitate, for a specified period of time, continued rotation of the shaft during interruption in power to the motor. In one implementation, the flywheel(s) is sized and coupled to the shaft to facilitate, for the specified time period, continued rotation of the shaft at a specified percentage, or greater, rotational speed of the shaft compared with shaft speed when rotatably driven by the motor. | 03-24-2016 |
| 20160088775 | BI-DIRECTIONAL AIRFLOW HEATSINK - An information handling system (IHS) has a heatsink including cooling fins each having a plate structure and attached to the base in spaced parallel arrangement for receiving a first air flow that is in parallel alignment to the conductive surface. The heatsink includes a tunnel formed through the cooling fins perpendicularly to the first air flow. The IHS provides cooling air to one or more heatsinks without thermally shadowing other compute components as well as providing a second flow of cooling air to downstream component/s via the tunnel of each heatsink. | 03-24-2016 |
| 20160106009 | SYSTEM AND METHOD OF PROVIDING COMPUTER RESOURCES - A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. Other embodiments are disclosed. | 04-14-2016 |
| 20160109913 | COOLING DEVICE AND ELECTRONIC APPARATUS - A cooling device that is thermally connected to a heat source and cools the heat source by means of a heat medium flowing inside the cooling device, includes: a first passage configured such that the heat medium before being heated by the heat source flows through the first passage; a second passage configured such that the heat medium after being heated by the heat source flows through the second passage; a plurality of heat exchanging chambers each configured such that in the heat exchanging chamber, the heat medium is heated by heat generated by the heat source; a first communicating passage provided in each of the plurality of heat exchanging chambers and configured such that through the first communicating passage, the first passage and the heat exchanging chamber communicate with each other; a second communicating passage provided in each of the plurality of heat exchanging chambers. | 04-21-2016 |
| 20160120019 | CIRCUIT BOARD ASSEMBLY ADAPTED FOR FLUID COOLING - A circuit board assembly, such as a motherboard, graphics card, sound card, or network card, can be adapted for fluid cooling. The circuit board assembly can include a processor electrically connected to a printed circuit board. The circuit board assembly can include a cooling line assembly with an inlet fitting, an outlet fitting, and a heat sink module fluidly connected between the inlet and outlet fittings by sections of tubing. The heat sink module can be mounted on a surface to be cooled that is a surface of, or a surface in thermal communication with, the processor. When fluidly connected to a cooling system, coolant flowing through the cooling line assembly can flow through a plurality of orifices in the heat sink module forming a plurality of jet streams that are projected against the surface to be cooled, resulting in heat transferring from the processor to the flowing coolant. | 04-28-2016 |
| 20160120071 | SERVER WITH COOLING LINE ASSEMBLY - A server can include a cooling line assembly to provide fluid cooling of one or more server components. The server can include a chassis, a circuit board positioned within the chassis, and a processor electrically connected to the circuit board. The cooling line assembly can include a heat sink module on a surface to be cooled that is in thermal communication with the processor. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. The orifices can deliver jet streams of coolant into the first outlet chamber and against the surface to be cooled when pressurized coolant is provided to the inlet chamber of the heat sink module. | 04-28-2016 |
| 20160128238 | HOT-SWAPPABLE SERVER WITH COOLING LINE ASSEMBLY - A hot-swappable server can be adapted to blindly mate to a manifold assembly of a cooling system. The server can include a chassis with a circuit board positioned within the chassis and a first processor electrically connected to the circuit board. The server can include a cooling line assembly with an inlet fitting, an outlet fitting, and a heat sink module fluidly connected between the inlet and outlet fittings. The first heat sink module can be in thermal communication with the first processor. The inlet and outlet fittings can be mounted to the chassis proximate a rear side of the chassis. The inlet and outlet fittings can be blind-mate fittings. Coolant flowing through the cooling line assembly can flow in through the inlet fitting, through the first heat sink module where it absorbs heat from the first processor, and out through the outlet fitting. | 05-05-2016 |
| 20160157387 | Data Center Facility Design Configuration | 06-02-2016 |
| 20160170454 | Flexible Heat Spreader with Differential Thermal Conductivity | 06-16-2016 |
| 20160192542 | DATA CENTER HEAT REMOVAL SYSTEMS AND METHODS - New data center heat removal systems and methods allow a combination of active and passive thermal processes for removing heat from and cooling air in data center environments. Systems and methods include a data center heat removal system including an adjustable thermal feed cold air intake system, a distribution system for cold and warm air including one or more hot aisles and one or more cold aisles, and a convection system to draw cool air through data center equipment using a naturally-occurring convection processes to expel hot air. Misters, cooling elements, and/or freezer boxes may further cool the intake of air. A controller is programmed to efficiently manage and control the climate (e.g., temperature, humidity, air flow, pressure, air quality, etc.) within a data center to minimize the use for energy for air distribution and cooling. | 06-30-2016 |
| 20160252936 | HEAT DISPERSION APPARATUS AND PORTABLE DEVICE | 09-01-2016 |
| 20160378147 | COMPUTER INTERNAL ARCHITECTURE - An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU). | 12-29-2016 |
| 20170235349 | 3D Printed Thermal Management System | 08-17-2017 |
| 20170238444 | MODULAR DATA CENTER | 08-17-2017 |
| 20180024599 | LIQUID-TYPE COOLING APPARATUS AND MANUFACTURING METHOD FOR HEAT RADIATION FIN IN LIQUID-TYPE COOLING APPARATUS | 01-25-2018 |
| 20180027696 | LIQUID COOLING WITH A COOLING CHAMBER | 01-25-2018 |
| 20190150317 | DATA CENTER RACK MOUNTED LIQUID CONDUCTION COOLING APPARATUS AND METHOD | 05-16-2019 |
| 20190150322 | COOLING SYSTEM FOR A SERVER | 05-16-2019 |
| 20190150326 | METHOD FOR PROVIDING COOLING TO ELECTRONIC RACKS USING LIQUID COOLING AND AIR COOLING | 05-16-2019 |
| 20190150327 | DATA CENTER SYSTEM, CONTROL METHOD OF DATA CENTER SYSTEM, AND RECORDING MEDIUM RECORDING CONTROL PROGRAM OF DATA CENTER SYSTEM | 05-16-2019 |
| 20220141999 | LIQUID-COOLED INTEGRATED CABINET - The present invention provides a liquid-cooled integrated cabinet, which belongs to the technical field of servers, and comprises a main body. A power distribution module is provided at the upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on the other side thereof; the computing power module is cooled by a liquid-cooled module, and the liquid-cooled module is a front and rear drawing structure relative to the main body. The cooling fan bears 8%-12% of the heat dissipation capacity. A cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module. The front end of the main body is provided with a hose for cooling medium to circulate; a liquid-cooled module corresponds to a hose; cooling medium flows through the hose and the liquid-cooled module, and then cools down the computing power module. The liquid-cooled integrated cabinet of the present invention is high in heat dissipation efficiency and compact in structure. | 05-05-2022 |
