Class / Patent application number | Description | Number of patent applications / Date published |
361679530 | Liquid | 81 |
20090067128 | PASSIVELY COOLED COMPUTER - A passively cooled computer includes two or more components arranged in a housing frame | 03-12-2009 |
20090080152 | Stackable self-aligning insulative guide tray for holding semiconductor substrates - A reconfigurable high performance computer includes a stack of self-aligning, injection-molded plastic, insulative guide trays. Each insulative guide tray retains at least one semiconductor substrate assembly (SSA) in a lateral dimension with respect to a set of elastomeric connectors. The trays hold the SSAs and the elastomeric connectors such that the elastomeric connectors are sandwiched between, and interconnect, adjacent semiconductor substrates proceeding down the stack. The trays also hold comb-shaped power bus bar assemblies such that power bus bars contact and supply power to circuitry of the SSAs of the stack. | 03-26-2009 |
20090154093 | Composition and Methods for Managing Heat Within an Information Handling System - An information handling system including a heat generating component positioned within the information handling system, a heat transfer surface in thermal communication with the heat generating component and a medium comprising water and gold thiolate nanoparticles, wherein the medium is in thermal communication with the heat transfer surface. | 06-18-2009 |
20090185343 | WATER-COOLING RADIATOR FOR A COMPUTER CHIP - A water-cooling radiator for a computer chip is provided to lower the temperature of the computer chip. The radiator includes a body on which other elements can be fixed and providing an interface for heat exchange, an internal circulation flow path built inside the body to provide a passage required for the coolant to flow through, and a pump fixed to the side of the body near the computer chip to provide power required for the coolant circulation. | 07-23-2009 |
20090213539 | HEAT DISSSIPATION ASSEMBLY FOR COMPUTING DEVICES - An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink. | 08-27-2009 |
20090219681 | MULTIPLE CHIP MODULE COOLING SYSTEM AND METHOD OF OPERATION THEREOF - Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM. | 09-03-2009 |
20100002376 | Planer Board with Integrated Cold Plate - AA cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting components on the motherboard. Chilled water is circulated through the cold pads to remove heat from the vicinity of the heat-emitting components. A heat exchanger may be coupled to the cold plate. | 01-07-2010 |
20100033923 | LIQUID-COOLED RACK WITH OPTIMIZED RACK HEAT EXCHANGER DESIGN FOR NON-UNIFORM POWER DISSIPATION - A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server | 02-11-2010 |
20100039767 | EXPANSION TANK DEVICE, PROCESS FOR FABRICATING EXPANSION TANK DEVICE, AND LIQUID COOLING RADIATOR - An expansion tank device | 02-18-2010 |
20100246117 | VARIABLE FLOW COMPUTER COOLING SYSTEM FOR A DATA CENTER AND METHOD OF OPERATION - Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center. | 09-30-2010 |
20100246118 | CASE AND RACK SYSTEM FOR LIQUID SUBMERSION COOLING OF ELECTRONIC DEVICES CONNECTED IN AN ARRAY - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 09-30-2010 |
20100277865 | MULTIPLE CHIP MODULE COOLING SYSTEM AND METHOD OF OPERATION THEREOF - Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM. | 11-04-2010 |
20100296238 | HEAT MANAGEMENT USING POWER MANAGEMENT INFORMATION - A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state. | 11-25-2010 |
20100296239 | THERMAL INTERPOSER LIQUID COOLING SYSTEM - A thermal interposer for a heat-generating electronic component includes a thermally conducting body that is configured to be thermally coupled to the electronic component. The thermally conducting body may include a first region that is located on a first face of the thermally conducting body. The first region may be adapted to be in thermal contact with a surface of the electronic component. The thermally conducting body may also include a second region located on a second face that is opposite the first face of the thermally conducting body. The thermal interposer may also include a cold plate assembly that is removably coupled to the thermally conducting body. The cold plate assembly may be in thermal contact with the second region of the thermally conducting body. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly. | 11-25-2010 |
20110063796 | ENDOTHERMIC REACTION APPARATUS FOR REMOVING EXCESS HEAT IN A DATACENTER - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 03-17-2011 |
20110188198 | Aircraft Signal Computer System Having A Plurality Of Modular Signal Computer Units - An aircraft signal computer system ( | 08-04-2011 |
20110286177 | SERVER CASE WITH OPTICAL INPUT/OUTPUT AND/OR WIRELESS POWER SUPPLY - A liquid submersion-cooled computer that is configured to reduce physical structures passing through walls of the computer liquid-tight computer case, which eliminates the amount of sealing needed around those physical structures and reduces the number of possible fluid leakage paths from the interior of the computer that contains a cooling liquid submerging at least some of the computer components. The computer includes a mechanism to pass input/output signals into and from the computer without any physical structure extending through any of the plurality of walls. The computer also has a mechanism for wirelessly transferring power into the interior space of the computer case, and a switch that controls power in the computer without having any physical structure extending through any of the plurality of walls. | 11-24-2011 |
20110292595 | Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems - A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through finned tubes exposed to the surrounding air. | 12-01-2011 |
20120033377 | MODULAR SYSTEM FOR OUTDOOR DATA CENTER - A system for providing computing capacity includes a base module and two or more fin modules coupled to the base module. At least one of the fin modules includes one or more fins and two or more computer systems coupled to the fins. The fins form an enclosure for the computer systems to protect the at least one computer system from environmental conditions. The system can operate in an outdoor environment. | 02-09-2012 |
20120075796 | SERVER CASE WITH OPTICAL INPUT/OUTPUT AND/OR WIRELESS POWER SUPPLY - A liquid submersion-cooled computer that is configured to reduce physical structures passing through walls of the computer liquid-tight computer case, which eliminates the amount of sealing needed around those physical structures and reduces the number of possible fluid leakage paths from the interior of the computer that contains a cooling liquid submerging at least some of the computer components. The computer includes a mechanism to pass input/output signals into and from the computer without any physical structure extending through any of the plurality of walls. The computer also has a mechanism for wirelessly transferring power into the interior space of the computer case, and a switch that controls power in the computer without having any physical structure extending through any of the plurality of walls. | 03-29-2012 |
20120075797 | CASE AND RACK SYSTEM FOR LIQUID SUBMERSION COOLING OF ELECTRONIC DEVICES CONNECTED IN AN ARRAY - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 03-29-2012 |
20120127657 | SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS - A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system. | 05-24-2012 |
20120140408 | COMPUTER HAVING AIRFLOW GUIDING DEVICE - A computer includes a main board, a plurality of electrical element mounted on the main board and a airflow guising device. The airflow guiding device includes a metallic cover and two flexible films. The cover includes a top plate and two side plates extending downward from opposite edges of the top plate. The top plate and the side plates cooperatively define a guiding channel. Each side plate is spaced a distance from the main board to form a clearance space. The flexible films are correspondingly attached to the side plates. Each flexible film includes a connecting portion and a shielding portion. The connecting portion is attached on the corresponding side plate. The shielding portion extends from an edge of the corresponding side plate to the main board and shields the clearance space. | 06-07-2012 |
20120147552 | DATA CENTER - A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum. | 06-14-2012 |
20120147553 | COOLING SYSTEM FOR A SERVER - Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold. | 06-14-2012 |
20120162906 | DATA CENTER AND ITS CONFIGURATION ARRANGEMENTS AND CONFIGURATION UNITS OF ELECTRONIC DEVICE ASSEMBLIES AND AIR CONDITIONERS - Disclosed is a data center and its configuration arrangements and configuration units of electronic device assemblies and air conditioners, in which the configuration arrangements of electronic device assemblies and air conditioners includes an air conditioner and a plurality of electron device assemblies. The air conditioner includes an intake and a corresponding opposite outtake and the electronic device assemblies are mounted around to form a block. Each electronic device assembly includes an air inlet and a corresponding air outlet. The air conditioner is mounted in the block and partitions the block into a first sector and a second which are both shaped as a polygon. The intake and the outtake of the air conditioner respectively face the first sector and the second sector, and the electronic device assembly adjacent to the first sector faces the first sector with its air outlet and the electronic device assembly adjacent to the second sector faces the second sector with its air inlet. | 06-28-2012 |
20120236495 | EXTERNAL THERMAL SOLUTION FOR A MOBILE COMPUTING DEVICE - A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device. | 09-20-2012 |
20120268890 | APPARATUS AND METHOD FOR COOLING ELECTRICAL COMPONENTS OF A COMPUTER - A plenum for guiding a flow of cooling air through the interior of a computer is designed to maximize the airflow over those electrical components within the computer which are most sensitive to temperature, and/or which require the greatest amount of cooling. The plenum is designed to be mounted over top of a computer motherboard which includes a plurality of electrical components mounted thereon. One or more apertures are formed in the lower wall of the plenum so that electrical components mounted on the computer motherboard can protrude through the apertures and into the interior of the plenum. The lower surface of the plenum is designed to prevent the flow of cooling air passing through the plenum from escaping through the apertures on the lower wall. Also, upper and lower protrusions on the plenum can extend into the interior of the plenum to concentrate the flow of cooling air onto the electrical components which are protruding through the apertures and into plenum. | 10-25-2012 |
20120293951 | RACK MOUNTED COMPUTER SYSTEM AND COOLING STRUCTURE THEREOF - A rack mounted computer system is disclosed and comprises a rack, at least one network switch and a cooling structure. The rack comprises an interior including at least one first compartment for installing the first compartment. The cooling structure is disposed in the interior of the rack and comprises a first airflow passage, a second airflow passage and an airflow directing mechanism. The first airflow passage and the second airflow passage are disposed in the first compartment and in fluid communication with an interior of the network switch. The airflow directing mechanism comprises a first blocking device selectively disposed at an entrance or an outlet of the first airflow passage and a second blocking device selectively disposed at an outlet or an entrance of the second airflow passage. The airflow directing mechanism is configured for directing the chilly airflow to flow through the first airflow passage, the interior of the network switch and the second airflow passage or through the second airflow passage, the interior of the network switch and the first airflow passage. | 11-22-2012 |
20130016472 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-17-2013 |
20130058038 | THERMAL INTERPOSER LIQUID COOLING SYSTEM - A thermal interposer for a heat-generating electronic component located on an adapter card of a computer includes a thermally conducting planar body. The thermally conducting planar body may be configured to be coupled to the adapter card such that a first surface of the planar body is in thermal contact with a surface of the electronic component. The thermal interposer may also include a cold plate assembly removably coupled to a second surface of the planar body opposite the first surface. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly. | 03-07-2013 |
20130083479 | RACK MOUNTED LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 04-04-2013 |
20130229769 | DATA CENTER CONTAINER WITH DRAINING MECHANISM - A data center container includes a chassis, a cooling system, a draining mechanism, and a latching member. The chassis includes a front plate with a securing hole. The cooling system includes a water tray and a drainer tray. The water tray communicates with the drainer tray. The draining mechanism communicates with the drainer tray and extends out of the chassis. The latching member is attached to the draining mechanism. The latching member includes an inserting post, and the inserting post being engaged in the securing hole, to position the draining mechanism to the front plate. | 09-05-2013 |
20130229770 | SYSTEM AND METHOD FOR COOLING INFORMATION HANDLING RESOURCES - Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid. | 09-05-2013 |
20130265714 | SERVER HAVING CARRIER AND POWER MODULE - A carrier for installation in a receiving space of a chassis includes a carrier body having a bottom wall and two sidewalls that cooperatively define a carrying space. The bottom wall has two opposite short sides respectively defining front and rear sides of the carrier body. A front shell is connected to the front side of the carrier body, and includes a front cover plate and two connecting walls extending into the carrying space and respectively and adjustably connected to the sidewalls in an overlapping manner to adjust a distance between the front cover plate and the rear side of the carrier body, so that the length of the carrier corresponds to the depth of the receiving space of the chassis. | 10-10-2013 |
20130308267 | SERVER ASSEMBLY - A rack includes a first pole, a second pole, a third pole, a fourth pole, four beams connected between the first to fourth poles, a number of first connection poles connected between the first pole and the second pole, and a number of second connection poles connected between the third pole and the fourth pole. The first to fourth poles, the beams, the first connection pole, and the second connection pole are all tubular and communicate with each other internally. A pump is arranged in a middle of each beam. Each first connection pole has a substantially same height with one of the second connection poles for sandwiching, together with the second connection pole, a liquid cooling server module which is operable to communicate with the rack internally to circulate cooling liquid. | 11-21-2013 |
20130322012 | Scalable Brain Boards For Data Networking, Processing And Storage - Systems, methods and other means for improving rack based systems are discussed herein. Some embodiments may provide for a module for insertion in a rack based system. The module may include a brain board, a plurality of lobe components, a network switch, and a power lobe component. The plurality of lobe components may be coupled to the brain board and may each be configured to support a variable composition of processing and storage elements. Furthermore, the module may be configured to thermally couple with the rack based system to receive cooling from the rack based system. | 12-05-2013 |
20130329358 | TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES - Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed. | 12-12-2013 |
20140022725 | INFORMATION TECHNOLOGY EQUIPMENT COOLING SYSTEM - According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment. | 01-23-2014 |
20140029196 | SYSTEM FOR BALANCED POWER AND THERMAL MANAGEMENT OF MISSION CRITICAL ENVIRONMENTS - Data center capsules providing modular and scalable capacity with integrated power and thermal transmission capabilities. Modular integrated central power system (“ICPS”) to fulfill the power and thermal needs of data center environments or other mission critical environments. Computer-based systems and methods for controlling the energy- and thermal-envelope of any single data center environment or other mission critical environment, or an ecosystem of multiple data center environments or multiple other mission critical environments. | 01-30-2014 |
20140049908 | THERMAL MANAGEMENT SYSTEM - Embodiments of the disclosure may include a thermal management system. The thermal management system may include a cooling apparatus including a cooler block configured to retain at least one fluid channel, wherein the at least one fluid channel is configured to circulate a coolant within the cooler block and at least one plate mounted to the cooler block, wherein the at least one plate is comprised of a heat-conducting material, wherein the at least one fluid channel faces the at least one plate to be in thermal contact with the at least one plate. The system may also include a hard drive mounted onto the at least one plate, wherein heat generated by the hard drive is transferred to the at least one plate and removed from the at least one plate by the coolant circulating within the cooler block. | 02-20-2014 |
20140092551 | Dielectrophoretic Cooling Solution for Electronics - At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in the cooling channel. The cooling channel is provided with at least one electrode. A potential is applied to the at least one electrode such that an electric field magnitude at the downstream end of the channel is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in the cooling channel will force it downstream. | 04-03-2014 |
20140146467 | IMMERSION-COOLED AND CONDUCTION-COOLED ELECTRONIC SYSTEM - A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component. | 05-29-2014 |
20140146468 | IMMERSION-COOLED AND CONDUCTION-COOLED METHOD FOR ELECTRONIC SYSTEM - A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component. | 05-29-2014 |
20140168889 | LIQUID COOLING SYSTEM FOR A SERVER - A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room. | 06-19-2014 |
20140218861 | Vertically-Oriented Immersion Server with Vapor Bubble Deflector - An immersion server includes: a first surface that is exposed when the server is submerged within a cooling liquid; and at least one vapor bubble deflector physically abutting the first surface and extending away from the first surface at an angle. The deflector divides the first surface into an upper segment and a lower segment when the server is upright. When the server is submerged, the cooling liquid surrounding the lower segment absorbs sufficient heat to evaporate and generate vapor bubbles rising to the liquid surface. The vapor bubble deflector deflects the rising vapor bubbles away from the surface of the upper segment. This enables superior liquid contact with heat dissipating components at the upper segment and better cooling of those components. The deflector can be a device-level deflector separating two or more components or a component-level deflector separating a lower segment from an upper segment of a single component. | 08-07-2014 |
20140240920 | SYSTEM FOR MOUNTING AND COOLING A COMPUTER COMPONENT - A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line. | 08-28-2014 |
20140285965 | SYSTEMS AND ASSEMBLIES FOR COOLING SERVER RACKS - A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server. | 09-25-2014 |
20140293532 | FLOW-GUIDING HOOD FOR GUIDING A FLOW OF AIR - A flow-guiding hood that guides a flow of air in a computer or an electronic device includes a plurality of individual parts which includes a first flow-guiding element made of a substantially planar first material that channels the flow and at least one second flow-guiding element made of a different, second material and likewise channels the flow, wherein the second flow-guiding element rests on and/or is attached to the first flow-guiding element. | 10-02-2014 |
20140301037 | LIQUID COOLANT-SUBMERSIBLE NODE - A node for performing computing operations includes a frame, a power supply coupled to the frame, and one or more liquid coolant-submersible motherboard assemblies. The one or more motherboard assemblies are configured to operate when submersed in a liquid coolant. The motherboard assemblies are mounted on the frame with one or more spaces between. The spaces form one or more channels between the motherboard assemblies. The frame includes an opening on at least one end of the one or more channels. | 10-09-2014 |
20140307384 | INTEGRATED COMPUTING MODULE WITH POWER AND LIQUID COOLING COMPONENTS - A computing module includes one or more racks, one or more cooling components, and one or more power distribution components. The racks include one or more servers and one or more tanks that hold liquid coolant for the servers. The one or more cooling components move a liquid to remove heat from the servers. The one or more power distribution components supply power to the servers. The one or more racks, one or more cooling components, and one or more power distribution components are commonly coupled to one another to be movable as a unit. | 10-16-2014 |
20140334095 | RADIATOR AND ELECTRONIC DEVICE HAVING THE SAME - A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube. | 11-13-2014 |
20140355204 | ELECTRONIC CIRCUIT DEVICE WITH ELECTROMAGNETIC CLOCK SIGNAL CONVEYED ALONG COOLING FLUID CONDUIT NETWORK - Electronic circuit device (ECD) and method for conveying clock signal in an ECD. The ECD includes: a cooling fluid conduit network (CFCN) including at least one conduit adapted for conveying an electromagnetic signal, wherein the CFCN is arranged in thermal communication with a first set of one or more components of the ECD and is in signal communication with a second set, and wherein the CFCN is configured to convey both a cooling fluid in the at least one conduit and an electromagnetic signal via the at least one conduit; a clock signal injection unit configured to inject an electromagnetic clock signal (ECS) at an input location of the CFCN; and a clock signal collection unit configured to collect at an output location of the CFCN, an ECS for one or more components of the second set, wherein the ECS is conveyed via a conduit of the CFCN. | 12-04-2014 |
20140362527 | SYSTEM AND METHOD OF PACKAGING COMPUTING RESOURCES FOR SPACE AND FIRE-RESISTANCE - A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant. | 12-11-2014 |
20140376178 | HEAT DISSIPATING SYSTEM - Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar. | 12-25-2014 |
20150036288 | VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the coolant exhaust. | 02-05-2015 |
20150049432 | PRIMARY CIRCUIT/SECONDARY CIRCUIT COOLING WITH LIQUID IN BOTH CIRCUITS - Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank. | 02-19-2015 |
20150062806 | Immersion Server, Immersion Server Drawer, and Rack-Mountable Immersion Server Drawer-Based Cabinet - An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within/at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable. | 03-05-2015 |
20150077930 | DATA PROCESSING RACK UNIT - A data processing rack unit including: a rack; a data processing device; a cable; a coupling member that is connected to a water pipe that is formed at a column positioned on the one side out of a plurality of columns and through which cooling water flows, and that extends toward one side; a cooling water pipe that is provided at the data processing device and cools an internal portion of the data processing device; and a coupled-to member that is provided at a location on the one side of the data processing device, that is connected to the cooling water pipe, that extends toward the opposite side from the one side, and that is coupled to the coupling member accompanying insertion of the data processing device into the rack. | 03-19-2015 |
20150109730 | DIRECT COOLANT CONTACT VAPOR CONDENSING - Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber. | 04-23-2015 |
20150131224 | LIQUID COOLING OF MULTIPLE COMPONENTS ON A CIRCUIT BOARD - A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate. | 05-14-2015 |
20150146368 | SCALABLE LIQUID SUBMERSION COOLING SYSTEM - A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems. | 05-28-2015 |
20150309546 | Computing Devices - Two computing elements ( | 10-29-2015 |
20150319883 | LIQUID COOLING SYSTEM FOR A SERVER - A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room. | 11-05-2015 |
20150319887 | LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING - Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums comprise saturated medium chain triglycerides having fatty acid carbon chain lengths in the range of from 6 to 12 carbon atoms. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors. | 11-05-2015 |
20150319889 | LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING - Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190° C., as determined according to ASTM D92, and a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors. | 11-05-2015 |
20150382514 | COOLING SYSTEM FOR A SERVER - Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold. | 12-31-2015 |
20160011635 | COOLING SYSTEM AND ELECTRONIC DEVICE | 01-14-2016 |
20160014932 | LIQUID SUBMERGED, HORIZONTAL COMPUTER SERVER RACK AND SYSTEMS AND METHOD OF COOLING SUCH A SERVER RACK | 01-14-2016 |
20160014933 | ELECTRONIC APPARATUS COOLING SYSTEM AND ELECTRONIC APPARATUS COOLING SYSTEM FABRICATION METHOD | 01-14-2016 |
20160014934 | COOLING MECHANISM FOR DATA CENTER | 01-14-2016 |
20160026224 | INFORMATION PROCESSING SYSTEM AND METHOD OF CONTROLLING INFORMATION PROCESSING SYSTEM - A disclosed information processing system includes a plurality of information processing devices cooled by cooling water; a plurality of chillers each configured to circulate the cooling water to and from the plurality of the information processing devices; a flow monitor unit configured to monitor a total flow volume, where the total flow volume being a sum of a flow volume of each cooling water of the plurality of the chillers; and adjustment units each provided to each of the chiller, where the adjustment unit being configured to adjust an individual flow volume of the cooling water in the corresponding chiller, such that the total flow volume monitored by the flow monitor unit becomes equal to a set value suitable for cooling the plurality of the information processing devices. | 01-28-2016 |
20160044833 | RECIRCULATING DIELECTRIC FLUID COOLING - Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed. | 02-11-2016 |
20160066480 | BLIND DOCKING APPARATUS TO ENABLE LIQUID COOLING IN COMPUTE NODES - An apparatus includes a rigid structure having first and second collars, a quick connect connector having first and second shoulders, and a spring biasing the connector toward an extended position with the first shoulder against the first collar and the second shoulder against the second collar. The first collar and the first shoulder form an inwardly and rearwardly angled contact surface there between, and the second collar and the second shoulder form an inwardly and rearwardly angled contact surface there between. The connector is centered in the first and second collars unless acted upon by a force overcoming the spring and pushing the connector to a retracted position with the first and second shoulders out of contact with the first and second collars. When retracted, the connector may adjust its position longitudinally, vertically, laterally or angularly to facilitate coupling with a mating fixed quick connect connector. | 03-03-2016 |
20160085277 | COOLING ELECTRONIC DEVICES IN A DATA CENTER - A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices. | 03-24-2016 |
20160113149 | MULTIFUNCTION COOLANT MANIFOLD STRUCTURES - A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir. | 04-21-2016 |
20160135323 | SMART MISSION CRITICAL RACK - Disclosed is a space and cost-efficient smart rack system designed for use in a data center or as a similar electronic component housing enclosure. | 05-12-2016 |
20160165761 | SYSTEM FOR MOUNTING AND COOLING A COMPUTER COMPONENT - A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line. | 06-09-2016 |
20160381838 | COOLING DEVICE AND ELECTRONIC DEVICE SYSTEM - A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator. | 12-29-2016 |
20180027702 | FLUID MANIFOLD | 01-25-2018 |
20190150323 | MULTIFUNCTION COOLANT MANIFOLD STRUCTURES | 05-16-2019 |