Entries |
Document | Title | Date |
20090109613 | MEMORY MODULE HEAT SINK - The invention relates to a memory module heat sink, in particular for FB-DIMM memory modules, for dissipating heat generated in the memory module to the outside, having an essentially planar metal plate ( | 04-30-2009 |
20090122481 | MEMORY HEAT SINK DEVICE PROVIDED WITH EXTRA HEAT SINK AREA - A memory heat sink device provided with an extra heat sink area includes two cooling fins that are respectively attached to the front and back sides of a memory. A plurality of raised dots that protrude toward the front side are formed on the cooling fin attached to the front side of the memory. Each of the raised dots and the cooling fin has at least one sectional area and one connection portion. Thus, the heat sink area of cooling fin increases and the sectional area is used to easily dissipate heat generated by the memory in the manner of convection. | 05-14-2009 |
20090201639 | CHASSIS OF PORTABLE ELECTRONIC APPARATUS - A chassis of a portable electronic apparatus includes a heat sink assembly disposed therein and carries a keyboard on the top. The chassis has an air inlet and an air outlet on a first surface on the side opposite to the keyboard, which are respectively corresponding to an intake end and an exhaust end of the heat sink assembly. The air outlet extends from the first surface to a second surface connected to the first surface, and the second surface has an opening for disposing communication connectors, so as to adequately the heat sink assembly and the communication connectors. | 08-13-2009 |
20090268394 | HEAT-RADIATING MICROCOMPUTER CASE - A heat-radiating microcomputer case includes a base having a bottom wall and two upright side walls, a top cover having a plurality of radiating fins formed on a top surface thereof, and a system unit located below a bottom surface of the top cover. Each of the two upright side walls of the base has a free edge with an insertion channel formed along an outer corner thereof. The top cover has two downward extended insertion sections slidably fitted in the insertion channels on the base to detachably assemble to the base. The system unit includes a circuit board having a heat-producing electronic element arranged on an upper side thereof to contact with the bottom surface of the top cover, so that heat produced by the electronic element may be transferred to the large-area top cover and dissipated into ambient air quickly. | 10-29-2009 |
20090268395 | Backplate for heat radiator - A backplate for heat radiator is configured to mount to a rear side of a motherboard, and is provided at predetermined positions with an insulating bonding material. The insulating bonding material not only firmly connects the backplate to the rear side of the motherboard, but also serves as an insulating means between the metal backplate and the motherboard. That is, with the insulating bonding material, the backplate would not separate from the motherboard when the motherboard is moved, and the motherboard is electrically insulated from the backplate. | 10-29-2009 |
20090284913 | APPARATUS INCLUDING PROCESSOR - An apparatus is disclosed. The apparatus includes a processor having a major surface, where the processor generates heat when energized. It also includes a heat dissipation plate comprising a thermally conductive material, and includes a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion. The heat dissipation plate is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate, and a heat dissipating material contacting the heat dissipation plate and the major surface of the processor. The heat dissipating material does not contact the second portion of the heat dissipating plate, and the pins are configured to be received in a socket assembly on a circuit board. | 11-19-2009 |
20090290301 | HEAT SINK FOR AN ELECTRONIC DEVICE - An electronic device with a clip and a plate of thermally conductive material is disclosed. A first surface of the plate is attached to a surface of the electronic device. The clip is arranged on a second surface of the plate. Two ends of the clip clasp the electronic device and the plate at opposed edges of the electronic device, pressing the plate to the electronic device. | 11-26-2009 |
20090310297 | PROTECTIVE COVER FOR LAPTOP COMPUTER - An exterior cover for a laptop computer having a display portion and a keyboard portion is disclosed. The exterior cover includes a first rigid planar element for placement on an outside surface of the display portion. The first rigid planar element includes a raised edge along a perimeter of the first rigid planar element, wherein the raised edge extends toward the display portion. The first rigid planar element further includes a plurality of tabs located on the raised edge, wherein each tab extends from the raised edge for gripping the display portion. The exterior cover further includes a second rigid planar element for placement on an outside surface of the keyboard portion. The second rigid planar element includes a raised edge extending toward the keyboard portion. The second rigid planar element further includes a plurality of tabs for gripping the keyboard portion. | 12-17-2009 |
20090316352 | MEMORY MODULE ASSEMBLY HAVING HEAT SINKS WITH IMPROVED STRUCTURE - A memory module assembly includes a printed circuit board having a plurality of heat-generating electronic components thereon, first and second heat sinks formed by stamping a metal sheet and attached on opposite sides of the printed circuit board and a clamp clamping the first, second heat sinks and the printed circuit board together. The first and second heat sinks each comprise a plurality of fins extending therefrom and define a plurality of openings between the fins. The fins and openings are alternately arranged on each of the first and second heat sinks along a height direction thereof. The second heat sink includes a pair of positioning tongues extending from opposite side edges thereof. The first heat sink engages with the second heat sink via the positioning tongues of the second heat sink extending in and engaging with the first heat sink. | 12-24-2009 |
20090323277 | Information Processing Apparatus - According to one embodiment, an information processing apparatus includes a heating device, a heat radiation module, a first temperature sensor configured to detect a temperature at a first position on a printed circuit board, a second temperature sensor configured to detect a temperature at a second position on the printed circuit board, which is farther from the heating device than the first position, a temperature difference detection module configured to detect a temperature difference which is obtained by subtracting the temperature at the second position from the temperature at the first position, and a performance determination module configured to execute a monitoring process of monitoring the temperature difference between the temperature at the first position and the temperature at the second position, and to determine whether a performance of the heat radiation module has lowered or not. | 12-31-2009 |
20100046160 | ENCLOSURE AND HEAT DISSIPATING DEVICE FOR THE SAME - An enclosure includes a back plate and a heat dissipating device. The back plate includes a plurality of locking members extending from the back plate. The heat dissipating device attached to the back plate and includes a plurality of fixing members engaging with the locking members. | 02-25-2010 |
20100053885 | METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES USING THERMALLY CONDUCTIVE HINGE ASSEMBLIES - An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing. In some embodiments, the hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing and on to the second housing. The second housing may include a heat spreader for dissipating the heat from the hinge assembly throughout the second housing. | 03-04-2010 |
20100128432 | SYSTEM AND METHOD FOR VIRTUAL COMPUTING ENVIRONMENT MANAGEMENT, NETWORK INTERFACE MANIPULATION AND INFORMATION INDICATION - An apparatus for providing virtualization services is presented. According to an exemplary embodiment, the apparatus may include a middle chassis for containing one or more computing components for providing virtualization services, a top chassis for covering the middle chassis, where the top chassis includes a heat sink for conducting thermal energy away from the one or more computing components contained in the middle chassis, and where the top chassis is capable of being securely fastened to the middle chassis. The exemplary embodiment may further include a bottom chassis providing a base for the apparatus and a covering for the bottom of the middle chassis, where the bottom chassis includes a heat sink for conducting thermal energy away from the one or more computing components contained in the middle chassis, and where the bottom chassis is capable of being securely fastened to the middle chassis. The exemplary embodiment may further include a carrier board for securing one or more components, the carrier board communicatively coupling the one or more computing components and the carrier board being capable of being securely fastened to the middle chassis. | 05-27-2010 |
20100157522 | Alternative Form Factor Computing Device with Cycling Air Flow - Various apparatus and methods of removing heat from devices in a computing device. In one aspect, a method of removing heat from a semiconductor chip in an enclosure of a computing device is provided. Heat from the semiconductor chip is transferred using a heat sink that is thermally coupled to the semiconductor chip. Air is moved using an air mover positioned in the enclosure. The air mover is operable to move the air past the heat sink and recycle at least a portion of the air to again pass the heat sink. | 06-24-2010 |
20100182744 | THERMAL SPACER FOR STACKED DIE PACKAGE THERMAL MANAGEMENT - In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated circuit die, and a thermal spacer between the top and bottom integrated circuit dice, the thermal spacer comprising a heat conducting material and the thermal spacer overhanging and extending parallel with one outside edge of the bottom integrated circuit die. Other embodiments are also disclosed and claimed. | 07-22-2010 |
20100220440 | HEAT SINK AND MOTHERBOARD ASSEMBLY UTILIZING THE HEAT SINK - A heat sink to dissipate heat for a motherboard includes a main body, and a fixing device. The main body includes a number of fins. The fixing device includes a fixing portion connected to a bottom of the main body, and two grounding pins extending from a bottom of the fixing portion, to engage in two idle grounding holes of the motherboard. A motherboard assembly utilizing the heat sink is also provided. | 09-02-2010 |
20100220441 | MODULAR TEST SYSTEMS FOR SEVERE ENVIRONMENTS - A modular equipment testing apparatus is suitable for use in severe environments. The testing apparatus comprises a base computing unit, an interchangeable test instrument board, and an interchangeable equipment interface pod. The base computing unit and the interchangeable test instrument board are sealed within a computing case. A bottom panel of the computing case is formed of a heat conducting material and acts as a heat sink for removing heat from inside the computing case. The computing case and the equipment interface pod interface to form a hermetically sealed case, which can withstand a drop of 1 meter to a solid surface and immersion to a depth of 0.5 meters in water without damage to components located within the sealed case. | 09-02-2010 |
20100254082 | Cooling Plate for a Notebook - A cooling plate for a notebook comprises a base, a deck, a support jig, and a mouse piece, wherein the base is axially connected with the deck and includes an air hole formed thereon, the air hole includes a fin and a fixing panel connected therewith, the base also includes a recessed opening adjacent to the air hole, the deck includes a chamber formed on a middle portion thereof and having a number of positioning tabs attached on two sides of the chamber individually, and includes two covers disposed on two sides thereof respectively, each cover includes a cut mounted on an inner side thereof and a plurality of engaging protrusions adjacent to an inner side of a bottom surface thereof, the support jig is pivotally disposed in the opening of the base, and the support jig includes two retaining foots arranged on two sides of the rear end thereof. | 10-07-2010 |
20100259890 | COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE - A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation. | 10-14-2010 |
20100290184 | TEMPERATURE CONTROL APPARATUS, INFORMATION PROCESSING APPARATUS AND METHOD FOR TEMPERATURE CONTROL - A temperature control apparatus for controlling a temperature of an electronic device operating with a power supply from a power supply unit, the temperature control apparatus includes a thermoelectric element configured to be serially connected between the power supply unit and the electronic device, and provided at a position where heat generated by the electronic device is transmitted so as to perform a temperature control over the electronic device with the power supplied from the power supply unit. | 11-18-2010 |
20100296240 | METHOD AND APPARATUS FOR THERMAL MANAGEMENT OF COMPUTER MEMORY MODULES - A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body. | 11-25-2010 |
20100309626 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION STRUCTURE - An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other. | 12-09-2010 |
20110013359 | Low Cost Liquid Cooling - A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes. Advantageously, the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring interrupting the cooling process applied to the cooling plate. | 01-20-2011 |
20110013360 | Quasi-radial heatsink with rectangular form factor and uniform fin length - In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular cross sectional form factor. Other embodiments are disclosed and claimed. | 01-20-2011 |
20110103011 | HEAT EXCHANGER DEVICE AND METHOD FOR HEAT REMOVAL OR TRANSFER - Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air. | 05-05-2011 |
20110110030 | COMPUTER SYSTEM WITH HEAT SINK - A computer system includes a chassis, a motherboard secured to the chassis, and a heat sink. A chip is mounted on the motherboard. A securing component secured to the motherboard adjacent the chip. The securing component defines an opening. Two positioning posts are located on the motherboard and adjoin two opposite edges of the opening. Each positioning post defines a fastener hole. A heat sink includes a main body and a fin portion located on the fin portion. The main body defines two through holes. The fin portion defines two recesses to expose the through holes. The heat sink is secured to the securing component, by two fasteners engaged in the through holes and the fastener holes. | 05-12-2011 |
20110110031 | Apparatuses And Methods For Dissipating Heat From A Computer Component - Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component. | 05-12-2011 |
20110116227 | COMPUTER SYSTEM WITH HEAT SINK - A computer system includes a chassis, a motherboard, an isolation component, and a block. The chassis includes a bottom wall, and a sidewall connected to the bottom wall. The motherboard is secured to the chassis. A heat sink is secured to the motherboard for cooling a chip mounted on the motherboard. An isolation component is secured to the chassis between the bottom wall and the motherboard. The isolation component includes a bent piece attached to the side wall and positioned between the heat sink and the sidewall. A distance is defined between the bent piece and the heat sink. The block is attached to the bent piece and positioned between the heat sink and the sidewall to span the distance. | 05-19-2011 |
20110122574 | ELECTRONIC APPARATUS - An electronic apparatus | 05-26-2011 |
20110134606 | LOW PROFILE COMPUTER PROCESSOR RETENTION DEVICE - A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame. | 06-09-2011 |
20110149509 | ELECTRONIC DEVICE THERMAL MANAGEMENT - An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described. | 06-23-2011 |
20110255240 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly includes a motherboard defining a number of plug slots, and a fixing mechanism for securing a heat sink. The fixing mechanism is positioned between two adjacent plug slots, and includes a support member mounted on the motherboard, two fixing brackets mounted on opposite ends of the support member, two bars rotatably connected to the fixing brackets, and a connection member detachably connected to the support member by the bars. The opposite borders of the support member extend in the same direction substantially parallel to the plug slots, and the support member forms four connecting portions for securing the heat sink on opposite sides thereof, and the connecting portions are located between the opposite borders. | 10-20-2011 |
20110255241 | PACKAGE AND ASSEMBLY HAVING A COMPUTER HOUSING, AN ARTICLE, AND THE PACKAGE - An assembly includes an article, and a computer housing including left and right sidewalls cooperatively defining an accommodating space and an opening for communicating the accommodating space with an external environment, and a positioning member provided on one of the sidewalls. Each sidewall includes a slide rail. A package is mounted removably in the accommodating space via the opening, is connected slidably to the slide rails of the sidewalls, and is positioned within the accommodating space through the positioning member. The package includes two interconnected cover parts cooperatively defining a receiving space for receiving the article and a communicating hole for communicating the receiving space with the external environment, and a handgrip to mount removably the package in the accommodating space. Each cover part includes a stop member abutting against the article to prevent escape of the article from the receiving space via the communicating hole. | 10-20-2011 |
20110267771 | HEAT SINK TYPE MODULE - A heat sink type module includes a mounting seat and a heat sink. The mounting seat includes a supporting plate, and two substantially parallel first side plates extending up from opposite first sides of the supporting plate. A latch protrudes from an inner surface of each first side plate. A heat sink includes a base plate and fins extending up from a top surface of the base plate. The base plate includes two substantially parallel first sides. The latches of the first side plates latch the first sides of the base plate to fix the heat sink. | 11-03-2011 |
20110273842 | Processor Loading System - A component loading system includes a board having a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket. A base member defines two base member securing holes, wherein the base member is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole. A loading member includes a pair of second heat dissipater coupling posts extending from the loading member, wherein the loading member is operable to be secured to the board by coupling the loading member to the base member and securing the loading member to the board using the first mounting member, and wherein a heat dissipater is operable to be coupled to the base member and the loading member using the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts. The component loading system couples a component to the socket while using less board space and volume next to the board than conventional loading systems in order to provide for, for example, increased trace routing volume and closer component positioning adjacent the socket. | 11-10-2011 |
20110286178 | Heat Sink For Distributing A Thermal Load - Heat sinks for distributing a thermal load are disclosed that include: a bottom plate; a front top plate; a back top plate; and a plurality of heat-dissipating fins connected to the bottom plate, the front top plate, and the back top plate, wherein the front top plate and the back top plate are separated by a predetermined distance. | 11-24-2011 |
20110286179 | MEMORY MODULE CONNECTOR HAVING MEMORY MODULE COOLING STRUCTURES - One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling. | 11-24-2011 |
20110286180 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a heat sink and a number of cooling members. A number of grooves are defined in a bottom of the heat sink. Each cooling member includes a first cooling piece, a second piece opposite to the first cooling piece, and a connection piece connected between tops of the first cooling piece and the second cooling piece. The heat sink is fixed on tops of the cooling members, with the connection pieces of the cooling members received in the corresponding grooves of the heat sink. | 11-24-2011 |
20110292596 | Heatsink Allowing In-Situ Maintenance in a Stackable Module - A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module. | 12-01-2011 |
20110292597 | Stackable Module for Energy-Efficient Computing Systems - A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system. | 12-01-2011 |
20120020017 | PRINTED CIRCUIT BOARD MODULE ENCLOSURE AND APPARATUS USING SAME - A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, and top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the top and bottom surfaces and being disposed on opposite sides of the circuit board from each other. A thermal shunt comprised of a thermally conductive material is disposed between the circuit board and the front surface of the enclosure and provides a thermally conductive path between at least some of the electronic components and the front surface of the enclosure, where the front surface of the enclosure conducts heat to at least one of the top, left, and right surfaces of the enclosure. | 01-26-2012 |
20120044635 | INTERNAL FRAME OPTIMIZED FOR STIFFNESS AND HEAT TRANSFER - A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame. | 02-23-2012 |
20120069515 | ELECTRONIC DEVICE WITH HEAT DISSIPATION CASING - An electronic device includes a casing, an electronic component accommodated in the casing; and a composite heat conductive layer between the casing and the electronic component. The composite heat conductive layer includes a graphite layer and a thermal pad layer between the electronic component and the graphite layer. The thermal pad layer is attached to the electronic component. The graphite layer is attached to an inner surface of the casing. The graphite layer is located between the casing and the thermal pad layer. Heat conductive efficiency of the graphite layer along a horizontal spreading direction thereof exceeds that along a vertical thickness direction thereof. A surface area of the graphite layer is not less than that of the electronic component. Heat generated by the electronic component is evenly transferred and is spread to the casing via the graphite layer of the composite heat conductive layer. | 03-22-2012 |
20120075798 | HEAT DISSIPATING APPARATUS - A heat dissipating apparatus comprises a first heat sink, a second heat sink and a fixing unit. The first heat sink comprises a connecting portion. The second heat sink comprises a connecting unit which is inserted into the connecting portion. The fixing unit includes an end portion exposed outside the connecting portion and a body accommodated in the connecting portion. | 03-29-2012 |
20120092826 | COLLAR FOR ELECTRICALLY GROUNDING A HEAT SINK FOR A COMPUTER COMPONENT - To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board. | 04-19-2012 |
20120106074 | Heat Sink Integrated Power Delivery and Distribution for Integrated Circuits - A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer. | 05-03-2012 |
20120106075 | COMPUTER ENCLOSURE - A computer enclosure includes an enclosure, an air conduction member mounted in the enclosure to guide airflow, and a data storage device mounted to a top of the air conduction member. | 05-03-2012 |
20120113589 | WEDGE LOCK FOR USE WITH A SINGLE BOARD COMPUTER AND METHOD OF ASSEMBLING A COMPUTER SYSTEM - A wedge lock for use with a single board computer includes a first portion configured to move in a first direction and a second portion configured to move in a plurality of directions in response to the movement of the first portion and to facilitate securing the single board computer in an operating environment and to facilitate conduction cooling of the single board computer. | 05-10-2012 |
20120147554 | MOTHERBOARD SYSTEM HAVING HEAT DISSIPATING DEVICE - A motherboard system includes a PCB, a CPU socket mounted on the PCB, a heat dissipating device, and a number of fastening devices. The CPU socket is configured for receiving a CPU. The heat dissipating device is mounted on the CPU socket for dissipating heat generated by the CPU. The fastening devices extend through the heat dissipating device and the CPU socket and are engaged in the PCB, thereby fastening the heat dissipating device, and the CPU socket to the PCB. | 06-14-2012 |
20120155018 | Rotatable Latch For Compressing Thermal Interface Material Between A Heat Generating Electrical Component And A Cooling Electrical Component - Apparatuses are provided for compressing a thermal interface material between a heat generating electronic component and a cooling electrical component. Embodiments include a rotatable latch fastened to the heat generating electrical component, the rotatable latch including a hook; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages a pin extending from the cooling electrical component such that the thermal interface material adhered to the heat generating electrical component is coupled to the cooling component; when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the cooling electrical component; a load screw; wherein when the rotatable latch is in the engaged position, threading the load screw into the rotatable latch moves the rotatable latch into a locked state; and a spring leaf that is coupled to the heat generating electrical component. | 06-21-2012 |
20120162907 | COMPUTER SYSTEM WITH AIR GUIDING DUCT - A computer system includes a computer case and an air guiding duct. The motherboard is attached to the computer case, and a heat sink is attached to the motherboard. The air guiding duct includes a top panel. A mounting member is slidably attached to the top panel and is clipped to the heat sink. A limiting device is located on the top panel and engaged with the mounting member to prevent the mounting member from sliding relative the top panel. | 06-28-2012 |
20120170210 | MOUNTING STRUCTURE AND METHOD FOR DISSIPATING HEAT FROM A COMPUTER EXPANSION CARD - A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure. | 07-05-2012 |
20120182686 | ELECTRONIC DEVICE - An electronic device includes a motherboard and a heat dissipating plate. The motherboard includes a base. The base includes a number of ports and an electronic element. The heat dissipating plate includes a substrate and a number of fasteners extending out from the substrate for engaging with the number of ports of the motherboard. The substrate defines a bulging cavity for engaging with and dissipating heat from the electronic element. | 07-19-2012 |
20120188707 | SLIDINGLY-ENGAGED HEAT-DISSIPATING ASSEMBLY FOR MEMORY AND MEMORY DEVICE HAVING THE SAME - A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other. | 07-26-2012 |
20120188708 | THERMAL AND POWER BUS STACKED PACKAGE ARCHITECTURE - A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board. | 07-26-2012 |
20120188709 | ELECTRONIC DEVICE WITH HEAT DISSIPATION STRUCTURE - An electronic device includes a computer, a circuit board, a supporting base attached to a top surface of the circuit board, and a backboard attached to a bottom surface of the circuit board. The case includes a bottom plate. The circuit board defines a through hole. A CPU is located on the supporting base. The backboard defines a retaining hole. The supporting base defines a fixing hole. A heat sink is attached to the supporting base and contacted the CPU. A fixing member is engaged with the retaining hole, the fixing hole and the through hole, to engage the backboard and the supporting base to the circuit board. | 07-26-2012 |
20120250248 | PORTABLE ELECTRONIC DEVICE WITH CONDUCTIVE FOAM - A portable electronic device comprises a motherboard with an electronic component mounted thereon, an electrical conducting port disposed on the motherboard, a heat dissipation plate for dissipating heat of the electronic component, and conductive foam placed between the electrical conducting port and the heat dissipation plate. The heat dissipation plate has a protrusion extending therefrom corresponds to the electrical conducting port. The conductive foam defines a hole, and the protrusion of the heat dissipation plate extends through the hole of the conductive foam to contact the electrical conducting port. | 10-04-2012 |
20120275109 | ELECTRONIC DEVICE WITH EMI SHIELDING HEAT DISSIPATION MEMBER - An electronic device include a metal chassis, a motherboard within the metal chassis, a central processing unit (CPU) socket attached on the motherboard, a CPU attached to the CPU socket, a heat dissipation pad attached on the CPU, and a metal heat dissipation member. The metal heat dissipation member is attached on the heat dissipation pad to transfer heat from the CPU and abuts the metal chassis to provide electro magnetic interference (EMI) shielding for the CPU. | 11-01-2012 |
20120293952 | HEAT TRANSFER APPARATUS - An apparatus is provided to remove heat from a heat-generating component of a computer, such as a processor. The apparatus comprises a first heat sink having a plurality of leader fins, wherein the first heat sink is thermo-conductively coupled to a heat-generating component that is coupled to a first portion of a chassis; and a second heat sink having a plurality of follower fins, wherein the second heat sink is thermo-conductively coupled to a second portion of the chassis, and wherein the plurality of follower fins are disposed in an interlaced configuration with the plurality of follower fins to promote radiative heat transfer from the leader fins to the follower fins. Optionally, one or more alignment structures may be used to facilitate the relative movement of the first and second chassis portions into an operative position in which the leader and follower fins are in the interlaced configuration. The apparatus may be used to remove heat from a heat-generating component in a closed system with little or no limited air flow. | 11-22-2012 |
20120314364 | COMPUTER CASING HAVING LIQUID COOLING UNIT - A computer casing includes several electronic components, a first heat sink, a side plate, a second heat sink, a container, a pump, and a tube. The first heat sink is attached to an electronic component, and defines a channel including an inlet and an outlet. The side plate defines an opening. The second heat sink is fixed to the side plate and covers the opening. The second heat sink includes a first side facing the opening and an opposite side external to the side plate. The container is used to store coolant and is fixed to the first side of the second heat sink. A pump is connected to the container. The tube includes a first end connected to the pump and a second end connected to the inlet of the channel of the first heat sink, and stays in contact with the first side of the second heat sink. | 12-13-2012 |
20120320523 | Memory Cooler - A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module. | 12-20-2012 |
20120320524 | Heatsink Allowing In-Situ Maintenance in a Stackable Module - A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module. | 12-20-2012 |
20130016473 | Electronic DeviceAANM Ito; NaoyukiAACI OsakaAACO JPAAGP Ito; Naoyuki Osaka JPAANM Shiraga; KazuhiroAACI OsakaAACO JPAAGP Shiraga; Kazuhiro Osaka JPAANM Goto; ShinjiAACI OsakaAACO JPAAGP Goto; Shinji Osaka JP - An electronic device includes: a casing in which electronic components including a heat-emitting component which emits heat during operation are accommodated; a heat-dissipating component including a plurality of fins to which heat emitted in the heat-emitting component transfers; a fan operable to supply cooling air to the heat-dissipating component; and a cleaning component movable on an end surface of the fins along the side nearer the fan with the cleaning component abutting against the end surface of the fins. In these features, dust on the end surface of the fins can be automatically removed by moving the cleaning component in the case of the spatial orientation of the electronic device being changed. Therefore, an effect of removing heat emitted in the heat-emitting components, by using cooling air supplied from the fan, can be continuously obtained. | 01-17-2013 |
20130044426 | MODULAR DATA CENTER - A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure. | 02-21-2013 |
20130077233 | ELECTRONIC DEVICE - An electronic device having a heat generating element and a housing is provided including a heat dissipation arrangement provided between the heat generating element and the housing, the heat dissipation arrangement comprising a first layer in contact with the heat generating element and a second layer provided on top of the first layer and being in contact with the housing, the first layer having higher heat conductivity than the second layer, the second layer preventing heat from rapidly passing through such that the heat can be diffused in the first layer. | 03-28-2013 |
20130120932 | MOTHERBOARD WITH HEAT SINK - A motherboard includes a heat sink, a circuit board forming an electronic element and two latches at opposite sides of the electronic element, and two fixing members. The heat sink includes a base board and a number of rows of spaced fins. Two lows of protrusions are formed on the base board and are respectively located at opposite sides of a row of fins. Each protrusion defines a through hole. Each fixing member includes a clamping portion engaging with one of the latching members, and two engaging portions engaging in the corresponding through holes. | 05-16-2013 |
20130128452 | Circuit Board Heatsink and Heatframe Structures With Heater Element For Circuit Board Operation At Below Zero Temperature - A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device. | 05-23-2013 |
20130141866 | PORTABLE COMPUTING DEVICE WITH THERMAL MANAGEMENT - Various computing devices and methods of thermally managing the same are disclosed. In one aspect, a method of thermally managing a computing device is provided where the computing device includes a housing that has a wall adapted to contact a body part of a user, a circuit board in the housing, and a semiconductor chip coupled to the circuit board. The method includes placing a first heat spreader in thermal contact with the semiconductor chip and the circuit board but separated from the wall by a gap. | 06-06-2013 |
20130182389 | HEAT SINK FOR AN INTERCHANGEABLE EXPANSION MODULE CAPABLE OF BEING CONNECTED TO A COMPUTER BOARD - The invention relates to a heat sink for an interchangeable expansion module that can be connected to a computer board, said heat sink having at least one cooling module in which a coolant flows, and at least one first electrical connector, wherein said expansion module ( | 07-18-2013 |
20130229771 | Modifying The Spatial Orientation Of A Thermal Acoustic Panel Of A Computing Enclosure Rack - Methods, apparatuses, and computer program products for modifying the spatial orientation of a thermal acoustic panel of a computing enclosure rack are provided. Embodiments include receiving, by a configuration controller, a configuration preference from a user; identifying, by the configuration controller, a spatial orientation configuration corresponding to the configuration preference received from the user; and coordinating, by the configuration controller, movement of the thermal acoustic panel relative to a body of the computing enclosure rack in accordance with the identified spatial orientation configuration. | 09-05-2013 |
20130301214 | ELECTRONIC UNIT HAVING A HOUSING IN WHICH HEAT GENERATING COMPONENTS ARE DISPOSED - An electronic unit having a housing including a heat generating first component, a heat generating second component and a cooling system disposed in the housing, wherein during operation of the unit, the first and second components are cooled by the cooling system, and the first component connects to the second component via a heat-conducting connection such that a lower temperature of the first component and a higher temperature of the second component converge. | 11-14-2013 |
20140002989 | INTEGRATED HEAT SPREADER THAT MAXIMIZES HEAT TRANSFER FROM A MULTI-CHIP PACKAGE | 01-02-2014 |
20140043753 | HIGH POWER DISSIPATION MEZZANINE CARD COOLING FRAME - Some embodiments are directed to cooling frames for mezzanine cards, mezzanine card assemblies and circuit card assemblies. A recessed cooling frame may be used to dissipate heat generated by components of a mezzanine card. The cooling frame may be directly coupled to a host card or host card cooling frame, thereby reducing the number of interfaces and reducing the thermal resistance of the heat dissipation pathway. The cooling frames of some embodiments may provide more efficient heat dissipation and thereby allow higher performance mezzanine cards to be used. Some embodiments provide a mezzanine card assembly that conforms to the mechanical envelope dimensions of the VITA 20, VITA 42 or VITA 61 specifications. | 02-13-2014 |
20140043754 | SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING - An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler. | 02-13-2014 |
20140085813 | FILM OR COMPOSITE THAT INCLUDES A NANOMATERIAL - The present disclosure relates to a film or a composite that provides excellent heat removal capabilities and improved chemical stability and methods of forming the film and the composite. The film can be a layer of a nanomaterial. The composite can include a nanomaterial and a thermal interface material (TIM). The methods generally involve dispersing the nanomaterial in a carrier when forming the film or the composite. | 03-27-2014 |
20140098489 | HEAT DISSIPATING APPARATUS FOR FOLDING ELECTRONIC DEVICES - Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat. | 04-10-2014 |
20140098490 | HEAT DISSIPATING MODULE WITH ENHANCED HEAT DISSIPATION EFFICIENCY AND ELECTRONIC DEVICE THEREWITH - A heat dissipating module includes a main body, a heat dissipating unit and at least one resilient engaging unit. A side of the heat dissipating unit is connected to the main body and the other side of the heat dissipating unit contacts against at least one heat component. An end of the at least one resilient engaging unit is connected to a side of the main body and the other end of the at least one resilient engaging unit engages with a side of a fastening base. The at least one resilient engaging unit is for resiliently pressing the main body so that the dissipating unit contacts with the at least one heat component closely. | 04-10-2014 |
20140104786 | Electronic module with heat spreading enclosure - An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard. | 04-17-2014 |
20140118927 | INSULATOR MODULE HAVING STRUCTURE ENCLOSING ATOMSPHERIC PRESSURE GAS - A device including a heat-absorbing component, and one or more heat-generating components. At least one heat-generating component is located in proximity to an inner surface of the heat-absorbing component, and a gap exists between the at least one heat-generating component and the inner surface of the heat-absorbing component. The device further including an insulator, located in the gap, including an insulator structure enclosing atmospheric pressure gas, where the atmospheric pressure gas has a thermal conductivity lower than air. | 05-01-2014 |
20140118928 | ELECTRONIC DEVICE - An electronic device comprises a case, a heat source and a radiator. The heat source is disposed inside the case. The radiator is disposed on the case and the radiator is kept away from the heat source at a distance. The radiator comprises a case body. A plurality of cellular compartments formed by a plurality of partition plates is disposed inside the case body. The cellular compartments are filled with a heat dissipation material. The radiator absorbs the heat of the heat source through thermal radiation. | 05-01-2014 |
20140133093 | COOLING SYSTEM FOR ELECTRONICS - A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel. | 05-15-2014 |
20140160673 | LOW PROFILE HEAT SPREADER AND METHODS - Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die. | 06-12-2014 |
20140160674 | DISPLAY DEVICE - The present application discloses a display device including a display panel for displaying images; a first thermal conduction layer including a flexible and compressively deformable portion in contact with the display panel, and a thermal conduction portion for conducting heat from the flexible portion; and a second thermal conduction layer in contact with the thermal conduction portion. The first thermal conduction layer conducts heat isotropically. The second thermal conduction layer with higher thermal conduction characteristics in an in-plane direction than the first thermal conduction layer forms a thermal conduction element with the thermal conduction portion. The thermal conduction element includes a first area corresponding to a center of the display panel and a second area closer to an edge of the display panel than the first area. The second area has higher thermal conductivity in the in-plane direction than the first area does. | 06-12-2014 |
20140177166 | METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCTURES FORMED THEREBY - Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments. | 06-26-2014 |
20140177167 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and an air duct mounted to the heat sink. The heat sink includes a board and a number of fins extending up from the board. The air duct includes an installation piece pivotably mounted to a side of the heat sink, and a blocking piece extending substantially perpendicularly out from an end of the installation piece. | 06-26-2014 |
20140177168 | AIRFLOW DUCTING APPARATUS FOR DATA PROCESSING SYSTEMS - A data processing system includes an enclosure, one or more airflow manifold structures within the enclosure, and a plurality of data processor cards mounted within the enclosure. Each one of the one or more airflow manifold structures has an air inlet portion and an air outlet portion. Each one of the data processor cards extends substantially parallel to each other one of the data processor cards. Each one of the data processor cards includes an airflow duct having an air inlet portion thereof covering a portion of the air outlet portion of at least one of the one or more airflow manifold structures and includes a plurality of data processing units within the airflow duct. | 06-26-2014 |
20140211415 | CONSOLIDATED THERMAL MODULE - A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed. | 07-31-2014 |
20140233179 | DATA STORAGE SYSTEM AND A METHOD OF COOLING A DATA STORAGE SYSTEM - A data storage system and a method of cooling the data storage system are presented. The data storage system includes: an enclosure; one or more drawer structures disposed within the enclosure, wherein at least one of the drawer structures is configured to receive one or more electronic devices; and one or more temperature control elements positioned adjacent to the bottom of the at least one drawer structure, wherein at least one of the temperature control elements is arranged in use to thermally communicate with at least one of the electronic devices. | 08-21-2014 |
20140240921 | INFORMATION HANDLING SYSTEM HOUSING HEAT SPREADER - Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor. | 08-28-2014 |
20140240922 | ELECTRONIC DEVICE AND REAR CASE OF ELECTRONIC DEVICE - An electronic device having a heat generating part in an internal space between a front case and a rear case wherein the rear case is integrally molded with a metal sheet and the metal sheet is given relief shapes which increase its surface area, whereby the heat of the heating generating part is dissipated from the rear case and conduction to the front case is reduced. The relief shapes can be formed from a wave shape. The rear case may be made a bathtub shape. Relief shapes of the metal sheet may be exposed at the inside space of the electronic device at the side wall part of the rear case or its vicinity. As a result, the heat which is generated inside the housing of a small electronic device can be efficiently dissipated from the back side and conduction of heat to the front side can be made difficult. | 08-28-2014 |
20140268554 | Stackable Computing System - Systems and methods providing for stackable rack-based computing systems are discussed herein. A stackable rack-based computing system may include a plurality of stackable shelf frames. Each stackable shelf frame may include a module and one or more cooling elements to cool the module from a first side. The stackable shelf frames may be adjustable between an open configuration and a stacked configuration. In the stacked configuration, where the stackable shelf frames are stacked on top of each other, the modules may receive cooling from a second side from an adjacent stackable shelf frame. In the open configuration, a gap may be opened between any two of the plurality of stackable shelf frames for service and maintenance tasks. | 09-18-2014 |
20140285966 | SERVER CABINET - A server cabinet includes a cabinet body and a heat dissipation apparatus attached to one side of the cabinet body. The heat dissipation apparatus includes a thermal conductive film, a heat sink, and a side cover fixed to the cabinet body. The side cover defines an opening for receiving the heat sink. The thermal conductive film is adhered to the side of the cabinet body. The heat sink contacts with the thermal conductive film. | 09-25-2014 |
20140285967 | CONFORMAL COATING INCLUDING EMBEDDED THERMAL ENERGY ABSORBING MATERIAL - Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components. | 09-25-2014 |
20140293533 | Cooling Electronic Components and Supplying Power to the Electronic Components - A mechanism is provided for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module. The computer module comprises a printed circuit board module, wherein the electronic components are attached to a first side of the printed circuit board module, and a cooling module being attached to a second side of the printed circuit board, being arranged in parallel to the printed circuit board and having a first layer being thermally and electrically conductive. The first layer is arranged such that heat is dissipated from the printed circuit board module and that power from a power source is supplied to the electronic components of the printed circuit board module. | 10-02-2014 |
20140307385 | HEAT SINK BASE AND SHIELD - A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base. | 10-16-2014 |
20140321051 | Shielding Panel Having an Opening for a Heat Sink - An example provides an apparatus including a shielding panel in spaced relation to a substrate such that a heat sink mounted on the substrate protrudes through an opening in the shielding panel. A first airflow path may be provided between the substrate and a first side of the shielding panel, and a second airflow path may be provided on a second side of the shielding panel across a portion of the heat sink protruding through the opening. | 10-30-2014 |
20140328018 | FANLESS NOTEBOOK COMPUTER STRUCTURE PROVIDING ENHANCED GRAPHICS PERFORMANCE AND FORM FACTOR - A notebook computer includes a lower notebook portion that provides a fanless environment having a keyboard and supplemental electronics. Additionally, the notebook computer also includes an upper notebook portion that provides an additional fanless environment having a display and a processing unit, wherein the processing unit includes a general purpose CPU and an integrated GPU configured to operate in the additional fanless environment. Another notebook computer includes a fanless lower notebook body that has a keyboard and a discrete GPU and a fanless upper notebook body that has a display and a general purpose CPU with an integrated GPU, wherein the discrete GPU is configured to augment the integrated GPU. A method of manufacturing a notebook computer is also provided. | 11-06-2014 |
20140347811 | PORTABLE ELECTRONIC DEVICE WITH EXPOSED HEAT DISSIPATING MECHANISM - A portable electronic device with an exposed heat dissipating mechanism includes a housing and a heat dissipating plate. A heat generating unit is arranged inside the housing, and the heat dissipating plate includes a main body arranged inside the housing and at least one cooling portion extended from the main body and exposed on the housing. The main body and the heat generating unit are thermally connected to each other. Therefore, the effectiveness of the heat dissipation can be enhanced without increasing the thickness of the device and such that the need for heat dissipation in a portable electronic device of higher performance and computing power can be satisfied. | 11-27-2014 |
20140355205 | ELECTRONIC DEVICE WITH AIR DUCT - An electronic device includes a motherboard, a heat-generation element mounted on the motherboard, a heat sink attached on the heat-generation element, and an air duct located on the motherboard and covering the heat sink. The air duct includes a main body and an air baffle detachably mounted to the main body. The main body includes a top board, and a first side board and a second side board extending down from two opposite sides of the top board. The top board defines an opening adjacent to the second side board. The air baffle is detachably inserted into the opening. | 12-04-2014 |
20140355206 | DYNAMICALLY MOUNTING PROCESSING CONTROL UNITS AND DISSIPATING HEAT THEREFROM - Systems and methods for mounting a modular processing unit that is configured to be selectively used alone or with other processing units in an enterprise. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units (including base modules and/or peripheral modules) in an enterprise. The one or more processing units are dynamically mounted based upon the particular enterprise needed and corresponding environment. In at least some implementations, shock mounting is included to provide for needed shock and vibe requirements. In some implementations, the mounting system includes a fixed mounting system for environments that need to be fixably secured. In other implementations, a selectively releasable connector is provided to allow for ease in mounting and removing the dynamically modular processing unit. In other implementations, a press-fit connector is provided to allow for ease in mounting and removing the dynamically modular processing unit. | 12-04-2014 |
20140362528 | METHOD AND SYSTEM FOR ATTACHMENT OF A HEAT SINK TO A CIRCUIT BOARD - A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller. | 12-11-2014 |
20140368992 | Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials - According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat generating components using thermoplastic and/or self-healing thermal interface materials. In an exemplary embodiment, a thermal interface material has a softening or melting temperature above a normal operating temperature of the one or more heat generating components. The thermal interface material is flowable to a thin bond line between a heat spreader or lid and one or more heat generating components when heated to at least the softening or melting temperature while under pressure. | 12-18-2014 |
20150029660 | CONFIGURABLE HEAT CONDUCTING PATH FOR PORTABLE ELECTRONIC DEVICE - A portable electronic device includes at least one energy module which further included thermoelectric materials which may convert heat to electric power. A plurality of heat removers selectively thermal contact to at least one wall of an enclosure of the portable electronic device depended on the configuration of the portable electronic device. | 01-29-2015 |
20150029661 | WEARABLE PORTABLE ELECTRONIC DEVICE WITH HEAT CONDUCTING PATH - A wearable portable electronic device includes at least one energy module which further included thermoelectric materials which may convert heat to electric power. A plurality of heat spreader thermally and electronically contact to at least one wall of an enclosure of the wearable portable electronic device by using graphene layer. | 01-29-2015 |
20150043161 | THERMAL ENERGY STORAGE, DISSIPATION AND EMI SUPPRESSION FOR INTEGRATED CIRCUITS USING POROUS GRAPHITE SHEETS AND PHASE CHANGE MATERIAL - Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration. | 02-12-2015 |
20150077931 | ELECTRONIC DEVICE WITH SERVICEABLE CPU - An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink. | 03-19-2015 |
20150077932 | SHIELDING ASSEMBLY AND ELECTRONIC DEVICE - A shielding assembly is used to shield electronic element positioned on a motherboard of an electronic device. The shielding assembly includes a shielding frame fixed to a first surface of the motherboard, a heat dissipating module, and a shielding plate. The heat dissipating module is detachably assembled to the shielding frame. When the heat dissipating module is assembled to the shielding frame, the heat dissipating module and the shielding frame form a shielding space to receive the electronic element. The shielding plate is fixed to a second surface of the motherboard opposite to the shielding frame to completely shield the electronic element. | 03-19-2015 |
20150085442 | COMPUTER PROVIDED WITH COOLING SYSTEM - The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board. | 03-26-2015 |
20150092343 | ULTRA-CAPACITOR STRUCTURES AND ELECTRONIC SYSTEMS WITH ULTRA-CAPACITOR STRUCTURES - Ultra-capacitor structures and electronic systems and assemblies are provided. In one aspect, the ultra-capacitor structure is configured to selectively power and at least partially house electronic component(s) therein. In one embodiment, the ultra-capacitor structure includes a thermally conductive material facilitating dissipation of heat generated. In another embodiment, the ultra-capacitor structure includes an electrically conductive sheet facilitating electromagnetic shielding. In another aspect, an electronic system includes: an electronic device including electronic component(s); and a support structure physically receiving and electrically coupling to the electronic device, and including an ultra-capacitor structure configured to selectively power the electronic component(s) of the electronic device when electrically coupled to the support structure. In another aspect, an electronic assembly has a first region including electronic component(s), and a second region including an ultra-capacitor structure configured to selectively power the electronic component(s) of the electronic assembly, where the first region is spaced apart from the second region. | 04-02-2015 |
20150092344 | PUSH PIN AND GRAPHICS CARD WITH THE PUSH PIN - The invention discloses a push pin and a graphics card with the push pin. The push pin comprises a rod, a head, an expansion lock and a first spring. The head is disposed at a first end of the rod and having a radial dimension larger than that of the rod. The expansion lock is disposed at a second end of the rod which is opposite to the first end and having a radial dimension larger than that of the rod, wherein the expansion lock is configured to be elastically contractible when entering a component to be installed in an installing direction, and wherein the installing direction is from the first end to the second end. The first spring made of a conducting material and configured to be installable onto the rod from the second end in a direction opposite to the installing direction. | 04-02-2015 |
20150131225 | MOBILE TERMINAL - A heat-dissipating mobile terminal includes a main body, a heat dissipating member positioned in the main body, and a back cover detachably connected to the main body. The main body includes a heat-producing element and the heat dissipating member includes a heat radiator arranged above the heat-producing element. The back cover defines a perforated portion above the heat dissipating member. The heat radiator is integrated with the main body. The heat radiator is exposed to external cooler air by the perforated portion in the back cover. The mobile terminal of the present disclosure effectively improves heat radiating efficiency and reduces cost. | 05-14-2015 |
20150327353 | BACKSIDE INITIATED UNIFORM HEAT SINK LOADING - A backside initiated uniform heat sink loading system includes a system board assembly, a heat sink assembly, a loading plate, and a fastener. The system board assembly includes at least one processing unit. The heat sink assembly is mounted upon the processing unit from a topside of the system board assembly and includes a plurality of tension members that extend through the system board assembly. The loading plate is mounted to the plurality of tension members from a backside of the system board assembly. The fastener engages with the loading plate from the backside and forces the loading plate away from the system board assembly. As a result, the tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit with the system board assembly and to thermally contact the heat sink assembly with the processing unit. | 11-12-2015 |
20150355691 | MOUNTING STRUCTURE AND METHOD FOR DISSIPATING HEAT FROM A COMPUTER EXPANSION CARD - A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure. | 12-10-2015 |
20150382448 | THERMAL SOLUTIONS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE ELECTRONIC DEVICES - A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a single package to reduce size and enhance form factor. Several tens or hundreds of components including multiple dies, passive components, mechanical or optical components can be packaged into a single system on a printed circuit board. One or more of the components can dissipate a lot of power resulting in the generation of excess heat. To remove the excess heat, the device can include one or more thermal solutions such as internal thermal plugs, heat spreaders, internal embedded heat sinks, and/or external heat sinks. In some examples, the thermal solutions can dissipate heat via conduction to the bottom of the substrate or via convection to the top of the system or a combination of both. | 12-31-2015 |
20160004284 | THERMAL GAP PAD - This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad. | 01-07-2016 |
20160018862 | FRAME AND ELECTRONIC DEVICE HAVING THE SAME - A frame to be assembled to a housing of an electronic device is provided. The frame includes a first material portion and a second material portion. The first material portion has a first thermal conductivity coefficient, and the second material portion has a second thermal conductivity coefficient. The first material portion is connected to the second material portion, and the first thermal conductivity coefficient is greater than the second thermal conductivity coefficient. A stiffness of the second material portion is greater than a stiffness of the first material portion. A heat generating element of the electronic device dissipates heat by the first material portion, and the heat generating element is disposed to be corresponding to the first material portion. An electronic device having said frame is also provided. | 01-21-2016 |
20160054770 | GRAPHENE HEAT DISSIPATORS IN PORTABLE ELECTRONIC DEVICES - The disclosed embodiments relate to techniques for facilitating thermal transfer in a portable electronic device. The portable electronic device includes a battery pack, which further includes a battery cell. The battery pack may supply power to a set of components in the portable electronic device. The portable electronic device also includes a heat dissipator composed of graphene. The heat dissipator may be in thermal contact with one or more of the components. The heat dissipator may also be disposed over a surface of the battery pack. | 02-25-2016 |
20160070318 | SYSTEMS AND METHODS FOR SUSTAINABLE SELF-COOLING OF CENTRAL PROCESSING UNIT THERMAL HOT SPOTS USING THERMOELECTRIC MATERIALS - Embodiments of a sustainable self-cooling framework for processors using thermoelectric generators that power an arrangement of thermoelectric coolers to reduce the temperature of thermal hot spots generated by a processor are disclosed. | 03-10-2016 |
20160073553 | HEAT DISSIPATION STRUCTURE OF HANDHELD DEVICE - A heat dissipation structure of handheld device includes a carrier body. The carrier body has a first receiving space. The first receiving space has a heat absorption section and a heat dissipation section. The heat dissipation section is adjacent to the heat absorption section and formed with a heat dissipation layer. The heat absorption section is able to quickly absorb the heat generated by the electronic components carried by the carrier body and transfer the heat to the heat dissipation layer of the heat dissipation section so as to quickly dissipate the heat. | 03-10-2016 |
20160091937 | HEAT DISSIPATION STRUCTURE FOR HAND-HELD DEVICE - A heat dissipation structure for hand-held device includes an element holding member internally defining a receiving space, a base plate held in the receiving space and having a plurality of electronic elements mounted on a top thereof, at least one heat conductive layer provided on one side of the electronic elements opposite to the base plate, and a graphite layer provided on one side of the heat conductive layer opposite to the electronic elements. The heat conductive layer transfers heat produced by the electronic elements to the graphite layer, from where the heat is quickly dissipated into ambient air, enabling upgraded heat dissipation efficiency of the electronic elements. | 03-31-2016 |
20160109912 | HEAT DISSIPATION STRUCTURE FOR MOBILE DEVICE - A heat dissipation structure for mobile device includes an element holding member, which has a holding portion and a cooling module set on the holding portion. The holding portion has a first side and an opposite second side; and the cooling module has a cold surface and an opposite hot surface. The cooling module is set on the holding portion with the cold surface and the hot surface being flush with the first and the second side of the holding portion, respectively. The heat dissipation structure can be mounted in a mobile device to quickly cool heat-producing electronic elements in the mobile device, so that any produced heat is guided away from the mobile device without accumulating therein. | 04-21-2016 |
20160116950 | HEAT DISSIPATION ASSEMBLY AND PORTABLE ELECTRONIC DEVICE EMPLOYING SAME - A heat dissipation assembly includes a main body, a heat conductor element, and a heat dissipation member. The heat conductor element is mounted to the main body and in thermal conductive contact with at least one electronic component. The heat dissipation member is mounted to the main body and is in thermal conductive communication with the heat conductor element. The heat generated by the at least one electronic component is transmitted through the heat conductor element to the heat dissipation member. | 04-28-2016 |
20160157339 | SERVER | 06-02-2016 |
20160157376 | LEVER UNIT | 06-02-2016 |
20160167340 | COMPOSITE MATERIAL AND ELECTRONIC APPARATUS | 06-16-2016 |
20160179147 | DYNAMIC THERMAL PLATFORM OPERATING POINT FOR ELECTRONIC DEVICES | 06-23-2016 |
20160179149 | DYNAMIC COOLING FOR ELECTRONIC DEVICES | 06-23-2016 |