| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156345120 |
With mechanical polishing (i.e., CMP-chemical mechanical polishing)
| 49 |
| 156345150 |
With measuring, sensing, detection or process control means
| 31 |
| 156345230 |
With specified workpiece support
| 26 |
| 156345210 |
Liquid etchant spray type
| 17 |
| 156345180 |
With means to supply, remove, or recycle liquid etchant outside of etching tank or chamber (e.g., supply tanks or pipe network)
| 15 |
| 156345190 |
With mechanical mask or shield or shutter for shielding workpiece
| 6 |
| 156345200 |
Running length workpiece (e.g., etching indeterminate length strip) | 3 |
| 20090159210 | Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board - In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided. | 06-25-2009 |
| 20110073256 | SEMICONDUCTOR MANUFACTURING APPARATUS - Reduction in a space of a manufacturing line, improvement of efficiency, improvement of utilization efficiency of materials, additionally, reduction in the manufacturing cost is realized by applying a means for describing a wiring pattern or a resist pattern directly on a substrate, a means for locally performing a vapor phase process such as film formation or etching under atmospheric pressure or adjacent to atmospheric pressure. | 03-31-2011 |
| 20130192757 | Web Processing Machine - A machine for processing of a web through a process tank containing process liquid and a tank containing wash water has in each tank an upper submerged guide and a pair of lower submerged guides, whereby the web passes on a sinusoidal path through the tank. Four drying guides are provided one above the over above the down-stream end of the processing tank. The guides have outlet slits | 08-01-2013 |
| Entries |
| Document | Title | Date |
|---|
| 20080236745 | METHOD AND APPARATUS FOR FABRICATING OR ALTERING MICROSTRUCTURES USING LOCAL CHEMICAL ALTERATIONS - A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure. | 10-02-2008 |
| 20110220286 | SOLUTION SUPPLYING UNIT AND SUBSTRATE TREATING APPARATUS HAVING THE SAME - A solution supplying unit includes a body, a first supplying tube and a second supplying tube. The body includes a chamber having a substantially circular cross-section to receive a solution and an out-flowing part connected to the chamber to flow out the solution. The first supplying tube is disposed at a side of the body, tangentially connected to the chamber, and supplying a first solution into the chamber to rotate the first solution in the chamber. The second supplying tube has an end portion, and supplying a second solution into the chamber to mix the first solution with the second solution. The end portion is formed through the body and is adjacent to a central axis of the body. | 09-15-2011 |
| 20120006485 | SUBSTRATE TREATMENT DEVICE - A substrate treatment device including a cleaning chamber that is capable of decreasing a thick waste solution from the chamber, and improving use efficiency of a diluted waste solution from the chamber. The chamber supplies a cleaning solution onto a front surface of a chemical-treated substrate being transferred tilted toward its back surface side at some degrees to the upright by a cleaning-solution discharge unit. The chamber is partitioned into rough and fine cleaning chambers ( | 01-12-2012 |
| 20130062014 | LIQUID-GAS INTERFACE PLASMA DEVICE - A plasma system for treating a workpiece is disclosed. The plasma system includes: a plasma device including an electrode formed from a metal alloy and a dielectric layer covering the electrode, the dielectric layer including a distal portion extending distally past a distal end of the electrode by a predetermined distance; a liquid source configured to supply a liquid to a workpiece; an ionizable media source coupled to the plasma device and configured to supply ionizable media thereto; and a power source coupled to the electrode and configured to ignite the ionizable media at the plasma device to form a plasma effluent in the presence of the liquid, whereby the plasma effluent reacts with the liquid to form at least one reactive species that interacts with the workpiece. | 03-14-2013 |
| 20130306238 | CHEMICAL LIQUID PREPARATION METHOD OF PREPARING A CHEMICAL LIQUID FOR SUBSTRATE PROCESSING, CHEMICAL LIQUID PREPARATION UNIT PREPARING A CHEMICAL LIQUID FOR SUBSTRATE PROCESSING, AND SUBSTRATE PROCESSING SYSTEM - A substrate processing system includes a chemical liquid preparation unit preparing a chemical liquid to be supplied to a substrate and a processing unit which supplies the chemical liquid, prepared by the chemical liquid preparation unit, to the substrate. The chemical liquid preparation unit supplies an oxygen-containing gas, containing oxygen gas, to a TMAH-containing chemical liquid, containing TMAH (tetramethylammoniumhydroxide),tomaketheoxygen-containing gas dissolve in the TMAH-containing chemical liquid. | 11-21-2013 |
| 20140060737 | Femtosecond Laser-Induced Formation Of Submicrometer Spikes On A Semiconductor Substrate - The present invention generally provides semiconductor substrates having submicronsized surface features generated by irradiating the surface with ultra short laser pulses. In one aspect, a method of processing a semiconductor substrate is disclosed that includes placing at least a portion of a surface of the substrate in contact with a fluid, and exposing that surface portion to one or more femtosecond pulses so as to modify the topography of that portion. The modification can include, e.g., generating a plurality of submicron-sized spikes in an upper layer of the surface. | 03-06-2014 |
| 20140090782 | ETCHING METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An etching method includes: applying a radiation to an etching aqueous solution; and etching a material to be etched by using the etching aqueous solution irradiated with the radiation. | 04-03-2014 |
| 20140130979 | CLEANING APPARATUS - A cleaning and purifying apparatus | 05-15-2014 |
| 20140182786 | ETCHING A LASER-CUT SEMICONDUCTOR BEFORE DICING A DIE ATTACH FILM (DAF) OR OTHER MATERIAL LAYER - Semiconductor die break strength and yield are improved with a combination of laser dicing and etching, which are followed by dicing an underlying layer of material, such as die attach film (DAF) or metal. A second laser process or a second etch process may be used for dicing of the underlying layer of material. Performing sidewall etching before cutting the underlying layer of material reduces or prevents debris on the kerf sidewalls during the sidewall etching process. A thin wafer dicing laser system may include either a single laser process head solution or a dual laser process head solution to meet throughput requirements. | 07-03-2014 |
| 20140231010 | CHEMICAL SUPPLIER, PROCESSING APPARATUS INCLUDING THE CHEMICAL SUPPLIER - A chemical supplier includes a chemical reservoir containing a chemical mixture at a room temperature, an inner space of the chemical reservoir being separated from surroundings, a supply line through which the chemical mixture is supplied to a process chamber from the chemical reservoir, an inline heater positioned on the supply line and heating the chemical mixture in the supply line to a process temperature, and a power source driving the chemical mixture to move the chemical mixture toward the process chamber. | 08-21-2014 |
| 20150034245 | SUBSTRATE TREATMENT APPARATUS - An inventive substrate treatment method includes a silylation step of supplying a silylation agent to a substrate, and an etching step of supplying an etching agent to the substrate after the silylation step. The method may further include a repeating step of repeating a sequence cycle including the silylation step and the etching step a plurality of times. The cycle may further include a rinsing step of supplying a rinse liquid to the substrate after the etching step. The cycle may further include a UV irradiation step of irradiating the substrate with ultraviolet radiation after the etching step. The method may further include a pre-silylation or post-silylation UV irradiation step of irradiating the substrate with the ultraviolet radiation before or after the silylation step. | 02-05-2015 |
| 20150096682 | CHEMICAL LIQUID CONTAINER REPLACEMENT DEVICE, CONTAINER MOUNTING MODULE, CHEMICAL LIQUID CONTAINER REPLACEMENT METHOD, AND SUBSTRATE PROCESSING APPARATUS - In a chemical liquid container replacement device D2 configured to replace a chemical liquid container | 04-09-2015 |
| 20150376796 | SURFACE CHEMICAL TREATMENT APPARATUS FOR FINE PATTERNING - A surface chemical treatment apparatus provided with: a first conduit having an opening at one end and communicating with a liquid supply means at the other end; a second conduit having at one end an opening that surrounds the opening of the first conduit and communicating with a liquid suction means at the other end; and a moving mechanism for moving the openings of the first and second conduits relative to the solid phase surface, so as to make a surface chemical treatment possible in a fine pattern by allowing the patterning solution to be dispensed through the opening of the first conduit while allowing the solution to be suctioned up together with the surrounding liquid phase or gas phase medium through the opening of the second conduit that surrounds the opening of the first conduit and, thus, preventing seepage of the solution in all directions. | 12-31-2015 |
| 20160166316 | SYSTEM FOR MANUFACTURING ELECTROSURGICAL SEAL PLATES | 06-16-2016 |
| 20160254173 | SPATIALLY LIMITED PROCESSING OF A SUBSTRATE | 09-01-2016 |
| 20190148176 | SUBSTRATE PROCESSING APPARATUS | 05-16-2019 |
