| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156345210 | Liquid etchant spray type | 17 |
| 20080196834 | LIQUID PHASE ETCHING METHOD AND LIQUID PHASE ETCHING APPARATUS - A liquid phase etching method which comprises spraying a chemically reactive liquid, with a specific speed, to a solid article, an aggregate of solid articles or a gelatinous material to be treated; and a liquid etching apparatus having a mechanism for holding a processing object to be treated and a nozzle structure for spraying a chemically reactive liquid to the processing object to be treated which is held by the mechanism. The method and apparatus allow the significant improvement of the etching rate while maintaining the accuracy of etching. | 08-21-2008 |
| 20090139656 | Substrate processing apparatus - The present invention provides a substrate processing apparatus for processing substrates by immersing the substrates in a processing liquid. This substrate processing apparatus includes a processing tank having a pair of side walls arranged to be opposed to each other; and a pair of processing-liquid supply mechanisms provided respectively corresponding to the pair of side walls. The pair of processing-liquid supply mechanisms are respectively configured for supplying the processing liquid toward a central portion of the processing tank in the width direction connecting the pair of side walls, thereby to create a rising flow of the processing liquid in a central area in the width direction of the processing tank. Each inner wall face of the pair of side walls includes a main body, a projecting portion located above the main body, and a discharge guide portion located uppermost and providing a discharge port configured for allowing the processing liquid to overflow. The discharge guide portion is inclined upward, opposite to the central portion in the width direction. The projecting portion includes an inner end portion located nearer to the central portion in the width direction, as compared with the main body and discharge guide portion. | 06-04-2009 |
| 20100122772 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - Provided is a substrate treatment apparatus that treats a surface of a substrate while rotating the substrate. The substrate treatment apparatus includes: a physical tool unit including a physical tool configured to treat the surface of the substrate; a nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate; a physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate; and a nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate. | 05-20-2010 |
| 20100200163 | APPARATUS AND METHOD FOR WET TREATMENT OF DISC-LIKE ARTICLES - Disclosed is an apparatus for wet treatment of a disc-like article, which comprises: a spin chuck for holding and rotating the disc-like article, and an inner edge nozzle dispensing treatment liquid directed towards a first peripheral region of the first surface of the disc-like article, wherein the first surface is facing the spin chuck and the first peripheral region is defined as being a region of the first surface with an inner radius (ri), which is greater than 1 cm less than the disc-like article's radius (ra), wherein the inner edge nozzle is positioned in a stationary manner between the disc-like article (when placed on the spin chuck) and the spin chuck, wherein the inner edge nozzle is feed through a central pipe, which is disposed in a stationary manner and penetrates centrally through the spin chuck, for supplying a treatment liquid against a first surface of the disc-like article. | 08-12-2010 |
| 20100206481 | APPARATUS FOR WET TREATMENT OF PLATE-LIKE ARTICLES - Disclosed is an apparatus for wet treatment of a plate-like article, which includes: a spin chuck for holding and rotating the plate-like article including an element for holding the plate-like article at the plate-like article's edge and a gas supply element for directing gas towards the side of the plate-like article, which faces the spin chuck, wherein the gas supply element includes a gas nozzle rotating with the spin chuck, for providing a gas cushion between the plate-like article and the spin chuck; a fluid supply element for directing fluid onto the side of the plate-like article, which is facing the spin chuck, through a non-rotatable fluid nozzle. | 08-19-2010 |
| 20110024042 | APPARATUS FOR WET PROCESSING SUBSTRATE - An exemplary wet processing apparatus includes a conveyor, a spraying system, and a suction system. The conveyor is configured for conveying a substrate. The spraying system includes an upper spraying conduit above the conveyor and an upper spraying nozzle mounted on the upper spraying conduit. The suction system includes a suction conduit and a suction nozzle connected to the suction conduit. The suction nozzle is adjacent to the conveyor and configured for suction the wet processing liquid sprayed on the substrate. The suction conduit is connected to the spraying conduit in such a manner that the flowing of the wet processing liquid in the upper spraying conduit can create a negative pressure in the suction conduit to enable the suction nozzle to suck the wet processing liquid on the substrate. | 02-03-2011 |
| 20110030897 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - In a substrate treatment method for supplying a coating solution to a substrate with projections and depressions on a front surface thereof to form a coating film on the front surface of the substrate, the coating solution is supplied to the rotating substrate to form a coating film on the front surface of the substrate, and the substrate having the coating film formed thereon is heated to adjust an etching condition of the coating film. Next, the etching solution is supplied to the rotating substrate to etch the coating film, and thereafter the coating solution is supplied to the substrate to form a flat coating film on the front surface of the substrate. Thereafter, the substrate is heated to cure the coating film. This flattens the coating film with uniformity and high accuracy without undergoing a high-load process such as chemical mechanical polishing. | 02-10-2011 |
| 20120186744 | LIQUID TREATMENT APPARATUS AND METHOD - A liquid treatment apparatus includes a substrate retaining unit, a rotational driving unit configured to rotate the substrate retaining unit; and a nozzle disposed below a lower surface of the substrate, the nozzle having first ejection ports provided to eject a chemical liquid and second ejection ports provided to eject a rinsing fluid towards the lower surface of the substrate. The nozzle comprises a first portion and a second portion each extending from a position opposing to a peripheral portion of the substrate towards a position opposing to a central portion of the substrate. At least part of the first ejection ports are arranged in the first portion. At least part of the second ejection ports are arranged in the second portion. The first portion and the second portion are arranged to form a V-shaped figure. | 07-26-2012 |
| 20130037214 | CURVED GLASS SHEET ETCHING DEVICE - An etching device is disclosed. The etching device comprises a base; a receiving member mounted on the base, the receiving member defines a receiving hole to receive an etching solution, the receiving member comprises a side surface, the side surface defines at least one spraying hole interconnected with the receiving hole, and at least one spraying hole is adapted to spray the etching solution; and at least one rotating member rotatably mounted on the base, opposite to the side surface of the receiving member. | 02-14-2013 |
| 20130180659 | LIQUID TREATMENT APPARATUS - A liquid treatment apparatus includes a substrate holder ( | 07-18-2013 |
| 20130233489 | APPARATUS FOR WET ETCHING WHILE FORMING INTERCONNECT TRENCH IN INSULATING FILM - A wet etching method that includes forming an insulating film on a substrate, and irradiating laser light to the insulating film during wet etching of the insulating film using an etching solution. | 09-12-2013 |
| 20130284368 | SUBSTRATE TREATMENT APPARATUS - A substrate treatment apparatus is provided, which includes: a seal chamber including a chamber body having an opening, a lid member provided rotatably with respect to the chamber body and configured to close the opening, and a first liquid seal structure which liquid-seals between the lid member and the chamber body, the seal chamber having an internal space sealed from outside; a lid member rotating unit which rotates the lid member; a substrate holding/rotating unit which holds and rotates a substrate in the internal space of the seal chamber; and a treatment liquid supplying unit which supplies a treatment liquid to the substrate rotated by the substrate holding/rotating unit. | 10-31-2013 |
| 20130312912 | Surface Treat and Survey Metallurgy Substrates Renewable Substances Food Starch, Sodium and Electrolyte Precision Media Systems - Surface Treat and Survey Metallurgy Substrates Renewable Substances Food Starch, Sodium and Electrolyte Precision Media Systems are a closed-type precision media system. The aqueous slurry type system pumps aqueous slurry Electrolyte from an aqueous slurry pump. The differential pressurized variable control regulation closed-type system utilizes negative pressurized air drawing media from a powerful control valve or control valve venturi and vacuum pump. The Surface Treat and Survey Metallurgy Substrates Renewable Substances Food Starch, Sodium and Electrolyte Precision Media Systems are light and easy to operate opening the door to whole new market of customers to safely perform paint stripping, substrate treatment, parts treatment and cleaning specifications. Efficiency of operation is acquired by way of diffusion, equal particle distribution, and the effective Surface Treat and Survey Metallurgy Substrates Renewable Substances Food Starch, Sodium and Electrolyte Precision Media Systems can compete against harmful paint thinners, petroleum distillates, and chemical cleaners. | 11-28-2013 |
| 20150114560 | SUBSTRATE PROCESSING APPARATUS AND LIQUID SUPPLY APPARATUS - A substrate processing includes a holding mechanism, a plurality of nozzles, and an adjusting unit. The holding mechanism rotatably holds a substrate. The nozzles are disposed to be arranged in a diametric direction of the substrate held by the holding mechanism and supply a chemical liquid to the substrate. The adjusting unit supplies a chemical liquid of a first temperature and a chemical liquid of a second temperature to each of the plurality of nozzles in a predetermined ratio, in which the second temperature is higher than the first temperature. The adjusting unit supplies the chemical liquid of the second temperature in a higher ratio to a nozzle disposed at an outer circumference side of the substrate than to a nozzle disposed at a center side of the substrate. In addition, the adjusting unit supplies the chemical liquid of the second temperature in a higher ratio to the nozzle disposed at the outer circumference side of the substrate than to the nozzle disposed at the center side of the substrate. Each of the nozzles supplies a chemical liquid in which the supplied chemical liquid of the first temperature and the supplied chemical liquid of the second temperature are mixed with each other. | 04-30-2015 |
| 20150340249 | APPARATUS FOR MANUFACTURING SEMICONDUCTOR WAFER - An apparatus for manufacturing a semiconductor wafer comprises: a wafer chuck which holds the rear surface of a wafer having a via hole; a cap which is installed in such a way as to move up and down above the wafer chuck and has a sealed lip which forms a liquid reservoir by sealing the outer peripheral portion of the upper surface of the wafer; and a nozzle which injects and recovers processing liquids to and from a reaction chamber. | 11-26-2015 |
| 20150357207 | SELECTIVE ETCHING OF SILICON WAFER - An apparatus that includes a solution bath of a seasoned solution, the seasoned solution containing a mixture of hydrofluoric acid, nitric acid, and acetic acid; and one or more silicon wafers being suspended in a position above the solution bath, wherein at least a portion of the mixture having been used in thinning the one or more silicon wafers. | 12-10-2015 |
| 20160013079 | APPARATUS FOR TREATING SUBSTRATE | 01-14-2016 |
