| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156345180 | With means to supply, remove, or recycle liquid etchant outside of etching tank or chamber (e.g., supply tanks or pipe network) | 15 |
| 20090242126 | EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER - The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer. | 10-01-2009 |
| 20100122771 | CHEMICAL TREATMENT APPARATUS - A chemical treatment apparatus includes an outer bath; an inner bath, located inside the outer bath; a circulation system, connecting the outer bath to the inner bath; and a draining system, having a first draining pipe and a connecting pipe, wherein the connecting pipe connects the first draining pipe to the circulation system. The suction force generated by a pump of the circulation system is thereby transferred to the first draining pipe. Therefore when the chemical solution is to be drained out from the inner bath, the draining of the chemical solution into the first draining pipe can be quickly done with the aid of the suction force. | 05-20-2010 |
| 20100212831 | Device with lifting and lowering drain tank for wet etching wafers - The present invention discloses a device for spin cleaning and etching wet processor. The support is kept in a fixed level, and the drain tank can be lifting and lowering to collect and drain out the liquid from the support. This device consists of a suport, a set of drain tank and a lifting and lowering device to move the drain tank so that one of the drain tank is in the same level with the suport. The suport is used to support a wafer to process etching and cleaning, can spin with different speed and supply etching solution and DI water. The number of drain tanks are selected by the number of etching solutions and DI water. A stationary axaust appratus kept in a fixed level as the support is used to axaust the acidic gas from the drain tanks. | 08-26-2010 |
| 20110139369 | ETCHING APPARATUS - An etching apparatus that includes a number of chambers having an opening that is opened to move in or discharge a substrate, an injection member that is installed inside each chamber to inject a chemical liquid, and an interception member that is adjacently installed at the opening of each chamber and sucks gas introduced into the opening. | 06-16-2011 |
| 20120103521 | ETCHING APPARATUS WITH SUCTION MECHANISM - An etching apparatus includes a conveyor, a spraying mechanism, a suction mechanism, and a controller. The conveyor is configured for conveying a substrate. The spraying mechanism includes a submersible pump and a number of spraying nozzles. The submersible pump selectively operates at an activated state where the spraying nozzles can spray etchant onto the substrate, or an unactivated state where the spraying nozzles cannot spray etchant. The suction mechanism includes a vacuum pump and a number of suction intakes. The vacuum pump selectively operates at an activated state where the suction intakes can suck up the etchant on the substrate, or an unactivated state where the suction intakes cannot suck up the etchant. The controller controls the pumps to operate alternately, so the vacuum pump is unactivated when the submersible pump is activated and vice versa. | 05-03-2012 |
| 20120261072 | APPARATUS FOR REDUCING ETCHING MARKS ON SOLAR CELL SURFACE - An apparatus for reducing etching marks on a solar cell surface includes an etching bath, an etchant-feeding pipe configured in the etching bath, and a bubble guiding device that covers the etchant-feeding pipe. The bubble guiding device guides bubbles discharged from the etchant-feeding pipe to move toward at least one end of the etchant-feeding pipe for reducing etching marks on the solar cell surface. | 10-18-2012 |
| 20130284367 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF SUPPLYING PROCESSING SOLUTION - Provided is a substrate processing apparatus. The apparatus includes a processing chamber containing a substrate and processing the substrate by using a processing solution and a supplying unit supplying the processing solution to the processing chamber. The supplying unit includes a supply line through which the processing solution is supplied, a preliminary heater installed on the supply line and preliminary heating the processing solution, a main heater installed on the supply line at a lower stream of the preliminary heater and secondarily heating the processing solution, a first detour line connected to the supply line to detour to the preliminary heater and comprising a first valve, a second detour line connected to the supply line to detour the preliminary heater and the main heater or the main heater and comprising a second valve, and a controller controlling the first valve and the second valve. | 10-31-2013 |
| 20140190634 | Method and Apparatus for Drying a Wafer - The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated. | 07-10-2014 |
| 20140283993 | ETCHING APPARATUS - A shower-type etching apparatus that includes a support member supporting a substrate in an inclined manner, a first spray member arranged at a lower end of the inclined substrate spraying a smaller amount of etching solution onto the substrate than a second spray member arranged at an upper end of the inclined substrate by increasing a pitch distance between adjacent nozzles in the first spray member as compared to the second spray member. | 09-25-2014 |
| 20150020968 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus of the present invention comprises a cooling mechanism for cooling a processing solution and a filter for removing impurities contained in the processing solution, at some midpoint in a circulation path of the processing solution. With this constitution, the substrate processing apparatus can precipitate the impurities dissolved in the processing solution and remove the precipitated impurities. It therefore becomes possible to maintain the performance of the processing solution and reuse the processing solution. Further, the frequency of changing the processing solution to a new solution decreases, and this causes an increase in availability of the substrate processing apparatus and a decrease in consumption and drainage of the processing solution. | 01-22-2015 |
| 20150101753 | ETCHING TRAY AND LID FOR ACID ETCHING PCD CUTTING INSERTS - An etching tray for etching PCD cutting inserts is provided. The etching system includes a tray having a bottom and side walls extending upwardly from the tray bottom and a lid attachable to the top of the tray. The lid may include a funnel formed as an integral part of the lid which has an upper opening disposed above the lid and a lower neck which extends into the tray. The lid may also include an opening for a float to pass through and provide a visual indication of the liquid level in the tray. An etching fixture may be disposed in the tray for etching cutting inserts. The etching fixture has a body which holds a cutting insert to expose the cutting insert for etching. | 04-16-2015 |
| 20150367286 | ETCHING LIQUID STORAGE APPARATUS AND A WET ETCHING DEVICE - The embodiments of the present disclosure provide an etching liquid storage apparatus and a wet etching device, which relates to the field of display technology, and can reduce the concentration of foreign ions in the etching liquid, so as to avoid frequent replacement of the etching liquid, thereby ensuring stability of the etching process, meanwhile, can also prolong the service life of the etching liquid, so as to reduce the cost; the etching liquid storage apparatus comprises an etching liquid storage tank, an ion exchange membrane for enabling selective permeation of ions in the etching liquid, and an anode or a cathode located at both sides of the ion exchange membrane; wherein a first chamber is formed between the ion exchange membrane and the anode, a second chamber is formed between the ion exchange membrane and the cathode; it is used for manufacture of the wet etching device. | 12-24-2015 |
| 20160042980 | SUBSTRATE PROCESSING APPARATUS - In a substrate processing apparatus ( | 02-11-2016 |
| 20160052024 | System for Coating Removal - Various embodiments of a system for coating removal are provided. In one embodiment, a system for removing a coating material from another material is provided, the system comprising: a staging hopper; a second elevator operatively connecting the staging hopper to the decoating mill; a decoating mill having a decoating mill tank and at least one rotary blade oriented within the decoating mill tank, wherein the at least one rotary blade can translate horizontally and vertically; a screen station having a dump hopper and a recovery tank; a washer; a dryer; an aspirator; a large waste water filter press; at least one process water filter press; a sanitary water filter; a staging tank; a water heater; and a process chemical feed system. | 02-25-2016 |
| 20160196954 | Circulating Cooling/Heating Device | 07-07-2016 |
