Class / Patent application number | Description | Number of patent applications / Date published |
156345230 | With specified workpiece support | 26 |
20080196835 | Device and Method For Liquid Treatment of Wafer-Shaped Articles - Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W | 08-21-2008 |
20080236746 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MOUNTING STAGE ON WHICH FOCUS RING IS MOUNTED - A substrate processing apparatus that can prevent a heat transfer sheet from becoming attached to a focus ring mounting surface of a substrate mounting stage. The substrate mounting stage is disposed in a housing chamber of the substrate processing apparatus, and a substrate is mounted on the substrate mounting stage. A focus ring that surrounds a peripheral portion of the mounted substrate is mounted on the focus ring mounting surface. The heat transfer sheet is interposed between the focus ring and the focus ring mounting surface, and a fluorine coating is formed on the focus ring mounting surface. | 10-02-2008 |
20080295962 | METHOD AND SYSTEM FOR MASK HANDLING IN HIGH PRODUCTIVITY CHAMBER - A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the wafer and the mask. In one embodiment, the extensions are affixed to an annular ring which is capable of moving in a vertical direction within the processing chamber. A processing chamber, a mask, and a method for combinatorially processing a substrate are also provided. | 12-04-2008 |
20090032188 | SINGLE-WAFER PROCESSOR - The present invention provides a single wafer processor structured such that similar immersion treatment to the conventional immersion treatment can be performed in the spin treatment, that a consumption of the chemical solutions can be reduced in the chemical solution treatment per wafer, that energy saving can be realized by using reaction heat of the chemical solutions to eliminate a necessity of a heating heater, that a problem of deterioration of the chemical solutions can be eliminated since the blending of the chemical solutions is implemented on the rotary disk part and the chemical solutions are used immediately thereafter, and that the maximum effective point of the chemical solutions can be utilized. The processor of the present invention includes: a rotary disk ( | 02-05-2009 |
20090090467 | Spin head - Provided is a spin head for supporting and rotating a substrate. The spin head includes a body, chuck pins disposed at the body and movable between supporting positions and rest positions, and a chuck pin moving unit configured to move the chuck pins straight. The chuck pins supports a substrate at the supporting positions and provides a substrate loading/unloading space at the rest position. The chuck pin moving unit includes movable rods fixed to the chuck pins, a rotatable cam including protrusions on an outer surface thereof so as to move the chuck pins from the supporting positions to the rest positions, and chuck pin return units respectively applying forces to the movable rods so as to move the chuck pins individually from the rest positions to the supporting positions. The chuck pin moving unit further includes contact maintaining members. | 04-09-2009 |
20090145552 | Substrate supporting unit and apparatus for treating substrate using the substrate supporting unit - Provided are a substrate supporting unit and a substrate treating apparatus using the substrate supporting unit. The substrate supporting unit comprises a base plate and a supporting portion formed on the base plate. The supporting portion comprises two supporting rods and a plurality of supporting members. The two supporting rods extend in a predetermined direction to be separated from each other. The plurality of supporting members is disposed to be separated from each other in the predetermined direction. Each of the supporting members connects the supporting rods. | 06-11-2009 |
20090194234 | SUBSTRATE TREATMENT APPARATUS, AND SUBSTRATE SUPPORT TO BE USED FOR THE APPARATUS - The substrate treatment apparatus according to the present invention includes a substrate holding mechanism including a support member which supports a substrate, and an extension surface which laterally surrounds one major surface of the substrate supported by the support member and extends continuously to the major surface of the substrate, a rotation mechanism which rotates the substrate holding mechanism, and an etching liquid supply mechanism which supplies an etching liquid onto the major surface of the substrate held by the substrate holding mechanism. | 08-06-2009 |
20100012272 | Substrate etching apparatus - A substrate etching apparatus includes a supporting unit for supporting substrate in a vertical position and an etching solution supply unit disposed above the substrate to supply an etching solution to the top of the substrate such that the etching solution runs down both of faces of the substrate from the top of the substrate. | 01-21-2010 |
20120085493 | Liquid Processing Apparatus - Disclosed is a liquid processing apparatus that includes: a rotational unit configured to rotate a substrate to be processed while the substrate is being held horizontally; and a processing liquid supplying unit configured to supply a processing liquid to the bottom surface of the substrate to be processed which is rotating. The rotational unit includes an enclosing member surrounding the periphery of the substrate to be processed, the enclosing member includes a plurality of guide grooves formed on the bottom surface of the enclosing member and configured to guide the processing liquid, and each of the plurality of guide grooves elongates outwardly from the inner periphery and is arranged in the circumferential direction of the enclosing member. | 04-12-2012 |
20120103522 | CLOSED CHAMBER FOR WAFER WET PROCESSING - An improved design for a closed chamber process module for single wafer wet processing utilizes a combination lid and gas showerhead for sealing the chamber from above. One or more media arms dispense liquid onto a wafer in the chamber. The media arms are mounted inside the chamber but are connected by a linkage that passes through the chamber wall to a drive unit mounted outside the chamber. | 05-03-2012 |
20120261073 | CONFORMING GRAPHENE TO A TARGET SUBSTRATE - Implementations and techniques for conforming a layer of graphene to a target substrate are generally disclosed. | 10-18-2012 |
20130008602 | APPARATUS FOR TREATING A WAFER-SHAPED ARTICLE - An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid incorporates a heater adapted to heat a wafer-shaped article positioned in the closed process chamber. | 01-10-2013 |
20130062015 | WET ETCHING APPARATUS AND METHOD - A wet etching apparatus and a wet etching method for etching a glass substrate are disclosed. The wet etching apparatus comprises a driving device, a supporting stage, a vibrating device and a substrate fixing rack. The glass substrate is fixed at the top of the substrate fixing rack and a bottom portion of the substrate fixing rack is connected with the vibrating device; the vibrating device is fixed on the supporting stage to drive the substrate fixing rack to reciprocate; and the supporting stage is disposed on the driving device and moves along with the driving device. According to the present disclosure, by controlling the vibrating device to drive the glass substrate to reciprocate in a direction where it is desired to accelerate the etching speed, the probability that the etched material interacts with the etching solution can be enhanced to increase the side etching rate. | 03-14-2013 |
20140102637 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. A heating assembly comprises a housing containing at least one infrared heating element. The heating assembly is mounted above the upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing also contains a conduit having an inlet connected to a source of cooling fluid and an outlet returning cooling fluid to the source of cooling fluid. | 04-17-2014 |
20140174657 | APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES AND LIQUID CONTROL RING FOR USE IN SAME - An apparatus for treating a wafer-shaped article includes a rotary chuck configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing the rotary chuck is spaced from an upper surface of the rotary chuck. A ring is mounted on the rotary chuck, and includes a first upper surface overlapping an outer peripheral edge of a wafer-shaped article when positioned on the rotary chuck and a second upper surface positioned radially inwardly of the first surface. The second upper surface is elevated relative to the first upper surface, to define an annular gap between the second upper surface and a wafer-shaped article when positioned on the spin chuck that is smaller than a distance between the first upper surface and a wafer-shaped article when positioned on the rotary chuck. | 06-26-2014 |
20140231012 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a spin chuck for holding a substrate horizontally, a phosphoric acid supply device for supplying phosphoric acid aqueous solution onto the upper surface of the substrate held on the spin chuck to form a liquid film of phosphoric acid aqueous solution covering the entire upper surface of the substrate, a heating device for heating the substrate with the liquid film of phosphoric acid aqueous solution held thereon and a pure water supply device for supplying pure water onto the liquid film of phosphoric acid aqueous solution. | 08-21-2014 |
20140231013 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a phosphoric acid supply device for supplying phosphoric acid aqueous solution onto the upper surface of a substrate held on a spin chuck, a heater for emitting heat toward a portion of the upper surface of the substrate with the phosphoric acid aqueous solution being held on the substrate, a heater moving device for moving the heater to move a position heated by the heater within the upper surface of the substrate, a water nozzle for discharging water therethrough toward a portion of the upper surface of the substrate with the phosphoric acid aqueous solution being held on the substrate and a water nozzle moving device for moving the water nozzle to move the water landing position within the upper surface of the substrate. | 08-21-2014 |
20140251539 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - Disclosed are a substrate processing apparatus and a substrate processing method configured to perform a processing of a substrate by a processing liquid, in which the processing liquid is supplied to a substrate which rotates to process the substrate. The substrate processing apparatus includes a substrate rotating unit that rotates the substrate, a processing liquid supply unit that supplies the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit which is provided at an inside of the collection cup and at an outside of the opening and generates a negative pressure which acts toward the outside of the substrate. | 09-11-2014 |
20140283994 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - An apparatus for liquid treatment of substrates, comprises a substrate holder and a liquid collector surrounding the substrate holder. The liquid collector comprises a trough for collecting liquid that has been used to treat a substrate. The trough is in fluid communication with a discharge conduit, and the liquid collector further comprising a recessed surface extending from a discharge opening in the trough to an inlet opening of the discharge conduit that is positioned lower than the trough. The discharge opening in the trough has a cross-sectional area that is at least twice as large in cross sectional area than the inlet opening of the discharge conduit. | 09-25-2014 |
20140374023 | Apparatuses and Methods for Gas Mixed Liquid Polishing, Etching, and Cleaning - In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid. | 12-25-2014 |
20150013905 | WET PROCESSING APPARATUS AND PLATING APPARATUS - A wet processing apparatus, such as a plating apparatus, and an etching apparatus, is disclosed. A wet processing apparatus includes a substrate-holder advancing mechanism configured to elevate a movable support to raise a substrate holder until the substrate holder is separated from a fixed support, move the movable support together with the substrate holder by a predetermined distance toward a holder takeout position, lower the movable support until the substrate holder is supported on the fixed support and the movable support is separated from the substrate holder, and move the movable support by the predetermined distance toward a holder put-in position. | 01-15-2015 |
20150059977 | SUPPORT FIXTURE AND CAP FOR THE ACID ETCHING OF PCD CUTTING INSERTS - A fixture for etching PCD drill inserts is provided. The fixture system includes an etching fixture having a body with a generally cylindrical top section, a bore through the body allowing a cylindrical cutting insert to be placed into the body and to extend partially out of the bore, and a sealing element disposed adjacent an end of the bore to seal against a cutting insert which is inserted into the bore. The fixture system also includes a cap disposed over the top section of the body which extends around the outside of the top section of the etching fixture body and engages the outside of the top section of the body to seal against the body and seal the first end of the bore. | 03-05-2015 |
20150114561 | LIQUID PROCESSING APPARATUS - A liquid processing apparatus of the present disclosure performs a liquid processing by supplying a processing liquid to a substrate that is rotating. A substrate holding unit configured to be rotatable around a vertical axis is provided with a holding surface to attract and hold a bottom surface of the substrate horizontally. A guide unit is formed integrally with the substrate holding unit, disposed around the substrate held in the substrate holding unit, and provided at a position equal to or lower than a height of a top surface of a periphery of the substrate. The guide unit includes a guide surface configured to guide the processing liquid. A rotary cup rotates integrally with the substrate holding unit, and guides the processing liquid towards the cup between the rotary cup and the guide unit. | 04-30-2015 |
20160027680 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber. | 01-28-2016 |
20160114359 | LIQUID DISPENSER WITH IMPROVED DRIP PREVENTION - In an apparatus for treating a wafer-shaped article, a spin chuck is provided for holding and rotating a wafer-shaped article. A liquid dispenser comprises a supply conduit that divides to form a first branch extending toward a dispensing outlet of the liquid dispenser and a second branch communicating with a vent opening of the liquid dispenser. The second branch extends upwardly relative to the first branch over at least a portion of its length. | 04-28-2016 |
20190148129 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 05-16-2019 |