| Entries |
| Document | Title | Date |
|---|
| 20080196865 | Exhaust heat recovery apparatus - An exhaust heat recovery apparatus includes an evaporation unit and a condensation unit communicated with the evaporation unit such that an operation fluid circulates therein. The evaporation unit is disposed in a first fluid passage through which a first fluid flows, and performs heat exchange between the first fluid and the operation fluid, thereby evaporating the operation fluid. The condensation unit is disposed in a second fluid passage through which a second fluid flows, and performs heat exchange between the second fluid and the operation fluid. The exhaust heat recovery apparatus further includes a wet area increasing member in a tube of the evaporation unit for increasing a wet area of the operation fluid due to surface tension of the operation fluid. The wet area increasing member is disposed adjacent to an inner surface of the tube and has extension surfaces extending in directions intersecting with the inner surface. | 08-21-2008 |
| 20080236795 | LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING - Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat. | 10-02-2008 |
| 20080236796 | Vapor Augmented Heatsink with Multi-Wick Structure - A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure. | 10-02-2008 |
| 20080245510 | HEAT DISSIPATION APPARATUS, TWO-PHASE HEAT EXCHANGE DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation apparatus includes a plurality of fins and a two-phase heat exchange device connected to the fins. The two-phase heat exchange device includes a main body and a continuous wick structure. The main body forms a closed space therein, and the continuous wick structure is disposed on the entire inner surface of the main body. Methods for manufacturing a two-phase heat exchange device and a heat dissipation apparatus are also introduced. | 10-09-2008 |
| 20080308259 | MULTIPLE TEMPERATURE SENSITIVE DEVICES USING TWO HEAT PIPES - A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe. | 12-18-2008 |
| 20080314563 | Method for Controlling the Temperature of Exothermic Chemical Reactions - A method for controlling the temperature of an exothermic reaction with simultaneous production of steam is based on the use of heat exchangers ( | 12-25-2008 |
| 20090000772 | CONTROL SCHEME FOR AN EVAPORATOR OPERATING AT CONDITIONS APPROACHING THERMODYNAMIC LIMITS - A heat exchanger assembly includes a plurality of evaporative heat exchangers that are selectively feed evaporant to tailor operation to current heat load in order to maintain operation in thermodynamically extreme operating conditions. | 01-01-2009 |
| 20090020266 | System and Method of Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements - According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure. | 01-22-2009 |
| 20090020267 | WORKING LIQUID FOR LATENT HEAT TRANSPORT APPARATUS AND METHOD FOR OPERATING LATENT HEAT TRANSPORT APPARATUS - To provide a working liquid for a latent heat transport apparatus which is free from environmental problems such as destruction of an ozone layer and global warming and which shows a high performance constantly at an operation temperature of from −50 to 200° C. | 01-22-2009 |
| 20090056916 | HEAT EXCHANGER - The present disclosure provides a heat exchanger for removing heat energy from a heat generator, comprising at least one conduit for a working fluid, which is arranged in an upright position of at least 45°, each conduit having an exterior wall and at least one interior wall for forming at least one evaporator channel and at least one condenser channel within the conduit. Furthermore, the heat exchanger comprises a first heat transfer element for transferring heat into the evaporator channel and a second heat transfer element for transferring heat out of the condenser channel. | 03-05-2009 |
| 20090071628 | HEAT-RADIATING DEVICE WITH COMPOSITE RADIATION EFFICIENCY - The heat-radiating device with composite heat radiation efficiency includes a foundation with a heating surface and a radiating surface. The foundation has an inner space for inserting phase-changing materials. A heat pipe includes a heat-absorbing end placed into the foundation and a radiating end protruded out of the foundation. A radiating fin set is arranged onto the radiating end of the heat pipe. The heat-radiating device enables the heat absorbed by the foundation to be quickly guided out of the foundation through the heat pipe. The radiation area is increased by the radiating fin set for improved heat radiation efficiency. The phase-changing material assists in heat absorption and storage by latent heat, thereby avoiding overheating of foundation and also helping to control efficiently the heat peak of the foundation. Furthermore, the heat-radiating device has a composite heat radiation effect with improved applicability. | 03-19-2009 |
| 20090071629 | Apparatus for cooling components in spacecraft - The invention relates to an apparatus for cooling components in spacecraft, comprising a heat radiator ( | 03-19-2009 |
| 20090071630 | Cooling System for High Power Vacuum Tubes - According to one embodiment, a two-phase cooling system includes a condensing heat exchanger fluidly coupled to an evaporator assembly and a pressure controller. The condensing heat exchanger condenses a coolant from a vapor phase to a liquid phase by removing heat from the coolant. The evaporator assembly is thermally coupled to a vacuum tube and operable to receive liquid coolant from the condensing heat exchanger, cool the vacuum tube by evaporating the coolant from the liquid phase to the vapor phase, and transporting the evaporated coolant to the condensing heat exchanger. The pressure controller maintains the pressure of the coolant in the evaporator assembly at a sub-ambient pressure to lower the boiling point of the coolant for reducing the operating temperature of the vacuum tube. | 03-19-2009 |
| 20090078395 | TEMPERATURE REGULATING MEMBER - A temperature regulating member for avoiding a deterioration in heat radiating output efficiency and deterioration in buffering occurring due to a non-uniform heat distribution within the heat storage material. Heat non-uniformities within the heat storage material are eliminated by inserting one or multiple agitating tools inside the heat storage material by generating an agitating current occurring due to use of agitator tools whose relative positions change within the heat storage material during shipping. | 03-26-2009 |
| 20090084524 | Evaporator and vapor production method - An evaporator includes a double pipe provided between an outer cylindrical member and an inner cylindrical member. The double pipe includes an inner pipe as a passage of water and an outer pipe as a passage of raw fuel. The inner pipe has a plurality of small holes connected to the outer pipe for maintaining the pressurized state of the water in the inner pipe. When the water gushes out of the small holes of the inner pipe in the outer pipe, phase transition of the water from the liquid phase to the gas phase occurs, and the water vapor is mixed with the raw fuel in the gas phase in the outer pipe. | 04-02-2009 |
| 20090084525 | HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME - A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate. | 04-02-2009 |
| 20090114374 | HEAT REMOVAL METHOD AND HEAT REMOVAL APPARATUS - A heat removal apparatus able to remove heat with a high heat flux from a large area is provided. A heat removal apparatus | 05-07-2009 |
| 20090120618 | COOLING APPARATUS FOR A COMPUTER SYSTEM - The invention relates to a cooling apparatus for a computer system and a method for cooling at least one heat producing component of a computer system. | 05-14-2009 |
| 20090145582 | Heat dissipation device - A heat dissipation device includes a base adapted for absorbing heat from an electronic device, a heat spreader located above the base, a first fin assembly including a plurality of fins arranged between the base and the heat spreader, and a heat pipe thermally contacting with the base and the heat spreader. A channel is defined between every two adjacent fins. Each of the fins extends along a front-to-rear direction. The heat pipe includes an evaporating portion thermally contacting with the base, a condensing portion thermally contacting with the heat spreader, and a connecting portion interconnecting the evaporating portion and the condensing portion. The evaporating portion and condensing portion of the heat pipe are parallel to the fins, and the connecting portion of the heat pipe is located at a rear side of the first fin assembly. | 06-11-2009 |
| 20090151904 | HEATING DEVICE - A heating device includes a heat-conductive tube unit adapted for passage of a heated fluid therethrough and having two opposite end portions and a middle portion extending between the end portions, a phase-change material enclosing the middle portion of the heat-conductive tube unit and that is capable of storing heat through phase changing, and an enclosure enclosing the phase-change material for preventing leakage of the phase-change material. | 06-18-2009 |
| 20090188650 | LIQUID DISTRIBUTION IN AN EVAPORATIVE HEAT REJECTION SYSTEM - A liquid distribution system for an evaporative heat rejection system that includes a heat transfer surface is disclosed. The liquid distribution system includes a plurality of liquid conduits adapted to transport liquid for distribution over the heat transfer surface, and each liquid conduit having at least one orifice. At least a first orifice in a first conduit and a second orifice in a second conduit are positioned such that when the liquid is transported under a predetermined pressure thought the conduits, the liquid is emitted from the first and second orifices in first and second streams, respectively, that collide at a collision site, thus causing liquid to be scattered from the collision site and distributed over the heat transfer surface. | 07-30-2009 |
| 20090211733 | METHOD FOR EVAPORATION AND/OR CONDENSATION IN A HEAT EXCHANGER - The invention concerns a method for evaporation and/or condensation of at least one fluid in a heat exchanger consisting of a stack of at least one tube ( | 08-27-2009 |
| 20090211734 | CLOSED CYCLE HEAT TRANSFER DEVICE AND METHOD - A closed cycle heat transfer device comprising a boiler ( | 08-27-2009 |
| 20090236079 | NANOPARTICLE-ENHANCED PHASE CHANGE MATERIALS (NEPCM) WITH GREAT POTENTIAL FOR IMPROVED THERMAL ENERGY STORAGE - Improved functionality of phase change materials (PCM) through dispersion of nanoparticles is described. The resulting nanoparticle-enhanced phase change materials (NEPCM) exhibit enhanced thermal conductivity in comparison to the base material. Starting with steady state natural convection within a differentially-heated square cavity that contains a nanofluid (water plus copper nanoparticles), the nanofluid is allowed to undergo solidification. Partly due to increase of thermal conductivity and also lowering of the latent heat of fusion, higher heat release rate of the NEPCM in relation to the conventional PCM is observed. The predicted increase of the heat release rate of the NEPCM is a clear indicator of its great potential for diverse thermal energy storage applications. | 09-24-2009 |
| 20090260781 | THERMAL BUFFER SYSTEM - A thermal buffer for an intermittent thermal load, e.g., a directed energy weapon (DEW) system, includes a phase change heat exchanger (PCHEX), an apparatus for circulating a first working fluid of the thermal load through first conduits of the PCHEX cell in a first direction such that heat is transferred between the first fluid and a phase change material (PCM) of the PCHEX in a second direction and causes a first phase change in the PCM, and an apparatus for circulating a second working fluid of, e.g., a heat pump through second conduits of the PCHEX in a third direction opposite to the first direction such that heat is transferred between the second fluid and the PCM in a fourth direction opposite to the second direction and results in a second phase change in the PCM opposite to the first phase change therein. | 10-22-2009 |
| 20090260782 | Heat sink base plate with heat pipe - A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface. | 10-22-2009 |
| 20090266520 | PHASE CONVERSION COOLER AND MOBILE EQUIPMENT - A small and lightweight phase conversion cooler having high cooling efficiency and mobile equipment. The phase conversion cooler has a cooling head having a first side in contact with a cooled object, a first circular port provided in a second side, a second circular port provided in a third side, a first pipe connected to the first circular port, a condenser part placed in a heat dissipation environment and a second pipe connected to the second circular port. The cooling head is formed by resin molding. The first side of the cooling head is provided with a metal plate. | 10-29-2009 |
| 20090277612 | UNDERWATER COOLING ASSEMBLY - A lightweight underwater cooling assembly with a high cooling capacity comprises: an assembly of heat exchanger tubes ( | 11-12-2009 |
| 20090294103 | PROCESS TO REDUCE THE TEMPERATURE OF A HYDROGEN AND CARBON MONOXIDE CONTAINING GAS AND HEAT EXCHANGER FOR USE IN SAID PROCESS - Process to reduce the temperature of a hydrogen and carbon monoxide containing gas by contacting the gas with a metal alloy surface having a lower temperature than the temperature of the gas, wherein the metal alloy surface comprises between 0 and 20 wt % iron, between 0 and 5 wt % aluminium, between 0 and 5 wt % silicon, between 20 and 50 wt % chromium and at least 35 wt % nickel, wherein the metal alloy surface maintains it lower temperature than the temperature of the gas by making use of coolant water. | 12-03-2009 |
| 20100006265 | COOLING SYSTEM - A cooling system to cool an electronic component is disclosed. The cooling system includes a first connection to receive refrigerant, a region to transfer heat from an electronic component to the refrigerant from the first connection, at least one of a cooling coil, a cooling tube, or a cooling block positioned in the region and in fluid communication with the first connection, and a second connection to return refrigerant from the region to an evaporator. | 01-14-2010 |
| 20100012299 | HEAT EXCHANGER UNIT - According to the present invention, there is provided a heat exchanger unit having, over a base, a surface-modified portion composed of a metal, the surface-modified portion being brought into contact with a flow path provided for a liquid refrigerant, wherein the liquid refrigerant is a liquid having a surface tension smaller than that of water, and the surface-modified portion has a porous structure, in which a plurality of recesses are provided on the flow path side thereof, each recess has an introduction path having a cross-section area gradually reduced from the inlet of the recess, and a cavity communicated with the introduction path while placing an inflection portion in between, and the shortest distance between the inflection portion and the flow path is larger than the shortest distance between the cavity and the flow path. | 01-21-2010 |
| 20100044013 | Radiator of Automobile - Disclosed is a radiator which can simplify the structure, cut down weight and costs, and reduce assembly process by coupling a plurality of core portions to a single header and a single tank portion. Furthermore, by arranging the plurality of core portions in a front-rear direction, the structure is simplified and it becomes easier to secure an installation space, thus allowing the radiator according to the present invention to be applied to more cars. Furthermore, by configuring the tank portion so as to be partitioned by a pocket or the like, heat transfer between the cooling water cooling the internal combustion engine and the cooling water cooling the electric field system is blocked, thereby improving cooling efficiency much more. | 02-25-2010 |
| 20100051236 | PROCESS AND ASSEMBLY FOR FLUSH CONNECTING EVAPORATOR SECTIONS OF JUXTAPOSED HEAT PIPES TO A FIXING BASE - A process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane includes the steps of: providing a fixing base with its bottom surface having an accommodating trough; providing at least two heat pipes each having an evaporator section and a condenser section; disposing the evaporator sections of the heat pipes in the accommodating trough; and machining the evaporator sections of the juxtaposed heat pipes, thereby forming a plane on the evaporator sections of the heat pipe. Via the above process, the evaporator sections of the heat pipes can be juxtaposed in and flush connected to the fixing base, thereby increasing the contact area between the evaporator sections of the heat pipes and a heat-generating element. It further provides an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane. | 03-04-2010 |
| 20100051237 | COOLING SYSTEM AND METHOD FOR COOLING AN AIRCRAFT ENGINE - A cooling system ( | 03-04-2010 |
| 20100065253 | Condenser - A condenser having improved condensation performance is provided. The condenser includes a plurality of cooling pipes, being disposed in a chassis to which the steam is introduced, through the interior of which cooling water used for heat exchange with steam flows; an inner channel that extends in a top-bottom direction and that is surrounded by the plurality of cooling pipes; a plurality of pipe-supporting plates disposed at a distance from one another in a direction in which the plurality of cooling pipes extend to support the plurality of cooling pipes; and a water receiving portion disposed between the plurality of pipe-supporting plates and being inclined downward from one pipe-supporting plate to the other pipe-supporting plate. | 03-18-2010 |
| 20100122798 | HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT DEVICE MANUFACTURING METHOD - According to an embodiment of the present invention, there is provided a heat transport device including an evaporation portion, a flow path, a condenser portion, and a working fluid. The evaporation portion is made of nanomaterial, and has V-shaped grooves formed on a surface. The flow path communicates with the evaporation portion. The condenser portion communicates with the evaporation portion through the flow path. The working fluid evaporates from a liquid phase to a vapor phase in the evaporation portion and condenses from the vapor phase to the liquid phase in the condenser portion. | 05-20-2010 |
| 20100155027 | COOLING DEVICE - A cooling device includes a case including a mount surface having a power transistor mounted thereon, a coolant accommodating chamber formed in the case located above the mount surface, for accommodating a coolant capable of evaporating by heat from the power transistor, a cooling pipe provided in the case and being capable of cooling the coolant in a gaseous state, and a defining member provided in the coolant accommodating chamber and being capable of defining in the coolant accommodating chamber a first region capable of guiding the coolant in a gaseous state evaporated by the heat from the power transistor toward the cooling pipe, and a second region located downstream in a flow direction of the coolant with respect to the first region and being capable of guiding the coolant cooled by the cooling pipe toward a bottom of the coolant accommodating chamber. | 06-24-2010 |
| 20100155028 | Combined Device Comprising An Internal Heat Exchanger And An Accumulator That Make Up An Air-Conditioning Loop - The invention relates to a combined device ( | 06-24-2010 |
| 20100186929 | METHOD AND APPARATUS FOR COOLING A HYDROCARBON STREAM - A mixed refrigerant stream ( | 07-29-2010 |
| 20100230075 | Thermal Storage System - An apparatus for storing and retrieving thermal energy from a phase change material including a plurality of heat exchangers. Each one of the plurality of heat exchangers provides the means for transferring energy between the phase change material on a primary side of the heat exchanger and a fluid on a secondary side of the heat exchanger. The phase change material is a mixture of two or more inorganic salts. | 09-16-2010 |
| 20100252237 | HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT MANUFACTURING METHOD - A heat transport device includes a working fluid, an evaporation portion, a condenser portion, a flow path portion, a concave portion, and a protrusion portion. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The concave portion is provided on at least one of the evaporation portion and the flow path portion, in which the liquid-phase working fluid flows. The protrusion portion is made of nanomaterial protruding from an inner wall side surface of the concave portion such that the protrusion portion partially covers an opening surface of the concave portion. | 10-07-2010 |
| 20100252238 | TWO-PHASE-FLOW, PANEL-COOLED, BATTERY APPARATUS AND METHOD - Two-phase, boiling heat transfer in confined channels close to a source of heat, such as an electrical component or device, carries the latent heat of vapors away to remote locations where “real estate” demands of air convection are tolerable operationally, economically, and technologically. Liquid-to-vapor, phase-change, heat transfer in a narrow channel (e.g., typically less than 0.200 inches total thickness, and often less than 0.150 in the channel itself) improves by several hundred percent the heat extraction from modest temperature (e.g., about 120 degree F.) devices, when compared to heat fluxes in pool boiling. Saturated working fluids provide nearly isothermal conditions in the working fluid. Minimal conduction paths provide minimal temperature gradients, and capillary action may maintain nearly constant temperature conditions about a surface of a heat source, while carrying heat of vaporization away to a condensation location. | 10-07-2010 |
| 20100314077 | COOLING SYSTEM FOR A COMPUTER DEVICE - A cooling system for cooling a heat source includes: a base unit configured with a fluid containing passage therein; a heat-conductive fluid container mounted on a mounting side of the base unit, formed with a fluid-receiving space therein in spatial communication with the fluid containing passage in the base unit, and having an outer contacting side adapted to be placed in thermal contact with the heat source; and a heat exchanging fluid contained in the fluid-receiving space in the fluid container and the fluid containing passage in the base unit, the heat exchanging fluid being capable of changing into fluid vapor when absorbing heat generated by the heat source, the fluid vapor being capable of changing into fluid condensate when cooled. | 12-16-2010 |
| 20100319879 | MULTI-PRESSURE CONDENSER AND CONDENSATE REHEATING METHOD - A multi-pressure condenser has first and second condensers with vacuum pressures. The second condenser has a higher pressure. The first condenser has a first cooling water tube bundle, and a pressure barrier which extends below the first cooling water tube bundle. A heat-transfer tube introduces fluid from outside the first condenser into the first hot well below the barrier. Liquid is dropped into the first hot well through the through holes of the pressure barrier. The second condenser has a second cooling water tube bundle. Condensate generated in the high-pressure chamber is accumulated below the second cooling water tube bundle. The multi-pressure condenser further has a steam duct to connect the gas phase parts of the first hot well and the second condenser, and a pipe to communicate the liquid phase parts of the first hot well and the second condenser. | 12-23-2010 |
| 20100326627 | Microelectronics cooling system - In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices. | 12-30-2010 |
| 20100326628 | CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided herein which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation. | 12-30-2010 |
| 20110005723 | IONIC LIQUID STABILIZER COMPOSITIONS - The present invention relates to compositions comprising at least one ionic liquid and CF | 01-13-2011 |
| 20110005724 | HEAT TRANSPORT DEVICE MANUFACTURING METHOD AND HEAT TRANSPORT DEVICE - [Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding. | 01-13-2011 |
| 20110024083 | HEAT EXCHANGER - A heat exchanger including a heat exchange fluid inlet, tubing coupled to the heat exchange fluid inlet, the tubing being configured to direct a flow of heat exchange fluid through the heat exchanger, the flow of fluid having a main fluid flow direction, and an air inlet configured to direct a flow of air in a generally collinear relationship with the main fluid flow direction. | 02-03-2011 |
| 20110024084 | DIRECT CONTACT HEAT EXCHANGER AND METHODS FOR MAKING AND USING SAME - A direct heat exchange method and apparatus for recovering heat from a liquid heat source is disclosed, where the method includes contacting a liquid heat source stream with a multi-component hydrocarbon fluid, where the hydrocarbon fluid compositions has a linear or substantially linear temperature versus enthalpy relationship over the temperature range of the direct heat exchange apparatus. | 02-03-2011 |
| 20110030921 | VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a plurality of supporting posts received in the casing and at least a metallic wire connecting the supporting posts. Each supporting post defines at least a channel therein. The at least a metallic wire engagingly extends through the channels of the supporting posts. Top and bottom ends of the supporting posts engage the wick structure to reinforce a structure of the vapor chamber. | 02-10-2011 |
| 20110048676 | COOLING SYSTEM AND ELECTRONIC APPARATUS APPLYING THE SAME THEREIN - A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU | 03-03-2011 |
| 20110067842 | FLUID ENCAPSULATED HEAT TRANSFER VESSEL AND METHOD - A heat transfer vessel is provided which facilitates heating of a substance when disposed therein. The vessel is a partially hollow structure which includes a chamber formed between an outer shell and an inner shell, in base and sidewall portions of the vessel. A heat transfer fluid is disposed within the chamber to facilitate transfer of heat from the outer shell to the inner shell, and therefore, to a substance when disposed within the vessel. The heat transfer fluid is a two-phase encapsulated fluid with a liquid state which undergoes boiling with the application of heat to the outer shell and a vapor state which condenses with contact to the inner shell, thereby facilitating transfer of heat from the outer shell to the inner shell, and hence to the substance when disposed within the vessel. | 03-24-2011 |
| 20110100604 | HEAT RADIATING DEVICE AND MANUFACTURING METHOD OF HEAT RADIATING DEVICE - A heat radiating device for radiating heat of a circuit, includes a heat pipe which has a first straight portion and a second straight portion parallel with the first straight portion, and a curved portion connected to the first and second straight portions, a first base which is in contact with the circuit and is joined at a first surface thereof opposite to a surface thereof facing the circuit, to the first straight portion; a plurality of first fins which are provided on the first surface, have flat surfaces perpendicular to the first straight portion, and cross the second straight portion; a second base which has a second surface perpendicular to the first base and the first straight portion and is joined to the first heat pipe; and a plurality of second fins which are provided on the second surface and extend to a direction perpendicular to the second surface. | 05-05-2011 |
| 20110108241 | METHOD FOR MAKING PHASE CHANGE PRODUCTS FROM AN ENCAPSULATED PHASE CHANGE MATERIAL - The present invention provides methods of producing manufactured aggregates and other compositions from an encapsulated PCM slurry, suspension or emulsion by combining a cementitious binder and an adsorbent and/or absorbent with the PCM slurry. The encapsulated PCM can be introduced as damp cake or dry form as alternatives to the liquid forms. Fire resistant aggregates can be produced in an agglomeration process. The ingredients can also be mixed to form a viscous mass which can be extruded or otherwise formed to produce useful products. | 05-12-2011 |
| 20110108242 | Method and Apparatus for Cooling a Temperature-Sensitive Assembly of a Motor Vehicle - A cooling arrangement for cooling a temperature-sensitive assembly, (such as an electrical assembly) of a motor vehicle includes a condenser for liquefying at least a partial volume of a cooling medium in a cooling circuit, and an evaporator disposed downstream of the condenser on which the cooling medium can impinge and to which heat from the electrical assembly (12) can be applied. The cooling arrangement comprises a pump device by which the evaporator can be charged by at least the liquefied partial volume of the cooling medium. A method for cooling a temperature-sensitive assembly, such an electrical assembly, of a motor vehicle is also provided. | 05-12-2011 |
| 20110127010 | MULTI-PASSAGE THERMAL SHEET AND HEAT EXCHANGER EQUIPPED THEREWITH - The present invention concerns a novel thermal sheet, which is divided into at least two passages by means of rolling or welding seams, and thermal sheet modules constructed thereof, wherein the passages are connected through common feed and discharge lines for a cooling or heating agent supply. Such thermal sheets are referred to as multi-passage thermal sheets. | 06-02-2011 |
| 20110127011 | HEAT EXCHANGER - An exemplary heat exchanger includes evaporator channels and condenser channels, connecting parts for providing fluid paths between evaporator channels and the condenser channels, a first heat transfer element for transferring a heat load to a fluid in said evaporator channels, and a second heat transfer element for transferring a heat load from a fluid in the condenser channels. In order to achieve a heat exchanger that can be used in any position, the evaporator channels and said condenser channels can have capillary dimensions. The connecting part arranged at a first end of heat exchanger can include a first fluid distribution element for conducting fluid from a predetermined condenser channel into a corresponding predetermined evaporator channel, and the connecting part arranged at a second end of the heat exchanger can include a second fluid distribution element for conducting fluid from a predetermined evaporator channel into a corresponding predetermined condenser channel. | 06-02-2011 |
| 20110155348 | LIQUID THERMAL INTERFACE MATERIAL DISPENSE AND REMOVAL SYSTEM - Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed. | 06-30-2011 |
| 20110155349 | METHOD AND SYSTEM FOR COOLING HOT GASES BY WATER INJECTION - Hot gas, produced in a thermal reactor ( | 06-30-2011 |
| 20110192574 | COOLING STRUCTURE, ELECTRONIC DEVICE USING SAME, AND COOLING METHOD - A maintenance-free cooling structure is provided which, by removing bubbles produced on a boiling surface utilizing an action other than buoyancy, heat change (heat transfer) is effectively brought about on the boiling surface, thus enabling efficient cooling and its miniaturization and low power consumption. The cooling structure has an evaporation chamber | 08-11-2011 |
| 20110203775 | System in a Network Node for Regulating Temperature of Electronic Equipment - A system in a radio network node for regulating temperature of electronic equipment comprises the electronic equipment and a heat exchanger unit ( | 08-25-2011 |
| 20110214840 | BOILING HEAT TRANSFER DEVICE - A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion. | 09-08-2011 |
| 20110220326 | ENERGY RECOVERY UNIT - Aspects relate to an energy recovery unit comprising a vessel having a condensate inlet and a condensate outlet and a fluid feed line defining a fluid path. First and second heat exchangers are located within the vessel and are arranged to transfer heat from flash vapor and condensate respectively, to fluid in the fluid feed line. The energy recovery unit can be used to recover waste energy from condensate and flash steam and use it to pre-heat process water, such as boiler feed water. | 09-15-2011 |
| 20110220327 | EBULLIENT COOLING DEVICE - Provided is an ebullient cooling device that can prevent the freezing of liquid cooling medium, and which can inhibit the occurrence of burnout. An ebullient cooling device includes an accommodating unit in which a liquid cooling medium is accommodated, the liquid cooling medium receiving heat that results from a heating element and is an ebullient cooling device to be installed in vehicle, wherein the liquid cooling medium is a mixed liquid of water and ethanol, and the mixed liquid has an ethanol concentration of 40% by mass or more. | 09-15-2011 |
| 20110232873 | COOLING DEVICE - A cooling device is made compact without impairing the desired cooling efficiency. A secondary cooling device ( | 09-29-2011 |
| 20110232874 | HEAT DISSIPATION APPARATUS WITH HEAT PIPE - A heat dissipation apparatus includes an evaporator receiving heat from a heat source, a condenser releasing the heat of the heat source, and a pipeline inter connecting the evaporator and the condenser. The condenser defines a flat rectangular chamber therein. A working fluid is contained in the evaporator. The working fluid vaporizes upon receiving the heat of the heat source. The pipeline conducts the vaporized working fluid from the evaporator to the condenser. The vaporized working fluid condenses upon releasing the heat in the chamber. | 09-29-2011 |
| 20110259553 | MODULAR HEAT EXCHANGER AND CONVERSION SYSTEM - Various embodiments of a waste heat recovery and conversion system are disclosed. The system may include a modular heat exchanger whose energy source is provided by waste heat energy transporting fluids transferring their energy to a working fluid. The working fluid may be in a liquid state contained in a reservoir hydraulically connected to a high-pressure heat transfer chamber. The high-pressure heat transfer chamber may be configured to receive thermal energy utilized to convert the working fluid into a superheated vapor. The system may also include a waste heat conversion system hydraulically connected to the heat transfer chamber to receive the superheated vaporized working fluid from the heat transfer chamber. The waste heat conversion system may be configured to expand the superheated working fluid through an expander for the conversion of waste heat energy into useful energy. For applications involving internal combustion engines, the system may be configured such that the conversion of waste heat energy into useful energy may drive an air compressor to enhance combustion engine performance and decrease pollutant emissions. | 10-27-2011 |
| 20110277962 | PRODUCTION OF PROCESS GAS BY HEAT RECOVERY FROM LOW-TEMPERATURE WASTE HEAT - Process for heat utilization in steam reforming, having a high-temperature conversion unit, a first heat exchanger, boiler feed water preheater, product condensate heat exchanger, and low-pressure evaporator, a cooling section, in which the process gas is further cooled and a condensate stream is generated and the resultant process gas is passed through at least one unit for further processing. Wherein a first part of the boiler feed water stream is passed into the low-pressure evaporator, and the low-pressure steam generated is divided and a first substream of the low-pressure steam is conducted into the water treatment unit for heat transfer and a second substream of the low-pressure steam is passed to at least one consumer. A second part of the boiler feed water stream is passed via a heat exchanger and one or more boiler feed water preheaters and finally passed for steam generation. | 11-17-2011 |
| 20110297354 | SYSTEM AND METHOD THAT DISSIPATE HEAT FROM AN ELECTRONIC DEVICE - The electronic system includes an electronic device and a liquid holding section that is thermally coupled to the electronic device. The electronic system further includes an impermeable section that engages the liquid holding section. The impermeable section includes a channel and a plurality of passages that provide fluid communication between the liquid holding section and the channel. The electronic system further includes (i) a first fluid that flows through the channel in the impermeable section to facilitate heat transfer from the electronic device to the first fluid; and (ii) a second fluid that flows from the liquid holding section through the plurality of passages into the channel when the second fluid boils within the liquid holding section due to heat transfer from the electronic device to the second fluid. In some embodiments, the first and second fluids are different types of substances. | 12-08-2011 |
| 20110315349 | APPARATUS AND PROCESS FOR THERMAL DECOMPOSITION OF ANY KIND OF ORGANIC MATERIAL - The present invention refers to a Low Temperature Conversion apparatus composed of tri-tubes which simultaneously carries out the functions of vessel and heat exchanger. This apparatus is capable of thermally decomposing any kind of organic material to obtain coal, oil, water and non-condensable gases, and also decontaminating soils and residues contaminated with organochlorides and dioxins. | 12-29-2011 |
| 20110315350 | DIRECT FORCED DRAFT FLUID COOLER/COOLING TOWER AND LIQUID COLLECTOR THEREFOR - Direct forced draft fluid cooler/closed loop cooling towers and cooling towers are provided with fans at the bottom of the unit, and a plurality of layers of water collection troughs or channels above the fans to capture water droplets sprayed downwardly from the top of the device through a heat exchanger or fill media above the collection troughs. In one embodiment the collection troughs supply the collected water to one or more gutters inside the housing which lead the water to an external collection tank from which the water is recirculated through the system. | 12-29-2011 |
| 20120000630 | Cooling Of An Electronic Device In An Aircraft By Case-By-Case Single-Phase Or Two-Phase Cooling - Cooling of an electronic device in an aircraft by case-by-case single-phase or two-phase cooling | 01-05-2012 |
| 20120012280 | DEVICE AND METHOD FOR GENERATING STEAM WITH A HIGH LEVEL OF EFFICIENCY - Steam is produced from a working medium of a steam generator, e.g., a waste heat steam generator, a Kalina steam generator or an ORC steam generator, using a thermal generator mounted upstream from the steam generator. To evaporate the working medium, the steam generator uses a hot heat transmitting medium that is heated in the thermal generator before being supplied to the steam generator, thereby increasing the efficiency of the steam generator. The residual or waste heat of an industrial plant or a geothermal plant using geothermal energy is used, for example, as a heat source for the thermal generator | 01-19-2012 |
| 20120018130 | THERMAL SIPHON STRUCTURE - A thermal siphon structure includes a main body, a chamber disposed therein, an evaporation section, a condensation section and a connection section positioned between the evaporation section and condensation section. The evaporation section and condensation section are respectively arranged in the chamber on two sides thereof. The connection section has a set of first communication holes and a set of second communication holes in communication with the evaporation section and condensation section. The evaporation section and condensation section respectively have multiple first and second flow guide bodies, which are arranged at intervals to define therebetween first and second flow ways. Each of the first and second flow ways has a narrower end and a wider end. The first flow ways communicate with a free area. The condensation section is designed with a low-pressure end to create a pressure gradient for driving a working fluid to circulate without any capillary structure. | 01-26-2012 |
| 20120018131 | PRESSURE DIFFERENCE DRIVEN HEAT SPREADER - A pressure difference driven heat spreader includes a chamber defined in a main body; a vaporizing section arranged in the chamber and including a plurality of first flow-guiding members spaced from one another to define first flow passages therebetween, the first flow passages each having at least one free end communicating with a free zone; a condensing section arranged in the chamber opposite to the vaporizing section and including a plurality of second flow-guiding members spaced from one another to define second flow passages therebetween; and an interconnecting section arranged between the vaporizing and condensing sections and having first and second communicating holes for communicating the vaporizing section with the condensing section. The condensing section functions as a low-pressure end, so that a pressure gradient is produced in the pressure difference driven heat spreader to drive steam-water circulation therein, and no wick structure is needed for driving the working fluid. | 01-26-2012 |
| 20120018132 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a centrifugal fan and a fin assembly. An air outlet is defined in the centrifugal fan. The fin assembly is located at the air outlet of the centrifugal fan. The fin assembly includes a first fin unit and two second fin units. The first fin unit includes a plurality of first fins made of a first material. Each of the second fin units includes a plurality of second fins made of a second material. A heat conductive efficiency of the first material exceeds that of the second material. | 01-26-2012 |
| 20120018133 | THERMOSIPHON EVAPORATOR - The invention relates to an evaporator ( | 01-26-2012 |
| 20120031586 | Condenser - Each tube and a corresponding fin satisfy all of the following relationships: Lp−t≧0.03Tr+0.22; Lp−t≦0.115Tr | 02-09-2012 |
| 20120037343 | DEVICE AND METHOD FOR CONDENSING WATER - A device for condensing water includes a container with a plurality of openings and a heat transfer zone arranged in an interior of the container. The heat transfer zone includes a bulk material layer and/or a fiber layer and/or a textile layer and/or a grid layer and/or a lattice layer and/or a perforated plate. The interior of the container is subdivided by the heat transfer zone into a first zone and a second zone. Further, the heat transfer zone has at least in sections an open porosity and/or channels through which process gas can flow from the first zone to the second zone and through which a further process gas in the form of cooling gas can flow in a reverse direction. A permeable region of the heat transfer zone partially includes materials which have a thermal conductivity of more than 20 W(mK) | 02-16-2012 |
| 20120067550 | HEAT SINK STRUCTURE EMBEDDED WITH HEAT PIPES - A heat sink structure embedded with a heat pipe includes a heat dissipation seat, at least one heat pipe, a metal-filling adhesive and at least one covering sheet. The heat dissipation seat has a heat absorption surface and a heat dissipation surface. The heat absorption surface has at least one groove to hold the heat pipe and a bonding medium. The groove is covered by the covering sheet. The metal-filling adhesive is filled with the groove to bond the heat pipe and covering sheet through the bonding medium that can increase adhesion force. The covering sheet covers the heat pipe from being damaged during polishing the heat absorption surface to maintain sealing characteristic of the heat pipe. Therefore, the heat pipe can provide rapid heat conduction effect to meet use requirement. | 03-22-2012 |
| 20120067551 | THERMAL ENERGY STORAGE USING SUPERCRITICAL FLUIDS - A thermal energy storage system is described employing latent heat storage of a supercritical fluid instead of typical phase change materials. Two fundamental thermodynamic concepts are invoked. First, by using the latent heat of liquid/vapor phase change, high energy density storage is feasible. Second, by operating the thermal energy storage system at a higher pressure, the saturation temperature is increased to operate at molten salt temperatures and above. Beyond the two-phase regime, supercritical operation permits capturing and utilizing heat taking advantage of latent and sensible heat, both in the two-phase regime as well as in supercritical regime while at the same time, reducing the required volume by taking advantage of the high compressibilities. | 03-22-2012 |
| 20120073787 | COOLING FOR SUPERCONDUCTING MACHINES - A device for cooling superconducting machines has a closed thermal siphon system which can be filled with a liquid coolant and has an evaporator for evaporating the liquid coolant. In order to improve the cooling performance of the device, the surface area of the evaporator which can be wetted with the liquid coolant is increased. | 03-29-2012 |
| 20120097368 | HEATING EXCHANGE CHAMBER FOR LIQUID STATE COOLING FLUID - A heat exchange chamber for liquid state cooling fluid is provided, which comprises a casing and a thermal dissipation device, the casing has a cavity and the thermal dissipation device is sited in the cavity. A cooling fluid flows through the cavity along a flow direction. The cross-sectional area of the cavity whose direction is perpendicular to the flow direction shows linear increase or non-linear increase gradually along the flow direction, and a part of the cooling fluid vaporizes after flowing through the thermal dissipation device. The chamber along the flow direction shows different pressures, and two phase fluid flows automatically due to the pressure difference. The heat exchange chamber for liquid state cooling fluid could lighten the loading of the pump which is for circulating the cooling fluid, and it also achieve the efficacy of saving energy and raising efficiency. | 04-26-2012 |
| 20120097369 | HEAT EXCHANGER - The disclosure relates to a heat exchanger including at least a first group and a second group of channels arranged to provide fluid paths between a first end and a second end of the heat exchanger. Connecting parts are arranged at the first end and at the second end of the heat exchanger. A first heat transfer element transfers a heat load to fluid, and a second heat transfer element transfers a heat load from the fluid. The channels have capillary dimensions. The connecting parts include fluid distribution elements, and the first and second heat transfer element contact all channels | 04-26-2012 |
| 20120097370 | FLOW BALANCING SCHEME FOR TWO-PHASE REFRIGERANT COOLED RACK - A cooling system distributes fluid to a plurality of docking bays within a server rack. The server rack includes docking bays for housing electronics devices. A two-phase fluid-based heat exchanging system is coupled to each docking bay, which functions to remove heat from the electronics server. The docking bays are conceptually divided into one or more sections, and a dynamic fluid flow regulator is included within a section input line that supplies a liquid-phase fluid to each section. The section input line branches into a plurality of parallel fluid paths, one parallel fluid path coupled to each docking bay in the section. A fixed fluid flow regulator is included within each branching fluid pathway. The combination of the dynamic and fixed fluid flow regulators provides balanced fluid flow to each two-phase heat exchanging system. | 04-26-2012 |
| 20120103570 | Natural Draft Condenser - A system for condensing steam includes a steam supply duct, a supply riser, a supply manifold, a pair of condensing panels, a return manifold, and a condensate return. The steam supply duct is configured to convey steam from a steam generator. The supply riser is configured to convey steam from the steam supply duct. The supply manifold is configured to convey steam from the supply riser. The pair of condensing panels is configured to receive steam from the supply manifold. The supply manifold bifurcates with each bifurcation being configured to supply a respective condensing panel of the pair of condensing panels. The return manifold is configured to receive condensate from the pair of condensing panels. The condensate return duct is configured to convey condensate from the return manifold to the steam generator. | 05-03-2012 |
| 20120111537 | FLEXIBLE HEAT DISSIPATION MODULE - A flexible heat dissipation module comprises at least one first heat pipe, one second heat pipe, and one flexible component. The first heat pipe includes a first heat absorbing end and a first heat dissipating end; the second heat pipe includes a second heat absorbing end and a second heat dissipating end. The flexible component includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining part, wherein the first and the second joining parts are attached respectively to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe. With the disposition of flexible components, the flexible heat module according to the present invention has wider installation applicability and more flexible programmability to adapt to existing narrow device space. | 05-10-2012 |
| 20120111538 | HEAT DISSIPATION STRUCTURE - A heat dissipation structure mounted onto an electronic element to dissipate heat. The heat dissipation structure includes a heat absorber connected with the electronic element and a heat sink. The heat absorber has a hollow first chamber to hold a working fluid. The heat absorber and heat sink are interposed by a plurality of first conduits. When the heat absorber absorbs heat generated by the electronic element through a contact surface, the working fluid held therein is vaporized into vapor. The vapor enters a second chamber of the heat sink through the first conduits and performs heat exchange with a cooling surface of the heat sink to be converted into the working fluid again. The working fluid is conveyed via a capillary structure in the second conduit to the first chamber to form a thermal cycle. The structure of the invention is simpler and can rapidly absorb and dissipate heat. | 05-10-2012 |
| 20120125570 | HEAT DISSIPATING DEVICE - A heat dissipating device is disclosed, which includes a fan body, an upper fan cover, and a lower fan cover. The upper fan cover and the lower fan cover are assembled on the fan body. The fan body has an airflow outlet. The upper fan cover includes an upper cover front portion, and plural upper cover recessions disposed at the upper cover front portion. The upper cover recessions are located in front of the airflow outlet. | 05-24-2012 |
| 20120125571 | Heat-Dissipating Device for Space-Based Equipment, Notably for a Satellite - A device for dissipating heat, for a space-based satellite, includes at least one dissipating panel, the dissipating panel having at least one skin formed from a composite structure comprising an organic resin and carbon fibers, wherein the organic resin is filled with carbon nanotubes. The heat-dissipating device may also comprise a network of heat pipes. The heat pipes may be made from an aluminum alloy incorporating elements having low coefficients of thermal expansion. The present invention is notably applicable to fixed dissipating panels or those that may be used in telecommunications, observation or scientific satellites, or else on racks assembled to dissipating panels. | 05-24-2012 |
| 20120132401 | MULTI-COOLING MODULE FOR VEHICLE - The present invention relates to a multi-cooling module for a vehicle, and more particularly to a multi-cooling module adapted to simultaneously cool an engine, electric parts, and a condenser through one or more heat pipes. In the multi-cooling module for a vehicle, one or more heat pipes are mounted to pass through two or more refrigerant passage pipes which go through with the same cooling system core unit. | 05-31-2012 |
| 20120132402 | LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME - A loop heat pipe includes: a first evaporator and a second evaporator each of which vaporizes a liquid-phase working fluid and converts the liquid-phase working fluid to a vapor-phase working fluid; a first condenser and a second condenser each of which condenses the vapor-phase working fluid and converts the vapor-phase working fluid back to the liquid-phase working fluid; a first vapor line through which the working fluid converted to the vapor phase is transported to the first condenser; a first liquid line through which the working fluid converted to the liquid phase is transported to the second evaporator; a second vapor line through which the working fluid converted to the vapor phase is transported to the second condenser; and a second liquid line through which the working fluid converted to the liquid phase is transported to the first evaporator. | 05-31-2012 |
| 20120168129 | ADAPTIVE HEAT DISSIPATING DEVICE - An adaptive heat dissipating device includes a heat-transfer element and a heat-dissipation element. An end of the heat-transfer element is a spherical body, and an end of the heat-dissipation element is a semispherical socket for correspondingly receiving the spherical body therein, such that the spherical body is rotatably connected to the semispherical socket. Therefore, the heat-transfer element has enough degrees of freedom to rotate in different directions and pitch at different angles relative to the heat-dissipation element. With these arrangements, the adaptive heat dissipating device can have largely upgraded heat dissipation efficiency and increased flexibility in application. | 07-05-2012 |
| 20120168130 | HEAT SINK - A heat sink includes a first plate having a first surface with a heat source contact region, and a second surface has a looped peripheral groove, and first to n | 07-05-2012 |
| 20120175082 | SOLAR HEAT PIPE HEAT EXCHANGER - This invention relates to the process of collecting heat and removing heat from a heat pipe for solar energy applications. More specifically, this invention is a solar energy system that elegantly couples a heat pipe and a single header heat transfer assembly that has the capability of interchangeable operational designs using solar collector panel, solar vacuum tube, or integrated solar thermal and photovoltaic array configurations. The header assembly is structurally and thermally connected to the heat pipe by a heat pipe receiver which surrounds the condenser end of the heat pipe and plugs into the interior of the header assembly. | 07-12-2012 |
| 20120175083 | HEAT TRANSFER DEVICE - A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system. | 07-12-2012 |
| 20120180992 | AXIAL FLOW HEAT EXCHANGER DEVICES AND METHODS FOR HEAT TRANSFER USING AXIAL FLOW DEVICES - Systems and methods described herein are directed to rotary heat exchangers configured to transfer heat to a heat transfer medium flowing in substantially axial direction within the heat exchangers. Exemplary heat exchangers include a heat conducting structure which is configured to be in thermal contact with a thermal load or a thermal sink, and a heat transfer structure rotatably coupled to the heat conducting structure to form a gap region between the heat conducting structure and the heat transfer structure, the heat transfer structure being configured to rotate during operation of the device. In example devices heat may be transferred across the gap region from a heated axial flow of the heat transfer medium to a cool stationary heat conducting structure, or from a heated stationary conducting structure to a cool axial flow of the heat transfer medium. | 07-19-2012 |
| 20120180993 | HEAT CONVEYING STRUCTURE FOR ELECTRONIC DEVICE - A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant; a condensing section that has a chamber structure with second fins erected therein, is thermally connected to a radiator provided outside the electronic device, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant; a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and a liquid pipe that connects the evaporating section and the condensing section, and moves the liquid coolant from the condensing section to the evaporating section. | 07-19-2012 |
| 20120186784 | MICRO VAPOR CHAMBER - A micro vapor chamber includes a first plate and a second plate. The first plate has a condensing region constituted of a plurality of protrusions. The second plate has a plurality of liquid-collecting regions and an evaporating region. The condensing region is located to correspond to the liquid-collecting regions and the evaporating region. The first plate is arranged to cover the second plate. The condensed working fluid are quickly collected on the protrusions to flow back to the evaporating region, thereby improving the liquid-vapor phase circulation of the working fluid in the micro vapor chamber greatly. | 07-26-2012 |
| 20120186785 | HEAT PIPE SYSTEM HAVING COMMON VAPOR RAIL FOR USE IN A VENTILATION SYSTEM - A heat transfer system is adapted for transferring heat between two different ducts in a ventilation system. The system has a heat pipe having a plurality of conduits. Each conduit including an evaporator section extending laterally from a first open end of the respective conduit, a condenser section extending laterally from a second open end of the respective conduit, and a liquid return section. The liquid return section of at least one conduit being distinct from the liquid return section of another of the conduits. A common vapor manifold is in fluid communication with and extends between the first and second open ends of each of said plurality of conduits so vapors produced in the evaporator sections can flow from the first open ends through the common vapor manifold to the second open ends without flowing through the conduits. | 07-26-2012 |
| 20120193076 | COOLING STRUCTURE FOR AN ELECTRONIC COMPONENT AND ELECTRONIC INSTRUMENT - A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the ehoofuocmmionnductordcnncni. A fixing support point of a plate spring is provided at a center of this protruding surface, and the plate spring is fixed on all sides. Grounding pressure is applied via the single point provided by the fixing support point. As a result, any tilting of the heat-absorbing surface relative to the surface of the heat-generating element is kept to a minimum. Heat pipes are provided around the periphery such that they enclose the protruding area from the outside. | 08-02-2012 |
| 20120199322 | COOLING METHOD AND DEVICE FOR COOLING A MEDIUM-VOLTAGE ELECTRICAL INSTALLATION IN A PROTECTIVE SHEATH - A device including a phase-change heat-transfer fluid cooling mechanism to cool a sheath in which is placed switchgear such as a circuit breaker. An evaporator is thus created which is connected to condensers that are placed on a roof of the sheath. The device can be for application to a medium-voltage high-current electrical installation. The device requires little maintenance and only consumes a reduced amount of energy, or even no energy. | 08-09-2012 |
| 20120205073 | Method and device for recovering heat from intermittently and briefly released blow-off steam charge - The invention relates to a method for recovering heat from intermittently and instantaneously released blow-off steam charges. The method is carried out using a container ( | 08-16-2012 |
| 20120211201 | COOLING DEVICE FOR A HEAT SOURCE - A cooling element for a heat source, especially LED modules with many components, includes a base body in thermal and mechanical contact with a body of the heat source, at least one heat pipe having an end section inserted into the base body in a form-fitting and thermoconducting manner, and at least one cooling body having cooling body lamellae on the other end section of the heat pipe. The heat pipes extend over the entire length of the base body such that a hot zone of the heat source lies on a contact surface of the base body, the heat pipes extend parallel to each other and to the contact surface of the heat source. The base body is fixed to the body of the heat source, base body lamellae being provided on the outer side of the base body, formed as a single component thereon or connected thereto. | 08-23-2012 |
| 20120216991 | METHOD FOR ASSEMBLING HEAT PIPE AND THERMO-CONDUCTIVE BODY AND STRUCTURE THEREOF - A heat pipe and thermo-conductive body assembling structure and a method for manufacturing the same are disclosed. The thermo-conductive body is provided a trough with two pressing arms at the opening thereof. The heat pipe is accommodated in the trough and pressed by the pressing arms. An exposed portion of the heat pipe and outer surfaces of the pressing arms are coplanar. | 08-30-2012 |
| 20120227933 | FLAT HEAT PIPE WITH SECTIONAL DIFFERENCES AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a flat heat pipe with sectional differences and a method for manufacturing the same. The heat pipe has a flat hollow pipe body. A working fluid is sealed in the pipe body. The pipe body is provided along its length with a plurality of flat sectional difference portions having different widths. A connecting portion is formed between the sectional difference portions. The inner wall of the pipe body is formed with a plurality of grooves. The pitch between the grooves in the sectional difference portion of a relatively large width is larger than the pitch between the grooves in the sectional difference portion of a relatively small width. | 09-13-2012 |
| 20120234517 | INTERMEDIATE HEAT EXCHANGER - An intermediate heat exchanger | 09-20-2012 |
| 20120247734 | Low Cost Long Exhaust Heat Exchanger - A design and manufacturing technique for a “Long Heat Exchanger”, a counter-flow heat exchanger sizeable to transfer up to 100% of heat and temperature between two fluids (gas or liquid). Inner “Core” capable of manufacture in continuous lengths, may be coiled, cut and formed to shape multiple applications, ranging from engine exhaust, to recycling steam turbine, to building furnaces. Core costs are comparable to metal tubing costs, and outer or “Main” channel housing may be existing exhaust channels being retrofitted or new housing injection molded in sections. | 10-04-2012 |
| 20120247735 | HEAT SINK - The heat sink has a first heat transfer plate member that has one surface thermally connected to a heat generating component and is thermally connected to a first heat dissipating fin section having thin plate fins; a second heat transfer plate member that has one surface thermally connected to a second heat dissipating fin section having thin plate fins; a heat pipe section that is provided between an opposite surface of the first heat transfer plate member and an opposite surface of the second heat transfer plate member to be thermally connected thereto; and a heat transfer block that is thermally connected to a side surface and an upper surface of the heat pipe section and arranged to sandwich the heat pipe section between the heat transfer block and the second heat transfer plate member. | 10-04-2012 |
| 20120261093 | HEAT PIPE - A heat pipe comprises a housing that has a heating section that is made of metal and is contacted by a heating element, a cooling section that is made of metal and is cooled by a cooling element, and a plurality of refrigerant flow channels formed inside the housing from the heating section to the cooling section; refrigerant that is enclosed inside the plurality of refrigerant flow channels; and heat-insulating layers that are disposed between the plurality of refrigerant flow channels located at least at the heating section in the housing. | 10-18-2012 |
| 20120267077 | COOLING APPARATUSES AND POWER ELECTRONICS MODULES COMPRISING THE SAME - Cooling apparatuses and power electronics modules with cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes a heat transfer plate having a heat output surface and a periodic fractal pattern formed in the heat output surface. The periodic fractal pattern increases the surface area of the heat output surface and provides vapor bubble nucleation sites. An enclosure encloses the heat transfer plate and forms a fluid chamber between the enclosure and the heat transfer plate. A fluid source is fluidly coupled to the fluid chamber and provides cooling fluid to the fluid chamber. When the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source. | 10-25-2012 |
| 20120279685 | PHASE-CHANGE TURBO-DISSIPATION COOLER - A phase-change turbo-dissipation cooler comprises a heat extracting apparatus and a heat dissipating apparatus. The heat extracting apparatus includes a closed container having an outlet nozzle and an inlet, the closed container being filled with a liquid of low boiling point. The heat dissipating apparatus includes a chambered body, an air supply tube, a vapor tube, and a condensing tube. The chambered body is provided with a common shaft, a turbine, and a blower. The condensing tube is provided with multiple fins and an expansion valve and connected between the vapor tube and the closed container. The liquid can be vaporized in the closed container by a heat source to blow into the chambered body to rotate the turbine together with the blower and then flow back to the closed container. The blower can suck in ambient air to blow through the fins on the condensing tube to dissipate heat. | 11-08-2012 |
| 20120279686 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 11-08-2012 |
| 20120312504 | BOILING REFRIGERANT TYPE COOLING SYSTEM - A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove. | 12-13-2012 |
| 20120312505 | Cryogenic Cooling Method Using a Gas-Solid Diphasic Flow of CO2 - The invention relates to a method implementing liquid CO | 12-13-2012 |
| 20120312506 | LOOP HEAT PIPE - A loop heat pipe includes an evaporator to vaporize a working fluid due to heat supplied from an external heat source; a condenser to cause the vaporized working fluid to condense; and connecting lines to connect the evaporator and the condenser in a loop, wherein the evaporator includes a first space defined by a set of walls including a contact wall that comes into contact with the external heat source, a second space provided adjacent to at least one of the walls other than the contact wall, and a through-hole formed in a dividing wall separating the first space and the second space to allow the first space and the second space to communicate with each other. | 12-13-2012 |
| 20120325436 | HIGH EFFICIENCY THERMAL MANAGEMENT SYSTEM - Disclosed are methods and apparatuses for cooling a work piece surface using two-phase impingement, such as direct jet impingement. Preferred methods include flowing a coolant through a chamber comprising a surface to be cooled by projecting a jet stream of coolant against the surface while maintaining pressure in the chamber to permit at least a portion of coolant contacting the surface to boil. Preferred apparatuses include a chamber comprising the surface and tubular nozzles configured to project a stream of coolant against the surface, a pump for forcing coolant through the tubular nozzles, a pressurizer for maintaining an appropriate pressure in the chamber, and a heat exchanger for cooling the coolant exiting the chamber. The apparatuses may further include a pressure regulator for detecting changes in temperature of the coolant exiting the chamber and communicating with the pressurizer to adjust the maintained pressure accordingly. The methods and apparatuses disclosed herein provide for effective and efficient cooling of work piece surfaces. | 12-27-2012 |
| 20130008629 | THERMAL MODULE AND METHOD OF MANUFACTURING SAME - A thermal module includes a base and at least one heat pipe. The base has at least one groove formed on one face thereof and a recess formed on another opposite face thereof, and the recess is communicable with the at least one groove. The at least one heat pipe is correspondingly fitted in the at least one groove with one surface of the heat pipe flushing with a bottom of the groove to direct contact with a heat source, so as to avoid thermal resistance and more securely locate the heat pipe in the groove, allowing the thermal module to provide largely increased heat dissipation performance. A method of manufacturing the above thermal module is also disclosed. | 01-10-2013 |
| 20130008630 | Cooling Assembly for Cooling Heat Generating Component - A cooling assembly for cooling of a heat generating component ( | 01-10-2013 |
| 20130014916 | MULTIFUNCTIONAL THERMAL MANAGEMENT SYSTEM AND RELATED METHOD - A system and related method that provides, but is not limited thereto, a thin structure with unique combination of thermal management and stress supporting properties. An advantage associated with the system and method includes, but is not limited thereto, the concept providing a multifunctional design that it is able to spread, store, and dissipate intense thermal fluxes while also being able to carry very high structural loads. An aspect associated with an approach may include, but is not limited thereto, a large area system for isothermalizing a localized heating source that has many applications. For example it can be used to mitigate the thermal buckling of ship deck plates, landing pad structures, or any other structures subjected to localized heating and compressive forces. It can also be used as a thermal regulation system in numerous applications, including but not limited to under-floor heating for residential or commercial buildings or for the de-icing of roads, runways, tunnels, sidewalks, and bridge surfaces. | 01-17-2013 |
| 20130020052 | HEAT DISSIPATION DEVICE WITH HEAT PIPE WITHIN BASE - A heat dissipation device includes a base, at least one heat pipe, and a fin assembly. The base is substantially planar. The base includes a first interface and a second interface opposite to the first interface. The first interface is adapted to contact a heat element. The base defines a slot at the second interface. The at least one heat pipe is received in the slot. The fin assembly contacts the second interface and the at least one heat pipe simultaneously. | 01-24-2013 |
| 20130020053 | LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING - Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat. | 01-24-2013 |
| 20130020054 | PROCESS FOR INCREASING THE EFFICIENCY OF HEAT REMOVAL FROM A FISCHER-TROPSCH SLURRY REACTOR - The present invention is directed to a cooling system for removing heat from a Fischer-Tropsch (F-T) slurry reactor. The cooling system including a downcomer disposed within the F-T reactor to deliver a coolant downward through the F-T reactor at a predetermined velocity. The downcomer and the pressure of the introduced coolant cooperate to increase the coolant velocity, thereby maintaining the coolant in the substantially liquid phase in the downcomer. The cooling system further includes a plenum connected to the downcomer, wherein the coolant remains in the substantially liquid phase. Additionally, the cooling system includes at least one riser extending upward from the plenum, wherein a portion of the coolant vaporizes to provide a boiling heat transfer surface on the at least one riser. | 01-24-2013 |
| 20130025826 | PHASE CHANGE COOLER AND ELECTRONIC EQUIPMENT PROVIDED WITH SAME - A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other. | 01-31-2013 |
| 20130037240 | REFRIGERATOR - Disclosed herein is a refrigerator. The refrigerator includes a main body including inner liners defining a freezer compartment and refrigerator compartment, doors rotatably coupled to the main body, gaskets installed at rears of the doors, each of the gaskets having a magnet provided therein, an intermediate partition wall formed by filling a space between the inner liners with an insulation material, an intermediate front plate disposed at a front of the intermediate partition wall to fix the inner liners, and a heat pipe installed at the front of the intermediate partition wall in a line to prevent dew from being formed on the intermediate front plate, wherein the intermediate front plate is formed in an asymmetric fashion so that the heat pipe installed at the front of the intermediate partition wall is fixed to a middle portion of the intermediate front plate in a tight contact fashion. | 02-14-2013 |
| 20130043004 | LIGHTWEIGHT HEAT PIPE AND METHOD OF MAKING THE SAME - In a lightweight heat pipe and a method for making the lightweight heat pipe, a first hollow pipe and a second hollow pipe making of two different materials are provided. The first hollow pipe is disposed into the second hollow pipe along an axial direction of the second hollow pipe. An inner wall surface of the second hollow pipe is attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe. An inner space of the first hollow pipe is then vacuumed, and the pipe body is sealed after the working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe. | 02-21-2013 |
| 20130056178 | EBULLIENT COOLING DEVICE - An ebullient cooling device includes a chamber, a heat sink, a heat receiving member, and a heat dissipating member. The chamber includes a heat conducting plate with a heat generating body on an outer side surface thereof, and an airtight space filled with coolant that undergoes a phase change between liquid and gas, on an inner side of the heat conducting plate. The heat sink is provided on the outer side surface of the heat conducting plate. The heat receiving member is provided on an inner side surface of the heat conducting plate so as to oppose the heat generating body with the heat conducting plate sandwiched therebetween, and transfers heat generated at the heat generating body to the coolant. The heat dissipating member is provided on the inner side surface of the heat conducting plate, receives heat transferred by the coolant, and dissipates the heat to the heat sink. | 03-07-2013 |
| 20130075064 | Heat Exchanger - A heat exchanger is disclosed for condensing a vapour to a condensate. The exchanger comprises a first heat exchanging chamber, a second heat exchanging chamber and an array of heat pipes which are arranged to extend from within the first heat exchanging chamber to within the second heat exchanging chamber. The first heat exchanging chamber comprises an inlet for receiving a coolant into the chamber and an outlet through which the coolant can exit the first chamber, the coolant being arranged to pass over the portion of the heat pipes which extend within the first chamber. The second heat exchanging chamber comprises an inlet for receiving the vapour into the chamber and an outlet through which the condensate can exit the second chamber, the vapour being arranged to pass over the portion of the heat pipes which extend within the second chamber. The heat exchanger further comprises a fm arranged in contact with the portion of at least one of the heat pipes within the first heat exchanging chamber, which is arranged to increase thermal transfer between said portion of the heat pipe and the coolant. | 03-28-2013 |
| 20130081787 | HEAT PIPE WITH SEALED VESICLE - A heat pipe includes a sealed casing, a sealed vesicle received in the sealed casing, and a working fluid contained in the sealed vesicle. The sealed casing includes an evaporating section, a condensing section, and a connecting section connecting the evaporating section and the condensing section. The sealed vesicle is made of soft metal. The sealed vesicle comprising a heat absorbing portion attached to the evaporating section, a heat dissipating portion attached to the condensing section, and an uneven portion connecting the heat absorbing portion and the condensing section. | 04-04-2013 |
| 20130105120 | MULTI-FLUID, TWO-PHASE IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) | 05-02-2013 |
| 20130105121 | HEAT DISSIPATION DEVICE WITH FIN SET | 05-02-2013 |
| 20130112372 | FLAT HEAT PIPE AND FABRICATION METHOD THEREOF - Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes. | 05-09-2013 |
| 20130112373 | COOLING DEVICE WITH A PLURALITY OF FIN PITCHES - It is an object to provide a cooling device with an increased leeward cooling capacity without increasing the number of heat radiation fins to be installed and the amount of cooling air. | 05-09-2013 |
| 20130118715 | Heat transfer system applying boundary later penetration - A heat transfer system is disclosed incorporating a passive pump utilizing bubble technology to cycle a coolant through associated channels. The system includes a housing and channels containing a slurry consisting of liquid having a low boiling point and microspheres formed of metallic foam introduced into said liquid. The microspheres are caused to flow onto a heat source and penetrate the coolant boundary layer and thereby provide an efficient and fast transfer of heat from the source onto the microspheres and the coolant. The microspheres further provide and efficient and fast transfer of heat through the slurry to a heat dissipating component. | 05-16-2013 |
| 20130118716 | HEAT SINK HAVING HEAT-DISSIPATING FINS CAPABLE OF INCREASING HEAT-DISSIPATING AREA - A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink. | 05-16-2013 |
| 20130126128 | HEAT PIPE AND METHOD OF MANUFACTURING HEAT PIPE - The method of manufacturing heat pipe is disclosed to insert a center bar into a metal tube such that the center bar contacts a clearance area of the inner sidewall of the metal tube. Then, the method is to fill the interval between the center bar and the metal tube with powder for sintering. At last, the method is to perform a sintering, extract the center bar, inject working fluid, and close the metal tube. A heat pipe is therefore formed. Because of no sintered powder on the clearance area, the heat pipe can be bent at the clearance area without damaging the capillary structure formed by the sintered powder. The flow path of the working fluid is not interrupted or influenced, so the heat transfer efficiency can be maintained, which overcomes the decrement of the heat transfer efficiency of a bent heat pipe in the prior art. | 05-23-2013 |
| 20130126129 | HEAT-DISSIPATING FINS - The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved. | 05-23-2013 |
| 20130126130 | HEAT SINK OF A LARGE AREA - The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved. | 05-23-2013 |
| 20130133862 | HEAT DISSIPATION DEVICE WITH FIXING MEMBER FOR HEAT PIPE THEREOF - An exemplary heat dissipation device includes a heat absorbing base, a heat pipe thermally connected to the heat absorbing base, and a fixing member including a main body abutting to the heat absorbing base and two clamps extending from the main body, the heat pipe is sandwiched between the main body and the heat absorbing base, each of the clamps includes an arm portion and a curved portion extending from the arm portion toward the heat absorbing base, the arm portions of the two clamps clamp two opposite lateral sides of the heat absorbing base, the curved portions of the two clamps elastically clamp edges of the heat absorbing base away from the main body. | 05-30-2013 |
| 20130140005 | Condensation Chamber Cooling System - A condensation chamber cooling system of a condensation chamber for a boiling water reactor has a heat exchanger outside the condensation chamber. An elongate cooling module is provided in the condensation chamber with an evaporation space in its upper region. The cooling module is configured such that the evaporation space is located above a maximum filling level of the condensation chamber. The cooling module includes at least one riser pipe and one downpipe that issue with their upper ends into the evaporation space and with their lower ends in the condensation chamber. A first pressure line leads from the evaporation space to the heat exchanger and, from there, a second pressure line which issues in the condensation chamber below the minimum filling level. Thus, the condensation chamber, the pressure lines, the cooling module and the heat exchanger form a passive closed cooling circuit. | 06-06-2013 |
| 20130146257 | CONDENSER FOR VEHICLE - A condenser for a vehicle is used in an air conditioning having an expansion valve, an evaporator, and a compressor, is provided between the compressor and the expansion valve, and circulates coolant supplied from a radiator so as to condense refrigerant supplied from the compressor through heat-exchange with the coolant and the refrigerant. | 06-13-2013 |
| 20130160974 | LOOP HEAT PIPE AND ELECTRONIC APPARATUS - An evaporator of a loop heat pipe includes a case having a liquid flow inlet and a vapor flow outlet, and at least one porous body disposed inside the case and configured to guide liquid-phase working fluid inward of the case. The evaporator further includes a liquid supply duct disposed inside the case and configured to guide the working fluid into the porous body from the liquid flow inlet. The liquid supply duct is made of a material having lower heat conductivity than a material of the case. The working fluid having flowed into the evaporator is prevented from evaporating before reaching the porous body. | 06-27-2013 |
| 20130168050 | HEAT EXCHANGE ASSEMBLY AND METHODS OF ASSEMBLING SAME - A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section. | 07-04-2013 |
| 20130168051 | HEAT DISSIPATING APPARATUS - A heat dissipating apparatus includes a base, a first fin assembly, a second fin assembly, a first heat pipe, and a second heat pipe. The first fin assembly and the second fin assembly are disposed on the top surface of the base. The first fin assembly defines a first through hole. The second fin assembly defines a second through hole. The second fin assembly is a structural mirror image of the first fin assembly. The first heat pipe includes a first contacting portion in contact with the base and a second contacting portion received in the first through hole of the first fin assembly. The second heat pipe includes a third contacting portion in contact with the base and a fourth contacting portion received in the second through hole of the second fin assembly. | 07-04-2013 |
| 20130180687 | CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided herein which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation. | 07-18-2013 |
| 20130186598 | Heat Transfer Device - A heat transfer device is described. In one or more implementations, a device includes a housing that is moveable through a plurality of orientations involving at least two dimensions during usage, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a plurality of heat pipes configured to transfer heat using thermal conductivity and phase transition from the heat-generating device, the plurality of heat pipes arranged to provide generally uniform heat transfer from the heat-generating device during movement of the housing through the plurality of orientations. | 07-25-2013 |
| 20130186599 | HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating device includes a base, a heat pipe and a fixing member. The base includes an accommodating recess and two restraining portions, wherein the two restraining portions are located at opposite sides of the accommodating recess and an opening is between the two restraining portions. A first end of the heat pipe is disposed in the accommodating recess such that a bottom surface of the first end is exposed out of the opening, wherein a width of the opening is smaller than a maximum width of the first end. The fixing member is disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the two restraining portions. | 07-25-2013 |
| 20130206368 | COOLING DEVICE AND METHOD FOR PRODUCING THE SAME - In a cooling device using an ebullient cooling system, the cooling performance adversely decreases if the evaporator includes projections activating the convection heat transfer and the bubble nuclei are formed on the inner wall surface, therefore, a cooling device according to an exemplary aspect of the invention includes an evaporator storing a refrigerant; a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat; and a connection connecting the evaporator and the condenser; wherein the evaporator includes a base thermally contacting with an object to be cooled, and a container; the base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant; and a bubble nucleus forming surface is included only on a part of a refrigerant contacting surface including the boiling surface and the surface of the projections. | 08-15-2013 |
| 20130220579 | EFFICIENT TEMPERATURE FORCING OF SEMICONDUCTOR DEVICES UNDER TEST - A temperature-forcing system, for controlling the temperature of an electronic device under test, comprising
| 08-29-2013 |
| 20130233515 | SPACECRAFT RADIATOR PANELS - Spacecraft, radiator panels for spacecraft, kits for radiator panels, inserts associated with radiator panels, heat pipes associated with radiator panels, and methods of assembling radiator panels are disclosed herein. Radiator panels according to the present disclosure include at least one insert that is positioned adjacent to a heat pipe between two spaced-apart face-sheets, with the insert being configured to secure a package to the inside face-sheet opposite of the heat pipe. | 09-12-2013 |
| 20130233516 | SPACECRAFT RADIATOR PANELS - Spacecraft, radiator panels for spacecraft, kits for radiator panels, inserts associated with radiator panels, heat pipes associated with radiator panels, external structural reinforcement members associated with radiator panels, and methods of assembling radiator panels are disclosed herein. Some radiator panels include at least one insert that is positioned adjacent to a heat pipe between two spaced-apart face-sheets, with the insert being configured to secure a package to the inside face-sheet opposite of the heat pipe. Some radiator panels include at least one external structural reinforcement member that extends across an external side of the radiator panel. | 09-12-2013 |
| 20130233517 | HYBRID RADIATOR COOLING SYSTEM - A method and hybrid radiator-cooling apparatus for implementing enhanced radiator-cooling are provided. The hybrid radiator-cooling apparatus includes an air-side finned surface for air cooling; an elongated vertically extending surface extending outwardly from the air-side finned surface on a downstream air-side of the hybrid radiator; and a water supply for selectively providing evaporative cooling with water flow by gravity on the elongated vertically extending surface. | 09-12-2013 |
| 20130240179 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe. | 09-19-2013 |
| 20130255920 | EBULLIENT COOLING DEVICE - A power card is accommodated in a vaporizing portion. Heat medium in the vaporizing portion is vaporized by heat generated at the power card so as to cool down the power card. A vapor passage and a condensing portion are connected to the vaporizing portion and a communication passage is provided at upper ends of the vapor passage and the condensing portion. The heat medium vaporized in the vaporizing portion moves up to the communication passage and to the condensing portion, so that the heat medium is condensed in the condensing portion and moves to the vaporizing portion. The condensing portion is arranged at an upstream side of the vapor passage in a direction of blowing air. A cross sectional area of the vapor passage is larger than that of the condensing portion. | 10-03-2013 |
| 20130284405 | HEAT EXCHANGER FOR AN EQUIPMENT RACK - A heat exchanger includes an air channel configured to receive air from an equipment rack. A fluid circuit is provided having a bi-phase coolant flowing therethrough. The fluid circuit includes a coolant channel coupled to the equipment rack and positioned adjacent to the air channel. The bi-phase coolant is part liquid and part gas as the bi-phase coolant flows through the coolant channel. The bi-phase coolant is configured to condition the air flowing through the air channel. | 10-31-2013 |
| 20130292094 | Heat Dissipating Device - A heat dissipating device includes an outer heat conducting unit, disposed with outer heat conducting plates, and an inner heat conducting unit. The outer heat conducting unit includes an outer surrounding wall having inner and outer wall surfaces. The inner wall surface defines a space. The outer surrounding wall further has an opening sealed by a cover. The inner heat conducting unit is formed as a separate component from the outer heat conducting unit, is received in the space, and is in thermal contact with the inner wall surface of the outer surrounding wall. | 11-07-2013 |
| 20130306274 | HEAT DISSIPATION STRUCTURE FOR HEAT DISSIPATION UNIT - A heat dissipation structure for heat dissipation unit includes a heat dissipation unit main body that internally defines a chamber, and the chamber is internally provided with at least a layer of nanoscale threadlike bodies and a working fluid. The layer of nanoscale threadlike bodies is provided on an inner wall surface of the chamber. By providing the layer of nanoscale threadlike bodies in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation unit, enabling the latter to have upgraded heat transfer performance. | 11-21-2013 |
| 20130306275 | HEAT DISSIPATION STRUCTURE FOR HEAT DISSIPATION DEVICE - A heat dissipation structure for heat dissipation device includes a heat dissipation device main body that internally defines a chamber, and the chamber is internally provided with at least a whisker layer and a working fluid. The whisker layer is provided on an inner wall surface of the chamber. By providing the whisker layer in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation device, enabling the latter to have upgraded heat transfer performance. | 11-21-2013 |
| 20130306276 | COMPUTING INFRASTRUCTURE - An affordable, highly trustworthy, survivable and available, operationally efficient distributed supercomputing infrastructure for processing, sharing and protecting both structured and unstructured information. A primary objective of the SHADOWS infrastructure is to establish a highly survivable, essentially maintenance-free shared platform for extremely high-performance computing (i.e., supercomputing)—with “high performance” defined both in terms of total throughput, but also in terms of very low-latency (although not every problem or customer necessarily requires very low latency)—while achieving unprecedented levels of affordability at its simplest, the idea is to use distributed “teams” of nodes in a self-healing network as the basis for managing and coordinating both the work to be accomplished and the resources available to do the work. The SHADOWS concept of “teams” is responsible for its ability to “self-heal” and “adapt” its distributed resources in an “organic” manner. Furthermore, the “teams” themselves are at the heart of decision-making, processing, and storage in the SHADOWS infrastructure. Everything that's important is handled under the auspices and stewardship of a team | 11-21-2013 |
| 20130312937 | NATURAL CIRCULATION TYPE COOLING APPARATUS - According to one embodiment, a natural circulation type cooling apparatus includes a heat receiver with a heat receiving surface on which an exothermic body is mounted, and containing therein a coolant, a condenser on a horizontally lateral side of the heat receiver, a radiator on a horizontally lateral side of the heat receiver and on a vertically downward side of the condenser, a vapor conduit configured to feed vapor of the coolant to an inlet of the condenser, a condensed liquid conduit configured to feed a condensed coolant from an outlet of the condenser to an inlet of the heat receiver, a coolant conduit configured to feed the coolant to an inlet of the radiator, and a circulation conduit configured to feed the coolant from an outlet of the radiator to the inlet of the heat receiver. | 11-28-2013 |
| 20130319638 | THERMAL ARCHITECTURE - The described embodiment relates generally to the field of thermal management. More specifically an apparatus for cooling a unibody computing device with obscured inlet and outlet vents is disclosed. Inlet vents are arranged on a bottom surface of the unibody computing device and then exhaust air is vented out from a rear surface of the computing device. The rear vents can be obscured by a stand designed to support the weight of the computing device. By venting exhaust air to either side of the support stand exhaust air can be prevented from being drawn back into the inlet vents, thereby avoiding an overheating condition. | 12-05-2013 |
| 20130327502 | PHASE CHANGE TYPE HEAT DISSIPATING DEVICE - A phase change type heat dissipating device for dissipating heat from a heat generating component includes a casing, a working medium received in the casing and a heat pipe connected to the casing. The heat pipe includes an evaporator section and a condenser section. The working medium is electrically insulated and phase change material, and represents solid state at normal temperature. The heat generating component is received in the casing, and the evaporator section of the heat pipe extends into the casing and contacts the working medium. | 12-12-2013 |
| 20130327503 | HEAT EXCHANGER FOR PHASE-CHANGING REFRIGERANT, WITH HORIZONTAL DISTRIBUTING AND COLLECTING TUBE - The invention relates to a exchanger for a phase changing refrigerant including a horizontal distributor tube; a horizontal collector tube; and at least one refrigerant carrying heat exchanger tube connected there between, wherein a refrigerant gas inlet into the at least one heat exchanger tube is arranged in an upper portion of a cross section of the horizontal distributor tube, and wherein a refrigerant outlet from the at least one heat exchanger tube is arranged in an upper portion of a cross section of the horizontal collector tube for condenser operation of the multi channel heat exchanger so that oil separation is provided in a lower portion of the cross section of the horizontal distributor tube and liquid refrigerant separation is provided in a lower portion of the cross section of the horizontal collector tube. | 12-12-2013 |
| 20130340977 | HEAT SINK FOR USE IN AN ELECTRONICS SYSTEM - A heat sink for use in a computer system may include a first heat sink body including a first plurality of heat dissipation structures; a second heat sink body including a second plurality of heat dissipation structures, the second heat sink body being physically spaced apart from the first heat sink body; and a heat pipe having a first portion coupled to the first heat sink body, a second portion coupled to the second heat sink body, and a third portion extending between the first and second heat sink bodies such that the heat pipe provides a physical coupling between the spaced apart first and second heat sink bodies. | 12-26-2013 |
| 20130340978 | TWO-PHASE COOLING SYSTEM FOR ELECTRONIC COMPONENTS - A two-phase heat exchanger for cooling at least one electronic and/or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and/or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel. | 12-26-2013 |
| 20140014303 | Thermosiphon Systems for Electronic Devices - A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation. | 01-16-2014 |
| 20140020869 | Cooling of Personal Computers and Other Apparatus - Apparatus and methods for removing unwanted heat generated by apparatus such as personal computer systems and other appliances. The apparatus comprising a thermally conductive surface to which heat from heat-generating components is communicated via a heat transmitting means such as a heatpipe. The apparatus can then be cooled by contacting cooling apparatus to the thermally conductive surface. Also described are liquid cooling apparatus suitable for contacting to apparatus having thermally conductive surfaces and a method for cooling a plurality of computer systems. | 01-23-2014 |
| 20140020870 | HEAT DISSIPATION MODULE WITH WIND STOP FUNCTION - A heat dissipation module includes a centrifugal fan and a heat dissipation fin array. The centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein the radial air outlet is defined between a first sidewall and an opposite second sidewall with a tongue potion. The heat dissipation fin array is located at the radial air outlet of the centrifugal fan. The heat dissipation fin array and the radial air outlet substantially share an equal length L. The heat dissipation fin array has a middle wind stop section which is closer to the second sidewall than the first sidewall. The wind stop section has a length ranging from about 0.1 L to about 0.42 L. | 01-23-2014 |
| 20140041837 | HEAT DISSIPATION DEVICE WITH PARALLEL AND PERPENDICULAR FINS - A heat dissipation device includes a heat pipe, a first fin unit, a second fin unit, and a fan arranged on the first fin unit for drawing air from the first fin unit to the second fin unit. The heat pipe includes an evaporation section, a first condensing section and a second condensing section. The first fin unit includes a plurality of stacked first fins with a first channel defined between adjacent first fins. A notch is defined in the first fin unit receiving the evaporation section, and a canal is defined in the first fin unit receiving the first condensing section of the heat pipe. The second fin unit includes a plurality of stacked second fins. A second channel is defined between adjacent second fins perpendicular to the first channels. A passage is defined in the second fin unit receiving the second condensing section of the heat pipe. | 02-13-2014 |
| 20140041838 | HEAT PIPE ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME - A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat, as a molded one-piece member, combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other. | 02-13-2014 |
| 20140041839 | MULTIDRUM EVAPORATOR - An evaporator for a heat recovery steam generator has two horizontal steam drums of moderate size, one located slightly higher than the other. It also includes a coil having tubes located in the flow of a hot gas. The lower drum communicates with the inlets of the tubes for the coil. The outlets of the tubes communicate with the upper drum. A drain line connects the bottom of the upper drum with the lower region of the lower drum, so that water will flow from the upper drum to the lower drum. Water, which is primarily in the liquid phase, enters the lower drum through an inlet line and mixes with water from the upper drum. The mixture flows through into the coil. Here some of it transforms into saturated steam while the rest remains as saturated water. The saturated steam and saturated water flow into the upper drum where the steam escapes and the water flows back into the lower drum to recirculate through the coil. Owing to their moderate sizes, the drums can withstand high pressures without having excessive wall thickness, and this enables the evaporator to be set into operation with minimal or no hold points. Yet the two drums provide a retention time—and the protection that it provides—of a single large capacity drum having substantial wall thickness. | 02-13-2014 |
| 20140048233 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 02-20-2014 |
| 20140060779 | Passive Cooling System For Switchgear With Star-Shaped Condenser - A condenser for condensing vapor to liquid for cooling a switchgear having a heat generating component inside an enclosure and tubing structure associated with the heat generating component. A working fluid is disposed within an end portion of the tubing structure. The condenser includes a hollow tubular base defining a volume and having first and second opposing opened ends. A plurality of fins extends from a periphery of the base. The fins are in spaced relation and disposed about the entire circumference of the base. A first end cap is coupled to the base so as to close the first opened end. A second end cap is coupled to the base to close the second opened end. The second end cap has port structure constructed and arranged to fluidly communicate the tubing structure with the volume. | 03-06-2014 |
| 20140060780 | FLAT HEAT PIPE AND FABRICATION METHOD THEREOF - The present disclosure relates to a flat heat pipe in which a plurality of minute wires is inserted and a fabrication method thereof. A flat heat pipe according to an exemplary embodiment of the present disclosure includes a through hole which is formed in a flat panel shaped body in a longitudinal direction one or more grooves which are formed above an inner wall of the through hole, and a plurality of wires which is inserted below the inner wall of the through hole in the longitudinal direction. | 03-06-2014 |
| 20140076521 | BIDIRECTIONAL HEAT DISSIPATION STRUCTURE - A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly. | 03-20-2014 |
| 20140076522 | COOLING SYSTEM FOR A POWER MODULE - A cooling system for a power module (or some other power electronics device) is described, the cooling system having a closed flow path for circulating a cooling fluid, the flow path having a pressure that is reduced to below atmospheric pressure. The cooling fluid is circulated along the flow path to provide cooling of the power module. The flow path is delimited from the exterior environment by a space provided between the flow path and the exterior environment, said space being sealed off from the cooling flow path, and said space being sealed off towards the exterior environment. The flow path has a pressure below atmospheric pressure and the space between the flow path and the exterior environment is evacuated and typically has a pressure lower than the pressure in the flow path. | 03-20-2014 |
| 20140083651 | MECHANICAL-THERMAL STRUCTURE SUITABLE FOR A SPACE ENVIRONMENT - A monolithic mechanical-thermal structure which is suitable for a space environment is provided, in which the structure contains at least one hole. The walls of the hole are lined with filaments. The monolithic mechanical-thermal structure may be made of metal. And a process for manufacturing the structure is also provided. | 03-27-2014 |
| 20140083652 | SEALED CASING - A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area. | 03-27-2014 |
| 20140090814 | COOLING SYSTEM AND ELECTRONIC APPARATUS USING THE SAME - The invention relates to a cooling system and an electronic apparatus using the same, and particularly aims to use a thermosiphon as the cooling system and derives an optimum shape (inter-fin gap, fin height, and fin upper-end hole diameter) of a boiling heat transfer surface for different coolants. In a cooling system using a thermosiphon according to the invention, an optimum shape (inter-fin gap, fin height, and fin upper-end hole diameter) of a boiling heat transfer surface of a heat receiving jacket that forms the cooling system is identified based on a critical radius of a steam bubble produced in an overheated liquid and the diameter of an air bubble departing from the heat transfer surface for a variety of coolants. | 04-03-2014 |
| 20140110087 | GRAVITY LOOP HEAT PIPE HEAT SINK, CONDENSER, AND PRODUCTION METHODS THEREOF - A condenser in a gravity loop heat pipe heat sink and a method for producing the condenser are disclosed. The production method includes the following steps: squeezing a base material of a condenser to form a condenser substrate and several longitudinal channels of the condenser, where the longitudinal channels of the condenser are parallel to and thread through the condenser substrate; drilling holes at the two ends of the condenser substrate to form transverse channels of the condenser, where the transverse channels of the condenser are connected to the longitudinal channels of the condenser; and sealing ends of the longitudinal channels of the condenser and ends of the transverse channels of the condenser according to determined holes on the condenser that are connected to the outside. | 04-24-2014 |
| 20140116652 | Passive Cooling of Transmission Using Mast Mounted Heat Pipes - A passive cooling system for an aircraft includes a rotor assembly and a closed heat pipe. The closed heat pipe is carried by the rotor assembly and configured to extract heat energy from a heat source positioned away from the rotor assembly and configured to dissipate the heat energy through the rotor assembly. | 05-01-2014 |
| 20140116653 | LOOP THERMOSYPHON COOLING DEVICE - A loop thermosyphon cooling device includes an evaporator, a condenser and a communication assembly. The evaporator includes a heat conducting element and evaporation pipes, and the heat conducting element has through holes, and each evaporation pipe is passed and positioned into each respective through hole. The condenser includes a condensation pipe. The communication assembly includes a first barrel and a second barrel, and both ends of each evaporation pipe are communicated with the first and second barrels, and both ends of the condensation pipe are communicated with the first and second barrels, so that the evaporation pipe, condensation pipe, first barrel and second barrel jointly define a loop. A communication assembly is coupled between the evaporation pipe and the condensation pipe, and the quantity of evaporation pipes and condensation pipes can be increased or decreased as needed, and the thermosyphon cooling device is compact and high heat dissipation efficiency. | 05-01-2014 |
| 20140131011 | Silicon-Based Thermal Energy Transfer Device And Apparatus - A thermal energy transfer apparatus is described. The apparatus includes a silicon-based support module and a plurality of silicon-based plate modules. The silicon-based support module includes a plurality of grooves on a first primary surface of the support module. The plurality of silicon-based plate modules each includes a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges that are between the first and the second primary surfaces. A first edge of the edges of each plate module is received in a respective one of the grooves of the support module to attach the respective plate module substantially orthogonally to the support module. | 05-15-2014 |
| 20140131012 | HEAT STORAGE APPARATUS - According to one embodiment, a heat storage apparatus includes a heat storage tank, a heat storage material, an anode electrode, a cathode electrode, and a voltage applying unit. The heat storage material has supercooling and is received in the heat storage tank. The anode electrode includes a nucleation start point portion. The cathode electrode is spaced apart from the anode electrode and is disposed in contact with the heat storage material. The voltage applying unit applies a voltage between the anode electrode and the cathode electrode. The heat storage material, which is supercooled and is in a liquid-phase state, is nucleated due to an application of a voltage by the voltage applying unit. | 05-15-2014 |
| 20140138056 | LOW-PROFILE COMPOSITE HEAT PIPE - A low-profile composite heat pipe includes a flat plate-like first pipe component shaped like a flat plat member and having flow-guide grooves located at the inner surface between two opposite ends thereof and a wick structure sintered on the surface of the flow-guide grooves, a flat plate-like second pipe component having flow-guide grooves located at the inner surface between two opposite ends thereof and a wick structure sintered on the surface of the flow-guide grooves, an enclosed cavity defined in between the first pipe component and the second pipe component and surrounded by the wick structures of the first and second pipe components, and a working fluid contained in the enclosed cavity. | 05-22-2014 |
| 20140166242 | COOLING SYSTEM FOR VEHICLE - A cooling system for a vehicle that system includes a radiator disposed in a front of the vehicle, and introduced with cooling water thereinto to cool the cooling water through heat exchange with exterior air;. In addition, a first condenser is disposed at a first side of the radiator in a width direction of the vehicle and connected with the radiator via a cooling water pipe to be introduced with the cooling water, and introduced with refrigerant via a refrigerant pipe to condense the refrigerant through heat exchange with the cooling water therein. A second condenser is interconnected with the first condenser via the refrigerant pipe to be introduced with the refrigerant condensed by the first condenser, and disposed in a front of the radiator to additionally condense the refrigerant through mutual heat exchange of the exterior air introduced while driving the vehicle and the refrigerant. | 06-19-2014 |
| 20140174699 | HEAT DISSIPATION ASSEMBLY - A heat sink assembly includes a base, a heat pipe, a first heat sink, and a second heat sink. The second heat sink is installed between the base and the first heat sink. The heat pipe includes a positioning portion sandwiched between the second heat sink and the base, and two heat-conductive portions extending up from two opposite ends of the positioning portion and inserted into the first heat sink. | 06-26-2014 |
| 20140182817 | LOW THERMAL RESISTANCE COOLER MODULE FOR EMBEDDED SYSTEM - A low thermal resistance cooler module includes a heat-transfer base member defining a recess and multiple elongated, curved locating grooves, flat heat pipes set in the elongated, curved locating grooves with respective hot interfaces thereof suspending in the recess and respective cold interfaces thereof bonded to the heat-transfer base member, a heat-transfer block fixedly mounted with the hot interfaces of the flat heat pipes in the recess of the heat-transfer base member for transferring waste heat from a heat source of an external circuit board by direct contact, and connection plates respectively connected between the heat-transfer block and the heat-transfer base member. | 07-03-2014 |
| 20140182818 | HEAT SINK - A heat sink for dissipating heat generated by an electronic element is provided. The heat sink includes a heat pipe and a conducting member for transferring heat generated by the electronic element to the heat pipe. The conducting member abuts the electronic element, and the conducting member is applied onto the heat pipe to reduce a thickness of the heat sink. | 07-03-2014 |
| 20140190666 | Active Cooling of High Speed Seeker Missile Domes and Radomes - A thermal management system and method for active cooling of high speed seeker missile domes or radomes comprising bonding to an IR dome or RF radome a heat pipe system having effective thermal conductivity of 10-20,000 W/m*K and comprising one or more mechanically controlled oscillating heat pipes, employing supporting integrating structure including a surface bonded to the IR dome or RF radome that matches the coefficient of thermal expansion the dome or radome material and that of said one or more mechanically controlled oscillating heat pipes, and operating the heat pipe system to cool the IR dome or RF radome while the missile is in flight. | 07-10-2014 |
| 20140238644 | HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a heat dissipating device includes steps of providing a base, wherein the base includes a clamping portion, a supporting portion and two side portions, the clamping portion is arc-shaped, a first recess structure is formed on an outer surface toward an inner surface of each side portion, the two side portions connect the clamping portion and the supporting portion, and an accommodating space is formed between the clamping portion, the supporting portion and the two side portions; disposing a first end of a heat pipe in the accommodating space, wherein the first end is supported on the supporting portion; and punching the clamping portion toward the supporting portion such that the clamping portion cooperates with the supporting portion to clamp the first end in a tight-fitting manner, wherein the clamping portion is capable of deforming through the first recess structure during punch processing. | 08-28-2014 |
| 20140238645 | HIERARCHICALLY STRUCTURAL AND BIPHILLIC SURFACE ENERGY DESIGNS FOR ENHANCED CONDENSATION HEAT TRANSFER - An apparatus comprising a base layer, a distribution of separated micro-nucleation sites thereon. The apparatus also includes a distribution nanostructures located on the base layer, each of the micro-nucleation sites being adjacent to some of the nanostructures. Each of the micro-nucleation sites has a hydrophilic surface and the distribution of nanostructures form a superhydrophobic surface. | 08-28-2014 |
| 20140238646 | SLOPED HIERARCHICALLY-STRUCTURED SURFACE DESIGNS FOR ENHANCED CONDENSATION HEAT TRANSFER - An apparatus. The apparatus comprises a distribution of microstructures on an area of a surface, each of the microstructures having one or more sloping sides. The apparatus comprises a distribution of nanostructures being located on the one or more sloping sides. The distribution of microstructures on the area of the surface is configured to nucleate and grow droplets of liquid from a gas. The distribution of nanostructures forms a superhydrophobic surface for the liquid. | 08-28-2014 |
| 20140262157 | WAFER PLATEN THERMOSYPHON COOLING SYSTEM - Disclosed is a thermosyphon system for cooling a platen in an ion implantation system. The thermosyphon system may include a vacuum chamber housing at least one wafer platen and a phase separator tank operative to contain both a liquid and gas phases of an element. A re-condensing cold head is exposed within the phase separator tank and is operative to condense the element from its gas phase to its liquid phase. This creates a convection driven closed loop pipe configuration. The closed loop pipe configuration includes a liquid phase pipe to carry the lower temperature liquid phase from the phase separator tank to the platen in the vacuum chamber. A reaction with the warmer platen converts the liquid phase to the gas phase. A gas phase pipe carries the higher temperature gas phase from the platen in the vacuum chamber back to the phase separator tank. | 09-18-2014 |
| 20140332185 | HEAT INSULATING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND HEAT DISSIPATING SYSTEM INCLUDING THE SAME - A heat dissipating system is disclosed to be disposed in a casing of an electronic apparatus in which a heat source is disposed. The heat dissipating system includes a heat dissipating device and a heat insulating device. The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source. The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device, and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween. | 11-13-2014 |
| 20140345829 | Thermal Transfer Device with Reduced Vertical Profile - A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states. | 11-27-2014 |
| 20140345830 | DC MOTOR DEVICE AND DC FAN USING THE SAME - A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins. | 11-27-2014 |
| 20140352923 | COOLING APPARATUS AND METHOD THEREOF FOR APPARATUS ROOM - The present invention provides a cooling apparatus and a method for an apparatus room, which is related to a cooling apparatus capable of transferring the heat generated by the heat source in the apparatus room out of the apparatus room and comprises a heat pipe having a heat transfer fluid flowing therein and attached to at least one heat transfer unit, characterized in that: one end portion of the heat transfer unit conducts a heat exchange with the heat source and the heat is transferred to another end portion thereof such that the heat is removed for cooling. The heat generated by the heat source is removed and carried away via the effective heat transfer to a remote end such that the temperature surrounding the heat source can be kept at low temperature and the effect of improved cooling can be advantageously achieved. | 12-04-2014 |
| 20140352924 | METHOD FOR COOLING BREAD AND RECOVERING THE EMITTED HEAT | 12-04-2014 |
| 20140360700 | HEATING DEVICE IN A WATER-BEARING DOMESTIC APPLIANCE - The invention relates to a heating device for heating a liquid flow (I) in a water-bearing domestic appliance. According to the invention, the heating device has a heat pipe having a heat-absorbing evaporator section and a heat-outputting condenser section that is in thermal connection with the liquid flow (I). | 12-11-2014 |
| 20140360701 | SHEET-LIKE HEAT PIPE, AND ELECTRONIC DEVICE PROVIDED WITH SAME - A sheet-like heat pipe for a heat-generating element, which is intended to make an electronic device more compact, more lightweight, and thinner, while also reducing costs, is provided. A sheet-like heat pipe ( | 12-11-2014 |
| 20140367071 | METHOD AND APPARATUS FOR EXECUTING AN ALTERNATING EVAPORATION AND CONDENSATION PROCESS OF A WORKING MEDIUM - The invention relates to a method for executing an alternating evaporation and condensation process of a working medium on a heat transfer surface provided simultaneously as an evaporation and condensation surface. The method is characterized in that, during a respective operating cycle from in each case an condensation process and in each case an evaporation process, a condensate film of the working medium which forms during the condensation process is stored permanently in situ on the heat transfer surface and is then evaporated from the heat transfer surface during the evaporation process. In terms of the apparatus, the heat transfer surface ( | 12-18-2014 |
| 20140367072 | HEAT PIPE AND METHOD FOR MANUFACTURING THEREOF - Method for manufacturing a heat pipe is disclosed. A tube and a vessel mesh are provided. Solder paste in a pattern is coated on the vessel mesh. The vessel mesh is rolled into a vessel and the vessel is placed in the tube. The tube is heat to weld to the vessel to the tube. The present disclosure also provides an exemplary heat pipe having a vessel welded therein. | 12-18-2014 |
| 20150007964 | RE-DIRECTION OF VAPOR FLOW ACROSS TUBULAR CONDENSERS - Vapor flow-diverting devices that re-direct upwardly flowing vapor, for example, in a downward direction across condenser tubes disposed in the upper or top section of a vapor-liquid contacting apparatus, are described. These devices are particularly beneficial in tubular condensers within distillation columns and may be used in combination with other associated equipment (e.g., a deflector plate and divider plate) as well as in combination with the tube surface enhancements to improve the heat transfer coefficient. | 01-08-2015 |
| 20150013941 | Conduction Cooled Chassis With Embedded Heatpipes - An electronics chassis heat-pipe conduction cooling system includes a first chassis wall having multiple heat transfer sleeves defining multiple first chassis slots. A cabinet bottom chassis wall has multiple second chassis slots. A cabinet second chassis wall has multiple heat transfer sleeves defining multiple third chassis slots. Multiple first heat-pipes each have a vertical leg received in one of the first chassis slots and a horizontal leg received in one of the second chassis slots. Multiple second heat-pipes each have a vertical leg received in one of the third chassis slots and a horizontal leg received in one of the second chassis slots. A cold plate in direct contact with the cabinet bottom chassis wall completes a conduction cooling path including the vertical leg of the first and second heat-pipes through the horizontal leg of the first and second heat-pipes and the bottom chassis wall. | 01-15-2015 |
| 20150013942 | TETRAFLUOROPROPENE COMPOSITIONS AND USES THEREOF - The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises a tetrafluoropropene and at least one other component. The compositions of the present invention are useful in processes for producing cooling or heat, as heat transfer fluids, foam blowing agents, aerosol propellants, and fire suppression and fire extinguishing agents. | 01-15-2015 |
| 20150020998 | CYCLING HEAT DISSIPATION MODULE - A cycling heat dissipation module is used for removing the heat generated by a heat generating element and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with fluid and has a wall to divide the chamber into a first compartment and a second compartment connected to each other. The first compartment has a first outlet, and the second compartment has a first inlet. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat exchanging section by a pressure difference after absorbing the heat of the heat guiding part. After it is cooled, the fluid is flowed back to the chamber. | 01-22-2015 |
| 20150020999 | HEAT EXCHANGER - A heat exchanger ( | 01-22-2015 |
| 20150034278 | HEAT PIPE MATRIX FOR ELECTRONICS COOLING - A heat pipe system and methods of arranging a heat pipe system are provided. The heat pipe system includes a plurality of heat pipes, with each of the plurality of heat pipes including a hot end thermally coupled to a heat source and a cold end thermally coupled to a heat sink The plurality of heat pipes include a first pair of heat pipes. When the plurality of heat pipes are secured to a rotatable body, the first pair of heat pipes are aligned with and oriented in opposing directions along a first axis of rotation of the rotatable body. | 02-05-2015 |
| 20150047812 | HEATING DEVICE WITH CONDENSING COUNTER-FLOW HEAT EXCHANGER - A heating device includes a heating device chamber, a heating element for heating air in the heating device chamber, and a condensing counter-flow heat exchanger including a first flow path that receives outgoing air from the heating device chamber and a second flow path for providing incoming air to the heating device chamber. The first flow path and the second flow path are configured in a counter-flow heat exchange relationship such that the outgoing air flows in a direction opposite the incoming air and the latent heat of evaporated water in the outgoing air is transferred to the incoming air thereby condensing liquid water from the outgoing air. | 02-19-2015 |
| 20150047813 | HEAT EXCHANGER WITH RECUPERATING AND CONDENSING FUNCTIONS AND HEAT CYCLE SYSTEM AND METHOD USING THE SAME - A heat exchanger with recuperating and condensing functions is provided. The heat exchanger includes a pressure vessel, a recuperating pipe and a cooling stream pipe. The pressure vessel has an inlet, an outlet and a baffle. The baffle, located between the inlet and the outlet, divides the interior of the pressure vessel into a working fluid recuperating region and a working fluid condensing region. The recuperating pipe is disposed in the pressure vessel, and passes through the working fluid recuperating region to heat a liquid working fluid flowing through the recuperating pipe. The cooling stream pipe is disposed in the pressure vessel, and passes through the working fluid condensing region to cool a vapor working fluid flowing into the pressure vessel. The vapor working fluid passes through the working fluid recuperating region and then flows into the working fluid condensing region. | 02-19-2015 |
| 20150060018 | HEAT PIPE BASED PASSIVE RESIDUAL HEAT REMOVAL SYSTEM FOR SPENT FUEL POOL - A heat pipe based passive residual heat removal system for a spent fuel pool has a plurality of partitions ( | 03-05-2015 |
| 20150075752 | METHODS AND APPARATUS FOR PROVIDING TRANSFER OF A HEAT LOAD BETWEEN A HEAT SOURCE AND A HEAT RECEIVER - An apparatus for providing transfer of a heat load between a heat source and a heat receiver includes a female part configured to be fixed to the heat source or the heat receiver and a male part configured to be fixed to the other of the heat source or the heat receiver. The female part includes a female structure. The male part includes a male structure. The male part and the female part are configured to form a heat transfer surface for the heat load therebetween when the male part is placed in the female part. Structures are configured to provide a heat transfer surface that increases with the temperature, so as to increase the heat load transfer between the structures. | 03-19-2015 |
| 20150075753 | HEAT TRANSFER DEVICE - A heat transfer device that can improve temperature uniformity along the entire length of a pipe line housed in the heat transfer device is provided. The heat transfer device transferring heat to the pipe line in which a fluid flows includes: a heat transfer block of high heat conductivity, surrounding the pipe line, a heat pipe formed in the heat transfer block, along an extending direction of the pipe line, and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extending direction of the pipe line. There is provided a proximity portion where the heat transfer block is in proximate to the pipe line at both ends of the heat transfer block in the extending direction of the pipe line. | 03-19-2015 |
| 20150096720 | HEAT DISSIPATION MODULE - A heat dissipation module includes a heat conducting plate having an upper surface, a stacked fins heat sink in thermal contact with and disposed on the upper surface of the heat conducting plate, at least one heat pipe and multiple fins. The evaporation end is in thermal contact with and disposed on the upper surface. The plurality of fins are located on the upper surface and positioned at intervals. Each of the fins has at least one through hole and the condensation end runs through the at least one through hole. | 04-09-2015 |
| 20150114600 | HEAT-EXCHANGE APPARATUS - A heat-exchange apparatus is provided, including a first heat exchanger, a second heat exchanger, a third heat exchanger and a fourth heat exchanger. The first heat exchanger is thermally separated from the second heat exchanger. The third heat exchanger is thermally connected to the first heat exchanger. The fourth heat exchanger is thermally connected to the second heat exchanger, wherein a first air flow passes through the first heat exchanger and the second heat exchanger to be divided into a first divergent flow and a second divergent flow, the first divergent flow flows on a surface of the first heat exchanger, the second divergent flow flows on a surface of the second heat exchanger, the first divergent flow does not flow on the surface of the second heat exchanger, and the second divergent flow does not flow on the surface of the first heat exchanger. | 04-30-2015 |
| 20150114601 | FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 04-30-2015 |
| 20150114602 | FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 04-30-2015 |
| 20150122460 | HEAT PIPE STRUCTURE - A heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered. | 05-07-2015 |
| 20150122461 | Medium for Boiling-Type Cooler and Method of Using Same - A working medium containing 2-methoxy-1,1,1,3,3,3-hexafluoropropane (HFE-356mmz) as a main component is disclosed. This working medium is a new working medium for a boiling-type cooler, which has a light burden on the environment such as the global warming potential, etc., is slightly flammable or flame retardant, has superior thermal and chemical stabilities, and a good compatibility with heat exchangers formed of various metal materials. This medium for the boiling-type cooler can be preferably used as a working medium for a cooler of a PCU (power control unit) of a car. | 05-07-2015 |
| 20150129174 | COMPONENT REACHABLE EXPANDABLE HEAT PLATE - Some embodiments of the invention provide a heat plate system that includes a closed vessel having at least one flexible surface. The flexible surface allows the vessel to come into intimate contact with heat-generating components (e.g., integrated circuits) residing at varying heights above the floor of a module (e.g., an avionics module). In some embodiments, the material may allow the heat plate to expand in response to absorbing heat, so that it may mold itself around the contours of different heat-generating components, increasing the surface area contact between the heat plate and the components, and increasing the heat plate's ability to conduct heat away from the components. | 05-14-2015 |
| 20150129175 | THERMOSYPHON HEAT SINK - A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit. | 05-14-2015 |
| 20150129176 | THERMALLY-CONTROLLED PACKAGING DEVICE AND METHOD OF MAKING - A phase change device for controlling temperature within a confined environment, comprising a foam material, a phase change material, the phase change material being absorbed into the foam, and a protective covering encasing the foam material/phase change material. A method for making a phase change device for controlling temperature within a confined environment, comprising providing a phase change material, providing a foam material, absorbing the phase change material into the foam material, and sealing the foam material/phase change material within a protective covering. | 05-14-2015 |
| 20150136362 | HEAT CONVEYING STRUCTURE FOR ELECTRONIC DEVICE - A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant, a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant, a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section, and a liquid pipe that connects the evaporating section and the condensing section. | 05-21-2015 |
| 20150144307 | HEAT DISSIPATING DEVICE AND HEAT DISSIPATING FIN - A heat dissipating device includes a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening. The heat pipe has a heat dissipating end and a heat absorbing end, wherein the heat dissipating end is opposite to the heat absorbing end and is disposed in the through hole and the closed ring-shaped portion. After punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner. | 05-28-2015 |
| 20150292807 | HEAT EXCHANGER AND METHOD FOR HEATING A FRACTURING FLUID - A heat exchanger comprises a shell internally divided into a hot fluid vessel and a cold fluid vessel by a pipe retaining plate having a plurality of apertures sealingly retaining a corresponding number of heat pipes, each of which has a hot end in the hot fluid vessel and a cold end in the cold fluid vessel. The hot fluid vessel is internally configured to direct a hot fluid through a porous dispersion plate that distributes the hot fluid amongst the hot ends of the heat pipes. The cold fluid vessel has an internal baffle that defines a serpentine channel that guides a cold fluid through the cold fluid vessel. Fracturing fluid may be heated by streaming flue gas exhausted from an incinerator through the hot fluid vessel while simultaneously streaming the fracturing fluid through the cold fluid vessel. | 10-15-2015 |
| 20150292808 | SUPERCONDUCTIVE NANO HEAT TRANSFER PLATE TYPE HEAT EXCHANGER AND MANUFACTURING METHOD THEREOF - A superconductive nano heat transfer plate type heat exchanger consisting of a plurality of superconductive nano plate bundles by welding, the plate bundles being formed by welding a plurality of heat transfer plates together and sealed in vacuum, each of the plate bundles comprising an evaporation zone and a condensation zone, inside the plate bundle is padded a superconductive nano medium. The heat exchanger enhances heat transfer efficiency and may perform highly efficient heat transfer at different pressures, different temperatures, within different application scopes. | 10-15-2015 |
| 20150300749 | MOTOR WITH COOLED ROTOR - A fan includes an air movement implement including a blade and a motor that drives the air movement implement. The motor includes a rotor that includes an internal diameter heat exchanger and a heat pipe having a first end and a second end, the first end in thermal contact with the internal diameter heat exchanger and the second end in thermal contact with the blade. | 10-22-2015 |
| 20150308749 | COMBINATION FIN AND HEAT PIPE ASSEMBLY - A combination fin and heat pipe assembly includes a heat pipe, and a plurality of radiation fins each including a fin plate, a mounting through hole in the fin plate that receives the heat pipe, an annular flange extending from one side of the fin plate around the mounting through hole and two opposing arched slots each cut through a part of the fin plate adjacent to a peripheral wall of the annular flange to partially separate the annular flange from the respective fin plate. The annular flange has the peripheral wall deformed on two opposite sides corresponding to the arched slots and forced into tight engagement with the periphery of the heat pipe. | 10-29-2015 |
| 20150318588 | METHOD AND SYSTEM FOR AUTOMOTIVE BATTERY COOLING - A battery-cooling system includes a battery array and a plurality of heat pipes that each include a low-profile extrusion having a plurality of hollow tubes formed therein. A heat transfer fluid is disposed in the plurality of hollow tubes. Each heat pipe includes an evaporator portion and a condenser portion. The evaporator portion is disposed between successive batteries within the battery array and the condenser portion is disposed outside of the battery array and exposed to a heat sink. | 11-05-2015 |
| 20150323229 | CONDENSER FOR REFRIGERATOR - A condenser for refrigerator includes left and right or upper and lower headers spaced apart from each other for introduction or discharge of refrigerant, a tube unit including tubes mounted between the headers and spaced apart from one another to allow the refrigerant to pass through the tubes, and a fin structure mounted in the respective neighboring tubes to perform heat exchange between the refrigerant passing through the tubes and outside air, the fin structure including fins having a greater width than a width of the tubes. Providing the fins with a greater width than that of the tubes may achieve an expanded heat exchange range and higher heat exchange efficiency. Moreover, wider gaps between the fins ensure smooth air movement, causing a reduced pressure difference of the moving air and neither dust nor debris is trapped between the fins, resulting in higher heat exchange efficiency. | 11-12-2015 |
| 20150338168 | HEAT EXCHANGER - A heat exchanger carries out heat exchange between a refrigerant that undergoes a phase change during heat exchange and another heating medium. The heat exchanger includes headers having the refrigerant flowing through interiors, a plurality of multi-hole first flat tubes, and a plurality of second flat tubes. The first flat tubes extend in a direction intersecting a lengthwise direction of the headers. The first flat tubes have a plurality of refrigerant flow channels with the refrigerant flowing through the refrigerant flow channels. The second flat tubes are stacked alternately with respect to the first flat tubes, with the other heating medium flowing through the second flat tubes. The headers are arranged to extend along a horizontal direction. | 11-26-2015 |
| 20150338170 | COMPOSITE TOP CASE WITH EMBEDDED HEAT PIPES - A system and method to transfer heat energy through a composite structure. The system includes a heat pipe extending through a thickness of the composite material. The method includes extending a heat pipe through the composite material from a first surface exposed to the heat energy to a second surface exposed to airflow. | 11-26-2015 |
| 20150354901 | HEAT REMOVAL ASSEMBLY - A heat removal assembly is provided herein. The heat removal assembly includes an evaporator block, a heat pipe, and a condenser plate. The evaporator block removes heat from an electronic component. The evaporator block engages with the electronic component and forms a thermal connection therebetween that removes the heat from the electronic component. The heat pipe connects to the evaporator block to remove heat from the evaporator block. The condenser plate connects to the heat pipe and receives heat from the heat pipe. The condenser plate includes a thermal mating surface that mates with a thermal member, such that the heat is removed from the assembly via the thermal mating surface. | 12-10-2015 |
| 20150362258 | HEAT MODULE - A heat module includes a fan and a heat pipe. A flat portion of the heat pipe includes a recessed portion being recessed toward a center of the heat pipe in a cross section. A heat receiving portion arranged between the heat source and the heat pipe includes a heat source contact portion arranged to be in thermal contact with the heat pipe. In at least a portion of the heat pipe which extends between a portion of the heat pipe which is in thermal contact with the fan contact portion and a portion of the heat pipe which is in thermal contact with the heat source contact portion, a difference between a maximum axial height of the heat pipe and a minimum axial height of a portion of the heat pipe where the recessed portion is defined is smaller than a wall thickness of the recessed portion. | 12-17-2015 |
| 20150362259 | Independent Phase-Change Heat-Transfer-Type Heat Tube and Manufacturing Method thereof - An independent phase-change heat-transfer-type heat tube and a manufacturing method thereof, wherein the heat tube comprises a housing of which an outer surface is provided with a coating, the housing is provided with an evaporating end and a condensing end opposite to the evaporating end, an inner groove is provided between the evaporating end and the condensing end, a side groove, being separated from the inner groove, is provided in the evaporating end and the condensing end respectively, the inner grooves are separated from each other, the side groove and the inner groove form a plurality of independent cavities which are filled with a working medium. | 12-17-2015 |
| 20160018164 | HEAT PIPE - A heat pipe includes a metal tube and a sintered powder layer. An inner sidewall of the metal tube thereon defines a clearance area. The sintered powder layer is formed on the inner sidewall without covering the clearance area, such that the clearance area is exposed out without being covered by the sintered powder layer. Because of no sintered powder on the clearance area, the heat pipe can be bent at the clearance area without damaging the capillary structure formed by the sintered powder. The flow path of the working fluid is not interrupted or influenced, so the heat transfer efficiency can be maintained, which overcomes the decrement of the heat transfer efficiency of a bent heat pipe in the prior art. | 01-21-2016 |
| 20160021791 | SERVER THERMAL MANAGEMENT WITH HEAT PIPES - Embodiments of the present disclosure describe servers having thermal management features and thermal management systems for servers. These embodiments include heat sinks to be thermally coupled by one or more heat pipes to transfer heat from hotter downstream heat sinks to cooler upstream heat sinks in order to distribute thermal loading across multiple devices. In one embodiment a single heat pipe may be used to thermally couple two heat sinks, whereas in other embodiments a modular heat pipe arrangement may be used. Techniques for thermally coupling modular heat pipes to one another such that vapor sections of adjacent heat pipes overlap are also disclosed. Other embodiments may be described and/or claimed. | 01-21-2016 |
| 20160025420 | FLOW DISTRIBUTOR FOR HEAT TRANSFER PLATE - A flow distributor for a heat transfer device having a plurality of channels includes a sheath defining a plurality of distributor holes, each distributor hole configured to be in fluid communication with a respective channel inlet of each channel of the heat transfer device and an insert defining a plurality of fluid channels therein and a fluid inlet, each fluid channel in fluid communication with the fluid inlet. The insert is disposed within the sheath to seal the fluid channels with each fluid channel in fluid communication with a respective one of the distribution holes. The fluid inlet includes an inner inlet and an outer inlet radially outward from the inner inlet for mixing a fluid flow in the fluid inlet for evenly distributing fluid flow (e.g., a two phase flow) into the fluid channels of the insert and into each channel of the heat transfer device. | 01-28-2016 |
| 20160033212 | ENHANCED FLOW BOILING HEAT TRANSFER IN MICROCHANNELS WITH STRUCTURED SURFACES - A two-phase microchannel heat sink can be a fluid channel including a bottom wall including a superhydrophilic surface with microstructures and a side wall including a surface that is hydrophobic relative to the superhydrophilic surface of the bottom wall. When heat flux is applied to the fluid channel, a liquid film on the bottom wall is maintained and nucleation of boiling occurs only on the side wall. | 02-04-2016 |
| 20160037683 | HEAT MODULE - A heat module includes a fan, a heat sink, a heat transfer member, and a plurality of connection portions. The heat transfer member includes a lower surface capable of being in thermal contact with a heat source, and an upper surface thermally connected to the heat sink, and is arranged to overlap with at least a portion of the fan in a plan view. The plurality of connection portions are arranged between the heat transfer member and the housing to define an axial gap between an upper surface of the heat transfer member and a lower surface of the lower plate portion. The heat transfer member includes a heat source contact portion arranged on a side, closer to the fan, of an end portion of the fan at which the air outlet is defined. | 02-04-2016 |
| 20160040916 | CONDENSER - A condenser includes a condensation section, a super-cooling section, and a liquid receiving section. Refrigerant from heat exchange tubes of a first heat exchange path of the condensation section flows into those of a second heat exchange path through the liquid receiving section. The liquid receiving section includes a first space for receiving refrigerant from the heat exchange tubes of the first heat exchange path, a second space which is located above the first space and in which refrigerant from the first space is separated into gaseous and liquid phases, and a third space which is located below the first space, which receives refrigerant from the second space, and from which refrigerant flows to the heat exchange tubes of the second heat exchange path. A first partition member between the first space and the second space has a throttle for refrigerant flowing from the first space into the second space. | 02-11-2016 |
| 20160061530 | COMBINED HEAT AND POWER SYSTEM - A CHP system includes a combustor as a heat source, a Rankine cycle apparatus, a second heat exchanger, and a thermal fluid flow path. The Rankine cycle apparatus includes, as an evaporator, a first heat exchanger that absorbs thermal energy from combustion gas (thermal fluid). The second heat exchanger absorbs thermal energy from the combustion gas and transfers the thermal energy to a heat medium. The first heat exchanger and the second heat exchanger are disposed in the thermal fluid flow path. The thermal fluid flow path includes a first flow path that allows the combustion gas to reach the first heat exchanger directly from the combustor and a second flow path that allows the combustion gas to reach the second heat exchanger directly from the combustor. | 03-03-2016 |
| 20160061532 | EVAPORATOR AND CONDENSER SECTION STRUCTURE FOR THERMOSIPHON - A thermosiphon device includes a closed loop evaporator section having one or more evaporation channels that are fed by a liquid return path, and a condenser section with one or more condensing channels. The condenser section may include a vapor supply path that is adjacent one or more condensing channels, e.g., located between two sets of condensing channels. Evaporator and/or condenser sections may be made from a single, flat bent tube, which may be bent about an axis parallel to the plane of the flat tube to form a turnaround and/or twisted about an axis along a length of the tube at the tube ends. A single tube may form both evaporator and condenser sections of a thermosiphon device, and an axially extending wall inside the tube in the evaporator section may separate an evaporator section from a liquid return section. | 03-03-2016 |
| 20160069597 | CONDENSER ASSEMBLY FOR REFRIGERANT - A condenser assembly including a plurality of heat-exchanger pipes, which are arranged equidistant from each other having corrugated fins arranged therebetween and lead into deflection regions at both ends and have a free length used for heat exchange and, in connection with the corrugated fins, form a frontal area having a width corresponding to the free length of the heat-exchanger pipes and a height, such that the frontal area results from the product of width and height. The heat-exchanger pipes are connected in parallel in groups and the individual groups are connected in series. The heat-exchanger pipes of the individual groups are arranged adjacent and each group has at least two heat-exchanger pipes. The percentage share of the heat-exchanger pipes of the first group results from 26.162 In (S/dm2)−40.746≦P≦25.49 In (S/dm2)−27.842 for a frontal area. | 03-10-2016 |
| 20160076819 | THERMOSIPHON WITH BENT TUBE SECTION - A thermosiphon device including one or more multi-port tubes that form both an evaporator section and a condenser section for the device. The one or more tubes may be flat tubes with multiple, parallel flow channels, and may be bent to form a bend between the evaporator and condenser sections of the tube(s). One or more flow channels of the tube at the bend may provide a vapor flow path or a liquid flow path between the evaporator and condenser sections. | 03-17-2016 |
| 20160089616 | MOISTURE- HARVESTING DEVICE - A moisture-harvesting device capable of harvesting moisture, which can be also used as drinking water or the like, from atmospheric air. The moisture-harvesting device includes: an atmospheric-air introduction unit; an atmospheric moisture converter that is provided with a mechanism for reducing a pressure of atmospheric air introduced by the atmospheric-air introduction unit and is equipped with a cooling section for cooling the introduced atmospheric air and extracting a moisture content; a water intake cock, that extracts water obtained by the atmospheric moisture converter; and a filter unit that has first to fifth fitters and is provided at an upstream side from the water intake cock, and removes foreign matter from the water obtained by the atmospheric moisture converter, whereby it is possible to harvest the moisture, which can be also used as the drinking water or the like, from the atmospheric air. | 03-31-2016 |
| 20160091229 | CONDENSER - The invention relates to a condenser of stacked-plate design, having a first flow duct for a refrigerant and having a second flow duct for a coolant. | 03-31-2016 |
| 20160091257 | EXPLOSION WELDED EVAPORATOR FOR USE IN TWO-PHASE HEAT TRANSFER APPARATUSES - A two-phase heat transfer apparatus for cooling electronics through an evaporation/condensation cycle, and an evaporator of a heat transfer apparatus are provided. The evaporator or apparatus includes multiple materials to leverage multiple beneficial material properties. A transition between the multiple materials is provided by use of explosion welding. A fluid-containing interior cavity is formed in the evaporator or apparatus such that cavity sidewalls include the transition, which is hermetically sealed due to the explosion weld. The use of multiple materials may be leveraged to incorporate features including a view glass or feed-through connector into the apparatus for viewing the working fluid or incorporating electrical components inside of the hermetic enclosure. In one embodiment, the apparatus base can be made of copper and the condenser can be made out of aluminum containing aluminum tubes, such as multiport tubes. | 03-31-2016 |
| 20160097601 | HEAT TRANSFER FINS - A heat exchanger includes a fin body and a heat pipe having a first portion disposed on or at least partially within the fin body and a second portion extending from the fin body, wherein the heat pipe includes a hollow core filled with a heat pipe working fluid having a liquid phase that is configured to transition to gas and to be returned to the liquid phase at an operational temperature of the heat exchanger. | 04-07-2016 |
| 20160097602 | THERMOSIPHON SYSTEMS FOR ELECTRONIC DEVICES - A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation. | 04-07-2016 |
| 20160101373 | SYSTEMS AND METHODS FOR CONTROLLING NON-CONDENSABLE GASES - Methods and systems for diffusing non-condensable gas are described. In an embodiment, a gas diffusion apparatus may be used to reduce non-condensable gas located adjacent to a condensation surface of a heat transfer system. The non-condensable gas may impede condensation at the condensation surface. The gas diffusion apparatus may include a plurality of blades arranged around a hub that is perpendicular to the condensation surface. The plurality of blades may rotate in a plane that is parallel or substantially parallel to the condensation surface. As the blades rotate, they generate gas flow that moves the non-condensable gas away from the condensation surface and imparts momentum on the vapor molecules heading toward the condensation surface. The blades may also contact the non-condensable gas layer and push them away from the condensation surface. | 04-14-2016 |
| 20160102920 | HEAT PIPE ASSEMBLY WITH BONDED FINS ON THE BASEPLATE HYBRID - A hybrid heat pipe assembly includes a baseplate dimensioned to be placed in surface contact with a device. The baseplate is configured to extract heat from the device. A plurality of fins is bonded to the baseplate. The fins are configured to transfer a first portion of the extracted heat from the baseplate to air surrounding the fins. A complex heat pipe extends from the baseplate and has an end positioned within the baseplate. The complex heat pipe is configured to receive and transfer a second portion of the extracted heat transferred from the baseplate. The complex heat pipe is configured to transfer the second portion of heat to a heat pipe fin stack to which. | 04-14-2016 |
| 20160105999 | COOLING DEVICE AND COOLING FIN - A cooling device includes a cooler. The cooler includes a base, a plurality of cooling fins secured to the base, and a heat pipe inserting through the cooling fins. Each cooling fin includes a fin body and a pressed portion extending from the fin body. The fin body includes a hole area, which defines a receiving hole. A portion of the heat pipe extends through the receiving hole; the pressed portion includes at least one guiding portion, which is configured to guide air to flow towards the hole area from the fin body. | 04-14-2016 |
| 20160116226 | TWO-PHASE HEAT TRANSFER DEVICE - A two-phase heat transfer device that is capillary-driven or gravity-driven, has a two-phase working fluid contained in a closed general circuit, including an evaporator, a condenser, a reservoir having an inner volume with a liquid portion and a gas portion, a first vapor communication circuit, and a second liquid phase communication circuit. The reservoir comprises a plurality of floating bodies separating the liquid portion from the gas portion, by means of which the heat exchanges between the liquid portion and the gas portion are slowed down, which allows to diminish the effect of movement of the liquid portion or of an influx of cold or warm liquid into the reservoir. | 04-28-2016 |
| 20160123678 | CONFORMAL THERMAL GROUND PLANES - A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid. | 05-05-2016 |
| 20160128227 | VEHICLE THERMAL MANAGEMENT SYSTEM - A heat transfer system includes a heat source, a first heat exchanger coupled to the heat source to remove heat from the heat source, and a second heat exchanger coupled to the first heat exchanger to remove heat from the first heat exchanger. The heat transfer system also includes a thermal doubler coupled to the second heat exchanger to remove heat from the second heat exchanger, a first heat pipe coupled to the thermal doubler to remove heat from the thermal doubler, and a second heat pipe coupled to the first heat pipe to remove heat from the first heat pipe. | 05-05-2016 |
| 20160146544 | ALUMINUM PIPE AND HEAT PIPE PACKAGE AND ITS PACKAGING METHOD - An aluminum pipe and heat pipe package formed by inserting a heat pipe into a hollow aluminum pipe, and then processing the combination of the heat pipe and hollow aluminum pipe through a series of extrusion molding steps by means of opposing top and bottom extrusion dies and opposing left and right necking dies to reduce the gap between the hollow aluminum pipe and the heat pipe, and to have the hollow aluminum pipe and the heat pipe to be peripherally tightly fitted together, and the two opposite open ends of the hollow aluminum pipe to be completely blocked up. | 05-26-2016 |
| 20160153720 | HEAT PIPE | 06-02-2016 |
| 20160153721 | FIN ASSEMBLY | 06-02-2016 |
| 20160156075 | COOLING SYSTEM AND METHOD | 06-02-2016 |
| 20160159195 | HEAT DISSIPATOR AND ASSOCIATED THERMAL MANAGEMENT CIRCUIT - The present invention relates to a heat dissipator ( | 06-09-2016 |
| 20160165756 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a mounting plate, a base, a first fin assembly, a heat pipe, and a second fin assembly separated from the first fin assembly. The first fin assembly is disposed on a top surface of the base. A bottom surface of the base can contact an electronic component. The fan module is located between the first fin assembly and the second fin assembly. The heat pipe is connected to the first fin assembly and the second fin assembly. The first fin assembly and the second fin assembly are mounted to the mounting plate. The heat pipe is located in a first plane, and the first plane coincides with an axis of the heat pipe. The mounting plate is located in a second plane parallel with the mounting plate, and the first plane intersects with the second plane. | 06-09-2016 |
| 20160169586 | HEAT EXCHANGER, AIR-CONDITIONING APPARATUS, REFRIGERATION CYCLE APPARATUS AND METHOD FOR MANUFACTURING HEAT EXCHANGER | 06-16-2016 |
| 20160169591 | THERMAL MANAGEMENT SYSTEM | 06-16-2016 |
| 20160169595 | STACKING-TYPE HEADER, HEAT EXCHANGER, AND AIR-CONDITIONING APPARATUS | 06-16-2016 |
| 20160178292 | LAMINATED HEADER, HEAT EXCHANGER, AND AIR-CONDITIONING APPARATUS | 06-23-2016 |
| 20160187068 | METHODS AND APPARATUS FOR DROPWISE EXCITATION HEAT TRANSFER - A method and apparatus for heat transfer. In some embodiments, a heat transfer apparatus includes a body defining an inner volume; an inlet coupled to a vapor source; a coolant channel extending through the heat transfer apparatus; a condensing surface on which a vapor condenses, wherein the condensing surface is configured to cause the vapor to form as one or more drops on the condensing surface; and an actuator configured to excite the one or more drops at a resonant frequency of the one or more drops to remove the one or more drops from the condensing surface. | 06-30-2016 |
| 20160192796 | BUBBLE GENERATION NOVELTY ITEM | 07-07-2016 |
| 20160201992 | HEAT PIPE | 07-14-2016 |
| 20160202000 | STACKING TYPE HEADER, HEAT EXCHANGER AND AIR-CONDITIONING APPARATUS | 07-14-2016 |
| 20160252307 | HEAT EXCHANGE SYSTEM AND METHOD | 09-01-2016 |
| 20160374411 | PERSONAL THERMAL MANAGEMENT SYSTEM - Embodiments of the present invention relate to a wearable personal thermal management system and an associated method of manufacture. The PTMS comprises a harness that includes one or more cooling components and/or heating components. The harness include an upper-torso wearable portion and/or a lower-torso wearable portion. The PTSM provides a heating and/or cooling effects to one or more thermally sensitive areas of its user when worn. | 12-29-2016 |
| 20160377353 | Two-Phase Cooling Devices with Low-Profile Charging Ports - A two-phase cooling device, including a predetermined amount of at least one working fluid, a cavity formed from at least one of a metal structure or a metal alloy structure, at least one opening formed in the structure, wherein said opening is configured as a port for partial filling of the cavity with the at least one working fluid, and at least one cover for said opening, wherein said cover is configured to be sealed to the opening, to prevent said working fluid from leaving the cavity, and to prevent contaminants and non-condensable gas from entering the cavity. | 12-29-2016 |
| 20160381839 | COOLING ELECTRONIC DEVICES IN A DATA CENTER - A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways. | 12-29-2016 |
| 20220136778 | HEAT PIPE AND HEAT DISSIPATION STRUCTURE - A heat pipe including a pipe body. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The condensation portion includes a condensation end. The evaporation portion includes an evaporation end. The evaporation end and/or the condensation end are/is in a rectangular shape. | 05-05-2022 |
