Class / Patent application number | Description | Number of patent applications / Date published |
165104270 | With pressurizing means or degassifying means | 11 |
20090120619 | METHOD FOR EXCHANGING HEAT IN VAPOR COMPRESSION HEAT TRANSFER SYSTEMS - The present disclosure relates to a method for exchanging heat in a vapor compression heat transfer system. In particular, it relates to use of an intermediate heat exchanger to improve performance of a vapor compression heat transfer system utilizing a working fluid comprising at least one fluoroolefin. In addition, the present disclosure relates to a vapor compression heat transfer system comprising an intermediate heat exchanger in combination with a dual-row evaporator or a dual-row condenser, or both. | 05-14-2009 |
20100101763 | THIN HEAT DISSIPATING APPARATUS - A heat dissipating apparatus includes a heat pipe, a heat dissipating element, and two heat conducting bases. The pipe body of the heat pipe is formed integrally and has two evaporation ends disposed on both distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively, such that the invention simply requires connecting the heat dissipating element with the single heat pipe to achieve the effect of reducing the volume or space occupied by the heat dissipating element. | 04-29-2010 |
20100270010 | TWISTED TUBE THERMOSYPHON - A thermosyphon heat exchanger includes a plurality of first conduit elements and a plurality of second conduit elements. Each first conduit element has a heat absorbing portion defining a first plane and a first fluid transfer portion defining a second plane. The first plane and the second plane are twisted relative to each other. Each second conduit element has a heat releasing portion and a second fluid transfer portion or a connection to a fluid return line. At least one first conduit element and at least one second conduit element are connected to each other such that the fluid in the thermosyphon heat exchanger can flow in a closed loop through said first conduit element and said second conduit element. | 10-28-2010 |
20120024500 | THERMOSYPHON FOR COOLING ELECTRONIC COMPONENTS - A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon. | 02-02-2012 |
20120160459 | METHOD AND APPARATUS FOR CHIP COOLING - In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure. | 06-28-2012 |
20130025831 | INTEGRATED BUBBLE GENERATION, TRANSPORT AND EXTRACTION FOR ENHANCED LIQUID COOLING IN A MICROCHANNEL HEAT EXCHANGER - One embodiment can include a heat exchange system for heat exchange with a heat source and a cold source. The system can include a circulation loop. The circulation loop can include a heat emission portion configured to exchange heat with the cold source and a heat absorption portion configured to exchange heat with the heat source, the heat absorption portion comprising a channel. The embodiment can include a liquid pump configured to circulate a liquid through the circulation loop, from an inlet of the channel to an outlet of the channel and a bubble injector coupled to the circulation loop proximal to the inlet of the channel and configured to flow a gas to form a plurality of gas bubbles in the channel, with each of the plurality of gas bubbles monodispersed across the channel, with segments of liquid separating successive gas bubbles of the plurality of gas bubbles. | 01-31-2013 |
20130081789 | Cryogenic Cooling Method and Installation Using Liquid CO2 and Employing Two Exchangers in Series - A method and installation using liquid CO | 04-04-2013 |
20130213613 | HEAT TRANSFER DEVICE - The invention relates to a device for transferring heat and a method of controlling such a device, the device comprising a stator chamber containing: a liquid; an input heat exchange surface; an output heat exchanger; and a rotor arranged to be rotated by vapour bubbles. | 08-22-2013 |
20130228314 | EXPANSION AND DEGASSING DEVICE FOR CONNECTING TO A CIRCUT SYSTEM, IN PARTICULAR THE CIRCUIT SYSTEM OF A BUILDING HEATING INSTALLATION - An expansion and degassing container is in an expansion and degassing device for connecting to a circuit system for a circulating liquid. Because the amount of circulating liquid in the circuit system constantly changes during operation, liquid is withdrawn from the expansion and degassing container by way of a pressure holding pump, or supplied via a supply line, if needed. The supply line for supplying the refilling liquid is provided as a closed line, a system separator being arranged at the beginning region of the line and the end region thereof penetrating the container cover of the expansion and degassing container in a pressure-tight manner. The valve of the supply line is controlled according to the liquid level in the container. A pressure load cell, which additionally controls the valve according to the pressure, is present as a unit for decreasing an undesirable level of negative pressure. | 09-05-2013 |
20150296665 | COOLING ARRANGEMENT FOR COMPONENTS DISPOSED IN AN INTERIOR OF A SWITCH CABINET - The invention relates to a switch cabinet with a cooling apparatus which has a first closed coolant circuit and a second closed coolant circuit separated fluidically from the first coolant circuit, the first coolant circuit having a refrigerating machine or a cold water set and the second coolant circuit having a heat pipe arrangement. | 10-15-2015 |
20160120064 | REDUNDANT HEAT SINK MODULE - A redundant heat sink module can include a first independent coolant pathway and a second independent coolant pathway. The first independent coolant pathway can include a first inlet chamber, a first outlet chamber, and a first plurality of orifices extending from the first inlet chamber to the first outlet chamber and providing a first plurality of impinging jet streams of coolant against a first region of a surface to be cooled when pressurized coolant is provided to the first inlet chamber. The second independent coolant pathway can include a second inlet chamber, a second outlet chamber, and a second plurality of orifices extending from the second inlet chamber to the second outlet chamber and providing a second plurality of impinging jet streams of coolant against a second region of the surface to be cooled when pressurized coolant is provided to the second inlet chamber. | 04-28-2016 |