Class / Patent application number | Description | Number of patent applications / Date published |
165104220 | Including means to move heat exchange material in liquid state | 38 |
20080283221 | Direct Air Contact Liquid Cooling System Heat Exchanger Assembly - A compact heat exchanger assembly for use in hybrid liquid-air cooling system adapted to provide a liquid cooling mechanism for components or adapter boards in a personal computer system. The heat exchanger assembly consists of a heat exchanger chamber, though which the thermal transfer liquid flows. An air pump injects air bubbles into the heat exchanger chamber through a porous material. The air bubbles rise up through the thermal transfer liquid and exit at the top of the heat exchanger chamber through a semi-permeable membrane which inhibits loss of the thermal transfer fluid. As the air bubbles pass through the thermal transfer liquid, heat is exchanged directly between the thermal transfer liquid and the contained air. The heat is then removed from the system as the heated air is expelled from the heat exchanger chamber. A valve assembly prevents the thermal transfer liquid from entering the air pump in the event air flow through the heat exchanger chamber is stopped. | 11-20-2008 |
20110232875 | VAPOR VORTEX HEAT SINK - A hermetic Rankine cycle in a sealed casing powers an internal centrifugal condensate pump with an internal vapor turbine during forced convective heat transfer between a heat source and a heat sink. No work is imported into the cycle during operation. A centrifugal pumping disk shears the working fluid against a heating surface, sweeping evolving vapor into radial vortices which provide sink flow conduits to a vapor space at the center of the cylindrical turbine. Convective mass flow through the vapor space to the condensing end of the casing spins the turbine and the centrifugal pumping disk which is connected to it. Vapor is continuously swept from the heating surface, so bubbles do not form and superheat while blocking heat flux into liquid working fluid. Vapor is sucked through the radial vortices into the central vapor space and into the condensing end of the casing along the low pressure gradients in vortex cores established by cooling power. A high heat flux surface is thereby thermally connected to a conventional heat sink having high cooling power, for maximal heat extraction at data centers or other heat sources. Vapor vortices organize counterflow of vapor and condensate in a continuous mass flow cycle, and extract work from heat. Organic working fluids can be used in the casing to make even low temperature waste heat a power source. | 09-29-2011 |
20130160975 | THERMOSIPHON COOLING SYSTEM AND METHOD - A thermosiphon cooling system is presented. One embodiment of the thermosiphon cooling system includes a reservoir having a first portion configured to store a liquid coolant. The thermosiphon cooling system also includes a tubing unit coupled to the reservoir and disposed adjacent to at least one superconducting unit to be cooled and configured to receive the liquid coolant from the first portion of the reservoir, and circulate the received liquid coolant within the tubing unit to dissipate heat generated by the at least one superconducting unit. The received liquid coolant is circulated within the tubing unit by varying a density of the received liquid coolant at different portions of the tubing unit. | 06-27-2013 |
20130228309 | Process and Apparatus for Recovering Energy from Wastewater - The invention provides a process and apparatus for the recovery of heat energy from wastewater. Wastewater, for example grey water from a domestic residence, is introduced to a detention chamber, which provides effective decoupling between the introduction of new wastewater and the demand for heat energy from its ultimate application. A heat exchange surface, in contact with the wastewater on one side and a working fluid on the other, extracts heat from the detention chamber through thermal conduction and the working fluid is transferred, via a heat pump, to a second heat exchange surface. The second heat exchange surface, in contact with the working fluid on one side and heat energy storage media on the other, transfers heat energy to the storage media through conduction. Heat energy can then be extracted from the storage media for applications including heating of potable water, or provision of building heating. | 09-05-2013 |
20150323261 | PULSATING MULTI-PIPE HEAT PIPE - A pulsating multi-pipe heat pipe has its pipe bodies arranged in parallel and bent into a plurality of snake-shaped metal pipes, and an independent chamber is furnished respectively at both ends of the plurality of the snake-shaped metal pipes and connected-and-communicative to both ends of the snake-shaped metal pipes so as to enclose around into an open loop making the working-fluid-flows flowing in the multi-pipe body mutually cross flows to increase the driving force in the multi-pipe body, thereby enhances the heat-dissipating effect as well as successfully overcomes the horizontal, negative angle, and low-temperature unable-to-start problems in the conventional pulsating multi-pipe heat pipe. | 11-12-2015 |
20160014930 | COLD PLATE WITH COMBINED INCLINED IMPINGEMENT AND RIBBED CHANNELS | 01-14-2016 |
20160116224 | FLEXIBLE COOLING LINE ASSEMBLY - A flexible cooling line assembly, when fluidly connected to a two-phase cooling apparatus, can provide device-level cooling to one or more devices. The assembly can include a first section of flexible, low-pressure tubing fluidly connected to an inlet port of a heat sink module. The heat sink module can include an inlet chamber fluidly connected to the inlet port and a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber. The outlet chamber can be fluidly connected to an outlet port of the module, and a second section of flexible, low-pressure tubing can be fluidly connected to the outlet port. The plurality of orifices can deliver a plurality of jet streams of coolant into the outlet chamber and against a heat providing surface when the first heat sink module is mounted to the heat providing surface and when pressurized coolant is delivered to the inlet chamber. | 04-28-2016 |
20160198591 | PASSIVE AIRCRAFT COOLING SYSTEMS AND METHODS | 07-07-2016 |
20160377352 | PASSIVE TWO-PHASE COOLING CIRCUIT - A passive two-phase cooling circuit includes a vaporizer and a condenser for a coolant conducted in the cooling circuit. A vaporizer supply line and a vaporizer discharge line are connected to the vaporizer, and a condenser supply line and a condenser discharge line are connected to the condenser. The cooling circuit has a simple and cost-effective structure which reduces or even completely prevents pressure shocks during operation by connecting the vaporizer supply line, the vaporizer discharge line, the condenser supply line and the condenser discharge line to a common damping container. A liquid column forms in the condenser discharge line during the operation of the cooling circuit and the column assumes the function of a liquid-tight seal and of a fluid-dynamic vibration damper. | 12-29-2016 |
165104230 | By direct application of electrical energy to heat exchange material | 3 |
20120168131 | HEAT EXCHANGE DEVICE WITH IMPROVED EFFICIENCY - A method for heat exchange by boiling a polar liquid on a surface including at least one low-wetting zone, including: a) generating appearance of nuclei of vapor bubbles on the low-wetting zone, and causing the nuclei to grow; and b) making the surface wetting by at least one electro-wetting system, to favor detachment of the gas bubbles formed in this manner. | 07-05-2012 |
20130146258 | ISOTHERMAL HEATING APPARATUS - An isothermal heating apparatus includes a plate including formed therein a heat pipe circuit in which working fluid is charged, and a heating mechanism heating the working fluid. The heat pipe circuit includes a header portion at which the working fluid is heated and evaporated and a plurality of branch portions in which vapor produced by vaporization of the working fluid exchanges heat with the plate and condensates, the branch portions branching off from the header portion. The heating mechanism is provided on an evaporating surface side of the header portion with which the working fluid is in contact when the heating mechanism heats the working fluid. The isothermal heating apparatus can achieve isothermal heating of a heat-treatment subject and size reduction of the apparatus. | 06-13-2013 |
20140367073 | LIQUID TRANSPORT MEMBRANE - A cooling device includes an electroosmotic liquid transport membrane and a passage through which a fluid to be cooled can flow. The passage has a wall which includes the electroosmotic liquid transport membrane. The membrane is arranged to transport liquid to effect evaporative cooling such that the fluid in the passage can be cooled. The fluid in the passage is a liquid and the cooling device is arranged so that in use, the liquid being transported to effect evaporative cooling is transported through the electroosmotic liquid transport membrane out of the passage. | 12-18-2014 |
165104240 | By application of heat other than in heat receiving area | 5 |
20080223556 | PUMP-FREE WATER-COOLING SYSTEM - A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured. | 09-18-2008 |
20090014155 | THERMALLY PUMPED LIQUID/GAS HEAT EXCHANGER FOR COOLING HEAT-GENERATING DEVICES - A cooling system for a heat-generating device includes: coolant fluid; an evaporator for holding the coolant fluid and for heating the coolant fluid; said evaporator in close proximity to the heat-generating device for removing unwanted heat. The cooling system also includes a plurality of tubes for providing a flow path for the coolant fluid and gases produced by the evaporator; a heat exchanger through which the tubes pass for cooling the coolant fluid. The heat exchanger includes: a reservoir, a coolant, and a heating element for heating the gas so that it expands and pushes cool coolant fluid back to the evaporator. The heating element may be located inside the reservoir. | 01-15-2009 |
20090071631 | VAPOR-LIFT PUMP HEAT TRANSPORT APPARATUS - A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces. | 03-19-2009 |
20150096721 | EMERGENCY COOLING SYSTEM USING A LOOP THERMOSYPHON - An emergency cooling system for cooling an object certainly and rapidly in case a temperature of the object is accidentally raised abnormally. A loop thermosyphon is formed by connecting an evaporating portion with a condensing portion through a vapor pipe and a return pipe in a manner to form a cyclic conduit. A condensable working fluid circulates within the loop thermosyphon to be evaporated by a heat of the cooling object at the evaporating portion, and to be condensed at the condensing portion to radiate the heat conducted from the cooling object. A switching valve is disposed on the return pipe to selectively allow the working fluid in a liquid phase to be returned from the condensing portion to the evaporating portion. Heat transfer pipes to which the heat of the cooling object is conducted are arranged in the evaporating portion. Heat transfer protrusions are formed on an inner wall of the heat transfer pipe to penetrate through dews of the working fluid, and a preheating portion to which the heat of the cooling object is conducted is formed within a portion of the return pipe connected to the heat transfer pipe. | 04-09-2015 |
20160054073 | Temperature Glide Thermosyphon and Heat Pipe - Fluid to fluid heat exchange processes involve the hot fluid reducing in temperature and the cold fluid increasing in temperature. To transfer heat between the two fluids, a third, separated heat transfer fluid is often used. The present invention allows for passive heat transfer between the two fluids, using a separate heat transfer fluid, while enabling heat absorption and rejection through a continuously variable temperature. | 02-25-2016 |
165104250 | By application of mechanical energy | 21 |
20080277098 | SUPERSONIC VAPOR COMPRESSION AND HEAT REJECTION CYCLE - Method and apparatus for cooling a fuel cell stack. The cooling system uses vaporization cooling of the fuel stack and supersonic vapor compression of the vaporized coolant to significantly increase the temperature and pressure of the liquid coolant flowing through a heat exchanger. By increasing the heat rejection temperature of the coolant delivered to the heat exchanger, the heat transfer area of the heat exchanger can be reduced and the mass flow rate of coolant can also be reduced. The increased fluid pressure is used to circulate the coolant through the cooling system, thereby eliminating the circulation pump associated with conventional systems. | 11-13-2008 |
20090242174 | VAPOR VORTEX HEAT SINK - A hermetic Rankine cycle in a sealed casing powers an internal centrifugal condensate pump with an internal vapor turbine during forced convective heat transfer between a heat source and a heat sink. No work is imported into the cycle during operation. A centrifugal pumping disk shears the working fluid against a heating surface, sweeping evolving vapor into radial vortices which provide sink flow conduits to a vapor space at the center of the cylindrical turbine. Convective mass flow through the vapor space to the condensing end of the casing spins the turbine and the centrifugal pumping disk which is connected to it. Vapor is continuously swept from the heating surface, so bubbles do not form and superheat while blocking heat flux into liquid working fluid. Vapor is sucked through the radial vortices into the central vapor space and into the condensing end of the casing along the low pressure gradients in vortex cores established by cooling power. A high heat flux surface is thereby thermally connected to a conventional heat sink having high cooling power, for maximal heat extraction at data centers or other heat sources. Vapor vortices organize counterflow of vapor and condensate in a continuous mass flow cycle, and extract work from heat. Organic working fluids can be used in the casing to make even low temperature waste heat a power source. | 10-01-2009 |
20100025015 | DISSIPATION UTILIZING FLOW OF REFRIGERANT - A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion scraping brush provided corresponding to the evaporation portion, the evaporation portion scraping brush being able to sweep relative to an inner surface of the evaporation portion. A refrigerant liquid film is formed on the inner surface of the evaporation portion. Since the fluid refrigerant is uniformly applied to an inner surface of the evaporation portion to form a liquid film, the heat dissipating ability of the heat pipe heat dissipating device is improved, and the heat dissipating uniformity of the heat pipe heat dissipating device is enhanced. A heat dissipating method is also provided. | 02-04-2010 |
20100051238 | Vapor Flow in Heat Pipe Using Centrifugal Blower - An assisted heat pipe comprises an evaporator section, a condenser section, and a blower. The evaporator section converts a fluid from a liquid form to a vapor form, and the condenser section converts the fluid from a vapor form to back to a liquid form. The blower is encapsulated within the assisted heat pipe and resides between the evaporator section and the condenser section. The blower rotates and assists the vapor to travel from the evaporator section to the condenser section. | 03-04-2010 |
20100155029 | BLOWER ASSEMBLY - A blower assembly for dissipating heat from a printed circuit board (PCB), the blower assembly includes a bracket and a fan. The bracket includes a sidewall defining an inlet and a lateral wall defining a fixing slot to receive one end of the PCB, the lateral wall also defines an outlet adjacent the fixing slot. The fan is installed in the bracket and exposed through the inlet to suck air, configured for expelling air from the inlet to the outlet to cool the PCB. | 06-24-2010 |
20110088872 | HEAT PIPE STRUCTURE - A heat pipe structure includes a pipe body and a convection device. The pipe body defines a chamber enclosed in an inner wall of the pipe body. The convection device includes a rotary unit and a driving unit for creating a fluid pressure gradient in the chamber of the pipe body. The rotary unit and the driving unit are respectively located at an interior and an exterior of the pipe body. When the driving unit is excited, the rotary unit is driven to rotate under magnetic induction. With the fluid pressure gradient created in the chamber of the pipe body, the circulation of the working fluid in the chamber can be improved, and a forced convection flow of the working fluid in the pipe body is enabled to largely increase the heat transfer efficiency and heat transfer effect of the heat pipe. | 04-21-2011 |
20110120673 | SYSTEMS AND METHODS OF THERMAL TRANSFER AND/OR STORAGE - Systems, methods, and computer-implemented embodiments consistent with the inventions herein are directed to storing and/or transferring heat. In one exemplary implementation, there is provided a system for transferring/storing heat comprised of a heat exchange/storage apparatus including a chamber, and a heat input device adapted to heat/provide a vapor into the chamber. Other exemplary implementations may include one or more features consistent with a heat output device through which a working medium/fluid passes, a thermal storage medium located within the chamber, and/or a heat exchange system that delivers a heat exchange medium/fluid to the thermal storage medium. | 05-26-2011 |
20120000631 | Cooling of Heat Intensive Systems - Disclosed herein is a cooling system that utilizes a supersonic cooling cycle. The cooling system includes accelerating a compressible working fluid, and may not require the use of a conventional mechanical pump. The cooling system accelerates the fluid to a velocity equal to or greater than the speed of sound in the compressible fluid selected to be used in the system. A phase change of the fluid due at least in part to a pressure differential cools a working fluid that may be utilized to transfer heat from a heat intensive system. | 01-05-2012 |
20120024499 | LOOP TYPE PRESSURE-GRADIENT-DRIEN LOW-PRESSURE THERMOSIPHON DEVICE - A loop type pressure-gradient-driven low-pressure thermosiphon device includes a case sealed by a cover to define a chamber with a vaporizing section. The vaporizing section includes a plurality of spaced flow-guiding members and first flow passages formed between adjacent flow-guiding members. The flow passages respectively have at least one free end communicating with a free zone in the chamber. A pipeline is connected at two ends to two opposite sides of the case, and has a second flow passage communicable with the vaporizing section. The pipeline extends through at least one heat-dissipating element, so that the pipeline and the heat-dissipating element together define a condensing section. In the thermosiphon device, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can be driven to circulate and transfer heat in the pipeline and the case without any wick structure. | 02-02-2012 |
20120132403 | METHOD FOR THE NATURAL-DRAUGHT COOLING OF A SOLAR CONCENTRATION PLANT - Method for the natural-draught cooling of a high-concentration thermoelectric solar plant that includes a central receiver or tower with a heliostat field, wherein the tower is used as a natural-draught cooling tower. | 05-31-2012 |
20120138272 | Pumping System Resistant to Cavitation - Techniques herein describe a pumping system, adapted to reduce or eliminate fluid cavitation. Optionally, the pumping system is adapted for application to a passive fluid recovery system. In one example, the pumping system includes a pump and a thermal sub-cooling device. The thermal sub-cooling device may sub-cool fluid input to a pump and heat fluid output from the pump, particularly under start-up conditions. In a further example, a controller manages power supplied to both the pump and the thermal sub-cooling device, to transition from an ambient temperature start-up condition to an elevated temperature operating condition. | 06-07-2012 |
20120261094 | DISSIPATION UTILIZING FLOW OF REFRIGERANT - Technologies are generally described for devices, methods, and programs for heat dissipating utilizing flow of refrigerant. An example heat dissipating device includes a conductive chamber to receive a fluid refrigerant, and the conductive chamber itself includes an evaporation portion having an interior layer and an exterior layer that is in contact with a heat generating unit, a condensation portion, and a rotatable brush that is configured inside of the conductive chamber to have an axis that is parallel to the interior layer of the evaporation portion and that is further configured to sweep across the interior layer of the evaporation portion to form a thin film of the fluid refrigerant. | 10-18-2012 |
20130000869 | PROCESS AND PLANT FOR COOLING SULFURIC ACID - A process for cooling an acid that is withdrawn from an absorption apparatus of a sulfuric acid plant includes pumping the acid to be cooled from an acid pump tank and supplying the acid to a shell space of a heat exchanger. Water is supplied as a heat transport medium to heat transfer elements disposed in the shell space so as to at least partially convert, by heat transfer from the acid, the water to steam. The acid which was cooled in the heat exchanger is supplied back to the absorption apparatus. The water is separated from the steam in a steam drum. The separated water is recirculated to the heat exchanger using a pump. | 01-03-2013 |
20130025827 | COOLING SYSTEM FOR ELECTRONIC DEVICE - A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The second heat exchanger is used for cooling the refrigerants by gasifying liquefied gas. The pump is used for circulating the refrigerants. | 01-31-2013 |
20130032310 | TRANSPORTABLE, ENVIRONMENTALLY-CONTROLLED EQUIPMENT ENCLOSURE - A transportable environmentally controlled equipment enclosure (TECEE), or other equipment enclosure of the type containing racks of heat-generating equipment, may include a pump-less heat pipe cooling system to carry heat away from the equipment, an improved equipment rack system that includes a suspended base supported by rails with multiple latching and/or locking positions, and various improvements related to power distribution, equipment access, internal and external communications, and safety. | 02-07-2013 |
20140144608 | EVAPORATION-ASSISTED HEAT DISSIPATION APPARATUS - An evaporation-assisted heat dissipation apparatus includes a heat sink, a fan, and a spraying member. The spraying member includes a water tank, a water transmitting tube, and a plurality of water output tubes. The water tank accommodates a heat-dissipating liquid which flows to the tops of the plurality of water output tubes via the water transmitting tube. The convex meniscus which is formed at the top of each of the plurality of water output tubes is atomized and blown toward the heat sink by the fan and the droplets attach on the heat sink. The droplets are evaporated from the heat sink and remove heat from the heat sink by doing so. | 05-29-2014 |
20140262158 | TWO-PHASE COOLING SYSTEM - Provided is a modular pumped loop cooling apparatus including a cooling module and a pumping module, wherein the pumping module has an inlet coupling for mating with a corresponding outlet coupling of the cooling module when the cooling module is placed atop the pumping module. The modular pumped loop cooling apparatus is provided as a standalone unit that can be coupled to any one of a plurality of heat sinks having different heat loads. The cooling apparatus is therefore scalable to accommodate a wide range of cooling applications so that the apparatus does not have to be redesigned to accommodate a particular system. | 09-18-2014 |
20140332186 | DISSIPATION UTILIZING FLOW OF REFRIGERANT - Technologies are generally described for devices, methods, and programs for heat dissipating utilizing flow of refrigerant. An example heat dissipating device includes a conductive chamber to receive a fluid refrigerant, and the conductive chamber itself includes an evaporation portion having an interior layer and an exterior layer that is in contact with a heat generating unit, a condensation portion, and a rotatable brush that is configured inside of the conductive chamber to have an axis that is parallel to the interior layer of the evaporation portion and that is further configured to sweep across the interior layer of the evaporation portion to form a thin film of the fluid refrigerant. | 11-13-2014 |
20150060019 | PULSATING MULTI-PIPE HEAT PIPE - A pulsating multi-pipe heat pipe having its metal pipes arranged in-parallel and bent in snake-shaped loop, is capable of making the working fluid flow through the pulsating multi-pipe heat pipe, enhance the pressure difference therein so as to improve its heat-dissipating effect and successfully overcome the problems of horizontal action when the heat pipe is laid in horizontal position. This is done by attaching at least a chambered connector in the metal pipes having their cross-sectional areas greater than the total cross-sectional areas of the metal pipes or furnishing at least a pair of communicative penetrating holes at the side-by-side adjacent pipe walls making the working fluid create cross-flow within the pulsating multi-pipe heat pipe. | 03-05-2015 |
20160047605 | ADVANCED CONTROL TWO PHASE HEAT TRANSFER LOOP - The advanced control heat transfer loop apparatus ( | 02-18-2016 |
20160116225 | COOLING DEVICE AND METHOD FOR MANUFACTURING SAME - This cooling device has: an evaporation section for storing a refrigerant; a condensation section for radiating the heat of a gas-phase refrigerant, which has been gasified by the evaporation section, by condensing and liquefying the gas-phase refrigerant; a vapor pipe for transporting the gas-phase refrigerant to the condensation section; a liquid pipe for transporting a liquid-phase refrigerant, which has been condensed by the condensation section, to the evaporation section; and a mounting plate provided with a connection structure connected to the device side which is to be cooled. The evaporation section is disposed on one surface of the mounting plate, and the condensation section is disposed on the other side of the mounting plate. This method for manufacturing a cooling device is configured in such a manner that a mounting plate is formed by providing a connection structure to a flat surface member, an evaporation section is disposed on one surface of the mounting plate, a condensation section is disposed on the other side of the mounting plate, and the condensation section is connected to the evaporation section by piping. In cooling devices using a phase change cooling method, the cost of manufacturing the entirety of each of the devices increases because the interchangeability of the device with existing cooling devices needs to be ensured. | 04-28-2016 |