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Process of forming a composition containing a nonreactive material (NRM) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof

Subclass of:

523 - Synthetic resins or natural rubbers -- part of the class 520 series

523000000 - SYNTHETIC RESINS (CLASS 520, SUBCLASS 1)

523001000 - PROCESSES OF PREPARING A DESIRED OR INTENTIONAL COMPOSITION OF AT LEAST ONE NONREACTANT MATERIAL AND AT LEAST ONE SOLID POLYMER OR SPECIFIED INTERMEDIATE CONDENSATION PRODUCT, OR PRODUCT THEREOF

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
523427000 Composition wherein two or more polymers or a polymer and a reactant all contain more than one 1,2-epoxy group, or product thereof 99
523466000 Inorganic SI-O bond DNRM 75
523451000 Phosphorus DNRM 72
523456000 Organic chalcogen compound DNRM 66
523402000 Product contains water per se or water of hydration as designated nonreactive material (DNRM) 66
523457000 Elemental metal or metal compound other than as silicate DNRM 62
523435000 Solid polymer derived from reactant containing element other than C, H, O, or N or chlorine-containing reactant of three or more carbon atoms 54
523468000 Elemental carbon DNRM 41
523440000 Designated nonreactive material (DNRM) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range 40
523437000 Two or more polymers derived from ethylenic reactants only 34
523436000 Polymer is graft, graft-type, block, or block-type 25
523455000 Carboxylic acid or derivative devoid of heavy metal atom DNRM 25
523447000 Carbohydrate or derivative including tannin or derivative DNRM 19
523454000 Ketone or aldehyde DNRM 13
523453000 Organic sulfur compound DNRM 13
523401000 Contains inorganic water settable material NRM 13
523445000 Boron DNRM 12
523461000 Organic nitrogen compound DNRM 6
523446000 Biologically derived cellular material other than cereal, cotton, or diatomaceous earth DNRM 5
20110028603HYPERBRANCHED POLYMERS AND OLIGOMERS COMPRISING TERMINAL AMINO GROUPS AS CURING AGENTS FOR EPOXY RESINS - The invention relates to the use of hyperbranched polymers or oligomers comprising terminal primary and/or secondary amino groups as curing agents for epoxy resins. The invention further relates to a composition containing such polymers or oligomers, an uncured or only partially cured epoxy resin, and at least one optional curing agent for epoxy resins, as well as a cured epoxy resin that can be obtained by curing said components. The invention finally relates to a method for curing epoxy resins. In said method, an uncured or only partially cured epoxy resin is brought to a temperature of 5 to 150° C. or is exposed to microwave radiation along with at least one polymer or oligomer according to the definition above and at least one optional conventional curing agent for epoxy resins.02-03-2011
20110319524Epoxy Acid Thermoset Resins and Composites that Can Be Hot-Fashioned and Recycled - Resins and thermoset composites comprising them, these materials being able to be hot-fashioned. These compositions resulting from placing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, in contact with at least one hardener chosen from carboxylic acids, in the presence of at least one transesterification catalyst whose total molar amount is between 5% and 25% of the total molar amount of hydroxyl and epoxy contained in the thermosetting resin precursor. Process for manufacturing these materials, process for transforming and process for recycling these materials. New solid forms of resins and of thermoset composites that may be used in the implementation of these processes.12-29-2011
20120172494METHOD FOR PRODUCING WOOD FIBRE-PLASTICS COMPOSITE PRODUCTS - A process for producing a composite product comprising fibres of a lignocellulosic material or natural fibres and a plastics material utilises a liquid or particulate binder formulation comprising a thermoset resin and a thermoplastic polymer, monomer, or oligomer. A composite product is formed for use as or in forming a feedstock in plastics manufacture may be broken down under heat and mechanical shearing in a plastics extrusion machine to release the major fraction of the fibres, or the product may be useful as an intermediate product in other form or as an end product.07-05-2012
20150329686BIOCOMPOSITE MATERIALS DERIVED FROM ANIMAL PROTEIN - Biocomposite materials are derived from animal proteins, and, in particular, animal proteins derived from byproducts such as specified risk material. The composite materials are created by embedding a fibrous material with a polymer matrix comprising a hydrolysate from the animal protein and a crosslinking reagent such as an epoxy.11-19-2015
20160137832FIBER REINFORCED COMPOSITE - The present invention relates to a fiber reinforced composite comprising a reinforcing constituent of fibers embedded in a resin matrix, wherein the resin matrix comprises epoxy resin crosslinked with aminated lignin. The invention further relates to a method for the production of a fiber reinforced composite.05-19-2016
523439000 Polymer derived from ethylenic reactants only derived from heterocyclic reactant other than 1,2-epoxy solely 5
20110288205POLYMER DISPERSIONS OF NARROW PARTICLE SIZE DISTRIBUTION - A process for the manufacture of a polymer dispersion comprising the steps of i) providing a mixture comprising from 2 to 60 parts by weight of a first polypropylene polymer having sufficient carboxylic acid and/or carboxylic acid anhydride groups equivalent to an acid value of from 2 to 50 mg KOH/g nv polymer and from 40 to 98 parts by weight of a second polymer having a molar excess of functional groups capable of reacting with the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene ii) causing the polymers to melt at a chosen temperature under conditions of high shear in an extruder to form an intimate mixture of the polymers iii) causing some of the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene to react with at least some of the functional groups of the second polymer to form a reaction mixture, under conditions of high shear in an extruder iv) rapidly cooling the reaction mixture outside the extruder to form a solid product v) optionally breaking up the solid product into smaller pieces vi) contacting the solid product with an organic liquid wherein the organic liquid is chosen to be a good solvent for the second polymer and a poor solvent for the polypropylene polymer whereby a dispersion comprising polypropylene particles in a solution of the second polymer dissolved in the organic liquid is formed.11-24-2011
20140107256THERMOSET RESIN COMPOSITION AND ITS USE - The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.04-17-2014
20140128509CURABLE COMPOSITIONS - Embodiments include a curable composition comprising an epoxy resin, a non-halogen flame retardant agent comprising at least two of an aryl-cyanato group and at least two of a phosphorus group, and a styrene and maleic anhydride copolymer. Embodiments include method of preparing the curable composition, prepregs that include a reinforcement component and the curable composition, and an electrical laminate formed with the curable composition.05-08-2014
20140296385COMPOSITION COMPRISING A SEMI-AROMATIC POLYAMIDE AND A CROSSLINKED POLYOLEFIN - A composition comprising a copolyamide and a crosslinked polyolefin. The present invention relates to a composition comprising at least one semi-aromatic polyamide and at least one crosslinked polyolefin, wherein the crosslinked polyolefin is obtained from at least one product (A) comprising an unsaturated epoxide and from at least one product (B) comprising an unsaturated carboxylic acid anhydride. According to the invention, the weight contents of (A) and B), denoted respectively [A] and [B], are such that the [B]/[A] ratio is between 3 and 14.10-02-2014
20160194438CURABLE COMPOSITIONS07-07-2016
523450000 Coal, asphaltic, or bituminous material DNRM 3
20090131558METHOD FOR PREPARING COMPLEX STYRENIC BLOCK COPOLYMER AND ASPHALT COMPOSITION CONTAINING IT - Disclosed is a modified asphalt composition obtained by blending asphalt with a complex block copolymer, which is prepared by polymerizing styrene in the presence of an anionic polymerization initiator to prepare a polystyrene solution, adding butadiene to the polystyrene solution, and then further polymerizing styrene, and wherein a triblock copolymer and diblock copolymer are present at a specific proportion. The modified asphalt composition of the present invention exhibits superior ductility at low temperature, while exhibiting comparable or better softening point as compared to conventional compositions, and, thus, is applicable to road paving, waterproof sheets and sealants.05-21-2009
20090247670Epoxy Resin Molding Material for Sealing, and Electronic Component Device - The invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B), and a colorant resin mixture (C) wherein a resin (C1) and a colorant (D) having an electric resistivity of 1×1010-01-2009
20120238669ASPHALTENES-BASED POLYMER NANO-COMPOSITES - Inventive composite materials are provided. The composite is preferably a nano-composite, and comprises an asphaltene, or a mixture of asphaltenes, blended with a polymer. The polymer can be any polymer in need of altered properties, including those selected from the group consisting of epoxies, acrylics, urethanes, silicones, cyanoacrylates, vulcanized rubber, phenol-formaldehyde, melamine-formaldehyde, urea-formaldehyde, imides, esters, cyanate esters, allyl resins.09-20-2012
523463000 Hydrocarbon other than xylenes, benzene, or toluene DNRM 2
20130324642CURABLE POLYMER MATERIALS - A curable compound of a formulation, a method for producing a polymer material from the curable compound, the resulting polymer material, and agents produced from the polymer material.12-05-2013
20100168280Process for preparing a self-healing composite material - The process for preparing a self-healing composite material comprising a matrix of epoxy polymer, in which a catalyst of ring opening metathesis reaction and microcapsules containing a cyclic olefin having 7 to 40 carbon atoms are dispersed, comprises the steps of: 07-01-2010
Entries
DocumentTitleDate
20080262127FLAME RESISTANT RESIN COMPOSITION - A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability. Therefore, the resin composition is particularly useful in composite materials, forming materials or semiconductor packaging materials.10-23-2008
20080262128Polymer Brushes - Polymer brushes (10-23-2008
20090062430Epoxy Resin Composition for Sealing and Electronic Component Device - The invention relates to an epoxy resin composition for sealing comprising (A) an epoxy resin, and (B) a curing agent, wherein the following is comprised as the curing agent (B): (C) a compound or compounds represented by the following general formula (I) in which n is or n's are each an integer of 1 to 10, and m is or m's are each an integer of 1 to 10:03-05-2009
20090093569Novel Dispersant And Compositions Thereof - A composition comprising a particulate Solid, an organic medium and a compound with an alkyleneoxy compound with an inorganic acidic polar head group (Z), wherein the compound is defined by Formula (1) and salts thereof: U—(Y)04-09-2009
20090131557SHAPE MEMORY RESIN - A shape memory resin of the present invention contains a network polymer and a thermoplastic polymer, and the thermoplastic polymer is dissolved in the network polymer. The shape memory resin of the present invention can be produced by a simple process of simply dissolving the thermoplastic polymer in a network polymer precursor and cross-linking this network polymer precursor. In the present invention, an epoxy compound is preferably used as the network polymer precursor.05-21-2009
20090137702COATING SYSTEM - A curable composition comprising 05-28-2009
20090203813Epoxy Resin, Epoxy Resin Composition Having the Same, Paint Composition and Method of Forming a Coating Layer Using the Same - In an epoxy resin having a low viscosity and excellent water resistance, an epoxy resin composition having the same, a paint composition and a method of forming a coating layer using the same, the epoxy resin composition includes an epoxy resin prepared by a reaction of a cashew nut shell liquid (CNSL) selected from cardol, cardanol, anacardic and an alkyl cardol, and a haloalkylene oxide. The paint composition having such epoxy resin composition may have excellent working efficiency and low-temperature curability, and may form a coating layer having improved water resistance.08-13-2009
20090253829PROCESS FOR THE MANUFACTURING OF SLABS OR BLOCKS OF CONGLOMERATE OF STONE GRANULATE AND POLYESTER RESIN - In the manufacture of articles in slabs or blocks according to so-called Bretonstone technology, a polyester resin is employed, free of reactive solvents, formed by the reaction between an epoxidised triglyceride and at least one carboxylic anhydride.10-08-2009
20090264558Capped polyurethane prepolymers and heat-curable epoxy resin compositions - The invention relates to differently blocked polyurethane polymers of formula, to their use as impact resistance modifiers, to heat-curable epoxy resin compositions containing said impact resistance modifiers and to methods for the production of said compositions. The invention also relates to bonding methods using said compositions and to articles produced by said methods.10-22-2009
20100004355ANTICORROSIVE COATING COMPOSITION - The anticorrosive coating composition of the present invention is characterized by comprising (A) an epoxy resin, (B) an amine curing agent and (C) a hydroxyl group-containing coumarone resin wherein the hydroxyl group-containing coumarone resin (C) is contained in an amount of 1 to 500 parts by weight based on 100 parts by weight of the epoxy resin (A). The hydroxyl group-containing coumarone resin (C) preferably has a hydroxyl group content in one molecule of 1 to 5% and a softening point of not higher than 200° C. The anticorrosive coating composition can form a coating film in which the plural resin components are homogeneously mixed and which are excellent in anticorrosion properties, water resistance and adhesion. Further, since the coating composition is free from tar unlike conventional anticorrosive coating compositions, it can form a clear coating film free from bleeding out of any component, and safety and hygiene problems at the time of coating operation thereof do not occur.01-07-2010
20100004356Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor - Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.01-07-2010
20100016473CRYSTALLINE RESIN CURED PRODUCT, CRYSTALLINE RESIN COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME - Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH01-21-2010
20100016474LIQUID EPOXY RESIN COMPOSITION - A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an amine curing agent, and (C) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A), wherein the component (B) is contained in such an amount that a molar ratio of epoxy groups of the component (A) to amino groups of the component (B), ranges from 0.6 to less than 1.0, provided that, if the component (B) includes an amine curing agent which is solid in the composition at a temperature of from room temperature to 150° C., a content of such an amine is 30 mol % or less, based on the component (B).01-21-2010
20100022685RAPID DRY FIBERGLASS STAIN - A portion of the linseed oil ingredient used in fiberglass composite stains is replaced with a modified Cashew Nut Shell Liquid (CNSL) resin. As a result, the drying time of the stain is shortened considerably yet is still long enough to allow working of the stain into the composite for developing a simulated wood appearance.01-28-2010
20100041794HYDROXYL-TERMINATED OR CARBOXYLIC ACID-TERMINATED REACTIVE MONOMER COMPOSITIONS, THEIR PREPARATION AND THEIR USE - The present invention relates to new reactive monomer compositions that have a plurality of reactive, functional moieties, such as one or both of a hydroxyl moiety or a carboxylic acid moiety. The present invention also further relates to use of such reactive monomer compositions as a component of curable coating compositions, especially curable powder coating compositions.02-18-2010
20100056671POLYFUNCTIONAL EPOXY OLIGOMERS - The present invention provides epoxy functional oligomeric compounds, methods of preparation and uses therefor. In particular, the present invention provides to oligomeric epoxy compounds derived from allyl glycidyl ether.03-04-2010
20100063181COATING SYSTEM - A curable composition comprising 03-11-2010
20100063182EPOXY COMPOSITION - There is disclosed an epoxy composition containing at least two kinds of epoxy compounds selected from the epoxy compounds of the formula (1):03-11-2010
20100063183INTERCALATION AGENT FREE COMPOSITIONS USEFUL TO MAKE NANOCOMPOSITE POLYMERS - A two step method for preparing a filler composition, the filler composition useful to prepare a nanocomposite polymer. The first step is to disperse a water dispersible filler material in a liquid comprising water to form a dispersion. The second step is to replace at least a portion of the water of the liquid with an organic solvent to form the filler composition, the water concentration of the liquid of the filler composition being less than six percent by weight, the average size of at least one dimension of the filler material being less than two hundred nanometers upon examination by transmission electron microscopy of a representative freeze dried sample of the dispersion of the first step. A nanocomposite polymer can be prepared by mixing the above-made filler composition with one or more polymer, polymer component, monomer or prepolymer to produce a polymer containing a filler having an average size of at least one dimension of the filler of less than two hundred nanometers upon examination by transmission electron microscopy of a representative sample of the polymer. In addition, an epoxy resin composition useful for making a cured epoxy nanocomposite polymer, the epoxy resin composition made by a two step process. The first step is to mix an epoxy resin with the filler composition to form an epoxy resin mixture. The second step is to remove organic solvent from the epoxy resin mixture to form the epoxy resin composition. And, a nanocomposite polymer, made by the step of mixing the filler composition with one or more polymer, polymer component, monomer or prepolymer to produce a polymer containing a filler having an average size of at least one dimension of the filler of less than two hundred nanometers upon examination by transmission electron microscopy of a representative sample of the polymer.03-11-2010
20100076119ADHESIVE FOR ELECTRONIC COMPONENTS - The present invention has its object to provide an adhesive for bonding electronic components with a constant distance between them, which makes it possible to maintain a distance between bonded electronic components at high accuracy and to provide a highly reliable electronic apparatus, and which can be stably and continuously applied with a jet dispenser. The present invention is an adhesive for bonding electronic components, including spacer particles, an epoxy compound (A), and a curing agent. The spacer particles have a CV value of 10% or less. The epoxy compound (A) has a molecular structure including 10 or less monomer units with an aromatic ring in each repeating unit, is in a state of crystalline solid at 25° C., and has a viscosity of 1 Pa·s or less measured by an E-type viscometer at a temperature of 50 to 80° C.03-25-2010
20100087567EPOXY GROUP-TERMINATED POLYMERS, THE COMPOSITIONS THEREOF AND THE USE THEREOF AS IMPACT RESISTANCE MODIFIERS - The present invention relates to epoxy group-terminated polymers of the formula (I). Said epoxy group-terminated polymers are suited extremely well as impact resistance modifiers, particularly in epoxy resin compostions. They are particularly suited for use in heat-curing epoxy resin adhesives. It has been found that such epoxy resin compostions not only have excellent mechanical properties and high glass transition temperatures, but also above all improved impact resistance properties, both at room temperature and at low temperatures.04-08-2010
20100120946Mitsubishi polyester film GmbH - The invention relates to biaxially oriented polyester films which contain 0.1-5.0% by weight (based on the weight of the film) of a hydrolysis stabilizer based on epoxidized fatty acid esters and 0.2-10% by weight (based on the weight of the film) of epoxidized fatty acid glycerides, the epoxidized fatty acid esters having a mean molecular weight of at least 425 g/mol. Such films find use in outdoor applications, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.05-13-2010
20100120947Biaxially stretched polyester film which comprises a chain extender, and process for production thereof and use thereof - The invention relates to biaxially oriented polyester films that include a chain extender in addition to polyester. Such films find use in all applications typical of biaxially oriented polyester films, especially in outdoor applications, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.05-13-2010
20100144926EPOXY RESIN COMPOSITION - A resin composition comprising an epoxy compound denoted by the formula (1):06-10-2010
20100144927THERMAL CURABLE POWDER COATING COMPOSITION - A powder coating composition based on including at least one specific kind of the polyuretdione resin having a carboxyl value in the range of 20 to 300 mg KOH/g which exhibits higher crosslinking density in thin films, high flexibility, and excellent weather resistance.06-10-2010
20100160494AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE - The present invention provides an amine based epoxy resin curing agent containing an epoxy resin and an amine compound capable of imparting a high gas barrier performance and a long pot life, in addition to excellent performances which an epoxy resin conventionally possesses, and an epoxy resin composition with a high gas barrier performance and a long pot life, which contains the subject curing agent. Also, the present invention provides an adhesive for laminate with excellent adhesiveness to various polymers, papers, metals, etc., which contains, as a main component, an epoxy resin composition containing an amine based resin curing agent with a high gas barrier performance and a long pot life.06-24-2010
20100160495EMULSION PAINT TYPE DAMPING COATINGS - Emulsion paint type damping coatings show an excellent film forming property even if it leaves at low temperature from 5 to 20° C. It does not generate a defective coated film like swellings after baking drying and brings out an excellent damping performance within a range of 20 to 60° C. That is, it contains one or more than two kinds of organic chemicals within a range of 0.5% to 5% by weight in total and the MFT, the minimum film forming temperature of the entire resin emulsion is within a range of 5 to 15° C. and the boiling point for a film forming assistant is within a range of 150 to 240° C., thus, it enables to obtain an excellent film forming property at 5° C. and even in baking drying and does not generate a defective coated film like swellings as well. As a result, emulsion paint type damping coatings bring out an excellent damping performance within a range of 20 to 60° C.06-24-2010
20100168277CURING AGENTS FOR EPOXY-FUNCTIONAL COMPOUNDS - The present invention relates to compounds suitable to use as curing agents for epoxy systems which can be obtained by reacting an amine-functional compound with an α-β unsaturated acid and/or ester and a mono-functional epoxy compound. The invention further relates to coating compositions comprising these curing agents.07-01-2010
20100168278One-Solution Type Thermosetting Composition for Protective Film of Color Filter, and Color Filter Using Same - The present invention relates to one-solution type thermosetting resin composition for a protective film of a color filter, and a color filter including the same. The one-solution type thermosetting resin composition includes a copolymer (A) including (meth)acrylate with an epoxy cyclic structure at the side chain, (meth)acrylate with a hydroxyl terminal, acid anhydride, and maleimide with a substituent; an epoxy resin (B); a base-generating agent (C); and an organic solvent (D). When a protective film of a color filter is prepared by using the one-solution type thermosetting resin composition according to the present invention, it has excellent storage stability as well as excellent flatness, close-contacting property, transmission properties, heat resistance, and chemical resistance.07-01-2010
20100197830ADHESIVE FOR ELECTRONIC COMPONENT - The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.08-05-2010
20100204363COATING COMPOSITIONS CONTAINING TETRAMETHYL CYCLOBUTANEDIOL - Disclosed are solvent borne thermosetting coating compositions that contain a curable polyester resin blended with an acrylic copolymer, a crosslinker, and a solvent. The polyester resin contains 2,2,4,4-tetramethyl-1,3-cyclobutanediol and exhibits good dry time, compatibility with acrylic resins, sag resistance and hardness development in a coating composition. The coating compositions can be used to prepare clear coat or pigmented coatings for automotive OEM, auto refinish, and other applications.08-12-2010
20100227949CURABLE COMPOSITION - Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).09-09-2010
20100227950COMB-LIKE POLYETHERALKANOLAMINES IN INKS AND COATINGS - Provided herein are compositions useful as ink or coatings which contain novel dispersants that are capable of dispersing pigments which are traditionally difficult to disperse while maintaining acceptable levels of viscosity. Use of dispersants as taught herein enables the preparation of a wide variety of inks and coatings having high pigment loading and existing within a conventionally-useful viscosity range.09-09-2010
20100249276CURATIVES FOR EPOXY COMPOSITIONS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.09-30-2010
20100298468EPOXY RESINS WITH IMPROVED FLEXURAL PROPERTIES - Epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4′-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.11-25-2010
20100298469EFFECT PIGMENTS BASED ON SUBSTRATES FORMED FROM INORGANIC-ORGANIC MIXED PHASES, PRODUCTION AND USE THEREOF - Effect pigments with a platelet-shaped substrate provided on at least one side with at least one coating of semitransparent metal and/or at least one high-index coating having a refractive index≧2.0. The platelet-shaped substrate includes at least one mixed inorganic/organic phase. Also, a method of producing effect pigments including the following steps: 11-25-2010
20100317767FULLERENE FILM AND FULLERENE POLYMER BOTH PRODUCED FROM FULLERENE DERIVATIVE AND PROCESSES FOR PRODUCING THESE - Disclosed is a fullerene film which can be easily formed by a wet process without deteriorating the intrinsic properties of a fullerene by using a fullerene derivative as a raw material. Also disclosed are a fullerene polymer, a method for producing a fullerene film, and a method for producing a fullerene polymer. A fullerene film or a fullerene polymer maintaining the intrinsic properties of the fullerene is obtained by coating a base with a solution of a fullerene derivative which is decomposed at a temperature lower than the thermal decomposition temperature of the fullerene, for example one represented by the formula below, and then heating the thus-obtained coating film at a temperature higher than the thermal decomposition temperature of the fullerene derivative but lower than the thermal decomposition temperature of the fullerene.12-16-2010
20100324174THERMOPLASTIC RESIN COMPOSITION AND SHAPED ARTICLE THEREFROM - Disclosed are a thermoplastic resin composition which has a reduced tendency to mold staining while being shaped and a high flowability, and a shaped article which, when used as a lamp component, has good surface appearance and generates little volatiles by the heat of the lamp. Specifically disclosed are a thermoplastic resin composition containing a polyester resin (A), a cresol novolac epoxy resin (B), and a vinyl cyanide-aromatic vinyl copolymer containing epoxy group (C), and a shaped article shaped therefrom, wherein the cresol novolac epoxy resin (B) and the vinyl cyanide-aromatic vinyl copolymer containing epoxy group (C) are compounded in amounts of 0.01 to 3 parts by mass and 2 to 12 parts by mass, respectively, relative to 100 parts by mass of the polyester resin (A).12-23-2010
20100331453Waterborne Polymeric Dispersions - A polymeric composition for making aqueous polymeric dispersions, comprises hydrophilic macromonomer (I), hydrophobic polymer (II) and bridging monomer (III), wherein the hydrophilic macromonomer (I) and hydrophobic polymer (II) are grafted together in the presence of bridging monomer (III) and the hydrophilic macromonomer (I) has a structure according to formula (1): R—C(X)═CH12-30-2010
20110009527THERMOSETTING COMPOSITIONS COMPRISING SILICONE POLYETHERS, THEIR MANUFACTURE, AND USES - Thermosetting compositions comprising a) at least a first thermosetting resin, b) at least one silicone polyether, and c) at least one filler or fibrous reinforcement, methods of making such thermosetting compositions, and thermoset products made from the compositions.01-13-2011
20110034591Thermosetting Resin Containing Irradiated Thermoplastic Toughening Agent - Thermosetting resins are provided that are toughened with an irradiated thermoplastic toughening agent and which have reduced levels of solvent-induced micro crack formation. The thermoplastic toughening agent is treated with a sufficient amount of high-energy radiation (e.g. electron beam or gamma rays) to cause a reduction in solvent-induced micro crack formation in the cured resin when compared to the same toughened thermosetting resin in which the non-irradiated version of the thermoplastic toughening agent is used.02-10-2011
20110039980Solvent-Promoted Self-Healing Materials - A composite material includes a solid polymer matrix, a plurality of capsules and a liquid, in the capsules. The liquid includes from 50 to 100 wt % of a solvent, and from 0 to 50 wt % of a polymerizer. There is no polymerizer outside of the capsules. The solid polymer matrix may include a native activating moiety for the polymerizer. The solvent may have a swelling ratio with the solid polymer matrix of at least 1.1 and/or may have a polarity ET of from 0.10 to 0.50. A composite material includes a solid polymer matrix, a plurality of capsules and a liquid, in the capsules. The liquid includes from 50 to 100 wt % of a solvent, and from 0 to 50 wt % of a polymerizer. There is no polymerizer outside of the capsules. The solid polymer matrix may include a native activating moiety for the polymerizer. The solvent may have a swelling ratio with the solid polymer matrix of at least 1.1 and/or may have a polarity ET of from 0.10 to 0.50.02-17-2011
20110039981EPOXY RESINS DERIVED FROM NON-SEED OIL BASED ALKANOLAMIDES AND A PROCESS FOR PREPARING THE SAME - An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one non-seed oil based alkanolamide; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.02-17-2011
20110039982EPOXY RESINS AND PROCESSES FOR PREPARING THE SAME - Epoxy resins comprising a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety and processes for preparing the epoxy resins. The process of preparation of the epoxy resins comprises reacting (a) a mixture of a cis-1,3-cyclohexanedimethanol, a trans-1,3-cyclohexanedimethanol, a cis-1,4-cyclohexanedimethanol, and a trans-1,4-cyclohexanedimethanol, (b) an epihalohydrin, (c) a basic acting substance, (d) optionally, a solvent, (e) optionally, a catalyst, and/or (f) optionally, a dehydrating agent. The process may be a slurry epoxidation process, an anhydrous epoxidation process, or a Lewis acid catalyzed coupling and epoxidation process.02-17-2011
20110046265New and novel engineering resin thermoplastic silicone vulcanizates - A method for preparing a modified thermoplastic resin by mixing a thermoplastic resin having a t02-24-2011
20110046266EPOXY RESIN REACTIVE DILUENT COMPOSITIONS - An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.02-24-2011
20110054073CURABLE COMPOSITION AND USE THEREOF - This invention relates to a curable composition comprising one or more of organic metal compounds as resin bleed-out controller and its application in semiconductor packages. Particularly, the organic metal compound is an organic titanate. In some embodiments, the organic titanates include, but are not limited to tetraalkyl titanates and titanate chelates. The composition shows excellent performance in bleeding-out control and thus can reduce the occurrence of failure, such as die top delamination, in semiconductor packages.03-03-2011
20110054074ADHESIVE - The present invention relates to an adhesive comprising at least one matrix material and core/shell particles comprising cores having a diameter in the range from 1 nm to 1 μm with a shell comprising oligomers and/or polymers, and to a process for the preparation thereof.03-03-2011
20110054075Dispersants From Linear Polyurethanes - The present invention provides a non-aqueous composition containing a particulate solid, an organic medium and polyurethane dispersant with a substantially linear anchoring segment pendant tertiary amine group(s) from said anchoring segment and terminally attached solvent-solubilising terminal chains of a polyester, polyether, or polyacrylate including mixtures of such terminal chains.03-03-2011
20110060076EPOXY RESINS DERIVED FROM SEED OIL BASED ALKANOLAMIDES AND A PROCESS FOR PREPARING THE SAME - An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one seed oil based alkanolamide; wherein the seed oil based alkanolamide is derived from the reaction of (i) at least one of a fatty acid ester, a fatty acid and a fatty acid triglyceride; and (ii) at least one alkanolamine; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.03-10-2011
20110065836POLYCOSANOL-BASED ASSOCIATIVE MONOMERS, CORRESPONDING ASSOCIATIVE THICKENING AGENTS AND THEIR USES - The present invention relates to new associative monomers, terminated by a hydrophobic chain with a base of polycosanols, which can be bio-resourced raw materials, and notably of octacosanol. It also concerns the HASE-type associative copolymers manufactured from these monomers, from (meth)acrylic acid and from an ester of one of these acids. The invention also concerns the use of these copolymers as thickening agents for water-based formulations.03-17-2011
20110077328USE OF FILLER THAT UNDERGOES ENDOTHERMIC PHASE TRANSITION TO LOWER THE REACTION EXOTHERM OF EPOXY BASED COMPOSITIONS - Disclosed are curable epoxy-based resins having a lower peak exotherm during cure, as well as thermoset resins and epoxy-based parts formed from the curable epoxy-based compositions. The epoxy-based compositions having a lower peak exotherm during cure may include: at least one epoxy resin, at least one hardener, and at least one endothermic transition additive. The thermoset resin may include the reaction product of the curable epoxy-based resins having a lower peak exotherm during cure, which may be useful when forming large epoxy-based parts, such as those including 200 grams or more of the thermoset resin. Also disclosed is a process for forming curable epoxy-based resins having a lower peak exotherm during cure, including: admixing at least one epoxy resin; at least one hardener; and at least one endothermic transition additive; to form a curable composition. The resulting curable composition may then be thermally cured at a temperature of at least 60° C. to form a thermoset resin.03-31-2011
20110082237Liquid crystal alignment agent, liquid crystal alignment film formed therefrom, and liquid crystal display element provided with the liquid crystal alignment film - The present invention provides a liquid crystal alignment agent and a liquid crystal alignment film formed therefrom, as well as a liquid crystal display element provided with the liquid crystal alignment film. More specifically, the present invention provides a liquid crystal alignment agent and liquid crystal alignment film formed therefrom, as well as a liquid crystal display element provided with the liquid crystal alignment film without image sticking problems and having superior voltage holding ratio. The liquid crystal alignment agent includes: a polymer (A) obtained from a reaction between tetracarboxylic dianhydride compound and diamine compounds, an epoxy compound (B), and an organic solvent (C). Wherein the liquid crystal alignment agent is coated on a glass substrate, and heated for 15 minutes at 220° C. to forth a hard coating film. The hard coating film is extracted for 72 hours by using acetone at 60° C. to obtain an extract, an epoxy value on the extract is designated O, and based on 100 parts by weight of the solid content of the liquid crystal alignment agent, the parts by weight of the epoxy compound (B) is designated W, the O and W conform to the following equation:04-07-2011
20110082238JETTABLE COMPOSITIONS - A fully curable jettable composition having a viscosity less than 30 cps at a temperature within the range of 15° C.-180° C. comprising (i) at least one low viscosity reactive resin; (ii) at least one higher viscosity resin having a viscosity greater than twice that of the low viscosity resin and a functionality of greater than or equal to 2; (iii) at least one curable toughener, (iv) at least one initiator for the polymerisation of the resins, and (v) at least one stabiliser for delaying the curing of the resins of the composition. The composition can be jetted from piezo electric printing heads under the control of a computer program to form a multi-layered article, for example, a three dimensional article, in which the adjacent droplets merge and are cured homogeneously together.04-07-2011
20110086946INK COMPOSITION FOR FORMING INSULATING FILM AND INSULATING FILM FORMED FROM THE INK COMPOSITION - An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3×1004-14-2011
20110098380POLYPHENOLIC COMPOUNDS AND EPOXY RESINS COMPRISING CYCLOALIPHATIC MOIETIES AND PROCESS FOR THE PRODUCTION THEREOF - Epoxy resins and mixtures of polyphenolic compounds which comprise cycloaliphatic moieties, processes for the production thereof and mixtures and cured products which comprise these resins and/or mixtures.04-28-2011
20110118385PROCESS FOR PREPARING SELF-HEALING COMPOSITE MATERIALS OF HIGH EFFICIENCY FOR STRUCTURAL APPLICATIONS - A process is for preparing a self-healing composite material including a matrix of epoxy polymer in which a catalyst of ring opening metathesis reaction and vessels containing at least one monomer able to polymerize due to a ring opening metathesis reaction are dispersed. The process includes the preliminary step of dispersing at molecular level the catalyst in a mixture containing at least one precursor of the epoxy polymer, and then the steps of dispersing, in the mixture, the vessels and a tertiary amine acting as curing agent of the precursor, and the step of curing the mixture by at least a first heating stage performed at a temperature between 70 and 90° C. for a time between 1 and 5 hours, and a second heating stage performed at a temperature between 90 and 170° C. for a time between 2 and 3 hours.05-19-2011
20110118386Prepreg Containing Epoxy Resin With Improved Flexural Properties - Prepreg that contains epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4′-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.05-19-2011
20110136940Coating Compositions for Containers and Methods of Coating - This invention provides a coating composition for use on a food-contact surface of a container (e.g., a food or beverage can) that includes a polymer having one or more segments of Formula I:06-09-2011
20110152407Novel diamino-alcohol compounds, their manufacture and use in epoxy resins - A new class of compounds, namely diamino alcohols, is described, along with a process for their production and their use as hardeners, or curing agents, for epoxy resin systems, some of which have high glass transition temperatures, Tgs, such as greater than about 120° C.06-23-2011
20110160341COMPOSITION FOR FIXING WOUND ITEMS - The invention provides a composition for fixing wound items comprising at least one α,β-unsaturated polyester, and at least two different monomeric or oligomeric ethylenically unsaturated components. The composition of the present invention provides a composition having low curing emissions, low viscosities and excellent impregnation properties. After curing, these impregnation materials show high mechanical toughness levels even at elevated temperatures.06-30-2011
20110166258RESIN COMPOSITION FOR NO-FLOW UNDERFILL, NO-FLOW UNDERFILL FLIM USING THE SAME AND MANUFACTURING METHOD THEREOF - Disclosed herein are a resin composition for no-flow underfill, which can be formed into a film, a no-flow underfill film formed from the composition and a manufacturing method of the no-flow underfill film. The resin composition for no-flow underfill has a viscosity higher than 500 cps which is suitable for coating on a film. Thus, the no-flow underfill composition can be manufactured into a laminatable film type without any additional additive. Accordingly, the resin composition makes it possible to accurately control the thickness and area of underfill, unlike the prior paste type composition.07-07-2011
20110172330POLYPROPYLENE OXIDE-CONTAINING POLYETHERS AND MIXTURES THEREOF WITH POLY(METH)ACRYLATES AS POWDER COATING LEVELING AGENTS - The invention relates to powder coating leveling agents comprising (a) at least one polypropylene oxide-containing polyether having a weight-average molecular weight of more than 1000 g/mol and a polypropylene oxide fraction of more than 75% by weight, and optionally (b) at least one poly(meth)acrylate. The invention further relates to the preparation of such leveling agents and to their use in powder coating materials, and also to powder coating materials comprising the leveling agents.07-14-2011
20110190418Cationic Polymerization Ink - A cationic polymerization ink that can be hardened by cationic polymerization, includes monomers. The monomers include an epoxy monomer having an epoxy group as a functional group and an oxetane monomer having an oxetane group as the functional group. The monomers include a monofunctional monomer having one functional group and a polyfunctional monomer having at least two functional groups. A total functional group equivalent weight, which is a total of a functional group equivalent weight of the monofunctional monomer and a functional group equivalent weight of the polyfunctional monomer, is not less than 130 and not greater than 144. A ratio of the functional group equivalent weight of the polyfunctional monomer to the total functional group equivalent weight is not less than 23 percent and not greater than 38 percent.08-04-2011
20110190419BLENDS COMPRISING EPOXY RESINS AND MIXTURES OF AMINES WITH GUANIDINE DERIVATIVES - The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.08-04-2011
20110196067WATER/OIL REPELLENT COMPOSITION AND METHOD FOR ITS PRODUCTION - To provide a water/oil repellent composition which is capable of imparting sufficient dynamic water repellency and post-air-drying water repellency to the surface of an article and which presents a low environmental impact, and a method for its production.08-11-2011
20110201724Phosphorous-Containing Flame Retardant Epoxy Resin Composition, Prepreg and Laminate Thereof - There is provided herein a curable epoxy resin composition comprising at least one curable epoxy resin, at least one flame retardant curing agent, and at least one curing catalyst.08-18-2011
20110213052Method for Producing Dialkylphosphinic Acids and Esters and Salts Thereof by Means of Acrylic Acid Derivatives and Use Thereof - The invention relates to a method for producing mono-carboxyfunctionalized dialkylphosphinic acids and esters and salts thereof, characterized in that a) a phosphinic acid source (I) is reacted with olefins (IV) to yield an alkylphosphonic acid, salt or ester (II) thereof in the presence of a catalyst A, b) the alkylphosphonic acid thus obtained, salt or ester (II) thereof is reacted with an α,β-unsaturated carboxylic acid derivative (V) to yield a mono-carboxyfunctionalized dialkylphosphinic acid derivative (III) in the presence of a catalyst B, wherein R09-01-2011
20110218270USE OF LINEAR TRIETHYLENTETRAMINE AS CURING AGENT FOR EPOXY RESINS - The present invention relates to an amine composition comprising linear triethylene-tetramine and one or more amine compounds selected from the group consisting of tertiary amines derived from the condensation of ethylenediamine and methyl-substituted compounds derived from linear triethylenetetramine as well as a method of production for said composition.09-08-2011
20110224328METHOD OF MAKING A CYCLIC GUANIDINE FROM A GUANIDINIUM SALT AND A WEAK ACID AND COATING COMPOSITIONS CONTAINING THE SAME - The present invention is directed to a method for preparing a cyclic guanidine comprising reacting (i) a guanidinium, (ii) a polyamine, and (iii) a weak acid. The present invention is also directed to a coating composition comprising the cyclic guanidine.09-15-2011
20110245375CURABLE COMPOSITION COMPRISING A THERMOLATENT BASE - The present invention relates to curable compositions comprising a thermolatent amidine base and an organic material which is polymerisable or crosslinkable with a basic or nucleophilic catalyst. In particular, the invention relates to curable coating compositions, especially powder coating compositions, and curable adhesive compositions, as well as to the use a thermo-latent amidine base as a curing catalyst for thermally induced base- catalyzed polymerisation or crosslinking reactions.10-06-2011
20110245376NANOCALCITE COMPOSITES - Compositions comprising surface-modified nanocalcite particles dispersed in a curable resin, and to coatings and fibrous composites incorporating such compositions are described. The surface-modifying agents include a binding group ionically associated with the calcite and a compatiblizing segment, compatible with the curable resin. The surface-modifying agent may also include a reactive group capable of reacting with the curable resin. Methods of preparing nanocalcite composites and coating a fibrous composites prepared from such nanocalcite composites are also described.10-06-2011
20110257296TUNABLE POLYMER COMPOSITIONS - The present invention provides polymer compositions having a tunable decomposition temperature. Suitable additives are disclosed for lowering the decomposition temperature of polymer compositions. The invention further provides methods of preparing such polymer compositions with tunable decomposition temperatures.10-20-2011
20110275739EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN - An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).11-10-2011
20110281972POWDER COATING COMPOSITIONS FOR LOW TEMPERATURE CURING AND HIGH FLOW - The present invention relates to powder coating compositions and to components and ingredients for incorporation therein, suitable for low temperature curing schedule and with excellent resistance to outside aging. The powder coating composition can be cured at a temperature from 140° C. to lead to a coating with excellent flow and high gloss.11-17-2011
20110288202HEAT-CURING POWDER-LACQUER COMPOSITIONS YIELDING A MATTE SURFACE AFTER CURING OF THE COATING, AS WELL AS A SIMPLE METHOD FOR PRODUCTION OF SAME - The invention relates to heat-curing powder-lacquer compositions exhibiting a matte surface after curing of the coating, as well as to a simple method for production of the same.11-24-2011
20110288203FIRE RESISTANT MATERIAL AND FORMULATION THEREOF - The invention provides a fire resistant material and a formulation thereof. The formulation comprises a liquid suspension of a modified inorganic particle and an organic component. The modified inorganic particle comprises an inorganic particle with hydroxyl groups and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The organic component comprises a monomer, oligomer, prepolymer, polymer, or combinations thereof, capable of reacting with the ethylenically unsaturated end group.11-24-2011
20110294918ANTI-CORROSIVE PAINTINGS AND COATINGS CONTAINING NANOPARTICLES - The present invention refers to a formulation for anticorrosion paints and coatings, based on epoxy, polyurethane, acrylic, alkylic, polyester resins and mixtures thereof, dissolved in organic or inorganic solvent and comprising a multitude of mostly bi-dimensionally developed nanoparticles, with a few hundred and about one nanometer, respectively, as to lateral dimensions and thickness, wherein the viscosity of the formulation is lower than 55000 mPa·s.12-01-2011
20110306702USE OF CYCLIC CARBONATES IN EPOXY RESIN COMPOSITIONS - The present invention relates to the use of cyclic carbonates of the formula I or a mixture thereof in epoxy resin compositions and also to epoxy resin compositions which comprise such cyclic carbonates.12-15-2011
20110306703THERMALLY CURABLE SOLDER RESIST COMPOSITION - A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R12-15-2011
20110313080BENZOXAZINE RESIN COMPOSITION - The invention provides a benzoxazine resin composition having excellent resistance to heat and moisture and providing excellent handleability when made into prepreg, and prepreg and a fiber-reinforced composite material prepared from the composition. The composition contains (A) a compound having in its molecule a benzoxazine ring represented by the formula (1), (B) an epoxy resin, (C) a curing agent, and (D) a toughness improver:12-22-2011
20120022183EPOXIDE (METH) ACRYLATE COMPOSITION - The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.01-26-2012
20120035298POLYHYDROXY-DIAMINES AS MULTI-FUNCTIONAL ADDITIVES FOR PAINTS, COATINGS AND EPOXIES - Provided are polyhydroxy-diamine compounds of the formula I: or salt thereof, wherein R02-09-2012
20120041101CATALYSIS OF EPOXY RESIN FORMULATIONS - The present invention relates to epoxy resin formulations comprising a specific catalyst mixture for enhancing the reactivity thereof.02-16-2012
20120046388Liquid Monobenzoxazine Based Resin System - The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.02-23-2012
20120046389High pH Process Resistant Coating For Metal Food Containers - Disclosed is an improved coating composition for food containers that is resistant to high pH processing environments. The improved coating composition is based upon an epoxy-amino resin coating composition that has been modified with other components to improve its performance in high pH environments balanced with flexibility, formability and abrasion resistance. Typically, the coating composition includes an epoxy resin, an amino resin cross-linking agent, a blocked polyisocyanate and a saturated polyester.02-23-2012
20120077903EPOXY RESIN-BASED COATING COMPOSITION - The present invention relates to epoxy resin coating composition which comprises, at least, epoxy resin, a thiol-type curing agent and a curing assistant, being composed of two liquids of liquid (A) containing epoxy resin and a thiol-type curing agent and liquid (B) containing a curing assistant, which liquids are mixed just before using, wherein the thiol-type curing agent contains a branched compound containing a thiol group (P), which compound is an ester of polyhydric alcohol with thiol group-containing carboxylic acid represented by formula (1)03-29-2012
20120083551MODIFIED EPOXIDE PRIMERS - Telechelic resins with reactive end groups (e.g., epoxy phosphate and epoxy ester) were synthesized using bisphenol-A (BPA) epoxide. The bisphenol-A based epoxide and the telechelic resins were all modified with tetraethylorthosilicate (TEOS) oligomers to produce epoxide/polysilicate (organic/inorganic) hybrid systems. The modified epoxides were thermally cured with a melamine-formaldehyde resin, cast on steel substrates and salt spray analysis revealed that the inorganically modified epoxides provided improvement over unmodified epoxide resins with respect to both corrosion resistance and adhesion to steel substrates.04-05-2012
20120108699Composite Compositions - In one embodiment, the present invention provides an uncured composite composition. The uncured composite composition includes an uncured resin and a triaxial braid. The triaxial braid includes a longitudinal axis, a first bias fiber extending in a first bias direction at a first bias angle to the longitudinal axis, a second bias fiber extending in a second bias direction at a second bias angle to the longitudinal axis, and an axial fiber extending in a direction parallel to the longitudinal axis; wherein the first bias fiber, the second bias fiber, and the axial fiber have a substantially same tow size, and the tow size is in a range of from about 1 k to about 11 k. A cured composite and a method of making the cured composite are also provided.05-03-2012
20120108700AIR-DRYING POLYESTER (METH)ACRYLATE RESIN COMPOSITION, STRUCTURE, AND METHOD FOR APPLYING THE RESIN COMPOSITION - An object of the present invention is to provide an air-drying polyester (meth)acrylate resin composition in a curing system of a ketone peroxide curing agent and a cobalt-based curing accelerator, the resin composition being used as a topcoat in the field of civil engineering and construction, and having such good properties as, when coated or stacked, being capable of forming a cured coating film with no bubbles remaining therein due to non-bubbling properties of suppressing the generation of bubbles in the course of the curing reaction and being free from problems related to room-temperature curability such as a retarded gelation time, even after being stored for about one month; a structure coated with the resin composition; and a method for applying the resin composition.05-03-2012
20120108701COMPOSITION OF A BLEND OF POLYAMIDE AND POLYESTER RESINS - A resin blend composition of a polyamide resin and a polyester resin is described, which includes a polyamide resin, a polyester resin and an epoxy resin. The resin blend composition can have improved compatibility between the polyamide resin and the thermoplastic polyester resin, and therefore mechanical properties (strength, bending strength, elasticity, abrasion resistance, impact strength), chemical properties (solvent resistance), thermal resistance, dimensional stability, and paintability.05-03-2012
20120108702PROCESS FOR THE PREPARATION OF RADIATION CURABLE COMPOSITIONS - The present invention relates to a process for the preparation of radiation curable compositions comprising at least one radiation curable (meth)acrylic copolymer A and at least one (meth)acrylated epoxy compound B, said process comprising:—the preparation of a copolymer P by copolymerization of monomers comprising: (i) from 0.1 to 50 mole % of at least one epoxy (meth)acrylate (a1), and (ii) from 50 to 99.9 mole % of at least one other copolymerizable monomer (m) different from (a1) in the presence of at least one non-copolymerizable epoxy compound (b1) and—further reacting copolymer P thereby obtained and the non-copolymerizable epoxy compound (b1) with at least one carboxylic (meth)acrylate (a3).05-03-2012
20120115985PROCESS FOR FORMING A HYDROPHILIC COATING AND HYDROPHILIC COATING, AND PROCESS FOR FORMING AN INK JET RECORDING HEAD AND INK JET RECORDING HEAD - A process for forming a hydrophilic coating, including (1) forming, on a substrate, coating resin layer including a cationic polymerization resin having an acid-cleavable linkage in its main chain, and a photoacid generator which generates antimonic acid or an acid having a weaker acid strength than that of antimonic acid by irradiation with active energy ray including ultraviolet light; (2) laminating, on the resin layer, a photoacid generator holding layer including a photoacid generator which generates an acid having a stronger acid strength than that of antimonic acid by irradiation with the energy ray, and a holder which holds the photoacid generator and can be removed in step (3); (3) removing the holding layer and curing the resin layer through exposure of those layers to the energy ray to conduct development; and (4) forming a hydrophilic coating by hydrophilizing a surface of the resin layer through heat treatment thereof.05-10-2012
20120115986AMINE FUNCTIONAL ADDUCTS AND CURABLE COMPOSITIONS COMPRISING SAME - A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises: 05-10-2012
20120115987RADIATION CURABLE COMPOSITIONS - The invention relates to radiation curable compositions comprising at least one radiation curable (meth)acrylic copolymer A prepared by reacting a copolymer P obtained from copolymerizing monomers comprising (i) from 10 to 50 mole % of at least one (meth)acrylate (a1) comprising a first functional group, and (ii) from 50 to 90 mole % of at least one alkyl(meth)acrylate (a2) having at least 6 carbon atoms in the alkyl chain, with at least one (meth)acrylate (a3) comprising a second functional group which can react with the first functional group of (meth)acrylate (a1), said radiation curable (meth)acrylic copolymer A having a number average molecular weight Mn of 1000 to 23000, and their use for making inks, varnishes, adhesives and coatings.05-10-2012
20120115988CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS - The present invention relates to epoxy resin formulations having a specific sparingly soluble catalyst mixture for enhancing reactivity.05-10-2012
20120123023(METH)ACRYLATE POLYMER, A RESIN COMPOSITION AND A SHAPED ARTICLE - Disclosed is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 μm, a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below, a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass of more.05-17-2012
20120123024AMINE FUNCTIONAL ADDUCTS AND CURABLE COMPOSITIONS COMPRISING SAME - A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises a first component which comprises a first amine functional adduct and a second amine functional adduct; and a second component which comprises at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.05-17-2012
20120129976Polyoxymethylene Polymer Compositions Having Improved Creep - Processes of making articles of a melt mixed polyoxymethylene composition comprising polyoxymethylene polymer and polyoxymethylene terpolymer in which the melt mixed composition is maintained above the crystallization temperature of the polyoxymethylene polymer. Such processes impart improved creep resistance compared to that of articles made of the same melt mixed composition but which has been cooled below crystallization temperature of the polyoxymethylene polymer during manufacture. These articles are useful for making plastic gears having high heat resistance.05-24-2012
20120129977COLOR POWDER FOR COATING - A method for producing a color powder, the method comprising dry mixing a pigment powder with a base powder while applying heat, so as to bring the base powder to an adhesive state while the pigment powder remains in a stable state, thereby forming a color powder having agglomerates essentially each comprising a component of the base powder and a component of the ground pigment powder.05-24-2012
20120136092THERMOSETTABLE RESIN COMPOSITIONS - A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior.05-31-2012
20120136093INTERCALATION AGENT FREE COMPOSITIONS USEFUL TO MAKE NANOCOMPOSITE POLYMERS - A two step method for preparing a filler composition, the filler composition useful to prepare a nanocomposite polymer and an epoxy nanocomposite coating. First, disperse a water dispersible filler material in a liquid comprising water, but without any added intercalation agent, to form a dispersion. Second, replace at least a portion of the water of the liquid with an organic solvent so that the water concentration of the liquid is less than six percent by weight to form the filler composition, the average size of at least one dimension of the filler material being less than two hundred nanometers upon examination by transmission electron microscopy of a representative freeze dried sample of the dispersion of the first step. A nanocomposite polymer can be prepared by mixing the filler composition with one or more polymer, polymer component, monomer or prepolymer to produce a polymer containing the filler composition.05-31-2012
20120142816Novel epoxy hardeners with improved cure and polymers with enhanced coating properties - A hardener composition for epoxy resins, the hardener composition including a mixture of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane. A prepolymer hardener composition for epoxy resins, the prepolymer hardener composition comprising the reaction product of an epoxy with a mixture of 1,3-bis(aminomethyl)cyclohexane; and 1,4-bis(aminomethyl)cyclohexane.06-07-2012
20120142817ONE COMPONENT EPOXY STRUCTURAL ADHESIVE COMPOSITION PREPARED FROM RENEWABLE RESOURCES - Curable, one-package, stable adhesive compositions are provided comprising: 06-07-2012
20120142818WATERBORNE, RADIATION-CURABLE COATING COMPOSITIONS AND RELATED METHODS - Disclosed are waterborne, radiation-curable coating compositions. These coating compositions include a water-dispersible polymer and a hydrophobic multi-functional ethylenically unsaturated compound. The compositions are characterized by being viscosity stable at elevated temperatures and alkaline conditions.06-07-2012
20120149803AUTOXIDISABLE AQUEOUS COATING COMPOSTIONS - An autoxidisable aqueous varnish composition comprising: a) film forming polymer latex binder system comprising, on a non-vol basis, i) 40-60 wt % soft autoxidisable polymer particles of Fox Tg less than 5° C., ii) 60-40 wt % hard polymer particles of Fox Tg at least 40° C. wherein the soft autoxidisable polymer particles comprise at least 60 wt % gel b) a carrier liquid comprising at least 50 wt % water and an amount of a volatile organic material of from 0 to 2 wt % when calculated on the total liquid varnish composition, c) optionally pigment at a pigment to binder weight ratio up to 0.05:1 calculated on a non-vol basis.06-14-2012
20120157572CURABLE COMPOSITION COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT - Disclosed are curable epoxy compositions comprising imidazolium monocarboxylate salts as curing catalysts and method for curing same. The imidazolium monocarboxylate salt is suitable for use as latent catalysts that effect curing upon heating to a curing temperature threshold. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards. Of particular utility are curable compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts.06-21-2012
20120157573MOLDED PRODUCT PRODUCTION DEVICE, MOLDED PRODUCT PRODUCTION METHOD, AND MOLDED PRODUCT - A molded product production device that includes a molding die having an inner circumferential surface defining a cavity with upper and lower openings, the cavity into which the molding material is to be filled, a lower punch provided so as to be inserted into the cavity from the lower opening thereof and vertically move, the lower punch having a lower punch surface and a lower punch release agent holding portion which is provided at a lower side of the lower punch surface and capable of holding a release agent, an upper punch provided so as to be inserted into the cavity from the upper opening thereof and vertically move, the upper punch having an upper punch surface, and a lower punch release agent supply means which supplies the release agent to the lower punch release agent holding portion when being exposed outside the cavity.06-21-2012
20120165428Polymer for Extending the Open Time of Waterborne Architectural Coatings - The present invention relates to water soluble open time extenders, which are mixed with an architectural coating, such as aqueous latex paints, to increase the coating's open time and crosslink to the architectural coating upon drying. The open time extender comprises neutralized water soluble polymers with hydrophobic, hydrophilic and cross-linkable monomers, and at least one crosslinking agent. The open time extender also comprises water and the total solid content of the open time extender is less than about 25% by weight.06-28-2012
20120165429NOVEL METHODS FOR PRODUCING THERMOSETTING EPOXY RESINS - The present application relates to a method for preparing epoxy resins from a mixture of epoxidized phenolic compounds, wherein said epoxidized phenolic compounds are obtained by the epoxidation of natural phenolic compounds selected from the group comprising simple phenol, acid-phenol, coumarin, naphthoquinone, stillbenoid, flavonoid, isoflavanoid, anthocyanin, condensed tannin and hydrolyzable tannin.06-28-2012
20120165430NON-AQUEOUS DISPERSIONS COMPRISING A NONLINEAR ACRYLIC STABILIZER - A non-aqueous dispersion comprising the dispersion polymerization reaction product of an ethylenically unsaturated monomer and a nonlinear, random acrylic polymer stabilizer wherein the polymerization reaction product comprises epoxy functionality is disclosed. Related coatings, methods, and substrates are also disclosed.06-28-2012
20120178851RESIN WITH HIGH HEAT TRANSFER - A resin with high heat transfer and potential is specially designed to transfer heat between two layers of different nature. One of the layers acts as an energy receiver via the outer face thereof and an energy emitter via the inner face thereof, and the other layer acts as a receiver of the accumulated energy in the resin, acting as connecting bridge between the two layers. The resin with high heat transfer of the invention includes granular particles of slate and preferably granular particles of a metallic nature, in a polymeric matrix.07-12-2012
20120178852PROCESS FOR PREPARING EPISULFIDE RESINS - A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.07-12-2012
20120184644Biaxially stretched polyester film which comprises a chain extender, and process for production thereof and use thereof - The invention relates to biaxially oriented polyester films that include a chain extender in addition to the polyester. Such films find use in all applications typical of biaxially oriented polyester films, especially in outdoor films, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.07-19-2012
20120190773COMPOSITE SURFACING FILM WITH ULTRAVIOLET LIGHT AND ABRASION RESISTANCE - The present invention is a one-part ultraviolet light and abrasion resistant pigmented surfacing film composition adapted for co-curing with an amine cured composite prepreg material using a chain extended base cycloaliphatic epoxy resin. The chain extended cycloaliphatic epoxy resin is formed through the pre-reaction of a base cycloaliphatic epoxy resin with a chain extension agent such as bisphenol and a high molecular weight elastomer in the presence of triphenyl phosphine to chain link the base cycloaliphatic epoxy resin to form a film formable cycloaliphatic resin prereact capable of low temperature curing when added to a latent amine based epoxy curing agent; an amine catalyst; at least one filler; at least one pigment; and a flow control agent to form surfacing film composition. The surfacing film composition adapted for co-curing with an amine curable composite from about 180° F. to about 350° F.07-26-2012
20120202920COATING COMPOSITIONS CONTAINING TETRAMETHYL CYCLOBUTANEDIOL - Disclosed are solvent borne thermosetting coating compositions that contain a curable polyester resin blended with an acrylic copolymer, a crosslinker, and a solvent. The polyester resin contains 2,2,4,4-tetramethyl-1,3-cyclobutanediol and exhibits good dry time, compatibility with acrylic resins, sag resistance and hardness development in a coating composition. The coating compositions can be used to prepare clear coat or pigmented coatings for automotive OEM, auto refinish, and other applications.08-09-2012
20120208924EPOXY RESIN COMPOSITION - An exemplary curable epoxy resin composition is disclosed which includes at least an epoxy resin component and a hardener component, and optionally further additives, wherein (a) at least a part of the hardener component is a chemically modified polycarbonic acid anhydride; (b) an optional glycol or polyglycol; (c) or a compound containing two carboxylic groups is included; and (d) the chemically modified acid anhydride hardener is present in an amount comprising at least 10% of reactive hardening groups calculated to all the reactive hardening groups contained in the total amount of hardener component present in the epoxy resin composition.08-16-2012
20120208925USE OF GUANIDINE DERIVATIVES AS CURING ACCELERATORS FOR EPOXY RESINS - The present invention describes guanidine derivatives of the general formula (I)08-16-2012
20120214905PROCESS OF RECYCLING POWDER COAT MATERIAL AND COMPONENT MADE THEREOF - A process for making a solid component out of recycled powder coat is provided. The process can include providing a powder coat material and providing a second material. Thereafter, the powder coat and the second material are mixed to produce a powder coat-second material mixture. The powder coal-second material mixture is processed in order to produce a polymer containing precursor. The processing can include granulating or densifying the powder coat-second material mixture. After the precursor has been produced, it can be placed within a molding machine and a solid component is molded. The molding machine can be an injection molding machine, an extrusion molding machine or a blow molding machine.08-23-2012
20120238666Direct-To-Metal and Exterior Durable Non-Skid Coating - A non-skid coating described herein attempts to overcome the deficiencies of the conventional coatings with improved external durability and color retention, a reduced level of VOCs, and direct-to-metal (DTM) adhesion using organo-siloxane chemistry. The non-skid coating has a first component having an amino-functional siloxane resin; a second component having a non-aromatic epoxy resin; a spherical filler for lowering viscosity; a pigment; a coarse aggregate; and a thixotropic agent. The amino-functional siloxane resin can be an amino-functional methyl phenyl polysiloxane, diphenyl polysiloxane or silsesquioxane-based resin. The non-aromatic epoxy resin can be cycloaliphatic or aliphatic. The first component is about 09-20-2012
20120238667CHIPPING-RESISTANT COATING COMPOSITION - The present invention provides a chipping-resistant coating composition including a hydroxyl group-containing urethane resin (A) obtained by reacting a polyol component (a) composed of a cyclic polyol compound (a1) having a nurate structure and another polyol compound (a2) with a polyisocyanate compound (b), and a curing agent (B). This chipping-resistant coating composition is capable of forming a coated film excellent in chipping resistance and water resistance. Furthermore, the present invention also provides an article coated with the chipping-resistant coating composition.09-20-2012
20120245252OXAZOLIDONE RING CONTAINING ADDUCTS - Embodiments include oxazolidone ring containing adducts obtainable by combining an aliphatic epoxy compound, an aromatic epoxy compound, and a diisocyanate. Embodiments further include a curable powder coating composition including a resin component and a hardener component, where the resin component includes the oxazolidone ring containing adduct.09-27-2012
20120252930RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF - The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.10-04-2012
20120259039RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF - The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.10-11-2012
20120259040CURABLE COMPOSITIONS - Embodiments include curable compositions including a resin component and a hardener component. The resin component can include an epoxy compound that is selected from the group consisting of aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and combinations thereof, and a reactive diluent that includes a polymeric glycidyl ether. The hardener component can include an adduct and a Mannich base.10-11-2012
20120270967LOW-VISCOSITY EPOXY RESIN COMPOSITION WITH LOW BLUSHING - A two-component epoxy resin composition, including: a resin component which includes at least one epoxy resin and at least one aldehyde, and a hardener component which includes at least one polyamine having at least one primary amino group.10-25-2012
20120283356THERMOSETTABLE RESIN COMPOSITIONS - A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior.11-08-2012
20120283357CURABLE PHOSPHORUS-CONTAINING FLAME RETARDANT EPOXY RESIN - This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.11-08-2012
20120289624COMPOSITE COMPOSITIONS - A curable resin composition for composites and electrical laminates including (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material; wherein the composite or electrical laminate has a balance of properties including a combination of (a) a Tg of at least about 150° C.; and (b) a water uptake of less than about 2.5 wt %.11-15-2012
20120296010ENCAPSULATING SHEET AND ELECTRONIC DEVICE - An encapsulating sheet is obtained by subjecting a kneaded material to plastic working, the kneaded material including an epoxy resin represented by General Formula (1) below, a curing agent, and an inorganic filler,11-22-2012
20120296011PHENOLIC COMPOUND, EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, AND CURED PRODUCT THEREOF - A phenolic compound which can be obtained by reacting the compound of the formula (1):11-22-2012
20120316262NOVEL CURING AGENTS - The invention relates to a resin curing agent having the formula (I), wherein R12-13-2012
20120322915PARTICLE PRODUCTION APPARATUS, PARTICLE PRODUCTION METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION - A particle production apparatus 12-20-2012
20130005852Epoxy Functional Polystyrene for Enhanced PLA Miscibility - Polystyrene blends and methods of making polystyrene blends including combining a styrene monomer and an epoxy-functional comonomer to form a combined mixture, subjecting the combined mixture to polymerization to obtain a polystyrene copolymer and combining the polystyrene copolymer with a biodegradable polymer to obtain a polystyrene blend.01-03-2013
20130005853CURABLE EPOXY RESIN SYSTEMS CONTAINING MIXTURES OF AMINE HARDENERS AND AN EXCESS OF EPOXIDE GROUPS - Fiber reinforced epoxy resin composites are produced using a specific epoxy resin system. The epoxy resin system contains at least one polyglycidyl ether of a polyphenol. The system also contains a hardener that contains a mixture of aminocyclohexanealkylamine and polyalkylene polyamine hardeners. The ratio of epoxy resin groups to amine hydrogen groups is from 1.05 to 1.50. The epoxy resin system contains a tertiary amine catalyst such as a tertiaryaminophenol, a benzyl tertiary amine or an imidazole compound.01-03-2013
20130005854CURABLE COMPOSITION - The present invention relates to a curable composition including: (a) at least one compound having at least one (meth)acrylic functional group in the molecule thereof, which is selected from a (meth)acrylic monomer and a (meth)acrylic oligomer; (b) an organic peroxide; (c) an o-benzoic sulfimide; and (d) an oxazoline compound, in which the component (d) is contained in an amount of 0.005 to 10 parts by mass based on 100 parts by weight of the component (a).01-03-2013
20130012618RESIN COMPOSITION, POLYMER, CURED FILM AND ELECTRONIC PART - Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent,01-10-2013
20130012619EPOXY RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for electronic component encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a curing agent: an allylated phenol resin containing a structural unit (1) shown below and a structural unit (2) shown below, in which a molar ratio [structural unit (1)/[structural unit (1)+structural unit (2)]×100] of the structural unit (1) to a total amount of the structural unit (1) and the structural unit (2) is from 40 to 100%; (C) a curing accelerator; and (D) an inorganic filler, in which the allylated phenol resin as the component (B) has a glass transition temperature of −5° C. to 70° C. as measured by a differential scanning calorimetry (DSC) method:01-10-2013
20130012620CURING AGENTS FOR EPOXY RESINS - The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.01-10-2013
20130018126POLYETHER-MODIFIED EPOXY AMINE ADDUCTS AS WETTING AND DISPERSING AGENTSAANM Orth; UlrichAACI WeselAACO DEAAGP Orth; Ulrich Wesel DEAANM Holtkamp; HeribertAACI WeselAACO DEAAGP Holtkamp; Heribert Wesel DEAANM Omeis; JurgenAACI Dorsten-LembeckAACO DEAAGP Omeis; Jurgen Dorsten-Lembeck DE - Addition compound suitable as wetting and dispersing agent, obtainable from the reaction of 01-17-2013
20130059942CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME - Disclosed is an epoxy or epoxy-polyester curable powder coating composition which can form a favorable cured coating film excellent in adhesion and solvent resistance and is excellent in storage stability. The curable powder coating composition of the present invention contains the following component (A) and component (B): (A) an epoxy resin or an epoxy-polyester hybrid resin; and (B) a clathrate complex which contains (b1) at least one selected from the group consisting of a carboxylic acid compound and a tetrakisphenol compound represented by the following formula (I), and (b2) at least one selected from compounds represented by formula (II). The carboxylic acid compound preferably includes an aromatic carboxylic acid.03-07-2013
20130072595CURING OF EPOXY RESIN COMPOSITIONS COMPRISING CYCLIC CARBONATES USING MIXTURES OF AMINO HARDENERS AND CATALYSTS - A process for curing epoxy resins which comprises curing epoxy resin compositions comprising 03-21-2013
20130079435Benzylated Polyamine Curing Agents - A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula:03-28-2013
20130079436CURING OF EPOXY RESIN COMPOSITIONS COMPRISING CYCLIC CARBONATES USING MIXTURES OF AMINO HARDENERS - A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I:03-28-2013
20130079437EPOXIDE/(METH) ACRYLATE COMPOSITION - A composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.03-28-2013
20130090412ANTICRATER AGENT FOR ELECTROCOATING COMPOSITION - The present disclosure relates to an improved electrocoating coating composition wherein the improvement is the addition of a non-water reducible anticrater agent. The non-water reducible anticrater agent is a polyesterurethane that is the reaction product of an aliphatic carboxylic acid anhydride, a monofunctional epoxy compound, a monofunctional alcohol and a diisocyanate and/or a polyisocyanate. The improved electrocoating composition provides cured coatings that have fewer craters and have a smooth surface when compared to coatings utilizing other anticrater additives.04-11-2013
20130096232CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM - A diluent-free curable epoxy resin composition for preparing a composite comprising: (A) at least one epoxy resin composition comprising a blend of: (A1) at least one epoxy resin, and (A2) at least one divinylarene dioxide; and (B) at least one hardener composition; and (C) at least one reinforcement materials; wherein the viscosity of the curable composition is the range of from about 0.15 Pa-s to about 1.5 Pa-s; and wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased Tg of greater than about 5° C. as compared to a curable composition having a reactive diluent.04-18-2013
20130123389COMPOSITIONS AND PROCESSES FOR PRODUCING DURABLE HYDROPHOBIC AND/OR OLEPHOBIC SURFACES - A method for forming a coating composition for application to a surface. The method includes forming conglomerates by providing a plurality of nano-sized particles having a mean diameter in a range from about 1 to about 500 nanometers, the nano-sized particles having hydrophobic, super-hydrophobic, olephobic, or super-olephobic properties; mixing the plurality of nano-sized particles with a binding material to form a mixture and heating the mixture to induce curing to bind the nano-sized particles to form a consolidated cake-form material; cooling the consolidated cake-form material and grinding the cake-form material to produce conglomerates having a size in a range from about 1 micron to about 40 microns; and b) mixing the conglomerates with a coating material to be applied to a surface, the binding material being one of a thermosetting resin and a thermoplastic resin having a melting temperature higher than a curing temperature of the coating composition.05-16-2013
20130131215NOVEL PHENOL RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, AND PRINTED WIRING BOARD - There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility.05-23-2013
20130137795EPOXYSILICONE CONDENSATE, CURABLE COMPOSITION COMPRISING CONDENSATE, AND CURED PRODUCT THEREOF - There is provided an epoxy group-containing silicone condensate that yields cured products with excellent transparency, thermal resistance and gas barrier properties. An epoxysilicone condensate which is the product of hydrolytic condensation of an epoxy group-containing alkoxysilane compound represented by formula (1):05-30-2013
20130143982COATING COMPOSITIONS - A coating composition comprising an advanced epoxy resin polymeric composition having the following chemical structure:(formula) I where n is a number from 1 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH06-06-2013
20130150485CATHODIC ELECTROCOATING COMPOSITIONS - Disclosed herein are functionalized polymers comprising ethylene and substituted ethylene segments, which have been modified by epoxidation to enhance their crosslinking ability. These functionalized polymers are useful as film forming resins in cathodic electrocoating compositions. Also disclosed herein are aqueous dispersion compositions comprising the functionalized polymers and a process for coating various electrically conductive substrates.06-13-2013
20130150486CATALYST FOR URETHANE BOND FORMATION - The invention relates to titanium compounds ABC comprising tetravalent titanium A, a moiety derived from a glycol B by removing two hydrogen atoms from hydroxyl groups, and a moiety derived from an N-alkylol-β-hydroxyamine C synthesised by reacting a β-hydroxyamine C12 with an aldehyde C3, to a process for their preparation, and to a method of use thereof as a curing catalyst in coating compositions.06-13-2013
20130165548SIZING COMPOSITIONS AND SIZED PRODUCTS FOR THERMOPLASTIC COMPOSITES - Sizing compositions to size fibers or particles used in plastic composites are described. The compositions may include a solution with a polymerization compound selected from: (a) at least one non-isocyanate-containing polymerization initiator (PI) for initiating the polymerization of caprolactam monomers; or (b) at least one precursor for a non-isocyanate-containing PI for initiating the polymerization of caprolactam monomers. Methods of making the sizing the composition, as well as methods of making reinforced thermoplastic composites from sized fibers or particles, are also described.06-27-2013
20130178558THERMOSET DAMPENER MATERIAL - Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 150° C. or greater, a tan δ peak of 0.2 or greater, and a tan δ peak width measured at half-height larger than about 40° C., as measured by dynamic thermo-mechanical analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C.07-11-2013
20130184376THERMOSET RESIN COMPOSITIONS WITH INCREASED TOUGHNESS - Disclosed herein is a block copolymer (M) suitable for toughening a thermoset resin (R). The block copolymer (M) has at least one block derived from a thermoplastic aromatic polymer (A) which exhibits a glass transition temperature (Tg) of at least about 150° C. and at least one block derived from a low Tg polymer (B) wherein: 07-18-2013
20130184377CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOL RESIN, EPOXY RESIN, AND SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.07-18-2013
20130190424MELAMINE EPOXY RESIN MONOMER AND RESIN COMPOSITION - A melamine epoxy resin monomer including: a glycidyl group; and a structural unit having a melamine residue and being represented by the following Formula (I) is disclosed. In Formula (I), each of R07-25-2013
20130203894CYCLOALIPHATIC CARBONATES AS REACTIVE DILUENTS IN EPOXY RESINS - Embodiments of the present invention disclose a method for limiting peak exotherm temperatures in epoxy systems comprising the step of: combining an amine hardener, an epoxy and a diluent to form an epoxy system, wherein the diluent is selected from the group consisting of: ethylene carbonate, propylene carbonate, butylene carbonate, delta-valerolactam, delta-valerolactone, gamma valerolactone, butyrolactam, beta butyrolactone, gamma butyrolactone, and combinations thereof.08-08-2013
20130203895CURING AGENTS FOR EPOXY RESINS - The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same, methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that posses a combination of excellent cure latency as well as low cure temperature onset.08-08-2013
20130210961Epoxy Composition with Crystallization Inhibition - An epoxy resin composition formed, at least in part, as the reaction product of a mixture comprising 95 and 99 wt % of an epoxy component comprising one or more diglycidyl ethers of Bisphenol A and between 1 and 5 wt % of an additive component comprising one or more aromatic amines, wherein each aromatic amine contains no more than two amine hydrogen atoms is provided. Also provided is a method of using the epoxy resin composition including incorporating the epoxy resin composition into a coating, an adhesive, a sealant, a casting, a laminate, or a composite.08-15-2013
20130217803NOVEL RESIN CURING AGENTS - A curable resin comprising a curing agent, wherein the curing agent comprises an adjustable structural unit having a stable chain-like arrangement which is adjustable to a stable ring-like arrangement, wherein the ring-like arrangement comprises the constituents of the chain-like arrangement with two terminal constituents exhibiting an attractive chemical interaction, and is adjustable back from the ring-like arrangement to the chain-like arrangement by separation of the two terminal constituents.08-22-2013
20130217804CURABLE AND CURED COMPOSITIONS - Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The reactive liquid modifier is an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.08-22-2013
20130225721FIBER STRUCTURE, METHOD FOR ITS MANUFACTURE AND USE AS WELL AS FIBER-RESIN COMPOSITE MATERIAL - The invention relates to a fixed and/or stabilized fiber structure from a fibrous material as well as from an agent for its fixing and stabilizing. The agent for fixing and stabilizing is a statistical copolyester which is formed from the diacid components terepththalic acid and, optionally, isophthalic acid as well as the diol components butanediol, diethylene glycol and triethylene glycol. A method of manufacturing this fiber structure is also provided. The fiber structure is used as a reinforcement material for polymer matrices, in particular epoxy resins. A fiber composite material containing at least one thermosetting resin as well as the fiber structure in accordance with the invention is furthermore provided.08-29-2013
20130225722EMULSIFIERS FOR CATALYSTS - The invention relates to an emulsifiable catalyst composition which comprises at least one of metal salts, metal complexes, and acids, and at least one amphiphilic compound which is a graft copolymer based on oils or diene homo-and copolymers that bear graft branches derived from olefinically unsaturated monomers, and an average, per molecule, of at least one cationic group or cationogenic group that forms cations when contacted with an acid, to a process for its preparation, and a method of use thereof as catalyst in aqueous coating compositions.08-29-2013
20130225723CONDENSATION PRODUCTS OF AMINO-FUNCTIONAL POLYMERS - A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.08-29-2013
20130237638LOW TEMPERATURE, MOISTURE CURABLE COATING COMPOSITIONS AND RELATED METHODS - Low temperature, moisture curable coating compositions, related coated substrates, and methods for coating a substrate are described. The coating compositions include an ungelled, secondary amine-containing Michael addition reaction product of reactants including a compound comprising more than one site of ethylenic unsaturation, and an aminofunctional silane.09-12-2013
20130237639CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOLIC RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL - A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below:09-12-2013
20130245158METHODS OF MEASURING A CHARACTERISTIC OF A CREPING ADHESIVE FILM AND METHODS OF MODIFYING THE CREPING ADHESIVE FILM - Described herein are quartz crystal microbalance (QCM) and quartz crystal microbalance with dissipation (QCMD) techniques that can be used for measuring characteristics of a creping adhesive film similar to the creping adhesive film that is formed on a Yankee dryer during the tissue and towel manufacturing process. In addition, exemplary embodiments described herein may use these techniques to predict performance of creping aids utilized to form a creping adhesive film.09-19-2013
20130296465Thermosetting Compositions Containing Isocyanurate Ring - The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.11-07-2013
20130324640COATING COMPOSITIONS - An unsaturated polyester resin composition comprising an unsaturated polyester, an acetoacetate functional monomer; a multifunctional di- or tri-acrylate monomer; and an allyl ether-functional monomer/oligomer, wherein the resin composition is substantially free of styrene.12-05-2013
20130324641METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT - Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer.12-05-2013
20130338262THERMOPLASTIC MELT-MIXED COMPOSITION WITH EPOXY-AMINO ACID COMPOUND HEAT STABILIZER AND PROCESSES FOR THEIR PREPARATION - Disclosed is a thermoplastic melt-mixed composition including: a) a polyamide resin; b) a poly(amino acid)-polyol compound provided by reacting: b1) one or more amino acids selected from the group consisting of primary amino acids and secondary amino acids and combinations of these; the amino acid having no more than one hydroxyl group; and b2) one or more polyepoxy compound comprising at least two or more epoxy groups; the poly(amino acid)-polyol compound having a range of at least 10 percent conversion of epoxy equivalents of component (b1) up to, but excluding, the gel point of the components b1) and b2) and c) reinforcing agent; and, optionally, d) polymeric toughener; and f) further additives. Processes for making the composition are also disclosed.12-19-2013
20130338263THERMOPLASTIC MELT-MIXED COMPOSITION WITH POLYETHEROL HEAT STABILIZER - Disclosed is a thermoplastic melt-mixed composition including: a) a polyamide resin; b) a polyetherol compound provided by reacting: b1) one or more polyepoxy compound having at least two or more epoxy groups; and b2) one or more polyhydric alcohols having two or more hydroxyl groups; c) 10 to 60 weight percent of reinforcing agent; d) 0 to 30 weight percent polymeric toughener; and e) 0 to 10 weight percent further additives. Also disclosed are molded parts derived from the composition.12-19-2013
20140005300GLYCIDYL ESTERS OF ALPHA, ALPHA BRANCHED ACIDS COMPOSITIONS01-02-2014
20140005301SULFONIUM SULFATES, THEIR PREPARATION AND USE01-02-2014
20140011916THERMALLY CURABLE RESIN COMPOSITION WITH GOOD COATABILITY AND RE-COATABILITY - The present invention relates to a thermally curable binder resin including an epoxy group-containing ethylenic unsaturated monomer and an aqueous monomer including an ethylene oxide group; or an epoxy group-containing ethylenic unsaturated monomer, a compound including an acidic component, and an aqueous monomer including an ethylene oxide group, a thermally curable resin composition including the same, a cured film prepared therefrom, a color filter, and a liquid crystal display device. The thermally curable binder resin of the present invention may significantly enhance the coatability of a cured film forming composition and increase the surface energy of a coated protective film to significantly enhance the recoating properties in subsequent processes after formation of the protective film.01-09-2014
20140024741HIGH-LATENCY HARDENERS FOR EPOXY RESINS - The present invention relates to novel high-latency liquid hardeners for hardening of curable polymer resins, especially epoxy resins, and to epoxy resin compositions comprising liquid hardeners for the production of fibre composite materials.01-23-2014
20140045973TRIMETHYL BORATE IN EPOXY RESINS - A composition comprising a polyepoxide, a hardener, trimethyl borate, and a flame retardant is disclosed. Methods for preparing the composition and its end uses are also disclosed.02-13-2014
20140066543THERMOSETTING LIGHT-REFLECTIVE RESIN COMPOSITION, METHOD FOR PREPARING THE SAME, OPTICAL SEMICONDUCTOR ELEMENT-MOUNTED REFLECTOR PRODUCED THEREFROM, AND OPTICAL SEMICONDUCTOR DEVICE COMPRISING THE SAME - Disclosed are a thermosetting light-reflective resin composition, a method for preparing the same, an optical semiconductor element-mounted reflector produced therefrom, and an optical semiconductor device including the same. More specifically, disclosed are a thermosetting light-reflective resin composition which includes a polyhydric polyol having two or more hydroxyl groups and thus exhibits superior discoloration resistance and entails little deterioration in reflectance, a method for preparing the same, an optical semiconductor element-mounted reflector produced therefrom and an optical semiconductor device including the same.03-06-2014
20140073719SYNTHESIS OF SUPERHYDROPHOBIC COPOLYMER USING CARBON DIOXIDE SOLVENT AND APPLICATION THEREOF - A method for preparing a superhydrophobic random copolymer using a carbon dioxide solvent, and more particularly, to a method for preparing a surface coating copolymer having a superhydrophobic performance by radical copolymerization of a hydrocarbon monomer, and a silicone monomer or a fluorinated monomer using a supercritical carbon dioxide solvent as a copolymerization solvent.03-13-2014
20140088223THERMOSET/SUPRAMOLECULAR HYBRID COMPOSITES AND RESINS THAT CAN BE HOT-FORMED AND RECYCLED - Thermoset/supramolecular hybrid composites and resins, resulting from bringing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, into contact with at least one hardener chosen from carboxylic acids and acid anhydrides, and with at least one compound comprising, on the one hand, at least one associative group, and on the other hand at least one function enabling the grafting thereof to the thermosetting resin precursor, to the hardener or to the product resulting from the reaction of the thermosetting resin precursor and the hardener, in the presence of at least one transesterification catalyst. Process for manufacturing these materials, process for transforming and process for recycling these materials. Novel solid forms of hybrid composites and resins which can be used in the implementation of these processes.03-27-2014
20140107254Epoxy Resin Composition For Fiber-Reinforced Composite Material - The present technology is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing promoter containing at least one selected from 1,1′-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass % and at most 5.0 mass % in the epoxy resin composition.04-17-2014
20140107255BLENDS COMPRISING EPOXY RESINS AND MIXTURES OF AMINES WITH GUANIDINE DERIVATIVES - The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.04-17-2014
20140128503DIGLYCIDYL ETHERS OF 2-PHENYL-1,3-PROPANEDIOL DERIVATIVES AND OLIGOMERS THEREOF AS CURABLE EPOXY RESINS - Cured epoxy resins are widespread on account of their outstanding mechanical and chemical properties. It is common to use epoxy resins based on bisphenol A diglycidyl ether or bisphenol F diglycidyl ether, but for many sectors these are problematic because of their endocrine effect. The present invention relates to 2-phenyl-1,3-propanediol diglycidyl ether derivates and to curable epoxy resin compositions based thereon, as alternatives to the bisphenol A or bisphenol F diglycidyl ethers and to the epoxy resin compositions based thereon.05-08-2014
20140128504Polymer Composition for Producing Articles with Light Reflective Properties - Polymer compositions are described containing a thermoplastic polymer in combination with one or more components, such as a white pigment and optionally one or more reinforcing fillers. In one embodiment, the polymer composition can be formulated to have high reflective properties. In other embodiments, the polymer composition can be formulated so as to have desired melt flow characteristics. In still another embodiment, the polymer composition can be formulated so as to have desired mechanical properties, such as impact resistance.05-08-2014
20140128505EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE - An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.05-08-2014
20140128506HARDENER FOR EPOXY RESINS - The present invention concerns low-odor, low-viscosity hardeners for epoxy resins, including an amine with at least one amino group of formula (I) and an amine with at least one amino group of formula (II), wherein the amino groups of formulas (I) and (II) are present in a particular ratio.05-08-2014
20140128507CURING AGENT FOR MOISTURE-CURING COMPOSITIONS - The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.05-08-2014
20140135426RESIN COMPOSITION - There is provided a resin composition including a copolymer having structural units of Formula (1), Formula (2), and Formula (3), and a solvent; or a resin composition including a copolymer having structural units of Formula (1), Formula (4), and Formula (5), and a solvent.05-15-2014
20140148529CURABLE EPOXY RESIN COMPOSITION - A curable epoxy resin composition including a defined aromatic epoxy resin component and a defined latent catalyst system, and optionally further additives, the curable composition being a single epoxy resin composition having a prolonged pot life at a processing temperature within the range of 40° C. to 70° C., wherein: (a) the epoxy resin component is a compound of formula (I) in monomeric form or in a low polymeric form thereof, or is a mixture of such compounds:05-29-2014
20140155522DURABLE SUPERHYDROPHOBIC COATINGS - A superhydrophobic coating including a plurality of particles and a resin. The particles covalently bond to the resin and the resin does not fill the pores of the superhydrophobic particles such that the three dimensional surface topology of the superhydrophobic particles is preserved.06-05-2014
20140171550EPOXY RESIN WITH ENHANCED VISCOSITY STABILITY AND USE THEREOF - The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).06-19-2014
20140179827QUATERNARY PHOSPHONIUM SALT, EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND INCLUDING THE QUATERNARY PHOSPHONIUM SALT, AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE EPOXY RESIN COMPOSITION - A quaternary phosphonium salt, an epoxy resin composition including the quaternary phosphonium salt, and a semiconductor device encapsulated with the epoxy resin composition, the quaternary phosphonium salt being represented by Formula 1:06-26-2014
20140179828EPOXY RESIN COMPOSITIONS, METHODS OF MAKING SAME, AND ARTICLES THEREOF - Epoxy resins comprising a diglycidyl ether of Formula 1 as defined herein are described. The diglycidyl ether contains a cycloaliphatic ring of 3-5 carbon atoms. The epoxy resins are made by a method comprising the steps of: (a) forming a reaction mixture comprising a diol of Formula 3 as defined herein, an epihalohydrin, a phase transfer catalyst, and optionally an organic solvent; (b) contacting a basic acting substance and water with the reaction mixture of step (a); (c) washing the mixture of step (b) with an aqueous solvent to substantially remove salts; and (d) isolating the epoxy resin. Curable and cured compositions comprising the epoxy resins are also disclosed. The epoxy resins have increased glass transition temperatures and reduced viscosity compared to epoxy resins derived from cyclohexanedimethanol.06-26-2014
20140187670ADHESION IMPROVER FOR AMINE CURING EPOXY RESIN PAINT - An adhesion improver for amine curing epoxy resin paint which, when added in a small amount to amine curing epoxy resin paint, is capable of preventing the inhibition of adhesion caused by amine blushing and of giving good interlayer adhesion is provided. This adhesion improver is a composition which contains a polymer obtained by the polymerization of (A) acrylic acid ester and/or methacrylic acid ester which has a formula as follows:07-03-2014
20140187671PROCESS FOR PRODUCING RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR - The present invention relates to a process for producing a resin composition for an optical semiconductor from a powdery material and a liquid material using a kneader having a first supply port and a secondary supply port disposed at a downstream side of the first supply port, the process including: a step of supplying the powdery material into the kneader from the first supply port and delivering the powdery material to a second supply port side by the kneader at a temperature at which the powdery material is not melted; a step of melting the powdery material by heating and simultaneously supplying the liquid material from the second supply port under a pressure higher than a pressure in the kneader to knead a melted product of the powdery material and the liquid material; and a step of further kneading a kneaded product thereof while cooling.07-03-2014
20140235755INIMER-CONTAINING RANDOM COPOLYMERS AND CROSSLINKED COPOLYMER FILMS FOR DENSE POLYMER BRUSH GROWTH - Crosslinkable random copolymers comprising atom transfer radical polymerization (ATRP) initiators and crosslinked copolymer films formed from the copolymers are provided. The random copolymers, which are polymerized from one or more alkyl halide functional inimers and one or more monomers having a crosslinkable functionality, are characterized by pendant ATRP initiating groups and pendant crosslinkable groups.08-21-2014
20140235756METHOD FOR PREPARING EMULSION RESIN COMPOSITION FOR CATIONIC ELECTRODEPOSITION PAINT - The present invention is to provide a method for preparing an emulsion resin composition for a cationic electrodeposition paint, which prepare a cationic electrodeposition paint composition as reducing time for desolvation time or eliminating desolvation step. The present invention provide a method for preparing an emulsion resin composition for cationic electrodeposition paint, which comprises a cationic resin and a blocked isocyanate curing agent, the method comprises the steps: 08-21-2014
20140243451RUBBERY POLYMER WITH LOW COMPRESSION SET - A rubbery polymer comprising: 08-28-2014
20140256852WATER BORNE EPOXY RESIN DISPERSIONS AND EPOXY HARDENER COMPOSITIONS - An epoxy or hardener mixture comprising (a) optionally water, (b) at least one hardener or epoxy resin, and (c) from 0.1 to 20 weight percent, based on epoxy resin of at least one distyryl phenol, tristyryl phenol or cumylphenol based additive surfactant with phosphate or sulfonate end groups having the structure R—OXn-W wherein R designates a polystyrylphenol or cumylphenol, preferentially chosen from among distyrylphenol, tristyrylphenol or cumylphenol, and mixtures thereof, and wherein OX designates ethylene oxide and/or propylene oxide. The number of groups “n” varies from 0 to 200, and W designates H, sulfate (—SO09-11-2014
20140256853Curing Agent for Low Temperature Cure Applications - The present invention provides Mannich base derivatives of N,N′-dimethyl secondary diamine polymers including Mannich base derivatives of methylamine-terminated poly-(N-methylazetidine) and Mannich base derivatives of methylamine-terminated poly-(N-methylazacycloheptane). Amine curing agent compositions and amine-epoxy compositions containing Mannich base derivatives of N,N′-dimethyl secondary diamine polymers are also disclosed.09-11-2014
20140256854FLUORINATED WATER-OIL REPELLENCY AGENTS - The present invention relates to an active energy ray curable compound (A) comprising: at least one (poly)lactone-containing moiety (a1), at least one fluorine-containing moiety (a3), and at least one further moiety (a2) present between moieties (a1) and (a3). The invention further relates to ways of making such compounds and to their use in providing water-oil repellency properties to a coating composition.09-11-2014
20140275340MODIFIED HYALURONATE HYDROPHILIC COMPOSITIONS, COATINGS AND METHODS - This invention relates to hydrophilic polymer compositions and a preferred application therefore, viz., hydrophilic medical device coatings. The hyaluronic acid hyaluronon by itself or modified as described herein advantageously reacts with compositions disclosed in U.S. Pat. No. 7,776,956 to produce hydrophilic compositions and coatings particularly useable with medical devices.09-18-2014
20140275341OXIRANE (ETHYLENE OXIDE) POLYURETHANE COATINGS - The present invention relates to hydrophilic, i.e., water loving coatings (hereafter referred to as “WLC”). Polyurethane epoxy alkylene oxide coatings usable as coatings on for example, medical devices are a preferred WLC.09-18-2014
20140275342EPOXY RESIN COMPOSITIONS, METHODS OF MAKING SAME, AND ARTICLES THEREOF - Advanced epoxy resins comprising the reaction product of an epoxy resin comprising a diglycidyl ether of Formula 1 as defined herein, and at least on difunctional compound selected from an aromatic diol and a dicarboxylic acid are described. The diglycidyl ether contains a cycloaliphatic ring of 3-5 carbon atoms. Purified diglycidyl ether is used to obtain substantially linear, high molecular weight, advanced epoxy resin. Curable compositions, cured compositions, and articles comprising the advanced epoxy resins are also disclosed. The advanced epoxy resins provide cured coatings having improved flexibility and low total chlorine content.09-18-2014
20140288213FIBRE REINFORCED PLASTIC COMPOSITE - A fibre reinforced plastic composite is provided having a matrix material, a plurality of fibres for reinforcement of the matrix material, and at least one thermoplastic additive material for enhancing a fracture toughness of the fibre reinforced plastic composite, wherein the thermoplastic additive material is dissolved in the matrix material. The thermoplastic additive material may initially, i.e., before dissolution in a base material, be in a powdery or granulate form. Additionally, a plastic composite starting material, suitable for a fibre reinforced plastic composite, and a method of manufacturing a fibre reinforced plastic composite are provided. Finally, a component of a wind turbine having a fibre reinforced plastic composite is provided.09-25-2014
20140296379AMINE-TERMINATED, SUBSTANTIALLY LINEAR SILOXANE COMPOUND AND EPOXY PRODUCTS MADE WITH THE SAME - An amine-terminated, substantially linear siloxane compound comprises siloxane repeating units conforming to specified structures, one of which contains pendant aromatic groups. The amine-terminated, substantially linear siloxane compound further comprises amine-substituted terminal siloxy groups. An epoxy product is made by reacting an epoxy resin and the amine-terminated, substantially linear siloxane compound.10-02-2014
20140296380METHOD FOR MANUFACTURING MICRO-STRUCTURE - A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.10-02-2014
20140296381LIQUID ACCELERATOR COMPOSITION FOR HARDENERS - A salicylic acid salt-containing liquid composition useful as an accelerator for a hardener includes a reaction product of (a) salicylic acid; and (b) at least one amine compound compatible with said salicylic acid such that the composition is in liquid form, the composition has a concentration of salicylic acid at from about 35 weight percent to about 55 weight percent, and the composition has a viscosity in the range of from about 500 mPas to about 20,000 mPa-s at 25° C.; a curable epoxy resin composition containing the salicylic acid salt-containing liquid composition accelerator; and a cured product made from the curable composition.10-02-2014
20140309333Resins, Resin/Fibre Composites, Methods of Use and Methods of Preparation - The present disclosure, pertains to resins, fibres, and/or resin/fibre composites. Certain aspects are directed to: the construction, composition and methods for producing resins, resin systems and/or resin blends that are suitable for use in very short fibre polymerisable liquid composites and other composites. Certain aspects are to the treatment of fibres and other types of reinforcement fillers so that they are suitable for use in very short fibre polymerisable liquid composites and other composites. Certain aspects are to methods of use and/or methods for producing very short fibre polymerisable liquid composites that can be produced by combining the aforesaid resins, resin systems and/or resin blends and treated fibres and other types of reinforcement fillers to produce suitable very short fibre polymerisable liquid composites.10-16-2014
20140309334CURING AGENT FOR EPOXY RESIN COATINGS - The present invention relates to curing agents for epoxy resins including an alkylated polyethyleneimine. These curing agents have high functionality and a high content of secondary amino groups. Together with epoxy resins, they cure surprisingly quickly and without blushing effects even under humid and cold conditions to form films having very high cross-linking density. They are suited for coatings with high resistance requirements.10-16-2014
20140309335EPOXY CURATIVE COMPOSITION AND COMPOSITIONS THEREFROM - An epoxy curative is provided comprising: a) a Lewis base, b) calcium nitrate, and c) a polyamine amide salt. The present disclosure additionally provides a composition which is a mixture obtained by mixing the epoxy curative and a curable epoxy resin. The present disclosure additionally provides cured compositions which result from cure of such a mixture.10-16-2014
20140316030GLYCIDYL ESTERS OF ALPHA, ALPHA BRANCHED NEONONANOIC ACIDS, SYNTHESIS AND USES - The invention relates to a manufacturing process for the preparation of α,α-branched alkane carboxylic acids providing glycidyl esters with an improved softness or hardness of the coatings derived thereof.10-23-2014
20140343191FIBER-REINFORCED RESIN COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME - The purpose of the present invention is to inhibit a decrease in strength attribute to the interface between a simple-shape portion and a complicated-shape portion. This fiber-reinforced resin composite material comprises: a simple-shape portion formed from at least one sheet-shaped prepreg material obtained by impregnating reinforcing fibers with a resin; and a complicated-shape portion obtained by impregnating reinforcing fibers with a resin, the complicated-shape portion having been integrated with the simple-shape portion. The resin used for the preprg material comprised the same components as the resin used for the complicated-shape portion.11-20-2014
20140357762USE OF N,N'-(DIMETHYL) URONES AND METHOD FOR CURING EPOXY RESIN COMPOSITIONS - The invention relates to the use of bis- or multifunctional N,N′-(dimethyl) urons as curing agents for curing epoxy resin compositions in a controlled manner.12-04-2014
20140364537SOLVENT-BASED COATING COMPOSITIONS - Coating compositions are disclosed. In some embodiments, the coating compositions are used to coat substrates such as packaging materials and the like for the storage of food and beverages. The coating compositions can be prepared by reacting an epoxidized vegetable oil and a hydroxyl functional material in the presence of an acid catalyst to form a hydroxyl functional oil polyol, mixing the hydroxyl functional oil polyol (with or without epoxidized polybutadiene) with a functional polyolefin copolymer to form a mixture,reacting the mixture with an ethylenically unsaturated monomer component in the presence of an initiator to form a graft copolymer, and crosslinking the graft copolymer with a crosslinker to form the coating composition.12-11-2014
20150011680BIOSOURCED EPOXIDE RESINS HAVING IMPROVED REACTIVITY - Biosourced epoxide resins are provided, including the product of the reaction of one or more biosourced epoxide lipid derivatives with at least one cross-linking agent in the presence of at least one co-reagent selected from among the glycidyl ether derivatives of biosourced polyols or the product of the reaction of one or more glycidyl ether derivatives of biosourced polyols with at least one cross-linking agent.01-08-2015
20150018455LOW VOLATILE ORGANIC COMPONENT DRY ERASE SILOXANE-BASED COATINGS - The present invention provides, among other things, compositions with at least one dry-erase characteristic and methods thereof. In some embodiments, provided paint composition comprising a resin part comprising an epoxy, a polysiloxane and an organooxysilane; and a cure part comprising one or more amino-silanes; the resin part and the cure part being designed and selected such that, when combined together, they cure to form a surface coating that demonstrates at least one thy-erase characteristic.01-15-2015
20150018456PREPARATION AND USES OF EPOXY RESINS OF CYCLODODECANE POLYPHENOLS - Disclosed herein are polyglycidyl ethers of the formula: where R, m, Q, p and Z are as defined here. Also disclosed are methods of forming said polyglycidyl ethers and methods of using said polyglycidyl ethers to make epoxy resin oligomers and polymers, including powder coatings.01-15-2015
20150018457USE OF LINEAR TRIETHYLENTETRAMINE AS CURING AGENT FOR EPOXY RESINS - The present invention relates to an amine composition comprising linear triethylenetetramine and one or more amine compounds selected from the group consisting of tertiary amines derived from the condensation of ethylenediamine and methyl-substituted compounds derived from linear triethylenetetramine as well as a method of production for said composition.01-15-2015
20150031797Room Temperature-Curable Coating Composition - To provide a room temperature-curable coating composition that has superior weatherability, in which cracking over time is suppressed due to by-products not being produced when curing, and the environmental burden is low due to an organic solvent not being included. This invention relates to a room temperature-curable coating composition comprising (A) an epoxy-functional organopolysiloxane and (B) an amino-functional organopolysiloxane.01-29-2015
20150045477POLY(PHENYLENE ETHER)/EPOXY HOMOGENEOUS SOLID AND POWDER COATING COMPOSITION INCORPORATING SAME - A homogeneous solid composition includes an aromatic epoxy resin and a poly(phenylene ether) having a number average molecular weight of 600 to 2000 atomic mass units and an average of 1.5 to 3 hydroxyl groups per molecule. The molecular weight and hydroxyl functionality of the poly(phenylene ether) allow it to be dissolved in the epoxy resin at relatively low temperature, and remain dissolved as the solution is cooled and solidified. The homogeneous solid composition facilitates incorporation of the poly(phenylene ether) into powder coating compositions that exhibit reduced water absorption in the cured state.02-12-2015
20150051315Mixture of Benzoxazine, Epoxy and Anhydride - The present disclosure provides a phenolic-free composition containing a benzoxazine, epoxy resin and acid anhydride. The phenolic-free composition, upon curing, renders void free cured articles having well balanced thermal, chemical and mechanical properties. The phenolic-free composition may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.02-19-2015
20150080497EPOXY RESIN COMPOSITION FOR MARINE MAINTENANCE AND REPAIR COATINGS WITH IMPROVED OVERCOATABILITY - This invention relates to an epoxy resin composition and its application in marine maintenance and repair coating with improved overcoatability.03-19-2015
20150087748LATENT CATALYST FOR CURABLE COMPOSITIONS - A curable composition including (a) at least one divinylarene dioxide; (b) at least one polyol; and (c) at least one latent cure catalyst.03-26-2015
20150087749CURABLE COMPOSITIONS - A curable composition including (a) at least one divinylarene dioxide; (b) at least one phenol, wherein the phenol is unsubstituted at a 2-, 4-, or 6-phenolic ring position; and (c) at least one acid compound-related cure catalyst; and a cured product made from the above curable composition.03-26-2015
20150094402Transparent Aliphatic Polycarbonate Composition and Use Thereof - Provided is a polyalkylene carbonate blend composition containing: aliphatic polycarbonate obtained by reacting carbon dioxide with one or at least two different kinds of epoxide compounds selected from a group consisting of (C2-C10)alkylene oxide substituted or unsubstituted with halogen or alkoxy, (C4-C20)cycloalkylene oxide substituted or unsubstituted with halogen or alkoxy, and (C8-C20)styrene oxide substituted or unsubstituted with halogen, alkoxy, alkyl, or aryl; and poly(D,L-lactide-co-glycolide) (PLGA).04-02-2015
20150099828LAMINATE AND METHOD FOR PRODUCING SAME - A laminate which has a cured layer formed on a base and made from a curable composition containing (A) a heat- and/or ultraviolet ray-curable resin and (B) inorganic microparticles having a functional group capable of binding to the component (A), in which the absorbance ratio P04-09-2015
20150099829Polyalkylene Carbonate Resin Composition Having an Interpenetrating Crosslinked Structure - A polyalkylene carbonate resin composition with interpenetrating network structure includes an aliphatic polycarbonate obtained through a reaction of carbon dioxide with at least one epoxide compound selected from the group consisting of (C2-C10)alkylene oxide substituted or unsubstituted with halogen or alkoxy, (C4-C20)cycloalkylene oxide substituted or unsubstituted with halogen or alkoxy, and (C8-C20)styrene oxide substituted or unsubstituted with halogen, alkoxy, alkyl or aryl, at least one compound selected from a polyol compound, an epoxy compound and an acryl compound, and a curing agent for polymerization or networking.04-09-2015
20150111990COATING COMPOSITION WITH IMPROVED ADHESION TO A SUBSTRATE - A process for providing a coating with improved adhesion to a substrate is provided. The coating composition comprises an epoxy function polymer, a fully alkylated melamine resin and an amidoamine. The process involves forming a mixture of the film forming components and allowing the mixture to mature before adding an acid catalyst. The result is a layer of the coating composition with a high degree of adhesion to the substrate.04-23-2015
20150111991AROMATIC ALDEHYDE, AND EPOXY RESIN CURING AGENT AND EPOXY RESIN COMPOSITION COMPRISING THE AROMATIC ALDEHYDE - There are provided a novel aromatic aldehyde compound capable of providing an epoxy resin coating film and an epoxy resin cured material satisfying all of the excellent surface property (smoothness, gloss), drying property, water resistance, transparency and adhesion, and an epoxy resin curing agent and an epoxy resin composition containing the aromatic aldehyde compound. The aromatic aldehyde has a branched alkyl group having 10 to 14 carbon atoms.04-23-2015
20150119497VINYL RESIN AND RESIN COMPOSITION - The present invention aims to provide a vinyl resin which, with a polyurethane resin, is capable of providing a film excellent in mechanical strength, weather resistance, solvent resistance, and water resistance. The vinyl resin (V1) of the present invention is obtainable by polymerizing monomer components including a monomer (X) represented by the formula (1):04-30-2015
20150119498SYSTEM AND METHOD FOR PRODUCING COMPOSITE COMPONENT - A system and method for producing a composite component, especially for continuous production of such composite components, includes a feeding device for feeding one or more layers of reinforcing material from a material supply along a process path, a resin application device for applying a resin matrix to the reinforcing material fed along the process path, and a forming device configured to shape or mould a profile of the reinforcing material and the resin matrix applied thereto to form a composite component as the reinforcing material is fed or conveyed along the process path.04-30-2015
20150126644POLYESTER-BASED FIBER FOR ARTIFICIAL HAIR AND HAIR ORNAMENT PRODUCT INCLUDING THE SAME, AND METHOD FOR PRODUCING THE SAME - The present invention relates to a polyester-based fiber for artificial hair obtained by melt spinning a polyester resin composition. The polyester resin composition includes 100 parts by weight of a polyester resin, 5 to 40 parts by weight of a brominated epoxy flame retardant, and 1.5 parts by weight or more and less than 7 parts by weight of an antimony oxide. The polyester resin is at least one kind of resin selected from the group consisting of polyalkylene terephthalate and a copolymerized polyester containing polyalkylene terephthalate as a main component. The polyester-based fiber for artificial hair has aggregates of the brominated epoxy flame retardant that are dispersed in the polyester resin in the form of islands, as viewed in the cross section of the fiber parallel to the fiber axis direction. The present invention also relates to hair ornament products including the polyester-based fiber for artificial hair and a method for producing the polyester-based fiber for artificial hair. Thus, the present invention provides a polyester-based fiber for artificial hair having a gloss and a texture that are similar to those of human hair, and hair ornament products including the polyester-based fiber for artificial hair.05-07-2015
20150141548LOW VISCOSITY EPOXY RESINS AND LOW VOC CURABLE FORMULATIONS THEREFROM - The present invention provides methods of making a low viscosity C05-21-2015
20150148449Polyurethane-based Waterproofing Composition for the Water-proofing of Concrete Structures - The present invention relates to waterproofing compositions based on polyurethanes, which are particularly useful for the waterproofing of concrete structures. The compositions are characterized in that they comprise at least one branched isocyanate component comprising on average at least 2.3 isocyanate groups per molecule and at least one hydroxycarboxylic acid component. Preferably the composition further comprises at least one polyol component and at least one latent amine component.05-28-2015
20150291740FLAME-RETARDANT POLYESTER - The present invention is directed to a flame-retardant polyester having a structure of formula (1):10-15-2015
20150299378CURABLE COMPOSITIONS - A curing agent composition including (a) at least one phenalkamine blended with (b) at least one styrenated phenol or styrenated phenol novolac compound to form a curing agent composition for an epoxy compound; a curable resin composition including (I) at least one epoxy compound; and (II) at least one phenalkamine blended with (III) at least one styrenated phenol or styrenated phenol novolac compound; and a thermoset prepared from the above curable composition.10-22-2015
20150307702EPOXY-BASED SUBSTANCE FOR FIXING PURPOSES, THE USE THEREOF AND THE USE OF SPECIFIC COMPONENTS - Compositions for a curable substance for fixing purposes, comprising an epoxy component (a), which contains curable epoxides, and a hardener component (b), which comprises a Mannich base formulation, obtainable by reaction of specific amines, and/or mixtures of styrenated phenols with low molecular weight amines, to novel Mannich base formulations or mixtures of styrenated phenols with low molecular weight amines, and to the use of such Mannich base formulations and/or of such mixtures of styrenated phenols with low molecular weight amines, and in each case especially further additional ingredients, especially in hardener components for epoxy resins.10-29-2015
20150307722METHODS FOR PRODUCING 1,5,7-TRIAZABICYCLO[4.4.0]DEC-5-ENE BY REACTION OF A DISUBSTITUTED CARBODIIMIDE AND DIPROPYLENE TRIAMINE - Methods for producing 1,5,7-triazabicyclo[4.4.0]dec-5-ene using a disubstituted carbodiimide, dipropylene triamine and optionally an ethereal solvent and/or an alcohol are disclosed. Use of 1,5,7-triazabicyclo[4.4.0]dec-5-ene produced by this method in an electrodepositable coating composition, and electrophoretic deposition of such coating onto a substrate to form a coated substrate, are also disclosed.10-29-2015
20150314497MOLDING APPARATUS, METHOD OF MOLDING, AND MOLDED PRODUCTS - A method for producing a molded product 11-05-2015
20150315378LOW EMISSION EPOXY CURING AGENTS - A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.11-05-2015
20150315416POLYTHIOETHER POLYMERS, METHODS FOR PREPARATION THEREOF, AND COMPOSITIONS COMPRISING THEM - Disclosed are poilythioethers that are the reaction product of reactants that include: a) an isocyanurate-containing trithiol; b) a polythiol different from (a); and c) a diene. Also disclosed are compositions, such as sealant compositions, that include such polythioethers.11-05-2015
20150319858METAL STABILIZERS FOR EPOXY RESINS - A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.11-05-2015
20150322274THERMALLY CURABLE SOLDER-RESISTANT INK AND METHOD OF MAKING THE SAME - A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic group, and an anhydride monomer having a carboxylic group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a modified polyimide; and mixing the modified polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.11-12-2015
20150322315CURABLE COMPOSITIONS - A curable polyfunctional terminal styrenic composition comprising a reaction product of: (a) at least one divinylarene monoxide compound, and (b) at least one polyfunctional epoxide coupling compound to form a curable polyfunctional terminal styrenic composition; a thermoset prepared from the above curable composition; and a process for preparing the curable composition and the thermoset.11-12-2015
20150337077Novolak Resin Containing Hexafluoroisopropanol Group, Method for Producing Same, and Composition of Same - Disclosed is a novolak resin containing a repeating unit represented by the general formula (1). R11-26-2015
20150338556NON-PHOTOSENSITIVE RESIN COMPOSITION - A non-photosensitive resin composition including: a self-cross-linkable copolymer having structural units of Formulae (1) and (2):11-26-2015
20150353761Comb-Like Polyetheralkanolamines in Inks and Coatings - Provided herein are compositions useful as ink or coatings which contain novel dispersants that are capable of dispersing pigments which are traditionally difficult to disperse while maintaining acceptable levels of viscosity. Use of dispersants as taught herein enables the preparation of a wide variety of inks and coatings having high pigment loading and existing within a conventionally-useful viscosity range.12-10-2015
20150368458REINFORCED THERMOPLASTIC COMPOUND WITH CHEMICAL RESISTANCE - Disclosed herein are blended thermoplastic compositions comprising at least one polycarbonate component, at least one polybutylene component, at least one polyester ether elastomer component, at least one poly(ethylene-co-ethylacrylate) component, at least one ethylene/alkyl acrylate/glycidyl methacrylate terpolymer component, and at least one glass fiber component. The thermal blended polycarbonate compositions can optionally further comprise a transesterification quenching agent and/or epoxy hydrostabilizer agent. The resulting compositions can be used in the manufacture of articles requiring materials that have high impact strength yet have very high stiffness, while retaining desired dielectric properties and are colorable from white to black.12-24-2015
20150368505ANTICORROSIVE COATING COMPOSITION, ANTICORROSIVE COATING FILM, AND METHOD FOR PREVENTING CORROSION OF SUBSTRATE - The present invention relates to an anticorrosive coating composition comprising an epoxy resin (a), a curing agent (b), an amide wax (c), and a liquid acrylic polymer (d) including a structural unit derived from an acrylate having an alkyl group of 4 to 18 carbon atoms. The anticorrosive coating composition of the present invention can form an anticorrosive coating film that is excellent adhesion to a metal substrate, anticorrosive properties and so on.12-24-2015
20150368509POLYAMINES HAVING SECONDARY ALIPHATIC AMINO GROUPS - Novel polyamines having secondary amino groups, and a process for producing them, adducts of these polyamines and their uses. The polyamines can be prepared in a simple way from readily available reactants. They and their adducts have, in particular, a low viscosity and are suitable as constituent of polyurethane and polyurea compositions having excellent processability and high flexibility, and also constituent of epoxy resin compositions, especially coatings.12-24-2015
20150376327CURABLE COMPOSITION WITH HIGH FRACTURE TOUGHNESS - The present invention relates to a curable or hardened composition comprising at least one epoxy resin, one open-chain polyamine and one compound of the formula (I)12-31-2015
20150376399Water Curable Resin Formulations - The present invention relates to a water curable resin formulation comprising: (a) an epoxy resin; (b) an aromatic amine curing agent, wherein the molar ratio of amine functional groups in said curing agent relative to the epoxy functional groups of said epoxy resin is 2:1 or less; and (c) a coupling agent comprising a siloxane group coupled to an epoxy reactive group.12-31-2015
20150376439COATING COMPOSITION FOR A FOOD OR BEVERAGE CAN - A two component coating composition, suitable for coating onto a metal substrate, especially food and beverage cans, the coating composition comprising: 12-31-2015
20160002491EPOXY RESIN COMPOSITION, AND ITS APPLICATIONS - This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, a process making thereof and its application in a low VOC high solids coating, and a low VOC waterborne coating.01-07-2016
20160009943Microgels Prepared Using Hybrid Crosslinker Systems and Coating Compositions Having Microgels Prepared Therefrom01-14-2016
20160024336POWDER COATINGS COMPOSITIONS - A solid epoxy resin powder coarting composition which includes a divinylarene dioxide resin as one component; and wherein the solid epoxy resin powder coating composition can be formed by blending or reacting various other components with the divinylarene dioxide resin. For example, other components can include other epoxy resins; phenolic resins; or monomeric and/or polymeric isocyanates. The powder coating composition or formulation may advantageously provide, for example, a Fusion Bonded Epoxy coating on a substrate.01-28-2016
20160032043BISPHENOL POLYMER PRECURSOR REPLACEMENTS - Use of biologically-derived polyphenols for the preparation of epoxy resins is described. Examples of biologically-derived polyphenols include resveratrol, genistein, daidzein, and polyphenols synthesized from tyrosine. Because the epoxy resins are prepared from biologically-derived materials, they provide epoxy resins that will degrade into biologically harmless materials. The epoxy resins can be used to provide coating compositions.02-04-2016
20160032104MODIFIED POLYPHENOL BINDER COMPOSITIONS AND METHODS FOR MAKING AND USING SAME - Modified polyphenol binder compositions and methods for making and using same are provided. In at least one specific embodiment, the binder composition can include at least one unsaturated monomer and at least one polyphenolic compound. The polyphenolic compound can include a lignin, a tannin, a novolac resin, a modified phenol formaldehyde resin, bis-phenol A, humic acid, or any mixture thereof.02-04-2016
20160054474GRADIENT REFRACTIVE INDEX OPTICS WITH LOW DISPERSION USING NANOPARTICLES - Gradient Refractive Index (GRIN) optical materials [02-25-2016
20160060383EPOXY RESIN COMPOSITIONS - A novel epoxy resin composition capable of forming a coating composition with a high volume solids content; a coating composition comprising such novel epoxy resin composition capable of providing a resultant coating films with balanced properties including good flexibility, good chemical resistance, short dry-hard time, desirable hardness, and good anti-corrosion performance; and the process of preparing the compositions.03-03-2016
20160083576Epoxy Resin Composition For Transparent Sheets And Cured Product Thereof - To provide an epoxy resin composition that is suitable for producing optical sheets which exhibit excellent transparency, heat resistance, strength, smoothness and light resistance, and a cured product thereof.03-24-2016
20160083580High-Latency Hardeners for Epoxy Resins - The present invention relates to novel high-latency liquid hardeners for hardening of curable polymer resins, especially epoxy resins, and to epoxy resin compositions comprising liquid hardeners for the production of fibre composite materials.03-24-2016
20160083582PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND RESIN COMPOSITION CONTAINING PARTICLES03-24-2016
20160083615Epoxy Resin Composition For Transparent Sheets And Cured Product Thereof - To provide an epoxy resin composition that is suitable for producing optical sheets which exhibit excellent transparency, heat resistance, strength, smoothness and light resistance, and a cured product thereof.03-24-2016
20160090510Urethane Coating Composition For Metal Substrate - A urethane composition useful in a variety of applications such as, for example, as a direct-to-metal coating, i.e. a coating composition that can be applied directly to the surface of a metal substrate without a primer or pretreatment is described. The coating composition preferably includes a polyol that is the reaction product of a resin of general formula (I) with an acid or a diol respectively, with the reaction being carried out in the presence of a catalyst. The coating composition also includes an isocyanate-functional compound as a crosslinker. The coating composition forms a corrosion-resistant film when applied directly to the substrate surface without a pretreatment or primer.03-31-2016
20160096958Low Temperature Shape Memory Thermosetting Epoxy, Film Material and Producing Method Thereof - A low temperature shape memory thermosetting epoxy has a epoxy, a curing agent, a modifying material and a functional material. The curing agent is fatty amine, polyamide and aromatic amino compound. The modifying material is polyester polyol, polyether polyol, aromatic diamine, and silicon compound. The functional material is boron trifleoride, terminal carboxyl group, calcium carbonate, pigment, and mixture thereof. Thus, the present invention provides an epoxy that is deformable and is shape memorable under room temperature.04-07-2016
20160096973COATINGS FOR WELLBORE TOOLS, COMPONENTS HAVING SUCH COATINGS, AND RELATED METHODS - A component of a wellbore tool comprises a plurality of compartments disposed over a body of the component and a coating disposed over at least a portion of a surface of the body. Each compartment comprises a healing agent formulated to form or catalyze the formation of a barrier upon release from the compartment. A matrix material separates the plurality of compartments. Methods of forming wellbore tools include forming a body, forming a plurality of capsules, and forming a coating comprising the capsules over the body. Methods of utilizing a wellbore tool in a subterranean borehole include contacting at least a portion of a body with a fluid comprising a healing agent formulated to form a barrier. Coatings for wellbore tools include a fiber comprising a plurality of discrete cells and a matrix material contacting and at least partially surrounding the fiber. Each cell comprises a healing agent.04-07-2016
20160102170LIGNIN-BASED BIOMASS EPOXY RESIN, METHOD FOR MANUFACTURING THE SAME, AND COMPOSITIONS INCLUDING THE SAME - A method of forming a lignin-based biomass epoxy resin is provided, which includes: (a) mixing a lignin, an acid anhydride compound, and a solvent to react for forming a first intermediate product, (b) reacting the first intermediate compound with a first polyol to form a second intermediate compound, and (c) reacting the second intermediate compound with an epoxy compound to form a lignin-based biomass epoxy resin.04-14-2016
20160102192EFFICIENT POLYMER COMPOSITES BASED ON NATURAL WOOL - A reinforced polymer composite, and more particularly, a wool reinforced polymer composite is provided. The composition includes wool fibers combined with a polymer to form a reinforced polymeric matrix having at least one of improved Izod Impact Strength (ASTM D-256) or improved Tensile Strength (ASTM D-1708) as compared to the polymer without the fibers.04-14-2016
20160115184PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED FROM THE SAME - A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:04-28-2016
20160121361METHOD FOR COATING A SURFACE OF AN ELECTRICALLY NON-CONDUCTIVE SUBSTRATE WITH POWDER COATINGS - A method for coating a surface of an electrically non-conductive substrate with powder coatings, the method comprising the following steps: providing a substrate to be coated, pre-heating the substrate to be coated to a temperature of 40 to 140° C. in order to decrease the surface resistance of the substrate to less than 1005-05-2016
20160122467Amidopolyamines with Enhanced Gel-Time for Elevated Temperature Applications - An epoxy curing agent is disclosed that can be obtained by reacting at least one carboxylic acid with at least one polyamine. The disclosed curing agent can be obtained by preparing an amidoamine with about 0.15 to about 0.30 molar excess of carboxylic acid.05-05-2016
20160122473ACRYLATED OR METHACRYLATED URETHANE OLIGOMER WITHOUT ISOCYANATE - The invention relates to a monofunctional or multifunctional acrylated or methacrylated urethane oligomer where said urethane bond is obtained without use of isocyanate and by the carbonate-amine reaction between a cyclic carbonate and a monoamine or polyamine, with subsequently the conversion of the hydroxyls in the β position with respect to the urethane bond into ester-acids by reaction with a cyclic anhydride, which reaction is followed by the conversion of said acid functional groups into acrylated or methacrylated end groups by reaction with a polyepoxide compound in the presence of acrylic or methacrylic acid.05-05-2016
20160122535Polyalkylene Carbonate Resin Composition Having High Thermal Stability - Provided is a polyalkylene carbonate resin composition having high thermal resistance including: polyalkylene carbonate obtained by reacting carbon dioxide with one or two or more different epoxide compound(s) selected from the group consisting of C2-C10 alkylene oxide unsubstituted or substituted with halogen or alkoxy, C4-C20 cycloalkylene oxide unsubstituted or substituted with halogen or alkoxy, and C8-C20 styrene oxide unsubstituted or substituted with halogen, alkoxy, alkyl or aryl; an epoxy resin; and a curing agent.05-05-2016
20160122585A POLYMERIC FILM COATING METHOD ON A SUBSTRATE BY DEPOSITING AND SUBSEQUENTLY POLYMERIZING A MONOMERIC COMPOSITION BY PLASMA TREATMENT - The present invention relates to a method for coating a substrate comprising the following steps : a) depositing a polymerizable composition on said substrate, the composition being selected from the following compositions: a composition (A) containing, as an essential component: a least one epoxy monomer (i) and/or at least one silicone epoxy monomer (ii); or a composition (B) containing as an essential component a least one silicone epoxy monomer (ii) and at least one monomer containing at least one ethylenic unsaturation (iii); b) polymerizing said composition by plasma treatment. The coating obtained with this method is substantially free from ionic photocatalysts, and the step (b) is carried out at atmospheric pressure.05-05-2016
20160145461COATING MATERIAL COMPOSITION, AND COATED FILMS OBTAINED BY THE COATING THEREOF - A coating material composition for providing coated films is disclosed. The coating material composition contains coated film forming resin (A), crosslinking agent (B), and resin beads (C), in which compression strength of the resin beads (C) at the time of the 10% pressurized deformation of an individual resin bead by means of a micro-compression tester lies between 0.1 MPa and 20 MPa and a recovery of the resin beads (C) following 90% pressurized deformation of an individual resin bead by means of a micro-compression tester is at least 80%.05-26-2016
20160152763MODIFIED AMINE CURING AGENTS, THEIR PREPARATION AND USE IN CURABLE COMPOSITIONS06-02-2016
20160159969EPOXY RESIN COMPOSITIONS - A novel modified epoxy compound that is capable of providing a coating composition with acceptable viscosity, short tack-free time and thy-hard time, and providing resultant coating films with good impact resistance; a process of preparing the modified epoxy compound; an epoxy resin composition comprising the modified epoxy compound; and a curable coating composition comprising the epoxy resin composition and a curing agent.06-09-2016
20160159971COMPOUND CONTAINING PHOSPHONIUM ION, EPOXY RESIN COMPOSITION CONTAINING SAME, AND DEVICE MANUFACTURED BY USING SAME - The present invention relates to a compound containing phosphonium ion of a chemical formula 1, an epoxy resin composition containing the same, and a device manufactured by using the same.06-09-2016
20160160078OXIRANE (ETHYLENE OXIDE) POLYURETHANE COATINGS - The present invention relates to hydrophilic, i.e., water loving coatings (hereafter referred to as “WLC”). Polyurethane epoxy alkylene oxide coatings usable as coatings on for example, medical devices are a preferred WLC.06-09-2016
20160160100ADHESIVE FOR HYDROPHOBIC OR WATER-REPELLENT SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed is an adhesive composition for hydrophobic or water-repellent substrate comprises an modified epoxy resin, a urethane resin, and a dilution solvent. The adhesive composition according to the present invention can be employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate.06-09-2016
20160168467LIQUID CRYSTAL ALIGNMENT AGENT AND LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT FORMED FROM THE LIQUID CRYSTAL ALIGNMENT AGENT06-16-2016
20160168468LIQUID CRYSTAL ALIGNMENT AGENT AND LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT FORMED FROM THE LIQUID CRYSTAL ALIGNMENT AGENT06-16-2016
20160177125CURING AGENT FOR EPOXY COATINGS06-23-2016
20160185895RESIN COMPOSITION AND COATING MATERIAL USING THE SAME - A resin composition formed by reacting a polyester-polyacid oligomer with a poly-epoxy oligomer is provided. The functionality of the resin composition is between 4 and 10. The weight average molecular weight of the resin composition is between 3,000 and 20,000 g/mol.06-30-2016
20160185896USE OF 2,5-BIS(AMINOMETHYL)FURAN AS A HARDENER FOR EPOXY RESINS - The present invention relates to the use of 2,5-bisaminomethylfuran as hardener for resin components made of epoxy resin and reactive diluent, and also to a corresponding curable composition, curing thereof, and the cured epoxy resin obtainable therefrom. The present invention further relates to the use of 2,5-bisaminomethylfuran as hardener for the production of epoxy-resin-based coatings, in particular of floor coatings with early-stage water resistance.06-30-2016
20160194436GLYCIDYL ETHERS OF DIVINYLBENZENE DERIVATIVES AND OLIGOMERS THEREOF AS CURABLE EPOXY RESINS07-07-2016
20160194517Underfill Material and Method for Manufacturing Semiconductor Device Using the Same07-07-2016
20160199254Method for Forming Resin Bodies and Formed Article07-14-2016
20160200865RADICAL CROSSLINKING OF POLYETHER CARBONATE POLYOLS THAT HAVE ELECTRON-POOR AND ELECTRON-RICH DOUBLE BONDS07-14-2016
20160376398EPOXY RESIN SYSTEM - A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.12-29-2016
20180022976Adhesive Composition with High Frequency Characteristics and Application thereof01-25-2018

Patent applications in class Process of forming a composition containing a nonreactive material (NRM) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof

Patent applications in all subclasses Process of forming a composition containing a nonreactive material (NRM) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof

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