| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 523466000 | Inorganic SI-O bond DNRM | 75 |
| 20100081732 | METHOD OF USING HYPERBRANCHED POLYAMINE TO EXFOLIATE INORGANIC CLAY INTO RANDOM FORM OF NANOSILICATE PLATELET - A method for producing random form of nanosilicate platelets comprises mixing and acidifying an exfoliating agent with an inorganic acid to form an acidified exfoliating agent; intercalating layered inorganic silicate clay with the acidified exfoliating agent to form a mixture; and dissolving the mixture in a solvent and reacting it with a hydroxide or chloride of alkali metal or alkaline-earth metal. The hyperbranched polyamines serving as the exfoliating agent are prepared by polymerizing poly(oxypropylene)-triamine and diglycidyl ether of bisphenol-A (DGEBA). Hydrophilic amine groups of the exfoliating agent are acidified and then reacted with the layered inorganic silicate clay through cation exchange reaction and physical clay exfoliation to give random form of nanosilicate platelets. | 04-01-2010 |
| 20100210759 | Adhesive Compositions, Micro-fluid Ejection Devices and Methods for Attaching Mirco-Fluid Ejection Heads - Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.). | 08-19-2010 |
| 20100216912 | TRANSPARENT HYBRID SHEET - There is provided a transparent hybrid sheet having superior transparency and thermal resistance and having smaller linear expansion coefficient and optical anisotropy and higher degree of flatness. In a transparent hybrid sheet obtained by curing a hybrid composition including an epoxy resin composition containing alicyclic epoxy compound and a curing agent and curing a glass filler together, the alicyclic epoxy compound contains, as a principal component thereof, a diepoxybicyclohexyl compound represented by Formula (1) below, with amounts of isomers of the diepoxybicyclohexyl compound being 20% or less, of a sum of the diepoxybicyclohexyl compound and the isomers, in terms of a ratio of its peak area determined by a gas chromatography. | 08-26-2010 |
| 20100216913 | Curable Epoxy Resin Composition and Cured Product Thereof - A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 μm, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength. | 08-26-2010 |
| 20100286311 | SILICA AND ALSO EPOXY RESINS - Fumed silicon dioxide powder in the form of aggregated primary particles having a BET surface area of 175±15 m | 11-11-2010 |
| 20110039983 | SURFACE MODIFIED SILICON DIOXIDE PARTICLES - Surface-modified silicon dioxide particles or silica sol preparable by reacting aqueous silica sol with at least one first modifier comprising at least one alkoxysilane and with at least one second modifier selected from the group consisting of halosilane, siloxane, and mixtures thereof, with water being removed before the reaction with the first or second modifier. | 02-17-2011 |
| 20110112222 | FIBER REINFORCED POLYMERS, EPOXY-BASED POLYMERIC COMPOSITIONS AND USE THEREOF - A composition including an epoxy resin having at least a difunctional epoxy resin and at least one cross-linking agent for epoxy resin. The difunctional epoxy resin has a viscosity of from 1000 to 5000 mPa·s. The composition may include a low viscosity diluent for modulating the composition viscosity in an amount not higher than 10% by weight. | 05-12-2011 |
| 20110160345 | POLYMERIC COMPOSITE INCLUDING NANOPARTICLE FILLER - Disclosed is a novel polymeric composite including a nanoparticle filler and method for the production thereof. More particularly, the present invention provides a novel halloysite nanoparticle filler which has the generally cylindrical or tubular (e.g. rolled scroll-like shape), in which the mean outer diameter of the filler particle is typically less than about 500 nm. The filler is effectively employed in a polymer composite in which the advantages of the tubular nanoparticle filler are provided (e.g., reinforcement, flame retardant, chemical agent elution, etc.) with improved or equivalent mechanical performance of the composite (e.g., strength and ductility). | 06-30-2011 |
| 20110178207 | Particle-stabilised emulsions - The invention relates to water-in-oil (W/O) or oil-in-water (O/W) emulsions containing an oil phase of at least one water-insoluble constituent; an aqueous phase; pyrogenic silica at the oil-water interface, the pyrogenic silica partially silylated such that non-silylated surface silanol groups remaining are between 95% and 5% of initial silanol groups, the equivalent of 1.7 to 0.1 surface SiOH groups per nm | 07-21-2011 |
| 20110184092 | EPOXY RESIN COMPOSITION - Curable epoxy resin composition, which is suitable for the production of electrical insulation systems for low, medium and high voltage applications, including at least an epoxy resin, a hardener, a mineral filler material, and optionally further additives, wherein (i) the epoxy resin component is a diglycidylether of bisphenol A (DGEBA); (ii) the hardener includes methyltetrahydrophthalic anhydride (MTHPA) and polypropylene glycol (PPG), wherein (iii) the average molecular weight of the polypropylene glycol (PPG) is within the range of about 300 to about 510 Dalton; and (iv) the molar ratio of methyltetrahydrophthalic anhydride (MTHPA) to polypropylene glycol (PPG) is within the range of about 9:1 to 19:1. A method of making the epoxy resin composition and electrical articles made therefrom are also provided. | 07-28-2011 |
| 20110190421 | ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE - Provided is an adhesive composition into which an additive for capturing a cation is incorporated, thereby making it possible to form a semiconductor-device-producing adhesive sheet capable of preventing deterioration of the electrical characteristic of a produced semiconductor device so as to improve the product reliability of the device. An adhesive composition, for producing a semiconductor device, which contains at least an additive for capturing a cation. | 08-04-2011 |
| 20110224333 | RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE - The present invention relates to a resin composition for electronic component encapsulation including: A: a cyanate ester resin; B: at least one selected from the group consisting of a phenol resin, a melamine compound and an epoxy resin; and C: an inorganic filler. | 09-15-2011 |
| 20110230596 | GLASS FIBERS HAVING IMPROVED STRENGTH - A glass fiber and a method of manufacturing a glass fiber for reinforcing a transparent composite matrix are disclosed. The glass fiber includes a first glass material having a first set of mechanical properties including a first modulus and a first coefficient of thermal expansion (CTE) and a second glass material having a second set of mechanical properties including a second modulus and a second CTE. The second glass material forms a substantially uniform coating on the first glass material. The second CTE is less than the first CTE. The glass fiber is formed by reducing the cross-section of a glass fiber preform of the first glass material coated with the second glass material by hot working. Because of the selected difference in the CTE's, the first glass material imparts a compressive force upon the second glass material, which improves the strength of the glass fiber. | 09-22-2011 |
| 20110230597 | GLASS FIBERS HAVING IMPROVED DURABILITY - A glass fiber and a method of manufacturing a glass fiber for reinforcing a transparent composite matrix is disclosed. The glass fiber includes a first glass material having a first refractive index, a first modulus, and a first durability characteristic and a second glass material having a second refractive index, a second modulus, and second durability characteristic. The second durability characteristic is greater than the first durability characteristic. Durability characteristic is selected from the group comprising resistance to chemical attack, resistance to acid attack, resistance to fading from exposure to ultra-violet radiation, and resistance to mechanical abrasion. | 09-22-2011 |
| 20110237712 | CERAMIC POWDER AND USE THEREOF - The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 μm; that observed for the second peak falls within the range of from 2 to 7 μm; the content of the particles having a particle size of greater than 7 μm and less than 12 μm is not more than 18% (including 0%); and wherein the ratio (F2/F1) of the frequency value F2 of the maximum particle size for the second peak to that F1 of the maximum particle size for the first peak ranges from 0.5 to 1.3. | 09-29-2011 |
| 20120010330 | CURABLE COMPOSITIONS CONTAINING CYCLIC DIAMINE AND CURED PRODUCTS THEREFROM - A curable composition including (a) at least one cyclic diamine, (b) at least one non-heterocyclic amine that has a pKa value of approximately 9.5 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the cyclic diamine compared to the total amine hydrogens from both the cyclic diamine and the non-heterocyclic amine in the composition are greater than about 5%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; and (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition. | 01-12-2012 |
| 20120046391 | ANISOTROPIC COMPOSITE - A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent. | 02-23-2012 |
| 20120101191 | THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE - A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm. | 04-26-2012 |
| 20120196955 | ANISOTROPIC COMPOSITE - A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent. | 08-02-2012 |
| 20120202923 | AMORPHOUS SILICA AND PROCESS FOR PRODUCING SAME - Provided are amorphous silica particles for application to industrial fields where there are increasing desires for high purity and colorlessness. The amorphous silica particles are produced through the steps of hydrolysis of an alkoxide, vacuum drying, and firing. The amorphous silica particles have been reduced in coloration and in Fe content, which is causative of coloration of the silica, and can meet the desires. The amorphous silica is characterized by having an Fe content of 20 ppm or less. | 08-09-2012 |
| 20120208931 | VIBRATION-DAMPING SHEET, METHOD FOR DAMPING VIBRATION OF VIBRATING MEMBER, AND METHOD FOR USE THEREOF - A vibration-damping sheet includes a resin layer having a glass transition temperature of more than 140° C. and 180° C. or less, and a constraining layer laminated on the resin layer. | 08-16-2012 |
| 20120259044 | HYPERBRANCHED POLYMERS FOR MODIFYING THE TOUGHNESS OF ANIONICALLY CURED EPOXY RESIN SYSTEMS - The invention relates to a curable composition comprising one or more epoxy compounds, one or more anionically curing catalysts, and an addition of one or more dendritic polymers, selected from the group consisting of the dendritic polyester polymers, the dendritic polyesteramide polymers, and the dendritic polymers based on 1,3,5-tris-alkanol-substituted cyanuric acid. These dendritic polymers improve mechanical properties, in particular the toughness of the cured epoxy resin. | 10-11-2012 |
| 20120302669 | PHOSPHOROUS FLAME RETARDANT AND APPLICATION THEREOF TO POLYMER - A phosphorous flame retardant primarily includes hexachlorotriphosphazene (HCP) having poly(oxyalkylene)amine substitutes. The poly(oxyalkylene)amine includes at least two end groups. The phosphorous flame retardant can further include layered silicate clay. The layered silicate clay can be intercalated and modified with the poly(oxyalkylene)amine substitutes of HCP to effectively promote thermal stability. The flame retardant, phosphazene-poly(oxyalkylene)amine adducts, can be applied to a polymer. By the cross-linking between them, the flame-retarding property of the polymer can be improved. Also provided is a method for producing the flame retardant of phosphazene-poly(oxyalkylene)amine adducts and application thereof to a polymer. | 11-29-2012 |
| 20120309870 | RESIN SYSTEM COMPRISING DISPERSED MULTIMODAL SURFACE-MODIFIED NANOPARTICLES - Dispersions of nanoparticles in a resin component are described. The nanoparticles have a multimodal particle size distribution including at least a first mode and a second mode. The number average particle diameter of the particles in the first mode is greater than the number average particle size distribution in the second mode. The use of multimodal nanoparticle size distributions and the relative number of particles in the first and second mode to reduce or eliminate particle stacking behavior is also described. | 12-06-2012 |
| 20130012624 | METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION AND PULVERIZING APPARATUS - A pulverizing apparatus is a gas stream type pulverizing apparatus. The pulverizing apparatus has a pulverizing unit for pulverizing a composition, a cooling device, a high-pressure air generating device and a collecting unit for receiving the pulverized composition. The chamber has a bottom portion, an outlet formed in the bottom portion for discharging the pulverized first composition therethrough and a wall portion formed in the bottom portion so as to surround the outlet. A plurality of first nozzles and a second nozzle are provided on a side portion of the chamber and a tubular supply unit is provided on an upper portion of the second nozzle. The gas pressure supplied into the chamber is 0.3 MPa or more, the gas temperature is 20° C. or less, and the humidity of the gas is 40% RH or less. | 01-10-2013 |
| 20130023605 | CURABLE COMPOSITIONS - A curable composition comprising (A) a resin component, comprising (i) an epoxy compound, (ii) a diluent, and (Hi) a first filler and (B) a hardener component, comprising (iv) a curing agent, (v) a second filler, and (vi) a non-reactive polyether block copolymer additive. The resin component and hardener component each having a viscosity of no greater than 30 Pascal-second under an applied shear of 10 reciprocal seconds at 25 degrees Celsius and the curable composition after 120 seconds of mixing the resin component and hardener component together under an applied shear of 10 reciprocal seconds has a viscosity of at least 100 Pascal-second at 25 degrees Celsius. | 01-24-2013 |
| 20130109788 | SPHERICAL ALPHA SILICON CARBIDE, THE METHOD FOR MANUFACTURING THE SAME, AND A SINTERED BODY AS WELL AS AN ORGANIC RESIN-BASED COMPOSITE MADE FROM THE SILICON CARBIDE | 05-02-2013 |
| 20130116363 | ARTIFICIAL MARBLE CONTAINING CHIPS OF PLATE-SHAPED WASTE GLASS AND METHOD FOR FABRICATING THE SAME - The present invention relates to artificial marble including chips of plate-shaped waste glass and a method for fabricating the same. The method includes preparing chips of plate-shaped waste glass having a thickness of 0.6 mm or less and a large diameter of 20 mm or less using thin plate glass as a waste product generated in production of an LCD backlight unit, and adding the chips to a base compound including at least one polymer resin and an additive. The prepared artificial marble has an outer appearance similar to that of natural stone, a surface having excellent properties, and optimum characteristics when used as an interior material for floors, walls, kitchens, and the like. | 05-09-2013 |
| 20130165551 | ADHESIVE RESIN COMPOSITION FOR HDD MOTOR AND HDD MOTOR FABRICATED USING THE SAME - There are provided an adhesive resin composition for a HDD motor and a HDD motor fabricated using the same. The adhesive resin composition for a HDD motor includes: 25 to 35 parts by weight of a bisphenol E-epoxy resin; 10 to 25 parts by weight of an epoxy resin; 10 to 20 parts by weight of mercaptan; and 5 to 15 parts by weight of imidazole. The constituents of an epoxy adhesive material may be controlled, such that a curing speed may be increased, as compared to the case of the related art, thereby enhancing working efficiency and reliability. | 06-27-2013 |
| 20130172447 | PHOSPHOROUS FLAME RETARDANT INCLUDING NSP - A phosphorous flame retardant including nanosilicate platelets (NSP) is made by first reacting hexachlorotriphosphazene (HCP) with poly(oxyalkylene)amine, then mixing the HCP product with nano silicate platelets (NSP) to obtain the phosphorous flame retardant including NSP. The phosphorous flame retardant can be further applied to an epoxy resin as a curing agent. | 07-04-2013 |
| 20130172448 | EPOXY COMPOSITE - The invention relates to a process for making a epoxy composite. In the process an epoxy prepolymer, a curing agent and a particulate filler are combined to form a curable mixture. The mixture is then agitated under a non-air atmosphere to render it substantially homogeneous, and pressure is applied to the mixture to reduce or eliminate gas pockets in the mixture and is maintained until the curable mixture is cured to form the epoxy composite. | 07-04-2013 |
| 20130203898 | HYPERBRANCHED POLYMERS FOR MODIFYING THE TOUGHNESS OF CURED EPOXY RESIN SYSTEMS - The invention relates to a curable composition comprising one or more epoxy compounds, one or more amino hardeners, and an addition of one or more dendritic polymers selected from the group of the dendritic polyester polymers, where the dendritic polyester polymers can be produced through an Ax+By synthesis route. | 08-08-2013 |
| 20130245161 | RESIN COMPOSITION FOR INSULATION FILM - A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes. | 09-19-2013 |
| 20130310487 | Thermally Conductive, Electrically Insulating, Silicon-Containing Epoxy Molding Compounds - Thermally conductive, electrically insulating epoxy molding compounds that use milled silicon as a filler material, and methods and processes for making the same. Some example embodiments of the present invention comprise the use of a passivation agent, for example ethyl silicate, to deposit a thin layer of glass on the surfaces of the powders as the powders are milled, creating an attractive surface dielectric property on these surfaces. | 11-21-2013 |
| 20130338268 | GLASS COMPOSITION FOR PRODUCING HIGH STRENGTH AND HIGH MODULUS FIBERS - A glass composition including SiO | 12-19-2013 |
| 20140031455 | METHOD FOR PRODUCING A COMPOUND BASED ON PSEUDOLAMINAR SILICATES AND THE USE THEREOF AS A FILLER FOR POLYMERIC MATERIALS - The present invention relates to a method for producing a compound that comprises a pseudolaminar silicate of natural origin, which is at least one clay of the paligorskite-sepiolite group, characterized in that said method comprises the following steps: defibrillating the microfibre bundles of the at least one clay in water; dispersing the defibrillated clay in an organic or inorganic liquid solvent until a stable gel is formed; adding to the dispersion at least one clay-surface-modifying agent; removing the solvent from the dispersion by means of a solid-liquid separation process and/or drying process; and deagglomerating the final compound until a powdered product is obtained. A further object of the present invention is the compound that can be obtained using said method, as well as the use of the compound as an additive or filler in composite polymeric materials in order to enhance the properties thereof, the composite polymeric material likewise being encompassed within the present invention. | 01-30-2014 |
| 20140179832 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME - The present invention provides an epoxy resin composition for encapsulating a semiconductor device, comprising: an epoxy resin, a curing agent, a curing accelerator, a coupling agent, and an inorganic filler, wherein the coupling agent comprises an alkylsilane compound represented by Formula 1: | 06-26-2014 |
| 20140179833 | EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME - A epoxy resin composition includes an epoxy resin including repeat units represented by Formulae 1 and 2; a curing agent; a curing accelerator; and an inorganic filler, | 06-26-2014 |
| 20140179834 | EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME - An epoxy resin composition includes an epoxy resin including repeat units represented by Formulae 1 and 2; a curing agent; a curing accelerator; and an inorganic filler, | 06-26-2014 |
| 20140179835 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME - An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1, | 06-26-2014 |
| 20140179836 | EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF - Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties. | 06-26-2014 |
| 20140213697 | 2,2',6,6'-TETRAMETHYL-4,4'-METHYLENEBIS(CYCLOHEXYLAMINE) AS HARDENER FOR EPOXY RESINS - The present invention relates to a curable composition which comprises epoxy resin, epoxy-group-bearing reactive diluent and the hardener 2,2′,6,6′-tetramethyl-4,4′-methylenebis(cyclohexylamine), curing thereof, and the cured epoxy resin obtainable therefrom, and the use of 2,2′,6,6′-tetramethyl-4,4′-methylenebis(cyclohexylamine) as a hardener for epoxy resins in curable compositions with epoxy-group-bearing reactive diluent. | 07-31-2014 |
| 20140221532 | GEL TIME CONTROLLABLE TWO PART EPOXY ADHESIVE - The present invention provides a gel time controllable epoxy adhesive, which includes a first part comprising an epoxy resin containing two or more epoxy groups in one molecule, and a second part comprising a thiol curing agent, wherein a peroxide is comprised in part A, part B and/or a third separate part C. | 08-07-2014 |
| 20140243456 | Anhydride Accelerators for Epoxy Resin Systems - Carboxylic acid salts of tertiary amines for use as an accelerator for an anhydride based epoxy curing agents are disclosed. The disclosed carboxylic acid salts of certain tertiary amines are latent anhydride accelerators and enable epoxy resin curing when heated to an elevated temperature (e.g., an onset temperature of greater than about 50° C.). | 08-28-2014 |
| 20140378581 | COMPOSITE MATERIAL - Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves. | 12-25-2014 |
| 20150025178 | AMINE CURABLE EPOXY RESIN COMPOSITION - The present invention relates to an amine curable epoxy resin composition comprising: (A) epoxy resin component comprising: 8-31 wt % of diglycidyl ether of bisphenol A, 3-14 wt % of diglycidyl ether of bisphenol F, 1-5 wt % of monoglycidylether, 0.6-5 wt % of alkylsulphonic phenyl ester, 0.16-1 wt % of wetting and dispersing agent, 0.16-1 wt % of defoamer, and 5-40 wt % of barium sulfate; (B) hardener component comprising: 3-18 wt % of first amine based composition, and 2-12 wt % of second amine based composition, wherein the first amine based composition comprises N,N′-bis(3-aminomethylbenzyl)-2-hydroxytrimethylenediamine represented by the following formula (I) and m-xylylenediamine, and the second amine based composition comprises the reaction products of m-xylylenediamine and styrene represented by the following formula (II) and m-xylylenediamine, wherein A is phenylene, and each of R | 01-22-2015 |
| 20150045478 | Polymer Composites with Silicon Dioxide Particles - Silicon dioxide particles can reinforce the mechanical properties of an epoxy matrix. Combining carbon nanotubes with the icon dioxide particles to co-reinforce the epoxy matrix achieves increases in compression strength, flexural strength, compression modulus, and flexural modulus. Such composites have increased mechanical properties over that of neat epoxy. | 02-12-2015 |
| 20150065613 | EPOXY ADHESIVE COMPOSITION - A curable epoxy adhesive composition including (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) at least a first hydrophilic filler that has a predetermined aspect ratio; (e) at least a second hydrophobic filler that is different from the first filler and that has a predetermined aspect ratio; and (f) at least a third filler that is different from the first and second fillers; wherein the third filler has a predetermined aspect ratio higher than the first filler and the second filer; and wherein the volume ratio of the third filler to the combination of the first filler and second filler is in the range of from 1:1 to 10:1 such as to minimize the thermal residual stresses of the cured product made from the curable composition. | 03-05-2015 |
| 20150094403 | SURFACE-MODIFIED INORGANIC FILLER, METHOD FOR PREPARING THE SAME, EPOXY RESIN COMPOSITION AND INSULATING FILM INCLUDING THE SAME - Disclosed herein is a surface-modified inorganic filler including an alkyl group and an amine group sequentially introduced on a surface thereof, wherein the alkyl group and the amine group are introduced on the surface of the inorganic filler in a weight ratio between the alkyl group and the amine group of 0.5:9.5 to 4:6. An epoxy resin composition including the surface-treated inorganic filler according to the present invention may have low dielectric loss rate and low coefficient of thermal expansion properties. | 04-02-2015 |
| 20150148453 | HALOGEN-FREE EPOXY RESIN COMPOSITION FOR INTEGRATED CIRCUIT PACKAGING - Disclosed is a halogen-free epoxy resin composition for integrated circuit packaging, and the resin composition includes a polyfunctional epoxy resin, a benzoxazine resin, a phosphorus-containing a curing agent, an inorganic filler, a curing accelerator and a solvent. The rigid and firm resins and inorganic filler contained in the composition provide a low coefficient of thermal expansion and a high heat resistance, so that laminates made of this composition are applicable for IC packaging substrates, and the laminates contain halogen-free compounds with a flame retardant rating of UL94-V0 grade. | 05-28-2015 |
| 20150148454 | POLYESTER COMPOSITIONS - The invention relates to compositions, especially thermoplastic moulding compositions, comprising polyethylene terephthalate (PET), poly(1,4-cyclohexanedimethanol terephthalate) (PCT), glass fibres and talc, to the use of these compositions in the form of moulding compositions for production of products resistant to heat distortion for short periods, and to a process for producing polyester-based products resistant to heat distortion for short periods, preferably polyester-based electric or electronic products, especially polyester-based optoelectronic products. | 05-28-2015 |
| 20150315430 | FIBER REINFORCED POLYMER COMPOSITE WITH A HARD INTERPHASE - A fiber reinforced polymer composition is provided comprising a fiber and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin, a curing agent, and a hard interfacial material. When cured, the adhesive composition forms good bonds to the reinforcing fiber, and an interfacial region between the reinforcing fiber and the adhesive composition is formed which comprises the hard interfacial material. Additional embodiments include a prepreg and a method of manufacturing a composite article by curing the adhesive composition and the reinforcing fiber. | 11-05-2015 |
| 20150337075 | RESIN COMPOSITION, PREPREG, AND FILM - A resin composition for transparent substrates comprises an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) comprises a cyclohexane tricarboxylic anhydride. | 11-26-2015 |
| 20160002109 | PROCESS FOR THE MANUFACTURING OF SLABS OR BLOCKS OF CONGLOMERATE OF STONE GRANULATE AND POLYESTER RESIN - In the manufacture of articles in slabs or blocks according to so-called Bretonstone technology, a polyester resin is employed, free of reactive solvents, formed by the reaction between an epoxidised triglyceride and at least one carboxylic anhydride. | 01-07-2016 |
| 20160032077 | THIXOTROPY-INCREASING ADDITIVE AND COMPOSITION CONTAINING SAID ADDITIVE - The invention relates to a use of at least one condensation product (A) in the form of the free compound or in the form of a salt of at least one acid as a thixotropy- increasing additive, which condensation product can be obtained by reacting at least one polymerized fatty acid or at least one reaction product (U) of at least two polymerized fatty acids and at least one polyamine having at least two primary amino groups as component (a1) with at least one polyalkylene polyamine, which is capable of forming at least one imidazoline and/or tetrahydropyrimidine unit and which has at least two primary amino groups or at least one primary and at least one secondary amino group, a composition containing at least one such condensation product (A) and at least one thixotropic agent (B), and a use of said composition, which additionally comprises at least one binder (C), as an adhesive, sealant, paint, coating agent, adhesive resin, casting resin, artificial marble, floor covering, polymer concrete, or fiber composite material. | 02-04-2016 |
| 20160083543 | CARBON FIBRE-CONTAINING PREPREGS - A prepreg comprising at least one layer of carbon fibres and a curable thermosetting resin system, the curable thermosetting resin system at least partly impregnating the at least one layer of carbon fibres, wherein the curable thermosetting resin system comprises:
| 03-24-2016 |
| 20160083557 | FILLER POWDER AND METHOD FOR MANUFACTURING SAME - Provided is a filler powder that has a lower coefficient of thermal expansion than silica powder and is less likely to cause quality and color alteration of a resin when blended into the resin. The filler powder is made of a crystallized glass in which β-quartz solid solution and/or β-eucryptite is precipitated. The filler powder preferably has an average particle size D | 03-24-2016 |
| 20160115283 | EPOXY-RESIN COMPOSITION FOR FIBER-MATRIX SEMIFINISHED PRODUCTS - The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one imidazole compound and at least one latent hardener. In said epoxy-resin composition, the amount of the imidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition, and the total amount of primary amine groups optionally comprised does not exceed a proportion of 0.09 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm. The fiber-matrix-semifinished-product composition can be produced via mixing of the constituents, whereupon the composition thickens. The resultant thickened product (semisolid fiber-matrix semifinished product) features comparatively short maturing time and comparatively long available operating time. The invention also relates to the corresponding semisolid fiber-matrix composite, in particular to the semisolid SMC and to the corresponding cured fiber-matrix semifinished product, in particular the cured SMC. Finally, the invention also relates to a screening process for identifying epoxy-resin-based compositions which are suitable for use as thermoset matrix for producing SMC. | 04-28-2016 |
| 20160168342 | Method For Manufacturing Nano-Structurally Aligned Multi-Scale Composites | 06-16-2016 |
| 20160168372 | EPOXY-BASED RESIN COMPOSITION FOR COMPOSITE MATERIALS | 06-16-2016 |
| 20160194437 | NEW FORMULATION METHODOLOGY FOR DISTORTIONAL THERMOSETS | 07-07-2016 |
| 523467000 | Polymer derived from ethylenic reactants only | 14 |
| 20120071587 | USE OF CURABLE RESINS CONTAINING A PREPOLYMER BASED ON GLYCIDYL (METH)ACRYLATE FOR MAKING MATERIALS FOR USE IN SPACE - It relates to the use of curable resins containing a prepolymer based on glycidyl (meth)acrylate for making composite materials for use in space and, more particularly to composite materials entering the composition of structures intended to be deployed in space and to be stiffened after deployment. | 03-22-2012 |
| 20120157575 | POLYMER COMPOSITION, RUBBER COMPOSITION, AND TIRE OBTAINED USING SAME - The present invention relates to a polymer composition containing (A) an elastomer that has a reactive functional group on a main chain, (B) an inorganic filler, and (C) a coupling agent that has one or less on average per molecule of a modification functional group having binding reactivity with the reactive functional group on the main chain of the elastomer as the component (A), and has a functional group having affinity with the component (B) or being capable of being bonded to the component (B), a rubber composition containing the polymer composition, and a tire containing the rubber composition, and provides a polymer composition that provides a rubber composition capable of enhancing fuel consumption efficiency of a tire and imparting sufficient wear resistance and rupture resistance to a tire, a rubber composition that has the aforementioned properties, containing the polymer composition, and a tire containing the rubber composition. | 06-21-2012 |
| 20120283360 | Rubber Composition Including an Expoxide Resin - A rubber composition which can be used in particular in tires, based on at least one diene elastomer, one reinforcing filler, one crosslinking system, between 1 and 20 phr of an epoxide resin and between 1 and 15 phr of an amine-comprising curing agent. The pair formed of epoxide resin with an amine-comprising curing agent advantageously replaces the pair formed of phenol/formaldehyde resin, which is a methylene acceptor, with the curing agent(s) HMT or H3M, which are conventional methylene donors. The use of this pair of reactants, epoxide resin and amine-comprising curing agent, makes it possible to obtain rubber compositions exhibiting a greater low-strain stiffness in comparison with conventional rubber compositions, without significantly damaging the hysteresis. Moreover, the combination of a phenolic resin, which is a methylene acceptor, with HMT or H3M, which is a methylene donor, produces formaldehyde during the vulcanization of the rubber composition. In point of fact, it is desirable to reduce, indeed even in the long run to eliminate, the formaldehyde of rubber compositions due to the environmental impact of this compound. | 11-08-2012 |
| 20120329914 | HEAT-STABILIZED ACRYLATE ELASTOMER COMPOSITION AND PROCESS FOR ITS PRODUCTION - Polyamide-filled acrylate copolymer compositions comprising a continuous acrylate copolymer phase and a discontinuous polyamide phase are produced by a melt mixing process. When crosslinked with diamine curatives the polyamide-filled acrylate copolymer compositions exhibit enhanced resistance to heat aging compared to carbon black-reinforced acrylate copolymer compositions. | 12-27-2012 |
| 20130225728 | ADDUCT - An adduct of (a) at least one divinylarene dioxide, and (b) at least one end-functionalized polymer. For example, the adduct may be beneficially used as a toughening agent for toughening thermoset resins such as epoxy resins. | 08-29-2013 |
| 20140179837 | RUBBER COMPOUND AND TIRE WITH COMPONENT - The invention relates to a rubber composition with a stiffness property promoted by combination of short fibers and resin product of a methylene donor and a methylene acceptor, where at least a portion of the methylene acceptor is comprised of expoxidized phenol formaldehyde, and to a tire with a component comprised of such rubber composition. | 06-26-2014 |
| 20140275347 | MODIFIED NANO-CLAY MATERIALS AND NANOCOMPOSITES MADE THEREFROM - A nano-clay material that exhibits improved compatibility with polymers is described. The nano-clay material may be mixed with polymers to produce a nano-clay polymer nanocomposite material including reduced levels of clay loading. Methods for making the nano-clay nanocomposite material and articles of manufacture from the nanocomposite material are also described. | 09-18-2014 |
| 20140303286 | ADHESIVE COMPOSITION FOR TEMPORARILY BONDING USE IN WAFER MANUFACTURING - The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer. | 10-09-2014 |
| 20150306790 | PROCESS FOR THE PRODUCTION OF STORAGE-STABLE EPOXY PREPREGS, AND COMPOSITES PRODUCED THEREFROM, BASED ON EPOXIDES AND ACIDS AMENABLE TO FREE-RADICAL POLYMERISATION - A process for the production of storage-stable epoxy prepregs is provided. In addition, composites produced from the prepregs based on epoxides and acids having groups reactive to free-radical polymerisation is provided. | 10-29-2015 |
| 20160017067 | MODIFYING AGENT, RESIN COMPOSITION, AND RESIN MOLDED ARTICLE - A modifying agent includes an acrylic copolymer containing an acrylic acid ester monomer unit, a methacrylic acid ester monomer unit, a monomer unit of a compound represented by Formula (1), and a cationic monomer unit: | 01-21-2016 |
| 20160017134 | Coated Article - An article is provided that includes a blend. The blend includes from at least 5.0% to at most 20.0% by weight of polylactic acid (PLA), based on the total weight of the blend; at least 5.0% to at most 92.0% by weight of polypropylene (PP) or of a mixture of polypropylene (PP) and polyethylene (PE), based on the total weight of the blend; from 0.0% to at most 40.0% by weight of an inorganic filler, based on the total weight of the blend; at least 0.1% to at most 10.0% by weight of a compatibilizer, based on the total weight of the blend; and at least 0.1% to at most 40.0% by weight of an elastomer, based on the total weight of the blend. The elastomer is ethylene octene rubber or ethylene butene monomer rubber. The article is at least partially coated with at least one coating. | 01-21-2016 |
| 20160040048 | LIQUID EPOXY RESIN COMPOSITION AND ADHESIVE AGENT FOR HEATSINK AND STIFFENER - Provided is a highly reliable adhesive agent for heatsink or stiffener, obtained by improving a conventional epoxy resin composition. The invention is a liquid epoxy resin composition exhibiting a viscosity of 50 to 1,000 Pa·s when measured by an E-type viscometer at 25° C., and including a liquid epoxy resin exhibiting a viscosity of 0.1 to 1,000 Pa·s when measured as above; a liquid phenol-based curing agent without siloxane bond and exhibiting a viscosity of 0.1 to 100 Pa·s when measured as above; a curing accelerator selected from tetraphenylphosphine, imidazole and tertiary amine; an inorganic filler treated with a silane coupling agent and exhibiting an average particle diameter of 0.1 μm or larger; thermoplastic resin particles being solid at 25° C.; and a silica treated with a silane coupling agent having a nonreactive functional group, and exhibiting an average particle diameter of not smaller than 0.005 μm but smaller than 0.1 μm. | 02-11-2016 |
| 20160130432 | COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - There is provided a composition for a fiber-reinforced composite material, the composition being capable of forming the fiber-reinforced composite material having a long pot life, the excellent work stability, and a high heat resistance. The composition for a fiber-reinforced composite material according to the present invention contains a radically polymerizable compound (A) having not less than two radically polymerizable groups in one molecule thereof, a cationically polymerizable compound (B) having not less than two cationically polymerizable groups in one molecule thereof, a radical polymerization initiator (C) having a 10-hour half-life decomposition temperature of not less than 85° C.; and an acid generator (D) having an exothermic onset temperature of not less than 100° C. as measured using a differential scanning calorimeter (DSC) at a temperature-rise rate of 10° C./min, wherein the composition has a viscosity at 25° C. of not less than 10,000 mPa·s. | 05-12-2016 |
| 20160176083 | MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION | 06-23-2016 |
