| Entries |
| Document | Title | Date |
|---|
| 20110021665 | RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE - A resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The resin composition for semiconductor encapsulation includes (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: | 01-27-2011 |
| 20110213053 | NEW-TYPE PAPERMAKING WET-END DEFOAMER - A new-type papermaking wet-end defoamer and methods of making relating to the field of the chemical preparations for use in papermaking. The defoamer including 5˜99% FAME (fatty acid methyl ester) derivatives having a general structural formula of R | 09-01-2011 |
| 20110313081 | THERMOSETTABLE COMPOSITION CONTAINING A GLYCIDYLETHER BASED ON TRIMETHYOLPROPANE OCTADECAETHOXILATE - A thermosettable composition including (a) a thermosetting resin and (b) at least one toughening agent; wherein the at least one toughening agent is a glycidyl ether based on trimethylolpropane octadecaethoxilate (TMP-18EO). | 12-22-2011 |
| 20110319523 | THERMOSETTABLE COMPOSITION CONTAINING A COMBINATION OF AN AMPHIPHILIC BLOCK COPOLYMER AND A POLYOL AND A THERMOSET PRODUCT THEREFROM - A thermosettable composition including (a) at least an amphophilic block copolymer, (b) at least a polyol, (c) at least an epoxy resin containing an average at least 2 oxirane rings per molecule, (d) at least an anhydride hardener containing an average at least 1 anhydride ring per molecule, and (e) at least a catalyst; and a thermoset product prepared from said thermosettable composition. | 12-29-2011 |
| 20120010328 | CAST RESIN SYSTEM FOR ISOLATORS - A casting resin for switchboards contains bisphenol F fluid epoxy resin. The properties of the casting resin can be significantly improved compared to bisphenol A-based casting resins, in particular regarding glass transition temperature and temperature shock resistance. More specifically, the glass transition temperature is advantageously increased for significantly better performance. | 01-12-2012 |
| 20120029116 | CURABLE ADHESIVE COMPOSITIONS, PROCESS, AND APPLICATIONS - The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent. | 02-02-2012 |
| 20120035299 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri—or more—functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg. | 02-09-2012 |
| 20120115989 | METHOD OF FORMING NANODIELECTRICS - A method of making a nanoparticle filled dielectric material. The method includes mixing nanoparticle precursors with a polymer material and reacting the nanoparticle precursors mixed with the polymer material to form nanoparticles dispersed within the polymer material to form a dielectric composite. | 05-10-2012 |
| 20120115990 | ADDUCT THERMOSETTING SURFACING FILM AND METHOD OF FORMING THE SAME - In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed. | 05-10-2012 |
| 20120172493 | CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM - A curable epoxy resin composite composition including a reinforcing material and an epoxy resin composition, and a process for preparing a composite from such composition; wherein a combination of at least one alkanolamine and at least one styrenated phenol are present in the epoxy resin composition in a sufficient amount to increase the rate of reaction of the at least one epoxy resin and the at least one alkanolamine curing agent while maintaining the thermal and mechanical properties of the composite upon curing of the epoxy resin composition. | 07-05-2012 |
| 20120202922 | HOMOGENOUS DISPENSING PROCESS FOR AN EPOXY-COMPOSITION WITH HIGH FILLER CONTENT - The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises:
| 08-09-2012 |
| 20120208927 | VIBRATION-DAMPING SHEET, METHOD FOR DAMPING VIBRATION OF VIBRATING MEMBER, AND METHOD FOR USE THEREOF - A vibration-damping sheet includes a resin layer having a glass transition temperature of 60° C. or more and 100° C. or less, and a constraining layer laminated on the resin layer. | 08-16-2012 |
| 20120238668 | COATING COMPOSITIONS - A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption. | 09-20-2012 |
| 20120296012 | ROOM TEMPERATURE IONIC LIQUID-EPOXY SYSTEMS AS DISPERSANTS AND MATRIX MATERIALS FOR NANOCOMPOSITES - Formulations containing a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin, the mixture having nano-materials dispersed or dissolved therein. These formulations can be used for the preparation of nanocomposites. Methods of preparing nanocomposites by curing a dispersion of nano-materials in a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin. Nanocomposites comprising a cured product formed by curing an epoxy resin with an ionic liquid or an adduct of an epoxy resin and an ionic liquid having nano-materials dispersed or dissolved therein. Embodiments of the invention permit manufacture of nanocomposites having relatively high fracture toughness, relatively high loadings of nano-materials and the ability to tailor the properties of the nano-composites. | 11-22-2012 |
| 20120302667 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE SAME - An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: | 11-29-2012 |
| 20130005855 | EPOXY RESIN COMPOSITION FOR USE IN A CARBON-FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND CARBON-FIBER-REINFORCED COMPOSITE MATERIAL - Disclosed is a carbon-fiber-reinforced composite material that is suitable for use as a construction material and exhibits high mechanical strength in harsh usage environments such as low-temperature environments and high-temperature moisture-absorbing environments. Also disclosed are an epoxy resin composition for producing the aforementioned carbon-fiber-rein-forced composite material and a prepreg obtained through the use of said epoxy resin composition. Said epoxy resin composition comprises at least the following constituents, by mass with respect to the total mass of the composition: (A) between 20% and 80% of an epoxy resin having the structure represented by formula (1); and (B) between 10% and 50% of an epoxy resin that has at least two ring structures with four or more members each and also has one amine glycidyl or ether glycidyl directly connected to a ring structure. | 01-03-2013 |
| 20130035419 | METHODS FOR DISPERSING CARBON NANOTUBES AND COMPOSITIONS USED FOR THE METHODS - The present invention refers to a method of dispersing carbon nanotubes in a thermosetting resin. The method comprises: (a) contacting the carbon nanotubes with a dispersant in a solvent to form a dispersion mixture, wherein the dispersant is a graft polymer comprising a polymeric backbone and a side chain grafted to the polymeric backbone; and (b) adding the thermosetting resin to the dispersion solution to form a resin blend. The present invention also refers to a composition used for the method. | 02-07-2013 |
| 20130065986 | CURABLE RESIN COMPOSITION AND CURED ARTICLE THEREOF - A curable resin composition essentially includes an epoxy compound (A) having an oxycyclohexane skeleton including a cyclohexane ring and an epoxy group bound thereto through a single bond; an alicyclic epoxy compound (B) having two or more alicyclic epoxy groups per molecule; at least one bisphenol diepoxy compound (C) selected from bisphenol-A epoxy resins and bisphenol-F epoxy resins; a polyglycidyl ether of an aliphatic polyhydric alcohol (D); and a curing agent (E). The curable resin composition can give a cured article which has extremely superior moisture resistance, and, when used typically as an LED sealant, does not cause reduction in luminous flux even under hot and humid conditions. The cured article also has satisfactory cracking resistance and thermal stability in heat cycles. | 03-14-2013 |
| 20130109784 | AQUEOUS RADIATION-CURABLE EPOXY ACRYLATE DISPERSIONS | 05-02-2013 |
| 20130165549 | PRINTING FORM AND PROCESS FOR PREPARING THE PRINTING FORM WITH CURABLE COMPOSITION HAVING SOLVENT-FREE EPOXY RESIN - The invention pertains to a printing form and a process for preparing the printing form from a solvent-free curable composition that includes, in prescribed relative amounts, an epoxy novolac resin; a bisphenol-A epoxy resin or a bisphenol-F epoxy resin; a monofunctional reactive diluent; a multifunctional reactive diluent; and a stoichiometric amount of an amine curing agent. The ratio of the epoxy novolac resin to the bisphenol epoxy resin is 1:3 to 3:1 by weight. The process includes applying the curable composition to a supporting substrate to form a layer, curing the layer at one or more temperatures in a temperature range, and engraving to form at least one cell in the cured layer. The process prepares printing forms, particularly gravure printing forms, having a cured resin composition layer that is engravable, resistant to solvent inks and to mechanical wear, and capable of printing gravure-quality images. | 06-27-2013 |
| 20130165550 | COATING COMPOSITIONS EXHIBITING CORROSION RESISTANCE PROPERTIES, RELATED COATED SUBSTRATES, AND METHODS - Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed. | 06-27-2013 |
| 20130178559 | FIBER-REINFORCED RESIN COMPOSITE MATERIAL - The resin-reinforcing fiber of the preset invention is a fiber surface-treated with an epoxidized polydiene resin. The fiber is preferably carbon fiber or glass fiber. The fiber-reinforced resin composite material of the present invention comprises the resin-reinforcing fiber and a matrix resin. The matrix resin is preferably an epoxy thermosetting resin. | 07-11-2013 |
| 20130184378 | EPOXY RESIN HARDENER COMPOSITIONS AND EPOXY RESIN COMPOSITIONS CONTAINING SUCH HARDENER COMPOSITIONS - An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group. | 07-18-2013 |
| 20130217805 | EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIALS - An epoxy resin composition containing an epoxy resin [A | 08-22-2013 |
| 20130237642 | THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM - A thermosettable (curable) epoxy resin composition including (A) a residual oligomeric product; wherein the residual oligomeric product comprises a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of (i) an aliphatic or cycloaliphatic hydroxyl-containing material with (ii) an epihalohydrin, (iii) a basic-acting substance, (iv) a non-Lewis acid catalyst, and (V) optionally one or more solvents; (B) an epoxy curing material comprising (i) an epoxy resin curing agent, (ii) an epoxy resin catalyst, or both an epoxy resin curing agent (i) and an epoxy resin catalyst (ii); and (C) optionally, an epoxy resin compound other than the aliphatic or cycloaliphatic polyfunctional epoxy resin (A). A thermoset may also be made from the above thermosettable composition. | 09-12-2013 |
| 20130237643 | D1364 BT SECONDARY COATINGS ON OPTICAL FIBER - The invention relates to a Radiation Curable Secondary Coating composition for use on an Optical Fiber. The Radiation Curable Secondary Coating composition is a urethane-free Alpha Oligomer prepared by reaction of the following: (a) an acrylate compound selected from an alcohol-containing acrylate or alcohol-containing methacrylate compound, (b) an anhydride compound, (c) an epoxy-containing compound, (d) optionally an extender compound, and (e) optionally a catalyst. The invention also relates to a coated wire and to a coated optical fiber. | 09-12-2013 |
| 20140058013 | COMPOSITE MATERIAL WITH POLYAMIDE PARTICLES - Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high compression strength under hot and wet conditions, as well as, high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes polyamide particles which are composed of the polymeric condensation product of a methyl derivative of bis(4-aminocyclohexyl)methane and an aliphatic dicarboxylic acid. | 02-27-2014 |
| 20140058014 | EPOXYBENZYL-TERMINATED POLY(ARYLENE ETHER)S, METHOD FOR PREPARATION THEREOF, AND CURABLE COMPOSITIONS COMPRISING SAME - An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards. | 02-27-2014 |
| 20140121299 | ADDUCTS AS TOUGHENERS IN THERMOSETTABLE EPOXY SYSTEMS - A liquid adduct consisting essentially of a reaction product of (a) an aliphatic epoxy resin, and (b) an isocyanate compound, wherein the viscosity of the adduct comprises less than about 60 Pa-s at about 25° C. is disclosed. The adduct can be used in an epoxy resin composition. | 05-01-2014 |
| 20140194554 | EPOXY RESIN COMPOSITIONS - A re-epoxidized polyfunctional epoxy resin composition comprising the reaction product of: (I) an epoxidized polyfunctional epoxy resin oligomeric composition comprising a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of: (i) an aliphatic or cycloaliphatic hydroxyl-containing material; (ii) an epihalohydrin, (iii) a basic-acting substance, in the presence of (iv) a non-Lewis acid catalyst; and (v) optionally, one or more solvents; (II) an epihalohydrin; (III) a basic acting substance; in the presence of (IV) a non-Lewis acid catalyst; and (V) optionally, one or more solvents. A curable epoxy resin composition of the re-epoxidized polyfunctional epoxy resin composition and a thermoset of the curable composition is also disclosed. | 07-10-2014 |
| 20140243452 | DISPERSIONS AND RELATED COATINGS AND CURED ARTICLES - A pre-dispersion composition comprising (i) a silsesquioxane; (ii) a dispersing agent; and (iii) a curable resin. | 08-28-2014 |
| 20140275343 | EPOXY RESIN ADDUCTS AND THERMOSETS THEREOF - An epoxy resin adduct comprising the reaction product of an epoxy resin comprising a diglycidyl ether of Formula 1 as defined herein, and at least one reactive compound having two or more active hydrogen atoms per molecule, wherein the active hydrogen atoms are reactive with epoxide groups are described. The diglycidyl ether contains a cycloaliphatic ring of 3-5 carbon atoms. Curable compositions, methods of curing, cured compositions, and articles comprising the epoxy resin adducts are also disclosed. The epoxy resin adduct has improved cure behavior and provides cured compositions having increased glass transition temperature, good weatherability, and a low total chlorine content. | 09-18-2014 |
| 20140309336 | PREPREG, FIBER REINFORCED COMPOSITE MATERIAL, AND MANUFACTURING METHOD FOR FIBER REINFORCED COMPOSITE MATERIAL - Embodiments herein relate to a prepreg comprising a thermosetting resin, and reinforcing fibers in the thermosetting resin, wherein when the prepreg is cured in vacuum bag only conditions, and a method of making the same. The method also applies for autoclave processing. Embodiments also relate to a cured fiber reinforced composite material made by thermally curing the prepreg. | 10-16-2014 |
| 20150011681 | CURABLE COMPOSITIONS - A curable epoxy resin formulation useful for making an insulator for a high-voltage gas insulated switchgear, the curable formulation including (A) an epoxy resin composition comprising a mixture of: (A1) at least one solid epoxy resin, (A2) at least one novolac epoxy resin, and (A3) at least one cycloaliphatic epoxy resin; (B) at least one anhydride hardener; (C) at least one filler; and (D) optionally, at least one catalyst or at least one accelerator. | 01-08-2015 |
| 20150051317 | MODIFIED EPOXY RESIN COMPOSITION USED IN HIGH SOLIDS COATING - This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, a process making thereof and its application in low VOC high solids coating. | 02-19-2015 |
| 20150099831 | COATING COMPOSITIONS - A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption. | 04-09-2015 |
| 20150119500 | EPOXY RESIN COMPOSITION FOR MARINE MAINTENANCE AND REPAIR COATINGS WITH IMPROVED OVERCOATABILITY - This invention relates to an epoxy resin composition and its application in marine maintenance and repair coating with improved overcoatability. | 04-30-2015 |
| 20150315412 | METAL STABILIZERS FOR EPOXY RESINS AND DISPERSION PROCESS - A method comprising (a) mixing a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, into a dispersant to provide a dispersion; and (b) adding the dispersion to a varnish, is disclosed. | 11-05-2015 |
| 20150322216 | SPRAYABLE, CARBON FIBER-EPOXY MATERIAL AND PROCESS - An article is reinforced by applying to it a thermally curable composition of a resin mixture of 10% to 60% by weight of a diglycidyl ether of bisphenol-A, 5% to 25% by weight of an epoxy novolac, and 5% to 25% by weight of a reinforcement material comprising carbon fibers. Following application, the composition is cured. In some instances, at least a portion of the diglycidyl ether of bisphenol-A and/or the epoxy phenyl novolac resin may be adducted with an elastomer. | 11-12-2015 |
| 20150376398 | SHEET MOLDING COMPOSITION CONTAINING SURFACE MODIFIED GLASS FILLER - A molded article is provided that has a resin matrix having a surface, the resin matrix formed from cross-linked polyester resin or vinyl-ester resin. Glass fibers are crossed linked to the resin matrix via a silane coupling agent reactive with the matrix. A molded article is provided that has a resin matrix having a surface, the resin matrix formed from cross-linked polyester resin or vinyl-ester resin. Glass fibers each covalently bonded to at least one microspheroid matrix via a silane coupling agent reactive with a surface of the at least one microspheroids are present in increase the fiber pull strength. A sizing composition for treating glass fibers is also provided for use in such articles. | 12-31-2015 |
| 20150376445 | EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - An object of the present invention is to provide an epoxy resin composition which has properties and viscosity to be easily controlled, can be cured at a low temperature in a short time, and can provide a cured product having excellent mechanical characteristics such as high tensile elongation at break, and high heat resistance, and a cured product of the epoxy resin composition (resin cured product). | 12-31-2015 |
| 20160002390 | EPOXY RESIN COMPOSITION, PREPREG, FIBER REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER REINFORCED PLASTIC MATERIAL - An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition; wherein the resin composition has a Tg of at least 160° C. when cured at 143° C. for 3 min and also maintains a Tg of greater than 160° C. when cured at 177C for 1 min or longer. | 01-07-2016 |
| 20160024294 | HEAT-CURABLE EPOXY RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - Provided is a heat-curable epoxy resin composition for encapsulating an optical semiconductor element. The resin composition exhibits a high strength and elastic modulus even in a high-temperature environment, hardly turns yellow due to an uneven hardening that occurs immediately after molding, and is solid under a room temperature such that the resin composition can be handled easily. The resin composition includes: a prepolymer obtained through a reaction of (A) a triazine derivative epoxy resin, (B) at least one epoxy resin selected from a group of (B-1) a bisphenol A-type epoxy resin, (B-2) a bisphenol F-type epoxy resin, (B-3) a hydrogenated bisphenol A-type epoxy resin and (B-4) an alicyclic epoxy resin and (C) an acid anhydride curing agent, at an epoxy group equivalent/acid anhydride group equivalent ratio of 0.6 to 2.0; and (D) a curing accelerator, such resin composition capable of being pressure molded under a room temperature before thermally cured. | 01-28-2016 |
| 20160130431 | EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - An epoxy resin composition comprising the following constituents [A], [B], and [C]:
| 05-12-2016 |
| 20160130464 | MODIFIED EPOXY RESIN COMPOSITION USED IN HIGH SOLIDS COATING - This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, a process making thereof and its application in low VOC high solids coating. | 05-12-2016 |
| 20160160040 | HEAT-CURABLE EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - Provided are a heat-curable epoxy resin composition with a superior handling property, transparency and crack resistance; and an optical semiconductor device having an optical semiconductor element encapsulated by such composition. The composition includes:
| 06-09-2016 |
| 20160177085 | Epoxy Resin Containing Silicone-Modified Epoxy Resin and Polyvalent Carboxylic Acid Compound, and Cured Product Thereof | 06-23-2016 |
