| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 523433000 | Polymer derived from reactant containing element other than C, H, O, or N or chlorine-containing reactant of three or more carbon atoms | 10 |
| 20100144928 | Curable Epoxy Resin Composition, Cured Body Thereof, and Use Thereof - A curable epoxy resin composition comprising at least the following components: (I) an epoxy resin; (II) a curing agent for an epoxy resin; (III) a diorganosiloxane having on both molecular terminals siloxane residual radicals represented by the following average unit formula: (XR | 06-10-2010 |
| 20110207852 | SELF-ASSEMBLED SILICA CONDENSATES - Self-assembled silica condensates are described as well as their use in coating compositions. The self-assembled silica condensates can be formed from the hydrolysis of medium to long chain trialkoxy silane compounds. Coating compositions containing the self-assembled silica condensates can provide coatings having improved scratch and mar resistance and can have excellent recoat adhesion. | 08-25-2011 |
| 20120071585 | EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL - Provided is an epoxy resin composition having superior flame resistance without containing a halogen-based flame retardant, red phosphorous or phosphate ester, and a prepreg and a fiber-reinforced composite material that use the epoxy resin composition. The epoxy resin composition has as essential components thereof (A) a phosphorous-containing epoxy resin composed of a compound (a) represented by the following formula (a), (C) a novolak-type epoxy resin, and (D) an epoxy resin curing agent. A prepreg containing the epoxy resin composition and a fiber-reinforced composite material obtained by curing the prepreg are also provided. | 03-22-2012 |
| 20120309869 | FLAME RETARDED COMPOSITIONS - The invention relates to a polyethylene composition comprising a mixture of flame retardants which are bromine-containing polymers. The polyethylene composition is useful in the manufacture of pallets. A process for making the polyethylene composition through a masterbatch route is also disclosed. | 12-06-2012 |
| 20130197129 | LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - Disclosed is a liquid epoxy resin composition containing: (A) a liquid epoxy resin comprising at least one liquid epoxy resin represented by the following general formula (1) or (2): | 08-01-2013 |
| 20140235757 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING SAME - The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), R | 08-21-2014 |
| 20140323611 | STRUCTURAL ADHESIVE SHEET SPECIFICALLY FOR USE IN A MIRROR BASE OF AN AUTOMOBILE INTERIOR REAR-VIEW MIRROR AND A METHOD FOR PRODUCING THE SAME - The present invention provides a structural adhesive sheet specifically for use in a mirror base of an automobile interior rear-view mirror and a method for producing the same, said structural adhesive sheet comprises in parts by weight of 20-100 parts of a nitrile-butadiene rubber, 10-70 parts of a partially cured polysulfide adhesive, 5-40 parts of a bisphenol A type epoxy resin, 0.1-2.5 parts of a crosslinking agent, 0.2-2.5 parts of a softening agent, 3-20 parts of a curing agent, 1-10 parts of an accelerator, 20-100 parts of an inorganic filler, and 0.1-3.0 parts of a silane coupling agent. The structural adhesive sheet of the present invention is obtained by subjecting the above-mentioned components to a compounding process and an extrusion film forming process. The advantages of said structural adhesive sheet include good film-forming property, and simple curing process, while having high structural strength, good toughness, and excellent heat-resistance and cold-resistance after cured. | 10-30-2014 |
| 20150080498 | POLYARYLENE SULFIDE RESIN COMPOSITION AND MOLDED BODY - Provided is a polyarylene sulfide resin composition including a polyarylene sulfide resin, an epoxy resin, glass fiber, and glass flake. The amount of the epoxy resin is 0.5 to 20 parts by mass, the amount of the glass fiber is 10 to 350 parts by mass, and the amount of the glass flake is 1 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin. The epoxy resin is a combination of a bisphenol-type epoxy resin and a novolac-type epoxy resin. Also provided is a molded body formed by melt-molding the resin composition. The resin composition has good adhesiveness to epoxy resins and good flowability. Furthermore, a molded body having high thermal shock resistance can be produced using the resin composition. | 03-19-2015 |
| 20150148450 | HALOGEN-FREE LOW-EXPANSION RESIN COMPOSITION - Disclosed is a halogen-free low-expansion resin composition including a polyfunctional epoxy resin, a phosphorus-containing epoxy resin, a benzoxazine resin, a phosphorus-containing curing agent, an inorganic filler, a curing accelerator, and a solvent. The rigid and firm resins and inorganic filler contained in the composition provide a low coefficient of thermal expansion and a high heat resistance, so that laminates made of this composition are applicable for IC packaging substrates, and the laminates contain halogen-free compounds with a flame retardant rating of UL94-V0 grade. | 05-28-2015 |
| 20160251511 | RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A SEMICONDUCTOR DEVICE | 09-01-2016 |
