| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 523428000 | With reactant nitrogen or sulfur compound | 31 |
| 20090048370 | TWO PART CRASH DURABLE EPOXY ADHESIVES - Two-component epoxy-based structural adhesives are disclosed which exhibit excellent impact resistance, even when cured at approximately room temperature. The adhesives include an epoxy resin component which includes an epoxy resin and a reactive tougher. The adhesives also include a hardener component, which includes from 15 to 50 weight percent of an amine-terminated polyether, from 4 to 40 weight percent of an amine terminated rubber having a glass transition temperature of −40° C. or below, and from 10 to 30 weight percent of an amine-terminated polyamide having a melting temperature of no greater than 50° C. | 02-19-2009 |
| 20100317768 | EPOXY RESIN HARDENER COMPOSITIONS AND EPOXY RESIN COMPOSITIONS CONTAINING SUCH HARDENER COMPOSITIONS - An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group. | 12-16-2010 |
| 20110009528 | EPOXY RESIN COMPOSITION, PREPREG, AND FIBER REINFORCED COMPOSITE MATERIAL - It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]:
| 01-13-2011 |
| 20110184091 | EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL - An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness. | 07-28-2011 |
| 20110190420 | CURABLE POLYMER MIXTURES - Curable polymer mixtures comprising at least one oligomeric addition product with hydrolyzable silane groups and additional functional groups as the mediator additive, and a curable polymer system having epoxy group-carrying polymers and curing agents, fillers and optionally addditives; polymer concrete mixtures and molded bodies produced therefrom | 08-04-2011 |
| 20110218272 | THERMOSETTING RESIN COMPOSITION AND PREPREG USING THE SAME - Provided are a thermosetting resin composition suitable for forming a composite material that has excellent mechanical characteristics, such as wet heat resistance and toughness, and also a prepreg using the same. The thermosetting resin composition includes at least a component [A] including thermoplastic resin particles and a thermosetting resin [B]. The component [A] includes a melt blend of at least the components [A-1] and [A-2] given below. In the particles, the component [A-1] and the component [A-2] may be in a non-compatibilized state or a compatibilized state. | 09-08-2011 |
| 20120016057 | ADHESIVE FOR ELECTRONIC COMPONENTS - It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group. | 01-19-2012 |
| 20120071584 | STRUCTURAL EPOXY RESINS CONTAINING CORE-SHELL RUBBERS - Core-shell rubbers are incorporated into epoxy adhesives. The adhesives are structural type adhesives that contain an epoxy resin and a toughener, and may contain a liquid rubber in addition to the core-shell rubber. The adhesives have good modulus and tensile strength, which are obtained without loss of elongation and adhesive properties. | 03-22-2012 |
| 20120259041 | ADHESIVE COMPOSTION - An adhesive composition includes a first part comprising about 15 to about 60 wt % of an epoxy compound, about 35 to about 80 wt % of an epoxy novolac, and about 5 to about 25 wt % of an epoxy-based reactive diluent based on the total weight of epoxy compound, epoxy novolac, and reactive diluent; and a second part comprising less than about 20 wt % of a hydroxyaromatic solvent, about 80 to about 99 wt % of a Mannich base, and about 1 to about 20 wt % of a tertiary amine, based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1. Additives to further enhance the properties may be included. A method of forming an adhesive layer includes applying the adhesive composition to a surface. | 10-11-2012 |
| 20130023603 | EPOXY RESIN COMPOSITION WITH REDUCED TOXICITY - The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins,
| 01-24-2013 |
| 20130137796 | Epoxy Adhesive - Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate. | 05-30-2013 |
| 20130217806 | BLENDS FOR COMPOSITE MATERIALS - The subject matter of the present invention relates to a blend comprising an epoxy resin, a cyclic carbonate, and a hardener comprising a polyalkoxypolyamine, another amine, and a catalyst, to a process for producing said blend, to the use of the blend of the invention for producing cured epoxy resin, and also to an epoxy resin cured with the blend of the invention, and in particular to fiber-reinforced cured epoxy resins for use in rotor blades for wind turbines. | 08-22-2013 |
| 20130225725 | CURABLE COMPOSITIONS - Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured compositions can be used as structural adhesives. The reactive liquid modifier is an acetoacetate ester of a dimer alcohol. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings. | 08-29-2013 |
| 20130261228 | CURABLE COMPOSITIONS - A curable composition or system including (a) at least one divinylarene dioxide, (b) at least one polythiol compound curing agent; and (c) at least one catalyst; wherein the resulting curable composition may be cured at ambient conditions to provide durable cured material. | 10-03-2013 |
| 20130310485 | EPOXY-ADDUCT HARDENING AGENTS - Embodiments of the present disclosure include an epoxy-adduct hardening agent formed as a reaction product of a first adduct formed as a reaction product of a first epoxy resin and a polyether monoamine and second adduct formed as a reaction product of an ethyleneamine and a glycidyl ether. Embodiments include a curable composition having an epoxy resin and the epoxy-adduct hardening agent. | 11-21-2013 |
| 20140011918 | POLYMERIC FORMULATIONS WITH CHEMICALLY ADJUSTABLE RHEOLOGY FOR THE MANUFACTURE OF PREPREGS AND ARTICLES MADE OF COMPOSITE MATERIAL - A polymeric formulation comprising at least one first epoxy resin having a density between 100 and 10,000 Pa·s, a blocked isocyanate, a polymer comprising hydroxy functional groups, a thermoplastic resin and a cross-linking agent, the polymer comprising hydroxyl functional groups with a hydroxyl content in the range 0.65 to 0.95 meq/g, the isocyanate-equivalents-to-polymer-OH-equivalents rate being in the range 0.60 to 1.1. The first epoxy resin is substantially semisolid at room temperature, the formulation comprising at least one second epoxy resin substantially liquid at room temperature, the first and second epoxy resins being present in a weight ratio from 60:40 to 80:20. These formulations are advantageously used for manufacturing prepregs and articles of composite material according to a dry winding process. By virtue of improved stability, a higher glass transition temperature, and a rheological profile result which can be chemically tailored to the needs of the impregnation/dry winding process. | 01-09-2014 |
| 20140309337 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - Provided are: a fiber-reinforced composite material which is suppressed in morphology variation due to the molding conditions, while having excellent mode I interlaminar fracture toughness and excellent wet heat resistance; an epoxy resin composition for obtaining the fiber-reinforced composite material; and a prepreg which is obtained using the epoxy resin composition. An epoxy resin composition for fiber-reinforced composite materials, which contains at least the following constituent elements [A]-[F], and which is characterized by containing 5-25 parts by mass of constituent element [C] and 2-15 parts by mass of constituent element [E] per 100 parts by mass of the total epoxy resin blended therein. [A] A bifunctional amine type epoxy resin. [B] A tetrafunctional amine type epoxy resin. [C] A bisphenol F type epoxy resin having an epoxy equivalent weight of 450-4,500. [D] An aromatic amine curing agent. [E] A block copolymer having a reactive group that can be reacted with as epoxy resin. [F] Thermoplastic resin particles that are insoluble in an epoxy resin. | 10-16-2014 |
| 20140357763 | LOW TEMPERATURE CURABLE EPOXY SYSTEM - An epoxy system having a Part A and a Part B, where the Part A has an epoxy resin component present in a range of 20 weight percent (wt %) to 70 wt %, based on the total weight of the Part A; a flexibilizer present in a range from 20 wt % to 60 wt %, based on the total weight of the Part A; and a catalyst present in the range of 3 wt % to 7 wt % based on the total weight of the Part A, where the wt % of the components of the Part A of the epoxy system totals 100 wt %; and a Part B having a Mannich base hardener. Embodiments of the present disclosure also include a concrete structure that includes a reaction product of the epoxy system. | 12-04-2014 |
| 20150099832 | Epoxy Resin Composition, Prepreg, and Fiber-Reinforced Composite Material - The present invention relates to an epoxy resin composition which comprises a phosphorus-containing modified epoxy resin (A) consisting of a compound (a) represented by Formula (a); a novolak epoxy resin (B); a hardener (C) for epoxy resins; and a metal hydroxide (D), wherein the content in mass % of the phosphorus-containing modified epoxy resin (A), C | 04-09-2015 |
| 20150329739 | HIGH SOLIDS EPOXY COATINGS - A coating composition including a blend of at least two or more epoxy resins, wherein at least one of the epoxy resins comprises (i) a CHDM epoxy resin having less than about 2 wt % total chlorine content; and wherein at least one of the epoxy resins comprises (ii) at least one other epoxy resin other than the epoxy resin in component (i); a curable coating composition including (a) the above blend of epoxy resins and (b) at least one amine curing agent; a thermoset coating product prepared from the above cur able composition; and a process for preparing the above compositions and a coating therefrom. | 11-19-2015 |
| 20160053108 | HARDENERS FOR COLD-CURING EPOXY SYSTEMS - A process comprising: a) producing a first adduct comprising a reaction product of a difunctional epoxy and Isophrondiamine (IPDA); b) producing a second adduct comprising a reaction product of a difunctional epoxy and m-Xylylenediamine (MXDA) and c) contacting i) the first adduct; ii) the second adduct; iii) an accelerator; and iv) a modifier to form a hardener composition, is disclosed. The hardener composition can be used with an epoxy compound to form a curable composition. | 02-25-2016 |
| 20160075839 | High Tg Epoxy Formulation with Good Thermal Properties - Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3. | 03-17-2016 |
| 20160083632 | CAULKING ADHESIVE - An epoxy caulking adhesive, including: a component A and a component B. The component A at least includes the following components in parts by weight: between 50 and 100 parts of an epoxy resin, between 0 and 100 part(s) of an inorganic filler, between 0 and 20 part(s) of a thickener. The component B at least includes the following components in parts by weight: between 20 and 100 parts of an amine curing agent, between 0 and 150 part(s) of the inorganic filler, and between 0 and 25 part(s) of the thickener. The weight ratio of the component A to the component B is between 1:1 and 10:1. At least one of the inorganic filler and the thickener exists in both the component A and the component B. | 03-24-2016 |
| 523429000 | Organic nitrogen compound contains N-heterocycle | 8 |
| 20110028602 | EPOXY-IMIDAZOLE CATALYSTS USEFUL FOR POWDER COATING APPLICATIONS - A process of forming a solid epoxy-imidazole catalyst, the process including: contacting an imidazole, an amine, and one or more epoxy resins, in the absence of added solvent, to form a solid epoxy-imidazole catalyst. In other aspects, embodiments disclosed herein relate to an epoxy-imidazole catalyst, as well as curable compositions, processes for forming curable compositions, and processes for forming a thermoset resin using the epoxy-imidazole catalyst formed in the absence of added solvent. | 02-03-2011 |
| 20110251305 | EPOXY COMPOSITION FOR ENCAPSULATING AN OPTICAL SEMICONDUCTOR ELEMENT - The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof. | 10-13-2011 |
| 20120095132 | HALOGEN- AND PHOSPHORUS-FREE THERMOSETTING RESIN COMPOSITION - A halogen- and phosphorus-free thermosetting resin composition is provided, which is mainly a varnish resin formed by mixing a mixture of two curing agents, an epoxy resin mixture, and an inorganic additive. The mixture of two curing agents is formed by mixing a phenolphthalein modified benzoxazine phenol aldehyde curing agent and an amino triazine novolak, and the epoxy resin mixture is formed by mixing an epoxy resin having an oxazolidone ring or a polyamide-imide-modified epoxy resin and a Bisphenol F epoxy resin. | 04-19-2012 |
| 20130225726 | PRIMER COMPOSITION - Disclosed herein is a primer composition for metal materials, capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various metal materials such as common steel, stainless steel, aluminum, aluminum alloy, copper, and zinc plating to impart high bond strength and high bond durability when the metal materials are bonded with an epoxy-based adhesive. The primer composition is intended to be applied onto the surface of a metal material to be bonded with an epoxy-based adhesive and includes an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin containing at least a phenol novolac-type epoxy resin, a curing agent composed of cyandiamide, a curing catalyst composed of imidazole, and an inorganic oxide filler composed of silica and titanium oxide. | 08-29-2013 |
| 20140066544 | INSULATING COMPOSITION FOR MULTILAYER PRINTED CIRCUIT BOARD - The present invention relates to an interlayer insulating composition for a multilayer printed wiring board including: an epoxy resin including a naphthalene-modified epoxy resin, a cresol novolac epoxy resin, and a rubber-modified epoxy resin; a thermoplastic resin; a curing agent; and an inorganic filler and a multilayer printed wiring board including the same as an insulating layer. The present invention can provide an insulating composition excellent in adhesion between an insulating layer and a Cu layer to secure normal operation and reliability of a final substrate. Further, since the present invention properly includes an epoxy resin and a thermoplastic resin regardless of an increase in the content of an inorganic filler, it is possible to secure the reliability of the substrate by preventing an insulating film from being brittle and improving toughness of the insulating film while maintaining a low thermal expansion rate. | 03-06-2014 |
| 20140303283 | CURABLE COMPOSITIONS - A multi-component curable composition which is reactive upon admixing of the components and which is the reaction product of: (i) a polyester epoxy block or graft copolymer having acetoacetoxy functionality; and (ii) a crosslinking component. The crosslinking component may include at least one imine functional compound having an average of at least two imine groups per molecule which are reactive with acetoacetoxy functionality. | 10-09-2014 |
| 20160005995 | THERMOSETTING COMPOSITION FOR ORGANIC LIGHT-EMITTING ELEMENT FILLER AND ORGANIC LIGHT-EMITTING ELEMENT DISPLAY DEVICE COMPRISING SAME - The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same. | 01-07-2016 |
| 20160039983 | ADDUCT AND THERMOSETTING SURFACING FILM AND METHOD OF FORMING THE SAME - In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed. | 02-11-2016 |
