Class / Patent application number | Description | Number of patent applications / Date published |
523451000 | Phosphorus DNRM | 72 |
20080234409 | Sealant Epoxy-Resin Molding Material, and Electronic Component Device - Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), R | 09-25-2008 |
20090093570 | ENCAPSULANT COMPOSITION FOR A LIGHT-EMITTING DIODE - An encapsulant composition for a light-emitting diode is provided. One embodiment of the encapsulant composition comprises: (a) about 100 parts by weight of at least one liquid bi-functional epoxy resin containing about 40˜50 weight % of aromatic ring; (b) about 55˜120 parts by weight of a curing agent comprising at least one bi-functional thiol curing agent containing aromatic ring and at least one aliphatic tetra-functional thiol curing agent, wherein the curing agent contains about 10˜50 weight % of aromatic ring and about 20˜35 weight % of sulfur; and (c) about 0.05˜0.5 parts by weight of a catalyst. The encapsulant composition having a high refractive index can be used for a solid state light emitting device to enhance light extraction efficiency. | 04-09-2009 |
20090318588 | Thermoplastic Resin Composition with Good Heat Stability, Light Stability, and Impact Strength - Disclosed herein is a thermoplastic resin composition with good heat stability, light stability and impact strength. In an exemplary embodiment, the thermoplastic resin composition comprises (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin; (B) about 1 to about 90 parts by weight of a polyester resin; (C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin comprising a cycloaliphatic diol such as cyclohexane dimethanol, per about 100 parts by weight of a base resin comprising (A)+(B); (D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of a base resin comprising (A)+(B); (E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of a base resin comprising (A)+(B); and (F) about 0.2 to about 6 parts by weight of a compound comprising a HALS compound, benzotriazol based compound, or a combination thereof, per about 100 parts by weight of a base resin comprising (A)+(B). | 12-24-2009 |
20100048766 | HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION - The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board. | 02-25-2010 |
20100298470 | PROCESS FOR CONTINUOUSLY PREPARING AN ORGANOPHOSPHORUS COMPOUND AND USE THEREOF - The present invention relates to the production of organophosphorus compounds, in particular 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) or derivatives thereof which have been known for many years in prior art. They are used preferably as additives for polymers. In particular the use of DOPO and derivatives thereof as flame retardants for polymers, such as e.g. polyesters, polyamides, epoxy resins, has proved to be advantageous. | 11-25-2010 |
20110028604 | FLAME-RETARDANT, CURABLE MOULDING MATERIALS - The invention relates to a halogen-free flameproofing agent for curable moulding materials, the use of such flameproofing agents for the flame-retardant treatment of curable moulding materials, a process for the preparation of halogen-free, flame-retardant curable moulding materials, and halogen-free, flame-retardant curable moulding materials. | 02-03-2011 |
20110054077 | PHOSPHORUS-CONTAINING COMPOUNDS USEFUL FOR MAKING HALOGEN-FREE, IGNITION-RESISTANT POLYMERS - Phosphorus-containing compounds are disclosed which are obtainable by reacting:
| 03-03-2011 |
20110054078 | PHOSPHORUS-CONTAINING COMPOUNDS USEFUL FOR MAKING HALOGEN-FREE, IGNITION-RESISTANT POLYMERS - Phosphorus-containing compounds are disclosed which are obtainable by reacting:
| 03-03-2011 |
20110054079 | PHOSPHORUS-CONTAINING COMPOUNDS USEFUL FOR MAKING HALOGEN-FREE, IGNITION-RESISTANT POLYMERS - Phosphorus-containing compounds are disclosed which are obtainable by reacting: a benzoxazine ring-containing compound comprising the reaction product of:
| 03-03-2011 |
20110065838 | Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins - A hydroxyphenyl or alkoxyphenyl phosphine oxide composition comprises (i) a first mixture of mono-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers each having the formula (I): | 03-17-2011 |
20110166260 | PHOSPHORUS-CONTAINING PHENOL COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE RESIN COMPOSITONS AND CURED PRODUCTS USING THE COMPOUND - To provide phosphorus-containing epoxy resins and phosphorus-containing epoxy resin compositions having high levels of appearance, yield and economic efficiency and cured products thereof that are used for various applications. | 07-07-2011 |
20110201725 | LOW- MELTING GLASS, RESIN COMPOSITION COMPRISING SAME, AND RESIN MOLDED ARTICLE - Disclosed is a low melting point glass which has excellent water resistance and can impart excellent flame retardancy to a resin composition. Also disclosed is a resin composition comprising the low melting point glass. Further disclosed is a resin molded article. Specifically disclosed is a low melting point glass which comprises 22-27 mol % of P | 08-18-2011 |
20110230595 | PROCESS FOR THE PRODUCTION OF IMPACT-MODIFIED POLYALKYLENE TEREPHTHALATE/POLYCARBONATE COMPOSITIONS - A process for the production of impact-modified composition that contains polyalkylene terephthalate and polycarbonate resins is disclosed. The process includes (i) in a first step combining in the melt at 90 to 175° C. glycidyl ester with at least one member selected from the first group consisting of polyalkylene terephthalate and polycarbonate to obtain a molten mixture, said member in powder form, and (ii) in a subsequent step combining the molten mixture with at least one component selected from the second group consisting of polyalkylene terephthalate and polycarbonate to obtain a composition. The composition is characterized in high gloss value. | 09-22-2011 |
20110288206 | MELAMINE PHENYLPHOSPHINATE FLAME RETARDANT COMPOSITIONS - The present invention relates to flame retardant polymer compositions which comprise melamine phenylphosphinates and mixtures with dihydro-oxa-phosphaphenanthrene derivatives. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates like polyesters, polyamides and polycarbonates. | 11-24-2011 |
20110294920 | DOPO-FLAME RETARDANT IN EPOXY RESINS - The present invention relates to flame retardant polymer compositions which comprise mixtures of phosphinic acid salts and dihydrophospho-phenantrene (DOPO). The mixtures are especially useful for the manufacture of flame retardant compositions based on polyfunctional epoxides and epoxy resin compositions that result in laminates with excellent surface characteristics and reduced delamination tendency. | 12-01-2011 |
20120004348 | SOLID PIGMENT PREPARATIONS WITH PHOSPHORIC OR PHOSPHONIC ESTERS AS SURFACE-ACTIVE ADDITIVES - The present invention relates to a solid pigment preparation comprising, all based on the total weight of the preparation,
| 01-05-2012 |
20120022185 | EPOXY RESIN BASED CORE FILLER MATERIAL DEVELOPING LOW EXOTHERMIC HEAT - Curable compositions comprising (i) at least one epoxy resin comprising at least one aromatic moiety or a moiety derivable by hydrogenating an aromatic moiety and wherein the epoxy resin does not contain an aromatic amine moiety, (ii) an epoxide hardener system comprising (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30° C. to about 100° C. and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50° C. to about 180° C. and having at least one primary amine group, wherein the first and second amines are selected such that they have a difference in melting points of at least 10° C. and wherein the first and second amines are contained in minor amounts by weight as compared to the carboxylic acid anhydride; (iii) a filler capable of reducing the density of the curable composition and, optionally, (iv) a fire-retardant system that includes a mixture of: (a) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (b) at least one phosphorous-containing material, furthermore, cured compositions obtainable by curing the above curable composition, the use of the curable composition for filling of voids in honeycomb structures and processes for filing voids in honeycomb structures. | 01-26-2012 |
20120083553 | Molded Articles For Electric Vehicle Parts - A molded article for an electric vehicle part is provided using a thermoplastic polyester resin composition imparting excellent hydrolysis resistance, electric insulation, flame retardance, and tracking resistance. The molded article for an electric vehicle part is formed by molding the thermoplastic polyester resin composition including a thermoplastic polyester resin, which has a terminal carboxyl group amount that is no more than 30 meq/kg, and a flame retardant, in which the tracking resistance measured according to IEC 112, the third edition, after pressurized heat treatment with the 120° C. saturated steam for 200 hours is no less than 500 V, and in which the volume resistivity value measured after the pressurized heating treatment with the 120° C. saturated steam for 200 hours is no less than 1×1015 Ω·m. | 04-05-2012 |
20120123025 | Mixed Phosphonate Flame-Retardants - Mixtures of three types of linear, branched or cyclic phosphates are useful flame retardants, especially for thermoplastic resins or as functional additives in polymer matrices. | 05-17-2012 |
20120129978 | PHOSPHORUS-CONTAINING COMPOUNDS USEFUL FOR MAKING HALOGEN-FREE, IGNITION-RESISTANT POLYMERS - Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired. | 05-24-2012 |
20120136094 | VARNISH COMPOSITION, AND PRE-IMPREGNATED MANUFACTURE THEREOF - A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin. | 05-31-2012 |
20120184647 | EPOXY RESIN COMPOSITIONS - A low color epoxy resin composition comprising (a) an epoxy resin and (b) at least one an inorganic phosphorous-containing compound stabilizing agent, for example an additive such as sodium pyrophosphate dibasic (SPD) compound; wherein the resulting epoxy resin composition is storage stable and the epoxy resin composition exhibits a low color. The low color epoxy resin composition is used to prepare an epoxy encapsulant which is useful in light emitting diodes (LEDs). | 07-19-2012 |
20120214906 | PHOSPHORUS-CONTAINING COMPOUNDS USEFUL FOR MAKING HALOGEN-FREE, IGNITION-RESISTANT POLYMERS - Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired. | 08-23-2012 |
20120277347 | FLAME RETARDANT COMPOSITIONS WITH A PHOSPHORATED COMPOUND - Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 μm | 11-01-2012 |
20120289625 | POLYLACTIC ACID COMPOSITION - A resin composition which comprises polylactic acid, does not release an isocyanate group at the time of production and has excellent hydrolysis resistance and a low environmental burden. | 11-15-2012 |
20120296013 | Aluminum Phosphorus Acid Salts as Epoxy Resin Cure Inhibitors - Certain aluminum salts of organic phosphorus acids are found to have a strong effect on inhibiting the epoxy cure rate in epoxy formulations. The substances act catalytically and can be used at a low level in an epoxy formulation to adjust the reactivity of a resin formulation to give longer gel times. Compositions and methods of preparing and using the compositions are disclosed. | 11-22-2012 |
20120322916 | FLAME-RETARDANT RUBBER COMPOSITION FOR VULCANIZATION - A flame-retardant rubber composition for vulcanization, comprising an epichlorohydrin based rubber (A), red phosphorus (B), and a vulcanizing agent (C), in which the content of the red phosphorus (B) is from 3 to 20 parts by weight for 100 parts by weight of the epichlorohydrin based rubber (A). | 12-20-2012 |
20130005857 | COMPOSITIONS HAVING PHOSPHORUS-CONTAINING COMPOUNDS - Embodiments of the present disclosure provide a composition that includes a phosphorous-containing compound, a cyanate ester, an epoxy resin, and a maleimide. For the various embodiments, a viscosity of the composition increases less than 100% as measured by Gardner Bubble Viscosity a temperature of 23° C. in at least 3 days. For the various embodiments, the composition of the present disclosure can also include an aprotic solvent, such as a ketone. Embodiments of the present disclosure further include a composition that includes the phosphorous-containing compound, the cyanate ester, and the aprotic solvent. For the various embodiments, the composition can also include the epoxy resin and the maleimide. For the various embodiments, the composition does not include an aliphatic alcohol. | 01-03-2013 |
20130018128 | Process For The Preparation Of Dopo-Derived Compounds And Compositions Thereof - This invention relates to a process for producing compounds derived from 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide (DOPO). In particular, the invention relates to producing DOPO-derived compounds by reacting DOPO with diol compounds in the presence of a catalyst. This invention also relates to DOPO derived composition containing a high melting point diastereomer. The DOPO derived compounds may be useful as flame-retardants. | 01-17-2013 |
20130053473 | HIGH MELTING POINT FLAME RETARDANT CRYSTAL AND METHOD FOR MANUFACTURING THE SAME, EPOXY RESIN COMPOSITION CONTAINING THE FLAME RETARDANT, AND PREPREG AND FLAME RETARDANT LAMINATE USING THE COMPOSITION - Disclosed herein is a method of preparing a high-melting point flame retardant crystal, comprising the steps of: reacting 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide with 1,4-naphthoquinone in an inert solvent having a dielectric constant of 10 or less to reduce a content of by-products, thereby obtaining a reaction composition; and dissolving the reaction composition in any one solvent selected from the group consisting of ethyleneglycol, propyleneglycol, diethyleneglycol, cyclohexanone, benzyl alcohol, acetate ester, benzoate ester and a mixture thereof to recrystallize and refine the reaction composition, thereby obtaining high-melting point retardant crystal, represented by Formula 1, having a start melting point of 280° C. or more and a melting point of 291° C. or more, which are measured by differential thermogravimetric analysis: | 02-28-2013 |
20130131216 | THERMOSETTING EPOXY RESIN COMPOSITION AND USES THEREOF - Disclosed is a liquid thermosetting epoxy resin composition including a base resin, a curing agent (D), and curing accelerator (E) or including a base resin and a curing catalyst (D′), each base resin including an alicyclic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a polyester polyol and/or a polycarbonate polyol (B), each polyol having two or more terminal hydroxyl groups; and a phosphorous ester (C). The liquid thermosetting epoxy resin composition exhibits excellent viscosity stability and can give a cured article which is homogeneous even when having a large thickness, does not crack under heat cycle conditions, and is highly thermally stable and satisfactorily optically transparent. | 05-23-2013 |
20130143984 | PRODUCTION OF CURED EPOXY RESINS WITH FLAME-RETARDANT PHOSPHONATES - The invention relates to curable compositions which comprise epoxy resins, amino hardeners, and a phosphonate of the formula I. Addition of phosphonate of the formula I can give cured epoxy resins which have not only improved flame retardants but also an increased glass transition temperature when comparison is made with the corresponding resins without said addition. | 06-06-2013 |
20130190425 | POLYCARBONATE-POLYESTER COMPOSITIONS, METHODS OF MANUFACTURE, AND ARTICLES THEREOF - A composition comprising polycarbonate, polyethylene terephthalate, organopolysiloxane-polycarbonate block copolymer, and epoxy-functional block copolymer for providing an improved balance of properties, including heat aging performance in combination with impact resistance. Articles molded from the composition are advantageously useful for automotive applications. | 07-25-2013 |
20130203896 | Chromium-Free Insulation Coating Material for Non-Oriented Silicon Steel - The present invention refers to a chromium-free insulation coating material for non-oriented silicon steel, comprising, in parts by weight, the following components: metal dihydrogen phosphate salt of 100 parts, epoxy resin of 10˜60 parts, naphthenate drier or isooctanoate metal salt drier of 0.001˜10 parts, organic solvent of 0.001˜100 parts and pure water of 60˜2000 parts. The metal dihydrogen phosphate salt is Al(H | 08-08-2013 |
20130253093 | ADHESIVE COMPOSITION AND USES THEREOF - Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlotrohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties. | 09-26-2013 |
20130310486 | CARBOXYL GROUP-CONTAINING POLYIMIDE, THERMOSETTING RESIN COMPOSITION AND FLEXIBLE METAL-CLAD LAMINATE - The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide. | 11-21-2013 |
20130338264 | CONDENSATION PRODUCTS OF MELAMINE AND PHENYLPHOSPHONIC ACID AND THEIR USE AS FLAME RETARDANTS - Condensation products of melamine and phenylphosphonic acid, a process for their preparation, their compositions with polymeric materials and their use as flame retardants in polymer substrates are provided. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates, such as polyesters, polyamides and polycarbonates. | 12-19-2013 |
20130345338 | SYSTEM AND METHOD FOR TREATING AGRICULTURAL SETTINGS - The treatment of an agricultural setting may be implemented by applying an adhesive using a pump sprayer. The agricultural setting may include mulch, pine straw, wood chips, and other materials used in landscaping. The adhesive may be used to keep the agricultural setting in place. For example, the adhesive may keep mulch from moving in heavy winds or during a storm. | 12-26-2013 |
20140005303 | ANTIMONY TRIOXIDE FREE FLAME RETARDANT THERMOPLASTIC COMPOSITION | 01-02-2014 |
20140058016 | Powder Coating Composition for Structuring and Texturing Coating Surfaces - The invention relates to the use of a powder coating composition consisting of a bonding agent system, a wax comprising an acid group, one or more basic metal compounds or SiO | 02-27-2014 |
20140073721 | RESIN COMPOSITION, PREPREG AND RESIN SHEET AND METAL FOIL-CLAD LAMINATE - A resin composition is provided which can be suitably used in a printed circuit board having excellent electrical properties, heat resistance and peel strength, with flame retardancy maintained, a prepreg and resin sheet which use the same, and a metal foil-clad laminate which uses the prepreg. A resin composition including a polyphenylene ether (A), a specific phosphorus-containing cyanate ester compound (B), a non-halogenated epoxy resin (C), a cyanate ester compound (D) and a filler (E) is used. | 03-13-2014 |
20140128510 | RESIN COMPOSITION, HARDENED COATING FILMS THEREFROM, AND PHOTOSEMICONDUCTOR DEVICE USING SAME - A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10 | 05-08-2014 |
20140179831 | Mesoporous Silicate Fire Retardant Compositions - Fire retardant or flame retardant additives are incorporated into thermoplastic, thermoset, and/or elastomeric polymer materials to form polymer compositions having improved fire retardant properties. More particularly, the polymer compositions of the present invention comprise additive compositions which have the effect of improving the FR effectiveness, the additive compositions comprising a mesoporous silicate additive. In addition, the polymer compositions of the present invention comprise additive compositions comprising a mesoporous silicate additive and a filler, wherein the filler is a flame retardant addition, an inert filler, or combinations thereof. | 06-26-2014 |
20140221529 | DOPO-FLAM RETARDANT IN EPOXY RESINS - The present invention relates to flame retardant polymer compositions which comprise mixtures of phosphinic acid salts and dihydrophospho-phenantrene (DOPO). The mixtures are especially useful for the manufacture of flame retardant compositions based on polyfunctional epoxides and epoxy resin compositions that result in laminates with excellent surface characteristics and reduced delamination tendency. | 08-07-2014 |
20140249253 | PHOSPHORUS-CONTAINING COMPOUNDS USEFUL FOR MAKING HALOGEN-FREE, IGNITION-RESISTANT POLYMERS - A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein R | 09-04-2014 |
20140275346 | HYDROLYSIS RESISTANT COMPOSITIONS - Polyester compositions comprising: a) at least one semi-aromatic polyester resin; b) at least one reinforcing agent; c) hydroxyapatite; d) at least one epoxy component having two or more epoxy functional groups per molecule of the epoxy component; and optionally, at least one toughener, wherein the compositions exhibit the combined property of a desirable melt viscosity stability and a desirable hydrolysis resistance to articles molded from the compositions. Articles molded or extruded from these compositions especially, electric and electronic components. Methods of maintaining melt viscosity stability of a melt-mixed composition while simultaneously retaining tensile strength in the article prepared from the melt-mixed composition. | 09-18-2014 |
20140303285 | NOVEL BIODEGRADABLE MASTER BATCH AND PREPARATION METHOD THEREOF - The present invention provides a biodegradable master batch and a preparation method thereof. The biodegradable master batch is prepared by in-situ polymerization of the components in the following formula in weight parts: 10-80 parts of biodegradable monomer or prepolymer, 0.01-5 parts of catalyst, 0.05-5 parts of reaction activator, 0.1-5 parts of thermal stabilizer, 0-80 parts of flame retardant, 0-80 parts of filler, 0-80 parts of antistatic agent, 0-80 parts of pigment, 0-80 parts of foaming agent, and 0-5 parts of surface coupling agent. Provided in the present invention are the biodegradable polymer master batch having good dispersion effect and excellent interface bonding property, and the preparation method thereof. | 10-09-2014 |
20140309339 | Mixtures Of Diphosphinic Acids And Alkylphosphinic Acids, A Process For The Preparation Thereof And The Use Thereof - Mixtures of diphosphinic acids and alkylphosphonic acids, a process for preparation thereof and use thereof. | 10-16-2014 |
20140309340 | Mixtures Of Dialkylphosphinic Acids And Alkylphosphinic Acids, A Process For Preparation Thereof And Use Thereof - The invention relates to mixtures of at least one dialkylphosphinic acid of the formula (I) | 10-16-2014 |
20140329933 | Mixtures Of Diphosphinic Acids And Alkylphosphinic Acids, A Process For The Preparation Thereof And The Use Thereof - The invention relates to mixtures of at least one diphosphinic acid of the formula (I) | 11-06-2014 |
20140357765 | COLOR STABLE THERMOPLASTIC COMPOSITION - A plastic article formed from a thermoplastic composition including a polycarbonate having repeating structural carbonate units according to the formula: | 12-04-2014 |
20140364540 | POWDER COATING - A particulate coating composition, preferably a powder coating composition comprising at least one epoxy containing compound, at least one polycarboxyl polymer, at least one organic Lewis acid and at least one organic Lewis base. | 12-11-2014 |
20150025177 | COATING COMPOSITIONS HAVING CHELANT FUNCTIONALITY - The present invention provides a floor coating composition comprising (A) and aqueous solvent; and (B) a chelating polymer which comprises units derived from one or more aminocarboxylate compounds or their salts, one or more other polymerizable monomers, one or more ethylenically unsaturated monomers and, optionally, one or more crosslinking monomers. For example, the aminocarboxylate compounds or their salts may be one or more of iminodiacetic acid (IDA), iminodisuccinic acid (IDS), ethylenediamine triacetic acid (ED3A) and ethylenediamine disuccinic acid (EDDS), or their salts. Suitable polymerizable monomers may be one or more of glycidyl methacrylate (GMA), allyl glycidyl ether (AGE), vinylbenzyl chloride (VBC), allyl bromide, and their derivatives. | 01-22-2015 |
20150051318 | ROLL COVER PRODUCTION METHOD AND ROLL COVER - A roll cover is produced, in particular for use in a machine for producing and/or processing a fibrous web such as a web of paper or cardboard. The roll cover includes least one layer of a resin matrix that is filled with at least one particulate filler. The filler particles are produced in a polymer component of the resin matrix and/or introduced into the resin matrix from a dispersion via matrix exchange. | 02-19-2015 |
20150291773 | THERMAL EXPANSION RESIN COMPOSITION - A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40. | 10-15-2015 |
20150344649 | FIRE RETARDANT EPOXY RESIN FORMULATIONS AND THEIR USE - Epoxy formulations comprising a polyfunctional epoxy resin, a phenoxy resin, a fire retardant, a toughener and a curative are provided as is their use in prepregs which are useful in the production of aircraft components particularly interior and external panels and sleeves for helicopter rotor blades. | 12-03-2015 |
20160017142 | RESIN COMPOSITION AND RESIN MOLDED ARTICLE - A resin composition includes a polycarbonate resin, an aromatic polyester resin, a glycidyl group-containing polyethylene copolymer, and red phosphorus of which particle surfaces are covered with at least one of a thermosetting resin and an inorganic substance, and a volume average particle diameter is 15 μm or less. | 01-21-2016 |
20160024304 | HALOGEN-FREE RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING THE SAME - Halogen-free resin composition, prepreg, and laminate for printed circuits using same. Based on 100 parts by weight of organic solid matter, the resin composition comprises: (A) bisphenol-type epoxy resin: 30˜60 parts by weight; (B) benzoxazine resin: 5˜45 parts by weight; (C) alkyl phenol novolac hardener: 10˜30 parts by weight; (D) phosphorus-containing flame retardant. The bisphenol-type epoxy resin, with numerous alkyl branched chains and benzene rings in its structure, makes the composition possess high glass transition temperature, low water absorption, good thermal resistance, and excellent dielectric properties. Taking the alkyl phenol novolac as the hardener can sufficiently exert the advantages of excellent dielectric properties and low water absorption resulted from containing numerous alkyls. The prepreg and laminate for printed circuits made from halogen-free resin composition have high glass transition temperature, low dielectric constant, low dielectric dissipation factor, low water absorption, high thermal resistance, and good flame retardancy, processability and chemical resistance. | 01-28-2016 |
20160046792 | FLAME RETARDANTS FROM RENEWABLE RESOURCES - Among other things the invention provides novel flame-retardant compounds useful for increasing the flame retardance of polymers. | 02-18-2016 |
20160137888 | BONDPLY ADHESIVE COMPOSITION - The present disclosure is directed to a bondply adhesive. The bondply adhesive contains 65 to 80 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride, 7 to 24 wt % epoxy resin, 0.3 to 3.0 wt % hardener, 0.05 to 0.1 wt % catalyst, 8 to 15 wt % organic flame retardant and 0.3 to 2.9 wt % 3-glycidyloxypropyl-trimethoxysilane, wherein a combined total of epoxy resin and organic flame retardant is less than 35 wt %. | 05-19-2016 |
20160137890 | COVERLAY ADHESIVE COMPOSITION - The present disclosure is directed to a coverlay adhesive. The coverlay adhesive contains 40 to 80 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride, 3 to 14 wt % epoxy resin, 0.5 to 1.5 wt % hardener, 0.05 to 0.1 wt % catalyst, 10 to 26 wt % organic flame retardant, and optionally polypheneylene ether. | 05-19-2016 |
20160145429 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED THEREFROM - Disclosed is a thermoplastic resin composition. Due to addition of the epoxy-based resin, the phosphorous-based flame retardant, the silicon-based compound and the calcium carbonate to the basic resin according to the present invention, a thermoplastic resin composition having superior flame retardancy and excellent rigidity, heat resistance and processability, and a molded article manufactured therefrom may be provided. | 05-26-2016 |
20160185952 | Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same - The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of dicyclopentadiene novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0. | 06-30-2016 |
20160185953 | Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same - The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0. | 06-30-2016 |
20180022899 | FLAME RETARDANT RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, COMPOSITE METAL SUBSTRATE AND FLAME RETARDANT ELECTRONIC MATERIAL | 01-25-2018 |
523452000 | Phosphorus directly bonded to nitrogen | 7 |
20100184884 | FLAME-RETARDANT POLYCARBONATE RESIN COMPOSITION - There is provided a resin composition that comprises a polycarbonate resin derived from an ether diol such as isosorbide and that is excellent in flame retardancy, heat resistance, thermal stability, rigidity, transparency and moldability. | 07-22-2010 |
20110319525 | EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT - Provided are a carbon fiber reinforced composite material which exhibits excellent flame retardance, fast curing properties, heat resistance, and mechanical characteristics. Also provided are an epoxy resin composition suitable for use in producing said carbon fiber reinforced composite material as well as a prepreg and housing for electronic/electrical components. The epoxy resin composition is characterized by comprising: [A] an epoxy resin containing at least 50 mass % of a compound as represented by general formula (I), [B] an organic nitrogen compound based curing agent, [C] a phosphoric acid ester, and [D] a phosphazene compound. In general formula (I), R | 12-29-2011 |
20130158165 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE SAME - An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated with the composition, the composition including an epoxy resin; an inorganic filler; a curing accelerator; and a curing agent, the curing agent including a compound having a multifunctional novolac structure including at least one biphenyl moiety, the compound being represented by Formula 1: | 06-20-2013 |
20140243455 | P-PIPERAZINE COMPOUNDS AS FLAME RETARDANTS - The present invention relates to the use of aromatic P-piperazine-compounds in flame retardant polymer compositions. These compositions are especially useful for the manufacture of flame retardant compositions based on thermoplastic polymers, especially polyolefin homo- and copolymers, polycondensates, such as polyamines or polyesters and duroplastic polymers, such as polyepoxides. | 08-28-2014 |
20140316032 | P-N-COMPOUNDS AS FLAME RETARDANTS - The present invention relates to the use of aromatic P—N-compounds in flame retardant polymer compositions. These compositions are especially useful for the manufacture of flame retardant compositions based onthermoplastic polymers, especially polyolefin homo- and copolymers, polycondensates, such as polyamines or polyesters and duroplastic polymers, such as polyepoxides. | 10-23-2014 |
20160024301 | GLASS-FIBER-REINFORCED POLYCARBONATE RESIN COMPOSITION - A glass-fiber-reinforced polycarbonate resin composition having a flat cross section and excellent weld strength, stiffness and flame retardancy. The resin comprises:
| 01-28-2016 |
20160185957 | RESIN COMPOSITION AND RESIN MOLDED ARTICLE - A resin composition includes a polycarbonate resin, a polyethylene terephthalate resin, a glycidyl group-containing polyethylene copolymer, an organic phosphorus flame retardant, and a flame retardant antidrip agent, wherein the polycarbonate resin and the polyethylene terephthalate resin are contained in a specific content range, and wherein the glycidyl group-containing polyethylene copolymer is a polyethylene copolymer which is constituted with a glycidyl group-containing (meth) acrylic acid ester unit and an ethylene unit, in which a content of the glycidyl group-containing (meth) acrylic acid ester unit in the glycidyl group-containing polyethylene copolymer is in a range of 2% by weight to 20% by weight, and has a glass transition point of 0° C. or lower, or is a copolymer obtained by performing graft polymerization of a polymerizable vinyl monomer onto a main chain of the polyethylene copolymer constituted with a glycidyl group-containing (meth) acrylic acid ester unit and an ethylene unit. | 06-30-2016 |