| Entries |
| Document | Title | Date |
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| 20080241985 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units - Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts. | 10-02-2008 |
| 20080268563 | Microelectronic Imaging Units and Methods of Manufacturing Microelectronic Imaging Units - Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts. | 10-30-2008 |
| 20090148977 | PACKAGING METHOD FOR IMAGE SENSOR IC - The method contains the following steps. First, a number of circuit blocks are formed in one or more tightly populated array on an uncut substrate. The substrate is then placed on a flat platform where a number of pins on the platform threading through corresponding holes of the substrate. A number of image sensor ICs are then fixed on the circuit blocks, respectively, and the ICs are wire-bonded to their underlying circuit blocks. Subsequently, gaps between the ICs are filled with an adhesive until the adhesive is slightly over a top side of the ICs. An uncut filtering glass is placed on the adhesive and the pins of the platform before the adhesive is thermally cured. To separate packaged image sensor IC modules, cutting is performed in the middle of the cured adhesive between two adjacent rows and columns of ICs. | 06-11-2009 |
| 20090239328 | PHOTO-DETECTOR FOR DETECTING IMAGE SIGNAL OF INFRARED LASER RADAR AND METHOD OF MANUFACTURING THE SAME - A photo-detector, in which metal wiring for connecting electrodes is arranged on a planarized surface and thus the metal wiring arrangement is simplified, and a method of manufacturing the same are provided. The photo-detector includes a multi-layer compound semiconductor layer formed on a compound semiconductor substrate. A number of p-n junction diodes are arranged in a regular order in a selected region of the compound semiconductor layer, and an isolation region for individually isolating the p-n junction diodes is formed by implanting impurity ions in the multi-layer compound semiconductor layer. The isolation region and the surface of the compound semiconductor layer are positioned on the same level. The isolation region may be a Fe-impurity region. | 09-24-2009 |
| 20090263927 | ISOLATION STRUCTURES FOR CMOS IMAGE SENSOR CHIP SCALE PACKAGES - Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge. | 10-22-2009 |
| 20090280595 | Process for assembling wafers by means of molecular adhesion - The invention relates to a process of bonding by molecular adhesion of two layers, such as wafers of semiconductor material, wherein propagation of a first bonding wave is initiated from a pressure point applied to at least one of the two layers, and wherein the first bonding wave step is followed by propagating a second bonding wave over an area, for example, in the vicinity of the pressure point. Propagation of the second bonding wave may be obtained through the interposing of a separation element between the two wafers and the withdrawal of the element, for example, after the beginning of the first bonding wave propagation. | 11-12-2009 |
| 20090298219 | Method for Manufacturing Solid-State Image Pickup Device Module - A method for manufacturing a solid-state pickup device module of the present invention includes: a step of processing a transparent substrate so that each of transparent substrates for a chip is held opposite to each of solid-state image pickup devices when the transparent substrate and a substrate having a plurality of solid-state image pickup devices are opposed to each other (step of processing a transparent substrate; S | 12-03-2009 |
| 20090317932 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer | 12-24-2009 |
| 20100047956 | METHODS OF FABRICATING INTEGRATED IMAGER AND MICROCONTROLLER - A method and apparatus providing a CMOS imager with an integrated controller on a common integrated circuit substrate. Also integrated on the common substrate are, a serializer circuit including a dynamic arbiter under the control of the microcontroller core and a set of extended special function registers through which data is passed to allow the microcontroller to control the CMOS imager and the serializer circuit. | 02-25-2010 |
| 20100105160 | Techniques for Glass Attachment in an Image Sensor Package - A low-cost wafer-level packaging (WLP) method for attaching glass to optical image-sensor devices on a semiconductor wafer in order to increase the yield of image-sensor modules during later steps of assembly. One embodiment relates to applications with image-sensors (and microlenses) fabricated on a wafer. A glass wafer is singulated, aligned to mirror the die pattern on an image-sensor wafer, and then bonded to the image-sensor wafer such that optical adhesive forms a layer between the each image-sensor and its glass cover. Another embodiment applies cavity walls to singulated glass covers, which are then attached to image sensors which may be formed on a single wafer. The wafer can then be singulated and a plurality of image sensor packages is formed. | 04-29-2010 |
| 20100233839 | String Interconnection and Fabrication of Inverted Metamorphic Multijunction Solar Cells - A method of manufacturing a solar cell by providing a first substrate; depositing on a first substrate a sequence of layers of semiconductor material forming a solar cell including at least a top subcell and a bottom subcell; mounting a surrogate substrate on top of the sequence of layers adjacent to the bottom subcell; removing the first substrate to expose the surface of the top subcell; removing the surrogate substrate; and holding the solar cell on a vacuum chuck to support it for subsequent fabrication operations, such as attaching interconnects to the solar cells to form an interconnected array. | 09-16-2010 |
| 20100273288 | IMAGER DEVICE WITH ELECTRIC CONNECTIONS TO ELECTRICAL DEVICE - An imager device is disclosed including a first substrate having an array of photosensitive elements formed thereon, a first conductive layer formed above the first substrate, a first conductive member extending through the first substrate, the first conductive member being conductively coupled to the first conductive layer, a standoff structure formed above the first substrate, a second conductive layer formed above the standoff structure, the second conductive layer being conductively coupled to the first conductive layer, and an electrically powered device positioned above the standoff structure, the electrically powered device being electrically coupled to the second conductive layer. A method of making an imager device is disclosed including providing a first substrate having a first conductive layer and an array of photosensitive elements formed above the first substrate, forming a conductive member that extends through the first substrate and is conductively coupled to the first conductive layer, forming a standoff structure above the first substrate, forming a patterned conductive layer above the standoff structure, the patterned conductive layer being conductively coupled to the first conductive layer, and conductively coupling an electrically powered device to the patterned conductive layer positioned above the standoff structure. | 10-28-2010 |
| 20100297800 | SOLAR CELL PANELS AND METHOD OF FABRICATING SAME - A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each anode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips. | 11-25-2010 |
| 20110020974 | METHOD FOR PRODUCING A STACKED PHOTOVOLTAIC DEVICE - A stacked photovoltaic device which includes a first photovoltaic unit having an amorphous silicon layer | 01-27-2011 |
| 20110059569 | PHOTOVOLTAIC PANEL, RELATIVE PRODUCTION PROCESS AND PLANT FOR CARRYING OUT SUCH A PROCESS - A photovoltaic panel made by direct co-extrusion of a plurality of superimposed polymeric layers and a plant for carrying out such a process. | 03-10-2011 |
| 20110076795 | MIXTURES OF ORGANOPOLYSILOXANE COPOLYMERS - Organopolysiloxane/polyuria/polyurethane block copolymers containing a compatible UV stabilizer are transparent and resistant to degradation. | 03-31-2011 |
| 20110171772 | Method for Producing a Photovoltaic Module - A method for producing a photovoltaic module by contacting at least one layer of liquid encapsulant and a plurality of solar cells. The liquid encapsulant has two components. The first component is an acrylic polyol having a terminal hydroxy group, an average number of hydroxy-functional monomer units per polymer chain from 2 to 25 and Mn from 1,000 to 10,000. The second component is an aliphatic polyisocyanate with an average functionality of at least two. The molar ratio of non-terminal hydroxy groups in the polyol to isocyanate groups in the aliphatic polyisocyanate is from 0.5:1 to 1:0.5. | 07-14-2011 |
| 20110189807 | SOLAR BATTERY MODULE MANUFACTURING METHOD - Provided is a process of producing a solar battery module | 08-04-2011 |
| 20110189808 | METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE - A method for manufacturing solid-state imaging device for collectively manufacturing a multiplicity of solid-state imaging devices at a wafer level, the method including: a step of reducing the thickness of a cover glass wafer ( | 08-04-2011 |
| 20110201143 | METHOD FOR MANUFACTURING A THIN FILM SOLAR CELL MODULE - A method for manufacturing a thin film solar cell module including at least a first and a second thin film solar cell, includes the steps of forming a first and a second back contact on a substrate. The active CIGS layer, or the absorber layer, and a window layer that extends over the first and the second back contacts is then deposited in a vacuum equipment. To form solar cells electrically isolated from each other, a first portion of the absorber layer and the window layer is separated from a second portion of the absorber layer the window layer. To connect the thin film solar cells in series, an electrical interconnection between the first portion of the window layer and the second back contact is formed by selectively transforming a third portion of the absorber layer to an electrically conductive compound. | 08-18-2011 |
| 20110207257 | MANUFACTURING METHOD FOR A SOLID-STATE IMAGE PICKUP DEVICE - Provided is a manufacturing method for a solid-state image pickup device, which enables easily manufacturing a thin-type solid-state image pickup device at a wafer level. A support substrate is bonded to a cover glass substrate. A surface of the cover glass substrate on an opposite side to the support substrate is mechanically polished. A part of the support substrate is removed, and a plurality of frame-shaped spacers are formed on the cover glass substrate. The cover glass substrate is made thinner by wet etching so as to have a predetermined thickness. The cover glass substrate and a silicon wafer on which solid-state image pickup elements are formed are attached to each other via the spacers. The cover glass substrate is divided into individual pieces. The silicon wafer is divided into individual pieces. In this way, the solid-state image pickup device is manufactured. | 08-25-2011 |
| 20110275175 | Light Induced Plating of Metals on Silicon Photovoltaic Cells - A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact. | 11-10-2011 |
| 20110300661 | SOLAR CELL INTERCONNECTION METHOD USING A FLAT METALLIC MESH - An improved method for interconnecting thin film solar cells to form solar cell modules is provided, the method comprising using a flat metallic mesh formed from a thin metallic strip to provide a current collection grid over a thin film solar cell. The method is particularly useful for forming interconnections between thin film solar cells deposited on flexible substrates. The rectangular cross sectional shape of the mesh elements provides an increased area of electrical contact to the solar cell compared to the small tangential area provided by elements of circular cross section. Mesh elements can be made higher rather than wider to improve conductivity without proportionally increasing shading loss. Various coatings can be applied to the mesh to improve its performance, provide corrosion resistance, and improve its cosmetic appearance. | 12-08-2011 |
| 20110306161 | GLASS SEALING OF DYE-SENSITIZED SOLAR CELLS - The presently disclosed subject matter describes a new sealing process of a specific type of photovoltaic cells named dye-sensitized solar cells. Currently, the sealing of these cells is made by means of a polymer, which connects the two electrode substrates made of glass, isolating the cell's inner content from the outside. The glass-based sealing method has the advantage of enhancing the cell's lifetime. However, glass sealing should not lead to the heating of the whole cell, which may cause its degradation. The process here unveiled employs a string of a glass precursor, a powder or a paste, that bounds the cell's entire external perimeter. The glass precursor string is then heated to its melting point with a laser beam, allowing the two substrates of the cell to stick together. | 12-15-2011 |
| 20120058590 | METHOD FOR MANUFACTURING SOLAR CELL MODULE - In manufacturing of a solar cell module in which a solar cell having a surface electrode to which a tab lead is connected is sealed with a resin, the step of connecting the tab lead and the step of sealing the solar cell with the resin are performed simultaneously at a relatively low temperature that is used for the resin sealing step. To perform these steps simultaneously, the solar cell having the surface electrode to which the tab lead is connected with an adhesive is resin-sealed using a vacuum laminator to manufacture the solar cell module. The vacuum laminator used includes a first chamber and a second chamber partitioned by a flexible sheet. The internal pressures of these chambers can be controlled independently, and a heating stage for heating is provided in the second chamber. | 03-08-2012 |
| 20120135560 | METHODS OF PACKAGING IMAGER DEVICES AND OPTICS MODULES, AND RESULTING ASSEMBLIES - A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements. | 05-31-2012 |
| 20120156824 | BONDING SOLAR CELLS DIRECTLY TO POLYIMIDE - A method of constructing a solar cell panel is disclosed that includes providing a solar cell that has a front side and a back side, where the front side faces the sun during normal operation, heating a thermoplastic polyimide to at least its reflow temperature, flowing the thermoplastic polyimide onto the back side of the solar cell while heated to at least its reflow temperature, and cooling the thermoplastic polyimide to a temperature below its reflow temperature to bond the thermoplastic polyimide directly to the solar cell. The direct bonding of the thermoplastic polyimide to the solar cell is accomplished without an adhesive such as RTV adhesives. The method may also include bonding a substrate directly to the thermoplastic polyimide opposite the solar cell. | 06-21-2012 |
| 20120164778 | METHOD OF BONDING BY MOLECULAR BONDING - A method of bonding by molecular bonding between at least one lower wafer and an upper wafer comprises positioning the upper wafer on the lower wafer. In accordance with the invention, a contact force is applied to the peripheral side of at least one of the two wafers in order to initiate a bonding wave between the two wafers. | 06-28-2012 |
| 20120329199 | Solar Cell Assembly With Combined Handle Substrate and Bypass Diode and Method - A solar cell assembly and method are disclosed. The solar cell assembly comprises a substrate having a front surface and a back surface, wherein the substrate has a p-n junction providing reverse bias protection, and wherein the substrate functions as a bypass diode. The solar cell assembly further comprises a multijunction solar cell having a plurality of solar cell layers, wherein the multijunction solar cell has a first surface and a second surface, the first surface being attached to the front surface of the substrate. The solar cell assembly further comprises an electrical connector element positioned adjacent the front surface of the substrate and the first surface of the multijunction solar cell, a first contact coupled to the back surface of the substrate, and at least one second contact coupled to a portion of the second surface of the multijunction solar cell. | 12-27-2012 |
| 20130034926 | ASSEMBLY TECHNIQUES FOR SOLAR CELL ARRAYS AND SOLAR CELLS FORMED THEREFROM - An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells. | 02-07-2013 |
| 20130059411 | UV CURABLE ENCAPSULANT - The present invention relates to UV curable encapsulant compositions based on acrylic and/or methacrylic block copolymers, to structures containing these compositions especially photovoltaic cells and to the use of these compositions in photovoltaic cells. The liquid encapsulant composition according to the invention comprises:
| 03-07-2013 |
| 20130109125 | INTEGRATED BACK-SHEET FOR BACK CONTACT PHOTOVOLTAIC MODULE | 05-02-2013 |
| 20130183788 | Multicolor Detectors And Applications Thereof - In one aspect, the present invention provides photodetectors and components thereof having multi-spectral sensing capabilities. In some embodiments, photodetectors of the present invention provide a first photosensitive element comprising at least one accessway extending through the element and an electrical connection at least partially disposed in the accessway, the electrical connection accessible for receiving a second photosensitive element. | 07-18-2013 |
| 20130316487 | METHODS AND APPLICATIONS OF NON-PLANAR IMAGING ARRAYS - System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface. | 11-28-2013 |
| 20130344638 | Fabrication of Window Cavity Cap Structures in Wafer Level Packaging - A method of forming a window cap wafer (WCW) structure for semiconductor devices includes machining a plurality of cavities into a front side of a first substrate; bonding the first substrate to a second substrate, at the front side of the first substrate; removing a back side of the first substrate so as to expose the plurality of cavities, thereby defining the WCW structure comprising the second substrate and a plurality of vertical supports comprised of material of the first substrate. | 12-26-2013 |
| 20140004646 | Method Of Making 3D Integration Microelectronic Assembly For Integrated Circuit Devices | 01-02-2014 |
| 20140017845 | Method Of Forming A Photovoltaic Cell Module With A Cell Press - A photovoltaic cell module is formed with the use of a cell press. The cell press has a longitudinal axis, two surfaces disposed opposite each other along the longitudinal axis, and a fluidic mechanism for moving at least one of the two surfaces towards the other of the two surfaces along the longitudinal axis. A method includes the step of disposing a substrate, photovoltaic cell, tie layer or precursor thereof, and superstrate between the two surfaces and spaced from one of the two surfaces. The method also includes the step of moving at least one of the two surfaces along the longitudinal axis towards the other of the two surfaces using the fluidic mechanism to compress the substrate, photovoltaic cell, tie layer or precursor thereof, and superstrate and form the photovoltaic cell module. The precursor has a viscosity of less than about 1,500 cPs measured at 25° C. before curing. | 01-16-2014 |
| 20140073079 | CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE - A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film. | 03-13-2014 |
| 20140120649 | DIAPHRAGM SHEET, METHOD FOR MANUFACTURING SOLAR CELL MODULE USING DIAPHRAGM SHEET, AND LAMINATION METHOD USING LAMINATOR FOR SOLAR CELL MODULE MANUFACTURE - The performances and durability of a diaphragm sheet of a solar cell laminator are enhanced, and a favorable lamination work is stably performed over a long period of time. In addition, by stably performing sufficient and uniform lamination over a long period of time, a high-quality module is stably manufactured over a long period of time. | 05-01-2014 |
| 20140120650 | REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS - A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit. | 05-01-2014 |
| 20140147957 | SOLAR CELL AND METHOD OF MANUFACTURING THE SAME - Provided are a solar cell and a method of manufacturing the same. The method of manufacturing the solar cell includes stacking a solar cell device layer containing GaN on a sacrificial substrate, etching the solar cell device layer to expose the sacrificial substrate, thereby forming one or more solar cell devices comprising the solar cell device layer, anisotropically etching the exposed sacrificial substrate, contacting the solar cell devices to a stamping processor to remove the solar cell devices from the sacrificial substrate, and transferring the solar cell devices onto a receiving substrate. A high temperature semiconductor process may be performed on a substrate such as a silicon substrate to transfer the solar cell devices onto the substrate, thereby manufacturing flexible solar cells. Also, a large number of solar cells may be excellently aligned on a large area. In addition, economical solar cells may be manufactured. | 05-29-2014 |
| 20140186989 | CONDUCTIVE BASE FOR FORMING WIRING PATTERN OF COLLECTOR SHEET FOR SOLAR CELLS, AND METHOD FOR PRODUCING COLLECTOR SHEET FOR SOLAR CELLS - Provided are: a conductive base for forming a wiring pattern of a collector sheet for solar cells, which has good rust inhibiting properties and solderability without using an organic rust inhibitor that may harm a solar cell element; and a method for producing a collector sheet for solar cells, said method using the conductive base. A conductive base for forming a wiring pattern of a collector sheet for solar cells, which is a conductive base ( | 07-03-2014 |
| 20140206128 | METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE - The solid-state imaging device in which pixel electrodes, a photoelectric conversion portion having an organic film generating electric charge in response to incident light, a transparent counter electrode, and a sealing layer are formed on a substrate is produced by the method including causing a metal mask to come into close contact with a substrate surface, on which the pixel electrodes are disposed, by magnetic force; forming the organic film by vapor-depositing an organic substance to the substrate surface on which the pixel electrodes are disposed; removing the metal mask after the organic film is formed; forming the counter electrode on the organic film; and forming the sealing layer covering the counter electrode, wherein the metal mask has undergone half etching to have a half etching portion and comes into close contact with the substrate surface such that a lower surface of the half etching portion faces the pixel electrodes. | 07-24-2014 |
| 20140213010 | WAFER PACKAGING METHOD - A wafer packaging method includes the following steps. A light transmissive carrier is provided. A hydrolytic temporary bonding layer is formed on the light transmissive carrier. A first surface of a light transmissive protection sheet is bonded to the hydrolytic temporary bonding layer, such that the hydrolytic temporary bonding layer is located between the light transmissive protection sheet and the light transmissive carrier. A second surface of the light transmissive protection sheet facing away from the first surface is bonded to a third surface of a wafer. The light transmissive carrier, the hydrolytic temporary bonding layer, the light transmissive protection sheet, and the wafer are immersed in a high temperature liquid, such that adhesion force of the hydrolytic temporary bonding layer is eliminated. The light transmissive protection sheet and the wafer are obtained from the high temperature liquid. | 07-31-2014 |
| 20140242742 | WAFER PACKAGING METHOD - A wafer packaging method includes the following steps. A wafer having a plurality of integrated circuit units is provided. A first surface of the wafer opposite to the integrated circuit units is ground. A release layer is formed on a second surface of a light transmissive carrier. An ultraviolet temporary bonding layer is formed on the second surface of the light transmissive carrier or a third surface of the wafer. The ultraviolet temporary bonding layer is used to adhere the second surface of the light transmissive carrier to the third surface of the wafer. The first surface of the wafer is adhered to an ultraviolet tape. A fourth surface of the light transmissive carrier is exposed to ultraviolet to eliminate adhesion force of the ultraviolet temporary bonding layer. The light transmissive carrier and the release layer are removed. | 08-28-2014 |
| 20140248737 | METHOD OF MANUFACTURING OPTICAL IMAGE STABILIZER - A method of manufacturing an optical image stabilizer including providing a silicon-on-insulator (SOI) substrate that includes first and second silicon each provided on an upper surface and a lower surface of the substrate, having an insulator layer therebetween, forming a table, a cantilever arm connected to the table, an anchor connected to the cantilever arm, and an electrode opposite to the cantilever arm by etching the first silicon, allowing the table and the cantilever arm to levitate from the second silicon by removing an insulator layer disposed under the table and the cantilever arm, and mounting an image sensor on the table. | 09-04-2014 |
| 20140322856 | METHOD OF MAKING INTERPOSER PACKAGE FOR CMOS IMAGE SENSOR - An image sensor package and method of manufacture that includes a crystalline handler with conductive elements extending therethrough, an image sensor chip disposed in a cavity of the handler, and a transparent substrate disposed over the cavity and bonded to both the handler and image sensor chip. The transparent substrate includes conductive traces that electrically connect the sensor chip's contact pads to the handler's conductive elements, so that off-chip signaling is provided by the substrate's conductive traces and the handler's conductive elements. | 10-30-2014 |
| 20140349438 | DIAPHRAGM SHEET, AND METHOD FOR MANUFACTURING SOLAR CELL MODULE USING DIAPHRAGM SHEET - The performances and durability of a diaphragm sheet of a solar cell laminator are enhanced, and a favorable lamination work is stably performed over a long period of time. In addition, by stably performing sufficient and uniform lamination over a long period of time, a high-quality module is stably manufactured over a long period of time. A solar cell module is manufactured by using a diaphragm sheet formed of a composition containing an ethylene-propylene-diene rubber (EPDM), which is low in creep deformation and high in durability against an organic peroxide and a silane coupling agent. | 11-27-2014 |
| 20150011038 | TWO-STAGE PACKAGING METHOD OF IMAGE SENSORS - A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs. | 01-08-2015 |
| 20150064834 | IMAGE SENSOR INTEGRATED CIRCUIT PACKAGE WITH REDUCED THICKNESS - An image sensor die may include a pixel array formed in an image sensor substrate. The image sensor die may be mounted to a thin metal interconnect layer that has been deposited on a sacrificial carrier substrate. The thin metal interconnect layer may include one or more metal layers that are patterned to form metal traces that serve as contact pads, signal lines, and other interconnects in the interconnect layer. The image sensor die may be wire bonded, flip-chip mounted, or otherwise mechanically and electrically coupled to the metal interconnect layer. The sacrificial carrier substrate may be etched or otherwise removed to expose the metal interconnects on the metal interconnect layer. An array of solder balls may be formed on the exposed metal interconnects to form a ball grid array package, or the exposed contact pads may be plated to form a leadless chip carrier package. | 03-05-2015 |
| 20150303349 | Top to Bottom Solution Deposition of Inorganic Solar Modules - A technique is described depositing a new formula of indium and tin salt solutions as a precursor to form a solid transparent indium tin oxide (ITO) film on non-conductive solid substrates. The utilization of this new composition of matter prompted the discovery of a method for preparing the first top-to-bottom completely solution processed solar cell. The specific patterning of the liquid-processed ITO precursor solution and the subsequent layers of a solar cell outlined here also demonstrate a unique way to connect solution processed (as opposed to deposited using vacuum techniques) solar cells in series and in parallel. Also contemplated are similar compositions capable of forming zinc tin oxide (ZTO), indium oxide (IO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), or zinc oxide (ZO). | 10-22-2015 |
| 20150325710 | ALIGNMENT FOR METALLIZATION - Forming a metal layer on a solar cell. Forming a metal layer can include placing a patterned metal foil on the solar cell, where the patterned metal foil includes a positive busbar, a negative busbar, a positive contact finger extending from the positive busbar, a negative contact finger extending from the negative busbar, and a metal strip, and one or more tabs. The positive and negative busbars and the positive and negative contact fingers can be connected to one another by the metal strip and tabs. Forming the metal layer can further include coupling the patterned metal foil to the solar cell and removing the metal strip and tabs. Removing the metal strip and tabs can separate the positive and negative busbars and contact fingers. | 11-12-2015 |
| 20150333204 | APPLICATION OF THE ENCAPSULANT TO A BACK-CONTACT BACK-SHEET - A method for the production of a photovoltaic module comprising back-contact solar cells ( | 11-19-2015 |
| 20150349193 | SHINGLED SOLAR CELL MODULE - A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency. | 12-03-2015 |
| 20150361204 | USE OF A FLUID POLYMERIC COMPOSITION FOR ENCAPSULATING PHOTOVOLTAIC MODULES - The use of a polymeric composition as an encapsulant in a photovoltaic module, said polymeric composition including a copolymer that comprises an ethylene monomer and a carboxylic acid vinyl ester comonomer, in particular an ethylene vinyl acetate copolymer, and the polymeric composition having a Brookfield viscosity measured at 120° C. of between 10,000 mPa·s and 25,000 mPa·s. Further, a method for encapsulating a photovoltaic module using this polymeric composition. | 12-17-2015 |
| 20160027836 | BACK SIDE ILLUMINATED IMAGE SENSOR HAVING ISOLATED BONDING PADS - Provided is a method of fabricating an image sensor device. An exemplary includes forming a plurality of radiation-sensing regions in a substrate. The substrate has a front surface, a back surface, and a sidewall that extends from the front surface to the back surface. The exemplary method further includes forming an interconnect structure over the front surface of the substrate, removing a portion of the substrate to expose a metal interconnect layer of the interconnect structure, and forming a bonding pad on the interconnect structure in a manner so that the bonding pad is electrically coupled to the exposed metal interconnect layer and separated from the sidewall of the substrate. | 01-28-2016 |
| 20160027948 | INTEGRATED THIN FILM SOLAR CELL INTERCONNECTION - Photovoltaic modules may include multiple flexible thin film photovoltaic cells electrically connected in series, and laminated to a substantially transparent top sheet having a conductive grid pattern facing the cells. Methods of manufacturing photovoltaic modules including integrated multi-cell interconnections are provided. Methods may include steps of coordinating, integrating, and registering multiple rolls of substrates in continuous processes. | 01-28-2016 |
| 20160079289 | METHOD FOR MOUNTING CHIP ON PRINTED CIRCUIT BOARD - A method for mounting a chip on a printed circuit board (PCB) is disclosed. The method includes the steps of: providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors; gluing the recess portion; placing the chip into the recess portion; and forming circuit patterns linking associated bonding pad and connector. A bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion after being glued. | 03-17-2016 |
| 20160086986 | METHOD FOR MANUFACTURING IMAGE PICKUP MODULE - The present invention achieves reduction in size and thickness while removing the cause of defective image and the like. According to an image pickup module ( | 03-24-2016 |
| 20160111555 | CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing chip package includes providing a semiconductor wafer having a plurality of semiconductor chips. An outer spacer and a plurality of inner spacers are formed on the semiconductor wafer. A protection lid is formed and disposed on the outer spacer and the inner spacers. A plurality of cavities is formed on each of the semiconductor chips from a lower surface thereof to expose the conductive pad disposed on the upper surface of the semiconductor chip. A plurality of conductive portions is formed and fills each of the cavities and electrically connected to each of the conductive pads. A plurality of solder balls is disposed on the lower surface and electrically connected to each of the conductive portions. The semiconductor chips are separated by cutting along a plurality of cutting lines between each of the semiconductor chips. | 04-21-2016 |
| 20160118530 | LASER SOLDERING SYSTEMS AND METHODS FOR JOINING CRYSTALLINE SILICON SOLAR BATTERIES - The disclosure includes a laser soldering method of connecting crystalline silicon solar batteries. Methods can include placing conductive soldering strips and crystalline silicon solar batteries on a lower press plate and aligning the conductive soldering strips on metal electrodes of crystalline silicon solar batteries. Methods can also include placing an upper press plate on the conductive soldering strips and the crystalline silicon solar batteries and vacuuming between the upper and lower press plates such that absolute pressure between the upper and lower press plates is less than atmospheric pressure. Methods can also include laser soldering the conductive soldering strips and the crystalline silicon solar batteries. | 04-28-2016 |
| 20160133779 | METHOD FOR MANUFACTURING CRYSTALLINE SILICON-BASED SOLAR CELL AND METHOD FOR MANUFACTURING CRYSTALLINE SILICON-BASED SOLAR CELL MODULE - A method for manufacturing a crystalline silicon-based solar cell having a photoelectric conversion section includes a silicon-based layer of an opposite conductivity-type on a first principal surface side of a crystalline silicon substrate of a first conductivity-type, and a collecting electrode formed by an electroplating method on a first principal surface of the photoelectric conversion section. By applying laser light from a first or second principal surface side of the photoelectric conversion section, an insulation-processed region his formed where a short-circuit between the first principal surface and a second principal surface of the photoelectric conversion section is eliminated. On the collecting electrode and/or the insulation-processed region, a protecting layer s formed for preventing diffusion of a metal, which is contained in the collecting electrode into the substrate. After the protecting layer is formed, the insulation-processed region is heated to eliminate leakage between the substrate and the silicon-based layer. | 05-12-2016 |
| 20160148971 | METHOD FOR TRANSFERRING A LAYER OF CIRCUITS - A process for transferring a buried circuit layer comprises taking a donor substrate comprising an internal etch stop zone and covered on its front side with a circuit layer, producing over the entire circumference of the donor substrate either a peripheral trench or a peripheral routing, this routing or trench being produced over a depth such that they pass entirely through the circuit layer and extend into the donor substrate, depositing on the circuit layer and on the routed side or on the walls of the trench a layer of an etch stop material that is selective with respect to etching of the circuit layer, without filling the trench, bonding a receiver substrate to the donor substrate, and thinning the donor substrate by etching its back side until reaching the etch stop zone so as to obtain the transfer of the buried circuit layer to the receiver substrate. | 05-26-2016 |
| 20160197115 | Methods and Apparatus for Glass Removal in CMOS Image Sensors | 07-07-2016 |
