| Entries |
| Document | Title | Date |
|---|
| 20080213937 | METHOD OF FABRICATING OPTICAL DEVICE CAPS - A wafer having a plurality of through holes is provided, and a glass wafer is disposed on the wafer. A plate having a plurality of concave cavities is disposed on the glass wafer, wherein the concave cavities corresponding to the through holes of the wafer so that a part of the plate corresponding to the through holes is not in contact with the glass wafer. A voltage source is provided, and two electrodes thereof respectively have electrical connections to the wafer and the plate. The wafer and the glass wafer are bonded to each other by the anodic bonding method so that a plurality of optical device caps are formed. | 09-04-2008 |
| 20080274579 | Wafer level image sensor package with die receiving cavity and method of making the same - The present invention provides a structure of package comprising a substrate with a die receiving cavity formed within an upper layer of the substrate, wherein terminal pads are formed on the upper surface of the substrate, the same plain as the micro lens. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. A re-distribution metal layer (RDL) is formed on the dielectric layer and coupled to the die. An opening is formed within the dielectric layer and a top protection layer to expose the micro lens area of the die for Image Sensor chip. A protection layer (film) be coated on the micro lens area with water repellent and oil repellent to away the particle contamination. A transparent cover with coated IR filter is optionally formed over the micron lens area for protection. | 11-06-2008 |
| 20090004768 | RADIATION DETECTING APPARATUS, RADIATION IMAGING APPARATUS AND RADIATION IMAGING SYSTEM - A radiation detecting apparatus according to the present invention includes: pixels including switching elements arranged on an insulating substrate and conversion elements arranged on the switching elements to convert a radiation into electric carriers, the switching elements and the conversion elements are connected with each other, the pixels two-dimensionally arranged on the insulating substrate in a matrix; gate wiring commonly connected with a plurality of switching elements arranged in a row direction on the insulating substrate; signal wiring commonly connected with a plurality of switching elements arranged in a column direction; and a plurality of insulating films arranged between the switching elements and the conversion elements, wherein at least one of the gate wiring and the signal wiring is arranged to be put between the plurality of insulating films. | 01-01-2009 |
| 20090053850 | METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE | 02-26-2009 |
| 20090061554 | RESINOUS HOLLOW PACKAGE AND PRODUCING METHOD THEREOF - The present invention provides a resinous hollow package that includes a moisture-proof island that is a planar structure disposed below a semiconductor element mounting surface of the resinous hollow package, the semiconductor element mounting surface having an area of 200 mm | 03-05-2009 |
| 20090162965 | Optical Die-Down Quad Flat Non-Leaded Package - An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), and light passes from outside the package through the opening in the lead frame die pad onto light collection elements on the active side of the chip. | 06-25-2009 |
| 20090215215 | METHOD AND APPARATUS FOR MANUFACTURING MULTI-LAYERED ELECTRO-OPTIC DEVICES - A method is provided for producing a hybrid multi-junction photovoltaic device. The method begins by providing a plurality of planar photovoltaic semi-transparent modules. Each of the modules is a fully functional, thin-film, photovoltaic device and includes first and second conductive layers and at least first and second semiconductor layers disposed between the conductive layers. The first and second semiconductor layers define a junction at an interface therebetween. The method continues by disposing the modules one on top of another and hybridly adhering them to each other. At least one of the modules is configured to convert a first spectral portion of optical energy into an electrical voltage and transmit a second spectral portion of optical energy to another of the junctions that is configured to convert at least part of the second spectral portion of optical energy into an electrical voltage. | 08-27-2009 |
| 20090305450 | METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERTING DEVICE - The present invention relates to a manufacturing method of obtaining a photoelectric converting device which can sufficiently maintain airtightness of a housing space for photocathode without degradation of the characteristics of the photocathode. In accordance with the manufacturing method, on the side wall end face of a lower frame and a bonding portion of an upper frame forming an envelope of the photoelectric converting device, a multilayered metal film of chromium and nickel is formed. In a vacuum space decompressed to a predetermined degree of vacuum and having a temperature not more than the melting point of indium, these upper and lower frames introduced therein are brought into close contact with each other with a predetermined pressure while sandwiching indium wire members, and accordingly, an envelope having a housing space whose airtightness is sufficiently maintained is obtained. | 12-10-2009 |
| 20100003779 | METHOD OF PRODUCING SOLID-STATE IMAGING DEVICE - A method of producing a solid-state imaging device according to one embodiment of the present invention is characterized in that, in a method of producing a solid-state imaging device such that a solid-state imaging element wafer is bonded to a light transmissive substrate on one surface of which spacers are formed so as to surround solid-state imaging elements formed on the solid-state imaging element wafer and ditches are formed between the spacers to produce a bonded substrate and then the bonded substrate is divided correspondingly to the individual solid-state imaging elements, a support is bonded to the surface opposite to the surface of the light transmissive substrate on which the ditches are formed. | 01-07-2010 |
| 20100009489 | METHOD AND SYSTEM FOR PRODUCING A SOLAR CELL USING ATMOSPHERIC PRESSURE PLASMA CHEMICAL VAPOR DEPOSITION - A process and system for producing a thin-film solar cell using atmospheric pressure plasma chemical vapor deposition is disclosed. A plasma at substantially atmospheric pressure is used to deposit P-type layers, intrinsic layers and N-type layers to form one or more P-N junctions for use in a solar cell. The surface onto which a P-N junction is deposited may be prepared or cleaned using the plasma at substantially atmospheric pressure. Alternatively, the plasma at substantially atmospheric pressure may be used to deposit other layers of the solar cell such as conductive layers in contact with a P-N junction. | 01-14-2010 |
| 20100009490 | METHOD FOR FABRICATING A SOLID-STATE IMAGING DEVICE - A method for manufacturing a solid-state imaging device. A solid-state image sensor is mounted on the semiconductor package support and electrically connected to first terminals and second terminals by bonding wires. The second terminals to which the bonding wires are connected are sealed with a sealing member. The optically-transparent member is thereafter disposed on the support member and the sealing member. The sealing member is cured to fix the optically transparent member. | 01-14-2010 |
| 20100093127 | Inverted Metamorphic Multijunction Solar Cell Mounted on Metallized Flexible Film - A method of manufacturing a mounted solar cell by providing a metallic flexible film having a predetermined coefficient of thermal expansion; and attaching the semiconductor solar cell to the metallic film, the coefficient of thermal expansion of the semiconductor body closely matching the predetermined coefficient of thermal expansion of the metallic film. | 04-15-2010 |
| 20100144083 | METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - The present invention relates to a method of manufacturing a photoelectric conversion device in which selective dye adsorption can be performed easily. In the step of a dye adsorbing process, a material unit | 06-10-2010 |
| 20100159628 | MANUFACTURING METHOD OF IMAGE SENSOR OF VERTICAL TYPE - A manufacturing method of an image sensor of vertical type is provided that includes: forming an insulation layer with a metal wiring and a contact plug therein on a first substrate; bonding a second substrate having an image sensing unit over the insulation layer; forming a trench in the second substrate to divide the image sensing unit for each pixel; forming a PTI by gap-filling the trench with insulating material; forming a first material layer over the PTI, the image sensing unit, and the insulation layer; and forming a second material layer over the first material layer and performing a deuterium annealing process thereon. The crystal defects of the substrate generated when performing the trench etching on the donor substrate to define unit pixels are cured by performing the deuterium annealing process, making it possible to improve the sensitivity and illumination characteristics of the image sensor of vertical type. | 06-24-2010 |
| 20100167451 | METHODS OF MANUFACTURING IMAGING DEVICE PACKAGES - Methods of manufacturing an imaging device package are provided. In accordance with an embodiment a sensor die may be coupled to bond pads on a transparent substrate. Electrically conductive paths comprising bond wires are formed through the bond pads from the sensor die to an outer surface of the imaging device package. | 07-01-2010 |
| 20100197069 | PROCESS FOR PRODUCING LAYERED MEMBER AND LAYERED MEMBER - The object is to provide a photoelectric surface member which allows higher quantum efficiency. In order to achieve this object, a photoelectric surface member | 08-05-2010 |
| 20100233838 | Mounting of Solar Cells on a Flexible Substrate - According to an embodiment, a method of manufacturing a solar cell includes depositing a sequence of layers of semiconductor material forming at least one solar cell on a first substrate; temporarily bonding a flexible film to a support second substrate; permanently bonding the sequence of layers of semiconductor material to the flexible film so that the flexible film is interposed between the first and second substrates; thinning the first substrate while bonded to the support substrate to expose the sequence of layers of semiconductor material; and subsequently removing the support substrate from the flexible film. | 09-16-2010 |
| 20100248411 | Demounting of Inverted Metamorphic Multijunction Solar Cells - A method of forming a multijunction solar cell including an upper subcell, a middle subcell, and a lower subcell by providing a first substrate for the epitaxial growth of semiconductor material; forming a first solar subcell on the substrate having a first band gap; forming a second solar subcell over the first solar subcell having a second band gap smaller than the first band gap; forming a graded interlayer over the second subcell; forming a third solar subcell over the graded interlayer having a fourth band gap smaller than the second band gap such that the third subcell is lattice mismatched with respect to the second subcell; attaching a surrogate second substrate over the third solar subcell and removing the first substrate; and etching a first trough around the periphery of the solar cell to the surrogate second substrate so as to form a mesa structure on the surrogate second substrate and facilitate the removal of the solar cell from the surrogate second substrate. | 09-30-2010 |
| 20100273287 | METHODS FOR INTEGRATING QUANTUM WINDOW STRUCTURES INTO SOLAR CELLS - The invention relates generally to methods of fabricating photovoltaic stack structures. Methods of the invention find particular use in solar cell fabrication. The performance of a photovoltaic stack can be improved by independent control of fabrication conditions during stack formation, particularly depositing window layers after formation of absorber layers where fabrication conditions of absorber layers would otherwise detrimentally affect quantum grain structures of window layers. | 10-28-2010 |
| 20100279452 | IMAGE SENSOR CHIP PACKAGE METHOD - In an image sensor chip package method, a transparent substrate having an upper surface, a lower surface, and through holes is provided. The through holes pass through the transparent substrate. Conductive posts are formed in the through holes. A sealing ring is formed on the lower surface of the transparent substrate. A chip having an active surface, an image sensitive area, and die pads is provided. The image sensitive area and the die pads are located on the active surface. Conductive bumps are formed and respectively disposed on the die pads for respectively connecting the conductive posts. At the time the active surface of the chip is turned to face toward the lower surface of the transparent substrate. The chip is assembled to the transparent substrate and electrically connected with the conductive posts via the die pads. The sealing ring surrounds the image sensitive area and the die pads. | 11-04-2010 |
| 20100297798 | Individually Encapsulated Solar Cells and/or Solar Cell Strings - Methods and devices are provided for improved environmental protection for photovoltaic devices and assemblies. In one embodiment, the device comprises of an individually encapsulated solar cell, wherein the encapsulated solar cell includes at least one protective layer coupled to at least one surface of the solar cell and the protective layer may be formed from a substantially inorganic material. The protective layer has a chemical composition that prevents moisture from entering the solar cell and wherein light passes through the protective layer to reach an absorber layer in the solar cell. | 11-25-2010 |
| 20100330725 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed. | 12-30-2010 |
| 20110053306 | Photovoltaic Lead Manufacture - An improved lead foil operation procedure for photovoltaic module manufacture is disclosed. The procedure includes lift, cut, and fold lead foil. | 03-03-2011 |
| 20110053307 | REPATTERNING OF POLYVINYL BUTYRAL SHEETS FOR USE IN SOLAR PANELS - Embodiments of the invention provide a method of forming a composite solar cell structure that includes preparing a device substrate, wherein the device substrate includes a glass substrate, a transparent conductive layer deposited over the glass substrate, one or more silicon layers deposited over the transparent conductive layer, a back contact layer deposited over the one or more silicon layers, and one or more internal electrical connections disposed on the back contact layer. The method also includes forming a mating pattern on a bonding material to match a topography of an exposed surface of the device substrate, the exposed surface comprising the back contact layer and the one or more internal electrical connections. The method also includes positioning the bonding material over the exposed surface, disposing a back glass substrate over the bonding material to form a composite structure, and compressing the composite structure. Embodiments of the present invention also include methods of preparing a pre-patterned bonding material for a solar cell assembly. | 03-03-2011 |
| 20110065225 | SOLID-STATE IMAGING DEVICE, METHOD OF PRODUCING THE SAME, AND CAMERA - To provide a solid-state imaging device able to improve light transmittance of a transparent insulation film in a light incident side of a substrate, suppress the dark current, and prevent a quantum efficiently loss, wherein a pixel circuit is formed in a first surface of the substrate and light is received from a second surface, and having: a light receiving unit formed in the substrate and for generating a signal charge corresponding to an amount of incidence light and storing it; a transparent first insulation film formed on the second surface; and a transparent second insulation film formed on the first insulation film and for retaining a charge having the same polarity as the signal charge in an interface of the first insulation film or in inside, thicknesses of the first and second insulation film being determined to obtain a transmittance higher than when using only the first insulation film. | 03-17-2011 |
| 20110070678 | Substrate and collector grid structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays - The invention teaches novel structure and methods for producing electrical current collectors and electrical interconnection structure. Such articles find particular use in facile production of modular arrays of photovoltaic cells. The current collector and interconnecting structures may be initially produced separately from the photovoltaic cells thereby allowing the use of unique materials and manufacture. Subsequent combination of the structures with photovoltaic cells allows facile and efficient completion of modular arrays. Methods for combining the collector and interconnection structures with cells and final interconnecting into modular arrays are taught. | 03-24-2011 |
| 20110111547 | BACKSIDE-ILLUMINATED IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME - A backside-illuminated imaging device, which performs imaging by illuminating light from a back side of a semiconductor substrate to generate electric charges in the semiconductor substrate based on the light and reading out the electric charges from a front side of the semiconductor substrate, is provided and includes: a back-side layer including an back-side element on the back side of the semiconductor substrate; a front-side layer including an front-side element on the front side of the semiconductor substrate; a support substrate above the front-side layer; a spacer, one end of which comes in contact with the front-side layer and the other end of which comes in contact with the support substrate, to form a space having a uniform distance between the semiconductor substrate and the support substrate; and an adhesive filled in at least a part of the space between the surface-side element formation layer and the support substrate. | 05-12-2011 |
| 20110124146 | METHODS OF FORMING HIGH-EFFICIENCY MULTI-JUNCTION SOLAR CELL STRUCTURES - In various embodiments, solar cells include a junction including SiGe, a junction including at least one III-V material, and may be formed on silicon substrates and/or with silicon-based capping layers thereover. | 05-26-2011 |
| 20110159629 | METHOD OF FORMING THREE-TERMINAL SOLAR CELL ARRAY - A method for manufacturing three-terminal solar cell array is provided. In this method, only four major scribing or etching steps are needed to expose the three conductive layers of the three-terminal solar cell and isolate the individual solar cells. | 06-30-2011 |
| 20110159630 | IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME - An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electrically connected to the photodiode units. A connecting region is formed around the peripheral region. Re-distribution layers are electrically connected to respective pads and extend to the connecting region. A transparent substrate covers the photodiode units and the pads and exposes at least a portion of the re-distribution layers. Connecting layers are electrically connected to the respective re-distribution layers and extend to a top surface of the transparent substrate. Connecting members are connected to the respective connecting layers disposed on the top surface of the transparent substrate. | 06-30-2011 |
| 20110171771 | Method for Producing a Photovoltaic Module - A method for producing a photovoltaic module by forming solar cells on a glass plate and contacting at least one layer of liquid encapsulant with the solar cells. The liquid encapsulant has two components. The first component is an acrylic polyol having an average number of hydroxy-functional monomer units per polymer chain from 2 to 25 and Mn from 1,000 to 10,000. The second component is a polyisocyanate with an average functionality of at least two. The molar ratio of non-terminal hydroxy groups in the polyol to isocyanate groups in the polyisocyanate is from 0.5:1 to 1:0.5. | 07-14-2011 |
| 20110212565 | Humidity Control and Method for Thin Film Photovoltaic Materials - A method for processing a thin film photovoltaic module. The method includes providing a plurality of substrates, each of the substrates having a first electrode layer and an overlying absorber layer composed of copper indium gallium selenide (CIGS)or copper indium selenide (CIS) material. The absorber material comprises a plurality of sodium bearing species. The method maintains the plurality of substrates in a controlled environment after formation of at least the absorber layer through one or more processes up to a lamination process. The controlled environment has a relative humidity of less than 10% and a temperature ranging from about 10 degrees Celsius to about 40 degrees Celsius. The method subjects the plurality of substrates to a liquid comprising water at a temperature from about 10 degrees Celsius to about 80 degrees Celsius to process the plurality of substrates after formation of the absorber layer. The plurality of substrates having the absorber layer is subjected to an environment having a relative humidity of greater than about 10% to a time period of less then four hours. | 09-01-2011 |
| 20110223703 | SEALING LAMINATED SHEET FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE PRODUCTION METHOD USING SAME - The present invention is a sealing laminated sheet for an electronic device in which a first sheet and a second sheet | 09-15-2011 |
| 20110223704 | DYE-SENSITIZED SOLAR CELL MANUFACTURING METHOD - A dye-sensitized solar cell manufacturing method of the invention comprises the steps of: preparing a first electrode having an oxide semiconductor layer and a second electrode; forming a first sealing portion by melting and bonding a thermoplastic resin at a first annular section of the first electrode; forming a second sealing portion by melting and bonding a thermoplastic resin at a second annular section of the second electrode; loading a photosensitive dye on the oxide semiconductor layer; forming an electrolyte layer by arranging an electrolyte on the first electrode within the first sealing portion; and forming a sealing portion through bonding the first and second sealing portions, wherein the electrolyte layer is formed after forming the first sealing portion; the sealing portion is formed after loading the dye and forming the electrolyte layer; and the sealing portion is formed through melting the first and second sealing portions, applying pressure. | 09-15-2011 |
| 20110256657 | METHOD OF ENCAPSULATING PHOTOVOLTAIC PANEL - Melted encapsulant is extruded directly onto the photovoltaic panel to encapsulate a photovoltaic panel. | 10-20-2011 |
| 20110269257 | Method and System for Large Scale Manufacture of Thin Film Photovoltaic Devices Using Multi-Chamber Configuration - A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films. These properties are used to determine and adjust process conditions for subsequent processes. | 11-03-2011 |
| 20110300660 | METHOD OF MANUFACTURING PHOTOVOLTAIC DEVICE - Disclosed herein is a method of manufacturing a photovoltaic device. The method includes the steps of providing a front substrate and a back substrate, forming a photovoltaic cell on the front substrate, encapsulating the photovoltaic cell by an encapsulant, attaching a solid state sealant tape on one of the two substrates, and adhering the two substrates through the solid state sealant tape and the encapsulant. The solid state sealant tape is in solid state at room temperature. The photovoltaic cell and the encapsulant are situated within an enclosed space formed by the two substrates and the solid state sealant tape. | 12-08-2011 |
| 20110312120 | ABSORBER REPAIR IN SUBSTRATE FABRICATED PHOTOVOLTAICS - The invention relates generally to methods of repairing defects in thin films. Void defects in thin films are repaired using methods that take advantage of substrate manufacturing protocols rather than conventional superstrate manufacturing protocols. Methods described herein are simple, robust and compatible with existing processes and equipment used in the manufacture of superstrate devices. | 12-22-2011 |
| 20120003774 | RTP HEATING SYSTEM AND METHOD - An RTP heating system and an RTP heating method, which can heat a photovoltaic-device intermediate product having a glass substrate, a Mo layer, and a light absorption layer in formation. The RTP heating system is composed of a chamber; a support member located in the chamber; a heating element mounted in the chamber for emitting infrared rays for heating; and a plurality of temperature sensors and a temperature control device for sensing and controlling thermal sources from the heating element and the support member. The infrared rays can be mostly reflected off the Mo layer to apply less direct heating to the glass substrate. Accordingly, the upper and lower surfaces of the photovoltaic-device intermediate product can be heated under different temperatures separately to prevent the glass substrate below the photovoltaic-device intermediate product from softening and deformation and to allow production of the light absorption layer on the Mo layer. | 01-05-2012 |
| 20120028396 | Method of manufacturing a silicon-based semiconductor device by essentially electrical means - Proposed is the method for forming selective emitters, field-induced emitters, back-surface field regions, and contacts to the functional regions of a solar cell by essentially electrical means and without conventional thermal diffusion and masking processes. The process includes forming conductive layers on both sides of an intermediate solar-cell structure, performing electrical and thermal treatment by passing electrical current independently through the front-side conductive layer and the back-side conductive layer, thus forming the selective emitters, the selective BSF regions, selective emitter contact regions, and contacts to the selective BSF regions. The obtained structure is then subjected to pulse electrical treatment by applying a voltage pulse or pulses between the front and back conductive layers to form the field-induced emitter and the field-induced BSF region. After the conductive layers are removed, a final solar cell is obtained. The proposed method can significantly simplify manufacturing, reduce cost, and increase throughput in the field of semiconductor fabrication. | 02-02-2012 |
| 20120028397 | ULTRA-THIN QUAD FLAT NO-LEAD (QFN) PACKAGE - An ultra-thin Quad Flat No-Lead (QFN) semiconductor chip package having a leadframe with lead terminals formed by recesses from both the top and bottom surfaces and substantially aligned contact areas formed on either the top or bottom surfaces. A die is electrically connected to the plurality of lead terminals and a molding compound encapsulates the leadframe and die together so as to form the ultra-thin QFN package. Accordingly, the substantially aligned contact areas are exposed on both the top and bottom surfaces of the package. The present disclosure also provides an ultra-thin Optical Quad Flat No-Lead (OQFN) semiconductor chip package, a stacked semiconductor module comprising at least two QFN semiconductor chip packages, and a method for manufacturing an ultra-thin Quad Flat No-Lead (QFN) semiconductor packages. | 02-02-2012 |
| 20120034727 | MULTILAYERED PHOTOVOLTAIC DEVICE ON ENVELOPE SURFACE - A method of producing a dye solar cell photovoltaic device. The method comprises the steps of providing a transparent envelope, with at least a portion of the envelope having a curved profile; and forming a dye solar cell voltaic element by depositing a plurality of layers of film on an inside surface of the envelope and thereby defining a space within the photovoltaic element. | 02-09-2012 |
| 20120040486 | METHOD AND APPARATUS FOR IRRADIATING A PHOTOVOLTAIC MATERIAL SURFACE BY LASER ENERGY - A method for manufacturing TF-PV material by providing a TF-PV material layer having a degree of crystallinity, and irradiating a surface region of the TF-PV material layer using a laser source having irradiation parameter selected such that the degree of crystallinity is increased at least at a top layer of the surface region. | 02-16-2012 |
| 20120040487 | MWT ARCHITECTURE FOR THIN SI SOLAR CELLS - Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell. The solar cells may comprise epitaxially deposited silicon and may include an epitaxially deposited back surface field. | 02-16-2012 |
| 20120070933 | METHOD FOR MANUFACTURING DYE-SENSITIZED SOLAR CELL - The present invention provides an intermediate structure for use in manufacturing a dye-sensitized solar cell (DSSC) and a method for manufacturing a DSSC with the intermediate structure. The intermediate structure comprises a first electrode coated with a nano-particle oxide and a second electrode laminated with the first electrode by a layer formed of a sealant. The sealant layer has openings in predetermined positions such that at least a portion of the internal space formed by the first electrode, the second electrode, and the sealant layer can communicate with the outside. With the intermediate structure, a superior quality of a DSSC can be manufactured in a simpler and more cost-effective way. | 03-22-2012 |
| 20120083064 | Process for solar cell module edge sealing - A new process of edge sealing for solar cell modules is described. The process comprises coating a waterproof material on the edge of the solar cell module to form a U-like shaped edge sealing which can achieve the function of shock absorber. | 04-05-2012 |
| 20120083065 | ARTICLES SUCH AS SAFETY LAMINATES AND SOLAR CELL MODULES CONTAINING HIGH MELT FLOW ACID COPOLYMER COMPOSITIONS - A process of manufacturing a solar cell module, the process comprising:
| 04-05-2012 |
| 20120107995 | PROCESS FOR PRODUCING SOLAR CELL MODULE - A process for producing a solar cell module, including (a) forming a seal part made of e.g. a double sided adhesive tape on the edge of a surface of a transparent surface material (first surface material), (b) supplying a liquid state photocurable resin composition to the region enclosed by the seal part, (c) laminating, in a reduced pressure atmosphere of not more than 100 Pa, on the photocurable resin composition, a glass substrate (second surface material) having a thin-film type solar cell device formed, to obtain a laminated material having the photocurable resin composition hermetically sealed, and (d) curing the photocurable resin composition in such a state that the laminated material is placed in a pressure atmosphere of not less than 50 kPa to form a resin layer. | 05-03-2012 |
| 20120129292 | LAMINATING ASSEMBLY - A carrier assembly for temporary accommodation of one or more solar cell laminates while the solar laminates are conveyed through a lamination plant. The solar cell laminate comprises a solar cell layer of silicon material, an upper and a lower encapsulating layer of EVA material covering the top and bottom of the solar cell layer, an upper and lower protective layer covering the upper and lower encapsulating layer, respectively. The encapsulating layer has a specific melting temperature and a specific curing temperature; the melting temperature is lower than the curing temperature. The carrier assembly comprises a carrier housing of heat conductive material which defines an inner volume, the carrier housing has an upper plate adapted to receive the solar cell laminate and an opposite lower plate which defines a first plurality of apertures the inner volume includes one or more connecting elements which interconnect the first and second plates The carrier further comprises an air supply system to provide a continuous outward air flow through the first plurality of apertures when the lower plate is received on a conveying surface of the lamination plant the airflow yields an elevated and substantially balanced air pressure on the lower plate to provide lift or buoyancy to the carrier housing and allows a substantially friction-free movement of the carrier housing in relation to the conveying surface of the lamination plant. The carrier further comprises a thermal transfer system which provides thermal energy to the upper plate to allow the encapsulating layer to melt and subsequently cure and preferably is adapted to provide a temperature on the upper plate of 80-130° C. | 05-24-2012 |
| 20120156822 | SOLAR CELL MODULE - A solar cell module is provided that comprises: a solar cell; a connection electrode provided on each of a light-receiving surface and back surface of the solar cell; a conductive resin adhesive arranged on an upper surface of the connection electrode; and a wiring material electrically connected to the solar cell and connected with the connection electrode and the conductive resin adhesive, wherein the conductive resin adhesive changes color upon curing, and the conductive resin adhesive on the upper surface of the connection electrode provided on the light-receiving surface of the solar cell is arranged within a region corresponding to at least one of the connection electrode and the wiring material, on a projection plane parallel with the light-receiving surface and exposed on a light-receiving surface side. | 06-21-2012 |
| 20120171800 | METHOD OF SEALING AN ELECTRONIC DEVICE - A method of sealing an electronic device is disclosed, comprising providing an assembly comprising first and second substrates in an opposed relationship, and an electronic device positioned between the first and second substrates; positioning a glass rod against or on the edge of the first and/or second substrate; and heating and softening the glass rod to form a hermetic seal between the first and second substrates and form a hermetically sealed electronic device. | 07-05-2012 |
| 20120171801 | SILICONE MEMBRANE FOR LAMINATION PROCESS - A membrane includes a blend of a silicone polymer and not greater than 25 wt % of an elastomeric component. The membrane has a thickness of at least 1 mm and exhibits a tensile retention index of at least 35%. | 07-05-2012 |
| 20120171802 | Collector grid and interconnect structures for photovoltaic arrays and modules - An interconnected arrangement of photovoltaic cells is achieved using laminating current collector electrodes. The electrodes comprise a pattern of conductive material extending over a first surface of sheetlike substrate material. The first surface comprises material having adhesive affinity for a selected conductive surface. Application of the electrode to the selected conductive surface brings the first surface of the sheetlike substrate into adhesive contact with the conductive surface and simultaneously brings the conductive surface into firm contact with the conductive material extending over first surface of the sheetlike substrate. Use of the laminating current collector electrodes allows facile and continuous production of expansive area interconnected photovoltaic arrays. | 07-05-2012 |
| 20120184061 | SEALING MATERIAL SHEET FOR SOLAR CELL MODULE AND A METHOD OF MANUFACTURING SOLAR CELL MODULE - Disclosed are a sealing material sheet for a solar cell module and a method of manufacturing a solar cell module capable of reducing damage to a photoelectric conversion cell and leakage of a sealing material during manufacturing of a solar cell module, and easily manufacturing a high-quality solar cell module. A sealing material sheet for a solar cell module includes transparent resin (A) exhibiting an MFR (190° C., 2.16 kg load) of 10 to 20 g/10 min and transparent resin (B) exhibiting an MFR (190° C., 2.16 kg load) of 30 to 40 g/10 min. The mass ratio α (=W | 07-19-2012 |
| 20120202308 | FABRICATING METHOD OF DYE-SENSITIZING SOLAR CELL - A fabricating method of a dye-sensitizing solar cell (DSSC) is provided. In the method, a working electrode and a counter electrode disposed opposite to each other is provided. The working electrode has a first patterned conductive line, and the counter electrode has a second patterned conductive line. A first gap control layer on at least an outer portion of one of the first and second patterned conductive lines is formed to surround the first and the second patterned conductive lines. Alternatively, the first gap control layer is symmetrically formed on one of the first and second patterned conductive lines. Then, a packaging material is formed on the first gap control layer. Next, the working electrode and the counter electrode are pressed to form a gap between the working electrode and the counter electrode. The packaging material is cured, and an electrolyte is filled into the gap. | 08-09-2012 |
| 20120258561 | Low-Temperature Method for Forming Amorphous Semiconductor Layers - In embodiments of the present invention an undoped amorphous, nanocrystalline or microcrystalline semiconductor layer and a heavily doped amorphous, nanocrystalline, or microcrystalline semiconductor layer are formed on a monocrystalline silicon lamina. The lamina is the base region of a photovoltaic cell, while the amorphous, nanocrystalline or monocrystalline layers serve to passivate the surface of the lamina, reducing recombination at this surface. In embodiments, the heavily doped layer additionally serves as either the emitter of the cell or to provide electrical contact to the base layer. The undoped and heavily doped layers are deposited at low temperature, for example about 150 degrees C. or less with hydrogen dilution. This low temperature allows use of low-temperature materials and methods, while increased hydrogen dilution improves film quality and/or conductivity. | 10-11-2012 |
| 20120270357 | METHODS OF MANUFACTURING SOLAR ENERGY MODULES - A solar energy module includes one or more solar cells, each having a front side for receiving light and an opposite back side. An encapsulant material covers at least the front side of each of the solar cells. The solar energy module also includes a backskin layer formed from a cross-linked mixture of high density polyethylene (HDPE) and acid copolymer bonded to the back side of each of the solar cells. | 10-25-2012 |
| 20120276676 | EPITAXIAL LIFT OFF IN INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELLS - The present disclosure provides a process for manufacturing a solar cell by selectively freeing an epitaxial layer from a single crystal substrate upon which it was grown. In some embodiments the process includes, among other things, providing a first substrate; depositing a separation layer on said first substrate; depositing on said separation layer a sequence of layers of semiconductor material forming a solar cell; mounting and bonding a flexible support on top of the sequence of layers; etching said separation layer while applying an agitating action to the etchant solution so as to remove said flexible support with said epitaxial layer from said first substrate. | 11-01-2012 |
| 20120276677 | METHOD AND STRUCTURE OF WAFER LEVEL ENCAPSULATION OF INTEGRATED CIRCUITS WITH CAVITY - The present invention is related shielding integrated devices using CMOS fabrication techniques to form an encapsulation with cavity. The integrated circuits are completed first using standard IC processes. A wafer-level hermetic encapsulation is applied to form a cavity above the sensitive portion of the circuits using IC-foundry compatible processes. The encapsulation and cavity provide a hermetic inert environment that shields the sensitive circuits from EM interference, noise, moisture, gas, and corrosion from the outside environment. | 11-01-2012 |
| 20120301991 | COMPOSITION SUITABLE FOR USE AS A CROSS-LINKING MASTERBATCH INCLUDING A FUNCTIONAL POLYOLEFIN - A composition including a mixture of a cross-linking agent and a first polyolefin including a functional monomer selected from among unsaturated carboxylic diacid or carboxylic acid anhydrides, the unsaturated carboxylic acids and the unsaturated epoxides being suitable for cross-linking with a second polyolefin in order to form an assembly adhered to a substrate, said assembly and the substrate forming an integral structure having two separate layers, characterized in that the amount of cross-linking agent is no lower than 5% of the total weight of the composition. Said masterbatch enables, even in the absence of silanes, cross-linking of polymers, in particular polyolefins, in order to increase the adhesive capacity thereof to substrates such as polymers, metals, metal oxides or silicon. Said masterbatch can be used in particular for encapsulating photovoltaic cells. | 11-29-2012 |
| 20120301992 | ELECTROLYTE SOLUTION FOR DYE SENSITIZED SOLAR CELL, AND DYE SENSITIZED SOLAR CELL USING SAME - It is to provide an electrolyte solution for a dye sensitized solar cell that does not generate a gas, can be used in a wide temperature range, and is excellent in durability. The electrolyte solution contains a chain sulfone compound represented by formula (1) as a solvent. (In the formula, R | 11-29-2012 |
| 20120322195 | METHOD FOR PRODUCING SOLAR MODULES - The present invention relates to a process for producing solar modules. | 12-20-2012 |
| 20120329196 | SOLAR CELL PACKAGING PROCESS - A solar cell packaging process is disclosed. At first, a solar cell is provided, and at least one liquid packaging material is spray-coated onto a surface of the solar cell by a spray-coating process. A liquid packaging material is directly spread on the surface of the solar cell in at least one covering process. Then, the liquid packaging material is hardened in curing process. Therefore, a packaging layer is formed on the surface of the solar cell to finish the solar cell packaging. By implementing the above packaging process, it ensures there is no over stress applied on the solar cell in the packaging process to avoid generating broken pieces for significantly improving the yield. | 12-27-2012 |
| 20120329197 | METHOD OF BONDING AND FORMATION OF BACK SURFACE FIELD (BSF) FOR MULTI-JUNCTION III-V SOLAR CELLS - A photovoltaic device including at least one top cell that include at least one III-V semiconductor material; a bottom cell of a germanium containing material having a thickness of | 12-27-2012 |
| 20130065347 | SHAPED TAB CONDUCTORS FOR A PHOTOVOLTAIC CELL - A shaped tab conductor configured to allow more incident light to strike a cell substrate, improving the photovoltaic efficiency of the cell. The shaped tab conductor is configured to reduce the amount of incident light that is blocked by the tab from reaching the surface of the cell substrate. The tab may also be configured to redirect light reflected from the cell surface back to the cell surface. The cross-section of the tab conductor may be polygonal, such as a rhombus, with at least one generally planar surface that forms an acute angle with the substrate. | 03-14-2013 |
| 20130084670 | PHOTOVOLTAIC DEVICE - A moisture trapping filler composition may include a filler material combined with a desiccant material. | 04-04-2013 |
| 20130102104 | SOLAR CELL MODULE AND MANUFACTURING METHOD OF SOLAR CELL MODULE - A solar cell module includes a structure in which a back surface material, a back-surface-side sealing resin, a solar cell, a light-receiving-surface-side sealing resin, and a front surface material are laminated in sequential order, in which a melting point of a portion, which is in contact with the solar cell, of at least one of the light-receiving-surface-side sealing resin and the back-surface-side sealing resin is lower than a melting point of a portion, which is in contact with the back surface material, of the back-surface-side sealing resin. | 04-25-2013 |
| 20130102105 | PRODUCTION METHOD OF SOLAR CELL MODULE - The present invention provides a production method of a solar cell module, comprising: a first process of mounting a module layered body, which comprises at least a glass member, an encapsulant, a solar cell element and a translucent member in this order, and in which an outer periphery of the encapsulant is positioned at an inner side of outer peripheries of the glass member and the translucent member, on a mounting platen of a double vacuum chamber system laminator comprising a first chamber and a second chamber that are partitioned by a flexible member, and the mounting platen, which is provided in the second chamber facing the flexible member and comprises a heating means, the module layered body being mounted on the mounting platen so that the glass member is at the flexible member side; a second process of depressurizing the inside of the first chamber and the inside of the second chamber; and a third process of heat-pressure bonding and integrating the module layered body by raising a pressure in the first chamber to from 0.005 MPa to 0.090 MPa (gauge pressure of from −0.096 MPa to −0.011 MPa) and pressing the module layered body to the heated mounting platen by the flexible member which has undergone flexural deformation. | 04-25-2013 |
| 20130122632 | METHOD OF MANUFACTURING SOLAR CELL MODULE - A method of manufacturing a solar cell module includes a step of connecting electrodes of solar cells with an interconnection tab so as to form a first solar cell unit, by welding the interconnection tab to the electrodes while remaining an unmelted part of solder of the interconnection tab, and a step of connecting an interconnection tab of a second solar cell unit to the interconnection tab of the first solar cell unit at the unmelted part of the interconnection tab of the first solar cell unit. | 05-16-2013 |
| 20130178009 | SOLAR CELL MODULE AND PROCESS FOR ITS PRODUCTION - An ultrahigh durability solar cell module that can be used semi-permanently, with an ultrahigh durability transparent substrate, solar cell element and filler, wherein the solar cell element and a liquid substance or a gel obtained by reacting the liquid substance as the filler, are sealed by a fast sealed structure comprising a high durability crosslinking reactive adhesive provided between a glass panel and back side protective substrate, and a hot-melt adhesive. The module is produced by placing the sealing compound, solar cell element and liquid substance on the glass panel and finally laying the back side protective substrate to form a provisional laminated body, and then compression bonding the provisional laminated body at room temperature in a vacuum for sealing. | 07-11-2013 |
| 20130203203 | MANUFACTURING METHOD FOR FLEXIBLE SOLAR CELL MODULES - An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to suitably produce flexible solar cell modules in which a solar cell element and a solar cell encapsulant sheet are well adhered to each other by encapsulating a solar cell by roll-to-roll processing in a continuous manner without the need to perform a crosslinking process and without causing wrinkles and curls. The present invention is a method for producing a flexible solar cell module, including thermocompression bonding of a solar cell encapsulant sheet to at least a light-receiving surface of a solar cell element that includes a flexible substrate and a photoelectric conversion layer on the flexible substrate by pressing the solar cell encapsulant sheet and the solar cell element together between a pair of heating rolls, the solar cell encapsulant sheet including a fluoropolymer sheet and an adhesive layer on the fluoropolymer sheet, the adhesive layer including a silane-modified polyolefin resin. | 08-08-2013 |
| 20130203204 | METHOD FOR MANUFACTURING FLEXIBLE SOLAR BATTERY MODULE - An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to encapsulate a solar cell in a continuous manner without the need to perform a crosslinking process and highly efficiently produce flexible solar cell modules in which a solar cell and a solar cell encapsulant sheet are well adhered to each other without causing wrinkles and curls. The present invention is a method for producing a flexible solar cell module, including thermocompression bonding of a solar cell encapsulant sheet to at least a light-receiving surface of a solar cell element that includes a flexible substrate and a photoelectric conversion layer on the flexible substrate by pressing the solar cell encapsulant sheet and the solar cell element together between a pair of heating rolls, the solar cell encapsulant sheet including a fluoropolymer sheet and an adhesive layer on the fluoropolymer sheet, the adhesive layer including an ethylene-glycidyl methacrylate copolymer resin, the ethylene-glycidyl methacrylate copolymer resin including 5 to 10% by weight of glycidyl methacrylate units. | 08-08-2013 |
| 20130210186 | METHOD FOR MANUFACTURING FLEXIBLE SOLAR CELL MODULE - An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to suitably produce flexible solar cell modules in which a solar cell element and a solar cell encapsulant sheet are well adhered to each other by encapsulating a solar cell by roll-to-roll processing in a continuous manner without the need to perform a crosslinking process and without causing wrinkles and curls. The present invention is a method for producing a flexible solar cell module, including thermocompression bonding of a solar cell encapsulant sheet to at least a light-receiving surface of a solar cell element that includes a flexible substrate and a photoelectric conversion layer on the flexible substrate by pressing the solar cell encapsulant sheet and the solar cell element together between a pair of heating rolls, the solar cell encapsulant sheet including a fluoropolymer sheet and an adhesive layer on the fluoropolymer sheet, the adhesive layer including at least one ethylene copolymer selected from the group consisting of ethylene-unsaturated carboxylic acid copolymers and ionomers of ethylene-unsaturated carboxylic acid copolymers, the ethylene copolymer including 10 to 25% by weight of unsaturated carboxylic acid units. | 08-15-2013 |
| 20130217168 | ORGANIC ELECTRONIC DEVICE WITH ENCAPSULATION - The invention relates to an organic electronic device, particularly an OLED device ( | 08-22-2013 |
| 20130237001 | METHODS OF PREPARING FLEXIBLE PHOTOVOLTAIC DEVICES USING EPITAXIAL LIFTOFF, AND PRESERVING THE INTEGRITY OF GROWTH SUBSTRATES USED IN EPITAXIAL GROWTH - There is disclosed methods of making photosensitive devices, such as flexible photovoltaic (PV) devices, through the use of epitaxial liftoff. Also described herein are methods of preparing flexible PV devices comprising a structure having a growth substrate, wherein the selective etching of protective layers yields a smooth growth substrate that us suitable for reuse. | 09-12-2013 |
| 20130244367 | HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP AND USE THEREFOR - Provided are: an alkoysilyl group-containing hydrogenated block copolymer produced by introducing an alkoxysilyl group into a hydrogenated block copolymer that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer that includes at least two polymer blocks [A] and at least one polymer block [B], the polymer block [A] including a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block [B] including a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer to a weight fraction wB of the polymer block [B] in the block copolymer being 20:80 to 60:40; a method for producing the same; a solar cell element encapsulating material; a sheet, a laminated sheet; a multilayer sheet; and a method for encapsulating a solar cell element. The alkoxysilyl group-containing hydrogenated block copolymer exhibits low hygroscopicity, a low water vapor permeability, transparency, weatherability, and flexibility, maintains excellent adhesion to glass even when exposed to a high-temperature/high-humidity environment for a long time, and can encapsulate a solar cell element without applying a special waterproof treatment. | 09-19-2013 |
| 20130280847 | TRANSPARENT CONTACTS ORGANIC SOLAR PANEL BY SPRAY - A method of fabricating organic solar panels with transparent contacts. The method uses a layer-by-layer spray technique to create the anode layer. The method includes placing the substrate on a flat magnet, aligning a magnetic shadow mask over the substrate, applying photoresist to the substrate using spray photolithography, etching the substrate, cleaning the substrate, spin coating a tuning layer on substrate, spin coating an active layer of P3HT/PCBM on the substrate, spray coating the substrate with a modified PEDOT solution, and annealing the substrate. | 10-24-2013 |
| 20130309800 | Peroxide Blends For Cross-Linking Ethylene Vinyl Acetate In An Accelerated Manner - The present invention relates to peroxide mixtures and in particular to peroxide mixtures that are suitable for the accelerated crosslinking of ethylene vinyl acetate. | 11-21-2013 |
| 20130323874 | MANUFACTURE OF SOLAR CELL MODULE - A solar cell module is manufactured by coating and curing a curable silicone gel composition onto one surface of each of two panels except a peripheral region to form a cured silicone gel coating, providing a seal member ( | 12-05-2013 |
| 20140011315 | Optical Semiconductor Device Having Pre-Molded Leadframe with Window and Method Therefor - A semiconductor device is made by providing a semiconductor die having an optically active area, providing a leadframe or pre-molded laminated substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads, attaching the semiconductor die to the leadframe so that the optically active area is aligned with the light transmitting material to provide a light transmission path to the optically active area, and disposing an underfill material between the semiconductor die and leadframe. The light transmitting material includes an elevated area to prevent the underfill material from blocking the light transmission path. The elevated area includes a dam surrounding the light transmission path, an adhesive ring, or the light transmission path itself can be the elevated area. An adhesive ring can be disposed on the dam. A filler material can be disposed between the light transmitting material and contact pads. | 01-09-2014 |
| 20140080244 | METHOD FOR MANUFACTURING OPTICAL IMAGE STABILIZER EMPLOYING SCRATCH DRIVE ACTUATOR - A method for an optical image stabilizer including: providing an SOI wafer substrate which has a plurality of cells, the SOI wafer substrate including an insulating layer, and first and second silicon layers disposed on both sides of the insulating layer; forming scratch drive arrays and supporting members on each of the cells by etching the first silicon layer; forming the table through cells' separation by etching the second silicon layer and the insulating layer; removing the insulating layer interposed between the scratch drive arrays and the table; mounting the image sensor on the table; forming the substrate which has an electrode layer corresponding to the scratch drive arrays; and assembling the table with the image sensor and the scratch drive arrays on the substrate having the electrode layer in such a manner that the scratch drive arrays face the electrode layer each other. | 03-20-2014 |
| 20140099746 | METHOD OF MANUFACTURING SOLAR CELL MODULE - A method of manufacturing a solar cell module includes pressing a first silicone gel sheet provided on a sunlight receiving surface and a second silicone gel sheet provided on an opposite side sunlight non-receiving surface in vacuum to encapsulate the solar cell string with the first and second silicone gel sheets; disposing the sunlight receiving side of the first silicone gel sheet on one surface of a transparent light receiving panel and disposing butyl rubber in a picture frame-like shape along an outer peripheral portion of the first silicone gel sheet and laying the light receiving panel and the light non-receiving panel or back sheet over each other with the silicone gel sheet-encapsulated solar cell string on the inside, and pressing them at 100 to 150° C. in vacuum to press bond the light receiving panel and the non-receiving panel to each other through the butyl rubber. | 04-10-2014 |
| 20140113398 | Apparatus for Vertically Integrated Backside Illuminated Image Sensors - A backside illuminated image sensor comprises a photodiode and a first transistor located in a first chip, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, wherein the second chip is stacked on the first chip and the third chip is stacked on the second chip. The logic circuit, the second transistor and the first transistor are coupled to each other through a plurality of boding pads and through vias. | 04-24-2014 |
| 20140113399 | MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS, SOLID-STATE IMAGING APPARATUS, AND ELECTRONIC IMAGING APPARATUS - A manufacturing method of a solid-state imaging apparatus includes the steps of: preparing a solid-state imaging device having a light receiving region at a main surface thereof; preparing a light transmitting member having an extending portion extending from the solid-state imaging device; preparing a holding member having a space for holding the solid-state imaging device therein, and having a positioning portion for positioning the solid-state imaging device; fixing the light transmitting member to the main surface of the solid-state imaging device in parallel to each other to keep a constant interval therebetween; bringing a side of the solid-state imaging device to meet the positioning portion of the holding member; and fixing the extending portion of the light transmitting member to the holding member. | 04-24-2014 |
| 20140141559 | Collector grid and interconnect structures for photovoltaic arrays and modules - An interconnected arrangement of photovoltaic cells is achieved using novel interconnection components. The interconnection component may comprise a current collector structure, an interconnection structure, or a combination of a current collector and interconnection structure. | 05-22-2014 |
| 20140141560 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - Disclosed is a manufacturing method of a semiconductor device including a step of attaching semiconductor wafers together, in which it is prevented that the bonding strength between the attached semiconductor wafers may be decreased due to a void caused between the two semiconductor wafers. Moisture, etc., adsorbed to the surfaces of the semiconductor wafers is desorbed by performing a heat treatment on the semiconductor wafers after cleaning the surfaces thereof with pure water. Subsequently, after a plasma treatment is performed on the semiconductor wafers, the two semiconductor wafers are attached together. The wafers are firmly bonded together by subjecting to a high-temperature heat treatment. | 05-22-2014 |
| 20140179050 | MODULE ASSEMBLY FOR THIN SOLAR CELLS - Solar cells are packaged by placing the solar cells between sheets of encapsulants. The encapsulants are exposed to ultraviolet (UV) light to cure the encapsulants and bond the encapsulants together to encapsulate the solar cells. The UV curing steps may be performed to bond one of the encapsulants to a transparent top cover and the solar cells, and to bond the other encapsulant to the solar cells and a backsheet. A protective package that includes the transparent top cover, encapsulated solar cells, and the backsheet is then optionally mounted on a frame. | 06-26-2014 |
| 20140186988 | CHEMICAL BATH DEPOSITION APPARATUS, METHOD OF FORMING BUFFER LAYER AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - A chemical bath deposition apparatus includes: a reaction vessel for containing a reaction solution for chemical bath deposition to form a film on a surface of a substrate; a substrate holding section for holding the substrate such that at least the surface of the substrate contacts the reaction solution, the substrate holding section including a fixing surface made of stainless steel on which a back side of the substrate is closely fixed; a heater disposed at a rear side of the fixing surface, the heater heating the substrate from the back side of the substrate; and a reaction solution temperature control unit for controlling temperature of the reaction solution in the reaction vessel. | 07-03-2014 |
| 20140248735 | THIN-FILM ENCAPSULATED INFRARED SENSOR - A method of fabricating a bolometer infrared sensor includes depositing a first sacrificial layer on a surface of a substrate over a sensor region, and forming an absorber structure for the infrared sensor on top of the first sacrificial layer. A second sacrificial layer is deposited on top of the absorber structure. An encapsulating thin film is then deposited on top of the second sacrificial layer. Vent holes are formed in the encapsulating thin film. The first and the second sacrificial layers are removed below the encapsulating thin film to release the absorber structure and form a cavity above the sensing region that extends down to the substrate in which the absorber structure is located via the vent holes. The vent holes are then closed in a vacuum environment to seal the absorber structure within the cavity. | 09-04-2014 |
| 20140302631 | Sensor - A method including encapsulating, at least partially, a transparent substrate supporting a sensor, in a casing. The casing includes interconnects to the sensor. | 10-09-2014 |
| 20140322855 | MODULE ASSEMBLY FOR THIN SOLAR CELLS - Solar cells are packaged by placing the solar cells between sheets of encapsulants. The encapsulants are exposed to ultraviolet (UV) light to cure the encapsulants and bond the encapsulants together to encapsulate the solar cells. The UV curing steps may be performed to bond one of the encapsulants to a transparent top cover and the solar cells, and to bond the other encapsulant to the solar cells and a backsheet. A protective package that includes the transparent top cover, encapsulated solar cells, and the backsheet is then optionally mounted on a frame. | 10-30-2014 |
| 20140335643 | METHOD FOR PRODUCING A PHOTOVOLTAIC MODULE - A photovoltaic module having at least one photovoltaic cell may be produced. At least one photovoltaic cell may be arranged on a substrate, covering the substrate and the cell with at least one rear wall. The rear wall may be made from at least one back sheet material, connecting the substrate, the cell, and the rear wall to one another in a planar fashion. At least one component may be arranged on the rear wall of the photovoltaic module by welding to the back sheet material. In the welding process, a heating element may be positioned between the component and at least a partial area of the rear wall, and at least the partial area of the rear wall of the photovoltaic module and a partial area of the component may be brought into contact with respective surfaces of the heating element. | 11-13-2014 |
| 20140377902 | SOLAR CELL WITH CONNECTING SHEET, SOLAR CELL MODULE, AND FABRICATION METHOD OF SOLAR CELL WITH CONNECTING SHEET - A method of fabricating a solar cell with a connecting sheet includes a fixing step of bonding at least a portion of a peripheral region of a back electrode type solar cell ( | 12-25-2014 |
| 20150050770 | PROCESS FOR PRODUCING LAYERED MEMBER AND LAYERED MEMBER - The object is to provide a photoelectric surface member which allows higher quantum efficiency. In order to achieve this object, a photoelectric surface member | 02-19-2015 |
| 20150056736 | METHODS OF HERMETICALLY SEALING PHOTOVOLTAIC MODULES - In various embodiments, photovoltaic modules are hermetically sealed by providing a first glass sheet, a photovoltaic device disposed on the first glass sheet, and a second glass sheet, a gap being defined between the first and second glass sheets, disposing a glass powder within the gap, and heating the powder to seal the glass sheets. | 02-26-2015 |
| 20150056737 | Interconnect Structure for CIS Flip-Chip Bonding and Methods for Forming the Same - A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity. | 02-26-2015 |
| 20150064831 | MANUFACTURE OF SOLAR CELL MODULE - A solar cell module is manufactured by encapsulating a solar cell matrix comprising a plurality of electrically connected solar cell components between a transparent panel and a backsheet with a resin. The method involves (i) embossing opposite surfaces of a green silicone rubber sheet, (ii) arranging a transparent panel ( | 03-05-2015 |
| 20150140719 | VERTICAL CONDUCTIVE CONNECTIONS IN SEMICONDUCTOR SUBSTRATES - An embodiment of a die comprising: a semiconductor body including a front side, a back side, and a lateral surface; an electronic device, formed in said semiconductor body and including an active area facing the front side; a vertical conductive connection, extending through the semiconductor body and defining a conductive path between the front side and the back side of the semiconductor body; and a conductive contact, defining a conductive path on the front side of the semiconductor body, between the active area and the vertical conductive connection, wherein the vertical conductive connection is formed on the lateral surface of the die, outside the active area. | 05-21-2015 |
| 20150298389 | METHOD OF PROTECTING AN ELECTRICAL COMPONENT IN A LAMINATE - A method for protecting an electrical component in a support layer of a functional laminate comprises the steps of providing the support layer with a first hole, a second hole and an opening connecting the first and the second holes together, positioning an electrical component inside the first hole, placing a patch of plastic material in the second hole, and causing the material of the patch to flow through the opening from the second hole to the first hole, flowing around the electrical component in order to surround it. | 10-22-2015 |
| 20150299509 | THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS FOR FORMING MICROELECTRONIC ASSEMBLIES - Embodiments in accordance with the present invention relate generally to polymer compositions useful in the forming of microelectronic assemblies, and more specifically to such compositions that encompass a thermally decomposable polymer and that provide both tackiness and solder fluxing. | 10-22-2015 |
| 20150303236 | FLIP-CHIP BONDING METHOD AND SOLID-STATE IMAGE PICKUP DEVICE MANUFACTURING METHOD CHARACTERIZED IN INCLUDING FLIP-CHIP BONDING METHOD - An electrode of an electronic component element ( | 10-22-2015 |
| 20150349189 | SOLAR CELL MODULE PRODUCTION METHOD, AND SOLAR CELL MODULE ADHESIVE APPLICATION SYSTEM - A solar cell module production method involves applying an adhesive on a light-receiving surface and a rear surface of a solar cell having electrodes on the light-receiving surface and the rear surface, and positioning and attaching a wiring material on the adhesive. Specifically, the solar cell, which is positioned with the light-receiving surface facing upward, is inverted so that the rear surface is facing upward, and the adhesive is applied on the rear surface; and then the solar cell is inverted once again so that the light-receiving surface is facing upward, and the adhesive is applied to the light-receiving surface. | 12-03-2015 |
| 20160005903 | SOLAR CELL METALLISATION AND INTERCONNECTION METHOD - A solar cell and a method of forming a contact structure on a solar cell having a p-n junction formed between a first semiconductor region of a first dopant polarity and a second semiconductor region of a second dopant polarity opposite to the first dopant polarity. The method comprises: forming a plurality of contact points on a surface of the solar cell, whereby the contact points provide an electrical connection to the first semiconductor region; and locating a plurality of conducting wires over the solar cell to make electrical connection to the contact points. The contact points are either an exposed silicon surface or a silicon surface over which metal pads are formed. The metal pads may comprise a plated layer of a low-melting temperature metal and/or may have a thickness of less than 5 microns. | 01-07-2016 |
| 20160079460 | MANUFACTURING PROCESS OF A HYBRID SOLAR PANEL - The invention relates to a hybrid solar panel comprising: photovoltaic elements having a front face and a rear face; a heat exchanger arranged opposite the rear face of said photovoltaic elements; and a cooling fluid circulating in said exchanger in such a way as to cool the photovoltaic elements, said exchanger comprising a heat exchange region through which said fluid flows, arranged beneath said photovoltaic elements, said exchange region comprising elements that enable the flow of the fluid to be disrupted in such a way as to stimulate the heat exchanges in the exchange region. The invention is characterised in that said exchange region is formed by a lower exchange plate designed in such a way as to form built-in obstruction elements extending over the entire thickness of the strand of cooling fluid flowing through the exchange region, and in that the upper end of the obstruction elements is in contact with the rear face of the photovoltaic elements in such a way that said photovoltaic elements are cooled mainly at these contact points. | 03-17-2016 |
| 20160104731 | Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region - A semiconductor device has a substrate containing a transparent or translucent material. A spacer is mounted to the substrate. A first semiconductor die has an active region and first conductive vias electrically connected to the active region. The active region can include a sensor responsive to light received through the substrate. The first die is mounted to the spacer with the active region positioned over an opening in the spacer and oriented toward the substrate. An encapsulant is deposited over the first die and substrate. An interconnect structure is formed over the encapsulant and first die. The interconnect structure is electrically connected through the first conductive vias to the active region. A second semiconductor die having second conductive vias can be mounted to the first die with the first conductive vias electrically connected to the second conductive vias. | 04-14-2016 |
| 20160118436 | METHOD OF MANUFACTURING AN IMAGE SENSOR BY JOINING A PIXEL CIRCUIT SUBSTRATE AND A LOGIC CIRCUIT SUBSTRATE AND THEREAFTER THINNING THE PIXEL CIRCUIT SUBSTRATE - The present technology includes: bonding a device formation side of a first substrate having a first device and a device formation side of a second substrate having a second device in opposition to each other; forming a protective film on at least an edge of the second substrate having the second device; and reducing a thickness of the first substrate. | 04-28-2016 |
| 20160118437 | MANUFACTURING METHOD OF BACK ILLUMINATION CMOS IMAGE SENSOR DEVICE USING WAFER BONDING - Disclosed is a manufacturing method of a semiconductor device including a step of attaching semiconductor wafers together, in which it is prevented that the bonding strength between the attached semiconductor wafers may be decreased due to a void caused between the two semiconductor wafers. Moisture, etc., adsorbed to the surfaces of the semiconductor wafers is desorbed by performing a heat treatment on the semiconductor wafers after cleaning the surfaces thereof with pure water. Subsequently, after a plasma treatment is performed on the semiconductor wafers, the two semiconductor wafers are attached together. The wafers are firmly bonded together by subjecting to a high-temperature heat treatment. | 04-28-2016 |
| 20160118520 | METHODS OF HERMETICALLY SEALING PHOTOVOLTAIC MODULES - In various embodiments, photovoltaic modules are hermetically sealed by providing a first glass sheet, a photovoltaic device disposed on the first glass sheet, and a second glass sheet, a gap being defined between the first and second glass sheets, disposing a glass powder within the gap, and heating the powder to seal the glass sheets. | 04-28-2016 |
| 20160126087 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device according to an embodiment includes forming an opening in a surface of an insulating layer which is provided in a surface of a first substrate and a surface of a second substrate. The method includes filling the opening with metal. The method includes activating the surface of the insulating layer. The method includes cleaning the surface of the metal filled in the opening of the first substrate using carbonated water. The method includes connecting the filled metal of the first substrate and the filled metal of the second substrate by bonding the insulating layer of the first substrate and the insulating layer of the second substrate. | 05-05-2016 |
| 20160177013 | CO-CROSSLINKER SYSTEMS FOR ENCAPSULATION FILMS COMPRISING UREA COMPOUNDS | 06-23-2016 |
| 20160177014 | CO-CROSSLINKER SYSTEMS FOR ENCAPSULATION FILMS COMPRISING (METH)ACRYLAMIDE COMPOUNDS | 06-23-2016 |
| 20160177015 | Dispersion for Simple Use in The Production of Encapsulation Films | 06-23-2016 |
| 20160177124 | CO-CROSSLINKER SYSTEMS FOR ENCAPSULATION FILMS COMPRISING ETHYLENE GLYCOL DI(METH)ACRYLATE COMPOUNDS | 06-23-2016 |
| 20160181466 | Solar Cell, Manufacturing Method Therefor, Solar-Cell Module, and Manufacturing Method Therefor | 06-23-2016 |
| 20160190204 | METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES - A method of forming image sensor packages may include performing a molding process. Mold material may be formed either on a transparent substrate in between image sensor dies, or on a removable panel in between transparent substrates attached to image sensor dies. Redistribution layers may be formed before or after the molding process. Mold material may be formed after forming redistribution layers so that the mold material covers the redistribution layers. In these cases, holes may be formed in the mold material to expose solder pads on the redistribution layers. Alternatively, redistribution layers may be formed after the molding process and the redistribution layers may extend over the mold material. Image sensor dies may be attached to a glass or notched glass substrate with dam structures. The methods of forming image sensor packages may result in hermetic image sensor packages that prevent exterior materials from reaching the image sensor. | 06-30-2016 |
| 20160197219 | SOLAR CELL MODULE MANUFACTURING METHOD | 07-07-2016 |
| 20160380139 | THIN FILM PHOTOVOLTAIC CELL WITH BACK CONTACTS - Photovoltaic cells, photovoltaic devices, and methods of fabrication are provided. The photovoltaic cells include a transparent substrate to allow light to enter the photovoltaic cell through the substrate, and a light absorption layer associated with the substrate. The light absorption layer has opposite first and second surfaces, with the first surface being closer to the transparent substrate than the second surface. A passivation layer is disposed over the second surface of the light absorption layer, and a plurality of first discrete contacts and a plurality of second discrete contacts are provided within the passivation layer to facilitate electrical coupling to the light absorption layer. A first electrode and a second electrode are disposed over the passivation layer to contact the plurality of first discrete contacts and the plurality of second discrete contacts, respectively. The first and second electrodes include a photon-reflective material. | 12-29-2016 |
