| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 427980400 |
Nonuniform or patterned coating
| 68 |
| 427970100 |
Multilayer
| 63 |
| 427960200 |
Protective coating (e.g., encapsulating, etc.)
| 24 |
| 427980600 |
With pretreatment of substrate
| 20 |
| 427990200 |
With posttreatment of coating or coating material
| 16 |
| 427970700 |
Coating hole wall
| 16 |
| 427960800 |
Vapor or gas deposition
| 13 |
| 427990500 |
Immersion metal plating from solution (e.g., electroless plating, etc.)
| 12 |
| 427960900 |
Front and back of substrate coated (excluding processes where all coating is by immersion) | 2 |
| 20120064230 | METHOD FOR FORMING CONDUCTIVE VIA IN A SUBSTRATE - The steps of the present invention are as follows: (a) a detachable film is formed on both sides of a substrate, respectively; (b) a number of vias running through both sides of the detachable films are formed in the substrate; (c) the vias are filled with a conductive paste; (d) the detachable films are peeled off; (e) a metallic conductive layer is deposited on both sides of the substrate, respectively; (f) a specific mold pattern is formed on the metallic conductive layers, respectively, by a photolithographic process; (g) a metallic circuit layout layer is formed on the patterns, respectively, by an electrochemical process; and (h) the mold patterns and the metallic conductive layers are removed. As such, the substrate is not contaminated by the conductive paste. Further, by using deposition, metallic conductive layers are directly adhered to the substrate and, by using photolithography, layouts with small linewidth could be formed. | 03-15-2012 |
| 20150010694 | METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY - The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching. | 01-08-2015 |
| 427960700 |
Using mist or aerosol | 2 |
| 20130029032 | Mechanically Integrated and Closely Coupled Print Head and Mist Source - A deposition apparatus comprising one or more atomizers structurally integrated with a deposition head. The entire head may be replaceable, and prefilled with material. The deposition head may comprise multiple nozzles. Also an apparatus for three dimensional materials deposition comprising a tiltable deposition head attached to a non-tiltable atomizer. Also methods and apparatuses for depositing different materials either simultaneously or sequentially. | 01-31-2013 |
| 20170232744 | METHOD FOR PRODUCING PIEZOELECTRIC ACTUATOR AND METHOD FOR PRODUCING LIQUID TRANSPORT APPARATUS | 08-17-2017 |
| Entries |
| Document | Title | Date |
|---|
| 20080268138 | Metal plating compositions and methods - Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power. | 10-30-2008 |
| 20080299300 | Method for providing near-hermetically coated, thermally protected integrated circuit assemblies - The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes adding thermally conductive particles to a low processing temperature, at least near-hermetic, glass-based coating. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to at least one of the integrated circuit and the substrate. The method further includes curing the coating. | 12-04-2008 |
| 20090029036 | COBALT PRECURSORS FOR SEMICONDUCTOR APPLICATIONS - Methods and compositions for depositing a cobalt containing film on one or more substrates are disclosed herein. A cobalt precursor, which comprises at least one pentadienyl ligand coupled to the cobalt for thermal stability, is introduced into a reaction chamber containing one or more substrates, and the cobalt precursor is deposited to form a cobalt containing film onto the substrate. | 01-29-2009 |
| 20090035453 | Pattern forming system, pattern forming method, and electronic apparatus - A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate. | 02-05-2009 |
| 20090130298 | Method for Obtaining Controlled Sidewall Profile in Print-Patterned Structures - High aspect ratio structures can be obtained by print-patterning masking features in feature stacks such that each feature has a lateral edge which is aligned in a plane roughly perpendicular to the plane of the substrate on which the features are formed. Due to the differential lateral spreading between features formed on a substrate and formed atop other features, the print head is indexed less than the radius of a droplet to a position where a droplet ejected by the print head forms an upper feature atop a lower feature such that the lateral edges of the upper and lower features are aligned in the plane roughly perpendicular to the plane of the substrate. Feature stacks of two or more features may provide a vertical (or re-entrant) sidewall mask for formation of high aspect ratio structures, by e.g., electroplating, etc. | 05-21-2009 |
| 20090142477 | Portable electronic device and transferring method of circuit element thereof - A portable electronic device and a transferring method of a circuit element thereof are provided. The portable electronic device comprises a main body and a circuit element. The main body has a shell and a control element by a print way. The circuit element is integrated with the shell by transferring and is electrically connected with the control element. | 06-04-2009 |
| 20100215839 | Integrated circuits having organic-inorganic dielectric materials and methods for forming such integrated circuits - A method for making an integrated circuit is disclosed comprising depositing alternating regions of electrically conductive material and hybrid organic inorganic dielectric material on a substrate, wherein an area of dielectric material is formed by hydrolyzing a plurality of precursors to form a hybrid organic inorganic material comprised of a silicon oxide backbone and having an organic substituent bound to the backbone, and depositing the hybrid organic inorganic material on a substrate, removing the hybrid organic-inorganic material in selected areas, and depositing an electrically conductive material in the selected areas, wherein one of the precursors is a compound of the general formula R | 08-26-2010 |
| 20100323099 | Non-Etching Non-Resist Adhesion Composition and Method of Preparing a Work Piece - To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N | 12-23-2010 |
| 20110064870 | PREPARING SUBSTRATES CONTAINING POLYMERS FOR METALLIZATION - Methods of swelling and topographically altering polymers of substrates using low foaming compositions are disclosed. Solvent swells which are stable, homogeneous and low foaming are applied to substrates containing polymers to swell and soften the polymers followed by applying an oxidizer to topographically alter and desmear the polymers in preparation for metallization of the substrate. | 03-17-2011 |
| 20110318478 | PARTICLES AND INKS AND FILMS USING THEM - Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards. | 12-29-2011 |
| 20110318479 | METAL PLATING COMPOSITIONS AND METHODS - Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power. | 12-29-2011 |
| 20120034371 | METAL PLATING COMPOSITIONS - Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate. | 02-09-2012 |
| 20120040088 | SYSTEMS AND METHODS FOR APPLYING A LIQUID COATING MATERIAL TO A SUBSTRATE - Systems and methods for applying liquid coating materials to a substrate, such as an electronic component or circuit board. A control system of a coating system controls an applicator and a robot moving the applicator to apply the liquid coating material to the substrate in accordance with the information contained in a coating program. The control system determines a volume of liquid coating material actually dispensed onto the substrate during the coating program, and compares the dispensed volume to a desired dispensed volume of liquid coating material to produce an error signal representing the difference between the calculated and desired volume values. The control system uses the error signal to change the dispensed volume of liquid coating material on a subsequent substrate by a future coating program. | 02-16-2012 |
| 20130078367 | ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS - An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition. | 03-28-2013 |
| 20130344234 | METHOD AND APPARATUS FOR COATING A COMPONENT - In a method for coating a component using a liquid, a liquid curtain is produced with the aid of a fan jet nozzle which has two adjustable nozzle pipes. | 12-26-2013 |
| 20150064345 | MATERIAL DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE - A material deposition system includes a frame, a support coupled to the frame to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber to hold material, an actuator to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity. | 03-05-2015 |
| 20160205787 | METHOD AND SYSTEM FOR NOZZLE COMPENSATION IN NON-CONTACT MATERIAL DEPOSITION | 07-14-2016 |
| 20220136111 | APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - An apparatus for fabricating a semiconductor device includes a chamber accommodating a substrate coated with a first fluid, a lower inlet which is placed in a lower wall of the chamber and providing a first supercritical fluid into the chamber, an upper inlet placed in an upper wall of the chamber and providing a second supercritical fluid into the chamber, a fluid outlet placed in the lower wall of the chamber and discharging a second fluid which is a mixture of the first fluid and the first supercritical fluid to outside of the chamber, and a drain cup placed between the lower wall of the chamber and the substrate, and having a first portion of which a width, in a horizontal direction, decreases toward the lower wall of the chamber, and a second portion which connects the first portion and the fluid outlet to each other. | 05-05-2022 |
