| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 427970700 | Coating hole wall | 16 |
| 20090029037 | PLATING APPARATUS AND METHOD OF PLATING - A plating apparatus and method to perform plating in non-through-hole openings or through-hole openings of a printed wiring board having at least either non-through holes or through-holes to form via-hole conductors or through-hole conductors. The plating method contacts a printed wiring board having the non-through holes or through-holes with a plating solution including plating ingredients, and plates metal on a surface of the printed wiring board while making contact with at least a portion of a pliable contact body. | 01-29-2009 |
| 20110300291 | Method for Film Formation, Apparatus for Film Formation, and Computer-Readable Recording Medium - Disclosed is a method for film formation, characterized by comprising allowing a treatment gas stream containing a metal carbonyl-containing treatment gas and a carbon monoxide-containing carrier gas to flow into a region on the upper outside of the outer periphery of a substrate to be treated in a diameter direction of the substrate while avoiding the surface of the substrate and diffusing the metal carbonyl from the treatment gas stream into the surface of the substrate to form a metal film on the surface of the substrate. | 12-08-2011 |
| 20120058254 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. | 03-08-2012 |
| 20120107489 | Cartridge Block for Multilayer Ceramic Screening - A cartridge block for screening a multilayer ceramic with a conductive paste includes a threaded paste cartridge attachment located at a top of the cartridge block, the threaded paste cartridge attachment being configured to receive a paste cartridge containing the conductive paste; a paste routing section, the paste routing section located underneath the threaded paste cartridge attachment, the paste routing section comprising a flared section located at a bottom of the cartridge block, the paste routing section being configured to receive the conductive paste from the threaded paste cartridge attachment and route the paste through the flared section. | 05-03-2012 |
| 20140023777 | METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUGH HOLE - There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and the metal wiring includes a polycrystalline region of the solder alloy. The metal wiring of the present invention is superior in conductivity. | 01-23-2014 |
| 20140120245 | PLATING METHOD - The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board. | 05-01-2014 |
| 20150376795 | FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS - The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates. | 12-31-2015 |
| 20160017498 | ELECTROLESS COPPER PLATING COMPOSITIONS - Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths. | 01-21-2016 |
| 427970800 | With pretreatment of substrate | 7 |
| 20130089658 | LASER PROCESSING METHOD AND PRODUCTION METHOD OF MULTILAYER FLEXIBLE PRINTED WIRING BOARD USING LASER PROCESSING METHOD - There is provided a laser processing method of forming via holes | 04-11-2013 |
| 20130209672 | COMPONENT HAVING A THROUGH-CONNECTION - A method for manufacturing a component having a through-connection. The method includes providing a semiconductor substrate, forming a recess in the semiconductor substrate, and introducing into the recess a pourable starting material which has a metal. The method furthermore includes carrying out a heating process, an electrically conductive structure forming the through-connection being developed from the pourable starting material. | 08-15-2013 |
| 20130216699 | METHOD AND APPARATUS FOR FILLING METAL PASTE, AND METHOD FOR FABRICATING VIA PLUG - Disclosed is a metal paste filling apparatus that fills the metal paste in a non-through hole of a substrate conveniently and efficiently without producing a void. | 08-22-2013 |
| 427970900 | Immersion metal plating from solution (e.g., electroless plating, etc.) | 4 |
| 20140099432 | FABRICATION METHOD FOR FLEXIBLE CIRCUIT BOARD - A fabrication method for a flexible circuit board is provided. The fabrication method includes the following steps. Firstly, a release film having an upper surface and a lower surface opposite to each other is provided. Next, two flexible substrates are respectively disposed on the upper surface and the lower surface. Next, a plurality of nano-scale micro-pores are formed on each flexible substrate to form two non-smooth flexible substrates. The nano-scale micro-pores evenly distributed over an outer surface of each non-smooth flexible substrate. Each non-smooth flexible substrate being adapted to be performed a plating process directly on the outer surface thereof. | 04-10-2014 |
| 20140178572 | FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS - The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates. | 06-26-2014 |
| 427980100 | Activating or catalyst pretreatment | 2 |
| 20140087062 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 03-27-2014 |
| 20160205783 | METHOD FOR TREATMENT OF RECESSED STRUCTURES IN DIELECTRIC MATERIALS FOR SMEAR REMOVAL | 07-14-2016 |
| 427980200 | With posttreatment of coating or coating material | 1 |
| 20160113119 | SUBSTRATE VIA FILLING - A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate. | 04-21-2016 |
