| Entries |
| Document | Title | Date |
|---|
| 20080198649 | Memory device and method of manufacturing a memory device - A memory device includes a bit line, a reading word line, a bit line contact, an electrode, a writing word line and a contact tip. The bit line is formed on a substrate. The reading word line is formed over the bit line. The bit line contact is disposed between adjacent reading word lines. The electrode extends substantially in parallel to the reading word line and includes a conductive material being bent in response to an applied voltage. The writing word line is formed over the electrode and is separated from the electrode. The contact tip is formed at an end portion of the electrode and is separated from the reading and the writing word lines. The contact tip protrudes toward the reading word line or writing word line. | 08-21-2008 |
| 20080253179 | SEMICONDUCTOR DEVICE, AN ELECTRONIC DEVICE AND A METHOD FOR OPERATING THE SAME - A semiconductor memory device includes circuitry coupled to a plurality of memory cells with transistors. The circuitry is configured to change a potential of a body of the transistor to a degree depending on a charging state of the body. A gate electrode of the transistor is maintained in a non-addressed state. | 10-16-2008 |
| 20080259680 | Memory Element and Method for Manufacturing Same - A novel nonvolatile memory element, which can be manufactured by a simple and high yield process by using an organic material and has a high on/off ratio, and a method for manufacturing such nonvolatile memory element. A switching layer ( | 10-23-2008 |
| 20080266944 | NON-VOLATILE MEMORY CELL WITH A HYBRID ACCESS TRANSISTOR - A non-volatile memory cell includes an access and a storage transistor coupled in series. The memory cell is formed on a thin gate well tailored for transistors with thin gate dielectrics. The access transistor is a hybrid transistor which includes a gate with a thick gate dielectric layer formed on the thin gate well. | 10-30-2008 |
| 20080285337 | RECORDABLE ELECTRICAL MEMORY - A memory device includes memory cells each having a recordable layer between two metal layers, each memory cell being constructed and designed to change from a first state to a second state upon application of an initialization signal, and change from the second state to a third state upon application of a write signal. For a voltage within a specified range that is applied across the two metal layers, the memory cell has a lower resistance in the first state than in the second state, and has a higher resistance in the second state than in the third state. | 11-20-2008 |
| 20090003050 | FLOATING BODY MEMORY ARRAY - Provided herein are embodiments of layouts for applying impact ionization potentials across the channel of a selected floating body cell in an array without having to impose the potential on other unselected cells. | 01-01-2009 |
| 20090003051 | Semiconductor Memory Device and Semiconductor Device - The semiconductor memory device includes an initialization memory cell having a first inverter circuit including a first transistor and a second transistor, and a second inverter circuit whose input portion is connected to an output portion of the first inverter circuit and output portion is connected to an input portion of the first inverter circuit, and including a third transistor and a fourth transistor. An absolute value of a threshold voltage of the third transistor is smaller than that of the first transistor | 01-01-2009 |
| 20090010052 | One-transistor type dram - A one-transistor type DRAM including a floating body storage element connected between a bit line and a source line and controlled by a word line comprises a plurality of source lines and word lines arranged in a row direction, a plurality of bit lines arranged in a column direction, a plurality of clamp bit lines and reference bit lines arranged in a column direction, a cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a clamp cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a reference cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, and a sense amplifier and a write driving unit connected to the bit line and configured to receive a clamp voltage and a reference voltage. | 01-08-2009 |
| 20090034327 | THERMAL-EMITTING MEMORY MODULE, THERMAL-EMITTING MODULE SOCKET, AND COMPUTER SYSTEM - The invention provides a thermal-emitting memory module, a thermal-emitting module socket, and a computer system comprising the thermal-emitting memory module and the thermal-emitting module socket. An embodiment of the thermal-emitting module includes: a module substrate having electrically-conductive traces; and a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting component disposed in proximity of the semiconductor device without directly contacting the semiconductor device. | 02-05-2009 |
| 20090073758 | SRAM CELLS WITH ASYMMETRIC FLOATING-BODY PASS-GATE TRANSISTORS - The embodiments of the invention provide SRAM cells with asymmetric floating-body pass-gate transistors. More specifically, a semiconductor device includes an SRAM cell, a first pass-gate transistor, and a second pass-gate transistor. The first pass-gate transistor is connected to a first side of the SRAM cell, wherein the first pass-gate transistor comprises a first drain region and a first source region. The second pass-gate transistor is connected to a second side of the SRAM cell, wherein the second side is opposite the first side. The second pass-gate transistor comprises a second source region and a second drain region. Furthermore, the first source region and/or the second source region comprise a xenon implant. The first drain region and the second drain region each lack a xenon implant. | 03-19-2009 |
| 20090086535 | SEMICONDUCTOR ARRAY - A semiconductor array includes a matrix of cells, the matrix being arranged in rows and columns of cells, and a plurality of control lines. Each cell is coupled to a number of control lines allowing to select and read/write said cell. At least one of said control lines is coupled to cells of a plurality of columns and of at least two rows of the matrix. | 04-02-2009 |
| 20090091972 | SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - The disclosure concerns a memory including a floating body provided in a semiconductor layer between a source and a drain and storing data; a first gate dielectric provided on a first surface of the body; a first gate electrode provided on the first surface via the first gate dielectric; a second gate dielectric provided on a second surface of the body different from the first surface; a second gate electrode provided on the second surface via the second gate dielectric; a driver driving the first gate electrode and the second gate electrode; and a sense amplifier writing into the memory cells first data showing a sate of a small charge amount in a state that a voltage of the second gate electrode at a data writing time is brought closer to a potential of the source layer than a voltage of the second gate electrode at a data holding time. | 04-09-2009 |
| 20090097308 | MULTIVALUE MEMORY STORAGE WITH TWO GATING TRANSISTORS - Digital memory devices and systems, as well as methods of operating digital memory devices, that include a multivalue memory cell with a first and a second gating transistor arranged in parallel, having a first and a second node, respectively, coupled to a storage element, and sensing circuitry coupled to a third and a fourth node of the first and second gating transistors, respectively, to sense a stored voltage of the memory cell. In embodiments, the first and second gating transistors are configured to activate at different threshold voltage levels. | 04-16-2009 |
| 20090129145 | Memory Cell Array Comprising Floating Body Memory Cells - A memory cell array includes a plurality of floating body memory cells, which are arranged in cell rows, and world lines, wherein each word line is configured to control memory cells associated with a pair of cell rows. The memory cell array also includes bitlines, wherein each bitline is electrically connected to an individual memory cell of each pair of the cell rows. | 05-21-2009 |
| 20090175073 | Nanostructure-Based Memory - Improved memory devices that include one or more nanostructures such as carbon nanotubes or other nanostructures, as well as systems and devices incorporating such improved memory devices, are disclosed. In at least some embodiments, the improved memory device is of a nonvolatile type such as a flash memory device, and employs a pair of triodes that form a memory cell, where each triode employs at least one carbon nanotube. Also disclosed are methods of operating and fabricating such improved memory devices. | 07-09-2009 |
| 20090185413 | SEMICONDUCTOR DEVICE HAVING INPUT CIRCUIT WITH OUTPUT PATH CONTROL UNIT - A semiconductor device minimizes generation of an output signal skew of an input buffer and thus stabilizes the operation of the semiconductor device. The semiconductor integrated circuit includes an input potential detection unit outputting a detection signal in response to a level of an input signal, an input buffer buffering the input signal, and an output path control unit that receives the output signal of the input buffer and the detection signal of the input potential detection unit and outputs an output driving signal in response to the level of the detection signal. | 07-23-2009 |
| 20090190394 | CAPACITORLESS DRAM ON BULK SILICON - A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate is provided, and an array of silicon studs is defined within the silicon substrate. An insulator layer is defined atop at least a portion of the silicon substrate, and between the silicon studs. A silicon-over-insulator layer is defined surrounding the silicon studs atop the insulator layer, and a capacitorless DRAM is formed within and above the silicon-over-insulator layer. | 07-30-2009 |
| 20090207654 | Semiconductor device including plurality of parallel input/output lines and methods of fabricating and using the same - Provided are semiconductor devices and methods for fabricating and using the semiconductor devices, wherein the semiconductor devices may include a first element, a second element, and a plurality of parallel IO lines connecting the first element with the second element. The plurality of IO lines may have different lengths and the shortest IO line from among the plurality of the IO lines may be adjacent to a longest IO line from among the plurality of the IO lines. | 08-20-2009 |
| 20090251958 | Read circuitry for an integrated circuit having memory cells and/or a memory cell array, and method of operating same - An integrated circuit device (e.g., a logic device or a memory device) having a memory cell array which includes (i) a plurality of memory cells, wherein each memory cell is programmable to store one of a plurality of data states, and (ii) a bit line, having a plurality of memory cells coupled thereto. Memory cell control circuitry applies one or more read control signals to perform a read operation wherein, in response to the read control signals, a selected memory cell conducts a current which is representative of the data state stored therein. Sense amplifier circuitry senses the data state stored in the selected memory cell using a signal which is responsive to the current conducted by the selected memory cell. Current regulation circuitry is responsively and electrically coupled to the bit line during a portion of the read operation to sink or source at least a portion of the current provided on the bit line. Sensing circuitry responsively couples the current regulation circuitry to the bit line during the portion of the read operation. | 10-08-2009 |
| 20090251959 | SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - A memory includes: memory cells including floating bodies, wherein in a data holding state, a potential of the first gate electrode is set to be higher than one of potentials of the source and drain layer and lower than the other of the potentials of the source and drain layer so that electric charges flow in the body region, and a potential of the second gate electrode is set to be higher as an absolute value than those of potentials of the source layer, drain layer, and first gate electrode so that electric charges flow from the body region, and in the data holding state, the memory cell is kept in a stationary state that a first amount of the electric charges flowing in the body region per unit time is substantially the same as a second amount of the electric charges flowing from the body region per unit time. | 10-08-2009 |
| 20090296463 | MEMORY CELLS, MEMORY DEVICES AND INTEGRATED CIRCUITS INCORPORATING THE SAME - A memory device is provided which includes a write bit line, a read bit line, and at least one memory cell. The memory cell includes a write access transistor, a read access transistor coupled to the read bit line and to the first write access transistor, and a gated-lateral thyristor (GLT) device coupled to the first write access transistor. Among its many features, the memory cell prevents read disturbances during read operations by decoupling the read and write bit lines. | 12-03-2009 |
| 20100067294 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: an input pad set configured to receive an external input signal and a reference voltage; an input buffer set configured to detect and transmit the input signal to an internal circuit of the semiconductor memory device by comparing the input signal with the reference voltage; and a reference voltage generation circuit configured to generate the reference voltage to supply the reference voltage to the input pad set and the input buffer set during a test operation, the reference voltage generation circuit being deactivated after the semiconductor memory device is packaged. | 03-18-2010 |
| 20100080055 | SEMICONDUCTOR MEMORY DEVICE - Disclosed herein is a semiconductor memory device which prevents the voltage of a select bit line from being reduced due to the action of coupling capacitance between the select bit line and a non-select bit line, reduces current consumption, and enables high speed reading of bit lines. The semiconductor memory device includes a plurality of memory banks, a plurality of second bit lines, a plurality of selector circuits, a voltage supply circuit. Each of the memory banks includes a plurality of first bit lines, a plurality of word lines, and a plurality of memory banks which are installed between the first bit lines and the word lines. The voltage supply circuit holds non-select bit lines of the first bit lines at the GND level at all times. | 04-01-2010 |
| 20100097853 | Jeet memory cell - A memory cell (FIG. | 04-22-2010 |
| 20100135073 | ORGANIC ELECTRONIC MEMORY COMPONENT, MEMORY COMPONENT ARRANGEMENT AND METHOD FOR OPERATING AN ORGANIC ELECTRONIC MEMORY COMPONENT - The invention relates to an organic electronic memory component having an electrode and a counterelectrode and an organic layer arrangement formed between said electrode and counterelectrode and in electrical contact herewith. wherein the organic layer arrangement comprises the following organic layers: an electrode-specific charge carrier transport layer and a counterelectrode-specific charge carrier-blocking layer and disposed between said electrode-specific charge carrier transport layer and counterelectrode-specific charge carrier-blocking layer a memory layer region having a charge carrier-storing layer and a further charge carrier-storing layer between which charge carrier-storing layer and a further charge carrier-storing layer is disposed a charge carrier barrier layer. Furthermore the invention relates to a method for the operating of an organic electronic memory component. | 06-03-2010 |
| 20100149864 | MEMORY CIRCUIT WITH QUANTUM WELL-TYPE CARRIER STORAGE - Data is stored in a quantum-well type structure with double gate control. According to an example embodiment, a transistor-based data storage circuit includes a gate, a back gate and a semiconductor channel between the gate and the back gate. Carriers are stored in a storage pocket structure in the channel, in response to biases applied to the gate and back gate. Current passing through the channel is sensed and used to detect the stored carriers and, correspondingly, a memory state of the storage circuit. | 06-17-2010 |
| 20100157667 | Capacitorless DRAM memory cell comprising a partially-depleted MOSFET device comprising a gate insulator in two parts - The capacitorless DRAM memory cell is constituted by a partially-depleted MOSFET device successively comprising a base substrate, a buried insulator, a floating substrate from semiconducting material including a channel, the gate insulator and a gate. The gate comprises a first zone doped by a first type of dopant and a second zone doped by a second type of dopant. The channel is doped by the second type of dopant. The gate insulator comprises a first part corresponding to the first doped zone and a second part corresponding to the second doped zone of the gate. The first part of the gate insulator has a higher tunnel resistance than the second part. Data storage is realized by means of charge carrier transportation from the gate to the floating substrate through the lower tunnel resistance part of the gate insulator. | 06-24-2010 |
| 20100254185 | NONVOLATILE MEMORY APPARATUS AND METHOD OF USING THIN FILM TRANSISTOR AS NONVOLATILE MEMORY - The present invention relates to a nonvolatile memory apparatus and a method of using a thin film transistor (TFT) as a nonvolatile memory by storing carriers in a body of the TFT, which operates a general TFT as a memory cell of a nonvolatile memory by manipulating the electrical characteristics of the TFT in order to integrate with other electrical components formed by TFTs, such as logic circuit or TFT-LCD pixel transistor, on the LCD panel without additional semiconductor manufacturing processes. | 10-07-2010 |
| 20100284218 | SUPERLATTICE DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE MEMORY INCLUDING SUPERLATTICE DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING DEVICE - To include a superlattice laminate having laminated thereon a first crystal layer of which crystal lattice is a cubic crystal and in which positions of constituent atoms are reversibly replaced by application of energy, and a second crystal layer having a composition different from that of the first crystal layer, and an orientation layer that is an underlaying layer of the superlattice laminate and causes a laminated surface of the first crystal layer to be (111)-orientated. According to the present invention, the laminated surface of the first crystal layer can be (111)-orientated by using the orientation layer as an underlaying layer. In the first crystal layer of which laminated surface is (111)-orientated, a crystal structure reversibly changes when a relatively low energy is applied. Therefore, characteristics of a superlattice device having this crystal layer can be enhanced. | 11-11-2010 |
| 20100315871 | DYNAMIC DATA RESTORE IN THYRISTOR-BASED MEMORY DEVICE - A dynamically-operating restoration circuit is used to apply a voltage or current restore pulse signal to thyristor-based memory cells and therein restore data in the cell using the internal positive feedback loop of the thyristor. In one example implementation, the internal positive feedback loop in the thyristor is used to restore the conducting state of a device after the thyristor current drops below the holding current. A pulse and/or periodic waveform are defined and applied to ensure that the thyristor is not released from its conducting state. The time average of the periodic restore current in the thyristor may be lower than the holding current threshold. While not necessarily limited to memory cells that are thyristor-based, various embodiments of the invention have been found to be the particularly useful for high-speed, low-power memory cells in which a thin capacitively-coupled thyristor is used to provide a bi-stable storage element. | 12-16-2010 |
| 20110170343 | DRAM MEMORY CELL HAVING A VERTICAL BIPOLAR INJECTOR - The invention relates to a memory cell having an FET transistor with a source, a drain and a floating body between the source and the drain, and an injector that can be controlled to inject a charge into the floating body of the FET transistor. The injector includes a bipolar transistor having an emitter, a base and a collector formed by the body of the FET transistor. Specifically, in the memory cell, the emitter of the bipolar transistor is arranged so that the source of the FET transistor serves as the base for the bipolar transistor. The invention also includes a memory array comprising a plurality of memory cells according to the first aspect of the invention, and to methods of controlling such memory cells. | 07-14-2011 |
| 20110222336 | SEMICONDUCTOR DEVICE - The invention provides a semiconductor device where data can be written after the production and forgery caused by rewriting of data can be prevented, and which can be manufactured at a low cost using a simple structure and an inexpensive material. Further, the invention provides a semiconductor device having the aforementioned functions, where wireless communication is not blocked by the internal structure. The semiconductor device of the invention has an organic memory provided with a memory cell array including a plurality of memory cells, a control circuit for controlling the organic memory, and a wire for connecting an antenna. Each of the plurality of memory cells has a transistor and a memory element. The memory element has a structure where an organic compound layer is provided between a first conductive layer and a second conductive layer. The second conductive layer is formed in a linear shape. | 09-15-2011 |
| 20120092924 | METHOD OF PROVIDING AN ERASE ACTIVATION ENERGY OF A MEMORY DEVICE - A write-once read-many times memory device is made up of first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrode. The memory device is programmed by providing a charged species from the passive layer into the active layer. The memory device may be programmed to have for the programmed memory device a first erase activation energy. The present method provides for the programmed memory device a second erase activation energy greater than the first erase activation energy. | 04-19-2012 |
| 20120163071 | SIGNAL PROCESSING CIRCUIT - It is an object to provide a signal processing circuit for which a complex manufacturing process is not necessary and whose power consumption can be suppressed. In particular, it is an object to provide a signal processing circuit whose power consumption can be suppressed by stopping the power supply for a short time. The signal processing circuit includes a control circuit, an arithmetic unit, and a buffer memory device. The buffer memory device stores data sent from the main memory device or the arithmetic unit in accordance with an instruction from the control unit; the buffer memory device comprises a plurality of memory cells; and the memory cells each include a transistor including an oxide semiconductor in a channel formation region and a memory element to which charge whose amount depends on a value of the data is supplied via the transistor. | 06-28-2012 |
| 20120188819 | METHODS AND SYSTEMS FOR MEMS CMOS PROGRAMMABLE MEMORIES AND RELATED DEVICES - Systems and methods for CMOS-based MEMS programmable memories are described. In one aspect, the systems and methods provide for a programmable memory having multiple memory cells. Each memory cell includes an electrode disposed within the memory cell, and a conductor material having two ends disposed proximate to the electrode. The programmable memory provides means for applying a voltage between the electrode and the conductor material, e.g., a voltage source. The applied voltage generates an electrostatic force sufficient to permanently alter the conductor material, thereby programming the memory cell. | 07-26-2012 |
| 20120195114 | SEMICONDUCTOR STORAGE DEVICE, SEMICONDUCTOR STORAGE DEVICE MANUFACTURING METHOD AND PACKAGE RESIN FORMING METHOD - A ferroelectric capacitor comprising a transistor layer superimposed on a semiconductor substrate, a ferroelectric capacitor layer provided superior to the transistor layer, a wiring layer provided superior to the ferroelectric capacitor layer, and a passivation film. Further, at least one layer of barrier film capable of inhibiting penetration of moisture and hydrogen into the underlayer is provided between the ferroelectric capacitor layer and the passivation film, and the passivation film is characterized by containing a novolac resin. | 08-02-2012 |
| 20120213000 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE - A highly integrated gain cell-type semiconductor memory is provided. A first insulator, a read bit line, a second insulator, a third insulator, a first semiconductor film, first conductive layers, and the like are formed. A projecting insulator is formed thereover. Then, second semiconductor films and a second gate insulating film are formed to cover the projecting insulator. After that, a conductive film is formed and subjected to anisotropic etching, so that write word lines are formed on side surfaces of the projecting insulator. A third contact plug for connection to a write bit line is formed over a top of the projecting insulator. With such a structure, the area of the memory cell can be 4 F | 08-23-2012 |
| 20120218816 | Non-Volatile Memory Devices - A non-volatile memory device may include a semiconductor substrate including an active region at a surface thereof, a ground select line crossing the active region, and a string select line crossing the active region and spaced apart from the ground select line. A plurality of memory cell word lines may cross the active region between the ground select line and the string select line with about a same first spacing provided between adjacent ones of the plurality of word lines and between a last of the plurality of memory cell word lines and the string select line. A second spacing may be provided between the ground select line and a first of the plurality of memory cell word lines. | 08-30-2012 |
| 20120281468 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE - The present disclosure provides a semiconductor device and a semiconductor memory device. The semiconductor device can be used as a memory cell, and may comprise a first P-type semiconductor layer, a first N-type semiconductor layer, a second P-type semiconductor layer, and a second N-type semiconductor layer arranged in sequence. A first data state may be stored in the semiconductor device by applying a forward bias, which is larger than a punch-through voltage V | 11-08-2012 |
| 20130301349 | Compact Semiconductor Memory Device Having Reduced Number of Contacts, Methods of Operating and Methods of Making - An integrated circuit including a link or string of semiconductor memory cells, wherein each memory cell includes a floating body region for storing data. The link or string includes at least one contact configured to electrically connect the memory cells to at least one control line, and the number of contacts in the string or link is the same as or less than the number of memory cells in the string or link. | 11-14-2013 |
| 20140016407 | Semiconductor Device And Method For Driving Semiconductor Device - A semiconductor device with a novel structure is provided, in which the operation voltage is reduced or the storage capacity is increased by reducing variation in the threshold voltages of memory cells after writing. The semiconductor device includes a plurality of memory cells each including a transistor including an oxide semiconductor and a transistor including a material other than an oxide semiconductor, a driver circuit that drives the plurality of memory cells, and a potential generating circuit that generates a plurality of potentials supplied to the driver circuit. The driver circuit includes a data buffer, a writing circuit that writes one potential of the plurality of potentials into each of the plurality of memory cells as data, a reading circuit that reads the data written into the memory cells, and a verifying circuit that verifies whether the read data agrees with data held in the data buffer or not. | 01-16-2014 |
| 20140177330 | VERTICAL BJT FOR HIGH DENSITY MEMORY - Some aspects of this disclosure relate to a memory device. The memory device includes a collector region having a first conductivity type and which is coupled to a source line of the memory device. A base region is formed over the collector region and has a second conductivity type. A gate structure is coupled to the base region and acts as a shared word line for first and second neighboring memory cells of the memory device. First and second emitter regions are formed over the base region and have the first conductivity type. The first and second emitter regions are arranged on opposite sides of the gate structure. First and second contacts extend upwardly from the first and second emitter regions, respectively, and couple the first and second emitter regions to first and second data storage elements, respectively, of the first and second neighboring memory cells, respectively. | 06-26-2014 |
| 20140211558 | SIGNAL PROCESSING CIRCUIT - It is an object to provide a signal processing circuit for which a complex manufacturing process is not necessary and whose power consumption can be suppressed. In particular, it is an object to provide a signal processing circuit whose power consumption can be suppressed by stopping the power supply for a short time. The signal processing circuit includes a control circuit, an arithmetic unit, and a buffer memory device. The buffer memory device stores data sent from the main memory device or the arithmetic unit in accordance with an instruction from the control unit; the buffer memory device comprises a plurality of memory cells; and the memory cells each include a transistor including an oxide semiconductor in a channel formation region and a memory element to which charge whose amount depends on a value of the data is supplied via the transistor. | 07-31-2014 |
| 20140269047 | APPARATUS AND METHODS RELATING TO A MEMORY CELL HAVING A FLOATING BODY - An apparatus is disclosed for a memory cell having a floating body. A memory cell may include a transistor over an insulation layer, the transistor including a source, and a drain. The memory cell may also include a floating body including a first region positioned between the source and the drain, a second region positioned remote from each of the source and drain, and a passage extending through the insulation layer and coupling the first region to the second region. Additionally, the memory cell may include a bias gate at least partially surrounding the second region and configured for operably coupling to a bias voltage. Furthermore, the memory cell may include a plurality of dielectric layers, wherein each outer vertical surface of the second region has a dielectric layer of the plurality adjacent thereto. | 09-18-2014 |
| 20150092484 | SEMICONDUCTOR INTEGRATED CIRCUIT - A plurality of memory blocks; and a control block configured to independently operate a part of the plurality of memory banks as a first sub-channel and a remainder of the plurality of memory banks as a second sub-channel according to whether a sub-channel is set. | 04-02-2015 |
| 20160197294 | SEMICONDUCTOR DEVICE WITH PROGRAMMABLE RESPONSE | 07-07-2016 |
| 20160197296 | SEMI-CONDUCTOR DEVICE WITH PROGRAMMABLE RESPONSE | 07-07-2016 |
| 20180026658 | LDPC DECODER, SEMICONDUCTOR MEMORY SYSTEM AND OPERATING METHOD THEREOF | 01-25-2018 |
