| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 365181000 | Complementary conductivity | 7 |
| 20080253180 | Hardened Memory Cell - The memory cell comprises first and second inverter circuits, connected in a loop. First and second decoupling transistors, normally turned off outside the write phases, are respectively connected between an output of the second inverter circuit and first and second inputs of the first inverter circuit. The memory cell is thereby protected against transient disturbances due to ionizing particles. The gates of the decoupling transistors are preferably respectively connected to a supply voltage for the P-type decoupling transistors and grounded for the N-type decoupling transistors. | 10-16-2008 |
| 20080259681 | Systems and Devices for Implementing Sub-Threshold Memory Devices - Various systems and methods for implementing memory devices are disclosed. For example, some embodiments of the present invention provide sub-threshold memory devices that include a differential bit cell. Such a differential bit cell includes two PMOS transistors, two NMOS transistors, and two inverters. The source of the first PMOS transistor and the source of the second PMOS transistor are electrically coupled to a bit line input, and the source of the first NMOS transistor and the source of the second NMOS transistor are electrically coupled to the bit line input. The gate of the first NMOS transistor and the gate of the second NMOS transistor are electrically coupled to a word line input. The gate of the first PMOS transistor and the gate of the second PMOS transistor are electrically coupled to an inverted version of the word line input. The drain of the first PMOS transistor is electrically coupled to the drain of the first NMOS transistor, and the drain of the second PMOS transistor is electrically coupled to the drain of the second NMOS transistor. In addition, the drain of the first PMOS transistor is electrically coupled to the drain of the second PMOS transistor by the first inverter, and the drain of the second PMOS transistor is electrically coupled to the drain of the first PMOS transistor by the second inverter. | 10-23-2008 |
| 20080273382 | Pseudo 6T SRAM Cell - A pseudo 6T SRAM cell design comprising eight transistors is provided. An embodiment comprises a pair of cross-coupled inverters and a pair of pass-gate transistors electrically coupled to each inverter through the substrate. Each pass-gate transistor has a different beta ratio from the other transistor in its pair, and the smaller beta ratio in the pair acts as a “read” port while the larger beta ratio in the pair acts as a “write” port. Two pairs of bit lines are connected to the pass-gate transistors. A variety of word lines are connected to the pass-gate transistors. In one embodiment, a single word line is connected to all of the pass-gate transistors. In another embodiment, a pair of word lines is connected to the pass-gate transistors. In yet another embodiment, a different word line is connected to each pass-gate transistor. | 11-06-2008 |
| 20080304314 | Semiconductor Device and Method Comprising a High Voltage Reset Driver and an Isolated Memory Array - A method of operating a semiconductor device, a semiconductor device and a digital micromirror system are presented. In an embodiment, the semiconductor device comprises a grounded substrate, a memory array, and a reset driver. The memory array may be isolated from the grounded substrate with a buried layer. The set of voltages of the memory array may be shifted with respect to a reset voltage. The reset driver may drive the reset voltage and the reset driver may have at least one extended drain transistor in the grounded substrate. | 12-11-2008 |
| 20090116282 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - Prior known static random access memory (SRAM) cells are required that a diffusion layer be bent into a key-like shape in order to make electrical contact with a substrate with a P-type well region formed therein, which would result in a decrease in asymmetry leading to occurrence of a problem as to the difficulty in micro-patterning. To avoid this problem, the P-type well region in which an inverter making up an SRAM cell is formed is subdivided into two portions, which are disposed on the opposite sides of an N-type well region NW | 05-07-2009 |
| 20090168509 | Ultra low voltage, low leakage, high density, variation tolerant memory bit cells - Methods and apparatus to provide ultra low voltage, low leakage, high density, and/or variation tolerant memory bit cells are described. In one embodiment, each of the cross-coupled invertors of a memory cell may include a plurality of p-channel transistors. Other embodiments are also described. | 07-02-2009 |
| 20130286729 | Methods and Apparatus for Non-Volatile Memory Cells - Non-volatile memory cells and methods. In an apparatus, an array of non-volatile storage cells formed in a portion of a semiconductor substrate includes a first storage cell having a first bit cell and a second bit cell; a second storage cell having a third bit cell and a fourth bit cell; and a column multiplexer coupled to a plurality of column lines, selected ones of the column lines coupled to a first source/drain terminal of the first and the second storage cell and coupled to a second source/drain terminal of the first and second storage cell, the column multiplexer coupling a voltage to one of the column lines connected to the first storage cell corresponding to the data, and coupling a voltage to one of the column lines connected to the second storage cell corresponding to the complementary data. Methods for operating the non-volatile memory cells are disclosed. | 10-31-2013 |
