| Entries |
| Document | Title | Date |
|---|
| 20080198559 | Base Module For a Motion Sensor - Disclosed is a base module for a motion sensor, particularly a tacho generator, phase transducer, or transmission sensor for a motor vehicle. Said base module ( | 08-21-2008 |
| 20080198560 | THIN-FILM MAGNETIC DEVICE, AND ELECTRONIC COMPONENT MODULE HAVING SAME - It is an object of the present invention to provide an electronic component module with which circuit malfunction can be adequately prevented. There are provided a base having wiring, and a thin-film magnetic device provided on one side of the base. The thin-film magnetic device comprises a first magnetic film disposed facing the base, a second magnetic film disposed on the opposite side of the first magnetic film with respect to the base, and a thin-film coil wound so as to encircle the second magnetic film a plurality of times. The thin-film coil has a plurality of first conductor pattern components provided between the first and second magnetic films, a plurality of second conductor pattern components provided on the opposite side of the second magnetic film with respect to the first magnetic film, and a plurality of connecting conductors that connect the first conductor pattern components and the second conductor pattern components in series. The relative magnetic permeability of the second magnetic film is greater than the relative magnetic permeability of the first magnetic film. | 08-21-2008 |
| 20080218981 | PACKAGE STRUCTURE FOR CONNECTION WITH OUTPUT/INPUT MODULE - A package structure for connection with an output/input module is disclosed. The package structure can be applied to conventional multi-chip packages and system in packages. The package structure defines at least one insertion cavity that is vertically or horizontally disposed. By simply inserting an output/input module into the insertion cavity, an electrical connection can be established between the output/input module and the package structure. Accordingly, the package structure thus constructed can address the repairing, replacement and upgrading problems of electronic components encountered by a package structure that adopts the conventional soldering connection method. | 09-11-2008 |
| 20080218982 | Surge Protector with a Mounting Base - A surge protector includes a housing with connectors for passing through an electrical lead that is to be protected, whereby a surge voltage discharge device is located inside the housing and a mounting base for placement on a mounting rail is located on the outside of the housing. The mounting base on the housing exhibits a power surge proof discharge contact for contacting the mounting rail with the discharge contact being connected to the discharge connector of the surge protector. An attachment is connected in a removeable fashion to the mounting base which includes a contact component which contacts the discharge contact of the mounting base and is connected in an electrically conducting manner with a lead that exits the attachment. | 09-11-2008 |
| 20080266814 | Module Rear Wall for a Switchgear Assembly Module, Switchgear Assembly Module and Electrical Switchgear Assembly - The invention relates to a modular rear wall for a switching system module, in particular an insertion module. Said modular rear wall comprises a measuring device which is integrated therein and which forms an integral component of the switching system module. The invention also relates to a switching circuit module which comprises said type of modular rear wall, in addition to a switching system comprising at least one switching system module having a modular rear wall. | 10-30-2008 |
| 20080278919 | SOCKET FOR ELECTRIC COMPONENT - The present invention provides a socket for an electric component having: a socket main body; a plurality of contact pins disposed within the socket main body; a socket cover; a slide plate disposed inside the socket main body to be movable up and down; and drive levers which are provided between the socket main body and the bottom face of the socket cover and press both end portions of two opposing sides of the slide plate by a down-movement-operation of the socket cover to lower the slide plate, wherein sub-levers for pressing one or plural positions of other opposing two sides of the slide plate to lower the slide plate are provided between the socket main body and the bottom face of the socket cover. | 11-13-2008 |
| 20080291642 | ELECTRONIC CIRCUIT MODULE INCLUDING CHIP MOUNTED TO MULTI-LAYER WIRING PLATE IN FLIP CHIP MANNER - The invention provides an electronic circuit module capable of reliably mounting a chip to a multi-layer wiring plate in a flip chip manner. | 11-27-2008 |
| 20080298026 | HOLDER FOR ELECTRONIC DEVICE - A holder for a portable electronic device is provided. The holder includes a anchoring portion and two latches to define a clamping area. The anchoring portion and the two latches are respectively disposed at each end of the holder. Each latch has a bent elastic arm and a hook extending from the elastic arm. The two latches are engaged into a fixing hole of the portable electronic device through the hooks, and the two latches provide elastic force in vertical and horizontal directions by the elastic arms. Therefore, the latches may be firmly engaged with the portable electronic device, for preventing latches from being disengaged from the portable electronic device when the holder bears an unexpected external force. | 12-04-2008 |
| 20080298027 | Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same - The dial module includes: a sheet-shaped dial having a design part on a surface of the dial; a sheet-shaped light source fixed to a back surface of the dial for illuminating the design part; and a flexible printed circuit fixed to a back surface of the light source. The dial module thus constructed enables to reduce the number of components, to facilitate assembly of a meter which employs the dial module therein, to improve the productivity, and to reduce the cost. | 12-04-2008 |
| 20080304240 | Received Information Transferring Apparatus, Receiving Apparatus and Received Information Transferring System - In order to maintain stability when connected, a cradle | 12-11-2008 |
| 20080310124 | COUPLING ARRANGEMENT FOR ELECTRONIC DEVICE TO A VEHICLE BODY - An electronic control module mounted to an adaptive vehicle mount or directly onto a car body. The control module includes a casing which may have at least one leverage tab integral with the casing. The casing also includes an integral fastening tab, and may act as a lever such that the leverage tab and fastener tab withstand forces which counterbalances the force exerted on the casing when the casing is mounted to an adaptive vehicle mount or directly onto the car body. | 12-18-2008 |
| 20080310125 | METHOD AND APPARATUS FOR ALIGNING AND INSTALLING FLEXIBLE CIRCUIT INTERCONNECTS - A method and apparatus for aligning components on a module. A flexible circuit may be attached to a module in which a tooling apparatus is attached to the module. A plurality of circuit pads on a functional section of the flexible circuit is aligned by a first alignment structure located on a sacrificial portion of the flexible circuit to a second alignment structure on the tooling apparatus. The flexible circuit is attached to the module while the flexible circuit is in an aligned position. | 12-18-2008 |
| 20080316713 | Power supply and speakerphone for handheld devices - The invention claimed herein and depicted in FIGS. | 12-25-2008 |
| 20080316714 | INTEGRATED STRUCTURES AND FABRICATION METHODS THEREOF IMPLEMENTING A CELL PHONE OR OTHER ELECTRONIC SYSTEM - Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer is disposed over the front surface of the multichip layer and includes interconnect metallization electrically connected to contact pads of the chips and to conductive structures extending through the structural material. A redistribution layer, disposed over the back surface of the multichip layer, includes a redistribution metallization also electrically connected to conductive structures extending through the structural material. Input/output contacts are arrayed over the redistribution layer, including over the lower surfaces of at least some integrated circuit chips within the multichip layer, and are electrically connected through the redistribution metallization, conductive structures, and interconnect metallization to contact pads of the integrated circuit chips of the multichip layer. | 12-25-2008 |
| 20090002954 | Handicap accessible removable control panel - This invention involves a control panel that is removable from a marking machine housing. This removable control panel is used to lower or raise the entire marking machine or just a module or modules of the machine. Wheelchair users have difficult times using a conventional marking machine such as a copier or printer. The user with the removable control panel can lower the entire machine so that access to all components is possible. In addition, the wheelchair user can raise the paper trays to be side by side with the processor module. It is important that the copier raise-lower function be on the control panel in addition to a control for horizontal movement of the module(s). Any other function can be put on the control panel. | 01-01-2009 |
| 20090002955 | LATCHING MECHANISM FOR PORTABLE ELECTRONIC DEVICE - A latching mechanism ( | 01-01-2009 |
| 20090002956 | Power Converter - A power converter which can attain a reliable electric connection with electrodes of a power module by facilitating positioning of conductors connected to the electrodes of the power module. The power converter includes the power module having the plurality of electrodes in the form of plate-shaped conductors within a casing having a lid, and also includes a plurality of plate-shaped conductors connected to the electrodes of the power module. Male screws are embedded in ones of the electrodes of the power module provided at least on the side of the lid to be projected therefrom, the plate-shaped conductors connected to the electrodes having the male screws are formed therein with holes at locations corresponding to the male screws, the male screws being inserted in the corresponding holes, and electrically connected with the electrodes with nuts fastened to the male screws. | 01-01-2009 |
| 20090009975 | Camera module package - There is provided a camera module package including: a housing having an optical system; a board bonded to a bottom end of the housing and mounting an image sensor on a top surface thereof; a contact part integrally formed in the housing to electrically connect a sensor bonding pad of the image sensor with a board bonding pad of the board each other when the housing is engaged with the board. In the camera module package, a process of bonding the housing and the board together is performed at the same time as a process of electrically connecting the image sensor and the board to each other. This simplifies an assembly process and enhances productivity. Also, the camera module package is fundamentally free from contamination of external contact terminals caused by an overflowing bonding material when the board and the housing are bonded together. | 01-08-2009 |
| 20090021919 | PLUGGABLE SYSTEM FOR READING INPUTS, CONTROLLING OUTPUTS AND COMMUNICATING WITH ANOTHER MODULE FOR POWER DISTRIBUTION UNIT - An electronics module for automotive vehicles includes a housing; an electrical connector having a commercial standard electrical connector footprint mounted on the housing; and an electronics assembly including commercial standard communication bus electronics contained in the housing, the electronics assembly being electrically connected to the electrical connector. The electronics module is adapted to be plugged into a power distribution unit of an automotive vehicle in order to control power distribution components of the unit. | 01-22-2009 |
| 20090021920 | Module and method for producing a module - A module, in particular a sensor module, has a module housing, a carrier element, a connection element, and at least one component, the module housing completely enclosing the at least one component and being situated on the carrier element, and the at least one component also being mounted on the connection element and being situated between the connection element and the carrier element. | 01-22-2009 |
| 20090027861 | Enclosure including an electrical module - A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected. | 01-29-2009 |
| 20090040733 | FILTER APPARATUS AND FREQUENCY CONVERTER TO WHICH THE FILTER APPARATUS IS CONNECTED - A filter apparatus connected to a wiring drawing portion of a frequency converter, said filter apparatus including: a condenser element having an electronic part having an insulator as a dielectric material held between conductor plates; a sealing agent sealing said condenser element; a filter circuit comprising said condenser element; a connection conductor establishing wiring connections of said filter circuit; and a filter housing supporting said sealing agent wherein said filter apparatus is fixed to said frequency converter based on a positioning portion provided in part of the housing of said frequency converter. | 02-12-2009 |
| 20090046434 | FILTER APPARATUS AND FREQUENCY CONVERTER TO WHICH THE FILTER APPARATUS IS CONNECTED - A power converter in which a filter apparatus reducing noises is connected to a wiring drawing portion, wherein a conductor plate is arranged along an inner wall of a filter housing of said filter apparatus, and part of a housing of said frequency converter and part of a filter housing of said filter apparatus are fitted to each other to fix said filter housing to the housing of said frequency converter. | 02-19-2009 |
| 20090046435 | FILTER APPARATUS AND FREQUENCY CONVERTER TO WHICH THE FILTER APPARATUS IS CONNECTED - A power converter in which a filter apparatus is connected to a wiring drawing portion, said filter apparatus including: a condenser element having an electronic part having an insulator as a dielectric material held between conductor plates; a sealing agent sealing said condenser element; a filter circuit comprising said condenser element; a connection conductor establishing wiring connections of said filter circuit; and a filter housing supporting said sealing agent. | 02-19-2009 |
| 20090052144 | Mounting Assembly With Video Distribution Functionality - A mounting assembly device, system and method support multimedia/video distribution functionalities. The mounting assembly includes a front face and a rear housing sized to fit within a conventional wall box, e.g., a single gang box. The mounting assembly includes a balun that is adapted to receive and convert signals, such that signals received by the balun may be transmitted from a coaxial cable to twisted pair cable, and vice versa. Additional communication modalities may be supported by the mounting assembly device/system, e.g., conventional jack/plug based communications and/or wireless communications. | 02-26-2009 |
| 20090052145 | SLIDING TYPE PORTABLE ELECTRONIC DEVICE - A portable electronic device includes a first housing: a second housing coupled with the first housing such that the second housing can slide while facing the first housing, guide ribs arranged on the first housing, guide slits arranged on the second housing, and at least one protuberance arranged on either an outer surface of each guide rib and an inner wall of each guide slit. The guide slits extend along a direction in which the second housing slides and each guide rib is restricted in each guide slit so as to guide a sliding movement of the second housing. The at least one protuberance contacts either an inner wall of each guide slit or an outer surface of each guide rib. | 02-26-2009 |
| 20090067137 | High Density In-Package Microelectronic Amplifier - A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate. | 03-12-2009 |
| 20090103271 | WALL PLATE ASSEMBLY - A wall plate assembly includes a wall plate with an insertion slot for the installation of a HDMI (High-Definition Multimedia Interface) connector of a HDMI cable and a power plug hole for the insertion of a power plug, a signal amplifier connected to the back side of the wall plate for receiving the installed HDMI connector and amplifying the signal, a support device, which comprises a first support frame vertically adjustably fastened to the wall plate below the insertion slot and a second support frame horizontally adjustably fastened to the first support frame for holding down the installed HDMI connector on the first support frame, and a power connector aimed at the power plug hole for receiving a power plug to provide the signal amplifier with the necessary working voltage. | 04-23-2009 |
| 20090109635 | Waterproof structure and portable electrical apparatus using the same - A waterproof structure for a housing of a portable electronic apparatus comprises a cover and an elastic pad. The cover comprises a pivot portion, and the cover is connected to the housing via the pivot portion such that the cover is capable of rotating in relation to the housing. The elastic pad comprises at least one protrusion structure, and the at least one protrusion structure is capable of inserting into a waterproof groove on the housing corresponding to the protrusion structure. When the cover is rotated to close the housing, the cover is capable of compressing the elastic pad to form a seal between the at least one protrusion structure and the waterproof groove. | 04-30-2009 |
| 20090109636 | Multiple package module using a rigid flex printed circuit board - A multiple package module and a method of fabricating a multiple package module. The module comprises a central region of a rigid flex circuit board for mounting circuitry, and at least one wing connected by a flexible portion to at least one edge of the central region of the rigid flex circuit board. | 04-30-2009 |
| 20090109637 | ELECTRONIC COMPONENT MODULE - An electronic component module includes a module body including a substrate having components mounted thereon. A metal case is attached to the substrate to cover the components of the module body. The metal case includes a top-plate portion arranged substantially parallel to the main surface of the substrate and claw portions arranged at both edges thereof. The claw portions each include a claw body defined by a rectangular portion that is bent at an edge of the top-plate portion and extends in the direction of the substrate and a holding claw. In addition, contacting portions are bent at both ends of the rectangular portion to extend towards the inner portion of the main surface of the substrate. The contacting portions come into contact with the main surface of the substrate, and the holding claws are soldered to the side surfaces of the substrate. Accordingly, it is possible to provide an electronic component module in which the proportion of a mounting area, in which components can be mounted, to a main surface of a substrate is increased, and in which positioning of a metal case can be easily performed. | 04-30-2009 |
| 20090122496 | Electronic Module and Electronic Device - An electronic module includes a board unit having a handle and a module housing. The handle includes a grip portion and a pair of leg portions. The leg portions have engagement convex portions extending from portions serving as rotary pivots, of the leg portions. The module housing includes an engagement concave portion provided to correspond to the engagement convex portions. When the board unit is inserted into the module housing, by rotating the handle around the rotary pivots in a direction along which the grip portion approaches the panel portion, the engagement convex portions are brought into contact with a part of the engagement concave portion to produce a force in a direction, along which the board unit is pressed into the module housing. | 05-14-2009 |
| 20090129030 | Arrester block module assembly and method - An electrical surge arrester includes an arrester block stack with a plurality of cylindrical surge arrester components arranged substantially coaxially to form a cylindrical stack of components having a longitudinal axis. First and second electrical conductive terminals are disposed at each end of the block stack and electrically coupled to the components. A spacer is disposed between each of the terminals and the plurality of cylindrical surge arrester components. A crimp pin is disposed in each of the metal terminals to plastically deform the terminals to compress the block stack. Rubber sheds can be directly molded around the device. | 05-21-2009 |
| 20090141458 | Expansion module and system thereof - An expansion module includes a housing, at least one first wedging device, a connecting device, and a module socket. At one side of the housing, there is at least one plugging pin. The first wedging device is located in the housing. The first wedging device corresponds to the plugging pin. The connecting device has a first connecting portion and a second connecting portion. The first connecting portion is electrically connected with the second connecting portion, and the first connecting portion and the second connecting portion are located at the two opposite sides of the housing. The module socket is located in the housing. The module socket is electrically connected with the connecting device. The user can easily uninstalled or installed the expansion module, the time is reduced, and it prevents the plugging pins of the module card from being damaged due to external force. | 06-04-2009 |
| 20090141459 | METHODS AND APPARATUS FOR PROVIDING HOLES THROUGH PORTIONS OF A HOUSING OF AN ELECTRONIC DEVICE - Electronic devices are provided with housing components that have improved aesthetics. One or more holes may be formed through an extruded portion of the housing. | 06-04-2009 |
| 20090154114 | AIR FLAP MECHANISM FOR SERVER CHASSIS - An air flap mechanism is installed in a server chassis with an opening. A functional module is capable of being inserted into the server chassis from the opening. The air flap mechanism includes an air flap pivotably installed in the server chassis for shielding the opening of the server chassis and a pair of first torsion springs attached to the air flap. A connecting bar connects between the first torsion springs for being driven by an end of the functional module to pivot the air flap inside the server chassis when the functional module is pushed into the server chassis. | 06-18-2009 |
| 20090161324 | SHIELDING CASE, WIRING BOARD AND ELECTRONIC MODULE - A shielding case for accommodating a wiring board includes a board mounting member with a fitting member formed at an outer frame thereof so that the wiring board is fixed and held to the board mounting member through fitting of the fitting member into a through hole formed at the wiring board. | 06-25-2009 |
| 20090190314 | MODULE BASE UNIT WITH STRAIN RELIEF MEANS - In a module base unit ( | 07-30-2009 |
| 20090190315 | CONTROL UNIT FOR CONTROLLING AN ELECTROMOTIVE DRIVE UNIT - A control unit for controlling an electromotive drive unit has a housing ( | 07-30-2009 |
| 20090195995 | COMMUNICATIONS DEVICE - A system includes a communications device and power supply units detachably installable thereon. On an outer surface of the communications device there is an aperture arranged to enable the insertion of different power supply units in different sections of the volume inside the communications device. The volume is continuous so that instead of separate power supply units it is possible to insert, through the aperture, in the volume a physically larger power supply unit which, when installed in the volume, extends into more than one section of the volume. The communications device can be flexibly equipped e.g. with power supply units functioning as back-ups for each other, each taking up part of the volume, or with a single power supply unit, larger than the above-mentioned, taking up the volume. Therefore the volume inside the communications device can be utilized in connection with power supply units of various types. | 08-06-2009 |
| 20090225520 | COVER MECHANISM AND ELECTRONIC DEVICE USING SAME - A portable electronic ( | 09-10-2009 |
| 20090237892 | HOUSING ASSEMBLY FOR ELECTRONIC DEVICE - A housing assembly ( | 09-24-2009 |
| 20090257199 | Connector Module for Ruggedized Applications - A connector module can be configured to provide a connection between a component such as an electrolytic capacitor and a circuit board while supporting the component in a spaced apart manner from the board Due to the connector module, secondary soldering operations can be avoided. For example, the module may comprise a body with fingers and support members that engage and support the capacitor. The body may feature a plurality of legs, each leg including spaced-apart members which fit into respective holes in the board. Each leg can include a retention and clip feature which cooperate to hold the module securely to the board. The body can include pins that engage electrodes of the capacitor and provide a connection to the board. In some embodiments, a locking cover can include a ring that engages the capacitor body while also ensuring a secure connection between the electrodes of the capacitor and pins of the module. | 10-15-2009 |
| 20090296355 | ASSEMBLY COMPRISING ELECTRIC AND/OR ELECTRONIC COMPONENTS - A module of electric and/or electronic components, wherein the module is cast with a curable electrically insulating casting material in a housing, characterized in that at least one terminal extending at least slightly into the housing and remaining accessible from outside the housing is provided on the housing, is electrically connected to the module, and is cast together with the module from the inside. | 12-03-2009 |
| 20100014257 | MODULE MOUNTING SYSTEM - An apparatus ( | 01-21-2010 |
| 20100020507 | ELECTRONIC GAS IGNITER DEVICE AND INTEGRATED BOX-LIKE TERMINAL BOARD FEATURING A CABLE CLAMP, IN PARTICULAR FOR ELECTRIC HOUSEHOLD APPLIANCES - A gas igniter device includes a first synthetic material casing containing igniter and an electronic control and a terminal board integrally coupled to the first casing and in turn including a cable clamp. The terminal board includes a second synthetic box-shaped material casing including: a cup-shaped body provided with a first and a second opposite side opening and an inlet oriented essentially perpendicular to the side openings; and a closing lid of the inlet hingedly restrained onto a first side of the cup-shaped body; a first end of the first casing is provided with a pair of electric power contacts for the igniter and is snappingly and removably coupled in use to the cup-shaped body within a first side opening with the contacts arranged inside the cup-shaped body in position facing the inlet. The lid is snappingly coupling to a second side of the cup-shaped body and provided with a first clamp for an electric power cable insertable in use through the second side opening; a second clamp joined to the first being integrally carried by a bottom wall of the cup-shaped body in addition to a third clamp adjacent to the second side opening. | 01-28-2010 |
| 20100027224 | ELECTRONIC DEVICE - An electronic device including a first body, a second body, a connecting mechanism, and an input unit is provided. The second body is movably disposed on the first body. The connecting mechanism is disposed in the first body. The input unit is movably disposed on the first body, wherein the connecting mechanism connects the input unit and the second body. When the second body moves from a first position to a second position relative to the first body, the second body drives the input unit to move from a third position to a fourth position relative to the first body through the connecting mechanism. | 02-04-2010 |
| 20100039778 | CFP MECHANICAL PLATFORM - In one example embodiment, a host device includes a host bezel, first and second guides, and a host connector. The host bezel defines an opening configured to receive a pluggable module. A first cutout on one side of the opening and a second cutout on the opposite side of the opening are adapted to receive corresponding guiderails on the module. The first and second guides are coupled to the host bezel and to a host printed circuit board. Each of the first and second guides defines a channel configured to receive the first and second guiderails of the module. The host connector is coupled to the host printed circuit board and is disposed at the back end of the first and second guides. The host connector includes a recessed slot configured to receive a module connector to electrically couple the module to the host printed circuit board. | 02-18-2010 |
| 20100053907 | SYSTEMS AND METHODS FOR SIMPLE EFFICIENT ASSEMBLY AND PACKAGING OF ELECTRONIC DEVICES - Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems. | 03-04-2010 |
| 20100067197 | PORTABLE MULTI-DEVICE POWER SUPPLY, BATTERY CHARGER, AND DOCKING SYSTEM - A multiple electronic device power supply, battery charger, and USB docking system has a plurality of power ports for charging/powering electronic devices and a plurality of USB ports for coupling peripheral devices to a computer or large electronic device. Electronic devices which may be charged using the present invention can require current from less than 500 mA to approximately 6 A. Voltage setting resistors in specialized adapters serve to set the voltage needed for individual devices in order to manage current and voltage distribution throughout the present invention, particularly when large and mid-sized electronic devices are connected to the present multiple device charger and docking system. Default settings set the voltage output at 24 volts if not otherwise directed. | 03-18-2010 |
| 20100091465 | APPARATUS AND METHOD FOR IMPROVING CUSTOMER RETENTION - The disclosed embodiments provide an apparatus and method for improving customer retention. In accordance with one embodiment, a telecommunication device comprising a chassis that includes features for operating the telecommunication device and a display module removably coupled to the chassis is presented. The chassis is compatible with different display modules. Thus, the disclosed embodiments enable a telecom customer to upgrade a telecommunication device at minimal cost, thereby, improving customer retention. | 04-15-2010 |
| 20100103626 | CIRCUIT BOARD MODULE AND CONNECTION PORT THEREOF - A connection port and a circuit board module employing such a connection port are provided. The circuit board module includes a circuit board, a plurality of electronic components, a switch, a control unit connected to the switch, and a connection port. The electronic components, the switch, the control unit and the connection port are disposed on the circuit board. The connection port is adapted for connecting with a connector. The connection port includes a body, a plurality of first connection terminals for connecting with the connector, and a detection terminal. Each of the first connection terminals has one end connected to the control unit via the switch. The detection terminal has one end connected with the switch of the circuit board module. When another end of the detection terminal gets in contact with the connector, the switch electrically conducts the first connection terminals with the control unit. | 04-29-2010 |
| 20100110643 | FLASH DRIVE AND HOUSING ASSEMBLY THEREOF - A flash drive and a housing assembly thereof is provided. The housing assembly comprises a housing, a base and a rotating mechanism. The housing has a first opening, a second opening, and a space, the first opening is situated at a side surface of the housing, and the second opening is situated on a top surface of the housing. The base is used for accommodating a storage device which has a connecting member, the base is movably disposed in the space and has a slot facing the second opening. The rotating mechanism is disposed at the second opening and mounted to the housing, the rotating mechanism has a protrusion portion movably engaged in the slot. When the rotating mechanism rotates relative to the housing, the protrusion portion moves along the slot and drives the base to reciprocate between a first position and a second position. | 05-06-2010 |
| 20100142157 | BOX FOR AN ELECTRONICS MODULE FOR CONTROLLING A MACHINE - A box for an electronics module for controlling a machine, in particular an engine, wherein the box comprises: | 06-10-2010 |
| 20100149757 | Energy storage device - With the objective of improving an energy storage device comprising a transducer unit and a capacitor module which interacts with the transducer unit so it can be inserted as a physical device into a motor vehicle in particular, it is proposed to provide a housing to accommodate the capacitor cells of the capacitor module, for the housing to comprise a capacitor chamber accommodating the capacitor cells, and for the capacitor chamber to have a gas-tight seal. | 06-17-2010 |
| 20100157545 | INTERFERENCE SHIELDED ELECTRONICS MODULE AND METHOD FOR PROVIDING THE SAME - An interference shielded, for example a RFI and/or EMI shielded, for an electronics module which forms a contact with at least one edge zone of a circuit board, is provided. The contact functions in the electronics module as a ground. The circuit board includes an outermost electrically conductive layer providing the interference shield of the electronics module; at least one circuit card layer unit comprising electronics components and a wiring pattern embedded into a filling material of the circuit board layer; and encapsulating activation material layer. The activation material layer is advantageously a substrate layer or a resin layer, and which overlays above the topmost circuit board layer, and which is arranged into a space between the outermost layer and topmost circuit board layer to be therein conformingly against the inner surface of the outermost layer for isolating the electronic components and the wiring pattern from outermost layer. | 06-24-2010 |
| 20100172108 | LOCKING MECHANISM AND ELECTRONIC DEVICE HAVING THE SAME - An electronic device includes a main body, a cover rotatably connected to the main body, at least one locking mechanism for fastening the cover to the main body, and a switch. The locking mechanism defines a locking hole in the main body and includes a locking member fixed to the cover. The locking member includes a magnetic member, an electromagnet, a compressed spring, and a locking pin. The electromagnet is electrically connected to the switch, and is operable to be powered off via switching the switch. The spring is disposed between the magnetic member and the electromagnet, and moves one of the magnetic member and the electromagnet when the electromagnet is powered off. The locking pin is inserted into the locking hole when the cover covers the main body and the electromagnet is powered off. | 07-08-2010 |
| 20100177486 | Electronic device comprising a visible electronic element connected to an internal module and manufacturing process of such a device - A method for manufacturing an electronic device and a device manufactured according to this method including an assembly of at least two insulating sheets, at least one electronic element, a first insulating sheet including at least one window in which the electronic element is at least partially lodged. One face of the electronic element flushes with the external surface of said first insulating sheet. The device may further include an internal module located between the two insulating sheets, a layer of filling material, an adhesive protection film extending over a region covering at least the outline of the window, said protection film being situated between the first insulating sheet and the layer of filling material covering the protection film and the internal module, conductive connection areas electrically linked to the internal module through an opening of the protection film and positioned on an internal face opposite to the external face of the electronic element. The adhesive protection film prevents the appearance of undesirable residues of filling material on the external face of the device in the vicinity of the electronic element. | 07-15-2010 |
| 20100202114 | ELECTRIC MODULE - An electronic module, comprising: a conductive-pattern layer; an insulating-material layer supporting the conductive-pattern layer; at least one component inside the insulating-material layer, the at least one component comprising a first surface and contact zones on the first surface; a first hardened adhesive layer on the first surface of the at least one component; a second hardened adhesive layer in contact with the conductive-pattern layer and the first hardened adhesive layer; holes in the first and second hardened adhesive layer at the locations of the contact zones; and conductive material in the holes and in electrical connection with the contact zones of the component and the conductive-pattern layer. | 08-12-2010 |
| 20100214746 | Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same - A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core. | 08-26-2010 |
| 20100246140 | Circuit Board and Method for Manufacturing Semiconductor Modules and Circuit Boards - The deterioration of dielectric breakdown strength arising from an opening of a metal plate is prevented and the reliability as a circuit board is enhanced. A circuit board is provided with a metal plate, having openings, as core material. The opening is provided in a manner that the size of the opening gradually increases from a lower surface side toward an upper surface side of the metal plate. On both surface sides of the metal plate there are provided wiring patterns, respectively, via insulating layers. The insulating layer provided on an upper region of the opening and the corresponding wiring pattern are provided such that they have a recess on the upper surface of them. To electrically connect each wiring pattern, the circuit board further includes a conductor which penetrates the metal plate via the opening and which connects the wiring patterns with each other. An LSI chip is directly coupled to the upper surface side of the metal plate via a solder ball. | 09-30-2010 |
| 20100254094 | High-Frequency Wiring Board and High-Frequency Module That Uses the High-Frequency Wiring Board - The high-frequency wiring board of the present invention is a wiring board that includes first coplanar lines and second coplanar lines formed on a different layer than the first coplanar lines; the first coplanar lines and second coplanar lines being connected at the line ends of each. The first coplanar lines are provided with a first signal line ( | 10-07-2010 |
| 20100254095 | MICROELECTRONIC SECURITY COATINGS - A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place. | 10-07-2010 |
| 20100259903 | Memory Stick - A memory stick for a USB connection to a computer may include a USB connection portion for the connection to the computer and a cap portion to cover the USB connection portion. The cap portion and the USB connection portion may form a logo, and the USB connection portion may include a electronic circuit. The electronic circuit may be enclosed by a metal casing, and the USB connection portion may include a front section. A memory stick for a USB connection to a computer may include A USB connection portion for the connection to the computer and a cap portion to cover the USB connection portion. The USB connection portion may form a mascot. | 10-14-2010 |
| 20100277873 | METHOD FOR MANUFACTURING A RIGID POWER MODULE SUITED FOR HIGH-VOLTAGE APPLICATIONS - Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps:
| 11-04-2010 |
| 20100277874 | Communication protocol interface module - A communication protocol interface module conceived to be applied to an electromechanical equipment ( | 11-04-2010 |
| 20100284154 | MODULAR SENSOR MOTE - A modular sensor mote, comprising an electronic board having two connector portions with associated connectors, a wireless communication management portion, a power management portion and a sensor receiving portion adapted for receiving a sensor element. | 11-11-2010 |
| 20100284155 | Power Semiconductor Module Including Substrates Spaced from Each Other - The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink. | 11-11-2010 |
| 20100302743 | Power Bank with Replaceable Battery Core - A power bank with a replaceable battery core includes a box and an electric power unit. The electric power unit includes one or more battery core and a power management module. A circuit protection module is disposed on a side of the battery core, and a first connecting unit is disposed between the power management module and the circuit protection module. The connecting unit is provided for connecting the power management module to the circuit protection module separately, such that the battery core can be separated from the power management module for a replacement easily when the battery core is damaged or failed. | 12-02-2010 |
| 20100309637 | SUPPORT ELEMENT ARRANGEMENT AND METHOD FOR MANUFACTURING A SUPPORT ELEMENT ARRANGEMENT - A support element arrangement for an electronic component includes a first support element and a second support element, the first support element being configured perpendicularly to the second support element and having a first main extension plane, and, in addition, the first support element having a first recess, the first recess at least partially surrounding the second support element in the first main extension plane. | 12-09-2010 |
| 20100309638 | ELECTRONIC ELEMENT PACKAGING MODULE - An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame. | 12-09-2010 |
| 20100321899 | CUSTOMIZABLE MODULAR MULTI-FUNCTION COMMUNICATION DEVICE - A configurable modular communication device is composed of an information delivery module and an information input module that are matable to each other. The information delivery module is a single base unit that can work with a touchscreen keypad or a number of modular keypad or other information input attachments. The information input module enables a user to change the look of the modular communication device according to personal taste and enhances its functionality to fit the exact occasion and mode of use. The information delivery module acts on its own as the navigation key and provides on its display screen menu (including an on-screen touch sensing keypad) user access to all functionality including telephone, PDA (personal digital assistant), camera, clock, GPS, and MP3 music player. User-controlled navigation takes place on or in the vicinity of the display screen, whether by hard or soft key actuation. | 12-23-2010 |
| 20100328900 | Apparatus - An apparatus including: an intermediate chassis configured to move in at least a first direction and configured to define a reaction surface; a movable chassis configured to move in at least a second direction orthogonal to the first direction and configured to define a follower wherein the reaction surface and follower interact to convert movement of the intermediate chassis and reaction surface in the first direction to movement of the follower and movable chassis in the second direction. Also, an apparatus including a first movable housing portion having side faces including one or more interface components; and a second housing portion; wherein the first movable housing portion is movable relative to the second housing portion between a compact configuration in which the one or more interface components are obscured by the second housing portion and an expanded configuration in which the one or more interface components are exposed. | 12-30-2010 |
| 20110007480 | CAPACITOR MODULE - A capacitor module is provided with a plurality of capacitor cells each having a capacitor and a capacitor case provided with a first closed-bottomed screw hole with an opening on a bottom surface for housing the capacitor, a metallic cell-fixing body having a through-hole in communication with the first screw hole to which the capacitor cells are fixed by inserting a cell screw in the through-hole and the first screw hole, an insulator made of a thermally conductive insulating material and provided between the capacitor cells and the cell-fixing body for insulating the capacitor cells from the cell fixing body, and a metallic heat-dissipating body having a second closed-bottomed screw hole in which a cell-fixing body screw is inserted and having a flow passage for causing a cooling medium to flow on a rear surface side of a surface on which the second screw hole is provided. | 01-13-2011 |
| 20110013368 | CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE - There are provided a circuit board module that can ease adverse effect due to radiation developing between a fragile circuit vulnerable to unwanted radiation and other circuits and that can diminish overall radiation to the outside of the module and an electronic device having the circuit board module. | 01-20-2011 |
| 20110044011 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor | 02-24-2011 |
| 20110044012 | SEMICONDUCTOR DEVICE - On a case member of a semiconductor device, a screw block terminal or the like for connection to external equipment is attached. The screw block terminal or the like arranged on a region inside a base plate is attached to a terminal attachment member. Terminal attachment member has wall-like bodies, similar to wall-like bodies formed on a sidewall portion, formed along the direction of extension of terminal attachment member. On one end of terminal attachment member in the direction of extension, a side fitting portion is formed that corresponds to the wall-like body, and by fitting the side fitting portion to a space between sidewall portion and the wall-like body, terminal attachment member is fixed on case member. Thus, a semiconductor device is provided that allows high degree of freedom with simpler structure, as to the position of attaching a screw block terminal or a pin terminal to the case member. | 02-24-2011 |
| 20110051375 | Highly Integrated Miniature Radio Frequency Module - A highly integrated miniature RF module includes a dielectric base board with opposing top and bottom metal layers and having interconnects traces, radio frequency (RF) circuits and semiconductor chips at the top metal layer and ground and signal pads at the bottom metal layer. Metalized vias extending through the dielectric material connect the top and bottom layers. A top cover made out of laminate material, such as FR-4, with opposing top and bottom metal layers and having machined compartments and channels, surrounded with arrays of metal plated vias extending through the laminate material, protects the RF circuits and chips and provide the required isolation and wave propagation. | 03-03-2011 |
| 20110051376 | SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING - A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni. | 03-03-2011 |
| 20110058340 | METHOD OF FORMING A MULTILAYER SUBSTRATE CORE STRUCTURE USING SEQUENTIAL MICROVIA LASER DRILLING AND SUBSTRATE CORE STRUCTURE FORMED ACCORDING TO THE METHOD - A method of fabricating a substrate core structure, and a substrate core structure formed according to the method. The method includes: laser drilling a first set of via openings through a starting insulating layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; providing first and second patterned conductive layers on opposite sides of the starting insulating layer; providing a supplemental insulating layer onto the first patterned conductive layer; laser drilling a second set of via openings through the supplemental insulating layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias; and providing a supplemental patterned conductive layer onto an exposed side of the supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer and the supplemental patterned conductive layer at opposite sides thereof. | 03-10-2011 |
| 20110063803 | Semiconductor Device - The problem of damage on an antenna or a circuit (electrostatic breakdown) due to discharge of electric charge accumulated in an insulator is solved; and the problem of NAKANUKE failure is solved. A pair of conductive layers, a pair of insulators provided between the pair of conductive layers, and a chip which is provided between the pair of insulators and includes an antenna, an analog circuit, and a digital circuit are provided, in which an opening is provided for at least one of the pair of conductive layers, and the opening is provided at a position which overlaps at least the analog circuit. | 03-17-2011 |
| 20110069458 | POWER MODULE - According to one embodiment, a power module includes a metal base, a ceramic substrate, a semiconductor chip, a nut holder housing a nut, an electrode terminal and a casing. The ceramic substrate is connected to an upper surface of the metal base via a lower electrode. The semiconductor chip is located on a first major surface of the ceramic substrate. The electrode terminal includes a bent portion surrounding a nut holder. The electrode terminal includes a first connecting portion extending perpendicularly to the bent portion from one end of the bent portion, and being located on the first major surface via an upper electrode, and electrically connected to the semiconductor chip. A casing is bonded to the metal base to enclose the semiconductor chip and the electrode terminal. An upper end portion of the bent portion of the electrode terminal is exposed to outside of the casing through the opening. | 03-24-2011 |
| 20110075379 | ELECTRONIC DEVICE WITH A COVERED EXPANSION CARD BAY - An electronic device includes a main body, an expansion card holder, and a protective cover assembly. The main body defines an opening. The expansion card holder is located in the main body adjacent to the opening. The expansion card holder defines a bay facing the opening to receive an expansion card. The protective cover assembly includes a rotary shaft unit, and a metallic cover rotatably connected to the main body via the rotary shaft unit. The metallic cover includes a cover portion covering the opening, and a resisting portion extending from the cover portion and resisting the main body. The resisting portion provides resilient force impelling the cover portion to cover the opening automatically. | 03-31-2011 |
| 20110096508 | LIGHT-BASED SEALING AND DEVICE PACKAGING - Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process. | 04-28-2011 |
| 20110096509 | HIGH EFFICIENCY MODULE | 04-28-2011 |
| 20110096510 | Ovenized Crystal Oscillator Assembly - An oscillator assembly which, in one embodiment, is an ovenized crystal oscillator assembly including an enclosure defined by a base and a lid which is seated on the base. The components of the oscillator assembly are supported by the base and located under the lid. The base and the lid together define an interior oven and are both preferably made of an insulative thermoplastic material to maximize the heat retention and oven performance of the oscillator assembly. In one embodiment, the lid and the base incorporate a clip for securing the lid to the base. | 04-28-2011 |
| 20110096511 | Ultra-low profile multi-chip module - The disclosed invention comprises a substrate having one or more conductive metal traces comprising one or more electrical access leads terminating on a lateral surface of the substrate. | 04-28-2011 |
| 20110103024 | Power Semiconductor Module - A power semiconductor module in which a substrate is provided with at least one power semiconductor and has first and second contact areas, wherein a first load connection element with first contact elements provided thereon is supported on the first contact areas and a second load connection element with second contact elements provided thereon is supported on the second contact areas. Wherein at least one spring element is provided for producing a pressure contact between the contact elements and the contact areas. To reduce the structural size of the module, the pressure contact between the contact elements and the contact areas is exerted by at least one electrical component arranged between the spring element and one of the load connection elements. | 05-05-2011 |
| 20110103025 | MODULAR ELECTRONIC SYSTEM - Off-the-shelf electronic packages eliminate the much of the need for hardware redesign for each product. The base unit has a base plastic housing and a power/communication board. The component module is comprised of a mid-section plastic housing, a common board, a component board, panels with connectors and a housing cover. The component board is unique board to each platform and could be, for example, a fluid control module, a low power temperature control module, a gateway module, a USB module, etc. | 05-05-2011 |
| 20110116240 | ROTATABLE POSITIONING PIVOT STRUCTURE AND DRIVER HAVING THE SAME - In a rotatable positioning pivot structure and a driver having the pivot structure, the pivot structure includes a casing and a cover movably assembled with the casing. The casing is provided with an opening. One side of the opening is provided with a positioning shaft. The positioning shaft is provided with a positioning portion. One side of the cover is provided with an elastic piece. The elastic piece is provided with a through trough, and an elastic arm is formed in the through trough. The positioning shaft of the casing penetrates the through trough of the cover and is located inside the elastic arm. The inside of the elastic arm is provided with at least one positioning slot to be engaged with the positioning portion of the positioning shaft. With the above arrangement, the rotation of the cover can be positioned. Further, the pivot structure is arranged in the driver. | 05-19-2011 |
| 20110134612 | REBUILT WAFER ASSEMBLY - An electronic component package including an electronic component having a circuit surface, a block of resin partially surrounding the electronic component, and a multi-layer interconnection in contact with said circuit surface, wherein the multi-layer interconnection is connected to bond-pads having a pitch lower than 50 μm, and the block of resin is made of injection-molding resin. | 06-09-2011 |
| 20110157836 | ELECTRONIC DEVICE AND COMPONENT - According to one embodiment, an electronic device includes: a device main body, a first engage portion; an operation element; and a disengage mechanism. The device main body includes component container detachably housing a component. The first engage portion is provided to the device main body and facing inside the component container, and when the component is housed in the component container, engaged with a second engage portion provided to the component. The operation element is provided on a rear wall of the device main body, the rear wall being a side wall of the device main body provided at a further side of the device main body and extended in a width direction of the device main body. The disengage mechanism moves the first engage portion in accordance with an operation of the operation element to disengage the first engage portion and the second engage portion from each other. | 06-30-2011 |
| 20110157837 | Flexible Intelligent Electronic Device - An intelligent electronic device for a Substation Automation or Distribution Automation system as well as to a method and computer program product for providing it. The device has a structuring of its own functionality according to a communication standard and includes mechanically separable, replaceable hardware modules interconnected via an inter-module bus). The modules implement functionality related to function related elements of the standard and include a communication module and I/O modules. The device includes elements of the communication standard comprising one device related element and replaceable function related elements of all the functions provided by the modules. The communication module includes the device related element and function elements associated with the function of the communication module as well as functions provided by all the I/O modules. | 06-30-2011 |
| 20110182037 | CARD DEVICE - A card device capable of improving mechanical strength of a mounting substrate with a simple structure is provided. A memory card includes the mounting substrate and a semiconductor package in a package. An electronic component such as a communication component on the mounting substrate is covered with a protective member having an electromagnetic shield function. The protective member is formed by drawing process of a sheet metal, has a containable space by a ceiling section and a side wall, and has a curve section at a joint section between an all rim of the ceiling section and the side wall. A flange is provided on the bottom end of the side wall, and the flange is solder-jointed with a ground region of the mounting substrate. In the protective member having the foregoing structure, stress hardly concentrates locally. Thus, its mechanical strength is large, and rigidity of the mounting substrate is increased. | 07-28-2011 |
| 20110182038 | Connecting module and electronic device coupling system - A connecting module includes: a main section in which an electronic circuit is housed; a plate section that is rotatably supported by the main section, and that is adapted to lie in front of the main section, and that is rotatable between a flat position in which an electronic device is laid on a first face representing a top face and a standing position in which the electronic device is leaned against a second face representing a back face opposite to the first face; and a first connector that couples with the electronic device laid on the plate section when the plate section is in the flat position so as to connect the electronic device to the electronic circuit in the main section. | 07-28-2011 |
| 20110199737 | SEMICONDUCTOR PACKAGE - Embodiments of the present invention provide a semiconductor package which includes: a semiconductor chip to which one end of each of a plurality of wires is connected; and a board on which the semiconductor chip is fixed, and a plurality of board wires to which the plurality of corresponding wires are connected are disposed, wherein the board includes: a first wiring pair that includes a first pair of wires in parallel with each other and first two board wires connected to the corresponding wires, one of the wires connected to one of the board wires crossing the other board wire without contact with the other board wire, and a second wiring pair that is provided adjacent to the first wiring pair and includes a second pair of wires in parallel with each other and second two board wires connected to the corresponding wires without a crossing. | 08-18-2011 |
| 20110205712 | ELECTRONIC MODULE AND ELECTRONIC ASSEMBLY COMPRISING SUCH A MODULE - The invention relates to an electronic module ( | 08-25-2011 |
| 20110235281 | HANDHELD ELECTRONIC DEVICE WITH INTEGRATED TRANSMITTERS - An electronic device may include wireless circuitry such as infrared sources that control external equipment such as televisions and set-top boxes. An infrared source may be mounted within an electronic device housing in a visually inconspicuous location such as in a connector port. A button may be provided with transparent structures that allow infrared light to pass through the button. A removable accessory port may be provided with an infrared transmitter accessory that allows an electronic device to serve as a remote control device. Portions of an electronic device housing may be provided with thin housing walls or holes that are too small to be noticeable to the naked eye to serve as windows for infrared light. An audio port may serve as an infrared light window. Gasket structures, bezel structures, and the edges of displays and other planar glass members may be used in transmitting infrared light. | 09-29-2011 |
| 20110242769 | Integrated Handle and Stacking System - An integrated handle and stacking system for an inverter generator is provided. Each of a plurality of inverter generators may have a handle disposed at a top side of the inverter generator. Additionally, a mount may be disposed at a bottom side of the inverter generator. The handles may have recesses sized and configured to receive the mounts of an upper inverter generator so that the plurality of inverter generators may be stacked upon each other. Accordingly, the handles provide a convenient means for carrying or transporting the inverter generator from point A to point B and the recesses/mounts provide a convenient means of stacking the plurality of inverter generators. The handles and/or mounts may have dampening material to isolate vibration between stacked inverter generators. | 10-06-2011 |
| 20110242770 | POWER MODULE - A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device. | 10-06-2011 |
| 20110249408 | PLUGGABLE ELECTRONIC UNIT WITH TRANSMISSION POWER ADJUSTMENT CAPABILITY - The present relates to pluggable electronic unit with transmission power adjustment capability such as for example small form-factor pluggable transceivers. The pluggable electronic unit with transmission power adjustment capability may comprise a power adjustment unit. By verifying the transmitted power is sufficient or could be reduced, it is possible to regulate transmission power of a transceiver autonomously within the pluggable electronic unit itself. | 10-13-2011 |
| 20110279983 | Automated mechanical disconection of an electrical converter module in a frequency converter arrangement - An arrangement is described for receiving an electrical converter module for converting a first frequency of an electrical input signal into a second frequency of an electrical output signal. A rack includes input terminals for receiving the electrical input signal and output terminals for providing the electrical output signal. A slot receives the converter module in a first and second positions where in first position the converter module is electrically connected both to the input and output terminals and in the second position the converter module is electrically disconnected both from the input and output terminals. An actuator, which is mounted to the rack and which, in response to a disconnect trigger signal, is adapted to move the electrical converter module from the first position to the second position. A frequency converter system equipped with such an arrangement and a method for disconnecting a converter module are provided | 11-17-2011 |
| 20110292617 | POWER MODULE WITH CURRENT SENSING - A power module operable to sense current, such as but not limited to a power module operable within a vehicle to sense current while rectifying an AC input to a DC output. The power module may include a shunt disposed relative an output of the power module to facilitate the current measurement. | 12-01-2011 |
| 20110299253 | ELECTRICAL POWER MODULE AND METHOD FOR CONNECTING AN ELECTRICAL POWER MODULE TO A PRINTED CIRCUIT BOARD AND A HEAT SINK - An electrical power module ( | 12-08-2011 |
| 20110317370 | ELECTRONIC COMPONENT MOUNTED ON A CAPACITOR ELECTRODE - One example includes a capacitor case sealed to retain electrolyte, electrolyte disposed in the capacitor case, a capacitor electrode disposed in the capacitor case, an electronic component mounted to the capacitor electrode and disposed in the capacitor case, the electronic component including two contacts, with a first contact mounted onto the capacitor electrode and with a second contact mounted onto a terminal disposed on an exterior of the capacitor case and sealingly extending through the capacitor case, the first and second contacts electrically isolated from one another, a additional capacitor electrode disposed in the capacitor case, a separator disposed between the capacitor electrode and the additional capacitor electrode and a additional terminal disposed on the exterior of the capacitor case and in electrical communication with the additional capacitor electrode, with the terminal and the additional terminal electrically isolated from one another. | 12-29-2011 |
| 20120044651 | TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELECTRONIC DEVICE - The present invention relates to a terminal structure and an electronic device having the terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni | 02-23-2012 |
| 20120044652 | TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELECTRONIC DEVICE - The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni | 02-23-2012 |
| 20120044653 | COMPARTMENTALIZED SHIELDING OF SELECTED COMPONENTS - Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module. | 02-23-2012 |
| 20120057307 | INTEGRAL CABLE GUIDE FOR ELECTRONIC MODULE - An integral cable guide for an electronic module is provided. The electronic module includes a top housing with a ridge formed on one side. The top housing is configured to removably couple with a bottom housing to enclose electronic components. The electronic module further includes a receptacle within the top housing configured to receive a removable terminal block (RTB), such that a channel is formed between the ridge and the RTB when the RTB is placed within the receptacle. The channel guides cables coupled to the RTB to an outside edge of the module. The electronic module further includes at least one anchor that provides support for the cables. | 03-08-2012 |
| 20120069528 | Method for Control of Solder Collapse in Stacked Microelectronic Structure - A process and product made from the process is disclosed to minimize solder collapse during solder reflow. | 03-22-2012 |
| 20120075810 | METHOD OF PRODUCING ELECTRONIC MODULE, AND ELECTRONIC MODULE - A method of producing an electronic module having an electronic part and a mounting part for mounting the electric module to an external apparatus, includes a step of disposing the electronic part in a cavity of a die, a step of disposing the mounting part in the die with a first portion of the mounting part being positioned in the cavity and a second portion of the mounting part being outside of the cavity, a step of supplying a resin into the cavity of the die, a step of curing the resin while the electronic part and the first portion of the mounting part are immersed in the resin in the cavity of the die, and a step of extracting the resin from the cavity after the resin is cured in the step of curing. | 03-29-2012 |
| 20120106092 | NAVIGATION TOOL HOLDER - A navigation tool holder for a mobile device can include a top holder, a bottom holder, and a cover layered on top of the top holder. The top holder defines an opening for receiving a navigation tool. The bottom holder is configured to matingly engage the top holder. A navigation tool housed between the top holder and the bottom holder. The navigation tool includes a top portion protruding through the opening of the top holder and a flexible circuit communicatively coupling the navigation tool to a circuit board of the mobile device. The cover layer on the top holder can surround the top portion of the navigation tool so that the cover maintains an alignment of the navigation tool with a housing of the mobile device. | 05-03-2012 |
| 20120106093 | Display Device and Electronic Device - According to one embodiment, a display device includes a base, a display module, and an connection portion. The display module includes a display screen that stands upright. The connection portion includes an extending portion that extends above the base. The connection portion is connected to the display module and is supported by the base to be rotatable about a rotation axis that extends vertically. The rotation axis is located on the display screen side with respect to the center axis of the extending portion extending along the vertical direction. | 05-03-2012 |
| 20120106094 | LOW-NOISE FLIP-CHIP PACKAGES AND FLIP CHIPS THEREOF - A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit. | 05-03-2012 |
| 20120127670 | MODULE HOUSING AND METHOD FOR MANUFACTURING A MODULE HOUSING - A module housing having an inner housing, an outer housing and a connection element is provided, the inner housing having at least one component and being completely enclosed by the outer housing in a form-locking manner, and the connection element being enclosed in a first subsection by the inner housing in a form-locking manner, wherein the connection element has electrical plug contacts in a third subsection. | 05-24-2012 |
| 20120127671 | MULTI-CHIP MODULE - A multi-chip module is disclosed to include a pin frame, an electric power switch chip, and a battery protection chip. The pin frame has a chip placement region and six pins. The second pin and the fifth pin are electrically connected at the chip placement region, and the other pins are set electrically isolated from each other. A bottom surface of the electric power switch chip is electrically connected at the chip placement region, and a top surface thereof is electrically connected to the first pin and the third pin. A bottom surface of the battery protection chip is disposed at the top surface of the electric power switch chip in an electrically isolated fashion. A top surface of the battery protection chip is electrically connected to the top surface of the electric power switch chip, the first pin, the fourth pin, and the sixth pin. | 05-24-2012 |
| 20120127672 | INTERFACE BETWEEN A SECURITY MODULE AND A HOST DEVICE - The present invention may be deployed in a system comprising a security module housed on a chip card and a host device comprising a chip card reader. The host device is comprised in a housing with a slot for the chip card. The housing is shielded to reduce the amount of electromagnetic radiation generated by the security module and/or the host device from penetrating to the exterior of the housing. Similarly, the shielding is adapted to reduce the effects of electromagnetic radiation generated outside of the host device on the components within the housing. The slot is also shielded by a flap made of an electrically conductive epoxy material or an electrically conductive resin. | 05-24-2012 |
| 20120147566 | MODULE RECEPTACLE - A module receptacle having a main frame arranged to hold a mountable functioning module in a specified position with respect to a covering frame. The covering frame can be attached by means of at least one fastening element to the main frame. The covering frame is at least large enough to cover the main frame. | 06-14-2012 |
| 20120155035 | DISPLAY DEVICE - A display device includes a display module, an outer housing, a glass cover and a strength-enhanced member. The display module is installed within the outer housing, and the outer housing has a support portion. The glass cover is attached to the support portion. The strength-enhanced member is located within the outer housing, and the strength-enhanced member is disposed closer to a corresponding corner of the outer housing than a corresponding corner of the glass cover is. | 06-21-2012 |
| 20120162928 | ELECTRONIC PACKAGE AND METHOD OF MAKING SAME - An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates and also including an opening therein in which is positioned at least one electrical component, such as a semiconductor chip, coupled to the lower or base substrate. A second component may also be mounted on and electrically coupled to the upper surface of the top or cover circuitized substrate. A method of making such a package is also provided. | 06-28-2012 |
| 20120162929 | POWER SUPPLY WITH SOLID INSULATING SUBSTANCE - A power supply includes a casing, an electronic module and a filler having a solid insulating substance, and the casing has a cavity for installing the electronic module, and a filling space reserved from an internal wall of the casing, and the filler having the solid insulating substance is filled into the filling space, such that the consumption of potting can be reduced to lower the cost of the potting and meet the application requirements of the power supply. | 06-28-2012 |
| 20120162930 | MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELD FUNCTION AND METHOD FOR MAKING THE SAME - A module IC package structure with electrical shield function includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one conductive element disposed on the circuit substrate, and the conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the conductive element, and the conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion. | 06-28-2012 |
| 20120176749 | POWER CONVERTER AND FUEL CELL VEHICLE WITH POWER CONVERTER - A soft-switching converter includes three main reactors, three main reactor terminal blocks, three auxiliary reactors, and three auxiliary reactor terminal blocks. The main reactors and the main reactor terminal blocks are each arranged on a first line. Also, the auxiliary reactors are each arranged on a second line that is parallel to the first line. Each of the auxiliary reactor terminal blocks is arranged stacked on a corresponding one of the auxiliary reactors. | 07-12-2012 |
| 20120182696 | EXPANSION SYSTEM FOR PORTABLE ELECTRONIC DEVICES - An expansion system for portable electronic devices is provided. A portable electronic device includes a main logic board and a battery component. The device includes a package for enclosing components of the device that is sealed to prevent ingress of foreign material from the surrounding environment. A mounting interface is provided that extends into the internal space of the package. The mounting interface mounts an expansion component that expands functionality of the device so that it is physically and mechanically spaced from the main logic board. The device may include an expansion interface mounted on the main logic board for logical communication between the main logic board and the expansion component. | 07-19-2012 |
| 20120182697 | BOARD MODULE AND FABRICATION METHOD THEREOF - Affixed to a projection ( | 07-19-2012 |
| 20120182698 | ASSEMBLY FOR INSTALLING BUILDING SYSTEMS ENGINEERING UNITS - An assembly for installing building systems engineering units includes a housing, which comprises a control device for carrying out an electronic function, and a base module which is designed for fastening the housing for a pre-determined installation situation. The housing and the base module are designed for fixed but removable connection so that the housing can be connected to a base module adapted to the respective installation situation in dependence on the installation situation. The modular sub-division of an installation unit into a base module and a housing, which comprises the control device for carrying out a defined function, can significantly reduce the diversity of variants. | 07-19-2012 |
| 20120188727 | EMI Shielding in a Package Module - The present invention discloses a package module with EMI shielding and the method thereof. The package module has a substrate or a PCB with at least one ground pad. A variety of electronic components are mounted on the substrate. The dielectric layer overlays a selected area which covers some electronic components and ground pads. Openings are formed within the dielectric layer and above ground pads. The shielding layer with at least two metal layers covers the dielectric layer and is electrically coupled, via the openings, to the ground pad. In general, there is a protection layer to encapsulate the entire substrate. The package module of the present invention not only achieves the requirement of miniature packaging but also reduces EMI caused by high speed electronic devices. | 07-26-2012 |
| 20120206883 | Electronic Device - According to one embodiment, an electronic device includes a display module, a first component, a second component, a reinforcing member, a wiring, and a supporting member. The display module includes a display screen. The first component includes a first wall and a first engagement portion. The second component includes a second wall located opposite the first wall with respect to the display module and a second engagement portion that engages with the first engagement portion. The reinforcing member is located between the display module and the first and second engagement portions and extends along at least part of the periphery of the display module. The wiring is located between the reinforcing member and the display module. The supporting member is provided to at least one of the first component and the second component and is located between the display module and the wiring to support the display module. | 08-16-2012 |
| 20120206884 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a hinge, a member attached to the hinge, and a housing. The housing accommodates the member and includes a wall configured to support the member and a portion configured to support the member from a side opposite to the wall. | 08-16-2012 |
| 20120224331 | LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS - A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate. | 09-06-2012 |
| 20120236507 | SENSOR MODULE, SENSOR DEVICE, METHOD FOR PRODUCING SENSOR DEVICE, AND ELECTRONIC APPARATUS - A sensor module includes a supporting member having three support faces orthogonal to one another, three IC chips each having connection terminals and external connection terminals on the side thereof where an active face is located, the three IC chips attached to the support faces of the supporting member on the sides thereof where passive faces lying along the active faces are located, three vibrating gyro elements each having a base, vibrating arms extending from the base, and connection electrodes, and flexible wiring substrates connected to the external connection terminals of the IC chips, each vibrating gyro element is disposed on the side of the IC chip where the active face is located, the connection electrodes are attached to the connection terminals of each IC chip such that one principal surface lies along the support face, and the flexible wiring substrate has a reinforcing layer. | 09-20-2012 |
| 20120236508 | ELECTRONIC-COMPONENT EMBEDDED RESIN SUBSTRATE AND ELECTRONIC CIRCUIT MODULE - An electronic component includes hollow vias provided within a resin layer such that first ends thereof extend to solders which connect and secure an embedded electronic component, and second ends thereof are sealed by a sealing-member layer, in order to cause the solders that become molten again to flow into the hollow vias such that the solders that have become molten again are housed in the hollow vias, thereby suppressing and preventing the occurrence of solder splash phenomena. | 09-20-2012 |
| 20120250263 | CONTROL PANEL HAVING A PIVOTABLE CONNECTOR - A control panel having a pivotable connector has a body, a rear cover and a connector. The connector is pivotally mounted inside the body and the rear cover, and has a plug being pivotable and freely aligned with an intended direction. Accordingly, users can adjust the orientation of the connector based on a position on which the control panel is to be mounted, placed or hung, so that the connector of the control panel can be smoothly connected with a connection port of the machine directly or through a connection cable. | 10-04-2012 |
| 20120250264 | MEMORY MODULE HAVING MEMORY CHIP AND REGISTER BUFFER - Disclosed herein is a memory module that includes a register buffer and a memory chip each mounted on a module substrate. Each of the command address output terminals belonging to the first group provided on the register buffer is connected to an associated one of the command address input terminals belonging to the first group provided on the memory chip through associated ones of the plurality of contact plugs and the first wiring layer. Each of the command address output terminals belonging to the second group provided on the register buffer is connected to an associated one of the command address input terminals belonging to the second group provided on the memory chip through associated ones of the plurality of contact plugs and the second wiring layer. | 10-04-2012 |
| 20120257357 | ELECTROCHEMICAL CAPACITOR - Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container ( | 10-11-2012 |
| 20120268898 | Thin carrier device - The present invention is to provide a thin carrier device with a support pad's length positioned at a USB port's height for a supporting segment securely supported and a USB metal contact electrically connected to a female connector of the USB port effectively without problems such as invalid electrical connection or poor contact between a USB metal contact and a female connector of a computer's USB port affected by the integrated circuit module's thinned thickness. Relying on the lowered thickness of the integrated circuit module, the present invention is able to integrate other thin products with their shapes including, without limitation, card, paper card or business card for the purpose of a thinning tendency. | 10-25-2012 |
| 20120268899 | REINFORCED FAN-OUT WAFER-LEVEL PACKAGE - A microelectronic package includes a microelectronic element including a first surface having contacts thereon, a second surface remote therefrom, and edge surfaces extending between the first and second surfaces. A reinforcing layer adheres to the at least one edge surface and extends in a direction away therefrom, the reinforcing layer not extending along the first surface of the microelectronic element. A conductive redistribution layer including a plurality of conductive elements extends from the contacts along the first surface and along a surface of the reinforcing layer beyond the at least one edge surface. An encapsulant overlies at least the reinforcing layer. The microelectronic element has a first coefficient of thermal expansion, the encapsulant has a second coefficient of thermal expansion, and the reinforcing layer has a third coefficient of thermal expansion that is between the first and second coefficients of thermal expansion. | 10-25-2012 |
| 20120275118 | PORTABLE ADJUNCT DEVICE FOR PORTABLE ELECTRONIC DEVICES - Disclosed is a portable adjunct device that includes a case having a first recess and a second recess. Mounted in the first recess is a docking connector movable between closed and open positions. Detachably mounted in the second recess is a universal serial bus connector operably connected to the docking connector. The case defines a chamber and a battery operably connected to the docking connector is disposed in the chamber. | 11-01-2012 |
| 20120275119 | Method and products related to deposited particles - The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices. | 11-01-2012 |
| 20120281367 | Non-Flat Panel Display Module and Back Frame Support Structure Thereof - Disclosed are a non-flat panel display module and the back frame support structure thereof. The non-flat panel display module comprises a non-flat display panel and an outer frame. The outer frame comprises a back frame. The back frame has a non-flat shape in accordance with a back surface of the non-flat display panel and is fixed to the back surface of the non-flat display panel. At least one support structure is fixed to the outer surface of the back frame. The support structure is fixed to an outer surface of the back frame. Therefore, the support structure can strengthen the outer frame intensity and to ensure the intensity and the curved feature of the non-flat panel display module. | 11-08-2012 |
| 20120287582 | Panel-Molded Electronic Assemblies - A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. | 11-15-2012 |
| 20120287583 | EMBEDDED CHIP PACKAGE - An electronic assembly is disclosed. One embodiment includes at least one semiconductor chip and a package structure embedding the semiconductor chip. The package structure includes at least one conducting line extending into an area of the package structure outside of the outline of the chip. | 11-15-2012 |
| 20120287584 | WIRELESS SENSOR DEVICE - A wireless sensor device capable of constant operation without replacement of batteries. The wireless sensor device is equipped with a rechargeable battery and the battery is recharged wirelessly. Radio waves received at an antenna circuit are converted into electrical energy and stored in the battery. A sensor circuit operates with the electrical energy stored in the battery, and acquires information. Then, a signal containing the information acquired is converted into radio waves at the antenna circuit, whereby the information can be read out wirelessly. | 11-15-2012 |
| 20120293964 | POWER ELECTRONIC MODULE WITH NON-LINEAR RESISTIVE FIELD GRADING AND METHOD FOR ITS MANUFACTURING - Exemplary embodiments are directed to a power electronic device with an electronic device including a substrate, a metal layer formed on the substrate and a field grading means located along an edge of the metal layer. The field grading means has a non-linear electrical resistivity. | 11-22-2012 |
| 20120300411 | DISPLAY MODULE HAVING ADJUSTABLE VIEW ANGLE FUNCTION - A display module includes a bottom cover, a locking part, a pressing part, and a display panel. The bottom cover includes a bottom wall and two sidewalls, defines a first groove on the bottom wall and a second groove on one sidewall. The locking part is rotatably mounted on the bottom wall, and includes a first hook. The pressing part is slidably received in the first groove, and rotatably connected with the locking part. The display panel includes a sliding part and a display part rotatably connected with each other. The sliding part includes one peg slidably received in the second groove and a second hook engaging with the first hook. When the pressing part is slid in the first groove to rotate the locking part, the first hook disengages from the second hook, the display part is pulled out from the bottom cover and rotated to adjust viewing angle. | 11-29-2012 |
| 20120300412 | Memory Device and Fabricating Method Thereof - The present disclosure provides a memory device and a fabricating method thereof. The memory device includes a substrate including a first metal layer formed therein, the first metal layer having at least a first surface with at least a first exposed portion of the first surface exposed at a lateral surface of the substrate, at least a first semiconductor chip formed on a top surface of the substrate, and a second metal layer surrounding the first semiconductor chip and extending to lateral surfaces of the substrate, at least a first portion of the second metal layer contacting the exposed surface of the first metal layer. | 11-29-2012 |
| 20120300413 | POWER FEEDING DEVICE FOR ELECTRONIC CASSETTE - An imaging support has a power feeding device that carries out a noncontact power feeding operation in an electromagnetic induction method. When a cassette is loaded in a cassette chamber of the imaging support, a power feeding controller of the power feeding device issues a query signal. In a case where the cassette loaded in the cassette chamber is an electronic cassette having a noncontact power receiving function, this electronic cassette issues a response signal answering the query signal. Upon receiving the response signal, the power feeding controller judges that the cassette is the electronic cassette, and starts the noncontact power feeding operation. On the other hand, in a case where the cassette loaded in the cassette chamber does not have the noncontact power receiving function, no response signal is issued. The power feeding controller stops issuing the query signal after a lapse of predetermined time. | 11-29-2012 |
| 20120307458 | MEMORY DEVICE AND RECEPTACLE FOR ELECTRONIC DEVICES - A random access memory (RAM) memory module has a compact form factor and is removable from a corresponding socket assembly to allow easy replacement of the memory module or reconfiguration of the memory module during development of an electronic device that includes the memory module. | 12-06-2012 |
| 20120307459 | MAINTAINING MEMBER, MODULE, AND ELECTRONIC APPARATUS - A maintaining member includes alignment portions that determine a maintaining position of a module, in which each of the alignment portions has a mounting face to fix the module. When the maintaining member is partitioned into a first region to a fourth region by a first axis and a second axis that are orthogonal to each other in plan view with respect to the center of the maintaining member, the alignment portions are provided at the regions one by one. | 12-06-2012 |
| 20120320535 | Closure and Interconnect Systems and Methods of Using Dry Silicone Gels in Closure and Interconnect Systems - Methods and systems are provided for a dry silicone gel in a closure or interconnect system. The dry silicone gel may be made by reacting a crosslinker, a chain extender, and a vinyl-terminated polydimethylsiloxane. The reaction may be conducted in the presence of a catalyst. In certain embodiments, the dry silicone gel may comprise: (1) a hardness between 100 g and 300 g, (2) a stress relaxation between 30% and 60% when subjected to a deformation of 50% of the original size of the gel, (3) a compression set between 4% and 20% after 50% strain has been applied to the gel for 1000 hours at 70° C., and/or (4) less than 10% oil bleed out under compression of 1.2 atm after 60 days at 60° C. | 12-20-2012 |
| 20120320536 | MODULE SUBSTRATE, MODULE-SUBSTRATE MANUFACTURING METHOD, AND TERMINAL CONNECTION SUBSTRATE - In a module substrate, a plurality of terminal connection substrates each including an insulator and a plurality of columnar terminal electrodes arranged on a single lateral surface or both lateral surfaces of the insulator is mounted on a single side of a composite substrate such that at least one of the terminal connection substrates extends over a border between a plurality of neighboring module substrates. The composite substrate, in which the plurality of terminal connection substrates is mounted on the single side and a plurality of electronic components is mounted on at least the single side, is divided at a location where the module substrates are to be cut from the composite substrate. | 12-20-2012 |
| 20120327607 | PACKAGE STRUCTURE OF TRANSIENT VOLTAGE SUPPRESSOR - A package structure of transient voltage suppressor is disclosed. The package structure comprises a package housing with a bottom thereof having a first contact pin, a second contact pin, and a third contact pin, wherein the third contact pin is positioned between the first contact pin and the second contact pin. A first diode is positioned in the package housing, and an anode and a cathode of the first diode are respectively connected with the third contact pin and the first contact pin. A second diode is installed in the package housing, and an anode and a cathode of the second diode are respectively connected with the third contact pin and the second contact pin. | 12-27-2012 |
| 20120327608 | Controlled Buckling Structures in Semiconductor Interconnects and Nanomembranes for Stretchable Electronics - In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices. | 12-27-2012 |
| 20120327609 | SEMICONDUCTOR DEVICE - A semiconductor device includes at least one arm series circuit. The at least one arm series circuit includes an upper arm, a lower arm, an insulating substrate, a positive terminal, a negative terminal, an upper arm control terminal, a lower arm control terminal, and an insulating member. The lower arm is connected to the upper arm in series. Each of the upper arm and the lower arm includes a switching element and a diode connected in anti-parallel to the switching element. The insulating substrate is disposed on ground. The positive terminal is provided on the insulating substrate. The negative terminal is provided on the insulating substrate. The upper arm control terminal is provided on the insulating substrate. The lower arm control terminal is provided adjacent to the negative terminal on the insulating substrate. | 12-27-2012 |
| 20130016483 | ADAPTER MODULE FOR PORTABLE ELECTRONIC DEVICE - An adapter module for a portable electronic device is disclosed. The adapter module is applied with a tablet electronic device. The adapter module includes an antenna unit, a first connection interface and a second connection interface. The first connection interface is configured for electrically connecting to the portable electronic device. The second connection interface is configured for electrically connecting to the tablet electronic device. When the first connection interface is electrically connected to the portable electronic device and the second connection interface is electrically connected to the tablet electronic device, the portable electronic device transmits a signal through the antenna unit of the adapter module, and the tablet electronic device displays an output information of the portable electronic device. | 01-17-2013 |
| 20130021758 | Interconnect Schemes, and Materials and Methods for Producing the Same - An interconnect scheme includes a conductive ink forming a plurality of conductive regions, and a dielectric ink occupying spaces between the conductive regions. The conductive ink and the dielectric ink have substantially identical optical, acoustic, and x-ray absorption properties, thereby making the interconnect scheme tamper-resistant and/or difficult to identify and reverse-engineer using conventional detection methods. | 01-24-2013 |
| 20130021759 | Power Semiconductor Module with Asymmetrical Lead Spacing - A power semiconductor has power terminals arranged in a row at one side of the housing, with control terminals arranged in a row at the other side of the housing. The spacing between adjacent power terminals is greater than the spacing between adjacent control terminals. | 01-24-2013 |
| 20130039015 | ELECTRONIC MODULE AND HANGING MECHANISM THEREOF - A hanging mechanism is for hanging an electronic device on a support wall. The hanging mechanism includes a fixing pad, first and second linkage rods, first arm and second arm rods, and first and second hanging rods. The fixing pad is detachably fixed onto the electronic device. The first linkage rod is pivoted to a first side of the fixing pad and the first arm rod. The second linkage rod is pivoted to a second side of the fixing pad and the second arm rod. The first hanging rod is pivoted to the first arm rod. The second hanging rod is pivoted to the second arm rod and rotatably intersects with the first hanging rod. The second hanging rod is for hanging on the support wall with the first hanging rod. When the first and second linkage rods rotate relatively, the first and second hanging rods rotate relatively. | 02-14-2013 |
| 20130044437 | SENSOR MODULE AND METHOD FOR PRODUCING A SENSOR MODULE - A method for producing a sensor module, in which a line part is provided in a first production step, which includes at least one receiving region for the force-fitting and/or form-fitting accommodation of a sensor element, and in a second production step for producing a housing, the line part is extrusion-coated with a plastic material in such a way that the at least one receiving region remains generally free of plastic material, and the sensor element is fixed in place in force-fitting and/or form-fitting manner in the at least one receiving region in a third production step. | 02-21-2013 |
| 20130050956 | Photovoltaic Junction Module - A photovoltaic junction module is provided, which includes a housing, an overmolded assembly, and a cable. The overmolded assembly includes an electrical assembly and a plastic body for enclosing the electrical assembly therein. The overmolded assembly is detachably mounted to the housing. The cable extends into the housing and detachably and electrically connects to the electrical assembly. | 02-28-2013 |
| 20130050957 | ELECTRONIC COMPONENT INCORPORATING BOARD AND COMPOSITE MODULE - An electronic component incorporating board that is less susceptible to a solder flash phenomenon therein even with application of heat, for example, when it is mounted to another substrate, includes a core substrate, electrodes located respectively on one principal surface and the other principal surface of the core substrate, an electronic component mounted to the electrodes that are located on the one principal surface of the core substrate, and a resin layer located on the one principal surface of the core substrate and covering the electronic component, wherein surfaces of the electrodes located on the one principal surface of the core substrate are not plated. | 02-28-2013 |
| 20130058049 | PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS - A package system includes at least one active circuitry disposed over a substrate. A passivation structure is disposed over the at least one active circuitry. The passivation structure has at least one opening that is configured to expose at least one first electrical pad. At least one passive electrical component is disposed over the passivation structure. The at least one passive electrical component is electrically coupled with the at least one first electrical pad. | 03-07-2013 |
| 20130058050 | SLOT AND MEMORY MODULE FOR A SLOT STANDING INTERCONNECT - According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable “D” interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board. | 03-07-2013 |
| 20130063902 | POWER SUPPLY CONTROL CIRCUIT MODULE - A power supply control IC is mounted on a surface of a multilayer body that defines a power supply control circuit module. A first inner-layer electrode connecting an inductor element and a switching regulator element for the power supply control IC, another first inner-layer electrode connecting the inductor element and a capacitor element, and still another first inner-layer electrode connecting the switching regulator element and the capacitor element are located on upper layer regions of the multilayer body and are routed in between a mounting area of the power supply control IC and a peripheral wall of the multilayer body. The first inner-layer electrodes have widths that are wider than those of second inner-layer electrodes which are located near a center region of the multilayer body and transmit control signals. | 03-14-2013 |
| 20130063903 | ARRANGEMENT COMPRISING AN ELECTRIC AND/OR ELECTRONIC MODULE AND A CIRCUIT CARRIER - The invention relates to an arrangement comprising an electric and/or electronic module ( | 03-14-2013 |
| 20130070423 | COMPACT CONNECTOR ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE - A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees. | 03-21-2013 |
| 20130070424 | Molded can package - A molded can package includes a circuit board, a MEMS die and a can. The MEMS die is connected to the circuit board by a conductive wire. The can is mounted to the circuit board so as to isolate the MEMS die to form a MEMS die unit. A compound mold packs the MEMS die unit to prevent the MEMS die from being interfered and physically damage by electro-magnetic radiation and light so as to simplify the manufacturing processes and increase the production and reduce the cost. | 03-21-2013 |
| 20130077260 | SMARTPAD - NOTIFICATIONS - A multi-display device is adapted to be dockable or otherwise associatable with an additional device. In accordance with one exemplary embodiment, the multi-display device is dockable with a smartpad. The exemplary smartpad can include a screen, a touch sensitive display, a configurable area, a gesture capture region(s) and a camera. The smartpad can also include a port adapted to receive the device. The exemplary smartpad is able to cooperate with the device such that information displayable on the device is also displayable on the smartpad. Furthermore, any one or more of the functions on the device are extendable to the smartpad, with the smartpad capable of acting as an input/output interface or extension of the smartpad. Therefore, for example, information from one or more of the displays on the multi-screen device is displayable on the smartpad. | 03-28-2013 |
| 20130083492 | POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A power module package includes: a substrate having a stepped portion and a non-stepped portion; a power circuit unit electrically connected to a circuit wiring provided in the stepped portion; a control circuit unit electrically connected to a circuit wiring provided in the non-stepped portion; and a molding unit molded on the substrate to seal the power circuit unit while exposing the circuit wiring of the non-stepped portion. Therefore, it is possible to improve thermal characteristics of the power module package, implement high reliability between the power circuit unit and the control circuit unit, improve design freedom of the power module package, and implement miniaturization of products. | 04-04-2013 |
| 20130083493 | ELECTRONIC COMPONENT, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a unit including an electronic device; and an opposite member opposing the electronic device, wherein the unit and the opposite member are bonded together with an adhering member disposed between the unit and the opposite member and having light-cured resin and inorganic particles dispersed in the light-cured resin; and wherein in a particle-diameter distribution of the inorganic particles by volume, a particle diameter having a cumulative value of distribution of 50% is 0.5 μm or more, and a particle diameter having a cumulative value of distribution of 90% is 5.0 μm or less. | 04-04-2013 |
| 20130088838 | DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDING THE SAME - A die package includes a substrate, a die mounted on the substrate, and a ZQ resistor disposed in the die package and connected to the substrate and the die. The ZQ resistor may be used to calibrate impedance of the die. | 04-11-2013 |
| 20130088839 | BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE ASSEMBLY - There is provided a method of manufacturing a board module which includes attaching a metal particle to a surface of a solder bump, which includes at least a tin component and is mounted on an electrode provided on a first surface of an electric part or a printed circuit board, the metal particle having a higher specific gravity and a higher melting point than the solder bump, making the first surface face up, heating the solder bump to a temperature equal to or higher than the melting point of the solder bump so that the metal particle precipitates in the solder bump, and forming an inter-metal compound layer, which has a higher melting point than a melting point of the solder bump, at an interface between the solder bump and the electrode by using the metal particle, which has precipitated, and the tin component of the solder bump. | 04-11-2013 |
| 20130107467 | CIRCUIT SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING CIRCUIT SUBSTRATE | 05-02-2013 |
| 20130107468 | APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUITS | 05-02-2013 |
| 20130107469 | Insulating Ring for Packaging, Insulating Ring Assembly and Package | 05-02-2013 |
| 20130107470 | ELECTRONIC APPARATUS COMPRISING A RECESS FOR RECEIVING AN EXTERNAL MODULE | 05-02-2013 |
| 20130114214 | Television Receiver and Electronic Apparatus - According to one embodiment, a television receiver includes: a housing; a circuit board arranged in the housing; an electronic component mounted on the circuit board; a reinforcing member comprising a first surface in contact with the circuit board, and a second surface located on an opposite side of the first surface and exposed to an inside of the housing; a component contained in the housing, the component comprising a first supported area located at a distance from a surface of the circuit board; and a support member configured to support the component, the support member comprising a first end portion fixed to the first supported area of the component, and a second end portion fixed to the second surface of the reinforcing member. | 05-09-2013 |
| 20130114215 | LASER APPARATUS - A laser apparatus may include: a first module including an oscillator configured to output a laser beam and an oscillator support portion for supporting the oscillator; a second module including a beam delivery unit for delivering the laser beam and a beam delivery unit support portion for supporting the beam delivery unit; a third module including an amplifier for amplifying the laser beam and an amplifier support portion for supporting the amplifier; and a frame on which the modules are placed, the frame including mounts on which the oscillator support portion, the beam delivery support portion and the amplifier support portion are placed. | 05-09-2013 |
| 20130128466 | Backlight Module, Backplane, and LCD Device - The present invention discloses a backlight module, a backplane and an LCD device. The backlight module comprises a backplane, a PCB and locking piece(s) for fixing the PCB on the backplane; the backplane comprises a frame formed by multiple brackets, and bridges arranged on the brackets; each bracket or bridge is provided with a chute, and the locking piece is arranged in the chute by a fixed structure at the bottom of the locking piece. Because the backplane comprises a frame formed by multiple brackets, the frame is provided with bridges for arranging PCB and the like, and both the brackets and bridges are formed by combining universal shaped parts, the present invention has the advantages of low manufacturing cost, and material saving; meanwhile, because each bridge is provided with a chute for arranging the hillock, the hillock is fixed in the random position of the chute. Thus, the hillock is arranged in the corresponding position of the chute in accordance with the PCB size, so that the backplane can be adapted for PCBs of different size, or backlight modules or LCD devices with components of different number. | 05-23-2013 |
| 20130128467 | ELECTRONIC COMPONENT HOUSING UNIT, ELECTRONIC MODULE, AND ELECTRONIC DEVICE - An electronic component housing unit includes: a substrate including a mounting region on which an electronic component is mounted; a connection conductor extending from a top face to a bottom face of the substrate, the connection conductor being electrically connected to the electronic component; a wiring conductor disposed on the bottom face of the substrate, one end of the wiring conductor being electrically connected to the connection conductor, another end of the wiring conductor being drawn out from a side face of the substrate; and a ground conductor disposed on the bottom face of the substrate, the ground conductor forming a coplanar line along with the wiring conductor. A bottom face of the wiring conductor is located above a bottom face of the ground conductor. | 05-23-2013 |
| 20130148309 | METHOD FOR CREATING A MULTIFUNCTIONAL MODULE AND DEVICE INCLUDING SAME - The invention relates to a method for creating a multi-component device, including the following steps, creating a module having a multilayer structure comprising electrical/electronic components arranged on at least one substrate in stacked layers, the components each having a main surface exposed to the outside, wherein the components are arranged such that the respective main surfaces thereof are oriented in mutually opposite directions. The invention also relates to the corresponding device. | 06-13-2013 |
| 20130148310 | PRINTED CIRCUIT BOARD HAVING WIRE PATTERN - A printed circuit board (PCB) includes a wire pattern having first and second surfaces facing in opposite directions from each other, the wire pattern including a first region having a first thickness and a second region having a second thickness greater than the first thickness; a core insulation layer on the second surface in the first region, the core insulation layer having a third surface adjacent to the second surface in the first region and a fourth surface facing in an opposite direction from the third surface, the fourth surface being connected to the second surface; and a first protection layer covering a portion of the fourth surface of the core insulation layer and a portion of the second surface in the second region. | 06-13-2013 |
| 20130155627 | ELECTRONIC DEVICESWITH SUPPORT FRAMES AND MECHANICALLY-BONDED PLASTIC AND METHODS FOR FORMING SUCH ELECTRONIC DEVICES - Electronic devices with support frames and mechanically-bonded plastic and methods for forming such electronic devices are provided. A representative electronic device includes: a housing that incorporates: a metal chassis having a base and a sidewall extending outwardly therefrom to define an interior, the chassis having an opening extending there through; a plastic part mechanically bonded to the metal of the chassis, the plastic part spanning the opening; and a support frame mounted at least partially within the housing such that the support frame increases rigidity of the housing. | 06-20-2013 |
| 20130170147 | RDL SYSTEM IN PACKAGE - In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area. | 07-04-2013 |
| 20130170148 | PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF - A manufacturing method of a package carrier is provided. A supporting board having an upper surface which a patterned circuit layer formed thereon is provided. A portion of the upper surface is exposed by the patterned circuit layer. An insulating layer and a conducting layer located at a first surface of the insulating layer are laminated onto the patterned circuit layer. The patterned circuit layer and the exposed portion of the upper surface are covered by the insulating layer. Plural conductive connection structures are formed on the patterned circuit layer. Plural of pads respectively connecting the conductive connection structures and exposing a portion of the first surface of the insulating layer is defined by patterning the conductive layer. The supporting board is removed so as to expose a second surface of the insulating layer. The second surface and a bonding surface of the patterned circuit layer are coplanar. | 07-04-2013 |
| 20130170149 | CONNECTOR AND ELECTRONIC CIRCUIT ASSEMBLY FOR IMPROVED WET INSULATION RESISTANCE - The present invention is premised upon a connector and electronic circuit assembly ( | 07-04-2013 |
| 20130176685 | MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME - There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit. | 07-11-2013 |
| 20130176686 | MODULE AND PRODUCTION METHOD - The invention specifies a module comprising a carrier substrate ( | 07-11-2013 |
| 20130182394 | ELECTRONIC MODULE PACKAGES AND ASSEMBLIES FOR ELECTRICAL SYSTEMS - An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array. | 07-18-2013 |
| 20130182395 | INTEGRATED MODULE, INTEGRATED SYSTEM BOARD, AND ELECTRONIC DEVICE - Embodiments of the present invention provide an integrated module. The integrated module includes a printed circuit board PCB and a modular device, where the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; and a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB. Positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same. | 07-18-2013 |
| 20130188321 | EXTERNAL ACCESSORY TO BE ATTACHED TO ELECTRONIC APPARATUS AND SYSTEM - An external accessory that can be attached to and detached from an electronic apparatus equipped with a power source unit includes: a first power receiving unit that receives power from the power source unit of the electronic apparatus; a second power receiving unit that receives power from the power source unit of the electronic apparatus; a decision-making unit that makes a decision as to whether or not the first power receiving unit is receiving power; a function execution unit that executes a predetermined function by using power received at one of the first power receiving unit and the second power receiving unit; and a control unit that engages the function execution unit in operation continuously when an affirmative decision is made by the decision-making unit, and engages the function execution unit in operation intermittently when a negative decision is made by the decision-making unit. | 07-25-2013 |
| 20130194756 | ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE - An electronic module includes a mold body in which an electronic component mounted on a circuit substrate is sealed by a mold resin; and a shield film formed to cover upper and side surfaces of the mold body, the shield film being a metal evaporated film formed by physical vapor deposition. | 08-01-2013 |
| 20130194757 | SENSORS AND SENSOR INTERFACE SYSTEMS - An apparatus, comprising a housing; a first connector coupled to the housing and having a first plurality of contacts; a second connector coupled to the housing and having a second plurality of contacts; and a circuit electrically connected to at least one of the first contacts and at least one of the second contacts. The circuit is encapsulated within the housing. The circuit is configured to generate an output signal in response to a resistance sensed at the at least one of the first contacts. | 08-01-2013 |
| 20130201631 | MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL CIRCUIT COMPONENTS WITHIN A THREE DIMENSIONAL MODULE - A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stacked substrate layers. Each of the substrate layers is fusion bonded to at least an adjacent one of the plurality of substrate layers. A first discrete electrical circuit component is bonded to a first layer of the plurality of layers. A bonding material is interposed between the discrete electrical circuit component and the first layer. The bonding material has a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers. | 08-08-2013 |
| 20130223014 | MECHANISMS FOR CONTROLLING BUMP HEIGHT VARIATION - The mechanisms for forming bumps on packaged dies and package substrates reduce variation of bump heights across the packaged dies and packaged substrates. Bumps are designed to have different widths to counter the higher plating current near edge(s) of dies or substrates. Bump sizes can be divided into different zones depending on the bump patterns and densities across the packaged die and/or substrates. Smaller bumps near edges reduce the thickness of plated film(s), which would have been thicker due to being near the edges. As a result, the bump heights across the packaged dies and/or substrates can be kept significantly constant and chip package can be properly formed. | 08-29-2013 |
| 20130223015 | ELECTRONIC APPARATUS, SUPPORT DEVICE, AND ATTACHMENT STRUCTURE - According to one embodiment, the electronic device of this embodiment includes a module, a first plate which has a first surface and a second surface, the first plate supporting the module, a cover which includes an attaching surface that is attached to the first plate, and an engaging part that includes a tip part, a second plate which is attached to the first plate from a side of the second surface and fill a space between the second surface and the tip part, the second plate being engaged with the engaging part and fixing the cover onto the first plate, and a fixing member which fixes the second plate onto the first plate. | 08-29-2013 |
| 20130223016 | TOUCH PANEL HAVING IMPROVED VISIBILITY AND METHOD OF MANUFACTURING THE SAME - A touch panel having improved visibility is provided. The touch panel includes a window part, at least one ultraviolet (UV) resin layer attached to a bottom surface of the window part, and a display part including a touch sensor film module attached to a bottom surface of the at least one UV resin layer such that the UV resin layer prevents refractions and reflections of light. | 08-29-2013 |
| 20130223017 | ELECTRONIC COMPONENT MODULE - An electronic component module includes a rectangular insulating substrate; lands that are arranged on a substrate surface thereof; electronic components that are connected to the lands using solder, and are mounted on the substrate surface; a solder resist protective layer that protects a wiring pattern by covering the substrate surface, and that is raised from the substrate surface toward the electronic components; a non-resist forming region that is not subjected to the solder resist and that exposes the substrate surface; and a sealing resin that seals the electronic components on the substrate surface. The non-resist forming region is formed in such a way as to communicate one side which partitions the substrate surface with another side which is separated from the one side, which partitions the substrate surface, through bottoms of component rear surfaces of the electronic components on the substrate surface. | 08-29-2013 |
| 20130250524 | Compact Flash Retainer - A method and apparatus for retaining a removable module (such as a memory card) in engagement with an interface structure of a printed circuit board (PCB). The PCB is coupled to a tray, wherein the module is positioned between the PCB and the tray. The tray includes one or more forms configured to receive the module, and prevent the module from moving out of engagement with the interface structure of the PCB. A first form includes a depressed region formed in the tray, wherein the module is fitted within the depressed region. A slot, which extends through the tray, may be located adjacent to the depressed region, wherein an edge of the slot restricts movement of the module. A second form may include a raised lip, which is located adjacent to the module, and restricts movement of the module. | 09-26-2013 |
| 20130258606 | DISPLAY DEVICE WITH REPLACEABLE HOUSING - A display device with a replaceable housing, applicable to an electronic product using a flip form, includes: a display panel module, a positioning plate, and an outer cover. The display panel module has a display portion on one side thereof. The positioning plate has a frame piece and a metal plate. The frame piece is disposed at the periphery of the display panel module. The metal plate is fixed at the frame piece to cover the other side of the display panel module. The outer cover is detachably joined with the positioning plate and covers the positioning plate. | 10-03-2013 |
| 20130258607 | HIGH VOLTAGE MODULE WITH CIRCUIT BREAKER FOR MOTOR VEHICLES - The invention relates to a high voltage module for motor vehicles. The high voltage module includes the a manually operated circuit breaker in a module housing which is disposed in a socket of the module housing. By removing the circuit breaker from the socket, at least one high voltage cable within the module housing is interrupted. A manually operated tool with a plug-type housing adapted to the socket includes a pivotable cover. The pivotable cover can assume an opened and a closed position. The tool includes at least one measuring lead which is connected to the at least one high voltage cable and a measuring terminal in the plug-type housing. | 10-03-2013 |
| 20130271923 | ELECTRICAL APPARATUS - Electrical apparatus comprises: a housing; an electrical circuit in the housing comprising a circuit component; a metallic component in the housing, for dissipating heat generated in the circuit component; and a thermally conductive body arranged between a surface of the circuit component and a surface of the metallic component. The housing comprises a first housing portion and a second housing portion, the second housing portion being adapted to locate on the first housing portion in a closed position in which the electrical circuit, metallic component, and body are enclosed within the housing, the second housing portion being adapted such that, when in the closed position, the second housing portion urges the surface of the circuit component towards the surface of the metallic component such that the body is in contact with both of these surfaces to assist transfer of heat generated in the circuit component to the metallic component. | 10-17-2013 |
| 20130271924 | SYSTEM IN PACKAGE ASSEMBLY - A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board | 10-17-2013 |
| 20130286601 | PORTABLE TERMINAL WITH CRACK PREVENTION STRUCTURE FOR DISPLAY DEVICE - A portable terminal includes a display module and a case member coupled to the display module. A face of the case member is formed to have a center portion and an edge, which are different from each other in their heights to thereby support a center portion of the display module in lengthwise and widthwise directions of the display module respectively. The portable terminal configured above supports a rear face of the flat display module using at least one of a portion protruded from the case member and a stiff material film, to thereby diffuse an impact exerted on a display device to the case member. Thus, it is possible to relieve the damage to the flat display device due to an external impact. | 10-31-2013 |
| 20130294034 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE - A method of manufacturing an electronic component module includes sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with a sealing resin and cutting boundary portions between electronic component modules from an outer surface of the sealing resin to a position at least partially through the aggregate substrate to form first grooves. A shield layer is formed by coating the outer surface of the sealing resin with a conductive resin and filling the first grooves with the conductive resin, and recesses are formed at positions on the shield layer where the first grooves are formed. The boundary portions between electronic component modules are cut along the corresponding recesses so that second grooves each having a width smaller than the width of a corresponding one of the recesses are formed, and the aggregate substrate is singulated into the individual electronic component modules. | 11-07-2013 |
| 20130301224 | INTELLIGENT WALL-MOUNTED SWITCH MODULE - An intelligent wall-mounted switch module is provided so that plural electric appliances can be turned on or off mechanically with a single switching element through touch-based selection. The switch module includes a switching element mounted on a wall. The switching element has a control unit electrically connected to the electric appliances and a display for displaying, under control of the control unit, plural identification images whereby the electric appliances or the space or spaces where they are located can be identified. A touch panel is provided on a surface of the display. A user may slide a finger along the touch panel, thus instructing the control unit to switch the identification images displayed by the display. Then, the switching element can be switched so as for the control unit to turn on or off the electric appliance corresponding to the identification image displayed. The switch module features enhanced durability. | 11-14-2013 |
| 20130314879 | CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY (HDA) POWER MODULE, AND METHOD OF MAKING SAME - A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components. | 11-28-2013 |
| 20130322025 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor module according to one embodiment includes a semiconductor chip, a wiring substrate, a mounting plate provided with the wiring substrate thereon, a frame body defining a case for the wiring substrate, together with the mounting plate, a bus bar extending from the case and being inserted into a side wall of the frame. The side wall has a projection. The bus bar includes a first region in the side wall, a second region extending from a first end of the first region outward from the frame, a third region extending from a second end of the first region into the frame. The third region is bent based on the shape being close to the wiring substrate of the projection. The mounting plate with the wiring substrate is attached to the frame such that the third region is in press-contact with the wiring pattern. | 12-05-2013 |
| 20130322026 | ELECTRONIC DEVICE - An electronic device of the invention includes a base and a touch-vibration module. The base has an opening. The touch-vibration module includes a supporting bracket, a mass balancing element, a vibrating unit and a touch unit. The supporting bracket is connected to the base at the opening of the base. The mass balancing element is disposed at the supporting bracket. The vibrating unit is disposed at the supporting bracket. The touch unit is disposed at the supporting bracket and the vibrating unit is located between the supporting bracket and the touch unit. | 12-05-2013 |
| 20130329373 | BIO-IMPLANTABLE HERMETIC INTEGRATED ULTRA HIGH DENSITY DEVICE - An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact. | 12-12-2013 |
| 20130329374 | Pre-molded Cavity 3D Packaging Module with Layout - A pre-molded cavity 3D packaging module with layout is disclosed. The 3D packaging module includes a pre-molded cavity. A wall and a vertical plane of the pre-molded cavity form an inclined angle of more than 3°. An intersecting region between a bottom and a sidewall of the 3D packaging module has a curved profile to facilitate smooth circuit layout. | 12-12-2013 |
| 20130329375 | SUPPORTING MECHANISM FOR SUPPORTING A DISPLAY MODULE ON A BASE AND PORTABLE ELECTRONIC DEVICE THEREWITH - A supporting mechanism for supporting a display module on a base includes a stand and a buckling structure. An end of the stand is pivoted to the base, and the buckling structure is pivoted to the other end of the stand and for buckling the display module. The buckling structure includes a housing, at least one buckling component and at least one resilient component. The housing is pivoted to the other end of the stand. The at least one buckling component is movably installed in the housing. The at least one resilient component is installed inside the housing and connected to the at least one buckling component. The at least one resilient component drives the at least one buckling component to buckle a fastening portion of the display module as the housing and the at least one buckling component are inserted into a containing portion on the display module. | 12-12-2013 |
| 20130329376 | ELECTRONIC MODULES - Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. | 12-12-2013 |
| 20130343006 | ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINES BY MEANS OF GENERATING A VACUUM - The invention relates to an electrical module ( | 12-26-2013 |
| 20140003000 | BIPOLAR TRANSISTOR ON HIGH-RESISTIVITY SUBSTRATE | 01-02-2014 |
| 20140003001 | POWER SUPPLY AND CIRCUIT MODULE FOR DATA PROCESSING SYSTEM | 01-02-2014 |
| 20140003002 | Semiconductor Device | 01-02-2014 |
| 20140016276 | CONTROL DEVICE FOR EXECUTING OPEN MODE OF MOTION MODULE OF ELECTRIC APPARATUS - The invention relates to a control device for executing an open mode of a motion module of an electric apparatus. The electric apparatus includes a motion module and a machine body module. The control device disposed on a path of the relative movement includes a combination of a carrier and an elastomer, in which the carrier has a blocking portion. The elastomer normally keeps the carrier at a first position, and the elastomer allows the carrier to motion toward a second position when the carrier is pressed. The control device allows the motion module to rotate (in an open mode) when the motion module crosses the blocking portion of the carrier. Accordingly, the invention promotes visual artistic effects by eliminating the essential exposure of the rotary shaft in the rotation-open mode of conventional skills. | 01-16-2014 |
| 20140016277 | RACETRACK DESIGN IN RADIO FREQUENCY SHIELDING APPLICATIONS - Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area. | 01-16-2014 |
| 20140016278 | CONDUCTIVE STRUCTURE, TOUCH PANEL, AND METHOD FOR MANUFACTURING SAME - Provided are a conductive structure including a) a base. b) a conductive pattern provided on at least one side of the base. and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof. | 01-16-2014 |
| 20140022734 | OPTICAL MODULE - An optical module includes: an optical receiving module | 01-23-2014 |
| 20140022735 | THREE-DIMENSIONAL CIRCUIT COMPONENT, METHOD OF MAKING THE SAME, AND PHYSICAL-QUANTITY MEASURING INSTRUMENT - For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed. | 01-23-2014 |
| 20140022736 | IC PACKAGE AND ASSEMBLY - Aspects of the disclosure provide a circuit that includes a printed circuit board (PCB) substrate formed with an opening portion that is dimensioned to accommodate an integrated circuit (IC) package. When the IC package is disposed in the opening portion and is electrically coupled to the PCB substrate for PCB assembling, a thickness of the assembled PCB is less than a thickness sum of the IC package and the PCB substrate. | 01-23-2014 |
| 20140029205 | Band Pass Filter for 2.5D/3D Integrated Circuit Applications - The present disclosure relates to a device and method for a band pass filter with a reduced cost, area penalty, and manufacturing complexity relative to current solutions. An integrated passive device chip comprising a plurality of capacitors embedded in a common molding compound along with a transceiver chip, and arranged within a polymer package. Ultra-thick metallization layers are disposed within the polymer package and configured to couple the integrated passive device chip to the transceiver chip. The ultra-thick metallization layers also form a plurality of transmission lines, wherein the combined integrated passive device chip and transmission lines form a band pass filter with improved frequency response, noise immunity, and cost and area penalty as compared to conventional solutions. The band pass filter may also be coupled to a plurality of solder balls comprising a Flip Chip Ball Grid Array suitable for 2.5D and 3D integrated circuit applications. | 01-30-2014 |
| 20140029206 | EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device. | 01-30-2014 |
| 20140029207 | CONTROL AND DISPLAY MODULE FOR MOTOR VEHICLES - The invention relates to a control and display module for motor vehicles, comprising: a display screen for displaying data; a touchpad for entering user commands, said touchpad at least partially overlapping the display screen; and a casing in which the display screen and the touchpad are housed, said casing comprising a front frame. The module is characterised in that: the casing includes an internal rim protruding between the display screen and the touchpad, which rim maintains the display screen in position in the casing; and the control and display module also comprises a seal including a first portion inserted between the internal rim of the casing and the display screen and a second portion extending beyond the internal rim towards the centre of the display screen. | 01-30-2014 |
| 20140029208 | COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING COMPONENT-CONTAINING MODULE - The present invention pertains to a component-containing module that is: provided with a substrate configured from flat sections and a projecting section, and electronic components mounted on the flat sections and the projecting section; and characterized in that the electronic components mounted on the flat sections are sealed in resin, and the electronic component mounted on the projecting section has an upper part thereof exposed above the resin surface. | 01-30-2014 |
| 20140036453 | POWER ELECTRONIC DEVICE AND AN ALIGNMENT DEVICE FOR THE POWER MODULE - An alignment device for a power module of a power electronic device is provided, which may be used for aligning the power module while the power module being plugging to or from a rear mounting part of a cabinet of the power electronic device. The rear mounting part is disposed at an inner side of a back plate of the cabinet, the alignment device comprises a first connector disposed on the power module; guide rail units disposed on inner sides of a left side plate and a right side plate of the cabinet; a second connector disposed on the rear mounting part; and a guide device for limiting an offset of the power module moving along the guide rail unit. | 02-06-2014 |
| 20140043770 | ELECTRONIC DEVICE AND ELECTRONIC MODULE FIXING STRUCTURE THEREOF - An electronic device includes an electronic module and an electronic module fixing structure that includes a main body, a position-limiting component slideably disposed on the main body along a first direction, at least one positioning component slideably disposed on the main body along a second direction, and at least one first elastic component. The position-limiting component has a position-limiting portion. The first elastic component is connected between the main body and the positioning component. The position-limiting component resists an elastic force of the first elastic component to limit the positioning component to be at a first position. When the electronic module moves into the main body, the electronic module pushes the position-limiting component to drive the position-limiting portion to move away from the positioning component, and the positioning component moves to a second position by the elastic force of the first elastic component to position the electronic module. | 02-13-2014 |
| 20140043771 | DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction. | 02-13-2014 |
| 20140043772 | DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part. | 02-13-2014 |
| 20140043773 | LED DISPLAY SCREEN CASE - An LED display screen case includes a module, a HUB plate, a case frame, a power supply and a receiving card. One side of the HUB plate is connected with the module by a plug A and an interface A in a plugging mode. The other side of the HUB plate is connected with the receiving card by a plug B and an interface B in the plugging mode. A through hole is formed at a position corresponding to the plug B on the case frame. The plug B passes through the through hole. The receiving card and the HUB plate are connected by the plug B and the interface B in the plugging mode and fixed to the two sides of the case frame. This kind of connection type reduces the space inside the case for accommodating devices, and also ensures the good radiating effect of the case. | 02-13-2014 |
| 20140049921 | FASTENING STURCTURE AND DISLAY MODULE USING THE SAME - A fastening structure includes a first main body, a second main body, a first fixing member protruding from the first main body, and a second fixing member protruding from the second main body. The first fixing member includes a first clamping element and a second clamping element. The second fixing member includes a first positioning element and a second positioning element. The first positioning element is limited by the first clamping element to prevent the first main body from moving with respect to the second main body in first directions, the second positioning element is limited by the second clamping element to prevent the first main body from moving with respect to the second main body in second directions cooperating with the first the directions to contain all directions in the reference plane. | 02-20-2014 |
| 20140049922 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE - A method of manufacturing an electronic component module and the electronic component module manufactured by the manufacturing method includes bumps, each including a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness and formed on one surface of the substrate. When looking at the electronic component in a mounted state in a plan view, the thicker portion is positioned on a side of a corresponding outer terminal closer to a center of the electronic component and the thinner portion is positioned on the opposite side of the corresponding outer terminal. In the plan view, joining portions joining the outer terminals respectively to the bumps are formed such that a height of each joining portion on the opposite side is lower than a height of the joining portion on the side closer to the center of the electronic component. | 02-20-2014 |
| 20140055958 | 3D TOUCH MODULE AND ITS METHODE OF MANUFACTURING - A 3 dimensional touch module of the present invention including: a base plate protruding outwards, an adhesive layer on the base plate, an induction thin film fixed on the base plate by means of the adhesive layer and a substrate layer combined with the induction thin film by a mode of injection shaping. The method of manufacturing mainly has the base integrally press shaped after being stuck firm with each other to form a protruding shape, this can not only provide a feeling of 3 dimensional touching, but also can simplify the process of manufacturing. | 02-27-2014 |
| 20140055959 | RACK MODULE - A module for mounting in a rack, the module including a frame and a tray, the frame being arranged such that it may be mounted to the rack, and the tray being slidably and pivotably connected to the frame, such that the tray may be moved between a first position, in which the tray is received within the frame and lies substantially parallel to the frame, and a second position, in which the tray lies outside the frame and at an angle to the frame. | 02-27-2014 |
| 20140063750 | HINGE, SUPPORTING MODULE HAVING THE HINGE, AND DISPLAY DEVICE HAVING THE SUPPORTING MODULE - A hinge for pivotally interconnecting first and second brackets includes a shaft having a shaft body extending through the first and second brackets and formed with an engaging end portion proximate to the second bracket, a fixing member connected to the engaging end portion, a ratchet sleeved rotatably on the shaft body between the fixing member and the second bracket, a friction mechanism having an urging unit sleeved on the shaft body between the ratchet and the fixing member and pressing the ratchet toward the second bracket, and a brake mechanism disposed on the second bracket and having a pawl member releasably engaged to the ratchet. | 03-06-2014 |
| 20140063751 | CIRCUIT MODULE - A circuit module includes a circuit board and electronic components mounted on the circuit board. The mounted electronic components include at least one discrimination-target electronic component and at least one module-discrimination electronic component. In addition, the circuit board includes land electrodes allowing the module-discrimination electronic component to be mounted at different positions and/or orientations with respect to the circuit board, and the module-discrimination electronic component is mounted at any one position and/or orientation among different positions and/or orientations with respect to the circuit board in accordance with the type of the discrimination-target electronic component. | 03-06-2014 |
| 20140063752 | SYSTEM AND METHOD OF POWER CONTROL FOR A HIGH-AVAILABILITY SYSTEM - Maintenance of reliable and highly available electronic systems to perform servicing and preventive maintenance may need to be performed without interruption of operations. Removal of circuit cards from a chassis may render the connectors on a chassis vulnerable to inadvertent short circuiting of power sources by stray metallic objects. A configuration where the power is removed from a connector as the circuit card is being extracted eliminates his possibility. The control circuits for the power supply connections and the power supplies are themselves redundant so that they may be similarly serviced. | 03-06-2014 |
| 20140071632 | SEMICONDUCTOR DEVICE, COMMUNICATION DEVICE, AND SEMICONDUCTOR PACKAGE - A semiconductor device includes a plate shaped semiconductor package substrate, a semiconductor chip mounted on the semiconductor package substrate, a plurality of electrodes formed on a lower surface of the semiconductor package substrate, the plurality of electrodes being electrically connected to a mother board; and a connector formed at an end of the semiconductor package substrate. The connector includes a plurality of terminals to be electrically connected to a plurality of spring terminals of a mating connector which is mated in a parallel direction to the semiconductor package substrate. | 03-13-2014 |
| 20140078683 | High Frequency High Isolation Multichip Module Hybrid Package - In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover. | 03-20-2014 |
| 20140078684 | POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate. | 03-20-2014 |
| 20140085833 | CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME - A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer. | 03-27-2014 |
| 20140111947 | Control Device With a Getter Layer For Use in a Motor Vehicle - A control device for a motor vehicle includes a housing having a housing cover and a housing base, a sealing device between the housing cover and the housing base, at least one circuit carrier having electrically conductive tracks, and at least one electronic component disposed on the circuit carrier. The control device further includes at least one conductor structure extending out of the interior of the housing, and at least one electrically conductive connecting line which connects the electronic component to the conductor structure. A getter layer is thermally sprayed on the inner face of the housing to protect the metal parts, which transmit current or data in the interior of the control device, against corrosive gases. The getter layer has a high specific surface area. | 04-24-2014 |
| 20140118955 | Display Device - The present invention provides a display device which is configured with a front cover, a rear cover, and a display module and flexible printed circuit sandwiched between the front and rear covers, wherein the display device further includes an elastic member arranged between a bottom surface of the front cover and the flexible printed circuit. A bending or folding contour of the flexible printed circuit can be readily controlled so as to prevent the flexible printed circuit from being damaged resulted from bending and folding. In addition, the display device made in accordance with the present invention featured a lowered manufacturing cost. | 05-01-2014 |
| 20140118956 | ALL-IN-ONE POWER SEMICONDUCTOR MODULE - Disclosed herein is an all-in-one power semiconductor module including a plurality of first semiconductor devices formed on a substrate; a housing molded and formed to include bridges formed across upper portions of the plurality of first semiconductor devices; and a plurality of lead members integrally formed with the housing and electrically connecting the plurality of first semiconductor devices and the substrate. | 05-01-2014 |
| 20140118957 | STAND ALONE INPUT/OUTPUT MODULE COMMONLY USABLE TO RECORDER AND DATA LOGGER - An input/output module is commonly usable to a recorder and a data logger. The input/output module includes an input/output unit and a power unit. The input/output unit is configured to achieve at least one of a function of acquiring a measurement signal from a measurement target and a function of outputting data. The power unit is configured to supply an operation voltage to the input/output unit The power unit includes an insulated power device. The power unit is configured to use a voltage, which has been converted by the insulated power device from a power supply voltage, as an operation voltage when the input/output module is connected with a base of the data logger and the power unit receives a power voltage supply via the base. The power unit is configured to use a power supply voltage as the operation voltage, when the input/output module is connected with the recorder and the power unit receives the power voltage supply from the recorder. | 05-01-2014 |
| 20140118958 | INPUT/OUTPUT MODULE - An input/output module is configured to achieve at least one of a function of acquiring a measurement signal from a measurement target and a function of outputting data. The input/output module includes a casing, a rotational connector disposed on the casing, the rotational connector including an arc-shaped notch, the rotational connector being configured to interlock with a connection mechanism of a base to serve as a rotation point so that the input/output module is rotatable to get connected to the base and a latch-shaped fixer configured to fit into a groove formed in at least one of an upper inner surface and a lower inner surface when the input/output module is pushed into a slot having the upper inner surface and the lower inner surface to get connected. | 05-01-2014 |
| 20140118959 | CHIP-HOUSING MODULE AND A METHOD FOR FORMING A CHIP-HOUSING MODULE - A chip-housing module is provided, the chip-housing module including a carrier configured to carry one or more chips; the carrier including a first plurality of openings, wherein each opening of the first plurality of openings is separated by a first pre-determined distance, and is configured to receive a chip connection for providing a voltage lying within a first range of voltage values to a chip; the carrier including a second plurality of openings, wherein each opening of the second plurality of openings is separated by a second pre-determined distance, and is configured to receive a chip connection for providing a voltage lying within a second range of voltage values to a chip; and wherein a pair of openings consisting of one opening of the first plurality of openings and one opening of the second plurality of openings is separated by a distance different from at least one of the first pre-determined distance and the second pre-determined distance. | 05-01-2014 |
| 20140126157 | ELECTRONIC CIRCUIT MODULE AND METHOD FOR PRODUCING THE SAME - An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface. | 05-08-2014 |
| 20140140012 | MODULE STRUCTURE - Disclosed is a module structure including a front sheet, a back sheet, and an optotronic device disposed between the front sheet and the back sheet. A first encapsulate layer is disposed between the optotronic device and the front sheet. A second encapsulate layer is disposed between the optotronic device and the back sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the second encapsulate layer and the polyolefin layer. | 05-22-2014 |
| 20140140013 | ELECTRONIC DEVICE WITH POWER SUPPLY CONTROL MODULE - An electronic device includes a bottom plate, an installation board, a circuit board, a battery, and a power supply control module. The power supply control module includes a control member and an activating member, and the activating member is pressed against the control member when the electronic device is assembled. So long as the control member remains pressed by the activating member, a flow of electrical power from the battery to the circuit board is permitted. When the electronic device is disassembled, the disassembly moves the activating member away from the activating member and cuts off the power from the battery to the circuit board, to avoid electrical short circuits or other damage that might otherwise occur if the flow of electrical power was maintained during disassembly. | 05-22-2014 |
| 20140146484 | ELECTROMAGNETIC FIXING MECHANISM FOR PREVENTING TOUCH DISPLAY MODULE FROM PIVOTING RELATIVE TO HOST MODULE AND ELECTRONIC DEVICE THEREWITH - An electromagnetic fixing mechanism includes a mounted component, a rotating component, a locating module, a fixing module, an electromagnetic component and a control unit. The locating module is for locating the rotating component on at least one fixing position while the rotating component pivots relative to the mounted component. The fixing module is installed on an end of the mounted component and used for fixing the rotating component while the rotating component is located on the at least one fixing position. The electromagnetic component is installed on the mounted component. The control unit is electrically connected to a touch display module and the electromagnetic component. The control unit is used for controlling the electromagnetic component to provide a magnetic attraction force to attract the fixing module for fixing the rotating component while the touch display module is activated. | 05-29-2014 |
| 20140153194 | MEMORY MODULE SOCKET WITH TERMINATING APPARATUS - A memory module socket and a terminating resistor assembly. The terminating resistor assembly provides an elongate conductive bus bar and a plurality of conductive branches, wherein each conductive branch is in electronic communication with the elongate conductive bus bar through a resistor, wherein each conductive branch has a distal end disposed for contacting a signal pin within a memory module socket installed on a printed circuit board. A distal end of each conductive branch is inserted into a window on the connector shoulder adjacent to the slot of an empty memory module socket and engages a plurality of signal pins within the socket in response to the absence of a memory module in the slot. The plurality of signal pins engage contact pads on the memory module and are pushed out of contact with the conductive branch in response to the presence of a memory module in the slot. | 06-05-2014 |
| 20140153195 | COMMUNICATION MODULE - A communication module includes a housing member, an electronic module, and a slidable mechanism. The housing member includes at least one fastening and releasing region, which is disposed on an external surface thereof. The fastening and releasing region has a first slant. The electronic module is partially disposed within the housing member. The slidable mechanism includes at least one extension arm with a second slant. The extension arm is accommodated within the corresponding fastening and releasing region. The second slant is aligned with the first slant, and a slope of the second slant is larger than a slope of the first slant. | 06-05-2014 |
| 20140153196 | MOUNTING STRUCTURE OF CHIP COMPONENT AND ELECTRONIC MODULE USING THE SAME - An electronic module is provided with a circuit board | 06-05-2014 |
| 20140160688 | Methods and Apparatus for Package with Interposers - Methods and apparatus for an interposer with a dam used in packaging dies are disclosed. An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within the area. A dam may comprise a conductive material, or a non-conductive material, or both. An underfill may be formed under the die, above the metal layer, and contained within the area surrounded by the dam, so that no underfill may overflow outside the area surrounded by the dam. Additional package may be placed above the die connected to the interposer to form a package-on-package structure. | 06-12-2014 |
| 20140160689 | PACKAGE - A package includes a ground plate, a chip mounting plate disposed at a side of the ground plate and having a top surface lower than a top surface of the ground plate, a chip on the chip mounting plate, a first input/output terminal opposite to the chip mounting plate and disposed at another side of the ground plate, and a second input/output terminal opposite to the ground plate and disposed at a side of the chip mounting plate. The first and second input/output terminals are electrically connected to the chip. | 06-12-2014 |
| 20140160690 | DISPLAY WITH IMPROVED BENDABLE COVER HAVING LIGHT TRANSMISSIVE AREA - A display is provided. The display includes a frame, a display module, and a bendable cover. The frame includes a bottom surface and a lateral surface, the display module is disposed on the frame, and the bendable cover has a surface layer and an adhesive layer, the adhesive layer is located on the surface layer, a part of the surface layer is adhered to the display module through the adhesive layer, another part of the surface layer is attached to the lateral surface of the frame and adhered to the bottom surface of the frame through the adhesive layer. | 06-12-2014 |
| 20140168905 | ELECTRIC BOX WITH WIRE PROTECTION MECHANISM - The electric box includes a box body, a control assembly and a protection structure. The box body has a chamber. The control assembly is received in the chamber. The protection structure includes a protector and at least one passing hole located on a side of the box body and communicating with the chamber. The protector is received in the chamber and located on a side of the control assembly. The protector is provided with at least one through hole corresponding to the at least one passing hole. The passing hole and through hole are used for being passed by a wire. | 06-19-2014 |
| 20140168906 | PLUGGABLE DATA COMMUNICATION MODULE WITH COMPLIANT PUSH-PULL TAB - A data communication module tab is sufficiently compliant in off-axis directions that it resists damage from forces in such off-axis directions, yet is sufficiently rigid in the direction of its longitudinal axis that a person can insert the data communication module into a cage and withdraw it from a cage by pushing and pulling the tab, respectively. | 06-19-2014 |
| 20140185247 | LATCH TO POSITION AND BIAS A MODULE WITHIN A CHASSIS - A system includes a module having a connector at a leading end and a handle pivotally coupled to a trailing end. The handle pivots between open and closed positions, and includes landing and grip portions. The system further includes a chassis having a bay, a connector disposed in the bay, and a spring latch assembly adjacent an open end of the bay for receiving the leading end of the module. The spring latch has a catch adjacent to a spring element. Receiving the leading end of the module into the bay aligns the module connector with the connector in the bay and aligns the landing of the handle with the catch of the spring latch assembly. Pivoting the handle from the open position to the closed position will then cause the landing of the handle to engage the catch and then load the spring element to couple the connectors. | 07-03-2014 |
| 20140185248 | MODULE BOARD - To provide a module board capable of suppressing depression of a top face of insulating resin near the center of a substrate by arranging multiple columnar connection terminals not only on a peripheral area of the substrate but also between multiple electronic components that are mounted. Multiple electronic components | 07-03-2014 |
| 20140198458 | MULTIPLE CABLE STRAIN RELIEF - A multiple cable strain relief and electronic assembly having such multiple cable strain relief includes a body, a plurality of cable cutouts and a compression member. The body has at least two spaced apart sidewalls thereby defining a cavity between the sidewalls. The plurality of cable cutouts are in each of the sidewalls. Each cable cutout in one of the sidewalls is aligned with a cable cutout in the other of sidewalls thereby defining a cable cutout pair. The compression member has a retention position that is at least partially extending into the cavity. With the compression member in the retention position a cable extending though a cable cutout pair is deflected in the cavity to retain that cable between the sidewalls and the compression member. | 07-17-2014 |
| 20140211423 | ELECTRONIC MODULE SHELF ASSEMBLY AND METHODS - An electronics chassis comprises an electronics module residing in the chassis and fronted by a multi-piece faceplate system. The multi-piece faceplate system includes a faceplate and a faceplate assembly. The faceplate assembly includes an ejection lever pivotally coupled to the electronics module. The ejection lever includes an ejection latch coupled to the faceplate assembly. The ejection latch is configured to facilitate retention of the electronics module within the chassis when said faceplate assembly is in a closed position. The ejection latch is further configured to facilitate ejection of the electronics module from the chassis when the faceplate assembly is in an open position. | 07-31-2014 |
| 20140211424 | HINGED CONNECTOR AND MODULAR VIDEO DISPLAY ASSEMBLY CONTAINING SAME - Disclosed are a hinged connector and a video display assembly containing an attachment panel having a front surface and a back surface, with a video display attached to the front surface and at least one hinged connector attached to the back surface. | 07-31-2014 |
| 20140233190 | ELECTRONIC MODULE - An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is inside of a region in which one built-in electronic component is built in and a center of gravity of the electronic module is located inside of the suckable region. A protective layer is not provided on the front surface of the substrate on which the surface mount electronic component is mounted. | 08-21-2014 |
| 20140247565 | MODULE, ELECTRONIC APPARATUS AND MOVING OBJECT - A module includes an insulating substrate that is a first base material; a cover member having a cavity section and a second recess section that form an internal space between the cover member and the insulating substrate, which is a second base material bonded to the insulating substrate on a first surface thereof; an element piece that is a first functional element, accommodated in the internal space; a recess section formed on a second surface that is a rear surface of the first surface of the cover member; and a semiconductor device that is a second functional element, connected in the recess section. | 09-04-2014 |
| 20140254107 | Electronic module with embedded jumper conductor - The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation. | 09-11-2014 |
| 20140268583 | Electrical Gasket and Electronic Module Having Electrical Gasket - An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment portion for fixedly attaching the electrical gasket to one of the first and second components and a plurality of spring members for engaging the other of the first and second components to make mechanical and electrical contact between the first and second components such that the electrical seal is provided between the first and second electrical components. One of the components of the module can be an EMI shield or printed circuit board of the module, and another of the components can be the module housing. | 09-18-2014 |
| 20140268584 | DISPLAY APPARATUS - A display apparatus includes a display module for displaying an image, and a variable member for varying a shape of the display module. The variable member includes a first portion capable of varying in shape, and a second portion having opposite ends respectively fixed to opposite ends of the first portion, where a distance between the opposite ends of the second portion is varied such that the opposite ends of the first portion protrudes with respect to a central region of the first portion and thereby, the display module is varied in shape. | 09-18-2014 |
| 20140268585 | ELECTRONIC MODULE AND ELECTRONIC DEVICE - An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided. | 09-18-2014 |
| 20140268586 | SEMICONDUCTOR PACKAGE AND PRINTED CIRCUIT BOARD - A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is arranged while being separated from the conductor pattern, and a conductor pattern which is formed so as to have a wiring width thinner than that of the conductor pattern and connects the conductor pattern with the conductor pattern. The substrate also comprises a conductor pattern which is formed in an inner layer, faces the conductor pattern through a dielectric and is electrically connected to the other terminal out of the power terminal and the ground terminal of the semiconductor element. | 09-18-2014 |
| 20140268587 | MODULE AND METHOD OF MANUFACTURING THE SAME - An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component. | 09-18-2014 |
| 20140268588 | PORTABLE TERMINAL AND METHOD OF MANUFACTURING A MODULE THEREOF - A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can. The portable terminal also includes at least one socket unit mounted to an upper side of the first assembly. The socket unit is mounted to an upper side of the flexible circuit board while the first assembly is positioned on a jig. | 09-18-2014 |
| 20140285975 | SOLAR PANEL JUNCTION BOX CAPABLE OF INTEGRATINGWITH A VARIETY OF ACCESSORY MODULES, AND METHOD OF USE - A junction box is affixed to, and electrically coupled with, a solar panel. The junction box is configured to releaseably engage and disengage accessory modules, thereby allowing accessory modules to be replaced or exchanged easily. Accessory modules are electrically coupled with other accessory modules in the solar panel string. The furthest downstream accessory module is connected to a wire harness, which is connected to a central combiner box. | 09-25-2014 |
| 20140293550 | CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR - A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion. | 10-02-2014 |
| 20140293551 | ELECTRONIC DEVICE, QUANTUM INTERFERENCE DEVICE, ATOMIC OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - An atomic oscillator includes a first unit and a second unit arranged to be separated from each other and a package including an internal space in which the first unit and the second unit are housed in a state in which the internal space is decompressed to pressure lower than the atmospheric pressure. The reflectance of the outer surfaces of the first unit and the second unit to an electromagnetic wave having a wavelength of 4 μm is equal to or higher than 50%. | 10-02-2014 |
| 20140293552 | Power Semiconductor Module and Method of Manufacturing a Power Semiconductor - A power semiconductor module, and method for its manufacture, comprising a first housing part having a cutout and a DC voltage load connection apparatus forming a structural unit, wherein the DC voltage load connection apparatus has first and second DC voltage load connection elements. The first DC voltage load connection element has a first leadthrough section arranged in the cutout, and the second DC voltage load connection element has a second leadthrough section arranged in the cutout forming a gap therebetween. The first and second leadthrough sections are sheathed by an elastomer, which fills the gap, is cohesively connected to the first and second leadthrough sections and seals off the first and second leadthrough sections with respect to the first housing part. The inventive power semiconductor module exhibits a high resistance to thermal cycling, and the distance between the DC voltage load connection elements can be configured to be small. | 10-02-2014 |
| 20140301043 | COVER STRUCTURE FOR ELECTRONIC CIRCUIT MODULE - A cover structure for an electronic circuit module includes a circuit board and a box-shaped cover integrated to each other. An electronic component is mounted on the circuit board. The cover has at least one open side. The cover includes a top plate and a mounting leg. The top plate is disposed so as to oppose the circuit board. The mounting leg is joined to the circuit board. The mounting leg is bent and extends from an outer periphery of the top plate. The top plate includes a bend portion and a cutaway portion. The bend portion is connected to the mounting leg. The cutaway portion is provided near the bend portion. | 10-09-2014 |
| 20140307394 | APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES - Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection. | 10-16-2014 |
| 20140321066 | MEMORY CONNECTION STRUCTURE OF STORAGE DEVICE - A memory connection structure of a storage device is disclosed. The storage device includes a circuit board, a memory controller, a bus, and a memory module. The memory controller, the bus, and the memory module are electrically connected on the circuit board. The memory module is composed of a plurality of memory sockets and a plurality of volatile memories. The volatile memories are connected to the same bus via the corresponding memory sockets and connected to the memory controller via the bus. The bus has at least one connection point and each connection point is connected to two memory sockets. The circuit board has a front surface and a rear surface, and two memory sockets connected to the same connection point are correspondingly installed on each of the two surfaces of the circuit board. In addition, two distances between the each memory socket and the memory controller are identical. | 10-30-2014 |
| 20140321067 | APPARATUS AND METHODS FOR POWERING MOTOR CONTROL CENTERS USING BACKFEED MODULES - A power backfeed apparatus includes a housing configured be removably positioned in a compartment of a motor control center (MCC), a contact assembly supported by the housing and comprising at least one contact configured to face a corresponding at least one power conductor of the MCC when the housing is disposed in the compartment and a power cable connector supported by the housing and configured to support connection of an external power cable thereto when the housing is disposed in the compartment, the power cable connector configured to be electrically coupled to the at least one contact of the contact assembly. A contact engagement mechanism forces the at least one contact into contact with the at least one power conductor to electrically couple the at least one contact and the at least one power conductor. | 10-30-2014 |
| 20140321068 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a first case, module accommodated in the first case, a first cushion between the first case and the module, and a holding member to hold the module with respect to the first case movably. | 10-30-2014 |
| 20140321069 | HIGH-FREQUENCY MODULE - A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding. | 10-30-2014 |
| 20140328027 | Coil with Variable Inner Diameter and Electronic Module made from the Coil - A coil with variable inner diameter is disclosed. The coil includes a coil body consisting of a plurality of turns of winding, and a connecting terminal configured to be connected to an external device, wherein the winding is wound to form at least two different inner diameters. And an electronic module made from the coil with variable inner diameter is also disclosed. The electronic module includes; electronic components including at least an integrated circuit chip; a coil with variable inner diameter, including a coil body having at least two different inner diameters and a connecting terminal; a connector, configured to be electrically connected with the electronic component and the coil; and a magnetic conductor, configured to enclose in and around the coil body and the electronic component. | 11-06-2014 |
| 20140334108 | SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE MODULE - A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns. | 11-13-2014 |
| 20140334109 | Electronic Component Module and Method of Manufacturing the Same - An electronic component module includes a wiring board on which at least one electronic component is mounted, an outer layer portion that is made of prepreg and covers the wiring board so that all of the at least one mounted electronic component is not exposed, and a terminal portion that is exposed from the outer layer portion to the outside and is configured to electrically connected to a mating connection member. | 11-13-2014 |
| 20140355218 | Panel-Molded Electronic Assemblies - A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. | 12-04-2014 |
| 20140362540 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out for inserting the electrode terminal; and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out. The guide member becomes out of contact with the electrode terminal after the electrode terminal is inserted into the through hole or the cut-out. | 12-11-2014 |
| 20140376192 | PROTECTING COVER FOR ELECTRONIC DEVICE - A protecting cover for an electronic device is provided, the protecting cover including a front cover portion positioned on a front surface of the electronic device, a back cover portion connected with the front cover portion and positioned on a back surface of the electronic device, an auxiliary display unit provided on the front cover portion, and a module configured to control transmission and reception of data and power supply depending on opening and closing of the front cover portion. | 12-25-2014 |
| 20150009632 | DISPLAY DEVICE - A display device includes: a display module; a window disposed on the display module; and an adhesive layer disposed between the display module and the window, where the adhesive layer includes a pressure sensitive adhesive including an impregnation region impregnated with a fiber, and a density of the fiber in the adhesive layer is predetermined based on a position thereof in the impregnation region or a part of the display device corresponding thereto. | 01-08-2015 |
| 20150016066 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first surface and a second surface, the first surface being opposite to the mount surface and having a first sealing area and a second sealing area, the second sealing area projecting from the first sealing area to an opposite side of the mount surface, the second surface being connected to the mount surface and the first surface. The conductive shield covers at least the second surface and the first sealing area of the first surface. | 01-15-2015 |
| 20150029677 | MULTILAYER WIRING SUBSTRATE, METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR PRODUCT - There is provided a multilayer wiring substrate, including: a trench produced at one surface of an insulation layer, the trench having a depth shallower than a thickness of the insulation layer; and a copper plating applied to the trench. Also, there are provided a method of producing the multilayer wiring substrate, and a semiconductor product including the multilayer wiring substrate. | 01-29-2015 |
| 20150036296 | EMI COMPARTMENT SHIELDING STRUCTURE AND FABRICATING METHOD THEREOF - A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member. A conformal shield is disposed on the encapsulating member, electrically connecting the compartment structure through the notch. | 02-05-2015 |
| 20150043169 | Electronic module and method of manufacturing the same - According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures. | 02-12-2015 |
| 20150043170 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench. | 02-12-2015 |
| 20150043171 | CIRCUIT MODULE - There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section. | 02-12-2015 |
| 20150043172 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section. | 02-12-2015 |
| 20150049439 | CIRCUIT MODULE - A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield. | 02-19-2015 |
| 20150055304 | ELECTRONIC DEVICE - An electronic device including a main chassis, an electronic module and an electromagnetic interference shielding structure is provided. The electronic module is disposed in the main chassis. The electromagnetic interference shielding structure includes a conductive plate and a plurality of conductive elastic pieces. The conductive plate is assembled to the main chassis. The conductive elastic pieces are connected to the conductive plate and arranged along a first direction. Each of the conductive elastic pieces extends along a second direction perpendicular to the first direction. Each of the conductive elastic pieces has an arc contacting surface, and the arc contacting surface of at least one of the conductive elastic pieces contacts the electronic module. An electromagnetic wave emitted from the electronic module passes through the corresponding conductive elastic piece and the conductive plate in sequence to be transmitted to the main chassis. | 02-26-2015 |
| 20150062828 | Connector, connector Assembly, and Wireless Communication Module - A connector is provided that is capable of high-speed transmission over a carrier wave of, for example, 30 GHz or higher. The connector includes a housing, a wireless communication module and a first magnet. The housing includes a planar face, and the wireless communication module is disposed in the housing and includes a wireless signal transmission IC and a wireless signal reception IC. The first magnet is disposed along the planar face. | 03-05-2015 |
| 20150062829 | ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire. | 03-05-2015 |
| 20150062830 | POWER MODULE - A power module is provided. The power module includes a housing assembly and an electrical assembly. The electrical assembly includes an AC input assembly, a DC input assembly, a number of AC feeder layers, a number of DC feeder layers, a number of AC electrical components and a number of DC electrical components. Each AC feeder layer includes a generally planar body and an embedded conductor. Each DC feeder layer includes a generally planar body and an embedded conductor. Each AC feeder layer conductor is coupled to, and in electrical communication with, said AC input assembly. Each DC feeder layer conductor is coupled to, and in electrical communication with, said DC input assembly. Each AC electrical component is coupled to, and in electrical communication with, an AC feeder layer conductor. And, each DC electrical component is coupled to, and in electrical communication with, a DC feeder layer conductor. | 03-05-2015 |
| 20150070849 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section. | 03-12-2015 |
| 20150070850 | THREE-DIMENSIONAL POWER SUPPLY MODULE WITH PASSIVE STACKED OVER CAVITY - A power converter sub-assembly/module includes a power switching assemblage defining a cavity within which can be mounted a driver IC. The power switching assemblage includes a load inductor component stack attached to a power transistor block and an interconnect spacer block, defining a cavity between the two blocks. The power transistor block includes a high and low side FETs attached side-by-side to a switch-node metal carrier that includes an attach-surface opposite the FETs. The power switching assemblage is mountable to an interconnect surface that includes connection pads VIN, VOUT, GND, HG (high-side gate) and LG low-side gate). For a module configuration, the power switching assemblage is combined with a driver IC that provides high (HG) and low (LG) gate drive—the power switching assemblage and the driver IC are mounted to a module interconnect substrate, with the driver IC mounted within the cavity of the power switching assemblage. | 03-12-2015 |
| 20150085448 | CONDUCTIVE STRUCTURE, TOUCH PANEL, AND METHOD FOR MANUFACTURING SAME - Provided are a conductive structure including a) a base, b) a conductive pattern provided on at least one side of the base, and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof. | 03-26-2015 |
| 20150098193 | COVERING DEVICE FOR A CONTACTING PORTION OF A PRINTED CIRCUIT BOARD, CONTROL SYSTEM FOR A MECHATRONIC MODULE AND METHOD FOR ASSEMBLING A CONTROL SYSTEM - A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element. | 04-09-2015 |
| 20150103493 | ELECTRONIC APPARTUS - According to one embodiment, an apparatus includes a board, a module, cables, and an insulator. The module includes a module body having a first end portion protruding to form a step and module terminals attached to the first end portion. The first end portion is thinner than a main portion of the module body. The protrusion height of the module terminal is less than that of the step. The cables have cable terminals fixed to the module terminals. The insulator has a first adhesive portion adhered to an adhesive point arranged on the back side to the first surface opposite to the board, a second adhesive portion adhered to the first surface, and a cover portion continued to the second adhesive portion and covering the cable terminal between both adhesive portions. | 04-16-2015 |
| 20150103494 | PRINTED CIRCUIT BOARDS HAVING METAL LAYERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided. | 04-16-2015 |
| 20150103495 | ELECTRONIC COMPONENT MODULE - A plating layer of a Cu—M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu—M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu—M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer. | 04-16-2015 |
| 20150109739 | DESIGN STRUCTURE FOR LOGIC CIRCUIT AND SERIALIZER-DESERIALIZER STACK - Serializer-deserializer (SERDES) and integrated circuit package including a package substrate, first and second SERDES dies having a SERDES circuit, and a logic die having a logic circuit. The SERDES circuit communicatively connected to the package substrate. The first and second SERDES dies positioned adjacent, in a plane, and disposed on the package substrate. The logic circuit communicatively connected to the SERDES circuit and to the package substrate. The logic die stacked vertically and disposed on the first and second SERDES dies. A method of assembling a SERDES and integrated circuit package including providing a SERDES structure selected from a menu of SERDES die and SERDES circuit combinations. A design structure of a SERDES and integrated circuit package including a package substrate, first and second SERDES dies having a SERDES circuit, and a logic die having a logic circuit. The SERDES circuit communicatively connected to the package substrate. | 04-23-2015 |
| 20150116949 | ELECTRIC COMPONENT - The electric component includes first and second members | 04-30-2015 |
| 20150116950 | COIL COMPONENT, MANUFACTURING METHOD THEREOF, COIL COMPONENT-EMBEDDED SUBSTRATE, AND VOLTAGE ADJUSTMENT MODULE HAVING THE SAME - A coil component may be capable of being easily manufactured and significantly decreasing direct current (DC) resistance of its wiring. The coil component may include a coil assembly including a core substrate and coil patterns formed on the core substrate; and a magnetic material part embedding the coil assembly therein. | 04-30-2015 |
| 20150116951 | MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND LID BODY - A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the base, and an opening area of the groove on the inner space side which is greater than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed. | 04-30-2015 |
| 20150124411 | METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE - This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module. | 05-07-2015 |
| 20150131235 | ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step. | 05-14-2015 |
| 20150131236 | HIGH VOLTAGE POWER CHIP MODULE - A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders. | 05-14-2015 |
| 20150131237 | FOLDABLE PACKAGE STRUCTURE - A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and the ultra-thin glass plate is disposed at one side of the predetermined folded region and stays away from the predetermined folded region. | 05-14-2015 |
| 20150146382 | PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND POWER MODULE PACKAGE USING PACKAGE SUBSTRATE - Disclosed herein are a package substrate, a method of manufacturing the same, and a power module package using the package substrate. The package substrate includes a substrate including an electronic device adhesive portion formed on one surface thereof and a protrusion portion formed on one side surface of the electronic device adhesive portion, an insulating layer formed on one surface of the substrate, and a circuit pattern formed on the insulating layer, wherein the protrusion portion includes an upper surface portion as a connection member adhesive portion, and a first side surface portion and a second side surface portion that are | 05-28-2015 |
| 20150146383 | ELECTRICAL CONNECTOR - An electrical connector for electrically connecting a chip module to a circuit board, includes an insulating body, multiple conducting bodies, and multiple pieces of low melting point metal. The insulating body has multiple accommodating spaces. Each accommodating space runs through upper and lower surfaces of the insulating body. The multiple conducting bodies are respectively received in the accommodating spaces. Two ends of each conducting body are exposed on the upper and lower surfaces of the insulating body. The low melting point metal is gallium or gallium alloy. Each piece of the low melting point metal is correspondingly arranged at at least one end of one of the conducting bodies. The low melting point metal protrudes from the insulating body, and is electrically connected to the chip module. | 05-28-2015 |
| 20150305188 | Electric Power Converter - An object of the invention is to improve the cooling performance for a bus bar and a smoothing capacitor in an electric power converter. The electric power converter of the present invention includes a power semiconductor module including a power semiconductor element that converts a DC current to an AC current, a capacitor cell that smooths a DC voltage, a bus bar that electrically connects the power semiconductor module and the capacitor cell, a base plate that is disposed between the bus bar and the capacitor cell, and a sealing material that seals the capacitor cell, the bus bar, and the base plate. The base plate forms an opening through which a capacitor terminal extending from the capacitor cell passes. | 10-22-2015 |
| 20150319876 | POWER MODULE - In a power module according to the present invention, a copper layer composed of copper or a copper alloy is provided at a surface of a circuit layer onto which a semiconductor element is bonded, and a solder layer formed by using a solder material is formed between the circuit layer and the semiconductor element. An alloy layer containing Sn as a main component, 0.5% by mass or more and 10% by mass or less of Ni, and 30% by mass or more and 40% by mass or less of Cu is formed at the interface between the solder layer and the circuit layer, the thickness of the alloy layer is set to be within a range of 2 μm or more and 20 μm or less, and a thermal resistance increase rate is less than 10% after loading a power cycles 100,000 times under a condition where an energization time is 5 seconds and a temperature difference is 80° C. in a power cycle test. | 11-05-2015 |
| 20150319877 | POWER MODULE - A power module is provided with a copper layer composed of copper or a copper alloy on a surface of a circuit layer to which a semiconductor device is bonded, and a solder layer that is formed by using a solder material is formed between the circuit layer and the semiconductor device. An average crystal grain size which is measured by EBSD measurement in a region having a thickness of up to 30 μm from the surface of the circuit layer in the solder layer is 10 μm or less, the solder layer has a composition that contains Sn as a main component, 0.01 to 1.0% by mass of Ni, and 0.1 to 5.0% by mass of Cu, and a thermal resistance increase rate when a power cycle is loaded 100,000 times is less than 10% in a power cycle test. | 11-05-2015 |
| 20150327390 | Electronic module, electronic system and method of manufacturing the same - An electronic module is provided, comprising an electronic chip arranged in the electronic module; at least two contact terminals electrically connected to the electronic chip each extending out of a package of the electronic module, wherein at least one of the at least two contact terminals is a signal contact terminal comprising a distal signal contact area, and at least another one of the at least two contact terminals is a power contact terminal comprising a distal power contact area; wherein the distal power contact area is adapted to be electrically connected to a power circuit external to the electronic module, wherein the external power circuit is oriented in a first plane; and wherein the distal signal contact area is adapted to be electrically connected to a signal circuit external to the electronic module, wherein the external signal circuit is oriented in a second plane extending perpendicular to the first plane. | 11-12-2015 |
| 20150334853 | ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE - The Electronic Module includes body case | 11-19-2015 |
| 20150342073 | Electronic module and method of manufacturing the same - An electronic module is provided, comprising an electronic chip arranged in the electronic module and comprising an input terminal and an output terminal; a first current path electrically connected to the input terminal; a second current path electrically connected to the output terminal; and an insulation arranged between the first current path and the second current path, wherein the first current path and the second current path extend in the same direction and arranged in close proximity to each other. | 11-26-2015 |
| 20150342074 | Semiconductor Module - To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module ( | 11-26-2015 |
| 20150351260 | CONTROL SYSTEM INCLUDING A STATIONARY EMERGENCY STOP BUTTON AND A MOBILE EMERGENCY STOP BUTTON - A control system including: a stationary control console and a first emergency stop button positioned on the control console, a mobile control unit including a mobile holder and a second emergency stop button arranged on the mobile holder, the control console including at least one cavity, the mobile holder configured to assume a first position in which the second emergency stop button is located inside the cavity to be hidden from a view of a user, and a second position in which the second emergency stop button is outside the cavity. | 12-03-2015 |
| 20150359111 | MEMORY DEVICE - According to one embodiment, a memory device includes a device body including a terminal connectable to an external device, a memory, a controller configured to control the memory, and a plurality of concave portions, and a case including a plurality of convex portions which are capable of fitting into the plurality of concave portions in a state where a part of the device body is inserted into the case. | 12-10-2015 |
| 20150359406 | DOMESTIC APPLIANCE - A domestic appliance includes a housing, a base support configured to support the housing on a floor, and a communication module configured to send and/or receive data wirelessly. The communication module is disposed within the base support, with the base support being made of plastic, at least in an area adjacent to the communication module. | 12-17-2015 |
| 20150382497 | ELECTRONIC COMPONENT ASSEMBLY STRUCTURE AND ELECTRONIC COMPONENT - An electronic component having plural lead terminals protruding from side surfaces of a component main body is inserted and accommodated in a housing member, and the lead terminals are brought into contact with plural terminal fittings held in the housing member to assemble the electronic component into the housing member. Each of the lead terminals includes a base end protruding from at least one side surface of the component main body and a contact portion connected to the base end to droop along the side surface. The component main body is provided with an insulating member which is located to contact or face the base ends from a side of an end surface of the component main body which is most distant from a bottom wall of the housing member in assembling the electronic component into the housing member. Accordingly, it is possible to suppress deformation of the lead terminals. | 12-31-2015 |
| 20160014897 | POWER SEMICONDUCTOR MODULE | 01-14-2016 |
| 20160021772 | WIRING MODULE - A wiring module to be attached to a power storage element group in which a plurality of power storage elements each having positive and negative electrode terminals are lined up includes: an insulating protector having a connection member holding section for holding a connection member that electrically connects adjacent electrode terminals; a temperature detecting member that is arranged so as to be in contact with the connection member held by the connection member holding section and is configured to detect the temperature of the connection member; a cover configured to cover the insulating protector; and a restricting member configured to restrict movement of the temperature detecting member by covering the insulating protector with the cover. | 01-21-2016 |
| 20160044807 | ELECTRONIC DEVICE - An electronic device includes a housing assembly and an electronic module. The housing assembly includes a first housing and a second housing. The first housing includes a main body, an accommodation box and an assembly component. The main body, the accommodation box and the assembly component are formed integrally into a single unit. The main body is connected to the accommodation box which has an accommodating space, a first side and a second side. The first side is opposite to the second side. The assembly component is disposed at the second side. The second housing detachably covers the accommodation box and the assembly component. The electronic module includes a fastening structure and is movably disposed in the accommodating space via the first side of the accommodation box. Accordingly, the fastening structure is combined with the assembly component. | 02-11-2016 |
| 20160050768 | Module with Integrated Power Electronic Circuitry and Logic Circuitry - A integrated power module with integrated power electronic circuitry and logic circuitry includes an embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material, a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board, and a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board. The flexible connection mechanically connects the embedded power semiconductor module to the logic printed circuit board and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board. A method of manufacturing the integrated power module is also provided. | 02-18-2016 |
| 20160057881 | SEMICONDUCTOR DEVICE - A semiconductor device includes a base plate, a semiconductor chip, and a first to a fourth terminal plates. The first terminal plate includes a first main body unit. The second terminal plate includes a second main body unit. The second main body unit opposes the first main body unit. The third terminal plate includes a third main body unit. The third main body unit opposes the first main body unit and the second main body unit. The fourth terminal plate includes a fourth main body unit. The fourth main body unit opposes the third main body unit. A thickness of the third main body unit is thinner than a thickness of the first main body unit. A thickness of the fourth main body unit is thinner than a thickness of the second main body unit. | 02-25-2016 |
| 20160064337 | INTRAMODULE RADIO FREQUENCY ISOLATION - A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices. | 03-03-2016 |
| 20160066464 | PARALLEL POWER CONVERTER - Apparatus and system for power conversion. In one embodiment, the apparatus comprises a power converter comprising a first plate for receiving an input power; a second plate for providing an output power; a plurality of power converter bricks coupled in parallel between the first and the second plates, each power converter brick comprising (i) an input stage for converting a brick input power to a second power, (ii) an output stage, coupled to the input stage by a transformer, for converting the second power to a brick output power, (iii) a local controller coupled to the input stage for controlling power conversion by the power converter brick; and a master controller coupled to each power converter brick of the plurality of power converter bricks, wherein the master controller dynamically controls operation of each power converter brick of the plurality of power converter bricks to generate the output power. | 03-03-2016 |
| 20160073533 | PV STAX - MULTI-FUNCTION JUNCTION MF/J SYSTEM - A system to provide a multi-function connection capability to contain and provide for stacking, mounting self-registering Multi-Function Junction (MF/J) boxes that contain a multiplicity of control electronics and can be stacked, removed, replaced, and/or upgraded with a minimal of steps or connection processes in order to simplify methods and conserve on or add value, capabilities to materials and electrical/mechanical equipment. The system can be engaged or utilized by any EMS/First Responder/Service Technician, authorized personnel in any field, Contractor, manufacturer, BOS integrator and any assembler of systems that require a multiplicity of interfacing devices to be in proximity, connection or contact to each other. | 03-10-2016 |
| 20160073535 | HIGH-POWER ELECTRONIC MODULE AND METHOD FOR MAKING SUCH A MODULE - A power electronic module including at least one pair of power electronic components, each pair including a first and a second component, each component including a first face, configured to be supported on a support and a second face configured to be electrically connected to an electrical circuit with a smaller thermal contact area than the contact area between the first face and the support, and a first and a second support. The first component in each pair is supported by the first support and is connected to a second electrical circuit of the second support and the second component in each pair is supported on the second support and is connected to a first electrical circuit of the first support. | 03-10-2016 |
| 20160088756 | ENCAPSULATION BARRIER STACK COMPRISING DENDRIMER ENCAPSULATED NANOP ARTICLES - Disclosed is an encapsulation barrier stack, capable of encapsulating a moisture and/or oxygen sensitive article and comprising a multilayer film, wherein the multilayer film comprises: one or more barrier layer(s) having low moisture and/or oxygen permeability, and one or more sealing layer(s) arranged to be in contact with a surface of the at least one barrier layer, thereby covering defects present in the barrier layer, wherein the one or more sealing layer(s) comprise(s) a plurality of dendrimer encapsulated nanoparticles, the nanoparticles being reactive in that they are capable of interacting with moisture and/or oxygen to retard the permeation of moisture and/or oxygen through the defects present in the barrier layer. | 03-24-2016 |
| 20160095244 | POWER SEMICONDUCTOR MODULE DEVICE - Second fixation portions of a terminal conversion adaptor are fitted into and engaged with engagement portions abutting on first fixation portions of a power semiconductor module. By use of one common fixation screw, each of the fixation portions and each of the second fixation portions are fixed to a cooler. Pin connection type external connection terminals of the power semiconductor module are connected to conversion terminals (which are provided with screw connection portions) of the terminal conversion adaptor so that the pin connection type external connection terminals can be converted into screw connection. Thus, it is possible to provide a conversion adaptor which can convert a connection form of each external connection terminal of a power semiconductor module easily and a power semiconductor module device in which the connection form of the external connection terminal can be converted into a desired connection form by the conversion adaptor. | 03-31-2016 |
| 20160100495 | PACKAGING FOR HIGH-POWER MICROWAVE MODULE - A microwave module is described. The microwave module includes a base bracket, a window plate and a lid. The base bracket is configured to contain a photoconductive switch, a radio-frequency transformer and dielectric oil. The window plate, which is transparent to optical light, covers a first portion of the base bracket in which the photoconductive switch is located. The window plate is sealed to the base bracket. The lid, which includes a cutout to allow the radio-frequency transformer to pass through the lid, covers a second portion of the base bracket in which the radio-frequency transformer is located. The window plate is sealed to the base bracket, and the lid is sealed to the window plate, the base bracket and the radio-frequency transformer to contain the dielectric oil within the microwave module. | 04-07-2016 |
| 20160104631 | Electronic Module and Method for Producing an Electronic Module - One aspect of the invention relates to an electronic module comprising a module housing and an electrically conductive connection element. The connection element has a first portion and a second portion, and also a shaft between the first portion and the second portion. The connection element, which is provided with a non-metallic coating in the region of the shaft, is injected together with the coating in the region of the shaft into the module housing, such that the connection element is fixed in the module housing. | 04-14-2016 |
| 20160105980 | LID BODY, PACKAGE, AND ELECTRONIC APPARATUS - A lid body includes a plate body containing silicon; a protective film disposed on a main surface of the plate body, the protective film protecting the plate body from a joining brazing material; a frame-like hole passing through the protective film, the frame-like hole being provided at an outer periphery of the protective film; and a sealing metallic layer made of metal, disposed so as to fill in the hole. | 04-14-2016 |
| 20160113127 | Electronic module having an electrically insulating structure with material having a low modulus of elasticity - Electronic module comprising at least one electronic chip, an encapsulation structure in which the at least one electronic chip is at least partially encapsulated, an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip, and an electrically insulating structure which is at least partially formed from a material having a low modulus of elasticity, wherein a variation of the value of the modulus of elasticity is at the most 10 GPa in a temperature range between −40° C. and +150° C. | 04-21-2016 |
| 20160113137 | WATERPROOF CONTROL UNIT AND METHOD OF ASSEMBLING THE SAME - In a waterproof control unit in which a part of a connector housing mounted on a circuit board is exposed and the circuit board is hermetically housed in a casing including a base and a cover, a sealing gap between the cover and the connector housing is defined between fitting surfaces of a first concave thread and a first convex thread, and a waterproof sealing material is applied to the sealing gap. A waterproof sealing material is applied to the latter sealing gap. Each of the sealing gaps extends inward and outward across an inner boundary surface of a partition wall of the connector housing. Plane movement of each of the sealing gaps is restricted by side-surface convex threads and side-surface concave threads. | 04-21-2016 |
| 20160128216 | ELECTRIC POWER CONVERTER - An electric power converter includes a semiconductor module, a capacitor, and a DC bus bar that electrically connects them. The capacitor has a capacitor element and a capacitor terminal connected to the capacitor element. The capacitor terminals and the DC bus bar are connected to each other at least at two connecting portions. The DC bus bar has a bus bar main body portion that is connected to the semiconductor module. The two connecting portions are connected by at least a portion of the bus bar main body portion. The capacitor terminal has a terminal main body portion that is connected to the capacitor element. The two connecting portions are connected by at least a portion of the terminal main body portion. | 05-05-2016 |
| 20160143147 | ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - The electronic device module and method thereof includes a board, an electronic device, a sealing part, and a connection conductor. The board includes external connection electrodes. The electronic device is mounted on the board. The sealing part is configured to seal the electronic device. The connection conductor is configured to penetrate through the sealing part and including one end bonded to the external connection electrodes of the board. One of the external connection electrodes includes a reinforcing via disposed in the board. | 05-19-2016 |
| 20160143160 | DISPLAY DEVICE WITH A DETACHABLE SPEAKER MODULE - A display device includes a monitor, a stand, and a speaker module. The monitor includes a first side and a second side. An accommodating groove is formed on the first side, and a slot is formed on the second side. The stand is selectively installed inside the accommodating groove for being stored in the first side of the monitor or inserted into the slot for supporting the monitor on a supporting surface. The speaker module is installed inside the stand for outputting an audio signal transmitted from the monitor. | 05-19-2016 |
| 20160157373 | HIGH-FREQUENCY MODULE | 06-02-2016 |
| 20160172995 | POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE | 06-16-2016 |
| 20160205794 | DISPLAY MODULE | 07-14-2016 |
| 20190150293 | ELECTRONIC DEVICE MODULE | 05-16-2019 |
| 20190150307 | ELECTRONIC DEVICE WITH SEAL MEMBER | 05-16-2019 |
