| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361746000 | With specific dielectric material or layer | 33 |
| 20090185354 | HEAT RADIATING STRUCTURE FOR ELECTRONIC MODULE AND ELECTRONIC DEVICE HAVING THE SAME - A heat radiating structure for an electronic module and an electronic device having the same structure thereon. The heat radiating structure is formed at the bottom of the electronic module to release the generated heat from the electronic module, and includes an impact absorber, which absorbs impact transferred from the outside. A heat radiating sheet is formed with a plurality of the multi-layered heat conductive sheets and is in contact with the bottom of the electronic module by covering the outside of the impact absorber. | 07-23-2009 |
| 20090201651 | RESIN SEALING SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING RESIN SEALING SEMICONDUCTOR DEVICE - A resin sealing semiconductor device ( | 08-13-2009 |
| 20100202115 | CIRCUIT BOARD INCLUDING AN EMBEDDED COMPONENT - The document describes a circuit board and an electronic module, comprising a conductor-pattern layer, an insulating-material layer supporting the conductor-pattern layer, and at least one component inside the insulating-material layer. The component has a plurality of contact areas and the circuit board or electronic module comprises contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component such that at least two of the contact elements are in direct contact with a common contact area. | 08-12-2010 |
| 20100220448 | COMPONENT-CONTAINING MODULE - A component-containing module includes a core substrate which includes a lower surface including recessed portions and a raised portion, and an upper surface facing the lower surface and which includes a plurality of in-plane conductors, an integrated circuit element arranged at a location which is above the upper surface and which corresponds to the raised portion, a first passive element and a second passive element disposed in the recessed portions of the lower surface, a composite resin layer which underlies the lower surface and which has a flat or substantially flat surface, and an external terminal electrode which is disposed on the flat or substantially flat surface of the composite resin layer and which is electrically connected to the in-plane conductors of the core substrate. The component-containing module enables electronic components, such as integrated circuit elements and passive elements, to be densely arranged and to be reduced in profile and size. | 09-02-2010 |
| 20100232119 | Method for producing an electronic module - A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module. | 09-16-2010 |
| 20110110050 | STRUCTURE WITH ELECTRONIC COMPONENT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH STRUCTURE - A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component. | 05-12-2011 |
| 20110194260 | SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE MODULE - A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns. | 08-11-2011 |
| 20110273851 | CIRCUIT BOARD, CIRCUIT MODULE, AND ELECTRONIC DEVICE PROVIDED WITH CIRCUIT MODULE - A circuit board includes a substrate having a first surface and a second surface on an opposite side of the first surface. A hole is provided in the substrate so as to penetrate from the first surface to the second surface. A recess portion is formed in the second surface and has a bottom larger than a cross-section area of the hole. The hole is exposed on the bottom of the recess portion. | 11-10-2011 |
| 20120026696 | Multilayer packagings - An ungrounded type multilayer packaging with a reduced energy of electrostatic discharge for packaging used in a combustible environment. The packaging comprises a non-conductive multilayer packaging material containing at least one polymeric thermoplastic electrostatic dissipating layer, to give an electrostatic discharge energy attenuation of more than 40 dB. | 02-02-2012 |
| 20120075812 | MULTI-CHIP PACKAGE - In various embodiments, a chip module may include a substrate; electronic components, the electronic components being arranged on a first side of the substrate; and an insulating layer, which is applied to the first side of the substrate and to the electronic components, contact openings being arranged in the insulating layer which permit electrical contacting of the electronic components; and an electrically conducting layer being arranged on the insulating layer and in the contact openings, which connects the electronic components electrically to one another. | 03-29-2012 |
| 20120106095 | STRETCHABLE ELECTRONICS MODULES AND CIRCUITS - An electronics module has a flexible substrate having conductors, an array of functional components on the substrate, the functional components arranged to contact at least one conductor, and perforations in the flexible substrate, the perforations arranged to increase stretchability of the flexible substrate, the conductor arranged around the perforation and the functional components arranged to one of reside between the perforations or partially cover the perforations. A method of manufacturing a flexible electronics module involves mounting at least two functional components onto a flexible substrate, forming electrical interconnects configured to provide connection between the two functional components, and perforating the flexible substrate with cuts configured to increase stretchability of the substrate. | 05-03-2012 |
| 20120120613 | ELECTRONIC MODULE AND PRODUCTION METHOD THEREFOR - An electronic module | 05-17-2012 |
| 20120176751 | ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREFOR - An electronic component module includes a substrate including a first electrode pattern and a first resist pattern on a first main surface thereof, a first electronic component mounted on the first main surface via the first electrode pattern, and a component-embedding resin layer provided on the first main surface so as to embed the first electronic component therein, and including, in an inside portion or a lateral portion thereof, an interlayer connection conductor connecting the first electrode pattern and an external connection electrode pattern disposed on a surface of the component-embedding resin layer to each other. The first electrode pattern and the first resist pattern are arranged so that the first resist pattern is disposed on top of a circumferential portion of the first electrode pattern. | 07-12-2012 |
| 20120218721 | METHOD OF MANUFACTURING COMPONENT BUILT-IN MODULE AND COMPONENT BUILT-IN MODULE - A method of manufacturing a component built-in module includes a step of preparing a sheet metal; a step of providing a conductive thick-film pad over one main surface of the sheet metal by applying and curing a conductive paste; a step of providing a joining material over the conductive thick-film pad; a step of mounting a chip component onto the conductive thick-film pad with the joining material interposed therebetween; a step of providing a resin layer over the one main surface so as to cover the chip component; and a step of forming a surface electrode by patterning the sheet metal. | 08-30-2012 |
| 20120293965 | COMPONENT BUILT-IN MODULE, AND MANUFACTURING METHOD FOR COMPONENT BUILT-IN MODULE - A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space. | 11-22-2012 |
| 20130003319 | BUMPLESS BUILD-UP LAYER PACKAGE WARPAGE REDUCTION - The present disclosure relates to the field of fabricating microelectronic packages and the fabrication thereof, wherein a microelectronic device may be formed within a bumpless build-up layer coreless (BBUL-C) microelectronic package and wherein a warpage control structure may be disposed on a back surface of the microelectronic device. The warpage control structure may be a layered structure comprising at least one layer of high coefficient of thermal expansion material, including but not limited to a filled epoxy material, and at least one high elastic modulus material layer, such as a metal layer. | 01-03-2013 |
| 20130070428 | METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND ELECTRONICS MODULE - The invention concerns a method of fusing and electrically contacting a first insulating substrate ( | 03-21-2013 |
| 20130155629 | Hermetic Semiconductor Package Structure and Method for Manufacturing the same - The invention provides a semiconductor package structure, comprising: a substrate having a first surface and a second surface; a first conductive layer plated on the first surface; a semiconductor element attached to the first conductive layer on the first surface of the substrate for electrically connecting; a second conductive layer plated on the first surface and surrounded the semiconductor element and the first conductive layer, wherein the height of the second conductive layer is higher than the first conductive layer; and a lid attached to the top of the second conductive layer for sealing the semiconductor element. | 06-20-2013 |
| 20130163211 | HIGH EFFICIENCY MODULE | 06-27-2013 |
| 20130286603 | MEMORY CARD AND SD CARD - According to one embodiment, there are provided a memory which is provided on a circuit board, a controller which is provided on the circuit board and controls the memory, and a signal line which is formed on the circuit board and configured to perform data transmission between the controller and the memory, in which a width of the signal line in the place where the signal line is led out from the memory is large compared with a place disposed under the memory. | 10-31-2013 |
| 20130308281 | ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE - The Electronic Module has a body case | 11-21-2013 |
| 20140029210 | DIFFUSION BARRIER FOR SURFACE MOUNT MODULES - A surface-mount package structure for reducing the ingress of moisture and gases thereto is disclosed. The surface-mount structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to a substrate structure, with a dielectric material positioned between the dielectric layer and the substrate structure to fill in gaps in the surface-mount structure. A diffusion barrier layer is applied over the sub-module, adjacent the first and second level I/O connections, and extends down to the substrate structure to reduce the ingress of moisture and gases from a surrounding environment into the surface-mount structure. | 01-30-2014 |
| 20140071633 | POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate. | 03-13-2014 |
| 20140078687 | DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, AND METHOD FOR FABRICATING THE DEVICE MOUNTING BOARD - A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device. | 03-20-2014 |
| 20140126160 | ELECTRONIC CIRCUIT MODULE - There is provided an electronic circuit module that prevents a bonding force between ground wiring and a shield from decreasing and maintains successfully a desirable shield effect. The electronic circuit module includes a core layer also functioning as the ground wiring, each face OS of each first protrusion of the core layer facing to an end face of a shield is adjacent to faces OS of an outer cover made of an insulating synthetic resin facing to the end face of the shield, and the end face of the shield is bonded to both of the each face OS of each first protrusion facing to the end face of the shield and the faces OS of the outer cover facing to the end face of the shield. | 05-08-2014 |
| 20140347822 | MODULE AND METHOD FOR MANUFACTURING THE SAME - A module includes a wiring board; a plurality of mounting electrodes for component mounting, the mounting electrodes being disposed on one principal surface of the wiring board; a plurality of components mounted on the one principal surface of the wiring board and solder-connected to the mounting electrodes; a solder resist being a photosensitive resin configured to cover the one principal surface of the wiring board, with a plating electrode layer of each mounting electrode exposed; and a sealing resin layer disposed on the one principal surface of the wiring board, the sealing resin layer being configured to cover the photosensitive resin and the components connected to the mounting electrodes. A recess substantially wedge-shaped in cross section is provided at a boundary between the plating electrode layer of each mounting electrode and the solder resist, and the recess is filled with resin of the sealing resin layer. | 11-27-2014 |
| 20140355224 | MOTOR VEHICLE PLASTIC PANEL HAVING AN INTEGRAL ELECTRICAL UNIT - A plastic panel forming part of a motor vehicle is disclosed having a number of embedded conductors for electrically connecting together an electrical connector and an electrical unit. Parts of the electrical connector and the electrical unit are formed as integral parts of the plastic panel. The electrical connector includes terminals connected to the electrical conductors for co-operation with terminals formed as part of a plug used to connect the conductors to other electrical circuits of the motor vehicle. In one embodiment the electrical unit is in the form of a fuse box having electrical terminals held in position by the plastic panel and in pairs for cooperation with a respective fuse. | 12-04-2014 |
| 20150092356 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE - A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral portion of the interlayer layer to connect second substrate, forming a seed layer on the resin layer, in the openings and on the second pads, forming on the seed layer a plating resist having resist openings exposing the openings of the resin layer with diameters greater than the openings, filling the resist openings with electrolytic plating such that metal posts are formed in the resist openings, removing the resist, removing the seed layer exposed on the resin layer, and removing the removable layer and the resin layer on the removable layer such that cavity exposing the first pads is formed in the resin layer. | 04-02-2015 |
| 20150092357 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE - A method for manufacturing a printed wiring board includes forming a resin insulation layer on an interlayer resin insulation layer and conductive circuits such that the resin insulation layer has first openings exposing pad portions in central portion of the interlayer layer and second openings exposing pad portions in peripheral portion of the interlayer layer, forming a seed layer on the resin insulation layer, in the first and second openings and on the pad portions, forming on the seed layer a plating resist such that the resist has resist openings exposing the second openings and having diameters greater than the second openings, filling the resist openings with electrolytic plating material via the seed layer such that metal posts are formed in the resist openings, removing the resist from the resin insulation layer, and removing the seed layer exposed on the resin insulation layer by the removing of the resist. | 04-02-2015 |
| 20150103499 | ELECTRONIC COMPONENT-EMBEDDED MODULE AND COMMUNICATION TERMINAL DEVICE - To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads. | 04-16-2015 |
| 20150116955 | ENGINE CONTROL UNIT - An engine control unit including a substantially rectangular printed circuit board in which a microcontroller is mounted. The printed circuit board includes a connector portion in which connection terminals are provided to be arranged in one side edge portion along the longitudinal direction thereof. The connection terminals of the connector portion include connection terminals for input on one side in the longitudinal direction and connection terminals for output on the other side with respect to a setting position. A microcontroller is disposed at substantially the center portion of the printed circuit board in the longitudinal direction thereof. An electronic component as an input interface circuit is disposed on the one side in the longitudinal direction, and an electronic component as an output interface circuit is disposed on the other side. | 04-30-2015 |
| 20160095224 | APPARATUS AND METHODS RELATED TO CERAMIC DEVICE EMBEDDED IN LAMINATE SUBSTRATE - Apparatus and methods related to ceramic device embedded in laminate substrate. In some embodiments, a laminate substrate can include a plurality of laminate layers, and a ceramic device having a first side and a second side, and embedded at least partially within the plurality of laminate layers. The ceramic device can include a conductive path between the first side and the second side. In some embodiments, such a laminate substrate can be utilized as a packaging substrate for a packaged module such as a radio-frequency (RF) module. | 03-31-2016 |
| 20160105982 | POWER SUPPLY MODULE, PACKAGE FOR THE POWER SUPPLY MODULE, METHOD OF MANUFACTURING THE POWER SUPPLY MODULE AND WIRELESS SENSOR MODULE - A package includes a metal core substrate, a first insulation layer formed along a periphery of a first surface of the metal core substrate, the first surface of the metal core substrate being exposed at an inner side of the first insulation layer, a second insulation layer formed along at least a periphery of a second surface of the metal core substrate, a first through-electrode penetrating the second insulation layer at a first part of the periphery of the metal core substrate, and a second through-electrode penetrating the first insulation layer, the metal core substrate and the second insulation layer at a second part of the periphery of the metal core substrate, the second through-electrode being electrically insulated from the metal core substrate via an insulation member. | 04-14-2016 |
