Entries |
Document | Title | Date |
20080218936 | Analog capacitor - Analog capacitors, and methods of fabricating the same, include a lower electrode having a lower conductive layer, a capacitor dielectric layer on the lower conductive layer, and an upper electrode on the capacitor dielectric layer to be opposite to the lower electrode, wherein the upper electrode includes at least an upper conductive layer in contact with the capacitor dielectric layer, wherein the upper conductive layer has a resistivity higher than that of the lower conductive layer. | 09-11-2008 |
20080232024 | METALIZED PLASTIC FILM FOR FILM CAPACITOR AND FILM CAPACITOR - A metalized plastic film for a rolled film capacitor or a laminated film capacitor and a film capacitor are disclosed. The metalized plastic film having a plastic film and an electrode metal deposited on the plastic film and patterned for a film capacitor includes rectangular split electrodes extending from a margin region defined at one side of the plastic film as a region free of the deposited electrode metal toward an opposite side of the plastic film, to have a length corresponding to about one fourth to four fifth of a width of the plastic film, the split electrodes being continuously arranged at specified intervals in a longitudinal direction of the plastic film, fuse portions each formed in an associated one of the split electrodes between the margin region and an electrode metal contacting region of the associated split electrode. Therefore, it is possible to reduce self-heating of the film capacitor and prevent capacitance of the film capacitor from decreasing due to an operation of the fuse portions, thereby ensuring safety of the capacitor, scaling down the capacitor and using the capacitor at a high temperature. | 09-25-2008 |
20080239619 | CAPACITOR STRUCTURE - The capacitor structure includes a first electrode having a plurality of teeth protruding in a comb shape from an electrode base of a first electrode line and a second electrode having a plurality of teeth protruding in a comb shape from an electrode base of a second electrode line, both formed in a first wiring layer. The first and second electrodes face each other with their teeth interdigitated with each other via a dielectric. At least one of the teeth of the first electrode is electrically connected with a third electrode line formed in a second wiring layer. | 10-02-2008 |
20080266749 | Scalable integrated circuit high density capacitors - The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The capacitors use different metallization patterns to form the metal layers, and different via patterns to couple adjacent metal layers. In embodiments, optional shields are included as the top-most and/or bottom-most layers of the capacitors, and/or as side shields, to reduce unwanted parasitic capacitance. | 10-30-2008 |
20080273288 | CAPACITORS, COUPLERS, DEVICES INCLUDING SAME AND METHODS OF MANUFACTURING SAME - Capacitors are provided comprising a first plate, a second plate spaced from the first plate and a dielectric between the first and second plates. In certain embodiments the plates are arranged generally opposite each other and each is shaped in a periodically repeating pattern that is spatially out of phase with the other so that misregistration of the plates is compensated. In certain embodiments, a floating equipotential conductor is positioned between the plates and has a larger dimension than a corresponding dimension of the plates so that misregistration of the plates is compensated. Methods of manufacturing the capacitors are also provided. | 11-06-2008 |
20080304202 | MULTI-LAYER CAPACITOR AND INTEGRATED CIRCUIT MODULE - It is intended to provide a multi-layer capacitor capable of obtaining good noise suppression characteristic at a high frequency band. The multi-layer capacitor has a structure that: a first conductor layer having a first extraction part connected to the first external electrode and a second extraction part connected to the second external electrode and a second conductor layer having a third extraction part connected to the third external electrode and a fourth extraction part connected to the fourth external electrode are alternately and integrally laminated via a dielectric layer; and each of the first conductor layers has a structure that two partial conductor layers are joined via a narrow part acting as an inductor, and each of the second conductor layers has a structure that two partial conductor layers are joined via a narrow part acting as an inductor. | 12-11-2008 |
20090002916 | Interdigital capacitor - An interdigital capacitor includes a first finger electrode structure and a second finger electrode structure. The first finger electrode structure has a first electrode and a plurality of first extending electrodes. The first extending electrodes are linearly disposed and arranged. The second finger electrode structure has a second electrode and a plurality of second extending electrodes. The second extending electrodes are linearly disposed and arranged. The second finger electrode structure interlaces with the first finger electrode structure. At least one pair of first coupling electrodes extend respectively from the neighboring first and second extending electrodes and are disposed between them. | 01-01-2009 |
20090009926 | Capacitor Structure - One or more embodiments relate to a capacitor structure comprising a first and second capacitor electrode. The first electrode may include a conductive strip having at least one wider portion and at least one narrower portion. The second electrode may include a conductive strip having at least one wider portion and at least one narrower portion. | 01-08-2009 |
20090015983 | Parallel plate capacitor - Capacitors including a first conductive material having a first upper finger located on an upper plane and a first lower finger located on a lower plane. The capacitor also includes a second conductive material having a second upper finger and a second lower finger, the second upper finger located on the upper plane such that the second upper finger is next to the first upper finger forming a first interface and on top of the first lower finger forming a second interface, the second lower finger located on the lower plane such that the second lower finger is next to the first lower finger forming a third interface and below the first upper finger forming a fourth interface. Finally, the capacitor includes a dielectric material located in the first interface, the second interface, the third interface, and the fourth interface. | 01-15-2009 |
20090021888 | CAPACITOR, METHOD OF MANUFACTURING A CAPACITOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A capacitor includes a lower electrode structure which includes a sidewall, an upper surface and a rounded surface between the sidewall and the upper surface. The capacitor further includes a ferroelectric layer pattern disposed on the lower electrode structure, and an upper electrode structure is provided on the ferroelectric layer pattern. The ferroelectric layer pattern is formed on the upper surface, the sidewall and the rounded surface of the lower electrode structure. The effective area between the lower electrode structure and the ferroelectric layer pattern may be increased, and the crystalline structure of the ferroelectric layer pattern may be improved. Accordingly, the capacitor may provide enhanced capacitance and electrical characteristics. | 01-22-2009 |
20090034154 | MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes: a capacitor body; internal electrodes disposed in the capacitor body, each internal electrode having one or more lead; and external electrodes disposed on first and second side surfaces of the capacitor body to be electrically connected to the internal electrodes through the leads. The average number of leads in each internal electrode is smaller than half (½) of the total number of external electrodes. The leads of the internal electrodes having opposite polarities and adjacent in the lamination direction are disposed to be adjacent to each other as seen from the lamination direction. All the internal electrodes having the same polarity are electrically connected to each other in the capacitor. | 02-05-2009 |
20090046409 | Capacitor-embedded printed circuit board and manufacturing method thereof - A capacitor-embedded printed circuit board and a method of manufacturing the printed circuit board are disclosed. The capacitor-embedded printed circuit board includes: an insulation layer, a first electrode formed on one side of the insulation layer, a second electrode formed on one side of the first electrode, a dielectric layer formed on one side of the second electrode, and a third electrode formed on one side of the dielectric layer. By forming the electrodes of the capacitor in a dual structure, deviations in contact area may be minimized between the second electrode and the dielectric layer, so that ultimately, errors in capacitance may be reduced. | 02-19-2009 |
20090052110 | CAPACITOR HAVING MICROSTRUCTURES - A capacitor element includes a pair of conductor layers, a plurality of generally tube-shaped dielectric substances, a first electrode outside the dielectric substances and second electrodes in the insides thereof, and insulation caps for insulating the first electrode from the conductor layer, wherein an electrode material is filled in gaps of a structure of an oxide base material resulting from anodic oxidation of a metal, and then, the structure is removed and replaced by a high permittivity material. | 02-26-2009 |
20090052111 | HIGH VOLTAGE CAPACITORS - A capacitor includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers and first and second external terminals attached to the ceramic capacitor body. The internal active electrodes within the ceramic capacitor body are configured in an alternating manner. Internal electrode shields within the ceramic capacitor body are used to assist in providing resistance to arc-over. The shields may include a top internal electrode shield and an opposite bottom internal electrode shield wherein the top internal electrode shield and the opposite bottom internal electrode shield are on opposite sides of the plurality of internal active electrodes and each internal electrode shield extends inwardly to or beyond a corresponding external terminal to thereby provide shielding. Side shields are used. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size. To further increase voltage breakdown, a coating on the ceramic capacitor may be used. | 02-26-2009 |
20090052112 | HIGH VOLTAGE CAPACITORS - A capacitor includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers and first and second external terminals attached to the ceramic capacitor body. The internal active electrodes within the ceramic capacitor body are configured in an alternating manner. Internal electrode shields within the ceramic capacitor body are used to assist in providing resistance to arc-over. The shields can include a top internal electrode shield and an opposite bottom internal electrode shield wherein the top internal electrode shield and the opposite bottom internal electrode shield are on opposite sides of the plurality of internal active electrodes and each internal electrode shield extends inwardly to or beyond a corresponding external terminal to thereby provide shielding. Side shields are used. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size. | 02-26-2009 |
20090067116 | CAPACITOR-EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A capacitor-embedded substrate includes a base material having a desired thickness, and a pair of conductors (feedthrough electrodes) each formed in a desired pattern to penetrate through the base material in the thickness direction thereof, and oppositely disposed with an insulating layer interposed therebetween. The pair of electrodes are formed in comb-shaped patterns, and are oppositely disposed in such a manner that respective comb-tooth portions are meshed with each other. | 03-12-2009 |
20090073634 | Circuit board for mounting multilayer chip capacitor and circuit board apparatus including the multilayer chip capacitor - A circuit board including: a substrate having a mounting area for mounting a vertical multilayer chip capacitor having first and second external electrodes of a first polarity and a third external electrode of a second polarity; first to third pads arranged on the mounting area, the first and second pads having the first polarity and disposed separately from each other on the mounting area, the third pad having the second polarity and disposed between the first and second pads to be connected to the third external electrode; at least one first via formed in the substrate and connected to the first pad; at least one second via formed in the substrate and connected to the second pad; and a plurality of third vias formed in the substrate and connected to the third pad. The first via is disposed adjacent to the third pad relative to a central line of the first pad, the second via is disposed adjacent to the third pad relative to a central line of the second pad, one or more of the third vias are disposed adjacent to the first via relative to a central line of the third pad, and the rest of the third vias are disposed adjacent to the second via relative to the central line of the third pad. | 03-19-2009 |
20090086404 | CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A capacitor element includes a pair of conductive layer, a plurality of first electrodes and second electrodes, and insulation caps for insulating these electrodes from the conductive layers. By anodizing a metal substrate in two stages, holes filled with the first electrodes and holes filled with the second electrodes are randomly distributed | 04-02-2009 |
20090091875 | SEMICONDUCTOR CAPACITOR STRUCTURE AND LAYOUT PATTERN THEREOF - The present invention provides a metal-oxide-metal (MOM) capacitor structure composed of a first capacitor and a second capacitor. The MOM capacitor structure has a plurality of symmetrical branch sections, which form an interdigitated structure along a plurality of ring contours. The MOM capacitor structure has an optimal geometrical symmetry, and therefore a better capacitance matching effect can be obtained, and the MOM capacitor structure has a higher unit capacitance. In addition, a capacitance value ratio between the first capacitor and the second capacitor can be adjusted according to different requirements in the MOM capacitor structure. Furthermore, the MOM capacitor structure of the present invention does not need additional masks, and the process cost is cheaper. In addition, due to the semiconductor process improvement, a large amount of metal layers can be stacked, and since the distance between the metal layers becomes smaller, the unit capacitance becomes higher. | 04-09-2009 |
20090103234 | Metal capacitor and manufacturing method thereof - A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The capacitor includes a metal member comprising a groove forming portion where a plurality of grooves is formed, an electrode withdrawing portion formed on the groove forming portion, and a sealing portion; a metal oxide layer being formed on the metal member; an insulating layer being formed on the metal member to expose the electrode withdrawing portion of the metal member; a plurality of main electrode layers, each main electrode layer being formed on the metal oxide layer that is formed on the groove forming portion of the metal member; and a conductive connecting layer being formed on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member and connect the plurality of main electrode layers, wherein a lead terminal is connected to the electrode withdrawing portion of the metal member and each of the main electrode layers. | 04-23-2009 |
20090109596 | MULTILAYER CAPACITOR - An element body has first and second inner electrodes which are alternately laminated. The first inner electrode has a first main electrode, a first coupling conductor extending to a first side face of the element body while being connected to an edge part of the first main electrode, and a first lead conductor extending to a third side face while being connected to the first coupling conductor. The second inner electrode has a second main electrode, a second coupling conductor extending to the first side face of the element body while being connected to an edge part of the second main electrode, and a second lead conductor extending to a fourth side face while being connected to the second coupling conductor. The first and second lead conductors are separated from the first and second main electrodes by gaps, respectively. | 04-30-2009 |
20090135543 | MULTILAYER CAPACITOR - A multilayer capacitor has a first inner electrode connected to a first terminal electrode, a second inner electrode connected to a second terminal electrode, and third and fourth inner electrodes connected to third and fourth terminal electrodes. The first and second inner electrodes have no overlapping area therebetween when seen in the opposing direction of the first and second main faces and are arranged at respective positions different from each other in the opposing direction of the first and second main faces and in the opposing direction of the first and second side faces. The third and fourth inner electrodes have no overlapping area therebetween when seen in the opposing direction of the first and second main faces and are arranged at respective positions different from each other in the opposing direction of the first and second main faces and in the opposing direction of the first and second side faces. The first and third inner electrodes have an overlapping area therebetween when seen in the opposing direction of the first and second main faces. The second and fourth inner electrodes have an overlapping area therebetween when seen in the opposing direction of the first and second main faces. | 05-28-2009 |
20090135544 | High Q and low stress capacitor electrode array - An embodiment of the present invention provides a method, comprising breaking an electrode into subsections with signal bus lines connecting said subsections and a solid electrode to improve Q. | 05-28-2009 |
20090141422 | Capacitive Device - Capacitive devices are described having electrical interconnects of electrodes which possess efficient electrical contact between current collectors, electrical isolation of electrodes, and/or electrochemical stability, while minimizing the mechanical stress and strain applied to the electrodes. The capacitive devices are adaptable to a wide range of electrode diameters and electrode stack lengths. | 06-04-2009 |
20090141423 | PARALLEL PLATE MAGNETIC CAPACITOR AND ELECTRIC ENERGY STORAGE DEVICE - A parallel plate magnetic capacitor (Mcap) includes two first pillar electrodes, two second pillar electrodes and a dielectric layer. The two first pillar electrodes electro-connect with each other and are located at right corner of a first plane and left corner of a second plane respectively. The two second pillar electrodes electro-connect with each other and are located at left corner of the first plane and right corner of the second plane respectively. The dielectric layer is located between the first pillar electrodes and the second pillar electrodes, such that the first pillar electrodes and the second pillar electrodes form capacitances therebetween. | 06-04-2009 |
20090161288 | MULTILAYER CAPACITOR ARRAY - Among a plurality of first inner electrodes, at least one first inner and a second inner electrode are arranged as opposed with at least one of the dielectric layers in between. Third and fourth inner electrodes are arranged as opposed with at least one of the dielectric layers in between. The first inner electrodes are electrically connected to a first external connection conductor via lead conductors. The second inner electrode is electrically connected to a second terminal conductor via a lead conductor. The third inner electrode is electrically connected to a third terminal conductor via a lead conductor. The fourth inner electrode is electrically connected to a fourth terminal conductor via a lead conductor. Among all the first inner electrodes, one to multiple first inner electrodes that are less than the total first inner electrodes are electrically connected to the first terminal conductors via lead conductors. | 06-25-2009 |
20090161289 | Feedthrough multilayer capacitor mounting structure - A feedthrough multilayer capacitor mounting structure including a capacitor body, at least two each of first and second signal terminal electrodes, and at least one each of first and second grounding terminal electrodes. The capacitor body has a plurality of insulator layers laminated, a first signal inner electrode connected to two first signal terminal electrodes, a second signal inner electrode connected to two second signal terminal electrodes, a first grounding inner electrode connected to one first grounding terminal electrode, and a second grounding inner electrode connected to one second grounding terminal electrode. The first signal inner electrode and second grounding inner electrode include respective portions opposing each other while holding therebetween at least one of the insulator layers. The second signal inner electrode and first grounding inner electrode include respective portions opposing each other while holding therebetween at least one of the insulator layers. The first and second signal inner electrodes include respective portions opposing each other while holding therebetween at least one of the insulator layers. | 06-25-2009 |
20090213525 | MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes a capacitor body including first and second longer side surfaces facing each other and first and second shorter side surfaces facing each other, first and second external electrodes respectively disposed at the first and second longer side surfaces, one or more first internal electrode pairs each including first and second internal electrodes, and one or more second internal electrode pairs each including third and fourth internal electrodes. The first to fourth internal electrodes each have one lead and are sequentially disposed in a stacked direction. The first to fourth internal electrodes have first to fourth leads respectively extending to first to fourth corners or portions adjacent thereto, and alternately connected with the first and second external electrodes. The first internal electrode pair and the second internal electrode pair cause a current to diagonally flow in opposite directions with respect to a long side direction. | 08-27-2009 |
20090219668 | CAPACITOR DEVICES HAVING MULTI-SECTIONAL CONDUCTORS - A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode. | 09-03-2009 |
20090268369 | CAPACITOR STRUCTURE WITH RAISED RESONANCE FREQUENCY - A capacitor structure is provided. In the capacitor structure, a signal electrode plate and an extension ground electrode plate are disposed on the same plane to form a co-plane capacitor structure. Due to slow wave characteristic, the resonance frequency of the capacitor structure is effectively raised and the capacitor structure may be applied in high frequency. | 10-29-2009 |
20090268370 | Capacitor - A method of forming a capacitor includes forming a cylindrical lower electrode structure having an internal support structure on a substrate, forming a dielectric layer on the cylindrical lower electrode structure and the support structure, and forming an upper electrode on the dielectric layer. | 10-29-2009 |
20090284896 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes a ceramic element and two external electrodes on both end surfaces of the ceramic element. The ceramic element includes a function part and lead parts thinner than the function part. Internal electrode layers are provided facing each other via a ceramic layer therebetween in the function part. The internal electrode layers are drawn out of the function part in the lead part. The external electrode includes an extended part and a curled part. The extended part is formed from the lead part through the function part on the main face. On the main face, the part of the extended part in the lead part is lower than the part of the function part. The curled part is formed from the end face of the ceramic element through the surface of the part of the extended part in the lead part on the main face. | 11-19-2009 |
20090284897 | CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND COLLECTIVE COMPONENT - A collective component has a first region that intersects a conductive paste film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect a conductive paste film for external terminal electrodes in the break line. The first break leading holes are formed in the first region so as not to reach the second region. The second break leading holes are formed only in the second region or from the second region to a portion of the first region. The pitch of the first break leading holes is wider than the pitch of the second break leading holes. | 11-19-2009 |
20090290280 | LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles. | 11-26-2009 |
20090310276 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A multilayer ceramic electronic component includes external terminal electrodes that are formed by direct plating on the first and second side surfaces of a ceramic body including stacked ceramic layers and inner conductors. The external terminal electrodes include base plating films formed so as to cover the exposed portions of inner conductors. Voids are provided that are open to the side surfaces of the ceramic body so as to be adjacent to the ends in the width direction of the exposed portions of the inner conductors. A plating metal defining the base plating films enters the voids and is electrically connected to the inner conductors in the ceramic body. | 12-17-2009 |
20100039750 | MULTILAYER CAPACITOR - A multilayer capacitor comprises a capacitor element body constituted by a plurality of laminated dielectric layers; first and second signal terminal electrodes and a ground terminal electrode which are arranged on an outer surface of the capacitor element body; and a ground electrode, first and second signal electrodes, and an intermediate internal electrode which are arranged within the capacitor element body. The first signal electrode is connected to the first signal terminal electrode, while the second signal electrode is connected to the second signal terminal electrode. The ground electrode is connected to the ground terminal electrode and has a first region overlapping the first signal electrode in a first direction in which the plurality of dielectric layers are laminated and a second region overlapping the second signal electrode in the first direction. The intermediate internal electrode is arranged such as to be separated from the first and second signal terminal electrodes and the ground terminal electrode and positioned between the first signal electrode and the ground electrode and between the second signal electrode and the ground electrode. The intermediate internal electrode has a region overlapping the first region in the first direction and a region overlapping the second region in the first direction. | 02-18-2010 |
20100061036 | INTERDIGITATED CAPACITORS - The specification describes matched capacitor pairs that employ interconnect metal in an interdigitated form, and are made with an area efficient configuration. In addition, structural variations between capacitors in the capacitor pair are minimized to provide optimum matching. According to the invention, the capacitor pairs are interdigitated in a manner that ensures that the plates of each pair occupy common area on the substrate. Structural anomalies due to process conditions are compensated in that a given anomaly affects both capacitors in the same way. Two of the capacitor plates, one in each pair, are formed of comb structures, with the fingers of the combs interdigitated. The other plates are formed using one or more plates interleaved between the interdigitated plates. | 03-11-2010 |
20100067169 | CAPACITOR STRUCTURE - A capacitor structure is disclosed. The capacitor structure includes at least a D | 03-18-2010 |
20100073845 | THIN FILM CAPACITORS ON METAL FOILS AND METHODS OF MANUFACTURING SAME - Disclosed are methods of making a dielectric on a metal foil, and a method of making a large area capacitor that includes a dielectric on a metal foil. A first dielectric layer is formed over the metal foil by physical vapor deposition, and a dielectric precursor layer is formed over the first dielectric layer by chemical solution deposition. The metal foil, first dielectric layer and dielectric precursor layer are prefired at a prefiring temperature in the range of 350 to 650° C. The prefired dielectric precursor layer, the first dielectric layer and the base metal foil are subsequently fired at a firing temperature in the range of 700 to 1200° C. | 03-25-2010 |
20100085682 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces. | 04-08-2010 |
20100123993 | ATOMIC LAYER DEPOSITION PROCESS FOR MANUFACTURE OF BATTERY ELECTRODES, CAPACITORS, RESISTORS, AND CATALYZERS - The present disclosure relates generally to the field of sequential surface chemistry. More specifically, it relates to products and methods for manufacturing products using Atomic Layer Deposition (“ALD”) to depose one or more materials onto a surface. ALD is an emerging variant of Chemical Vapor Deposition (“CVD”) technology with capability for high-quality film deposition at low pressures and temperatures, which may produce defect-free films, on a macroscopic scale, at any given thickness. The present disclosure includes, in varying embodiments, methods of manufacturing microelectronic assemblies and components such as battery electrodes, capacitors, resistors, catalyzers and PCB assemblies by ALD, and the products manufactured by those methods. | 05-20-2010 |
20100157506 | MULTILAYER CAPACITOR - Each of second terminal portions of a first terminal electrode has a wide part a width of which is larger than a first lead width of lead portions in each first internal electrode, and a narrow part a width of which decreases from the wide part toward the second terminal electrode and toward the first or second side face side. In a multilayer capacitor, the wide part causes an electric current to flow in the lead portions of the first internal electrodes in a direction opposite to that of an electric current flowing in the first terminal electrode, so as to cancel magnetic field thereof each other and thereby reduce ESL, and the narrow part prevents a solder bridge from occurring between the first terminal electrode and the second terminal electrode in a work of mounting the terminal electrodes of the multilayer capacitor on a circuit board or the like. | 06-24-2010 |
20100165541 | DIELECTRIC CERAMICS, AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic contains a BaTiO | 07-01-2010 |
20100177459 | PROCESS FOR FABRICATING CROWN CAPACITORS OF DRAM AND CAPACITOR STRUCTURE - A process for fabricating crown capacitors is described. A substrate having a template layer thereon is provided. A patterned support layer is formed over the template layer. A sacrifice layer is formed over the substrate covering the patterned support layer. Holes are formed through the sacrifice layer, the patterned support layer and the template layer, wherein the patterned support layer is located at a depth at which bowing of the sidewalls of the holes occurs and is bowed less than the sacrifice layer at the sidewalls. A substantially conformal conductive layer is formed over the substrate. The conductive layer is then divided into lower electrodes of the crown capacitors. | 07-15-2010 |
20100182732 | MULTILAYER CAPACITOR - A multilayer capacitor is provided which can efficiently prevent chattering noises from occurring in a simple structure. | 07-22-2010 |
20100188797 | LAMINATED CERAMIC CAPACITOR - A crystal constituting a dielectric porcelain, comprised of a first crystal group composed of crystal grains of 0.2 atomic % or less calcium concentration and a second crystal group composed of crystal grains of 0.4 atomic % or more calcium concentration, wherein the ratio of concentration of each of magnesium and a first rare earth element contained in a center portion to that contained in a surface layer portion of crystal grains constituting the first crystal group is greater than the corresponding concentration ratio of crystal grains constituting the second crystal group, and wherein on a polished surface resulting from polishing of the surface of the dielectric porcelain, when the area of crystal grains of the first crystal group is referred to as a and the area of crystal grains of the second crystal group referred to as b, the ratio of b/(a+b) is in the range of 0.5 to 0.8. | 07-29-2010 |
20100195260 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic containing ABO | 08-05-2010 |
20100202097 | Method for Producing a Multilayer Component - A method for producing a multilayer component is described. A stack of green foils, to which inner electrodes including palladium oxide are applied, is sintered. The sintered stack is provided with a silver paste on two or more sides for outer electrodes that are burned into the sintered stack in a further temperature step. | 08-12-2010 |
20100214717 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor capable of achieving both a high dielectric constant and high electrical insulation property even when the thickness of the dielectric ceramic layer is less than 1 μm, contains a plurality of laminated dielectric ceramic layers and a plurality of internal electrodes at interfaces between the dielectric ceramic layers, where dielectric ceramic layers are made of dielectric ceramic containing a perovskite-type compound represented by ABO | 08-26-2010 |
20100232085 | ELECTRONIC DEVICES WITH FLOATING METAL RINGS - A electronic device is provided. The electronic device comprises first and second electrodes and a first floating metal ring. The first and second electrodes are formed in a first layer. The first floating metal ring is formed in the first layer and encloses the first electrode and the second electrode. Thus, noise on a conducting line near the electronic device does not directly affect differential signals on the first and second electrodes. | 09-16-2010 |
20100232086 | MULTILAYER CAPACITOR - There are a plurality of types of first internal electrodes and each type of first internal electrode includes a first main electrode portion and a first lead portion. A second internal electrode includes a plurality of second main electrode portions forming respective capacitance components with the respective types of first internal electrodes, an interconnection portion connecting between each pair of second main electrode portions, and a second lead portion. Positions of the first lead portions of the respective types of first internal electrodes are different from each other and distances from the first lead portions of the respective types of first internal electrodes to the second lead portion are different from each other. The width of the interconnection portion is smaller than the width of at least one second main electrode portion out of the plurality of second main electrode portions. | 09-16-2010 |
20100238604 | Surface mounting type high voltage capacitor with array structure - Provided is a surface mounting type high voltage ceramic capacitor with an array structure that may form a plurality of capacitors in an array structure to thereby simultaneously mount the plurality of capacitors on a printed circuit board, and thus may reduce a work procedure and enhance a work productivity. The surface mounting type high voltage ceramic capacitor with an array structure, may include: a ceramic member | 09-23-2010 |
20100271752 | LAMINATED CERAMIC ELECTRONIC COMPONENT - In a laminated ceramic electronic component including a ceramic element body including a plurality of effective sections, each of which constitutes a circuit element such as a laminated capacitor unit, bumps generated between the effective portions and a gap interposed between the effective portions can be made minimized. Specifically, the ceramic element body includes a first effective section including a first circuit element and a second effective section including a second circuit element. A gap is provided between the first and second effective section. Floating internal conductors are arranged in the gap at least in one of first and second external layer sections, the first external section being interposed between a first main surface and the first and second effective sections, and the second external layer section being interposed between a second main surface and the first and second effective sections. | 10-28-2010 |
20100321860 | Multilayer Capacitor - The invention relates to a multilayer capacitor capable of controlling ESR while maintaining the level of ESL low. A multilayer capacitor ( | 12-23-2010 |
20110019335 | CAPACITOR STRUCTURE - The disclosure provides a capacitor structure. A first dielectric layer is disposed over the first electrode layer. A second electrode layer is disposed over the first dielectric layer. At least one of the first electrode layer and the second electrode layer has a peak-valley like structure to create at least two different gap distances therebetween, thereby providing parallel combinations of at least two different capacitances. | 01-27-2011 |
20110075317 | THIN-FILM CAPACITOR AND MANUFACTURING METHOD THEREOF - To provide a thin-film capacitor capable of improving the stability of electric connection between an internal electrode layer and a connection electrode. The thin-film capacitor comprises: two or more dielectric layers deposited above a base electrode; an internal electrode layer being deposited between the dielectric layers and having a projecting portion which projects from the dielectric layer when seen from a laminating direction; and a connection electrode electrically connected to the internal electrode layer via at least a part of a surface and an end face of the internal electrode layer included in the projecting portion, wherein a ratio L/t between a projection amount L of the projecting portion of the internal electrode layer with respect to the dielectric layer and a thickness t of the internal electrode layer is 0.5 to 120. | 03-31-2011 |
20110075318 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component has a variety of superior mechanical properties and electrical properties, including a high degree of freedom in the design for ceramic materials, and can be manufactured at low cost and with a low percentage of defective products. The laminated ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes containing Al as a main constituent, the internal electrodes being arranged along specific interfaces between the ceramic layers, and external electrodes located on an outer surface of the laminate, wherein surface layer sections of the internal electrodes include an Al | 03-31-2011 |
20110090617 | CAPACITOR ELECTRODE, CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME - A method of fabricating a capacitor electrode. A stack structure is formed on a substrate, and the stack structure includes a first conductive layer, a first sacrificial layer, and a second sacrificial layer. The stack structure includes a first sidewall and a second sidewall facing the first sidewall. A conductive sidewall is formed on the first sidewall and the second sidewall to electrically connect the first conductive layer to the second conductive layer. Finally, the first and the second sacrificial layers are removed. | 04-21-2011 |
20110141655 | MULTILAYER CERAMIC CAPACITOR - Disclosed is multilayer ceramic capacitor. The multilayer ceramic capacitor includes a capacitive part including dielectric layers and first and second internal electrodes alternately laminated therein, wherein the dielectric layers include first ceramic particles having an average particle size of 0.1 μm to 0.3 μm, and one set of ends of the first internal electrodes and one set of ends of the second internal electrodes are exposed in a lamination direction of the dielectric layers, a protective layer formed on at least one of top and bottom surfaces of the capacitive part, including second ceramic particles and having a porosity of 2% to 4%, wherein an average particle size ratio of the second ceramic particles to the first ceramic particles ranges from 1.1 to 1.3; and first and second external electrodes electrically connected to the first and second internal electrodes exposed in the lamination direction of the dielectric layers. | 06-16-2011 |
20110141656 | MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - A multilayer ceramic capacitor includes: a ceramic element; a plurality of first and second inner electrodes formed at the interior of the ceramic element and including capacity contribution portions facing each other and capacity non-contribution portions extending from the capacity contribution portions and having one end alternately exposed from the side of the ceramic element; first and second outer electrodes formed at the side of the ceramic main body and electrically connected with the first and second inner electrodes, wherein the thickness of the capacity non-contribution portion is greater than that of the capacity contribution portion and connectivity of the capacity non-contribution portion is higher than that of the capacity contribution portion at one or more of the first and second inner electrodes. | 06-16-2011 |
20110149466 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor. The multilayer ceramic capacitor includes a capacitor body including a plurality of inner electrodes and a plurality of dielectric layers alternated with the plurality of inner electrodes, and outer electrodes respectively disposed on both sides surfaces of the capacitor body and electrically connected with the inner electrodes. The inner electrodes are stacked such that three or more inner electrodes, electrically connected with the same outer electrode, are successively stacked and alternated with the dielectric layers. | 06-23-2011 |
20110157765 | MULTILAYER CERAMIC CAPACITOR AND FABRICATING METHOD THEREOF - A multilayer ceramic capacitor includes a capacitor body in which inner electrodes and dielectric layers are alternately laminated, and a length difference rate (D) of the inner electrodes is 7% or less. The length difference rate (D) is defined by D={L−1}/L×100, where L is a maximum length of the inner electrode, and l is a minimum length of the inner electrode. | 06-30-2011 |
20110157766 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor. The multilayer ceramic capacitor includes inner electrodes and dielectric layers stacked alternately with each other. When a continuity level of each of the inner electrodes is defined as B/A where A denotes a total length of the inner electrode and B denotes a length of the inner electrode excluding pores of the inner electrode, and a section of the inner electrode, having a predetermined length from each end of the inner electrode, is defined as an outer section, a section of the inner electrode excluding the outer section is defined as an inner section, and a section of the dielectric layers from each end of the inner electrode to a corresponding surface of the multilayer ceramic capacitor is defined as an edge section, a length of the outer section is 0.1 to 0.3 times that of the edge section, and the outer section of the inner electrode has a lower continuity level than that of the inner section of the inner electrode. | 06-30-2011 |
20120008250 | DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR AND FILM CAPACITOR - To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking. | 01-12-2012 |
20120014035 | CLAD FIBER CAPACITOR AND METHOD OF MAKING SAME - A clad capacitor and method of manufacture includes assembling a preform comprising a ductile, electrically conductive fiber; a ductile, electrically insulating cladding positioned on the fiber; and a ductile, electrically conductive sleeve positioned over the cladding. One or more preforms are then bundled, heated and drawn along a longitudinal axis to decrease the diameter of the ductile components of the preform and fuse the preform into a unitized strand. | 01-19-2012 |
20120019979 | OFFSET RISER WIRE - An anode with a pellet wherein the pellet has a bottom surface. The anode further also has an anode wire with a primary axis and extending beyond the pellet along the primary axis wherein the anode wire has a cross-section perpendicular to the primary axis wherein the cross-section of the anode wire breaches the bottom surface. | 01-26-2012 |
20120081834 | CONCENTRATED CAPACITOR ASSEMBLY - A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace. | 04-05-2012 |
20120099242 | CAPACITOR ELECTRODE BODY, METHOD FOR MANUFACTURING THE CAPACITOR ELECTRODE BODY, CAPACITOR, AND METHOD FOR MANUFACTURING THE CAPACITOR - An anode body includes an anode substrate, made of at least one of a valve metal and its alloy, and a porous layer, disposed on the anode substrate, which is formed of a combination of a plurality of second particles each composed of first metal particles. The porous layer includes a diffusely packed region X, formed within the secondary particles, and a closely packed region Y, formed between the anode substrate and the secondary particles and between the respective secondary particles. The closely packed region Y has a lower porosity than that of the diffusely packed region X. | 04-26-2012 |
20120099243 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via. | 04-26-2012 |
20120154977 | CONDUCTIVE PASTE COMPOSITION FOR TERMINATION ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME AND METHOD OF MANUFACTURING THEREOF - There are provided a conductive paste composition for a termination electrode, a multilayer ceramic capacitor having the same, and a method thereof. The conductive paste composition for a termination electrode includes a conductive metal powder and a glass frit represented by the following Formula: aSiO | 06-21-2012 |
20120194965 | ELECTRONIC COMPONENT AND SUBSTRATE MODULE - A multilayer body includes first and second capacitance conductors and an internal conductor, which define a capacitor, provided therein. First and second external electrodes are respectively connected to the first and second capacitance conductors via first and second led out conductors. The internal conductor faces the first and second capacitance conductors. Third and fourth external electrodes are connected to the first capacitance conductor via third and fourth led out conductors. Fifth and sixth external electrodes are connected to the second capacitance conductor via fifth and sixth led out conductors. | 08-02-2012 |
20120212878 | DECOUPLING CAPACITOR - An electronic device package includes first and second electrodes of a package substrate. The first electrode has fingers formed from a first metal level and is configured to operate at a first DC potential. The second electrode has fingers formed from the first metal level interdigitated with the fingers of the first electrode. A via conductively connects the second electrode to a second metal level. The second metal level is configured to operate at a second DC potential. The first and second DC potentials are thereby capacitively coupled through the interdigitated electrodes. | 08-23-2012 |
20120218678 | CAPACITOR - [Object] To provide a capacitor in which generation of warpage of a laminate can be prevented. | 08-30-2012 |
20120250219 | HIGH VOLTAGE CAPACITORS - A multilayer ceramic capacitor component includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers, first and second external terminals attached to the ceramic capacitor body. The plurality of electrode layers include a plurality of alternating layers of active electrodes extending inwardly from alternating ends of the ceramic capacitor body. The capacitor may include a plurality of side shields disposed within the plurality of alternating layers of active electrodes to provide shielding with the alternating layers of active electrodes having a pattern to increase overlap area to provide higher capacitance without decreasing separation between the alternative layers of active electrodes. The capacitor may have a voltage breakdown of 3500 volts DC or more in air. The capacitor may have a coating. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size. | 10-04-2012 |
20120281337 | ELECTRONIC DEVICES WITH FLOATING METAL RINGS - A electronic device is provided. The electronic device includes a first electrode formed in a first layer; a second electrode formed in the first layer, wherein the first electrode and the second electrode are symmetrically disposed with respect to a first point; and a first floating metal ring formed in the first layer and enclosing the first electrode and the second electrode. | 11-08-2012 |
20130038982 | MULTILAYER CERAMIC CONDENSER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a multilayer ceramic condenser and a method for manufacturing the same. The multilayer ceramic condenser includes inner metal electrode layers formed within a magnetic layer, and conductive layers each formed between the inner metal electrode layers, and a method for manufacturing the same. | 02-14-2013 |
20130120900 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes, wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%. | 05-16-2013 |
20130120901 | CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - The capacitor includes, a pair of conductor layers opposed to each other at a predetermined distance; a dielectric layer interposed between the pair of conductor layers and composed of an oxide of valve metal; a multitude of holes formed through the dielectric layer, so as to be orthogonal to the pair of conductor layers and reach each of the pair of conductor layers; first electrodes and second electrodes formed by filling an electrode material in the holes and connected to one and the other one of the conductor layers, respectively; and insulators for electrically insulating the first electrodes from the other one of the pair of the conductor layers and the second electrodes from the one of the pair of the conductor layers, wherein the holes are formed so that the size of the diameter thereof observed in a cross-section of the dielectric layer parallel to the conductor layers becomes gradually larger from a cross-sectional position at one end of the dielectric layer toward a cross-sectional position at the other end of the dielectric layer. | 05-16-2013 |
20130120902 | SUBSTRATE-INCORPORATED CAPACITOR, CAPACITOR-INCORPORATING SUBSTRATE PROVIDED WITH THE SAME, AND METHOD FOR MANUFACTURING SUBSTRATE-INCORPORATED CAPACITOR - A substrate-incorporated capacitor includes a first electrode extending in a predetermined direction, a dielectric layer arranged on the first electrode, a second electrode arranged on the dielectric layer and facing the first electrode through the dielectric layer, wherein the second electrode includes an end projecting from the dielectric layer in the predetermined direction, and an electrode layer spaced apart from the first electrode in the predetermined direction. The end of the second electrode is connected to the electrode layer in the predetermined direction. The electrode layer includes a surface that is flush with a surface of the first electrode. | 05-16-2013 |
20130128410 | METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR - A method of manufacturing a thin film capacitor, having: a base electrode; dielectric layers consecutively deposited on the base electrode; an internal electrode deposited between the dielectric layers; an upper electrode deposited opposite the base electrode with the dielectric layers and the internal electrode being interposed therebetween; and a cover layer deposited on the upper electrode, has depositing an upper electrode layer which is to be the upper electrode, and a cover film which is to be the cover layer on the unsintered dielectric film which is to be the dielectric layer, to fabricate a lamination component, and sintering the lamination component. | 05-23-2013 |
20130148258 | CAPACITOR STRUCTURE - A capacitor structure including a dielectric material layer and at least two metal layers is provided. The metal layers are disposed at intervals in the dielectric material layer. Each of the metal layers includes a zigzaging electrode, a first finger-shaped electrode and a second finger-shaped electrode. The zigzaging electrode forms a plurality of first concave parts disposed at one side of the zigzaging electrode and a plurality of second concave parts disposed at the other side of the zigzaging electrode. The first finger-shaped electrode includes a plurality of first extension parts. The first extension parts are respectively disposed in the first concave parts. The second finger-shaped electrode includes a plurality of second extension parts. The second extension parts are respectively disposed in the second concave parts. The zigzaging electrode in each of the metal layers is electrically coupled to the first and second finger-shaped electrodes of adjacent metal layers. | 06-13-2013 |
20130148259 | CAPACITOR AND METHOD OF MANUFACTURING SAME - One object is to provide a capacitor that can have an improved capacitance value without sacrificing a dielectric breakdown voltage and a method for manufacturing the capacitor, or a capacitor that can have an improved dielectric breakdown voltage without sacrificing the capacitance value and a method for manufacturing the capacitor. In accordance with one aspect, a capacitor includes a porous dielectric layer obtained by metal anodization; columnar electrodes filled into the holes of the dielectric layer; a first external electrode formed on one principal surface of the dielectric layer and electrically conductive to some of the columnar electrodes; and second external electrodes formed on the other principal surface of the dielectric layer and electrically conductive to columnar electrodes not electrically conductive to the first external electrode. The second external electrodes are disposed so as to be electrically isolated from each other. | 06-13-2013 |
20130194719 | CAPACITOR ARRAY AND SIGNAL PROCESSOR INCLUDING THE ARRAY - A capacitor array includes a plurality of comb capacitors sharing a common comb electrode. At least one of the comb capacitors has a comb electrode as a single base part. Each of the other ones of the comb capacitors has an electrode formed by coupling a plurality of base parts. In the other ones of the comb capacitors, a space between a wire coupling the base parts and an end of each of comb teeth of the common electrode, which is interposed between the base parts, is larger than a space between a base of each of the base parts of the plurality of comb capacitors and an end of each of the comb teeth of the common electrode, which is interposed between comb teeth of the base part. | 08-01-2013 |
20130201603 | ARRAY-TYPE MULTILAYERED CERAMIC ELECTRONIC COMPONENT - There is provided an array-type multilayered ceramic electronic component including: a ceramic body; a plurality of external electrodes formed on one surface of the ceramic body and the other surface thereof opposing the one surface; and a plurality of internal electrode multilayered parts formed in the ceramic body and connected to the external electrodes, respectively, wherein when a gap between the internal electrode multilayered parts is G and internal electrode density is D, 40%≦D≦57%, 10 μm≦G≦200 μm, and G≧(0.0577×D | 08-08-2013 |
20130201604 | POROUS CAPACITORS AND METHOD FOR MANUFACTURING THE SAME - One object is to provide a porous capacitor having an improved mechanical strength and a method of manufacturing the porous capacitor. In accordance with one aspect, the porous capacitor has a first conductor layer a second conductor layer opposed to each other at a certain distance, a dielectric layer made of an oxidized valve metal and disposed between the first conductor layer and the second conductor layer, a large number of holes in the dielectric layer substantially orthogonal to the first conductor layer and the second conductor layer, first and second electrodes made of a conductive material filled in the holes, insulators for electrically insulating the first electrodes from the second conductor layer and the second electrodes from the first conductor layer, wherein the levels of the ends of the first and/or second electrodes electrically insulated from the second and/or first conductor layers are uneven with each other. | 08-08-2013 |
20130208400 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 □m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths. | 08-15-2013 |
20130242460 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic including: a ceramic body; and a plurality of internal electrodes laminated within the ceramic body, wherein, when T1 is the greatest distance between an upper outermost internal electrode and a lower outermost internal electrode among the plurality of internal electrodes and T2 is the distance between the highest point and the lowest point in each of the upper outermost internal electrode and the lower outermost internal electrode in a thickness direction of the ceramic body, T2/T1<0.05 is satisfied, and thus, defects in alignment of internal electrodes of the multilayer ceramic electronic component may be suppressed. | 09-19-2013 |
20130250476 | ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t | 09-26-2013 |
20130250477 | CAPACITOR STRUCTURES AND METHODS OF FORMING THE SAME - A method of forming a capacitor structure includes forming a mold layer on a substrate, in which the substrate includes a plurality of plugs therein, partially removing the mold layer to form a plurality of openings, in which the plugs are exposed by the openings, forming a plurality of lower electrodes filling the openings, in which the lower electrodes have a pillar shape, removing an upper portion of the mold layer to expose upper portions of the lower electrodes, forming a supporting pattern on exposed upper sidewalls of the lower electrodes and on the mold layer, removing the mold layer, and sequentially forming a dielectric layer and an upper electrode on the lower electrodes and the supporting pattern. | 09-26-2013 |
20130286538 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a manufacturing method thereof, the multilayer ceramic electronic component including: a ceramic body including dielectric layers; a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein a thickness to of the internal electrode satisfies 0.1 μm≦Te≦0.5 μm, and when, in a cross-section of the ceramic body taken in length and thickness directions, cut through a central portion of the ceramic body in a width direction, a distance, in the length direction, of a central portion of an internal electrode grain closest to a disconnected portion of the internal electrode is denoted by Tc, and a distance, in the length direction, of the internal electrode grain at a point equal to 25% of the thickness thereof above or below the central portion thereof is denoted by Tl, 0.7≦Tl/Tc≦1.3 is satisfied. | 10-31-2013 |
20130286539 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body; and internal electrodes formed inside the ceramic body and having a plurality of non-electrode regions, wherein, on a cross-section taken in length and thickness directions of the ceramic body, when a thickness of the internal electrode is denoted by Te, a continuity of the internal electrode is denoted by C, an area of the internal electrode is denoted by Ae, an area of the plurality of non-electrode regions is denoted by Ao, and a maximum diameter of the non-electrode region having the maximum diameter among the plurality of non-electrode regions is denoted by Pmax, 0.1 μm≦Te≦0.5 μm, 1.1%≦Ao/Ae≦3.2%, Pmax≦120 nm, and 95%≦C≦99.5% are satisfied. | 10-31-2013 |
20130286540 | MIM CAPACITOR - A method of forming a metal- insulator-metal capacitor having top and bottom plates separated by a dielectric layer, one of the top and bottom plates having at least one protrusion extending into a corresponding cavity in the other of the top and bottom plates, the method including the steps of growing one or more nanofibers on a base surface. | 10-31-2013 |
20130301187 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a capacitor plate includes a first propeller-shaped portion and a second propeller-shaped portion. A via portion is disposed between the first propeller-shaped portion and the second propeller-shaped portion. | 11-14-2013 |
20130314842 | THIN FILM CONDENSER FOR HIGH-DENSITY PACKAGING, METHOD FOR MANUFACTURING THE SAME, AND HIGH-DENSITY PACKAGE SUBSTRATE INCLUDING THE SAME - Provided are a thin film condenser for high-density packaging, a method for manufacturing the same and a high-density package substrate. The thin film condenser for high-density packaging, includes: a support substrate; a lower electrode formed on the support substrate; a dielectric thin film formed on the lower electrode; and an upper electrode formed on the dielectric thin film. Provided also is a method for manufacturing the same. The high-density package substrate, includes: at least two stacked substrates; thin film condensers embedded in the stacked substrates; an internal connection electrode formed in the stacked substrates and connecting the thin film condensers in series or in parallel; a surface electrode formed on the surface of the outermost substrate among the stacked substrates and connected to the internal connection electrode; and an integrated circuit connected to the surface electrode via a bump. | 11-28-2013 |
20130329337 | CAPACITOR - A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and a close contact portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The close contact portion brings at least any one of the first external electrode layer and the second external electrode layer into close contact with the dielectric layer, the close contact portion being provided on a third through-hole portion. | 12-12-2013 |
20130335880 | CAPACITOR, STRUCTURE AND METHOD OF FORMING CAPACITOR - There is provided a capacitor including a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane, including a plurality of arrangement regions where arrangement directions of the plurality of through-holes are same; a first external electrode layer disposed on the first plane; a second external electrode layer disposed on the second plane; a first internal electrode housed in a part of the plurality of through-holes and connected to the first external electrode layer; and a second internal electrode housed in a part of the plurality of through-holes and connected to the second external electrode layer. | 12-19-2013 |
20130335881 | CAPACITOR DEVICE - The present invention is a capacitor device comprising: | 12-19-2013 |
20140016242 | ELECTRONIC COMPONENT - A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate. | 01-16-2014 |
20140029159 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a laminated ceramic electronic component, a side-surface outer electrode includes a first electrode portion including side-surface electrode portions located on first and second side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the first electrode portion to portions of third and fourth side surfaces; and a second electrode portion including side-surface electrode portions located on the third and fourth side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the second electrode portion to portions of the first and second side surfaces. The wrap-around electrode portions of the second electrode portion reach regions covering portions of outermost inner electrodes located at an outermost side portion among inner electrodes, which portions are exposed in the first and second side surfaces. | 01-30-2014 |
20140055910 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face | 02-27-2014 |
20140092523 | BONE FRAME, LOW RESISTANCE VIA COUPLED METAL OXIDE-METAL (MOM) ORTHOGONAL FINGER CAPACITOR - An orthogonal finger capacitor includes a layer having an anode bone frame adjacent a cathode bone frame, the anode bone frame having a first portion extending along an axis and a second portion extending perpendicular to the axis. A set of anode fingers extends from the first portion. A set of cathode fingers extends from the cathode bone frame, interdigitated with the set of anode fingers. An overlaying layer has another anode bone frame having a first portion parallel to the axis and a perpendicular second portion. A via couples the overlaying anode bone frame to the underlying anode bone frame. The via is located where the first portion of the overlaying anode bone frame overlaps the second portion of the underlying anode bone frame or, optionally, where the second portion of the overlying anode bone frame overlaps the first portion of the underlying anode bone frame. | 04-03-2014 |
20140104748 | MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multi-layered ceramic electronic component and a method of manufacturing the same. The multi-layered ceramic electronic component includes: a ceramic body; internal electrodes formed within the ceramic body and including non-electrode regions formed therein; and external electrodes formed on ends of the ceramic body and electrically connected to the internal electrodes, wherein in a cross section of the internal electrode, 70% or more of the non-electrode regions are distributed in a region formed between points inwardly spaced apart from each of the upper and lower boundary surfaces of the internal electrodes by 5%. | 04-17-2014 |
20140126105 | CAPACITOR STRUCTURE AND PROCESS FOR FABRICATING THE SAME - A process for fabricating a capacitor is described. A template layer including a stack of at least one first layer and at least one second layer is formed over a substrate, wherein the at least one first layer and the at least one second layer have different etching selectivities and are arranged alternately. An opening is formed through the template layer. A wet etching process is performed to recess the at least one first layer relative to the at least one second layer, at the sidewall of the opening. A bottom electrode of the capacitor is formed at the bottom of the opening and on the sidewall of the opening, and then the template layer is removed. | 05-08-2014 |
20140126106 | LAMINATED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, SERIAL TAPING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND DIRECTION IDENTIFICATION METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT - In a laminated ceramic electronic component, a side surface outer electrode circles around a ceramic element body, a first electrode portion includes a first side surface electrode portion on first and second side surfaces of the ceramic element body and a first wrap-around electrode portion extending from the first side surface electrode portion and wraps around portions of third and fourth side surfaces, and a second electrode portion includes a second side surface electrode portion on the third and fourth side surfaces and a second wrap-around electrode portion extending from the second side surface electrode portion and wrap around portions of the first and second side surfaces. External appearance configurations in which the first and second wrap-around electrode portions are recognizable from outside are provided to the first and second wrap-around electrode portions. | 05-08-2014 |
20140126107 | CAPACITOR - This capacitor has: a single capacitor block provided with a plurality of capacitor elements electrically connected in parallel, each of said capacitor elements having a terminal part on each end; a first electrode plate that electrically connects the first terminal parts of the capacitor elements; a second electrode plate that electrically connects the second terminal parts of the capacitor elements and continues on to the side where the first terminal parts are; and at least one bypass electrode plate that electrically bypasses the second electrode plate. | 05-08-2014 |
20140126108 | HIGH ENERGY CAPACITORS - The following invention relates to high energy capacitors with increased thermal resilience over conventional bulk ceramic capacitors, particularly capacitors that may be formed into a three dimensional shape to fit inside an existing device. The capacitor is provided with first and second electrodes which have a plurality of interlocating protrusions, which increase the relative surface area of the electrodes. The first and second electrodes and interlocating protrusions are provided with through holes. The devices are filled with a flowable dielectric material. | 05-08-2014 |
20140133064 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 05-15-2014 |
20140153156 | MULTILAYERED CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - A multilayered ceramic capacitor includes a ceramic body in which a plurality of dielectric layers having an average thickness of 0.2 to 2.0 μm are stacked; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, to form capacitance; an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and thicker than the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the dielectric layer is configured of dielectric grains, and when an average thickness of the dielectric layer is defined as td, an average thickness of the first and second internal electrodes is defined as te, and an average grain size of the dielectric grains is defined as Da, Da≦td/3 and 0.2 μm06-05-2014 | |
20140160627 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes external electrodes having a multi-layer structure including an intermediate conductive resin layer, wherein the intermediate conductive resin layer in the external electrode is made of epoxy resin containing conductive filler, and the intermediate conductive resin layer meets both the condition B/A≦0.47 and condition C/A≧0.39 (A, B and C represent the maximum spectral intensities obtained based on the relationship line of the wave number and spectral intensity of the intermediate conductive resin layer as obtained by the ATR method). The ceramic electronic component minimizes separation that could occur at the interface between such intermediate conductive resin layer and a metal layer. | 06-12-2014 |
20140168851 | MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD WITH MULTILAYER CERAMIC CAPACITOR MOUNTED THERE ON - A multilayer ceramic capacitor includes a ceramic body having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another. First and second internal electrodes have an overlap region with lead out portions exposed to the first lateral surface of the ceramic body. An insulating layer is formed to cover the overlap region of the lead out portions exposed to the first lateral surface of the ceramic body; and first and second external electrodes are formed on the first lateral surface of the ceramic body on which the insulating layer is formed and electrically connected to the first and second internal electrodes. Thicknesses of the insulating layer from the first lateral surface and the first and second external electrodes from the first lateral surface are specified. | 06-19-2014 |
20140168852 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed having a thickness greater than that of the upper cover layer; and first and second external electrodes, wherein when an average of a length of an upper portion, a length of a middle portion, and a length of a lower portion of the ceramic body is I, and an average of values obtained by adding a length of an upper portion, a length of a middle portion, and a length of a lower portion of the first external electrode and a length of an upper portion, a length of a middle portion, and a length of a lower portion of the second external electrode is BW, BW/I satisfies a range of 0.105≦BW/I≦1.049. | 06-19-2014 |
20140177131 | HIGH VOLTAGE CAPACITOR - A high voltage capacitor comprises a columnar capacitor element body, made of a dielectric material, having a pair of principal surfaces opposing each other; a pair of electrodes arranged on the respective principal surfaces; a pair of terminal metal fittings connected to the respective electrodes; a case; and a resin part. The case contains a resin material and has a bottom part formed with an opening for exposing the terminal metal fitting and a trunk part extending from an edge of the bottom part in a direction intersecting the bottom part. The bottom part and trunk part define a space for containing the capacitor element body. The resin part is made of an insulating material and arranged within the case so as to seal the capacitor element body within the case. The case has a degree of hardness lower than that of the resin part. | 06-26-2014 |
20140185186 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the ceramic body includes an active layer forming capacitance by including the plurality of first and second internal electrodes and a cover layer formed on an upper portion or a lower portion of the active layer, wherein the active layer includes a first block in which a first region I, and a second region II, and a second block in which a third region III, and a fourth region IV. | 07-03-2014 |
20140218840 | DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There are provided a dielectric composition and a multilayer ceramic electronic component using the same, the dielectric composition including dielectric grains having a perovskite structure represented by ABO | 08-07-2014 |
20140240898 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including a ceramic body, and an internal electrode formed in the ceramic body and having a plurality of non-electrode regions formed therein, wherein in a cross section formed in length and thickness directions of the ceramic body, when a thickness of the internal electrode is Te, an area of the internal electrode is Ae, and an area of the plurality of non-electrode regions is Ao, 0.1 μm≦Te≦0.55 μm and 3.2%≦Ao:Ae≦4.5% are satisfied. | 08-28-2014 |
20140254064 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing an electronic component, when conductive paste used to form outer electrodes is applied to a component body, a side surface of the component body is subjected to an affinity-reducing process to reduce an affinity for solvent, and then an end surface of the component body is dipped into the conductive paste. Accordingly, spreading of the conductive paste stops at ridge portions of the component body, and the conductive paste is applied to a large thickness. After that, the end surface of the component body is dipped deeper into the conductive paste. Also in this step, the affinity-reducing process prevents upward spreading of the conductive paste along the side surface. | 09-11-2014 |
20140301019 | ELECTRODE STRUCTURE OF A LAMINATED METALLIZATION FILM CAPACITOR - An electrode structure of a laminated metallization film capacitor includes at least two laminated metallization films. Each metallization film is further disposed with a plurality of metal-uncoated curved gap strips with a certain width on the plane of section of the laminated metallization film capacitor core to separate two adjacent metal coating units partially or totally. A center of the curved gas strip is concaved with a notch. Both sides of the notch form like misaligned shoulders. A projection forms opposite to the open of the notch; in two adjacent curve gap strips. An extreme point of the projection of one curve gap strip is disposed inside the notch of the other one in any event. | 10-09-2014 |
20150022948 | CAPACITOR STRUCTURE - A capacitor structure includes a first electrode structure and a second electrode structure. The first electrode structure includes a first negative plate and a first positive plate spaced apart from each other. The first electrode structure has a first horizontal capacitance between the first negative plate and the first positive plate. The second electrode structure includes a second positive plate and a second negative plate spaced apart from each other on the first electrode structure. The second electrode structure has a second horizontal capacitance between the second negative plate and the second positive plate. First and second vertical capacitances are formed between the first negative plate and the second positive plate and between the first positive plate and the second negative plate. | 01-22-2015 |
20150043126 | Thin Film Capacitors Embedded in Polymer Dielectric - A substrate comprising a capacitor comprising metal electrodes and a ceramic or metal oxide dielectric layer, the capacitor being embedded in a polymer based encapsulating material and connectable to a circuit via a via post standing on said capacitor. | 02-12-2015 |
20150043127 | MULTI-LAYER COMPONENT AND METHOD FOR PRODUCING SAME - The multi-layer component has a main body ( | 02-12-2015 |
20150092317 | MAGNETICALLY ENHANCED ENERGY STORAGE SYSTEMS AND METHODS - In one embodiment, a system, comprising: a first non-magnetic conductive electrode; a second non-magnetic conductive electrode; a dielectric layer disposed between the first and second electrodes, the dielectric layer extending between the first and second electrodes; and first and second layers comprising plural pairs of magnetically coupled pairings of discrete magnets, the first and second layers separated by a non-magnetic material, wherein the magnets of at least the first layer are conductively connected to the first non-magnetic conductive electrode. | 04-02-2015 |
20150131203 | ELECTRONIC DEVICES WITH FLOATING METAL RINGS - A electronic device is provided. In one configuration, the electronic device includes a first electrode formed in a first layer; a second electrode formed in the first layer, wherein the first electrode and the second electrode are reflection symmetrically disposed; and a first floating metal ring formed in the first layer and enclosing the first electrode and the second electrode. The shape of the first electrode is the same shape as the second electrode. | 05-14-2015 |
20150131204 | VERTICAL METAL INSULATOR METAL CAPACITOR - A capacitor structure includes at least two capacitors. A first electrode includes a bottom conductive plane and first vertical conductive structures. The bottom conductive plane is disposed over a substrate. The bottom conductive plane has a first area and a first shape. At least two second electrodes include top conductive planes and second vertical conductive structures. A combined area of the top conductive planes and a gap area between adjacent top conductive planes has a second area and a second shape. The first area and the second area are about the same and the first shape and the second shape are about the same. An insulating structure is disposed between the first electrode and the second electrodes. The first vertical conductive structures and the second vertical conductive structures are interlaced with each other. The capacitors share the bottom conductive plane and have separate top conductive planes. | 05-14-2015 |
20150310994 | LC COMPOSITE COMPONENT - Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil. | 10-29-2015 |
20150357121 | HIGH ENERGY DENSITY CAPACTOR WITH MICROMETER STRUCTURES AND NANOMETER COMPONENTS - A high density energy storage system including a giant-colossal dielectric thin film material electrically insulating between two electrodes configured to have increased overlapping surface area. | 12-10-2015 |
20150380159 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic electronic component may include a ceramic body including a plurality of dielectric layers, and internal electrodes disposed on the dielectric layer and having an unevenness portion on at least one surface thereof. The unevenness portion includes a plurality of convex portions and a plurality of concave portions alternately disposed, and the convex and concave portions may be formed to extend in a first direction, respectively. | 12-31-2015 |
20160020027 | Capacitor and Method of Production Thereof - The present invention relates generally to the fields of electrical engineering and electronics. More specifically, the present invention relates to passive components of electrical circuit and more particularly to a capacitor intended for energy storage and method of production thereof. | 01-21-2016 |
20160049241 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING A PAIR OF SIDE OUTER ELECTRODES AND A CENTER ELECTRODE - A multilayer ceramic electronic component includes a multilayer ceramic element, a center outer electrode at a center portion of a surface of the multilayer ceramic element, side outer electrodes interposing the center outer electrode therebetween, first inner electrodes inside the multilayer ceramic element and electrically connected to the outer electrode via center extending portions, and second inner electrodes electrically connected to the side outer electrodes via first and second-side extending portions. Exposed ends of the first-side extending portions of the second inner electrodes near a center layer of the multilayer ceramic element are spaced from an end surface of the multilayer ceramic element by a distance C. Exposed ends of the first-side extending portions of the second inner electrodes disposed near an outermost layer of the multilayer portion are spaced from the end surface of the multilayer ceramic element by a distance D greater than the distance C. | 02-18-2016 |
20160049243 | MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR - In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction. | 02-18-2016 |