| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361304000 | Non-self-supporting electrodes | 10 |
| 20090154056 | Low inductance capacitor and method of manufacturing same - A film capacitor includes metallization that is sectionalized, patterned and configured to provide interconnections on only one face of a rolled or stacked film capacitor. | 06-18-2009 |
| 20130003255 | INTEGRATED CAPACITIVE DEVICE AND INTEGRATED ANALOG DIGITAL CONVERTER COMPRISING SUCH A DEVICE - An integrated capacitive device includes an electrically conducting comb, at least some of whose teeth form first electrodes of capacitors, and electrically conducting fingers extending between the teeth of the comb so as to form second electrodes of the capacitors. The device includes a first finger-teeth set having a single reference finger forming a reference capacitor having a reference capacitive value, at least one second finger-teeth set including several fingers, the reference finger and the number of fingers of the second finger-teeth set or sets forming a geometric series with ratio two. At least one additional set includes a single additional finger forming, with at least one tooth of the comb, an additional capacitor having an additional capacitive value substantially equal to half the reference capacitive value. | 01-03-2013 |
| 20130063860 | LEAD UNIT OF ENERGY STORAGE DEVICE - Disclosed herein is a lead unit of an energy storage device including a lead frame for fixing withdrawal electrodes of the energy storage device, including: an output terminal unit formed on an upper portion of the lead frame; a lead unit formed to extend from the output terminal unit to a lower portion of the lead frame and allowing end portions of the withdrawal electrodes to be inserted therein; and an expanding unit formed at an end portion of the lead unit and being brought into contact with the withdrawal electrodes in a compressed manner. | 03-14-2013 |
| 20130148260 | HIGH DENSITY CAPACITOR ARRAY PATTERNS - A thin-film device system includes a substrate and a plurality of pillars. The plurality of pillars project from a surface of the substrate. Each of the plurality of pillars have a perimeter that includes at least four protrusions that define at least four recessed regions between the at least four protrusions. Each of the at least four recessed regions of each of the plurality of pillars receives one protrusion from an adjacent one of the plurality of pillars. A thin-film device is fabricated over the plurality of pillars. | 06-13-2013 |
| 20140009865 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size. | 01-09-2014 |
| 20150109718 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - A multilayer ceramic electronic component may include a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, a length of the ceramic body being 1300 μm or less; a first external electrode; a second external electrode; a third external electrode; a first internal electrode connected to the first and second external electrodes; and a second internal electrode connected to the third external electrode. When a thickness of the first to third external electrodes formed on the first and second main surfaces and the first and second side surfaces is defined as to and an interval between adjacent external electrodes among the first to third external electrodes is defined as G, 5≦G/te is satisfied. | 04-23-2015 |
| 20150138691 | METALLIZED FILM CAPACITOR - A metallized film capacitor includes: a first dielectric film; a first metal deposition electrode provided to a first surface of the first dielectric film; a second dielectric film; and a second metal deposition electrode that is provided to a first surface of the second dielectric film and that faces the first dielectric film. The metallized film capacitor further includes: a low resistance provided above at least one of a first end of the first metal deposition electrode and a first end of the second metal deposition electrode; and a first film that covers at least a portion of the low resistance and that comprises mainly aluminum oxide. | 05-21-2015 |
| 20160012969 | HIGH CAPACITANCE SINGLE LAYER CAPACITOR | 01-14-2016 |
| 20160020030 | THIN FILM CAPACITOR - A thin film capacitor including a lower electrode layer, a dielectric layer provided on the lower electrode layer, and an upper electrode layer formed on the dielectric layer, wherein the dielectric layer includes a recessed portion in a portion on the upper face thereof, a cross-sectional structure perpendicular to the dielectric layer of the recessed portion has a cross-sectional taper angle of 1 degree or more and 25 degrees or less, and the distance between the bottom portion center and an outermost portion of the recessed portion is 20 times or more and 150 times or less a thickness of the dielectric layer. | 01-21-2016 |
| 20160071651 | THIN FILM CAPACITOR - A thin film capacitor includes: a supporting substrate; a capacitance forming member formed on the supporting substrate and made of at least two thin film electrodes and at least one thin film dielectric layer alternately stacked on one another; intermediate electrodes electrically connected to the respective thin film electrodes; a sealing member that seals the capacitance forming member and the intermediate electrodes on the supporting substrate the sealing member leaving portions of the intermediate electrodes exposed; and external electrodes formed on at least side faces of the sealing member and respectively connected to the exposed portions of the intermediate electrodes. | 03-10-2016 |
