| Entries |
| Document | Title | Date |
|---|
| 20080196864 | HEAT DISSIPATION MODULE - A heat dissipation module including a base, a heat pipe and a fastener is provided. The base has a holding space, and the heat pipe is provided through the holding space. In addition, the fastener is inserted into the holding space. The fastener includes a body and at least an elastomer extending from the body, wherein the elastomer is suitable to press against the heat pipe to make the heat pipe tightly assembled with the base. | 08-21-2008 |
| 20080264603 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-30-2008 |
| 20080289797 | HEAT DISSIPATION DEVICE HAVING CAP FOR PROTECTING THERMAL INTERFACE MATERIAL THEREON - A heat dissipation device includes a heat sink having a base with thermal interface material thereon and a protective cap covering the base. The protective cap includes a body shielding the thermal interface material and sidewalls extending from the body and engaging with a periphery of the base of the heat sink. A rotatable portion is rotatable relative to the body of the protective cap. The rotatable portion includes a base-wall being rotatably connected with the body of the protective cap and a plurality of positioning sides extending from the base-wall and engaging lateral sides of a corner of the base of the heat sink. | 11-27-2008 |
| 20080314553 | RETAINER AND THERMAL DISPLACEMENT APPARATUS FOR ELECTRONIC COMPONENTS, METHODS OF PRODUCTION AND APPLICATIONS THEREOF - Retainers are described that comprise at least one center body component comprising a plurality of center body troughs, and at least one compatible component comprising a plurality of compatible troughs, wherein at least part of the plurality of the compatible troughs couple with at least part of the plurality of center body troughs. In addition, thermal displacement devices are described that incorporate at least one retainers and at least one additional component, wherein the at least one retainer is coupled at least in part to the at least one additional component through a contact area or a substrate, surface or combination thereof, wherein the at least one retainer is coupled with the substrate, surface or combination thereof through a contact area. | 12-25-2008 |
| 20090000767 | COOLING ELEMENT - The present invention relates to a cooling element ( | 01-01-2009 |
| 20090050292 | CIRCUIT BOARD HEAT EXCHANGER CARRIER SYSTEM AND METHOD - A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components. | 02-26-2009 |
| 20090095444 | MICROJET MODULE ASSEMBLY - Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops. | 04-16-2009 |
| 20090107652 | COLD AISLE ISOLATION - A data center cooling solution providing techniques for using baffles, doors and roof sections to prevent warm air from being entrained into a cold aisle in a data center, wherein the data center generally contains an air cooling system and a raised floor structure. The raised floor structure is configured to deliver cool air into the data center through a plurality of grates and perforated tiles in the floor. Electronic equipment racks are disposed around the grates and perforated tiles, such that the front faces of the equipment racks face the grates and perforated tiles. A collection of baffles, doors or roof sections inhibit the mixing of the cool air delivered by the air cooling system and the warm air exhausted by the electronic equipment. | 04-30-2009 |
| 20090126904 | THERMAL MODULE ALLOWING ADJUSTMENT IN THE HEIGHT OF HEAT SINK RELATIVE TO FIXING RACK - A thermal module includes a fixing rack and a heat sink fitted in the fixing rack. The fixing rack is provided at an inner side with at least one stopper and at least one projected portion adjacent to and vertically lower than the stopper by distance. The heat sink is provided along an outer periphery at a predetermined position with at least one vertically extended groove. By vertically turning the heat sink by 180 degrees, the heat sink may be selectively fitted in the fixing rack with an upward-facing side thereof upward abutted on the upper stopper or the lower projected portion to restrict the fixing rack from sliding downward. Meanwhile, due to the height difference between the stopper and the projected portion, a distance between the upward-facing side of the heat sink and the fixing rack is adjustable. | 05-21-2009 |
| 20090139690 | HEAT SINK AND METHOD FOR PRODUCING A HEAT SINK - A heat sink includes a base body of an electrically insulating material and one or several metallic molded parts having a mounting portion and a heat-transfer portion, wherein the heat-transfer portion is mechanically connected to the base body. The heat sink can be inserted on a printed circuit board having several heat sources that can be at different electrical potentials, wherein the mounting portions of the molded parts are soldered to respective heat sources or close to the respective heat sources. | 06-04-2009 |
| 20090145578 | HEAT DISSIPATION MODULE AND FASTENING STRUCTURE THEREOF - A heat dissipation module is disclosed, including a fan and a fastening structure. The fastening structure includes housing and at least one fixing element. The fixing element is disposed on the sidewall of the housing and has a first protruding part extruding from the inner side of the sidewall. When the fan is assembled with the fastening structure, the first protruding part partially enters into at least one molding hole of the frame of the fan and the first protruding part is placed against the edge of the molding hole. | 06-11-2009 |
| 20090145579 | METHOD AND AN APPARATUS FOR COOLING A COMPUTER - A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device. | 06-11-2009 |
| 20090151893 | HIGH PERFORMANCE COMPLIANT THERMAL INTERFACE COOLING STRUCTURES - A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding areas of the stacked sheets using thermo-compression bonding. | 06-18-2009 |
| 20090151894 | COMPUTER WITH IMPROVED COOLING FEATURES - A personal computer has a central air plenum straddled by opposed drive bays, and memory modules in the plenum are covered by a shroud that increases the air flow over the memory modules. The plenum establishes a first pathway for air flow and parallel to the plenum is a second pathway for air flow past cards such as graphics and network cards. | 06-18-2009 |
| 20090151895 | HEAT DISSIPATION DEVICE - A heat dissipation device for removing heat from a heat generating-component mounted on a printed circuit board includes a heat sink and two heat pipes. The heat sink comprises a base plate in contact with the heat-generating component, two conducting arms extending upwardly and obliquely from two opposite ends of the base plate, a plurality of first fins extending upwardly from top surfaces of the base plate and the two conducting arms, and a plurality of second fins extending downwardly from bottoms surfaces of the conducting arms. The two heat pipes each comprise an evaporating section received in the base plate, at least a condensing section received in one of the conducting arms and at least a connecting section connecting at least an end of the evaporating section and the at least a condensing section. | 06-18-2009 |
| 20090159240 | MOBILE COOLING STRUCTURE AND MACHINE CASE HAVING THE SAME - A cooling structure, through a design of rail installed on an inner wall of a machine case, can be adjusted in corresponding to various electronic heating components disposed in the machine case, and freely moved to a position, where an electronic heating component is needed to conduct heat generated thereof to the machine case. | 06-25-2009 |
| 20090159241 | COOLING SYSTEM FOR CONTACT COOLED ELECTRONIC MODULES - Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid. | 06-25-2009 |
| 20090183855 | HEAT RADIATING PLATE FOR SEMICONDUCTOR PACKAGE AND PLATING METHOD THEREOF - A heat radiating plate for a semiconductor package has a concave portion provided on a surface of the heat radiating plate, having an inner bottom face and an inner wall portion, a stepped portion provided on the inner wall portion of the concave portion and a plating portion covering an entire surface of the inner bottom portion of the concave portion. | 07-23-2009 |
| 20090205806 | SEMICONDUCTOR PACKAGE - A semiconductor package is provided with a package body including a base part and a semiconductor device housing part housing a semiconductor device. An electric terminal electrically connected to the device is provided in the housing part and is exposed to an outer surface. A high heat transfer element is arranged from a heat generating part corresponding position corresponding to a heat generating part of the device to a position outside the corresponding position in the base part. The base part is configured by contacting a plurality of thin sheets mutually closely with each other and by bonding integrally with each other. The high heat transfer element includes particles configured by a material having a thermal conductivity higher than that of the base part and dispersed in the base part. The particles are dispersed between two mutually adjacent thin sheets among the thin sheets. | 08-20-2009 |
| 20090218072 | Cooling system for a computer system - The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system. | 09-03-2009 |
| 20090236075 | HEAT DISSIPATION ASSEMBLY WITH STRETCHABLE FASTENERS - A heat dissipation assembly comprises a heat sink for being disposed on an electronic component mounted on a printed circuit board, and a pair of fasteners for securing the heat sink on the printed circuit board. Each fastener comprises a sleeve extending through the printed circuit board, a latch received in the sleeve, a stretchable pole inserted through the sleeve and a handle pivotably fixed to the pole. The pole is raised by rotation of the handle to a locked position. At the locked position, the handle downwardly acts on the heat sink, and the pole pushes the latch out of the sleeve. The latch presses against the printed circuit board upwardly to realize an intimate contact between the heat sink and the electronic component. | 09-24-2009 |
| 20090255648 | PROTECTIVE DEVICE FOR PROTECTING THERMAL INTERFACE MATERIAL AND FASTENERS OF HEAT DISSIPATION DEVICE - A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported. | 10-15-2009 |
| 20090266511 | METHODS AND SYSTEMS FOR USING A STORAGE DEVICE TO CONTROL AND MANAGE EXTERNAL COOLING DEVICES - The present invention is directed toward methods and systems for cooling electronics. More particularly, in various embodiments, the present invention provides systems and methods for cooling a data storage device. In some embodiments, a multiple data storage device enclosure might include a first data storage device and a second data storage device. Both data storage devices may be within the multiple data storage device enclosure. In various embodiments, a first cooling device, external to the first and second data storage device may be coupled to the multiple data storage device enclosure. Additionally, in some embodiments, a controller, may be coupled to the cooling device and configured to receive control signals from the first and second data storage devices. | 10-29-2009 |
| 20090288802 | Heat sink for chips - A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member. | 11-26-2009 |
| 20090288803 | Heat sink for chips - A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member. | 11-26-2009 |
| 20090288804 | Heat sink for chips - A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The clamping members each have a first portion fixed to the base board and a second board which is removably connected to the first portion. The second portion is connected to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member. | 11-26-2009 |
| 20090288805 | SEMICONDUCTOR PACKAGE WITH A CHIP ON A SUPPORT PLATE - A semiconductor package includes a support plate made of an electrically non-conducting material. Electrical connection vias are formed outside a chip fixing region provided on the front face of the support plate. Electrical connection wires connect pads on a front of the chip to pads on the front of the support plate associated with the electrical connection vias. The front face of the support plate is further provided with at least one intermediate front layer made of a thermally conducting material extending at least partly below the chip. The rear face of the support plate is provided with at least one rear layer made of a thermally conducting material extending at least partly opposite the front layer. The front and rear layers are connected by vias made of a thermally conducting material that fills through-holes made through the plate. | 11-26-2009 |
| 20090294099 | Heat dispensing unit for memory chip - A heat dispensing unit includes two heat dispensing plates between which the memory chip is clamped. Each heat dispensing plate has a plurality of bending plates which split from an inside of each of the heat dispensing plates and each bending plate has an insertion and a hole. When connecting the two heat dispensing plates, the first insertions on one of the two heat dispensing plates are engaged with the first holes of the other heat dispending plate. The heat dispensing plates have a flange on a top thereof so as to cover the gap between the two heat dispensing plates. | 12-03-2009 |
| 20090321043 | HEAT ABSORBING DEVICE - A heat absorbing device includes a converter, a heat semi-conductor located on the converter, a cool guide plate placed on the heat semi-conductor, and a moisture-proof cap provided with a recessed accommodating space for receiving the heat converter and the heat semi-conductor. The moisture-proof cap has an upper opening that the cool guide plate is fitted closely in, and a combining mouth formed in its bottom for the combining member of the heat converter fitted closely therein, insulating the heat semi-conductor from exterior air. | 12-31-2009 |
| 20090321044 | ACTIVE HEAT SINK DESIGNS - A heat sink includes a surface and a first active element connected to the surface. The first active element is configured to move from a first position relative to the surface to a second position relative to the surface. The movement alters the heat transfer characteristics of the heat sink. | 12-31-2009 |
| 20090321045 | MONOLITHIC STRUCTURALLY COMPLEX HEAT SINK DESIGNS - A heat sink includes a base and a heat exchange element monolithically connected to the base. The heat exchange element has a surface that at least partially bounds first and second paths through the heat exchange element. The surface forms an upper boundary of the first and second paths and includes an opening therethrough connecting the first and second paths. | 12-31-2009 |
| 20100006260 | HEAT SINK - A heat sink includes a base plate and at least one elastic plate. The base plate is connected to a heat generator such as a semiconductor chip. One end portion of the elastic plate is connected to the base plate and the elastic plate has a zigzag structure to ensure desired elasticity. The elastic plate dissipates the heat generated from the heat generator. | 01-14-2010 |
| 20100032134 | HEAT SINK ASSEMBLY - An assembly includes a circuit board and a heat sink apparatus attached to the motherboard. The heat sink apparatus has at least two screws, and a first mistake-proof structure. A plurality of screw holes are defined in the circuit board corresponding to the screws. The circuit board has a second mistake-proof structure corresponding to the first mistake-proof structure. The first mistake-proof structure engages with the second mistake-proof structure to align the heat sink apparatus to the circuit board in only one configuration. | 02-11-2010 |
| 20100038053 | SUSTAINABLE ENDOTHERMIC HEAT STRIPPING METHOD AND APPARATUS - A sustainable system for cooling at least one electronic device, for example a Light Emitting Diode (LED), and preferably a plurality of electronic devices, using at least one heat absorbing material contained within a housing that it is in thermal communication with said electronic devices. Said heat absorbing materials may be present individually or in combinations thereof in order to achieve the desired heat absorption effect; said housing may be comprised of multiple chambers containing heat absorbing materials or combinations thereof. | 02-18-2010 |
| 20100038054 | Heat dispensing unit for memory chip - A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which is connected between the two side plates, two protrusions extend from two respective insides of the two side plates so as to be engaged with two holes in the two heat dispensing plates to securely connect the two heat dispensing plates. The clamps each have two hooks to hook the notches in two ends of the chip. | 02-18-2010 |
| 20100038055 | Heat dispensing unit for memory chip - A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are connected to each other, the connection pieces are connected to the connection ports. | 02-18-2010 |
| 20100044008 | PORTABLE ENVIRONMENTALLY ROBUST ENCLOSURE OPTIMIZED FOR SIZE, WEIGHT, AND POWER DISSIPATION - An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris. It is small, compact, lightweight, rugged and otherwise ergonomic for ease of use and protection from accidental impact caused by, for example, dropping the unit. The reliability of the system is improved because the internal electronic components are protected from moisture, dust, and other liquid or particle contaminants, all while maintaining an internal temperature that is lower than a maximum permissible operating temperature. | 02-25-2010 |
| 20100065246 | Methods of fabricating robust integrated heat spreader designs and structures formed thereby - Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications. | 03-18-2010 |
| 20100096105 | REAR DOOR HEAT EXCHANGER TRANSITION FRAME - A transition frame system integrates a liquid cooling door with associated computer equipment racks. Dissimilar dimensions of equipment racks and cooling doors are accommodated by a transition frame. The frame has a top, bottom, first side, and a second side; each providing a rack face opposing a door face. The frame may be one piece. The rack face includes a means for mating/sealing with the rack and the door face includes a means for mating/sealing with a cooling door that may include replacement hinges and latches. The transition frame can be included as part of the rack or the door. Cooling of equipment in the rack is maintained through airflow through the cooling door. | 04-22-2010 |
| 20100108291 | Method and apparatus for embedded battery cells and thermal management - Battery cells are embedded in a device to control thermal management of the device. One embodiment includes an embedded battery arrangement that improves thermal management of a portable computer, such as heat transfer and dissipation from heat generating components of the portable computer (including, for example, central processing unit chips or graphics processing unit chips). In one specific embodiment, a printed circuit board is mounted to a battery pack to cause improved radiation of heat from heat generating components of the portable computer to outside of the portable computer housing. In another embodiment, battery cells are distributed within the housing of a portable computer that improves thermal management. | 05-06-2010 |
| 20100122795 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink, a plurality of heat pipes extending in the heat sink, a heat-conducting plate attached to the heat pipes, and a mounting member located between the heat sink and the heat-conducting plate and firmly securing the heat pipes to the heat-conducting plate. The mounting member includes a mounting base and a mounting board mounting on the mounting base. The heat pipes extending through the mounting base are received in the heat-conducting plate. The mounting board spanning the mounting base and the heat pipes press the heat pipes towards the heat-conducting plate via fasteners extending through the mounting base and screwing in the mounting board, whereby the heat pipes have an intimate contact with the heat-conducting plate. | 05-20-2010 |
| 20100155021 | Heat exchange cooling structure - A heat exchange cooling structure includes a LED module, a heat spreader plate bonded to the bottom surface of the substrate of the LED module, and an electronic ceramic cooling plate made of a nano-scale inorganic semiconductor material through a sintering process and bonded to the bottom side of the heat spreader plate for dissipating heat from the heat spreader plate by means of a thermoelectric effect produced in millions of parallel-connected and series-connected N-P interfaces in the nano-scale inorganic semiconductor material. | 06-24-2010 |
| 20100175851 | MODULAR ABSORPTION HEAT SINK DEVICES FOR PASSIVE COOLING OF SERVERS AND OTHER ELECTRONICS - A passive heat sink for cooling an electronic component such as a high-performance processor. The heat sink includes a shell with a surface that is positionable adjacent a heat generating surface of the electronic component. The shell includes a heat exchanger portion with cooling fins extending outward and positioned in a fan-provided airflow. A generator compartment is provided within the shell with a generator vessel for containing an absorbent, and the generator compartment is maintained at a pressure lower than ambient. The generator compartment conducts heat away from the electronic component to the absorbent in the generator vessel. An absorber compartment, at a pressure lower than the generator compartment, is provided within the shell above the generator compartment, and, in use, an absorption refrigeration cycle contained within the shell is activated by heat from the electronic component. A bubble pump moves absorbent from the generator compartment to the absorber compartment. | 07-15-2010 |
| 20100175852 | Cooling Manifold Assembly - A cooling apparatus comprising a cooling manifold assembly is disclosed. The cooling manifold assembly comprises a manifold inlet end cap, a manifold outlet end cap and at least one cooling manifold. Cooling fluid flows into the manifold inlet end cap, through the cooling manifold, and the exits from the manifold outlet end cap. The cooling manifold is configured to rotate from a closed position into an open position without breaking a fluid seal between the manifold inlet end cap, the cooling manifold, and the manifold outlet end cap. | 07-15-2010 |
| 20100175853 | MULTI-COMPONENT COOLING ELEMENT - The invention relates to a micro heat sink ( | 07-15-2010 |
| 20100236753 | Heat Sink for Drill Bits of Different Sizes - A heat sink for a drill press includes a main body having a receiving chamber which has a top provided with a limit tube, a guide unit mounted on the main body, and a sponge mounted in the main body. The guide unit includes an outer tube mounted on the receiving chamber and protruding from the limit tube, a plurality of inner tubes laminating each other and mounted in the outer tube, and a positioning tube mounted between the limit tube and the outer tube and abutting the inner tubes to position the inner tubes in the outer tube. Thus, the guide unit has an adjustable size by provision of the inner tubes and the outer tube so as to fit drill bits of different sizes and specifications, thereby enhancing the versatility of the heat sink. | 09-23-2010 |
| 20100243203 | COOLING DEVICE FOR ADD-ON CARD - A cooling device for cooling an add-on card includes a heat absorption member attached to the add-on card to absorb heat therefrom, a heat sink and a clip for clasping the heat sink onto the heat absorption member. The heat sink includes a supporting plate, and a first plate and a second plate respectively extending from opposite sides of the supporting plate and attached to the heat absorption member tightly. The clip includes an operation board, and an engaging board and a supporting board respectively extending from opposite sides of the supporting plate. The engaging board and the supporting board respectively abut the first plate and the second plate of the heat sink. A tongue extends from the engaging board rearwards and downwards toward the operation board. The tongue is provided for blocking a separation of the clip from the heat sink. | 09-30-2010 |
| 20100252234 | HIGH PERFORMANCE DUAL-IN-LINE MEMORY (DIMM) ARRAY LIQUID COOLING ASSEMBLY AND METHOD - A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit. | 10-07-2010 |
| 20100263830 | Cold Row Encapsulation for Server Farm Cooling System - Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves utilizing a raised sub-floor design of a data center room. | 10-21-2010 |
| 20100270007 | HEAT SINK - A heat sink has a conducting heat seat, multiple heat pipes and multiple heat dissipating fins. The heat pipes are mounted through the conducting heat seat and each heat pipe has a central portion and two distal portions. The central portion is flat. The distal portions on one side of the conducting heat seat lined zigzag. The flat central portions and zigzag lined distal portions allow more heat pipes to be mounted through the seat per unit area. The heat dissipating fins are separately mounted on the first conducting distal portions of the heat pipes to transfer heat to the atmosphere. | 10-28-2010 |
| 20100294461 | ENCLOSURE FOR HEAT TRANSFER DEVICES, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is a heat transfer device that includes a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell during the operation of the heat transfer device; the shell having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell; the porous particle layer having a thickness effective to enclose a vapor space between opposing faces; the vapor space being effective to provide a passage for the transport of a fluid; the heat transfer device having a thermal conductivity of greater than or equal to about 10 watts per meter-Kelvin and a coefficient of thermal expansion that is substantially similar to that of a semiconductor. | 11-25-2010 |
| 20100307716 | HOT AISLE CONTAINMENT COOLING UNIT AND METHOD FOR COOLING - A cooling unit, which is configured to contain and cool air between two rows of equipment racks defining a hot aisle, includes a housing configured to be secured mounted on the two rows of equipment racks such that the housing spans the hot aisle, a heat exchanger supported by the housing and coupled to and in fluid communication with a coolant supply and a coolant return, and an air movement assembly supported by the housing and configured to move air over the heat exchanger. Other embodiments of the cooling unit and methods of cooling are further disclosed. | 12-09-2010 |
| 20100314072 | BASE PLATE WITH TAILORED INTERFACE - Base plate apparatus for mounting IGBT modules, the base plate apparatus includes a base plate with a mounting surface and an opposed surface. A tailored coefficient of thermal expansion interface layer is directly bonded to the mounting surface of the base plate and forms a mounting surface for mounting IGBT modules. The interface layer has a coefficient of thermal expansion ranging from approximately 4 ppm/° C. to approximately 12 ppm/° C. | 12-16-2010 |
| 20100319876 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE - A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material. | 12-23-2010 |
| 20110005721 | Integrated cooling lapdesk without electronics - A cooling lapdesk comprises an interior cushion layer including a rear, a front, a left side and a right side, the rear being thicker than the front, the left and right sides having equal thickness at a given proximity to the front or rear, the interior layer elastic throughout its length and width. The cooling lapdesk also has a hollow exterior cover layer tightly surrounding and urged to be in contact with the interior layer on all sides of the interior layer, the exterior layer including a cooling top section integrally formed with the exterior layer, the cooling top section having a coolant such as granules of sodium sulfate decahydrate embedded therein, the granules capable of absorbing heat striking the cooling top section. The granules may be housed in compartments on the top surface of the top section of the exterior layer that are elevated. | 01-13-2011 |
| 20110056651 | INTEGRATED COMPUTER EQUIPMENT CONTAINER AND COOLING UNIT - A shipping container having an interior and a plurality of electronic equipment modules disposed within the interior of the container is cooled by an air conditioning unit adapted to be disposed within the interior of the container. The electronic equipment may include computing equipment and electronic data storage equipment. | 03-10-2011 |
| 20110061834 | COOLED BASE PLATE FOR ELECTRIC COMPONENTS - A cooled base plate is provided for electric components. A first side of the cooled base plate is provided for attaching exothermal electric components thereto. On a second side of the base plate, opposite to the first side, there is embedded a cooling channel system having a cooling fluid inlet at a first end of the base plate and a cooling fluid outlet at a second end of the base plate. In order to minimize differences in temperature between the electric components, the thickness of the base plate increases in the direction from the inlet of the cooling channel system towards the outlet of the cooling channel system, e.g., in the flow direction of the cooling fluid, for at least a portion of the length of the base plate. | 03-17-2011 |
| 20110073278 | HEAT SINK FOR NOTEBOOK COMPUTER - The present invention is able to guide the wind produced by a fan interior of a heat sink when rotating to the interior of a computer, and discharge heat energy from the interior of the computer. Moreover, a user can easily adjust and fix air outlets of fan assemblies to corresponding positions beneath air inlets of a notebook computer to achieve optimum heat dissipation effectiveness. In addition, the user can adjust the screen viewing angle and height of the notebook computer, as well as make forward and rearward displacement or right and left rotation of the computer, thereby facilitating operational use by the user. | 03-31-2011 |
| 20110073279 | ELECTRICAL CONTROL CABINET - An electrical control cabinet includes a casing, a plurality of heat elements, a heat exchanger, and two fans. The casing includes a first receiving portion and a second receiving portion. The first receiving portion communicates outside of the casing through the heat exchanger. The fans are received in the second receiving portion. The heat elements include a plurality of first heat members received in first receiving portion and a plurality of second heat members received in the second receiving portion. The first heat members is isolated from airborne contaminants and moisture. The first heat members in the first receiving portion disperse heat by the heat exchanger, and the second heat members in the second receiving portion disperse heat by the fans. | 03-31-2011 |
| 20110079369 | Configuration To Detect And Control The Wireless Network Inside A Building - A memory heatsink set for dissipating heat from a memory module is disclosed to include a first memory heatsink and a second memory heatsink, two guide devices bilaterally provided between the first memory heatsink and the second memory heatsink for positioning during the assembly process of the memory heatsink set and for guiding the first memory heatsink and the second memory heatsink into alignment, and two supplementary retaining devices respectively provided at two ends between the first memory heatsink and the second memory heatsink, each supplementary retaining device having a main engagement opening and two lateral sub-engagement openings located on one end of the first memory heatsink and a main engagement block and two lateral sub-engagement blocks located on the corresponding end of the second memory heatsink for engaging the main engagement opening and the two lateral sub-engagement openings respectively. | 04-07-2011 |
| 20110083824 | Data Centre - A data centre ( | 04-14-2011 |
| 20110083825 | Temperature Control within Storage Device Testing Systems - A storage device testing system cooling circuit includes a plurality of test racks. Each of the test racks include a test slot compartment and a test electronics compartment. Each of the test slot compartments includes multiple test slots, and one or more cooling conduits configured to convey a cooling liquid toward the test slots. Each of the test electronics compartments includes test electronics configured to communicate with the test slots for executing a test algorithm, and a heat exchanger in fluid communication with the one or more cooling conduits. The heat exchanger is configured to cool an air flow directed toward the test electronics. | 04-14-2011 |
| 20110088870 | Memory Heatsink Set With Supplementary Retaining Devices - A memory heatsink set for dissipating heat from a memory module is disclosed to include a first memory heatsink and a second memory heatsink, two guide devices bilaterally provided between the first memory heatsink and the second memory heatsink for positioning during the assembly process of the memory heatsink set and for guiding the first memory heatsink and the second memory heatsink into alignment, and two supplementary retaining devices respectively provided at two ends between the first memory heatsink and the second memory heatsink, each supplementary retaining device having a main engagement opening and two lateral sub-engagement openings located on one end of the first memory heatsink and a main engagement block and two lateral sub-engagement blocks located on the corresponding end of the second memory heatsink for engaging the main engagement opening and the two lateral sub-engagement openings respectively. | 04-21-2011 |
| 20110100598 | COOLING ARRANGEMENT - The invention relates to an arrangement for cooling at least one electrical and/or electronic component and/or group of electrical/electronic components by means of a cooling body. The cooling body demonstrates at least one recess into which the electrical/electronic component and/or the group of electrical/electronic components to be cooled can be inserted. Introduced into the recess of the cooling body is a medium, which nearly completely surrounds the at least one electrical/electronic component and/or the group of electrical/electronic components in their state of insertion into the recess. | 05-05-2011 |
| 20110155346 | HEAT DISSIPATION DEVICE WITH FAN HOLDER - A heat dissipation device includes a base plate, a bracket engaged with the base plate, a heat radiator mounted on the base plate and the bracket, a fan holder and a fan mounted on the fan holder. The base plate has first and second faces at opposite sides thereof. The bracket includes two opposite arms, and a first wall and a second wall interconnecting ends of the arms and defining an opening receiving the base plate. Each of the first and second walls has a baffle extending obliquely therefrom. The heat radiator has a contact surface contacting the base and a lateral locating surface abutting against the baffles. The heat radiator also has a slot defined therein. The fan holder comprises a top plate, and a clamping leg and two tabs extending downwardly from the top plate, the clamping leg fittingly received in the slot of the heat radiator. | 06-30-2011 |
| 20110240260 | COOLING ARRANGEMENT - A cooling arrangement for cooling a heat generating electrical component is disclosed, which arrangement comprises a heat spreading element ( | 10-06-2011 |
| 20120006507 | MULTI-MODULAR DATA CENTER - A multi-modular data center includes at least one modular computing module and at least one modular power supply module. The modular computing module includes a transportable container, a plurality of computing systems, a cooling system, a surveillance system, and a network interface. The modular power supply module includes a transportable container and a plurality of power supply systems. The transportable containers are configured for transport via a transport infrastructure. The plurality of computing systems is mounted within the transportable container. The cooling system is disposed in the transportable container. The surveillance system is configured to monitor the transportable container. The network interface is configured to interface between an Internet access connection and the computing systems. The plurality of power supply systems is mounted within the transportable container. | 01-12-2012 |
| 20120037339 | COOLING SYSTEM FOR CONTACT COOLED ELECTRONIC MODULES - Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid. | 02-16-2012 |
| 20120061054 | DISTRIBUTED COOLING OF ARRAYED SEMI-CONDUCTOR RADIATION EMITTING DEVICES - Techniques for the removal of waste heat from solid state, semiconductor devices (such as cooking or heating devices) are provided. In particular, techniques for conducting waste heat away from the device through a heat sink in contact with a cooling system are provided. In addition, a multi-head cooling system applicable to multiple solid state, semiconductor sources is provided. | 03-15-2012 |
| 20120067547 | Device for protecting an electronic system mounted in a rack - Device for protecting an electronic system, comprising a case ( | 03-22-2012 |
| 20120090817 | INTEGRATED ELECTRONICS COOLING DEVICE - An integrated electronics cooling device including a substrate having a first surface for mounting one or more electronic components and a second surface, a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate, and a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly. | 04-19-2012 |
| 20120103566 | LIQUID COOLED DATA CENTER WITH ALTERNATING COOLANT SUPPLY LINES - Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines. | 05-03-2012 |
| 20120111533 | COOLING CIRCULATION SYSTEM OF SERVER - A cooling circulation system of a server includes a cabinet assembly, a plurality of first fan modules, a plurality of second fan modules, and two air guide hoods. The first fan modules and the second fan modules are disposed on the cabinet assembly. The first fan modules blow a first airflow towards a first direction, and the second fan modules blow a second airflow towards a second direction. The air guide hoods are respectively installed on two ends of the cabinet assembly. The first airflow and the second airflow join each other through the air guide hoods, so as to form a cooling circulation loop inside the cabinet assembly. | 05-10-2012 |
| 20120138263 | HEAT DISSIPATION DEVICE - A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes two brackets attached to the motherboard and at opposite sides of the memory chips, are a support, and a fan. The support includes a fixing plate and two clamping plates extending from opposite ends of the fixing plate. The clamping plates are rotatably mounted to the brackets, and are positioned above the memory chips. The fan is sandwiched between the clamping plates or mounted to the fixing plate. | 06-07-2012 |
| 20120138264 | BOARD COOLANT JACKET JIG SYSTEM AND METHOD OF SEPARATING BOARD COOLANT JACKET - A board coolant jacket jig system includes a main frame that includes a board installation stand on which a board is installed, and a coolant jacket separation unit that is coupled to the main frame and selectively coupled to the coolant jacket coupled to the board, to separate the coolant jacket. | 06-07-2012 |
| 20120160449 | THERMAL TRANSFER COMPONENT, APPARATUS AND METHOD INCLUDING THERMALLY CONDUCTIVE FRAME PENETRATED BY THERMALLY CONDUCTIVE PLUG - A thermal transfer component, a thermal transfer apparatus and a method for cooling a heat generating component located upon a substrate each include a thermally conductive frame having an aperture formed completely through the thermally conductive frame within which aperture is located a thermally conductive plug. The thermally conductive plug aligns with and contacts the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. A spring may further compress the thermally conductive plug against the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. The thermally conductive plug comprises an isotropic thermal transfer material and the thermally conductive frame comprises an anisotropic thermal conductive material to provide for enhanced thermal transfer from the heat generating component to a chassis. | 06-28-2012 |
| 20120168122 | THERMAL MANAGEMENT FOR ELECTRONIC DEVICE HOUSING - The present invention relates to a cage for thermal management and for housing an electronic module. The cage includes top, bottom and side walls joined to form an interior cavity. The side walls form an enclosure having a first panel. A thermally conductive pathway is disposed on the first panel. The enclosure receives an electronic device such as a transceiver module and a heat sink mounted on the first panel. The thermally conductive pathway is disposed between the electronic device and the heat sink so that heat from the electronic device is transmitted via the thermally conductive pathway to the heat sink. | 07-05-2012 |
| 20120168123 | OVERHEAD-MOUNTED HEATSINK - An apparatus includes a supporting member, a cooling stage and a translating member. The cooling stage has a surface for contacting an electronic device. The cooling stage is translatably coupled to the supporting member. The translating member is coupled to the supporting member and attached to the cooling stage. The translating member is operable to translate the cooling stage relative to the supporting member to urge the cooling stage surface against the electronic device. | 07-05-2012 |
| 20120255710 | Modular Data Center - A building system for housing electronic equipment is described. The building system includes a building stack that includes an instrumentation modular building unit, with an internal configuration of space in the instrumentation modular building unit configured to house electronics equipment, a power modular building unit, with an internal configuration of space in the power modular building unit storing power distribution equipment, power filtering equipment and uninterruptable power supplies and further configured to deliver electronic power to the instrumentation modular building unit; and a cooling modular unit comprising an air conditioner unit and a water chiller unit, with the instrumentation modular building unit, the power unit modular building unit and the cooling modular unit stacked together. | 10-11-2012 |
| 20120279683 | COOLING APPARATUS FOR COMMUNICATIONS PLATFORMS - An apparatus comprising a rack having one or more shelves, a plurality of electronics circuit boards and heat conduits and a cooler. Each board is held by one of the one or more shelves, some of the boards having a localized heat source thereon. Each heat conduit forms a heat conducting path over and adjacent to a particular one of the boards from a region adjacent to the heat source thereon to a connection zone, the zone being remote from the heat source. The cooler is located on a side of the rack and coupled to the zones such that heat is transferable from the paths to the cooler. The cooler is configured to flow a cooling fluid therein to cool localized thermal interfaces at the cooler, each interface being adjacent to and at a corresponding one of the zones. | 11-08-2012 |
| 20120279684 | SYSTEMS AND METHODS FOR COOLING ELECTRONIC EQUIPMENT - A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic equipment and is configured to receive a cooling fluid at a first temperature. The first exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a second temperature. The second exchanger is disposed in the airflow between the first exchanger and the electronic equipment and is configured to receive the cooling fluid at the second temperature. The second exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a third temperature. The condenser is configured to receive the cooling fluid at the third temperature and is configured to enable heat transfer from the cooling fluid to a cooling source to cool the cooling fluid to the first temperature. | 11-08-2012 |
| 20130025823 | HEAT SINK ASSEMBLY FOR ELECTRONIC COMPONENTS - One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. The heat sink assembly includes a heat sink having a base and at least one fin extending from the base. The at least one fin has an opening formed therein that is configured to receive a fastener. The heat sink assembly also includes a clip. The clip has a first portion configured to receive the fastener and at least one second portion flexibly coupled to the first portion. The at least one second portion is configured to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the first portion by the fastener. | 01-31-2013 |
| 20130081784 | SYSTEM FOR AIR-CONDITIONING THE INTERIOR OF A DATA PROCESSING CENTER - Environment conditioning system of the inner space of a data centre ( | 04-04-2013 |
| 20130186595 | HEAT SINK CLIP AND METHOD FOR FORMING THE SAME - A heat sink clip is provided for clipping a memory module. The heat sink clip is made from a flexible heat-conductive metal plate formed by bending, and includes a top plate and two side plates facing opposite. Each side plate has a top portion, an inwardly inclined portion and a lead. The top portions of the two side plates extend from two opposite side edges of the top plate, respectively, and incline inwardly. The inwardly inclined portions of the two side plates extend from bottoms of the two top portions, respectively, and continue to incline inwardly. The leads of the two side plates extend from bottoms of the two inwardly inclined portions, respectively, and incline outwardly. | 07-25-2013 |
| 20130233511 | HEAT SINK FOR USE WITH A LIGHT SOURCE HOLDING COMPONENT - A heat sink for use in connection with a LED light source holding assembly is provided with a flexible conduit fitting that is used to secure a flexible conduit directly to the heat sink. The heat sink may be provided with a sealed, integrated junction box. | 09-12-2013 |
| 20130277010 | HEAT DISSIPATING APPARATUS WITH AIR DUCT - A heat dissipating apparatus in an electrical device includes a air duct. The air duct includes an air inlet and an air outlet. A plurality of ventilation members are attached to the air inlet and the air outlet thereof. Each ventilation member defines a number of ventilation holes of a certain size calculated to keep EMI out. A coated layer formed on an inner surface of the air duct to shield electromagnetic waves which may be generated by the electrical components of the device. | 10-24-2013 |
| 20140000843 | SUSCEPTOR HEATER AND METHOD OF HEATING A SUBSTRATE | 01-02-2014 |
| 20140000844 | ELECTRONICS CASE WITH INCLUDED HEAT DIFFUSER | 01-02-2014 |
| 20140166234 | LAPTOP COMPUTER COOLING STAND - A laptop computer cooling stand includes a main body, a number of semiconductor chilling plates, a number of first heat sinks, and a number of second heat sinks. The main body includes a base and a cover. The base defines a receiving space. The cover covers the receiving space and defines a number of openings. The semiconductor chilling plates are set in the receiving space. The first heat sinks are set on the semiconductor chilling plates. The first heat sinks are exposed through the opening of the cover. The second heat sinks are attached to a bottom of the base. The second heat sinks make contact with heat-dissipating sides of the semiconductor chilling plates through the base. The first heat sinks make contact with heat-collecting sides of the semiconductor chilling plates. | 06-19-2014 |
| 20140182814 | AIR DUCT - An air duct includes a top wall, two sidewalls connected to opposite sides of the top wall, and a board. One of the sidewalls defines an opening extending through a bottom side of the sidewall, and a receiving space communicating with the opening and extending through a top side of the sidewall. The board is slidably received in the receiving space to cover or uncover the opening. | 07-03-2014 |
| 20140209273 | BUCKLE AND HEAT DISSIPATION MODULE HAVING THE SAME - A heat dissipation module includes a fin stack, a fan and buckles. The fin stack includes fins arranged at interval and in parallel with each other, wherein a notch is formed at an edge of each fin and the notches of the fins are in alignment. The fan includes through holes. Each buckle includes an elastic connecting piece, a first cylinder and a second cylinder. An extension portion is formed at one end of the elastic connecting piece. A lateral side of the first cylinder connects the extension portion. The second cylinder vertically extends from the other end of the elastic connecting piece. The first cylinder is snapped on corresponding notches. The second cylinder is received in a corresponding through hole. Whereby, the first cylinder could be easily snapped on and removed from the notch. | 07-31-2014 |
| 20140262149 | AIR CIRCULATION IN A SYSTEM - An example system may include racks that house slots, in which devices may be stored for testing. Cold air from a cold atrium is drawn over the slots and expelled into a warm atrium. The resulting warm air is cooled and then recycled back through the slots to control slot temperature. | 09-18-2014 |
| 20140262150 | Sealed Enclosure for Power Electronics Incorporating a Heat Exchanger - A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration. | 09-18-2014 |
| 20140290908 | HEAT DISSIPATION MODULE - A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes an outer housing, a heat dissipation fin array, a retaining wall, an impeller and a rotation-driving device. The outer housing includes an axial air inlet, an axial air outlet and a radial air outlet. The heat dissipation fin array is located at an inner wall of the radial air outlet. The retaining wall is located on a flat wall of the outer housing on which the axial air outlet is located. The retaining wall is in contact with an inner wall of an electronic device to collectively form a circulation channel so as to guide airflows output from the axial air outlet through the flat wall with which the heat dissipation fin array is aligned, and into the axial air inlet. The heat pipe is in contact with the heat dissipation fin array. | 10-02-2014 |
| 20140326436 | CARRIER WITH ADJUSTABLE HEAT REMOVAL ELEMENTS - A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements. | 11-06-2014 |
| 20140332181 | AIR DUCT - An air duct includes a first duct. The first duct includes a first top board, two first sidewalls connected to opposite sides of the first top board, and a side cover. One of the first sidewalls defines an cutout. The side cover is rotatably connected to the first sidewall to cover or open the cutout. | 11-13-2014 |
| 20150060014 | SERVER RACK COOLING SYSTEM - A server rack includes a plurality of servers received therein. The server rack includes a delivery mechanism, a plurality of main fan groups and a backup fan group for cooling the servers. Each main fan group and the backup fan group both include one or more cooling fans. The delivery mechanism carries the backup fan group and to drive the backup fan group to move within the server rack. When a main fan group is malfunctioned, the backup fan group is moved to a location corresponding to a location of the malfunctioned main fan group to replace the malfunctioned group to cool one or more corresponding servers. | 03-05-2015 |
| 20150144302 | EXTERNAL COOLING DEVICES AND SYSTEMS FOR SURGICAL INSTRUMENTS - A surgical system includes a portable surgical instrument and a sleeve. The portable surgical instrument includes an end effector assembly and a housing operably coupled to the end effector assembly. The housing includes a generator and a battery assembly coupled thereto and configured to supply energy to the end effector assembly for treating tissue. The sleeve is shaped complementarily to the housing and is removably positionable about the housing. The sleeve is configured to cool the housing and/or remove heat from the housing to inhibit overheating of the generator and/or the battery assembly. | 05-28-2015 |
| 20150296656 | COOLING SYSTEM FOR AN ELECTRICAL SYSTEM - A cooling system ( | 10-15-2015 |
| 20150303124 | NOVEL MULTI-FUNCTIONAL SEMICONDUCTOR REFRIGERATING AND WARMING DUAL-PURPOSE BOX AND MANUFACTURING METHOD - A multi-functional semiconductor refrigerating and warming dual-purpose box includes a box body, a refrigerating and heating unit, a composite condenser unit, and a liquid delivering pump. The box body includes two independent rooms, a bottom machine room, an upper working room, and a lower working room. The refrigerating and heating unit includes an upper room semiconductor refrigerating and heating unit and a lower room semiconductor refrigerating and heating unit, the upper room semiconductor refrigerating and heating unit comprising an external heat exchanger of the upper room, a first semiconductor chilling plate, and an internal heat exchanger of the upper room. The composite condenser unit and the liquid delivering pump are connected to the external heat exchanger of the upper room and the external heat exchanger of the lower room through pipes. A manufacturing method of a multi-functional semiconductor refrigerating and warming dual-purpose box is also provided. | 10-22-2015 |
| 20150306661 | METALLIC ARTICLE AND METHOD FOR MANUFACTURING METALLIC ARTICLE - A metallic article can include a cast metallic body and at least one metallic element. The cast metallic body defines at least one first space. The least one metallic element is received in the cast metallic body and seamless with the cast metallic body. The at least one metallic element is exposed from the at least one first space. A heat conductivity of the cast metallic body is lower than that of the at least one metallic element. The present disclosure further provides a method for manufacturing metallic article. | 10-29-2015 |
| 20150357214 | VACUUM PROCESSING APPARATUS - A vacuum processing apparatus includes a tilting unit configured to tilt, in a vacuum vessel, a substrate holder including a refrigerator, and a rotary joint provided in the tilting unit and including a coolant path configured to supply or exhaust a coolant gas to or from the refrigerator. The rotary joint includes a fixed portion fixed to the vacuum vessel, a pivotal portion provided so as to pivot with respect to the fixed portion and fixed to the substrate holder, and a grease supply passage. | 12-10-2015 |
| 20150357259 | SEMICONDUCTOR RADIATOR - The present invention discloses a semiconductor radiator, a hollow thermally insulating stand and a lower heat conductive connection base are arranged on an upper end and a lower end of the through hole arranged on an electrically and thermally insulating rigid substrate respectively, a stage which extends through the through hole and cooperates with a cavity of the hollow thermally insulating stand is arranged on the lower heat conductive connection base, a top surface of the stage is attached to a bottom surface of a semiconductor cooling plate arranged on the top of the hollow thermally insulating stand, an upper heat conductive connection base is attached to a top surface of the semiconductor cooling plate. The present invention has a simple structure, a good anti-dust capability, a noise-free feature, a stable and reliable heat dissipation performance, and easy installation. | 12-10-2015 |
| 20150359137 | COOLANT-COOLED HEAT SINK CONFIGURED FOR ACCELERATING COOLANT FLOW - Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment. | 12-10-2015 |
| 20150359139 | LIQUID-COOLING APPARATUS WITH INTEGRATED COOLANT FILTER - Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area. | 12-10-2015 |
| 20150366103 | Signal Transmission Device and Cooling Device - The heat generating elements are more effectively cooled by improving a heat radiating property of the heat generating elements provided so as to be adjacent to each other. An extending direction of fins of a second heat sink corresponding to a second communication-use LSI is made to intersect with an extending direction of fines of a third heat sink corresponding to a third communication-use LSI. Thus, a cooling air that has passed through the second heat sink is prevented from passing through the third heat sink. Therefore, a cooling air that is not warmed can be supplied to both of the second heat sink and the third heat sink. Thus, each heat radiating property of the second and third communication-use LSIs provided so as to be adjacent to each other can be improved. As a result, both of the second and third communication-use LSIs can be efficiently cooled. | 12-17-2015 |
| 20160006086 | Elastic Device for the Temperature Control of Battery Cells - A device for the temperature control of battery cells in a battery, particularly a battery configured as an energy source for the drive of hybrid, plug-in hybrid, or electric vehicles includes a contact surface for thermally contacting the battery cells with the device. The contact surface is configured such that the battery cells to be temperature-controlled are arranged on the contact surface. The device has elements below the contact surface that are elastically restoring such that, when a compressive load acting orthogonally to the contact surface is applied, the contact surface is lowered in the region of the applied compressive load. A restoring force acts against the compressive load. | 01-07-2016 |
| 20160006088 | BATTERY THERMAL MANAGEMENT FOR HYBRID ELECTRIC VEHICLES USING A PHASE-CHANGE MATERIAL COLD PLATE - A thermal management system for an energy storage device that includes a liquid-cooled cold plate made of phase-change material changeable from a substantially solid form to a substantially liquid form upon absorbing heat generated by the energy storage device. The system may be useful as a thermal management solution for energy storage systems (ESS) in hybrid-electric vehicles (HEV). | 01-07-2016 |
| 20160021768 | Multi-Purpose Enclosures And Methods For Removing Heat In The Enclosures - A multi-purpose enclosure for telecommunication applications includes plural walls defining a first chamber and a second chamber, and a heat generating component positioned in the first chamber. At least one of the plural walls separates the first chamber and the second chamber. At least a portion of the wall separating the first chamber and the second chamber spans an area defined by a width and a height. The wall portion has a surface area that is greater than a product of the width and the height. The plural walls define an airflow path adjacent to the wall portion for removing from the enclosure heat generated by the heat generating component and thermally conducted from the first chamber to the second chamber through the wall portion. Other example enclosures are also disclosed. | 01-21-2016 |
| 20160026223 | SERVER MEMORY COOLING APPARATUS - A system to aid in cooling an in-line memory module may include a heat spreader including a channel to accommodate the in-line memory module, thermal interface material, and a liquid-cooler block including a heat-conducting cold plate and an internal liquid channel filled with circulating cooling liquid. Also disclosed are systems employing tubes to convey cooling fluid. | 01-28-2016 |
| 20160029510 | SUPPORT MEMBER - An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module. | 01-28-2016 |
| 20160044822 | OPENING AND CLOSING CONTROL SYSTEM AND OPENING AND CLOSING CONTROL APPARATUS - An opening and closing control system that controls an operation of an inlet port so that an external environment is detected more accurately and opening and closing of the inlet port is controlled more properly is provided. In the ventilation control system, an internal environment sensor detects an internal environment of a casing, and an external environment sensor is disposed apart from the casing without being in contact with the casing and detects an external environment of the casing which corresponds to the internal environment. Then, a calculation unit obtains the internal environment and the external environment detected by the internal environment sensor and the external environment sensor, and controls opening and closing of a ventilation port in response to difference between the internal environment and the external environment. According to the ventilation control system, the external environment sensor can be less susceptible to an effect of the presence of the casing when detecting the external environment, and can detect the external environment with high accuracy. Accordingly, opening and closing of the ventilation port can be controlled in an appropriate manner. | 02-11-2016 |
| 20160056511 | HEAT EXCHANGER COMPONENT - A heat exchanger component of a temperature control system of an electrical energy store may include a carrier material and at least two layers. The at least two layers may include a first layer composed of an electrically insulating material and a second layer that may facilitate temperature control via at least one of cooling and heating the electrical energy store. | 02-25-2016 |
| 20160056512 | HEAT EXCHANGER COMPONENT - A heat exchanger component of a temperature control system of an electrical energy store may include a carrier material and at least two layers. The at least two layers may include a first layer composed of an electrically insulating material and a second layer that may facilitate temperature control via at least one of cooling and heating the electrical energy store. | 02-25-2016 |
| 20160057891 | HEAT SINK AND METHOD OF ASSEMBLYING - A heat sink assembly includes a heat sink configured to be attached to an electronic assembly and to secure at least one component package thereto, a clip configured to be secured to the heat sink and to secure the component package to the heat sink, and at least one fastener to secure the clip to the heat sink. A method for assembling a heat sink assembly includes securing an component package to a heat sink with a clip, and securing the heat sink to an electronic substrate. | 02-25-2016 |
| 20160069971 | THERMAL MANAGEMENT METHODS AND APPARATUS - According to some aspects, a thermal management component adapted to cool, when present, at least one component of a magnetic resonance imaging (MRI) system is provided. The thermal management component is adapted to reduce or eliminate eddy current production during operation of the MRI system. The thermal management component comprises at least one conduit configured to circulate coolant, and at least one thermally-conductive substrate coupled to the at least one conduit and configured to transfer heat from the at least one component to the coolant when circulated through the at least one conduit, wherein the at least one thermally-conductive substrate is configured to reduce or eliminate eddy current production | 03-10-2016 |
| 20160088776 | Thermal Conduction To A Cylindrical Shaft - A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided. | 03-24-2016 |
| 20160095248 | COOLING SYSTEM FOR USE WITH A POWER ELECTRONICS ASSEMBLY AND METHOD OF MANUFACTURING THEREOF - A cooling system for use with a power electronics assembly comprising an array of line-replaceable units is provided. The cooling system includes a first manifold coupled in flow communication with the array of line-replaceable units, and a fluid supply coupled in flow communication with the first manifold. The fluid supply is configured to channel cooling fluid towards the first manifold such that the cooling fluid is discharged towards the line-replaceable units in the array substantially simultaneously. | 03-31-2016 |
| 20160104655 | BONDING SHEET AND MANUFACTURING METHOD THEREOF, AND HEAT DISSIPATION MECHANISM AND MANUFACTURING METHOD THEREOF - A CNT-metal composite structure is formed by forming a plurality of CNTs which stand side by side from a base substance, forming a sheet-shaped support film which covers upper ends of the CNTs, and filling gaps each present between adjacent ones of the CNTs with a metal. By this structure, highly reliable bonding sheet and heat dissipation mechanism which are very excellent in heat dissipation efficiency, and manufacturing methods of these are realized. | 04-14-2016 |
| 20160108301 | HIGH-EFFICIENCY COOLANT FOR ELECTRONIC SYSTEMS - The invention teaches an enhanced coolant in a cooling system defined by adding silver alloy metal into the flow of a liquid such as water. Silver alloy strips of various shapes are added in a liquid to form a compound coolant used in a liquid cooling system for cooling electronic assemblies and computer devices during prolonged use and overclocking. The excellent thermal conductivity of silver strips helps to conduct heat from high performance electronic assemblies. The fundamental engineering aspect is the combined surface areas of the silver alloys added in the coolant to enhance conductive heat transfer throughout the cooling system. | 04-21-2016 |
| 20160113151 | COOLING DEVICE FOR ELECTRONIC COMPONENTS USING LIQUID COOLANT - Device used for cooling a component, comprising a support to receive a component to be cooled, the support comprising a fluid network in which a liquid will circulate, the network comprising a first cavity, a second cavity, and a first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane forming a mobile wall of the first cavity and a mobile wall of the second cavity respectively, the device further comprising means of actuation of the first membrane and of the second membrane and a thermal conducting element close to the channel or in contact with the channel (FIG. | 04-21-2016 |
| 20160143178 | Baffle and Reinforcement System - In one embodiment, a system comprises a bar and a baffle. The bar is connected to a frame through a plurality of holes in a board. The baffle is connected to the bar and is configured to direct air to components on the board. One or more fasteners may be used to connect the bar and the baffle. | 05-19-2016 |
| 20160143188 | HEAT DISSIPATING MODULE - A heat dissipating module includes a bottom cover, a top cover, a fan body, and a heat dissipating structure. The top cover is disposed opposite the bottom cover, in which an air outlet is formed by the top cover and the bottom cover. The fan body is disposed between the top cover and the bottom cover, and the fan body provides an airflow toward the air outlet. The heat dissipating structure is disposed in front of the air outlet, in which the heat dissipating structure and the bottom cover are formed with a one-piece metal sheet. The heat dissipating structure is bent from the bottom cover toward the air outlet. The heat dissipating structure includes openings, such that the airflow passes through the openings from the air outlet and performs heat exchange with the heat dissipating structure. | 05-19-2016 |
| 20160165751 | PARTITIONED COOLING FOR ELECTRONIC DEVICES AND SYSTEMS - Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone, wherein the first cooling zone provides cooling for the one or more components that include an active thermal element; and a first fan located in the first cooling zone, the first fan to produce airflow for cooling in the first cooling zone and a second fan located in the second cooling zone to produce airflow for the cooling in the second cooling zone. | 06-09-2016 |
| 20160165755 | COOLING STRUCTURE FOR ELECTRONIC BOARDS - A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels. | 06-09-2016 |
| 20160172725 | METHOD FOR THE PRODUCTION OF A COOLING PLATE FOR A COOLING DEVICE OF A BATTERY | 06-16-2016 |
| 20160181170 | CRIMPING POWER MODULE | 06-23-2016 |
| 20180023904 | GRAPHITE LAMINATES, PROCESSES FOR PRODUCING GRAPHITE LAMINATES, STRUCTURAL OBJECT FOR HEAT TRANSPORT, AND ROD-SHAPED HEAT-TRANSPORTING OBJECT | 01-25-2018 |
