HEAT SINK

Abstract

ing heat seat, multiple heat pipes and multiple heat dissipating fins. The heat pipes are mounted through the conducting heat seat and each heat pipe has a central portion and two distal portions. The central portion is flat. The distal portions on one side of the conducting heat seat lined zigzag. The flat central portions and zigzag lined distal portions allow more heat pipes to be mounted through the seat per unit area. The heat dissipating fins are separately mounted on the first conducting distal portions of the heat pipes to transfer heat to the atmosphere.

Description

BACKGROUND OF THE INVENTION

[0001]1. Field of the Invention

[0002]The present invention relates to a heat sink, especially to a heat sink for a central processing unit (CPU) with improved thermal exchange.

[0003]2. Description of the Prior Arts

[0004]With reference to FIGS. 13 to 15, a heat sink in accordance with the prior art is used to mount a central processing unit (CPU) on a motherboard and allow heat from the CPU to be dissipated to the air to prevent damage and improve operating efficiency. The heat sink has a seat (90), multiple heat pipe (91) and multiple heat dissipating fins (92). The seat (90) has two sides and multiple through holes (93). The through holes (93) are formed through the sides of the seat (90). The heat pipes (91) are U-shaped and each heating tube (91) has a central portion (94) and two distal portions (95). The central portion (94) is mounted through one through hole (93) of the seat (90), is circular in cross section and has two ends and a diameter. The distal portions (95) are respectively formed on the two ends of the central portion (91) of the heat pipe (91). The heat dissipating fins (92) are mounted around the distal portions (95) of the heat pipes (91) to increase dissipation area of the heat sink.

[0005]However, a number of heat pipes (91) that may be mounted through the seat (90) is limited by the diameter of the central portion (94).

[0006]To overcome the shortcomings, the present invention provides a heat sink to mitigate or obviate the aforementioned problems.

SUMMARY OF THE INVENTION

[0007]The main objective of the present invention is to provide a heat sink for a central processing unit (CPU) with improved thermal exchange.

[0008]A heat sink has a conducting heat seat, multiple heat pipes and multiple heat dissipating fins. The heat pipes are mounted through the conducting heat seat and each heat pipe has a central portion and two distal portions. The central is flat. The distal portions on one side of the conducting heat seat lined zigzag. The flat central portions and zigzag lined distal portions allow more heat pipes to be mounted through the seat per unit area. The heat dissipating fins are separately mounted on the first conducting distal portions of the heat pipes to transfer heat to the atmosphere.

[0009]Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010]FIG. 1 is a perspective view of a first embodiment of a heat sink in accordance with the present invention;

[0011]FIG. 2 is a side view of the heat sink in FIG. 1;

[0012]FIG. 3 is a partly exploded perspective view of the heat sink in FIG. 1;

[0013]FIG. 4 is a perspective view of the first kind of a heat pipe of the heat sink in FIG. 1;

[0014]FIG. 5 is a side view of the heat pipe of the heat sink in FIG. 4;

[0015]FIG. 6 is a perspective view of the second kind of a heat pipe of the heat sink in FIG. 1;

[0016]FIG. 7 is a side view of the heat pipe of the heat sink in FIG. 6;

[0017]FIG. 8 is a perspective view of the third kind of a third tube of the heat sink in FIG. 1;

[0018]FIG. 9 is a side view of the heat pipe of the heat sink in FIG. 8;

[0019]FIG. 10 is a top view of the heat sink in FIG. 1;

[0020]FIG. 11 is a front view of the heat sink in FIG. 1;

[0021]FIG. 12 is a side view of a second embodiment of a heat sink;

[0022]FIG. 13 is a side view of the heat sink in accordance with the prior art;

[0023]FIG. 14 is a perspective view of the heat pipe of the heat sink in FIG. 11; and

[0024]FIG. 15 is a: side view of the heat sink in FIG. 12.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025]With reference to FIGS. 1 to 3, a first embodiment of a heat sink in accordance with the present invention comprises a conducting heat seat (10), multiple heat pipes (20) and multiple heat dissipating fins (30).

[0026]The conducting heat seat (10) has two opposite sides, a base (11) and a cover (12). The base (11) has an inner surface and multiple base recesses (111).

[0027]The base recesses (111) are formed in the inner surface of the conducting heat seat (10).

[0028]The cover (12) is mounted securely on the base (11) and has an inner surface, multiple cover recesses (121). The cover recesses (121) are formed in the inner surface of the cover (12), respectively correspond to the base recesses (111).

[0029]With further reference to FIGS. 4 to 9, the heat pipes (20A, 20B, 20C) are mounted through the conducting heat seat (10), are mounted respectively in the base recesses (111) of the base (11) and are mounted respectively in the cover recesses (121) of the cover (12). Each heat pipe (20) has a central portion (22A, 22B, 22C) and two distal portions (23A, 23B, 23C).

[0030]The central portion (22A, 22B, 22C) is substantially flat, is mounted in one base recess (111) of the base (11) and one cover recess (121) of the cover (12) and has a transverse length (223A, 223B, 223C), a longitudinal depth (221A, 221B, 221C), a vertical thickness (222A, 222B, 222C) and two ends. The longitudinal depth (221A, 221B, 221C) correspond to heights of the base and cover recesses (111, 121). The vertical thickness (222A, 222B, 222C) are less than the longitudinal depth (221A, 221B, 221C) and correspond to depths of the base and cover recesses (111, 121). Furthermore, the central portions (22A, 22B, 22C) of the heat pipes of the first embodiment are separate, as shown in FIG. 2.

[0031]The distal portions (23A, 23B, 23C) are respectively formed on the ends of the heat pipe (20A, 20B, 20C) and are substantially perpendicularly to the conducting heat seat (10). The heat pipes (20A, 20B, 20C) are first heat pipes (20A), second heat pipes (20B) and third heat pipes (20C). The first, second and third heat pipes (20A, 20B, 20C) are arranged in a staggered arrangement so that the distal portions (23A, 23B, 23C) of the heat pipes (20A, 20B, 20C) on one side of the conducting heat seat (10) is arranged in a zigzag line as shown in FIGS. 10 and 11. The distal portions (23A, 23B, 23C) in the zigzag lines cooperate with the flat central portions (22A, 22B, 22C) and allow adjacent heat pipes (20A, 20B, 20C) to be closer and abut tighter each other when compared to central portions of a conventional heat pipe arranged in a straight line.

[0032]The heat dissipating fins (30) are separately mounted around the distal portions (23A, 23B, 23C) of the heat pipes (20A, 20B, 20C) and have multiple through holes (31). The through holes (31) are formed through the heat dissipating fin (30), correspond respectively to and are mounted respectively around the distal ends (23) of the heat pipes (20A, 20B, 20C) and align with through holes (31) in adjacent dissipating fins (30). Each through hole (31) has a rim (32) and a shoulder (33). The shoulder (33) is formed around the rim (32) of the through hole (31).

[0033]With further reference to FIG. 12, a second embodiment of the heat sink is similar to the first embodiment, the base and cover recesses (111, 121) are arranged more compact and the heat pipes is in a closer arrangement when compared to the first embodiment. Therefore, the central portions (22A, 22B, 22C) of adjacent heat pipes (20A, 20B, 20C) abut and contact each other.

[0034]Since the vertical thickness (222A, 222B, 222C) of the heat pipes (20A, 20B, 20C) are less than the longitudinal depths (221A, 221B, 221C) and the distal portions (23A, 23B, 23C) are in the zigzag lines, more heat pipes (20A, 20B, 20C) per unit area can be arranged through the seat (10) to conduct heat generated by a CPU to the heat dissipating fins (30). Therefore, the thermal dissipation of the heat sink is improved.

[0035]Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and features of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat sink comprisinga conducting heat seat having two opposite sides;multiple heat pipes being mounted through the conducting heat seat and each heat pipe havinga central portion being substantially flat and havinga longitudinal depth;a vertical thickness being less than the longitudinal depth;a transverse length; andtwo ends; andtwo distal portions being respectively formed on the ends of the heat pipe and being substantially perpendicularly to the conducting heat seat, the distal portions of the heat pipes on one side of the conducting heat seat are arranged in a zigzag line; andmultiple heat dissipating fins being separately mounted around the distal portions of the heat-pipes and havingmultiple through holes being formed through the heat dissipating fin, corresponding respectively to and being mounted respectively around the distal ends of the heat pipes, aligning with through holes in adjacent dissipating fins and each through hole havinga rim; anda shoulder being formed around the rim of the through hole.

2. The heat sink as claimed in claim 1, whereinthe conducting heat seat hasa base havingan inner surface; andmultiple base recesses being formed in the inner surface of the conducting heat seat; anda cover being mounted securely on the base and havingan inner surface;multiple cover recesses being formed in the inner surface of the cover and respectively corresponding to the base recesses; andthe heat pipes are mounted respectively in the base recesses of the base and mounted respectively in the cover recesses of the cover and each central portion is mounted in one base recess of the base and one cover recess of the cover.

3. The heat sink as claimed in claim 2, wherein the central portions of the adjacent heat pipes are separate.

4. The heat sink as claimed in claim 2, wherein the central portions of adjacent heat pipes abut and contact each other.

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