Patent application number | Description | Published |
20080236798 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a base ( | 10-02-2008 |
20080239679 | HEAT DISSIPATION DEVICE HAVING METAL DIE-CASTING COMPONENT AND METAL-EXTRUSION COMPONENT - A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion. | 10-02-2008 |
20080289798 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly includes a plurality of fins and has a bottom surface cooperatively formed by bottom edges of the fins. The heat pipes of the heat pipe assembly are juxtaposed with each other; the top faces of the heat pipes are thermally attached to the bottom surface of the fin set; the bottom faces of the heat pipes are positioned level with each other to form a contacting surface for contacting with the heat generating device. | 11-27-2008 |
20080295993 | HEAT DISSIPATION APPARATUS WITH HEAT PIPES - A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm. | 12-04-2008 |
20080314555 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a first fin group located above the base, at least one heat pipe connecting the base and the first fin group and first and second fans located at two opposite sides of the first fin group. Each of the first and second fans is oriented with an acute angle to the base. Outlet and inlet of the first and second fans are oriented towards the base and the first fan produces cooling air to blow towards the first fin group and the base and the second fan draws heated air away from the first fin group and the base. | 12-25-2008 |
20090000768 | HEAT DISSIPATION DEVICE - A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set. | 01-01-2009 |
20090008065 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device for dissipating heat from a heat-generating device includes a heat-absorbing plate, a heat pipe assembly attached to the heat-absorbing plate and a fin set attached to the heat pipe assembly. The fin set includes a plurality of fins and has a contacting surface cooperatively formed by bottom edges of the fins and attached to the heat pipe assembly. The heat pipe assembly includes heat pipes with evaporating sections and condensing sections located away from the evaporating sections. The evaporating sections of the heat pipes are covered by the heat-absorbing plate and the condensing sections of the heat pipes are exposed outside of the heat-absorbing plate. The heat pipes absorb heat from the heat-generating device via the heat-absorbing plate, and directly transfer the heat to the fin set. | 01-08-2009 |
20090016023 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe. | 01-15-2009 |
20090107653 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device includes a base for contacting with an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, comprising a first transferring portion thermally engaging with the base, and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe comprises an evaporation portion thermally engaging with the base, and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set. | 04-30-2009 |
20090141453 | HEAT DISSIPATION DEVICE HAVING A CLIP ASSEMBLY - A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto. | 06-04-2009 |
20090151896 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a wire clip. The heat sink has a base plate and a plurality of parallel fins arranged on the base plate. The heat sink defining a plurality lengthways channels between every two neighboring fins and a plurality of transverse channels perpendicular to the lengthways channels. The clip comprises a main body spanning on the base plate of the heat sink and two latching legs extending contrary from two opposite ends of the main body. The main body comprises a pressing section received in the lengthways channels and two pivoting sections extending from two opposite ends of the pressing section and received in the transverse channels. The two latching legs are located at the two opposite sides of the heat sink. | 06-18-2009 |
20090153805 | PORTABLE PROJECTOR WITH A HEAT DISSIPATION SYSTEM - A portable projector includes a housing, a first light source and a second light source located in the housing. A board thermally contacts the first light source for absorbing heat from the first light source. A heat pipe connects the board and a first heat sink for transferring the heat generated by the first light source from the board to the first heat sink. A second heat sink thermally contacts the second light source for dissipating heat from the second light source. | 06-18-2009 |
20090154102 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component. | 06-18-2009 |
20090159245 | HEAT DISSIPATION DEVICE HAVING A FAN HOLDER - A heat dissipation device includes a heat sink, a fan holder and a fan secured on a front side of the fan holder. The heat sink comprises a base and a plurality of fins on the base. An engaging groove is defined in top ends of the fins. The fan holder comprises a top panel and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has an inserting protrusion at a bottom surface thereof. The two sidewalls have two latching legs at lower ends thereof. The top panel is partially placed on front portion of the top ends of the fins and the inserting protrusion is inserted into the engaging groove of the fins, the two sidewalls abut against two lateral sides of the heat sink and the two latching legs fasten to two lateral sides of the base of the heat sink. | 06-25-2009 |
20090166010 | HEAT DISSIPATION DEVICE HAVING A FAN HOLDER - A heat dissipation device includes a heat sink, a fan holder and a fan secured on a front side of the fan holder. The heat sink includes a base having two first fixing ears at its two lateral sides and a plurality of fins on the base. At least an engaging notch is defined in top ends of the fins. The fan holder includes a top panel and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has at least an inserting protrusion at a bottom surface thereof. The two sidewalls have two fixing flanges at lower ends thereof. The top panel is partially placed on front portion of the top ends of the fins and the inserting protrusion is inserted into the engaging notch of the fins, the two sidewalls abut against two lateral sides of the heat sink and the two fixing flanges are disposed on the two first fixing ears. | 07-02-2009 |
20090195756 | PORTABLE PROJECTOR USING AN LED AND RELATED HEAT DISSIPATION SYSTEM - A portable projector with a heat dissipation system, includes a housing and two LED light sources located in the housing. Each of the LED light sources includes a circuit aboard, an LED device mounted on the circuit aboard and a heat pipe. The heat pipe has an evaporating section thermally contacting the circuit board, and a condensing section. A fin set thermally contacts with the condensing section of the heat pipe for dissipating heat therefrom. The fin set of one LED light source is located behind the evaporating section of the heat pipe of the other light source and closely adjacent to a wall of the housing. | 08-06-2009 |
20090211730 | HEAT DISSIPATION DEVICE HAVING A BRACKET - A heat dissipation device includes a first heat sink, a second heat sink far away from the first heat sink, a heat pipe transferring heat from the first heat sink to the second heat sink and a bracket for reinforcing the heat dissipation device. The bracket includes a first end attached to the first heat sink and a second end attached to the second heat sink. The second end defines a through hole receiving the heat pipe therethrough. The second end has a supporting portion and a clasping portion from an edge of the through hole. The supporting portion and the clasping portion are spaced from each other and firmly clasp the heat pipe. The clasping portion is bent to abut against the heat pipe and urge the heat pipe toward the supporting portion. | 08-27-2009 |
20090236076 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof. | 09-24-2009 |
20090242168 | HEAT SINK ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe. | 10-01-2009 |
20090242176 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction. | 10-01-2009 |
20090244849 | HEAT DISSIPATION DEVICE - A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device. | 10-01-2009 |
20090257820 | FASTENER - A fastener for fastening a heat sink to a printed circuit board via a back plate comprises a head and a shaft extending from the head. The shaft comprises a first and second engaging portions and a connecting portion therebetween. The first and second engaging portions have outer threads on exteriors thereof. Two cutouts are defined in the connecting portion. The back plate defines four thread holes machined with inner threads for engaging with the outer threads. In use of the fastener, an elastic force is produced to the fastener due to a deformation of the two cutouts during the threading. The elastic force helps the outer threads to have a secure engagement with the inner threads whereby the fastener can firmly engage with the back plate even when the fastener is subject to vibration or shock. | 10-15-2009 |
20090260779 | HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE - A heat dissipation device for dissipating heat from an electronic element, includes a base plate for absorbing heat from the heat-generating component, a fin unit located above the base plate and having a plurality of fins stacked together, and at least a heat pipe having an evaporating section thermally engaging with the base plate and a pair of condensing sections extending through the fins. Each of the fins has a plurality of parallel and protruding flanges on a top face thereof. The protruding flanges of the fins are of equal height and parallel to short sides of the fins. Each protruding flange has a length equal to that of the short sides of the fins. A distance between two neighboring ones of the protruding flanges located between the condensing sections is the same. The protruding flanges are provided for increasing a heat dissipation area of the fin. | 10-22-2009 |
20090266521 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current. | 10-29-2009 |
20090277615 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a clip. The fin assembly includes a first fin unit, a second fin unit, and a third fin unit. The third fin unit is located on the substrate, the second fin unit is located on the third fin unit, and the first fin unit is located on the first fin unit. A receiving space is defined in the second and third fin unit. The fan is received in the receiving space and spaced apart from the fin assembly. | 11-12-2009 |
20090279251 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink. | 11-12-2009 |
20090284927 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture. | 11-19-2009 |
20090301690 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a securing device. The securing device includes a holder fixed to the substrate and a plurality of elastic fasteners. The fasteners secure the fan onto the holder and each includes a sandwiched portion sandwiched between the fan and the holder to segregate the fan from the holder. | 12-10-2009 |
20090301694 | HEAT DISSIPATION DEVICE - A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a centre of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a centre of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously. | 12-10-2009 |
20090314465 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan. | 12-24-2009 |
20090316358 | HEAT DISSIPATION DEVICE WITH A FAN HOLDER ATTACHED WITH A POSITION-ADJUSTABLE AIR GUIDING MEMBER - A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink. | 12-24-2009 |
20090316362 | HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE - A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round corners in four corners of the body. Each main body of the fins defines a plurality of locking members thereon to engage with corresponding locking members of a corresponding front fin. The arch-shaped flanges in four respective corners of the fins cooperate with each other to form four arced faces in four corners of the assembled fins along an entire length of the assembled fins. | 12-24-2009 |
20100000715 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a sleeve coupling with the base, and a fastener engaging with the base and the sleeve. The base defines a hole extending therethrough. The sleeve includes a first portion coupling with the hole of the base and a second portion extending from an end of the first portion. The second portion is located at a first side of the base. The fastener includes a body portion extending through the sleeve and the base, a head portion and a foot portion formed at two ends of the body portion, respectively. The head portion is located at the first side of the base. A spring member is compressed between the head portion and the second portion. A compressed length of the spring member is adjustable by adjusting a coupling length of the first portion with the hole of the base. | 01-07-2010 |
20100000716 | HEAT DISSIPATION DEVICE HAVING A CLIP - A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device. | 01-07-2010 |
20100002381 | HEAT DISSIPATION DEVICE AND METHOD FOR MOUNTING THE SAME - A heat dissipation device used for dissipating heat generated by an electronic device comprises a base defining two cutouts recessed from two opposite sides thereof, two fasteners mounted in through holes of the base via the two cutouts and two elastic members coiled around the two fasteners. Each of the two fasteners comprises a shaft, a head and a threaded pole located at two ends of the shaft, a latching portion interconnecting the shaft and the threaded pole and a mounting portion which is formed on the shaft and located a distance above the latching portion. The mounting portion extends through the cutout and makes the elastic member be sandwiched elastically between the head and a top face of the base. The latching portion abuts against a bottom face of the base, thereby the two fasteners being mounted on the base. | 01-07-2010 |
20100020501 | HEAT DISSIPATION DEVICE - A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader. | 01-28-2010 |
20100025012 | HEAT SINK ASSEMBLY - A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The supporting bracket includes a mounting portion secured on the base and a pair of supporting arms extending from the mounting portion and fixed to the fan. Four screws extend through the fan to threadedly engage with the fin group. Lower two of the screws also extend through the supporting arms of the supporting bracket whereby the supporting bracket also connects with the fan. | 02-04-2010 |
20100038057 | HEAT DISSIPATION DEVICE - A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending near two opposite ends thereof and towards the supporting bracket. The clasps are bent to press against a bottom of the supporting bracket after the clasps extend through the supporting bracket. | 02-18-2010 |
20100053567 | PROJECTOR HAVING LED LIGHT SOURCES AND HEAT DISSIPATION DEVICE ASSEMBLY THEREIN - A projector includes first, second and third light sources and first, second and third heat dissipation devices attached to and thermally connecting with the light sources for dissipating heat generated thereby. The first heat dissipation device includes a first heat sink located adjacent to a lateral side of the projector from which a lens protrudes, a fin assembly and a bent heat pipe connecting the first heat sink and the fin assembly. The second heat dissipation device includes a base and a plurality of fins located at a rear side of the projector and defining a stepped portion on which the fin assembly of the first heat dissipation device is mounted. The third heat dissipation device includes a base and a plurality of fins and is located adjacent to an opposite lateral side of the projector. | 03-04-2010 |
20100078154 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device. | 04-01-2010 |
20100096107 | HEAT DISSIPATION DEVICE - A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device. | 04-22-2010 |
20100097763 | HEAT DISSIPATION DEVICE - A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly. | 04-22-2010 |
20100101757 | HEAT DISSIPATION DEVICE - A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting. | 04-29-2010 |
20100116462 | HEAT DISSIPATION SYSTEM - A heat dissipation system comprises a printed circuit board and at least a heat dissipation device mounted on the printed circuit board for dissipating heat generated by an electronic member mounted on the printed circuit board. The at least a heat dissipation device comprises a base, a plurality of fins extending upwardly from the base and an air guiding member located at a corner of the base. These fins are spaced from each other to define a plurality of heat exchange passages. Non-fins are disposed at a side of the base to define a cooling air passage. The cooling air passage is parallel to the heat exchange passages of the fins. The air guiding member is located in the cooling air passage for controlling open and close of the cooling air passage. | 05-13-2010 |
20100116467 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a plurality of fins stacked together, a plurality of heat pipes extending through the fins, and solder filled in gaps between the fins and the heat pipes. Each fin includes a plate defining a plurality of holes therein for extension of the heat pipes therethrough, respectively. A collar extends from a periphery of each of the holes. The collar includes a columned portion attached to an outer surface of each of the heat pipes, and a taper portion interconnecting the plate and the columned portion. The solder fills in a gap between the columned portion and a corresponding heat pipe and a space between the taper portion and the corresponding heat pipe. The collar has a height slightly smaller than a distance between two adjacent fins. | 05-13-2010 |
20100122795 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink, a plurality of heat pipes extending in the heat sink, a heat-conducting plate attached to the heat pipes, and a mounting member located between the heat sink and the heat-conducting plate and firmly securing the heat pipes to the heat-conducting plate. The mounting member includes a mounting base and a mounting board mounting on the mounting base. The heat pipes extending through the mounting base are received in the heat-conducting plate. The mounting board spanning the mounting base and the heat pipes press the heat pipes towards the heat-conducting plate via fasteners extending through the mounting base and screwing in the mounting board, whereby the heat pipes have an intimate contact with the heat-conducting plate. | 05-20-2010 |
20100139892 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, first and second fin units, two heat pipes, and a fan. The first fin unit is located on the base, and the second fin unit is located on the first fin unit. Each fin unit comprises a plurality of parallel fins with a plurality of channels defined therebetween. Each fin comprises an inlet section, an outlet section and a neck section interconnecting the inlet and outlet sections. A height of the neck section reduces gradually from the inlet section to the outlet section. Each heat pipe comprises an evaporating portion connecting with the base and a condensing portion inserting into a corresponding one of the outlet sections of the first and second fin units. The fan is located above the base and mounted onto the inlet sections of the first and second fin units. | 06-10-2010 |
20100147491 | HEAT DISSIPATION DEVICE HAVING A FAN HOLDER FOR ATTACHMENT OF A FAN - A heat dissipation device includes a heat sink, a fan and a fan holder attaching the fan to the heat sink. The heat sink includes a base and a plurality of fins. The fan includes a frame and four engaging flanges at a periphery thereof. The fan holder includes a supporting board supporting the fan thereon, a plurality of spaced retaining plates extending downwardly from a periphery edge of the supporting board and clasping the fins, two locking sheets extending upwardly from two diagonal corners of the supporting board and two locking poles extending upwardly from another two diagonal corners of the supporting board. The locking sheets abut against lateral sides of two engaging flanges of the fan. The locking poles are engagingly received in another two engaging flanges of the fan. | 06-17-2010 |
20100147502 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a heat pipe. The heat pipe includes an evaporating section connecting with a heat spreader, a condensing section connecting with a fin assembly, and a connecting section interconnecting the evaporating section and the condensing section. The evaporating section of the heat pipe has a diameter smaller than that of the condensing section. | 06-17-2010 |
20100155023 | HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN - A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan. | 06-24-2010 |
20100163213 | ACTIVE HEAT SINK FOR USE WITH ELECTRONIC DEVICE - A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft. | 07-01-2010 |
20100172088 | HEAT DISSIPATION DEVICE FOR MEMORY MODULE - A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation. | 07-08-2010 |
20100239385 | LOCKING DEVICE AND ELECTRONIC DEVICE USING THE SAME - An electronic device comprises a printed circuit board, a heat sink and a plurality of locking devices securing the heat sink to the printed circuit board. Each locking device comprises a shaft, a knob and an elastic member. The shaft has a plurality of outer teeth protruding outwardly from an outer surface of a top end thereof. The outer teeth are arranged along an axial direction of the shaft. The knob has an inner tooth meshing with the outer teeth of the shaft. The elastic member is compressed between a bottom of the knob and the heat sink. A length of the elastic changes when the inner tooth of the knob meshes with different outer teeth along the axial direction of the shaft to adjust a pressure of the locking device on the heat sink. | 09-23-2010 |
20100243207 | THERMAL MODULE - A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick structure is received in the chamber and attached to an inner wall of the heat spreader surrounding the chamber. The fin unit comprises a plurality of fins stacked together. | 09-30-2010 |
20100243229 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed. | 09-30-2010 |
20100246127 | HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit. | 09-30-2010 |
20100252239 | HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins. | 10-07-2010 |
20100258276 | HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board. | 10-14-2010 |
20100258277 | HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board. | 10-14-2010 |
20100258287 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base, a cover and plurality of columned fins. The base protrudes a plurality of studs from a top surface thereof. The cover defines a plurality of recesses and orifices therein. The columned fins each have a head received in corresponding recess of the base and a body extending from the head through the cover. The base joints with the cover by the studs of the base riveted in the orifices of the cover. The base cooperates with the cover to sandwich the heads of the fins therebetween to thereby secure the columned fins to the cover. | 10-14-2010 |
20100259897 | HEAT DISSIPATION DEVICE - A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader. | 10-14-2010 |
20100263431 | METHOD FOR MANUFACTURING COVER OF ELECTRONIC DEVICE AND COVER OBTAINED THEREBY - A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other. | 10-21-2010 |
20100296251 | HEAT DISSIPATION DEVICE - A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components. | 11-25-2010 |
20100297890 | ELECTRICAL CONNECTOR INTEGRALLY FORMED WITH SCREW HOLES - An electrical connector includes a plurality of terminals and an insulating housing loading terminals and defining a pair of mounting portions. Each of mounting portions has a screw hole extending along an upper to lower direction in which the electrical connector is mounted. The hole is divided into at least a first segment and a second segment below the first segment. The first segment and the second segment are tapped with a plurality of threads thereinside and open in opposite directions along a front and rear direction respectively. | 11-25-2010 |
20100307728 | HEAT DISSIPATION DEVICE - A heat dissipation device for removing heat from heat-generating components includes a fin unit. The fin unit includes a plurality of fins stacked together. Each fin is wave-shaped in profile and comprises a plurality of wave crests and wave troughs alternately arranged with each other. The wave crests of one of the fins respectively engage the wave troughs of a neighboring upper one of the fins. The wave troughs of the one of the fins are separated from and located below the corresponding wave crests of the upper one of the fins. | 12-09-2010 |
20100309626 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION STRUCTURE - An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other. | 12-09-2010 |
20100314073 | HEAT DISSIPATION DEVICE AND CLIP ASSEMBLY THEREOF - A heat dissipation device includes a heat sink, a positioning member and a wire clip. The heat sink includes a base and a plurality of fins. Two of the fins each form a hook. The positioning member includes a seat and two positioning arms each forming two opposite fingers. A receiving groove is defined under the seat, and a positioning slot is defined through a central portion of the seat. The seat is laterally sandwiched between the two fins and vertically sandwiched between the base and the hooks. Each of the two fins is sandwiched between the two fingers. The wire clip includes a resisting portion forming a protrusion and two clipping arms. The resisting portion rests on the base and is received in the receiving groove. The protrusion is received in the positioning slot. | 12-16-2010 |
20110024090 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section. | 02-03-2011 |
20110032680 | HEAT SINK ASSEMBLY HAVING CLIP - A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink. | 02-10-2011 |
20110048675 | HEAT SINK - A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first fins. The inner end of each of the first fins is engagingly received in the inner end of the previous adjacent first fin, sandwiching the inner end of a corresponding second fin therebetween. The outer end of each of the first fins is engagingly received in the outer end of the previous adjacent second fin, and the outer end of each of the second fins is engagingly received in the outer end of the previous adjacent first fin. | 03-03-2011 |
20110048681 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink. | 03-03-2011 |
20110063802 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE - A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component. | 03-17-2011 |
20110083830 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions. | 04-14-2011 |
20110094711 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly. | 04-28-2011 |
20110155351 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage. | 06-30-2011 |
20110180435 | METHOD FOR COMBINING COMPONENTS AND SHELL OBTAINED THEREBY - An exemplary combining method includes the following. Firstly, providing two components and a connector. Secondly, welding the connector to one of the two components, and securing the other one of the two components to the connector. | 07-28-2011 |
20120057278 | CONSUMER ELECTRONIC PRODUCT ASSEMBLY WITH BRACKET - A consumer electronic product assembly includes a consumer electronic product and a bracket holding the consumer electronic product. The bracket includes a supporting seat, a holding member and a connecting bar. The holding member holds the consumer electronic product. Opposite ends of the connecting bar hinge on the holding member and the supporting seat, respectively. The connecting bar is rotatable with respect to the supporting seat, and the holding member is rotatable with respect to the connecting bar, whereby the consumer electronic product held by the holding member can be adjusted to various positions with respect to the supporting seat. | 03-08-2012 |
20120087069 | ELECTRONIC DEVICE ASSEMBLY WITH TWO-PART BRACKET - An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation. | 04-12-2012 |
20120145374 | HEAT SINK - An exemplary heat sink includes a base plate and a fin unit including a plurality of fins arranged on the base plate. One of the base plate and fin unit includes a protruding member, and the other one of the base plate and the fin unit defines a groove corresponding to the protruding member. The protruding member is interferingly fitted in the groove thereby connecting the fin unit and the base plate together. | 06-14-2012 |
20120275848 | CONNECTOR - An exemplary connector includes a main body and a block engaged with the main body. The main body includes a central plate, a first extension plate extending downwardly from a lateral side of the central plate, and a second extension plate extending upwardly from an opposite lateral side of the central plate. Two riveting holes are defined through the central plate. The block includes a first securing plate and a second securing plate extending from the first securing plate and attached to the central plate of the main body. Two pins extend from the second securing plate and are punched to be engagingly received in the rivet holes of the central plate to engage with the main body. | 11-01-2012 |
20130000880 | HEAT DISSIPATION DEVICE WITH GOOD APPEARANCE - A heat dissipation device for a heat-generating component includes a heat dissipation fin group and a side plate. The heat dissipation fin group comprises a plurality of heat dissipation fins arranged one on the other, each of the heat dissipation fins comprises a base plate and a fold extending vertically from a side of the base plate. The folds of the heat dissipation fins located at a common side are combined with each other to form a side surface. The side plate covers the side surface of the heat dissipation fin group, and an exposed surface of the side plate includes a plurality of strips formed thereon. | 01-03-2013 |
20130048244 | HEAT DISSIPATION APPARATUS WITH HEAT PIPE - An exemplary heat dissipation apparatus includes a number of fins and a heat pipe. Each fin defines a through hole therein. A collar extends from each fin at an edge of the through hole. The collar inclines toward a center of the through hole. An inner diameter of the collar gradually decreases along a direction away form the fin. A diameter of the heat pipe is larger than a minimum inner diameter of the collar when the collar in a natural state. When the heat pipe extends through the through hole of the fin, the collar is pushed by the heat pipe to expand outwardly, so that the heat pipe intimately contacts an inner face of the collar. | 02-28-2013 |
20130048251 | HEAT DISSIPATION DEVICE INCORPORATING HEAT SPREADER - An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat spreader and a fin set placed on the heat spreader. The heat spreader includes a base, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board. A first chamber is defined between the base and the partition board, and a second chamber is defined between the partition board and the covering plate. | 02-28-2013 |
20130105123 | HEAT DISSIPATION DEVICE | 05-02-2013 |
20130240190 | HEAT SINK AND METHOD FOR MANUFACTURING THE SAME - An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins. | 09-19-2013 |
20130255929 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base and a plurality of fins. Two latch parts project from a top surface of the base, the two latch parts cooperatively define a recess therebetween. Each fin defines a tenon at a bottom portion. The tenon has a configuration in complement with that of the recess. The latch parts located between two neighboring fins is punched to make the fins fix on the base. | 10-03-2013 |