| Entries |
| Document | Title | Date |
|---|
| 20080202240 | Two-Dimensional Adaptive Accelerometer Based on Dielectrophoresis - Conventional accelerometers are based on test masses that are suspended in some kind of spring damper system. According to an exemplary embodiment of the present invention, a two-dimensional adaptive accelerometer based on dielectrophoresis is provided, which measures an acceleration of a test mass freely floating in a medium by determining the movement of the test mass due to an accelerating force acting on the test mass. A non-uniform electric force field provides for a wide and adjustable dynamic range. | 08-28-2008 |
| 20080210008 | Multi-axial angular velocity sensor - A flexible substrate ( | 09-04-2008 |
| 20090000377 | Brain impact measurement system - A brain and/or skull impact measurement system has a body mounted impact device. The body mounted impact device includes a tri-axial accelerometer configured to measure impacts to an individual's body where the sensor produces impact data in response to the impact. A reader is provided with a data processor and a transmitter/receiver that receives the impact data. The reader is coupled to the body mounted impact device and can be a handheld device. | 01-01-2009 |
| 20090013785 | Detection circuit, physical quantity measurement circuit, physical quantity measurement device, and electronic instrument - A detection circuit includes a detection terminal to which an alternating current signal from a physical quantity transducer is input, a detection current/voltage conversion amplifier circuit that converts the alternating current signal input through the detection terminal into a voltage signal, an evaluation terminal that supplies an evaluation voltage signal to the detection current/voltage conversion amplifier circuit, an input resistor that has a given resistance ratio with respect to a feedback resistor; and a switch circuit of the detection circuit provided in a signal path that connects the evaluation terminal and an input node of the detection current/voltage conversion amplifier circuit. | 01-15-2009 |
| 20090056446 | Multiple-axis sensor package and method of assembly - A multiple-axis sensor package and method of assembling a multiple-axis sensor package are provided. The package includes a first accelerometer for sensing acceleration in a first sensing axis. The package also includes a second substrate having a second accelerometer for sensing acceleration in a second sensing axis. The package further includes one or more bent lead connectors connecting the first substrate to the second substrate, wherein the one or more bent lead connectors are bent so that the first sensing axis is different than the second sensing axis. | 03-05-2009 |
| 20090084181 | INTEGRALLY FABRICATED MICROMACHINE AND LOGIC ELEMENTS - Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element comprises a FinFET structure having a height and a width, the height being greater than the width. | 04-02-2009 |
| 20090133499 | Accelerometer Module for Use With A Touch Sensitive Device - An accelerometer module for use with a touch sensor on a device, a method of detecting acceleration using a touch sensor, and a computer program product for receiving the touch sensor data and producing output representative of acceleration. The accelerometer module provides a device with a touch sensor, such as a mobile phone, with the ability to sense acceleration, orientation, or both. The accelerometer module may sense acceleration along a single axis or multiple axis. Sensing acceleration along three axis may be useful for producing a handheld game controller or for providing input to many other applications. The accelerometer module applies a force against a deformable member to change the contact area between the deformable member and the touch sensor, wherein the contact area is a function of the amount of applied acceleration. | 05-28-2009 |
| 20100116053 | Convective Accelerometer - A convective accelerometer capable of measuring linear or angular acceleration, velocity, or angle of inclination is provided. The accelerometer comprises sensing elements that are sensitive to convection located inside a sealed housing containing a liquid agent. Applied external acceleration causes forced convection of the liquid agent, which produces variations in an electric current produced by the sensing elements that are proportional to the applied acceleration or angle of inclination. The accelerometer has a small size, extremely wide frequency and dynamic ranges, high sensitivity, simple design and is suitable for mass production. The device has a wide range of application, such as stabilization and control systems, homeland security, and oil exploration. | 05-13-2010 |
| 20100126273 | FLEXIBLE IMPACT SENSORS AND METHODS OF MAKING SAME - Flexible impact sensors are provided which are constructed of flexible polyimide substrate, electrodes and a pressure-sensitive electrically conductive polymer composite layer having conductive nanoparticles. Dual-purpose impact and temperature sensors are also described. Methods of making flexible impact sensors are disclosed. | 05-27-2010 |
| 20100307246 | Semiconductor dynamic quantity sensor and method of manufacturing the same - A semiconductor dynamic quantity sensor has a substrate including a semiconductor substrate, an insulation layer on a main surface of the semiconductor substrate, and a semiconductor layer on the insulation layer. The main surface has a projection that is trapezoidal or triangular in cross section. The semiconductor layer is divided by a through hole into a movable portion. A tip of the projection is located directly below the movable portion and spaced from the movable portion by a predetermined distance in a thickness direction of the substrate. A width of the tip of the projection is less than a width of the movable portion in a planar direction of the substrate. The distance between the tip of the projection and the movable portion is equal to a thickness of the insulation layer. | 12-09-2010 |
| 20110048132 | Microsystem - A microsystem, e.g., a micromechanical sensor, has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint. | 03-03-2011 |
| 20110192228 | SENSOR - A sensor includes: a first polymer sensor element generating a first voltage corresponding to a deformation thereof; a second polymer sensor element generating a second voltage corresponding to a deformation thereof; a fixing member fixing a first end of each of the first and the second polymer sensor elements while electrically insulating the first ends from each other; and a detector detecting an acceleration and an angular acceleration based on the first voltage derived from the first polymer sensor element and the second voltage derived from the second polymer sensor element. | 08-11-2011 |
| 20120060606 | ACCELEROMETER BASED REMOVAL AND INVERSION TAMPER DETECTION AND TAP SWITCH FEATURE - Disclosed are apparatus and methodologies for detecting inversion tamper, removal tamper, and taps using a three-axes accelerometer sensor in a utility meter environment. Inversion tamper is detected upon power up if the acceleration value along Y axis is greater than or equal to some small positive threshold. Removal tamper is detected if the average acceleration change of both Y and Z axes is greater than or equal to the removal threshold. A tap is detected if the average acceleration change along the X axis is greater than or equal to the tap threshold. The initial acceleration values are set upon power up. Removal tamper detection and tap detection are distinguished using a moving average filter. Tap detection uses timing constraints to avoid false tap detections. | 03-15-2012 |
| 20120266672 | Heated air mass WCSP package and method for accelerometer - An inertial sensor ( | 10-25-2012 |
| 20120266673 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an inertial sensor. The inertial sensor includes a sensor unit including a flexible substrate part on which a driving electrode and a sensing electrode are formed, a mass displaceably mounted on the flexible substrate part, and a support body coupled with the flexible substrate part in order to support the mass in a floated state and made of silicon; and a lower cap covering a bottom portion of the mass and made of silicon, wherein the lower cap and the sensor unit are coupled by a silicon direct bonding method, whereby the inertial sensor and the method of manufacturing the same may be obtained to improve the convenience in manufacturing and the reliability of the sensor by bonding the sensor unit and the lower cap by the silicon direct bonding method. | 10-25-2012 |
| 20120279304 | Activity Detection in MEMS Accelerometers - A method of detecting activity with a MEMS accelerometer stores a value of acceleration, then measures acceleration at a later time, calculates a change in acceleration using the measured acceleration and the stored acceleration, and compares the change in acceleration to an activity threshold to detect activity. A method of detecting inactivity uses a similar technique along with a timer. The method of detecting inactivity with a MEMS accelerometer stores an acceleration value, then measures acceleration at a later time, calculates a change in acceleration using the measured acceleration and the stored acceleration, and compares the change in acceleration to an inactivity threshold. If the change in acceleration is less than the inactivity threshold and, if a predetermined period of time has elapsed, then inactivity is detected. | 11-08-2012 |
| 20130014585 | ACCELEROMETER-BASED TOUCH PAD FOR TIMING SWIMMING AND OTHER COMPETITIVE EVENTS - A touchpad useful in timing competitive sporting events such as swim meets includes a touch plate having a front surface and a back surface, one or more accelerometers coupled to the touch plate, electrical circuitry in communication with the accelerometers to detect motion indicative of a user's touch, and communications circuitry to transmit information indicative of a user's touch to a display, storage device or other remote unit. The back surface of the touch plate may have resilient ridges or a backing structure that more positively ensures contact recording. The circuitry may battery powered with rechargeable batteries. The communications circuitry may use wireless RF technology such as WiFi synchronized absolute time to transmit the touch information to a central timing system. In competitive swimming events, the communications circuitry utilizes a standard Colorado Timing systems banana plug. | 01-17-2013 |
| 20130025369 | Inertial Measurement Systems, and Methods of Use and Manufacture Thereof - A micro-electro-mechanical systems (MEMS) inertial measurement system facilitates accurate location and/or attitude measurements via passive thermal management of MEMS inertial sensors. Accuracy of the system is also improved by subjecting the inertial sensors to programmed single-axis gimbal motion, and by performing coarse and fine adjustments to the attitude estimates obtained by the system based on the programmed motion and on the passive thermal management of the sensors. | 01-31-2013 |
| 20130042685 | PHYSICAL QUANTITY SENSOR AND ELECTRONIC APPARATUS - A physical quantity sensor includes a base substrate, a movable part located on the base substrate and provided on a principal surface of the base substrate, a movable electrode part provided in the movable part, and a fixed electrode part provided on the principal surface of the base substrate and located to be opposed to a movable electrode finger, and the fixed electrode part is connected to fixed electrode wiring provided at the principal surface side of the base substrate, the movable electrode part is connected to movable electrode wiring provided at the principal surface side of the base substrate, and a shield part is provided between the fixed electrode wiring and the movable electrode wiring. | 02-21-2013 |
| 20130068021 | INERTIAL SENSOR - Disclosed herein is an inertial sensor including: a sensor part including a driving body displaceably mounted on a flexible substrate part, a driving unit moving the driving body, and a displacement detection unit detecting a displacement of the driving body, wherein the inertial sensor includes an application specific integrated circuit (ASIC) including the sensor part coupled thereto; a printed circuit board including the ASIC coupled thereto and electrically connected to the sensor part and the ASIC by a wire; and a cap covering the sensor part and the ASIC and coupled to the printed circuit board, whereby the driving body and the flexing substrate part is protected and an interval between the driving body and the flexible substrate part is optimized to obtain efficient driving characteristics and a Q factor and improve a freedom of design in a space use. | 03-21-2013 |
| 20130074598 | INERTIAL SENSOR - Disclosed herein is an inertial sensor including: a sensor part including a driving body, a flexible substrate part displaceably supporting the driving body, a support part supporting the flexible substrate part so that the driving body is freely movable in a state in which it is floated, and a lower cap covering a lower portion of the driving body and coupled to the support part; an application specific integrated circuit (ASIC) including the sensor part stacked thereon and coupled thereto; a printed circuit board including the ASIC stacked thereon and coupled thereto and electrically connected to the sensor part and the ASIC by a wire; and a cap covering the sensor part and the ASIC and coupled to the printed circuit board, wherein the cap includes an air discharging hole formed in order to discharge internal air to the outside. | 03-28-2013 |
| 20130104654 | MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT | 05-02-2013 |
| 20130118257 | MEMS TUNNELING ACCELEROMETER - A tunneling accelerometer includes a proof mass that moves laterally with respect to a cap wafer. Either the proof mass or the cap wafer includes a plurality of tunneling tips such that the remaining one of proof mass and the cap wafer includes a corresponding plurality of counter electrodes. The tunneling current flowing between the tunneling tips and the counter electrodes will thus vary as the proof mass laterally displaces in response to an applied acceleration. | 05-16-2013 |
| 20130125651 | FAIL SAFE TEST FOR A BANDWIDTH CHECK ON INERTIAL SENSING COMPONENTS - The output amplitude of an inertial sensor output signal is compared to an upper and a lower limit to determine whether or not the bandwidth of the sensor is within specification. | 05-23-2013 |
| 20130228013 | PHYSICAL QUANTITY SENSOR AND ELECTRONIC APPARATUS - A physical quantity sensor includes a base section, a movable body having a movable electrode section, pivot sections connected to the movable body, and forming a pivot axis of the movable body, a fixation section fixed to the substrate, and adapted to support the movable body via the pivot sections, and a fixed electrode section disposed on the substrate so as to be opposed to the movable electrode section, and the fixation section is provided with opening sections disposed on a line of the pivot axis. | 09-05-2013 |
| 20130283912 | SENSOR DEVICE AND RELATED FABRICATION METHODS - Apparatus and related fabrication methods are provided for a sensor device. An exemplary sensor device includes a first structure including a first sensing arrangement and a second sensing arrangement formed therein and a second structure affixed to the first structure. The second structure includes a cavity aligned with the first sensing arrangement to provide a first reference pressure on a first side of the first sensing arrangement and an opening aligned with the second sensing arrangement to expose the first side of the second sensing arrangement to an ambient pressure. | 10-31-2013 |
| 20140238131 | INERTIAL FORCE SENSOR - An inertial force sensor that can suppress fluctuation of detection sensitivity even if an external stress is applied to the inertial force sensor. Angular velocity sensor ( | 08-28-2014 |
| 20150007656 | REDUCING THE EFFECT OF GLASS CHARGING IN MEMS DEVICES - A method of controlling exposed glass charging in a micro-electro-mechanical systems (MEMS) device is disclosed. The method includes providing a MEMS device comprising a proof mass positioned apart from at least one sense plate and at least one outboard metallization layer, wherein at least one conductive glass layer is coupled to the sense plate and the outboard metallization layer, the conductive glass layer including at least one exposed glass portion near the proof mass; and applying a first voltage to the sense plate and a second voltage to the outboard metallization layer. The first voltage is separated from the second voltage by a predetermined voltage level such that the exposed glass portion has an average voltage corresponding to a voltage midway between the first voltage and the second voltage. | 01-08-2015 |
| 20150096376 | Inertial and Pressure Sensors on Single Chip - In accordance with one embodiment, a single chip combination inertial and pressure sensor device includes a substrate, an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure, and a pressure sensor including a gap formed in the sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane. | 04-09-2015 |
| 20150355219 | MULTI-AXIS SENSOR - Embodiments of the invention provide a multi-axis sensor, including a first sensor embedded in an embedded substrate to sense a position, and a second sensor formed on a lower cap substrate bonded on the embedded substrate by a wafer level package scheme to sense an inertial force. | 12-10-2015 |
