| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 073514330 | Resistive sensor | 47 |
| 20080216573 | Semiconductor acceleration sensor - According to the present invention, a semiconductor acceleration sensor fabricated using a semiconductor substrate comprises: an outer frame formed by the semiconductor substrate; a plurality of beam portions formed by the semiconductor substrate and connected to the outer frame; a first mass portion formed by the semiconductor substrate and connected to the beam portion; and a second mass portion connected to the end face opposite to the beam portion of the first mass portion. The second mass portion is formed of material having a higher specific gravity than the first mass portion. | 09-11-2008 |
| 20080271535 | Semiconductor Acceleration Sensor - An object of the present invention is to provide a semiconductor acceleration sensor capable of sensing accelerations in two directions parallel to the surface of a diaphragm and orthogonal to each other with respective proper sensitivities. | 11-06-2008 |
| 20080314148 | Piezo-resistive detection resonant device made using surface technologies - This invention relates to a resonant device with detection in the piezo-resistive plane made using surface technologies on a bulk, which comprises a resonator connected to this bulk by at least one embedded portion, means of exciting this resonator and detection means comprising at least one suspended beam type strain gauge made from piezo-resistive material, in which each strain gauge has a common plane with the resonator, and is connected to this resonator at a point situated outside of this at least one embedded portion to increase the stress observed by this strain gauge. | 12-25-2008 |
| 20090025478 | Acceleration sensor - The present invention provides an acceleration sensor that improves endurance by avoiding damage to stopper portions. When a downward vibration is applied to a weight member and the weight member displaces downward, a bottom face of the weight member abuts a bottom plate, and the weight member stops and downward displacement is obstructed. Furthermore, when the weight member displaces upward, peripheral weight portions abut stopper portions, and the weight member stops and upward displacement is obstructed. Because displacement of the weight member is obstructed by abutting the stopper portions, if the strength of the stopper portions is low, the stopper portions may be damaged. However, by providing reinforcement portions which reinforce the stopper portions, damage to the stopper portions may be prevented, and endurance of the acceleration sensor is improved. | 01-29-2009 |
| 20090056449 | ACCELERATION SENSING DEVICE - An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. | 03-05-2009 |
| 20090071248 | ACCELERATION SENSOR DEVICE - An acceleration sensor device comprising: an acceleration sensor chip comprising a mass portion, a support frame and flexible arms having piezo-resistors on their top surfaces; and an upper regulation plate having an IC circuit, which is larger in area than the support frame, bonded to a top surface of the support frame; wherein the acceleration sensor chip and the upper regulation plate are placed in a protection case with a lid. The regulation plate protrudes from outside walls of the support frame to partition the space accommodating the chip in the protection case by the protrusion and to prevent air circulation above and below the regulation plate, so that a temperature rise due to the IC circuit among the piezo-resistors provided on the top surfaces of the flexible arms is kept uniform to reduce offset voltage. | 03-19-2009 |
| 20090071249 | ACCELERATION SENSOR-ATTACHED TIRE - An acceleration sensor-attached tire is provided which can detect acceleration in one arbitrary direction, in two or more directions where vectors are linearly independent of each other, or in two or more directions where vectors of the detected acceleration cross each other generated in a tire in a practical velocity range. A sensor unit | 03-19-2009 |
| 20090071250 | Beam accelerometer with limiting apparatus - An accelerometer includes a cantilever mass with a thin beam element between the mass and the fixed end of the accelerometer. The end of the mass is tapered. A limiting member has an aperture that is tapered corresponding to the taper at the end of the mass and positioned to surround the tapered end of the seismic mass. The beam accelerometer as well as the limiting member is placed in a cylindrical housing whereby the limiting member is moved along the taper of the seismic mass to adjust the spacing between the limiting member and the inner wall of the housing to thereby adjust the amount of movement of the seismic mass. In one embodiment the aperture of the tapered limited member also surrounds the seismic mass but the gap between the inner wall of the tapered limiting member and the outer wall of the seismic mass is adjusted to determine the amount of movement of the beam. In this manner, one can utilize a beam accelerometer arrangement of a cylindrical configuration within a housing and whereby the seismic mass has a taper and the taper coacts with a limiting member which has a corresponding taper to adjust the distance that the beam can move upon application of a force thereto. | 03-19-2009 |
| 20090183571 | ACCELERATION SENSOR - An acceleration sensor includes a base having an XY-substrate surface which is parallel to an XY plane, a beam portion having a frame shape which is arranged in a floating state above the XY-substrate surface of the base, a beam-supporting fixed portion which supports the beam on the base via supporting units like a beam supported by its both ends, weight portions | 07-23-2009 |
| 20090241669 | Coupled pivoted acceleration sensors - A pivoted acceleration sensor has a substrate that is substantially parallel to first and second surfaces. A reference frame is provided. A first unbalanced seismic mass is suspended within the reference frame and is coupled with the reference frame through first and second strain gauges. The first and second strain gauges are located along a pivot axis of the first unbalanced seismic mass. The first and second strain gauges are first and second piezoresistors on the first surface of the substrate, A second unbalanced seismic mass is flexibly coupled with the first unbalanced seismic mass. The second unbalanced seismic mass is suspended within the reference frame and is coupled with the reference frame through third and fourth strain gauges. The third and fourth strain gauges are located along a pivot axis of the second unbalanced seismic mass. The third and fourth strain gauges are third and fourth piezoresistors on the first surface of the substrate. Metallization on the first surface of the substrate is configured to connect the first, second, third and fourth piezoresistors in a bridge configuration without crossovers. | 10-01-2009 |
| 20090241670 | SEMICONDUCTOR ACCELERATION SENSOR - A semiconductor acceleration sensor includes an acceleration sensor chip that includes a weight portion, a base portion provided around the weight portion with a gap therebetween, and beam portions flexibly connecting the weight portion and the base portion; and a stopper plate that is provided above the acceleration sensor chip. The stopper plate includes: a plurality of fixing portions that are protrudingly provided at positions opposite to the base portion and are fixed to the base portion; first concave portions that are formed around the fixing portions at positions opposite to the weight portion and define the displacement of the weight portion; and a second concave portion that is formed at a position opposite to the beam portions and is deeper than the first concave portion. | 10-01-2009 |
| 20090255340 | SEMICONDUCTOR ACCELERATION SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part. | 10-15-2009 |
| 20090282918 | ACCELERATION SENSOR - An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). | 11-19-2009 |
| 20090293618 | Acceleration Sensor Device - An acceleration sensor device includes an acceleration sensor chip fixed onto a substrate at its bottom, sealed with a molding resin. The acceleration sensor chip has an airtight sealed space for a weight portion to swing in, in accordance with acceleration applied, and a cushion member which covers a side surface and a top surface of the acceleration sensor chip is interposed between the molding resin and the acceleration sensor chip. | 12-03-2009 |
| 20100043553 | ACCELERATION SENSOR CHIP PACKAGE - An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion. | 02-25-2010 |
| 20100064808 | Acceleration sensor and method of manufacturing acceleration sensor - The acceleration sensor according to the present invention includes a sensor chip having a movable portion operating in response to a change in a physical quantity and a silicon chip arranged to be opposed to a first side of the sensor chip and bonded to the sensor chip, while the sensor chip is provided with a penetrating portion penetrating the sensor chip in the thickness direction so that the first side is visually recognizable from a second side of the sensor chip, and the silicon chip is provided with an alignment mark on a portion opposed to the penetrating portion. | 03-18-2010 |
| 20100101324 | MEMS SENSOR - The MEMS sensor according to the present invention includes: a substrate; a supporting portion provided on one surface of the substrate; a beam, supported by the supporting portion, having a movable portion opposed to the surface of the substrate through a space; a resistive conductor formed on at least the movable portion of the beam; a weight arranged on a side of the beam opposite to the substrate; and a coupling portion, made of a metallic material, coupling the beam and the weight with each other. | 04-29-2010 |
| 20100101325 | Acceleration sensor - An acceleration sensor has a semiconductor acceleration sensor chip and a case. The semiconductor acceleration sensor chip has a fixed portion, a plummet portion surrounding the fixed portion without contacting the fixed portion, and a beam portion connecting the fixed portion and the plummet portion, the thickness of the beam portion being thinner than the thickness of the fixed portion. The case has a cavity housing the semiconductor acceleration sensor chip, and a projection portion formed on the bottom face of the cavity, the bottom face of the fixed portion being fixed to the top face of the projection portion. | 04-29-2010 |
| 20100116057 | MEMS SENSOR AND METHOD OF MANUFACTURING THE SAME - An MEMS (Micro Electro Mechanical Systems) sensor includes a base layer and a deformation portion provided on the base layer at an interval from the base layer and deformed by external force. The deformation portion is made of an organic material. | 05-13-2010 |
| 20100139402 | Highly sensitive piezoresistive element - A mechanical-to-electrical sensing structure is provided with first and second movable blocks. A first hinge is coupled to the first and second movable blocks and configured to resist loads other than flexing of the first hinge. At least a first gage link is separated from the first hinge and aligned to provide that a moment tending to rotate one of the first or second blocks relative to the other about the first hinge applies a tensile or compressive force along a length of the first gage link. Electrochemistry is used to define the at least first gage. | 06-10-2010 |
| 20100218607 | ACCELERATION SENSOR - An acceleration sensor whose characteristics including sensitivity are less likely to change relative to disturbance force applied to a sensor chip. The acceleration sensor has a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam. When disturbance force is applied to a sensor element in the direction in which the entire each of the beams extends, the stress damping sections absorbs the disturbance force. Because stress imposed in the direction in which the entire each of the beams extends becomes minimally changeable, and the deformability of the beam also becomes difficult to change, and this reduces the change in the sensitivity of the acceleration sensor caused by disturbance force. | 09-02-2010 |
| 20100300205 | ACCELERATION SENSOR ELEMENT AND ACCELERATION SENSOR HAVING SAME - A covered acceleration sensor element includes a weight portion, a support frame portion surrounding the weight portion, a plurality of flexible beam portions for connecting the weight portion to the support frame portion to support the weight portion, piezoresistance elements provided on the beam portions, and wirings for connecting them. An upper cover and a lower cover enclosing the periphery of the weight portion together with the support frame portion are joined to the face and back of the support frame portion. Acceleration in the directions of three axes, i.e., a first axis in the joining thickness direction, a second axis in a plane perpendicular to the first axis, and a third axis in the plane and perpendicular to the second axis, or acceleration in the direction of any of the axes, is detected from changes in the resistances of the piezoresistance elements. The support frame portion is separated by separation grooves into an inner frame and an outer frame. The upper cover and the lower cover are joined to the outer frame. The inner frame is connected to the outer frame by a plurality of inner frame support portions having flexibility. The beam portions are connected to both sides of the weight portion along the second axis and the third axis. The inner frame support portions are connected to both sides of the inner frame in a direction in which they are rotated nearly 45 degrees from the second axis and the third axis. | 12-02-2010 |
| 20120024065 | ACCELERATION SENSOR - An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). | 02-02-2012 |
| 20120085170 | Shock Resistant Mounting for High G Shock Accelerometer - A high-g shock accelerometer is provided with an LCC case. A MEMs acceleration sensor is positioned in an interior of the LCC case. The MEMs acceleration sensor has exterior surfaces including top and bottom surfaces and side surfaces. An elastomer is in an adjacent relationship or in contact to a majority of the exterior surfaces and to the interior of the LCC case. The MEMs acceleration sensor with the elastomer attenuates LCC case strain sensitivity while retaining wide band frequency response. | 04-12-2012 |
| 20120255358 | ACCELERATION SENSOR - An acceleration sensor includes a frame, a weight portion, an arm portion for connecting the frame and the weight portion, and a sensing portion for detecting a bend of the arm portion. The sensing portion includes a first electrode portion, a second electrode portion, and a strain resistor portion. The first electrode portion and the second electrode portion are provided on the weight portion. A first end of the strain resistor portion is connected to the first electrode portion, and a second end of the strain resistor portion is connected to the second electrode portion. The strain resistor portion is formed of a strain resistor film comprising a metal oxide. The strain resistor portion is formed in meander shape in the part which is nearer to the weight portion than the frame in the arm portion. | 10-11-2012 |
| 20130042687 | PIEZORESISTIVE TRANSDUCER - A piezoresistive transducer is disclosed having a framework including a support element attached to a bending element that undergoes a deformation relative to the support element when a force acts on the bending element including a neutral fiber whose length does not change during the deformation. At least one piezoresistive expansion body is attached to the support element that exhibits a piezoresistive material and converts the deformation of the bending element into an electrically detectable change in resistance. | 02-21-2013 |
| 20130061675 | ACCELERATION MEASURING APPARATUS AND ACCELERATION MEASURING METHOD - Disclosed herein are an acceleration measuring apparatus and an acceleration measuring method. The acceleration measuring apparatus includes: an acceleration sensor including a first output terminal and a second output terminal; a first switch of which an end is connected to the first output terminal; a second switch of which an end is connected to the second output terminal; a first resistor of which an end is connected to the other end of the first switch; a second resistor of which an end is connected to the other end of the second switch; a logic element connected to the end of the first resistor and the end of the second resistor; and a Time-to-Digital Convertor (TDC) converting a signal output from the logic element into a digital value. | 03-14-2013 |
| 20130133426 | INERTIAL SENSOR - Disclosed herein is an inertial sensor including: a membrane; a mass body provided under the membrane; a plurality of patterned magnets provided under the mass body; and a magnetoresistive element provided to be spaced apart from the mass body and measuring static DC acceleration acting on the mass body through resistance changed according to magnetic fields of the plurality of patterned magnets. The plurality of patterned magnets and the magnetoresistive element are included, thereby making it possible to measure static DC acceleration (particularly, gravity acceleration) that is difficult to measure using an existing to piezoelectric element. | 05-30-2013 |
| 20130205901 | SUSPENDED MASSES IN MICRO-MECHANICAL DEVICES - The micro-mechanical device includes a substrate with an internal cavity, a first surface, and an opposing second surface. A first trench is formed from the first surface of the substrate into the internal cavity. The first trench at least partially defines flexures. A second trench is formed from the second surface of the substrate into the internal cavity and at least partially defines a suspended mass. The suspended mass is connected by the flexures to the substrate. | 08-15-2013 |
| 20130312522 | METHOD AND APPARATUS FOR SENSING UNDERWATER SIGNALS - Methods and apparatuses are disclosed that assist in sensing underwater signals in connection with geophysical surveys. One embodiment relates to a transducer including a cantilever coupled to a base. The cantilever may include a beam and a first coupling surface angularly oriented from the beam, and the base may include a second coupling surface angularly oriented from the beam and substantially parallel to the first coupling surface of the cantilever. The transducer may further include a sensing material coupled between the first coupling surface of the cantilever and the second coupling surface of the base. | 11-28-2013 |
| 20130340527 | ACCELERATION SENSOR - An acceleration sensor with improved impact resistance includes a beam portion connected to a supporting portion at a base side and connected to a weight portion at a top side. The beam portion has a T-shaped cross-section, and piezoresistors are located on an upper surface of the beam portion. The weight portion connects to a top of the beam portion and is arranged inside the supporting portion. A C-shaped slit is provided between the weight portion and the supporting portion so as to surround the weight portion. The weight portion includes an extended portion in which an end of a top surface layer on a side facing the beam portion extends out toward the beam portion beyond an end of the supporting substrate layer on a side facing the beam portion. | 12-26-2013 |
| 20140000368 | DYNAMIC SENSOR | 01-02-2014 |
| 20140060187 | ACCELERATION SENSOR - An acceleration sensor includes an outer frame body, a heating element, a first temperature sensing element for temperature measurement and a second temperature sensing element for temperature measurement, and an operational amplifier. In the outer frame body, a fluid chamber capable of sealing a fluid inside thereof is formed. The heating element is formed on a circuit mounting surface which is a specific inner wall surface of a plurality of inner wall surfaces defining the fluid chamber. The first temperature sensing element and the second temperature sensing element are formed on the circuit mounting surface. The distance from the first temperature sensing element to the heating element is shorter than the distance from the second temperature sensing element to the heating element. The operational amplifier calculates a difference between a measurement result by the first temperature sensing element and a measurement result by the second temperature sensing element. | 03-06-2014 |
| 20140144236 | ACCELERATION SENSOR - Disclosed herein is an accelerator sensor, including: a mass body; a flexible beam that is provided with a piezoresistive element configured of an X-axis resistive element, a Y-axis resistive element, and a Z-axis resistive element having both ends connected with contact pads and is connected with the mass body; and a support portion that is connected with the flexible beam and supports the flexible beam so as to float the mass body, wherein the flexible beam has a slit provided between one-axis resistive element and the other axis resistive element adjacent to each other and the slit is extendedly formed from the contact pads connected with ends of the one axis resistive element and the other axis resistive element to the contact pads connected with the other ends thereof. | 05-29-2014 |
| 20140165725 | Analysis Circuit for Field Effect Transistors Having a Displaceable Gate Structure - An analysis circuit for a field effect transistor having a displaceable gate structure, includes a measurement circuit coupled between a supply voltage connection of the analysis circuit and a drain connection of the field effect transistor and configured to output a measurement signal that is dependent on the current strength of a current flowing through the field effect transistor to a measurement connection. | 06-19-2014 |
| 20140283606 | ACCELERATION SENSOR - An acceleration sensor includes a weight, a supporting portion arranged so as to face the weight, beams configured to be flexible and connect the weight and the supporting portion, and piezoresistive elements disposed at the beams, wherein the weight oscillates in a pendulum motion while using center portions of the beams as fulcrums. | 09-25-2014 |
| 20140305212 | CIRCUIT FOR MEASURING ACCELERATION OF THREE-AXIS ACCELERATION SENSOR - Disclosed herein is a circuit for measuring acceleration of a three-axis acceleration sensor. The circuit for measuring acceleration of a three-axis acceleration sensor includes: three-axis acceleration sensors connected to one another in parallel and sensing the respective accelerations applied to three axes directions of X, Y, and Z axes to output corresponding signals; a demultiplexer outputting three axes signals each output from the three-axis acceleration sensors through a single path; and an amplifier amplifying the output signal from the demultiplexer, and further includes, at a back-end of the amplifier, a multiplexer distributing a signal output from the amplifier to the respective axes, a sample and hold circuit unit sampling and storing an analog signal of each axis output from the multiplexer, and an analog-to-digital converter converting an analog signal output from the amplifier into a digital signal. | 10-16-2014 |
| 20150007657 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an inertial sensor including: a flexible part; a mass body connected to the flexible part; and a support part connected to the flexible part and supporting the mass body in a floated state to displace the mass body, wherein the flexible part has an upper piezoresistor disposed on one surface thereof and a lower piezoresistor disposed on the other surface thereof to detect a displacement of the mass body. | 01-08-2015 |
| 20150020592 | RESISTIVE TYPE ACCELERATION SENSOR - Disclosed herein is a resistive type accelerator sensor, including: a sensor unit; and a continuous time sigma-delta ADC including an input unit which receives an analog input signal transferred from the sensor unit, an addition circuit which is coupled with the input unit to receive the analog input signal and an analog feedback signal transferred from DAC to provide a summed signal, an integrator which integrates the summed signal transferred from the addition circuit, a comparator which converts an integrated signal transferred from the integrator into a digital signal, and an output unit which transfers the digital output signal. | 01-22-2015 |
| 20150059476 | ACCELERATION SENSOR - Disclosed herein is an acceleration sensor including: a mass body part; a flexible beam having an electrode or a piezoresistor disposed thereon and having the mass body part coupled thereto; and a support part having the flexible beam connected thereto and supporting the flexible beam, wherein the mass body part, the flexible beam, and the support part are formed by coupling first and second substrates to each other, one surface of the first substrate is provided with a first masking pattern corresponding to the flexible beam, the mass body part, and the support part, and one surface of the second substrate is provided with a second masking pattern corresponding to the mass body part and the support part. | 03-05-2015 |
| 20150059477 | ACCELERATION SENSOR - Disclosed herein is an acceleration sensor including: a mass; a flexible beam on which an electrode or a piezoresistive element is disposed and the mass is coupled; and a support part connecting to and supporting the flexible beam and having therein a stress isolating slit facing the mass, wherein the mass, the flexible beam and the support part are formed by coupling first and second substrates, wherein the first substrate has a first masking pattern formed thereon corresponding to the flexible beam, the mass and the support part and the second substrate has a second masking pattern formed thereon corresponding to the mass and the support part. | 03-05-2015 |
| 20150107359 | PIEZORESISTANCE SENSOR MODULE AND MEMS SENSOR HAVING THE SAME - Disclosed herein is a piezoresistance sensor module including: a piezoresistor, a depletion layer formed in a region of a portion of the piezoresistor, an insulator formed to cover the depletion layer and one surface of the piezoresistor, and a piezoelectric capacitor formed on the insulator so as to be opposite to the depletion layer. | 04-23-2015 |
| 20150331010 | ACCELERATION SENSOR - An acceleration sensor includes weights, a support, and beams on which piezoresistive elements are disposed. The weights include projections and recesses. The support includes projections and recesses. The beams are connected to the projections and the recesses. The beams are connected to the recesses and the projections. The beams are connected to the recesses and the projections. | 11-19-2015 |
| 20150346235 | HIGH-OUTPUT MEMS ACCELEROMETER - A MEMS acceleration sensor is provided. In one embodiment, the MEMS acceleration sensor comprises: a frame; a first proofmass located within the frame, the first proofmass including a left side, right side, top, and bottom; an axis running from the left side to the right side at about a median point between the top and bottom; a first flexure running along the axis and coupling the left side to the frame; a second flexure running along the axis and coupling the right side to the frame; a first channel that extends from the bottom up past the axis to a first channel end; a second channel that extends from the top down past the axis to a second channel end; a second proofmass located within the first channel and coupled to the first proofmass via a first hinge and a first gauge at the first channel end and coupled to the frame at the bottom via a second hinge and a second gauge; and a third proofmass located within the second channel and coupled to the first proofmass via a third hinge and a third gauge at the second channel end and coupled to the frame at the top via a fourth hinge and a fourth gauge. | 12-03-2015 |
| 20160054352 | MULTI-AXIS SENSOR AND METHOD FOR MANUFACTURING THE SAME - There are provided a multi-axis sensor and a method for manufacturing the same. The multi-axis sensor includes: a first sensor mounted on a board and detecting inertial force; and a second sensor mounted on the board and detecting a position and a motion, wherein the first sensor and the board have a seal formed therebetween so as to prevent permeation from the outside and are electrically connected to each other. | 02-25-2016 |
| 20160069927 | ACCELERATION SENSOR - An acceleration sensor includes a fixing portion, a weight portion, a detection beam, support beams, and a metal wiring. The weight portion is supported on the fixing portion so as to be freely displaced. The detection beam is connected to the fixing portion and the weight portion and piezoresistive elements are provided on the detection beam. The support beams are provided separately from the detection beam and are connected to the fixing portion and the weight portion. Both ends of the metal wiring are extended to the fixing portion and the metal wiring is wired so as to pass through the support beams. | 03-10-2016 |
| 20160124012 | ACCELERATION SENSOR - An acceleration sensor includes an outer frame body, a heating element, a first temperature sensing element for temperature measurement and a second temperature sensing element for temperature measurement, and an operational amplifier. In the outer frame body, a fluid chamber capable of sealing a fluid inside thereof is formed. The heating element is formed on a circuit mounting surface which is a specific inner wall surface of a plurality of inner wall surfaces defining the fluid chamber. The first temperature sensing element and the second temperature sensing element are formed on the circuit mounting surface. The distance from the first temperature sensing element to the heating element is shorter than the distance from the second temperature sensing element to the heating element. The operational amplifier calculates a difference between a measurement result by the first temperature sensing element and a measurement result by the second temperature sensing element. | 05-05-2016 |
