Entries |
Document | Title | Date |
20080202740 | RESILIENT FASTENER AND THERMAL MODULE INCORPORATING THE SAME - A thermal module ( | 08-28-2008 |
20080216997 | Heat plate construction and attachment for dismounting heat plate - A heat plate construction is provided, which is applicable for being fixed on a circuit board and contacting with a chip to perform a heat exchange. The heat plate construction includes a heat plate body and at least one buffer element. The heat plate body has a plurality of fixing points fixed on the circuit board and located outside the contacting region between the heat plate body and the chip. The buffer element is disposed outside the contacting region between the heat plate body and the chip, and the height of the buffer element is equal to a distance between the heat plate body and the circuit board, such that when the heat plate is dismounted, the buffer element relieves a force for the heat plate to press against the chip, so as to protect the chip from being damaged. | 09-11-2008 |
20080216998 | Thermostat and testing machine provided with the same - A thermostat includes a plate body, a heat insulator, and an electric heater. The plate body defines a cavity therewithin. The plate body has on its bottom two openings, which communicate with the cavity and function as a cooling medium inlet and a cooling medium outlet, respectively. The outer periphery of the plate body is covered with the heat insulator. That prevents heat intrusion and/or dissipation from the outer periphery of the plate body in transferring heat between the mounting face and a heat transfer medium within the cavity. That reduces the thermal influence on the mounting face, thereby ensuring more uniform temperature distribution on the mounting face. | 09-11-2008 |
20080223567 | Heat Dissipating Device - A heat dissipating device includes a heat sink having a base with an upper surface and a lower surface, and a plurality of heat dissipating elements disposed on the upper surface of the base; a clip having a frame matching with a contour of the base, wherein the frame has a positioning portion for preventing the base from displacement, at least a first fastener defined at an inner rim of the frame, and at least two second fasteners respectively defined at an outer rim of the frame, each of which has a through hole, such that the heat sink is able to be fixed by engaging the positioning portion with base and fastening the first fastener to the heat dissipating elements. | 09-18-2008 |
20080236804 | ELECTROTHERMAL INTERFACE MATERIAL ENHANCER - Vertically oriented carbon nanotubes (CNT) arrays have been simultaneously synthesized at relatively low growth temperatures (i.e., <700° C.) on both sides of aluminum foil via plasma enhanced chemical vapor deposition. The resulting CNT arrays were highly dense, and the average CNT diameter in the arrays was approximately 10 nm, A CNT TIM that consist of CNT arrays directly and simultaneously synthesized on both sides of aluminum foil has been fabricated. The TIM is insertable and allows temperature sensitive and/or rough substrates to be interfaced by highly conductive and conformable CNT arrays. The use of metallic foil is economical and may prove favorable in manufacturing due to its wide use. | 10-02-2008 |
20080236805 | TEMPERATURE CONTROL DEVICE FOR LIQUID MEDICINES - In a temperature control device for liquid medicines provided with a flow path block having flow paths for liquid medicines at both of front and back surfaces, heat-transmitting plates respectively disposed at both of the front and back surfaces of the flow path block in a manner so as to face the flow paths, and thermo-modules for performing a cooling operation or a heating operation on the liquid medicines that flows through the flow path via the heat-transmitting plates, respectively, at least one ridge of mountain-shaped sealing projection portion surrounding a periphery of the flow path are integrally formed with the flow path block at sealing surfaces respectively surrounding the flow paths at both of the front and back surfaces of the flow path block, and the heat-transmitting plates are fixed to the flow path block in a state of pressure-contacting the sealing projection portion. | 10-02-2008 |
20080236806 | Laminated Body - A laminated body comprises a thermally conductive sheet, a protective sheet, an auxiliary sheet, a carrier sheet and a coating sheet. The thermally conductive sheet comprises a main sheet body and an adhesive layer. The coefficient of static friction of the main sheet body is 1.0 or lower. The adhesive layer has high adhesiveness in comparison with the main sheet body, and has an outer shape smaller than that of the main sheet body. The protective sheet is formed having an outer shape larger than that of the adhesive layer, and provided with a cutting line extending toward the adhesive layer from the peripheral portion of the protective sheet so that the protective sheet can be cut along the cutting line. | 10-02-2008 |
20080289810 | Thermal Diffusion Sheet and Method for Positioning Thermal Diffusion Sheet - A thermal diffusion sheet is provided with a graphite sheet for diffusing heat generated by a heat emitting body and a polymer film provided on the graphite sheet. The thermal diffusion sheet is provided with a positioning portion for carrying out positioning relative to the heat emitting body. | 11-27-2008 |
20080314576 | THERMAL MODULE WITH POROUS TYPE HEAT DISSIPATER - A thermal module ( | 12-25-2008 |
20090020279 | Jointing structure of a heat dissipating fin - A jointing structure of a heat dissipating fin, disposed on an upper level edge and a lower level edge of each fin body of the heat dissipating fin, comprises at least one hole or more on each of the level edges, at least one lock tab or more on the fin body of the heat dissipating fin corresponding to the hole, and the lock tab is formed by directly folding the fin body instead of extendingly disposed from the upper and lower level edges. More than one protrusion is disposed on each of the lock tabs. The protrusions on the lock tabs of the upper and lower level edges in a previous fin body are coupled into the corresponding holes of the upper and lower level edges in a next fin body, so as to join multiple heat dissipating fins integrally and stably. | 01-22-2009 |
20090032234 | APPARATUS FOR TRANSFERRING HEAT IN A FIN OF A HEAT SINK - An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at least one fin of the plurality of fins, the thermal material having a thermal conductivity greater than the thermal conductivity of the at least one fin in a direction normal to the first side of the heat dissipating member. Finally, a thermal spreader thermally coupled to the heat dissipating member, the thermal spreader configured to spread heat across the plurality of fins of the heat dissipating member is included. | 02-05-2009 |
20090044934 | VERSATILE FLEXIBLE MAT AND METHOD OF IMPLEMENTING AND USING SAME - A flexible heating mat is provided. The mat comprises a plurality of sections, connected to each other by arch ribs. The arch ribs form a flexible, preferably raised, ceiling and a closed space above the precipitation-covered surface. Each section comprises a tube, capable of conducting a melting substance therethrough and dissipating it through at least one jet for melting of ice and/or drying of moisture. In other embodiments, the mat comprises at least one snow-mashing member. The mat may further comprise a pump for pumping out the melt and/or recycling the melting medium. Other embodiments are provided, and each of the embodiments described herein can be used alone or in combination with one another. The method of using the mat is also described and claimed. | 02-19-2009 |
20090050308 | Base Structure for a Heat Sink - A base structure for a heat sink comprises: a heat conducting plate, a positioning piece, a plurality of legs and fasteners. The heat conducting plate is assembled together with the heat conducting plate to form two opposite guiding channels. The legs are positioned in the guiding channel by the fasteners. The fasteners are movable along the guiding channel along with the legs, and the legs are rotatable around the corresponding fastener, so that the positions of the legs are adjustable. Furthermore, the guiding channels is formed by the concave portion of the heat conducting plate and the groove of the positioning piece, and the heat conducting plate and the positioning piece can be produced separately, thus making it easier to produce the guiding channel. | 02-26-2009 |
20090065187 | ADJUSTABLE COOLING UNIT FOR SEMICONDUCTOR MODULE - A cooling unit for a semiconductor module includes a plate shaped first cooling body, a plate shaped second cooling body opposing the first cooling body and an adjustable cooling member placed between the first and second cooling bodies so that a distance between the first and second cooling bodies may be adjusted. Shapes of the cooling body include a honeycomb structure, cylinders, a hemicylindrical shape, a zigzag shape, and a bellows structure shape. By forming the cooling unit with an adjustable cooling member, the cooling unit can fit electronic devices of various sizes. | 03-12-2009 |
20090095461 | Layered Heat Spreader and Method of Making the Same - A heat spreader having at least two adjoining layers each having at least two pyrolytic graphite strips cut from a sheet of pyrolytic graphite along the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z direction cut provides strips which are each oriented 90 degrees such that the thickness direction of the original sheet becomes the width or length of the cut strip. A side of a first strip adjoins a side of a second strip in each layer. Because of the greater thermal conductivity in the xy plane of the strips as compared to the z direction heat transfers more rapidly in the length and thickness direction of the strips than across adjoining sides of the oriented strips in each layer. The first layer strips are oriented about 90 degrees from the orientation of the second layer strips. | 04-16-2009 |
20090101324 | HEAT CONDUCTING APPARATUS - A heat conducting apparatus adopts a design of two oblique slide blocks disposed between and contacted with two objects for conducting heat from one of the two objects to another. The two oblique slide blocks can be adjusted freely according to the different heights of the two objects to conduct the heat produced by a heat generating component to a heat dissipating structure. | 04-23-2009 |
20090101325 | METHOD AND APPARATUS FOR COOLING SUPERCONDUCTIVE JOINTS - In a method and apparatus for joining a number of superconductive cables to establish electrical connection therebetween, a cup-like member having a base, a sidewall, and an opening to receive electrically conductive ends of said cables is provided. The base of the cup-like member is attached to a holder device. The holder device is attached to a cryogenically cooled surface. The ends of the superconductive cables are connected together within the cup-like member. | 04-23-2009 |
20090107662 | EVAPORATOR FOR FUEL CELL SYSTEM - An evaporator for a fuel cell system generating steam used for a steam reforming reaction provides an evaporator including a body having an inner space formed by a hollow for allowing a flow of a fluid, and a plurality of cell barrier members dividing the inner space into a plurality of spaces and having heat conductivity. The spaces include at least one first space for allowing a flow of a flue gas and at least one second space for allowing a flow of water. | 04-30-2009 |
20090126922 | Heat transfer device - The invention is for an apparatus and method for removal of waste heat from heat-generating components including high-power solid-state analog electronics such as being developed for hybrid-electric vehicles, solid-state digital electronics, light-emitting diodes for solid-state lighting, semiconductor laser diodes, photo-voltaic cells, anodes for x-ray tubes, and solids-state laser crystals. Liquid coolant is flowed in one or more closed channels having a substantially constant radius of curvature. Suitable coolants include electrically conductive liquids (including liquid metals) and ferrofluids. The former may be flowed by magneto-hydrodynamic effect or by electromagnetic induction. The latter may be flowed by magnetic forces. Alternatively, an arbitrary liquid coolant may be used and flowed by an impeller operated by electromagnetic induction or by magnetic forces. The coolant may be flowed at very high velocity to produce very high heat transfer rates and allow for heat removal at very high flux. | 05-21-2009 |
20090139704 | HEAT SINK DEVICE - A heat radiator | 06-04-2009 |
20090139705 | HOTPLATE WITH LIFTING ELEMENTS - The hotplate for a workpiece comprises a heatable plate which on a first side comprises a support surface for the workpiece, several lifting elements for the lifting of the workpiece relative to the support surface, wherein each lifting element is moveably arranged in such a manner that the respective lifting element can be retracted with respect to the support surface and/or extended with respect to the support surface and means for heating the plate. The means for heating comprise at least one heating channel which extends on a second side of the plate located opposite the support surface and is filled with a heating fluid. The heating fluid is in contact with the plate. The lifting elements are loaded with the heating fluid in such a manner that the lifting elements are extendable through a predetermined change of the hydrostatic pressure of the heating fluid. | 06-04-2009 |
20090139706 | COOLING PLATE STRUCTURE OF COOLING APPARATUS AND TRANSMITTER WITH THE COOLING APPARATUS - A cooling plate structure of a cooling apparatus includes a cooling plate and at least one refrigerant circulating conduit disposed in the cooling plate. The conduit includes refrigerant introducing and discharging ports disposed side by side on an outer surface of the cooling plate in an exposed state, a flow-in part extending from the introducing port to an intermediate position between the introducing port and the discharging port in the cooling plate, and a flow-out part extending along the flow-in part from the intermediate position to the discharging port such that flow-out part is separated from the flow-in part. Heat generating elements are disposed along the circulating conduit at an intermediate portion between a flow-in part corresponding portion and a flow-out part corresponding portion, both corresponding to the flow-in part and flow-out part of the circulating conduit, on the outer surface of the cooling plate. | 06-04-2009 |
20090145592 | Windshield washer fluid heating system - The invention provides a system for capturing waste heat from a heat source via an air cooled radiator to heat a container of windshield washer fluid in a motor vehicle. The system's components include a radiator, means to induce air flow through the radiator, and a shroud assembly for mounting a windshield washer fluid container downdraft of the radiator. The shroud assembly includes a radiator shroud that is adapted to mount onto the radiator to define a plenum for receiving heated air and a windshield washer fluid container. The windshield washer fluid container may be formed with the radiator shroud as a single integral unit. On the container surface is a heat conductive element that is in direct contact with both the heated air flow and windshield washer fluid. | 06-11-2009 |
20090151920 | HEAT PIPES AND USE OF HEAT PIPES IN FURNACE EXHAUST - An array of a plurality of heat pipe are mounted in spaced relationship to one another with the hot end of the heat pipes in a heated environment, e.g. the exhaust flue of a furnace, and the cold end outside the furnace. Heat conversion equipment is connected to the cold end of the heat pipes. | 06-18-2009 |
20090151921 | HEAT SINK HAVING LOCKING DEVICE - A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together. | 06-18-2009 |
20090151922 | Heat pipe and method for forming the same - A heat pipe and a method for forming the same are provided. The method includes: defining a closed end, a closed portion, and a contact section in sequence along a heat pipe to be processed; closing the opening of the closed end and the passage of the closed portion so as to finalize the heat pipe; and cutting axially the contact section into a plurality of equal parts, bending the equal parts outward to assume a divergent shape, thereby providing the contact section with an area for contact with a heat-generating source. Heat is directly transferred from the heat-generating source to the heat pipe via the contact section, thereby enhancing heat dissipation. | 06-18-2009 |
20090151923 | THERMAL GROUND PLANES, THERMAL GROUND PLANE STRUCTURES, AND METHODS OF HEAT MANAGEMENT - Thermal ground planes, thermal ground plane structures, and methods of thermal energy management, are disclosed. | 06-18-2009 |
20090159254 | HEAT SINK ASSEMBLY AND METHOD OF FABRICATING - A heat sink assembly and a method of fabricating a heat sink assembly. The heat sink assembly comprises a cylindrical core onto which are mounted a plurality of fin disks. The fin disks and cylindrical core are assembled to a threaded base. This assembly comprises the heat sink assembly. The heat sink assembly can be mounted onto a mounting clip or threaded directly onto a device having mating threads. The device can be a printed circuit board or components of a printed circuit board adapted to have threads or other electrical or electronic component that is adapted to have threads to receive the heat sink assembly. The fin disks are interference fit onto the cylindrical core to form a fin disk assembly to provide thermo-mechanical contact between the fin disks and the cylindrical core. The base is then interference fit onto the fin disk assembly to provide thermo-mechanical contact between the fin disk assembly and the base to form a heat sink assembly. The device can then be assembled to the electrical or electronic component requiring cooling. | 06-25-2009 |
20090159255 | FOOD PREPARATION AND STORAGE DEVICE - A food storage and preparation device ( | 06-25-2009 |
20090166021 | HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM - The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element. | 07-02-2009 |
20090178795 | Manufacturing method for a radiator and a structure thereof - A manufacturing method for a radiator and a structure thereof are disclosed. The manufacturing method for a radiator includes the following steps. A substrate and a plurality of cooling sheets are provided. The side wall of the substrate has a plurality of concave troughs. The cooling sheets are respectively plugged into the concave troughs. The two side walls of each of the concave troughs tightly contact the two opposing surfaces of the cooling sheet. Thereby, each of the cooling sheets is located at the side wall of the substrate, and the top portion and the bottom portion of the cooling sheet extend to outside of the top surface and the bottom surface of the substrate. By using the riveting technology to directly fasten the cooling sheets via the two side walls of the concave troughs, the present invention prevents the heat-conduction loss from being occurred. | 07-16-2009 |
20090178796 | BASE PLATE FOR A DUAL BASE PLATE HEATSINK - A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and finds, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins. | 07-16-2009 |
20090194268 | METHOD FOR MANUFACTURING A HEAT EXCHANGER - The method for manufacturing a heat exchanger from a plastic material comprises feeding of at least two sheet elements, and, by means of shaping means, shaping of said sheet elements to form heat exchanger plates. The shaping means are adapted to also undertake joining the sheet elements partly along edges so that a fluid inlet and outlet are created, whereby the sheet elements are pressed together. The heat exchanger plates are stacked and joined to a heat exchanger. The stack of heat exchanger plates is welded so that the fluid inlets are fluid outlets of the respective heat exchanger plates are combined to form a common fluid inlet and a common fluid outlet, and the sides of the heat exchanger plates are welded together, so that a fully functional heat exchanger is manufactured with plastic sheets as the only raw material. | 08-06-2009 |
20090218087 | Thermal conduction structure, composite material, and method of producing the material - A thermal conduction structure includes a heat receiving portion, a heat releasing portion, and actuators disposed between the heat receiving portion and the heat releasing portion. A path is defined from the heat receiving portion to the heat releasing portion through the actuator. The actuator is movable between a first position and a second position to correspond to an energy supplied from outside, and is contact with the heat receiving portion and the heat releasing portion, when the actuator is in the first position. The path has a non-contact part between the heat receiving portion and the heat releasing portion, when the actuator is in the second position. | 09-03-2009 |
20090229808 | HEAT-CONDUCTING ASSEMBLY - A heat-conducting assembly is mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly includes a base, a first heat-conducting block, a second heat-conducting block and an elastic element. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing groove. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a locking groove. The second slope is slidingly disposed on the first slope. The elastic element has a fixed end and a buckling end formed on one side of the fixed end. The fixed end is fixed in the fixing groove, and the buckling end is buckled into the locking groove. Via this arrangement, the heat-conducting efficiency of the heat-conducting assembly of the present invention can be improved. | 09-17-2009 |
20090229809 | DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING - The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, polyimide substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic polymer. The polyimide substrate has at least two polyimide layers. The polyimide layers are derived from at least one aromatic dianhydride and at least one aromatic diamine. The adhesive layers and the polyimide layers may contain thermally conductive fillers, light absorbing pigments or mixtures of both. | 09-17-2009 |
20090236087 | HEAT EXCHANGE DEVICE - A heat exchange device includes a heat exchanger disposed in connection with at least one of a heat-dissipation electrode and a heat-absorption electrode, between which a plurality of thermoelectric elements is connected in series, via an insulating resin layer, which is composed of an epoxy resin or polyimide resin doped with fillers having high thermal conductivity, without intervention of a substrate. The heat exchanger corresponds to a plurality of corrugated fins which are constituted of a plurality of joint regions joining with one of the heat-dissipation electrode and heat-absorption electrode and a plurality of non-joint regions projecting externally from a plurality of gaps formed between the joint regions adjacently aligned together, wherein the joint regions and non-joint regions are alternately aligned. Thus, it is possible to achieve high reliability by reducing thermal resistance and thermal stress while increasing the maximum heat absorption coefficient (Qmax). | 09-24-2009 |
20090255658 | HEAT DISSIPATION MODULE - A heat dissipation module comprises an aluminum cooling block and a copper base. The cooling block has a plurality of fins extending outward radially from the periphery of the cooling block. The base fits with the cooling block. A central recess is disposed at the bottom of the cooling block with at least an elongated through hole piercing the cooling block from the recess to the top of the cooling block. The base fits with the recess and has at least a support leg corresponding to the respective through hole to insert into the respective through hole. The heat dissipation module is less in cost and weight and enables the heat source to transmit to the fins of the cooling block rapidly and effectively. | 10-15-2009 |
20090255659 | PROTECTIVE CAP FOR THERMAL GREASE OF HEAT SINK - A protective cap for use with a heat sink, includes a cover plate for enclosing thermal grease on the heat sink, and a plurality of strengthening ribs positioned on the cover plate. The strengthening ribs resist the heat sink to prevent the thermal grease from being pressed against the cover plate. | 10-15-2009 |
20090255660 | High Thermal Conductivity Heat Sinks With Z-Axis Inserts - A heat sink including a composite material base plate that defines at least one through hole. At least one composite material insert is position into the at least one through hole prior to pressure infiltration. The composite material insert is oriented to increase thermal conductivity in the through-plan direction. | 10-15-2009 |
20090266531 | Heat Sink and Method of Manufacturing the Same - The invention seeks to provide a heat sink capable of sufficiently lessening the mounting dimensions of coil-shaped heat exchanging fin to offer a wide versatility and a suitable method for manufacturing the heat sink. | 10-29-2009 |
20090277621 | COOLING ELEMENT - Cooling element, with multiple cooling disks ( | 11-12-2009 |
20090283250 | HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY HEAT TRANSFER APPARATUS - A heat transfer apparatus includes a first protective layer of a first metallic material, a second protective layer of a second metallic material, and a heat transfer layer bonded between the first protective layer and the second protective layer. The heat transfer layer is made of a metal matrix composite, such as aluminum oxide reinforcement dispersed within a copper matrix. | 11-19-2009 |
20090288814 | Mixed Carbon Foam/Metallic Heat Exchanger - A heat exchanger includes a thermally-conductive fluid barrier having first and second surfaces, at least one first type of foam element placed in thermally-conductive contact with the first surface of the thermally-conductive fluid barrier and having a first coefficient of thermal expansion and at least one second type of foam element placed in thermally-conductive contact with the second surface of the thermally-conductive fluid barrier and having a second coefficient of thermal expansion. The first coefficient of thermal expansion of the first type of foam element and the second coefficient of thermal expansion of the second type of foam element are substantially different. | 11-26-2009 |
20090288815 | Heat-dissipating device without injection pipe and method of making the same - A heat-dissipating device without any injection pipe, which includes an upper cover plate and a lower cover plate. The upper cover plate is combined with the lower cover plate, wherein a crevice and an internal space are formed between the upper and lower cover plates. The crevice is sealed by where the upper and lower cover plates are close to the crevice by high-temperature autogenous welding to become a flat sealed surface flush with the surfaces of the upper and lower cover plates. Accordingly, the heat-dissipating device is provided with enhanced reliability and heat-dissipating efficiency. A method of making the heat-dissipating device includes the steps of putting the upper and lower cover plates together by welding; injecting a liquid working medium through the crevice into the internal space; and sealing the crevice by high-speed welding under a vacuum environment. | 11-26-2009 |
20090294113 | Heat exchanger - Disclosed is a heat exchanger. The heat exchanger includes a plurality of plates superimposed on one another, and a plurality of heat transfer fins formed on the plurality of plates, and shaped into an airfoil, wherein a channel of a fluid between the superimposed plates is formed to perform a heat exchange. | 12-03-2009 |
20090294114 | HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes an evaporator section and a rectangular condenser section extending from one end of the evaporator section and surrounding the evaporator section. The heat sink includes a main body and a plurality of fins extending outwardly from four lateral sides of the main body. The main body defines a groove on an end surface thereof for receiving the evaporator section therein. Each of the fins includes a plate-shaped body and a flange extending perpendicularly from an end of the plate-shaped body. The top flanges cooperatively form a rectangular supporting surface for supporting the condenser section thereon. The supporting surface is lower than the end surface of the main body. | 12-03-2009 |
20090294115 | Thermal Interconnect System and Production Thereof - A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component. | 12-03-2009 |
20090308584 | Thermal conduction principle and device of the multi-layers structure with different thermal characteristics - The present invention innovatively discloses a relay thermal conductor being made of material with better thermal conducting characteristics, wherein one end or face of the relay thermal conductor is thermal conductively coupled with the first thermal body for heating or cooling; while another end or face of the relay thermal conductor is thermal conductively coupled with the interface thermal conductor, wherein the interface thermal conductor having higher specific heat capacity is used as the thermal conduction carrier between the relay thermal conductor and the second thermal body. | 12-17-2009 |
20090308585 | Method for Manufacturing Tube and Fin Heat Exchanger with Reduced Tube Diameter and Optimized Fin Produced Thereby - An improved method for manufacturing tube and fin heat exchangers that, according to a preferred embodiment, includes a process for increasing the stiffness and rigidity of heat exchanger fins. Stiffer fins have a greater tendency to maintain proper alignment within a stack of fins, which aids in lacing long stacks of fins with small (e.g., 5 mm) diameter tubing. Preferably, fin stiffness is increased by forming a plurality of longitudinal ribs within the fin during the fin stamping process. More preferably still, two ribs for each longitudinal row of collared holes are provided. The preferred embodiment also includes a slotted heat exchanger fin that is dimensioned and arranged for optimized thermodynamic performance when used with small diameter tubing, thus reducing the space required for a given heat exchanger system. | 12-17-2009 |
20090314482 | METAL POLYMER COMPOSITE WITH ENHANCED VISCOELASTIC AND THERMAL PROPERTIES - The invention relates to a metal polymer composite having properties that are enhanced or increased in the composite. Such properties include viscoelastic character, color, magnetism, thermal conductivity, electrical conductivity, density, improved malleability and ductility and thermoplastic or injection molding properties. | 12-24-2009 |
20090314483 | HEAT EXCHANGER WITH A FLOW CONNECTOR - The invention relates to a heat exchanger (e.g., a charge air cooler) having a cooling body composed of flat tubes arranged at intervals and having corrugated fins positioned in the intervals. The charge air in the flat tubes can be cooled by cooling air flowing through the corrugated fins. The heat exchanger can include a flow connector and an integrated pre-cooler in which a medium, for example charge air, is cooled by means of a coolant. The pre-cooler/post cooler can be integrated into a section of the cooling body. A flow connector composed of at least two tubular parts which can be plugged one into the other, locked and sealed, can include a partitioning wall extending in one of the parts. At least one inlet connection and/or at least one outlet connection can be arranged on one or the other of the parts. | 12-24-2009 |
20090321060 | Cooling Fin - A cooling fin is integrally formed and comprises a board body, a passage penetrating the board body, and plural heat dissipating portions located outside the board body in the direction along the passage. Between each two neighboring portions is defined a heat dissipating space. By such arrangements, the cooling fin has the advantages such as better heat dissipation effect, easy to assemble and simple structure without any assembling operations and procedures. | 12-31-2009 |
20090321061 | METHODS AND APPARATUSES FOR TRANSFERRING HEAT FROM STACKED MICROFEATURE DEVICES - Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap. | 12-31-2009 |
20100006277 | ALUMINUM ALLOY MATERIAL AND PLATE HEAT EXCHANGER WITH SUPERIOR CORROSION RESISTANCE - Disclosed are an aluminum alloy material and a plate heat exchanger using the aluminum alloy material, both of which have superior corrosion resistance. Specifically, the aluminum alloy material includes an aluminum alloy base material having an anodic oxide layer with an average thickness of 1 to 20 μm as its surface layer, an organic phosphonic acid primer coating arranged on the surface of the aluminum alloy base material, and a fluorocarbon resin coating arranged on the surface of the organic phosphonic acid primer coating and having an average thickness of to 100 μm after drying. | 01-14-2010 |
20100006278 | HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation device for a heat generating element includes a fastening layer and a plurality of carbon nanotubes. The fastening layer is formed on the heat generating element. The carbon nanotubes are arranged in an array structure. The carbon nanotubes are arranged in a predetermined pattern. Ends of the carbon nanotubes are connected to the fastening layer. | 01-14-2010 |
20100012309 | Enthalpy Exchanger - The invention relates to an enthalpy exchanger, comprising at least one enthalpy-exchanging unit, which enthalpy-exchanging unit: comprises at least one plate, along at least one contact side of which a first liquid medium and a second medium can be displaced while exchanging enthalpy, and comprises at least one hygroscopic material layer which connects to at least one contact side of the plate in contact with the first liquid medium, wherein the mutual orientation of the plate and the material layer is such that a liquid film of the first medium can form between the plate and the material layer, wherein the liquid film is in enthalpy-exchanging contact with both the plate and the material layer, whereby the material layer is attached to the plate at a plurality of point locations lying a distance from each other such that the liquid film can extend substantially unobstructed over substantially the whole contact side of the separating wall. | 01-21-2010 |
20100018690 | Thermal conduction principle and device for intercrossed structure having different thermal characteristics - The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is thermal conductively coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof, wherein the relay thermal conductor directly performs thermal conduction with second thermal body at another part thereof and the interface thermal conductor having higher specific heat capacity is the thermal conducting carrier between relay thermal conductor and second thermal body. | 01-28-2010 |
20100018691 | FIN FOR HEAT EXCHANGER, GUIDE, AND METHOD OF USING THE GUIDE - A heat exchanger-use fin includes a fin body, collars and erect portions. The fin body has a plurality of holes. The collars surround the holes. The collars are disposed between two straight lines on a surface of the fin body. Outer peripheries of the collars contact the straight lines. The erect portions are positioned outside the two straight lines. Distal ends of the erect portions are in higher positions than distal ends of the collars relative to the surface of the fin body. A guide used with the fin includes first and second alternately arranged grooves. The second grooves are deeper than the first grooves. A method of using the guide includes slidably fitting the collars into one of the first grooves, and fitting the erect portions into the second groove adjacent to the first groove having the collars fitted therein. | 01-28-2010 |
20100025030 | HEAT CONDUCTIVE PLATE STRUCTURE - A heat conductive plate structure includes a base metal plate having a seating portion; a coupling layer disposed above the base metal plate around the seating portion; an electric conduction layer disposed above the coupling layer around the seating portion to define a clearance therebetween; a coupling film disposed above the electric conduction layer and the seating portion to define an inner clearance in communication with the clearance of the electric conduction layer and an outer clearance surrounding the inner clearance; a non-weldable material for inserting into the inner clearance and the outer clearance in the coupling film; a heat conduction member disposed on a central portion of the coupling film; an electric conduction member disposed above the coupling film to surround the heat conduction member from an exterior thereof; and a high power element mounted above so as to be in direct contact with the heat conduction member and the electric conduction member simultaneously. | 02-04-2010 |
20100038065 | Thermal conducting principle and device for prestressed clamping type multi-layered structure - The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is heat transfer coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof, wherein the interface thermal conductor having higher specific heat capacity is the heat transfer carrier between relay thermal conductor and second thermal body. | 02-18-2010 |
20100038066 | Thermal conducting principle and device for prestressed clamping type multi-layered structure - The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is heat transfer coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof, wherein the interface thermal conductor having higher specific heat capacity is the heat transfer carrier between relay thermal conductor and second thermal body. | 02-18-2010 |
20100044024 | APPARATUS AND METHOD FOR CONTROLLED COOLING - An apparatus for controlled cooling and a control method related to controlled cooling of hot plate or strip shaped metal. The apparatus comprises a header fitted with a first valve which allows air to escape from the header and prevents cooling fluid escaping from the header when being filled and prevents air from getting back into the header. During operation due to the apparatus an improved operation even at low flow rates is possible. | 02-25-2010 |
20100084122 | RADIATOR APPARATUS - A radiator apparatus for concentrating or dispersing energy. In one embodiment, the radiator includes a thermal conductive layer, a radiation layer, and a thermal insulation layer. The radiation layer is powered by an energy source and includes at least one radiation element embedded in at least a portion of the thermal conductive layer. The thermal insulation layer faces the thermal conductive layer. In another embodiment, the radiator includes a generally helical dome-shaped radiation member powered by an energy source and a generally dome-shaped reflection member including a reflective surface facing the radiation member. In yet another embodiment, the radiator includes a radiation member powered by an energy source and a reflection member having an at least partially ring-shaped concave reflective surface facing the radiation member for distributing energy to an at least partially hat-shaped or ring-shaped area or zone. | 04-08-2010 |
20100096116 | Heat Diffuser with Silicone Handle - A heat diffuser for use with a cooking implement is disclosed. The heat diffuser may be positioned using its handle between a heat source and a cooking container to counteract high temperature zones within the cooking container. The diffuser thus aids in even heat distribution throughout a cookware container for more even cooking and provides the user with more control over the heat applied to the cookware container. | 04-22-2010 |
20100096117 | RADIATOR PLATE, PERFORATED PLATE AND METHODS OF MAKING THE SAME - A radiator plate includes a core having core surfaces and holes whose hole axes are directed in a direction along a normal direction of the core surface, and heat transfer plates joined to the core surfaces and filled in the holes. A multilayer radiator plate includes a first radiator plate including a first core having first core surfaces and first holes whose hole axes are directed in a direction along a normal direction of the first core surface and first heat transfer plates joined to the first core surfaces and filled in the first holes, a second radiator plate including a second core having second core surfaces and second holes whose hole axes are directed in a direction along a normal direction of the second core surface and second heat transfer plates joined to the second core surfaces and filled in the second holes, and the first radiator plate and the second radiator plate are joined to each other. | 04-22-2010 |
20100122807 | Cooler / Heater Arrangement - The present invention relates to a device for heating and cooling an object in a controlled manner permitting a good thermal contact between the thermal block, the element for heating and cooling and the heat sink without the need for using a thermal interface material, an instrument comprising such a device and a method for conducting a thermal profile using the device. | 05-20-2010 |
20100126708 | HEAT DISSIPATING STRUCTURE AND PORTABLE PHONE - A heat dissipating structure and a portable device are provided, which enable that heat is dissipated from a heat generating part without causing a user to feel discomfort. A heat transfer member is configured to transfer heat generated in a heat generating body and a thermal storrage unit is thermally connected to the heat transfer member. The thermal storrage unit includes a pack with stretching property and a thermal storrage medium which is filled in the pack and a volume of which changes with a change in temperature. The pack is arranged such that there is a gap between the pack and a first heat dissipating portion at normal temperature and the pack contacts the first heat dissipating portion when the thermal storrage medium expands with a change in temperature. | 05-27-2010 |
20100126709 | Heat Dissipating Module - A heat dissipating module is provided. The heat dissipating module includes a first heat dissipating unit and a second heat dissipating unit. The first heat dissipating unit has a first connecting portion. The second heat dissipating unit has a second connecting portion corresponding to the first connecting portion. The second connecting portion and the first connecting portion are connected to each other tightly. | 05-27-2010 |
20100132931 | THERMAL MODULE FOR LIGHT SOURCE - The present invention discloses a thermal module for light source, which comprises a heat-conducting part and a heat-dissipating part engaged therewith. The heat-conducting part is provided with a heat-receiving portion to receive the heat generated by a light source, a joint portion to join with the heat-dissipating part. The heat-dissipating part is provided with a plurality of fin-shaped heat-dissipating sheets for heat dissipation and to join with the joint portion of the heat-conducting part. | 06-03-2010 |
20100132932 | METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION - Components having ceramic bases provided with a metalized structure on at least two opposite and/or juxtaposed faces at the same time, wherein metal in the form of pastes, films or sheets is provided for metallization and is applied to the surfaces of the ceramic base to be provided with a metalized structure. | 06-03-2010 |
20100139904 | HEAT SINK AND METHOD OF PRODUCING THE SAME - A heat sink ( | 06-10-2010 |
20100139905 | Combination Heat Sink Formed of a Stack of Heat Spreader Sheet Members - A combination heat sink formed of a stack of heat spreader sheet members is disclosed. Each heat spreader sheet member has a flat base panel two side flanges respectively perpendicularly extending along two opposite lateral sides of the flat base panel in a parallel manner, a plurality of narrow elongated notches respectively symmetrically formed on the two opposite lateral sides of the flat base panel, and a plurality of protruding positioning portions respectively formed of the side flanges in such a manner that when two heat spreader sheet members are attached together the protruding positioning portions of one heat spreader sheet member are inserted through the narrow elongated notches of the other heat spreader sheet member bent sideways and secured to the side flanges of the other heat spreader sheet member, and therefore the two stacked heat spreader sheet members are firmed secured together. | 06-10-2010 |
20100139906 | DROP-IN PASSIVE THERMAL INSERT FOR FOOD SERVICE COUNTERS - Passive temperature control is provided to vessels too tall to be stored in a shallow, temperature-controlled tray or basin by a vertically oriented thermally-conductive tube. In one embodiment, an insulative collar covers the tray and insulates portions of the tube that extend above the top of the tray. Optional heat sinking fins and air convection holes increase heat transfer between the tube and the tray. | 06-10-2010 |
20100139907 | PASSIVE THERMAL INSERT FOR TEMPERATURE-CONTROLLED TRAYS AND FOOD SERVICE COUNTERS - Temperature control is provided to food dispensing vessels like condiment dispensers that are too tall to be stored in a shallow, temperature-controlled tray or basin by using inclined or tilted, thermally-conductive tubes placed inside a temperature-controlled tray. Thermal insulating covers improve the thermal efficiency of the tubes. | 06-10-2010 |
20100147503 | METHOD FOR PRODUCING HEATING PANEL AND HEATING PANEL RESULTING THEREFROM - Method for producing a heating panel, and heating panel resulting therefrom. In a first platform, a stack of a sound-proof and moisture-proof material and a thermal insulating material, through which shock-absorbing poles having protecting caps are inserted by a predetermined interval, is prepared. A lower thermal energy storage plate is attached to the thermal insulating material in a second platform, a heat conduction steel plate is attached to the lower thermal energy storage plate in a third platform, and an upper thermal energy storage plate is attached to the heat conduction steel plate in a fourth platform. Rivet holes are perforated through the thermal energy storage plates, heat conduction steel plate, and protecting caps in a fifth platform, and rivets are into the holes in a sixth platform. The rivets are riveted in a seventh platform, completing the complex heating panel. The completed panel is transported in an eighth platform. | 06-17-2010 |
20100155042 | TEMPERATURE-STABLE CAST IRON ALLOY AND USE OF SAID ALLOY - A description is given of a temperature-stable cast-iron alloy having high wear resistance at temperatures between 500 and 900° C. The alloy is characterized in that it has the following composition expressed in weight percentages: chromium: 15.0-20.0%, carbon: 1.0-2.0%, manganese: 0.8-1.2%, silicon: 1.2-1.5%, nickel: 1.5-2.5%, balance iron and unavoidable metallic and non-metallic contaminants where the non-metallic contaminants comprise nitrogen, oxygen, phosphorous and sulphur. Hereby is obtained a cast-iron alloy which has a higher wear resistance and a reduced tendency to form the undesirable sigma phase when heated to temperatures between 500 and 900° C. as compared to the known allows. | 06-24-2010 |
20100155043 | ELEMENT FOR EMISSION OF THERMAL RADIATION - The present disclosure provides an element for emission of thermal radiation. The element comprises particles arranged for receiving thermal energy and emitting at least a portion of the received thermal energy in the form of the thermal radiation. The thermal radiation predominantly has a wavelength or wavelength range within an atmospheric window wavelength range in which the atmosphere of the Earth has a reduced average absorption and emission compared with an average absorption and emission in an adjacent wavelength range whereby absorption by the element of radiation from the atmosphere is reduced. | 06-24-2010 |
20100163218 | Split Bearing Assemblies, Air-Cooled Heat Exchangers and Related Methods - Bearing assemblies are provided that include a bearing having a split bearing body that includes a material such as a composite or a thermoplastic; and at least one recess configured for receiving a rotary seal assembly; and at least one rotary seal assembly comprising an energizing component. The bearing assemblies may further include at least two recesses and/or an energizing component that is an o-ring. | 07-01-2010 |
20100163219 | Split Bearing Assemblies, Air-Cooled Heat Exchangers and Related Methods - Bearing assemblies are provided that include a bearing having a split bearing body that includes a material such as a composite or a thermoplastic; and at least one recess configured for receiving a rotary seal assembly; and at least one rotary seal assembly comprising an energizing component. The bearing assemblies may further include at least two recesses and/or an energizing component that is an o-ring. | 07-01-2010 |
20100170670 | Advanced Cooling Method and Device for LED Lighting - A light emitting diode cooling device and method are disclosed for passively removing heat from the LED using liquid convection to cool the LED. The liquid convection cooling device operates to cool the LED by circulating a liquid cooling medium without consuming external power to move the medium. | 07-08-2010 |
20100181059 | Stress equalized heat sink unit - A stress equalized heat sink unit includes a radiating fin assembly consisting of a plurality of radiating fans and a stress equalizing element. A part of the radiating fins are correspondingly cut at a predetermined position to form a receiving hole vertically downward extended from a top of the radiating fin assembly by a predetermined depth. The stress equalizing element is positioned on a bottom in the receiving hole to thereby locate the radiating fins in place. One side of the stress equalizing element facing away from the bottom of the receiving hole serves as a pressure receiving face. When a tightening device tightly fitted on the radiating fin assembly applies a downward pressure on the pressure receiving face of the stress equalizing element, the applied pressure is uniformly dispersed via the pressure receiving face and the radiating fins to avoid deformation of the radiating fins due to stress concentration. | 07-22-2010 |
20100181060 | HEAT RADIATOR OF SEMICONDUCTOR PACKAGE - A heat radiator of a semiconductor package, the heat radiator being provided on the semiconductor package, the heat radiator contacting a thermal interface material, the heat radiator includes a line state high thermal interface material standing, in a thermally conductive direction, on a surface of the heat radiator facing the thermal interface material. Head end parts of the line state high thermal interface material are adhered to a surface of the thermal interface material. | 07-22-2010 |
20100186937 | Heat dissipating device for LED light-emitting module - A heat dissipating device for LED light-emitting module, which embodies: A heat dissipating unit; An LED light-emitting module, in which light emitting diode are connected to a baseplate; A heat dissipating base; | 07-29-2010 |
20100186938 | HEAT TRANSFER SHEET AND HEAT DISSIPATION STRUCTURE - A heat transfer sheet of the present invention includes a heat transfer layer having a first portion and a second portion provided in a position different from the first portion in a planar view of the heat transfer layer, the second portion being capable of expanding and contracting in a thickness direction of the heat transfer layer at an expansion ratio larger than that of the first portion depending on temperature changes in an object from which heat is to be dissipated. In a state that the heat transfer sheet is used, in the case where a temperature of the heat transfer layer is a predetermined temperature or lower, thermal conductivity between the object and a dissipation member is lowered due to creation of a gap between the second portion and the object and/or the dissipation member, whereas in the case where the temperature of the heat transfer layer is a predetermined temperature or higher, the thermal conductivity between the object and the dissipation member is increased due to substantial elimination of the gap. | 07-29-2010 |
20100186939 | ATTACHING STRUCTURE OF COMPONENT FOR MOUNTING HEATING ELEMENT - The invention improves the heat radiation efficiency by improving the heat conduction efficiency after ensuring downsizing. A plurality of projections | 07-29-2010 |
20100186940 | Method, Device and System for the Heat Treatment of a Moving Metal Strip - The invention relates to a method for the heat treatment of a running metal strip, which comprises: a heating step for heating the strip; a step for cooling the heated strip; and conductive heat transfer from at least one segment of the strip which is being cooled to at least one segment of the strip which is being heated, so that at least part of each of said cooling and heating steps is carried out on the strip. The invention also relates to a heat transmission device for implementing said method and having at least one thermally conductive solid element, such as for example a roll, and to a system for the heat treatment of a running metal strip that incorporates such a device. | 07-29-2010 |
20100193172 | FIN FOR A HEAT EXCHANGER - A fin for a heat exchanger is provided that includes a fin element which extends in a flow direction of a first fluid and has a wall face around which the first fluid flows on both sides, wherein at least one flap is provided in the wall face, which flap forms a cutout, through which the first fluid can flow, in the wall face, wherein a first straight edge of the flap extends substantially perpendicularly to the flow direction and is arranged at a distance from the wall face in order to form the cutout, wherein the flap has an inclined, smooth tab face which terminates at the first straight edge, and wherein the tab face is connected to the wall face via two side walls of the tab, which side walls have a curved profile mirror-symmetrically with respect to each other and, starting from the first edge, have a height which decreases in a manner corresponding to the inclination of the tab face. | 08-05-2010 |
20100193173 | HEAT SINKS AND METHOD OF FORMATION - A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent. | 08-05-2010 |
20100200206 | Heat Sink Assembly - Apparatus and method for making a heat sink assembly. The apparatus includes a first clip configured to be urgingly attached to a heat producing device, the first clip having a first edge, a second edge, a third edge, and a fourth edge. The apparatus further includes a heat sink configured to be attached to the first clip, and a second clip configured to be attached to the first clip, the second clip being sized to accommodate a portion of the heat sink, and the second clip urging the heat sink towards the heat producing device. Methods to make the foregoing apparatus are also described. | 08-12-2010 |
20100200207 | HYDROPHILIC COMPOSITION - A hydrophilic composition containing a hydrophilic polymer (A) having two or more hydrolyzable silyl groups per molecule and a catalyst (B), with the surface zeta potential of a coating film obtained by coating and drying the hydrophilic composition being from −15 mV to 10 mV, is provided for the purpose of providing a hydrophilic composition capable of forming a hydrophilic coating film having excellent scratch resistance and antifouling properties without hybridizing with sol-gel. | 08-12-2010 |
20100200208 | METHODS FOR ATTACHING CARBON NANOTUBES TO A CARBON SUBSTRATE - Vertically oriented carbon nanotubes (CNT) arrays have been simultaneously synthesized at relatively low growth temperatures (i.e., <700° C.) on both sides of aluminum foil via plasma enhanced chemical vapor deposition. The resulting CNT arrays were highly dense, and the average CNT diameter in the arrays was approximately 10 nm, A CNT TIM that consist of CNT arrays directly and simultaneously synthesized on both sides of various types of foil has been fabricated. The TIM is insertable and allows temperature sensitive and/or rough substrates to be interfaced by highly conductive and conformable CNT arrays. The use of foil, including substrates fabricated from carbon (CNT woven arrays, exfoliated graphite sheets, bucky paper, and the like) is disclosed. | 08-12-2010 |
20100200209 | METHODS AND DEVICES FOR DIRECTIONAL RADIATIVE COOLING THERMAL COMPENSATION - A radiative thermal compensation system is described. An imaging arrangement located in an optical path between a surface to be thermally compensated (e.g., cooled) and one or more thermal sinks. The imaging arrangement is oriented with respect to the surface and the sinks so that solid angles are defined, along which the sinks are imaged onto the surface and control heat flow from the surface. | 08-12-2010 |
20100206536 | METHOD FOR PRODUCING A COMPOSITE INCLUDING AT LEAST ONE NON-FLAT COMPONENT - A method for producing a composite from at least two metal components that have perforations or openings, especially for producing a cooler or cooling elements or heat sinks that have at least one composite. The components are joined to each other to yield the composite by heating them to a process temperature while using a joining agent or joining surfaces defined by surface faces of the components. To produce components having complicated geometric shapes, thereby increasing their cooling capacity, at least a first component is not flat, and is joined to at least one flat or non-flat component to yield the composite. | 08-19-2010 |
20100206537 | HEAT SPREADER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - Provided are a heat spreader for a semiconductor device, which can be joined such that a multitude of pin-shaped fins are not easily fractured even when the heat spreader for a semiconductor device is incorporated in a heat dissipation structure for a semiconductor device, in which direct cooling is performed by using water, and a method for manufacturing the heat spreader for a semiconductor device. The heat spreader ( | 08-19-2010 |
20100212877 | AIRFLOW GUIDING AND HEAT DISSIPATING ASSEMBLY FOR ELECTRONIC DEVICE - An airflow guiding and heat dissipating assembly is mounted in an electronic device and has a base and at least one baffle being mounted on the base. Multiple electronic components are mounted on the base and are arranged in a line. Airflow flows along one electronic component upstream, past the baffle and then over the other electronic component downstream to take away heat from the electronic component. The baffle prevents the airflow from becoming turbulent and, therefore, temperatures of the electronic component are lowered efficiently. | 08-26-2010 |
20100212878 | Heat exchanger for bathirg shower - A manufacturing method and structure of a heat exchanger for a bathing shower involves two plates welded together to form a passage for cold water. Hot water from the shower drips onto the upper plate and transfer heat to cold water flowing through the passage between the plates. The upper plate may be spot welded to the lower plate at bottoms of frustoconical indentations in the lower plate, the plates may sandwich an adiabatic layer, and/or the passage between the plates may be formed by pipes situated between the plates. | 08-26-2010 |
20100218927 | Heat exchange surface - A heating surface element with a zig zag arrangement of longitudinal undulations which serve to minimize the skew flow of the gas. The angle of the undulations is preferably 15° to 35° to the primary flow direction of the gas. When used in combination with a notched heat surface element, the undulation preferably crosses no more than one opposing notch before changing direction. | 09-02-2010 |
20100218928 | Method and apparatus for rapidly cooling a gem - A cooling apparatus includes a container configured to contain a coolant within a space. The apparatus further includes a cooling block positioned substantially within the space and having a high heat capacity such that the space not occupied by the cooling block is filled with a coolant to a level at or below the top of the cooling block, and a placement structure having high thermal conductivity positioned on top of the cooling block and outside of the space. A method for cooling an object is also provided, which includes inserting a coolant into a container configured to contain the coolant within a space, and placing the object on a placement structure outside the space. For this method, the placement structure has a high thermal conductivity and is coupled to a cooling block, the cooling block having a high heat capacity and positioned substantially within the space. | 09-02-2010 |
20100218929 | Heat sink - A heat sink includes a radiator fin for dissipating heat of an electronic device provided on a printed board; a plurality of radiator fins included in the heat sink is formed in an arbitrary diameter size; and the radiator fins are connected to each other by inserting a pair of fastening screws through a through hole provided on each of the radiator fins, and a tip end of the fastening screws is screwed and fastened to a screw hole of a base heat sink fixed on the upper surface of an electronic device. | 09-02-2010 |
20100218930 | SYSTEM AND METHOD FOR CONSTRUCTING HEAT EXCHANGER - The present invention generally relates to various types and/or structures of heat exchangers and to methods of making and/or using such heat exchangers. In one embodiment, the present invention relates to a system and method for constructing a microchannel gas-to-working fluid heat exchanger. In another embodiment, there is disclosed a power generation cycle that employs a heat exchanger that serves as a regenerative heat exchanger. | 09-02-2010 |
20100218931 | HEAT EXCHANGE AND HEAT EXCHANGE PROCESS - Heat exchange process comprising sequential cooling a first fluid by indirect heat exchange with a second fluid and comprising the following steps:
| 09-02-2010 |
20100218932 | THERMALLY CONDUCTING FOAM INTERFACE MATERIALS - In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film. | 09-02-2010 |
20100224352 | THERMAL CONTROLLER FOR ELECTRONIC DEVICES - An apparatus controls a temperature of a device by circulating a fluid through a heat sink in thermal contact with the device. The apparatus includes an adjustable cold input, which inputs a cold portion of the fluid having a first temperature, and an adjustable hot input, which inputs a hot portion of the fluid having a second temperature higher than the first temperature. The apparatus further includes a chamber, connected to the cold input and hot input, in which the cold and hot portions of the fluid mix in a combined fluid portion that impinges on the heat sink. The combined fluid portion has a combined temperature that directly affects a temperature of the heat sink. The cold input and hot input are adjusted to dynamically control the combined temperature, enabling the heat sink temperature to compensate for changes in the device temperature, substantially maintaining a set point temperature of the device. | 09-09-2010 |
20100224353 | METHODS AND APPARATUS INVOLVING COOLING FINS - A fin apparatus including a corrugated strip of material having, a first lower planar surface, a second lower planar surface, a first upper planar surface corresponding to the first lower planar surface and the second lower planar surface, wherein the first lower planar surface and the second lower planar surface are operative to be attached to a surface of a component, and a first fin portion connecting the first lower planar surface to the first upper planar surface. | 09-09-2010 |
20100224354 | Depositing carbon nanotubes onto substrate - To deposit carbon nanotubes onto a substrate, an at least partially porous film is prepared so that a surface of the film has a layer of carbon nanotubes thereon. The film is positioned in relation to a surface of the substrate such that the surface of the film having the layer of carbon nanotubes is brought into contact with the surface of the substrate. Pressure is applied to the film to attach the film, including the layer of carbon nanotubes, to the surface of the substrate. | 09-09-2010 |
20100230085 | TURBULIZERS AND METHOD FOR FORMING SAME - Disclosed is a method of forming a heat exchanger turbulizer apparatus including a member having a longitudinal axis, a lateral width and a plurality of strips including first strips and second strips, each strip extending widthwise and being corrugated longitudinally so as to form a plurality of laterally spaced-apart sections connected to one another by bridges projecting from the sections in a common direction, the bridges of the first and second strips extending in the same direction and the corrugations of the second strips being offset laterally from the corrugations of the first strips. The method comprises: crimping longitudinally-corrugated strip material between first and second forming dies to form said apparatus, said dies being adapted such that substantially all lateral movement of strip material in crimping results from strip material being drawn laterally by material that has been displaced in a direction parallel to the direction of die movement. | 09-16-2010 |
20100230086 | METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER, POWER MODULE, VEHICLE INVERTER, AND VEHICLE - The present invention provides a method for manufacturing a heat transfer member which method allows peel-off and cracking possibly caused by thermal expansion to be inhibited. That is, the present invention provides a method for manufacturing a heat transfer member | 09-16-2010 |
20100236768 | LUBRICANT OIL COOLING APPARATUS FOR POWER TRANSMISSION APPARATUS - A lubricant oil cooling apparatus | 09-23-2010 |
20100243227 | Thermal interface material and method for manufacturing same - One embodiment of a thermal interface material includes a plurality of carbon nanotubes each having a first end and an opposite second end, a heat current collector covering one of the first ends and the second ends of the carbon nanotubes, and a macromolecular material filled in spaces between the carbon nanotubes and heat current collector. A method for manufacturing a thermal interface material is also provided. | 09-30-2010 |
20100243228 | Method and Apparatus to Effect Heat Transfer - The disclosed methods and apparatus seek to effect heat transfer through the use of one or more conductive fin devices. In addition, the disclosed devices seek to reduce the discharge of pollutants from primary combustion processes using carbonaceous fuel sources by implementing secondary combustion features and other apparatus. With more effective heat capture and utilization, the disclosed heat exchange technologies provide methods and apparatus to reduce heat dissipation to atmosphere. The methods and apparatus have application in the areas of industrial incineration, power boilers, water heaters, residential and commercial solid fuel waste heat recovery appliances, and electric power generation. In addition, the technology could have application in the areas of solar systems, desalination systems, aircraft and vehicular engines, electric motors, turbines, oil pans on internal combustion engines, transmission cooling pans, cooling navigational and electronic systems, and computer cooling and power supply. | 09-30-2010 |
20100243229 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed. | 09-30-2010 |
20100243230 | HEAT-DISSIPATING DEVICE INCLUDING A PLATING METAL LAYER - A heat-dissipating device includes: a planar body made of a graphite laminate and extending along an x-y plane of the graphite laminate; and a plating metal layer formed on the planar body. The heat-dissipating device further includes a metal panel. The planar body is connected substantially perpendicularly to the metal panel. A method of making the heat-dissipating device is also disclosed. | 09-30-2010 |
20100252248 | HEAT EXCHANGER HEAT-UTILIZATION DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat exchanger heat-utilization device is obtained that can efficiently store heat and dissipate heat in or from a chemical thermal storage medium, and a manufacturing method of the heat exchanger heat-utilization device. A heat exchanger heat-utilization device includes: chemical thermal storage medium composite molded formed by organizing chemical thermal storage medium particles into a porous structural body having flow channels; and a heat exchanger body. The heat exchanger body has thermal storage medium containing portions in which the chemical thermal storage medium composite molded bodies are accommodated, and fluid flow channels that are partitioned from the thermal storage medium containing portions by partition walls and through which a heat exchange medium flows for heat exchange with the chemical thermal storage medium composite molded bodies. | 10-07-2010 |
20100258287 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base, a cover and plurality of columned fins. The base protrudes a plurality of studs from a top surface thereof. The cover defines a plurality of recesses and orifices therein. The columned fins each have a head received in corresponding recess of the base and a body extending from the head through the cover. The base joints with the cover by the studs of the base riveted in the orifices of the cover. The base cooperates with the cover to sandwich the heads of the fins therebetween to thereby secure the columned fins to the cover. | 10-14-2010 |
20100258288 | Heat Exchanger - A plate for the use in a heat exchanger cassette, where the plate comprises a corrugated pattern having a plurality of ridges ( | 10-14-2010 |
20100263849 | SOLDER LAYER, HEAT SINK USING SUCH A SOLDER LAYER AND METHOD FOR MANUFACTURING SUCH A HEAT SINK - A heat sink ( | 10-21-2010 |
20100263850 | HEAT SINK - A heat sink includes a base panel having parallel channels located on the top wall, first ribs protruding from the top wall and respectively extending along one side of each channel and second ribs protruding from the top wall and respectively extending along the other side of each channel, and radiation fins respectively mounted in the channels of the base panel and supported on the second ribs in vertical positions, each radiation fin having an angled foot portion, which is inserted into one channel and secured thereto by the associated first rib upon deformation of the associated first rib by an external force. | 10-21-2010 |
20100263851 | HEAT-TRANSFER MECHANISM AND INFORMATION DEVICE - A heat-transfer mechanism which transfers heat of a heat-generating component mounted on a board to a housing includes a heat-transfer plate having a bottom face portion which has contact with the heat-generating component, a first heat-transfer portion which is screwed near one end portion of the housing and a second heat-transfer portion which is screwed near the other end portion of the housing. | 10-21-2010 |
20100276134 | Heat Sink for a RAM - A heat sink for a RAM includes a first and a second heat dissipating plate, on each of which a retaining tongue, a pair of locating tabs, and a catch tab are provided. The retaining tongue includes an expanded head portion and a narrowed root portion, and the head portion is a tab having a specific shape. The catch tab is provided with an expanded through retaining hole and a narrowed through root hole, which are configured to match the shape of the heat portion and the root portion of the retaining tongue, respectively. When the two heat dissipating plates are connected to each other, once the head portions and root portions of the retaining tongues are extended through the corresponding retaining holes and root holes of the catch tabs, the retaining tongues will not unexpectedly separate from the catch tabs. | 11-04-2010 |
20100276135 | COOLING FIN AND MANUFACTURING METHOD OF THE COOLING FIN - A cooling fin includes fin parts integrally extending from a base part. Each fin part is partially formed at a slant so that a proximal end portion is straight and a distal end portion is wavy (corrugated). Each fin part is partially slanted to make each fin part wavier as coming closer to the distal end portion from the proximal end portion. In a manufacturing process of the cooling fin, firstly, a straight cooling fin is produced by extrusion molding (an extruding step). Subsequently, the distal end portion of each fin is partially bent in a direction intersecting an extruding direction into a wave shape (a bending step). | 11-04-2010 |
20100282457 | ENERGY-SAVING PLAN - An energy-saving pan which is characterized in a bottom with a plurality of lattices, a plurality of radial fins, a plurality of spiral fins, a plurality of L-shaped protuberances, or a plurality of cylindrical pins thereby increasing heat absorbing area of said bottom and reducing reflection of heat energy. | 11-11-2010 |
20100282458 | CARBON FIBER HEATING SOURCE AND HEATING SYSTEM USING THE SAME - A carbon fiber heating source includes a bundle of carbon fibers combined with glass fibers. The bundle is surrounded with a silicone coating layer and has high tensile strength responsive to bending and tension while emitting heat at high temperature. The carbon fiber heat emitting source includes heat emitting fibers formed by combining carbon fibers with glass fibers. Connection terminals are formed at both ends of the heat emitting fibers so that electricity can be applied thereto. A coating member coats the surfaces of the heat emitting fibers and the connection terminals. The coating member may be a silicone coating layer formed on the heat emitting fibers and the connection terminals. The coating member may be a quartz pipe that is filled with LPG and hydrogen and receives and seals the heat emitting fibers such that only a portion of the connection terminals is exposed from the both ends. | 11-11-2010 |
20100282459 | HEAT SINK AND METHOD FOR MANUFACTURING A HEAT SINK - A heat sink of a composite material having a first material and a second material is described, the first material including an electrical insulator, and the second material including an electrical conductor, the heat sink having a first side parallel to a main plane of extent of the heat sink, and the heat sink having a second side essentially parallel to the first side and opposite the first side perpendicularly to the main direction of extent, and furthermore the proportion of the first material in the area of the first side being greater than the proportion of the first material in the area of the second side. | 11-11-2010 |
20100294475 | HIGH PERFORMANCE HEAT TRANSFER DEVICE, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is an heat transfer device comprising a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell; the shell having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell; the porous layer having a thickness effective to enclose a region between opposing faces; the region providing a passage for the transport of a fluid; the porous layer having a thermal conductivity of about 0.1 to about 2000 watts per meter-Kelvin and a mass flow rate of about 10 | 11-25-2010 |
20100300669 | METHODS AND APPARATUS FOR A MICRO-TRUSS BASED STRUCTURAL INSULATION LAYER - An apparatus for maintaining a temperature differential between a component and a source of heat is described. The apparatus includes a micro-truss structure having a plurality of nodes and members which define a first surface and a second surface. The second surface is operable for attachment to the component. The apparatus further includes a skin material attached to the first surface of the micro-truss structure such that the skin material is operable for placement between the heat source and the micro-truss structure. The skin material defines at least a portion of a fluid flow path through the micro-truss structure. A skin material is not utilized with certain configurations of the micro-truss structure. | 12-02-2010 |
20100300670 | FIXING APPARATUS FOR HEAT SINK - A heat sink assembly includes a heat sink, and a fixing apparatus for fixing the heat sink. The fixing apparatus includes two fasteners to fix opposite ends of the heat sink, and a connecting piece connecting tops of the fasteners to abutting a top of the heat sink. A middle of the connecting piece is bent upwardly to depart from the top of the heat sink, to transfer pressing force to two portions of the connecting piece adjacent to the protruding portion, to allow the connecting piece to press a middle of the heat sink. | 12-02-2010 |
20100300671 | HEAT SINK AND METHOD FOR MANUFACTURING SAME - A heat sink capable of permitting heat transfer from an electronic component to the heat sink to be effectively promoted while reducing a manufacturing cost of the heat sink and increasing yields thereof. The heat sink includes a base plate adaptable to be kept in direct contact with an electronic component which requires that heat be dissipated therefrom during operation thereof and radiation fins arranged so as to project from the base plate. The base plate includes a main base plate section made of a main material of which the radiation fins are made and a heat transfer promoting base plate section made of a heat transfer promoting material different from the material of which the main base plate section is made. The heat transfer promoting material is integrated with said main material at a stage at which working of a workpiece. This permits heat generated from the electronic component to be dispersed over the whole heat transfer base plate section and then transferred through the whole main base plate section to the radiation fins, so that the heat sink may be increased in heat dissipation efficiency. | 12-02-2010 |
20100307730 | Liquid-cooled heat dissipating device and method of making the same - A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed. | 12-09-2010 |
20100319895 | HEAT SPREADER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A heat spreader structure includes at least one carbonaceous matter-metal composite layer having a plurality of carbonaceous particles and at least one metal-mesh layer having a plurality of meshes. The carbonaceous particles are either separately firmly held inside the meshes of the metal-mesh layer or covered and held in place by the metal-mesh layer. The carbonaceous matter-metal composite layer can be coated on a metal-made body through sintering to ensure good bonding of the carbonaceous particles to the metal-made body and accordingly enhance the heat spreading efficiency of the metal-made body. A method for manufacturing the heat spreader structure is also disclosed. | 12-23-2010 |
20100319896 | THERMAL BLOCK AND THERMAL RAIL - The innovation relates to systems and methodologies for facilitating and/or enhancing heat transfer in a stage machine employed in an industrial or manufacturing environment. A thermal block and thermal rail combination and/or a thermal block and bearing rail combination draw accumulated heat away from a source of heat generated within the stage machine, and such combinations conduct the heat to a base of the stage machine. Each type of combination is conductively coupled such that the conductive coupling facilitates the translation or movement of the stage while maintaining contact to facilitate the conduction through the thermal block and thermal rail of the stage machine. The removal of the heat from the source of the heat or the accumulation of the heat within the stage machine system prevents distortion of the machine or products being manufactured or measured by the machine from the heat. | 12-23-2010 |
20100319897 | High-performance heat dissipation substrate with monoparticle layer - A high-performance heat dissipation substrate with monoparticle layer, including a surface plate having a first face connected to a heat source and a second face on which a heat dissipation substrate is disposed. The heat dissipation substrate is connectable to an external heat dissipation device. A thermal particle layer is disposed between the surface plate and the heat dissipation substrate in the form of a monoparticle layer. The thermal particle layer includes multiple thermal particles (ceramic materials as diamond, SiC, AIN, Single Crystal Silicon) arranged immediately adjacent to each other and partially inlaid in the surface plate and the heat dissipation substrate. The heat of the heat source can be transferred from the surface plate through the thermal particle layer to the heat dissipation substrate and dissipated outward. | 12-23-2010 |
20100319898 | THERMAL INTERCONNECT AND INTEGRATED INTERFACE SYSTEMS, METHODS OF PRODUCTION AND USES THEREOF - Heat spreader assemblies are disclosed that include a heat spreader component, at least one coupling layer, and at least one thermally conductive layer, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. In some instances, heat spreader assemblies include an aluminum-based heat spreader component, at least one coupling layer, wherein the coupling layer comprises zinc, a zinc-based material, tin, a tin-based material or a combination thereof, and at least one thermally conductive layer comprising nickel, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. Methods of forming heat spreader assemblies are also disclosed that include providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; providing at least one coupling material, wherein the coupling material is directly deposited onto the bottom surface of the heat spreader component; and depositing, applying or coating at least one thermally conductive coating, film or layer on at least part of the bottom surface of the heat spreader component. In several embodiments, heat spreader component comprises a native oxide layer, an oxide barrier layer or a combination thereof that is removed before application of the at least one coupling material. | 12-23-2010 |
20100319899 | HEAT SINK AND METHOD OF MANUFACTURE THEREOF - In a first process of this method of manufacturing a heat sink, into a groove, formed in a base and both of whose side surfaces are provided with projections or concave portions and whose upper portion is open, from the groove open portion, there is fitted a pipe that has a diameter smaller than the gap between the edge portions of the open portion of the groove. Next, the pipe is pressed from above the open portion of the groove and the upper portion of the pipe is deformed so that it follows the plane of the open portion of the groove, and moreover both side portions of the pipe are deformed so that they follow along the inner surfaces of both side portions of the groove. By this second process, both side portions of the pipe are engaged with the projections or concave portions. | 12-23-2010 |
20100319900 | COMPOSITE MATERIAL HAVING HIGH THERMAL CONDUCTIVITY ND PROCESS OF FABRICATING SAME - The invention relates to high thermal conductivity (TC) materials, in particular, to copper-diamond composite materials, which can be used as heat exchangers, heat sinks, heat spreaders for electronic and other devices and a method of production thereof. A high TC diamond-metal composite according to the invention has a TC above 500 W/(m*K) and comprises coated diamond particles in a metal or metal alloy matrix having a TC of not less than 300 W/(m*K), wherein the particles are coated with a single-layered continuous high surface area coating comprising a metal and/or carbide of a carbide-forming element selected from IV-VI Groups of the Periodic Table, the coating having a thickness of less than 500 nm and a certain surface texture to provide high TC of composite. | 12-23-2010 |
20100326644 | Plane-type heat-dissipating structure with high heat-dissipating effect and method formanufacturing the same - A plane-type heat-dissipating structure with high heat-dissipating effect includes a first heat-dissipating unit and a second heat-dissipating unit. The first heat-dissipating unit has an evacuated hollow heat-dissipating body, a plurality of supports integratedly formed in the hollow heat-dissipating body in order to divide an inner space of the hollow heat-dissipating body into a plurality of receiving spaces, and a plurality of microstructures integratedly formed on an inner surface of the hollow heat-dissipating body. Work liquid is filled into the receiving spaces. The second heat-dissipating unit is integratedly formed on an outer surface of the first heat-dissipating unit. | 12-30-2010 |
20100326645 | THERMAL PYROLYTIC GRAPHITE LAMINATES WITH VIAS - A thermally conductive laminate comprising a first substrate, a second substrate, and a performance layer disposed between the first substrate and the second substrate. The performance layer comprising thermal pyrolytic graphite (TPG) and vias. The TPG board surface and the vias may be at least partially filled with a material comprising at least one of thermally conductive epoxy, soldering metal/alloy or brazing metal/alloy. In addition, the thermally conductive laminate may not contain a framing structure surrounding the performance layer. | 12-30-2010 |
20110000658 | HYDROPHILIC MEMBER - A hydrophilic member is provided which comprises a substrate of every kind having formed thereon a surface having excellent antifouling properties, quick-drying properties of water or the like, and wear resistance and being flexible. | 01-06-2011 |
20110005740 | COMBINATION HEAT SINK - A combination heat sink including a first radiating element having a first plane section and a second radiating element having a second plane section. Multiple first radiating fins integrally upward extend from the first plane section. Each two adjacent first radiating fins define therebetween a first connection section. Multiple second radiating fins integrally upward extend from the second plane section. Each two adjacent second radiating fins define therebetween a second connection section. The first and second radiating elements are connected with each other in an alternating manner with the first radiating fins attaching to and contacting with the second radiating fins to form the heat sink. | 01-13-2011 |
20110011573 | SIDE MATERIAL AND METHOD FOR PRODUCING THE SAME AND METHOD FOR PRODUCING CLAD MEMBER FOR HEAT EXCHANGER - Provided are a side member from which a clad member for heat exchanger exhibiting excellent productivity and corrosion resistance while preventing poor adhesion can be produced in production of a clad member for heat exchanger by controlling the surface state and flatness, a method for producing the side member, and a method for producing a clad member for a heat exchanger by using the side member. A side member (A) consists of a core material and one or more layers of side member (A) applied onto one side or both sides thereof and being used in a clad member for a heat exchanger, wherein a plurality of periodic forms (B) of fine groove which become arcuate toward one direction of the side member (A) is formed on the surface of the side member (A). The periodic form (B) of fine groove extends up to the outer circumferential edge of the side member (A) with a radius of curvature of 800-1500 ram and has a period (D) of 1-8 mm in the above-mentioned direction of the side member (A) and surface roughness of the side member (A) in the above-mentioned direction of 1-15 μm 10-point average roughness (Rz). | 01-20-2011 |
20110017441 | Heat Sink Using Latent Heat of LED Street Light - There is provided a heat sink using latent heat of an LED street light, wherein a phase change material (PCM) is used in the heat sink to quickly and efficiently dissipate high-temperature heat which generated by LED elements when the street light using LEDs as a light source is turned on. | 01-27-2011 |
20110024099 | CONTAINMENT FOR A PATTERNED METAL THERMAL INTERFACE - A system and method to improve long term reliability of an integrated circuit package containing a patterned metal thermal interface (PMTI), the method including: coupling a heat sink to a heat source; providing a PMTI material between the heat source and the heat sink; providing a partial containment of a compressed malleable metal to impede the PMTI from being inched-out of its location under a bearing load. | 02-03-2011 |
20110024100 | HEAT RADIATING UNIT STRUCTURE AND HEAT SINK THEREOF - A heat radiating unit is provided on a front face with at least one raised strip having a curved head portion and a neck portion, the neck portion being located at a joint of the raised strip and the heat radiating unit and having a width smaller than that of the curved head portion; and on a reverse face with at least one receiving groove opposite to the raised strip, the receiving groove having a curved recess portion and an engaging shoulder portion, and the engaging shoulder portion being located at a joint of the receiving groove and the heat radiating unit. A plurality of the heat radiating units can be assembled to provide a heat sink by engaging the curved head portion and the neck portion of one heat radiating unit with the curved recess portion and the engaging shoulder portion, respectively, of another heat radiating unit. | 02-03-2011 |
20110024101 | THERMAL CONDUCTIVE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Provided are a thermal conductive substrate having high thermal conductivity, which dissipates heat through as small as possible area thereof, and a method of manufacturing the thermal conductive substrate. The thermal conductive substrate includes a lower heat sink layer, a thermal conductive layer including thermal conductors formed to contact the lower heat sink layer, and an insulating adhesive portion filled between the thermal conductors, and an upper layer formed on the thermal conductor, wherein the upper layer contacts the thermal conductor so as to dissipate heat to the lower heat sink layer. | 02-03-2011 |
20110030938 | HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION SYSTEM ADOPTING THE SAME - A heat dissipation structure includes a thermal interface material and a transition layer. The thermal interface material includes a matrix and a plurality of carbon nanotubes dispersed in the matrix. The thermal interface material has a first surface and a second surface opposite to the first surface. The transition layer is positioned on one of the first surface or the second surface of the thermal interface material. A thickness of the transition layer is in a range from about 1 nanometer to about 100 nanometers. The transition layer is in contact with the carbon nanotubes of the thermal interface material. An interface thermal resistance between the transition layer and the heat source is less than that between the plurality of carbon nanotubes and the heat source. The present application also relates to a heat dissipation system adopting the heat dissipation structure. | 02-10-2011 |
20110030939 | HEAT EXCHANGER BEDS COMPOSED OF THERMOMAGNETIC MATERIAL - What are described are a packed heat exchanger bed composed of thermomagnetic material particles which have a mean diameter in the range from 50 μm to 1 mm and give rise to a porosity in the packed bed of 30 to 45%, and a heat exchanger bed composed of a thermomagnetic material monolith which has continuous channels with a cross-sectional area of the individual channels in the range from 0.001 to 0.2 mm | 02-10-2011 |
20110030940 | CARBON FIBER CARBON COMPOSITE MOLDED BODY, CARBON FIBER-REINFORCED CARBON COMPOSITE MATERIAL AND MANUFACTURING METHOD THEREOF - To obtain a carbon fiber-reinforced carbon composite material exhibiting excellent thermal conductivity in every direction in the plane containing the X and Y axes. A carbon fiber-carbon composite formed body in which a number of sheet-like dispersions containing pitch-based carbon fibers dispersed therein randomly in the plane containing the X and Y axes are laminated into a carbon fiber laminate, and pyrolytic carbon is deposited on the surfaces of the carbon fibers of the carbon fiber laminate to coat around the carbon fibers, whereby the carbon fiber laminate is filled with the pyrolytic carbon, and a carbon fiber-reinforced carbon composite material obtained using the carbon fiber-carbon composite formed body. | 02-10-2011 |
20110036552 | HEATSINK HAVING ONE OR MORE OZONE CATALYZING FINS - Ion wind fans produce ozone. In one embodiment, a heat sink used in conjunction with an ion wind fan includes at least one ozone catalyst fin coated with an ozone catalyst, to destroy at least some of the ozone produced by the ion wind fan. In one embodiment, the ozone catalyst fan protrudes from the downstream side of the heat sink towards the ion wind fan. | 02-17-2011 |
20110036553 | INTEGRAL EVAPORATOR AND DEFROST HEATER SYSTEM - A heat exchanger system having a fluid passage operable to fluidly communicate a first fluid and a heat transfer surface extending from the fluid passage for transferring heat between the first fluid and a second fluid. The system can further include a heating element operably coupled to and selectively applying thermal energy to at least one of the fluid passage and the heat transfer surface. | 02-17-2011 |
20110042051 | TEMPERATURE STABLE CAST-IRON ALLOY AND ITS USE - A description is given of a temperature-stable cast-iron alloy having high wear resistance at temperatures between 500 and 900° C. The alloy is characterized in that it has the following composition expressed in weight percentages: chromium: 15.0-20.0%, carbon: 1.0-2.0%, manganese: 1.5-2.0%, silicon: 0.8-1.2%, nickel: 8.0-10.0%, molybdenum: 0.8-1.2% balance iron and unavoidable metallic and non-metallic contaminants where the non-metallic contaminants comprise nitrogen, oxygen, phosphorous and sulphur. Hereby is obtained a cast-iron alloy which has a higher wear resistance and a reduced tendency to form the undesirable sigma phase when heated to temperatures between 500 and 900 ° C. as compared to the known allows. | 02-24-2011 |
20110042052 | COOLING MATERIAL - The present disclosure provides a cooling material which comprises a first spectrally selective component that comprises particles. The particles are arranged for emission of radiation predominantly having a wavelength or wavelength range within an atmospheric window wavelength range in which the atmosphere of the earth has a reduced average absorption and emission compared with an average absorption and emission in an adjacent wavelength range. Consequently, the cooling material is arranged for emission of thermal radiation and absorption of radiation from the atmosphere within that wavelength range is reduced. The cooling material further comprises a second spectrally selective component having a property that distinguishes the second spectrally selective component from the first spectrally selective component and facilitates at least one desired function of the cooling material. | 02-24-2011 |
20110042053 | SANDWICH MATERIAL FOR BRAZING WITH HIGH STRENGTH AT HIGH TEMPERATURE - The invention relates to a sandwich material for brazing comprising a core layer of a first aluminum alloy and a barrier layer of a second aluminum alloy characterized by that: the first alloy, constituting the core layer contains (in weight %): 0.8-2% Mn, ≦1.0% Mg, 0.3-1.5% Si, ≦0.3% Ti, ≦0.3% Cr, ≦0.3% Zr, ≦1.3% Cu, ≦0.5% Zn, ≦0.2% In, ≦0.1% Sn and ≦0.7% (Fe+Ni), the balance consisting of Al and ≦0.05% of each of the unavoidable impurities, and that the second alloy, constituting the barrier layer contains (in weight %): ≦0.2% Mn+Cr, ≦1.0% Mg, ≦1.5% Si, ≦0.3% Ti, ≦0.2% Zr, ≦0.3% Cu, ≦0.5% Zn, ≦0.2% In, ≦0.1% Sn and ≦1.5% (Fe+Ni), the balance consisting of Al and ≦0.05% of each of the unavoidable impurities, The invention also concerns a method for the manufacture of the sandwich material, a brazed product, such as a heat exchanger comprising the sandwich material and the use of the brazed product at high and low temperatures. | 02-24-2011 |
20110048690 | Article for Magnetic Heat Exchange and Method for Manufacturing an Article for Magnetic Heat Exchange - An article ( | 03-03-2011 |
20110056669 | Heat Transfer Device - According to one embodiment, a heat transfer device includes an array of elongated pins coupled between a base plate and a cover plate. Each pin has a cross-sectional shape with a major width and a minor width that is perpendicular to the major width, in which the length of the minor width is less than the major width. The cover plate and the base plate forming a plenum for the movement of air across the array of pins along a direction parallel to the major width of each pin. | 03-10-2011 |
20110056670 | HEAT SINK - A heat sink includes a frame, a vapor chamber fixed to the frame, and a heat-dissipating plate adhered to one surface of the vapor chamber. The heat-dissipating plate has a first heat-dissipating fins region and a second heat-dissipating fins region. The first heat-dissipating fins region and the second heat-dissipating fins region are composed of a plurality of first heat-dissipating fins and a plurality of second heat-dissipating fins that are arranged at intervals, respectively. The pitch of the first heat-dissipating fins in the first heat-dissipating fins region is smaller than that of the second heat-dissipating fins in the second heat-dissipating fins region. By this arrangement, airflow can flow freely among the respective heat-dissipating fins. The first heat-dissipating fins region is used to dissipate a great amount of heat, while the second heat-dissipating fins region is used to exhaust the air rapidly. Thus, the heat-dissipating efficiency can be increased. | 03-10-2011 |
20110056671 | SOLID TYPE HEAT DISSIPATION DEVICE - Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers. | 03-10-2011 |
20110056672 | Heat Spreader Having Single Layer of Diamond Particles and Associated Methods - A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders. | 03-10-2011 |
20110061847 | HEAT DISSIPATION DEVICE - A heat dissipation apparatus includes a heat conductive plate, a heat-dissipating fin set and a fastener. The heat-dissipating fin set has a bottom surface attached to a top surface of the heat conductive plate. The fastener includes a curled section and two legs joined to opposite ends of the curled section. Basically, the curled section is elastically deformable and has a trough pressing against a top surface of the heat-dissipating fin set and a crest spaced apart from the top surface of the heat-dissipating fin set. Each of the legs of the fastener has a clasping member to be fastened on heat conductive plate. When the clasping members of the legs are fastened on the heat conductive plate, the curled section is tightened by the legs. | 03-17-2011 |
20110061848 | Heat Dissipation Module and the Manufacturing Method Thereof - The present invention discloses a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a metal base, a porous metal layer and a metal plate member. The porous metal layer is disposed on one side of the metal base and includes a plurality of micropores. Parts of the plurality of micropores contain a metal medium. The metal plate member is disposed on one side of the porous metal layer. Heat is rapidly conducted from the metal base through the metal plate member to the environment by means of the porous metal layer and the metal medium. | 03-17-2011 |
20110061849 | DEVICE FOR COOLING SEMI-CONDUCTORS - The device serves for cooling electronic structural elements and has a cooling body and a metal base plate constructed as a part of the support of the structural element. The cooling body is arranged adjacent the base plate. A connecting element is arranged at least over areas between the base plate and the cooling body. The connecting element is at least partially constructed of a metal which has a melting temperature of at least 60° C. The connecting element is provided with a frame-like seal. | 03-17-2011 |
20110061850 | SOLDERING WORK PIECE, SOLDERING METHOD AND HEAT EXCHANGER - The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the soldering work piece is provided with an artificially applied oxide layer. | 03-17-2011 |
20110061851 | COOLING ARRANGEMENT FOR AN ELECTRICAL CONNECTOR FOR A SUPERCONDUCTOR - A cooling arrangement for an electrical connector for a superconductor including at least one superconductor arranged in a container and the container is arranged in a vacuum chamber. A cryocooler is thermally connected to the container to cool the container and the contents of the container including the superconductor. The electrical connector extends through the vacuum chamber and the container to the at least one superconductor. The electrical connector has a thermally conducting and electrically insulating arrangement. The thermally conducting and electrically insulating arrangement comprises an electrically insulating member contacting the electrical connector. A thermally conducting member contacts the electrically insulating member and the thermally conducting member is thermally connected to the to cool the electrical connector. | 03-17-2011 |
20110061852 | HEAT RADIATION SHEET AND HEAT RADIATION DEVICE - A heat radiation sheet having high heat-radiation property and excellent handleability and having sheet properties permitting the sheet to cope with changes in use temperature thereof. Also provided is a heat radiation device using the sheet. The heat radiation sheet comprises: a binder component comprising: (A) a thermoplastic rubber component; (B) a thermosetting rubber component; and (C) a thermosetting rubber curing agent crosslinkable with the thermosetting rubber component (B); and an anisotropic graphite powder oriented into a specified direction in the binder component. | 03-17-2011 |
20110067850 | Buckling Device with Cooling Function - A buckling device for electronic heating element, inter-assembled with a thermally conductive body, includes a cooling plate, a pair of fixing legs bent-and-extended from the cooling plate and formed under the cooling plate and a fixing arm bent-and-extended from the cooling plate and formed under the cooling plate. On the cooling plate, a plurality of slots are stamped, one side of each of which is bent and configured into a cooling piece. The thermally conductive body is fixed by being sandwiched between the fixing arm and the cooling plate. Thereby, the buckling device can be used in a thin electronic device to reduce its assembly and machining costs on a large scale. | 03-24-2011 |
20110073293 | Thermal Wick Cooling For Vibroacoustic Transducers - A soft thermally-conductive wick is provided to be connected between the metallic components on a transducer and onto a thermal sink. Beryllia ceramic is provided to improve heat flux within the transducer while maintaining electrical insulation. The wick provides adequate heat flux and such that the mass and stiffness of the wick do not adversely affect the vibroacoustic properties of the transducer in the frequency band of interest. The mass of the wick attachment is considered in the transducer design with the location and direction of the wick attachment designed so as to not introduce rocking modes or other adverse affects in the frequency band of interest. The wick may be strung, coiled, folded or configured in many ways between the transducer and the thermal sink to ensure that no acoustic or vibrational energy is transmitted down the length of the wick. | 03-31-2011 |
20110073294 | SYSTEM, METHOD AND APPARATUS OF COOL TOUCH HOUSINGS - A system, apparatus and method for cool touch housings are described. The apparatus may include a housing arranged to at least partially enclose at least one internal component of a mobile device. A portion of the housing may include an exterior surface spreader, a thin active heat pump with a first side and a second side, wherein the first side of the thin active heat pump is thermally coupled to the exterior surface spreader, and an interior surface spreader thermally coupled to the second side of the thin active heat pump. Other embodiments are described and claimed. | 03-31-2011 |
20110079376 | COLD PLATE WITH PINS - A cold plate includes an enclosure with an inlet, an outlet, a base and a lid. The inlet and outlet are in fluid communication, so fluid can flow from the inlet though the enclosure to the outlet. The base is formed from a base plate, and the base plate includes an island facing into the enclosure. A plurality of pins extends from the island toward the lid. The pins can have a spiral shape, where the cross sectional profile of the pins change along the length of the pin. | 04-07-2011 |
20110079377 | HEATING PAD - The heating pad has a case, a plug and heating liquid. The case is hollow, made by injection molding, and has a space, an opening and a loading surface. The space is formed in the case. The opening is formed in the case, and communicates with the space. The loading surface is flat, and formed on the case. The plug is detachable mounted tightly on the opening of the case. The case is filled with the heating liquid in the space, and the heating liquid can be heated to provide a warming effect. | 04-07-2011 |
20110079378 | METHOD FOR MANUFACTURING A HEAT EXCHANGER AND EXCHANGER OBTAINED BY THE METHOD - The present invention relates to a method for manufacturing an air/fluid heat exchanger ( | 04-07-2011 |
20110079379 | MOLD POWDER SUPPLY APPARATUS USING THE WASTE HEAT OF A TUNDISH - The present invention relates to a mold powder supply apparatus using the waste heat of a tundish, which can collect waste heat from molten steel in the tundish, and preheat and dry mold powder. The mold powder supply apparatus using the waste heat of a tundish according to an embodiment of the present invention includes: a powder hopper that is mounted to a frame close to a tundish to absorb heat radiated from the top of the tundish, through one side; an agitator that agitates mold powder filled in the powder hopper; and a supply pipe that is connected to the bottom of the powder hopper to supply the powder hopper into a mold. | 04-07-2011 |
20110083835 | Heat-dissipating structure and method for fabricating the same - Provided are a heat-dissipating structure and a method for fabricating the same so as for the heat-dissipating structure thus fabricated to dissipate heat from the heat-generating portion of an electronic device. The heat-dissipating structure includes a metal base and a carbon composite layer. The carbon composite layer is formed on the metal base and includes metal particles and carbon particles sintered together. The heat-dissipating structure is more effective in dissipating heat than a conventional vapor chamber or heat spreader. The heat-dissipating structure further includes a carbon composite layer and a metal plate with high thermal conductivity. The heat-dissipating structure is attachable to a heat-generating electronic component to facilitate heat exchange therebetween and thereby enhance heat dissipation. | 04-14-2011 |
20110083836 | HEAT RADIATING COMPONENT - A heat radiating component provided on a semiconductor package, the heat radiating component coming in contact with a semiconductor element, the heat radiating component includes a heat radiating plate having a concave part; linear high thermal conductivity materials formed on a bottom surface of the concave part so as to stand in a thermal conductive direction; first and second resin layers configured to fill space parts formed by the neighboring linear high thermal conductivity materials, the first and the second resin layers being stacked on the bottom surface of the concave part in order to expose head end parts of the linear high thermal conductivity materials; and a metal layer formed on an upper surface of the second resin layer and at least a portion of a surface of the heat radiating plate where the concave part is formed. | 04-14-2011 |
20110094723 | COMBINATION OF FASTENER AND THERMAL-CONDUCTING MEMBER - A combination of a fastener and a thermal-conducting member is mounted on an electronic heat-generating member. The fastener includes a plate provided with an opening for allowing the electronic heat-generating element to be disposed therein; posts connected to the plate and formed around the opening; and clamping arms extending from the plate opposite to the posts. The thermal-conducting member is disposed on the plate to span the opening. The clamping arms are bent to press in the thermal-conducting member, thereby forming on the surface of the thermal-conducting member with a plurality of positioning notches for allowing the clamping arms to be inserted therein. With this arrangement, the fastener can be combined with the thermal-conducting member tightly. Thus, the heat generated by the electronic heat-generating element can be continuously conducted to the outside, so that the temperature of the electronic heat-generating element can be kept in a normal range. | 04-28-2011 |
20110100616 | Heat radiating structure and method for manufacturing the same - The present invention provides a heat radiating structure including: a metal substrate having a front surface facing a light emitting device, a rear surface opposite to the front surface, and side surfaces connecting the front surface and the rear surface; an oxide film pattern covering the front surface of the metal substrate; an adhesive film covering the oxide film pattern; and a metal pattern formed on the adhesive film and having a heat transmission via bonded to the oxide film pattern through the adhesive film. | 05-05-2011 |
20110108261 | THREE-LAYERED COLD/HOT CONTROLLER - A three-layered cold/hot controller comprises a semiconductor plate, a first metal plate, and a second metal plate. The semiconductor plate has a top and a bottom contact surface and connected with a power source. When the semiconductor plate is electrified, the top contact surface of the semiconductor plate forms a contact surface for decreasing temperature while the bottom contact surface of the semiconductor plate forms a contact surface for elevating temperature. The first metal plate is combined to the top contact surface of the semiconductor plate for conducting the heat between the first metal plate and the top contact surface. The second metal plate is combined to the bottom contact surface of the semiconductor plate for conducting the heat between the second metal plate and the bottom contact surface. | 05-12-2011 |
20110108262 | HYDROPHILIC MEMBER, FIN STOCK, ALUMINUM-MADE FIN STOCK, HEAT EXCHANGER AND AIR CONDITIONER - A hydrophilic member endowed with sufficient hydrophilicity and excellent in the water resistance, antifouling property and scratch resistance can be provided, which is a hydrophilic member comprising a base material having provided thereon a hydrophilic film formed from a hydrophilic composition containing (A-1) a hydrophilic polymer having at least one hydrolyzable alkoxysilyl group on the polymer side chain and (B) a metal complex catalyst, wherein the water swelling degree of the hydrophilic film is 1.5 times or less. | 05-12-2011 |
20110114301 | HEAT DISSIPATION APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation apparatus includes fins each including a body and blades extending radially outwardly from the body. The blades define cutouts therebetween. The fins are stacked together in such a manner that the cutouts of the fins cooperatively form airflow guiding channels each extending spirally from top to bottom. | 05-19-2011 |
20110114302 | HEAT EXCHANGER - The invention describes a method for producing a plate heat exchanger | 05-19-2011 |
20110114303 | ULTRASONIC PROBE HAVING HEAT SINK - The present invention provides an ultrasonic probe which includes a heat sink ( | 05-19-2011 |
20110120689 | HEAT EXCHANGER RADIATING FIN STRUCTURE AND HEAT EXCHANGER THEREOF - A heat exchanger radiating fin structure and a heat exchanger thereof. The radiating fin includes a main body and at least one rib. The main body has a first plane face and at least one lateral side. Multiple depressions are formed on the first plane face. The rib is disposed on a portion of the first plane face, which portion is free from any of the depressions. The rib obliquely extends in a direction neither normal nor parallel to any lateral side of the first plane face. The heat exchanger includes a radiating fin assembly composed of multiple piled up radiating fins. Each two adjacent radiating fins define therebetween a flow way having at least one inlet and at least one outlet. With the depressions and the rib, the structural strength of the radiating fin is increased and the heat exchange performance of the heat exchanger is enhanced. | 05-26-2011 |
20110120690 | METHOD OF FORMING A HEAT EXCHANGER HAVING A BRAZED CORE ASSEMBLY - A method of manufacturing a heat exchanger having a brazed core with parallel tubes separated by and contacting centers that extend parallel to the tubes. The method utilizes a brazing fixture that enables the core to expand during brazing due to thermal expansion of the tubes and centers and maintains tube to center contact as the core shrinks due to melting of the braze alloy. The resulting brazed core has a post-brazed tube spacing pattern that facilitates assembly of the brazed core with headers of the heat exchanger. | 05-26-2011 |
20110120691 | AIR COOLING EQUIPMENT FOR HEAT TREATMENT PROCESS FOR MARTENSITIC STAINLESS STEEL PIPE OR TUBE - An object of the present invention is to provide air cooling equipment for a heat treatment process for a martensitic stainless steel pipe, which is capable of shortening the time required for the heat treatment process by enhancing the cooling efficiency at the time when the inner surface of steel pipe is air cooled in the heat treatment ent process. | 05-26-2011 |
20110120692 | RADIATION TRANSMITTER - Radiation transmitter, also called radiation semiconductor, is a structure that can rectify and gather the random radiation from a single heat source. It is known from the Fermat's principle that light in a medium with graded index usually deflects from an area with high refractive index to an area with low refractive index, and light in the area with low refractive index always can reach the area with high refractive index, but part of the light traveling from the area with high refractive index to the area with low refractive index will return to the area with high refractive index within an inflexion effective distance. As a result, the radiation heat exchange between the surface with low refractive index and the isothermal surface with high refractive index is unbalanced, radiation is automatically and directionally transferred by wave-guide, and the heat of an object is automatically and directionally transferred to the isothermal and high-temperature objects by radiation. The radiation transmitter, which is a basic structure for developing atom energy, can gather, store and transfer solar radiation energy and spontaneous radiation energy of other objects, and can be used for refrigeration, heating, air conditioning, cooking, heat engine driving, power generation, etc. | 05-26-2011 |
20110132591 | HEAT EXCHANGER AND METHOD OF MANUFACTURING SAME - Provided are a heat exchanger having a novel structure and efficiently cooling a heat generating body, and a method of manufacturing the heat exchanger. A heat exchanger has flow paths formed by being closed by an upper plate and a lower plate which have rectilinearly formed upstanding fins parallelly arranged at specific intervals, and gaps extend between adjacent fins in the top-bottom direction along the direction in which the fins extend. Either of or both the upper plate and the lower plate are provided with projections arranged in the longitudinal direction of the flow path and projecting inward of the flow path. | 06-09-2011 |
20110139429 | SHAPED HEAT SINKS TO OPTIMIZE FLOW - A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins. | 06-16-2011 |
20110139430 | HEAT DISSIPATION SYSTEM - A system for dissipating heat generated by an electronic system, for example an electronic device in an aircraft. The system includes a housing including an external lid covering the electronic system and configured to be in contact with a first cold source, and a second cold source located inside the external lid. The housing includes an internal lid located inside the external lid and covering the electronic system, the second cold source being located between the internal and external lids. | 06-16-2011 |
20110155360 | Surface mount heat sink apparatus - A surface mountable heat sink apparatus for use with surface mount electronic components comprises a heat dissipating body and a plurality of solderable feet complying with Surface Mounting Technology (SMT). The heat dissipating body and the solderable feet are made of different materials and of unitary construction. The solderable feet project partially beyond one edge of the heat dissipating body. The surface mount heat sink apparatus and surface mount electronic component are touchlessly sandwiched and simultaneously soldered onto the solder drain pads on the printed circuit board. Heat dissipated from the surface mount electronic component is conductively transferred to the heat sink body through the solder drain pad, printed circuit board and solderable feet, and finally rejected to surroundings thereafter. Like all the SMT electronic components, the surface mount heat sink apparatus can be placed onto the printed circuit board manually or automatically by a pick-&-place automation equipment. | 06-30-2011 |
20110155361 | Heat dissipation module and portable device having the heat dissipation module - A heat dissipation module for lowering the temperature of a heating element is disclosed. The heat dissipation module comprises a heat dissipation module body, a container, and a liquid element. The heat dissipation module body is made of a heat conductive material; the container is installed in the heat dissipation module body; and the liquid element is disposed in the container. Therefore, when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element. | 06-30-2011 |
20110155362 | METHOD AND APPARATUS FOR HEATING COUPLING MEDIUM - An ultrasound diagnostic apparatus includes an apparatus for heating a coupling medium, wherein the apparatus includes an external heat conductive unit, including a base for positioning a container storing the coupling medium, and an internal heat sink unit for absorbing heat from the heat generating unit of the ultrasound diagnostic apparatus. The external heat conductive unit and the internal heat sink unit are configured as separate assembly structures such that, in the state of assembly, the heat of the heat generating unit is transferred to the container through them. | 06-30-2011 |
20110155363 | MEMORY MODULE ASSEMBLY AND HEAT SINK THEREOF - A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly cling to the respective heat source. | 06-30-2011 |
20110155364 | SMART PASSIVE THERMAL DEVICES AND METHODS - Devices and methods for increasing and decreasing cooling capacity as thermal load increases by utilizing bimaterial. For increasing the cooling capacity, the upper plate of a thin film microchannel can be configured from a bimaterial, such that the upper layer possesses a higher linear thermal expansion coefficient than that of the lower layer material. Excessive heating causes the coolant temperature to increase which in turn heats the upper plate. As such, the upper plate bends outward allowing for more coolant to flow within the thin film. For decreasing the cooling capacity, the upper plate can be configured from a bimaterial such that its lower layer has a higher linear thermal expansion coefficient than that of the upper layer material. Excessive heating can cause the coolant temperature to increase, which in turn heats the upper plate. As such, the upper plate can bend inward resulting in less coolant flow within the thin film. | 06-30-2011 |
20110162828 | THERMAL PLUG FOR USE WITH A HEAT SINK AND METHOD OF ASSEMBLING SAME - A plug is provided for use with a heat sink body and an electronic device. The plug includes a first plug member and a second plug member. The first plug member defines a socket therein. The second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device. | 07-07-2011 |
20110168374 | CORRUGATED-FIN TYPE RADIATOR - Disclosed is a corrugated-fin type radiator ( | 07-14-2011 |
20110168375 | Expandable fluid cooling structure - A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays. | 07-14-2011 |
20110168376 | HEAT CONDUCTION COMPOSITION - A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m | 07-14-2011 |
20110174473 | Methods of forming enhanced-surface walls for use in apparatae for performing a process, enhanced-surface walls, and apparatae incorporating same - This invention relates generally to: (1) methods of forming enhanced-surface walls ( | 07-21-2011 |
20110174474 | VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - This invention discloses a vapor chamber and a method for manufacturing the same. The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer. | 07-21-2011 |
20110180246 | HEAT-DISSIPATING DEVICE HAVING A LAYERED FUNCTIONAL UNIT - A heat-dissipating device comprises a metallic layer to contact a heat source, and a layered functional unit formed on the metallic layer and including a semiconductor material and a far infrared material. Preferably, the functional unit further includes a carbon material having a large specific surface area. The heat from the metallic layer excites the electrons in the semiconductor material to jump across band gap and then release heat energy, and excites the far infrared material to radiate far infrared rays. A rapid heat dissipation rate can be achieved by increasing heat transfer area and by converting heat into far infrared rays that can be radiated away rapidly. | 07-28-2011 |
20110180247 | HEAT EXCHANGER - The invention relates to a plate heat exchanger ( | 07-28-2011 |
20110180248 | Method for Surface Treating a Heat Exchanger, Hydrophilizing Treatment Agent, and Aluminum Heat Exchanger - A method for surface treating a heat exchanger, a hydrophilizing treatment agent used in this method, and an aluminum heat exchanger obtained from this method are provided that excel in the initial adherence, hydrophilicity, and odor suppressibility, and can maintain these abilities for an extended time, while having little burden on the environment and the human body. The method for surface treating an aluminum heat exchanger that is brazed includes (1) a pickling treatment step; (2) a chemical conversion treatment step; and (3) a hydrophilization treatment step, in which the acidic cleaning agent contains nitric acid and sulfuric acid and contains ferric salt in a predetermined amount, the hydrophilizing treatment agent contains silica grains coated with a vinyl alcohol polymer and a polyallylamine resin. | 07-28-2011 |
20110180249 | METHOD FOR SURFACE TREATING A HEAT EXCHANGER, SURFACE TREATMENT AGENT, AND ALUMINUM HEAT EXCHANGER - A method for surface treating a heat exchanger and an aluminum heat exchanger obtained from this method are provided that can effectively suppress the foul odor characteristic to flux that emanates following degradation of a hydrophilic coating film and a chemical conversion coating film in a non-corrosive flux brazed heat exchanger on which flux easily remains. The method for surface treating a non-corrosive flux brazed heat exchanger made of an aluminum material conducts a pickling treatment step, a chemical conversion treatment step, and a deodorizing treatment step on the heat exchanger, in which the acidic cleaning agent contains nitric acid and sulfuric acid as well as a predetermined amount of ferric salt, and the surface treatment agent contains silica grains coated by a vinyl alcohol polymer and polyallylamine resin such that the total content of the silica grains and the vinyl alcohol polymer is a predetermined amount. | 07-28-2011 |
20110186280 | Radiator fin and radiator fin component thereof - One or more radiator fins each includes two heat conducting vanes which are joined end to end and top to top. There are multiple strength vanes next to inner walls of the heat conducting vanes in the space between two heat conducting vanes. The radiator fins are made into porous structure and bear high pressure. The two heat conducting vanes have corresponding allowing ventilation region and the radiator fins have multiple heat conducting paths and can achieve a very good cooling effect. A radiator fin component includes multiple radiator fins and a base, wherein multiple track grooves are provided in the base. The radiator fins possess rivet joints corresponding to rivet joints of groove regions of the base. After the rivet joints are pushed into the corresponding grooves, downward pressure can be applied to the top of the radiator fins fixing the radiator fins in the base. | 08-04-2011 |
20110186281 | COOLING TOWER HAVING REDUCED MICROBIAL CONTAMINATION - The invention relates to a cooling tower in which contamination with and proliferation of microorganisms can be prevented by incorporating composite materials and/or material combinations and an antimicrobial substance containing tungsten and/or molybdenum into the cooling tower. | 08-04-2011 |
20110186282 | METHOD AND DEVICE FOR ADJUSTING THE COOLING AND ENERGY RECOVERY OF A STEEL STRIP IN AN ANNEALING OR GALVANIZATION PHASE - A method and a device adjust the cooling of a steel strip in an annealing or galvanization phase. The device is suitable for the forced cooling of a steel strip continuously running in a plant adapted for the continuous annealing or the continuous tempering galvanization. The device has at least one exchange member for transferring the heat of the steel strip to cooling water and includes an outlet for the cooling water thus heated up. At least one cooling unit is provided and has a sealed enclosure connected to the outlet of the exchange member and includes at least one outlet to a Venturi effect device such as a vapor outlet ejector and in which the cooling water itself is subjected to a vacuum-vaporization cooling. An auxiliary outlet of the sealed enclosure is connected to an inlet of the exchange member. | 08-04-2011 |
20110192585 | Water Spread Limiting System for Pre-Insulated Piping - A section of pipe is used in a pre-insulated piping system where the system is made up of lengths of insulated and jacketed pre-insulated piping. Each length of piping is made up of an inner carrier pipe having an interior surface and an exterior surface. An envelope of foamed insulation surrounds the inner pipe exterior surface and an outer protective jacket surrounds the envelope of foamed insulation. The length of piping has a joining end for joining to an adjacent length of piping, whereby the adjacent lengths of piping provide a continuous length of fluid conduit for conveying high temperature fluids. A heat dissipating element surrounds the inner carrier pipe for at least a portion of the length thereof. The heat dissipating element is itself insulated, whereby any water which penetrates the outer protective jacket contacts the heat dissipating element and is cooled below boiling before traveling any significant distance along the length of the section of piping. | 08-11-2011 |
20110192586 | HEAT-DISSIPATION STRUCTURE OF LED LAMP - A heat-dissipation structure of an LED lamp is disclosed. The LED lamp includes a metal profile, a lampshade attached to the metal profile from bottom, a lamp head mounted around the combined lampshade and metal profile, a printed circuit board set in receiving recesses bilaterally formed below the metal profile, and LEDs provided on a surface of the printed circuit board facing the lampshade. The heat-dissipation structure is characterized in a downward-bending accurate profile of the metal profile being formed between the receiving recesses, and two pads being each positioned between the flanges and the printed circuit board, the two pads serving to prop two lateral sides of the printed circuit board upward such that the printed circuit board fits the accurate profile and closely contacts the metal profile with increased contacting area. Thereby, the printed circuit board can have heat accumulated in operation rapidly dissipated from the metal profile. | 08-11-2011 |
20110192587 | THERMAL MANAGEMENT OF ELECTRONIC DEVICES - Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias. | 08-11-2011 |
20110192588 | HEAT CONDUCTING SHEET, MANUFACTURING METHOD THEREOF, AND HEAT RADIATOR THAT UTILIZES THE SAME - A heat conducting sheet including a composition, wherein the composition contains plate-form boron nitride particles (A) having an average particle diameter of more than 10 μm and 60 μm or less, and an organic polymer compound (B) having a glass transition temperature (Tg) of 50° C. or lower, the plate-form boron nitride particles (A) are contained in the composition in an amount ranging from 45 to 75% by volume thereof, and are oriented to direct the major axis direction thereof along the thickness direction of the sheet. Thus, there is provided an electrically insulating and heat conducting sheet which can keep a high thermal conductivity while the sheet has additional properties such as flexibility. | 08-11-2011 |
20110198067 | SHEET HAVING HIGH THERMAL CONDUCTIVITY AND FLEXIBILITY - [Problem] To reduce thermal resistance between a heating body and a radiating body. | 08-18-2011 |
20110198068 | Heat dissipation structure having combined cooling fins - The present invention relates to a heat dissipation structure comprising a metal base and a plurality of cooling fins, wherein the metal base is formed with a receiving space therein for receiving a heat generating object, an outer surface of the metal base is equidistantly formed with a plurality of recesses, each of the cooling fins is formed by a U-shaped metal plate including two heat dissipation portions and an elastic engagement portion, the elastic engagement portion is in U-shape and has two ends connected to one end of each of the two heat dissipation portions respectively, and an outer surface of the elastic engagement portion can be engaged with an inner surface of each of the recesses by the resilience thereof, so as to efficiently increase the amount and heat dissipation area of the cooling fins and greatly enhance the heat dissipation efficiency of the heat dissipation structure. | 08-18-2011 |
20110198069 | ARTICLE FOR MAGNETIC HEAT EXCHANGE AND METHOD OF FABRICATING AN ARTICLE FOR MAGNETIC HEAT EXCHANGE - An article for magnetic heat exchange comprising a magnetocalorically active phase with a NaZn | 08-18-2011 |
20110203783 | HOLOGRAPHIC PATTERNED HEAT MANAGEMENT MATERIAL - Embodiments of the present disclosure relate generally to body gear having designed performance characteristics, and in particular to methods and apparatuses that utilize an array of holographic heat managing elements coupled to a base material to direct body heat while also maintaining the desired transfer properties of the base material. In some embodiments, the heat managing material elements include heat-directing elements that reflect heat or conduct heat, and may be directed towards the body of a user or away from the body of the user. | 08-25-2011 |
20110203784 | HEAT EXCHANGE DEVICE FOR POWDER AND GRANULAR MATERIAL, AND METHOD FOR MANUFACTURING THE SAME - An object of the present invention is to provide a heat exchange device for a powder and granular material, which is capable of suppressing an object to be processed from adhering/accumulating, and reducing the number of manufacturing processes (time), while keeping high heat efficiency, piston flowability and other advantages of a conventional device that uses wedge-shaped hollow rotating bodies. In order to achieve this object, a heat exchange device for a powder and granular material according to the present invention is configured such that at least one of a plurality of heat exchangers | 08-25-2011 |
20110209861 | METHOD OF MANUFACTURING PLATE HEAT EXCHANGER AND PLATE HEAT EXCHANGER - In a plate heat exchanger, it is aimed to enhance strength, such as the pressure resistance and the internal pressure fatigue resistance, by increasing the joint area of a joint portion joined by brazing in a wave-patterned portion. Before a brazing process of the plate heat exchanger, a plurality of plates are stacked and pressure is applied thereto. By this pressure process, indentations of approximately “0.05 mm to 0.1 mm” are formed at contact points | 09-01-2011 |
20110214849 | LAMP HOLDER - A lamp holder includes a heat dissipating seat having a compartment. A substrate is mounted in the compartment of the heat dissipating seat. The substrate includes a control circuit and at least one slot. At least one lighting element is mounted in the at least one slot and in electrical connection with the control circuit. The substrate further includes two flexible terminals in electrical connection with the control circuit and the at least one slot. When mounting the lamp holder into a space of a base, the flexible terminals are inserted into two coupling holes in a conductive portion of an inner periphery of the space. The heat dissipating seat is then pressed downward so that the resiliency of the flexible terminals urges the heat dissipating seat into the space of the base, providing easy assembly. | 09-08-2011 |
20110214850 | Nanotube Materials for Thermal Management of Electronic Components - A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a disk having relatively high thermal conductivity and heat spreading characteristics. The heat-conducting medium also includes a first recessed surface and an opposing second recessed surface. Extending from within each recessed surface is an array of heat conducting bristles to provide a plurality of contact points to the heat source and heat sink to aid in the transfer of heat. The recessed surfaces may be defined by a rim positioned circumferentially about the disk. The presence of the rim about each recessed surface acts to minimize the amount of pressure that may be exerted by the heat sink and the heat source against the bristles. A method for manufacturing the heat-conducting medium is also provided. | 09-08-2011 |
20110214851 | USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER - The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed. | 09-08-2011 |
20110214852 | HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K. | 09-08-2011 |
20110220338 | LED HEAT SINK AND METHOD OF MANUFACTURING SAME - A LED heat sink and a method of manufacturing same are disclosed. The LED heat sink includes a holding zone bordered by one or more anchor portion of a higher elevation. The anchor zone has an upper side formed a compact stamping zone. The compact stamping zone is stamped forcefully through a mold in a diagonal direction towards the holding zone such that the material of the anchor zone is squeezed above the holding zone to form a latch hook to latch and press a LED lamp onto the holding zone so that the LED lamp is tightly in contact with the heat sink. Thus a forced transfer effect can be achieved to rapidly reduce the temperature of the LED lamp. | 09-15-2011 |
20110220339 | METHOD AND APPARATUS FOR REDUCING ACOUSTIC NOISE IN A SYNTHETIC JET - A synthetic jet includes a first backer structure and a first actuator coupled to the first backer structure to form a first composite unit. The synthetic jet also includes a second backer structure, and a second actuator coupled to the second backer structure to form a second composite unit. A wall member is coupled to and positioned between the first and second backer structures to form a cavity. The first composite unit has an orifice formed therethrough and the orifice is fluidically coupled to the cavity and fluidically coupled to an environment external to the cavity. | 09-15-2011 |
20110220340 | HEAT EXCHANGER ELEMENT - The invention relates to an heat exchanger element of a plate type, with one internal flow passage, comprising two plates defining an inlet, an outlet and an internal passage extending between said inlet and said outlet, whereas said passage is between two generally parallel plates of self supporting polymer material. The present invention also relates to the use of such an exchanger element as collector in a solar energy arrangement, as chilled beam, as hear distributing element, as subterranean collector, as exchange element in industrial processes and as heat absorber in arrangements for cooling electrical components that are negatively affected by being close to elements having electrical conductivity. | 09-15-2011 |
20110226458 | MODULAR HEAT SINK AND METHOD FOR FABRICATING SAME - There is described a method for fabricating a modular heat sink, the method comprising: extruding N individual integral heat sink segments using an extrusion process, each one of the N segments corresponding to 1/N of the modular heat sink, N being an integer greater than one; and assembling the N individual integral heat sink segments together in order to obtain the modular heat sink. | 09-22-2011 |
20110226459 | MATERIAL FOR JOINING AND PRODUCT PRODUCED THEREWITH - The invention relates to an iron-based brazing material comprising a brazing alloy, which alloy comprises: from about 9 wt % to about 30 wt % Cr, from about 5 wt % to about 25 wt % Ni, from about 0 wt % to about 9 wt % Mo, from about 0 wt % to about 5 wt % Mn, from about 0 wt % to about 1 wt % N, from about 6 wt % to about 20 wt % Si. Within the alloy is at least one of the B and the P are present as a melting point lowering supplement to Si, and wherein B is from about 0.1 wt % to about 1.5 wt %, or wherein P is from about 0.1 to about 15 wt % P. The brazing alloy may comprise contaminating elements as at least one of C, O, and S, and optionally the brazing alloy also comprises at least one micro-alloying element as V, Ti, W, Nb, or Ta, and the micro-alloying element is less than 1.5 wt % in the brazing alloy. All values are stated in weight percent, and wherein Si, B and P lower the liquidus temperature, that is the temperature when the brazing material is completely melted. | 09-22-2011 |
20110232886 | Heat dissipation housing for led lamp - The present invention is to provide a heat dissipation housing for an LED lamp, which is made as a one-piece member by metal casting and formed with a receiving channel axially passing therethrough. A plurality of cooling fins axially are formed on an outer surface of the housing, wherein each said cooling fin is radially extended out of the housing and formed therein with a plurality of heat dissipation holes, and has two opposite sides with an included angle defined therebetween. Therefore, when an LED lamp installed on an end of the receiving channel starts to emit light, heat exchange between the LED lamp and the ambient cooling air outside the housing can be carried out through the cooling fins and the heat dissipation holes by both of thermal conduction and thermal convection, so as to effectively enhance the heat dissipation efficiency of the housing for the LED lamp. | 09-29-2011 |
20110232887 | COLD PLATE WITH INTEGRAL STRUCTURAL FLUID PORT - A cold plate assembly includes a sheet having an aperture. A fluid port includes a body having a passage. A flange extends from the body and is secured to the sheet with a material. The passage and the aperture is in fluid communication with one another. The cold plate is manufactured, for example, by arranging multiple sheets relative to one another with a first material provided between the sheets. A fluid port is arranged on one of the multiple sheets with the passage in the fluid port in fluid communication with the aperture in at least one of the multiple sheets. A second material is provided between the fluid port and at least one of the multiple sheets. The fluid port and the multiple sheets are secured to one another with the first and second materials by a method, such as brazing. | 09-29-2011 |
20110232888 | ZONE TEMPERATURE CONTROL STRUCTURE - A zone temperature control structure which has two or more zone of which surface temperatures are controlled to different temperatures, respectively. The structure can maintain a temperature difference by suppressing heat conduction in a direction in which the zones are arrayed, and prevent formation of a hot spot by ensuring smooth heat conduction for heat input in a direction intersecting the direction in which the zones are arrayed. A heat-conducting anisotropic material layer is disposed between the two or more zones. The heat-conducting anisotropic material layer is configured such that heat conductivity is lower in the direction in which the two or more zones are arrayed than in the direction intersecting the direction in which the two or more zones are arrayed. | 09-29-2011 |
20110240279 | HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE - The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal. | 10-06-2011 |
20110240280 | ALUMINUM ALLOY BRAZING SHEET AND HEAT EXCHANGER - The present invention provides an aluminum alloy brazing sheet that is applied particularly to a tube material of a heat exchanger and is excellent in brazability and erosion resistance. | 10-06-2011 |
20110247795 | SLIM TYPE HEAT DISSIPATION DEVICE - A heat dissipation device for transferring heat generated by a heat-producing element to a heat-dissipating element, includes a graphene plate, a main casing and a supporting plate. The graphene plate, in the form of relatively thin structure, has a first dissipation portion and a second dissipation portion extending from the first dissipation portion. The main casing, generally a planar structure, encloses the graphene plate therein, and has a first dissipation opening exposing the first dissipation portion of the graphene plate. The supporting plate extends integrally from the main casing in order to support the second dissipation portion of the graphene plate. The heat-producing element is inserted through the first dissipation opening in order to mount the same on the first dissipation portion of the graphene plate while the heat-dissipating element is mounted on the second dissipation portion of the graphene plate. | 10-13-2011 |
20110247796 | HEAT SINK - A heat sink includes a main body, a base formed on a bottom of the main body, and a conducting member attached to a bottom of the base. The heat exchange coefficient of the conducting member is higher than the heat exchange coefficient of the base. | 10-13-2011 |
20110247797 | Plate Heat Exchanger - The invention relates to a plate heat exchanger for treatment of a medium, comprising a number of compression-molded heat exchanger plates, which are successively provided in a plate package and which form first plate interspaces and second plate interspaces, wherein the first plate interspaces and the second plate interspaces are provided in an alternating order in the plate package, where the inlet and outlets of the heat exchanger plate located in a centre portion of the plate heat exchanger, and where the plate package is arranged between end plates on each side of the plate package, where at least one of the end plates are provided with connections in a centre portion of the at least one end plate and that the location of the connections on the at least one end plate correspond to the location of the inlet and outlets of the heat exchanger plate. To be published together with | 10-13-2011 |
20110253355 | LED LAMP RADIATOR - An LED lamp radiator comprising a generally ring-shaped upper base member; a generally ring-shaped lower base member; a plurality of fins fixedly attached to the upper base member and the lower base member, forming a generally cylindrical shape. Each of the plurality of fins having an upper portion, a middle portion and a lower portion, the upper portion being fixedly attached to a periphery of the upper base member, the lower portion being fixedly attached to a periphery of the lower base member, and the middle portion being configured for physically separating the upper base member and the lower base member. The LED lamp radiator further comprising a support plate removably secured to the upper base member, the support plate configured for supporting an LED lamp within the generally cylindrical shape formed by the upper base member, the lower base member and the plurality of fins. | 10-20-2011 |
20110253356 | Replacement Fitting and Method of Installing Same - A replacement fitting assembly for a pipe is disclosed including a split connector with a first wall portion having a first externally threaded portion and a first support portion, and a second wall portion having a second externally threaded portion and a second support portion, the first and second outer wall portions being configured to be aligned with one another to form a tubular opening, and a fastener having a side wall defining a central longitudinal opening, the side wall including an internally threaded nut portion configured to engage the first and second externally threaded portions of the connector, and an extension portion adjacent the nut portion, the side wall having a gap configured to permit lateral entry of a pipe into the longitudinal opening. A method of replacing a fitting assembly also is described. | 10-20-2011 |
20110253357 | HEAT SINK PROVIDING REDISTRIBUTED AIRFLOW THERETHROUGH - An exemplary heat sink includes elongated fins stacked together. Each of the fins includes a first dissipating portion and a second dissipating portion arranged in turn along a longitudinal axis of the fin. The first dissipating portion and the second dissipating portion of each fin are offset from each other along a stacked axis of the fins. An opening is defined in each fin between the first dissipating portion and the second dissipating portion thereof. | 10-20-2011 |
20110253358 | LAMP ASSEMBLY - A lamp assembly is provided, including a light source, a thermal module, a connecting member, and an adapter electrically connected to the light source. The thermal module includes a first thermal member and a second thermal member. The first and second thermal members respectively have a plurality of first and second fins which are arranged in a staggered manner. The second thermal member forms a plurality of through holes for heat dissipation. The light source is disposed on the second thermal member, and the connecting member connects the thermal module with the adapter. | 10-20-2011 |
20110259564 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. The breakdown voltage of the thermal conductive sheet as measured in conformity with JIS C 2110 (2010) is 10 kV/mm or more. | 10-27-2011 |
20110259565 | HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes a substrate, an electronic component mounted on the substrate, a heat dissipation member for dissipating heat generated from the electronic component, and a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component. The thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle. The thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and the thermal conductive adhesive sheet is in contact with the heat dissipation member. | 10-27-2011 |
20110259566 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more. The thermal conductive sheet does not fall off from an adherend in the initial adhesion test ( | 10-27-2011 |
20110259567 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less. | 10-27-2011 |
20110259568 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet containing a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and a glass transition point determined as the peak value of tanδ obtained by measuring a dynamic viscoelasticity of the thermal conductive sheet at a frequency of 10 Hz is 125° C. or more. | 10-27-2011 |
20110259569 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle. The proportion of the boron nitride particle content is 35 vol % or more, and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. | 10-27-2011 |
20110259570 | HEAT RADIATOR COMPOSED OF A COMBINATION OF A GRAPHITE-METAL COMPLEX AND AN ALUMINUM EXTRUDED MATERIAL - To provide a heat radiator that is useful for an LED package, high-load semiconductor, high-load capacitor or an integrated circuit board composed of a combination thereof that assumes a short lifetime and falls at high temperatures. | 10-27-2011 |
20110259571 | HYDROPHILIC COMPOSITION AND HYDROPHILIC MEMBER HAVING ANTIFUNGAL PROPERTY - The invention can provide a hydrophilic composition and a hydrophilic member having high hydrophilic property and excellent durability and high antifungal effect. | 10-27-2011 |
20110259572 | Process for producing molded product, and heat-exchange membrane element - A molded product including a film bonded to a resin frame is produced by a method including: 1) reinforcing the film with a solvent-soluble or solvent-disintegrable reinforcing layer; 2) inserting the reinforced film in an injection mold; 3) feeding a resin to the mold to attach a frame body to the reinforced film while injection molding the resin frame; and 4) treating the resulting injection molded product with a solvent to remove the reinforcing layer. This production process can establish a technique capable of bonding (integrally molding) the film solely to the frame body, regardless of the size of the film. The film may preferably be an expanded porous polytetrafluoroethylene film, and the moisture-permeable resin may preferably be combined with the expanded porous polytetrafluoroethylene film. | 10-27-2011 |
20110265979 | THERMAL INTERFACE MATERIALS WITH GOOD RELIABILITY - A composition for a highly reliable thermal interface materials includes: (A) moisture-resistant polymer with a water permeability coefficient preferably less than 10 | 11-03-2011 |
20110265980 | GRAPHITE SHEET AND HEAT TRANSFER STRUCTURE USING SAME - A graphite sheet preventing leakage of a heat radiating member when a fluid heat radiating member such as grease is used and improving heat radiation performance is provided. A graphite sheet includes a first main surface and a second main surface opposite to the first main surface and has a large anisotropic thermal conductivity in a main surface direction. The graphite sheet includes a first concave portion provided on the first main surface and having a first bottom surface, a second concave portion provided on the second main surface and having a second bottom surface, a thin film portion formed in a region in which the first bottom surface and the second bottom surface are overlapped with each other, and a connecting hole penetrating the thin film portion and allowing the first concave portion and the second concave portion to communicate with each other. | 11-03-2011 |
20110272127 | COMPACT PLATE-FIN HEAT EXCHANGER UTILIZING AN INTEGRAL HEAT TRANSFER LAYER - A heat exchanger includes a housing which maintains a first section that has a first inlet and a first outlet, and a second section that has a second inlet and a second outlet. At least one conductive plate extends between the first section and the second section, wherein the conductive plate transfers heat from a fluid flowing in one of the sections to another fluid flowing in the other of the sections. The sections may be positioned side-by-side such that the fluids' flow is coplanar, or co-curvilinear, and non-intersecting. | 11-10-2011 |
20110272128 | RADIATOR AND ELECTRONIC DEVICE HAVING THE SAME - A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube. | 11-10-2011 |
20110272129 | HEAT EXCHANGER - A heat exchanger may include a base plate for fastening to a component and a plurality of supply channels running through the base plate. The heat exchanger may also include at least one sealing element, which may be at least one of injection molded and vulcanized directly onto the base plate generating a tight connection to the component. | 11-10-2011 |
20110272130 | HEAT EXCHANGER WITH RECEIVER TANK - In a heat exchanger | 11-10-2011 |
20110277978 | SNAP-FIT TYPE HEAT SINK MODULE - A snap-fit type heat sink module includes a heat sink having at least one receiving slot, the receiving slot each including a first slot section sunken from one side surface of the heat sink and a second slot section extended from one side of the first slot section into the heat sink; and a snap-fit coupling member including a main body having a first surface and an opposite second surface, and at least one cantilever arm including a first arm section projected from the first surface for snap-fitting in the first slot section, and a second arm section extended from an end of the first arm section distant from the first surface for engaging with the second slot section. The heat sink and the coupling member can be quickly connected to each other at reduced cost by snap-fitting the cantilever arm in the receiving slot without the need of welding. | 11-17-2011 |
20110277979 | Heat Exchanger - A radiator as a heat exchanger of the invention includes: an upper tank into which a cooling water flows; a core in which fluid from the upper tank is heat-exchanged; and a lower tank that collects the fluid from the core. A baffle plate is provided inside the upper tank, the baffle plate dividing an inner space into a lower space and an upper space and provided with a communication opening that communicates between the lower space and the upper space. A bent portion bent toward the lower space is provided at each longitudinal end of the baffle plate. | 11-17-2011 |
20110277980 | MICROFINS FOR COOLING AN ULTRAMOBILE DEVICE - The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device. | 11-17-2011 |
20110284197 | Heat Exchanger - An inner fin is a wave fin having board portions extending in a pipe longitudinal direction and a top portion connecting the board portions located adjacent with each other. The wave fin has a wave-shaped cross-section perpendicularly intersecting a pipe longitudinal direction, and the board portion is bent into a waveform extending in the pipe longitudinal direction when seen from a pipe layering direction. A wave pitch WP[mm], a wave depth WD[mm], and a passage width H[mm] are set to satisfy relationships of 2.2≦WP/WD≦4.28 and 0.5≦WD/H≦1.8. | 11-24-2011 |
20110284198 | METHOD FOR JOINING COMPONENTS MADE OF A HIGH-STRENGTH ALUMINUM MATERIAL AND HEAT EXCHANGER ASSEMBLED ACCORDING TO THE METHOD - The invention relates to a method for joining components made of a high-strength aluminum material, whereby at least two components of high-strength aluminum alloys are joined by soldering, both components separated from each other by at least one aluminum layer with a lower magnesium content compared with the contact surfaces before joining is carried out, and a heat exchanger produced according to this method. | 11-24-2011 |
20110290468 | HEAT CONDUCTIVE ADHESIVE COMPOSITION AND HEAT CONDUCTIVE ADHESIVE SHEET - An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 μm or more and 300 μm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 μm or more and 20 μm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 μm and 60 μm or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 μm and 300 μm or less. | 12-01-2011 |
20110297359 | SYSTEM AND METHOD FOR ATTACHING STAINLESS STEEL SIDE PLATES TO THE COPPER/BRASS TUBES OF A HEAT EXCHANGER CORE - A system and method for attaching very thin stainless steel plates to a radiator or heat exchanger core using the CuproBraze® brazing technique. The use of thin stainless steel side plates produces the structural strength needed in the radiator or heat exchanger core assembly without adding an excessive amount of weight. Heretofore, the CuproBraze® brazing technique has not been used with stainless steel. The stainless steel radiator or heat exchanger core side plates need only be about half as thick as a copper/brass side plate to provide the strength needed for support of the radiator or heat exchanger core. | 12-08-2011 |
20110297360 | HEAT TRANSFER BETWEEN TRACER AND PIPE - A heat transfer element includes curved mounting surfaces configured to mate with an outer surface of a pipe for attachment thereto; and a channel configured to receive a tracer therein. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with heat transfer cement (HTC) to both the pipe and the tracer. A system includes a pipe and a tracer; HTC; and a heat transfer element having curved mounting surfaces configured to mate with an outer surface of the pipe and attached thereto via the HTC, and a channel in which the tracer is received and secured via HTC. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with HTC to both the pipe and the tracer. | 12-08-2011 |
20110297361 | Low Stress-Inducing Heat Sink - A low stress-inducing heat sink may reduce thermally induced stress and strain in the heat source. The low stress-inducing heat sink may be made of materials with low thermal conductivity. The heat sink may have in-plane flexibility and hence reduce thermally induced stress and strain generated in the heat source and at the interface of the heat sink and the heat source. | 12-08-2011 |
20110297362 | MICRO-CHIMNEY AND THERMOSIPHON DIE-LEVEL COOLING - A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated. | 12-08-2011 |
20110303405 | THREE PHASE FIN SURFACE COOLER - A surface cooler is provided and includes an oil layer, through which oil flows, a separating plate disposed in heat transfer communication with the oil and fins extending into an air flow pathway and being disposed in heat transfer communication with the separating plate, the fins being arranged with varied configurations at each of two or more sections sequentially defined along a predominant direction of air flow along the air flow pathway. | 12-15-2011 |
20110308781 | THERMALLY CONDUCTIVE GEL PACKS - A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. | 12-22-2011 |
20110308782 | THERMAL INTERFACE MATERIAL AND METHOD OF MAKING AND USING THE SAME - A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components. In one exemplary heat transfer material, a coupling agent having the formula: | 12-22-2011 |
20110315365 | HEAT SINK AND METHOD FOR MANUFACTURING THE SAME - A heat sink composed of a fin set and a seat and a method for manufacturing the same are disclosed. One side of the seat is provided with a plurality of rail rods whose cross sections are of a hook shape. One side of the fin set is formed with a plurality of slots corresponding to the rail rods. Thus the fin set and the seat can be assembled by engagement of the rail rods and slots. A press mold is employed to press the rail rods, thus the rail rods are deformed to make the fin set and seat tightly engage with each other. | 12-29-2011 |
20110315366 | HEAT SINK AND METHOD FOR MANUFACTURING THE SAME - A heat sink composed of a fin set and a seat and a method for manufacturing the same are disclosed. One side of the fin set is provided with a plurality of rail rods whose cross sections are of a hook shape. One side of the seat is formed with a plurality of slots corresponding to the rail rods. Thus the fin set and the seat can be assembled by engagement of the rail rods and slots. A press mold is employed to press the rail rods and the slots, thus the rail rods and slots are deformed to make the fin set and seat tightly engage with each other. | 12-29-2011 |
20110315367 | FLUID COOLED ASSEMBLY AND METHOD OF MAKING THE SAME - A method of making a fluid cooled assembly that incorporates a base that forms a partial enclosure defining an interior void space and having a top wall that has a top surface and that defines at least one opening through the top wall to the void space, the base further defining fluid entrance and exit ports into the void space, the top wall being made of material that can be friction stir welded. A lid having a size and shape substantially conformal to the opening, having a top surface and a bottom surface that defines a set of downwardly extending pins, and that is formed of a material that can be friction stir welded to the base is placed into the opening so that the lid top surface is flush with the top surface of the base top wall and friction welding the lid to the base. | 12-29-2011 |
20120000636 | CHIP COOLING DEVICE HAVING WEDGE ELEMENT - The present invention relates to a cooling device improving the heat transfer between a chip ( | 01-05-2012 |
20120000637 | PLATE, HEAT EXCHANGER AND METHOD OF MANUFACTURING A HEAT EXCHANGER | 01-05-2012 |
20120000638 | CONFINEMENT GROUP FOR A PLATE HEAT EXCHANGER, A METHOD OF OBTAINING SUCH AN EXCHANGER, AND A METHOD OF ABSORBING STRESS IN A CONFINEMENT GROUP FOR PACK-TYPE PLATE HEAT EXCHANGERS - The present disclosure relates to a confinement group for a pack-type plate heat exchanger including at least one pair of end heads ( | 01-05-2012 |
20120006520 | COOLING APPARATUS FOR A WEB DEPOSITION SYSTEM - Described are an apparatus and a method for cooling a web. The apparatus includes an inner cylinder having a void therein and configured for coupling to a gas source. The apparatus also includes an outer cylinder having an inner surface, an outer surface to support a web and apertures between the inner and outer surfaces. The outer cylinder rotates about the inner cylinder so that gas provided to the void of the inner cylinder flows through the apertures that are adjacent to the void and passes to the outer surface of the outer cylinder to increase the heat transfer between the web and the outer cylinder. The volume of gas introduced into the vacuum deposition chamber during a process run is thereby limited. Advantageously, the apparatus enables higher deposition rates and increased productivity. | 01-12-2012 |
20120006521 | Heat sink for an electronic component - Described is a heat sink for an electronic component. In at least one embodiment, the heat sink includes several cooling fins and carbon nanotubes, present between the top surface of the heat sink and the cooling fins. The carbon nanotubes extend from the top surface of the heat sink in the direction toward one of the cooling fins and are oriented at an angle to the orientation of the associated cooling fin. | 01-12-2012 |
20120006522 | IRON-BASED BRAZING FOIL AND METHOD FOR BRAZING - Disclosed are amorphous, ductile brazing foils with a composition consisting essentially of Fe | 01-12-2012 |
20120006523 | HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME - A heat exchanger having a fin member which can be easily formed by extrusion molding and warps (bends) less and configured such that an occurrence of voids at a weld portion between the fin member and a frame is suppressed. A method of manufacturing the heat exchanger is also provided. A heat exchanger has, mounted inside a frame forming an outer frame, a fin member having fins for forming flow channels for a refrigerant. The fin member is an integrally formed fin member formed by extrusion molding and is provided with a base formed in a rectangular flat plate-like shape, front side fins projecting from the front side of the base, and back side fins projecting from the back side of the base. In the fin member, the front side and the back side are not welded to the frame but the front ends of at least either the front side fins or the back side fins are welded to the frame. | 01-12-2012 |
20120012294 | HEAT SINK - A heat sink which is mounted in a movable body and which is to be exposed to a traveling air stream generated while the movable body moves includes a base and a heat dissipating portion having a plurality of fins. At least in a front end portion of the heat dissipating portion, the heat dissipating portion includes a rectifying portion provided so as to extend across a predetermined area in a longitudinal direction in front portions of slit-shaped flow paths at an upstanding end (i.e., an end apart from the base). | 01-19-2012 |
20120012295 | HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME - A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger, the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space, the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern. | 01-19-2012 |
20120018136 | UNIVERSAL CONDUCTION COOLING PLATFORM - Disclosed is an embodiment of a module for insertion between a first shelf and a second shelf of a rack based processing system. The module includes a first thermal plate substantially parallel to a second thermal plate. An inner surface of the first thermal plate faces an inner surface of the second plate and an outer surface of each of the first and second thermal plates faces opposite to the respective inner surfaces. Each thermal plate is configured to thermally couple to one or more component units locatable between the inner surfaces of the first and second thermal plates. | 01-26-2012 |
20120018137 | HEAT-DISSIPATING ASSEMBLY - A heat-dissipating assembly includes a body and a bottom plate. The body has a heat-absorbing portion. The interior of the heat-absorbing portion is provided with a chamber covered by the bottom plate. The chamber has an evaporating region for generating a high pressure, and a condensing region for generating a low pressure. The pressure gradient between the evaporating region and the condensing region is used to drive the circulation of liquid/vapor phase of a working fluid. With this structure, heat can be conducted rapidly without providing any wick structure. | 01-26-2012 |
20120018138 | HEAT SINK SYSTEM AND ASSEMBLY - A heat sink system with reduced airborne debris clogging, for cooling power electronics, the heat sink system including a heat sink having a plurality of fins, a housing configured to direct air flow around the side, top, and/or bottom of the heat sink and then through the fins of the heat sink at a back of the heat sink, and an inlet airway passage formed between a wall of the housing and said side, top, and/or bottom of the finned heat sink to allow air to pass within the housing, wherein said side, top, and/or bottom of the heat sink comprises at least one of said plurality of fins disposed directly in contact with the inlet airway passage. | 01-26-2012 |
20120024512 | HEAT SINK DEVICE AND METHOD OF REPAIRING SEMICONDUCTOR DEVICE - A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member. | 02-02-2012 |
20120024513 | COOLING STRUCTURE, HEATSINK AND COOLING METHOD OF HEAT GENERATOR - A cooling structure includes a heat dissipation structure having a heat generator and a heatsink that is adhered through an insulating adhesive layer to at least a surface of the heat generator that faces a cooling fluid and made of a metal foil having the flexibility. A fluid flow path is disposed outside of the heat dissipation structure so that the cooling fluid flowing inside thereof and the heatsink may directly come into contact. Further, a fine recess is disposed on a surface of the heatsink that directly comes into contact with the cooling fluid. | 02-02-2012 |
20120024514 | PLATE COOLING FIN WITH SLOTTED PROJECTIONS - A plate cooling fin with slotted projections comprises a plate member and projection parts on the plate member with slots disposed at the periphery of the respective projection and spacing apart from each other for the cold airflow being guided to pass through the slots and turned into a turbulent flow with eddy currents at the periphery of the cooling fin to extend the stagnation time of the airflow. As a result, more heat can be carried outward the cooling fin to enhance the heat dissipation efficiency. | 02-02-2012 |
20120031603 | IN-PLANE SILICON HEAT SPREADER AND METHOD THEREFOR - A method of dissipating heat from a heat source includes providing a plurality of heat flux paths in a plane of the heat source to remove heat from the heat source. | 02-09-2012 |
20120031604 | SYSTEM AND METHOD FOR FABRICATING THIN-FILM PHOTOVOLTAIC DEVICES - Described is a vapor trap that enables the capture of material from the condensate of a vapor. The vapor trap includes an inner module, outer module and cooling system. The inner module has a transport channel to pass a web substrate or discrete substrate, and to limit conductance of the vapor. Plenums extend from the transport channel to an outer surface of the inner module. The inner module is configured to be at a temperature that is greater than a condensation temperature of the vapor. The outer module includes collection surfaces disposed across from the outer ends of the plenums. The temperature of the collection surfaces is less that a condensation temperature of the vapor. In various embodiments, the vapor trap is a selenium trap that can be used, for example, in a copper indium gallium diselenide (CIGS) deposition system for fabrication of thin film solar cells and modules. | 02-09-2012 |
20120037351 | METHOD FOR MANUFACTURING HEAT SINK HAVING HEAT-DISSIPATING FINS AND STRUCTURE OF THE SAME - A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss. | 02-16-2012 |
20120043066 | Article for Magnetic Heat Exchange and Method for Manufacturing an Article for Magnetic Heat Exchange - An article ( | 02-23-2012 |
20120043067 | HEAT SINK CORE MEMBER AND ITS FABRICATION PROCEDURE - A heat sink core member made by: preparing a predetermined mass of aluminum block, extruding the aluminum block through an extruding machine into a tubular body having one close end wall and then punch-cutting the outside wall of the tubular body to form a plurality of densely distributed and equally spaced vertical retaining grooves. Radiation fins can easily be affixed to the vertical retaining grooves of the tubular body to form a heat sink. | 02-23-2012 |
20120055662 | Hot-Runner System having Non-Structurally Supportive Heat Insulator Including Visible Material - Hot-runner system ( | 03-08-2012 |
20120061065 | HEAT-ABSORBING STRUCTURAL MATERIAL - A heat-absorbing structural material has a sealed outside shell or container, and an internal structure in the interior space enclosed by the container. In addition the structural material has a phase-change material in the interior space, interspersed between elements of the internal structure. The internal structure provides increased strength to the structural material, allowing it to better withstand external forces placed on it. The phase change material may change from a solid to a liquid during operation of the structural material as a heat absorber, such as a heat sink. The internal structure may be made as an integral part of the structural material, formed with at least part of the container by a three-dimensional printing process, or by casting. The phase change material, such as a suitable wax, may improve heat-absorbing performance of the structural material by changing phase during heating. | 03-15-2012 |
20120061066 | ARTICLE FOR MAGNETIC HEAT EXCHANGE AND METHOD OF FABRICATING AN ARTICLE FOR MAGNETIC HEAT EXCHANGE - An article for magnetic heat exchange comprising a magnetocalorically active phase with a NaZn | 03-15-2012 |
20120061067 | Heat sink - A heat sink includes a pillar member, to which a device that generates heat is to be mounted, and a plurality of heat-dissipating fins arranged on a side surface of the pillar member to dissipate the heat generated by the device. The heat sink further includes a ring-shaped holding member that has a plurality of grooves formed therein. The holding member is mounted to a longitudinal end of the pillar member and has each of the heat-dissipating fins inserted in a corresponding one of the grooves of the holding member, thereby holding the heat-dissipating fins to the pillar member. Each of the heat-dissipating fins has a detachment prevention portion that prevents the heat-dissipating fin from being detached from the pillar member in a direction perpendicular to the longitudinal direction of the pillar member. | 03-15-2012 |
20120067558 | THERMAL EXCHANGE DEVICE WITH INCREASED THERMAL EXCHANGE COEFFICIENT AND METHOD FOR PRODUCTION OF SUCH A DEVICE - A heat exchange device including a first surface configured to be in contact with a source of heat to be discharged and a second surface configured to be in contact with a coolant. The device includes a plurality of recesses fluidically insulated from one another, each recess leading onto the second surface via at least one channel, each channel having a length and a transverse size that prevents the coolant from entering the recess. The second surface has better wettability properties with respect to the coolant and the inner surfaces of the channels and the recesses have wettability properties less than or equal to those of the second surface. | 03-22-2012 |
20120073795 | THIN FILM COMPOSITE HEAT EXCHANGERS - The invention generally relates to thin film composite heat exchangers and methods of making thin film composite heat exchangers. The heat exchangers can be made with polymers or other materials including, but not limited to, inorganic materials such as silicon, clay, ceramic, brick, or metal. Heat exchangers in accordance with the invention may be made of a material that is non-corrosive, durable, and that may be applied in a thin coating so as to minimize resistance to heat transfer and material costs. | 03-29-2012 |
20120073796 | ALUMINUM ALLOY FOR DIE CASTINGS AND PRODUCTION PROCESS OF ALUMINUM ALLOY CASTINGS - The present invention provides an aluminum alloy for die castings that has superior castability and corrosion resistance. The amounts of Mn, Fe and Cu contained in the aluminum alloy components for die castings were determined to have a considerable effect on the corrosion resistance of the aluminum alloy. Therefore, the aluminum alloy for die castings of the present invention contains 9.0 to 12.0% by weight of Si, 0.20 to 0.80% by weight of Mg, and 0.7 to 1.1% by weight of Mn+Fe, the Mn/Fe ratio is 1.5 or more, the amount of Cu as impurity is controlled to 0.5% by weight or less, and the remainder is composed of aluminum and unavoidable impurities. | 03-29-2012 |
20120080175 | Manifolding Arrangement for a Modular Heat-Exchange Apparatus - A heat-exchanger module that conveys a fluid through one or more heat exchangers with little or no pressure drop is presented. The heat-exchanger module comprises a first manifold that smoothly channels the fluid from a fluid source to each of the heat exchangers. The heat-exchanger module further comprises a second manifold that smoothly channels the fluid from the heat exchangers to a fluid sink. The manifolds are dimensioned and arranged to mitigate development of pressure drops in the fluid flow. | 04-05-2012 |
20120080176 | HIGH-POWER FINNED HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more and are suitable for cooling high-power electronic components. | 04-05-2012 |
20120080177 | HIGH-POWER FINLESS HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more is suitable for cooling down high-power electronic components. | 04-05-2012 |
20120085525 | HEAT SPREADER FACET PLANE APPARATUS - The invention provides an apparatus for dissipating heat produced by a laser for lighting projection to enable a passive encapsulated enclosure. The laser is mounted into a collar system which integrates to the internal enclosure body with a single or plurality of bonded extending facet planes. The facet planes can conduct and radiate heat to the internal enclosure body planes which dissipate heat to the outside environment of the closed enclosure as a heat sink. | 04-12-2012 |
20120085526 | HEAT SINK - A heat sink has a stand and a nano-carbon film. The stand is made of a strong and thermally conductive material and includes a lower surface, two sides and two sidewalls. The sidewalls are respectively formed on the sides of the stand. The nano-carbon film can provide excellent heat dissipation effect, is formed on the lower surface of the stand and includes at least one hole. The heat sink is mounted in an electronic device to make the stand contact electronic components through the hole of the nano-carbon film. Therefore, the heat generated by the electronic components can be dissipated by both the stand and the nano-carbon film. Besides, the heat sink is small in size so that it can be applied to small electronic devices. Moreover, the stand can hold the input unit and structurally reinforce the housing of the electronic device. | 04-12-2012 |
20120085527 | HEAT SPREADER WITH MECHANICALLY SECURED HEAT COUPLING ELEMENT - A heat spreader for dissipating heat generated by at least one heat-generating power semiconductor device. Such a heat spreader comprises a base plate ( | 04-12-2012 |
20120090824 | Heat plate with clip - A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved. | 04-19-2012 |
20120090825 | NANOFIBER COVERED MICRO COMPONENTS AND METHODS FOR MICRO COMPONENT COOLING - A device including a micro component having an external surface and a permeable nanofiber covering on at least a portion of the external surface of the micro component. A cooled micro component system further includes a droplet spray system for spraying liquid droplets onto the nanofiber covering to cool the micro component. In an example method for cooling a micro component, droplet spray is directed onto a nanofiber covering that covers at least a portion of the micro component. The directing is controlled to permit efficient spreading and evaporation of liquid permeating the nanofiber covering. In example embodiments nanofibers of the permeable nanofiber covering are metalized to provide a rougher surface (e.g., a nano-textured metal layer). | 04-19-2012 |
20120097382 | HEATING EXCHANGE CHAMBER FOR LIQUID STATE COOLING FLUID - A heat exchange chamber for liquid state cooling fluid is provided, which comprises a thermal dissipation device, and the thermal dissipation device sites in a cavity of the heat exchange chamber for liquid state cooling fluid. The thermal dissipation device comprises a plate and a plurality of heat dissipating fins formed on the plate, and the thermal dissipation device comprises at least one groove. After flowing through the heat dissipating fins, partial cooling fluid absorbs the heat of the heat dissipating fins and gasifies to bubbles. The design of the groove could discharge the bubbles trapped between heat dissipating fins helpfully and improve the efficiency of heat dissipation. | 04-26-2012 |
20120103588 | HEAT-DISSIPATING SUBSTRATE - Disclosed herein is a heat-dissipating substrate in order to improve heat-dissipating characteristics. The heat-dissipating substrate, comprising: a copper layer having a predetermined thickness; anodized insulating layers formed on upper and lower surfaces of the copper layer; and aluminum (Al) layers formed between the copper layer and the anodized insulating layer. Therefore, a heat-dissipating function of the base made of the aluminum (Al) layer and the copper (Cu) layer is improved, thereby making it possible to provide a high-output metal substrate appropriate for high-integration/high capacity electronic components. | 05-03-2012 |
20120103589 | HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE - Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized. | 05-03-2012 |
20120111553 | HEAT SPREADING DEVICE AND METHOD THEREFORE - A heat spreading device of thermo siphon, the device comprising sectioning forming a first chamber portion and a second chamber portion, first plurality of conduits, and second at least two conduits, the second at least two conduits providing interconnection of the first and second chamber portions is disclosed. Integral parts/portions are provided, such as cavities, barrier and fins. | 05-10-2012 |
20120118549 | Heat Conducting Composite Materials, Systems and Methods For Manufacturing The Same - In one embodiment, a heat conducting composite material may include a bulk material, a conduit, and a conduit material. The bulk material forms a shaped body having a heat introduction portion and a heat dissipation portion. The conduit is disposed in the bulk material and connects the heat introduction portion to the heat dissipation portion. The conduit material is disposed within and fills the conduit. The bulk material thermal conductivity of the bulk material is about equal to a conduit material thermal conductivity of the conduit material at an activation temperature. The bulk material thermal conductivity is less than or equal to the conduit material thermal conductivity throughout an activation temperature range. The bulk material thermal conductivity is greater than or equal to the conduit material thermal conductivity throughout a deactivation temperature range. | 05-17-2012 |
20120118550 | HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURE THEREOF - A heat dissipating device and a method of fabricating thereof, the device comprising a first base adapted to be placed in contact with a heat emitter and first heat-dissipating fins extending from the first base on at least part of a periphery of the first base. The method comprises providing a first sheet of heat conductive and mechanically resistant material; cutting, out of the first sheet of material, a first piece comprising a first central part and first tabs extending radially from the first central part; and erecting the first tabs up from the first central part. | 05-17-2012 |
20120118551 | Heat Transfer Interface And Method Of Improving Heat Transfer - An embodiment of a heat transfer interface includes a solid material having first and second surfaces, and a nanotube forest covering at least a portion of the first surface, In operation in a heat exchanger, the heat transfer interface transmits heat from a first side to a second side of the heat transfer interface. An embodiment of a method of improving heat transfer in a heat exchanger includes applying a nanotube forest to a heat transfer surface of a heat transfer interface and installing the heat transfer interface in the heat exchanger. | 05-17-2012 |
20120118552 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS - The device for extracting heat from carbon nanotubes wires or cables used under high power applications is provided. The device can include a thermally conductive member for placement against a heat source and for directing heat away from the heat source to a heat dissipating medium. The device can further include an electrically conductive member positioned on the thermally conductive member and made from a layer of carbon nanotubes, to reduce electrical resistance along the electrically conductive member. A geometric pattern can be imparted to the electrically conductive member to enhance dissipation of heat away from the thermally conductive member and the heat source. | 05-17-2012 |
20120125588 | HEAT DISSIPATION PLATE FOR PROJECTION-TYPE IC PACKAGE - The present invention relates to a heat dissipation plate for a projection-type integration circuit (IC) package, which is installed to be adhered and fixed to a projection-type IC package in which an integration circuit in a board is formed to project, so as to dissipate heat generated by the integrated circuit, including: a fixed plate adhered and fixed to the projection-type IC package; and heat dissipation fins (cooling fins) formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove that accommodates the integrated circuit is formed in a rear surface of the fixed plate, and the accommodation groove is formed to have a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove. Therefore, there are advantages in that the heat dissipation plate can enhance not only heat dissipation efficiency but also adhesion performance by increasing the contact area with the projection-type IC package, and simultaneously can be simply produced, thereby reducing production costs. | 05-24-2012 |
20120125589 | HEAT SINK - A heat sink allowing circuit elements to be simply coupled thereto and allowing a size and a thickness thereof to be adjusted according to the number and capacity of circuit elements. The heat sink includes: a support plate; a plurality of heat radiation pins vertically protruded from one surface of the support plate; an element insertion groove formed to be depressed in a longitudinal direction from the other surface of the support plate; and element support parts formed to be protruded from the element insertion groove and supporting a circuit element. The circuit element slides and is coupled thereto. In addition, the circuit element is freely moved, thereby making it possible to simply correct mounting position. | 05-24-2012 |
20120125590 | TEMPERATURE CONTROL MEDIUM AND TEMPERATURE CONTROL METHOD - A temperature control medium is formed of a liquid and solid particles, the solid particles containing carbon particles. The amount of carbon in the temperature control medium is preferably less than 20% by weight. The carbon particles may contain synthetic graphite, natural graphite, soot, carbon fibers, graphite fibers or expanded graphite or a mixture of at least two of these elements. | 05-24-2012 |
20120125591 | HEAT RADIATING FIN - A heat radiating fin includes a flat body having a front side and a rear side, a plurality of protruded portions formed on the front side of the flat body, and a plurality of recessed portions correspondingly formed on the rear side of the flat body behind the protruded portions. The protruded portions on the flat body of a first heat radiating fin are partially extendable into corresponding recessed portions on the flat body of a second heat radiating fin located before the first one, allowing the first and the second heat radiating fins to be easily and stably stacked. | 05-24-2012 |
20120132408 | Heat Dissipating Chassis for Handheld Battery Operated Device - A heat sink for a handheld device is found as a one piece chassis for supporting heat-producing circuits inside the device while having heat radiating surfaces outside the device. In another embodiment a battery pack control circuit under microprocessor control allows battery packs having different battery chemistries and characteristics to be interchanged in the same device without switches or adapters. Control of operating modes of the device despite changes in the battery pack including battery chemistry, state of charge, available voltage, or desired operating mode are automatic. The microprocessor measures the battery pack characteristics, using look up tables in a suitable program to adjust the circuit operating modes. The microprocessor also responds to sequential switch contact closures in setting operating modes. | 05-31-2012 |
20120132409 | HEAT-DISSIPATING DEVICE - An exemplary heat-dissipating device includes a base having a first surface, and a number of fins extending from the first surface. Each fin includes a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface. | 05-31-2012 |
20120132410 | HEAT SINK FIN FORMING PROCESS - Some example embodiments relate to a heat sink fin that has a first substrate. The first substrate includes a first angular dimple and a first micro air channel in fluid communication with the first angular dimple. The first angular dimple includes a first surface that forms an angle relative to a first plane of the first substrate. The first angular dimple includes a first micro diameter hole in fluid communication with the first angular dimple. The heat sink fin also has a second substrate folded against the first substrate. The second substrate includes a second angular dimple and a second micro air channel in fluid communication with the second angular dimple. The second angular dimple includes a second surface that forms an angle relative to a second plane of the second substrate. The second angular dimple includes a second micro diameter hole in fluid communication with the second angular dimple. | 05-31-2012 |
20120138283 | FOLDED FIN HEAT SINK - In one embodiment, a heat sink comprising a folded fin is disclosed. The folded fin comprises a base portion, an offset portion extending away from the base portion, the offset portion having a width, a narrowing tapering portion having a maximum width equal to the width of the offset portion, and an extension portion extending away from the narrowing tapering portion, the extension portion having a width smaller than the width of the offset portion. | 06-07-2012 |
20120138284 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device. | 06-07-2012 |
20120145374 | HEAT SINK - An exemplary heat sink includes a base plate and a fin unit including a plurality of fins arranged on the base plate. One of the base plate and fin unit includes a protruding member, and the other one of the base plate and the fin unit defines a groove corresponding to the protruding member. The protruding member is interferingly fitted in the groove thereby connecting the fin unit and the base plate together. | 06-14-2012 |
20120152509 | HEAT SINK - A heat sink includes a substrate, a first heat dissipation body, and a second heat dissipation. The first heat dissipation body includes a first base plate attached to the substrate, and a number of first cooling fins extending from the first base plate. The second heat dissipation body includes a second base plate attached to tops of first cooling fins and a number of second cooling fins extending from the second base plate. | 06-21-2012 |
20120152510 | BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND COOLING UNIT USING THE SAME - A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source. | 06-21-2012 |
20120160466 | SURFACE COOLER HAVING CHANNELED FINS - A surface cooler includes a base plate, and at least one fin element extending from the base plate. The at least one fin element includes an outer surface portion that is configured and disposed to be in direct contact with a first fluid and an inner surface portion that is configured and disposed to be in direct contact with a second fluid. The at least one fin element defines a primary heat exchange member that is configured and disposed to facilitate an exchange of heat between the first and second fluids. | 06-28-2012 |
20120160467 | HEAT SINK AND ASSEMBLY METHOD THEREOF - An exemplary heat sink includes a base plate and a fin unit including fins stacked together and arranged on the base plate. The base plate includes two fixing portions extending upward from a top surface thereof. Each of the fixing portions defines a groove therein. Each of the fins includes a main body and two fixing strips extending from two opposite sides of the main body. The fixing strips of the fins contact each other to cooperatively form two protruding members of the fin unit, the protruding members correspond to the grooves of the fixing portions of the base plate, respectively, and the protruding portions are interference fitted in the grooves, whereby the fin unit and the base plate are connected together. | 06-28-2012 |
20120160468 | Local Thermal Management - An apparatus and a method for thermal management of a component in a first region, wherein an interconnector connects the component thermally to a second heat region, wherein a thermally conducting heat shield encloses the interconnector from a position within the first region in close proximity to the component to the second region, and that at least one heat unit is thermally connected to the interconnector within the second region. The heat units may be heat sources and/or heat sinks, and the invention may manage the component at a higher or lower temperature than the surrounding first region. When heat enters the heat shield from a hot surrounding first region, e.g. hot gas, the heat shield conducts heat more efficiently than the medium encapsulated by the heat shield. Thus, the heat tends to follow the path provided by the heat shield. Areas of use include providing efficient particle deposition by thermophoresis or heat a component in a cold environment. | 06-28-2012 |
20120168137 | COMPRESSED NATURAL GAS (CNG) SUB-COOLING SYSTEM FOR CNG-FILLING STATIONS - The present invention is referred to a compressed natural gas (CNG) sub-cooling system for CNG-filling stations, comprising a CNG inlet pipeline coming from the CNG compressor, a set of coils connected to an expansion heat exchanger capable of creating a Joule-Thomson cooling effect on the gas, both coils are immersed in a heat exchange facilitator solution and are also connected to outlet valves which in turn are connected to feeding hoses of a charging station. | 07-05-2012 |
20120181008 | HEAT SINK CLIP DEVICE - A heat sink clip device, configured to secure a heat sink to a heat generating unit, the heat sink clip comprises a thermal conductive board and a plurality of locking members. The thermal conductive board is attached to the heat generating unit. The thermal conductive board may include a plurality of connecting apertures. Each connecting aperture may include a bigger diameter portion and a smaller diameter portion connected with the bigger diameter portion. A plurality of locking members may be engaged with the corresponding connecting aperture. Each locking members may include a threaded member and an elastic unit sheathed on the threaded member. The threaded member may include a bar portion, a head portion and a blocking ring. The head portion and the blocking ring are respectively on both sides of the bar portion. The diameter of the bar portion may be a little bit smaller than the size of the smaller diameter portion. The outside diameter of the blocking ring may be a little bit smaller than the size of the bigger diameter portion. The inside diameter of the elastic unit may be a little bit bigger than the outside diameter of the blocking ring. The bar portion and the blocking ring may go through the bigger diameter portion and then may be secured to the smaller diameter portion. The elastic unit may be suppressed between the threaded member head and the thermal conductive board. This creates a heat sink clip device. | 07-19-2012 |
20120186799 | Laminating Heat Sink Having Enhanced Heat Dissipation Capacity - A laminating heat sink includes a first heatsink plate, at least one second heatsink plate overlapping the first heatsink plate, and a plurality of fixing bars each extended through the first heatsink plate and the second heatsink plate to combine and fix the first heatsink plate and the second heatsink plate. The first heatsink plate has a first side combining a heat source and a second side abutting the second heatsink plate. Thus, each of the fixing bars is extended through the first heatsink plate and the second heatsink plate so that the heat produced by the heat source is directly introduced by the fixing bars and is transferred through the first heatsink plate and the second heatsink plate easily and quickly so as to achieve a quick heat dissipation effect. | 07-26-2012 |
20120186800 | HEAT SINK FOR ELECTRONIC DEVICE AND PROCESS FOR PRODUCTION THEREOF - A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer. | 07-26-2012 |
20120193083 | HEAT EXCHANGER ASSEMBLY WITH FIN LOCATING STRUCTURE - A heat exchanger includes a core with layers and a closure bar. The layers are arranged in a stack and include a first layer that is separated from abutting layers by a first parting sheet and a second parting sheet. Fins are disposed between the first and second parting sheets and form one or more tabs. The closure bar interfaces with the fins and receives the one or more tabs in one or more slots. | 08-02-2012 |
20120193084 | PURE TITANIUM SHEET EXCELLENT IN BALANCE BETWEEN STAMPING FORMABILITY AND STRENGTH - Disclosed is a pure titanium sheet having a strength corresponding to JIS Grade 2 level (215 MPa in terms of 0.2% yield strength) or more and having satisfactory stamping formability. The pure titanium sheet includes titanium and inevitable impurities, has a 0.2% yield strength of 215 MPa or more, has an average grain size d of its structure of 25 μm or more and 75 μm or less, and has a hexagonal crystal structure, in which respective grains in the hexagonal crystal structure have an average of Schmidt factors (SF) of (11-22) twins with a rolling direction as axes, and the average Schmidt factor (SF) and the average grain size d satisfy following Expression (1): | 08-02-2012 |
20120193085 | HEATSINK FOR LED ARRAY LIGHT - A heatsink that includes a plurality of thermally conductive plates coupled to each other in a stacked configuration. Each plate includes a core section and a plurality of protrusions extending radially outwardly from the core section in a direction substantially parallel to the core section. The core section of each plate is in direct contact with the core section of an adjacent plate. | 08-02-2012 |
20120199333 | CUSTOMIZED THERMAL INTERFACE TO OPTIMIZE MECHANICAL LOADING AND THERMAL CONDUCTIVITY CHARACTERISTICS - A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed. | 08-09-2012 |
20120199334 | HEAT EXCHANGER WITH FOAM FINS - Heat exchangers are described that employ fins made of a heat conducting foam material to enhance heat transfer. The foam fins can be used in any type of heat exchanger including, but not limited to, a plate-fin heat exchanger, a plate-frame heat exchanger or a shell-and-tube heat exchanger. The heat exchangers employing foam fins described herein are highly efficient, inexpensive to build, and corrosion resistant. The described heat exchangers can be used in a variety of applications, including but not limited to, low thermal driving force applications, power generation applications, and non-power generation applications such as refrigeration and cryogenics. The fins can be made from any thermally conductive foam material including, but not limited to, graphite foam or metal foam. | 08-09-2012 |
20120199335 | RADIAL-FLOW HEAT EXCHANGER WITH FOAM HEAT EXCHANGE FINS - A radial flow plate-fin heat exchanger includes a plurality of heat exchange units connected together to form an annular shaped core. The core has a plurality of first fluid passageways that are circumferentially spaced from one another and that extend generally axially from a first end of the core to a second end. Each of the first fluid passageways is defined at least in part by a plurality of fins that include graphite foam. The core also has a plurality of second fluid passageways that are circumferentially spaced from one another and that extend generally radially from the central fluid passageway through an exterior wall of the core. The second fluid passageways are separated from the first fluid passageways so that a first fluid that flows through the first fluid passageways does not mix with a second fluid that flows through the second fluid passageways. | 08-09-2012 |
20120199336 | HEAT SINK WITH COLUMNAR HEAT DISSIPATING STRUCTURE - A heat sink includes a base and a heat dissipating structure composed of columnar heat dissipating units integrally formed on the base. Air stream gaps communicating with the dissipating units, each having opposite first and second sides, are formed. The first side is an arced surface structure, and the second side has a flow-guide projection. Furthermore, the dissipating units facing the same direction are arranged in an array. Alternatively, first sides of the outermost layer of the dissipating units face directions away from the inner layer of the dissipating units, and the corresponding directions of the first sides of the dissipating units from the outer to inner layers gradually deflect. The air streams flowing in various directions have the higher possibility of entering the dissipating structure and are dispersed. Thus, the time and possibility for the air to contact the dissipating units are increased, and the dissipation efficiency is increased. | 08-09-2012 |
20120199337 | Heat Sink for Dissipating a Thermal Load - A heat sink for dissipating a thermal load is disclosed that includes one or more heat sink bases configured around a central axis of the heat sink so as to define an interior space, at least one heat sink base receiving the thermal load, a thermal transport connected to the at least one heat sink base receiving the thermal load so as to distribute the thermal load in the heat sink, and heat-dissipating fins connected to each heat sink base, the heat-dissipating fins extending from each heat sink base into the interior space of the heat sink, each heat-dissipating fin shaped according to the location of the heat-dissipating fin with respect to the location of the thermal load and the location of the distributed thermal load in the heat sink. | 08-09-2012 |
20120211211 | HEAT SINK EQUIPPED WITH A VAPOR CHAMBER - A heat sink equipped with a vapor chamber includes a heat conduction plate and a vapor chamber. The heat conduction plate has one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion. The two fastening portions are interposed by a recess to bond the vapor chamber. Each fastening portion is fastened to a printed circuit board through at least one screw to allow the vapor chamber to contact a heat generation element. The fastening portion is integrally formed at a desired thickness, thus has sufficient strength to withstand the fastening force of the screw to prevent tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate. Thereby the vapor chamber can smoothly contact the heat generation element to rapidly transfer heat outside. | 08-23-2012 |
20120211212 | HEAT SINK AND MANUFACTURING METHOD OF POROUS GRAPHITE - A heat sink using porous graphite having graphite particle-stacked porous graphite is provided. The heat sink may provide good heat conductivity and improve strength of carbon foam. Also, a manufacturing method of porous graphite is provided. | 08-23-2012 |
20120211213 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a laminated body disposed in a flow path for circulating a refrigerant. The laminated body includes a metallic tube body enclosing the flow path therein, an insulation layer formed on a periphery of the tube body, and a conductor that is formed on a periphery of the insulation layer and includes a bonding surface bonded to an electrode of a semiconductor device to be cooled. | 08-23-2012 |
20120211214 | Heatsink Device and Method - A heatsink device and methods for manufacturing and using same. The heatsink device includes a plurality of heatsink fins that extend from a heatsink base. Each heatsink fin has a distal end region and a proximal end region disposed adjacent to the heatsink base. A fin width of each heatsink fin progressively decreases from the proximal end region to the distal end region in accordance with a parabolic profile such that opposing fin profiles of adjacent heatsink fins define an air space that is parabolic. The parabolic chamfer advantageously promotes full heat flow from the heatsink base to the heatsink fins and removes more heat than conventional heatsink devices. When applied in conjunction with a heat-generating component, the heatsink can enable the heat-generating component to operate at a lower stabilized component temperature. Accordingly, the performance, reliability, safety, and operational lifetime of the heat-generating component can be increased. | 08-23-2012 |
20120211215 | VAPOR COOLING HEAT EXCHANGER - A vapor cooling heat exchanger is provided with: a partition wall for partitioning path for a fluid to be cooled through which a fluid to be cooled flows, and path for a refrigerant through which a refrigerant for cooling the fluid to be cooled flows; and fins which are disposed within path for a fluid to be cooled, and which is thermally connected to the partition wall. The fins constitute a first fin and a second fin, the local heat flux of which on the partition wall is smaller than the first fin. The first fin and the second fin are arranged on the basis of the relationship between the local heat flux on the partition wall and the heat flux limit of the refrigerant. As a consequence, the occurrence of local burn-out on the vapor cooling heat exchanger is suppressed. | 08-23-2012 |
20120216996 | THERMAL MODULE AND METHOD OF MANUFACTURING SAME - A thermal module and a method of manufacturing same are disclosed. The thermal module includes a radiating fin assembly and a base. The base has a bottom and a plurality of slot vertically extending through the base in a thickness direction thereof. The radiating fin assembly includes a plurality of radiating fins, each of which has a heat-dissipation end and a heat-absorption end. The heat-absorption ends are correspondingly extended through the slots and bent to bear on the bottom for contacting with a heat-producing element. Heat produced by the heat-producing element is absorbed by the heat-absorption ends and directly transferred from the heat-absorption ends to the heat-dissipation ends without the problem of thermal resistance. Therefore, upgraded heat transfer efficiency and excellent heat dissipation effect can be achieved with the thermal module. | 08-30-2012 |
20120216997 | COMPOSITE PLATING LIQUID - In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method. | 08-30-2012 |
20120222850 | HEAT EXCHANGER END CAP - A heat exchanger assembly, such as a condenser, may employ a portion of a heat exchanger end tank to define a slot with a second portion of the end tank. The first and second portions define an interior volume of the end tank. A flared end of a side plate may reside within the slot and may have a straight portion having a first width, a first step portion having a second width that is wider than the first width, and a second step portion that has a third width that is wider than the second width. The flared end may have a tab that protrudes from the second step portion and that is symmetrical about a longitudinal axis of the side plate. The end tank may define a second slot where the tab resides when the flared end resides over an entire cross-sectional portion of a volume defined by end tank. | 09-06-2012 |
20120227948 | HEAT SINK FIN STRUCTURE - A heat sink fin structure includes a fin assembly and a protection unit. The fin assembly includes multiple radiating fins and an outside radiating fin. The outside radiating fin has a first main body. The protection unit has a second main body. | 09-13-2012 |
20120227949 | AERODYNAMIC HEAT EXCHANGE STRUCTURE - The present invention relates to heat exchangers, and more particularly to a heat exchange structure configured to operate in an air stream. In one embodiment, a heat exchange structure configured to operate in an air stream includes coolant flow portions, each of the coolant flow portions having at least one substantially closed surface directed into the air stream; and air flow portions disposed between adjacent coolant flow portions for receiving air from the air stream, the air flow portions having air passages directed into the air stream; the substantially closed surface of the coolant flow portions having an aerodynamic shape. | 09-13-2012 |
20120227950 | FREE AIR STREAM HEAT EXCHANGER DESIGN - The present invention relates to heat exchangers, and more particularly to a heat exchange apparatus configured to operate in a free air stream. In an embodiment, a heat exchange apparatus configured to operate in a free air stream includes a heat exchange structure having a shape configured to conform to a body of a vehicle when in a stowed condition; and a deployment mechanism for moving the heat exchange structure to a deployed condition external to the vehicle. The heat exchange structure has a curved surface that is concave into the air stream when the heat exchange structure is in the deployed condition. | 09-13-2012 |
20120227951 | HEAT TRANSFER BETWEEN TRACER AND PIPE - A heat transfer element includes curved mounting surfaces configured to mate with an outer surface of a pipe for attachment thereto; and a channel configured to receive a tracer therein. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with heat transfer cement (HTC) to both the pipe and the tracer. A system includes a pipe and a tracer; HTC; and a heat transfer element having curved mounting surfaces configured to mate with an outer surface of the pipe and attached thereto via the HTC, and a channel in which the tracer is received and secured via HTC. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with HTC to both the pipe and the tracer. | 09-13-2012 |
20120227952 | RADIATOR AND METHOD OF MANUFACTURING RADIATOR - A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other. | 09-13-2012 |
20120234524 | HIGH THERMAL CONDUCTIVITY/LOW COEFFICIENT OF THERMAL EXPANSION COMPOSITES - A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material. | 09-20-2012 |
20120234525 | HEAT SPREADER FOR PLASMA DISPLAY PANEL - The invention presented is a method for applying heat spreaders to a plurality of plasma display panels, including (a) providing a plurality of heat spreader composites, each of which comprises a heat spreader material having an adhesive thereon and a release material positioned such that the adhesive is sandwiched between the heat spreader material and the release material; (b) removing the release material from a plurality of the composites; and (c) applying at least one of the composites to each of the plurality of plasma display panels each such that the adhesive adheres the heat spreader material to the plasma display panel. | 09-20-2012 |
20120241138 | INSULATING DEVICE AND METHOD FOR PRODUCING AN INSULATING DEVICE - An insulating device for an electrochemical energy storage unit is provided, wherein the insulating device includes a cooling plate that comprises at least one opening. A contact rail is provided for dissipating heat and a retaining element for fixing an arrangement between the cooling plate and the contact rail and has a shaft extending through the opening of the cooling plate, and a first intermediate space is defined by a distance between a wall of the opening and the shaft and/or a second intermediate space is defined by a distance between an edge of the contact rail and the shaft. A connecting element having a surface including an electrically insulating material is disposed between a main surface of the cooling plate and a surface of the contact rail, and a partial region thereof protrudes into the first and/or the second intermediate space. | 09-27-2012 |
20120255717 | LED HEAT-DISSIPATION STRUCTURE FOR MATRIX LED LAMP - An improved heat-dissipation structure for a matrix LED lamp is disclosed. The heat-dissipation structure is a plate-shaped metal hood configured to hold an LED matrix module for heat dissipation so as to maintain the entire matrix LED lamp cool. The heat-dissipation structure is a plate-shaped metal shell having a plurality of threaded holes allowing the LED matrix module to be fixed thereto. In virtue of the tight contact between the bottom of the LED matrix module and the plate-shaped metal hood, heat generated by the LED matrix module can be quickly absorbed and dissipated by the plate-shaped metal hood, so as to prevent the LED matrix module from premature aging, thereby enlightening the service life of the LED matrix module. | 10-11-2012 |
20120255718 | METHOD OF MACHINING CARBON AND GRAPHITE FOAMS - A method for fabricating a solid foam article from a solid foam blank includes the steps of forming a pilot hole in the solid foam blank; positioning a chisel in the pilot hole, the chisel having a cutting portion and a shaft; and directing the cutting portion into the pilot hole in a reciprocating motion to remove solid foam material surrounding the pilot hole. A system for forming articles from solid foam blanks and a heat exchange device are also disclosed. | 10-11-2012 |
20120255719 | CERAMIC HEAT SINK MODULE AND MANUFACTURING METHOD THEREOF - A ceramic heat sink module for lowering a temperature of a heating element is disclosed. The ceramic heat sink module includes a ceramic heat sink module body, wherein a composition of the ceramic heat sink module body includes at least 70% by weight aluminium oxide. | 10-11-2012 |
20120261105 | LED HEAT SINK AND MANUFACTURING METHOD THEREOF - An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink. | 10-18-2012 |
20120261106 | Non-Isotropic Structures for Heat Exchangers and Reactors - A Non-Isotropic Structure for a Heat Exchanger (NISHEX) that forms fins from nested woven wire meshes. The wire meshes are shaped into channels that are stacked on top of each other to produce a non-isotropic fin structure having multiple fin layers. The fin structure exhibits a high heat coefficient while maintaining relatively high fin efficiency through the selection of fin lengths in proportion to the wire diameter in the mesh fins. | 10-18-2012 |
20120261107 | DEVICE FOR COOLING BATTERIES - A device for cooling batteries includes a cooling plate for receiving at least one battery thereon and at least one heat transfer element in heat transfer relationship with the cooling plate. A mechanical stress produced by a contact force causes the at least one heat transfer element to thermally abut the cooling plate. | 10-18-2012 |
20120261108 | COUPLING SYSTEM BETWEEN A WASTE-HEAT GENERATOR AND A WASTE-HEAT RECEIVER - A coupling system as a thermal interface between a waste-heat generator and a waste-heat receiver includes a first body having a first contact area, and a second body having a second contact area, with the first and second contact areas abutting one another for heat exchange. A tongue and groove connection having at least one tongue and at least one groove extends in a longitudinal direction for connecting and tensioning the first and second contact areas. | 10-18-2012 |
20120273180 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a tubular body having a first open end, and a plurality of heat dissipating fins, each having a fin body and a first engaging portion formed on the fin body for engaging the first open end of the tubular body in a manner that the heat dissipating fins are disposed to radiate from and to surround the tubular body. The first engaging portion includes a first extension section bent from the fin body, and a first hook extending from the first extension section for hooking onto the tubular body at the first open end. | 11-01-2012 |
20120273181 | LOW TEMPERATURE THERMAL CONDUCTOR - A thermal conductor material having excellent heat transfer properties by obtaining high thermal conductivity even at low temperature of, for example, a liquid nitrogen temperature (77 K) or lower is to provide. A thermal conductor to be used at low temperature of 77 K or lower in the magnetic field of a magnetic flux density of 1 T or more, includes aluminum which has a purity of 99.999% by mass or more and also has the content of iron of 1 ppm by mass or less. | 11-01-2012 |
20120273182 | FIN MEMBER FOR HEAT EXCHANGER - A fin member for a heat exchanger is produced by repeatedly folding a plate over itself into a corrugated shape to form corrugated fins. The folded sections which are formed by the folding are pressed and deformed into a recessed shape to form engagement recesses. A pipe member through which fluid flows is disposed at the engagement recesses. The pressing and deformation of the engagement recesses cause swollen sections to protrude at both sides of each folded section with respect to the folding-over direction of the folded section and form flat butt surfaces at the tips of the swollen sections. Adjacent butt surfaces are caused to be in surface contact with each other with the pipe member disposed at the engagement recesses. | 11-01-2012 |
20120279696 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a plate and a pair of flanges extending from the plate. Each flange includes a first section extending perpendicularly away from the plate, a third section extending perpendicularly towards the plate and a second section interconnecting the first section and the third section. The first section is parallel to the third section and the second section is parallel to the plate. Three channels are defined by the first flange, the second flange and the plate for allowing airflow to flow through the fins. | 11-08-2012 |
20120279697 | THERMAL INTERFACE MATERIAL WITH PHENYL ESTER - A thermal interface material comprises a phenyl ester and a thermally conductive filler. The material optionally contains an epoxy resin derived from nutshell oil or an epoxidized dimer fatty acid. | 11-08-2012 |
20120285672 | Structure of Heat Sink - An improved structure of heat sink, which comprising: a heat conduction layer and cooling fins; the heat conduction layer of an elongated shape is designed in a manner that a heat source is incorporated into the central zone, and convection holes with equidistant arrangement are distributed peripherally; every convection hole is of obround shape and located in parallel with the long side of the heat conduction layer; the cooling fins are arranged into sheets and attached below the heat conduction layer, with the length the same as the long side of the heat conduction layer, namely, the cooling, fins are arranged in parallel with the long side of the heat conduction layer. | 11-15-2012 |
20120285673 | NANOSTRUCTURED COMPOSITE POLYMER THERMAL/ELECTRICAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME - An exemplary embodiment of the present invention provides a thermal interface material for providing thermal communication between a heat sink and a heat source. The thermal interface material comprises a plurality of polymer nanofibers having first ends and second ends. The first ends can be positioned substantially adjacent to the heat source. The second ends can be positioned substantially adjacent to the heat sink. The plurality of polymer nanofibers can be aligned substantially perpendicular to at least a portion of the heat source and the heat sink. | 11-15-2012 |
20120285674 | THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER - A thermal conductive sheet contains a resin and a plate-like or flake-like filler. The average orientation angle of the filler is 29 degrees or more and the maximum orientation angle thereof is 65 degrees or more with respect to the plane direction of the thermal conductive sheet. | 11-15-2012 |
20120292005 | THERMAL INTERFACE MATERIALS AND METHODS FOR PROCESSING THE SAME - A thermal interface material is provided for use to fill a gap between surfaces in a thermal transfer system to transfer heat between the surfaces. The thermal interface material includes a base material and thermally conductive particles dispersed within the base material. The thermal interface material is conditioned under reduced pressure (e.g., prior to being placed in the gap between the surfaces, while being placed in the gap, after being placed in the gap, etc.) and, within about forty-eight hours or less of conditioning, the conditioned thermal interface material is either positioned in a container that inhibits ambient gas from contacting it (either alone or applied to the surfaces), or used to transfer heat between the surfaces. As such, the thermal interface material is substantially free of cracks following exposure to thermal cycling comprising a temperature change of at least about 100 degrees Celsius for at least about 10 cycles. | 11-22-2012 |
20120298345 | HEAT SINK SHEET INCLUDING AN ADHESIVE HAVING GOOD HEAT CONDUCTIVITY - The present invention relates to a heat sink sheet including an adhesive containing a carbon nano-complex and having good heat conductivity. The adhesive having good heat conductivity is coated on a graphite sheet to improve heat conductivity, and an existing adhesive process and adhesive coating process are combined into a single process to manufacture a heat sink sheet, thereby providing a heat sink sheet having improved heat conductivity so as to contribute to cost reduction and increased yield. | 11-29-2012 |
20120298346 | BENT-TYPE HEAT DISSIPATER - Disclosed is a bent-type dissipater, including one or a plurality of heat sinks which are adapted with cooling apertures; one or a plurality of cooling pins which are bent in structure, and which are integrated to the heat sinks, and a central heat passage for combining heat moving in one direction with ambient air, and discharging the heat in the opposite direction. | 11-29-2012 |
20120305230 | DEVICE FOR HOLDING A SOURCE OF LIGHT - An assembly includes a light source holding component sized and arranged to securely receive a source of light. The light source holding component may include a displaceable protective device that functions to generally protect against an accidental touching of electrical terminals of the light source holding component. An accessory mounting feature may also be provided to the light source holding component, The accessory mounting feature is adapted to cooperate with an accessory to provide a seal against a surface to which the light source holding component is attached. The light source holding component may have wire ports that are formed within an overall general outer diameter of the light source holding component. By way of example, the wire ports may include wire contacts having wires pre-attached thereto or the wire ports may include electrical connectors of the push-in type for receiving and thereupon holding wires inserted therein. | 12-06-2012 |
20120312519 | Partially composite plate - A partially composite plate includes an area of metal matrix composite and a margin of metal, of the same metal as used to infiltrate the composite, along at least one edge of the composite. In a preferred embodiment of the invention, the margin surrounds the composite, the metal is aluminum, and the metal matrix composite is AlSiC. | 12-13-2012 |
20120325451 | COMPONENTS WITH COOLING CHANNELS AND METHODS OF MANUFACTURE - A manufacturing method includes forming one or more grooves in a component that comprises a substrate with an outer surface. The substrate has at least one interior space, and each groove extends at least partially along the substrate and has a base. The manufacturing method further includes forming one or more access holes through the base of a respective groove, to connect the groove in fluid communication with the respective hollow interior space. The manufacturing method further includes forming at least one connecting groove in the component, such that each connecting groove intersects at least a subset of the one or more grooves. The manufacturing method further includes disposing a coating over at least a portion of the outer surface of the substrate, such that the groove(s) and the coating together define one or more channels for cooling the component. The coating does not completely bridge the connecting groove, such that the connecting groove at least partially defines an exit region for the respective cooling channel(s). | 12-27-2012 |
20120325452 | HEAT SINK - A heat sink includes a plurality of fins arranged parallel to each other. The fins include a first fin, a second fin, a third fin, a fourth fin, and a plurality of middle fins sandwiched between the third fin and the fourth fin. The first fin is at an outmost side of the heat sink. The first fin has a protrusion. The second fin is located at an opposite outmost side of the heat sink. The third fin is adjacent to the first fin. The protrusion of the first fin abuts against the third fin. The fourth fin is adjacent to the second fin and has a protrusion to abut against the second fin. The middle fins being flat with no protrusions. | 12-27-2012 |
20120325453 | Monolithic Fin-type Heat Sink - A fin-type heat sink applied to a electronic device includes a flake structured contact section adhered to an electronic component via an adhesive material, and a fin section including a plurality of pleats extending horizontally from the contact section, so as to substantially increase a heat-sinking area of the heat sink and effectively reduce heat generated when the electronic component is under operation. The contact section and the fin section are monolithically formed from a heat conductive metal, and since the fin section can be deformed with respect to the contact section to make room for any ambient components around the electronic component such that the fin-type heat sink is applicable to various situations without customization. | 12-27-2012 |
20120325454 | HEAT DISSIPATING STRUCTURE AND MANUFACTURE THEREOF - A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of opposing surfaces of the heat source and the heat dissipating part; and a heat conducting structure comprising a filler layer of thermoplastic material disposed between the heat source and the heat dissipating part and contacting with the opposing surfaces of the heat source and the heat dissipating part, and an assembly of carbon nanotubes that are distributed in the thermoplastic material, oriented perpendicularly to the surfaces of the filler layer, contacting, at both ends, with the opposing surfaces of the heat source and the heat dissipating part, and limited its distribution in the opposing surfaces by the concave portion. | 12-27-2012 |
20130000879 | ROAD LAMP COOLING MANAGEMENT DEVICE - The present invention relates to a road lamp cooling management device including a plurality of cooling pipes installed into fins of an LED light source coupled to the large road lamp, and an open end of each of cooling pipes is inserted and fixed directly into a fixing hole base of an upper lamp casing, such that high heat generated by the LED light source can be cooled by the fins as a first-stage cooling and circulated and cooled by the plurality of cooling pipes as a second-stage cooling. | 01-03-2013 |
20130000880 | HEAT DISSIPATION DEVICE WITH GOOD APPEARANCE - A heat dissipation device for a heat-generating component includes a heat dissipation fin group and a side plate. The heat dissipation fin group comprises a plurality of heat dissipation fins arranged one on the other, each of the heat dissipation fins comprises a base plate and a fold extending vertically from a side of the base plate. The folds of the heat dissipation fins located at a common side are combined with each other to form a side surface. The side plate covers the side surface of the heat dissipation fin group, and an exposed surface of the side plate includes a plurality of strips formed thereon. | 01-03-2013 |
20130000881 | PASSIVE HEAT EXCHANGER FOR GIMBAL THERMAL MANAGEMENT - A passive heat exchanger for gimbal thermal management is disclosed. In one embodiment, a thermal management system includes one or more electronics and/or sensor equipment. Further, the thermal management system includes a thermally conductive shell configured to house the electronics and/or sensor equipment. Furthermore, the thermally conductive shell includes an external surface and an internal surface. In addition, at least some portion of the external surface and the internal surface of the thermally conductive shell include an extended surface configured to reduce thermal resistance between an interior region of the thermally conductive shell and ambient air. | 01-03-2013 |
20130008638 | PHASE CHANGE MATERIAL HEAT SINK - A phase change material heat sink includes a sealed enclosure containing a phase change material. A fluid passage element is in contact with the sealed enclosure and includes a thermal exchange layer in thermal contact with the top and that directs fluid in a first flow direction and a shunt passage element in thermal contact with at least one of the sides or the bottom and that directs fluid in a second flow direction. | 01-10-2013 |
20130014925 | HEAT SINKING METHODS FOR PERFORMANCE AND SCALABILITY - A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique. | 01-17-2013 |
20130025839 | THERMAL SUBSTRATE - An organic substrate capable of providing effective heat transfer through its entire thickness by the use of parallel, linear common thermally conductive openings that extend through the substrate, the substrate having thin dielectric layers bonded together to form an integral substrate structure. The structure is adapted for assisting in providing cooling of high temperature electrical components on one side by effectively transferring heat from the components to a cooling structure positioned on an opposing side. Methods of making the substrate are also provided, as is an electrical assembly including the substrate, component and cooling structure. | 01-31-2013 |
20130032322 | EXTERNAL CELLULAR HEAT SINK STRUCTURE - An external cellular heat sink structure includes a base and a heat dissipating body integrally formed on the base. The heat dissipating body includes a plurality of hollow cellular units, wherein the neighboring cellular units are connected together, and each cellular unit has at least two openings for communicating the connected cellular units with each other. Thus, the cellular unit can provide the larger dissipation area, and each opening can let the gas pass and disperse the gas so that the time and possibility for the gas to contact the heat dissipating surface are lengthened and increased, respectively, and the heat dissipation efficiency is increased. | 02-07-2013 |
20130032323 | HEAT SINK STRUCTURE - A heat sink structure includes a base and heat dissipating fins, which are arranged into at least two heat dissipating groups and integrally formed with the base. Lines connecting apexes of the heat dissipating fins in the heat dissipating group form a convex arc shape. In addition, The heat dissipating fins of the neighboring heat dissipating groups are arranged in the same pattern, or are arranged at different levels and in a gradually rising or gradually falling manner. Thus, the heat dissipation efficiency of the heat sink structure is enhanced. | 02-07-2013 |
20130032324 | THERMAL SOLUTION WITH SPRING-LOADED INTERFACE - Thermal solution systems including a heat sink and a spreader plate mounted to the heat sink via one or more springs. Thermal gap filler provides a thermal interface between the heat sink and the spreader plate. The one or more springs provide contact force between the heat spreader plate and a component to be cooled, while accommodating dimensional variation, such as manufacturing tolerance or assembly tolerance related variation. | 02-07-2013 |
20130037248 | FABRIC AND METHOD OF MAKING THE SAME - A fabric for thermal management including the cooling of an object, such as a person's skin. The fabric is formed of a plurality of functional zones arranged to extend the period of cooling without the use of artificial cooling chemicals. The functional zones include one or more of three different functional zone types. The first type diverts moisture. The second type retains and stores moisture. The third type absorbs moisture. One of the functional zones may be punched to create perforations to provide fabric flexibility and to assist in liquid diversion from within the fabric. An anchor system facilitates retention of the fabric on the object. | 02-14-2013 |
20130043015 | MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTERFACE FOR ELECTRONIC COMPONENT - A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process. | 02-21-2013 |
20130043016 | STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE - Structure of a heat dissipation substrate including a metal substrate, a first insulating material, a second insulating material, a first patterned conductive layer and a second patterned conductive layer is provided. The metal substrate has an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface and a plurality of second recesses located on the lower surface. The first insulating material is provided to fill into the first recesses. The second insulating material is provided to fill into the second recesses. The first patterned conductive layer is disposed on the upper surface of the metal substrate and a portion of the first insulating material. The second patterned conductive layer is disposed on the lower surface of the metal substrate and a portion of the second insulating material. | 02-21-2013 |
20130043017 | HEAT SINKING PLATE - Provided is a heat sinking plate, the plate formed with a square-shaped opening of a predetermined length when viewed from the other direction of a rectangular metal plate by erecting four triangles obtained by diagonally and crossly cutting a square of a predetermined length to one direction of the metal plate at a predetermined first angle relative to the metal plate. | 02-21-2013 |
20130056192 | HEAT DISSIPATION DEVICE WITH FASTENER - An exemplary heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and a spring coiled around the fastening element. The fastening element includes a pole portion, a head portion, and an engaging portion. The conductive plate has a through hole defined therein. An inner face defining the through hole includes a first face and a second face which have different curvatures. A flange protrudes from a circumference of the pole portion adjacent to the engaging portion. The structure of the flange matches the configuration of the through hole. After the flange extends through the through hole from a side of the conductive plate, the flange is rotated an angle and buckled at another opposite side of the conductive plate. The spring is compressed between the head portion and the conductive plate. | 03-07-2013 |
20130056193 | HEAT TRANSFER INTERFACE - Embodiments of the invention provide systems and methods for heat management systems at temperatures in the range of 120° C. to 1,300° C. The systems consist of various heat transfer chambers configured such that they contain heat transfer devices that are spherical, cylindrical or have other shapes, and that absorb heat within a broad range of temperatures, and return such heat at constant temperature over long periods of time. | 03-07-2013 |
20130062045 | HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK. | 03-14-2013 |
20130062046 | THERMAL CONDUCTIVE SHEET AND PRODUCING METHOD THEREOF - A thermal conductive sheet is obtained by preparing a resin layer, laminating a particle-containing monomer mixture layer which contains a monomer to be absorbed in the resin layer and a thermal conductive particle on one side surface of the resin layer, localizing the thermal conductive particle at one side by allowing the monomer to be absorbed in the resin layer, and thereafter, reacting the monomer to be cured. | 03-14-2013 |
20130068439 | Heat Sink Assembly - A heat sink assembly ( | 03-21-2013 |
20130075072 | APPARATUSES AND METHODS FOR CONTROLLING HEAT FOR RAPID THERMAL PROCESSING OF CARBONACEOUS MATERIAL - Embodiments of apparatuses and methods for controlling heat for rapid thermal processing of carbonaceous material are provided herein. The apparatus comprises a reheater for containing a fluidized bubbling bed comprising an oxygen-containing gas, inorganic heat carrier particles, and char and for burning the char into ash to form heated inorganic particles. An inorganic particle cooler is in fluid communication with the reheater to receive a first portion of the heated inorganic particles. The inorganic particle cooler is configured to receive a cooling medium for indirect heat exchange with the first portion of the heated inorganic particles to form first partially-cooled heated inorganic particles that are fluidly communicated to the reheater and combined with a second portion of the heated inorganic particles to form second partially-cooled heated inorganic particles. A reactor is in fluid communication with the reheater to receive the second partially-cooled heated inorganic particles. | 03-28-2013 |
20130075073 | HEAT-DISSIPATING FIN AND HEAT-DISSIPATING FIN ASSEMBLY - A heat-dissipating fin comprises a first longitudinal section, a second longitudinal section, a first contacting section extending transversely from the first longitudinal section, a second contacting section extending transversely from the second longitudinal section, and a third contacting section connected between the first longitudinal section and the second longitudinal section and extending transversely. When a plurality of heat-dissipating fins are assembled, contact among the first contacting sections, among the second contacting sections, and among the third contacting sections of the heat-dissipating fins are established. | 03-28-2013 |
20130075074 | Thermal Dissipation Device - A thermal dissipation device for an electronic device includes a heat sink having predetermined shape and form for placing over the electronic device, wherein the heat sink includes fins for increase surface area; and carbon nanotubes formed on a surface of the heat sink and the fins to increase the thermal dissipation surface, thereby enhancing thermal dissipation. The carbon nanotubes comprises multi-walled carbon nanotubes (MWNTs), single-walled carbon nanotubes (SWNTs), graphenated carbon nanotubes. | 03-28-2013 |
20130081796 | THERMAL INTERFACE MATERIAL, METHOD FOR MANUFACTURING THERMAL INTERFACE MATERIAL, AND JOINING STRUCTURE USING THERMAL INTERFACE MATERIAL - A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors. | 04-04-2013 |
20130081797 | HEAT EXCHANGER HAVING POWDER COATED ELEMENTS - Powder coated heat exchange elements for a heat exchanger. Powder coating provides improved protective coating on surfaces of heat exchange elements. In many applications, the heat exchange elements are subjected to harsh operating conditions that promote corrosion. Traditional enamel coating tends to fracture when subjected to mechanical stresses thereby allowing corrosion inducing agents to penetrate and corrode the underlying surfaces. Powder coating reduces breaches in the protective layer. Powder coating may be adapted to withstand high temperatures so as to make them suitable for use in harsh operating environments. One such environment can be found in the processing of flue gas from fossil burning power generators, where the flue gas has a relatively high temperature and high sulfur content. | 04-04-2013 |
20130081798 | HEAT SINK, AND METHOD FOR PRODUCING SAME - A heat sink including a base section, connection fins, and parallel fins. The base section includes: a first base plate configured to be mounted with a heat generating component on its outer surface; a second base plate disposed to face the first base plate in a parallel manner, configured to be mounted with a heat generating component on its outer surface; and a third base plate disposed perpendicular to the first base plate and the second base plate, which secures the first base plate and the second base plate along a junction line. The base section includes first and second regions arranged in the direction of the junction line. The connection fins are disposed on the first region to connect inner surfaces of the first and second base plates and to be parallel to the third base plate, and the parallel fins are disposed on the second region from an inner surface of the third base plate to be parallel to the first base plate. | 04-04-2013 |
20130092362 | HEAT DISSIPATING STRUCTURE FOR LIGHT BULB - The present invention provides a heat dissipating structure for a light bulb and enhances the heat dissipating efficiency of the light bulb. The heat dissipating structure comprises a heat dissipating housing and a plurality of fins. The light source is assembled on the plurality of fins. The heat generated by the light source is conducted to the heat dissipating housing via the plurality of fins. In addition, a power driver is disposed at the bottom of the plurality of fins and dissipates heat through the heat dissipating housing. Thereby, the light source and the power driver, which are two heat sources, are disposed separately. Then the heat is transferred to the surrounding environment by means of the heat dissipating housing. Consequently, the overall heat dissipating process is accelerated, thus improving the light emitting efficiency and lifetime of the light bulb. | 04-18-2013 |
20130092363 | HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM - The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element. | 04-18-2013 |
20130098592 | HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components. | 04-25-2013 |
20130105132 | HEAT SINK FIN AND HEAT SINK DEVICE | 05-02-2013 |
20130105133 | HEAT DISSIPATION ASSEMBLY | 05-02-2013 |
20130105134 | HEAT-DISSIPATING FIN CAPABLE OF INCREASING HEAT-DISSIPATING AREA | 05-02-2013 |
20130105135 | CMOS Compatible Microchannel Heat Sink for Electronic Cooling and Its Fabrication | 05-02-2013 |
20130112385 | Cooling Structure - An improved cooling structure comprises a cooling means and a base plate. The cooling means is provided with a plurality of connection portions extending outwardly. The connection portions are capable of being affixed to a first frame and a second frame, each frame being provided with a colored region. The base plate is capable of being fixedly assembled to the first and second frames. The base plate is provided with an application zone, which can be formed into a literal, figurative, or mesh-like pattern. The base plate can be made of acrylic, plastic such as PC or ABS, bamboo, ceramic material, non-metal, or metal. In use, a user may choose a base plate having a pattern according to his or her preference, and cut the base plate into a final plate suitable to a notebook. Thereafter, the base place can be assembled or replaced conveniently. | 05-09-2013 |
20130112386 | HEAT DISSIPATING DEVICE AND MANUFACTURE METHOD THEREOF - A heat dissipating device includes a base and a plurality of heat dissipating layers. The base has a first surface and a second surface which are opposite to each other. The heat dissipating layers are formed on the first surface of the base in sequence. Each heat dissipating layer has at least one heat dissipating structure, which includes a heat storage/dissipation area and a heat conductive area. The heat storage/dissipation area surrounds the heat conductive area, and a gap is configured between the heat storage/dissipation area and the heat conductive area. The heat storage/dissipation areas of two adjacent heat dissipating layers contact with each other, while the heat conductive areas of two adjacent heat dissipating layers contact with each other. | 05-09-2013 |
20130112387 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink and a second heat sink connected to each other. Each of the first and second heat sinks includes a base and a plurality of fins extending from the base. The base of the first heat sink forms a rib on a lateral face thereof, and the base of the second heat sink defines a groove in a lateral face thereof. The rib is received in the groove to connect the first heat sink with the second heat sink. | 05-09-2013 |
20130112388 | HEAT SINK - Disclosed herein is a heat sink including: a first region connected to a cooling water introduction part and having a plurality of first pins arranged therein; and a second region connected to a cooling water discharge part and having a plurality of second pins arranged therein. | 05-09-2013 |
20130112389 | THERMAL CONDUCTIVE SHEET, METHOD OF PRODUCING THERMAL CONDUCTIVE SHEET AND HEAT RELEASING DEVICE - The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction. | 05-09-2013 |
20130118725 | Heat Sink and Fins Thereof - The heat sink of the invention includes a cylinder and fins fastened thereto. A hollow in the cylinder is for receiving a heat source. Each the fin includes two parallel wings and a connection plate therebetween. A space is defined by the two wings and the connection plate for air flow. | 05-16-2013 |
20130126145 | HEAT SINK WITH ORIENTABLE FINS - A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis. | 05-23-2013 |
20130126146 | PLANAR THERMAL DISSIPATION PATCH M AND THE METHOD OF THE SAME - A planar thermal dissipation patch comprises a polymer substrate; an adhesive layer attached under the polymer substrate; a protection sheet over the adhesive layer, the protection sheet is removed from the adhesive layer before attaching the planar thermal dissipation patch; a thermal dissipation layer formed on the polymer substrate; wherein the thermal dissipation layer is formed of CNT, conductive polymer, graphite or the combination thereof. | 05-23-2013 |
20130133871 | Multiple Thermal Circuit Heat Spreader - A heat spreader has more than one thermal circuit to give better performance over a wider range of heat input regimes. Different working fluids may be used in the different thermal circuits. The thermal circuits may extend in three dimensions to improve the density of the channels in limited space. | 05-30-2013 |
20130140013 | RADIATOR FIN - A radiator fin ( | 06-06-2013 |
20130140014 | METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL - Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s). | 06-06-2013 |
20130146269 | HEAT SINK - A heat sink includes a base and a number of fins perpendicularly extending from the base. The base includes a main body. The fins include a number of parallel first fins and two second fins sandwiching the first fins. Each second fin includes a main piece extending from the main body and a guiding piece extending from one end of the main piece. | 06-13-2013 |
20130146270 | FIXING DEVICE, AND HEAT SINK DEVICE OR SHIELD CASE COMPRISING THE SAME - A fixing device, and a heat sink device or a shield case comprising the same. The fixing device is used to connect the heat sink device or the shield case to a circuit board. The circuit board has a via hole which comprises a first size, a second size, and a first height. The fixing device has a connecting member which comprises successively along its extending direction a first boss part, a clamping part, and a second boss part. The first boss part has a first width; the clamping part engages with the via hole, and has a second width and a second height; the second boss part has a third width. The third width is smaller than the second size, the second width equals to the first size, the second height equals to the first height, and the first and third width are larger than the first size. | 06-13-2013 |
20130153187 | Dual Heat Sinks For Distributing A Thermal Load - Dual heat sinks, apparatuses, and methods for installing a dual heat sink for distributing a thermal load are provided. Embodiments include a top base to couple with a first integrated circuit of a first board and to receive a first thermal load from the first integrated circuit; a bottom base to couple with a second integrated circuit of a second board and to receive a second thermal load from the second integrated circuit; and a thermal dissipating structure coupled between the top base and the bottom base, the thermal dissipating structure to receive and distribute the first thermal load and the second thermal load from the top base and the bottom base; wherein a height of the thermal dissipating structure is adjustable so as to change a distance separating the top base and the bottom base. | 06-20-2013 |
20130153188 | ADVANCED SMR REACTOR DESIGN FEATURING HIGH THERMAL EFFICIENCY - An improved reactor process is provided. This process includes providing at least one reactor tube, the reactor tube comprising an exterior and an interior, the interior comprising an inside surface, providing a heat source to the exterior of the at least one reactor tube, providing a reactant gas stream to the interior of the at least one reactor tube, placing at least one heat transfer structure in thermal contact with the inside surface of the at least one reactor tube, and transferring heat from the heat source to at least a portion of the reactant gas stream at least partially through the at least one heat transfer structure, thereby producing a product gas stream. There may be a catalyst on the interior of the at least one reactor tube. The reactant gas stream may comprise methane and steam. | 06-20-2013 |
20130153189 | HEAT DISSIPATING FIN, HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion. | 06-20-2013 |
20130153190 | HEAT SINK - A heat sink for dissipating heat of a heat-generating element on a circuit board includes a base, a linear fastener and a heat-dissipating fin set. The linear fastener includes a fixing section disposed on the base and an engaging section extending from the fixing section. The engaging section extends out of the base to be fixed on the circuit board. The heat-dissipation fin set is combined on the base and has stamped fins. The bottom of a portion of the stamped fins is provided with a receiving means at a position corresponding to the fixing section. The fixing section is disposed in the receiving means and clamped between the heat-dissipation fin set and the base. The linear fastener is used to combine the heat-dissipating fin set on the circuit board to increase the heat-dissipating efficiency of the heat sink to the heat-generating element. | 06-20-2013 |
20130153191 | Conduction coil - A device for heating or cooling material, having at least one first conductive portion sized to be inserted into the material; and at least one second conductive portion conductively attached to the first portion. the second portion is sized to absorb and conduct heat or cooling from a source proximate the second portion into the first portion. The first portion heats or cools the interior of the material. | 06-20-2013 |
20130153192 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion. | 06-20-2013 |
20130153193 | BIDIRECTIONAL HEAT SINK FOR PACKAGE ELEMENT AND METHOD FOR ASSEMBLING THE SAME - In a bidirectional heat sink for a package element and a method for assembling the same, the bidirectional heat sink includes a first heat-dissipating plate, a second heat-dissipating plate, and a plurality of heat-dissipating pieces. The first heat-dissipating plate is provided with a groove. Both sides of the groove are formed with two separation walls. The package element is inserted into the groove to contact the two separation walls. The second heat-dissipating plate extends from one end of the first heat-dissipating plate. Each of the heat-dissipating pieces extends from the second heat-dissipating plate in a direction away from the first heat-dissipating plat). By this structure, the contact area of the package element is increased to improve the heat-dissipating efficiency. Further, the assembling process is performed quickly to form a firm structure. | 06-20-2013 |
20130153194 | HEAT-CONDUCTING ELEMENT, ASSEMBLY AND USE OF THE SAME - The invention relates to a heat-conducting element ( | 06-20-2013 |
20130160982 | HEAT SINK AND A METHOD FOR MAKING THE SAME - A heat sink and a method for making the same include steps of drawing-extrusion, cutting, ripping, inserting, and punching. By the step of drawing-extrusion, an extruded body is extruded and on an upper end thereof forms at least one set of elongated strips. The extruded body is cut into sub rippled bodies, and the elongated strips are ripped at intervals for forming separate sets of holding members. A fin set forms bent flakes with gaps at a bottom end of each fin unit thereof for combining with a radiating seat. Punched by punching molds, the holding members deform for firmly holding the bent flakes on each fin unit of the fin set, thereby achieving a complete combination of the radiating seat and the fin set. Accordingly, the radiating seat is lighter, which saves more materials and reduces manufacturing costs. | 06-27-2013 |
20130160983 | HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING THE SAME - A heat-dissipation structure includes a first carbon nanotube layer and a thermal interface material layer. The first carbon nanotube layer and the thermal interface material layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper, and the density of the first carbon nanotube paper ranges from about 0.3 g/cm | 06-27-2013 |
20130168072 | HEAT EXCHANGER CONSTRUCTION USING LOW TEMPERATURE SINTER TECHNIQUES - Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction. | 07-04-2013 |
20130175018 | TILTABLE NOTEBOOK-COMPUTER COOLING PAD WITH TABLET-COMPUTER BRACKET - A tiltable notebook-computer cooling pad with a tablet-computer bracket is disclosed. The notebook-computer cooling pad has its bottom its bottom detachable assembled with a tablet-computer bracket that can provide tiltable and rotatable support. The tablet-computer bracket can work with the notebook-computer cooling pad to allow adjustment of a tilting angle of the notebook-computer cooling pad, or it can work independently as a stand-alone tablet-computer bracket that provides tiltable and rotatable support to a tablet computer. Thereby, the disclosed device can serve to not only maintain an operating notebook computer cool, but also support a tablet computer. | 07-11-2013 |
20130175019 | HEAT SINK AND METHOD FOR MANUFACTURING - The present application relates to a method of manufacturing a heat sink from a plurality of extruded lamellas, each lamella including a base portion having a top surface, a bottom surface, and two side surfaces, each lamella further including a fin portion extending from the top surface of the base portion, wherein the base portion is wider than the fin portion. The method includes aligning the base portions of the plurality of lamellas with the fin portion of each lamella extending in the same direction and the side surfaces of adjacent base portions facing each other; pressing the base portions of adjacent lamellas into contact with each other by applying a force to the side surface of at least one of the base portions; and welding the bottom surfaces of adjacent base portions together. A heat sink and a lamella for use in manufacturing a heat sink are also disclosed. | 07-11-2013 |
20130175020 | Heat Spreader Having Single Layer Of Diamond Particles and Associated Methods - A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders. | 07-11-2013 |
20130175021 | SERVO AMPLIFIER WITH HEAT SINK HAVING TWO SETS OF HEAT-RELEASING PLATES PERPENDICULAR TO EACH OTHER - A servo amplifier having a heat sink of low (assembly) cost, with high heat-releasing capacity and reliability, capable of being safely used under high temperature. The heat sink has a base plate, a heat-transferring plate thermally connected to the base plate, a plurality of first heat-releasing fins extending from the base plate, and a plurality of second heat-releasing fins extending from the heat-transferring plate. The first heat-releasing fins are arranged so as to extend from a second major surface of the base plate in the Z-direction, and the second heat-releasing fins are arranged on a region of the both surfaces of the heat-transferring plate where is separated from the second major surface by at least the height of the first heat-releasing fins, the second heat-releasing fins extending generally parallel to second major surface. | 07-11-2013 |
20130180697 | HEAT DISSIPATING MODULE - A heat dissipating module including multiple first heat dissipating fins and multiple second heat dissipating fins combined to the first heat dissipating fins is provided. Each first/second heat dissipating fin has a first/second body and multiple first/second heat dissipating groove assemblies disposed in the first/second body, wherein each first/second heat dissipating groove assembly has multiple first/second heat dissipating groove unit. One end of the first heat dissipating groove unit is overlapped to one end of the second heat dissipating groove unit adjacent thereof. The other end of the first heat dissipating groove unit is overlapped to one end of another second heat dissipating groove unit. The two second heat dissipating groove units are disposed in the second body adjacent to each other. | 07-18-2013 |
20130180698 | CORRUGATED PLATE MANUFACTURING APPARATUS - Flat-plate connecting portions are formed in a band plate by a connecting-portion forming unit. The flat-plate connecting portions are cut off by another connecting-portion forming unit except one flat-plate connecting portion so as to form a corrugated-plate connecting portion. A corrugated-plate portion is formed by a corrugation forming unit, so that the corrugated-plate portion has multiple projections arranged in a width direction of the band plate and each of the projections extends in a plate feeding direction. The corrugated-plate connecting portion corresponding to a predetermined connecting number is cut off so as to form a corrugated fin having a predetermined number of corrugated-plate portions. | 07-18-2013 |
20130180699 | PLATE HEAT EXCHANGER - A plate heat exchanger for exchanging heat between mediacomprises a number of stacked plates (A, B, C, D), the plates being provided with a first, large scale pressed pattern comprising ridges (R) and grooves (G) intended to keep first (A, B) and second (B,C) pairs of stacked plates on a distance from one another, such that flow channels for a first medium is formed in spaces between said plate pairs. Contact points are provided between the plate pairs in points where the large scale pressed pattern of neighboring plate pairs contact one another. The plates of each plate pair (A, B; C, D) are kept on a distance from one another by a small-scale pressed pattern comprising ridges (r) and grooves (g). | 07-18-2013 |
20130186609 | Heating Pad Applicable to Induction Cooker - The present invention relates to a heating pad which is applicable to an induction cooker and includes a pad body and a metal sheet held in the pad body. A lower portion of the pad body is adapted to be sucked on a furnace surface of the induction cooker, and an upper portion of the pad body is adapted to carry a container. | 07-25-2013 |
20130186610 | RING-SHAPED HEAT DISSIPATING DEVICE AND A MANUFACTURING METHOD THEREOF, AND A HEAT DISSIPATING APPARATUS INCLUDING SAID RING-SHAPED HEAT DISSIPATING DEVICE - A ring-shaped heat dissipating device made of a continuously-bending metal sheet includes a plurality of fins arranged in a radial form to form a central passage communicating from theretop to therebottom. Each of fins has a top plate, a front side plate and a rear side plate extending downwardly from opposite edges of the top plate respectively, and a bottom plate extending from a bottom edge of the rear side plate. The front side plate of one of fins connects with the bottom plate of another fin adjacent thereto. An inner edge of the top plate of one of fins adjacent to the central passage is connected with another two inner edges of two top plate plates of two fins adjacent thereto. And an inner edge of the bottom plate is connected with another two inner edges of two bottom plates of two fins adjacent thereto. | 07-25-2013 |
20130192813 | Heat Radiation Sheet - Disclosed is a heat radiation sheet, including a thermoconductive adhesive layer, a thermal diffusion layer, an adiabatic adhesive layer formed on the thermal diffusion layer, and a graphite layer. The thermoconductive adhesive layer is formed by mixing a metal powder with a nonconductive resin adhesive, the thermal diffusion layer is formed of metal foil, and the adiabatic adhesive layer is formed by mixing a metal powder with a nonconductive resin adhesive. The heat radiation sheet is effective in that high-temperature heat generated from heat sources of various kinds of electronic appliances is rapidly absorbed by a thermoconductive adhesive layer and a thermal diffusion layer, and the absorbed heat rapidly spreads over the entire area of the heat radiation sheet, is stored, and is then slowly discharged to prevent the external temperature of the electronic appliance from rapidly increasing, preventing the deterioration of reliability attributable to the high-temperature heat. | 08-01-2013 |
20130199767 | COMPLIANT PIN FIN HEAT SINK AND METHODS - A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source. | 08-08-2013 |
20130199768 | APPARATUS FOR SECURE DEVICE TO EDGE OF PLATE - Apparatuses to secure surface mount heat emitting device with back heat spreader to edge of a heat dissipate plate in order to conduct heat from said heat emitting device to heat dissipate plate directly. Each apparatus comprising of adapter PCB with device mounting pads on surface and opening at location of back heat spreader to expose it for contact access; heat dissipate plate has contact stub to make contact with said back heat spreader and bounding means to bound together said heat dissipate plate and PCB. | 08-08-2013 |
20130199769 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink and a number of protecting members. The heat sink includes a number of parallel fins. The fins form a fin assembly including a number of lengthwise corners at lateral sides of the fin assembly. Each lengthwise corner is covered by one of the protecting members. Each protecting member includes a first stop plate and a second stop plate engaging with two adjacent sides of the fin assembly, and a number of pairs of connecting plates between the first and second stop plates, at opposing ends of the first and second stop plates. A slot is bounded by each pair of connecting plates. The corners of the fins on upper and lower portions of the fin assembly engage and are retained by the slots in upper and lower portions of the protecting members. | 08-08-2013 |
20130199770 | SPRDR- HEAT SPREADER- TAILORABLE, FLEXIBLE, PASSIVE - New heat spreaders are proposed to connect high power, high heat generating electronic devices to their downstream heat dissipating cooling components. First, the spreaders distribute the high heat flux over a wider surface area, thus reducing the flux to levels more easily handled by the downstream cooling system. Second, the spreaders incorporate flexible columns or elements to join the electronic devices to the main body of the spreader, so as to negate the undesirable effects of CTE mismatch. Columns with a higher standoff distance between the components are more flexible than a direct flat interface attachment between the heat source and the heat sink, and will have less chance of delaminating. Several embodiments are proposed and can be used in appropriate situations. The heat spreaders can be helpful in harsh environments and in high heat generating applications, such as spacecraft, satellites, as well as land locked high power computer systems. | 08-08-2013 |
20130199771 | HEAT-DISSIPATING SUBSTRATE FOR LED - The present invention relates to a heat-dissipating substrate for LED, comprising a polyimide film, a copper foil or a copper alloy foil which is laminated on one side of the polyimide film, and an aluminum foil or an aluminum alloy foil which is laminated on the other side of the polyimide film, in which the thermal resistance between the surface of the copper foil or the copper alloy foil and the surface of the aluminum foil or the aluminum alloy foil is 1.8° C./W or less. | 08-08-2013 |
20130206380 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink, a base, and a number of fasteners. The heat sink includes a bottom plate defining a number of holes. The base is mounted to a bottom of the bottom plate. A number of through holes aligning with the holes of the bottom plate are defined in the base. A number of tapered guiding surfaces is formed on a bottom of the base. Each guiding surface bounds a corresponding one of the through holes. A diameter of each guiding surface gradually increases in a downward direction, facilitates the entry of securing screws. The fasteners are mounted to the heat sink. Bottoms of the fasteners are respectively extended through the holes of the heat sink and received in the through holes of the base. An internally-threaded hole is defined in a bottom of each fastener. | 08-15-2013 |
20130206381 | HEAT RADIATOR - A heat radiator includes a base and heat radiating fins. The base has a surface formed with grooves for insertion of the heat radiating fins. Each heat radiating fin has a bent portion at one end thereof. The bent portion has spaced protrusions thereon. The bent portion is inserted and embedded in the groove of the base. Then, a press head is aligned with the bent portion for pressing. The press head has an inclined surface to cover the bent portion and a side wall of the groove. After pressing, the bent portion is deformed and enlarged to engage with the groove. The side wall of the groove is compressed by the inclined surface of the press head to be shifted and deformed. The deformed side wall holds against the bent portion, so that the heat radiating fins and the base are connected. | 08-15-2013 |
20130213628 | Convective Airflow Using a Passive Radiator - Systems and methods to remove heat from an acoustic enclosure are provided. An apparatus for reproducing acoustic signals includes an acoustic enclosure comprising an acoustic volume. A heat producing element is coupled to the acoustic enclosure, and a thermally conductive structure is thermally coupled to the heat producing element. The thermally conductive structure includes a first surface. A first passive radiator includes a first diaphragm. The first diaphragm extends over at least a portion of the first surface and moves in response to pressure variations within the acoustic volume. Movement of the first diaphragm causes air to flow over the first surface, to facilitate heat removal from the thermally conductive structure. | 08-22-2013 |
20130213629 | COMPOSITE HEAT-DISSIPATION SUBSTRATE AND MANUFACTURING METHOD OF THE SAME - The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics. | 08-22-2013 |
20130213630 | Composite Heat Spreader - A composite heat spreader ( | 08-22-2013 |
20130220587 | COOLER AND COOLING DEVICE - The cooling device comprises a heat exchange unit provided in a cooling water flow path. The heat exchange unit has a plate part in the form of a plate and multiple fins erected on the plate face of the plate part, and provided in the manner that the plate face of the plate part extends along the cooling water flow path and the cooling water runs through the space between the fins. The multiple fins are each in the form of a rhombic column and provided on the plate part in a lattice pattern in the manner that the longer diagonal of the rhombic column extends along the cooling water flow path. | 08-29-2013 |
20130228322 | BRAZING METHOD AND BRAZED STRUCTURE - In this brazing method, which brazes an insulating substrate and a top plate that configure an HV inverter cooler, the insulating substrate is disposed on the top plate with a brazing material layer therebetween, and then, by means of laser irradiation, laser welding is performed at an arbitrary plurality of positions at the joining section between the top plate and the insulating substrate, thus provisionally affixing the insulating substrate to the top plate. Thereafter, by means of heating and melting the brazing material layer, the insulating substrate is brazed onto the top plate with the plurality of laser-welded positions as the brazing start points. After brazing, a power semiconductor is joined onto the insulating substrate corresponding to the center portion of the region surrounded by the plurality of brazing start points. | 09-05-2013 |
20130233528 | HEAT DISSIPATING ASSEMBLY - A heat dissipating assembly includes a heat exchanger and a base. The heat exchanger defines at least one latching slot. A touching piece is surrounded the latching slot. The base includes at least one latching post. The touching piece is resiliently deformable to engage the at least one latching post in the at least one latching slot. The touching piece abuts the at least one latching post. | 09-12-2013 |
20130233529 | TOTAL HEAT EXCHANGING ELEMENT PAPER - The object of the present invention is to provide an excellent total heat exchanging element paper and a total heat exchanging element which are excellent in heat transferability, water vapor permeability and gas barrier properties and cause no mixing of supplied air and discharged air. The present invention provides a total heat exchanging element paper using a paper made using mainly a natural pulp beaten to a Canadian modification freeness of not more than 150 ml, a substantially non-porous total heat exchanging element paper comprising a substantially non-porous cellulosic base which contains a moisture absorbing agent, a non-porous total heat exchanging element paper having a high gas barrier property which has a thickness of not more than 100 μm and a carbon dioxide permeation constant specified in JIS K7126 of not more than 5.0×10 | 09-12-2013 |
20130240194 | HEAT EXCHANGER AND METHOD FOR FABRICATING THE SAME - A heat exchanger comprises a base portion and a plurality of fins. The fins are disposed on the base portion in parallel along a processing direction. Each fin has a processing surface far away from the base portion. The processing surfaces sunken to form at least one groove, and the groove extends along a grooving direction which intersects with the processing direction. Furthermore, each fin has two upper valley sides at the groove, and the two upper valley sides connect the processing surface. The two upper valley sides and the processing surface form an obtuse angle. The structure of the heat exchanger can prevent processing waste filling in the passages between fins. | 09-19-2013 |
20130240195 | HEAT EXCHANGER AND METHOD FOR FABRICATING THE SAME - A heat exchanger comprises a base portion and a plurality of fins. The fins are disposed in parallel on the base portion. Each fin has an upper margin far away from the base portion. The distance between each upper margin and the base portion is substantially gradually reduced along a first direction. The upper margins sunken to form at least one groove. The groove extends along a second direction which intersects with the first direction. The structure of the heat exchanger can prevent cutting waste filling in the passages between fins and thus block of passages can be avoided. | 09-19-2013 |
20130248162 | Cooling Apparatus Using Stackable Extruded Plates - A cooler with an inner core created from a plurality of extruded plates is disclosed. The plates have a first side with rigid fins and an opposite side that is substantially flat. The extruded plates are stacked on top of each other to create cooling channels. The plates are then held within a container which has an input, an output and can be sealed to prevent leaks. | 09-26-2013 |
20130248163 | High Temperature Stable Thermally Conductive Materials - Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period. | 09-26-2013 |
20130255927 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar. | 10-03-2013 |
20130255928 | MEMORY MODULE WITH HEAT DISSIPATING APPARATUS - A memory module includes a plurality of memory cards and a heat dissipating apparatus. The heat dissipating apparatus is a continuously-bending metal sheet. The heat dissipating apparatus includes a plurality of thermal conductive portions arranged in a row and a plurality of connecting sheets locating in between the thermal conductive portions respectively and configured to connect with the two adjacent thermal conductive portions. Each of the thermal conductive portions includes a top plate, a front side plate, and a rear side plate, the front and rear side plates extend from two opposite sides of the top plate respectively. The front and rear side plates of each of the thermal conductive portions are configured to snugly clip to one of the memory cards and are in contact with heat sources on two opposite sides of the corresponding memory card. | 10-03-2013 |
20130255929 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base and a plurality of fins. Two latch parts project from a top surface of the base, the two latch parts cooperatively define a recess therebetween. Each fin defines a tenon at a bottom portion. The tenon has a configuration in complement with that of the recess. The latch parts located between two neighboring fins is punched to make the fins fix on the base. | 10-03-2013 |
20130264041 | Thermal management system containing an integrated graphene film for electronic devices - Disclosed is a graphene-based heat dissipation system for an electronic device, comprising: (a) an electronic device comprising a heat source, wherein the heat source transmits heat to a second component or an external surface of the electronic device; (b) a heat-conducting layer comprising two major surfaces, the heat-conducting layer being positioned such that one of its major surfaces is in operative contact with the heat source such that it is interposed between the heat source and the second component or the external surface of the electronic device; wherein the heat-conducting layer comprises at least one sheet of integrated graphene film which thermally shields the second component or the external surface of the electronic device from heat generated by the heat source. | 10-10-2013 |
20130264042 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink and a second heat sink. The first heat sink includes a first heat spreader and a plurality of fins. The first heat spreader includes a receiving structure having a first tooth and two second teeth. The first tooth is located between the second teeth to define two first grooves between the first tooth and the second teeth. The second heat sink includes a second heat spreader and a plurality of fins. The second heat spreader includes a protruding structure having two first inserting portions. When the second heat sink is assembled to the first heat sink, the each of the first inserting portions is inserted in the first groove of the first heat spreader and deformed to be firmly engaged in the first groove and clasped by the first tooth. | 10-10-2013 |
20130264043 | HEAT SINK RADIATION FIN AND BASE BLOCK MOUNTING STRUCTURE - A heat sink radiation fin and base block mounting structure includes a base block providing a plurality of grooves at one side thereof, and a plurality of radiation fins each having a bottom edge thereof stamped to provide a plurality of folded portions and hook portions, the folded portions and hook portions of the radiation fins being inserted into the grooves of the base block and then embedded in or clamped to the base block. | 10-10-2013 |
20130269920 | COOLING DEVICE - A heat-transferring member is mounted on one side of a circuit board. A heat sink is arranged farther away from the circuit board than the heat-transferring member in the thickness direction of the circuit board. The heat sink has a plurality of fins each extending in the direction of the circuit board and separated from each other by a space. Also, the heat sink includes a support portion extending in the direction of the plurality of fins and supporting the plurality of fins. A plurality of heat pipes is connected to the heat-transferring member and separated from each other by a space, each extending in the thickness direction of the circuit board and connecting to the support portion. | 10-17-2013 |
20130277030 | HEAT DISPERSER WITH HEAT TRANSMISSION, HEAT CONVECTION AND HEAT RADIATION FUNCTION - A heat disperser with heat transmission, heat convection and heat radiation function includes a body made of a material able to easily conduct heat. The body is formed into a continuous S shape by repeated bending, making up plural heat dispersing sheets connected with plural heat dispersing walls, with two ends of each heat dispersing sheet connected with one end of two heat dispersing walls, with two ends of each heat dispersing wall connected with one end of two heat dispersing sheets. Then the heat disperser is combined with a heat producing element, whose heat is transmitted to the body. Then the body has a large area for heat dispersing into open air by means of heat transmission, heat convection and heat radiation synchronously. | 10-24-2013 |
20130277031 | HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base and a plurality of radiating fins. The base has a plurality of grooves formed thereon, and each of the grooves has an open top and closed bottom. The radiating fins respectively have a heat-radiating zone and a bent zone. When a pressure is applied onto the bent zones, the bent zones respectively form an assembling section in the grooves to tightly fit therein. With the above arrangements, the radiating fins can be firmly locked to the base without the need of welding, so that the manufacturing cost is reduced and the problem of a damaged base due to assembling can be avoided. A method of manufacturing the above-described heat-dissipation unit is also disclosed. | 10-24-2013 |
20130277032 | CONNECTION STRUCTURE OF LED LAMP HOLDER AND HEAT RADIATION FINS - A connection structure of an LED lamp holder and heat radiation fins includes a heat radiation fin module, a heat radiation core pipe and an insulation connector. The heat radiation fin module includes a plurality of heat radiation fins surrounding the heat radiation core pipe. Each heat radiation fin has an insertion portion and a stop tab at a distal end thereof. The insulation connector includes a plurality of engaging hooks and engaging holes around an opening corresponding to the heat radiation fins. The heat radiation fins are coupled to the heat radiation core pipe. The insertion portions of the heat radiation fins hold against the engaging hooks and are inserted in the engaging holes of the insulation connector. The stop tab of each heat radiation fin holds against the respective engaging hook so that the insulation connector and the heat radiation fins are connected quickly. | 10-24-2013 |
20130277033 | HEAT CONDUCTION STRUCTURE MOUNTED IN CASING OF ELECTRONIC PRODUCT - A heat conduction structure mounted in a casing of an electronic product includes a main heat conduction module and at least one secondary heat conduction module between a heat source and the casing. The main heat conduction module includes a first heat conduction member located close to the heat source to conduct the heat of the heat source, a first heat resistant member to stop the heat from diffusing, and a heat radiation member contact with the first heat conduction member to radiate the heat. The secondary heat conduction module includes a second heat conduction member parallel to the first heat conduction member, a second heat resistant member between the first heat resistant member and the casing, a first heat radiation member and a second heat radiation member contact with the second heat conduction member to radiate the heat of the second heat conduction member. | 10-24-2013 |
20130277034 | HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation device includes an insulating substrate, a metal layer connected to the insulating substrate via a first brazing filler material, a stress relaxation member connected to the insulating substrate via a second brazing filler material, and a cooler connected to the stress relaxation member via a third brazing filler material. The stress relaxation member has one or more stress relaxation spaces each including an opening that is open to at least one of a face side and a back side of the stress relaxation member. At least one of the second and third brazing filler materials has one or more through-holes. Each through-hole includes an opening overlapped with the opening of the stress relaxation space or with the opening of a corresponding one of the stress relaxation spaces, and an edge of each through-hole opening is located externally to an edge of the corresponding stress relaxation space opening. | 10-24-2013 |
20130277035 | Manufacturing Method of Carbonaceous Heat Sink - A manufacturing method of carbonaceous heat sink includes a mixing step and a molding step. In the mixing step, a graphite material is mixed with a thermosetting binder to obtain a mixture. In the molding step, the mixture is pressure formed with a mold into the carbonaceous heat sink, Preferably, the carbonaceous heat sink can increase its carbonaceous percentage by using a heat treating step. The manufacturing method can produce carbonaceous heat sinks with a high carbonaceous percentage with a low cost. | 10-24-2013 |
20130292105 | SEGMENTED HEAT SINK FOR NATURAL-CONVECTION COOLED SYSTEMS - Various exemplary embodiments relate to a heat sink system. The heat sink system may include: a first heat sink segment including a first fluid inlet and a first fluid outlet having an outlet flow path; and a second heat sink segment including a second fluid inlet having an inlet flow path and a second fluid outlet. The second heat sink segment may be arranged in a placement position within the heat sink system so that the second fluid inlet receives fluid from substantially other sources than the first outlet flow path. Various exemplary embodiments relate to a heat sink segment. The heat sink segment may include: a base plate; a plurality of vertical fins; a horizontal wall; a first fluid opening; and a second fluid opening. The first fluid opening may face a different direction than the second fluid opening. | 11-07-2013 |
20130292106 | HEAT DISSIPATION STRUCTURE FOR LIGHT BULB ASSEMBLY - A heat dissipation structure for a light bulb assembly includes a holder, a heat dissipating cover, and a light seat. The holder includes a socket and a receiving space defined in the socket to receive a circuit board, the socket includes a first abutting portion formed on a peripheral side thereof and at least one first coupling portion arranged on a lateral side thereof. The heat dissipating cover includes a through hole for inserting the socket, and at least one cooling fin arranged around an outer peripheral side thereof. The light seat is used for installing a LED light, which includes a second coupling portion connected with the at least one first coupling portion, and a second abutting portion retaining the heat dissipating cover with the first abutting portion. | 11-07-2013 |
20130299154 | THERMAL MODULE AND MANUFACTURING METHOD THEREOF - A thermal module and a manufacturing method thereof. The thermal module includes a radiating fin assembly and a base seat. The radiating fin assembly has at least one folded edge on one side. The folded edge has at least one connection section. The base seat has at least one fixing section corresponding to the connection section. The fixing section is latched with the folded edge. A pressure is applied to the fixing section to plastically deform the fixing section and press the fixing section against the folded edge so as to securely connect the radiating fin assembly with the base seat. The thermal module can be assembled without welding so that the working time is shortened and the manufacturing cost is lowered. | 11-14-2013 |
20130299155 | HEAT DISSIPATION DEVICE ASSEMBLY STRUCTURE - A heat dissipation device assembly structure includes a heat dissipation unit and at least one fastening member. The heat dissipation unit has a bottom face and a locating section. The locating section is formed with at least one channel in communication with the bottom face. The fastening member is assembled on the bottom face. The fastening member has at least one latch section correspondingly inserted in the locating section. The fastening member further has at least one locking section on one side of the fastening member, which side is distal from the bottom face. The fastening member can be quickly assembled with the heat dissipation unit by means of inserting the latch section into the locating section of the heat dissipation unit. The heat dissipation device assembly structure has higher heat dissipation efficiency and is free from welding process so that the welding cost is saved. | 11-14-2013 |
20130299156 | SINK HEATING METHODS FOR PERFORMANCE AND SCALABILITY - A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique. | 11-14-2013 |
20130306291 | STRIP HEATSINK - A strip heatsink has a base, multiple dissipating strips and a fastening loop. The strip heatsink uses a row of the dissipating strips to replace one conventional fin, and a shape of the strip part of each dissipating strip is circular. Therefore a whole surface area of the row of the dissipating strips is much bigger. Besides, because a cross section area of the mounting part is bigger than a cross section area of the strip part in a dissipating strip, the strip parts of the dissipating strips are mounted separately, and the blocking of the airflow is reduced. Therefore, air can flow more smoothly in an interval between the strip parts. To sum up, the strip heatsink enhances the heat conduction by increasing the whole surface area, and enhances the heat convection by making more space between the dissipating strips. | 11-21-2013 |
20130306292 | APPARATUS FOR THE COMPACT COOLING OF MODULES - An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip. | 11-21-2013 |
20130306293 | EXTRUDED MATCHING SET RADIATORS - A thermal management system for use in a vacuum is provided including a heat generation device and a heat dissipation device. An extruded first heat transfer panel is mounted to a surface of the heat generation device and an extruded second heat transfer panel is mounted to a surface of the heat dissipation device. The first and second heat transfer panels are positioned between the heat generation device and the heat dissipation device. A portion of the first heat transfer panel and a portion of the second heat transfer panel are interposed. | 11-21-2013 |
20130306294 | HEAT DISSIPATION DEVICE WITH FASTENER - A heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and an elastic element coiled around the fastening element. The fastening element includes a pole portion and a head portion formed at one end of the pole portion. The conductive plate defines a supporting portion through the conductive plate. The supporting portion includes a hole and a groove communicating with the hole. A flange protrudes from a circumference of the pole portion. The pole portion enters the groove. The flange abuts a bottom of the conductive plate. The elastic element elastically abuts the top of the conductive plate. | 11-21-2013 |
20130306295 | METHOD AND MACHINE FOR MANUFACTURING A HEAT EXCHANGER BLOCK, FINS FOR MANUFACTURING A HEAT EXCHANGER BLOCK, AND HEAT EXCHANGER BLOCK - This invention relates to a method and machine for manufacturing a heat exchanger block, to fins for manufacturing a heat exchanger block, and to a heat exchanger block. There is provided a method of manufacturing a heat exchanger block( | 11-21-2013 |
20130306296 | SEMICONDUCTOR MODULE RADIATOR PLATE FABRICATION METHOD, RADIATOR PLATE, AND SEMICONDUCTOR MODULE USING THE SAME - When insulating substrates of different shapes are soldered to a radiator plate, a third concave curve is previously formed on an insulating substrate side of the radiator plate. The third curve is determined by adding a second concave curve which is expected at the time of actually soldering the insulating substrates to the radiator plate to a first concave curve obtained by moving upside down a convex curve which appears at the time of soldering the insulating substrates to a flat radiator plate. A bottom of the third curve is positioned under the large insulating substrate, and a curvature of a portion where the distance between the bottom and a reference point of the radiator plate is longer is made smaller than a curvature of a portion where the distance between the bottom and a reference point of the radiator plate is shorter. | 11-21-2013 |
20130319646 | HEAT TRANSFER - The invention relates to a method for transferring heat between a first material having a first temperature and a second material having a second temperature, wherein said first temperature is greater than said second temperature, said method comprising providing one or more rotatable elements, disposing said one or more rotatable elements such that a heat transfer portion thereof is thermally contactable with both said first material and said second material on rotation of said one or more rotatable elements, and rotating said one or more rotatable elements, whereby heat is transferred from said first material to said heat transfer portion and from said heat transfer portion to said second material. | 12-05-2013 |
20130319647 | METHOD FOR PRODUCING AN EXHAUST-GAS HEAT EXCHANGER - In a method of producing an exhaust-gas heat exchanger of a motor vehicle, at least one component of the exhaust-gas heat exchanger, e.g. an outer jacket or ducts arranged in the outer jacket or metal sheets, is subjected to an electrochemical machining process to produce a homogenous and smooth surface. The electrochemical machining process may involve plasma-polishing or electro-polishing. | 12-05-2013 |
20130319648 | FIN FOR A HEAT EXCHANGER - A fin for a heat exchanger, comprising a fin plate which is corrugated in a longitudinal direction and which is arranged between two structures and comprising a multiplicity of fin flanks formed by the corrugation, wherein the fin plate can be traversed in a depth direction by a flow of an in particular gaseous fluid for the purpose of transferring heat between the structures and the gaseous fluid, and wherein a multiplicity of gills with a gill depth and with a gill angle with respect to the depth direction is provided in the fin plate, said gills being arranged one behind the other on the fin flanks, running on a neutral line and extending substantially transversely with respect to the depth direction. The fin flanks have, at least in regions, a substantially undulating structure profile, resulting in an arrangement of the gills which runs on an undulating neutral line. | 12-05-2013 |
20130319649 | COOLING RING FOR WELDING BELLOWS GENERATING LESS METAL POWDER - Provided is a cooling ring for welding used to manufacture a bellows including a plurality of pairs of barriers, each pair formed of a first barrier and a second barrier disposed to face the first barrier. The cooling ring includes a body formed as a circular arc shape, disposed to attach the first barrier and the second barrier closely to each other while being in contact with at least one of the first barrier and the second barrier, the body including copper and a plating layer plating the body. The plating layer includes at least one selected from the group consisting of nickel and chrome. | 12-05-2013 |
20130327513 | HEAT EXCHANGER PLATE, PLATE HEAT EXCHANGER PROVIDED THEREWITH AND METHOD FOR MANUFACTURING A HEAT EXCHANGER PLATE - A heat exchanger plate for a plate heat exchanger includes a plate substrate formed at least on its upper side with a flow duct configuration having a multiplicity of flow ducts. Some or all of the flow ducts have duct webs, over an entire extent thereof or in sections, forming duct walls delimiting a duct groove of a respective flow duct. A plate heat exchanger and a method for manufacturing a heat exchanger plate for a plate heat exchanger are also provided. | 12-12-2013 |
20130333870 | ALUMINUM ALLOY POWDER METAL WITH HIGH THERMAL CONDUCTIVITY - An aluminum alloy powder metal is disclosed. A sintered part made from the aluminum alloy powder has a thermal conductivity comparable to or exceeding parts made from wrought aluminum materials. | 12-19-2013 |
20130340987 | HEAT-DISSIPATING BASE - A heat-dissipating base includes a main body. The main body has a basic portion. Four corners of the basic portion are respectively connected to a first extending arm, a second extending arm, a third extending arm and a fourth extending arm. Both sides of the first, second, third, and fourth extending arms are respectively provided with a first bending portion, a second bending portion, a third bending portion and a fourth bending portion. An end of the first, second, third, and fourth extending arms opposite to the basic portion is respectively formed with at least one positioning hole. The first, second, third and fourth bending portions are configured to increase the structural strength of the first, second, third and fourth extending arms respectively. | 12-26-2013 |
20130340988 | HEAT DISSIPATING STRUCTURE, HEAT DISSIPATING PAD, AND HEAT DISSIPATING BAG - A heat dissipating structure, a heat dissipating pad, and a heat dissipating bag which enable heat generated from an electronic device to be dissipated are introduced. The heat dissipating structure includes a substrate and a heat dissipating body disposed thereon. The heat dissipating body has a main rib and a plurality of auxiliary ribs. The main rib is half-wave shaped and protrudes from the substrate periodically. The auxiliary ribs flank the main rib to form a plurality of heat dissipating grooves therebetween and define a ratio. The heat dissipating pad and a plurality of heat dissipating bodies are alternately disposed on a substrate to effectuate heat dissipation. The heat dissipating bag not only dissipates heat generated from the electronic device but also contains the electronic device. | 12-26-2013 |
20130340989 | MULTICOMPONENT HEAT SINK WITH MOVABLE FIN SUPPORT PORTION - A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component. | 12-26-2013 |
20130340990 | RADIATIVE COOLING OF OPTOELECTRONIC DEVICES USING HYPERBOLIC METAMATERIALS - A method of radiative cooling of optoelectronic devices using a hyperbolic metamaterial TIM layer below the heat generating optoelectronics is disclosed. Optoelectronic devices are optimized for high radiative heat conductance due to broad hyperbolic frequency band in the Long-Wavelength Infrared (LWIR) range with an efficient electromagnetic black hole thermal interface between the metamaterial TIM layer and a metallic heat sink. A modified Stefan-Boltzmann law in the hyperbolic metamaterial layer enables domination of the radiative heat transfer in the TIM layer. The broadband divergence of the photonic density of states in hyperbolic metamaterials leads to an increase in radiative heat transfer, beyond the limit set by the Stefan-Boltzmann law. The resulting radiative thermal hyper-conductivity approach or even exceed heat conductivity via electrons and phonons in regular solids. | 12-26-2013 |
20130340991 | LAYOUT FOR ELECTRONIC COMPONENT TO BE COOLED, CHAMBER CONTAINING THE LAYOUT, VACUUM COOLING SYSTEM INCLUDING CHAMBER, METHOD OF USING THE VACUUM COOLING SYSTEM - The layout for an electronic component to be cooled during operation, said layout comprises a support ( | 12-26-2013 |
20130340992 | Composition For Forming Film - A substrate is surface treated using a composition for forming a film that comprises (A) an organoalkoxysilane, (B) an organopolysiloxane having a silicon-bonded hydrogen atom, and (C) a condensation reaction catalyst. This composition for forming a film can form a highly hydrophobic water repellent film provided with sufficient water shedding performance. It is possible to provide a highly hydrophobic substrate such as a heat dissipating body. | 12-26-2013 |
20140000854 | HEAT-DISSIPATION BASE STRUCTURE | 01-02-2014 |
20140000855 | HEAT DISSIPATION DEVICE WITH FASTENER | 01-02-2014 |
20140000856 | Silicon-Based Lens Support Structure And Cooling Package With Passive Alignment For Compact Heat-Generating Devices | 01-02-2014 |
20140000857 | REFRIGERANT REPELLING SURFACES | 01-02-2014 |
20140008049 | HEAT DISSIPATION BASE SEAT - A heat dissipation base seat includes a main body. A first extension arm, a second extension arm, a third extension arm and a fourth extension arm respectively extend from four corners of the main body. Two first bent sections respectively extend from two sides of the first extension arm. Two second bent sections respectively extend from two sides of the second extension arm. Two third bent sections respectively extend from two sides of the third extension arm. Two fourth bent sections respectively extend from two sides of the fourth extension arm. At least one locating hole is formed at a free end of each of the first, second, third and fourth extension arms, which free end is distal from the main body. By means of the first, second, third and fourth bent sections, the structural strengths of the extension arms are greatly increased. | 01-09-2014 |
20140008050 | Thermal interface pad material with perforated liner - This invention relates to a thermal interface device ( | 01-09-2014 |
20140014308 | Heat Sink and Electronic Device and Heat Exchanger Applying the Same - A heat sink includes a substrate, at least a first fin set and at least a second fin set. The first fin set is disposed on the substrate and has a plurality of first fins, and the first fin has a plurality of first holes. The second fin set is disposed on the substrate and has a plurality of second fins, and the second fin has a plurality of second holes. The total area of the second holes is larger than that of the first holes. An electronic device and a heat exchanger which are configured with the heat sink are also disclosed. The structure and configuration of the heat fins can increase the wind guiding effect, and thus improve the heat-dissipation efficiency. | 01-16-2014 |
20140014309 | HEAT SINK AND A METHOD OF FIXING THE SAME - The invention relates to a heat sink and a method of fixing the same. In one embodiment this is accomplished by a method for bonding a heat sink and an electronic device together, wherein the heat sink including a base member and a heat radiating portion the method comprising milling the base member in the midst of the heat sink of a predetermined depth, cleaning the milled surface of the heat sink with an activator, filling the milled surface of the heat sink with an adhesive for bonding with the electronic device and placing the heat sink on the electronic device and applying force for a predetermined amount of time period. | 01-16-2014 |
20140014310 | HEAT SINK - The invention relates to a improved heat sink In one embodiment this is accomplished by a base member and a heat radiating portion, wherein heat radiating portion includes a plurality of fins, wherein the distance between rows of the plurality of fins (fluid guide) are arranged such that they don't obstruct the horizontal flow of fluid or change the characteristic of the fluid substantially. | 01-16-2014 |
20140020878 | SYSTEMS AND METHODS FOR A PROTECTIVE CASING - Systems and methods for a protective casing are provided. In at least one embodiment, a protective casing includes a flexible insulation layer configured to inhibit thermal energy from conducting from an external side of the flexible insulation layer to an internal side of the flexible insulation layer. The protective casing also includes a microlattice layer abutting the internal side of the flexible insulation layer, the microlattice layer configured to distribute thermal energy that passes through the flexible insulation layer substantially throughout the microlattice layer. Further, the protective casing includes a heat absorbing material that impregnates the microlattice layer, the heat absorbing material configured to absorb the thermal energy in the microlattice layer. | 01-23-2014 |
20140020879 | HEAT SINK - A heat sink includes a plurality of fins. Each of the plurality of fins includes a fin body and a bent part located on one side of the fin body. The bent part of each of the plurality of fins includes an extension piece slanted relative to the fin body. | 01-23-2014 |
20140020880 | REMOVABLE RADIATOR FIN ASSEMBLY - A removable radiator fin assembly adapted to removably receive a radiator pipe. The removable fin assembly includes a first plurality of fins and a second plurality of fins having collar flanges sized to receive a radiator pipe. The fins are received on first and second spacer rods, respectively and are hingedly connected by a hinge rod such that the first and second plurality of fins are pivotally movable about the hinge rod between an open position and a closed position. In the open position, the first and second plurality of fins are positionable over the radiator pipe. In the closed position, the collar flanges of the first and second plurality of fins substantially surround the radiator pipe. A fin clamp secures the first and second plurality of fins together in the closed position about the radiator pipe. | 01-23-2014 |
20140020881 | COMPOSITE ARTICLE WITH MAGNETOCALORICALLY ACTIVE MATERIAL AND METHOD FOR ITS PRODUCTION - A composite article ( | 01-23-2014 |
20140020882 | HEAT SINK FOR LED LIGHTING - A heat sink for LED lighting formed of an aluminum material includes: a mounting face part having an LED element mounted on a surface thereof; a first fin part extending in a direction perpendicular to the mounting face part; and a second fin part extending in a direction perpendicular to the mounting face part and extending in a direction intersecting the first fin part. | 01-23-2014 |
20140027102 | AIR-COOLED ENGINE SURFACE COOLER - A surface cooler comprises a plate-like layer and a plurality of spaced-apart fins extending substantially perpendicular from an uppermost layer of the plate-like layer. The plurality of fins defining a plurality of air flow paths. The plurality of spaced-apart fins are configured to augment heat transfer of the surface cooler by increasing the turbulence levels of a fluid flowing through the airflow paths by promoting increased mixing with a resulting increase in the heat transfer coefficient of the surface cooler. A method of forming the surface cooler and an engine including the surface cooler. | 01-30-2014 |
20140034277 | HEAT SINK STRUCTURE AND METHOD OF MANUFACTURING SAME - A heat sink structure and a method of manufacturing same are disclosed. The heat sink structure includes a main body and a plurality of radiating fins. The main body has a plurality of coupling flutes circumferentially spaced along an outer surface thereof and longitudinally extended from a first end to a second thereof. The radiating fins respectively have a bent section integrally located between a first and a second heat radiating section. To quickly assemble the radiating fins to the main body, the radiating fins are disposed in a forming mold, and the main body is mechanically driven into the forming mold at a high speed, so that the bent sections of the radiating fins are longitudinally forced into the coupling flutes from the first to the second end of the main body to thereby tightly connect the radiating fins to the main body. | 02-06-2014 |
20140034278 | HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body. | 02-06-2014 |
20140034279 | HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. | 02-06-2014 |
20140034280 | HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased. | 02-06-2014 |
20140034281 | HEAT DISSIPATION MECHANISM - A heat dissipation mechanism is provided, comprising a main casing, an air exhaust device and a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing. | 02-06-2014 |
20140034282 | HEAT RADIATION COMPONENT AND METHOD FOR MANUFACTURING HEAT RADIATION COMPONENT - A heat radiation component includes a substrate including a predetermined surface, a plurality of carbon materials arranged with spaces in between, and a plating layer having a surface and including a plating material that fills the spaces between the plurality of carbon materials. At least one of the plurality of carbon materials is oriented orthogonal to the predetermined surface of the substrate. A part of each of the plurality of carbon materials protrudes from the surface of the plating layer in a direction opposite to the substrate. | 02-06-2014 |
20140041845 | LAMINATED ROLL OF SEALED GRAPHITE POUCHES AND METHODS FOR MAKING THE SAME - Laminated rolls of sealed graphite pouches and methods for making the same are provided. The laminated roll can include a first substrate having a length and a plurality of sealed pouches disposed on the substrate at predetermined intervals along its length. Each sealed pouch can include a graphite sheet having first and second sides, the first side affixed to the substrate, and a second substrate affixed to at least the second side of the graphite sheet and to a portion of the substrate to fully seal the graphite sheet within an enclosed space. In one embodiment, the roll of sealed graphite sheet pouches can be fixed to a roll of another substrate in a roll-to-roll fashion and the combined rolls can be cut into discrete portions for use in a particular application. For example, the roll of the other substrate can be a roll of enhanced spectral reflector (ESR). | 02-13-2014 |
20140048240 | THERMAL STRAPS FOR SPACECRAFT - Negative-stiffness-producing mechanisms can be incorporated with structural devices that are used on spacecraft that provide thermal coupling between a vibrating source and a vibration-sensitive object. Negative-stiffness-producing mechanisms can be associated with a flexible conductive link (FCL) or “thermal strap” or “cold strap” to reduce the positive stiffness of the FCL. The negative-stiffness-producing mechanism can be loaded so as to create negative stiffness that will reduce or negate the natural positive stiffness inherent with the FCL. The FCL will still be able to provide maximum thermal conductance while achieving low or near-zero stiffness to maximize structural decoupling. | 02-20-2014 |
20140048241 | HEAT SINK ASSEMBLY - An exemplary heat sink assembly includes a base plate for thermally contacting an electronic component and fins protruded from the base plate to dissipate heat transferred from the base plate by nature convection and thermal radiation. A heat conductive film is formed on an outer surface of the heat sink. A thermal radiation wavelength region of a far and middle infrared ray is located in a thermal radiation wavelength region of the heat conductive film. | 02-20-2014 |
20140048242 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 02-20-2014 |
20140054020 | METHOD FOR FABRICATING A HEAT SINK, AND A HEAT SINK - A method for fabricating a heat sink may include: providing a carbon fiber fabric having carbon fibers and openings, the openings leading from a first side to a second side of the fabric; and electroplating the fabric with metal, wherein metal is deposited with a higher rate at the first side than at the second side of the fabric. Another method for fabricating a heat sink may include: providing a carbon metal composite having metal-coated carbon fibers and openings, the openings leading from a first side to a second side of the carbon metal composite; disposing the composite over a semiconductor element such that the first side of the composite faces the semiconductor element; and bonding the composite to the semiconductor element by means of an electroplating process, wherein metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the openings. | 02-27-2014 |
20140054021 | METHOD AND PHASE-CHANGE GAIN-FIBER HOLDER THAT CONTROL TEMPERATURE RISE AND UNIFORMITY WITH MINIMAL STRESS - A thermal-management optical-fiber packaging system that includes an optical fiber and a temperature-management device configured to remove excess heat from the optical fiber. In some embodiments, the temperature-management device includes a first housing having a first outer-perimeter surface and an inner volume facing a first inner surface (wherein the inner volume has a length), a plurality of fiber-support members coupled to, and/or integral with, the first inner surface of the first housing, wherein each of the fiber-support members has one or more small-area-of-contact supports arranged along the length of the inner volume, and wherein each small-area-of-contact support is configured to provide a small area (e.g., a point) of contact with the optical fiber, and wherein the optical fiber follows a coiled path around the inner volume. A thermal-management material surrounds the optical fiber except at those locations where the optical fiber contacts the fiber-support members. | 02-27-2014 |
20140054022 | PLATE FIN HEAT EXCHANGER AND REPAIR METHOD FOR PLATE FIN HEAT EXCHANGER - In a heat exchanger of the present invention, a release port for, in a case where a fluid flows into an internal space, releasing the fluid to an exterior is provided in a protection unit main body of each of protection units arranged on both outer sides of a heat exchange unit, and a protection unit fin plate of the protection unit has such strength that a coupling state between an outer surface of an outermost-layer partition plate and a bonding plate of the protection unit main body facing the outer surface is maintained even in a case where an inner pressure set as a design pressure for a part of the heat exchange unit constituting an outermost-layer flow passage adjacent to the protection unit is applied to the internal space of the protection unit main body of the protection unit. | 02-27-2014 |
20140054023 | FORGING METHOD - The present invention is directed to a forging method for forming a heat sink | 02-27-2014 |
20140060790 | HEAT SINK, MANUFACTURING METHOD THEREOF AND TESTING METHOD OF HEAT-DISSIPATING CAPABILITY - An exemplary heat sink includes a heat-conducting substrate and a heat-conducting film formed on an outer surface of the substrate. A heat resistance of the heat-conducting film is lower than that of the heat-conducting substrate. A heat conductivity coefficient of the heat-conducting film is higher than that of the heat-conducting film. The heat-conducting film is thinner than the heat-conducting substrate, and a thickness of the heat-conducting film is in a range from about 0.025 mm to about 0.05 mm. | 03-06-2014 |
20140060791 | HEAT DISSIPATION DEVICE HAVING FASTENER - A heat dissipation device includes a base and a fastener. The fastener includes a clasping portion, an elastic member placed and a first gasket. The clasping portion includes a fixing part, an operating part, and a connecting part connected to the fixing part and the operating part. The connecting part defines a slip groove. The first gasket interferingly fits the slip groove of the clasping portion. The elastic member is placed around the connecting part of the clasping portion and is arranged between the operation part and the first gasket. The first gasket abuts the base after the fixing part extending through the base. | 03-06-2014 |
20140060792 | Method and Apparatus to Reduce Thermal Stress by Regulation and Control of Lamp Operating Temperatures - A fluid input manifold distributes injected fluid around the body of a bulb to cool the bulb below a threshold. The injected fluid also distributes heat more evenly along the surface of the bulb to reduce thermal stress. The fluid input manifold may comprise one or more airfoils to direct a substantially laminar fluid flow along the surface of the bulb or it may comprise a plurality of fluid injection nozzles oriented to produce a substantially laminar fluid flow. An output portion may be configured to facilitate fluid flow along the surface of the bulb by allowing injected fluid to easily escape after absorbing heat from the bulb or by applying negative pressure to actively draw injected fluid along the surface of the bulb and away. | 03-06-2014 |
20140060793 | PLATE-TYPE HEAT EXCHANGER AND SUPPORT STRUCTURE THEREOF - A plate-type heat exchanger includes a casing having a chamber therein; and a support structure in the chamber and including a plurality of frameworks, any two of the frameworks distributing to each other at a distance; and a plurality of support portions, the support portions connecting with the frameworks in order to surround a plurality of hollow areas and being vertical, each of the support portions and each of the frameworks being combined by means of a twisted stagger; wherein the upper and lower positions of the support portion form an urging edge respectively, the two urging edges being against the upper inner side and the lower inner side of the casing respectively. | 03-06-2014 |
20140069622 | HEAT DISSIPATION COMPOSITE AND THE USE THEREOF - A multi-layer heat dissipation composite for reducing the external surface temperature of an electronic device is disclosed. The heat dissipation composite comprises a reflective component and a component with anisotropic property. The heat dissipation composite further comprises an adhesive. Some embodiments also provide methods for reducing the external surface temperature of an electronic device. | 03-13-2014 |
20140069623 | METHOD OF MANUFACTURING HEAT DISSIPATING BASE, HEAT DISSIPATING BASE AND HEAT DISSIPATING DEVICE - A method of manufacturing a heat dissipating base includes steps of providing a first base, wherein the first base is made of a first heat conducting material; putting the first base into a mold; pouring a second heat conducting material, which is melted, into the mold, wherein a thermal conductivity of the first heat conducting material is larger than that of the second heat conducting material; and processing the second heat conducting material by a die casting process, so as to form a second base, wherein the second base covers a periphery of the first base and an upper surface and a lower face of the first base are exposed. | 03-13-2014 |
20140069624 | FABRICS AND OTHER SUBSTRATES WITH ENHANCED COOLING - An article made up of a substrate which has a polymer coating applied to at least one of its surfaces, wherein the polymer coating forms an interrupted pattern such that at least 10% to 80% of the substrate surface remains uncoated, and wherein the polymer coating comprises a moisture permeable polymer. | 03-13-2014 |
20140076529 | HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums. | 03-20-2014 |
20140083669 | HEAT SINK - A heat sink includes a bottom plate, a number of first fins extending up from the bottom plate, and a number of second fins. The second fins are detachably connected to tops of the corresponding first fins. | 03-27-2014 |
20140083670 | THERMAL TRANSPIRATION DEVICE AND METHOD OF MAKING SAME - A thermal transpiration device and method of making the same. The device includes a pair of membranes having predetermined thicknesses in order to provide the device with strength and rigidity. The thickness of a portion of each membrane is reduced in the area where thermal transpiration occurs in order to optimize the effectiveness of the thermal transpiration device without scarifying structural integrity of the device. | 03-27-2014 |
20140083671 | HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME - A heat radiating plate | 03-27-2014 |
20140090828 | Radiative Transfer and Power Control with Fractal Metamaterial and Plasmonics - Systems according to the present disclosure provide one or more surfaces that function as heat or power radiating surfaces for which at least a portion of the radiating surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface (plasmonic) wave causes near replication of current present in one fractal cell in an adjacent fractal cell. A fractal of such a fractal cell can be of any suitable fractal shape and may have two or more iterations. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges. | 04-03-2014 |
20140102686 | THERMAL EXTRACTION USING RADIATION - In one embodiment of the present disclosure, a device is disclosed comprising a macroscopic thermal body and an extraction structure that is electromagnetically-coupled to the thermal emitting area of the thermal body. The macroscopic thermal body having a thermal emitting area, and the extraction structure configured and arranged to facilitate emission from, or receipt to the thermal emitting area that exceeds a theoretical, Stefan-Boltzmann, emission limit for a blackbody having the same thermal emitting area as the thermal body. | 04-17-2014 |
20140102687 | THERMAL INTERFACE MATERIAL - A thermal interface material includes a low melting point metal matrix and a number of carbon nanotube arrays disposed in the low melting point matrix. The low melting point metal matrix includes a first surface and a second surface opposite to the first surface. Each carbon nanotube array includes a number of carbon nanotubes substantially parallel to each other. A number of first interspaces are defined between adjacent carbon nanotube arrays. The carbon nanotubes of the carbon nanotube arrays extend from the first surface to the second surface. | 04-17-2014 |
20140110096 | MAXIMIZING THE LIGHTING EFFICIENCY OF LED LAMPS - Disclosed is a method of making an LED light bulb using a plurality of surface mount light emitting diodes mounted on a variety of semiregular polyhedrons and optimizing the number and placement of the surface mount light emitting diodes for the widest lighting angle (to achieve as close to 360-degrees in three dimensions) with a heat sink matched to the thermal output of the surface mount light emitting diodes and the heat conductive capacity of the polyhedron. Also described are a light emitting diode light bulb made using a plurality of surface mount light emitting diodes mounted on a variety of semiregular polyhedrons. Some embodiments may include a heat conductor comprising a plurality of curved-T shaped heat fins. | 04-24-2014 |
20140116669 | HEAT-CONDUCTING STRUCTURE AND HEAT EXCHANGER AND HEAT-EXCHANGING SYSTEM USING THEREOF - A heat-conducting structure comprises a heat-conducting metal layer, a heat-conducting support layer, and a heat-conducting protection layer. The heat-conducting support layer is formed to enclose the heat-conducting metal layer thereby preventing the heat-conducting metal layer from thermal deformation, while the heat-conducting protection layer is formed to enclose the heat-conducting support layer. In another embodiment, the heat-conducting structures are utilized to form a heat exchanger or a heat-exchanging system comprising a heat-absorbing zone and a heat-dissipating zone, whereby a high-temperature fluid is guided to flow through the heat-absorbing zone for transmitting the heat to the heat-conducting structures within the heat-absorbing zone through heat convention and the heat-exchanging structures conducting the heat to the heat-dissipating zone such that a low-temperature fluid passing therethrough can absorb the heat dissipated from the heat-exchanging structures within the heat-dissipating zone and transmit the heat energy out of the heat exchanger or the heat-exchanging system. | 05-01-2014 |
20140116670 | HEAT SINK AND COOLING SYSTEM INCLUDING THE SAME - Disclosed herein is a heat sink including: a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections. | 05-01-2014 |
20140116671 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink. The heat sink includes a base. The base defines a hermetic space. The base includes a panel body and a plurality of magnetic posts extending from the panel body. The plurality of magnetic posts are located in the hermetic space. | 05-01-2014 |
20140116672 | Stacked-Plate Heat Exchanger With Single Plate Design - A plate-type heat exchanger comprising a plurality of spaced-apart stacked plate pairs, the plate pairs each comprised of first and second plates. The first and second plates each having an elongated central, planar portion surrounded by peripheral edge portions, the peripheral edge portions of the first and second plates being sealably joined together to form a first set of fluid passages in the heat exchanger. The first and second plates are provided with boss potions at respective ends of the plates, one of the boss portions being an elongated boss portion having a first position and a second position for the location of a fluid opening. The first and second heat exchanger plates are identical in structure and can be used to form various heat exchangers using the single plate design. | 05-01-2014 |
20140124185 | Silicon-Based Thermal Energy Transfer Device And Apparatus - A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove. | 05-08-2014 |
20140124186 | RADIATION MEMBER - A radiation member includes a base material; and a composite plating layer, formed on the base material, that includes a metal layer and two or more kinds of carbon materials, having different diameters from each other, dispersed in the metal layer such that to be provided with a plurality of protruding portions, each of the protruding portions being composed by a part of each of the carbon materials that are protruded from a surface of the metal layer. | 05-08-2014 |
20140124187 | FLUID WARMING OR COOLING SYSTEM - The present invention relates to a multilayer fluid heat exchanger container comprising a thermo-conductive sheet, said sheet comprising at least a first layer comprising a metal foil and at least a second layer comprising a biocompatible plastic material, a multilayer sheet for the fluid container and systems for heating or cooling a fluid comprising the container and a fluid heating or cooling device for receiving the container. The present invention further relates to methods for heating or cooling a fluid comprising the step of circulating a fluid through the container and a process for the manufacture of the fluid container. | 05-08-2014 |
20140131023 | STRUCTURES FOR RADIATIVE COOLING - Various aspects as described herein are directed to a radiative cooling device and method for cooling an object. As consistent with one or more embodiments, a radiative cooling device includes a solar spectrum reflecting structure configured and arranged to suppress light modes, and a thermally-emissive structure configured and arranged to facilitate thermally-generated electromagnetic emissions from the object and in mid-infrared (IR) wavelengths. | 05-15-2014 |
20140131024 | OUTDOOR UNIT FOR AIR CONDITIONER - An outdoor unit for an air conditioner, comprising: a heat exchanger disposed inside a housing; and a bottom plate of the housing, including, a bottom plate portion, a flange formed by upwardly folding back an edge of the bottom plate portion, a drainage hole penetrating the bottom plate portion and configured to discharge water, a plurality of mounting bases protruding upwardly from the bottom plate portion and supporting a lower end of the heat exchanger by upper surfaces thereof, and a drainage conduit provided in contact with the mounting bases and inclining downward toward the drainage hole, wherein a portion of the bottom plate portion positioned between at least one of the plurality of the mounting bases and the flange includes an inclined portion which is inclined toward the drainage conduit in a longitudinal direction of the flange. | 05-15-2014 |
20140131025 | HEAT TRANSFER PLATE FOR A PLATE-AND-SHELL HEAT EXCHANGER - A heat transfer plate configured to be arranged in a plate-and-shell type plate heat exchanger. The heat transfer plate comprises an inlet port and an outlet port. The inlet port has a first inlet section that faces the outlet port and comprises a first fluid blocker, for distribution of at least a part of a flow of fluid over a second inlet section of the inlet port. The outlet port has a first outlet section that faces the inlet port and comprises a second fluid blocker, for distribution of at least a part of the flow of fluid over a second outlet section of the outlet port. Corrugations are arranged intermediate the inlet port and the outlet port. | 05-15-2014 |
20140138074 | HEAT SINK MODULE - A heat sink module includes a base block having opposing top wall and bottom wall, insertion grooves located at the top wall, heat pipe grooves located at the bottom wall and rows of equally spaced holes cut through the top and bottom walls in communication between the insertion grooves and the heat pipe grooves and matching the insertion grooves, heat pipes mounted in the heat pipe grooves of the base block, and radiation fins respectively mounted in the insertion grooves of the base block, each radiation fin having heat pipe mating edges respectively inserted into the holes and stopped against the heat pipes for dissipating heat from the heat pipes. | 05-22-2014 |
20140138075 | HEAT EXCHANGER AND SEMICONDUCTOR MODULE - A heat exchanger suitable for cooling a heat source is provided, wherein a bypass channel formed in the heat exchanger has a width greater than a width of other channels to reduce a flow resistance of a fluid and a pumping power for driving a system. That is, under the same pumping power loss, more fluid is driven to achieve a better heat dissipation effect. By applying the heat exchanger, electronic devices are bonded to a top of the heat exchanger through a supporting substrate. In this way, heat generated when the electronic devices are is transferred to the heat exchanger through the supporting substrate and dissipated to the outside via the heat exchanger. Since the distance of heat transfer is decreased, the thermal resistance generated by an interface between the devices is reduced to improve heat transfer efficiency and heat dissipation effect. | 05-22-2014 |
20140144613 | ALUMINUM ALLOY CLAD MEMBER ADOPTED TO HEAT EXCHANGER, AND CORE MATERIAL FOR THE SAME - A core material for an aluminum alloy clad material contains Si in a content of 0.3% to 1.5% (hereinafter “%” means “percent by mass”), Mn in a content of 0.3% t 2.0%, Cu in a content of 0.3% to 1.5%, Ti in a content of 0.01% to 0.5%, and B in a content of 0.001% to 0.1%, with the remainder including Al and inevitable impurities. The core material and an aluminum alloy clad material using the same ensure sufficient corrosion resistance and give a product having an extended life. | 05-29-2014 |
20140151009 | THERMAL INTERFACE ELEMENT AND METHOD OF PREPARATION - An article and method of assembling the article is disclosed. The method of assembling includes positioning a pre-fabricated thermal interface element between a heat source and a heat-sink. The pre-fabricated thermal interface element includes an indium substrate and a plurality of nanosprings disposed on the indium substrate. | 06-05-2014 |
20140151010 | HEAT SINK - A heat sink includes a base having a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. A cooling fin extends a height outwardly from the environmental side of the base. The cooling fin extends a cord length along the base from a leading edge to a trailing edge of the cooling fin. The cooling fin includes the cross-sectional shape of an airfoil along at least a portion of the height of the cooling fin to increase the velocity of a flow of air along the cord length of the cooling fin. | 06-05-2014 |
20140151011 | HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME - A heat exchanger and a method of manufacturing the same are provided. With the heat exchanger and method of manufacturing, a tube may be inserted into a through hole formed in a fin coated with a filler metal, the tube may be expanded using a tube expansion ball, and the tube and the fin may be joined through the filler metal by brazing processing. The tube may be made of aluminum (Al). An interval between an outer circumferential surface of the tube and an inner circumferential surface of the fin collar before expanding the tube may be approximately 0.1 mm or more, and the tube may be expanded so that the interval between the outer circumferential surface of the tube and the inner circumferential surface of the fin collar is approximately 0.1 mm or less. Accordingly, a heat transfer performance of the heat exchanger may be improved. | 06-05-2014 |
20140151012 | HEAT SINK WITH STAGGERED HEAT EXCHANGE ELEMENTS - A heat sink comprising a base, a first row of metal fins and a second row of wedge-shaped vortex generators. The first row of metal fins can be connected to and raised above a surface of the base, long dimensions of the metal fins being substantially parallel to each other and to the surface. The second row of wedge-shaped vortex generators can be connected to and raised above the base, each of the wedge-shaped vortex generators having a long dimension that is substantially parallel to the long dimensions of others of the wedge-shaped vortex generators and to the surface. The first and second rows can be substantially opposed to each other such that first ends of the metal fins are staggered with respect to first ends of the wedge-shaped vortex generators. | 06-05-2014 |
20140151013 | METHOD FOR FORMING A COMPOSITE MATERIAL, AND HEAT SINK - A method for forming a carbon-metal composite material for a heat sink, comprising the following steps: applying at least one layer comprising carbon particles and at least one layer comprising metal particles on top of one another; and fusing of the layers by irradiating the layers with laser radiation to form the carbon-metal composite material. The invention also relates to a heat sink having a shaped body that comprises a plurality of layers, each layer containing carbon particles in a metal matrix. | 06-05-2014 |
20140158334 | THERMAL MANAGEMENT SYSTEM WITH VARIABLE-VOLUME MATERIAL - A thermal management system configured to be installed between a heat source and a heat sink, including a first heat conductor and a second heat conductor, a thermal switch configured to allow or prevent thermal connection between the first and second heat conductors, the thermal switch including at least one thermally conductive material that can connect the first and second conductors by a change in its volume, and the thermal switch including a controller configured to transfer thermal energy to the phase-change material to change a connection state. The connection is made when the heat source goes above a critical temperature, since the connection enables a heat flux to be established between the heat source and the heat sink. | 06-12-2014 |
20140158335 | CLAD MATERIAL FOR COOLER, COOLER FOR HEAT-GENERATING DEVICE, AND METHOD OF PRODUCING COOLER FOR HEAT-GENERATING DEVICE - A clad material for a cooler is provided by executing production of a tensile strain of 3 to 10% or rolling at a finish rolling ratio of 10 to 25%, and optionally performing a heat treatment for 1 to 8 hours at a temperature within a range from 150 to 400° C., on a clad raw material having a three layer structure of a core material, a first brazing filler metal layer that covers one side (the surface on the side of a cooling water passage) of this core material, and a second brazing filler metal layer that covers the other side (the surface on the opposite side from the cooling water passage). Specific ranges are prescribed for certain properties before and after brazing. | 06-12-2014 |
20140166257 | HEAT DISSIPATION COMPOSITE - Disclosed herein is a heat dissipation composite having a metal substrate, a metal bonding layer, and a ceramic layer. The metal bonding layer has a melting point lower than that of the metal substrate and is formed on the metal substrate through metal-to-metal bonding. The ceramic layer is composed of ceramic powders and is covered on and bonded to the metal bonding layer opposite to the metal substrate. | 06-19-2014 |
20140166258 | HEAT CONDUCTIVE SHEET - The present invention provides a heat conductive sheet that can maintain high heat conductivity and flexibility across a long period of time even in high temperature environments. The heat conductive sheet includes a (meth)acrylate polymer, a trimellitate ester plasticizer, a first antioxidant with a hindered phenol backbone, and a second antioxidant with a thioether backbone. | 06-19-2014 |
20140174704 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first board body and a second board body. The first board body has a first face and a second face. The second face is formed with a rough structure. The second board body has a third face and a fourth face. The fourth face is mated with the second face and covered by the second face. The second and fourth faces together define a chamber. A working fluid is filled in the chamber. The rough structure is coated with a coating. By means of the rough structure and the coating, the cost for the heat dissipation device is reduced and the thermal resistance of the heat dissipation device is lowered. | 06-26-2014 |
20140174705 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink and a grease cover. The heat sink includes a bottom plate. A layer of thermal grease is attached to a bottom surface of the bottom plate. A number of fasteners are mounted to the bottom plate. The grease cover defines a receiving recess for receiving the thermal grease. A number of magnets are fastened to the grease cover and attract the fasteners. | 06-26-2014 |
20140174706 | THERMAL CONDUCTIVE STRESS RELAXATION STRUCTURE - A thermal conductive stress relaxation structure is interposed between a high-temperature substance and a low-temperature substance to conduct heat in a heat-transfer direction from the high-temperature substance to the low-temperature substance. The structure includes an assembly configured such that a thermal conductive material gathers in a non-bonded state having stress relaxation effect. Such an assembly is a rolled-up body configured such that a carbon-based sheet material and a metal-based sheet material are alternately rolled up, for example. This structure has one or more interfaces at which adjacent parts can slide, thereby dividing a deformable region to relax the thermal stress. It has a low rigidity and can thus deform to release the thermal stress. The structure can suppress the thermal stresses and the shape changes that would be generated in the high-temperature substance and the low-temperature substance, and each physical body located there between. | 06-26-2014 |
20140182830 | Graphene composite hand-held and hand-heated thawing tool - The present invention provides a hand-held and hand-heated thawing tool comprising a handling portion and a functional portion wherein one or both portions comprises a composite material comprising 1-90% by weight of a conductivity-enhancing graphene phase dispersed in or bonded by a matrix material of 10-99% by weight based on a total composite weight, and wherein the handling portion, when being held by a human hand, transfers heat from the hand to the functional portion for thawing or melting a food item, such as butter and ice cube. By holding such a tool, a person can use his or her own body heat to rapidly thaw a slice of butter, or melt and cut through a block of ice without the assistance of any other heating tool (e.g. an oven). | 07-03-2014 |
20140182831 | Multiple Layered Radiant Active Assembly - An active insulated assembly for controlling heat transfer through insulated assemblies. The active insulated assembly includes a thermal conductor configured to actively move thermal energy from the active insulated assembly. The active insulated assembly also includes a first radiant barrier on a first side of the thermal conductor configured to reflect radiant energy back to its source and allow the assembly to resist heat transfer in either direction. The active insulated assembly further includes a second radiant barrier on a second side of the thermal conductor wherein the second side is opposite the first side, the second radiant barrier configured to reflect radiant energy back to its source and allow the assembly to resist heat transfer in either direction. | 07-03-2014 |
20140190676 | Unitary graphene material-based integrated finned heat sink - A unitary graphene-based integrated heat sink comprising a heat collection member (base) and at least one heat dissipation member (e.g. fins) integral to the baser, wherein the base is configured to be in thermal contact with a heat source, collects heat therefrom, and dissipates heat through the fins. The unitary graphene material is obtained from heat-treating a graphene oxide gel at a temperature higher than 100° C., 500° C., 1,250° C., or 2,000° C., and contains chemically bonded graphene molecules having inter-graphene distance of 0.3354-0.4 nm (preferably <0.337 nm). The unitary graphene material is a graphene single crystal, a poly-crystal with incomplete grain boundaries, or a poly-crystal having large grain sizes (e.g. >mm or cm), exhibiting a degree of graphitization preferably from 1% to 100% and a Mosaic spread value less than 0.7 (preferably no greater than 0.4). The finned heat sink may also be made from a filler-reinforced graphene matrix composite. | 07-10-2014 |
20140190677 | THERMAL STRAPS FOR SPACECRAFT - Negative-stiffness-producing mechanisms can be incorporated with structural devices that are used on spacecraft that provide thermal coupling between a vibrating source and a vibration-sensitive object. Negative-stiffness-producing mechanisms can be associated with a flexible conductive link (FCL) or “thermal strap” or “cold strap” to reduce the positive stiffness of the FCL. The negative-stiffness-producing mechanisms can be loaded so as to create negative stiffness that will reduce or negate the natural positive stiffness inherent with the FCL. The FCL will still be able to provide maximum thermal conductance while achieving low or near-zero stiffness to maximize structural decoupling. | 07-10-2014 |
20140196878 | THERMAL DISSIPATER APPARATUS FOR USE WITH ELECTRONIC DEVICES - Thermal dissipater apparatus for use with electronic devices. An example heat dissipater apparatus disclosed herein includes a body defining a lateral wall. A first wall projects from an inner surface of the lateral wall to define a first cavity, and a second wall projects from the inner surface of the lateral wall to define a second cavity. The first wall isolates the first cavity from the second cavity. | 07-17-2014 |
20140196879 | HEAT SINK THERMAL PRESS FOR PHASE CHANGE HEAT SINK MATERIAL - Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards. | 07-17-2014 |
20140202675 | HEAT DISSIPATION UNIT USED IN MEMORY DEVICE - A heat dissipation unit used in a memory device includes two heat dissipation sheets, two sides at the top edge of each heat dissipation sheet are bent for respectively forming two lugs having a height difference, and two buckle pieces having a height difference between the two lugs, wherein each lug and each buckle piece of a heat dissipating sheet is mutually stacked onto a corresponding lug and buckle piece of the other heat dissipating sheet, respectively. | 07-24-2014 |
20140202676 | FIXING ASSEMBLY FOR HEAT SINK - A fixing assembly includes a main body, a fixing member, and a limiting member secured to the main body. The limiting member angles with the main body to form a limited but resiliently deformable space for mounting of the fixing member, but then restores to hold the fixing member captive and avoid the displacement or loss of the fixing member at any time. A heat sink using the fixing assembly is also provided. | 07-24-2014 |
20140202677 | ORIGINAL PLATE MATERIAL FOR HEAT-EXCHANGING PLATE AND HEAT-EXCHANGING PLATE USING THE SAME - An original plate material for a heat exchanging plate includes a titanium flat plate material including a minute recess and projections on the surface thereof, and the flat plate material is press-worked to obtain the heat exchanging plate. The shape parameter, defined as [height (μm) of the projections]×[width (μm) of the recess/pitch (μm) of adjacent projections], is 85 μm or less. Relating to this original plate material for a heat exchanging plate, the shape parameter, defined as [height (μm) of the projections]×[width (μm) of the recess/pitch (μm) of adjacent projections/angle (deg) of the projections], is 0.94 μm/deg or less. | 07-24-2014 |
20140209287 | ROLLER FOR FORMING HEAT TRANSFER ELEMENTS OF HEAT EXCHANGERS - A roller for forming heat transfer elements may include a central shaft and a plurality of roller elements. The plurality of roller elements may be stacked on the central shaft. Each roller element defines an outer periphery, which is configured to include a geometrical characteristic thereacross. The stacked roller elements, either stacked on the central shaft or stacked without using the central shaft, configures the roller with a circumferential surface corresponding to the geometrical characteristic of the stacked roller elements, to form the heat transfer elements corresponding to the circumferential surface. | 07-31-2014 |
20140216703 | HEAT SINK - A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger having a base and cooling fins. The base has a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame. | 08-07-2014 |
20140231060 | Method for closing a housing by means of an optical joining method - A housing includes first and second housing elements, each of which is heat conductive. The housing elements are joined by a joining process in which a joining material is configured between the first and second housing elements and at least one of the housing elements is heated such that the joining material is conditioned for the joining of the housing elements. At least one of the housing elements has a localized reduction in the heat conductivity such that the dissipation of heat in the at least one housing element is reduced. | 08-21-2014 |
20140238651 | Heat Exchanger Assembly - The present application provides a heat exchanger assembly. The heat exchanger assembly may include a folded fin core with a ridge end and a trough end, a first end plate positioned about the ridge end of the folded fin core, a second end plate positioned about the trough end of the folded fin core, and with the first end plate and the second end plate including a number of protrusions thereon. | 08-28-2014 |
20140238652 | TECHNICAL PLATE - A technical can cool or heat food by the use of a PCM gel or Phase Change Material, injected at the bottom or the containment chamber of the technical plate. The chamber is designed to contain said PCM material. The technical plate is essentially composed of two parts: an upper and a lower, the upper part forming a support plane whose surface is apt to support, chill or heat the food, and the lower part is in the manner of the box-shaped body having at least a containment chamber of the PCM material. The supporting surface is preferably induction welded, forming an integral part with the lower part or box-shaped body with the containment chamber of the PCM material, after the PCM material has been injected to fill the said containment chamber. | 08-28-2014 |
20140238653 | HEAT SINK OF POROUS GRAPHITE - A heat sink using porous graphite having graphite particle-stacked porous graphite is provided. The heat sink may provide good heat conductivity and improve strength of carbon foam. | 08-28-2014 |
20140251588 | HEAT-DISSIPATING MEMBER AND METHOD FOR PRODUCING SAME - The present invention provides a heat dissipating member containing a fluorine resin and a thermally-conductive filler and having good adhesive properties. The present invention is a heat dissipating member including: a porous base material containing a fluorine resin and a thermally-conductive filler; and an adhesive material contained in pores of the porous base material. The fluorine resin contains polytetrafluoroethylene. | 09-11-2014 |
20140262191 | THERMAL INTERFACE MATERIALS - A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material. | 09-18-2014 |
20140262192 | THERMALLY REVERSIBLE THERMAL INTERFACE MATERIALS WITH IMPROVED MOISTURE RESISTANCE - The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×10 | 09-18-2014 |
20140262193 | EDGE RING COOLING MODULE FOR SEMI-CONDUCTOR MANUFACTURE CHUCK - An edge ring cooling module for semiconductor manufacturing chuck is provided which effectively cools the edge ring equipped in electrostatic chuck. The edge ring cooling module forcibly exhausts the heat of an edge ring ( | 09-18-2014 |
20140262194 | FLOW DIVERTERS TO ENHANCE HEAT SINK PERFORMANCE - A heat sink comprising a base, fins attached to the base and a flow diverter in contact with the base or at least one of the fins. The flow diverter has a rectangular cross-sectional profile in a plane that is coplanar with and elevated above a plane of the base and spanning the entire separation distance, and, a segment of the flow diverter is angled towards the base to direct the fluid flow towards the base. | 09-18-2014 |
20140284038 | HEAT EXCHANGER DESIGN AND FABRICATION - A method of forming a heat exchanger for use with a rotating component configured to rotate about an axis of rotation is provided including generating a stereolithography file of the surface geometry of the heat exchanger. The surface geometry of the heat exchanger includes a cylindrical base having a plurality of fins extending generally radially therefrom. The surface geometry defined in the stereolithography file is ‘sliced’ into a plurality of axisymmetric layers, perpendicular to the axis of rotation. Energy from an energy source is applied to a powdered material causing the powdered material to fuse and form the plurality of axisymmetric thin layers. Each of the axisymmetric thin layers is integrally formed with an adjacent axisymmetric thin layer to create a unitary heat exchanger. | 09-25-2014 |
20140284039 | THERMAL ENERGY GUIDING SYSTEMS INCLUDING ANISOTROPIC THERMAL GUIDING COATINGS AND METHODS FOR FABRICATING THE SAME - Thermal energy guiding systems and methods for fabricating thermal energy guiding systems are provided. A thermal energy guiding system includes a thermal energy source and an anisotropic thermal guiding coating in thermal communication with a surface of the thermal energy source. The anisotropic thermal guiding coating includes a plurality of layers including a first layer and a second layer. The first layer has a first thermal conductivity and the second layer has a second thermal conductivity. The plurality of layers are non-uniformly arranged on the surface of the thermal energy source in order to guide thermal energy from the thermal energy source according to a thermal energy management objective. | 09-25-2014 |
20140284040 | HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY - Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps. | 09-25-2014 |
20140290925 | FLOW DIVERTERS TO ENHANCE HEAT SINK PERFORMANCE - A heat sink comprising a base, fins attached to the base and a flow diverter in contact with the base or at least one of the fins. The flow diverter has a rectangular cross-sectional profile in a plane that is coplanar with and elevated above a plane of the base and spanning the entire separation distance, and, a segment of the flow diverter is angled towards the base to direct the fluid flow towards the base. | 10-02-2014 |
20140290926 | Silicon-Based Heat-Dissipation Device For Heat-Generating Devices - Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device. | 10-02-2014 |
20140305623 | HEAT SINK MOUNTING APPARATUS AND METHOD - A heat sink mounting apparatus including: a heat sink; and a device housing, the housing having a slot in the wall of the housing configured to receive a heat sink, wherein the heat sink and the housing are configured such that the heat sink can be secured within the slot with an interference fit. | 10-16-2014 |
20140318757 | HEAT SINK INCORPORATING INTERLOCKED FIN - An exemplary heat sink includes a plurality of fins interconnected together. Each of the fins includes a main body and at least an engaging portion extending outwardly from the main body. The engaging portions of every two adjacent fins are interlocked with each other. The engaging portion includes a base extending outwardly from the main body, an engaging groove defined at a lateral side of the base, and an inserting rib protruding outwardly from another lateral side of the base opposite to the engaging groove. In the two adjacent fins, the inserting rib of the engaging portion of one fin is fitly inserted into the engaging groove of the engaging portion of another fin. | 10-30-2014 |
20140318758 | COMPOSITE LAMINAE HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MANAGEMENT APPARATUSES COMPRISING THE SAME - Heat transfer management apparatuses according to the present disclosure includes a composite lamina having an insulator substrate and a thermal conductor at least partially embedded in the insulator substrate, a temperature-sensitive component coupled to the composite lamina, and a temperature-insensitive component coupled to the composite lamina and positioned distally from the temperature-sensitive component. The temperature-insensitive component produces heat during operation. The thermal conductor and the insulator substrate are arranged into a targeted heat transfer region proximate to the temperature-sensitive component and a bulk region proximate to the temperature-insensitive component. The targeted heat transfer region and the bulk region are in thermal continuity with one another. | 10-30-2014 |
20140326441 | CLUSTER OF INCLINED STRUCTURES - The present invention involves both the geometrical specification of a structure and positioning the structure in the cluster layout to achieve rapid heating/cooling as a medium transverses through them, and with little pressure drop penalty. | 11-06-2014 |
20140332193 | THERMALLY-CONDUCTIVE ELASTIC BODY - Disclosed is a thermally-conductive elastic body that effectively dissipates heat generated from a heat generation source such as an electronic product and prevents a phenomenon in which small graphite fragments are separated from (fall off) a graphite layer by completely sealing up the graphite layer that conducts the heat. The thermally-conductive elastic body according to the embodiments of the present disclosure includes an elastic body and a thermally conductive layer that is formed to be wrapped around an external surface of the elastic body, in which the thermally conductive layer includes a first base film and a graphite layer that is internally arranged within an edge region of the first base film, and in which the edge region of the first base film is attached to the elastic body in such a manner that the graphite layer is sealed up. | 11-13-2014 |
20140332194 | APPARATUS, SYSTEMS AND METHODS FOR REDUCING NOISE GENERATED BY ROTATING COUPLINGS AND DRIVES - A heat sink element for a device is operable by relative rotation of a conductor rotor assembly and a magnet rotor assembly. The heat sink element includes a base portion and a plurality of fins. The base portion includes a mounting face that is sized and dimensioned to be coupled to the conductor rotor assembly, and an opposing convective heat transfer face. The plurality of fins extend from the convective heat transfer face of the base portion. Adjacent fins are separated by a channel that extends along a longitudinal direction of the fins. The fins include at least one surface disruption on a top surface thereof. | 11-13-2014 |
20140338878 | Two Piece Aluminum Heat Sink - A heat sink includes an extruded component, a cast component, and an interface layer. The extruded component includes a first aluminum material and is configured to be coupled to a solid state light source. The cast component includes a second aluminum material overmolded onto a portion of the extruded component to form the interface layer. The interface layer is formed of at least one of the first and the second aluminum materials and abuts against and couples the extruded component to the cast component. | 11-20-2014 |
20140338879 | BENDABLE HEAT READIATING COMPOSITE AND BACKLIGHT UNIT HAVING THE SAME - A heat-transfer apparatus for dissipating heat from an electronic device is disclosed. The heat-transfer apparatus includes a composite, comprising a metal layer, a dielectric layer and one or more electrically conductive layers. The composite is plastically deformed and is substantially free of crack. A backlight apparatus comprising the heat-transfer apparatus is also provided. | 11-20-2014 |
20140338880 | Low Vibration Cryocooled System for Low Temperature Microscopy and Spectroscopy Applications - A vertical support rigidly mounted to a planar base positions and supports a cryocooler expander unit off axis and away from a sample to be examined. The sample support is likewise rigidly mounted to the planar base with a rigidly mounted sample housing therein. The cryocooler expander unit is suspended in the vertical support by spring dampening bearings. A pair of opposing flexible vacuum bellows connects the cryocooler expander unit to the sample housing and vertical support. This configuration isolates the sample from vibration. Flexible thermal links associated with a predictive electronic closed loop control sequence maintains sample temperature. | 11-20-2014 |
20140345840 | Heat Transference Device - The invention comprises of an elongated heat conductive material ( | 11-27-2014 |
20140345841 | HEAT DISSIPATION PLATE - A heat dissipation plate including a heat-conductive material layer, a first metal layer, a metal substrate, and a metal ring frame is provided. The heat-conductive material layer has an upper surface and a lower surface opposite to each other. A material of the heat-conductive material layer includes ceramic or silicon germanium. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber. | 11-27-2014 |
20140345842 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink and two fixing members. The heat sink includes a board and a number of fins extending substantially perpendicularly up from the board. A first fixing portion and two second fixing portions at opposite sides of the first fixing portion are formed at each of opposite sides of the board. Each fixing member includes a driving portion, a fixing bolt, and two positioning poles. Each driving portion defines an installing hole and two positioning holes at opposite sides of the installing hole. The fixing bolts extend through the installing holes, the first fixing portions, and a circuit board to engage with the circuit board. The positioning poles are inserted into the second fixing portions and the positioning holes. A spring is fitted about each positioning pole and is sandwiched between the corresponding second fixing portion and the corresponding driving portion. | 11-27-2014 |
20140345843 | DYNAMIC THERMAL INTERFACE MATERIAL - Aspects of the invention provide compositions that include carbon nanotubes dispersed within nanographite particles, and that have useful thermal properties. Certain compositions have high thermal conductivities (e.g., high thermal conductivities at ambient temperature). Certain compositions have a temperature dependent thermal conductivity that reversibly increases with temperature. Certain compositions are useful for heat transfer and can be used as thermal interface material, for example, in the context of computer and/or power generating devices. | 11-27-2014 |
20140345844 | HEAT SINK - A heat sink includes a base block, a plurality of upright panels horizontally outwardly extended from the base block in a flush manner, each two adjacent upright panels defining with the base block a space, a plurality of radiation fins respectively extended from the periphery of the base block and two opposite lateral sides of each upright panel and respectively suspended in each space between each two adjacent upright panels, a mounting member located at a distal end of each upright panel remote from the base block, a sub-upright panel extended from one side of each upright panel adjacent to the mounting member of the respective upright panel, and a screw-connection member located at a distal end of each sub-upright panel remote from the respective upright panel. | 11-27-2014 |
20140352940 | FASTENER ASSEMBLY AND METHOD FOR HEAT SINK MOUNTING - Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board. | 12-04-2014 |
20140360709 | METAMATERIAL SYSTEMS WITH VARIABLE CONDUCTIVITIES AND METHODS FOR THEIR MANUFACTURE AND USE - Metamaterial systems capable of exhibiting changes in thermal conductivities in response to an external control or input, as well as methods relating thereto. The metamaterial systems include first and second plates, and a metamaterial core between and thermally coupled to the first and second plates. The metamaterial core comprises a plurality of elements coupled to and contacting each other, with each of the elements being a pseudo-tetrahedron having surfaces that define surface-to-surface contacts with at least one other of the elements. A force is applied to the metamaterial core that increases contact pressures between the elements at the surface-to-surface contacts thereof and thereby increases thermal contact conductivities at the surface-to-surface contacts and increases a thermal conductivity of the metamaterial core. | 12-11-2014 |
20140360710 | HEAT-DISSIPATING ASSEMBLY FOR ELECTRONIC COMPONENT - A heat-dissipating assembly for electronic component is provided, which comprises a body and at least one insert element. The body has a front surface and a back surface opposite to each other, two side surfaces opposite to each other, and at least one through-hole which penetrates the two side surfaces. Each of the insert elements is detachably inserted into the at least one through-hole respectively, and is provided with at least one internal thread hole which is formed from the front surface to the back surface of the body. The heat-dissipating assembly for electronic component according to the present disclosure may be used easily and flexibly, benefits in reducing space to be occupied. | 12-11-2014 |
20140360711 | CONTAINER SPINNING DEVICE AND METHOD OF USE THEREOF - An apparatus and a method to affect the heat transfer of a container is provided for rapidly heating or cooling the contents of a container through convective heat transfer. The apparatus includes a cylindrical sleeve which positively engages a distal end of a container, said sleeve including a can clip or bottle clip. The cylindrical sleeve is connected to a first end of a shaft having two ends, while the second end of the shaft may be connected to a rotating device. The rotating device is operated thus rotating the shaft, the cylindrical sleeve, and the container about the horizontal axis while the container is being exposed to the heating or cooling source. The cylindrical sleeve is capable of holding varying sizes of containers. | 12-11-2014 |
20140360712 | ALUMINUM ALLOY MATERIAL FOR HEAT EXCHANGER FIN, MANUFACTURING METHOD FOR SAME, AND HEAT EXCHANGER USING THE ALUMINUM ALLOY MATERIAL - Disclosed is an aluminum alloy material for a heat exchanger fin, the aluminum alloy material containing Si: 1.0% to 5.0% by mass, Fe: 0.1% to 2.0% by mass, and Mn: 0.1% to 2.0% by mass with balance being Al and inevitable impurities, wherein 250 pieces/mm | 12-11-2014 |
20140360713 | LIGHTING SYSTEM WITH THERMAL MANAGEMENT SYSTEM - Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system. | 12-11-2014 |
20140367077 | COMPLEX HEAT DISSIPATION ASSEMBLY - A complex heat dissipation assembly, which includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly having a contact face in contact with the heat source; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. Each heat spreader has a proximal-to-heat-source section and a distal-from-heat-source section. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat of the heat source in different directions so as to uniformly and quickly dissipate the heat. Accordingly, the heat is prevented from accumulating around the heat source. In this case, the temperature will not locally abnormally rise. | 12-18-2014 |
20140367078 | Use Of An Anistropic Fluoropolymer For The Conduction of Heat - The present invention relates to the use of an anisotropic fluoropolymer having a different intrinsic thermal conductivity in at least two directions as a heat conducting material in a thermally conductive article, to a thermally conductive article comprising said anisotropic fluoropolymer and to a process for the production of said anisotropic fluoropolymer. | 12-18-2014 |
20140374079 | CONFORMABLE AND ADHESIVE SOLID COMPOSITIONS FORMED FROM METAL NANOPARTICLES AND METHODS FOR THEIR PRODUCTION AND USE - Materials that readily adhere to and conform to various surfaces can be desirable for a number of applications. In heat transfer and thermal management applications, for example, conformable materials can be used in establishing a thermal interface between a heat source and a heat sink. There are limited materials that provide good thermal conductivity values while maintaining capabilities to readily adhere and conform to a surface. Compositions including a conformable and adhesive solid can include a reaction product formed by heating a mixture containing a plurality of metal nanoparticles, one or more amines, and one or more carboxylic acids. The compositions can further include one or more additives dispersed in the conformable and adhesive solid. | 12-25-2014 |
20140374080 | COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material. | 12-25-2014 |
20150013955 | HEAT SINK - A heat sink includes a base and a number of fins mounted parallelly on the base. Each fin defines a number of vents, and two heat dissipating pieces protrude from opposite sides of each vent. The heat dissipating pieces of each vent cooperatively bounds an opening communicating with the corresponding vent. The number of openings of each fin is aligned with the number of openings of the other fins. The aligned openings of the number of fins cooperatively define a number of first air channels perpendicular to the number of fins. The number of heat dissipating pieces bound a number of second air channels parallel to the number of fins. | 01-15-2015 |
20150013956 | HEAT RADIATION PLATE AND SUBMARINE APPARATUS - A heat radiation plate includes a depressed portion into which thermally-conductive resin that transfers heat of an electronic component to the heat radiation plate is poured, and a plurality of check portions configured to be provided to the depressed portion and with an upper surface portion and a lower surface portion stepwise at positions lower than an outer edge portion of the depressed portion and higher than a bottom surface portion of the depressed portion so that a liquid level of the thermally-conductive resin is visually checkable, wherein when the thermally-conductive resin is normally filled in the depressed portion, each of the lower surface portions of the plurality of check portions is covered with the thermally-conductive resin and each of the upper surface portions of the plurality of check portions is exposed without being covered with the thermally-conductive resin. | 01-15-2015 |
20150034291 | Heat dissipation case - A heat dissipation case is used to dissipate heat of electronic equipment and contains: a body. The body includes a receiving chamber for receiving electronic equipment and a dissipation groove defined thereon and corresponding to the receiving chamber, wherein the metal plate and the dissipating piece are stacked in the dissipation groove, and electronic equipment is received in the receiving chamber and contacts with the dissipating piece so as to dissipates heat of the electronic equipment. The metal plate has a peripheral side retained in the body. The peripheral side of the metal plate extends into the metal plate completely, and an area of the metal plate is larger than that of the dissipating piece. | 02-05-2015 |
20150034292 | METHOD OF FABRICATING A HEAT SINK - A method for fabricating a straight fin heat sink ( | 02-05-2015 |
20150047821 | HEATING DEVICE STRUCTURE - The present relates to a heating device structure, which comprises a heat conducting member to mate with the heat dissipation fins of an electronic device. Thereby, during the packaging process of the electronic device, the effect of multi-point heating can be achieved by combining the heat conducting member and the fins. Accordingly, heating can be performed rapidly to reach the soldering temperature. Without the influence of the structure of heat dissipation fins, the heating process will not be performed at low efficiency. | 02-19-2015 |
20150047822 | HEAT SINK DEVICE WITH EMI SHIELDING FUNCTION - A heat sink is configured to dissipate heat generated by an electronic component and protect the electronic component from Electromagnetic Interference (EMI). The heat sink comprises a base and a number of waveguides extending out from the base. A number of through holes is defined through the base. Each of the waveguides is a hollow but blind tube communicating with a through hole. | 02-19-2015 |
20150053389 | METHOD OF BRAZING ARTICLES OF STAINLESS STEEL - The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel. | 02-26-2015 |
20150060036 | ASSEMBLED ALUMINUM EXTRUSION HEAT DISSIPATOR - An assembled aluminum extrusion heat dissipator includes a heat-conducting plate and a plurality of U-shaped heat-dissipating members. The surface of the heat-conducting plate has a plurality of slots, and each of the slots extends from one side of the heat-conducting plate to another corresponding side. The U-shaped heat-dissipating member has a U-shaped body and a plurality of heat-dissipating fins, and the U-shaped body having a bottom plate and a pair of lateral plates, wherein the distance between the pair of lateral plates is corresponding to the distance of the two adjacent slots, so that the pair of lateral plates insert into the two adjacent slots, and the U-shaped heat-dissipating member integrates with the heat-conducting plate. | 03-05-2015 |
20150068719 | HEAT SINK - A heat sink includes a heat conduction portion and a heat dissipation portion. The heat conduction portion has a thickness, and a flat portion of the heat conduction portion contacts a heat source. The heat dissipation portion is extended from at least one side of the thickness of the heat conduction portion and includes at least a bending portion including a plurality of holes. | 03-12-2015 |
20150075762 | FLEXIBLE COMPOSITES CONTAINING GRAPHITE AND FILLERS - Flexible composites of graphite leaf, containing fillers other than natural graphite, which has higher thermal conductivity than conventional 100% natural graphite based graphite sheet/foil/paper, and methods of preparing such flexible composites. In a second embodiment, there is a thermal management system comprising at least one flexible composites as set forth just Supra, wherein a graphite surface of a flexible composite is in thermal contact with a heat source of a heat generating device. | 03-19-2015 |
20150090433 | THERMAL SHIELD SHEET - A method of reducing heat in an electronic device includes providing a housing, providing a heat generating component and positioning a heat reduction sheet between the housing and the heat generating component. The heat reduction sheet includes a substrate, a first porous layer and a second porous layer. Each of the substrate and first and second porous layers has a first main surface and a second main surface. The first porous layer has an average cavity diameter of between approximately 0.01 μm and approximately 10 μm. The second porous layer has an average cavity diameter of between approximately 0.01 μm and approximately 10 μm. At least a portion of the first main surface of the substrate is in contact with at least part of the first main surface of the first porous layer. At least a portion of the second main surface of the substrate is in contact with at least part of the first main surface of the second porous layer. | 04-02-2015 |
20150090434 | Performance Enhanced Heat Spreader - Embodiments of the present invention include methods of disposing a metallic coating layer comprising a metal in an amorphous and/or fine grain microstructure over at least a portion of a surface of a pyrolytic graphite substrate, the metal comprising Nickel, Iron, a Nickel-Iron Alloy, or any combination thereof, and the grains of the metal being of 1 nm to 10000 nm in size. Embodiments of the invention also encompass the coated pyrolytic graphite articles. The coated substrate exhibits a thermal conductivity not less than the uncoated substrate. | 04-02-2015 |
20150090435 | SUPPORT PLATEHEAT DISSIPATION APPARATUS - Embodiments of the present invention relate to a heat dissipation apparatus and relates to the field of heat dissipation technologies, so as to solve a problem that heat dissipation efficiency of heat dissipation fins of an existing heat dissipation apparatus is low. In embodiments of the present invention, the heat dissipation apparatus includes a base plate, where multiple main fins are disposed on the base plate, and multiple auxiliary fins are disposed on the main fins; a gap exists between the auxiliary fins and the base plate; and a blocking structure is disposed and fastened on the base plate and/or the main fins, and the blocking structure can make cooling airflow first flow along the auxiliary fins and then flow along gaps between adjacent main fins and flow out. The present invention is mainly used in the field of communication accessories. | 04-02-2015 |
20150096731 | Device and System for Dissipating Heat, and Method of Making Same - A device and system for dissipating heat includes a bent portion of pyrolytic graphite in which a-b planes at a center region of the bent portion follow a surface contour of the bent portion. A method for making a heat dissipating device includes bending a flat sheet of pyrolytic graphite such that a-b planes at a center region of a bent portion follow a surface contour of the bent portion. | 04-09-2015 |
20150096732 | THERMALLY CONDUCTIVE FLEXIBLE MEMBER FOR HEAT TRANSFER - An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that is disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly. | 04-09-2015 |
20150101786 | Cooling Gel Pad - A device for providing heat dissipation is claimed. The device comprises an outer shell and an inner, heat-dissipating gel layer within said outer shell, the inner heat-dissipating gel layer that comprises a hydrogel compound that dissipates body heat without refrigeration at room temperature. | 04-16-2015 |
20150101787 | ULTRA SAGGING AND MELTING RESISTANT FIN MATERIAL WITH VERY HIGH STRENGTH - Method for producing AIMn strip or sheet for making components by brazing and products obtained by said method, in particular fin materials of thin gauge used in heat exchangers. Rolling slabs are produced from a melt with <0.3% Si, ≦0.5% Fe, ≦0.3% Cu, 1.0-2.0% Mn, ≦0.5% Mg, ≦4.0% Zn, ≦0.5% Ni, ≦0.3% each of group IVb, Vb, or Vib elements, and unavoidable impurity elements, as well as aluminium that, prior to hot rolling, are preheated at <550° C. to control the number and size of dispersoid particles, hot rolled into a hot strip, cold rolled into a strip with total reduction of at least 90%, and heat treated to obtain a 0.2% proof stress value that is 50-90% of its proof stress value in the as cold rolled condition and in a range between 100 and 200 MPa. The strip may alternatively be produced by twin-roll strip casting. | 04-16-2015 |
20150129189 | Method and Apparatus for Reducing the Mechanical Stress when Mounting Assemblies with Thermal Pads - It is provided a device and method for mounting of a heat sink on a printed circuit board with one or more electronic components to be cooled reducing the mechanical stress on the electronic components and the printed circuit board. The thermal contact between the heat sink and the electronic components to be cooled is formed by a thermal pad. The surface of the heat sink which is in contact with the thermal pad has at least one cavity into which the thermal pad can spread when the electronic component and the heat sink are pressed against each other thereby compressing the thermal pad. | 05-14-2015 |
20150129190 | Thermal Dissipation Through Seal Rings in 3DIC Structure - A package includes a die, which includes a semiconductor substrate, a plurality of through-vias penetrating through the semiconductor substrate, a seal ring overlapping and connected to the plurality of through-vias, and a plurality of electrical connectors underlying the semiconductor substrate and connected to the seal ring. An interposer is underlying and bonded to the die. The interposer includes a substrate, and a plurality of metal lines over the substrate. The plurality of metal lines is electrically coupled to the plurality of electrical connectors. Each of the plurality metal lines has a first portion overlapped by the first die, and a second portion misaligned with the die. A heat spreader encircles the die and the interposer. A wire includes a first end bonded to one of the plurality of metal lines, and a second end bonded to the heat spreader. | 05-14-2015 |
20150136375 | System and Method of Producing Scalable Heat-sink Assembly - A system for producing heat-sink assemblies in which a series of extruded members possess mating faces, each face having an alternating series of troughs and bulbous shaped ridges which are formed from the sides of the troughs. Mating ridges of one face of each extruded member are dipped with a thermally conductive compound prior to press-fitting and at least some of the ridges and troughs possess a groove that when mated to an opposing region of an adjacent extruded member, produces a reservoir that serves as a feeder source for thermally conductive compound. Once the extruded members are press-fitted, portions of the bulbous-shaped ridges on one face are forced past portions of the bulbous-shaped ridges of the opposing face and into the troughs. Deformation of the bulbous-shaped ridges is uniformly expansive so as to reduce shearing relative to the surfaces of the troughs, and the formed reservoirs are further compressed and feed thermal compound into the interstices between mating members. | 05-21-2015 |
20150144316 | METHOD OF PRODUCING HEAT CONDUCTIVE SHEET - A method of producing a heat conductive sheet includes: a step (A) of dispersing a fibrous filler and a spherical filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition; a step (C) of slicing the formed molded block to a desired thickness to form a sheet; and a step (D) of pressing the sliced surface of the formed sheet, the sliced surface being pressed such that the thermal resistance value of the sheet after pressing becomes lower than the thermal resistance value of the sheet before pressing. | 05-28-2015 |
20150144317 | HEAT DISSIPATING MODULE - A heat dissipating module includes a heat sink and a number of latching assemblies. The heat sink includes a base and a number of positioning portions. A number of positioning holes is defined extending through the corresponding positioning portions and the base. Each latching assembly includes a latching member and a resilient member. | 05-28-2015 |
20150144318 | HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a protruding portion, wherein the protruding portion protrudes from an end of the heat dissipating portion and is disposed in the accommodating recess. The base and the heat dissipating fin are combined with each other by a punching process, such that a first side wall of the accommodating recess covers at least a part of the protruding portion. | 05-28-2015 |
20150144319 | PART OF A CONTAINER FOR ELECTRONIC EQUIPMENT, HAVING THE FUNCTION OF A HEAT SINK, AND METHOD FOR MAKING IT | 05-28-2015 |
20150144320 | HEAT RADIATION SHEET AND METHOD OF MANUFACTURING SAME - A heat radiation sheet including: a heat radiation layer that is formed in the form of a nano-web having a plurality of pores by electrospinning a spinning solution that is obtained by mixing a polymer material and a solvent, or the polymer material, a heat conductive material, and the solvent; and an adhesive layer that is laminated on one surface or both surfaces of the heat radiation layer, and that is formed in the form of the nano-web by electrospinning an adhesive material that is obtained by an adhesive, the heat conductive material, and the solvent. | 05-28-2015 |
20150144321 | APPARATUS FOR DISSIPATING HEAT THROUGH HEAT SINK - The present invention is an apparatus for dissipating heat through a heat sink, the apparatus comprising: a heat transfer member having one end with a contact surface contacting a heating element arranged on a substrate and the other end with a contact surface contacting the heat sink, the heat transfer member transferring the heat generated from the heating element to the heat sink; an elastic member for providing elastic force for pushing the heat transfer member toward the heating element; a guide member arranged in the heat sink to form a contact surface contacting the heat transfer member, the guide member mechanically guiding the heat transfer member such that the heat transfer member may slide and move toward the heating element; and a spacing member inserted between the substrate and the heat sink so as to maintain a preset spacing when the substrate and the heat sink are fixed and attached with each other. | 05-28-2015 |
20150292815 | SUSCEPTOR WITH RADIATION SOURCE COMPENSATION - Embodiments described herein relate to an apparatus and methods for temperature measurement. A susceptor may be configured to support a substrate on a first surface and second surface of the substrate may be oriented opposite the first surface. One or more reflective features may be formed on the second surface. The one or more reflective features may be disposed in various patterns at a radius viewed by a temperature sensor. The one or more reflective features may provide for increased reflection of radiation from the second surface of the susceptor and provide more accurate temperature calculations from a thermal signal detected by the temperature sensor. | 10-15-2015 |
20150296662 | Multiple Flow Entrance Heat sink - Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields. | 10-15-2015 |
20150296663 | HEAT SINK FASTENING DEVICE AND THERMAL MODULE ASSEMBLY USING SAME - A heat sink fastening device includes an operating member and a retaining member axially extended through the operating member and associated with the latter via a pivot shaft. The operating member includes a cylindrical cam portion, which has an elastic element received therein to provide the cam portion with an elastic force. The cam portion has an upper end formed into a pair of cam surfaces, on which the pivot shaft is rested. The operating member can be horizontally rotated about an axis thereof. When the operating member is rotated, the cam surfaces rotate and cause the pivot shaft to move from a higher to a lower position on the cam surfaces or vice versa, so that the retaining member associated with the operating member via the pivot shaft is brought by the pivot shaft to axially move downward to a released position or upward to a fastened position. | 10-15-2015 |
20150315449 | COMPOSITE MATERIAL CONTAINING GRAPHENE - In one aspect, a composite material is disclosed herein that includes graphene platelets dispersed in a matrix. In some cases, the graphene platelets are randomly oriented within the matrix. The composite material can provide improved thermal conductivity and may be formed into heat spreaders or other thermal management devices to provide improved cooling to electronic, electrical components and semiconductor devices. | 11-05-2015 |
20150316332 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS - Provided is a heat conductive foam sheet for electronic equipment sufficiently thin and flexible to be suitably used in the interior of electronic equipment and excellent in heat conductivity. A heat conductive foam sheet for electronic equipment containing a heat conductor in an elastomer resin portion constituting the foam sheet, in which the content of the heat conductor relative to 100 parts by mass of the elastomer resin is 100 to 500 parts by mass, the 25% compressive strength of the foam sheet is 200 kPa or less and the thickness thereof is 0.05 to 1 mm. | 11-05-2015 |
20150322984 | Hybrid IFS with Metallic Aft Section - A hybrid inner fixed structure is disclosed. The inner fixed structure may have an inner fixed structure panel having an inner fixed structure panel surface and an inset panel having an inset panel surface disposed in at least partial contact with a first portion of the inner fixed structure panel surface. In this manner, a hybrid inner fixed structure may be designed to be both lightweight and heat tolerant. | 11-12-2015 |
20150327404 | Heat transfer component with dendritic crystal structures and purpose and method of use for such a component - A heat transfer component with dendritic crystal structures and a purpose and method of use for such a component; this component is used to resolve the deficiency concerning conventional heat transfer components possessing inadequate surface areas for heat dissipation. Dendritic crystal structure is comprising: a substrate and multiple dendritic crystals. The substrate contains multiple preset crystal defects in which all the dendritic crystals deposit and congregate, and a space is located between each dendritic crystal for thermal convection. Regarding the method of use, the substrate is connected to a heat source, which then induces directional heat transfer from the substrate and the metal layer to the main branch and at least one sub-branch of the dendritic crystal, or the dendritic crystal is placed on a heat source, which induces heat transfer from the crystal to the substrate. | 11-12-2015 |
20150330721 | HEAT EXCHANGER BEDS COMPOSED OF THERMOMAGNETIC MATERIAL - Provided is a packed heat exchanger bed composed of thermomagnetic material particles having a mean particle diameter of 50 μm to 1 mm. The packed bed has porosity of 30-45%. A thermomagnetic material is a metal containing material such as (A | 11-19-2015 |
20150330724 | HEAT CONDUCTOR AND DEVICE INCLUDING THE SAME - Provided is a heat conductor including: a first layer containing a first resin component and a plurality of flake graphite fillers each having a basal plane; and a second layer containing a second resin component and the plurality of flake graphite fillers, wherein the heat conductor is a laminate including the first layer and the second layer, an average of first angles in the first layer is 35 degrees or smaller, each of the first angles being an acute angle between the basal plane of a corresponding one of the flake graphite fillers and a laminated surface of the laminate, and an average of second angles in the second layer ranges from 55 degrees to 90 degrees, each of the second angles being an acute angle between the basal plane of a corresponding one of the flake graphite fillers and the laminated surface of the laminate. | 11-19-2015 |
20150334871 | THERMAL INTERFACE MATERIALS WITH THIN FILM SEALANTS - According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In an exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side. A dry material is along at least a portion of the first side of the thermal interface material. The dry material has a thickness less than 0.005 millimeters. At least one edge of the thermal interface material is sealed at least partially by the dry material. | 11-19-2015 |
20150338174 | HEAT TRANSFER SHEET AND HEAT DISSIPATION STRUCTURE - A heat transfer sheet of the present invention includes a heat transfer layer having a first portion and a second portion provided in a position different from the first portion in a planar view of the heat transfer layer, the second portion being capable of expanding and contracting in a thickness direction of the heat transfer layer at an expansion ratio larger than that of the first portion depending on temperature changes in an object from which heat is to be dissipated. In a state that the heat transfer sheet is used, in the case where a temperature of the heat transfer layer is a predetermined temperature or lower, thermal conductivity between the object and a dissipation member is lowered due to creation of a gap between the second portion and the object and/or the dissipation member, whereas in the case where the temperature of the heat transfer layer is a predetermined temperature or higher, the thermal conductivity between the object and the dissipation member is increased due to substantial elimination of the gap. | 11-26-2015 |
20150338175 | RADIATIVE COOLING WITH SOLAR SPECTRUM REFLECTION - Various aspects as described herein are directed to a radiative cooling apparatuses and methods for cooling an object. As consistent with one or more embodiments, a radiative cooling apparatus includes an arrangement of a plurality of different material located at different depths along a depth dimension relative to the object. The plurality of different material includes a solar spectrum reflecting portion configured and arranged to suppress light modes, thereby inhibiting coupling of the incoming electromagnetic radiation, of at least some wavelengths in the solar spectrum, to the object at a range of angles of incidence relative to the depth dimension. Further, the plurality of material includes a thermally-emissive arrangement configured and arranged to facilitate, simultaneously with the inhibiting coupling of the incoming electromagnetic radiation, the thermally-generated electromagnetic emissions from the object at the range of angles of incidence and in mid-IR wavelengths. | 11-26-2015 |
20150338176 | COMPOUND HEAT-DISSIPATING DEVICE - A compound heat-dissipating device includes a conductive base and a heat-dissipating body. The conductive base has a first bottom surface, a first top surface, and a plurality of combining portions protruded from the first top surface. Each combining portion has a bottom end connected with the first bottom surface and a top end extended from the bottom end integrally. The top end has a cross-sectional area bigger than that of the bottom end. The heat-dissipating body has a second bottom surface and a second top surface. The second bottom surface has a pair of concave portions corresponding to a contour of the conductive base, and a plurality of combining grooves formed in the concave portion. The shape of the combining grooves is corresponding to that of the combining portions, and the combining portions are correspondingly combined with the combining grooves. | 11-26-2015 |
20150340266 | THERMAL PROCESSING SUSCEPTOR - In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim. | 11-26-2015 |
20150342092 | HEATSINK WITH INTERNAL CAVITY FOR LIQUID COOLING - A heatsink with an internal cavity for liquid cooling includes: a first part having a first group of fins extending into the internal cavity; a second part attached to the first part so that the internal cavity is formed, the second part having a second group of fins that extend into the internal cavity and that are configured to fit among the first group of fins; an inlet into the internal cavity on at least one of the first and second parts; and an outlet from the internal cavity on at least one of the first and second parts. | 11-26-2015 |
20150342093 | FRACTAL HEAT TRANSFER DEVICE - A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements. | 11-26-2015 |
20150351285 | HEAT DISSIPATION STRUCTURE AND SYNTHESIZING METHOD THEREOF - A heat dissipation structure and a synthesizing method thereof are provided by the present disclosure. The method comprises: providing a metal foil; forming a deposition substrate on a first surface of the metal foil, wherein the deposition substrate includes a barrier layer disposed on the metal foil and a catalyst layer disposed on the barrier layer, such that catalyst in the catalyst layer is prevented from diffusing into the metal foil; and synthesizing a carbon nanotube array on the deposition substrate formed on the first surface. The method provided by the present disclosure can increase density of the CNTs in the heat dissipation structure. | 12-03-2015 |
20150359143 | METHOD OF HEAT TRANSFER IN POWER ELECTRONICS APPLICATIONS - An exemplary method of heat transfer in power electronics applications is disclosed, wherein a metal foil including at least about 50% of tin, based on a total amount of metals contained in the metal foil, is used as a thermal interface material between a base plate of a heat-generating component and a heat sink. The metal foil is disposed on a heat sink. A base plate of a heat generating component or module is disposed on the heat sink covered by the metal foil to provide a power electronics device. A clamping force is applied to the power electronics assembly to provide a cooled power electronics assembly. | 12-10-2015 |
20150361922 | HEAT EXCHANGER DESIGNS USING VARIABLE GEOMETRIES AND CONFIGURATIONS - A heat exchanger may include at least one fluid passageway adjacent a heat transfer plate and a plurality of heat transfer elements positioned in the at least one fluid passageway and joined with the heat transfer plate. The heat transfer elements may be positioned with first spacings therebetween at an inlet end of the at least one fluid passageway. The heat transfer elements may be positioned with second spacings therebetween at an outlet end of the at least one fluid passageway. The first spacings may be smaller than the second spacings. | 12-17-2015 |
20150362262 | CONTROL PANEL COOLING DEVICE FOR MACHINE TOOL - A cooling device with a first heat sink is provided with a blowing unit configured to introduce an ambient atmosphere into the cooling device. The first heat sink is provided with a plurality of fin portions, configured to perform heat exchange when contacted by the ambient atmosphere introduced by the blowing unit, and a mist collection unit horizontally projecting from the fin portions and configured to collect mists in the ambient atmosphere. | 12-17-2015 |
20150362266 | HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION SYSTEM ADOPTING THE SAME - A heat dissipation structure includes a thermal interface material and a transition layer. The thermal interface material includes a matrix and a plurality of carbon nanotubes dispersed in the matrix. The thermal interface material has a first surface and a second surface opposite to the first surface. The transition layer is positioned on one of the first surface or the second surface of the thermal interface material. A thickness of the transition layer is in a range from about 1 nanometer to about 100 nanometers. The transition layer is in contact with the carbon nanotubes of the thermal interface material. An interface thermal resistance between the transition layer and the heat source is less than that between the plurality of carbon nanotubes and the heat source. The present application also relates to a heat dissipation system adopting the heat dissipation structure. | 12-17-2015 |
20150369544 | LIQUID COOLING - An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween. | 12-24-2015 |
20150373878 | HEAT CONTROL DEVICE FOR POWER EQUIPMENT - This invention involves and discloses a heat control device for power equipment, which comprises heat source, heat sink base plate, heat insulation layer, dissipation heat sink and thermal control switch, wherein the heat source is placed on and in contact with dissipation heat sink, and its bottom is in direct lap joint with heat sink base plate, wherein the heat insulation layer is set around heat sink base plate, wherein the thermal control switch is placed on heat sink base plate. This invention of heat control device is one that demonstrates excellent low temperature thermal insulation property for key components or heat-sensitive elements of power equipment. The heat control device applying technical solutions described in this invention features easy manufacturing, low cost and reliable performance. | 12-24-2015 |
20150373879 | HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY - Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps. | 12-24-2015 |
20150373880 | HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY - Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps. | 12-24-2015 |
20150377564 | HEAT DISSIPATING FIN ASSEMBLY - A heat dissipating fin assembly includes a bottom plate, a plurality of first heat dissipating fins, a plurality of second heat dissipating fins, an inner cover plate and an outer cover plate. The first heat dissipating fins extend from an inner end to an outer end. The second heat dissipating fins are located between two of the first heat dissipating fins. The inner cover plate is disposed at the inner end and connected to the first heat dissipating fins. The outer cover plate is disposed at the outer end and connected to the second heat dissipating fins. The outer cover plate and the inner cover plate are separated so as to form an opening. The second heat dissipating fins extend from around the opening to the outer end. The length of the first heat dissipating fins is larger than that of the second heat dissipating fins. | 12-31-2015 |
20150377569 | Media Pads for Gas Turbine - The present application provides an inlet heat exchanger for cooling an inlet air flow in a compressor of a gas turbine engine. The inlet air exchanger may include a media pad with a number of media sheets having a substantially three-dimensional contoured shape made from non-woven synthetic fibers and a heat exchange medium flowing from a top to a bottom of the media pad to exchange heat with the inlet air flow. | 12-31-2015 |
20160003563 | Composite Structure of Tungsten Copper and Molybdenum Copper with Embedded Diamond for Higher Thermal Conductivity - A heatsink for dissipating heat generated by electronic components comprising an outer frame of copper tungsten or copper molybdenum metal matrix composite having a cavity extending between the top and the bottom surfaces, a copper-diamond composite material within the opening, and copper plating on the top and the bottom surfaces. The heatsink also includes an array of alternating layers of copper and a material selected from the group of molybdenum and copper/molybdenum metal matrix surrounding the outer frame. The heatsink can be manufactured by press fitting at room temperature a porous isotropic diamond material in the cavity of an outer frame of porous tungsten or molybdenum, co-infiltrating the assembly under pressure with copper, press fitting at room temperature the outer frame into the layered array, and subjecting the heatsink to a temperature of approximately 800 Deg C. | 01-07-2016 |
20160007498 | HEAT RADIATION SHEET - Provided is a heat-radiating sheet including a heat-radiating layer having a porous structure with multiple pores, a filler including multiple thermally conductive particles and filling the pores inside the heat-radiating layer, and an adhesive layer disposed on at least one surface of the heat-radiating layer. | 01-07-2016 |
20160007499 | HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS - A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device. | 01-07-2016 |
20160010843 | PRE-COATED ALUMINUM SHEET, ALUMINUM SHEET, AND HEAT SINK FOR ONBOARD LED LIGHTING | 01-14-2016 |
20160010930 | PLANAR ELEMENT FOR FORMING HEAT EXCHANGER | 01-14-2016 |
20160025430 | Heat Transfer Management Apparatuses Having A Composite Lamina - Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate, where the plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount coupled to the composite lamina and a temperature sensitive component mount coupled to the composite lamina and positioned distally from the heat generating component mount. At least one of the plurality of thermal conductor traces is in electrical continuity with the heat generating component mount and the temperature sensitive component mount, and at least one of the plurality of thermal conductor traces is electrically isolated from at least one of the heat generating component mount or the temperature sensitive component mount. | 01-28-2016 |
20160025431 | NANO-THERMAL AGENTS FOR ENHANCED INTERFACIAL THERMAL CONDUCTANCE - A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires. | 01-28-2016 |
20160031914 | THERMAL CONDUCTIVE COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE - Thermal conductive compositions, methods for their preparation, and use are provided, which include, for example, as thermal sinks and other uses. | 02-04-2016 |
20160033213 | CONDUCTIVE THERMAL COMPOSITIONS, USES THEREOF, AND METHODS FOR THEIR PREPARATION - Thermal conductive compositions, methods for their preparation, and use are provided, which include, for example, as thermal sinks, heat transfer systems, and other uses. | 02-04-2016 |
20160040947 | ALUMINUM ALLOY FOR HEAT EXCHANGER FINS - An aluminum alloy fin stock material comprising about 0.9-1.2 wt. % Si, 0.3-0.5 wt. % Fe, 0.20-0.40 wt. % Cu, 1.0-1.5 wt. % Mn, 0-0.1% Mg and 0.0-3.0% Zn, with remainder Al and impurities at ≦0.15 wt. %. The aluminum alloy fin stock material is produced in a form of a sheet by a process comprising the steps of direct chill casting an ingot, hot rolling the ingot after the direct chill casting, cold rolling the aluminum alloy to an intermediate thickness, inter-annealing the aluminum alloy cold rolled to an intermediate thickness at a temperature between 200 and 400° C., and cold rolling the material after inter-annealing to achieve % cold work (% CW) of 20 to 40%. The aluminum alloy fin stock material possesses an improved combination of one or more of pre- and/or post-brazes strength, conductivity, sag resistance and corrosion potential. It is useful for fabrication of heat exchanger fins. | 02-11-2016 |
20160047607 | APPARATUS BODY HEAT DISSIPATION DEVICE - An apparatus body heat dissipation device includes an apparatus case, at least one plate body and at least one drive member. The apparatus case has at least one first opening and at least one second opening and a receiving space. The plate body is disposed in the receiving space. The drive member serves to drive the plate body to move within the receiving space to produce air convection effect between the interior of the apparatus case and the ambience of the apparatus case so that the air convection in the limited space of the apparatus body can be effectively enhanced to greatly enhance the heat dissipation efficiency. | 02-18-2016 |
20160050792 | HEAT DISSIPATING SUBSTRATE - There is provided a heat dissipating substrate including: a base substrate having a first through hole formed therein; a first substrate disposed on an upper end portion of the base substrate and including a second through hole having a diameter smaller than that of the first through hole; and a heat dissipating pad disposed on an upper end portion of the second through hole. In addition, a flow phenomenon of a thermal conduction member (lead) may be reduced using the thermal conduction member by forming a second through hole smaller than a first through hole. | 02-18-2016 |
20160052094 | SYSTEM AND METHOD FOR METALIZING VERTICALLY ALIGNED CARBON NANOTUBE ARRAY - A method for metallizing a vertically aligned carbon nanotube array includes coupling a support structure to an actuator, the support structure supporting a vertically aligned carbon nanotube array, and vibrating the support structure with the actuator. The method can also include the step of fixedly positioning the actuator between a first member and a second member. The vibration can be consistent or it can vary in amplitude and/or frequency over time. The step of fixedly positioning can include the first member having a first mass and the second member having a second mass that is different or less than the first mass. The actuator can include a piezoelectric element. A metalizing assembly for intercalating a vertically aligned carbon nanotube array with a metal includes a first member, a support structure, a second member and an actuator. The support structure is coupled to the first member. The support structure supports the vertically aligned carbon nanotube array. The second member is coupled to the support structure. The actuator is positioned between the first member and the second member. The actuator vibrates the support structure. | 02-25-2016 |
20160081227 | VACUUM-ENHANCED HEAT SPREADER - Embodiments described in this disclosure include a heat spreader. The heat spreader may include a first layer having a thickness less than about 300 microns; a plurality of pillars disposed on the first layer and arrayed in a pattern, wherein each of the plurality of pillars have a height of less than 100 microns; a second layer having a thickness of less than 200 microns, wherein a portion of the first layer and a portion of the second layer are sealed together; and a vacuum chamber formed between the first layer and the second layer and within which the plurality of pillars are disposed. | 03-17-2016 |
20160091260 | PIN FIN COMPLIANT HEAT SINK WITH ENHANCED FLEXIBILITY - Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates. | 03-31-2016 |
20160091265 | Thermally Conductive Sheet and Method for Producing Thermally Conductive Sheet - A thermally conductive sheet having good thermal conductivity in the thickness direction and a method for producing a thermally conductive sheet. A thermally conductive sheet having a surface with an L* value in a L*a*b color system of 29 or more and 47 or less is obtained by preparing a thermally conductive composition comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, extrusion-molding the thermally conductive composition to obtain a columnar cured product, and cutting the columnar cured product in a direction almost perpendicular to a length direction of a column to a predetermined thickness. | 03-31-2016 |
20160105991 | THERMAL INTERPOSER SUITABLE FOR ELECTRONIC MODULES - A thermal interposer for use in providing a mating interface between a heat sink and an electronic module includes an elongated body portion having two opposing surfaces. On one surface, a plurality of press-fit pegs are defined that extend upwardly and outwardly away from the interposer body portion. On the other, opposing surface, a plurality of contact arms are defined that extend, in cantilevered fashion, downwardly and away from the interposer body portion. The press-fit pins are configured to enter grooves formed in a heat sink in a manner to form intimate, metal to metal, contact while the contact arms are configured to contact the top surface of an electronic module with reliable normal force. | 04-14-2016 |
20160106004 | CARBON NANOTUBES DISPOSED ON METAL SUBSTRATES WITH ONE OR MORE CAVITIES - Provided herein are carbon nanotubes disposed on a metal substrate containing one or more cavities, methods of making thereof and uses thereof. In some embodiments, an apparatus is provided which includes carbon nanotubes carbon nanotubes disposed on a metal substrate containing one or more cavities. | 04-14-2016 |
20160106005 | CARBON NANOTUBES AS A THERMAL INTERFACE MATERIAL - Provided herein is an apparatus including a thermal interface material incorporating carbon nanotubes attached to a depression on a heat sink, where the thickness of the thermal interface material is greater than the depth of the depression on the heat sink and methods of making thereof. The thermal interface material may be further attached to a functional device(s) and transfers heat from the device(s) to the heat sink. | 04-14-2016 |
20160107586 | HEADLINING HAVING HEAT SHIELDING FUNCTION FOR VEHICLE AND MANUFACTURING METHOD THEREOF - A headlining having a heat shielding function for a vehicle and a manufacturing method for producing the headlining, in which a heat shielding layer having a heat shielding effect is stacked on a polyurethane foam sheet as a substrate having an excellent insulating effect and integrally formed therewith to prevent heat from being transferred to an inside of the vehicle through a roof panel occupying a wide portion exposed to an outside of the vehicle. In so doing, it is possible to create comfortable indoor environment of the vehicle even in hot summertime, to restrict an increase in an internal temperature of the vehicle and thus to reduce an operation time of an air conditioner and to enhance fuel efficiency of the vehicle. | 04-21-2016 |
20160108816 | Media Pads with Mist Elimination Features - The present application provides a media pad for cooling an inlet air flow to a compressor of a gas turbine engine. The media pad may include a first media sheet with a chevron corrugated surface having a first mist eliminator and a second media sheet with a wavy corrugated surface having a second mist eliminator. | 04-21-2016 |
20160114439 | Method of Making a Heat Exchanger Using Additive Manufacturing and Heat Exchanger - A method of making a component of a heat exchanger includes the steps of providing a substrate, performing a first printing step to add one or more heat-transfer-enhancing structures onto a first side of the substrate, and performing a second printing to add one or more heat-transfer-enhancing structures onto a second side of the substrate. A heat exchanger is also disclosed. | 04-28-2016 |
20160131440 | METHOD FOR HEAT TRANSFER AND DEVICE THEREFOR - A heat transfer device comprising at least an aggregate of fibres or sheet of fibres ( | 05-12-2016 |
20160138879 | ALUMINUM ALLOY BRAZING SHEET FOR HEAT EXCHANGERS AND ALUMINUM ALLOY BRAZED ARTICLE FOR HEAT EXCHANGERS - Disclosed is an aluminum alloy brazing sheet ( | 05-19-2016 |
20160143189 | COMPOSITE HEAT SINK STRUCTURES - Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment. | 05-19-2016 |
20160146549 | Heat Exchanger Element And Method of Production - A method for producing a heat exchanger element for a heat exchanger, in particular for a recuperator or the like, and to a heat exchanger element, includes a substantially carbon body infiltrated with pyrolytic carbon. The heat exchanger element forms a first contact surface in a first flow channel of the heat exchanger and a second contact surface in a second flow channel of the heat exchanger. | 05-26-2016 |
20160150672 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat dissipation member, a heat transfer member, and a reinforcing member. The heat transfer member has one side attached to the heat dissipation member, and two opposite lateral edges thereof are respectively provided with at least one connection portion and at least one through hole. The reinforcing member is connected to the other side of the heat transfer member, and two opposite lateral edges thereof are respectively formed with at least one mating connection portion for correspondingly connecting to the connection portion. The reinforcing member is provided at a central portion with an opening. With these arrangements, the heat transfer member can bear a larger locking force when the heat dissipation member is locked thereto, and is also prevented from deformation. | 05-26-2016 |
20160153725 | HEAT DISSIPATION FIN SET | 06-02-2016 |
20160169598 | Thermal Interface Material System | 06-16-2016 |
20160183411 | COOLING BODY | 06-23-2016 |
20160187079 | ALUMINUM ALLOY FIN MATERIAL FOR HEAT EXCHANGER EXCELLENT IN STRENGTH, ELECTRICAL CONDUCTIVITY, AND BRAZEABILITY, METHOD FOR MANUFACTURING ALUMINUM ALLOY FIN MATERIAL FOR HEAT EXCHANGER, AND HEAT EXCHANGER COMPRISING ALUMINUM ALLOY FIN MATERIAL FOR HEAT EXCHANGER - An aluminum alloy fin material for a heat exchanger in the present invention comprises an aluminum alloy having a composition containing Mn: 1.2 to 2.0%, Cu: 0.05 to 0.20%, Si: 0.5 to 1.30%, Fe: 0.05 to 0.5%, and Zn: 1.0 to 3.0% by mass and a remainder comprising Al and an unavoidable impurity, further containing one or two or more of Ti: 0.01 to 0.20%, Cr: 0.01 to 0.20% and Mg: 0.01 to 0.20% by mass as desired, and, after heating in brazing, has a tensile strength of 140 MPa or more, a proof stress of 50 MPa or more, an electrical conductivity of 42% IACS or more, an average grain diameter of 150 μm or more and less than 700 μm, and a potential of −800 mV or more and −720 mV or less. | 06-30-2016 |
20160187080 | BONDED ALUMINUM-DISSIMILAR METAL STRUCTURE AND METHOD OF MAKING SAME - A bonded dissimilar material structure includes a first component made of a first dissimilar material; a second component made of a second dissimilar material stacked under the first component; and a plurality of blind holes formed on an upper surface of the second component; and the first component has a plurality of protrusions formed in the plurality of blind holes on the second component, respectively. | 06-30-2016 |
20160187081 | BONDED FUNCTIONALLY GRADED MATERIAL STRUCTURE FOR HEAT TRANSFER AND CTE MATCHING AND METHOD OF MAKING SAME - A method for producing a bonded functionally graded Material (FGM) structure, includes the steps of providing a plurality of dissimilar material layers; forming a first group and a second group of through holes alternately on a plurality of intermediate dissimilar material layers and on a bottom dissimilar material layer, wherein the first group of through holes has a diameter larger than a diameter of the second group of through holes; stacking the plurality of dissimilar material layers on top of one another. A first group of through holes on any dissimilar material layer is arranged corresponding to a second group of through holes on a dissimilar material layer stacked above, and a second group of through holes on any dissimilar material layer is arranged corresponding to a first group of through holes on a dissimilar material stacked right below; and bonding the plurality of dissimilar material layers. | 06-30-2016 |
20160252312 | Two Piece Aluminum Heat Sink | 09-01-2016 |
20160381832 | DIFFERENTLY ORIENTED LAYERED THERMAL CONDUIT - A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path. | 12-29-2016 |