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Patent application title: THERMAL MODULE AND METHOD OF MANUFACTURING SAME

Inventors:  Chun-Ming Wu (New Taipei City, TW)  Chun-Ming Wu (New Taipei City, TW)
IPC8 Class: AF28D1502FI
USPC Class: 16510421
Class name: Intermediate fluent heat exchange material receiving and discharging heat liquid fluent heat exchange material utilizing change of state
Publication date: 2013-01-10
Patent application number: 20130008629



Abstract:

A thermal module includes a base and at least one heat pipe. The base has at least one groove formed on one face thereof and a recess formed on another opposite face thereof, and the recess is communicable with the at least one groove. The at least one heat pipe is correspondingly fitted in the at least one groove with one surface of the heat pipe flushing with a bottom of the groove to direct contact with a heat source, so as to avoid thermal resistance and more securely locate the heat pipe in the groove, allowing the thermal module to provide largely increased heat dissipation performance. A method of manufacturing the above thermal module is also disclosed.

Claims:

1. A thermal module, comprising: a base having a first face and an opposite second face; the first face being provided with at least one groove, and the second face being provided with a recess; and the at least one groove being communicable with the recess; and at least one heat pipe being correspondingly fitted in the at least one groove.

2. The thermal module as claimed in claim 1, wherein the groove each has an open side and a closed side; and the open side has a width smaller than that of the closed side.

3. The thermal module as claimed in claim 1, further comprising a plate being correspondingly covered onto the at least one groove formed on the first face of the base.

4. The thermal module as claimed in claim 3, wherein the plate is provided at each of four corners with at least one mounting hole.

5. The thermal module as claimed in claim 3, further comprising at least one coupling unit; the coupling unit each including a female connector arranged on the first face of the base and a male connector correspondingly arranged on one

6. The thermal module as claimed in claim 3, further comprising at least one coupling unit; the coupling unit each including a female connector arranged on one side of the plate facing toward the first face of the base and a male connector correspondingly arranged the first face of the base, such that the female and the male connector are correspondingly engaged with each other.

7. The thermal module as claimed in claim 1, wherein the heat pipe each includes a first surface and an opposite second surface that are directly connected at respective two lateral edges with one another.

8. The thermal module as claimed in claim 1, wherein the base further includes a first, a second, a third and a fourth extended section, on each of which at least one mounting hole is provided.

9. A method of manufacturing thermal module, comprising the following steps: providing at least one heat pipe and a base having at least one groove formed one face thereof and a recess formed on an opposite face thereof; and correspondingly fitting the at least heat pipe in the at least one groove on the base.

10. The method of manufacturing a thermal module as claimed in claim 9, further comprising the following steps: providing a plate; and correspondingly covering the plate onto the at least one groove to confine the at least heat pipe in the groove.

Description:

FIELD OF THE INVENTION

[0001] The present invention relates to a thermal module, and more particularly, to a thermal module that includes heat dissipating elements being fitted and assembled to one another without the need of welding. The present invention also relates to a method of manufacturing thermal module.

BACKGROUND OF THE INVENTION

[0002] The currently available heat dissipating devices and thermal modules include a plurality of components, including, but not limited to, heat pipes, heat sinks and bases, which are securely assembled to one another mainly by welding. However, for components made of an aluminum material, the welding of them to one another requires special procedures and accordingly, increased processing cost.

[0003] There are also manufacturers who use fastening elements, such as screws, to connect and fix different components to form the thermal modules. However, only some of the components, such as radiating fins and bases, can be assembled together using screws. The heat pipes could not be fixed to other components with screws.

[0004] According to the conventional thermal module forming technique, the heat pipe is assembled to a base by machining the base to form a hole or a groove thereon and then extending the heat pipe through the hole or the groove, so as to overcome the problem of not able to weld or screw the heat pipe to other components. However, with the heat pipe assembled to the base by extending the heat pipe through the hole or groove formed on the base, a heat source is indirectly transferred to the heat pipe via the base. Therefore, the thermal module with the above type of assembling structure is subject to thermal resistance due to clearance existed between the heat pipe and the base, and has reduced heat transfer efficiency.

[0005] In brief, the conventional ways of assembling different components to form a thermal module have the following disadvantages: (1) requiring high cost; (2) not always suitable for all kinds of components for the thermal module; and (3) resulting in reduced heat transfer efficiency of the thermal module so formed.

SUMMARY OF THE INVENTION

[0006] A primary object of the present invention is to provide a thermal module that allows for increased flexibility in the assembling of different components to one another.

[0007] Another object of the present invention is to provide a thermal module that provides increased heat transfer efficiency.

[0008] A further object of the present invention is to provide a method of manufacturing a thermal module that allows for increased flexibility in the assembling of different components to one another and provides increased heat transfer efficiency.

[0009] To achieve the above and other objects, the thermal module according to a preferred embodiment of the present invention includes a base and at least one heat pipe. The base has a first face with at least one groove formed thereon and an opposite second face with a recess formed thereon to communicate with the at least one groove. The at least one heat pipe is correspondingly fitted in the at least one groove.

[0010] To achieve the above and other objects, the method of manufacturing thermal module according to the present invention includes the following steps: providing at least one heat pipe, a base having at least one groove formed on a face of the base, and a plate; correspondingly fitting the at least one heat pipe in the at least one groove on the base; and covering the plate onto the at least one groove to confine the at least heat pipe therein.

[0011] According to another embodiment of the present invention, the base is machined to form a recess on another face opposite to the face with the at least one groove, such that the recess is communicable with the at least one groove.

[0012] With the thermal module and the method of manufacturing same according to the present invention, increased heat transfer efficiency can be obtained, and components for forming the thermal module can be flexibly assembled in different ways.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein

[0014] FIG. 1 is an exploded perspective view of a thermal module according to a first embodiment of the present invention;

[0015] FIG. 2 is an assembled view of FIG. 1;

[0016] FIG. 3 is an assembled perspective view of a thermal module according to a second embodiment of the present invention;

[0017] FIG. 4 is an assembled sectional view of a thermal module according to a third embodiment of the present invention;

[0018] FIG. 5a is an exploded perspective view of a thermal module according to a fourth embodiment of the present invention;

[0019] FIG. 5b is an assembled view of FIG. 5a;

[0020] FIG. 6 is a partially assembled perspective view of a thermal module according to a fifth embodiment of the present invention;

[0021] FIG. 7 is a perspective view showing the thermal module of FIG. 6 is mounted to a substrate;

[0022] FIG. 8 is an exploded perspective view of a thermal module according to a sixth embodiment of the present invention;

[0023] FIG. 9 is an exploded perspective view of a thermal module according to a seventh embodiment of the present invention;

[0024] FIG. 10 is a flowchart showing the steps included in a first method of manufacturing the thermal module of the present invention;

[0025] FIG. 11 is another flowchart showing the steps included in a second method of manufacturing the thermal module of the present invention; and

[0026] FIG. 12 is a perspective view showing an example of application of the thermal module according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.

[0028] Please refer to FIGS. 1 and 2 that are exploded and assembled perspective views, respectively, of a thermal module 1 according to a first embodiment of the present invention. As shown, in the first embodiment, the thermal module 1 includes a base 11 and at least one heat pipe 12.

[0029] The base 11 has a first face 111 and an opposite second face 112. The first face 111 of the base 11 has at least one groove 113 formed thereon; and the second face 112 of the base 11 has a recess 114 formed thereon. The at least one groove 113 and the recess 114 are communicable with one another.

[0030] The at least one heat pipe 12 is correspondingly fitted in the at least one groove 113, and has a first surface 121 and an opposite second surface 122 that are directly connected at respective two lateral edges with one another.

[0031] FIG. 3 is an assembled perspective view of a thermal module according to a second embodiment of the present invention. As shown, the thermal module in the second embodiment is generally structurally similar to the first embodiment, except for a base 11 that further includes a first extended section 115, a second extended section 116, a third extended section 117, and a fourth extended section 118. The first, second, third and fourth extended sections 115˜118 respectively have at least one mounting hole 119 formed thereon.

[0032] FIG. 4 is an assembled sectional view of a thermal module according to a third embodiment of the present invention. As shown, the thermal module in the third embodiment is generally structurally similar to the first embodiment, except for at least one groove 113 that has an open side 1131 and a closed side 1132, and the open side 1131 has a width smaller than that of the closed side 1132.

[0033] Please refer to FIGS. 5a and 5b that are exploded and assembled perspective views, respectively, of a thermal module according to a fourth embodiment of the present invention. As shown, the thermal module in the fourth embodiment is generally structurally similar to the first embodiment but further includes a plate 13 being correspondingly covered onto the first face 111 of the base 11.

[0034] FIG. 6 is a partially assembled perspective view of a thermal module 1 according to a fifth embodiment of the present invention. As shown, the thermal module 1 in the fifth embodiment is generally structurally similar to the fourth embodiment, except for a plate 13 that is provided at each of four corners with at least one mounting hole 131. Fastening elements 2 can be extended through the mounting holes 131 to lock the thermal module onto a substrate 3, as shown in FIG. 7.

[0035] Please refer to FIG. 8 that is an exploded perspective view of a thermal module 1 according to a sixth embodiment of the present invention. As shown, the thermal module 1 in the sixth embodiment is generally structurally similar to the fourth embodiment, except for at least one coupling unit 14. The coupling unit 14 includes a female connector 141 and a male connector 142. The female connector 141 is arranged on the first face 111 of the base 11 and the male connector 142 is correspondingly arranged on one side of the plate 13 facing toward the first face 111, such that the male connector 142 and the female connector 141 are securely engaged with each other to hold the plate 13 to the base 11.

[0036] Please refer to FIG. 9 that is an exploded perspective view of a thermal module 1 according to a seventh embodiment of the present invention. As shown, the thermal module 1 in the seventh embodiment is generally structurally similar to the fourth embodiment, except for at least one coupling unit 14. The coupling unit 14 includes a female connector 141 and a male connector 142. The female connector 141 is arranged on one side of the plate 13 facing toward the first face 111 of the base 11 and the male connector 142 is correspondingly arranged on the first face 111, such that the male connector 142 and the female connector 141 are securely engaged with each other to hold the plate 13 to the base 11.

[0037] The present invention also provides methods of manufacturing the above-described thermal modules. Please refer to FIG. 10 that is a flowchart showing steps S1, S2 included in a first method of the present invention for manufacturing the thermal module as illustrated in FIGS. 1 and 2.

[0038] In the first step S1 of the first thermal module manufacturing method of the present invention, at least one heat pipe and a base provided with at least one groove and a recess are provided.

[0039] More specifically, at least one heat pipe 12 and a base 11 are provided; and the base 11 has at least one groove 113 formed on one face thereof and a recess 114 formed on an opposite face thereof.

[0040] Then, in the second step S2 of the first thermal module manufacturing method, the at least one heat pipe is correspondingly fitted in the at least one groove on the base.

[0041] More specifically, the at least one heat pipe 12 is correspondingly pressed into and accordingly securely fitted in the at least one groove 113 on the base 11 with one surface of the heat pipe 12 flushing with a bottom of the groove 113.

[0042] Please refer to FIG. 11 that is another flowchart showing steps S1, S2 and S3 included in a second method of the present invention for manufacturing the thermal modules as illustrated in FIGS. 4 to 8.

[0043] In the first step S1 of the second thermal module manufacturing method of the present invention, at least one heat pipe and a base provided with at least one groove and a recess are provided.

[0044] Since the first step S1 is the same as that in the first thermal module manufacturing method, it is not repeatedly described in details herein.

[0045] In the second step S2 of the second thermal module manufacturing method, the at least one heat pipe is correspondingly fitted in the at least one groove on the base.

[0046] Since the second step S2 is the same as that in the first thermal module manufacturing method, it is not repeatedly described in details herein.

[0047] In the third step S3 of the second thermal module manufacturing method, a plate is provided and correspondingly covered onto the base to confine the at least one heat pipe in the at least one groove.

[0048] More specifically, a plate 13 is provided and correspondingly covered onto one face, i.e., the first face 111, of the base 11 having the at least one groove 113 formed thereon, so as to close the at least one groove 113 and confine the at least one heat pipe 12 therein.

[0049] FIG. 12 shows an example of application of the thermal module of the present invention. As shown, with the particularly designed base 11 of the thermal module 1 of the present invention, the first surface 121 and the second surface 122 of the at least one heat pipe 12 can respectively contact with a heat source 4 at the same time to thereby provide increased heat dissipation efficiency. Meanwhile, the thermal module 1 of the present invention provides largely increased flexibility for using at places with limited space.

[0050] The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.


Patent applications by Chun-Ming Wu, New Taipei City TW

Patent applications in class Utilizing change of state

Patent applications in all subclasses Utilizing change of state


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