| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 438115000 | Including contaminant removal or mitigation | 8 |
| 20080248613 | Method of Forming a Micromechanical Device with Microfluidic Lubricant Channel - A micromechanical device assembly includes a micromechanical device enclosed within a processing region and a lubricant channel formed through an interior wall of the processing region and in fluid communication with the processing region. Lubricant is injected into the lubricant channel via capillary forces and held therein via surface tension of the lubricant against the internal surfaces of the lubrication channel. The lubricant channel containing the lubricant provides a ready supply of fresh lubricant to prevent stiction from occurring between interacting components of the micromechanical device disposed within the processing region. | 10-09-2008 |
| 20080280398 | System And Method For Direct Bonding Of Substrates - A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port. | 11-13-2008 |
| 20110097853 | VIA FORMING METHOD AND METHOD OF MANUFACTURING MULTI-CHIP PACKAGE USING THE SAME - A via forming method is provided. The via forming method includes: forming via-holes in a substrate; putting the substrate having the via-holes in a first solution to fill the via-holes with the first solution; sinking the metal particles into the via-holes by supplying a second solution containing metal particles to the first solution, in which there is the substrate; and performing a first curing process of heat-treating the substrate having the via-holes filled with the metal particles so as to form vias in the via-holes. Further, a method of manufacturing a multi-chip package using the via forming method is provided. | 04-28-2011 |
| 20120064670 | APPARATUS FOR RESTRICTING MOISTURE INGRESS - Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier. | 03-15-2012 |
| 20120208321 | PASSIVATION LAYER FOR SEMICONDUCTOR DEVICE PACKAGING - Methods of protecting a surface of a copper layer or a copper bonding pad on a semiconductor device against oxidation. A surface of the layer or bonding pad is cleaned by removing an oxidation layer with a plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma-enhanced deposition process to protect the cleaned surface of the layer against exposure to an oxidizing gas. | 08-16-2012 |
| 20130089955 | PROCESS FOR ENCAPSULATING A MICRO-DEVICE BY ATTACHING A CAP AND DEPOSITING GETTER THROUGH THE CAP - Process for encapsulating a micro-device in a cavity formed between one first and one second substrate, comprising at least the steps of:
| 04-11-2013 |
| 20130109136 | METHODS OF FABRICATING ELECTRONICS ASSEMBLIES | 05-02-2013 |
| 20160056051 | EXTERNAL GETTERING METHOD AND DEVICE - Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed. | 02-25-2016 |
