| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 438068000 | Substrate dicing | 52 |
| 20090233397 | Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells - For forming the separating lines, ( | 09-17-2009 |
| 20090239329 | METHOD FOR MANUFACTURING PACKAGE STRUCTURE OF OPTICAL DEVICE - A package structure of optical devices has a chip, a sealant, a cover, a substrate, a plurality of bonding wires, and a transparent encapsulant. The chip has at least an optical device and a plurality of chip connection pads. The sealant is disposed around the optical elements. The cover is disposed on the sealant. The substrate supports the chip and has a plurality of connection pads. The bonding wires are used for electrically connecting the chip connection pads of the chip to the connection pads of the substrate. The transparent encapsulant is formed over the substrate and the cover, and encapsulates the bonding wires. | 09-24-2009 |
| 20100009491 | Joined wafer, fabrication method thereof, and fabrication method of semiconductor devices - A method of fabricating a joined wafer has an exposure process which comprises a device formed-area exposure process of exposing by a stepper such that parts of the photosensitive adhesive layer formed over a surface of the transparent wafer or the device formed wafer are removed, the parts corresponding to the device formed areas when the transparent wafer and the device formed wafer are stuck together; and a wafer periphery exposure process of exposing such that a portion of the photosensitive adhesive layer over the periphery of the transparent wafer is left. | 01-14-2010 |
| 20100009492 | METHOD FOR PRODUCTION OF THIN SEMICONDUCTOR SOLAR CELLS AND INTEGRATED CIRCUITS - The invention relates to the formation of thin-film crystalline silicon using a zone-melting recrystallization process in which the substrate is a ceramic material. Integrated circuits and solar cells are fabricated in the recrystallized silicon thin film and lifted off the substrate. Following lift-off, these circuits and devices are self-sustained, lightweight and flexible and the released ceramic substrate can be reused making the device fabrication process cost effective. | 01-14-2010 |
| 20100062560 | APPLICATION SPECIFIC SOLAR CELL AND METHOD FOR MANUFACTURE USING THIN FILM PHOTOVOLTAIC MATERIALS - A method for manufacture of application specific solar cells includes providing and processing custom design information to determine at least a cell size and a cell shape. The method includes providing a transparent substrate having a back surface region, a front surface region, and one or more grid-line regions overlying the front side surface region. The one or more grid regions provide one or more unit cells having the cell size and the cell shape. The method further includes forming a layered structure including photovoltaic materials overlying the front surface region. Additionally, the method includes aligning a laser beam from the back surface region to illuminate a first region within the one or more grid-line regions, subjecting a first portion of the layered structure overlying the first region to the laser beam to separate the first portion of the layered structure from the first region, and scanning the laser beam along the one or more grid-line regions to cause formation of one or more unit cells having the cell size and cell shape. The method further includes transferring the one or more unit cells. | 03-11-2010 |
| 20100068847 | METHOD FOR MANUFACTURING AN IMAGE SENSOR - A method for fabricating an image sensor die includes providing a wafer having a plurality of die, each die having a raised portion adjacent to an image area onto which a glass cover will be adhered; and thereafter dicing the wafer so that the plurality of die are separated into individual die. | 03-18-2010 |
| 20100167454 | DOUBLE-SIDED DONOR FOR PREPARING A PAIR OF THIN LAMINAE - A method for forming a photovoltaic cell is disclosed which comprises the steps of providing a semiconductor donor body having a first surface and a second surface opposite the first surface, cleaving a first portion from the first surface of the semiconductor donor body to form a first lamina of semiconductor material, wherein the first lamina of semiconductor material has a first lamina thickness, and cleaving a second portion from the second surface of the semiconductor donor body to form a second lamina of semiconductor material, wherein the second lamina of semiconductor material has a second lamina thickness. | 07-01-2010 |
| 20100197070 | Methods and Apparatuses for Manufacturing Cast Silicon From Seed Crystals - Methods and apparatuses are provided for casting silicon for photovoltaic cells and other applications. With these methods, an ingot can be grown that is low in carbon and whose crystal growth is controlled to increase the cross-sectional area of seeded material during casting. | 08-05-2010 |
| 20100240169 | METHOD TO MAKE ELECTRICAL CONTACT TO A BONDED FACE OF A PHOTOVOLTAIC CELL - A photovoltaic cell is formed by bonding a donor body to a receiver element and cleaving a thin lamina from the donor body. Electrical contact is made to the bonded surface of the lamina through vias formed in the lamina. In some embodiments the emitter exists only at the bonded surface or only at the cleaved surface face; the emitter does not wrap through the vias between the surfaces. Wiring contacting each of the two surfaces is formed only at the cleaved face, and one set of wiring contacts the bonded surface through conductive material formed in the vias, insulated from the via sidewalls. | 09-23-2010 |
| 20100297803 | NANOPHOTOVOLTAIC DEVICES - The present invention provides nanophotovoltaic devices having sizes in a range of about 50 nm to about 5microns, and method of their fabrication. In some embodiments, the nanophotovoltaic device includes a semiconductor core, e.g., formed of silicon, sandwiched between two metallic layers, one of which forms a Schottky barrier junction with the semiconductor core and the other forms an ohmic contact therewith. In other embodiment, the nanophotovoltaic device includes a semiconductor core comprising a p-n junction that is sandwiched between two metallic layers forming ohmic contacts with the core. | 11-25-2010 |
| 20100304519 | METHOD OF FABRICATING SOLAR CELL CHIPS - A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips. | 12-02-2010 |
| 20110045625 | METHOD OF MANUFACTURING A SEMICONDUCTOR WAFER COMPRISING AN INTEGRATED OPTICAL FILTER - A method manufactures semiconductor chips each comprising a component implanted in the semiconductor. The method includes collectively implanting components onto a front face of a semiconductor wafer and fixing a plate of a transparent material onto the front face of the wafer. Fixing the plate of transparent material is preceded by a step of depositing, on the front face of the wafer, at least one layer of polymer material forming an optical filter. Application is particularly to the manufacturing of imagers. | 02-24-2011 |
| 20110053308 | Method for the Production of an Optoelectronic Component using Thin-Film Technology - On an epitaxy substrate ( | 03-03-2011 |
| 20110065227 | COMMON LASER MODULE FOR A PHOTOVOLTAIC PRODUCTION LINE - Embodiments of the present invention generally relate to an automated production line using a common laser scribe module for providing consistent scribe lines in multiple layers during the formation of thin film photovoltaic modules. The common laser scribe module includes a plurality of identical, programmable laser tools configured to emit radiation at a common wavelength. Substrates flowing through the production line are tracked by a system controller, which identifies available laser tools within the common laser scribe module and routes substrates to available tools for scribing features in one or more layers disposed on the substrates. The system controller also sets and controls laser parameters, such as power, pulse frequency, pulse width, and laser pattern, in order to accurately and consistently produce scribed lines in the appropriate material layer of the substrate. | 03-17-2011 |
| 20110111548 | METHOD OF MANUFACTURING A SOLAR CELL USING A PRE-CLEANING STEP THAT CONTRIBUTES TO HOMOGENEOUS TEXTURE MORPHOLOGY - A method of manufacturing a solar cell wherein a pre-cleaning step is completed prior to a saw damage removal step and prior to texturization, thereby resulting in the subsequently formed textured surface to have a more homogeneous textural morphology. In one aspect, the invention is a method comprising: a) applying a pre-cleaning solution to an as-cut surface of a crystalline silicon substrate to remove surface contaminants, thereby converting the as-cut surface to a pre-cleaned surface, the as-cut surface formed by a sawing process to create the crystalline silicon substrate; b) applying a first etching solution to the pre-cleaned surface to remove physical damage caused during the sawing process, thereby converting the pre-cleaned surface into a prepared surface; c) applying a second etching solution to the prepared surface to texturize the prepared surface, thereby converting the prepared surface into a texturized surface; and d) forming at least one solar cell on the texturized surface of the crystalline silicon substrate. | 05-12-2011 |
| 20110124147 | METHOD FOR SEPARATING SILICON SOLAR CELLS - In a method for separating silicon solar cells, a groove is introduced into a silicon wafer containing the silicon solar cells along a separating line in a front side of the silicon wafer adjacent to a p-n junction in the silicon wafer using a first laser beam. The groove has a depth reaching at least to the p-n junction and extends to a lateral edge of the silicon wafer. In a second work step, the silicon wafer is cut along the separating line starting at the lateral edge using a second laser beam directed into the groove. Wherein the melt arising during the cutting is driven out of the cutting kerf arising during the cutting using a cutting gas flowing at least approximately in the direction of the second laser beam. | 05-26-2011 |
| 20110237015 | NANOPHOTOVOLTAIC DEVICES - The present invention provides nanophotovoltaic devices having sizes in a range of about 50 nm to about 5 microns, and method of their fabrication. In some embodiments, the nanophotovoltaic device includes a semiconductor core, e.g., formed of silicon, sandwiched between two metallic layers, one of which forms a Schottky barrier junction with the semiconductor core and the other forms an ohmic contact therewith. In other embodiment, the nanophotovoltaic device includes a semiconductor core comprising a p-n junction that is sandwiched between two metallic layers forming ohmic contacts with the core. | 09-29-2011 |
| 20110306162 | PHOTOVOLTAIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A photovoltaic device uses a single crystal or polycrystalline semiconductor layer which is separated from a single crystal or polycrystalline semiconductor substrate as a photoelectric conversion layer and has a SOI structure in which the semiconductor layer is bonded to a substrate having an insulating surface or an insulating substrate. A single crystal semiconductor layer which is a separated surface layer part of a single crystal semiconductor substrate and is transferred is used as a photoelectric conversion layer and includes an impurity semiconductor layer to which hydrogen or halogen is added on a light incidence surface or on an opposite surface. The semiconductor layer is fixed to a substrate having an insulating surface or an insulating substrate. | 12-15-2011 |
| 20110318863 | PHOTOVOLTAIC DEVICE MANUFACTURE - A photovoltaic device manufacturing method is disclosed. Methods include manufacturing a photovoltaic cell using nanoimprint technology to define individual cell units of the photovoltaic device. The methods can include providing a substrate; forming a first conductive layer over the substrate; forming first grooves in the first conductive layer using a nanoimprint and etching process; forming an absorption layer over the first conductive layer, the absorption layer filling in the first grooves; forming second grooves in the absorption layer using a nanoimprint process; forming a second conductive layer over the absorption layer, the second conductive layer filling in the second grooves; and forming third grooves in the second conductive layer and the absorption layer, thereby defining a photovoltaic cell unit. | 12-29-2011 |
| 20120003775 | Formed Ceramic Receiver Element Adhered to a Semiconductor Lamina - A method is described to create a thin semiconductor lamina adhered to a ceramic body. The method includes defining a cleave plane in a semiconductor donor body, applying a ceramic mixture to a first face of the semiconductor body, the ceramic mixture including ceramic powder and a binder, curing the ceramic mixture to form a ceramic body, and cleaving a lamina from the semiconductor donor body at the cleave plane, the lamina remaining adhered to the ceramic body. Forming the ceramic body this way allows outgassing of volatiles during the curing step. Devices can be formed in the lamina, including photovoltaic devices. The ceramic body and lamina can withstand high processing temperatures. In some embodiments, the ceramic body may be conductive. | 01-05-2012 |
| 20120003776 | IMAGE SENSOR AND MANUFACTURING METHOD FOR SAME - An image sensor including a first region where a pad is to be formed, and a second region where a light-receiving element is to be formed. A pad is formed over a substrate of the first region. A passivation layer is formed over the substrate of the first and second regions to expose a portion of the pad. A color filter is formed over the passivation layer of the second region. A microlens is formed over the color filter. A bump is formed over the pad. A protective layer is formed between the bump and the pad to expose the portion of the pad. | 01-05-2012 |
| 20120003777 | SYSTEMS, METHODS AND APPARATUSES FOR MAGNETIC PROCESSING OF SOLAR MODULES - Provided herein are methods, apparatuses and systems for fabricating photovoltaic cells and modules. In certain embodiments, the methods, apparatuses and systems involve coating ferromagnetic substrates with thin film solar cell materials and using magnetic force to constrain, move or otherwise manipulate partially fabricated cells or modules. According to various embodiments, the methods, apparatuses and systems provide magnetically actuated handling throughout a photovoltaic cell or module fabrication process, from forming photovoltaic cell layers on a substrate to packaging the module for transport and installation. The magnetically manipulated processing provides advantages over conventional photovoltaic module processing operations, including fewer mechanical components, greater control over placement and tolerances, and ease of handling. As a result, the methods, apparatuses and systems provide highly efficient, low maintenance photovoltaic module fabrication processes. | 01-05-2012 |
| 20120009717 | PACKAGED MICROELECTRONIC IMAGERS AND METHODS OF PACKAGING MICROELECTRONIC IMAGERS - Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrate, an integrated circuit, and an image sensor electrically coupled to the integrated circuit. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends partially through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending partially through the substrate to the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, a conductive layer deposited onto at least a portion of the dielectric liner, a wetting agent deposited onto at least a portion of the conductive layer, and a conductive fill material deposited into the passage and electrically coupled to the bond-pad. | 01-12-2012 |
| 20120009718 | IMAGE SENSOR MODULE, METHOD OF MANUFACTURING THE SAME, CAMERA MODULE INCLUDING THE SAME AND ELECTRONIC DEVICE INCLUDING THE CAMERA MODULE - An image sensor module may include an image sensor, a variable thickness member and a lens member. The image sensor may include a light receiver configured to receive a light. Further, a driving voltage may be applied to the image sensor. The variable thickness member may be arranged on the image sensor adjacent to the light receiver. Further, the variable thickness member may have a variable thickness along an optical axis of the light in accordance with the driving voltage through the image sensor. | 01-12-2012 |
| 20120034728 | LINEAR SEMICONDUCTOR SUBSTRATE, AND DEVICE, DEVICE ARRAY AND MODULE, USING THE SAME - The linear semiconductor substrate | 02-09-2012 |
| 20120045866 | METHOD OF FORMING AN ELECTRONIC DEVICE USING A SEPARATION TECHNIQUE - A method of forming an electronic device can include forming a patterned layer adjacent to a side of a substrate including a semiconductor material. The method can also include separating a semiconductor layer and the patterned layer from the substrate, wherein the semiconductor layer is a portion of the substrate. | 02-23-2012 |
| 20120058591 | Method of fabricating epitaxial structures - A method of fabricating epitaxial structures including applying an etch stop to one side of a substrate and then growing at least one epitaxial layer on a first side of said substrate, flipping the substrate, growing a second etch stop and at least one epitaxial layer on a second side of the substrate, applying a carrier medium to the ultimate epitaxial layer on each side, dividing the substrate into two parts generally along an epitaxial plane to create separate epitaxial structures, removing any residual substrate and removing the etch stop. | 03-08-2012 |
| 20120094422 | PARTIALLY TRANSMITTED IMAGED LASER BEAM FOR SCRIBING SOLAR CELL STRUCTURES - Provided herein are methods and systems for scribing solar cell structures to create isolated solar cells. According to various embodiments, the methods involve scanning an excimer laser beam along a scribe line of a solar cell structure to ablate electrically active layers of the structure. A photomask having variable transmittance is disposed between the beam source and the solar cell structure. The transmittance is calibrated to produce variable fluence levels such that a stepped scribed profile is obtained. In certain embodiments, a front contact/absorber/back contact stack is removed along a portion of the scribe line, while a front contact/absorber stack is simultaneously removed along a parallel portion, with the back contact layer unremoved. In this manner, the scribe electrically isolates solar cells on either side of the scribe line, while providing a contact point to the back contact layer of one of the solar cells for subsequent cell-cell interconnection. | 04-19-2012 |
| 20120142139 | MOUNTING OF SOLAR CELLS ON A FLEXIBLE SUBSTRATE - According to an embodiment, a method of manufacturing a solar cell includes depositing a sequence of layers of semiconductor material forming at least one solar cell on a first substrate; temporarily bonding a flexible film to a support second substrate; permanently bonding the sequence of layers of semiconductor material to the flexible film so that the flexible film is interposed between the first and second substrates; thinning the first substrate while bonded to the support substrate to expose the sequence of layers of semiconductor material; and subsequently removing the support substrate from the flexible film. | 06-07-2012 |
| 20120178202 | PLASMA VAPOR DEPOSITION SYSTEM AND METHOD FOR MAKING MULTI-JUNCTION SILICON THIN FILM SOLAR CELL MODULES AND PANELS - A plasma vapor deposition system for making multi-junction silicon thin film solar cell modules and panels including a flexible substrate disposed about and removably supported by a dual-walled cylindrical substrate support for axially rotating the flexible substrate about its longitudinal axis, the dual-walled cylindrical substrate support comprising an inner wall spaced apart by an outer wall to define a coaxial cavity; a plasma vapor deposition torch located substantially adjacent to the flexible substrate for depositing at least one thin film material layer on an outer surface of the flexible substrate; and a traversing platform for supporting the rotatable substrate support relative to the plasma vapor deposition torch, the rotatable substrate support being traversed along its longitudinal axis by the traversing platform. | 07-12-2012 |
| 20120244656 | METHOD AND APPARATUS FOR PRODUCING SOLAR CELL - Disclosed herein are a method and an apparatus for producing a solar cell. The method includes: (a) preparing a rear contact solar cell substrate having electrode patterns formed on a rear surface thereof; (b) performing scribing on a front surface of the substrate on which the electrode patterns are not formed, by using laser; and (c) cutting the substrate in each cell along the scribing so as to form the solar cell. Further, an apparatus for producing a solar cell is operated by the method for producing a solar cell. | 09-27-2012 |
| 20120270358 | Method for Fabrication of an Array of Chip-Sized Photovoltaic Cells for a Monolithic Low Concentration Photovoltaic Panel Based on Crossed Compound Parabolic Concentrators - Method for determining the dimensions of a plurality of chip-size photovoltaic cells diced out of a photovoltaic wafer, the method includes the procedures of determining the field of view angle of a plurality of crossed compound parabolic concentrators of an optical layer, determining the index of refraction of the material forming the optical layer, determining the dimensions of the optical entry aperture and the optical exit aperture of the crossed compound parabolic concentrators, as well as the distance separating the optical entry apertures of adjacent ones of the crossed compound parabolic concentrators, determining a dicing width for dicing the photovoltaic wafer into the plurality of chip-size photovoltaic cells, and determining the dimensions of the plurality of chip-size photovoltaic cells according to the dimensions of the optical entry aperture of the plurality of crossed compound parabolic concentrators, the distance separating the optical entry apertures of adjacent ones of the crossed compound parabolic concentrators, the index of refraction of the optical layer, the field of view angle of the plurality of crossed compound parabolic concentrators and according to the dicing width. | 10-25-2012 |
| 20130040415 | METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - A process of forming an isolation region that defines an active region on a semiconductor wafer, a process of forming a photoelectric conversion element in the active region defined by the isolation region, and a process of forming a micro lens over the photoelectric conversion element are provided. Alignment in the process of forming the photoelectric conversion element and alignment in the process of forming the micro lens are performed using an alignment mark formed in the process of forming the isolation region. | 02-14-2013 |
| 20130084671 | METHOD FOR FRACTURING SEMICONDUCTOR SUBSTRATE, METHOD FOR FRACTURING SOLAR CELL, AND THE SOLAR CELL - In accordance with the present invention, the dividing grooves | 04-04-2013 |
| 20130130425 | Method and Machine for Producing a Semiconductor, of the Photovoltaic or Similar Electronic Component Type - The invention relates to a method for producing a semiconductor, of the photovoltaic cell type, or similar electronic components. According to the invention, at least one silicon wafer is cut from the cross-section of a silicon rod and, after doping, a substrate is assembled on either side of the silicon wafer and the latter is cut into two parts through the thickness of the silicon, so as to form two semiconductor units each comprising a substrate and a thin silicon film. | 05-23-2013 |
| 20130157402 | SOLAR CELL SYSTEM MANUFACTURING METHOD - A method for manufacturing a solar cell system includes the following steps. First, a number of P-N junction cell preforms are provided. The number of the P-N junction cell preforms is M. The M P-N junction cell preforms is named from a first P-N junction cell preform to a Mth P-N junction cell preform. Second, the M P-N junction cell preforms are arranged along a straight line. Third, an inner electrode preform is formed between each two adjacent P-N junction cell preforms, wherein at least one inner electrode is a carbon nanotube array. Axial directions of the carbon nanotubes in the carbon nanotube array are parallel to the straight line. | 06-20-2013 |
| 20130267057 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor chip having a first surface, a second surface and a pixel area, first adhesion patterns disposed on the first surface, second adhesion patterns disposed between the first adhesion patterns and the pixel area and disposed on the first surface, and external connection terminals disposed on the second surface, wherein the second adhesion patterns and the external connection terminals are disposed to overlap each other. | 10-10-2013 |
| 20130288418 | METHOD FOR FABRICATING A THREE-DIMENSIONAL THIN-FILM SEMICONDUCTOR SUBSTRATE FROM A TEMPLATE - A method is presented for fabrication of a three-dimensional thin-film solar cell semiconductor substrate from a template. A semiconductor template having three-dimensional surface features comprising a top surfaces substantially aligned along a (100) crystallographic plane of semiconductor template and a plurality of inverted pyramidal cavities defined by sidewalls substantially aligned along a (111) crystallographic plane is formed according to an anisotropic etching process. A dose of relatively of high energy light-mass species is implanted in the template at a uniform depth and parallel to the top surfaces and said sidewalls defining the inverted pyramidal cavities of the template. The semiconductor template is annealed to convert the dose of relatively of high energy light-mass species to a mechanically-weak-thin layer. The semiconductor template is cleaved along the mechanically-weak-thin layer to release a three-dimensional thin-film semiconductor substrate from the semiconductor template. | 10-31-2013 |
| 20130288419 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, ELECTRONIC APPARATUS, AND SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate, a region including a semiconductor element on the substrate, and at least one guard ring structure provided around the region. The guard ring structure includes a guard ring and at least one portion comprised of the substrate. | 10-31-2013 |
| 20130316488 | REMOVAL OF STRESSOR LAYER FROM A SPALLED LAYER AND METHOD OF MAKING A BIFACIAL SOLAR CELL USING THE SAME - A stressor layer used in a controlled spalling method is removed through the use of a cleave layer that can be fractured or dissolved. The cleave layer is formed between a host semiconductor substrate and the metal stressor layer. A controlled spalling process separates a relatively thin residual host substrate layer from the host substrate. Following attachment of a handle substrate to the residual substrate layer or other layers subsequently formed thereon, the cleave layer is dissolved or otherwise compromised to facilitate removal of the stressor layer. Such removal allows the fabrication of a bifacial solar cell. | 11-28-2013 |
| 20140045293 | FABRICATION OF INTERCONNECTED THIN-FILM CONCENTRATOR CELLS USING SHADOW MASKS - A method for fabricating thin film solar cells for a concentrated photovoltaic system uses three shadow masks. The first mask, used to deposit a back contact layer, has multiple horizontal and vertical lines defining columns and rows of cells, and multiple tabs each located in a cell along a center of a vertical border. The second mask, used to deposit a CIGS absorption layer, a window layer and a transparent contact layer, is similar to the first mask except the tabs are located along the opposite vertical border of the cells. The third mask, used to deposit a metal grid layer, has multiple bus bar openings and finger openings. Each bus bar opening is located along a horizontal center line of a cell and overlaps the second tab of a neighboring cell. The cells in a horizontal row are connected in series, forming a linear solar receiver. | 02-13-2014 |
| 20140154831 | Method and Device for processing at least one crystalline Silicon-wafer or a Solar-cell wafer - In different embodiments, a method is provided for processing at least one crystalline Silicon-wafer or a Solar-cell wafer. The method may include: a movement of the wafer with respect to a laser producing a laser beam; and therefore the formation of a laser channel in the wafer by means of a laser beam, wherein a thermal budget applied on the wafer by means of the laser beam is reduced in the peripheral region of the wafer, wherein the peripheral region includes a wafer edge, through which the laser beam exits the wafer after formation of the laser channel. | 06-05-2014 |
| 20140170798 | INTEGRATED THIN FILM SOLAR CELL INTERCONNECTION - Photovoltaic modules may include multiple flexible thin film photovoltaic cells electrically connected in series, and laminated to a substantially transparent top sheet having a conductive grid pattern facing the cells. Methods of manufacturing photovoltaic modules including integrated multi-cell interconnections are provided. Methods may include steps of coordinating, integrating, and registering multiple rolls of substrates in continuous processes. | 06-19-2014 |
| 20140273329 | SOLAR CELL LASER SCRIBING METHODS - A multi-step scribing operation is provided for forming scribe lines in solar panels to form multiple interconnected cells on a solar panel substrate. The multi-step scribing operation includes at least one step utilizing a nanosecond laser cutting operation. The nanosecond laser cutting operation is followed by a mechanical cutting operation or a subsequent nanosecond laser cutting operation. In some embodiments, the multi-step scribing operation produces a two-tiered scribe line profile and the method prevents local shunting and minimizes active area loss on the solar panel. | 09-18-2014 |
| 20140322857 | Dark Current Reduction for Back Side Illuminated Image Sensor - A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material. | 10-30-2014 |
| 20150044810 | Backside Illumination Image Sensor Chips and Methods for Forming the Same - A die includes a first plurality of edges, and a semiconductor substrate in the die. The semiconductor substrate includes a first portion including a second plurality of edges misaligned with respective ones of the first plurality of edges. The semiconductor substrate further includes a second portion extending from one of the second plurality of edges to one of the first plurality of edges of the die. The second portion includes a first end connected to the one of the second plurality of edges, and a second end having an edge aligned to the one of the first plurality of edges of the die. | 02-12-2015 |
| 20150087103 | LASER ETCHING A STACK OF THIN LAYERS FOR A CONNECTION OF A PHOTOVOLTAIC CELL - A treatment of thin layers for forming a connection of a photovoltaic cell including the thin layers, which includes a first layer, having photovoltaic properties, deposited on a second layer, and the second layer, which is a metal contact layer, deposited on a substrate, the treatment including etching, in the first layer, at least one first trench having a first width so as to expose the second layer; and etching, in the first trench, a second trench so as to expose the substrate, the second trench having a second width less than the first width. | 03-26-2015 |
| 20150340403 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE - A manufacturing method of a semiconductor structure includes the following steps. A temporary bonding layer is used to adhere a carrier to a first surface of a wafer. A second surface of the wafer is adhered to an ultraviolet tape on a frame, and the temporary bonding layer and the carrier are removed. A protection tape is adhered to the first surface of the wafer. An ultraviolet light is used to irradiate the ultraviolet tape. A dicing tape is adhered to the protection tape and the frame, and the ultraviolet tape is removed. A first cutter is used to dice the wafer from the second surface of the wafer, such that plural chips and plural gaps between the chips are formed. A second cutter with a width smaller than the width of the first cutter is used to cut the protection tape along the gaps. | 11-26-2015 |
| 20160035787 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case. | 02-04-2016 |
| 20160099284 | MINIATURE WAFER-LEVEL CAMERA MODULES - In one aspect, a method includes providing a lens substrate having an array of lenses. The lens substrate includes an overflow region next to each lens of the array. Each overflow region includes an overflow lens material. The method also includes separating the lens substrate into a plurality of smaller lens substrates. Each of the smaller lens substrates has one of the single lens and the plurality of stacked lenses. Separating the lens substrate into the smaller lens substrates may include removing or substantially removing the overflow regions. In one aspect, the method may be performed as a method of making a miniature camera module. Other methods are also described, as are miniature camera modules. | 04-07-2016 |
| 20160148972 | WAFER-LEVEL PACKAGING METHOD OF BSI IMAGE SENSORS HAVING DIFFERENT CUTTING PROCESSES - A wafer-level packaging method of BSI image sensors includes the following steps: S | 05-26-2016 |
| 20160254313 | SEMICONDUCTOR ELEMENT HAVING GROOVES WHICH DIVIDE AN ELECTRODE LAYER, AND METHOD OF FORMING THE GROOVES | 09-01-2016 |
