| Entries |
| Document | Title | Date |
|---|
| 20080199810 | HIGH PERFORMANCE CURABLE POLYMERS AND PROCESSES FOR THE PREPARATION THEREOF - Disclosed is a composition which comprises a polymer containing at least some monomer repeat units with photosensitivity-imparting substituents which enable crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer being of the formula | 08-21-2008 |
| 20080199811 | PHOTOSENSITIVE COMPOSITION AND TWO-PHOTON ABSORPTION PHOTORECORDING MEDIUM - A photosensitive composition containing a binder polymer, a polymerizable compound, and a compound of formula (I): | 08-21-2008 |
| 20080206678 | RADIATION-SENSITIVE COMPOSITIONS AND ELEMENTS WITH BASIC DEVELOPMENT ENHANCERS - Radiation-sensitive compositions can be used to prepare positive-working imageable elements useful for example to make lithographic printing plates. The compositions include an aqueous alkaline solvent soluble polymeric binder that includes a phenolic resin (such as a novolak) or a poly(vinyl acetal). The compositions also include a developability-enhancing composition comprising one or more basic nitrogen-containing organic compounds. The radiation-sensitive composition can be coated as an imageable layer that further includes a radiation absorbing compound that is, for example, sensitive to infrared radiation. | 08-28-2008 |
| 20080213699 | PHOTORESIST COMPOSITION AND METHOD OF FORMING A PHOTORESIST PATTERN USING THE PHOTORESIST COMPOSITION - In a photoresist composition and a method of forming a photoresist pattern using the photoresist composition, the photoresist composition includes a photosensitive polymer having a first repeating unit of p-hydroxystyrene and a second repeating unit of an acrylate at a molar ratio of from about 40:60 to about 60:40, a photosensitive material and an organic solvent. The photoresist composition having good reproducibility and stability may form a photoresist film having a substantially uniform thickness, and may form a fine pattern with accuracy. | 09-04-2008 |
| 20080241747 | Positive Resist Composition and Method of Forming Resist Pattern - A positive resist composition that exhibits a large exposure margin, and excellent levels of resolution and dry etching resistance, as well as a method of forming a resist pattern that uses the positive resist composition. This resist composition includes a resin component (A), which contains acid dissociable, dissolution inhibiting groups and displays increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) contains a structural unit (a1) represented by a general formula (I) shown below, a structural unit (a2) in which a hydroxyl group within the above general formula (I) has been protected by substituting the hydrogen atom thereof with an acid dissociable, dissolution inhibiting group (II) represented by a general formula (II) shown below, and a structural unit (a3) in which a hydroxyl group within the above general formula (I) has been protected by substituting the hydrogen atom thereof with an acyclic acid dissociable, dissolution inhibiting group (III). | 10-02-2008 |
| 20080241748 | Etch-resistant disilane and saturated hydrocarbon bridged silicon-containing polymers, method of making the same, and method of using the same - A composition includes a copolymer including a mixture of monomeric units having structures (A), (B), and (C), and one or more of structures (D) or (E): | 10-02-2008 |
| 20080241749 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition, includes: (B1) a resin capable of decomposing under an action of an acid to increase a solubility of the resin (B1) in an aqueous alkali solution, the resin (B1) containing a specific hydroxystyrene-based repeating unit and/or (meth)acrylic acid-based repeating unit as defined in the specification; (B2) a resin capable of decomposing under an action of an acid to increase a solubility of the resin (B2) in an aqueous alkali solution, the resin (B2) containing a specific hydroxystyrene-based repeating unit and/or (meth)acrylic acid-based repeating unit as defined in the specification and containing a specific aromatic ring structure-containing repeating unit as defined in the specification; and (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation, and a pattern forming method uses the composition. | 10-02-2008 |
| 20080241750 | RESIST COMPOSITION AND PATTERN FORMATION METHOD USING THE SAME - A resist composition includes: (A) a resin that includes: a repeating unit represented by a following formula (I), and a repeating unit represented by a following formula (II); and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation: | 10-02-2008 |
| 20080241751 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND PATTERNING PROCESS - A chemically amplified negative resist composition comprises a polymer comprising recurring hydroxystyrene units and recurring styrene units having electron withdrawing groups substituted thereon. In forming a pattern having a fine feature size of less than 0.1 μm, the composition exhibits a high resolution in that a resist coating formed from the composition can be processed into such a fine size pattern while the formation of bridges between pattern features is minimized. | 10-02-2008 |
| 20080241752 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition, includes: (A) a resin having a property of becoming soluble in an alkali developer under an action of an acid and having a phenolic hydroxyl group and a weight average molecular weight of 1,500 to 3,500; and (B) a compound capable of generating a sulfonic acid upon irradiation with actinic rays or radiation, wherein a ratio of dissolution rates of an exposed area and an unexposed area in an aqueous 2.38 wt % tetramethylammonium hydroxide at 23° C. under atmospheric pressure is in a range from 200 to 5,000 times, and a pattern forming method uses the composition. | 10-02-2008 |
| 20080248426 | Antihalation compositions - Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder. | 10-09-2008 |
| 20080254385 | Photosensitive Resin for Flexographic Printing Plate - Disclosed is a photosensitive resin composition for flexographic printing plates containing a thermoplastic elastomer (A), a polymer (B) mainly composed of butadiene, a photopolymerizable unsaturated monomer (C) and a photopolymerization initiator (D) (which composition substantially contains no hydrophilic polymers). In this photosensitive resin composition for flexographic printing plates, the number average molecular weight of the polymer (B) is not less than 10,000 and not more than 60,000, and the 1, 2 vinyl content in the total double bonds of the polymer (B) is not more than 25%. | 10-16-2008 |
| 20080254386 | Positive resist composition and patterning process - A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid, and (B) an acid generator which is a specific sulfonium salt compound. The resin (A) is a polymer comprising tertiary alkyl protective group units having a hydrophobic tetracyclo[4.4.0.1 | 10-16-2008 |
| 20080261151 | Thermally Reactive Infrared Absorption Polymers and Their Use in a Heat Sensitive Lithographic Printing Plate - The invention provides a near infrared absorption polymer comprising at least two different pendent infra-red chromophoric moieties covalently bonded to the backbone of an alkali-soluble resin, at least one of which is an indole cyanine dye and the other of which is a benz[e]-indole cyanine dye. When used in the coating of a heat sensitive positive working lithographic printing plate precursor the stabilization time needed after manufacture is significantly reduced, avoiding further conditioning processes before use. The precursors are preferably imagewise exposed with a near-infrared laser emitting at between 780 nm and 850 nm. | 10-23-2008 |
| 20080274425 | POSITIVE WORKING LIGHT SENSITIVE PLANOGRAPHIC PRINTING PLATE MATERIAL - Disclosed is a positive working light sensitive planographic printing plate material comprising an aluminum support and provided thereon, a lower layer and an upper layer in that order, at least one of the upper and lower layers containing a fluoroalkyl group-containing acryl resin, wherein the upper layer contains an alkali soluble resin and a light-to-heat conversion material, and the lower layer contains an alkali soluble resin and an acid decomposable compound represented by the following formula (1), | 11-06-2008 |
| 20080286691 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION - A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): | 11-20-2008 |
| 20080299488 | NEGATIVE-WORKING IMAGEABLE ELEMENTS AND METHODS OF USE - Negative-working imageable elements that can be imaged using infrared radiation comprise an imageable layer and a protective overcoat on a hydrophilic substrate. The imageable layer includes an IR-sensitive cyanine dye. The protective overcoat predominantly comprises one or more poly(vinyl alcohol) resins, each of which has a hydrolysis level of 85% or less. The use of this particular overcoat composition used in combination with the IR-sensitive cyanine dye provides improved tolerance to fogging by white light while maintaining desired imaging speed. | 12-04-2008 |
| 20080299489 | ULTRAVIOLET CURABLE COATING FLUID FOR PRINTING SYSTEMS - An ultraviolet curable coating fluid includes a polymerizable olefin monomer or monomer blend that undergoes self-photoinitiating polymerization when exposed to a predetermined ultraviolet wavelength range, and a predetermined amount of an ultraviolet absorbing image stabilizer that has minimal absorption in the predetermined ultraviolet wavelength range. | 12-04-2008 |
| 20080311516 | INKLESS PRINTING PAPER AND METHOD - An image forming medium includes a substrate and an imaging layer coated on or impregnated into the substrate, where the imaging layer includes a photobase generator and coupling agent. In the image forming medium, irradiation of the imaging layer causes the photobase generator to generate base that reacts with the coupling agent to produce an image. | 12-18-2008 |
| 20080311517 | INKLESS PRINTING PAPER AND METHOD - An image forming medium includes a substrate and an imaging layer coated on or impregnated into the substrate, where the imaging layer includes a photoacid generator and an acid-base indicator. In the image forming medium, irradiation of the imaging layer causes the photoacid generator to generate an acid that reacts with the acid-base indicator to produce an image. | 12-18-2008 |
| 20080311518 | INKLESS PRINTING PAPER AND METHOD - An image forming medium includes a substrate and an imaging layer coated on or impregnated into the substrate, where the imaging layer includes a photobase generator and an acid-base indicator. In the image forming medium, irradiation of the imaging layer causes the photobase generator to generate a base that reacts with the acid-base indicator to produce an image. | 12-18-2008 |
| 20080311519 | INKLESS REIMAGEABLE PRINTING PAPER AND METHOD - An image forming medium includes a substrate, and an imaging layer coated on or impregnated into said substrate, wherein the imaging layer includes an imaging composition including a photochromic or photochromic-thermochromic material dissolved or dispersed in a solvent or polymeric binder, wherein the imaging composition is imageable by light of a first wavelength and erasable in a short time period by a combination of heat and light of a second wavelength such that simultaneous erase with heat and light of the second wavelength is faster than erase by heat alone and exhibits a reversible transition between a colorless and a colored state. | 12-18-2008 |
| 20080311520 | ON-PRESS DEVELOPABLE NEGATIVE-WORKING IMAGEABLE ELEMENTS AND METHODS OF USE - A negative-working imageable element has an imageable layer that includes an initiator composition including an iodonium cation and a borate anion, an infrared radiation absorbing compound, a particulate primary polymeric binder, and a phosphate (meth)acrylate adhesion promoter. The element also includes a polymeric overcoat disposed over the imageable layer and can be developed on-press to provide a lithographic printing plate with high run length. The element also has improved shelf-life. | 12-18-2008 |
| 20080311521 | INKLESS REIMAGEABLE PRINTING PAPER AND METHOD - An image forming medium includes a substrate, and an imaging layer coated on or impregnated into said substrate, wherein the imaging layer includes an imaging composition including a photochromic or photochromic-thermochromic material dissolved or dispersed in a solvent or polymeric binder, wherein the imaging composition is imageable by light of a first wavelength and erasable in a short time period by a combination of heat and light of a second wavelength such that simultaneous erase with heat and light of the second wavelength is faster than erase by heat alone and exhibits a reversible transition between a colorless and a colored state. | 12-18-2008 |
| 20080311522 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR - A compound represented by general formula (b-14); and acid generator consisting of the compound; and a resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) consisting of a compound represented by general formula (b1-14): | 12-18-2008 |
| 20080318161 | Photosensitive Resin Composition for Flexographic Printing - A photosensitive resin composition for flexographic printing comprising a thermoplastic elastomer (a), a photopolymerizable unsaturated monomer (b), and a photopolymerization initiator (c) as essential ingredients, wherein the thermoplastic elastomer (a) is a block copolymer composition containing a block copolymer (i) having at least one polymer block comprised mainly of a mono-alkenyl aromatic compound and at least one polymer block comprised mainly of butadiene, and a branched block copolymer (ii) having at least two polymer blocks comprised mainly of a mono-alkenyl aromatic compound and at least one polymer block comprised mainly of butadiene; the amount of the mono-alkenyl aromatic compound unit in the thermoplastic elastomer (a) is 10-28 mass %; the amount of the block copolymer (i) in the thermoplastic elastomer (a) is 15-50 mass %; and the number average molecular weight (number average molecular weight in terms of polystyrene measured by GPC) of the branched block copolymer (ii) is 200,000-400,000. | 12-25-2008 |
| 20090004601 | Chemically amplified positive resist composition - A chemically amplified positive resist composition comprising (A) a salt represented by the formula (I): | 01-01-2009 |
| 20090017399 | IMAGEABLE ELEMENTS WITH LOW PH DEVELOPER SOLUBILITY - Single- and multi-layer positive-working imageable elements include an ink receptive outer layer includes a primary polymeric binder that is a poly(vinyl phenol) or a phenolic polymer having certain acidic groups. The use of this type of polymeric binder makes the imaged elements developable in low pH (11 or less) alkaline developers. | 01-15-2009 |
| 20090029291 | POSITIVE RESIST COMPOSITION FOR THIN-FILM IMPLANTATION PROCESS AND METHOD FOR FORMING RESIST PATTERN - A positive resist composition for a thin-film implantation process of the present invention includes: a resin component (A) with an acid-dissociable dissolution inhibiting group, whose alkali solubility increases by the action of an acid; an acid generator component (B) which generates an acid by irradiation with radiation; and a compound (C) having a radiation absorbing ability, wherein said resin component (A) comprises a structural unit (a1) derived from a hydroxystyrene and a structural unit (a2) obtained by substituting the hydrogen atom in a hydroxyl group of said structural unit (a1) with an acid-dissociable dissolution inhibiting group, and said acid-dissociable dissolution inhibiting group contains an acid-dissociable dissolution inhibiting group (II) represented by the following general formula (II) as a main component. | 01-29-2009 |
| 20090035701 | Photoresist and pattern-forming process using the same - A photolithography process using a photoresist is as following. A substrate is provided for coating a photoresist thereon to form a photoresist layer and the photoresist is formed by mixing photocatalyst particles and polymer binder in a solvent. The photoresist layer is well-adhesive and has good mechanical strength. A light is illuminated on the photoresist layer through a photo mask having a pre-designed pattern thereon. Then, the portion of the photoresist layer where the light projects is removed by water or another environment-friendly solvent so as to reduce the harmful waste produced in the processes. | 02-05-2009 |
| 20090035702 | PROCESS FOR PRODUCING COMPOUND HAVING ACID-LABILE GROUP - The present invention provides a process for producing a compound having a group represented by general formula (II): | 02-05-2009 |
| 20090042133 | Antireflective Coating Composition - An antireflective coating composition which forms films with high n values is described. | 02-12-2009 |
| 20090042134 | Photosensitive composition, photosensitive planographic printing plate material, and image forming method of photosensitive planographic printing plate material - A photosensitive composition containing: (A) a polymerizable compound containing an ethylenic double bond in the molecule; (B) a photopolymerization initiator; (C) a polymer binder; and (D) a dye exhibiting a maximum absorption wavelength of 350-450 nm, wherein the dye is represented by Formula (1): | 02-12-2009 |
| 20090053652 | PHOTORESIST COMPOSITIONS - Photoresist compositions are disclosed. | 02-26-2009 |
| 20090053653 | POLYMERIZABLE COMPOSITION AND LITHOGRAPHIC PRINTING PLATE PRECURSOR - A polymerizable composition comprising: a polyurethane resin synthesized by using a compound represented by the following formula (I) as one of starting materials; a photopolymerization or thermal polymerization initiator; and an addition-polymerizable compound having an ethylenically unsaturated bond: | 02-26-2009 |
| 20090061357 | IONIC POLYMER PARTICLES FOR PROCESSLESS PRINTING PLATE PRECURSOR - A processless lithographic printing precursor comprising a substrate, a layer of imaginable element on the substrate. The imaginable element comprising: (1) a substance capable of converting radiation into heat; (2) anionic polymer particles and (3) cationic polymer particles. The imaginable element can not be removed by water or fountain used for press when coated and dried, and becomes hydrophobic under the action of heat. The converter substance may be selected to have an absorption spectrum that is optimized to absorb at the wavelength of imaging radiation. The anionic polymer particles have an anionic surface and cationic polymer particles have a cationic surface. The processless lithographic printing precursor so created may be imaged using absorbed radiation that is imagewise converted to heat, resulting in areas of hydrophobic property, while unimaged areas retain their hydrophilic property. This allows the latent image so formed to be employed in creating a negative-working lithographic printing master. The negative-working lithographic printing master so created is irreversible, does not require a substrate of controlled hydrophilicity and provides great toughness in the exposed areas. | 03-05-2009 |
| 20090061358 | NOVEL PHOTOACID GENERATOR, RESIST COMPOSITION, AND PATTERNING PROCESS - Photoacid generators generate sulfonic acids of formula (1a) or (1c) upon exposure to high-energy radiation. | 03-05-2009 |
| 20090068593 | Photosensitive Resin Composition - The present invention relates to a photosensitive resin composition comprising at least a thermoplastic elastomer (a), a photopolymerizable unsaturated monomer (b), and a photopolymerization initiator (c), characterized in that the thermoplastic elastomer (a) comprises at least vinyl aromatic hydrocarbon units, butadiene units, and alkylene units and contains alkylene units not less than 5 wt % and not more than 80 wt % with respect to the total amount of butadiene units and alkylene units. The present invention provides a photosensitive resin composition that simultaneously achieves excellent fine line reproducibility, ester solvent resistance, and prevention of cracks occurring on plate surface. | 03-12-2009 |
| 20090068594 | POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN - A positive resist composition for producing MEMS using an electron beam, the composition comprising a resin component (A) that displays increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon irradiation, wherein the resin component (A) is a resin prepared by protecting a portion of all the hydroxyl groups within an alkali-soluble novolak resin with acid-dissociable, dissolution-inhibiting groups. | 03-12-2009 |
| 20090068595 | PHOTOSENSITIVE RESIN COMPOSITION, COMPOSITION FOR SOLDER RESIST, AND PHOTOSENSITIVE DRY FILM - A photosensitive resin composition which is excellent in storage stability required for one-part type compositions and in processability required for dry-film formation and gives a cured product suitable for FPC substrates or suspension substrates for hard-disc which each retains essential properties required for solder resists, such as heat resistance, water resistance, and electrical-insulation reliability, and has flexibility and low polluting property. The composition comprises: a compound which has a carbon-carbon double bond and carboxy group and is obtained by allowing a bisphenol type epoxy compound and an unsaturated monocarboxylic acid to react and then allowing a polybasic acid anhydride to undergo addition reaction with part or all of the secondary hydroxy groups of the reaction product; a urethane (meth)acrylate compound having a structure derived from a polycarbonate polyol structure; another polymerizable compound having a carbon-carbon double bond; and a photopolymerization initiator. | 03-12-2009 |
| 20090075205 | Aqueous developable benzocyclobutene-based polymer composition and method of use of such compositions - The invention is a composition comprising a curable arylcyclobutene based oligomer or polymer and a dissolution inhibitor which comprises a compound comprising at least two diazonaphthoquinone (DNQ) moieties each of which is pendant from different phenyl groups. | 03-19-2009 |
| 20090075206 | CURABLE COMPOSITION, IMAGE FORMING MATERIAL, AND PLANOGRAPHIC PRINTING PLATE PRECURSOR - A curable composition, including: a polymerizable compound (a) including an ethylenically unsaturated bond; a binder polymer (b); a radical polymerization initiator (c); and an alicyclic compound (d) including a urea bond is provided. | 03-19-2009 |
| 20090075207 | NORBORNENE POLYMER FOR PHOTORESIST AND PHOTORESIST COMPOSITION COMPRISING THE SAME - Disclosed herein is a photoresist composition which includes a norbornene copolymer having an epoxy group, an acid generator, and an organic solvent. The norbornene polymer shows superior mechanical and thermal properties, high transparency, excellent insulating properties, and particularly, improved mechanical properties due to the presence of an epoxy group. The photosensitive resin composition shows superior performance, e.g., transparence, developing properties, residual film characteristics, chemical resistance, heat resistance, and flatness. Particularly, since the photosensitive resin composition enables easy formation of a pattern as an interlayer insulating film and shows a high light transmittance even when being formed into a thin film with a relatively large thickness, it is suitable for the production of an interlayer insulating film used in the fabrication processes of LCDs. | 03-19-2009 |
| 20090081589 | THICK FILM RESISTS - Thick film photoresist compositions are disclosed. | 03-26-2009 |
| 20090087787 | PLANOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF PRODUCING A COPOLYMER USED THEREIN - A planographic printing plate precursor having an intermediate layer containing a copolymer containing structural units represented by Formulae (1), (2) and (3) below, and a image forming layer, in this order on a support, | 04-02-2009 |
| 20090087788 | CURABLE COMPOSITION, IMAGE FORMING MATERIAL, AND PLANOGRAPHIC PRINTING PLATE PRECURSOR - A curable composition in which polymerization inhibition due to oxygen is suppressed and which may be cured with high sensitivity by exposure to laser light or the like is provided. The curable composition includes: a polymerizable compound having an ethylenically unsaturated bond; a binder; a radical polymerization initiator; and at least one specific amine compound. Also provided is an image forming material and a negative-working planographic printing plate precursor including the curable composition. | 04-02-2009 |
| 20090087789 | RESIST COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME - A resist composition includes (A) a resin including: a repeating unit capable of decomposing by the action of an acid to increase solubility in an alkali developing solution and represented by formula (I), and a repeating unit represented by formula (II); and (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation: | 04-02-2009 |
| 20090098486 | COMPOSITION FOR FORMING LOWER LAYER FILM AND PATTERN FORMING METHOD - A composition for forming a lower layer film comprises a polymer (A) having a naphthalene derivative structural unit shown by the following formula (1), | 04-16-2009 |
| 20090111052 | PHOTOPOLYMERIZABLE COMPOSITION - A composition that is photopolymerizable upon absorption of light and/or heat, the composition including a binder, a polymerizable compound, a sensitizer, and a photoinitiator, characterized in that the composition includes, with respect to its non-volatile compounds, at least about 0.01 wt.-% of a polythiol compound, and wherein the composition when coated on a support has a sensitivity of about 150 μJ/cm | 04-30-2009 |
| 20090111053 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition for electron beam, X-ray or EUV exposure, including (A) a resin capable of decomposing by the action of an acid to increase the solubility in an alkali developer; and (B) a compound capable of generating a sulfonic acid upon irradiation with an actinic ray or radiation, wherein the resin (A) is a resin having a phenolic hydroxyl group and having a weight average molecular weight of 1,500 to 3,500, the positive resist composition has a property of decomposing by the action of an acid and causing the dissolution rate in an aqueous 2.38 wt % tetramethylammonium hydroxide solution at 23° C. under normal pressure to increase in a range of 200 to 5,000 times, and the positive resist composition has a solid content concentration of from 2.5 to 4.5 mass %. | 04-30-2009 |
| 20090111054 | NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A negative resist composition including:
| 04-30-2009 |
| 20090142699 | FLUORINE-CONTAINING COMPOUND, RESIST COMPOSITION FOR IMMERSION EXPOSURE, AND METHOD OF FORMING RESIST PATTERN - A fluorine-containing compound represented by a general formula (c-1) shown below: | 06-04-2009 |
| 20090142700 | RESIN FOR PHOTORESIST COMPOSITION, PHOTORESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN - A resin for photoresist compositions is disclosed with excellent resolution and line edge roughness characteristics. A photoresist composition and a method for forming a resist pattern using such a resin are also disclosed. The resin has a hydroxyl group bonded to a carbon atom at a polymer terminal, and the carbon atom in the α-position to the hydroxyl group has at least one electron attractive group. | 06-04-2009 |
| 20090176176 | Photosensitive Resin Composition for Flexographic Printing - There is provided a photosensitive resin composition for a solvent-developing or thermally-developing flexographic printing plate, the photosensitive resin composition comprising: (a) a block copolymer containing a polymer block having conjugated diene as a main component and a polymer block having a vinyl aromatic hydrocarbon as a main component; (b) a photopolymerizable monomer; (c) a photopolymerization initiator; and (d) an organosilicon compound. A photosensitive resin composition for printing in which the organosilicon compound is a silicone oil containing a specific group is preferable, and a photosensitive resin composition for printing in which the organosilicon compound is a silicone oil containing an amino group or an aryl group is most preferable. | 07-09-2009 |
| 20090197202 | PHOTOSENSITIVE PLANOGRAPHIC PRINTING PLATE MATERIAL - Disclosed is a photosensitive surface printing plate material which is suitable for the exposure to a laser beam having a light emission wavelength ranging from 350 to 450 nm, is highly sensitive, and has excellent storage stability. The material has a substrate and a photosensitive layer provided on the substrate, wherein the photosensitive layer comprise a polymerization initiator (A), a polymerizable compound (B) having an ethylenic double bond, a sensitizing dye (C), and a polymeric binder (D). In the photosensitive layer, the polymerizable compound (B) comprises a product of the reaction among (a) a compound represented by the general formula (1), (b) a diisocyanate compound and (c) a (methacrylate compound having a hydroxyl group in the molecule. General formula (1): HO—(CH | 08-06-2009 |
| 20090197203 | Photosensitive conductive paste for transferring and photosensitive transfer sheet - A photosensitive conductive paste for transferring including a metal powder, an inorganic material powder, a photosensitive resin and a polymerization initiator, and to be applied onto a surface of a transfer support, comprising an acrylic resin or a rosin-based resin. | 08-06-2009 |
| 20090197204 | RESIST COMPOSITION FOR IMMERSION EXPOSURE, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND FLUORINE-CONTAINING COMPOUND - A resist composition for immersion exposure, including a base component (A) that exhibits changed solubility in an alkali developing solution under action of acid, an acid generator component (B) that generates acid upon exposure, and a fluorine-containing compound (C) represented by a general formula (c-1) shown below that is decomposable in an alkali developing solution: | 08-06-2009 |
| 20090197205 | LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PRINTING METHOD - A lithographic printing plate precursor includes a support, an image-recording layer and a protective layer in this order, wherein the protective layer contains a stratiform compound and the image-recording layer contains a polymer compound having a phosphonium structure in a side chain. | 08-06-2009 |
| 20090202944 | PHOTOSENSITIVE RESIN COMPOSITION, AND, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PARTITION WALL FOR PLASMA DISPLAY PANEL USING THE COMPOSITION - A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with a polymerizable ethylenic unsaturated bond, (C) a photoradical polymerization initiator containing a 2,4,5-triarylimidazole dimer or its derivative, and (D) a compound represented by the following general formula (1) | 08-13-2009 |
| 20090202945 | FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION - An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E). | 08-13-2009 |
| 20090202946 | POSITIVE RESIST COMPOSITION FOR USE WITH ELECTRON BEAM, X-RAY OR EUV AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition for use with electron beam, X-ray or EUV and a pattern forming method using the positive resist composition are provided, the positive resist composition including: (A) a resin capable of decomposing under an action of an acid to increase a dissolution rate in an aqueous alkali solution; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a basic compound; and (D) an organic solvent, wherein the entire solid content concentration in the resist composition is from 1.0 to 4.5 mass % and a ratio of (B) the compound capable of generating an acid upon irradiation with actinic rays or radiation is from 10 to 50 mass % based on the entire solid content. | 08-13-2009 |
| 20090208872 | Sulphonium Salt Initiators - Compounds of the formula (I), (II), (III), (IV) and wherein, R is hydrogen, C | 08-20-2009 |
| 20090208873 | POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS - A polymer obtained through copolymerization of a monomer having a hexafluoroalcohol pendant whose hydroxyl moiety has been protected and a monomer having an acid labile group is useful as an additive to a photoresist composition for immersion lithography. When processed by immersion lithography, the resist composition exhibits good water repellency and water slip and produces few development defects. | 08-20-2009 |
| 20090220889 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN - A photosensitive resin composition which has a quenching function and satisfactory long-term stability and which, in particular, can be prevented from suffering sensitivity abnormality caused by change with time during storage (change from given sensitivity); and a method of forming a pattern from the composition. The resist composition contains a base resin comprising, as the main component, a silicon-containing polymer which is a siloxane or silsesquioxane polymer or the like, the composition containing, as a quencher, a specific sulfonium compound in place of a nitrogenous compound. | 09-03-2009 |
| 20090220890 | CHEMICALLY AMPLIFIED RESIST COMPOSITION AND CHEMICALLY AMPLIFIED RESIST COMPOSITION FOR IMMERSION LITHOGRAPHY - A chemically amplified resist composition, comprising: a resin which includes a structural unit having an acid-labile group in a side chain, a structural unit represented by the formula (I) and a structural unit having a polycyclic lactone structure, and which is soluble in an organic solvent and insoluble or poorly soluble in an alkali aqueous solution but rendered soluble in an alkali aqueous solution by the action of an acid; and an acid generator represented by the formula (II). | 09-03-2009 |
| 20090246695 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE SAME, POLYMERIZABLE COMPOUND AND POLYMER COMPOUND OBTAINED BY POLYMERIZING THE POLYMERIZABLE COMPOUND - An actinic ray-sensitive or radiation-sensitive resin composition and a pattern forming method using the composition are provided, the composition including (A) a resin containing a repeating unit having a group represented by formula (1) as defined in the specification, the resin being capable of increasing a solubility of the resin in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and a polymerizable compound represented by formula (M-1) as defined in the specification and a polymer compound obtained by polymerizing the polymerizable compound are provided. | 10-01-2009 |
| 20090253076 | Coating-type underlayer coating forming composition for lithography containing vinylnaphthalene resin derivative - [Object] To provide a coating-type underlayer coating forming composition that is applied for multi-ply coating process by thin film resist in order to prevent collapse of resist pattern after development with miniaturization of resist pattern, and that shows a sufficient etching resistance against a semiconductor substrate to be processed on processing of the substrate by having a low dry etching rate compared with the photoresist and substrate. | 10-08-2009 |
| 20090286183 | TRULY PROCESSLESS LITHOGRAPHIC PRINTING PLATE PRECURSOR - A true processless lithographic printing precursor comprising a substrate, a layer of imaginable element on the substrate. The imaginable element comprising: (1) a substance capable of converting radiation into heat; (2) hydrophobic polymer particles and (3) hydrophilic polymer particles. The imaginable element can not be removed by water or fountain used for press when coated and dried, and becomes hydrophobic under the action of heat. The converter substance may be selected to have an absorption spectrum that is optimized to absorb at the wavelength of imaging radiation. The hydrophilic polymer particles are made by polymerization of at least one hydrophilic monomer and the hydrophobic polymer particles are made by polymerization of at least one hydrophobic monomer. Hydrophilic particles comprise major hydrophilic polymer and reject the ink or oil, and hydrophobic particles comprise major hydrophobic polymer and accept the ink or oil. The processless lithographic printing precursor so created may be imaged using absorbed radiation that is imagewise converted to heat, resulting in areas of hydrophobic property, while unimaged areas retain their hydrophilic property. This allows the latent image so formed to be employed in creating a negative-working lithographic printing master. The negative-working lithographic printing master so created is irreversible, does not require a substrate of controlled hydrophilicity and provides great toughness in the exposed areas. | 11-19-2009 |
| 20090291393 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN USING THE SAME - A positive photoresist composition capable of forming a film thickness of 5 μm or greater, preventing cracking due to thermal shock even if exposed to a low temperature atmosphere, having high sensitivity, and easily releasable with general solvents; and a method of forming a photoresist pattern using the positive photoresist composition. The positive photoresist composition contains (A) an alkali soluble novolak resin, (B) at least one plasticizer selected from an alkali soluble acrylic resin and an alkali soluble vinyl resin, and (C) a quinonediazide group-containing compound. The method of forming a photoresist pattern uses the positive photoresist composition. | 11-26-2009 |
| 20090297981 | Photosensitive Resin Composition and Photosensitive Film Made with the Same - The invention provides a photosensitive resin composition that can form resists with excellent adhesiveness for conductive layers and that does not easily produce conductive layer discoloration, as well as a photosensitive film employing the composition. A preferred photosensitive film ( | 12-03-2009 |
| 20090297982 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMATION OF RESIST PATTERN, AND METHOD FOR PRODUCTION OF PRINT CIRCUIT BOARD - A photosensitive element comprises a support, a photosensitive layer and a protective film laminated in that order, wherein the photosensitive layer is composed of a photosensitive resin composition containing a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a compound with a maximum absorption wavelength of 370-420 nm, and the protective film is composed mainly of polypropylene. | 12-03-2009 |
| 20090297983 | PRINTING MEMBERS HAVING PERMEABILITY-TRANSITION LAYERS AND RELATED METHODS - Affinity transitions from hydrophobic to hydrophilic states, rather than ablation mechanisms, facilitate the creation of an imagewise lithographic pattern on a printing plate. | 12-03-2009 |
| 20090305163 | NEGATIVE RESIST COMPOSITION - A negative resist composition is used for either a first or second resist layer within a method of forming a resist pattern that includes the following steps (i) and (ii): (i) a step of forming the first resist layer on a substrate using a first resist composition, and then conducting selective exposure that forms a dense pattern in the first resist layer, and (ii) a step of forming the second resist layer on top of the first resist layer using a second resist composition, and then conducting selective exposure that forms a pattern in the second resist layer, wherein the negative resist composition is dissolved in an alcohol-based organic solvent, which functions as an organic solvent (D) that does not dissolve the first or second resist layer that contacts the resist layer formed from the negative resist composition. | 12-10-2009 |
| 20090311627 | Resist composition for immersion exposure and method of forming resist pattern using the same - A resist composition for immersion exposure, including a base component (A) that exhibits changed solubility in an alkali developing solution under action of acid, an acid generator component (B) that generates acid upon exposure, and a fluorine-containing compound (C) represented by general formula (c-1) (in formula (c-1), R | 12-17-2009 |
| 20100009291 | RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN - A resist composition for immersion exposure, including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of an acid, and contains no structural unit (c1) represented by the general formula (c1-1) shown below; an acid generator component (B) which generates an acid upon exposure; and a fluorine-containing resin component (C) which contains the structural unit (c1) | 01-14-2010 |
| 20100009292 | RESIN COMPOSITION FOR MICROPATTERN FORMATION AND METHOD OF MICROPATTERN FORMATION - A resin composition which can increase the pattern shrink rate while maintaining the advantages of capability of effectually and precisely micronizing the resist pattern gaps irrespective of the surface conditions of the substrate and forming resist patterns exceeding the wavelength limit economically at low cost in a good condition having only small defects, and a method of efficiently forming a micropattern using the resin composition are disclosed. The resin composition for forming a micropattern includes a hydroxyl group-containing resin, a crosslinking component, and an alcohol solvent which contains an alcohol and not more than 10 mass % of water relative to the total solvent. The crosslinking component includes a compound having two or more acryloyloxy groups in the molecule. | 01-14-2010 |
| 20100015554 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION - An actinic-ray- or radiation-sensitive resin composition comprises (A) a resin that when acted on by an acid, exhibits an increased solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, (C) a resin containing two or more resins (c) each having at least either a fluorine atom or a silicon atom, and (D) a solvent. | 01-21-2010 |
| 20100015555 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND NOVEL COMPOUND AND ACID GENERATOR - A resist composition including a base component that exhibits changed solubility in an alkali developing solution under the action of acid, and an acid generator consisting of a compound represented by general formula (b1). In formula (b1), Y | 01-21-2010 |
| 20100021847 | Oxime Compound and Resist Composition Containing the Same - An oxime compound represented by the formula (I): | 01-28-2010 |
| 20100028807 | Imide Compound and Chemically Amplified Resist Composition Containing The Same - An imide compound represented by the formula (I): | 02-04-2010 |
| 20100028808 | PHOTOSENSITIVE ELEMENT - A photosensitive element wherein the haze of the support film | 02-04-2010 |
| 20100035185 | Compound for Photoacid Generator, Resist Composition Using the Same, and Pattern-Forming Method - A sulfonic acid onium salt represented by the following formula (1) can be used as a superior radiosensitive acid generator for resist compositions. It is possible to form a good pattern by using a resist composition containing this sulfonic acid onium salt. | 02-11-2010 |
| 20100040978 | PHOTOSENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL - A lithographic printing plate material that is suitable for exposure with laser beams of 350 to 450 nm emission wavelength, being highly sensitive and excelling in developability. The lithographic printing plate material is a photosensitive lithographic printing plate material with a photosensitive layer containing (A) polymerization initiator, (B) compound having an ethylenic double bond, (C) sensitizing dye and (D) polymer binder, characterized in that the photosensitive layer contains, as polymerizable ethylenic double bond having compound (B), a reaction product obtained by reaction of (BM1) compound having in each molecule at least one polymerizable ethylenic double bond and one hydroxyl and (BM2) compound having in each molecule one secondary amino and one hydroxyl with (BM3) diisocyanate compound, wherein the ratio of BM1(mole)/BM2(mole) is in the range of 2.4 to 38.0. | 02-18-2010 |
| 20100047714 | New propanoates and processes for preparing the same - A process for preparing proponates which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) replacing the methanol in said ether containing solution with a second solvent and (iv) reacting the ether containing ethyl lactate solution with a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form said propanoates. New compositions of matter which comprise the propanoates, prepared in the above manner, have application in the electronic chemicals market such as in a photoresist composition. | 02-25-2010 |
| 20100047715 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTORESIST COMPOSITION FOR THICK FILM, CHEMICALLY AMPLIFIED DRY FILM FOR THICK FILM, AND METHOD FOR PRODUCTION OF THICK FILM RESIST PATTERN - Disclosed are a chemically amplified positive-type photoresist composition for a thick film, a chemically amplified dry film for a thick film, and a method for producing a thick film resist pattern, all of which are capable of obtaining a satisfactory resist pattern with high sensitivity even on a substrate having a portion formed of copper on an upper surface thereof. The chemically amplified positive-type photoresist composition for a thick film comprises component (A) which includes at least one compound capable of producing an acid upon irradiation with an actinic ray or radiation, and component (B) which includes at least one resin whose alkali solubility increases by the action of an acid, in which the component (A) includes an onium fluorinated alkyl fluorophosphate having a specific structure. | 02-25-2010 |
| 20100062371 | Copolymer and composition for semiconductor lithography and process for producing the copolymer - [Task to be Achieved] To provide a chemically amplified type positive copolymer for semiconductor lithography, which has eliminated the problems of prior art, has a high development contrast, and has excellent resolution in fine-pattern formation; a composition for semiconductor lithography which contains the copolymer; and a process for producing the copolymer. | 03-11-2010 |
| 20100062372 | POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by at least one of formulae (1-1) to (1-3) wherein R | 03-11-2010 |
| 20100062373 | POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by formula (1) wherein R | 03-11-2010 |
| 20100062374 | POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by formula (1) wherein R | 03-11-2010 |
| 20100075256 | Onium salt compound, polymer compound comprising the salt compound, chemically amplified resist composition comprising the polymer compound, and method for patterning using the composition - A compound represented by the following formula (1) is provided: | 03-25-2010 |
| 20100075257 | Resin and Chemically Amplified Resist Composition Comprising the Same - A resin comprising a structural unit represented by the formula (I): | 03-25-2010 |
| 20100081089 | PHOTOSENSITIVE RESIN COMPOSITION COMPRISING A POLYMER PREPARED BY USING MACROMONOMER AS ALKALI SOLUBLE RESIN - The present invention relates to a photosensitive resin composition that includes a polymer prepared by using a macromonomer as an alkali soluble resin. The photosensitive resin composition is used for various types of purposes such as a photoresist for preparing a color filter, an overcoat photoresist, a column spacer, and an insulating material having a light blocking property, and improves physical properties such as residue or not, chemical resistance, and heat resistance of the photoresist. | 04-01-2010 |
| 20100104981 | COLORED DISPERSION, PHOTORESIST COMPOSITION AND BLACK MATRIX - A colored dispersion according to the present invention comprises a resin including monomers of Formulas 1 to 4, as a binder resin. | 04-29-2010 |
| 20100112480 | METHOD FOR PRODUCTION OF CROSSLINKED POLYVINYL ACETAL RESIN, AND CROSSLINKED POLYVINYL ACETAL RESIN - An object of the present invention is to provide a method for producing a cross-linked polyvinyl acetal resin, which can provide a cross-linked polyvinyl acetal resin having high mechanical strength and excellent solvent resistance by a simple method without a cross-linking agent, and can solve such problems as sheet attack, insufficient strength, and instability of viscosity for a long-time storage, and another object of the present invention is to provide a cross-linked polyvinyl acetal resin produced by the above method for producing a cross-linked polyvinyl acetal resin. The method for producing a cross-linked polyvinyl acetal resin comprises the step of irradiating a polyvinyl acetal resin at least having structural units represented by the following formulas (1) to (4) with ultraviolet light having a wavelength in a range of 200 to 365 nm, | 05-06-2010 |
| 20100112481 | PHOTOSENSITIVE ELEMENT - A photosensitive element | 05-06-2010 |
| 20100112482 | FLUORINATED MONOMER OF CYCLIC ACETAL STRUCTURE, POLYMER, RESIST PROTECTIVE COATING COMPOSITION, RESIST COMPOSITION, AND PATTERNING PROCESS - A fluorinated monomer of cyclic acetal structure has formula (1) wherein R is a C | 05-06-2010 |
| 20100119975 | COMPOSITION FOR FORMING MICROPATTERN AND METHOD FOR FORMING MICROPATTERN USING THE SAME - The present invention provides a fine pattern-forming composition and a fine pattern-forming method. This fine pattern-forming composition enables a pattern of high aspect ratio to be made finer than a limit of resolution determined by the wavelength of light for exposure. The composition contains a water-soluble resin and a water-containing solvent, and has a kinetic viscosity ν at 25° C. in the range of 10 to 35 mm | 05-13-2010 |
| 20100119976 | COMPOSITION FOR RADICAL POLYMERIZATION AND METHOD OF FORMING PATTERN USING THE COMPOSITION - A composition for radical polymerization includes a photosensitive material, a photoinitiator, a solvent, and a material for adjusting a size of a pattern. A method of forming a pattern using the composition is also disclosed. | 05-13-2010 |
| 20100124721 | POSITIVE-WORKING IMAGEABLE ELEMENTS AND METHOD OF USE - An infrared radiation-sensitive positive-working imageable element has a substrate and single imageable layer that includes a first polymeric binder having urethane or urea moieties in its backbone. The first polymeric binder is also insoluble in water and soluble in a weakly alkaline solution. This imageable element can be imaged and processed using weakly alkaline processing solutions that are free of silicates and metasilicates, which processing solutions may also be used to “gum” the imaged and developed printing surface. | 05-20-2010 |
| 20100129754 | Hot melt compositions - Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices. | 05-27-2010 |
| 20100136484 | PHOTOSENSITIVE PASTE AND SINTERED LAYER - Disclosed is a photosensitive paste including glass frit; organic binder; polymerizable monomer; photopolymerization initiator; and organic solvent, wherein at least a part of the polymerizable monomer contains phosphorus atom within the structure. | 06-03-2010 |
| 20100151389 | Alkaline developable photosensitive materials - Disclosed is a photosensitive resin composition suitable for forming barrier ribs for LCD pixels during a process for fabricating an LCD using an ink jet printing step. Also disclosed is a method of forming barrier ribs for LCD pixels using such photosensitive resin composition. | 06-17-2010 |
| 20100159392 | PATTERNING PROCESS AND RESIST COMPOSITION - A pattern is formed by coating a first positive resist composition comprising a copolymer comprising lactone-containing recurring units and acid labile group-containing recurring units onto a substrate to form a first resist film, patternwise exposure, PEB, and development to form a first resist pattern, applying an amine or oxazoline compound to the first resist pattern for inactivation, coating a second positive resist composition comprising a C | 06-24-2010 |
| 20100167207 | Chemically amplified positive resist composition and resist patterning process - There is disclosed a chemically amplified positive resist composition to form a chemically amplified resist film to be used in a lithography, wherein the chemically amplified positive resist composition comprises at least, (A) a base resin, insoluble or poorly soluble in an alkaline solution, having a repeating unit whose phenolic ydroxyl group is protected by a tertiary alkyl group, while soluble in an alkaline solution when the tertiary alkyl group is removed; (B) an acid generator; (C) a basic component; and (D) an organic solvent, and a solid component concentration is controlled so that the chemically amplified resist film having the film thickness of 10 to 100 nm is obtained by a spin coating method. There can be provided, in a lithography, a chemically amplified positive resist composition giving a high resolution with a suppressed LER deterioration caused by film-thinning at the time of forming a chemically amplified resist film with the film thickness of 10 to 100 nm, and a resist patterning process using the same. | 07-01-2010 |
| 20100196825 | DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS ESPECIALLY SUITABLE FOR ION IMPLANT APPLICATIONS - Compositions characterized by the presence of an aqueous base-soluble polymer having aromatic moieties and aliphatic alcohol moieties have been found which are especially useful as developable bottom antireflective coatings in 193 nm lithographic processes. The compositions enable improved lithographic processes which are especially useful in the context of subsequent ion implantation or other similar processes where avoidance of aggressive antireflective coating removal techniques is desired. | 08-05-2010 |
| 20100196826 | Photoinitiators for Energy Curing - Photopolymerisable systems for coatings or photolithography comprising radically photopolimerisable oligomers and/or monomers having ethylenically unsaturated groups and, as photoinitiator, at least one compound of formula (I). | 08-05-2010 |
| 20100203452 | RADIATION-SENSITIVE COMPOSITION - A radiation-sensitive composition includes a polymer (A) which includes a repeating unit (1) shown by the following formula (1) and a repeating unit (2) shown by the following formula (2), and a radiation-sensitive acid generator (B). | 08-12-2010 |
| 20100221664 | RADIATION-SENSITIVE COMPOSITION - A radiation-sensitive composition includes (A) a first polymer which becomes alkali-soluble by the action of an acid and does not contain a fluorine atom, (B) a second polymer having a repeating unit (b1) shown by the following formula (1) and a fluorine-containing repeating unit (b2), and (C) a radiation-sensitive acid generator, the content of the second polymer (B) in the composition being 0.1 to 20 parts by mass relative to 100 parts by mass of the first polymer (A). | 09-02-2010 |
| 20100233627 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PLASMA DISPLAY PANEL - A photosensitive resin composition comprising (A) a binder polymer with a weight-average molecular weight of 35000 to 65000, (B) a photopolymerizable compound with an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein component (B) includes (B1) a photopolymerizable compound with one ethylenically unsaturated bond, (B2) a photopolymerizable compound with two ethylenically unsaturated bonds and (B3) a photopolymerizable compound with three ethylenically unsaturated bonds, and the proportion of component (B3) with respect to the total of component (B) is 15 to 30 wt %. | 09-16-2010 |
| 20100233628 | COMPOUND AND CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION - A compound represented by the formula (I): | 09-16-2010 |
| 20100233629 | PHOTOSENSITIVE COMPOSTION, COMPOUND FOR USE IN THE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION - A photosensitive composition comprising: (A) a compound capable of generating a compound having a specific structure upon irradiation with actinic rays or radiation, a pattern forming method using the photosensitive composition, and a compound capable of generating a compound having a specific structure upon irradiation with actinic rays or radiation. | 09-16-2010 |
| 20100239981 | POLYMER AND POSITIVE-TONE RADIATION-SENSITIVE RESIN COMPOSITION - A polymer includes a repeating unit (a-1) shown by a following formula (a-1), a repeating unit (a-2) shown by a following formula (a-2), and a GPC weight average molecular weight of about 1000 to about 100,000, | 09-23-2010 |
| 20100239982 | Photoresist composition with high etching resistance - A resist composition includes a first polymer including a repeating unit having the following Chemical Formula 1 and a repeating unit having the following Chemical Formula 2, a second polymer including a repeating unit having the following Chemical Formula 3, a repeating unit having the following Chemical Formula 4, and a repeating unit having the following Chemical Formula 5, a photoacid generator, and a solvent. | 09-23-2010 |
| 20100248145 | SELF-FORMING TOP ANTI-REFLECTIVE COATING COMPOSITIONS AND, PHOTORESIST MIXTURES AND METHOD OF IMAGING USING SAME - A composition of matter. The composition of matter includes a polymer having an ethylenic backbone and comprising a first monomer having an aromatic moiety, a second monomer having a base soluble moiety or an acid labile protected base soluble moiety, and a third monomer having a fluoroalkyl moiety. Also a photoresist formulation including the composition of matter and a method of imaging using the photoresist formulation including the composition of matter. | 09-30-2010 |
| 20100248146 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition comprising (A) a resin which contains all of the repeating units represented by formulae (I) to (III), and becomes soluble in an alkali developer by the action of an acid, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and a pattern forming method using the composition. A represents a group capable of decomposing and leaving by the action of an acid, each R | 09-30-2010 |
| 20100248147 | PHOTORESIST COMPOSITIONS AND PROCESS FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER PHOTORESIST SYSTEMS - A photoresist composition and methods using the photoresist composition in multiple exposure/multiple layer processes. The photoresist composition includes a polymer comprising repeat units having a hydroxyl moiety; a photoacid generator; and a solvent. The polymer when formed on a substrate is substantially insoluble to the solvent after heating to a temperature of about 150° C. or greater. One method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second non photoresist layer on the substrate and patterned first photoresist layer. Another method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second photoresist layer on the substrate and patterned first photoresist layer and patternwise exposing the second photoresist layer. | 09-30-2010 |
| 20100248148 | POLYMER COMPOUND, POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - There is provided a positive resist composition including a resin component (A) which displays increased solubility in an alkali developing solution under action of acid, and an acid generator component (B) which generates an acid upon exposure, wherein the resin component (A) includes a polymer compound (A1) containing a structural unit (a0) represented by a general formula (a0-1) shown below, and a structural unit (a1) derived from an acrylate ester which has an acid dissociable, dissolution inhibiting group: | 09-30-2010 |
| 20100266958 | RESIST MATERIAL AND METHOD FOR FORMING PATTERN USING THE SAME - Initially, on a substrate, a resist film is formed from a resist material including a monomer containing a halogen atom (fluorine) and stable to acid, a polymer containing fluorine and stable to acid, a polymer containing an acid-labile group, and a photo acid generator. Next, while liquid is provided on the resist film, pattern exposure is performed by selectively irradiating the resist film with exposing light. Next, the resist film after the pattern exposure is developed to form a resist pattern from the resist film. | 10-21-2010 |
| 20100273106 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid and an acid generator component (B) which generates acid upon exposure, wherein the base component (A) includes a polymeric compound (A1) having a structural unit (a0) containing an acid-dissociable, dissolution-inhibiting group, and the acid-dissociable, dissolution-inhibiting group has a 1,3-dioxole skeleton. | 10-28-2010 |
| 20100279228 | ORGANO-METALLIC HYBRID MATERIALS FOR MICRO- AND NANOFABRICATION - One embodiment of the present invention provides a photosensitive organo-metallic hybrid material which functions as both a structural material and a photoresist material. More specifically, this photosensitive organo-metallic hybrid material includes an organo-metallic compound comprised of at least one unsaturated double bond. The photosensitive organo-metallic hybrid material also includes a cross-linking agent comprised of at least two unsaturated double bonds capable of cross-linking the organo-metallic compound to form an organo-metallic hybrid material. Additionally, the photosensitive organo-metallic hybrid material includes a photoactive compound capable of absorbing exposure light during a photolithography process to form the photosensitive organo-metallic hybrid material. | 11-04-2010 |
| 20100279229 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD - A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, | 11-04-2010 |
| 20100285408 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD - A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, | 11-11-2010 |
| 20100304303 | Novel Sulfonic Acid Salt and Derivative Thereof, Photoacid Generator Agent, and Resist Material and Pattern Formation Method Using the Photoacid Generator Agent - Disclosed is a fluorinated sulfonic acid salt or fluorinated sulfonic acid group-containing compound having a structure represented by the following general formula (A). | 12-02-2010 |
| 20100323296 | RESIN AND RESIST COMPOSITION - A resin comprises a structural unit derived from a compound represented by the formula (aa) | 12-23-2010 |
| 20110020750 | LITHOGRAPHIC IMAGING AND PRINTING WITH WET, POSITIVE-WORKING PRINTING MEMBERS - Embodiments of the present invention involve printing members that avoid ablation imaging mechanisms and, as a result, crosslinked topmost layers. Topmost layers as described herein exhibit good thermal stability and durability during printing, but can be cleaned (and thereby removed from unimaged areas) with water or aqueous cleaning fluids following imaging. It is found, in some embodiments, that the viability of certain topmost layers can be critically dependent on the nature of the underlying substrate, e.g., in terms of texture and/or surface volume. | 01-27-2011 |
| 20110027718 | RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND - A radiation-sensitive resin composition includes a compound shown by a formula (1) in which R | 02-03-2011 |
| 20110039210 | NOVEL RESINS AND PHOTORESIST COMPOSITIONS COMPRISING SAME - Provided are new resins that comprise lactone units and photoresist compositions that comprise such resins. | 02-17-2011 |
| 20110053085 | LITHOGRAPHIC PRINTING PLATE PRECURSORS AND STACKS - Lithographic printing plate precursors have been designed so that they can be stored, shipped, and used in stacks without interleaf paper between individual precursors. This is achieved by incorporating polymeric particles having an average diameter of from about 3 to about 20 μm into the outermost precursor layer such as an imageable layer or topcoat. The polymeric particles comprise a core of a crosslinked polymer and have grafted hydrophilic polymeric surface groups that are grafted onto the particle surfaces by polymerizing hydrophilic monomers in the presence of the crosslinked polymeric particles. The lithographic printing plates can be either negative- or positive-working elements. | 03-03-2011 |
| 20110065048 | LITHOGRAPHIC IMAGING AND PRINTING WITH PRINTING MEMBERS HAVING FUSIBLE POLYMERIC PARTICLES - Embodiments of the present invention involve printing members that utilize a particle-fusion imaging mechanism but avoid susceptibility to handling damage. In particular, printing plates in accordance with the invention may utilize two phases, and these may originate, during manufacture, as two particle systems. Both systems are initially dispersed in a single coating applied as a layer, or in multiple coatings applied as adjacent layers, on a substrate. The second particle system exhibits a glass-transition or thermal coalescing temperature well above room temperature and also above the temperature at which the coating is dried. The coalescing temperature of the first particle system is below the drying temperature. As a result, when the coating is dried, the first particle system coalesces and forms a binder that entrains the second particle system, which has not coalesced. The binder formed by the first particle system is preferably insoluble in aqueous liquids, but is swellable or softened by such liquids, whereas the binder formed by the second particle system is preferably insoluble in and not swellable by aqueous liquids. Aqueous insolubility allows the dried (and ready-to-image) coating to resist handling damage, while swellability facilitates development. | 03-17-2011 |
| 20110097670 | PATTERNING PROCESS AND CHEMICAL AMPLIFIED PHOTORESIST COMPOSITION - A lithography method includes forming a photosensitive layer on a substrate, exposing the photosensitive layer, baking the photosensitive layer, and developing the exposed photosensitive layer. The photosensitive layer includes a polymer that turns soluble to a base solution in response to reaction with acid, a plurality of photo-acid generators (PAGs) that decompose to form acid in response to radiation energy, and a plurality of quenchers having boiling points distributed between about 200 C and about 350 C. The quenchers also have molecular weights distributed between 300 Dalton and about 20000 Dalton, and are vertically distributed in the photosensitive layer such that a first concentration C1 at a top portion of the photosensitive layer is greater than a second concentration C2 at a bottom portion of the photosensitive layer. | 04-28-2011 |
| 20110111346 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes: (A) a polybenzoxazole precursor including a repeating unit represented by the Chemical Formula 1, a repeating unit represented by the Chemical Formula 2, or a combination thereof, and a thermally polymerizable functional group at least one terminal end of the polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound including a cross-linking functional group; and (E) a solvent. | 05-12-2011 |
| 20110159433 | PHOTOSENSITIVE COMPOSITION, PATTERN-FORMING METHOD USING THE COMPOSITION, AND RESIN USED IN THE COMPOSITION - Provided are a radiation-sensitive composition including a compound (P) having a partial structure (A) having an ionic structural site and capable of decomposing upon irradiation with an actinic ray or radiation to generate an acid and a partial structure (B) having at least one phenolic hydroxyl group, a part or all of hydrogen atoms of the hydroxyl group or groups each being protected by a group capable of leaving by the action of an acid, wherein the ionic structural site of the partial structure (A) contained in the compound (P) is a structure capable of generating an acid anion in the compound (P) upon irradiation with an actinic ray or radiation; a pattern-forming method using the same; and a resin which is used in the composition. | 06-30-2011 |
| 20110165519 | RESIN SUITABLE FOR AN ACID GENERATOR AND A CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION CONTAINING THE SAME - The present invention provides a resin which generates an acid by irradiation and is a salt of an organic cation and an anionic polymer wherein the anionic polymer has no carbon-carbon unsaturated bond. The present invention further provides a chemically amplified resist composition comprising the same. | 07-07-2011 |
| 20110171581 | PHOTORESIST COMPOSTION AND METHOD OF MANUFACTURING ARRAY SUBSTRATE USING THE SAME - A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent. | 07-14-2011 |
| 20110212402 | PHOTOSENSITIVE RESIN COMPOSITION AND ITS APPLICATION - A photosensitive resin composition comprising:
| 09-01-2011 |
| 20110318692 | PHOTOACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE SAME - The present invention relates to a photoactive compound of a novel structure represented by Chemical Formula 1 below | 12-29-2011 |
| 20120003585 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition comprises (A) any of the compounds of General Formula (I) below and (B) a resin that contains the residue (c) of a compound having an ionization potential value lower than that of phenol and when acted on by an acid, exhibits an increased solubility in an alkali developer, | 01-05-2012 |
| 20120040290 | PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME - The present invention relates to a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein the (C) photopolymerization initiator comprises a compound represented by the following general formula (1). In formula (1), R | 02-16-2012 |
| 20120129106 | POSITIVE LIFT-OFF RESIST COMPOSITION AND PATTERNING PROCESS - A positive lift-off resist composition is provided comprising (A) an alkali-soluble novolac resin, (B) a quinonediazidosulfonate photosensitive agent, (C) an alkali-soluble cellulose resin, and (D) an aromatic hydroxy compound having a formula weight of 180-800. The composition has shelf stability, high sensitivity, and a film retention after development of at least 95% and is used to form a lift-off resist pattern of fully undercut profile. | 05-24-2012 |
| 20120135352 | Preparation of Norbornane-based PAC Ballasts - Embodiments in accordance with the present invention provide for norbornane-type ballast materials, norbornane-type photoactive compounds derived from such ballast materials and alkali-soluble positive-tone polymer compositions that encompass such norbornane-type photoactive compounds and one of a PBO or PNB resin. | 05-31-2012 |
| 20120156622 | Ortho-Nitrobenzyl Ester Compound and Positive Type Photosensitive Resin Composition Including the Same - An ortho-nitrobenzyl ester compound including a compound represented by Chemical Formula 1, and a positive photosensitive resin composition including the same are provided. | 06-21-2012 |
| 20120231393 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING A PATTERN USING THE SAME - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a resin that is decomposed when acted on by an acid to thereby increase its solubility in an alkali developer, a compound that generates an acid when exposed to actinic rays or radiation, and any of basic compounds of general formula (1) below. | 09-13-2012 |
| 20120244473 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE UTILIZING SAME AND SOLID-STATE IMAGING DEVICE - A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent. | 09-27-2012 |
| 20120251954 | LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF PREPARING THE SAME - A lithographic printing plate precursor in a positive-type with an infrared-sensitivity, having a support and an image recording layer provided on the support, the support having a hydrophilic surface, the recording layer having a particular resin, an amphoteric surfactant and/or an anionic surfactant, and an infrared absorbing agent, wherein the particular resin being at least one of resins selected from the group consisting of a polyurethane resin, a poly (vinyl acetal) resin, and maleimide resin A. | 10-04-2012 |
| 20120288798 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM AND ELECTRONIC COMPONENT - A positive photosensitive resin composition including: | 11-15-2012 |
| 20120301831 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME - An actinic ray-sensitive or radiation-sensitive resin composition, and a resist film and a pattern forming method using the composition are provided, the composition including (A) a compound capable of decomposing by the action of an acid to increase the solubility of the resin (A) in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a basic compound; and (D) a specific compound containing at least two specific alicyclic hydrocarbon groups each substituted with a hydroxyl group. | 11-29-2012 |
| 20130004896 | COMPOUND FOR RESIST AND RADIATION-SENSITIVE COMPOSITION SPECIFICATION - A radiation-sensitive composition containing 1 to 80% by weight of a solid component and 20 to 99% by weight of a solvent. The solid component contains a compound B which has (a) a structure derived from a polyphenol compound A by introducing an acid-dissociating group to at least one phenolic hydroxyl group of the polyphenol compound A which is synthesized by a condensation between a di- to tetrafunctional aromatic ketone or aromatic aldehyde each having 5 to 36 carbon atoms with a compound having 1 to 3 phenolic hydroxyl groups and 6 to 15 carbon atoms, and (b) a molecular weight of 400 to 2000. The composition containing the compound B is useful as an acid-amplified, non-polymeric resist material, because it is highly sensitive to radiation such as KrF excimer lasers, extreme ultraviolet rays, electron beams, and X-rays, and provides resist patterns with a high resolution, high heat resistance, and high etching resistance. | 01-03-2013 |
| 20130108965 | RADIATION-SENSITIVE COMPOSITION | 05-02-2013 |
| 20130130179 | POLYSILOXANE COMPOSITION AND PATTERN-FORMING METHOD - A polysiloxane composition includes a polysiloxane, and a first compound. The first compound includes a nitrogen-containing heterocyclic ring structure, and a polar group, an ester group or a combination thereof. A pattern-forming method includes coating the polysiloxane composition on a substrate to be processed to provide a silicon-containing film. A resist composition is coated on the silicon-containing film to provide a resist coating film. The resist coating film is selectively irradiated with a radioactive ray through a photomask to expose the resist coating film. The exposed resist coating film is developed to form a resist pattern. The silicon-containing film and the substrate to be processed are sequentially dry etched using the resist pattern as a mask. | 05-23-2013 |
| 20130171568 | Positive Photosensitive Resin Composition, and Photosensitive Resin Layer and Display Device Using the Same - Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same. | 07-04-2013 |
| 20130196268 | LITHOGRAPHIC PRINTING PLATE PRECURSOR - A lithographic printing plate precursor is provided that exhibits less blooming without using a specific polymerization initiator, infrared radiation absorbing agent and the like. The lithographic printing plate precursor comprises a substrate having thereon an image forming layer comprising a radiation-sensitive composition which comprises a radical polymerizable component, an infrared radiation absorbing agent and a radical polymerization initiator, wherein the radiation-sensitive composition comprises a fluorinated copolymer substantially having no hydrophilic moiety. | 08-01-2013 |
| 20130216952 | POSITIVE PHOTOSENSITIVE SILOXANE COMPOSITION - A positive photosensitive siloxane composition containing: a polysiloxane (Ia), which is obtained by hydrolyzing and condensing the silane compound represented by RSi(OR | 08-22-2013 |
| 20140057205 | Method of Improving Surface Cure in Digital Flexographic Printing Plates - A photocurable relief image printing element is described. The photocurable relief image printing element comprises (a) a support layer; (b) one or more photocurable layers disposed on the support layer, wherein the one or more photocurable layers comprise: (i) a binder; (ii) one or more monomers; (iii) a photoinitiator; and (iv) an additive selected from the group consisting of phosphites, phosphines, thioether amine compounds, and combinations of one or more of the foregoing; (c) a laser ablatable masking layer disposed on the one or more photocurable layers, the laser ablatable masking layer comprising a radiation opaque material; and (d) optionally, a removable coversheet. The photocurable relief image printing element provides improved surface cure in digital relief image printing elements. | 02-27-2014 |
| 20140113233 | Photopolymerizable Flexographic Printing Elements for Printing with UV Inks - Photopolymerizable flexographic printing elements which contain cyclohexanepolycarboxylic esters as plasticizers and also their use for producing flexographic printing forms for printing with UV inks, in particular for UV narrow web printing. | 04-24-2014 |
| 20140141375 | SELF-ASSEMBLED STRUCTURES, METHOD OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is a composition comprising a graft block copolymer comprising a copolymer comprising a backbone polymer; and a first graft polymer that comprises a surface energy reducing moiety; the first graft polymer being grafted onto the backbone polymer; where the surface energy reducing moiety comprises a fluorine atom, a silicon atom, or a combination of a fluorine atom and a silicon atom; a photoacid generator; and a crosslinking agent. | 05-22-2014 |
| 20140178823 | PHOTOSENSITIVE POLYIMIDE AND NEGATIVE TYPE PHOTORESIST COMPOSITION CONTAINING THE SAME - A photosensitive polyimide and negative type photo-resist composition containing the same are provided. The photosensitive polyimide is represented by formula (I): | 06-26-2014 |
| 20140212814 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM, METHOD OF FORMING PATTERN USING THE COMPOSITION, PROCESS FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE - Provided is an actinic-ray- or radiation-sensitive resin composition, including any of compounds of general formula (1) below that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid and a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer. | 07-31-2014 |
| 20140234777 | PHOTOSENSITIVE COMPOSITION, CURED FILM AND PRODUCTION PROCESS THEREOF, AND ELECTRONIC PART - It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH | 08-21-2014 |
| 20140356790 | METHOD FOR MANUFACTURING MICRO-STRUCTURE AND OPTICALLY PATTERNABLE SACRIFICIAL FILM-FORMING COMPOSITION - A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, and etching away the sacrificial film pattern through an aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) coating a substrate with a composition comprising a cresol novolac resin, a crosslinker, and a photoacid generator, (B) heating to form a sacrificial film, (C) patternwise exposure, (D) development to form a sacrificial film pattern, and (E) forming crosslinks within the cresol novolac resin. | 12-04-2014 |
| 20150118622 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device - Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6; (B) a photosensitive diazoquinone compound; (C) a thermal acid generator; and (D) a solvent, a photosensitive resin film using the same, and a display device. | 04-30-2015 |
| 20150118623 | RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A resin composition of the present invention includes a polymer compound (A) containing a repeating unit (Q) represented by the following general formula (1): | 04-30-2015 |
| 20150132700 | PHOTORESIST WITH RARE-EARTH SENSITIZERS - A method of making a photoresist with rare-earth sensitizers is provided. The rare-earth sensitizer could be a salt or a rare-earth complex. According to the invention, photoresist composition is useful to pattern circuits by visible light. | 05-14-2015 |
| 20160017083 | MODIFIED NOVOLAC PHENOL RESIN, RESIST MATERIAL, COATING FILM, AND RESIST PERMANENT FILM - The present invention provides a modified novolac phenol resin having excellent developability and heat resistance, a method for producing the same, a photosensitive composition, a resist material, and a permanent film. The modified novolac phenol resin has a molecular structure in which hydrogen atoms of phenolic hydroxyl groups possessed by a novolac phenol resin (C) are partially or entirely substituted by acid dissociable groups, the novolac phenol resin (C) being produced by condensing an aromatic compound (A) represented by structural formula (1) below with an aldehyde compound (B). | 01-21-2016 |
| 20160085148 | SULFONIC ACID DERIVATIVE COMPOUNDS AS PHOTOACID GENERATORS IN RESIST APPLICATIONS - Novel photoacid generator compounds are provided. Photoresist compositions that include the novel photoacid generator compounds are also provided. The invention further provides methods of making and using the photoacid generator compounds and photoresist compositions disclosed herein. The compounds and compositions are useful as photoactive components in chemically amplified resist compositions for various microfabrication applications. | 03-24-2016 |
| 20160137758 | POLYMERIZABLE OLIGOMER AND PHOTORESIST COMPOSITION COMPRISING THE SAME - The embodiments of the invention provide a polymerizable oligomer and a photoresist composition including the polymerizable oligomer, wherein the polymerizable oligomer contains a polymerizable double bond and a hydrophilic group. | 05-19-2016 |
| 20160147145 | PHOTOIMAGEABLE COMPOSITIONS CONTAINING OXETANE FUNCTIONALITY - Embodiments in accordance with the present invention encompass negative-tone, solvent developable, self-imageable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. | 05-26-2016 |
| 20160377765 | Black Photosensitive Resin Composition, Photosensitive Resin Layer, and Display Device Comprising the Same - A black photosensitive resin composition includes (A) an alkali soluble polyimide-polyamic acid copolymerization resin; (B) a multi-functional monomer; (C) a photopolymerization initiator; (D) a black colorant; and (E) a solvent, a photosensitive resin layer manufactured using the same, and a display device including the photosensitive resin layer. | 12-29-2016 |
| 20190146338 | POSITIVE PHOTORESIST COMPOSITION, PHOTORESIST PATTERN USING THE SAME, AND MANUFACTURING METHOD OF THE PHOTORESIST PATTERN | 05-16-2019 |
