| Entries |
| Document | Title | Date |
|---|
| 20080213597 | Formaldehyde-Free Adhesives and Lignocellulosic Composites Made from the Adhesives - A first variant of an adhesive composition for making a lignocellulosic composite includes soy protein and/or lignin; at least one substantially formaldehyde-free curing agent that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the soy protein; and at least one compound selected from a boron compound, a group IA oxide or hydroxide, or a group IIA oxide or hydroxide. A second variant of an adhesive composition includes a first component selected from soy protein and/or lignin; and at least one substantially formaldehyde-free curing agent selected from a reaction product of epichlorohydrin with ethylenediamine, a reaction product of epichlorohydrin with bis-hexamethylenetriamine, or a reaction product of epichlorohydrin with hexamethylenediamine. | 09-04-2008 |
| 20090017308 | INTERMEDIATE LAYER MATERIAL AND COMPOSITE LAMINATE - There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (α1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C. | 01-15-2009 |
| 20090123759 | Amphiphilic Block Copolymer-Toughened Epoxy Resins and Adhesives Made Therefrom - A curable adhesive epoxy resin composition including (a) an epoxy resin; (b) an amphiphilic block copolymer containing at least one epoxy resin miscible block segment and at least one epoxy resin immiscible block segment; wherein the immiscible block segment comprises at least one polyether structure provided that the polyether structure of said immiscible block segment contains at least one or more alkylene oxide monomer units having at least four carbon atoms; in an amount such that when the epoxy resin composition is cured, the bond strength of the resulting cured epoxy adhesive resin composition increases compared to an epoxy resin composition without said amphiphilic polyether block copolymer; and (c) at least one curing agent. The amphiphilic block copolymer is preferably an all polyether block copolymer such as a PEO-PBO diblock copolymer or a PEO-PBO-PEO triblock copolymer. | 05-14-2009 |
| 20090155597 | CONDUCTIVE ADHESIVE PRECURSOR, METHOD OF USING THE SAME, AND ARTICLE - A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive precursor can be cured to form a conductive adhesive useful for bonding two substrates together. | 06-18-2009 |
| 20090176103 | Gas Barrier Film - Disclosed is a gas barrier film exhibiting excellent oxygen and water vapor blocking performance, while having resistance to heat sterilization treatments such as a boiling/retorting treatment. A gas barrier film as a first embodiment of the present invention is characterized by having a structure wherein a deposition layer of an inorganic compound is formed on one side of a base film, a gas barrier layer of a polyepoxy cured product having a skeleton represented by the formula (1) below is formed on the deposition layer, and an overcoat layer made of at least one resin selected from the group consisting of polyepoxy resins, polyester resins and polyacrylic resins is formed on the gas barrier layer. A gas barrier film as a second embodiment of the present invention is characterized by having a structure wherein a deposition layer of an inorganic compound is formed on one side of a base film, a gas barrier layer of a polyurethane resin is formed on the deposition layer, and an overcoat layer made of a polyester resin and/or a polyacrylic resin is formed on the gas barrier layer. | 07-09-2009 |
| 20090220794 | Bonding An Adherent To A Substrate Via A Primer - A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent. | 09-03-2009 |
| 20090220795 | COMPOSITES COMPRISING A MULTI-LAYER COATING SYSTEM - Composites having a multi-layer coating system applied to at least a portion thereof are disclosed. Methods for repairing wind blades, such as the leading edge of the wind blade, are also disclosed. | 09-03-2009 |
| 20090274911 | Liquid Crystal Display With Polymer Layer Of Varying Thickness And Method Of Producing Such A Layer - Various methods and apparatus relating to a multi-level layer ( | 11-05-2009 |
| 20090297856 | Adhesion promoter composition comprising epoxy resin - The present invention provides compositions comprising at least one reaction product obtained from a reaction mixture comprising i) at least one mercaptosilane MS, and also ii) at least one polysilane PS which contains in particular at least one secondary or tertiary amino group, preferably a secondary amino group, and also iii) at least one epoxy resin EP. | 12-03-2009 |
| 20090305049 | POLARIZING LAMINATE AND PROCESS FOR PRODUCING THE SAME - An object of the present invention is to provide a polarizing laminate which is resistant to impact, has the high polarization degree, hardly causes a solvent crack, and hardly causes a fine crack even when perforation-processed, for example, goggles, sunglasses, prescription sunglasses, and shields which are resistant to impact, have higher stability, and can effectively prevent glare. | 12-10-2009 |
| 20090324958 | Heat Setting Compounds Suitable for Sticking Together Coated Substrates - Described are heat hardening compounds which contain at least one epoxy resin, A, with on average more than one epoxy group per molecule, at least one impact-strength modifier, B, at least one crack promoter, C, as well as at least one hardener, D, for epoxy resin, which is activated by raised temperature. Silicate layers such as mica or talc and graphite are particularly suitable as crack promoters, C. | 12-31-2009 |
| 20100028688 | ADHESIVE FOR PLASTIC-LINED CONCRETE STRUCTURE AND METHOD OF PRODUCING A PLASTIC-LINED CONCRETE STRUCTURE - A composite structure and method of making the same. The composite structure has a thermoplastic liner that is bonded to wet cement by a thermosetting resin adhesive. The thermosetting resin adhesive contains an epoxy resin system, solvent and a primer therein to form a solvent blend. The solvent blend is formed such that the blend is not flammable and is able to bond to thermoplastic liners with only a single coat and not requiring an extra coat of primer. | 02-04-2010 |
| 20100119835 | PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES - The present invention relates to a photocurable composition comprising:
| 05-13-2010 |
| 20100173164 | ADHESIVE FILM AND SEMICONDUCTOR DEVICE HAVING THE SAME - The adhesive film of the present invention is adapted to be used for bonding a semiconductor element and a substrate together or bonding semiconductor elements together. The adhesive film is formed of a resin composition containing an epoxy resin, an acrylic resin, and an acrylic oligomer having a weight average molecular weight of 6,000 or less. The resin composition is characterized in that in the case where an amount of the acrylic resin contained in the resin composition is defined as Wa and an amount of the acrylic oligomer contained therein is defined as Wb, a ratio of Wa/Wb is in the range of 0.5 to 4. Further, the semiconductor device of the present invention is characterized in that a semiconductor element and a substrate or semiconductor elements are bonded together using the above mentioned adhesive film. | 07-08-2010 |
| 20100178514 | ADHESION METHOD, AND BIOCHEMICAL CHIP AND OPTICAL COMPONENT MADE BY THE SAME - An adhesion method capable of strongly adhering two members without using an adhesive and without impairing a fine structure or optical properties of a joining surface, and a biochemical chip and optical component made by the same are provided. | 07-15-2010 |
| 20100183880 | FLUORESCENT FINE PARTICLE FILMS - A fluorescent fine particle film that retains the intrinsic functions of fluorescent fine particles and that can be formed on any substrate at a desired thickness, a method for manufacturing the fluorescent fine particle film, and a display apparatus, a photoconductor, and a sensor each including the fluorescent fine particle film are provided. | 07-22-2010 |
| 20100190013 | DETACHABLE ADHESIVE CONTAINING REACTION PRODUCT OF OXIDIZING AGENT AND AMINE COMPOUND - Disclosed is a detachable adhesive containing an organic adhesive component and a reaction product which is obtained by reacting an onium salt containing an oxidizing anion with an amine group of an amine compound at a reaction ratio of not less than 50%. | 07-29-2010 |
| 20100227171 | SURFACE COATING AND RESTORATION - A surface coating system and process and a construction surface restoration system and process are disclosed that utilize advantageous protective materials as coating and filling media. The bonding characteristics of the protective materials are such that surfaces coated with the protective materials and process possess improved and more diversified force absorption attributes. The filler material is capable of imitating pre-existing construction surfaces and possesses a substantial longevity. | 09-09-2010 |
| 20100255313 | ONE-PACK TYPE EPOXY RESIN COMPOSITION AND USE THEREOF - Disclosed is a one-pack type epoxy resin composition containing an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and a non-latent imidazole compound. The one-pack type epoxy resin composition is capable of being cured at a low temperature, while having excellent heat resistance and sealing properties. Also disclosed is use of the one-pack type epoxy resin composition. | 10-07-2010 |
| 20100255314 | AROMATIC ALDIMINES AND POLYURETHANE COMPOSITIONS WHICH CONTAIN ALDIMINE - The present invention relates to aromatic aldimines, which are based on primary aromatic polyamines, which are solid at room temperature and liquid at room temperature and which have the lowest possible viscosity, hydrolyze with little odor, and can be used as blocked amines in curable compositions, in particular in compositions having one-component and two-component isocyanate groups. Said compositions have a relatively long open time, but cure surprisingly rapidly, said curing occurring without strong odor formation and without bubbling. In addition, the compositions have outstanding mechanical properties after curing, in particular high strength with high ductility, and good resistance to heat and moisture. | 10-07-2010 |
| 20100261018 | Curable Adhesive Compositions - Curable adhesive compositions are provided that exhibit a high refractive index. | 10-14-2010 |
| 20100273005 | HEAT-CURING EPOXY RESIN COMPOSITION CONTAINING NON-AROMATIC UREAS AS ACCELERATOR - The present invention relates to heat-curing epoxy resin compositions, which are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions. | 10-28-2010 |
| 20100304150 | Process for Preparing Articles Having Anti-Fog Layer by Layer Coating and Coated Articles Having Enhanced Anti-Fog and Durability Properties - Disclosed are processes for preparing articles having anti-fog properties, comprising providing a substrate having at least one main surface coated with an intermediate coating obtained by applying and at least partially curing an intermediate coating composition comprising at least one monoepoxysilane and/or an hydrolyzate thereof and at least one polyepoxy monomer comprising at least two epoxy groups, forming onto said intermediate coating at least one bi-layer, and curing said at least one bi-layer by heating at a temperature of 150° C. or less at atmospheric pressure and in the absence of added water steam. Also disclosed are articles made and/or makeable by these processes. | 12-02-2010 |
| 20100310877 | Protein-Containing Emulsions and Adhesives, and Manufacture and Use Thereof - This invention provides emulsions and adhesives comprising proteins that can be isolated from a variety of sources including renewable plant biomass, and methods of making and using such emulsions and adhesives. | 12-09-2010 |
| 20100310878 | WASH-OUT RESISTANT HEAT-CURING EPOXY RESIN ADHESIVES - The present invention relates to heat-curing epoxy resin compositions, which are used in particular as body shell adhesives for vehicle construction, in that they have improved wash-out resistance, especially also at temperatures around 60° C., and the viscosity of which at room temperature enables an application at room temperature. | 12-09-2010 |
| 20110020652 | Two-Component Epoxy Adhesive Composition - The present invention relates to a two-component epoxy adhesive composition comprising
| 01-27-2011 |
| 20110027591 | Aqueous two-component or multicomponent aqueous epoxy resin primer composition - The invention relates to two-component or multicomponent aqueous epoxy resin primer compositions comprising a first component, a second component, and an optional other component. The first component contains at least water and an epoxy resin while the second component contains at least one polyamine. The composition also comprises carbon black and/or epoxy silane and/or epoxy siloxane and/or an amino silane and/or an amino siloxane and/or mercaptosilane. The aqueous epoxy resin primer compositions improve adhesion of moisture-curing polyurethane adhesives or sealants on various bases. | 02-03-2011 |
| 20110027592 | AQUEOUS BINDER OR SIZING COMPOSITION - A binder or sizing composition that is provided that demonstrates improved hydrolytic stability of the bond between a SiO containing substrate, such as glass, and a matrix polymer, such as polypropylene, which is especially useful in reinforced plastics. A water-based composition is provided that contains at least one amino-functional coupling agent, and acid or anhydride modified polyolefin, and an epoxy functional compound. This composition is useful as a glass binder or sizing to provide a strong bond between glass and a polymer. | 02-03-2011 |
| 20110039108 | HIGH STRENGTH EPOXY ADHESIVE AND USE THEREOF - A heat-curable adhesive composition comprising an epoxy-resin, a toughening agent, a curing agent and an acetoacetoxy-functionalized compound wherein the composition can be cured to form structural adhesives of high impact strength. | 02-17-2011 |
| 20110039109 | ACTIVATOR FOR EPOXY RESIN COMPOSITIONS - Activators for heat-curing epoxy resin compositions, as well as use thereof in heat-curing epoxy resin compositions. These activators are distinguished by a good activation effect as well as good storage stability. | 02-17-2011 |
| 20110052919 | COATING COMPOSITION CONTAINING POLYTRIMETHYLENE ETHER DIOL - The present disclosure is directed to a coating composition having excellent adhesion to primer layers, fast drying, improved flexibility and good pot life. This disclosure is further directed to a coating composition comprising components derived from renewable resources, low Tg acrylic polymers having one or more crosslinkable functional groups and a crosslinking agent having one or more crosslinking functional groups. | 03-03-2011 |
| 20110052920 | POLYESTER AND POLYTRIMETHYLENE ETHER DIOL BASED COATING COMPOSITION - The present disclosure is directed to a coating composition having excellent adhesion and flexibility. This invention is further directed to a coating composition comprising components derived from renewable resources. | 03-03-2011 |
| 20110064953 | Assemblies and Methods for Reducing Warp and Bow of a Flexible Substrate During Semiconductor Processing - Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein. | 03-17-2011 |
| 20110070449 | A COMPOSITE MATERIAL, THE METHOD FOR PREPARING THE SAME AND THE USE THEREOF - The present invention pertains to a composite material, the method for preparing the same and the use thereof. In this invention, the surface of the polyacrylate layer is treated by silane or silane solution during the process for preparing the composite material to improve the adhesion strength between the polyacrylate layer and the polyurethane layer. | 03-24-2011 |
| 20110111234 | Adhesives With Thermal Conductivity Enhanced By Mixed Silver Fillers - A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m | 05-12-2011 |
| 20110159294 | ATTACH FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY AND ATTACH FILM USING THE SAME - An attach film composition for semiconductor assembly includes a polymer binder, an epoxy resin, a phenolic epoxy curing agent, a curing accelerator, a silane coupling agent, and an inorganic filler. The attach film composition may have an exothermic peak start temperature of about 300° C. or more in curing, and a melt viscosity of about 1.0×10 | 06-30-2011 |
| 20110159295 | BIOMASS ARTICLE AND METHOD OF MANUFACTURING - A biodegradable biomass article for use in construction includes a cellulose biomass. The cellulose biomass includes an alkaline crystalline substance. An adhesive layer covers an outer surface of the biomass, and a sealing layer covers the adhesive layer. A method for manufacturing the biodegradable biomass article includes drying a cellulose biomass, and mixing the biomass with water into a slurry. The slurry is heated, and strained after the step of heating, resulting in a residual paste. The residual paste is compressed to form a biomass mat. The biomass mat is heated, and an adhesive layer is applied which covers the biomass mat. A sealing layer is applied over the adhesive layer. | 06-30-2011 |
| 20110171474 | Toughened Resin Fiber Laminates with Titanium Particles - A composite structure includes at least one resin matrix layer having a resin material and a plurality of fiber elements and a plurality of titanium particles provided in the resin material. A method of toughening a resin matrix layer is also disclosed. | 07-14-2011 |
| 20110177342 | Cured Organopolysiloxane Resin Film Having Gas Barrier Properties and Method Of Producing The Same - A cured organopolysiloxane resin film having gas barrier properties in which a layer of cured organopolysiloxane that contains an organic functional group, an organic group produced by the polymerization of polymerizable organic functional groups, or the hydrosilyl group or silanol group, is formed on a visible region-transparent film comprising cured organopolysiloxane resin yielded by hydrosilylation reaction-mediated crosslinking, and in which a silicon oxynitride layer, silicon nitride layer, or silicon oxide layer is formed on the aforementioned layer of cured organopolysiloxane. Also, a method of producing this cured organopolysiloxane resin film having gas barrier properties. | 07-21-2011 |
| 20110195257 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF - The present invention provides a semiconductor device and a fabricating method thereof. The fabricating method comprises: providing a first substrate; forming a soft dry film having an adhesive film and a release film; sticking the soft dry film on the first substrate with the adhesive film; removing the release film; sticking a second substrate on the adhesive film; and heating the adhesive film to solidify the adhesive film to form a solid adhesive film. The semiconductor device comprises: a first substrate, a solid adhesive film, and a second substrate. The solid adhesive film is formed on the first substrate, and the second substrate is formed on the solid adhesive film. | 08-11-2011 |
| 20110200828 | HYDROPHILIC COATINGS FOR MEDICAL DEVICES - Biocompatible, lubricious, highly durable coatings for medical devices are formed from a highly adherent base-coat and a hydrophilic top-coat that is chemically grafted to the base-coat and has a chemically cross-linked structure. The base-coat constitutes a carboxylic acid containing polymer. The top-coat includes a carboxylic acid containing hydrophilic polymer and chromium (III) ion as the cross-linking agent. The coating possesses biocompatibility and gamma ray-sterilization stability. The coated products in aqueous media display an unmatched combination of lubricity, abrasion resistance, and chemical stability. | 08-18-2011 |
| 20110212331 | Resistive implant welding for adhesive curing for thermoplastic and thermoset applications - A welded joint for structural component having two or more portions fused together at a weld line. An adhesive layer is placed between the two or more portions at the location of the weld line and a conductor is placed between the two or more portions in operable contact with the adhesive. Energy is transmitted through the conductor and into the adhesive layer to activate the adhesive layer and create the weld line that defines the welded joints between the two or more portions. The welded joint of the structural component allows energy to be injected into the adhesive layer via the conductor in order to cause the adhesive layer to activate from the inside of the adhesive outward. The conductor can be placed adjacent the adhesive layer or within the adhesive layer in order to cause the adhesive to be activated from the inside outward. | 09-01-2011 |
| 20110250459 | EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD, AND MULTI-LAYER BOARD - The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. | 10-13-2011 |
| 20110300387 | MODIFIED POLYVINYL ALCOHOL RESINS AND ADHESIVE, POLARIZER, AND DISPLAY DEVICE CONTAINING THE SAME - Provided are a modified polyvinyl alcohol-based resin with an acrylic group introduced thereto and including a hydroxyl group formed during the introduction of the acrylic group, an adhesive including the modified polyvinyl alcohol-based resin having excellent adhesion, humidity resistance, and water resistance, an adhesive including a polyvinyl alcohol-based resin, and a compound having an epoxy group, and an acrylic group, a polarizing plate and an image display device including the adhesive. The adhesive for a polarizing plate according to an embodiment of the present invention has excellent adhesion, humidity resistance, and water resistance as well as having excellent solubility with respect to water and an increase in adhesion while physical properties of a typical polyvinyl alcohol-based resin are maintained. | 12-08-2011 |
| 20110305907 | COATED REINFORCEMENT AND METHOD FOR PRODUCING SAME - The invention relates to a coated reinforcement, to a method for producing the same and to the use thereof. In order to provide a coated reinforcement, in particular to be used for large surface area components, the coating of which can be applied easily and without difficultly substantially independently of the processing-relevant properties of the components of the resin mixture, it is proposed that the surface of the reinforcement has a coating made of a composition, the composition contains a mixture 1 of at least one resin, selected from the group consisting of epoxidized phenol novolacs, epoxidized cresol novolacs, polyepoxides based on bisphenol A, epoxidized fluorenone bisphenols and/or polyepoxides bases on bisphenol-F, and/or based on triglycidyl isocyanurates, epoxidized novolac and at least one component that accelerates the curing of the resin, and said mixture is subjected to a heat treatment, so that the mixture 1 is affixed to the surface of the reinforcement by fusing it thereon. | 12-15-2011 |
| 20120128987 | EPOXY RESIN-BASED COMPOSITION MODIFIED FOR IMPACT RESISTANCE - A resin component for a one- or two-component adhesive, a matrix resin, or a structural foam, comprising: C1) at least one epoxy resin, having an average of more than one epoxy group per molecule, that does not correspond to the definition of component C2); C2) at least one oligomeric or polymeric urethane-group-free polyether compound. A one- or two-component epoxy adhesive, structural foam, or matrix material for composites, comprising the aforesaid resin components. | 05-24-2012 |
| 20120135244 | TIE COAT FOR ORGANOPOLYSILOXANE ANTIFOULING COAT, COMPOSITE COATS, AND SHIPS AND UNDERWATER STRUCTURES COVERED WITH THE COMPOSITE COATS - Disclosed is a tie coat which is formed on a surface of a base or an undercoating film prior to formation of an organopolysiloxane-based antifouling coating film and is formed from a moisture-curing organopolysiloxane-based composition comprising (b1) organopolysiloxane having condensing functional groups at both ends of a molecule and/or (b2) a curing composition formed by subjecting the component (b1) and an extender pigment to contact treatment with heating or without heating, as well as a composite coating film including the tie coat. | 05-31-2012 |
| 20120141803 | CURABLE AND CURED ADHESIVE COMPOSITIONS - Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, d) a toughening agent, and e) an oil displacing agent. The cured adhesive compositions can be used as structural adhesives. | 06-07-2012 |
| 20120156501 | CURABLE AND CURED ADHESIVE COMPOSITIONS - Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured adhesive compositions can be used as structural adhesives. | 06-21-2012 |
| 20120156502 | ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive film in which the adhesive film contains a thermosetting resin (A), a curing agent (B), a compound having flux activity (C) and a film forming resin (D), the minimum melt viscosity of the adhesive film is 0.01 to 10,000 Pa·s, and the adhesive film satisfies the following formula (1) when the exothermic peak temperature of the adhesive film is defined as (a) and the 5% weight loss temperature by thermogravimetry of the adhesive film is defined as (b), | 06-21-2012 |
| 20120177930 | Electrically Conductive Adhesives - The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler. | 07-12-2012 |
| 20120214002 | ONE-PACK TYPE LIQUID EPOXY RESIN COMPOSITION AND ADHESION METHOD USING SAME - The present disclosure provides an epoxy resin composition that has storage stability and allows the formation of cured products having flexibility. The epoxy resin composition is a one-pack type liquid epoxy resin composition comprising a polyfunctional linear epoxy resin having an epoxy equivalent of 400 or more, a tetrabasic acid anhydride having a melting point of 10° C. or higher, and an organic metal compound. | 08-23-2012 |
| 20120251829 | SUBSTRATE-BASED ADDITIVE FABRICATION PROCESS - The invention relates to a substrate-based method for forming a three-dimensional object by additive fabrication by coating a liquid radiation curable resin comprising from 30 to 80 wt % of cationically curable compounds on a substrate, contacting the liquid radiation curable resin with a previously cured layer, selectively exposing the layer of liquid radiation curable layer to actinic radiation thereby forming a cured layer, separating the cured layer at the substrate, and repeating the steps a sufficient number of time in order to build up a three-dimensional object. | 10-04-2012 |
| 20120258314 | SINGLE-COMPONENT EPOXY RESIN COMPOSITION AND USE THEREOF - An epoxy resin composition is a one-part epoxy resin composition for hermetic sealing of an electronic component or an electrical component, containing: a liquid epoxy resin; dicyandiamide; and a filler, the filler having an average particle size between 0.1 μm and 1 μm, the filler containing particles not less than 5 μm in particle size in an amount of not more than 20 wt %, and the amount of the filler contained in the one-part epoxy resin composition being between 5 and 60 parts by weight relative to 100 parts by weight of the liquid epoxy resin. This achieves a one-part liquid epoxy resin composition in which a great variety of curing agents can be used and dissociation of an epoxy resin and a curing agent is suppressed even when used in a gap of approximately several tens of micrometers. | 10-11-2012 |
| 20120270055 | COATINGS FOR CERAMIC SUBSTRATES - A process for making highly mechanical and chemical resistant ceramic substrates, especially tiles is provided, wherein the process comprises coating said substrates with a base coat layer of a thermosetting or radiation curable powder coating composition, curing the applied powder coating composition, and applying a further layer of a liquid coating composition and curing the composition by exposure to heat. Coated ceramic substrates, in particular tiles are also provided. | 10-25-2012 |
| 20120301726 | COATING SYSTEM - A coating system for application to a substrate having a sol-gel film layer applied thereon includes a decorative color coat applied directly on top of the sol-gel film without an intervening adhesion layer. The decorative color coat may be a solvent borne composition including a resin which is the reaction product of a crosslinked polyepoxy resin and a polyamine crosslinker, and one or more opacifying pigments. Decorative designs may be formed by selectively applying more than one layer of decorative color coats having different colors. A transparent clearcoat may be applied to the decorative film. | 11-29-2012 |
| 20120301727 | FLOORING MATERIAL - The present invention provides flooring material which comprises a thermal conductive base material with a resin film including a carbon nano-tube; or a thermal conductive sheet. The flooring material of the present invention has high floor heating efficiency because thermal conduction is high and can save energy. | 11-29-2012 |
| 20120308832 | PHENOL RESIN COMPOSITION, PRODUCTION METHOD THEREFOR, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD - A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R | 12-06-2012 |
| 20130022818 | ONE-PACK EPOXY RESIN COMPOSITION, AND USE THEREOF - Provided are (i) a one-pack epoxy resin which exhibits excellent storage stability in terms of not only composition viscosity but also flowability and (ii) use thereof. The one-pack type epoxy resin composition, contains, as main components, (A) epoxy resin; (B) a modified aliphatic polyamine compound; and (C) inorganic filler treated with a long-chain hydrocarbon-group containing compound. Therefore, the present invention achieves (i) the one-pack type epoxy resin composition which exhibits the excellent storage stability in terms of not only the viscosity but also the flowability and (ii) use thereof. | 01-24-2013 |
| 20130115464 | INTERLAYER ADHESIVE, WATERPROOF STRUCTURE AND WATERPROOF CONSTRUCTION METHOD - An interlayer adhesive which is interposed between a waterproof layer formed from a resin-coated film and an inorganic material layer using mortar or concrete to adhere the waterproof layer and the inorganic material layer to each other, the interlayer adhesive containing a resin composition obtained by reacting (a) a base resin including an emulsion of a main resin containing at least one of an acrylic-based resin, an ethylene-vinyl acetate-based resin, and an epoxy-based resin, with (b) an isocyanate compound having an isocyanate group. | 05-09-2013 |
| 20130157059 | ADHESION METHOD, AND BIOCHEMICAL CHIP AND OPTICAL COMPONENT MADE BY THE SAME - An adhesion method capable of strongly adhering two members without using an adhesive and without impairing a fine structure or optical properties of a joining surface, and a biochemical chip and optical component made by the same are provided. | 06-20-2013 |
| 20130157060 | REINFORCING METHOD AND REINFORCING STRUCTURE FOR STEEL STRUCTURE AND ELASTIC LAYER FORMING MATERIAL FOR REINFORCING STEEL STRUCTURE - A reinforcing method and structure for a steel structure and an elastic layer forming material for reinforcing a steel structure are provided that can prevent a reinforcing effect from being lowered by direct sunlight, can obtain a sufficient reinforcing effect, and can prevent a fiber sheet from being peeled away from a steel structure surface before the fiber sheet is torn. The reinforcing method for a steel structure, in which a fiber sheet including reinforcing fibers is bonded to a surface of the steel structure to integrate the fiber sheet with the steel structure, includes (a) a step of applying and hardening a polyurea resin putty to the surface of the steel structure to form an elastic layer, and (b) a step of bonding the fiber sheet to the surface of the steel structure having the elastic layer formed thereon with an adhesive agent. | 06-20-2013 |
| 20130177769 | METHOD FOR THE FORMATION OF PAINT FILMS AND THE PAINT FILMS - A method for the formation of a paint film in which an aluminum or aluminum alloy part is subjected to an anodic oxidation treatment and an anodic oxide film is formed on the surface of the aluminum or aluminum alloy part, an anti-rust primer is coated on said anodic oxide film and an anti-rust primer paint film is formed and, as required, a top-coat paint is coated on said anti-rust primer paint film and a top-coat paint film is formed in which said anti-rust primer includes a base resin comprising hydroxyl group containing epoxy resin and a hardening agent, selected from among melamine resin and polyisocyanate, and barium sulfate, and the proportion of said barium sulfate included is a proportion within the range from 20 to 70 parts by mass per 100 parts by mass in total of the solid fractions of the base resin and the hardening agent. | 07-11-2013 |
| 20130189525 | ADHESIVES SUITABLE FOR USE IN BONDING APPLICATIONS - The present invention relates to adhesives that are suitable for use in a broad variety of bonding applications. In particular, the present invention relates to adhesives that are suitable for use in polymer-to-metal, for example elastomer-to-metal, such as rubber-to-metal bonding applications, wherein the adhesives comprise at least one halogenated polyolefin, at least one epoxysilane having at least one terminal alkoxy silane group, at least one bis-silane, and optionally at lease one organic solvent. | 07-25-2013 |
| 20130196161 | LAMINATES USEFUL FOR ELECTRICAL INSULATION - A laminate useful for electrical insulation having: (a) at least one layer of a mica-aramid paper comprising 55 to 95 weight percent mica and 5 to 45 weight percent aramid and (b) at least one layer of a polymeric electrical insulating film bonded to the mica-aramid paper with an adhesive. | 08-01-2013 |
| 20130230726 | TWO-COMPONENT STRUCTURAL ADHESIVE WHICH IS IMPACT RESISTANT AT ROOM TEMPERATURE - The disclosure relates to the field of two-component epoxy resin compositions and to the use thereof as a repair adhesive, in particular in vehicle manufacturing. The two-component epoxy resin compositions according to the disclosure contain a curing component K2, which comprises between 1 and 10 wt. % of an amino group-terminated polyamide B, together with an epoxy resin component K1. The compositions show that the impact resistance is highly increased while an acceptable sheer strength is simultaneously retained. | 09-05-2013 |
| 20130288058 | DEVELOPMENT OF HIGH-VISCOSITY BONDING LAYER THROUGH IN-SITU POLYMER CHAIN EXTENSION - New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments. | 10-31-2013 |
| 20130316180 | Biocompatible Packaging Suitable for Long-term Implantation and Method of Formation - A method for forming an electrical-conductor-free vapor barrier suitable for protecting long-term implanted electronic systems is disclosed. The method comprises forming a nascent layer of a partially cured layer and repeatedly compressing the layer via a roller-based process. Once the layer has been suitably compressed, the layer is fully cured. In some embodiments, a multi-layer protective layer is formed by repeating the roller-based formation process for each of a plurality of layers. In some embodiments, a multi-layer protective layer comprising layers of different materials is formed. | 11-28-2013 |
| 20140044972 | TEMPORARY ATTACHMENT AND ALIGNMENT OF LIGHT-WEIGHT COMPONENTS USING SPATIALLY MODULATED MAGNETIC FIELDS TECHNOLOGY - Fixtureless self-alignment and orientation of components during an assembly process, and self-aligning/self-orienting components for assembly. Self-alignment and self-orientation are provided by integrating complementary spatially-modulated magnetic arrays into components requiring alignment and/or orientation during an assembly process. In addition to providing self-alignment/self-orientation, the spatially-modulated magnetic arrays also provide selective component placement and/or assembly order. Final assembly can involve permanent mechanical or adhesive fasteners. | 02-13-2014 |
| 20140113142 | MULTILAYER FILM STRUCTURE COMPRISING RENEWABLY SOURCED MATERIALS - A coextruded multilayer structure which can be oriented and a process therefor are disclosed in which the structure comprises a poly(hydroxyalkanoic acid) polymer (PHA) composition layer, a tie layer, and a sealant layer and the process comprises, consists essentially of, or consists of coextruding a PHA composition, a tie layer composition, and a sealant layer composition to produce a tubular multiplayer structure; cooling the multilayer film structure in a first bubble to produce a tubular multilayer structure; orienting the tubular multilayer structure under heating in a second bubble to produce an oriented tubular multilayer structure; and relaxing the oriented tubular multilayer structure under heating in a third bubble. The structure can be used to produce an article such as a packaging article. | 04-24-2014 |
| 20140120351 | PROCESSES FOR COATING SUBSTRATES AND SUBSTRATES FORMED THEREFROM - Processes for coating substrates and the related substrates are disclosed herein. A one-component base coating composition is applied onto a substrate and a one-component top coating composition is applied wet-on-wet onto the applied base coating composition. The coating compositions are based on aqueous acrylate/polyurethane dispersions. The top coating composition is applied after the applied base coating composition develops a pendulum hardness of at least 50% of the pendulum hardness that would be exhibited by the base coating composition after UV cure. The applied coatings exposed to UV radiation to simultaneously cure both the base coating composition and the top coating composition. | 05-01-2014 |
| 20140141254 | SELF-REPAIRING LAMINATED STRUCTURE AND SELF-FUSING INSULATED WIRE - Provided is a laminated structure having excellent self-repairing performance, which can be prepared by an inexpensive and simple method; also provided are a self-bonding insulated wire and electrical machine using the same. A self-repairing laminated structure in which a self-repairing resin layer is formed on a base material and a thermosetting resin topcoat is formed on an outer layer thereof is characterized in that the self-repairing resin layer includes an uncured cross-linkable or curable thermoplastic resin, and the thermosetting resin topcoat includes a cross-linking agent, curing agent, or curing catalyst of the cross-linkable thermoplastic resin. | 05-22-2014 |
| 20140154515 | POLYMER IMPREGNATED BAMBOO - An engineering or constructional member comprising at least two strips bonded with an adhesive; each of the strips comprises bamboo impregnated or treated with a polymer derived from one or more furfuryl alcohol resin precursors. | 06-05-2014 |
| 20140154516 | ADHESIVES DERIVED FROM AGRICULTURAL PROTEINS - The invention is directed to adhesives derived from animal or plant proteins, particularly canola and spent hen proteins. The adhesives are prepared by extracting the proteins by pH shifting; and either treating the extracted proteins with urea or sodium dodecyl sulfate, or polymerizing the proteins to form a protein-polymer conjugate. The invention is also directed to a wood based product comprising pieces of wood based material joined or consolidated with the adhesives. | 06-05-2014 |
| 20140178694 | METHOD FOR COATING A BUILDING PANEL AND A BUILDING PANEL - A method for coating a building panel ( | 06-26-2014 |
| 20140178695 | PROTEIN-CONTAINING EMULSIONS AND ADHESIVES, AND MANUFACTURE AND USE THEREOF - This invention provides emulsions and adhesives comprising proteins that can be isolated from a variety of sources including renewable plant biomass, and methods of making and using such emulsions and adhesives. | 06-26-2014 |
| 20140272420 | CORROSION-RESISTANT COATINGS AND METHODS USING POLYEPOXYSILANE PRECURSORS - The disclosure relates to curable polyepoxysilane compounds and compositions, methods related to curing of such compounds via hydrolysis and/or condensation to form coatings on a substrate, and coated articles formed from the curable polyepoxysilane compounds. The polyepoxysilane compounds are silane-functional precursors and can be used as coatings (or pretreatments) on various substrates (e.g., metals such as aluminum) and provide a substantial improvement in corrosion resistance relative to other anti-corrosion coatings. The silane-functional precursors can be prepared by reaction of functional silanes (e.g., amino-functional silanes or other epoxide-reactive functionalized silanes) with epoxide-containing organic or hydrocarbon compounds and oligomers/polymers thereof (e.g., glycidyl-type ethers or other epoxide-/oxirane-functionalized hydrocarbon compounds), for example including hydrocarbons with one or more aromatic hydrocarbon groups (e.g., in an aromatic polyether). | 09-18-2014 |
| 20140302327 | MULTI-PHASE SELF-STRATIFYING COATING EXHIBITING GRADIENT BEHAVIOR - The present invention relates to multi-phase self-stratifying coating systems, and in particular, to multi-phase self-stratifying coating systems having a substantially homogeneous composition of polymeric binder components that upon application and cure generates a multi-phase stratified coating wherein each phase is rich in a different polymeric binder component and wherein individual phases are separated by a diffuse interface, such that the stratified coating exhibits a gradient behavior wherein a given interface exhibits the attributes of the polymeric binder component that is rich at that interface, and wherein at least one phase is rich in a polymeric binder having a telechelic resin with reactive internal groups, reactive end groups, and an alkoxide oligomer, and at least one other phase is rich in a polymeric binder having a fluorinated polymer derived from fluorinated vinyl-based monomers. | 10-09-2014 |
| 20140302328 | ADHESIVE FOR POLARIZING PLATE, AND POLARIZING PLATE COMPRISING THE SAME - Provided are an adhesive for a polarizing plate and a polarizing plate comprising the same, and more particularly, an adhesive composition for a polarizing plate comprising one or more acrylic monomers having a hydrophilic group, a radical polymerization initiator, an epoxy resin, and a cationic photopolymerization initiator, as well as a polarizing plate comprising a polarizer, a polymer film adhered to one side or both sides of the polarizer, and an adhesive layer for bonding the polarizer and the polymer film, in which the adhesive layer is formed of an adhesive composition comprising one or more acrylic monomers having a hydrophilic group, a radical polymerization initiator, an epoxy resin, and a cationic photopolymerization initiator. | 10-09-2014 |
| 20140342160 | B-STAGE FILM ADHESIVE COMPATIBLE WITH AQUEOUS INK FOR PRINTHEAD STRUCTURES INTERSTITIAL BONDING IN HIGH DENSITY PIEZO PRINTHEADS FABRICATION FOR AQUEOUS INKJET - A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications. | 11-20-2014 |
| 20140370298 | OXIRANE-CONTAINING BISANHYDROHEXITOL DERIVATIVES AND USES THEREOF - Epoxy compounds that are bisanhydrohexitol derivatives (i.e., isosorbide derivatives, isomannide derivatives, isoidide derivatives, or mixtures thereof) having two terminal oxirane groups are provided. Additionally, curable compositions that include these epoxy compounds, cured compositions prepared from the curable compositions, and articles containing the cured compositions are described. The cured compositions can be used, for example, as a structural adhesive or as a coating. | 12-18-2014 |
| 20150010760 | FIBER-REINFORCED COMPOSITE MATERIAL - A fiber-reinforced composite material can achieve dynamical properties at high levels, and can simultaneously improve Mode I interlaminar fracture toughness G | 01-08-2015 |
| 20150017448 | ADHESIVE COMPOSITION FOR POLARIZING PLATE, ADHESIVE FILM FOR POLARIZING PLATE COMPRISING THE SAME, POLARIZING PLATE COMPRISING THE SAME AND DISPLAY DEVICE COMPRISING THE SAME - An adhesive composition for a polarizing plate has good initial curing and an adhesive property. The adhesive composition includes (A) a polymerizable functional group-containing monomer capable of providing an anchor effect; (B) an epoxy group-containing compound; (D) a photoacid generator; and (E) at least one of a photopolymerization initiator and a photosensitizer. | 01-15-2015 |
| 20150086791 | APPLICATIONS OF A REVERSIBLE DRY ADHESIVE SYSTEM - One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate. One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate during building or reconfiguring a product. | 03-26-2015 |
| 20150099127 | ADHESIVE COMPOSITION FOR POLARIZER AND POLARIZER USING SAME - Disclosed herein is an adhesive composition for polarizing plates having increased adhesion by preventing curing inhibition due to moisture. The present invention provides an adhesive composition for polarizing plates, comprising: (A) a radical polymerizable monomer; (B) a cationic polymerizable monomer; (C) an unsaturated dicarboxylic acid anhydride; and (D) an initiator. | 04-09-2015 |
| 20150104650 | ADHESIVE COMPOSITION FOR POLARIZING PLATE, POLARIZING PLATE INCLUDING THE SAME, AND DISPLAY APPARATUS INCLUDING THE SAME - An adhesive composition for polarizing plates includes: (A) a non-(meth)acrylate type epoxy compound; (B) a non-epoxy type (meth)acrylate compound; and (C) a (meth)acrylate group-containing epoxy compound. A polarizing plate includes an adhesive layer formed from the adhesive composition on a polarizer, and a protective film on the adhesive layer. A display apparatus includes the polarizing plate. | 04-16-2015 |
| 20150111043 | Anti-Fogging Film-Forming Material, Coating Liquid for Forming Anti-Fogging Film, Anti-Fogging Article, and Methods for Producing These - Disclosed is an antifogging film-forming material obtained by reacting, in the presence of a quaternary ammonium salt or quaternary phosphonium salt, a copolymer represented by a certain general formula with a multifunctional epoxy compound having a solubility of 40-100 mass % in 25° C. water. The antifogging film-forming material is characterized by having a weight average molecular weight of 100,000-5,000,000. With this material, it becomes possible to obtain an antifogging article excellent in antifogging property, heat resistance, chemical resistance and abrasion resistance. | 04-23-2015 |
| 20150291809 | Water-Based Epoxy Formulations for Applied Fireproofing - The present disclosure relates to coating compositions, kits, and methods of applying the same, for use with fireproofing materials. The coating compositions are effective to control the drying rate and shrinkage of fireproofing materials. The coating compositions are also able to be applied to fireproofing materials shortly after these materials have been applied to a substrate. | 10-15-2015 |
| 20150293444 | Photosensitive Resin Composition, Resist Laminate, And Articles Obtained By Curing Same (5) - The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). | 10-15-2015 |
| 20150293448 | Photosensitive Resin Composition, Resist Laminate, And Cured Product (1) Thereof - The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2). | 10-15-2015 |
| 20150299407 | FAST CURE EPOXY RESIN SYSTEMS - A fast cure epoxy resin system is provided that upon curing has a Tg no greater than 140° C. and a Phase angle below 20° at a temperature of 140° C. or below, and prepregs and mouldings based on the system. The resin formulation matches the reactivity of the resin to the amount of curative and hardener employed. | 10-22-2015 |
| 20150301369 | FRAME SEALANT AND SEALING METHOD, DISPLAY PANEL AND DISPLAY DEVICE SEALED THEREWITH - A frame sealant and a sealing method, a display panel and a display device containing the frame sealant. A sealing method for a frame sealant comprises: successively coating a water-borne epoxy resin and a solvent-based epoxy resin or successively coating a solvent-based epoxy resin and a water-borne epoxy resin on a first substrate, aligning and pressing the first substrate and a second substrate; or coating a water-borne epoxy resin on a first substrate, coating a solvent-based epoxy resin on a second substrate, and aligning and pressing the two substrates; a first material by which a nano-scale second material is encapsulated is dispersed in the solvent-based epoxy resin, wherein, the first material is a hydrophilic polymeric material and the second material is one which will undergo an exothermic reaction with water. When the frame sealant is pressed, the hydrophilic polymeric material will absorb water and thus be saturated with water, the remaining water will react with the material which undergoes an exothermal reaction with water to generate heat, which will cause the curing of the frame sealant as an internal heat source. | 10-22-2015 |
| 20150322257 | BINDER RESIN COMPOSITION FOR PREFORM, BINDER PARTICLE, PREFORM, AND FIBER-REINFORCED COMPOSITE MATERIAL - A binder resin composition for preform production includes thermosetting resin [A], thermoplastic resin [B], and curing catalyst [C], thermosetting resin [A] containing a bifunctional epoxy resin, thermoplastic resin [B] accounting for 10 to 100 parts by mass relative to 100 parts by mass of thermosetting resin [A], and curing catalyst [C] being at least one curing catalyst selected from the group consisting of organic phosphorus compounds, imidazole, and derivatives thereof. | 11-12-2015 |
| 20150343486 | A METHOD FOR COATING A BUILDING PANEL AND A BUILDING PANEL - A method for coating a building panel, including applying a first coating fluid including an organic binder on a surface of the building panel to obtain at least one coating layer, and applying barrier components and photocatalytic particles, preferably TiO2, on said at least one coating layer. Also, a building panel formed by the method. | 12-03-2015 |
| 20150361304 | PROCESS FOR PRODUCING A METAL-PLASTIC HYBRID COMPONENT - The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive. | 12-17-2015 |
| 20160017172 | CURING AGENT FOR TIE-COAT COMPOSITION COMPRISING AN AMINO-SILANE ADDUCT - The application discloses a method for applying a fouling-release coating system to a surface, said surface suitably provided with an anticorrosive coat, and an article comprising a substrate, said substrate having a surface, preferably an anticorrosive coat on at least a part of the surface of said substrate and a tie-coat on said substrate. A curing agent composition comprising an amino-silane adduct comprising a high molecular weight amine, HMWA, as well as a tie-coat comprising said curing agent composition are also provided. | 01-21-2016 |
| 20160041307 | METHOD OF FORMING AN ANTI-GLARE COATING ON A SUBSTRATE - A method of forming an anti-glare coating on a substrate is provided. The method comprises: (a) heating the substrate to a temperature of at least 100° F. (37.8° C.) to form a hot substrate; (b) applying a curable film-forming sol-gel composition on at least one surface of the hot substrate, to form a coated substrate with a sol-gel network layer having a surface roughness; and (c) subjecting the coated substrate to conditions for a time sufficient to effect cure of the sol-gel layer and form an anti-glare, coated article. The sol-gel network layer is essentially free of inorganic oxide particles and comprises: | 02-11-2016 |
| 20160053045 | MULTIPLE ACCELERATOR SYSTEMS FOR EPOXY ADHESIVES - There is provided a one -part curable epoxy composition comprising a heat curable epoxy resin; and a latent curative system in an amount sufficient to cure the epoxy resin, where the latent curative system comprises at least one epoxy resin miscible first curative comprising a latent hardener, selected from dicyandiamide and its derivatives, and two or more latent accelerators selected from at least one of substituted ureas, substituted imidazoles, and combinations thereof. There are also provided adhesive compositions, cured adhesives and articles made using such one-part curable epoxy compositions. | 02-25-2016 |
| 20160060490 | CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICES USING BOTH - [Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 massppm or less, preferably 50 massppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid. | 03-03-2016 |
| 20160077241 | Tinting Enhancers for Hard Coat Tinting - The invention pertains to a tintable hard coat composition for forming a film on an optical article, the composition comprising at least one tinting enhancer, and at least two polymerizable monomers, a first monomer being an hydrolysat of an alkoxysilane comprising at least two alkoxy groups and one epoxy group, and a second monomer having at least two functional groups reacting with the first monomer, at least one of the two monomers having three functional groups of the same kind; the tinting enhancer being preferably chosen from the group consisting of 4-(methyl mercapto) phenol, 4,4′ thiodiphenol,4,4′-Sulfonyldiphenol, and 3,3′-(Ethylenedioxy)diphenol or a mix thereof: Formulas (I), (II), (III), (IV). | 03-17-2016 |
| 20160082707 | PROTECTIVE LAYER TRANSFER SHEET, AND THE INTERMEDIATE TRANSFER MEDIUM - The purpose is to provide a protective layer transfer sheet and an intermediate transfer medium, in which the protective layer has excellent foil tearing property during transfer and in which sufficient durability can be imparted to the thermally transferred image. | 03-24-2016 |
| 20160096352 | LAMINATION METHOD - Provided is a method of forming a laminated structure comprising
| 04-07-2016 |
| 20160152522 | COMBINATION OF TERNARY BINDERS WITH AQUEOUS EPOXY RESIN SYSTEM | 06-02-2016 |
| 20160152879 | HIGH MODULUS EPOXY ADHESIVES FOR SHIMMING APPLICATIONS | 06-02-2016 |
| 20160160098 | PHOTOCURABLE EPOXY ADHESIVE AGENT, RESIN COMPOSITION, LAMINATE , DISPLAY, AND METHOD FOR PRODUCING RESIN COMPOSITION - The invention provides a photocuring epoxy adhesive agent having excellent polymerization conversion rate at low temperature, and excellent adhesive strength and resistance to moisture permeation, and also provides a cured product having good productivity. The photocuring epoxy adhesive agent of the invention contains: (A) an epoxy monomer or oligomer; (B) a photo cationic polymerization initiator; and (C) a layered silicate. Since the adhesive agent is photocurable, curing can be performed at low temperature, and the adhesive agent shows excellent adhesive strength. Moreover, since the adhesive agent can be cured in a short time, productivity is excellent. The cured resin composition has high resistance to moisture permeation. | 06-09-2016 |
| 20160160563 | Fiberglass Reinforced Plastic Products Having Increased Weatherability, System and Method - Climbing products containing rails decorated using veil products colored, patterned, painted or in combination with marking methods such as company names and logos and resin formulation designed to withstand exposure to UV radiation with minimal change in appearance which create specific appearances for applications, enhance weathering performance, and facilitate processing efficiency. A combination of a filler free resin and coated veil systems to create a synergistic weather resistance surface with self-contained color, pattern, picture, logo or combination of said same for climbing products. A system for producing components. Various methods, system, a ladder rail. | 06-09-2016 |
