Class / Patent application number | Description | Number of patent applications / Date published |
428416000 | Next to metal | 42 |
20090068473 | Epoxy Based Coatings - An epoxy based primer composition comprising at least 10% zinc oxide w/w dry solids is described. A coated metal substrate is also described comprising a metal substrate, at least one epoxy based primer layer, the primer layer comprising at least 10% w/w zinc oxide in the dry primer coating, and at least one top-coat adhered to the primer layer. A process of coating a metal substrate is also described. | 03-12-2009 |
20090081466 | Polyamide resin, epoxy resin compositions, and cured articles thereof - Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The phenolic hydroxyl group-containing aromatic polyamide resin has a structure represented by the following formula (1): | 03-26-2009 |
20090123760 | Article made of biodegradable resin and method of making the same - An article has a body made of a biodegradable resin. A heat insulating material covers over the surface of the body. A resin adhesive is interposed between the body and the heat insulating material. Heat insulation is achieved with such a simplified structure. Heating process is employed to melt the resin adhesive, for example. The heat insulating material can thus easily be detached from the surface of the body. Since the body is made of a biodegradable resin, the body is easily degraded in soil, for example. No waste is generated. When the body is incinerated for thermal recycle, for example, emission of carbon-dioxide is reduced to half an amount of the case where a petroleum resin is incinerated. This results in less deterioration of the environment. | 05-14-2009 |
20090246533 | COEXTRUSION BINDER OF CO-GRAFTED PE AND PP DILUTED IN A NON-GRAFTED PE - The invention concerns a coextrusion binder comprising a mixture of at least one ethylene homo- or copolymer (A1) of density ranging between 0.940 and 0.980 g/cm | 10-01-2009 |
20090280331 | PHOSPHORUS-CONTAINING BENZOXAZINE COMPOUND, PROCESS FOR PRODUCTION THEREOF, CURABLE RESIN COMPOSITION, CURED ARTICLE, AND LAMINATE PLATE - The present invention is directed to a compound serving as both a flame retardant and a curing agent (a crosslinking agent) for curable resin, a method for producing the compound, a flame-retardant curable resin composition containing the compound, and a cured product and a laminate sheet having flame retardancy produced through curing the cured resin composition. The compound has a benzoxazine structure and a phosphine oxide structure in a molecule thereof. | 11-12-2009 |
20100035066 | DOUBLE-SIDED METAL CLAD LAMINATE AND FABRICATION METHOD THEREOF - The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil. | 02-11-2010 |
20100062260 | Composition Containing Porphyrin to Improve Adhesion - An adhesive composition includes a curable resin and a porphyrin derivative, in which the porphyrin derivative has at least one carboxylic acid group that is typically pendant from the porphyrin ring. In another embodiment, this invention is a method for improving adhesion of an adhesive composition to a metal substrate in which a porphyrin derivative is added to a resin, wherein the porphyrin derivative has at least one carboxylic acid group pendant from the porphyrin ring. In a third embodiment, this invention is an assembly in which a semiconductor die is mounted on a metal substrate using an adhesive composition that contains a porphyrin derivative that has at least one carboxylic acid group. In one embodiment the porphyrin derivative is Protoporphyrin IX, having the structure | 03-11-2010 |
20100119836 | STAINLESS STEEL COMPOSITE AND MANUFACTURING METHOD THEREOF - A CFRP-integrated stainless steel complex used for a hydrogen containing tank, a food processing machine, a medical device, a general-purpose machine, and other machines can be designed as a further rational design product with a smaller weight. It has been found that a stainless steel material ( | 05-13-2010 |
20100310879 | Skid resistant coating for metal surfaces and method of application - A coating for metal ship decks that provides skid resistance and corrosion protection using a polymer emulsion and aggregate layer over an epoxy layer and sealing the polymer emulsion and aggregate layer with xylene. | 12-09-2010 |
20110033710 | COMPOSITE STRUCTURES OF A METAL COMPONENT WITH A RESIN COMPONENT AND ARTICLES THEREOF - The present invention aims at providing an article having a composite structure including a metal component and a resin component bonded together. The present invention provides an article which is a composite structure, including a first component and s second component, the first component is a metal substrate and the second component is a molded product comprising a thermoplastic resin composition, and the reaction of a silane coupling compound resin with the metal substrate for forming binder between the first and second components comprising SiOx, C—Si—O—X bond (X is metallic substance of the first component) as determined by x-ray photoelectron spectroscopy, wherein the bonding strength between the first and second components is about 30 Mpa or more. | 02-10-2011 |
20110076501 | SUBSTRATE AND RUBBER COMPOSITION AND METHOD OF MAKING THE COMPOSITION - This invention provides a product comprised of a substrate with a rubber composition attached to the substrate by at least one interlayer of a polysilsesquioxane composition having phosphate cross-linkages. The at least one polysilsesquioxane layer having phosphate cross-linkages is produced from a mixture of a silane coupling agent and a phosphatizing reagent. | 03-31-2011 |
20110143142 | HYBRID COMPONENTS CONTAINING REACTIVE HOTMELT ADHESIVES - Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction. | 06-16-2011 |
20110159296 | INSULATING SHEET AND LAMINATED STRUCTURE - The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1). | 06-30-2011 |
20110244245 | EPOXY ADHESIVE COMPOSITIONS COMPRISING AN ADHESION PROMOTER - Curable adhesive compositions comprising
| 10-06-2011 |
20120070670 | HYBRID COMPONENTS WITH REACTIVE HOTMELT ADHESIVES - A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraft construction, for example. | 03-22-2012 |
20120082853 | URETHANE RESIN, ACTINIC ENERGY RAY CURABLE ADHESIVE, AND BACK PROTECTIVE SHEET FOR SOLAR CELL - An actinic energy ray curable adhesive contains a urethane resin (D) and a epoxy resin (E). The urethane resin (D) is prepared by reacting a diol ingredient (A1) having no (meth)acryloyl group, an optional diol ingredient (A2) having no (meth)acryloyl group, no carbonate structure and no alicyclic structure, a polyol ingredient (B) having a (meth)acryloyl group and two or more hydroxyl groups in a molecule, and a polyisocyanate ingredient (C) together. The ingredient (A1) is selected from a diol (a1) having a carbonate structure and an alicyclic structure in a molecule, a combination of a diol (a2) having no alicyclic structure but having a carbonate structure, and a diol (a3) having no carbonate structure but having an alicyclic structure, and a combination of a diol (a1) and at least one of the diol (a2) and the diol (a3). | 04-05-2012 |
20120258315 | ASSEMBLY OF TWO SUBSTRATES BONDED BY A RIGID POLYMER, AND METHODS FOR ASSEMBLY AND DISMANTLING BY MEANS OF MIGRATION OF SAID BONDED ASSEMBLY - An assembly ( | 10-11-2012 |
20120263955 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1−m2≧3. | 10-18-2012 |
20130004774 | COMPOSITE STRUCTURE HAVING AN INORGANIC COATING ADHERED THERETO AND METHOD OF MAKING SAME - The present disclosure provides a composite structure and associated method for preparing a composite substrate comprising an inorganic coating that is adhered to an organic-based substrate via an adhesion promoting agent comprising a molecule having a urea moiety at one end of the molecule and an alkoxysilane moiety at the other end of the molecule. The use of adhesion promoting agent having at least one of an amine or imine moiety and an alkoxysilane moiety promotes tight adhesion of the inorganic coating to the substrate. In one embodiment, the adhesion promoting agent may have the following structure as shown in formula (I) below: | 01-03-2013 |
20130065059 | METHOD OF ADHERING IONOMER TO METAL - Disclosed is a method of bonding ionomer compositions to metal using partially cured epoxy primers. The method is useful for preparing highly abrasion-resistant tubular articles such as pipes comprising ionomer liner layers. | 03-14-2013 |
20130108874 | METHOD FOR ASSEMBLING A PART FOR AN AUTOMOBILE | 05-02-2013 |
20130266812 | Epoxy Resin Composition, and Prepreg and Copper Clad Laminate Made Therefrom - The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises the following essential components: (A) at least an epoxy resin, of which the melt viscosity is not more than 0.5 Pa·s under the temperature of 150 ° C.; (B) phenolic resin, of which the structure is as shown in the formula 1: | 10-10-2013 |
20130295388 | EPOXY RESIN COMPOSITION AND COPPER CLAD LAMINATE MANUFACTURED BY USING SAME - The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards. | 11-07-2013 |
20140004352 | METAL-CLAD HYBRID ARTICLE HAVING SYNERGISTIC MECHANICAL PROPERTIES | 01-02-2014 |
20140017501 | RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE - There are provided a resin composition which has excellent heat resistance, exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment, and can be used suitably for an LED-mounting printed wiring board; a prepreg containing the resin composition; and a metal foil-clad laminate containing the resin composition, or the like. The resin composition of the present invention contains a fluorene-containing epoxy resin (A) having a specific structure, an acid anhydride (B) of a completely or partially hydrogenated product of an aromatic polycarboxylic acid, titanium dioxide (C), and a wet dispersing agent (D). | 01-16-2014 |
20140072807 | RESIN COMPOSITIONS AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a first filler containing calcium carbonate and hydrated magnesium silicate and a hardener, wherein the first filler has a diameter ranging from about 0.1 μm to about 100 μm; and the amount of the first filler is about 1 part by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin. | 03-13-2014 |
20140093736 | RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE - There are provided a resin composition which exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment and a light irradiation treatment, has an excellent peel strength with a metal foil, and can be used suitably for an LED-mounting printed wiring board; a prepreg using the resin composition; and a metal foil-clad laminate using the resin composition, or the like. A resin composition of the present invention comprises at least an epoxy resin (A) having a bisphenol A skeleton, an alicyclic epoxy resin (B), an acid anhydride (C) of a completely or partially hydrogenated product of an aromatic polycarboxylic acid, titanium dioxide (D), and a dispersing agent (E). | 04-03-2014 |
20140147677 | Novel Structural Adhesive and Use Thereof - A structural adhesive exhibiting good humidity resistance in the uncured state, good failure mode after curing, good crash stability, and good corrosion resistance, is provided, as well as methods of use thereof. The structural adhesive and methods of use thereof are applicable, e.g., in complete knock down (CKD) assembly systems, e.g., in the assembly of automobile body structures. | 05-29-2014 |
20140162071 | RESIN COMPOSITION, AND PREPREG AND METAL FOIL-CLAD LAMINATE USING THE SAME - There are provided a resin composition which has high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment and a light irradiation treatment, has an improved peel strength to a metal foil, has excellent heat resistance, and can be used suitably for an LED-mounting printed wiring board; and a prepreg and a metal foil-clad laminate using the same. The resin composition of the present invention comprises: an aliphatic epoxy-modified silicone compound (A); a multibranched imide resin (B) having an isocyanurate ring and a carboxyl group; titanium dioxide (C); and a dispersing agent (D). | 06-12-2014 |
20140272421 | MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUSES | 09-18-2014 |
20140322540 | SURFACE TREATMENT FOR STRUCTURAL BONDING TO ALUMINUM - Provided are methods for structurally bonding adhesives to aluminum components without using adhesive bond primers. Also provided are apparatuses that include these structural bonds. An aluminum component may be treated with a conversion coating creating a conversion layer on the surface of the aluminum component and then treated with a sol-gel material creating a sol-gel layer on the conversion layer. An adhesive layer is applied directly onto the sol-gel layer without any adhesive bond primers. After curing the adhesive layer, a structural bond is formed between the aluminum component and the adhesive layer. The sol-gel material may be specifically formulated for a specific adhesive type and may include functional groups providing covalent bonds to the adhesive layer. The sol-gel material may be cured within about 30 minutes at a room temperature in comparison to 90 minutes at 250 F needed to cure a typical adhesive bond primer. | 10-30-2014 |
20140342161 | Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the Same - Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature. | 11-20-2014 |
20140349120 | Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the Same - Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1. The high frequency circuit board manufactured by using the epoxy resin composition comprises multiple layers of laminated semi-cured sheets and copper foils press-bonded on both sides of them, and each of the multiple layers of laminated semi-cured sheets comprises a substrate and the epoxy resin composition attached on it by impregnating and drying. | 11-27-2014 |
20150017449 | RESIN COMPOSITION, PREPREG, RESIN SHEET, AND METAL FOIL-CLAD LAMINATE - A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. | 01-15-2015 |
20150079401 | CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING THE SAME, HIGH THERMAL CONDUCTIVE RESIN COMPOSITION, AND HIGH THERMAL CONDUCTIVE LAMINATED SUBSTRATE - A curable resin composition including aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphate ester represented by the following formula (1): | 03-19-2015 |
20150140339 | METHOD FOR PRODUCING AN ADJUSTMENT SPACER - A method for producing an adjustment shim includes preparing a liquid solution of a non-polymerized resin and a solvent; coating sheets of metal with the liquid solution so as to form a film of resin on at least one face of each of the sheets of metal; stacking the metal sheets so that two adjacent sheets of metal are separated by the film of resin; and curing the resin films in the stack of metal sheets, for a predefined time period, at a temperature higher than a degradation or burning temperature of the resin. | 05-21-2015 |
20150140340 | Thermal resistant mirror-like coating - This invention discloses a new process of preparing highly reflective coatings with thermal resistance on substrates of metals. The thermal resistant coating layers include a minor-like coating with high reflectivity and a transparent protective coating, which are coated on metallic substrates with surfaces pre-treated by anodizing or thermal resistant primers (base coating layers). | 05-21-2015 |
20150361316 | ADHESION PROMOTER COMPOSITIONS AND PRIMER COMPOSITIONS FOR METAL-PLASTIC HYBRID COMPONENTS - The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive. | 12-17-2015 |
20160023389 | METAL/PLASTIC HYBRID STRUCTURAL PARTS - The invention relates to a structural part that has a metal component, a plastic component and a bonding agent system interconnecting the metal component and the plastic component. The invention is characterized in that the bonding agent system consists of a plastic bonding agent or of a plastic bonding agent combined with a primer, the plastic bonding agent being a polyester, a polyurethane or an epoxide that is modified with a diene and/or a polyene. The invention also relates to a method for producing said structural part. | 01-28-2016 |
20160047051 | FABRICATION OF MIRROR-LIKE COATINGS - This invention relates to an object with electroless plated coatings that includes an adhesion coating, a smoothening coating, a silver coating and an anti-scratch coating. A method of fabricating the electroless plated object is also described. | 02-18-2016 |
20160193811 | SELF-FIXTURING METALLIC COMPOSITE LAMINATE | 07-07-2016 |
20160375658 | COMPOSITION FOR NON-ORIENTED ELECTRICAL STEEL SHEET, METHOD OF MANUFACTURING NON-ORIENTED ELECTRICAL STEEL SHEET PRODUCT, AND NON-ORIENTED ELECTRICAL STEEL SHEET PRODUCT - A non-oriented electrical steel sheet composition, a manufacturing method of the non-oriented electrical steel sheet product, and a non-oriented electrical steel sheet product are provided, and the non-oriented electrical steel sheet composition includes a first composition including a soluble epoxy resin and an inorganic nanoparticle of SiO | 12-29-2016 |