| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 428415000 | Next to glass or quartz | 8 |
| 20080268257 | MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYMIDE FILM, FILM FOR TAB, AND PREPREG - It is an object of the invention to provide a material for -insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustion | 10-30-2008 |
| 20090176104 | RESIN COMPOSITION AND APPLICATION THEREOF - A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too. | 07-09-2009 |
| 20120077040 | HEAT DISSIPATION COATING AGENT AND HEAT-DISSIPATING PLATE INCLUDING SAME - The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source. | 03-29-2012 |
| 20120114952 | ADHESIVE COMPOSITION FOR DETACHABLE ADHESIVE BONDS AND MODIFICATION OF THE ENCAPSULATION MATERIALS FOR A PURPOSEFUL ENERGY INPUT - An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material, the particles of the expansion material being at least partially encapsulated. | 05-10-2012 |
| 20140072806 | POLYMER COMPOSITIONS AND METHODS - The present invention encompasses polymer compositions comprising aliphatic polycarbonate chains containing functional groups that increase the polymer's ability to wet or adhere to inorganic materials. In certain embodiments, chain ends of the aliphatic polycarbonates are modified to introduce silicon-containing functional groups, boron-containing functional groups, phosphorous-containing functional groups, sulfonic acid groups or carboxylic acid groups. | 03-13-2014 |
| 20150132581 | Joining Dissimilar Materials Using an Epoxy Resin Composition - An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can be used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cured, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected. | 05-14-2015 |
| 20150344698 | ADHESION PRIMER FOR GLASS AND CERAMICS - A primer composition that provides a primer layer that improves adhesion between a coating and a substrate. The primer composition includes an adhesion promoter and a catalyst. The adhesion promoter includes a functional group that reacts with the substrate and a functional group that reacts with the coating or a component of the coating composition used to form the coating. Functional groups that react with the substrate include hydroxyl groups and alkoxy groups. The coating or components of the coating composition may include thiol or episulfide groups. Functional groups of the adhesion promoter that react with the coating or coating composition include epoxy groups and episulfide groups. The coating may form from a reaction between the coating composition and the primer layer and/or between components of the coating composition. The reaction that forms the coating may be catalyzed by a catalyst in the primer layer that was included in the primer composition. | 12-03-2015 |
| 20180022066 | LAMINATED-GLASS INTERLAYER AND LAMINATED GLASS | 01-25-2018 |
